Plate taking device and plate taking method

The upper edge height of the printed circuit board is measured by laser photoelectric sensor, and the cooperation of the lifting and plate-release mechanism is used to realize automatic and accurate plate picking of the plate parts, solving the problems of low efficiency and plate parts in the prior art.

CN111288904BActive Publication Date: 2025-05-13GUANGZHOU TAILI ELECTRICAL & MECHANICAL EQUIP CO LTD
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Patent Information

Application Number
CN202010159934.5
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2020-03-09
Publication Date
2025-05-13
Estimated Expiration
2040-03-09

AI Technical Summary

Technical Problem

The prior art is difficult to accurately measure the upper edge height of a printed circuit board, which makes it difficult for the plate extraction device to accurately clamp and move the plate parts, which are inefficient and prone to damage the plate parts.

Method used

The upper edge height of the plate is measured by laser photoelectric sensor, and the plate is automatically moved to the designated plate place through the cooperation of the plate lifting mechanism and the plate placement mechanism to ensure that the plate is balanced and moved and flipped, avoiding bends or warping.

Benefits of technology

Accurate measurement and automatic board extraction of printed circuit boards are achieved, efficiency and accuracy are improved, and plate damage and inefficiency in manual operation are avoided.

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Abstract

The present invention relates to the technical field of printed circuit board processing equipment, specifically a board taking device and a board taking method, the board taking device includes a board frame transfer mechanism, a board lifting mechanism, a board placing mechanism, a laser photoelectric sensor and a control device, the laser photoelectric sensor includes a laser transmitter and a laser receiver, the laser transmitter is fixed on the front side of the board and is lower than the upper edge of the board, the laser receiver is fixed on the rear side of the board and is higher than the upper edge of the board, the laser transmitter faces the laser receiver, and the control device connects the board frame transfer mechanism, the board lifting mechanism, the board placing mechanism and the laser photoelectric sensor. The board taking device of the present invention can accurately measure the height of the upper edge of the board to be taken, and then automatically move the board to a designated board placing position through the cooperation of the board lifting mechanism and the board placing mechanism, which is efficient and convenient, with high precision, and is conducive to maintaining the force balance of the board in the process of moving and flipping the board, avoiding bending or warping deformation of the board plane.
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Description

Technical Field

[0001] The invention relates to the technical field of printed circuit board processing equipment, in particular to a board taking device and a board taking method. Background Art

[0002] At present, when a printed circuit board (PCB) is processed and manufactured, it is usually a large square board, which is cut into several smaller finished boards in the later stage of manufacturing. Before the PCB is cut, several PCBs of the same size are usually inserted into a board frame for storage. The board frame is generally provided with several vertical slots in parallel. The length of the slot is generally roughly equal to the length of the PCB, but the width of the slot is usually greater than the thickness of the PCB. Therefore, the PCB will be slightly tilted in the slot, and the tilt angle of each PCB is not necessarily the same, so it is difficult to accurately determine the height of the upper edge of each PCB in the board frame. Since the circuit is printed on the PCB, only the blank area at the edge can be grasped by the mechanical gripper of the board taking device, and the blank area at the edge of the board is generally narrow. If the clamping depth is too deep, it may exceed the blank area and damage the circuit structure on the board. If the clamping is too shallow, the clamping may be unreliable. Therefore, if the upper edge height of the PCB board cannot be accurately determined, it will lead to the inability to use the board taking device to take the PCB board out of the board frame and place it on the board placement position of the printed circuit board processing equipment for processing. Therefore, at present, the art can only basically take the PCB board out of the board frame and place it on the board placement position by manual operation, which is time-consuming and labor-intensive, low in efficiency, and low in accuracy of placement. In addition, since the PCB board is large in size and thin in thickness, it is easy to cause the board to bend or warp due to its own gravity when moving and turning the board, causing damage to the board. Summary of the invention

[0003] In order to overcome the shortcomings of the above-mentioned prior art, the present invention provides a plate taking device and a plate taking method, which can accurately measure the upper edge height of the plate to be taken, and then automatically move the plate to a designated plate placing position through the cooperation of the plate lifting mechanism and the plate placing mechanism, thereby replacing the manual plate taking method. The method is efficient, convenient and highly accurate, and is also conducive to maintaining the force balance of the plate during the movement and flipping of the plate, thereby avoiding bending or warping of the plate plane.

