Lens assembly, photosensitive assembly, camera module and assembly method thereof

Abstract

The present invention provides a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof. The lens assembly is suitable for being assembled with a photosensitive assembly into a camera module, and comprises: an optical lens group, a lens barrel and a support member, wherein the optical lens group is installed in the lens barrel to form a lens; wherein the lens barrel is fixed to the inner side of the support member by dispensing glue in two opposite first areas between the lens barrel and the support member to limit the displacement of the two in the X direction, wherein the first area corresponds to the long side area of ​​a photosensitive chip of the photosensitive assembly.

Description

Technical Field

[0001] The present invention relates to the field of camera modules, and more particularly to a lens assembly, a photosensitive assembly, a camera module and an assembly method thereof, so as to reduce the influence of deformation of glue during baking on imaging. Background Art

[0002] In recent years, in order to meet people's demand for taking pictures, cameras have become one of the necessary accessories for mobile phones and other terminal devices. In addition, as people's requirements for photography continue to increase, the demand is becoming more and more diversified, and multi-array camera modules have also emerged, such as wide-angle and telephoto array modules.

[0003] At present, most camera modules include a lens assembly, a lens mount, a color filter, a photosensitive element, a circuit board and other components. The assembly process of the camera module is generally to electrically connect the photosensitive chip to the circuit board, the lens mount to the circuit board, and the color filter to the lens mount, thereby forming a photosensitive assembly. In a fixed-focus camera module, the lens assembly is generally assembled from an optical lens assembly, a lens barrel and a support. In an autofocus camera module, the lens assembly generally has an actuator as the support of the lens barrel to carry the optical lens assembly and the lens barrel. The lens assembly is supported on the top side of the photosensitive assembly, and finally forms the camera module. During the assembly process, most of the components are exposed and fixed by dispensing glue.

[0004] In the actual assembly process, as the components are stacked, the assembly tolerances of the components are accumulated. In order to achieve a good match between the lens assembly and the photosensitive chip, during assembly, the support member of the lens assembly is installed on the top side of the photosensitive component, and then a lens (i.e., the lens barrel equipped with the optical lens assembly) and the support member are assembled using the AA process to reduce the tolerance. That is, by lighting up the photosensitive chip, fixing the photosensitive component, adjusting the robotic arm to clamp the lens, and taking a photo of the standard plate. By running the defocus curve, the optimal assembly position of the lens and the support member is obtained, and the relative position of the two is fixed by dispensing and curing.

[0005] In the existing technology, the photosensitive chip and its photosensitive area are both rectangular, while the imaging surface of an optical system of the lens assembly is circular. In order to improve the utilization rate of the photosensitive area of ​​the photosensitive chip, the light area of ​​the optical system reaching the photosensitive area needs to fully cover the photosensitive area, such as Figure 1As shown. It can be seen that the offset value of the optical system imaging surface in the long side direction (X direction) of the photosensitive chip is smaller than the offset value in the wide side direction (Y direction). A slight offset and tilt in the X direction may cause the optical system imaging surface to fail to cover the photosensitive area well, resulting in blurred imaging. In other words, the photosensitive area is more sensitive to the offset or tilt of the photosensitive chip in the X direction.

[0006] In order to strengthen the fixing strength between the lens and the support, the prior art usually adopts a four-point glue dispensing method with uniform and symmetrical distribution. After AA adjustment and glue curing at the optimal relative position of the lens and the support, the camera module needs to undergo baking in the post-process. During the baking process, the glue will be deformed due to reasons such as the increase in temperature. In addition, due to the thermal expansion and contraction of the lens assembly itself, the lens will be subjected to forces in all directions. Different amounts of glue will have different variations in the same environment, and the pulling force applied to the lens will also be different. The lens is unevenly stressed, causing it to deviate from the original assembly position. In some cases, because the deformation amounts of each glue dispensing position are different, they pull on each other, causing the glue to crack in places where the glue adhesion is relatively small.

[0007] When the four-point glue dispensing method is used, the lens and the support are glued in the areas corresponding to the two long sides and the two short sides of the photosensitive chip. At this time, it is very likely that due to the uneven glue dispensing, the glue dispensing amount at the four-point glue dispensing positions is inconsistent, resulting in inconsistent deformation of the glue dispensing positions during the baking process, and even causing the glue to crack. Figure 2A and Figure 2B As shown, the positions indicated by arrows in the figure are the four-point glue dispensing positions commonly used in the prior art when installing the lens and the support member.

