Conductive Adhesive Structure, Display Device and Bonding Method

Abstract

The present invention provides a conductive adhesive structure, which includes a conductive adhesive layer and a reinforcing insulating layer arranged in a stacked manner. Among them, the reinforcing insulating layer has a higher light energy absorption rate than the conductive adhesive layer. During use, the conductive adhesive structure is intensively irradiated from one side of the reinforcing insulating layer. Passing through the reinforcing insulating layer can improve the heat absorption rate, thereby increasing the heating rate of the conductive adhesive structure, shortening the curing time of the conductive adhesive structure, while reducing the direct heat absorption of the driving chip, reducing the temperature difference between the driving chip and the conductive adhesive structure, and further reducing the expansion difference and improving the warping problem, effectively improving the production efficiency. In addition, the present invention also provides a display device including the conductive adhesive structure and a bonding method using the conductive adhesive structure.

Description

Technical Field

[0001] The present invention relates to the field of display technologies, and particularly to a conductive adhesive structure, a display device including the conductive adhesive structure, and a bonding method for bonding a driving chip to a display substrate using the conductive adhesive structure. Background Art

[0002] With the development of display technologies, liquid crystal display panels have been widely used due to advantages such as low power consumption. However, in current liquid crystal display devices, there are still problems such as uneven display brightness or light leakage, which affect the user experience. Summary of the Invention

[0003] The present invention at least partially solves the problems of uneven display brightness or light leakage in existing display devices, and provides a conductive adhesive structure, a display device including the conductive adhesive structure, and a bonding method using the conductive adhesive structure.

[0004] As a first aspect of the present invention, there is provided a conductive adhesive structure including a stacked conductive adhesive layer and an enhanced insulating layer, wherein the enhanced insulating layer has a higher light absorption rate of light energy than the conductive adhesive layer.

[0005] Optionally, the enhanced insulating layer includes a first insulating matrix and a black material dispersed in the first insulating matrix.

[0006] Optionally, the black material includes carbon black and / or graphene.

[0007] Optionally, the black material is carbon black, and the mass percentage of the carbon black in the enhanced insulating layer does not exceed 4 wt%.

[0008] Optionally, the black material is graphene, and the mass percentage of the graphene in the enhanced insulating layer does not exceed 1 wt%.

[0009] Optionally, the material of the first insulating matrix includes epoxy resin and / or polyimide.

[0010] Optionally, the thickness of the enhanced insulating layer is 5 μm to 10 μm.

[0011] Optionally, the thickness of the conductive adhesive layer is 8 μm to 15 μm.

[0012] As a second aspect of the present invention, there is provided a display device including a display substrate and a driving chip. Among them, the display device further includes the conductive adhesive structure provided in the first aspect of the present invention. The conductive adhesive structure is disposed between the bonding portions of the driving chip and the display substrate to bond the driving chip to the display substrate, wherein the enhanced insulating layer is attached to the display substrate.

[0013] As a third aspect of the present disclosure, a bonding method is provided, including:

[0014] Providing a display substrate;

[0015] Stacking a conductive adhesive structure and a driving chip on the bonding portion of the display substrate in sequence, wherein the conductive adhesive structure is the conductive adhesive structure provided in the first aspect of the present invention, and the enhanced insulating layer is attached to the display substrate, and the driving chip is attached to the conductive adhesive layer;

[0016] Performing thermocompression on the driving chip, and simultaneously irradiating the bonding portion of the display substrate with enhanced light from a side of the display substrate away from the driving chip towards the bonding portion of the display substrate.

[0017] Optionally, the irradiation duration of the enhanced light is 3 s to 5 s. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of the conductive adhesive structure provided by an embodiment of the present invention;

[0019] Figure 2 A schematic diagram of the display device provided by an embodiment of the present invention;

[0020] Figure 3 A flowchart of the bonding method provided by an embodiment of the present invention;

[0021] Figures 4a to 4e A step-by-step schematic diagram of the bonding method provided by an embodiment of the present invention;

[0022] Figure 5a A comparison of the temperature curves of the conductive adhesive structure provided by the present invention and the anisotropic conductive adhesive film of the prior art;

[0023] Figure 5b A comparison of the curing degree curves of the conductive adhesive structure provided by the present invention and the anisotropic conductive adhesive film of the prior art.