[0004] The present invention is achieved through the following technical solutions:

[0005] A plate taking device comprises a plate frame transfer mechanism for moving a plate frame along an X-axis direction, a plate lifting mechanism for grabbing a square plate to be taken vertically inserted in the plate frame and lifting it along the Z-axis direction to move it out of the plate frame, a plate placing mechanism for balancing and grabbing the plate taken out of the plate frame and moving and flipping it to a plate placing position, as well as a laser photoelectric sensor and a control device, wherein the laser photoelectric sensor comprises a laser transmitter and a laser receiver, the laser transmitter is fixedly arranged on the front side of the plate frame and its height is lower than the upper edge of the plate to be taken, the laser receiver is fixedly arranged on the rear side of the plate frame and its height is higher than the upper edge of the plate to be taken, the direction in which the laser transmitter emits laser is obliquely upward to face the laser receiver, and the control device connects the plate frame transfer mechanism, the plate lifting mechanism, the plate placing mechanism and the laser photoelectric sensor.

[0006] Preferably, the plate placing mechanism includes a clamp seat, a mechanical arm for driving the clamp seat to move and flip, and a left clamp and a right clamp arranged at the left and right ends of the clamp seat to respectively clamp the left and right edges of the plate, and the upper and lower ends of the left clamp and the right clamp can respectively symmetrically clamp the upper and lower sides of the left and right edges of the plate, so that the force on the plate is balanced when flipping, thereby avoiding bending or warping deformation of the plane of the plate.

[0007] Preferably, the left clamp and the right clamp respectively include two or more first clamps arranged at intervals, and a first clamp driving mechanism capable of driving the first clamp to rotate and open and close, so that the left clamp and the right clamp can clamp or release the panel from both sides of the panel at the same time.

[0008] Preferably, the left clamp and / or the right clamp is transmission-connected to the clamp seat via a first linear drive module, so that the distance between the left clamp and the right clamp can be adjusted.

[0009] Preferably, the plate lifting mechanism includes an upper clamp for clamping the upper edge of the plate and a lifting mechanism for driving the upper clamp to reciprocate along the Z-axis direction; the upper clamp includes a second clamp and a second clamp driving mechanism capable of driving the second clamp to open and close.

[0010] Preferably, the plate lifting mechanism also includes a transverse bracket, and the upper clamp is transmission-connected to the transverse bracket via a second linear drive module arranged along the Y-axis direction so that it can reciprocate along the Y-axis direction relative to the transverse bracket, and the lifting mechanism includes a column and a third linear drive module, and one end of the transverse bracket is transmission-connected to the column via the third linear drive module so that it can reciprocate along the Z-axis direction relative to the column.

[0011] Preferably, the plate frame transfer mechanism includes a base and a frame carrier seat for positioning the plate frame. The frame carrier seat is placed on the base and is transmission-connected to the base via a fourth linear drive module arranged along the X-axis direction, so that the frame carrier seat can reciprocate relative to the base along the X-axis direction.

[0012] Preferably, the plate-taking device comprises two or more plate-frame transfer mechanisms, each of which is arranged in parallel, and each of which is respectively provided with one laser photoelectric sensor.

[0013] Preferably, each of the plate-frame transplanting mechanisms is respectively provided with a corresponding plate lifting mechanism.

[0014] A plate taking method using the plate taking device comprises the following steps:

[0015] (1) placing a plate frame with a plate inserted therein at the starting point of the plate frame transfer mechanism, and pre-storing the position information of the plate frame slot, the size information of the plate, and the oblique upward angle at which the laser emitter emits the laser in the control device;

[0016] (2) The control device controls the laser transmitter to transmit a laser signal toward the laser receiver, the laser receiver receives the laser signal and feeds it back to the control device, the control device controls the plate frame transfer mechanism to drive the plate frame to move forward along the X-axis direction until the upper edge of the first plate at the front blocks the laser signal emitted by the laser transmitter, the laser receiver stops receiving the laser signal and feeds it back to the control device, and the control device controls the plate frame transfer mechanism to stop driving the plate frame to move;

[0017] (3) The control device records the distance the plate frame moves forward, and combines the position information of the slot where the first plate is located and the upward angle of the laser to analyze and calculate the height of the upper edge of the first plate, and then analyze and calculate the XYZ axis coordinate of the midpoint of the upper edge of the first plate. The control device controls the plate lifting mechanism to grab and lift the upper edge of the first plate according to the XYZ axis coordinate of the midpoint of the upper edge of the first plate, so that the first plate moves upward in a balanced manner, until the first plate leaves the plate frame, and the control device controls the plate lifting mechanism to stop moving upward;

