Organic light emitting display device

Abstract

An organic light-emitting display device is disclosed, comprising a substrate, a light-emitting structure, a first conductive pattern, and a functional module. The substrate has an opening area, a peripheral area surrounding the opening area, and a display area surrounding the peripheral area, and comprises a first groove having an extended lower portion formed in the peripheral area and an opening formed in the opening area. The light-emitting structure is located in the display area and on the substrate. The first conductive pattern overlaps the first groove in the peripheral area and on the substrate. The functional module is located in the opening of the substrate.

Description

Technical Field

[0001] Example embodiments generally relate to an organic light emitting display device. Background Art

[0002] Flat panel display ("FPD") devices are widely used as display devices of electronic devices because they are lightweight and thin compared to cathode ray tube ("CRT") display devices. Typical examples of FPD devices are liquid crystal display ("LCD") devices and organic light emitting display ("OLED") devices. Summary of the invention

[0003] An embodiment relates to an organic light-emitting display device, which includes a substrate, a light-emitting structure, a first conductive pattern, and a functional module. The substrate has an opening area, a peripheral area surrounding the opening area, and a display area surrounding the peripheral area, and includes a first groove having an extended lower portion formed in the peripheral area and an opening formed in the opening area. The light-emitting structure is located on the substrate in the display area. The first conductive pattern is in the peripheral area and overlaps with the first groove on the substrate. The functional module is located in the opening of the substrate.

[0004] In example embodiments, the first conductive pattern may include a first sub-conductive pattern and a second sub-conductive pattern. The first sub-conductive pattern may overlap the first groove and may have a circular planar shape including a partial opening of an opening portion. The second sub-conductive pattern may extend from the opening portion of the first sub-conductive pattern in an outward direction.

[0005] In an example embodiment, the OLED device may further include a pad electrode and a signal wiring. The pad electrode may be located on the substrate and may be electrically connected to an external device. The signal wiring located on the substrate may be disposed along an outer portion of the substrate and may electrically connect the second sub-conductive pattern and the pad electrode.

[0006] In example embodiments, the first groove may surround the opening on the substrate.

[0007] In example embodiments, the first groove may have a circular planar shape.

[0008] In example embodiments, the first conductive pattern positioned on the first groove may be disposed along an outline of an outer portion of the first groove.

[0009] In example embodiments, the substrate may include a first organic film layer, a first barrier layer, a second organic film layer, and a second barrier layer, the first barrier layer may be located on the first organic film layer. The second organic film layer may be located on the first barrier layer and may have a groove in a peripheral region. The second barrier layer may be located on the second organic film layer, and the second barrier layer positioned on the groove may have a protruding portion protruding in an inner portion of the groove. The second barrier layer may have an opening defined by the protruding portion.

[0010] In example embodiments, the first conductive pattern may overlap the protruding portion of the second barrier layer.

[0011] In example embodiments, the protruding portion of the second barrier layer may include a first protruding portion and a second protruding portion. The first protruding portion may be positioned adjacent to the opening of the substrate. The second protruding portion may face the first protruding portion and may be spaced apart from the first protruding portion in a direction from the opening region to the peripheral region.

[0012] In example embodiments, the OLED device may further include a second conductive pattern overlapping the first protrusion portion, the second conductive pattern being on the first protrusion portion. The first conductive pattern may overlap the second protrusion portion.

[0013] In example embodiments, the first conductive pattern and the second conductive pattern may be connected to each other in the region of the peripheral region and may be integrally formed.

[0014] In example embodiments, the groove of the second organic film layer, the protruding portion of the second barrier layer, and the opening of the second barrier layer may be defined as a first recess of the substrate having an expanded lower portion.

[0015] In example embodiments, the light emitting structure may include: a lower electrode; a light emitting layer on the lower electrode; and an upper electrode on the light emitting layer.

[0016] In example embodiments, the light emitting layer may extend on the substrate in a direction from the display region to the peripheral region, and may be divided in a portion where the first groove is formed.

[0017] In example embodiments, the upper electrode may extend on the substrate in a direction from the display region to the peripheral region, and may be divided in a portion where the first groove is formed.

[0018] In example embodiments, the light emitting layer and the upper electrode may be located in at least a portion of an inner portion of the first groove.

[0019] In example embodiments, the OLED device may further include: a thin film encapsulation structure on the light emitting structure; and a touch screen structure on the thin film encapsulation structure in the display area.

[0020] In an example embodiment, the thin film encapsulation structure may include a first thin film encapsulation layer, a second thin film encapsulation layer, and a third thin film encapsulation layer. The first thin film encapsulation layer may be located on the upper electrode and may include an inorganic material having flexibility. The second thin film encapsulation layer may be located on the first thin film encapsulation layer and may include an organic material having flexibility. The third thin film encapsulation layer may be located on the second thin film encapsulation layer and may include an inorganic material having flexibility.

[0021] In example embodiments, each of the first thin film encapsulation layer and the third thin film encapsulation layer may extend on the upper electrode in a direction from the display region to the peripheral region, and may be continuously disposed in a portion where the first groove is formed.

[0022] In an example embodiment, the touch screen structure may include: a first insulating layer located on the third thin film encapsulation layer in the display area; a touch screen electrode located on the first insulating layer; a second insulating layer located on the touch screen electrode; a touch screen connecting electrode located on the second insulating layer; and a protective insulating layer located on the touch screen connecting electrode.

[0023] In example embodiments, the first insulating layer may extend on the third thin film encapsulation layer in a direction from the display region to the peripheral region, and may be continuously disposed in a portion where the first groove is formed.

[0024] In example embodiments, the OLED device may further include an organic insulation pattern on the first insulation layer in the peripheral region.

[0025] In example embodiments, the second insulating layer may contact an upper surface of the first insulating layer in the display region, and may contact an upper surface of the organic insulating pattern in the peripheral region.

[0026] In example embodiments, the first conductive pattern may be located between the second insulating layer and the protective insulating layer.

[0027] In an example embodiment, the functional module may contact a side surface of the substrate, a side surface of the light emitting layer, a side surface of the upper electrode, a side surface of the first thin film encapsulation layer, a side surface of the third thin film encapsulation layer, a side surface of the first insulating layer, a side surface of the organic insulating pattern, a side surface of the second insulating layer, and a side surface of the protective insulating layer in a boundary of the peripheral area and the opening area.

[0028] In example embodiments, the substrate may further include at least one second groove between the first groove and the functional module, the at least one second groove having an expanded lower portion. The first groove may surround the second groove.

[0029] In example embodiments, the substrate may further include at least one third groove surrounding the first groove.

[0030] In example embodiments, the OLED device may further include a blocking structure located between the first groove and the third groove on the substrate in the peripheral region. The blocking structure may surround the first groove. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Features will become apparent to those skilled in the art by describing example embodiments in detail with reference to the accompanying drawings, in which:

[0032] Figure 1 illustrates a perspective view of an organic light emitting display ("OLED") device according to an example embodiment;

[0033] Figure 2 Shows Figure 1 A plan view of an OLED device;

[0034] Figure 3 and Figure 4 shows a method for describing the formation of Figure 1 A perspective view of an opening in an OLED device;

[0035] Figure 5 Shown with Figure 2 A partially enlarged plan view corresponding to area "A";

[0036] Figure 6 Shown are the instructions for describing the Figure 5 A plan view of a conductive pattern in an OLED device;

[0037] Figure 7 shows a diagram for describing electrical connections to Figure 6 A block diagram of external devices of an OLED device;

[0038] Figure 8 Shown along Figure 5 A cross-sectional view taken along line II';

[0039] Fig. 9 Shown are the instructions for describing the Figure 8 A plan view of a touch screen structure in an OLED device;

[0040] Figures 10 to 20 A cross-sectional view illustrating a method of manufacturing an OLED device according to an example embodiment;

[0041] Fig.21 shows a plan view of an OLED device according to an example embodiment;

[0042] Fig. 22 Shows the corresponding Fig.21 a partial enlarged plan view of area "B";

[0043] Fig.23 Shows the corresponding Fig.21 a partial enlarged plan view of area "B";

[0044] Fig.24 Shown along Fig. 22 A cross-sectional view taken along line II-II'; and

[0045] Fig.25 A cross-sectional view of an OLED device according to example embodiments is shown. DETAILED DESCRIPTION

[0046] Example embodiments will now be described more fully below with reference to the accompanying drawings; however, example embodiments may be implemented in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey example implementations to those skilled in the art. In the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. The same reference numerals indicate the same elements throughout.

[0047] Figure 1 is a perspective view showing an organic light emitting display ("OLED") device according to an example embodiment, Figure 2 It is shown Figure 1 A plan view of an OLED device. Figure 3 and Figure 4 is used to describe the formation of Figure 1 A perspective view of an opening in an OLED device.

[0048] Reference Figure 1 , Figure 2 , Figure 3 and Figure 4 , the OLED device 100 may include a functional module 700 and the like. The OLED device 100 may have a first surface S1 and a second surface S2. An image may be displayed in the first surface S1, and the second surface S2 may be opposite to the first surface S1. The functional module 700 may be located in one side of the OLED device 100.

[0049] like Figure 2 As shown in FIG. 1 , the OLED device 100 may have a display area 10, an opening area 20, a peripheral area 30, and a pad area 40. The peripheral area 30 may substantially surround the opening area 20, and the display area 10 may substantially surround the peripheral area 30. In another embodiment, the display area 10 may not completely surround the peripheral area 30. Figure 3 and Figure 4As shown in , the OLED device 100 may have an opening 910 formed in the opening region 20. The pad region 40 may be located in one side of the display region 10. A plurality of pad electrodes may be located in the pad region 40, and the pad electrodes may be electrically connected to an external device. In an example embodiment, the OLED device 100 may have a bending region located between the display region 10 and the pad region 40. For example, the bending region may be bent along an axis with respect to a first direction D1 parallel to an upper surface of the OLED device 100, and the pad region 40 may be located on a lower surface of the OLED device 100.

[0050] The display region 10 may include a plurality of sub-pixel regions, and the plurality of sub-pixel regions may be arranged in a matrix as a whole in the display region 10. The sub-pixel circuit (e.g., Figure 8 The semiconductor element 250 of the display area 10 may be located in each sub-pixel region of the display area 10, and the OLED (eg, Figure 8 The light emitting structure 200 may be located on the sub-pixel circuit. An image may be displayed in the display area 10 through the sub-pixel circuit and the OLED.

[0051] For example, the first sub-pixel circuit, the second sub-pixel circuit, and the third sub-pixel circuit may be located in the sub-pixel region, and the first OLED, the second OLED, and the third OLED may be located on the first sub-pixel circuit, the second sub-pixel circuit, and the third sub-pixel circuit. The first sub-pixel circuit may be coupled to (or connected to) a first OLED capable of emitting red light, and the second sub-pixel circuit may be coupled to a second OLED capable of emitting green light. The third sub-pixel circuit may be coupled to a third OLED capable of emitting blue light.

[0052] In an example embodiment, the first OLED may overlap with the first sub-pixel circuit, and the second OLED may overlap with the second sub-pixel circuit. The third OLED may overlap with the third sub-pixel circuit. In another embodiment, the first OLED may overlap with a portion of the first sub-pixel circuit and a portion of a sub-pixel circuit different from the first sub-pixel circuit, and the second OLED may overlap with a portion of the second sub-pixel circuit and a portion of a sub-pixel circuit different from the second sub-pixel circuit. The third OLED may overlap with a portion of the third sub-pixel circuit and a portion of a sub-pixel circuit different from the third sub-pixel circuit.

[0053] Therefore, the first OLED, the second OLED and the third OLED can be arranged using an RGB stripe method, an s stripe method, a WRGB method, a pen-tile method, etc., in which quadrilaterals of the same size are sequentially arranged, the s stripe method includes a blue OLED having a relatively large area, the WRGB method further includes a white OLED, and the sub-pixels are repeatedly arranged in an RG-GB pattern in the pen-tile method.