[0008] The cracking and deformation of the glue are inconsistent, which will cause the restoring force applied to the lens to be different from the pulling force during the baking process when the glue returns to its original state due to the temperature drop during the subsequent cooling process. The lens cannot return to its original position, causing the position of the lens relative to the support to shift, and then the position of the optical system relative to the photosensitive area to shift. The two do not work well together, and the image is not clear. Especially in the X direction of the photosensitive chip that is sensitive to tilt and offset, the impact on imaging is more serious.

[0009] In particular, when the glue cracks, the lens is not bonded to the glue, and naturally cannot receive the restoring force from the glue during the cooling and recovery process. Therefore, during the baking process, the lens that is pushed and offset by the pulling force cannot return to its original position during the cooling process because it does not receive the corresponding restoring force, causing the lens and the support member to be offset in the final product.

[0010] This effect is more serious in wide-angle camera modules. On the one hand, the photosensitive area of ​​the wide-angle camera module is larger than that of the ordinary camera module, and the offset value in the X direction is smaller. On the other hand, the offset direction is inconsistent due to the deformation of the glue, which will cause the optical axes of the two modules in the array module to be non-parallel or deviate from the calibration coordinates, making it more difficult to match the images of the two.

[0011] In addition to the offset between the lens and the support due to glue deformation, similar problems exist between other components that are connected by four-point glue, such as between the support and the lens holder, between the lens holder and the circuit board, and between the photosensitive chip and the circuit board. The glue deformation between these components will cause the optical imaging surface and the photosensitive area to shift, thereby affecting the imaging quality. Summary of the invention

[0012] One object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof, wherein the gluing scheme adopted between the components of the camera module can reduce or even avoid the possibility of offset of an optical system of the lens assembly and a photosensitive chip of the photosensitive assembly during the baking process and the cooling process, thereby improving the product yield.

[0013] One object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof, wherein the glue dispensing scheme adopted between the components of the camera module can reduce or even avoid the offset of the optical system and the photosensitive chip in the offset-sensitive X direction during the baking process and the cooling process, thereby improving the product yield.

[0014] Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof, wherein the glue between a support member and a lens barrel of the lens assembly allows the two to offset in the Y direction and limits the two to offset in the X direction, thereby reducing the impact of the offset between the optical system and the photosensitive chip on imaging.

[0015] Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof, wherein the glue between the support member and the lens barrel is arranged between the two, in two opposite first areas corresponding to the long side areas of the photosensitive chip, thereby allowing the two to offset in the Y direction and limiting the two to offset in the X direction.

[0016] Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof, wherein the glue between the support member and the lens barrel forms a roughly straight line with the center of the lens assembly in the coating area relative to the first area, and the straight line roughly overlaps in the Y direction.

[0017] Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof, wherein between the support member and the lens barrel, two relative first areas are coated with glue with strong bonding force to enhance the bonding strength between the two; and the second area corresponding to the short side area of ​​the photosensitive chip is coated with glue with low bonding force or low deformation to achieve a dust-proof effect.

[0018] Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof, wherein the glue between the support member and the lens barrel is respectively arranged between the two, in a group of adjacent first areas and second areas, so that the support member and the lens barrel are only subjected to force on one side in the X direction and the Y direction, thereby avoiding the mutual pulling phenomenon in the four-point glue dispensing in the prior art, reducing the influence of glue deformation on offset, and avoiding the occurrence of glue cracking.

[0019] Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof, wherein the glue between the support member and the lens barrel is respectively arranged between the two, in the middle area of ​​an adjacent group of first areas and in the middle area of ​​the second area, thereby reducing and avoiding the possibility of offset.

[0020] Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof, wherein the glue between the support member and the photosensitive assembly allows the two to be offset in the Y direction and limits the two to be offset in the X direction, thereby reducing the impact of the offset between the optical system of the lens assembly and the photosensitive chip of the photosensitive assembly on imaging.

[0021] Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof, wherein the glue between the support member and the photosensitive assembly is arranged between the two, in two opposite first areas, thereby allowing the two to offset in the Y direction and limiting the two to offset in the X direction.

[0022] Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof, wherein between the support member and the photosensitive assembly, two relative first areas are coated with glue with strong bonding force to enhance the bonding strength between the two; and the second area is coated with glue with low bonding force or low deformation to achieve a dust-proof effect.

[0023] Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof, wherein the glue between the support member and the photosensitive assembly is respectively arranged between the two, in a group of adjacent first and second areas, so that the support member and the photosensitive assembly are only subjected to force on one side in the X direction and the Y direction, thereby avoiding the mutual pulling phenomenon in the four-point glue dispensing in the prior art, reducing the influence of glue deformation on offset, and avoiding the occurrence of glue cracking.