[0018] (4) The control device records the distance the first plate moves upward, and calculates the XYZ axis coordinates of the midpoints of the left and right edges of the first plate at this time in combination with the plate size information. The control device controls the plate placing mechanism to symmetrically grab the left and right edges of the first plate according to the XYZ axis coordinates of the midpoints of the left and right edges of the first plate, and moves the first plate to the top of the plate placing position and flips it over and places it flat on the plate placing position according to the target coordinates of the plate placing position. At the same time, when the first plate is lifted out of the plate frame by the plate lifting mechanism and no longer blocks the laser, the laser receiver receives the laser signal again and feeds it back to the control device. The control device controls the plate frame transfer mechanism to drive the plate frame to continue moving forward along the X-axis direction until the upper edge of the second plate in the front blocks the laser signal emitted by the laser transmitter, and the laser receiver stops receiving the laser signal and feeds it back to the control device. The control device controls the plate frame transfer mechanism to stop driving the plate frame to move, and then the cycle is repeated.

[0019] Compared with the prior art, the beneficial effects of the present invention are: by using a laser photoelectric sensor, the upper edge height of the plate to be taken in the plate frame can be accurately measured, and then through the cooperation of the plate lifting mechanism and the plate placing mechanism, the plate is first lifted out of the plate frame by the plate lifting mechanism, and then the plate is balanced and grasped by the plate placing mechanism and the plate is moved and flipped until the plate is placed horizontally on the plate placing position, replacing the manual plate taking method, which is efficient and convenient, with high precision, and is conducive to maintaining the force balance of the plate in the process of moving and flipping the plate, avoiding bending or warping deformation of the plate plane.

[0020] The concept, specific structure and effects of the present invention will be further described below in conjunction with the accompanying drawings to fully understand the purpose, characteristics and effects of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a schematic structural diagram of the plate taking device in Example 1;

[0022] Figure 2 It is a structural schematic diagram of the plate removing device in Example 2.

[0023] Among them: plate frame transfer mechanism 1, base 11, frame carrier seat 12, fourth screw slide module 13, plate lifting mechanism 2, upper clamp 21, second clamp 211, second clamp cylinder 212, transverse bracket 22, second screw slide module 23, third screw slide module 24, column 25, plate placing mechanism 3, clamp seat 31, mechanical arm 32, left clamp 33, right clamp 34, first clamp 35, first clamp cylinder 36, first screw slide module 37, laser transmitter 41, laser receiver 42, plate frame 5, plate 6, plate placing position 7. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention and are not used to limit the present invention.

[0025] It should be noted that when an element is referred to as "connected" to another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "fixed", "connected", "front", "rear", "left", "right", "up", "down" and similar expressions used in this specification are for illustrative purposes only and are not intended to limit the present invention. In addition, the "mechanical arm", "cylinder", "screw slide module", "gripper", "control device", "laser photoelectric sensor" and other components in this embodiment can all be selected from general products that are very mature in the prior art, and the specific structure of the above-mentioned mechanism does not affect the implementation of the technical solution of the present invention and the realization of the purpose of the invention. Therefore, this article does not introduce and limit its structure in detail. In addition, there are many options for the setting position and method of the "control device", which is not specifically limited by the present invention and is therefore not shown in the accompanying drawings.

[0026] Embodiment 1:

[0027] like Figure 1 As shown, a plate taking device includes a frame (the frame is attached Figure 1 ), the frame is provided with: a plate frame transfer mechanism 1 for moving the plate frame 5 along the X-axis direction, a plate lifting mechanism 2 for grabbing the square plate 6 to be taken out vertically inserted in the plate frame 5 and lifting it along the Z-axis direction to move it out of the plate frame 5, a plate placing mechanism 3 for balancing and grabbing the plate 6 taken out of the plate frame 5 and moving and flipping it to be flat on the plate placing position 7, as well as a laser photoelectric sensor and a control device, the laser photoelectric sensor includes a laser emitter 41 and a laser receiver 42, the laser emitter 41 is fixedly arranged on the front side of the plate frame 5 and its height is lower than the upper edge of the plate 6 to be taken, the laser receiver 42 is fixedly arranged on the rear side of the plate frame 5 and its height is higher than the upper edge of the plate 6 to be taken, and the direction in which the laser emitter 41 emits the laser is obliquely upward to face the laser receiver 42 (as shown in the attached Figure 1 The control device is connected with the plate frame transfer mechanism 1, the plate lifting mechanism 2, the plate placing mechanism 3 and the laser photoelectric sensor.