[0054] Additionally, at least one driving transistor, at least one switching transistor, and at least one capacitor may be located in each sub-pixel region.

[0055] In an example embodiment, for example, the shape of the display area 10 may be a quadrilateral plane shape. In an implementation, the shape of the display area 10 may have a triangular plane shape, a rhombus plane shape, a polygonal plane shape, a circular plane shape, a runway plane shape, an elliptical plane shape, etc.

[0056] The functional module 700 may be located in the opening 910. For example, the functional module 700 may include a camera module for capturing (or recognizing) an image of an object, a facial recognition sensor module for sensing a user's face, a pupil recognition sensor module for sensing a user's pupil, an acceleration and geomagnetic sensor module for determining movement of the OLED device 100, a proximity and infrared sensor module for detecting proximity to the OLED device 100, and a light intensity sensor module for measuring the degree of brightness when placed in a pocket or bag (bag), etc. In an example embodiment, a vibration or haptic module for indicating an incoming alarm, a speaker module for outputting sound, etc. may be located in the opening 910.

[0057] In the example embodiment, for example, the shapes of the opening area 20 and the peripheral area 30 each have a circular plan shape. In an embodiment, the shapes of the opening area 20 and the peripheral area 30 may each have a triangular plan shape, a rhombus plan shape, a polygonal plan shape, a quadrilateral plan shape, a racetrack plan shape, an elliptical plan shape, etc.

[0058] Figure 5 is with Figure 2 The area "A" corresponds to the local enlarged plan view, Figure 6 It is used to describe the Figure 5 Plan view of the conductive pattern in the OLED device. Figure 7 is used to describe electrical connections to Figure 6 Block diagram of the external devices of an OLED device.

[0059] Reference Figure 5 , Figure 6 and Figure 7 , the OLED device 100 may include a conductive pattern 400 , a functional module 700 , a pad electrode 470 , a connection wiring 370 , and the like.

[0060] In example embodiments, the opening 910 may be formed in the opening region 20, and the groove 930 may be formed in the peripheral region 30. The groove 930 may have a circular planar shape in a plan view of the OLED device 100, and may surround the opening region 20. In addition, the groove 930 may have an expanded (or dilated) lower portion in a cross-sectional view of the OLED device 100. Therefore, the lower portion of the groove 930 may be relatively larger than the upper portion of the groove 930.

[0061] The functional module 700 may be located in the opening 910, and the conductive pattern 400 may overlap the groove 930. Therefore, the conductive pattern 400 may be disposed on the groove 930 along the contour of the outer portion (outer portion) of the groove 930. The conductive pattern 400 may substantially surround the functional module 700 (or the opening 910). Figure 6 As shown in , the conductive pattern 400 may include a first sub-conductive pattern 401 and a second sub-conductive pattern 402. The first sub-conductive pattern 401 may have a circular planar shape including a partial opening of an opening portion, and the second sub-conductive pattern 402 may extend from the opening portion of the first sub-conductive pattern 401 in an outward direction (e.g., a direction from the opening region 20 to the peripheral region 30 or a second direction D2 perpendicular to the first direction D1). In an example embodiment, the first sub-conductive pattern 401 and the second sub-conductive pattern 402 may be integrally formed at the same layer. In another embodiment, the first sub-conductive pattern 401 may be located on the second sub-conductive pattern 402, and the opening portion of the first sub-conductive pattern 401 may be connected to the distal end of the second sub-conductive pattern 402 through a contact hole. In an embodiment, the second sub-conductive pattern 402 may be located on the first sub-conductive pattern 401, and the opening portion of the first sub-conductive pattern 401 may be connected to the distal end of the second sub-conductive pattern 402 through a contact hole. The first sub-conductive pattern 401 may overlap with the groove 930. For example, the first sub-conductive pattern 401 may overlap the outermost portion of the groove 930. Therefore, the first sub-conductive pattern 401 may overlap the outer boundary of the groove 930. In another embodiment, the first sub-conductive pattern 401 may overlap the innermost portion of the groove 930. Therefore, the first sub-conductive pattern 401 may overlap the inner boundary of the groove 930.

[0062] The conductive pattern 400 may include a metal, an alloy of a metal, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. For example, the conductive pattern 400 may include gold (Au), silver (Ag), aluminum (Al), tungsten (W), copper (Cu), platinum (Pt), nickel (Ni), titanium (Ti), palladium (Pd), magnesium (Mg), calcium (Ca), lithium (Li), chromium (Cr), tantalum (Ta), molybdenum (Mo), scandium (Sc), neodymium (Nd), iridium (Ir), an alloy of aluminum, aluminum nitride (AlN), an alloy of silver, tungsten nitride (WN), an alloy of copper, an alloy of molybdenum, titanium nitride (TiN), chromium nitride (CrN), tantalum nitride (TaN), strontium ruthenium oxide (SRO), zinc oxide (ZnO), indium tin oxide (ITO), tin oxide (SnO), indium oxide (InO), gallium oxide (GaO), indium zinc oxide (IZO), etc. These may be used alone or in appropriate combinations thereof. In example embodiments, the conductive pattern 400 may have a multi-layer structure including a plurality of layers.

[0063] The pad electrode 470 may be located in the pad region 40. The pad electrode 470 may include a first pad electrode 471 and a second pad electrode 472. For example, the first pad electrode 471 may be located in the left side of the pad region 40, and the second pad electrode 472 may be located in the right side of the pad region 40. In example embodiments, an additional pad electrode may also be located between the first pad electrode 471 and the second pad electrode 472. The pad electrode 470 may include a metal, an alloy of a metal, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These may be used alone or in a suitable combination thereof. In example embodiments, the pad electrode 470 may have a multilayer structure including a plurality of layers.

[0064] The connection wiring 370 may be located in the outer portion of the display area 10 and the pad area 40. The connection wiring 370 may include a first connection wiring 371 and a second connection wiring 372. A first distal end of the first connection wiring 371 may be connected to the second sub-conductive pattern 402 located in the left side of the second sub-conductive pattern 402, and the first connection wiring 371 may extend along the outline of the outer portion of the display area 10 and the pad area 40 in a counterclockwise direction. A second distal end of the first connection wiring 371 opposite to the first distal end may be connected to a first pad electrode 471 in the pad area 40. Similarly, a first distal end of the second connection wiring 372 may be connected to the second sub-conductive pattern 402 located in the right side of the second sub-conductive pattern 402, and the second connection wiring 372 may extend along the outline of the outer portion of the display area 10 and the pad area 40 in a clockwise direction. A second distal end of the second connection wiring 372 opposite to the first distal end may be connected to a second pad electrode 472 in the pad area 40. Therefore, the connection wiring 370 may electrically connect the conductive pattern 400 and the pad electrode 470. The connection wiring 370 may include a metal, an alloy of a metal, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These may be used alone or in a suitable combination thereof. In example embodiments, the connection wiring 370 may have a multilayer structure including a plurality of layers.

[0065] like Figure 7 As shown in , the external device 101 may be electrically connected to the OLED device 100 through a flexible printed circuit board ("FPCB"). For example, one side of the FPCB may be in direct contact with the pad electrode 470, and the other side of the FPCB may be in direct contact with the external device 101. Therefore, the external device 101 may electrically connect the first pad electrode 471 and the second pad electrode 472, and may measure the resistance value between the first pad electrode 471 and the second pad electrode 472.

[0066] A commonly used OLED device may include a substrate, and a groove having an extended lower portion may be formed in the substrate. The substrate may have a stacked structure in which a first organic film layer, a first barrier layer, a second organic film layer, and a second barrier layer are sequentially stacked. When the groove is formed in the substrate, the light-emitting layer and the upper electrode may be separated (or cut, etc.) in the peripheral region. For example, the groove having an extended lower portion may have an undercut shape, and the second organic film layer and the second barrier layer may be formed in the peripheral region. The second organic film layer may have a groove of a second width, and the second barrier layer may have an opening of a first width superimposed with the groove. The first width may be less than the second width. In addition, a protruding portion of the second barrier layer positioned adjacent to the opening may be defined as a tip (also referred to as a tip), and the light-emitting layer and the upper electrode may be separated in the peripheral region by the tip. However, the tip may be easily damaged under the action of external impact or stress in a manufacturing process (e.g., removing a top protective film and / or a bottom protective film, etc.). When the tip is damaged, the light-emitting layer and the upper electrode cannot be separated in the peripheral region, and moisture and / or water may penetrate through the light-emitting layer and the upper electrode. Therefore, defects of pixels included in a conventional OLED device may occur due to moisture and / or water. Therefore, defects of a conventional OLED device may occur due to damage to the tip, and such damage to the tip should be checked in a manufacturing process of the conventional OLED device. However, damage to the tip cannot be directly visually inspected.

[0067] In an exemplary embodiment, the OLED device 100 includes a conductive pattern 400, a pad electrode 470, and a connection wiring 370, and the OLED device 100 can check whether the tip is damaged. For example, the OLED device 100 can measure the resistance value between the first pad electrode 471 and the second pad electrode 472 by using an external device 101. Therefore, the OLED device 100 can check whether the tip is damaged by using the resistance value. Here, when damage to the tip occurs, the resistance value increases or the tip is in an open circuit state due to the cut of the conductive pattern 400. Therefore, the defect rate of the OLED device 100 can be reduced by checking whether the tip is damaged by the OLED device 100.

[0068] In an example embodiment, the external device 101 may generate a data signal, a gate signal, a light emitting signal, a gate initialization signal, an initialization voltage, a power supply, etc. As described above, an additional pad electrode may also be located between the first pad electrode 471 and the second pad electrode 472, and the external device 101 may be electrically connected to the additional pad electrode. In this case, the external device 101 may provide the OLED device 100 with a data signal, a gate signal, a light emitting signal, a gate initialization signal, an initialization voltage, a power supply, etc. In addition, a driver integrated circuit may be installed in the FPCB. In another embodiment, the driver integrated circuit may be installed in a portion of the OLED device 100 that is located adjacent to the pad electrode 470.

[0069] Figure 8 is along Figure 5 A cross-sectional view taken along line II' of Fig. 9 It is used to describe the Figure 8 A plan view of the touch screen structure in an OLED device.

[0070] Reference Figure 8 and Fig. 9 , the OLED device 100 may include a substrate 110, a semiconductor element 250, a planarization layer 270, a light emitting structure 200, a pixel defining layer 310, a thin film encapsulation ("TFE") structure 450, a touch screen structure 380, an organic insulating pattern 490, a conductive pattern 400, a functional module 700, etc. The substrate 110 may include a first organic film layer 111, a first barrier layer 112, a second organic film layer 113, and a second barrier layer 114. In the OLED device 100 having a display area 10, an opening area 20, a peripheral area 30, and a pad area 40, the substrate 110 may be divided into the display area 10, the opening area 20, the peripheral area 30, and the pad area 40. In addition, the semiconductor element 250 may include an active layer 130, a gate insulating layer 150, a gate electrode 170, an insulating interlayer 190, a source electrode 210, and a drain electrode 230, and the light emitting structure 200 may include a lower electrode 290, a light emitting layer 330, and an upper electrode 340. In addition, the TFE structure 450 may include a first TFE layer 451, a second TFE layer 452 and a third TFE layer 453, and the touch screen structure 380 may include a first insulating layer 390, multiple first touch screen electrodes 382, ​​multiple second touch screen electrodes 384, multiple touch screen connecting electrodes 386, a second insulating layer 395 and a protective insulating layer 410.

[0071] In an example embodiment, the substrate 110 may further include a groove 930 formed in the peripheral region 30, and each of the light emitting layer 330 and the upper electrode 340 may be separated in the inner portion (or interior) of the groove 930. Therefore, each of the light emitting layer 330 and the upper electrode 340 may be separated in the inner portion (inner portion) of the groove 930. In the OLED device 100 having the light emitting layer 330 and the upper electrode 340 separated in the inner portion of the groove 930, the OLED device 100 may block moisture, water, etc. from penetrating into the semiconductor element 250 and the light emitting structure 200. In addition, the substrate 110 may have an opening 910 formed in the opening region 20, and the functional module 700 may be located in the opening 910 (refer to Fig. 20 )middle.