[0024] Among them, the reference numerals are:

[0025] 10 - conductive adhesive structure; 11 - conductive adhesive layer; 12 - enhanced insulating layer; 13 - conductive particles; 20 - display substrate; 30 - driving chip. DETAILED DESCRIPTION

[0026] To enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further described in detail below with reference to the drawings and specific embodiments.

[0027] It can be understood that the specific embodiments and drawings described herein are only for explaining the present invention, rather than limiting the present invention.

[0028] It is understood that, without conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0029] It is understood that, for the convenience of description, only the parts related to the present invention are shown in the drawings of the present invention, while the parts unrelated to the present invention are not shown in the drawings.

[0030] Through the research of the inventor, it is found that one of the reasons for light leakage is:

[0031] The liquid crystal display panel mainly includes a display substrate, a printed circuit board, a driving chip, etc. The driving chip is generally attached to the display substrate in a Chip On Glass (COG) bonding manner. In order to bond the driving chip to the display substrate, an anisotropic conductive film needs to be provided between the driving chip and the display substrate.

[0032] However, the current bonding method will cause the edge glass of the display substrate to bend and deform. The warping effect will make the vertical conduction of the anisotropic conductive film poor and cause phenomena such as display unevenness like MURA. Seriously, it will even cause problems such as uneven brightness or light leakage of the display.

[0033] Specifically, in the related art, when the anisotropic conductive adhesive is heated to the curing temperature and then cooled to room temperature, due to the inconsistent shrinkage rates of the driving chip and the display substrate, the driving chip will generate a warping effect. This is because the anisotropic conductive adhesive must absorb sufficient heat or energy to be used normally. However, since the heating rate of the Hotbar is slow, and the temperature and time both adopt the lower limit of the anisotropic conductive adhesive specification requirements, the energy absorbed by the anisotropic conductive adhesive is limited.

[0034] In view of this, as the first aspect of the present invention, a conductive adhesive structure is provided. This embodiment provides a conductive adhesive structure. As Figure 1 shown, the conductive adhesive structure 10 includes a stacked conductive adhesive layer 11 and a reinforcing insulating layer 12, wherein the light energy absorption rate of the reinforcing insulating layer 12 is higher than that of the conductive adhesive layer 11.

[0035] Among them, the "light energy absorption rate" refers to the ratio of the amount of light energy projected onto an object that is absorbed and converted into heat energy to the total amount of light energy projected onto the object.

[0036] Among them, when the conductive adhesive structure 10 is used in a display device, it is disposed between the driving chip of the display device and the display substrate of the display device, used to bond the driving chip and the display substrate together, and at the same time, enable electrical conduction between the driving chip and the display substrate through the conductive adhesive structure 10.

[0037] In the present invention, the conductive adhesive layer 11 is a conventional anisotropic conductive adhesive, and an enhanced insulating layer 12 with a higher light absorption rate is provided on one side of the conductive adhesive layer 11. By providing the enhanced insulating layer 12, the ability of the conductive adhesive structure 10 to absorb light is overall improved. During the process of binding the display substrate of the display device to the driving chip using the conductive adhesive structure, in addition to thermally pressing the conductive adhesive structure, enhanced light is used to irradiate the conductive adhesive structure 10 from one side of the enhanced insulating layer 12. Through the enhanced insulating layer 12, the light absorption rate of the conductive adhesive structure 10 can be increased, thereby increasing the heating rate of the entire conductive adhesive structure 10, shortening the curing time of the conductive adhesive layer in the conductive adhesive structure 10, reducing the heat directly absorbed by the driving chip at the same time, reducing the temperature difference between the driving chip and the conductive adhesive structure 10, further reducing the expansion difference between the driving chip and the conductive adhesive structure, improving the warping problem, and avoiding the occurrence of problems such as uneven display brightness or light leakage, thereby improving the user experience.

[0038] In some embodiments, the enhanced insulating layer 12 includes a first insulating matrix and a black material dispersed in the first insulating matrix.

[0039] Among them, the black material is used to increase the light absorption rate of the enhanced insulating layer 12.

[0040] Optionally, the black material includes carbon black and / or graphene. In other words, the black material can be carbon black, can be graphene, or can be a mixture of carbon black and graphene.