[0028] The plate placing mechanism 3 includes a clamp seat 31, a mechanical arm 32 for driving the clamp seat 31 to move and flip, and a left clamp 33 and a right clamp 34 arranged at the left and right ends of the clamp seat 31 to clamp the left and right edges of the plate 6 respectively, and the upper and lower ends of the left clamp 33 and the right clamp 34 can symmetrically clamp the upper and lower sides of the left and right edges of the plate 6 respectively, so that the plate 6 is subjected to balanced force when flipping, thereby avoiding bending or warping deformation of the plane of the plate 6.

[0029] The left clamp 33 and the right clamp 34 respectively include two first clamps 35 spaced apart, and a first clamp cylinder 36 capable of driving the first clamps 35 to rotate and open and close, so that the left clamp 33 and the right clamp 34 can simultaneously clamp or release the plate 6 from both sides of the plate 6. When the left clamp 33 and the right clamp 34 are respectively located on the left and right sides of the plate 6, the first clamp cylinder 36 first drives each first clamp 35 to rotate so that the two clamps of the first clamp 35 are respectively located on the front and rear sides of the side edge of the plate 6, and then drives the two clamps of each first clamp 35 to close to clamp the side edge of the plate 6.

[0030] The right clamp 34 is transmission-connected to the clamp seat 31 via the first lead screw slide module 37 , so that the distance between the left clamp 33 and the right clamp 34 can be adjusted.

[0031] The plate lifting mechanism 2 includes an upper clamp 21 for clamping the upper edge of the plate 6. The upper clamp 21 is connected to the transverse bracket 22 through a second screw slide module 23 arranged along the Y-axis direction so that it can reciprocate relative to the transverse bracket 22 along the Y-axis direction. One end of the transverse bracket 22 is connected to the column 25 through a third screw slide module 24 arranged along the Z-axis direction and can reciprocate along the Z-axis direction under the drive of the third screw slide module 24. Since the width of the plate in the same plate frame and its position in the Y-axis direction are usually the same, the second screw slide module 23 is generally not required to move. When the model of the plate is adjusted as a whole, the position of the upper clamp 21 in the Y-axis direction can be adjusted through the transverse slide 23 to realign the upper clamp 21 with the middle position of the plate. The upper clamp 21 includes a second clamp 211 and a second clamp cylinder 212 that can drive the second clamp 211 to open and close.

[0032] The plate frame transfer mechanism 1 includes a base 11 and a frame seat 12 for positioning the plate frame 5. The frame seat 12 is placed on the base 11 and is transmission-connected to the base 11 via a fourth lead screw slide module 13 arranged along the X-axis direction, so that the frame seat 12 can reciprocate along the X-axis direction under the drive of the fourth lead screw slide module 13.

[0033] Each linear drive module and the clamping jaw drive mechanism in this embodiment are respectively selected from the screw slide module and the clamping jaw cylinder which are very mature in the prior art. Of course, in other embodiments, other products in the prior art that can achieve the same or similar functions can also be selected, and this embodiment will not cite them one by one.

[0034] The plate taking method of the plate taking device of the present invention comprises the following steps:

[0035] (1) placing a plate frame with a plate inserted therein at the starting point of the plate frame transfer mechanism, and pre-storing the position information of the plate frame slot, the size information of the plate, and the oblique upward angle at which the laser emitter emits the laser in the control device;

[0036] (2) The control device controls the laser transmitter to transmit a laser signal toward the laser receiver. The laser receiver receives the laser signal and feeds it back to the control device. The control device controls the plate frame transfer mechanism to drive the plate frame to move forward along the X-axis direction until the upper edge of the first plate at the front blocks the laser signal emitted by the laser transmitter. The laser receiver stops receiving the laser signal and feeds it back to the control device. The control device controls the plate frame transfer mechanism to stop driving the plate frame to move.