[0072] A first organic film layer 111 may be provided. The first organic film layer 111 may include an organic material having flexibility. For example, the first organic film layer 111 may include a random copolymer or a block copolymer. In addition, the first organic film layer 111 may have high transparency, a low coefficient of thermal expansion, and a high glass transition temperature. In the case where the first organic film layer 111 includes imide radicals, heat resistance, chemical resistance, wear resistance, and electrical characteristics may be excellent. In an example embodiment, the first organic film layer 111 may include polyimide.

[0073] The first barrier layer 112 may be located on the entire first organic film layer 111. The first barrier layer 112 may block water and / or moisture that penetrates through the first organic film layer 111. The first barrier layer 112 may include an inorganic material having flexibility. In example embodiments, the first barrier layer 112 may include silicon oxide, silicon nitride, and the like. For example, the first barrier layer 112 may include silicon oxide (SiO x ), Silicon Nitride (SiN x ), silicon oxynitride (SiO x N y ), Silicon Oxycarbide (SiO x C y ), Silicon Carbonitride (SiC x N y ), aluminum oxide (AlO x ), aluminum nitride (AlN x ), tantalum oxide (TaO x ), hafnium oxide (HfO x )、ZrO x ), titanium oxide (TiO x )wait.

[0074] The second organic film layer 113 may be located on the entire first barrier layer 112. In example embodiments, the second organic film layer 113 may have a groove in the peripheral region 30. Therefore, a portion of the second organic film layer 113 located in the peripheral region 30 may be partially removed. The width of the groove may be defined as a second width W2 (refer to Fig.13 In another embodiment, the portion of the second organic film layer 113 positioned in the peripheral region 30 may be completely removed so that the second organic film layer 113 may have an opening in the peripheral region 30. In this case, the upper surface of the first barrier layer 112 may be exposed through the opening.

[0075] The second organic film layer 113 may include an organic material having flexibility. For example, the second organic film layer 113 may include a random copolymer or a block copolymer. In example embodiments, the second organic film layer 113 may include polyimide.

[0076] The second barrier layer 114 may be located on the entire second organic film layer 113. In example embodiments, the second barrier layer 114 may have an opening in the peripheral region 30. Therefore, the second barrier layer 114 may have a first protruding portion 116 and a second protruding portion 117 protruding in the interior of the groove (or a tip protruding in the interior of the groove) on the groove, and may have an opening defined by the first protruding portion 116 and the second protruding portion 117. For example, the first protruding portion 116 may be located adjacent to a boundary of the peripheral region 30 and the opening region 20 (e.g., the opening 910 of the substrate 110). The second protruding portion 117 may face the first protruding portion 116 and may be spaced apart from the first protruding portion 116. The width of the opening of the second barrier layer 114 may have a first width W1 (refer to FIG. 1 ) that is smaller than a second width W2. Fig.13 ). In addition, the space positioned below each of the first protrusion 116 and the second protrusion 117 may be defined as a first space 118 and a second space 119 (refer to Fig.14 ). The groove of the second organic film layer 113, the first protruding portion 116 and the second protruding portion 117 of the second barrier layer 114, and the opening of the second barrier layer 114 may be defined as a groove 930 having an extended lower portion, the groove 930 being formed in the OLED device 100 and positioned in the peripheral region 30. For example, the groove 930 having the extended lower portion may have an undercut shape. The groove 930 may be used as a blocking pattern capable of blocking water and / or moisture that penetrates from the opening region 20 into the display region 10. In an example embodiment, a plurality of grooves may be formed between the groove 930 and the functional module 700, and may be formed between the light emitting structure 200 and the groove 930 positioned adjacent to the boundary of the display region 10 and the peripheral region 30.

[0077] The second barrier layer 114 may block water and / or moisture that penetrates through the second organic film layer 113. The second barrier layer 114 may include an inorganic material having flexibility. In example embodiments, the second barrier layer 114 may include SiO x 、SiN x wait.

[0078] Therefore, a substrate 110 including a first organic film layer 111 , a first barrier layer 112 , a second organic film layer 113 , and a second barrier layer 114 may be provided.

[0079] In example embodiments, the substrate 110 includes four layers, but the substrate 110 may include, for example, a single layer or at least two layers.

[0080] In example embodiments, the substrate 110 may include a transparent or opaque material. For example, the substrate 110 may include a quartz substrate, a synthetic quartz substrate, a calcium fluoride substrate, a fluoride-doped quartz substrate, a soda-lime glass substrate, an alkali-free glass substrate, or the like.

[0081] The buffer layer may be located on the substrate 110 (e.g., the second barrier layer 114). For example, the buffer layer may be located on the entire substrate 110 except for the peripheral region 30. In another embodiment, the buffer layer may be located on the substrate 110 in the peripheral region 30. In this case, the buffer layer may have an opening overlapping the opening of the second barrier layer 114. The buffer layer can help prevent metal atoms and / or impurities from diffusing from the substrate 110 into the semiconductor element 250 and the light emitting structure 200. In addition, the buffer layer can control the heat transfer rate in the crystallization process for forming the active layer 130, thereby obtaining a substantially uniform active layer 130. In addition, when the surface of the substrate 110 is relatively irregular, the buffer layer can improve the surface flatness of the substrate 110. Depending on the type of the substrate 110, at least two buffer layers may be provided on the substrate 110, or no buffer layer may be provided. For example, the buffer layer may include an organic material or an inorganic material.

[0082] The active layer 130 may be located on the substrate 110 in the display region 10. The active layer 130 may include an oxide semiconductor, an inorganic semiconductor (eg, amorphous silicon, polysilicon, etc.), an organic semiconductor, etc. The active layer 130 may have a source region and a drain region.

[0083] The gate insulating layer 150 may be located on the active layer 130. The gate insulating layer 150 may be in the display region 10 and cover the active layer 130 on the substrate 110, and may not be in the peripheral region 30. Therefore, the gate insulating layer 150 may be located only in the display region 10 on the substrate 110. For example, the gate insulating layer 150 may fully cover the active layer 130 on the substrate 110, and may have a substantially flat upper surface without steps around the active layer 130. In another embodiment, the gate insulating layer 150 may cover the active layer 130 on the substrate 110, and may be disposed with a substantially uniform thickness along the contour of the active layer 130. The gate insulating layer 150 may include a silicon compound, a metal oxide, etc. In an example embodiment, the gate insulating layer 150 may have a multilayer structure including a plurality of insulating layers. For example, the insulating layers may have different thicknesses from each other or include different materials from each other.

[0084] The gate electrode 170 may be located on the gate insulating layer 150 in the display region 10. The gate electrode 170 may be located on a portion of the gate insulating layer 150 under which the active layer 130 is located. The gate electrode 170 may include a metal, a metal alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These may be used alone or in a suitable combination thereof. In another embodiment, the gate electrode 170 may have a multilayer structure including a plurality of layers.

[0085] The insulating interlayer 190 may be located on the gate electrode 170. The insulating interlayer 190 may be in the display region 10 and cover the gate electrode 170 on the gate insulating layer 150, and may not be in the peripheral region 30. Therefore, the insulating interlayer 190 may be located only in the display region 10 on the gate insulating layer 150. For example, the insulating interlayer 190 may fully cover the gate electrode 170 on the gate insulating layer 150, and may have a substantially flat upper surface without steps around the gate electrode 170. In another embodiment, the insulating interlayer 190 may cover the gate electrode 170 on the gate insulating layer 150, and may be provided with a substantially uniform thickness along the contour of the gate electrode 170. The insulating interlayer 190 may include a silicon compound, a metal oxide, etc. In an example embodiment, the insulating interlayer 190 may have a multilayer structure including a plurality of insulating layers. The insulating layers may have different thicknesses from each other or include different materials from each other.

[0086] The source electrode 210 and the drain electrode 230 may be located on the insulating interlayer 190 in the display area 10. The source electrode 210 may be connected to the source region of the active layer 130 via a contact hole formed by removing the first portion of the gate insulating layer 150 and the insulating interlayer 190. The drain electrode 230 may be connected to the drain region of the active layer 130 via a contact hole formed by removing the second portion of the gate insulating layer 150 and the insulating interlayer 190. Each of the source electrode 210 and the drain electrode 230 may include a metal, a metal alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These may be used alone or in a suitable combination thereof. In an example embodiment, each of the source electrode 210 and the drain electrode 230 may have a multilayer structure including a plurality of layers. Therefore, a semiconductor element 250 including an active layer 130, a gate insulating layer 150, a gate electrode 170, an insulating interlayer 190, a source electrode 210, and a drain electrode 230 may be provided.

[0087] In example embodiments, for example, the semiconductor element 250 may have a top gate structure. In another embodiment, the semiconductor element 250 may have a bottom gate structure, a double gate structure, or the like.

[0088] In addition, for example, the OLED device 100 may include one semiconductor element. In another embodiment, the OLED device 100 may include at least one semiconductor element and at least one capacitor.

[0089] The planarization layer 270 may be located on the insulating interlayer 190, the source electrode 210, and the drain electrode 230. The planarization layer 270 may cover the source electrode 210 and the drain electrode 230 in the display region 10 and on the insulating interlayer 190, and may not be in the peripheral region 30. Therefore, the planarization layer 270 may be located only in the display region 10 on the insulating interlayer 190. For example, the planarization layer 270 may be disposed in the display region 10 with a relatively high thickness. In this case, the planarization layer 270 may have a substantially flat upper surface, and a planarization process may be further performed on the planarization layer 270 to achieve a flat upper surface of the planarization layer 270. In another embodiment, the planarization layer 270 may be disposed in the display region 10 with a substantially uniform thickness along the contours of the source electrode 210 and the drain electrode 230 on the insulating interlayer 190. The planarization layer 270 may include an organic material or an inorganic material. In an example embodiment, the planarization layer 270 may include an organic material.

[0090] The lower electrode 290 may be located on the planarization layer 270 in the display area 10. The lower electrode 290 may be connected to the drain electrode 230 via a contact hole formed by removing a portion of the planarization layer 270. In addition, the lower electrode 290 may be electrically connected to the semiconductor element 250. The lower electrode 290 may include a metal, a metal alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These may be used alone or in a suitable combination thereof. In example embodiments, the lower electrode 290 may have a multilayer structure including a plurality of layers.

[0091] The pixel defining layer 310 may be located on the planarization layer 270 in the display region 10, and may not be in the peripheral region 30. Therefore, the pixel defining layer 310 may be located only in the display region 10. For example, the pixel defining layer 310 may cover both lateral portions of the lower electrode 290, and may expose a portion of the upper surface of the lower electrode 290. The pixel defining layer 310 may include an organic material or an inorganic material. In example embodiments, the pixel defining layer 310 may include an organic material.

[0092] The light emitting layer 330 may be located on the pixel defining layer 310 and the lower electrode 290 in the display region 10 and may extend in the first direction D1, and may be located on the substrate 110 in the peripheral region 30. In example embodiments, the light emitting layer 330 may be partially in the inner portion of the groove 930, and the light emitting layer 330 in the portion where the groove 930 is located may be divided in the depth direction (e.g., a direction from the second barrier layer 114 to the first organic film layer 111). Therefore, the light emitting layer 330 may be divided in the peripheral region 30. Therefore, the light emitting layer 330 may be divided by the first space 118 and the second space 119 in the peripheral region 30.

[0093] For example, when the groove 930 does not have the first protruding portion 116 and the second protruding portion 117, the light emitting layer 330 may be continuously disposed in the portion where the groove 930 is formed, and the light emitting layer 330 may serve as a permeation path for water and / or moisture. Therefore, a portion of the light emitting layer 330 (e.g., the side distal end of the light emitting layer 330) may be exposed in the opening region 20, and water and / or moisture may penetrate into the exposed portion of the light emitting layer 330. In this case, the semiconductor element 250 and the light emitting structure 200 positioned adjacent to the peripheral region 30 in the display region 10 may be damaged by water and / or moisture. Meanwhile, according to an example embodiment, the OLED device 100 includes a groove 930 having an extended lower portion. Therefore, the light emitting layer 330 may be separated in the inner portion of the groove 930, so that the permeation path of the light emitting layer 330 may be blocked. Therefore, when the light emitting layer 330 is in the peripheral region 30, defects of pixels included in the OLED device 100 do not occur.