[0024] Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof, wherein the glue between a circuit board and a lens mount of the photosensitive assembly allows the two to be offset in the Y direction and limits the two to be offset in the X direction, thereby reducing the impact of the offset between the optical system of the lens assembly and the photosensitive chip of the photosensitive assembly on imaging.

[0025] Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof, wherein the glue between the circuit board and the lens mount is arranged between the two and in two relative first areas, thereby allowing the two to offset in the Y direction and limiting the two to offset in the X direction.

[0026] Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof, wherein between the circuit board and the lens mount, two relative first areas are coated with glue with strong bonding force to enhance the bonding strength between the two; and the second area is coated with glue with low bonding force or low deformation to achieve a dust-proof effect.

[0027] Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof, wherein the glue between the circuit board and the lens mount is respectively arranged in a group of first areas and second areas adjacent thereto, so that the circuit board and the lens mount are subjected to force on only one side in the X direction and the Y direction, thereby avoiding the mutual pulling phenomenon in the four-point glue dispensing in the prior art, reducing the influence of glue deformation on offset, and avoiding the occurrence of glue cracking.

[0028] Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof, wherein the glue between the photosensitive chip of the photosensitive assembly and the circuit board allows the two to be offset in the Y direction and limits the two to be offset in the X direction, thereby reducing the impact of the offset between the optical system of the lens assembly and the photosensitive chip of the photosensitive assembly on imaging.

[0029] Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof, wherein the glue between the photosensitive chip and the circuit board is arranged between the two, in two opposite first areas, thereby allowing the two to offset in the Y direction and limiting the two to offset in the X direction.

[0030] Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof, wherein between the photosensitive chip and the circuit board, two relative first areas are coated with glue with strong bonding force to enhance the bonding strength between the two; and the second area is coated with glue with low bonding force or low deformation to achieve a dust-proof effect.

[0031] Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof, wherein the glue between the photosensitive chip and the circuit board is respectively arranged between the two, in a group of adjacent first areas and second areas, so that the photosensitive chip and the circuit board are only subjected to force on one side in the X direction and the Y direction, thereby avoiding the mutual pulling phenomenon in the four-point glue dispensing in the prior art, reducing the influence of glue deformation on offset, and avoiding the occurrence of glue cracking.

[0032] Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof, wherein for an array camera module, especially an array camera module with a wide-angle plus telephoto combination, the glue dispensing scheme of the present invention used between its components can reduce or even avoid the displacement of its optical system and the corresponding photosensitive chip in the X direction, which is more sensitive to displacement than ordinary camera modules, during the baking process, thereby improving the product yield.

[0033] Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof, wherein for an array camera module, especially an array camera module with a wide-angle and telephoto combination, the gluing scheme of the present invention used between its components can reduce or even avoid the impact of the offset caused by glue deformation on the matching between various images.

[0034] Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof, wherein between the support member and the lens barrel, when the relative first area is coated with glue, the area corresponding to the second area is coated with dust-proof glue to prevent dust from entering the interior of the camera module.

[0035] Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof, wherein the dust-proof glue between the support member and the lens barrel only contacts the outer wall of the lens barrel, or only contacts the inner wall of the support member, thereby bonding the dust in the gap between the outer wall of the lens barrel and the inner wall of the support member.

[0036] Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof, wherein the dust-proof glue between the support member and the lens barrel is filled in at least one dust-proof groove provided on the inner wall of the support member, and is spaced a preset distance from the outer wall of the lens barrel to bond dust in the gap between the outer wall of the lens barrel and the inner wall of the support member.

[0037] Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof, wherein the dust-proof glue between the support member and the lens barrel is filled in at least one dust-proof groove provided on the outer wall of the lens barrel, and is spaced a preset distance from the inner wall of the support member to bond dust in the gap between the outer wall of the lens barrel and the inner wall of the support member.

[0038] Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof, wherein between the support member and the lens mount of the photosensitive assembly, when the relative first area is coated with glue, the second area is coated with dust-proof glue to prevent dust from entering the interior of the camera module.

[0039] Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof, wherein between the circuit board and the lens mount, when the relative first area is coated with glue, the second area is coated with dust-proof glue to prevent dust from entering the interior of the camera module.

[0040] Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof, wherein between the circuit board and the photosensitive chip, when the relative first area is coated with glue, the second area is covered with dust-proof glue to prevent dust from entering the interior of the camera module.

[0041] Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof, wherein, between the support member and the lens barrel, when the relative first area is coated with glue, a staggered protrusion structure is adopted in the second area to extend the path for dust to enter the camera module, thereby preventing dust from affecting the imaging of the photosensitive chip.