[0041] In addition, when other materials are selected as the black material, the mass percentage of the other materials in the enhanced insulating layer 12 should satisfy that the enhanced insulating layer 12 after adding the other materials is still an insulating material. Among them, an insulating material refers to a material that does not conduct electricity under an allowable voltage. The resistivity of the insulating material is very large, usually between 109 Ω·cm and 1022 Ω·cm. That is to say, the resistivity of the enhanced insulating layer 12 after adding other materials should be within the resistivity range of the insulating material.

[0042] In the present disclosure, no special limitation is imposed on the specific amount of the black material in the enhanced insulating layer, as long as it can have a high light absorption rate and does not change the insulating performance of the enhanced insulating layer 12. Specifically, when the resistivity of the material is between 109 Ω·cm and 1022 Ω·cm, the material can be called an insulating material. In the conductive adhesive structure provided by the present invention, whether carbon black, graphene, or a mixture of the two is added to the first insulating matrix, it is necessary to ensure that the resistivity of the finally obtained enhanced insulating layer 12 is between 109 Ω·cm and 1022 Ω·cm.

[0043] To achieve this purpose, when the black material is carbon black, the mass percentage of carbon black in the enhanced insulating layer 12 does not exceed 6 wt%. Preferably, the mass percentage of carbon black in the enhanced insulating layer 12 does not exceed 4 wt%.

[0044] Correspondingly, when the black material is graphene, the mass percentage of graphene in the enhanced insulating layer 12 does not exceed 2 wt%. Preferably, the mass percentage of graphene in the enhanced insulating layer 12 does not exceed 1 wt%.

[0045] Since the mass percentage of carbon black or graphene in the enhanced insulating layer 12 is not high, the enhanced insulating layer 12 after adding carbon black or graphene will still be in an insulating state, that is, the insulation property of the enhanced insulating layer 12 will not be changed.

[0046] It should be noted that in practical applications, other materials can also be selected as the black material, as long as the material with a higher light energy absorption rate than that of the conductive adhesive layer 11 can be added to the first insulating matrix as the black material.

[0047] In the present invention, no special limitation is imposed on the specific material of the first insulating matrix, as long as it can ensure that the insulation property is still maintained after adding black materials such as carbon black or graphene. To achieve this purpose, the resistivity range of the first insulating matrix of the enhanced insulating layer 12 is from 1013 Ω·cm to 1016 Ω·cm. Correspondingly, in some embodiments, the material of the first insulating matrix of the enhanced insulating layer 12 is a thermosetting resin. Preferably, the first insulating matrix of the enhanced insulating layer 12 can adopt the same material as the first insulating matrix of the conductive adhesive layer 11. To reduce the time consumed for material preparation and improve the process efficiency.

[0048] For example, the material of the first insulating matrix can be epoxy resin and / or polyimide. In other words, the material of the first insulating matrix can be epoxy resin, can be polyimide, or can also be a mixture of the two.

[0049] Since in this embodiment, the enhanced insulating layer 12 is stacked on the conductive adhesive layer 11 in the conductive adhesive structure 10, in order to keep the thickness of the bound product unchanged, the thickness of the conductive adhesive layer provided by the present invention should be reduced so that the overall thickness of the conductive adhesive structure 10 is consistent with the thickness of the conductive adhesive in the related art. Optionally, the thickness of the conductive adhesive layer 11 is from 8 μm to 15 μm. Correspondingly, the thickness of the enhanced insulating layer 12 is from 3 μm to 12 μm. Preferably, the thickness of the enhanced insulating layer 12 is 5 μm to 10 μm.

[0050] In addition to including the first insulating substrate and the black material, in some embodiments, the reinforcing insulating layer 12 may further include a coupling agent to improve the interfacial bonding strength between the reinforcing insulating layer 12 and the conductive adhesive layer 11, as well as between the reinforcing insulating layer 12 and the display substrate.

[0051] Optionally, the mass percentage of the coupling agent in the reinforcing insulating layer 12 ranges from 0.5 wt% to 4 wt%. Preferably, the mass percentage of the coupling agent in the reinforcing insulating layer 12 ranges from 1 wt% to 3 wt%.

[0052] The structure of the conductive adhesive layer 11 will be described in detail below.

[0053] When the conductive adhesive structure is applied to a display device, the binding layer in the display device is formed using the conductive adhesive structure. The thickness of the binding layer made using the conductive adhesive structure provided by the present invention should be the same as that of the binding layer made using a conductive adhesive in the related art.

[0054] In some embodiments, the conductive adhesive layer 11 includes a second insulating substrate and conductive particles 13 dispersed in the second insulating substrate.