[0094] The light emitting layer 330 may have a multi-layer structure including an organic light emitting layer ("EML"), a hole injection layer ("HIL"), a hole transport layer ("HTL"), an electron transport layer ("ETL"), an electron injection layer ("EIL"), etc. In example embodiments, the EML, the HIL, the HTL, the ETL, and the EIL may be located in the peripheral region 30. In example embodiments, the HIL, the HTL, the ETL, and the EIL except the EML may be located in the peripheral region 30.

[0095] The EML of the light emitting layer 330 can be formed using at least one of the light emitting materials capable of producing light of different colors (e.g., red light, blue light, green light, etc.) according to the sub-pixel. In another embodiment, the EML of the light emitting layer 330 can generally produce white light by stacking a plurality of light emitting materials capable of producing light of different colors (such as red light, green light, blue light, etc.). In this case, a color filter can be located on the light emitting layer 330 positioned on the lower electrode 290. The color filter may include at least one selected from a red color filter, a green color filter, and a blue color filter. In another embodiment, the color filter may include a yellow color filter, a cyan color filter, and a magenta color filter. The color filter may include a photosensitive resin, a color photoresist, etc.

[0096] The upper electrode 340 may be located on the light emitting layer 330. The upper electrode 340 may overlap the light emitting layer 330 in the display area 10 and may extend in the first direction D1, and may be located on the light emitting layer 330 in the peripheral area 30. In example embodiments, the upper electrode 340 may be partially in the inner portion of the groove 930, and the upper electrode 340 in the portion where the groove 930 is located may be separated in the depth direction. Therefore, the upper electrode 340 may be separated in the peripheral area 30. Therefore, the upper electrode 340 may be separated by the first space 118 and the second space 119 in the peripheral area 30.

[0097] For example, when the groove 930 does not have the first protruding portion 116 and the second protruding portion 117, the upper electrode 340 may be continuously disposed in the portion where the groove 930 is formed, and the upper electrode 340 may serve as a permeation path for water and / or moisture. Therefore, a portion of the upper electrode 340 (e.g., the side distal end of the upper electrode 340) may be exposed in the opening region 20, and water and / or moisture may penetrate into the exposed portion of the upper electrode 340. In this case, the semiconductor element 250 and the light emitting structure 200 positioned adjacent to the peripheral region 30 in the display region 10 may be damaged by water and / or moisture. Meanwhile, according to example embodiments, the OLED device 100 may include a groove 930 having an extended lower portion. Therefore, the upper electrode 340 may be separated in the inner portion of the groove 930. Therefore, when the upper electrode 340 is separated in the inner portion of the groove 930, the permeation path of the upper electrode 340 may be blocked. Therefore, when the upper electrode 340 is in the peripheral region 30 , defects of pixels included in the OLED device 100 do not occur.

[0098] The upper electrode 340 may include a metal, a metal alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These may be used alone or in a suitable combination thereof. In example embodiments, the upper electrode 340 may have a multilayer structure including a plurality of layers.

[0099] Therefore, the light emitting structure 200 including the lower electrode 290 , the light emitting layer 330 , and the upper electrode 340 may be provided.

[0100] The cover layer may be located on the upper electrode 340. The cover layer may overlap the upper electrode 340 in the display area 10 and may extend in the first direction D1, and may be located on the upper electrode 340 in the peripheral area 30. In example embodiments, the cover layer may be partially in the inner portion of the groove 930, and the cover layer in the portion where the groove 930 is located may be separated in the depth direction. Therefore, the cover layer may be separated in the peripheral area 30. Therefore, the cover layer may be separated by the first space 118 and the second space 119 in the peripheral area 30.

[0101] For example, when the groove 930 does not have the first protruding portion 116 and the second protruding portion 117, the cover layer can be continuously disposed in the portion where the groove 930 is formed, and the cover layer can serve as a permeation path for water and / or moisture. Therefore, a portion of the cover layer (e.g., the side distal end of the cover layer) can be exposed in the opening region 20, and water and / or moisture can penetrate into the exposed portion of the cover layer. In this case, the semiconductor element 250 and the light emitting structure 200 located adjacent to the peripheral region 30 in the display region 10 may be damaged by water and / or moisture. Meanwhile, according to an example embodiment, the OLED device 100 includes a groove 930 having an extended lower portion. Therefore, the cover layer can be separated in the inner portion of the groove 930. Therefore, when the cover layer is separated in the inner portion of the groove 930, the permeation path of the cover layer can be blocked. Therefore, when the cover layer is in the peripheral region 30, defects of pixels included in the OLED device 100 do not occur.

[0102] The cover layer may protect the light emitting structure 200, and may include an organic material or an inorganic material. In example embodiments, the cover layer may include an organic material such as a triamine derivative, an arylene diamine derivative, 4,4'-N,N'-dicarbazole-biphenyl ("CBP"), tris(8-hydroxyquinoline)aluminum ("Alq 3 ")wait.

[0103] The first TFE layer 451 may be located on the upper electrode 340 in the display region 10 and the peripheral region 30. The first TFE layer 451 may cover the upper electrode 340 in the display region 10, and may be disposed with a substantially uniform thickness along the contour of the upper electrode 340 and may extend in the peripheral region 30. The first TFE layer 451 may be disposed along the contour of the upper electrode 340 in the peripheral region 30. Therefore, the first TFE layer 451 may be continuously disposed in the portion where the groove 930 is formed. In example embodiments, the first TFE layer 451 may completely cover the groove 930. Therefore, the first TFE layer 451 may cover the first protruding portion 116 and the second protruding portion 117, and may be in the first space 118 and the second space 119 and completely cover the light emitting layer 330 and the upper electrode 340 disposed inside the groove 930. Therefore, the first TFE layer 451 may directly contact the second organic film layer 113 in the first space 118 and the second space 119. The first TFE layer 451 may help prevent the light emitting structure 200 from being degraded due to penetration of moisture, water, oxygen, etc. In addition, the first TFE layer 451 may protect the light emitting structure 200 from external impact. The first TFE layer 451 may include an inorganic material having flexibility.

[0104] The second TFE layer 452 may be located on the first TFE layer 451 in the display region 10, and may not be in the peripheral region 30. Therefore, the second TFE layer 452 may be only in the display region 10. In another embodiment, the second TFE layer 452 may be in a portion of the peripheral region 30. The second TFE layer 452 may improve the flatness of the OLED device 100, and may protect the light emitting structure 200. The second TFE layer 452 may include an organic material having flexibility.

[0105] The third TFE layer 453 may be located on the second TFE layer 452 in the display area 10 and on the first TFE layer 451 in the peripheral area 30. The third TFE layer 453 may cover the second TFE layer 452 in the display area 10, and may be disposed with a substantially uniform thickness along the contour of the second TFE layer 452 and may extend in the peripheral area 30. The third TFE layer 453 may be disposed with a substantially uniform thickness along the contour of the first TFE layer 451 in the peripheral area 30. Therefore, the third TFE layer 453 may be continuously formed in the portion where the groove 930 is formed. The third TFE layer 453 together with the first TFE layer 451 may help prevent the light emitting structure 200 from being degraded due to the penetration of moisture, water, oxygen, etc. In addition, the third TFE layer 453 together with the first TFE layer 451 and the second TFE layer 452 may protect the light emitting structure 200 from external impact. The third TFE layer 453 may include an inorganic material having flexibility.

[0106] Thus, a TFE structure 450 including first, second, and third TFE layers 451, 452, and 453 may be provided. In another embodiment, the TFE structure 450 may have a five-layer structure having first to fifth TFE layers stacked or a seven-layer structure having first to seventh TFE layers stacked.

[0107] The first insulating layer 390 may be located on the third TFE layer 453 in the display area 10 and the peripheral area 30. The first insulating layer 390 may cover the third TFE layer 453 in the display area 10, and may be provided with a substantially uniform thickness along the contour of the third TFE layer 453 and may extend in the peripheral area 30. The first insulating layer 390 may be provided with a substantially uniform thickness along the contour of the third TFE layer 453 in the peripheral area 30. Therefore, the first insulating layer 390 may be continuously provided in the portion where the first insulating layer 390 is formed. The first insulating layer 390 may include an organic material or an inorganic material. In another embodiment, the first insulating layer 390 may have a multilayer structure including a plurality of insulating layers. For example, the insulating layers may have different thicknesses from each other or include different materials from each other.

[0108] The organic insulating pattern 490 may be located on the first insulating layer 390 in the peripheral region 30. In example embodiments, the organic insulating pattern 490 may be only in the peripheral region 30. In another embodiment, the organic insulating pattern 490 may be in a portion of the display region 10. The organic insulating pattern 490 may be disposed on the first insulating layer 390 in the peripheral region 30 with a relatively high thickness. In this case, the organic insulating pattern 490 may have a substantially flat upper surface, and a planarization process may be further performed on the organic insulating pattern 490 to achieve a flat upper surface of the organic insulating pattern 490. In another embodiment, the organic insulating pattern 490 may be disposed on the first insulating layer 390 with a substantially uniform thickness along a contour of the first insulating layer 390 in the display region 10. In example embodiments, the organic insulating pattern 490 may include an organic material such as a photoresist, a polyacrylic resin, a polyimide resin, a polyamide resin, a siloxane resin, an acrylic resin, an epoxy resin, or the like.

[0109] The first touch screen electrode 382 and the second touch screen electrode 384 may be located on the first insulating layer 390 in the display area 10. Fig. 9 As shown in , each first touch screen electrode 382 may extend in the first direction D1 and may be spaced apart from each other along the second direction D2. The second touch screen electrodes 384 may be spaced apart from each other along the first direction D1 between two adjacent first touch screen electrodes 382 among the first touch screen electrodes 382. For example, each of the first touch screen electrodes 382 and the second touch screen electrodes 384 may include carbon nanotubes (CNTs), transparent conductive oxides (such as ITO, indium gallium zinc oxide (IGZO), ZnO), graphene, Ag nanowires (AgNW), Cu, Cr, etc.

[0110] The second insulating layer 395 may be located on the first touch screen electrode 382 and the second touch screen electrode 384 in the display area 10. The second insulating layer 395 may cover the first touch screen electrode 382 and the second touch screen electrode 384 in the display area 10, and may be disposed with a substantially uniform thickness along the contours of the first touch screen electrode 382 and the second touch screen electrode 384 and may extend in the peripheral area 30. The second insulating layer 395 may be disposed along the contour of the organic insulating pattern 490 in the peripheral area 30. Therefore, the second insulating layer 395 may contact the upper surface of the first insulating layer 390 in the display area 10, and may contact the upper surface of the organic insulating pattern 490 in the peripheral area 30. The second insulating layer 395 may include an organic material or an inorganic material. In another embodiment, the second insulating layer 395 may have a multilayer structure including a plurality of insulating layers. The insulating layers may have different thicknesses from each other or include different materials from each other.

[0111] The touch screen connection electrode 386 may be located on the second insulating layer 395 in the display area 10. Fig. 9 As shown in , the touch screen connection electrode 386 can electrically connect two second touch screen electrodes 384 adjacent in the second direction D2 among the second touch screen electrodes 384 through the contact hole. For example, the touch screen connection electrode 386 and the first touch screen electrode 382 and the second touch screen electrode 384 can have the same material. In another embodiment, the touch screen connection electrode 386 can include a metal, a metal alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These can be used alone or in a suitable combination thereof.

[0112] The conductive pattern 400 may be located on the second insulating layer 395 in the peripheral region 30. In example embodiments, in order to detect damage of the second protruding portion 117 (or the first protruding portion 116), the conductive pattern 400 may overlap the second protruding portion 117 of the groove 930. In another embodiment, the conductive pattern 400 may overlap the first protruding portion 116.