[0042] Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof, wherein between the support member and the lens mount, when the relative first area is coated with glue, a staggered protrusion structure is adopted in the second area to extend the path for dust to enter the camera module, thereby preventing dust from affecting the imaging of the photosensitive chip.

[0043] Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof, wherein between the support member and the lens barrel, a glue dispensing space is reserved only in a relative first area, and the second area is closed to prevent dust from entering.

[0044] Another object of the present invention is to provide a lens assembly, a photosensitive assembly and a camera module and an assembly method thereof, wherein the gluing scheme used between the components of the camera module is improved without changing the original design, thereby ensuring a good combination of the lens and the support member and the imaging quality of the camera module.

[0045] According to one aspect of the present invention, the present invention further provides a lens assembly, suitable for being assembled with a photosensitive assembly into a camera module, comprising:

[0046] an optical lens set;

[0047] a lens barrel, wherein the optical lens group is installed in the lens barrel to form a lens; and

[0048] A support member, wherein the lens barrel is fixed to the inner side of the support member by dispensing glue on two opposite first areas between the lens barrel and the support member to limit the offset of the two in the X direction, wherein the first area corresponds to a long side area of ​​a photosensitive chip of the photosensitive component.

[0049] According to an embodiment of the present invention, the glue between the support member and the lens barrel is applied to the middle area of ​​the first area opposite to the support member and the lens barrel.

[0050] According to one embodiment of the present invention, the lens assembly further includes a dust-proof glue, wherein the dust-proof glue is applied to two opposite second areas between the lens barrel and the support member, wherein the second area corresponds to a short side area of ​​a photosensitive chip of the photosensitive component.

[0051] According to one embodiment of the present invention, in at least one of the two second areas, at least one dustproof groove is arranged on the inner wall of the support member, wherein the dustproof glue is filled in the dustproof groove, wherein the outer surface of the dustproof glue is spaced a preset distance from the outer wall of the lens barrel, so as to bond dust in the gap between the outer wall of the lens barrel and the inner wall of the support member.

[0052] According to one embodiment of the present invention, in at least one of the two second areas, at least one dustproof groove is arranged on the outer wall of the lens barrel, wherein the dustproof glue is filled in the dustproof groove located on the outer wall, and is spaced a preset distance from the inner wall of the support member, so as to bond the dust in the gap between the outer wall of the lens barrel and the inner wall of the support member.

[0053] According to one embodiment of the present invention, in at least one of the two second areas, the outer wall of the lens barrel and the inner wall of the support member are provided with staggered and matching protrusions to form a staggered protrusion structure to extend the path for dust to enter the camera module.

[0054] According to an embodiment of the present invention, the lens assembly further has two glue dispensing spaces, wherein the two glue dispensing spaces are respectively formed in two opposite first areas between the lens barrel and the support member, and the two opposite second areas are closed.

[0055] According to another aspect of the present invention, the present invention further provides a lens assembly, suitable for being assembled with a photosensitive assembly into a camera module, comprising:

[0056] an optical lens set;

[0057] a lens barrel, wherein the optical lens group is installed in the lens barrel to form a lens; and

[0058] A support member, wherein the lens barrel is fixed to the inner side of the support member by dispensing glue in a group of first area and second area between the lens barrel and the support member to limit the offset of the two, wherein the first area corresponds to a long side area of ​​a photosensitive chip of the photosensitive component, and the second area corresponds to a short side area of ​​a photosensitive chip of the photosensitive component.

[0059] According to an embodiment of the present invention, the glue between the support member and the lens barrel is applied to a middle area of ​​a group of adjacent first areas and a middle area of ​​the second area respectively.

[0060] According to an embodiment of the present invention, the lens assembly further comprises a dustproof glue, wherein the dustproof glue is applied to another set of adjacent first areas and second areas between the lens barrel and the support member.

[0061] According to one embodiment of the present invention, in at least one of another adjacent group of the first area and the second area, at least one dustproof groove is arranged on the inner wall of the support member, wherein the dustproof glue is filled in the dustproof groove, wherein the outer surface of the dustproof glue is spaced a preset distance from the outer wall of the lens barrel, so as to bond dust in the gap between the outer wall of the lens barrel and the inner wall of the support member.

[0062] According to one embodiment of the present invention, in at least one of another adjacent set of the first area and the second area, at least one dustproof groove is arranged on the outer wall of the lens barrel, wherein the dustproof glue is filled in the dustproof groove located on the outer wall, and is spaced a preset distance from the inner wall of the support member, so as to bond the dust in the gap between the outer wall of the lens barrel and the inner wall of the support member.