[0055] Optionally, the material of the conductive particles 13 includes at least one of nickel, gold, silver, and tin.

[0056] It should be noted that in the related art, the light energy absorption rate of the anisotropic conductive adhesive for a laser with a wavelength of 808 nm is 30% to 40%. Moreover, when the above materials are used to prepare the conductive particles 13, the light energy absorption rate of the conductive particles 13 for a laser with a wavelength of 808 nm is relatively small, between 0.5% and 2%, that is, there is a problem of poor light energy absorption rate. In this embodiment, however, the carbon black and graphene added to the reinforcing insulating layer 12 have a relatively high absorption rate for a laser with a wavelength of 808 nm. The absorption rate of carbon black for a laser with a wavelength of 808 nm is 60% to 80%, and the absorption rate of graphene for a laser with a wavelength of 808 nm is 70% to 90%. Therefore, the overall light absorption rate of the conductive adhesive structure can be effectively improved, the warping problem can be improved, and the problems of uneven display brightness or light leakage can be avoided, thereby improving the user experience.

[0057] It should also be noted that the anisotropic conductive adhesive in the related art is characterized in that after the anisotropic conductive adhesive is disposed between the driving chip and the display substrate, the anisotropic conductive adhesive is electrically conductive in the direction perpendicular to the display substrate, and the anisotropic conductive adhesive is electrically insulating in the direction parallel to the display substrate. In the conductive adhesive structure 10 provided by the present invention, there are only conductive particles 13 in the conductive adhesive layer 11, and there are no conductive particles in the enhanced insulating layer 11. Compared with the single-layer structure having conductive particles in the related art, the density of conductive particles per unit volume is reduced. After the driving chip is pressed down and bonded to the bonding portion of the display substrate, the bonding portion is squeezed by the pressure to reduce the number of conductive particles in the bonding portion and reduce the lateral contact probability of the conductive particles 13, thereby reducing the probability of short circuit occurrence.

[0058] In the present invention, no special limitation is imposed on the size of the conductive particles 13. Optionally, the particle size range of the conductive particles 13 is from 1 μm to 7 μm. Further, the particle size range of the conductive particles can be from 3 μm to 5 μm.

[0059] In the present invention, no special limitation is imposed on the shape of the conductive particles 13. Optionally, the particle shape of the conductive particles 13 can be circular or elliptical, and the conductive particles 13 should have good particle size uniformity and a small roundness.

[0060] The preparation method of the conductive adhesive structure provided by the embodiments of the present invention will be introduced in detail below.

[0061] Prepare the conductive adhesive layer 11. Add a polymerization inhibitor and 15 to 20 parts of epoxy resin into a mixed solvent of 60 to 70 parts of toluene and ethyl acetate, and then heat and stir to dissolve the epoxy resin to obtain a second insulating matrix mixture. Add the conductive particles 13 into the second insulating matrix mixture, and at the same time add a certain amount of curing agent, tackifier, etc. After stirring evenly, coat it on the carrier substrate, and after drying and film formation, form a film with a thickness of 8 μm to 15 μm, that is, form the conductive adhesive layer 11.

[0062] An enhanced insulation layer 12 is laminated on the conductive adhesive layer 11. An epoxy resin substrate is dissolved into a first insulating matrix solution by a solvent. Then, a black material is added to the first insulating matrix solution to obtain an initial mixture (wherein, when the black material is carbon black, the mass percentage of carbon black in the initial mixture does not exceed 4 wt%, and when the black material is graphene, the mass percentage of graphene in the final mixture does not exceed 1 wt%). The initial mixture obtained after adding the black material remains in an insulating state. Then, a coupling agent is added to the initial mixture to obtain a final mixture, wherein the mass percentage of the coupling agent in the final mixture is between 1 wt% and 3 wt%. The final mixture is stirred for a predetermined time to form an enhanced insulating solution. Finally, the enhanced insulation layer 12 is formed on the conductive adhesive layer 11 by means of roll to roll or direct coating, wherein the thickness range of the enhanced insulation layer 12 is 5 μm to 10 μm.

[0063] As a second aspect of the present invention, a display device, such as Figure 2 shown, the display device includes a display substrate 20 and a driving chip 30. Among them, the display device further includes the conductive adhesive structure 10 provided in the first aspect of the present invention. The conductive adhesive structure 10 is disposed between the bonding portions of the driving chip 30 and the display substrate 20 to bond the driving chip 30 to the display substrate 20. Among them, the enhanced insulation layer 12 is attached to the display substrate 20, and the conductive adhesive layer 11 is attached to the driving chip 30.