[0113] For example, the conductive pattern 400 on the groove 930 may be arranged along the contour of the second protruding portion 117 of the groove 930. The conductive pattern 400 may substantially surround the functional module 700 (or the opening 910). The conductive pattern 400 may include a first sub-conductive pattern 401 and a second sub-conductive pattern 402 (see Figure 6 ). The first sub-conductive pattern 401 may have a circular planar shape including a partial opening of an opening portion, and the second sub-conductive pattern 402 may extend in the second direction D2 from the opening portion of the first sub-conductive pattern 401. In example embodiments, the first sub-conductive pattern 401 and the second sub-conductive pattern 402 may be integrally formed at the same layer.

[0114] In another embodiment, the first sub-conductive pattern 401 may be located on the second sub-conductive pattern 402, and the opening portion of the first sub-conductive pattern 401 may be connected to the distal end of the second sub-conductive pattern 402 through a contact hole. In another embodiment, the second sub-conductive pattern 402 may be located on the first sub-conductive pattern 401, and the opening portion of the first sub-conductive pattern 401 may be connected to the distal end of the second sub-conductive pattern 402 through a contact hole.

[0115] The first sub-conductive pattern 401 may overlap with the groove 930. For example, the first sub-conductive pattern 401 may overlap with the outermost portion of the groove 930. Thus, the first sub-conductive pattern 401 may overlap with the outer boundary of the groove. In another embodiment, the first sub-conductive pattern 401 may overlap with the innermost portion of the groove 930. Thus, the first sub-conductive pattern 401 may overlap with the inner boundary of the groove 930.

[0116] The conductive pattern 400 and the touch screen connection electrode 386 may be formed simultaneously using the same material. In another embodiment, the conductive pattern 400 and the first touch screen electrode 382 and the second touch screen electrode 384 may be formed simultaneously using the same material.

[0117] The protective insulating layer 410 may be located on the second insulating layer 395, the touch screen connection electrode 386, and the conductive pattern 400 in the display area 10 and the peripheral area 30. The protective insulating layer 410 may be disposed on the second insulating layer 395 with a relatively high thickness. In this case, the protective insulating layer 410 may have a substantially flat upper surface. In another embodiment, the protective insulating layer 410 may cover the touch screen connection electrode 386 and the conductive pattern 400 in the display area 10 and the peripheral area 30 and on the second insulating layer 395, and may be disposed with a substantially uniform thickness along the contours of the touch screen connection electrode 386 and the conductive pattern 400. The protective insulating layer 410 may include an organic material or an inorganic material. In an example embodiment, the protective insulating layer 410 may include an organic material.

[0118] As described above, the touch screen structure 380 including the first insulating layer 390 , the first touch screen electrodes 382 , the second touch screen electrodes 384 , the second insulating layer 395 , the touch screen connection electrodes 386 , and the protective insulating layer 410 may be arranged.

[0119] The functional module 700 may be located in the opening region 20. In example embodiments, the functional module 700 may contact a side surface of the substrate 110, a side surface of the light emitting layer 330, a side surface of the upper electrode 340, a side surface of the first TFE layer 451, a side surface of the third TFE layer 453, a side surface of the first insulating layer 390, a side surface of the organic insulating pattern 490, a side surface of the second insulating layer 395, and a side surface of the protective insulating layer 410 in a boundary between the peripheral region 30 and the opening region 20.

[0120] For example, the functional module 700 may include a camera module, a facial recognition sensor module, a pupil recognition sensor module, an acceleration and geomagnetic sensor module, a proximity and infrared sensor module, and a light intensity sensor module, etc. In an example embodiment, a vibration or haptic module for indicating an incoming alarm, a speaker module for outputting sound, etc. may be located in the opening 910.

[0121] The OLED device 100 according to the example embodiment includes the conductive pattern 400, the pad electrode 470, and the connection wiring 370. Therefore, the OLED device 100 can check whether the second protrusion portion 117 is damaged. Therefore, the defect rate of the OLED device 100 can be reduced by checking whether the second protrusion portion 117 is damaged.

[0122] Figures 10 to 20 is a cross-sectional view illustrating a method of manufacturing an OLED device according to example embodiments.

[0123] Reference Fig.10 , a rigid glass substrate 105 may be provided. A first organic film layer 111 may be formed on the rigid glass substrate 105. The first organic film layer 111 may be formed on the entire rigid glass substrate 105, and may be formed using an organic material having flexibility, such as polyimide.

[0124] The first barrier layer 112 may be formed on the entire first organic film layer 111. The first barrier layer 112 may block water and / or moisture that penetrates through the first organic film layer 111. The first barrier layer 112 may be formed using an inorganic material having flexibility (such as silicon oxide, silicon nitride, etc.). For example, the first barrier layer 112 may include SiO x 、SiN x 、SiO x N y 、SiO x C y 、SiC x N y 、AlO x 、AlN x 、TaO x , HfO x 、ZrO x 、TiO x wait.

[0125] The second organic film layer 113 may be formed on the first barrier layer 112. The second organic film layer 113 may be formed on the entire first barrier layer 112, and may be formed using an organic material having flexibility, such as polyimide.

[0126] The second barrier layer 114 may be formed on the entire second organic film layer 113. The second barrier layer 114 may block water and / or moisture that penetrates through the second organic film layer 113. The second barrier layer 114 may be made of an inorganic material having flexibility (such as SiO x 、SiN x etc.) are formed.

[0127] Thus, the substrate 110 including the first organic film layer 111 , the first barrier layer 112 , the second organic film layer 113 , and the second barrier layer 114 may be formed.

[0128] The substrate 110 may be relatively thin and flexible. Therefore, the substrate 110 may be formed on the rigid glass substrate 105 to help support the formation of the upper structure (e.g., semiconductor elements and light emitting structures, etc.). For example, after the upper structure is formed on the substrate 110, the rigid glass substrate 105 may be removed. Because the first organic film layer 111 and the second organic film layer 113 and the first barrier layer 112 and the second barrier layer 114 are relatively thin and flexible, it may not be easy to directly form the upper structure on the first organic film layer 111 and the second organic film layer 113 and the first barrier layer 112 and the second barrier layer 114. Therefore, the upper structure may be formed on the substrate 110 and the rigid glass substrate 105, and then after removing the rigid glass substrate 105, the first organic film layer 111 and the second organic film layer 113 and the first barrier layer 112 and the second barrier layer 114 may be used as the substrate 110.

[0129] A buffer layer may be formed on the substrate 110. The buffer layer may be formed on the entire substrate 110. The buffer layer may help prevent diffusion of metal atoms and / or impurities from the substrate 110. In addition, the buffer layer may control the heat transfer rate in the crystallization process for forming the active layer, thereby obtaining a substantially uniform active layer. In addition, when the surface of the substrate 110 is relatively irregular, the buffer layer may improve the surface flatness of the substrate 110. Depending on the type of the substrate 110, at least two buffer layers may be provided on the substrate 110, or no buffer layer may be formed. For example, the buffer layer may be formed using an organic material or an inorganic material.

[0130] Reference Fig.11 , an active layer 130 may be formed in the display region 10 and on the substrate 110. The active layer 130 may be formed using an oxide semiconductor, an inorganic semiconductor, an organic semiconductor, etc. The active layer 130 may have a source region and a drain region.

[0131] The gate insulating layer 150 may be formed on the active layer 130. The gate insulating layer 150 may cover the active layer 130 in the display region 10 and on the substrate 110, and may extend from the display region 10 to the opening region 20 in the first direction D1. Therefore, the gate insulating layer 150 may be formed on the entire substrate 110. For example, the gate insulating layer 150 may fully cover the active layer 130 on the substrate 110, and may have a substantially flat upper surface without steps around the active layer 130. In another embodiment, the gate insulating layer 150 may cover the active layer 130 on the substrate 110, and may be formed with a substantially uniform thickness along the contour of the active layer 130. The gate insulating layer 150 may be formed using silicon compounds, metal oxides, etc. In another embodiment, the gate insulating layer 150 may have a multilayer structure including a plurality of insulating layers. For example, the insulating layers may have different thicknesses from each other or include different materials from each other.

[0132] The gate electrode 170 may be formed in the display region 10 and on the gate insulating layer 150. The gate electrode 170 may be formed on a portion of the gate insulating layer 150 under which the active layer 130 is positioned. The gate electrode 170 may be formed using a metal, a metal alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These may be used alone or in a suitable combination thereof. In another embodiment, the gate electrode 170 may have a multilayer structure including a plurality of layers.

[0133] An insulating interlayer 190 may be formed on the gate electrode 170. The insulating interlayer 190 may cover the gate electrode 170 in the display region 10 and on the gate insulating layer 150, and may extend in the first direction D1. Therefore, the insulating interlayer 190 may be formed on the entire gate insulating layer 150. For example, the insulating interlayer 190 may fully cover the gate electrode 170 on the gate insulating layer 150, and may have a substantially flat upper surface without steps around the gate electrode 170. In another embodiment, the insulating interlayer 190 may cover the gate electrode 170 on the gate insulating layer 150, and may be formed with a substantially uniform thickness along the contour of the gate electrode 170. The insulating interlayer 190 may be formed using a silicon compound, a metal oxide, or the like. In an example embodiment, the insulating interlayer 190 may have a multilayer structure including a plurality of insulating layers. The insulating layers may have different thicknesses from each other or include different materials from each other.

[0134] Reference Fig.12 , a source electrode 210 and a drain electrode 230 may be formed in the display area 10 and on the insulating interlayer 190. The source electrode 210 may be connected to the source region of the active layer 130 via a contact hole formed by removing the first portion of the gate insulating layer 150 and the insulating interlayer 190. The drain electrode 230 may be connected to the drain region of the active layer 130 via a contact hole formed by removing the second portion of the gate insulating layer 150 and the insulating interlayer 190. Each of the source electrode 210 and the drain electrode 230 may include a metal, a metal alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These may be used alone or in a suitable combination thereof. In an example embodiment, each of the source electrode 210 and the drain electrode 230 may have a multilayer structure including a plurality of layers. Therefore, a semiconductor element 250 including the active layer 130, the gate insulating layer 150, the gate electrode 170, the insulating interlayer 190, the source electrode 210, and the drain electrode 230 may be formed.

[0135] A planarization layer 270 may be formed on the insulating interlayer 190, the source electrode 210, and the drain electrode 230. The planarization layer 270 may cover the source electrode 210 and the drain electrode 230 in the display region 10 and on the insulating interlayer 190, and may not be formed in the peripheral region 30. Therefore, the planarization layer 270 may be formed only in the display region 10 and on the insulating interlayer 190. For example, the planarization layer 270 may be formed with a relatively high thickness in the display region 10. In this case, the planarization layer 270 may have a substantially flat upper surface, and a planarization process may be further performed on the planarization layer 270 to achieve a flat upper surface of the planarization layer 270. In another embodiment, the planarization layer 270 may be formed with a substantially uniform thickness along the contours of the source electrode 210 and the drain electrode 230 in the display region 10 and on the insulating interlayer 190. The planarization layer 270 may be formed using an organic material.

[0136] A lower electrode 290 may be formed in the display region 10 and on the planarization layer 270. The lower electrode 290 may be connected to the drain electrode 230 via a contact hole formed by removing a portion of the planarization layer 270. In addition, the lower electrode 290 may be electrically connected to the semiconductor element 250. The lower electrode 290 may be formed using a metal, a metal alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, or the like. These may be used alone or in a suitable combination thereof. In an example embodiment, the lower electrode 290 may have a multilayer structure including a plurality of layers.