[0063] According to one embodiment of the present invention, in at least another group of adjacent first areas and second areas, the outer wall of the lens barrel and the inner wall of the support member are provided with staggered and matching protrusions to form a staggered protrusion structure to extend the path for dust to enter the camera module.

[0064] According to one embodiment of the present invention, the lens assembly further has two glue dispensing spaces, wherein the two glue dispensing spaces are respectively formed between the lens barrel and the support member, a group of adjacent first areas and second areas, and another group of adjacent first areas and second areas are closed.

[0065] According to another aspect of the present invention, the present invention further provides a camera module, comprising:

[0066] A lens assembly as described above; and

[0067] A photosensitive component, wherein the photosensitive component includes a photosensitive chip, a lens holder and a circuit board, wherein

[0068] The photosensitive chip is electrically attached to the circuit board, wherein the lens holder surrounds the photosensitive chip and is attached to the circuit board, wherein the lens holder has a light window corresponding to the photosensitive area of ​​the photosensitive chip, wherein the support member supports the lens corresponding to the light window, and wherein the support member extends from the lens holder.

[0069] According to one embodiment of the present invention, the support member is fixed to the top side of the mirror base by dispensing glue on two opposite first areas between the mirror base and the support member.

[0070] According to an embodiment of the present invention, the glue between the support member and the mirror base is coated along two long sides of the mirror base respectively.

[0071] According to one embodiment of the present invention, the support member is fixed to the top side of the mirror base by dispensing glue on a group of adjacent first areas and second areas between the mirror base and the support member.

[0072] According to an embodiment of the present invention, between the mirror base and the support member, the glue located in one of the first regions is coated along the long side of the mirror base, while the glue located in the adjacent second region is coated along the short side of the mirror base.

[0073] According to one embodiment of the present invention, the camera module further includes dust-proof glue, wherein the dust-proof glue is applied to two opposite second areas between the lens holder and the support member.

[0074] According to one embodiment of the present invention, the camera module further includes dust-proof glue, wherein the dust-proof glue is applied to another set of adjacent first areas and second areas between the lens mount and the support member.

[0075] According to one embodiment of the present invention, at least one dustproof groove and a matching dustproof protrusion are provided on the mirror base and the support member, wherein the dustproof protrusion is fixed to the dustproof groove to prevent dust from entering the internal space.

[0076] According to an embodiment of the present invention, the mirror base is fixed to the circuit board by dispensing glue on two opposite first areas between the mirror base and the circuit board.

[0077] According to an embodiment of the present invention, the glue between the mirror base and the circuit board is coated along two long sides of the mirror base respectively.

[0078] According to an embodiment of the present invention, the mirror base is fixed to the circuit board by dispensing glue on a group of adjacent first areas and second areas between the mirror base and the circuit board.

[0079] According to an embodiment of the present invention, between the mirror base and the circuit board, the glue located in one of the first regions is coated along the long side of the mirror base, while the glue located in the adjacent second region is coated along the short side of the mirror base.

[0080] According to one embodiment of the present invention, the photosensitive chip is fixed to the circuit board by dispensing glue in two opposite first areas between the photosensitive chip and the circuit board.

[0081] According to one embodiment of the present invention, the glue between the photosensitive chip and the circuit board is coated along two long sides of the photosensitive chip respectively.

[0082] According to one embodiment of the present invention, the photosensitive chip is fixed to the circuit board by dispensing glue on a group of adjacent first areas and second areas between the photosensitive chip and the circuit board.

[0083] According to one embodiment of the present invention, between the photosensitive chip and the circuit board, the glue located in one of the first regions is coated along the long side of the photosensitive chip, while the glue located in the adjacent second region is coated along the short side of the photosensitive chip.

[0084] According to another aspect of the present invention, the present invention further provides an array camera module, comprising:

[0085] At least two lens assemblies as described above; and

[0086] At least two photosensitive chips;

[0087] an integrated mirror mount; and

[0088] A circuit board, wherein the photosensitive chip is correspondingly and electrically attached to the circuit board, wherein the integrated lens holder surrounds the circumference of each photosensitive chip and is attached to the circuit board, wherein the integrated lens holder has at least two light windows corresponding to the photosensitive areas of the photosensitive chip, wherein the support member supports the lens corresponding to the light windows, and wherein the support member extends from the integrated lens holder.