[0064] Due to the use of the conductive adhesive structure 10 provided by the present invention, during the bonding process, the temperature difference between the driving chip 30 and the conductive adhesive structure 10 is reduced, and thus the expansion difference can be reduced, the warping problem of the display device can be improved, and the problems of uneven display brightness or light leakage can be avoided, thereby improving the user's visual experience.

[0065] As a third aspect of the present invention, a bonding method is provided, such as Figure 3 shown, the bonding method includes:

[0066] In step S10, a display substrate is provided;

[0067] In step S20, a conductive adhesive structure is laminated on the display substrate. Among them, the conductive adhesive structure is the conductive adhesive structure provided in the first aspect of the present invention, and the enhanced insulation layer is attached to the display substrate;

[0068] In S30, hot pressing is performed on the driving chip, and at the same time, enhanced light is irradiated from the side of the display substrate away from the driving chip toward the bonding portion of the display substrate.

[0069] In the present disclosure, no special limitation is imposed on the wavelength of the enhanced light. Optionally, the wavelength of the enhanced light is 750 nm to 1 mm. Further, the wavelength of the enhanced light is 808 nm.

[0070] Among them, by irradiating the enhanced insulating layer 12 of the conductive adhesive structure 10 with the enhanced light, the enhanced insulating layer 12 can be rapidly heated.

[0071] Through the bonding method provided by the present invention, by irradiating from the side of the display substrate 20 away from the driving chip 30 towards the display substrate 20, the temperature of the irradiated enhanced insulating layer 12 rapidly increases, enabling the entire conductive adhesive structure 10 to be heated faster and cured by increasing the temperature. Subsequently, the enhanced transmission continues to irradiate onto the driving chip 30, and the driving chip 30 can also be rapidly heated, causing the display substrate 20, the conductive adhesive structure 10, and the driving chip 30 to form a stable and uniform temperature field as a whole, thereby improving the warping problem and effectively enhancing the production efficiency.

[0072] To form a uniform enhanced light energy, preferably, a prism can be used to diffuse the enhanced light.

[0073] In some embodiments, when irradiating with light having a wavelength of 808 nm, the irradiation duration of the enhanced light is 2 s to 8 s. Further preferably, the irradiation duration of the enhanced light is 3 s to 5 s, so that the temperature of the conductive adhesive structure 10 after irradiation reaches 130 °C to 180 °C.

[0074] The bonding method provided in this embodiment will be introduced step by step below with reference to the accompanying drawings.

[0075] As Figure 4a shown, in step S10, a display substrate 20 is provided.

[0076] As Figure 4b shown, in step S20, a conductive adhesive structure 10 is stacked on the display substrate 20, the enhanced insulating layer 12 is attached to the display substrate 20, and the conductive adhesive structure 10 is pre-pressed using a tool.

[0077] Among them, the temperature for pre-pressing can be 50 °C to 70 °C. Further preferably, the pre-pressing temperature is 60 °C.

[0078] Preferably, a alignment step S21 is further included after step S20.

[0079] As Figure 4c shown, in step S21, the pre-pressed display substrate 20 with the conductive adhesive structure 10 is placed on the main pressing device, and the driving chip 30 and the display substrate 20 are aligned.

[0080] To ensure the accuracy of alignment, preferably, a microscope is used as an auxiliary tool for alignment during the alignment process.

[0081] In step S30, the driving chip 10 is thermocompressed, and during the thermocompression, enhanced light is irradiated onto the display substrate 20 from the side of the display substrate 20 away from the driving chip 30.

[0082] Preferably, step S30 includes the following two sub-steps:

[0083] As Figure 4d shown, in step S31, the driving chip 30 is pre-thermocompressed.

[0084] That is to say, in step S31, irradiation is not carried out using enhanced light.

[0085] As Figure 4e shown, in step S32, while the driving chip 30 is thermocompressed, enhanced light is irradiated onto the display substrate 20 from the side of the display substrate 20 away from the driving chip 30.

[0086] As an alternative embodiment, the enhanced light can be a laser.

[0087] To more intuitively show the effect of the conductive adhesive structure 10 provided by the present invention, a three-dimensional finite element model was established, and the bonding method was simulated using ABAQUS software.