[0137] Reference Fig.13 , after forming the lower electrode 290, the gate insulating layer 150 and the insulating interlayer 190 positioned in the peripheral region 30 may be removed. After removing the gate insulating layer 150 and the insulating interlayer 190 positioned in the peripheral region 30, a groove 930 having an extended lower portion may be formed in the substrate 110 positioned in the peripheral region 30 by a laser or dry etching process. The groove 930 may have an undercut shape. For example, a groove having a second width W2 formed in the second organic film layer 113 and an opening having a first width W1 less than the second width W2 formed in the second barrier layer 114 may be defined as an undercut shape. In another embodiment, an opening having a second width W2 formed in the second organic film layer 113 and an opening having a first width W1 less than the second width W2 formed in the second barrier layer 114 may be defined as an undercut shape. In this case, the upper surface of the first barrier layer 112 may be exposed through the opening of the second organic film layer 113.

[0138] The first protruding portion 116 and the second protruding portion 117 protruding in the inner portion of the groove on the groove of the second organic film layer 113 may be defined by the opening of the second barrier layer 114. For example, the first protruding portion 116 may be located adjacent to the boundary of the peripheral region 30 and the opening region 20. The second protruding portion 117 may face the first protruding portion 116 and may be spaced apart from the first protruding portion 116. In addition, the space located below each of the first protruding portion 116 and the second protruding portion 117 may be defined as a first space 118 and a second space 119 (refer to Fig.14 ). Therefore, the groove of the second organic film layer 113, the first and second protruding portions 116 and 117 of the second barrier layer 114, and the opening of the second barrier layer 114 may be defined as a groove 930 formed in the substrate 110 positioned in the peripheral region 30, the groove 930 having an expanded lower portion. In example embodiments, a plurality of grooves may be formed to be spaced apart from the groove 930 in the first direction D1, and may be formed to be spaced apart from the groove 930 in a direction opposite to the first direction D1.

[0139] Reference Fig.14 , the pixel defining layer 310 may be formed in the display region 10 and on the planarization layer 270, and the pixel defining layer 310 may not be formed in the peripheral region 30. Therefore, the pixel defining layer 310 may be formed only in the display region 10. For example, the pixel defining layer 310 may cover both lateral portions of the lower electrode 290, and may expose a portion of the upper surface of the lower electrode 290. The pixel defining layer 310 may be formed using an organic material.

[0140] The light emitting layer 330 may be formed on the lower electrode 290 and the pixel defining layer 310 in the display region 10 and may extend in the first direction D1, and may be formed in the peripheral region 30. In example embodiments, the light emitting layer 330 may be partially formed in the inner portion of the groove 930, and the light emitting layer 330 located in the portion where the groove 930 is located may be divided in the depth direction. Therefore, the light emitting layer 330 may be divided in the peripheral region 30. Therefore, the light emitting layer 330 may be divided by the first space 118 and the second space 119 in the peripheral region 30.

[0141] The light emitting layer 330 may have a multi-layer structure including EML, HIL, HTL, ETL, EIL, etc. In example embodiments, the EML, HIL, HTL, ETL, and EIL may be formed in the peripheral region 30. In example embodiments, the HIL, HTL, ETL, and EIL may be formed in the peripheral region 30 except for the EML.

[0142] The EML of the light-emitting layer 330 may be formed using at least one of the light-emitting materials capable of generating light of different colors (e.g., red light, blue light, green light, etc.) according to the sub-pixel. In another embodiment, the EML of the light-emitting layer 330 may generally generate white light by stacking a plurality of light-emitting materials capable of generating light of different colors (such as red light, green light, blue light, etc.). In this case, a color filter may be formed on the light-emitting layer 330 formed on the lower electrode 290. The color filter may include at least one selected from a red color filter, a green color filter, and a blue color filter. In another embodiment, the color filter may include a yellow color filter, a cyan color filter, and a magenta color filter. The color filter may be formed using a photosensitive resin, a color photoresist, etc.

[0143] The upper electrode 340 may be formed on the light emitting layer 330. The upper electrode 340 may be formed to overlap the light emitting layer 330 in the display area 10 and may extend in the first direction D1, and may be formed on the light emitting layer 330 in the peripheral area 30. In example embodiments, the upper electrode 340 may be partially formed in the inner portion of the groove 930, and the upper electrode 340 located in the portion where the groove 930 is located may be separated in the depth direction. Therefore, the upper electrode 340 may be separated in the peripheral area 30. Therefore, the upper electrode 340 may be separated by the first space 118 and the second space 119 in the peripheral area 30.

[0144] The upper electrode 340 may be formed using metal, metal alloy, metal nitride, conductive metal oxide, transparent conductive material, etc. These may be used alone or in appropriate combination thereof. In example embodiments, the upper electrode 340 may have a multi-layer structure including a plurality of layers.

[0145] Thus, the light emitting structure 200 including the lower electrode 290 , the light emitting layer 330 , and the upper electrode 340 may be formed.

[0146] Reference Fig.15 , a covering layer may be formed on the upper electrode 340. The covering layer may be formed to overlap with the upper electrode 340 in the display area 10 and may extend in the first direction D1, and may be formed on the upper electrode 340 in the peripheral area 30. In example embodiments, the covering layer may be partially formed in the inner portion of the groove 930, and the covering layer located in the portion where the groove 930 is located may be separated in the depth direction. Therefore, the covering layer may be separated in the peripheral area 30. Therefore, the covering layer may be separated by the first space 118 and the second space 119 in the peripheral area 30. The covering layer may protect the light emitting structure 200, and may use a material such as a triamine derivative, an arylene diamine derivative, CBP, Alq 3 Formed by organic materials such as etc.

[0147] The first TFE layer 451 may be formed in the display region 10 and the peripheral region 30 and on the upper electrode 340. The first TFE layer 451 may cover the upper electrode 340 in the display region 10, and may be formed with a substantially uniform thickness along the contour of the upper electrode 340 and may extend in the peripheral region 30. The first TFE layer 451 may be formed along the contour of the upper electrode 340 in the peripheral region 30. Therefore, the first TFE layer 451 may be continuously formed in the portion where the groove 930 is formed. In example embodiments, the first TFE layer 451 may completely cover the groove 930. Therefore, the first TFE layer 451 may cover the first protruding portion 116 and the second protruding portion 117, and may be formed in the first space 118 and the second space 119 and may completely cover the light emitting layer 330 and the upper electrode 340 formed inside the groove 930. Therefore, the first TFE layer 451 may directly contact the second organic film layer 113 in the first space 118 and the second space 119. The first TFE layer 451 may help prevent the light emitting structure 200 from being degraded due to penetration of moisture, water, oxygen, etc. In addition, the first TFE layer 451 may protect the light emitting structure 200 from external impact. The first TFE layer 451 may be formed using an inorganic material having flexibility.

[0148] The second TFE layer 452 may be formed on the first TFE layer 451 in the display region 10, and may not be formed in the peripheral region 30. Therefore, the second TFE layer 452 may be formed only in the display region 10. The second TFE layer 452 may improve the flatness of the OLED device 100, and may protect the light emitting structure 200. The second TFE layer 452 may be formed using an organic material having flexibility.

[0149] Reference Fig.16 , the third TFE layer 453 may be formed on the second TFE layer 452 in the display area 10 and on the first TFE layer 451 in the peripheral area 30. The third TFE layer 453 may cover the second TFE layer 452 in the display area 10, and may be formed with a substantially uniform thickness along the contour of the second TFE layer 452, and may extend in the peripheral area 30. The third TFE layer 453 may be formed with a substantially uniform thickness along the contour of the first TFE layer 451 in the peripheral area 30. Therefore, the third TFE layer 453 may be continuously formed in the portion where the groove 930 is formed. The third TFE layer 453 together with the first TFE layer 451 may help prevent the light emitting structure 200 from being degraded due to the penetration of moisture, water, oxygen, etc. In addition, the third TFE layer 453 together with the first TFE layer 451 and the second TFE layer 452 may protect the light emitting structure 200 from external impact. The third TFE layer 453 may be formed using an inorganic material having flexibility.

[0150] Thus, a TFE structure 450 including first, second, and third TFE layers 451, 452, and 453 may be formed. In another embodiment, the TFE structure 450 may have a five-layer structure in which first to fifth TFE layers are stacked or a seven-layer structure in which first to seventh TFE layers are stacked.

[0151] The first insulating layer 390 may be formed in the display region 10 and the peripheral region 30 and on the third TFE layer 453. The first insulating layer 390 may cover the third TFE layer 453 in the display region 10, and may be provided with a substantially uniform thickness along the contour of the third TFE layer 453 and may extend in the peripheral region 30. The first insulating layer 390 may be formed with a substantially uniform thickness along the contour of the third TFE layer 453 in the peripheral region 30. Therefore, the first insulating layer 390 may be continuously formed in the portion where the first insulating layer 390 is formed. The first insulating layer 390 may be formed using an organic material or an inorganic material. In another embodiment, the first insulating layer 390 may have a multilayer structure including a plurality of insulating layers. For example, the insulating layers may have different thicknesses from each other or include different materials from each other.

[0152] Reference Fig.17 , an organic insulating pattern 490 may be formed in the peripheral region 30 and on the first insulating layer 390. In example embodiments, the organic insulating pattern 490 may be formed only in the peripheral region 30. The organic insulating pattern 490 may be formed on the first insulating layer 390 in the peripheral region 30 with a relatively high thickness. In this case, the organic insulating pattern 490 may have a substantially flat upper surface, and a planarization process may be further performed on the organic insulating pattern 490 to achieve a flat upper surface of the organic insulating pattern 490. In another embodiment, the organic insulating pattern 490 may be formed on the first insulating layer 390 along a contour of the first insulating layer 390 in the display region 10 with a substantially uniform thickness. The organic insulating pattern 490 may be formed using an organic material such as a photoresist, a polyacrylate resin, a polyimide resin, a polyamide resin, a siloxane resin, an acrylic resin, an epoxy resin, or the like.

[0153] Reference Fig.18 , a first touch screen electrode 382 and a second touch screen electrode 384 may be formed in the display region 10 and on the first insulating layer 390 (see Fig. 9). Each of the first touch screen electrodes 382 may extend in the first direction D1 and may be spaced apart from each other along the second direction D2. The second touch screen electrodes 384 may be spaced apart from each other along the first direction D1 between two adjacent first touch screen electrodes 382 among the first touch screen electrodes 382. For example, each of the first touch screen electrodes 382 and the second touch screen electrodes 384 may be formed using carbon nanotubes (CNTs), transparent conductive oxides (such as ITO, indium gallium zinc oxide (IGZO), ZnO), graphene, Ag nanowires (AgNW), Cu, Cr, etc.

[0154] The second insulating layer 395 may be formed in the display area 10 and on the first touch screen electrode 382 and the second touch screen electrode 384. The second insulating layer 395 may cover the first touch screen electrode 382 and the second touch screen electrode 384 in the display area 10, and may be formed with a substantially uniform thickness along the contours of the first touch screen electrode 382 and the second touch screen electrode 384 and may extend in the peripheral area 30. The second insulating layer 395 may be formed along the contour of the organic insulating pattern 490 in the peripheral area 30. Therefore, the second insulating layer 395 may contact the upper surface of the first insulating layer 390 in the display area 10, and may contact the upper surface of the organic insulating pattern 490 in the peripheral area 30. The second insulating layer 395 may be formed using an organic material or an inorganic material. In another embodiment, the second insulating layer 395 may have a multilayer structure including a plurality of insulating layers. The insulating layers may have different thicknesses from each other or include different materials from each other.

[0155] Reference Fig.19 A touch screen connection electrode 386 may be formed in the display region 10 and on the second insulating layer 395 (see Fig. 9 ). The touch screen connection electrode 386 can electrically connect two second touch screen electrodes 384 adjacent to each other in the second direction D2 among the second touch screen electrodes 384 through the contact hole. For example, the touch screen connection electrode 386 and the first touch screen electrode 382 and the second touch screen electrode 384 can be formed using the same material. In another embodiment, the touch screen connection electrode 386 can be formed using a metal, a metal alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These can be used alone or in a suitable combination thereof.