[0089] According to another aspect of the present invention, the present invention further provides an array camera module, comprising:

[0090] At least two lens assemblies as described above; and

[0091] At least two photosensitive chips;

[0092] At least two mirror mounts; and

[0093] A circuit board, wherein the photosensitive chip is correspondingly and electrically attached to the circuit board, wherein each of the lens seats surrounds the circumference of the corresponding photosensitive chip and is attached to the circuit board, wherein the lens seat has a light window corresponding to the photosensitive area of ​​the photosensitive chip, wherein the support member supports the lens corresponding to the light window, and wherein the support member extends from the corresponding lens seat.

[0094] According to another aspect of the present invention, the present invention further provides a photosensitive component, comprising:

[0095] A photosensitive chip;

[0096] a circuit board, wherein the photosensitive chip is electrically connected and attached to the circuit board; and

[0097] A mirror base, wherein the mirror base is formed by dispensing glue on two opposite first areas between the circuit board and the mirror base.

[0098] The mirror holder is fixed to the circuit board, wherein the mirror holder surrounds the circumference of the photosensitive chip, wherein the mirror holder has at least one light window corresponding to the photosensitive area of ​​the photosensitive chip, wherein the first area corresponds to a long side area of ​​a photosensitive chip of the photosensitive component.

[0099] According to another aspect of the present invention, the present invention further provides a photosensitive component, comprising:

[0100] A photosensitive chip;

[0101] a circuit board, wherein the photosensitive chip is electrically connected and attached to the circuit board; and

[0102] A mirror mount, wherein the mirror mount is fixed to the circuit board by dispensing glue on a group of adjacent first areas and second areas between the circuit board and the mirror mount, wherein the mirror mount surrounds the circumference of the photosensitive chip, wherein the mirror mount has at least one light window corresponding to the photosensitive area of ​​the photosensitive chip, wherein the first area corresponds to a long side area of ​​a photosensitive chip of the photosensitive component, and wherein the second area corresponds to a short side area of ​​a photosensitive chip of the photosensitive component.

[0103] According to another aspect of the present invention, the present invention further provides a photosensitive component, comprising:

[0104] A photosensitive chip;

[0105] A circuit board, wherein the photosensitive chip is electrically connected and attached to the circuit board by dispensing glue on two opposite first areas between the circuit board and the photosensitive area, wherein the first area corresponds to a long side area of ​​a photosensitive chip of the photosensitive component; and

[0106] A mirror mount, wherein the mirror mount is fixed to the circuit board, wherein the mirror mount surrounds the peripheral side of the photosensitive chip, and wherein the mirror mount has at least one light window corresponding to the photosensitive area of ​​the photosensitive chip.

[0107] According to another aspect of the present invention, the present invention further provides a photosensitive component, comprising:

[0108] A photosensitive chip;

[0109] A circuit board, wherein the photosensitive chip is electrically connected and attached to the circuit board by dispensing glue in a group of adjacent first and second areas between the circuit board and the photosensitive area, wherein the first area corresponds to a long side area of ​​a photosensitive chip of the photosensitive component, and the second area corresponds to a short side area of ​​a photosensitive chip of the photosensitive component; and

[0110] A mirror mount, wherein the mirror mount is fixed to the circuit board, wherein the mirror mount surrounds the peripheral side of the photosensitive chip, and wherein the mirror mount has at least one light window corresponding to the photosensitive area of ​​the photosensitive chip.

[0111] According to another aspect of the present invention, the present invention further provides a method for assembling a camera module, comprising:

[0112] (a) assembling a set of optical lenses and a lens barrel to form a lens;

[0113] (b) attaching a support member to a reserved position on the top side of a photosensitive component; and

[0114] (c) by respectively passing through two opposite first regions between the support member and the lens barrel

[0115] Glue is dispensed in the intermediate area to fix the support member and the lens barrel, wherein the lens corresponds to the light-sensitive path of the photosensitive component, and the first area corresponds to the long side area of ​​a photosensitive chip of the photosensitive component.

[0116] According to one embodiment of the present invention, the step (b) further comprises:

[0117] (b1) Fixing the support member and the photosensitive component by dispensing glue along two long sides of the lens holder of the photosensitive component at two opposite first areas between the support member and the photosensitive component.

[0118] According to one embodiment of the present invention, the step (b) further comprises:

[0119] (b2) dispensing glue along the long side of the lens mount of the photosensitive component in a first area between the support member and the photosensitive component, and dispensing glue along the short side of the lens mount of the photosensitive component in a second area between the two.

[0120] According to one embodiment of the present invention, the step (c) further comprises:

[0121] (c1) Adhere glue along two long sides of a photosensitive chip by dispensing glue in two opposite first areas between a photosensitive chip and a circuit board, and electrically attach the photosensitive chip to the circuit board.