[0037] (3) The control device records the distance the plate frame moves forward, and combines the position information of the slot where the first plate is located and the upward angle of the laser to analyze and calculate the height of the upper edge of the first plate, and then analyzes and calculates the XYZ axis coordinate of the midpoint of the upper edge of the first plate. The control device controls the plate lifting mechanism to grab and lift the upper edge of the first plate according to the XYZ axis coordinate of the midpoint of the upper edge of the first plate, so that the first plate moves upward in a balanced manner until the first plate leaves the plate frame, and the control device controls the plate lifting mechanism to stop moving upward; this should be It is explained that although the width of the board frame slot is greater than the thickness of the board, which will cause the front and rear position of the board (i.e., the X-axis coordinate) to be not particularly accurate, the clamping claws of the lifting mechanism are closed from both sides of the board to clamp the board, so a slight deviation of the front and rear position of the board will not affect the clamping of the board. However, if the upper edge height of the board is not accurate, the clamping claws will clamp too deeply and damage the circuit structure on the board, or clamp too shallowly and be difficult to clamp securely. Therefore, the upper edge height of each board must be measured accurately before the board can be clamped and lifted;

[0038] (4) The control device records the distance the first plate moves upward, and calculates the XYZ coordinates of the midpoints of the left and right edges of the first plate based on the plate size information. The control device controls the left and right clamps of the plate placement mechanism to symmetrically grab the left and right edges of the first plate according to the XYZ coordinates of the midpoints of the left and right edges of the first plate, and moves the first plate to the top of the plate placement position according to the target coordinates of the plate placement position and flips it over and places it flat on the plate placement position. After the plate is placed horizontally on the plate placement position, the printed circuit board processing equipment can perform the next step of processing on the plate. At the same time, when the first plate is lifted out of the plate frame by the plate lifting mechanism and no longer blocks the laser, the laser receiver receives the laser signal again and feeds it back to the control device. The control device controls the plate frame transfer mechanism to drive the plate frame to continue moving forward along the X-axis direction until the upper edge of the second plate in the front blocks the laser signal emitted by the laser transmitter. The laser receiver stops receiving the laser signal and feeds it back to the control device. The control device controls the plate frame transfer mechanism to stop driving the plate frame to move, and then the cycle is repeated.

[0039] After the last plate in the plate frame is lifted out of the plate frame by the plate lifting mechanism, the plate frame transfer mechanism moves backward to the starting point position, and the plate frame with the inserted plate is replaced, and the cycle is repeated in sequence.

[0040] Compared with the prior art, the beneficial effects of the present invention are as follows: by using a laser photoelectric sensor, the height of the upper edge of the plate 6 to be taken out of the plate frame 5 can be accurately measured, and then by cooperating with the plate lifting mechanism 2 and the plate placing mechanism 3, the plate 6 is first lifted out of the plate frame 5 by the plate lifting mechanism 2, and then the plate placing mechanism 3 is used to balance the grip of the plate 6 and move and flip the plate 6 until the plate 6 is horizontally placed on the plate placing position 7, replacing the manual plate taking method, which is efficient, convenient and highly accurate, and is conducive to maintaining the force balance of the plate 6 during the moving and flipping process, thereby avoiding bending or warping of the plane of the plate 6.

[0041] Embodiment 2:

[0042] Based on the technical solution of Example 1, further improvements were made:

[0043] like Figure 2 As shown, the plate taking device includes two plate frame transfer mechanisms 1, and each plate frame transfer mechanism 1 is arranged in parallel. Each plate frame 5 transfer mechanism is respectively provided with a laser photoelectric sensor and a plate lifting mechanism 2, so that the plate placing mechanism 3 can alternately move and flip the lifted plates in the two plate frames 5 to place the plates, thereby further improving the plate placing efficiency. Figure 2 In order not to block other structures, the laser photoelectric sensor and some supporting structures in this embodiment are not shown.

[0044] The preferred embodiments of the present invention are shown in the accompanying drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described in this specification. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