[0156] The conductive pattern 400 may be formed in the peripheral region 30 and on the second insulating layer 395. In example embodiments, in order to detect damage of the second protrusion portion 117, the conductive pattern 400 may be formed to overlap the second protrusion portion 117 of the groove 930. In another embodiment, the conductive pattern 400 may be formed to overlap the first protrusion portion 116 of the groove 930.

[0157] For example, the conductive pattern 400 on the groove 930 may be formed along the contour of the second protruding portion 117 of the groove 930. The conductive pattern 400 may substantially surround the opening region 20. The conductive pattern 400 may include a first sub-conductive pattern 401 and a second sub-conductive pattern 402 (see Figure 6 ). The first sub-conductive pattern 401 may have a circular planar shape including a partial opening of an opening portion, and the second sub-conductive pattern 402 may extend in the second direction D2 from the opening portion of the first sub-conductive pattern 401. In example embodiments, the first sub-conductive pattern 401 and the second sub-conductive pattern 402 may be integrally formed at the same layer.

[0158] In another embodiment, the first sub-conductive pattern 401 may be formed on the second sub-conductive pattern 402, and the opening portion of the first sub-conductive pattern 401 may be connected to the distal end of the second sub-conductive pattern 402 through a contact hole. Alternatively, the second sub-conductive pattern 402 may be formed on the first sub-conductive pattern 401, and the opening portion of the first sub-conductive pattern 401 may be connected to the distal end of the second sub-conductive pattern 402 through a contact hole.

[0159] The first sub conductive pattern 401 may be formed to overlap the groove 930. For example, the first sub conductive pattern 401 may be formed to overlap the second protrusion portion 117 of the groove 930. In another embodiment, the first sub conductive pattern 401 may overlap the first protrusion portion 116 of the groove 930.

[0160] The conductive pattern 400 and the touch screen connection electrode 386 may be formed simultaneously using the same material. In another embodiment, the conductive pattern 400 and the first touch screen electrode 382 and the second touch screen electrode 384 may be formed simultaneously using the same material.

[0161] A protective insulating layer 410 may be formed in the display region 10 and the peripheral region 30 and on the second insulating layer 395, the touch screen connection electrode 386, and the conductive pattern 400. The protective insulating layer 410 may be formed on the second insulating layer 395 with a relatively high thickness. In this case, the protective insulating layer 410 may have a substantially flat upper surface. In another embodiment, the protective insulating layer 410 may cover the touch screen connection electrode 386 and the conductive pattern 400 in the display region 10 and the peripheral region 30 and on the second insulating layer 395, and may be formed with a substantially uniform thickness along the contours of the touch screen connection electrode 386 and the conductive pattern 400. The protective insulating layer 410 may be formed using an organic material.

[0162] As described above, the touch screen structure 380 including the first insulating layer 390 , the first touch screen electrodes 382 , the second touch screen electrodes 384 , the second insulating layer 395 , the touch screen connecting electrodes 386 , and the protective insulating layer 410 may be formed.

[0163] After forming the touch screen structure 380, laser may be irradiated in the opening region 20 and on the protective insulating layer 410. In another embodiment, a different etching process may be performed to expose the opening region 20 on the protective insulating layer 410.

[0164] Reference Fig. 20 and Figure 8 , an opening 910 may be formed in the opening region 20 by laser irradiation, and a functional module 700 may be formed in the opening 910. In an exemplary embodiment, the functional module 700 may contact a side surface of the substrate 110, a side surface of the light emitting layer 330, a side surface of the upper electrode 340, a side surface of the first TFE layer 451, a side surface of the third TFE layer 453, a side surface of the first insulating layer 390, a side surface of the organic insulating pattern 490, a side surface of the second insulating layer 395, and a side surface of the protective insulating layer 410 in the boundary between the peripheral region 30 and the opening region 20. For example, the functional module 700 may include a camera module, a facial recognition sensor module, a pupil recognition sensor module, an acceleration and geomagnetic sensor module, a proximity and infrared sensor module, and a light intensity sensor module, etc. After forming the functional module 700, the rigid glass substrate 105 may be removed from the substrate 110. Thus, a Figure 8 The OLED device 100 shown in FIG.

[0165] Fig.21 is a plan view showing an OLED device according to an example embodiment, Fig. 22 is corresponding to Fig.21 A partial enlarged plan view of area "B". Fig.23 is corresponding to Fig.21 A partial enlarged plan view of area "B", Fig.24 is along Fig. 22 In addition to the conductive pattern 1400, Fig.21 , Fig. 22 and Fig.24 The OLED device 500 shown in FIG. 5 may have the same Figures 1 to 9 The configuration of the OLED device 100 described above is substantially the same or similar. Fig.21 , Fig. 22 and Fig.24 In the example, you can avoid duplication of references Figures 1 to 9 Detailed description of elements that are substantially the same or similar to the elements described.

[0166] Reference Fig.21 , Fig. 22 and Fig.24 , the OLED device 500 may include a substrate 110, a semiconductor element 250, a planarization layer 270, a light emitting structure 200, a pixel defining layer 310, a TFE structure 450, a touch screen structure 380, an organic insulating pattern 490, a conductive pattern 1400, a functional module 700, etc. The substrate 110 may include a first organic film layer 111, a first barrier layer 112, a second organic film layer 113, and a second barrier layer 114. Since the OLED device 500 has a display area 10, an opening area 20, a peripheral area 30, and a pad area 40, the substrate 110 may be divided into the display area 10, the opening area 20, the peripheral area 30, and the pad area 40. In addition, the touch screen structure 380 may include a first insulating layer 390, a plurality of first touch screen electrodes 382, ​​a plurality of second touch screen electrodes 384, a plurality of touch screen connection electrodes 386, a second insulating layer 395, and a protective insulating layer 410.

[0167] The conductive pattern 1400 may be located on the second insulating layer 395 in the peripheral region 30. In example embodiments, in order to detect damage of the first and second protrusions 116 and 117, the conductive pattern 1400 may overlap the first and second protrusions 116 and 117 of the groove 930.

[0168] For example, the conductive pattern 1400 on the groove 930 may be disposed along the contours of the first protruding portion 116 and the second protruding portion 117 of the groove 930. Fig. 22 As shown in, the conductive pattern 1400 may include a first sub-conductive pattern, a second sub-conductive pattern, a third sub-conductive pattern, and a fourth sub-conductive pattern. The first sub-conductive pattern may have a circular planar shape including a top opening portion and a partial opening of a bottom opening portion, and may overlap with the second protruding portion 117 of the groove 930. The second sub-conductive pattern may have a circular planar shape including a partial opening of a bottom opening portion, and may overlap with the first protruding portion 116 of the groove 930. The third sub-conductive pattern may extend from the top opening portion of the first sub-conductive pattern in the second direction D2. The fourth sub-conductive pattern may connect the bottom opening portion of the first sub-conductive pattern and the bottom opening portion of the second sub-conductive pattern. In an example embodiment, the first sub-conductive pattern, the second sub-conductive pattern, the third sub-conductive pattern, and the fourth sub-conductive pattern may be integrally formed at the same layer.

[0169] In an example embodiment, if Fig.23As shown in , the OLED device 500 may include a first conductive pattern 400 and a second conductive pattern 600. The first conductive pattern 400 on the groove 930 may be arranged along the outline of the second protruding portion 117 of the groove 930, and the second conductive pattern 600 on the groove 930 may be arranged along the outline of the first protruding portion 116 of the groove 930. Therefore, the first conductive pattern 400 may substantially surround the second conductive pattern 600. The first conductive pattern 400 may include a first sub-conductive pattern and a second sub-conductive pattern. A portion of the first sub-conductive pattern may have a circular planar shape including a partial opening of an opening portion, and the second sub-conductive pattern may extend from the opening portion of the first sub-conductive pattern in the second direction D2. In an example embodiment, the first sub-conductive pattern and the second sub-conductive pattern may be integrally formed at the same layer. In addition, the second conductive pattern 600 may include a third sub-conductive pattern and a fourth sub-conductive pattern. A portion of the third sub-conductive pattern may have a circular planar shape including a partial opening of an opening portion, and the fourth sub-conductive pattern may extend from the opening portion of the third sub-conductive pattern in the second direction D2. In example embodiments, the third sub-conductive pattern and the fourth sub-conductive pattern may be integrally formed at the same layer.

[0170] The OLED device 500 according to the example embodiment may include the conductive pattern 1400, the pad electrode 470, and the connection wiring 370. Therefore, the OLED device 500 may check whether the first protrusion portion 116 and the second protrusion portion 117 are damaged. Therefore, the defect rate of the OLED device 500 may be reduced by checking whether the first protrusion portion 116 and the second protrusion portion 117 are damaged by the OLED device 500.

[0171] Fig.25 9 is a cross-sectional view showing an OLED device according to an example embodiment. In addition to the second groove 950 and the third groove 970, Fig.25 The OLED device 800 shown in FIG. 8 may have the same Figure 21 to Figure 24 The configuration of the OLED device 500 described above is substantially the same or similar. Fig.25 In the example, you can avoid duplication of references Figure 21 to Figure 24 Detailed description of elements that are substantially the same or similar to the elements described.

[0172] Reference Fig.25, the OLED device 800 may include a substrate 110, a semiconductor element 250, a planarization layer 270, a light emitting structure 200, a pixel defining layer 310, a TFE structure 450, a touch screen structure 380, an organic insulating pattern 490, a conductive pattern 400, a functional module 700, a barrier structure 550, etc. The substrate 110 may include a first organic film layer 111, a first barrier layer 112, a second organic film layer 113, and a second barrier layer 114. Since the OLED device 800 has a display area 10, an opening area 20, a peripheral area 30, and a pad area 40, the substrate 110 may be divided into the display area 10, the opening area 20, the peripheral area 30, and the pad area 40. In addition, the light emitting structure 200 may include a lower electrode 290, a light emitting layer 330, and an upper electrode 340, and the TFE structure 450 may include a first TFE layer 451, a second TFE layer 452, and a third TFE layer 453. In addition, the touch screen structure 380 may include a first insulating layer 390 , a plurality of first touch screen electrodes 382 , a plurality of second touch screen electrodes 384 , a plurality of touch screen connecting electrodes 386 , a second insulating layer 395 , and a protective insulating layer 410 .

[0173] The first groove 930, the second groove 950, and the third groove 970 may be formed with an expanded lower portion. For example, in the substrate 110, the first groove 930 may be formed in the peripheral area 30, and the second groove 950 may be formed between the first groove 930 and the functional module 700. The third groove 970 may be formed in the display area 10. In addition, the second groove 950 may surround the functional module 700, and the first groove 930 may surround the second groove 950. The third groove 970 may surround the first groove 930. In another embodiment, at least one groove having an expanded lower portion may also be formed between the second groove 950 and the functional module 700 and between the third groove 970 and the first groove 930.

[0174] The OLED device 800 according to the example embodiment may include the first to third grooves 930, 950, and 970. Therefore, due to the relatively large number of grooves having the extended lower portion, the light emitting layer 330 and the upper electrode 340 may be easily separated. In addition, since the relatively large number of grooves having the extended lower portion are located in the peripheral region 30, when an external impact or stress in a manufacturing process is transmitted to the substrate 110 in a direction from the opening region 20 to the display region 10, the amount of impact may be reduced due to the relatively large number of grooves having the extended lower portion. In addition, since the relatively large number of grooves having the extended lower portion are located in the peripheral region 30, the contact area of ​​the first TFE layer 451 and the substrate 110 may be relatively increased in the peripheral region 30. Therefore, the OLED device 800 may help prevent the first TFE layer 451 from being separated from the substrate 110.

[0175] The blocking structure 550 may be located between the first groove 930 and the third groove 970 on the substrate 110 positioned in the peripheral area 30. In example embodiments, the blocking structure 550 may block leakage of the second TFE layer 452. The blocking structure 550 may include an organic material or an inorganic material. In example embodiments, the blocking structure 550 may include an organic material.