[0122] According to one embodiment of the present invention, the step (c) further comprises:

[0123] (c2) Fixing the mirror base to the circuit board by dispensing glue along two long sides of the mirror base respectively between two opposite first areas between a mirror base and the circuit board, wherein the mirror base surrounds the photosensitive chip and has a light window corresponding to the photosensitive area of ​​the photosensitive chip.

[0124] According to one embodiment of the present invention, the step (c) further comprises:

[0125] (c3) The photosensitive chip is electrically attached to the circuit board by dispensing glue along the long side of the photosensitive chip in the first area between the photosensitive chip and the circuit board, and dispensing glue along the short side of the photosensitive chip in the second area between the two.

[0126] According to one embodiment of the present invention, the step (c) further comprises:

[0127] (c4) Fixing the mirror base to the circuit board by dispensing glue along the long side of the mirror base in a first area between the mirror base and the circuit board, and dispensing glue along the short side of the mirror base in a second area therebetween, wherein the mirror base surrounds the photosensitive chip and has a light window corresponding to the photosensitive area of ​​the photosensitive chip.

[0128] According to one embodiment of the present invention, the assembly method further comprises the steps of:

[0129] (d) Dust is prevented by coating dust-proof glue on two opposite second areas between the support member and the lens barrel, wherein the second areas correspond to a short side area of ​​a photosensitive chip of the photosensitive component.

[0130] According to another aspect of the present invention, the present invention further provides a method for assembling a camera module, comprising:

[0131] (A) Assembling a set of optical lenses and a lens barrel to form a lens;

[0132] (B) attaching a support member to a reserved position on the top side of a photosensitive component; and

[0133] (C) The support member and the lens barrel are fixed by dispensing glue between the support member and the lens barrel, in the middle area of ​​a group of first areas, and in the middle area of ​​a group of second areas, wherein the lens corresponds to the photosensitive path of the photosensitive component, and wherein the first area corresponds to the long side area of ​​a photosensitive chip of the photosensitive component.

[0134] According to one embodiment of the present invention, the assembly method further comprises the steps of:

[0135] (D) Dust is prevented by coating another set of first and second regions between the support member and the lens barrel with dust-proof glue. BRIEF DESCRIPTION OF THE DRAWINGS

[0136] Figure 1 It is a relationship diagram of an optical system of a lens assembly and a photosensitive chip.

[0137] Figure 2A and Figure 2B The present invention is a schematic diagram of the glue dispensing position of a lens assembly in the prior art.

[0138] Figure 3 It is an exploded view of a camera module according to a preferred embodiment of the present invention.

[0139] Figure 4 It is a perspective view of the camera module according to the above preferred embodiment of the present invention.

[0140] Figure 5It is a top view of the camera module according to the above preferred embodiment of the present invention.

[0141] Fig. 6A It is a cross-sectional view of the camera module along the AA direction according to the above preferred embodiment of the present invention.

[0142] Figure 6B It is a cross-sectional view of the camera module along the BB direction according to the above preferred embodiment of the present invention.

[0143] Fig. 7A is a top view of a camera module according to an embodiment of the present invention.

[0144] Figure 7B It is a cross-sectional view of the camera module along the CC direction according to the above embodiment of the present invention.

[0145] Figure 7C It is a cross-sectional view of the camera module along the DD direction according to the above embodiment of the present invention.

[0146] Fig. 8A is a partial schematic diagram of a lens assembly according to an embodiment of the present invention.

[0147] Figure 8B is a partial schematic diagram of a lens assembly according to an embodiment of the present invention.

[0148] Fig. 9 is a top view of a camera module according to an embodiment of the present invention.

[0149] Fig. 10A is a top view of a camera module according to an embodiment of the present invention.

[0150] Fig. 10B It is a cross-sectional view of the camera module in the EE direction according to the above embodiment of the present invention.

[0151] Fig. 10C It is a cross-sectional view of the camera module along the FF direction according to the above embodiment of the present invention.

[0152] Fig.11 is a top view of a photosensitive component according to an embodiment of the present invention.

[0153] Fig. 12A and Fig. 12B It is a cross-sectional view in different directions of a camera module according to an embodiment of the present invention.

[0154] Fig.13A It is a partial schematic diagram of a camera module according to an embodiment of the present invention.

[0155] Fig. 13BIt is a partial schematic diagram of a camera module according to an embodiment of the present invention.

[0156] Fig. 13C It is a partial schematic diagram of a camera module according to an embodiment of the present invention.