Claims

1. A plate taking device, characterized in that: It includes a plate frame transfer mechanism for moving the plate frame along the X-axis direction, a plate lifting mechanism for grabbing a square plate to be taken vertically inserted in the plate frame and lifting it to move it out of the plate frame along the Z-axis direction, a plate placing mechanism for balancing and grabbing the plate taken out of the plate frame and moving and flipping it to be flat on a plate placing position, and a laser photoelectric sensor and a control device, the laser photoelectric sensor includes a laser transmitter and a laser receiver, the laser transmitter is fixedly arranged on the front side of the plate frame and its height is lower than the upper edge of the plate to be taken, the laser receiver is fixedly arranged on the rear side of the plate frame and its height is higher than the upper edge of the plate to be taken, the laser transmitter emits laser in a direction obliquely upward to face the laser receiver, and the control device connects the plate frame transfer mechanism, the plate lifting mechanism, the plate placing mechanism and the laser photoelectric sensor; The plate placing mechanism includes a clamp seat, a mechanical arm for driving the clamp seat to move and flip, and a left clamp and a right clamp arranged at the left and right ends of the clamp seat to clamp the left and right edges of the plate respectively, and the upper and lower ends of the left clamp and the right clamp can symmetrically clamp the upper and lower sides of the left and right edges of the plate respectively, so that the plate is subjected to balanced force when flipping, thereby avoiding bending or warping deformation of the plate plane; The left clamp and the right clamp respectively include two or more first clamps arranged at intervals, and a first clamp driving mechanism capable of driving the first clamps to rotate and perform opening and closing actions, so that the left clamp and the right clamp can clamp or release the plate from both sides of the plate at the same time; The left clamp and / or the right clamp are connected to the clamp seat by transmission via a first linear drive module, so that the distance between the left clamp and the right clamp can be adjusted; The plate lifting mechanism includes an upper clamp for clamping the upper edge of the plate and a lifting mechanism for driving the upper clamp to reciprocate along the Z-axis direction, and the upper clamp includes a second clamp and a second clamp driving mechanism capable of driving the second clamp to open and close; The plate lifting mechanism also includes a transverse bracket, the upper clamp and the transverse bracket are connected by a second linear drive module arranged along the Y-axis direction so that they can reciprocate relative to the transverse bracket along the Y-axis direction, and the lifting mechanism includes a column and a third linear drive module, one end of the transverse bracket is connected by a third linear drive module so that they can reciprocate relative to the column along the Z-axis direction; The plate frame transfer mechanism includes a base and a frame carrier seat for positioning and placing the plate frame, the frame carrier seat is placed on the base and is connected to the base through a fourth linear drive module arranged along the X-axis direction, so that the frame carrier seat can reciprocate relative to the base along the X-axis direction; The plate taking device comprises two or more plate frame transfer mechanisms, each of which is arranged in parallel, and each of which is correspondingly provided with one laser photoelectric sensor; Each of the plate frame transplanting mechanisms is respectively provided with a corresponding plate lifting mechanism.

2. A plate taking method using the plate taking device according to claim 1, comprising the following steps: (1) A plate frame with plates inserted is placed at the starting point of the plate frame transfer mechanism, and the position information of the plate frame slot, the size information of the plate, and the oblique upward angle of the laser emitted by the laser emitter are pre-stored in the control device; (2) The control device controls the laser emitter to emit a laser signal toward the laser receiver, the laser receiver receives the laser signal and feeds it back to the control device, and the control device controls the plate frame transfer mechanism to drive the plate frame to move forward along the X-axis direction until the upper edge of the first plate in the front blocks the laser signal emitted by the laser emitter, the laser receiver stops receiving the laser signal and feeds it back to the control device, and the control device controls the plate frame transfer mechanism to stop driving the plate frame to move; (3) The control device records the distance the plate frame moves forward, and combines the position information of the slot where the first plate is located and the oblique upward angle of the laser to analyze and calculate the height of the upper edge of the first plate, and then analyze and calculate the XYZ axis coordinate of the midpoint of the upper edge of the first plate. The control device controls the plate lifting mechanism to move the first plate according to the XYZ axis coordinate of the midpoint of the upper edge of the first plate. The upper edge is grasped and lifted to make the first plate move upward in a balanced manner until the first plate leaves the plate frame, and the control device controls the plate lifting mechanism to stop moving upward; (4) the control device records the distance the first plate moves upward, and calculates the XYZ axis coordinates of the midpoints of the left and right edges of the first plate at this time in combination with the plate size information analysis; the control device controls the plate placing mechanism to symmetrically grasp the left and right edges of the first plate according to the XYZ axis coordinates of the midpoints of the left and right edges of the first plate, and places the first plate according to the target coordinates of the plate placing position. The plate moves to the top of the plate placement position and is turned over and placed flat on the plate placement position; at the same time, when the first plate is lifted out of the plate frame by the plate lifting mechanism and no longer blocks the laser, the laser receiver receives the laser signal again and feeds it back to the control device, and the control device controls the plate frame transfer mechanism to drive the plate frame to continue moving forward along the X-axis direction until the upper edge of the second plate in the front blocks the laser signal emitted by the laser transmitter, and the laser receiver stops receiving the laser signal and feeds it back to the control device, and the control device controls the plate frame transfer mechanism to stop driving the plate frame to move, and then the cycle is repeated in sequence.

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