[0176] The light emitting layer 330 may be located on the pixel defining layer 310 and the lower electrode 290 in the display area 10 and may extend in the first direction D1, and may be located on the substrate 110 and the blocking structure 550 in the peripheral area 30. In example embodiments, the light emitting layer 330 may be partially located in the inner portion of each of the first to third grooves 930, 950, and 970, and the light emitting layer 330 in the portion where each of the first to third grooves 930, 950, and 970 is located may be divided in the depth direction. Therefore, the light emitting layer 330 may be divided in the first to third grooves 930, 950, and 970. Therefore, the light emitting layer 330 may be divided by the first space 118 and the second space 119 in the peripheral area 30.

[0177] The upper electrode 340 may be located on the light emitting layer 330. The upper electrode 340 may overlap the light emitting layer 330 in the display region 10 and may extend in the first direction D1, and may be located on the light emitting layer 330 in the peripheral region 30. In example embodiments, the upper electrode 340 may be partially located in an inner portion of each of the first to third grooves 930, 950, and 970, and the upper electrode 340 in a portion where each of the first to third grooves 930, 950, and 970 is located may be separated in a depth direction. Therefore, the upper electrode 340 may be separated in each of the first to third grooves 930, 950, and 970.

[0178] The first TFE layer 451 may be located on the upper electrode 340 in the display region 10 and the peripheral region 30. The first TFE layer 451 may cover the upper electrode 340 in the display region 10, and may be disposed with a substantially uniform thickness along the contour of the upper electrode 340 and may extend in the peripheral region 30. The first TFE layer 451 may be disposed along the contour of the upper electrode 340 in the peripheral region 30. Therefore, the first TFE layer 451 may be continuously disposed in a portion where each of the first to third grooves 930, 950, and 970 is formed. In example embodiments, the first TFE layer 451 may completely cover each of the first to third grooves 930, 950, and 970. Therefore, the first TFE layer 451 may completely cover the light emitting layer 330 and the upper electrode 340 disposed inside each of the first to third grooves 930, 950, and 970. Therefore, the first TFE layer 451 may be in direct contact with the second organic film layer 113 in the first space 118 and the second space 119.

[0179] The second TFE layer 452 may be located on the first TFE layer 451 in a portion of the peripheral region 30 and the display region 10. In example embodiments, the second TFE layer 452 may fill an inner portion of the third groove 970 and may not be disposed inside the first and second grooves 930 and 950.

[0180] The third TFE layer 453 may be located on the second TFE layer 452 in the display area 10 and on the first TFE layer 451 in the peripheral area 30. The third TFE layer 453 may cover the second TFE layer 452 in the display area 10, and may be disposed with a substantially uniform thickness along the contour of the second TFE layer 452 and may extend in the peripheral area 30. The third TFE layer 453 may be disposed with a substantially uniform thickness along the contour of the first TFE layer 451 in the peripheral area 30. Therefore, the third TFE layer 453 may be continuously formed in each portion where the second groove 950 and the third groove 970 are formed.

[0181] The first insulating layer 390 may be located on the third TFE layer 453 in the display region 10 and the peripheral region 30. The first insulating layer 390 may cover the third TFE layer 453 in the display region 10, and may be disposed with a substantially uniform thickness along the contour of the third TFE layer 453 and may extend in the peripheral region 30. The first insulating layer 390 may be disposed with a substantially uniform thickness along the contour of the third TFE layer 453 in the peripheral region 30. Therefore, the first insulating layer 390 may be continuously disposed in each portion where the second groove 950 and the third groove 970 are formed.

[0182] The organic insulating pattern 490 may be located on the first insulating layer 390 in the peripheral region 30. The organic insulating pattern 490 may be disposed on the first insulating layer 390 with a relatively high thickness in a portion of the display region 10 and the peripheral region 30. In this case, the organic insulating pattern 490 may have a substantially flat upper surface.

[0183] The conductive pattern 1400 may be located on the second insulating layer 395 in the peripheral region 30. In example embodiments, in order to detect damage of the first protrusion 116 and the second protrusion 117, the conductive pattern 1400 may overlap the first protrusion 116 and the second protrusion 117 of the first groove 930. For example, the conductive pattern 1400 on the first groove 930 may be disposed along the contour of each of the first protrusion 116 and the second protrusion 117 of the first groove 930.

[0184] In example embodiments, a conductive pattern may be further disposed on a protruding portion of each of the second groove 950 and the third groove 970 .

[0185] Example embodiments may be applied to various display devices including OLED devices. For example, example embodiments may be applied to vehicle display devices, ship display devices, aircraft display devices, portable communication devices, display devices for display or for information transmission, medical display devices, etc.

[0186] By way of summary and review, a display device such as an OLED device may have a display area for displaying an image and a non-display area in which a gate driver, a data driver, wiring, and a functional module (e.g., a camera module, a motion recognition sensor, etc.) are disposed. A blocking pattern (for blocking water, moisture, etc. from penetrating into a portion of the display area adjacent to the functional module) may be formed adjacent to the functional module. The blocking pattern may be susceptible to damage from external impact or stress during the manufacturing process, in which case defects in the display pixels may occur.

[0187] As described above, example embodiments relate to an organic light emitting display device that may include a functional module located in a portion of a display area. An OLED device according to example embodiments may include a conductive pattern, a pad electrode, and a connection wiring, and the OLED device may check whether the second protruding portion is damaged. Therefore, since the OLED device checks whether the second protruding portion is damaged, the defect rate of the OLED device may be reduced.

[0188] Example embodiments have been disclosed herein, and although specific terms are employed, the specific terms are used and interpreted only in a general and descriptive sense and not for limiting purposes. In some cases, it will be apparent to one of ordinary skill in the art as of the time of filing this application that features, characteristics, and / or elements described with respect to a particular embodiment may be used alone or in combination with features, characteristics, and / or elements described with respect to other embodiments, unless otherwise specifically stated. Therefore, it will be understood by those skilled in the art that various changes in form and detail may be made without departing from the spirit and scope of the example embodiments as set forth in the claims.

Claims

1. An organic light-emitting display device, comprising: a substrate having an opening area, a peripheral area surrounding the opening area, and a display area surrounding the peripheral area, the substrate comprising a first groove having an expanded lower portion formed in the peripheral area and an opening formed in the opening area; a light emitting structure, located in the display area and on the substrate; a first conductive pattern in the peripheral region and overlapping the first groove on the substrate; as well as a functional module, located in the opening of the substrate, The substrate includes: a first organic film layer; a first barrier layer located on the first organic film layer; a second organic film layer located on the first barrier layer, the second organic film layer having a groove in the peripheral region; and a second barrier layer located on the second organic film layer, the second barrier layer being positioned on the groove and having a protruding portion protruding in an inner portion of the groove, the second barrier layer having an opening defined by the protruding portion, and Wherein, the first conductive pattern overlaps with the protruding portion of the second barrier layer.

2. The organic light emitting display device according to claim 1, wherein: The first conductive pattern comprises: a first sub-conductive pattern overlapping the first groove, the first sub-conductive pattern having a circular plan shape including a partial opening of an opening portion; and A second sub-conductive pattern extends in an outward direction from the opening portion of the first sub-conductive pattern.

3. The organic light emitting display device according to claim 2, further comprising: a pad electrode, located on the substrate, the pad electrode being electrically connected to an external device; as well as A signal wiring is positioned on the substrate and disposed along an outer portion of the substrate, the signal wiring electrically connecting the second sub-conductive pattern and the pad electrode.

4. The organic light emitting display device according to claim 1, wherein: The first groove surrounds the opening on the substrate.

5. The organic light emitting display device according to claim 4, wherein: The first groove has a circular planar shape.

6. The organic light emitting display device according to claim 1, wherein: The first conductive pattern positioned on the first groove is disposed along an outline of an outer portion of the first groove.

7. The organic light emitting display device according to claim 1, wherein: The protruding portion of the second barrier layer comprises: a first protrusion positioned adjacent to the opening of the substrate; and A second protruding portion faces the first protruding portion, the second protruding portion being spaced apart from the first protruding portion in a direction from the opening region to the peripheral region.

8. The organic light emitting display device according to claim 7, further comprising: a second conductive pattern, the second conductive pattern being located on the first protruding portion and overlapping the first protruding portion, Wherein, the first conductive pattern is overlapped on the second protruding portion.

9. The organic light emitting display device according to claim 8, wherein: The first conductive pattern and the second conductive pattern are connected to each other in a region of the peripheral area and are integrally formed.

10. The organic light emitting display device according to claim 1, wherein: The groove of the second organic film layer, the protruding portion of the second barrier layer, and the opening of the second barrier layer are defined as the first recess having the expanded lower portion.

11. The organic light emitting display device according to claim 1, wherein: The light emitting structure comprises: Lower electrode; a light-emitting layer, located on the lower electrode; and The upper electrode is located on the light-emitting layer.

12. The organic light emitting display device according to claim 11, wherein: The light emitting layer extends on the substrate in a direction from the display region to the peripheral region, and is divided in a portion where the first groove is formed.

13. The organic light emitting display device according to claim 11, wherein: The upper electrode extends on the substrate in a direction from the display region to the peripheral region, and is divided in a portion where the first groove is formed.

14. The organic light emitting display device according to claim 11, wherein: The light emitting layer and the upper electrode are located in at least a portion of an inner portion of the first groove.

15. The organic light emitting display device according to claim 11, further comprising: A thin film packaging structure, located on the light emitting structure; as well as The touch screen structure is located in the display area and on the thin film packaging structure.

16. The organic light emitting display device according to claim 15, wherein: The thin film encapsulation structure comprises: A first thin film encapsulation layer, located on the upper electrode, wherein the first thin film encapsulation layer comprises a flexible inorganic material; a second thin film encapsulation layer, located on the first thin film encapsulation layer, the second thin film encapsulation layer comprising a flexible organic material; and The third thin film encapsulation layer is located on the second thin film encapsulation layer, and the third thin film encapsulation layer includes a flexible inorganic material.

17. The organic light emitting display device according to claim 16, wherein: Each of the first thin film encapsulation layer and the third thin film encapsulation layer extends on the upper electrode in a direction from the display region to the peripheral region, and is continuously located in a portion where the first groove is formed.

18. The organic light emitting display device according to claim 16, wherein: The touch screen structure comprises: A first insulating layer, located in the display area and on the third thin film encapsulation layer; Touch screen electrodes, located on the first insulating layer; A second insulating layer, located on the touch screen electrodes; A touch screen connecting electrode is located on the second insulating layer; and The protective insulating layer is located on the touch screen connecting electrodes.

19. The organic light emitting display device according to claim 18, wherein: The first insulating layer extends on the third thin film encapsulation layer in a direction from the display region to the peripheral region and is continuously located in a portion where the first groove is formed.

20. The organic light emitting display device according to claim 18, further comprising: An organic insulating pattern is located in the peripheral region and on the first insulating layer.

21. The organic light emitting display device according to claim 20, wherein: The second insulating layer contacts an upper surface of the first insulating layer in the display region, and contacts an upper surface of the organic insulating pattern in the peripheral region.

22. The organic light emitting display device according to claim 21, wherein: The first conductive pattern is located between the second insulating layer and the protective insulating layer.

23. The organic light emitting display device according to claim 20, wherein: The functional module contacts a side surface of the substrate, a side surface of the light-emitting layer, a side surface of the upper electrode, a side surface of the first thin-film encapsulation layer, a side surface of the third thin-film encapsulation layer, a side surface of the first insulating layer, a side surface of the organic insulating pattern, a side surface of the second insulating layer, and a side surface of the protective insulating layer in a boundary between the peripheral area and the opening area.

24. The organic light emitting display device according to claim 1, wherein: The substrate further includes at least one second groove between the first groove and the functional module, the at least one second groove having an extended lower portion, and The first groove surrounds the at least one second groove.

25. The organic light emitting display device according to claim 1, wherein: The substrate further includes at least one third groove surrounding the first groove. 26 . The organic light-emitting display device according to claim 25 , further comprising a blocking structure, the blocking structure being located in the peripheral region and between the first groove and the at least one third groove on the substrate, the blocking structure surrounding the first groove.

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