[0088] Specifically, the performance of conductive adhesive structures of two different materials was simulated. Among them, the light absorption rate of the anisotropic conductive adhesive film (ACF-2) in the related art is two-thirds of the light absorption rate of the conductive adhesive structure (ACF-1) provided by the present invention.

[0089] Figure 5a is a comparison of the temperature curves of the conductive adhesive structure provided by the present invention and the anisotropic conductive adhesive film in the related art. From Figure 5a it can be seen that for the conductive adhesive structure (ACF-1) provided by the present invention, the temperature reaches the required maximum at 1 s when the bonding process starts, while in the bonding process in the related art, it takes 1.5 s for the anisotropic conductive adhesive film (ACF-2) to reach the required maximum temperature after the bonding process starts.

[0090] It can be seen that when using the conductive adhesive structure (ACF-1) material provided by the present invention, the heating rate of the conductive adhesive structure can be effectively increased.

[0091] Figure 5b is a comparison of the curing degree curves of the conductive adhesive structure provided by the present invention and the anisotropic conductive adhesive film in the related art. From Figure 5bIt can be seen that the conductive adhesive structure (ACF-1) provided by the present invention is completely cured at 2.07 s after the start of curing, while the anisotropic conductive adhesive film (ACF-2) of the related technology is completely cured at about 2.5 s after the start of curing. And, as Figure 5b shown, whether it is the anisotropic conductive adhesive film (ACF-2) of the related technology or the conductive adhesive structure (ACF-1) provided by the present invention, the degree of curing on both sides and in the middle of the conductive adhesive structure is the same, indicating that the material is heated evenly.

[0092] It can be seen that by increasing the absorption rate of the conductive adhesive structure, it is beneficial to reduce the curing time, thereby reducing the time of the bonding process and improving the production efficiency. At the same time, by reducing the time of the bonding process, the overall warpage can be reduced.

[0093] It should be understood that the above embodiments are merely exemplary embodiments adopted to illustrate the principle of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also regarded as the protection scope of the present invention.

Claims

1. A display device, comprising a display substrate and a driving chip, characterized in that, The display device further includes a conductive adhesive structure disposed between a binding portion of the driving chip and the display substrate to bind the driving chip to the display substrate; Wherein, the conductive adhesive structure includes a stacked conductive adhesive layer and a reinforcing insulating layer, and the light absorption rate of the reinforcing insulating layer for light energy is higher than that of the conductive adhesive layer for light energy. Wherein, the reinforcing insulating layer is attached to the display substrate to receive enhanced light irradiation from the side of the display substrate away from the driving chip towards the binding portion of the display substrate; the reinforcing insulating layer includes a first insulating matrix and a black material dispersed in the first insulating matrix.

2. The display device according to claim 1, characterized in that, The black material includes carbon black and / or graphene.

3. The display device according to claim 2, characterized in that, The black material is carbon black, and the mass percentage of the carbon black in the reinforcing insulating layer does not exceed 4wt%; or The black material is graphene, and the mass percentage of the graphene in the reinforcing insulating layer does not exceed 1wt%.

4. The display device according to claim 1, characterized in that, The material of the first insulating matrix includes epoxy resin and / or polyimide.

5. The display device according to any one of claims 1 to 4, characterized in that, The thickness of the reinforcing insulating layer is 5μm to 10μm.

6. The display device according to any one of claims 1 to 4, characterized in that, The thickness of the conductive adhesive layer is 8μm to 15μm.

7. A bonding method, characterized in that, Comprising: Providing a display substrate; Sequentially stacking a conductive adhesive structure and a driving chip on a binding portion of the display substrate, wherein the conductive adhesive structure includes a stacked conductive adhesive layer and a reinforcing insulating layer, and the light absorption rate of the reinforcing insulating layer for light energy is higher than that of the conductive adhesive layer for light energy. Wherein, the reinforcing insulating layer is attached to the display substrate, and the reinforcing insulating layer includes a first insulating matrix and a black material dispersed in the first insulating matrix; the driving chip is attached to the conductive adhesive layer; Performing hot pressing on the driving chip, and simultaneously irradiating the binding portion of the display substrate with enhanced light from the side of the display substrate away from the driving chip.

8. The bonding method according to claim 7, characterized in that, The irradiation duration of the enhanced light is 3s to 5s.

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