[0157] Fig.13D It is a partial schematic diagram of a camera module according to an embodiment of the present invention.

[0158] Fig.14A is a top view of an array camera module according to an embodiment of the present invention.

[0159] Fig. 14B It is a cross-sectional view along the GG direction of the array camera module according to the above embodiment of the present invention.

[0160] Fig. 14C It is a cross-sectional view along the HH direction of the array camera module according to the above embodiment of the present invention.

[0161] Fig.14D It is a cross-sectional view along direction II of the array camera module according to the above embodiment of the present invention.

[0162] Fig.15A is a top view of a camera module according to a second embodiment of the present invention.

[0163] Fig. 15B It is a cross-sectional view along the JJ direction of the camera module according to the second embodiment of the present invention.

[0164] Fig. 15C It is a cross-sectional view along the KK direction of the camera module according to the second embodiment of the present invention.

[0165] Fig.16A and Fig. 16B It is a cross-sectional view of the camera module in different directions according to another embodiment of the present invention.

[0166] Fig.17A is a top view of an array camera module according to a second embodiment of the present invention.

[0167] Fig. 17B It is a cross-sectional view along the LL direction of the array camera module according to the above-mentioned second embodiment of the present invention.

[0168] Fig. 17C It is a cross-sectional view along the MM direction of the array camera module according to the above-mentioned second embodiment of the present invention.

[0169] Fig.17D It is a cross-sectional view along the NN direction of the array camera module according to the above-mentioned second embodiment of the present invention.

[0170] Fig.18A is a top view of a camera module according to an embodiment of the present invention.

[0171] Fig.18B is a top view of an array camera module according to another embodiment of the present invention.

[0172] Fig.19 It is a flow chart of an assembly method of a camera module according to the present invention.

[0173] Fig. 20 is a flow chart of an assembling method of a photosensitive component according to the present invention.

[0174] Fig.21 is a flow chart of another method for assembling a photosensitive component according to the present invention.

[0175] FIG. 22A to FIG. 22C It is a cross-sectional view at different positions of another array camera module according to the present invention.

[0176] FIG. 23A to FIG. 23C It is a cross-sectional view at different positions of another array camera module according to the present invention. DETAILED DESCRIPTION

[0177] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not deviate from the spirit and scope of the present invention.

[0178] Those skilled in the art should understand that, in the disclosure of the present invention, the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0179] It is to be understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0180] refer to Figures 3 to 14DAccording to a preferred embodiment of the present invention, a lens assembly, a photosensitive assembly and a camera module are described, providing a dispensing solution different from the prior art, which can reduce or even avoid the offset between an optical system of the lens assembly and a photosensitive chip of the photosensitive assembly during the baking process, thereby improving the product yield. The camera module 300 includes the lens assembly 100 and the photosensitive assembly 200. The lens assembly 100 is supported on the top side of the photosensitive assembly 200, corresponding to the photosensitive path of the photosensitive assembly 200.

[0181] In the present invention, the long side direction of a photosensitive chip 210 of the photosensitive component 200 is taken as the X direction, and the short side direction of the photosensitive chip 210 is taken as the Y direction for explanation. In order to ensure that a photosensitive area 211 of the photosensitive chip 210 is fully utilized, the center of the photosensitive area 211 is on the same straight line as the optical axis of the optical system of the lens assembly 100, an overlapping central axis is defined, and the imaging surface radius of the optical system should be greater than the diagonal radius of the photosensitive area 211. Correspondingly, the intersection point of each horizontal cross section at the overlapping central axis is the center position of the corresponding horizontal plane.

[0182] In the prior art, the photosensitive chip 210 and the photosensitive area 211 are both rectangular, and an optical system imaging surface of the lens assembly 100 is circular. Figure 1 As shown. It can be seen that the offset value of the optical system imaging surface in the X direction is smaller than the offset value in the Y direction. A slight offset and tilt in the X direction may cause the optical system imaging surface to fail to cover the photosensitive area well, thereby causing blurred imaging. In other words, the photosensitive area is more sensitive to offset or tilt in the X direction.

[0183] The lens assembly 100 includes an optical lens assembly 110, a lens barrel 120 for accommodating the optical lens assembly 110, and a support member 130. The optical lens assembly 110 includes a single or multiple optical lenses. During assembly, the optical lens assembly 110 is installed in the lens barrel 120 to form a lens, and then the support member 130 carries the lens and is installed on the top side of the photosensitive assembly 200 so that the optical lens assembly 110 corresponds to the light sensing path of the photosensitive assembly 200.

[0184] As described above, in the prior art, the assembly of the lens and the support member 130 is fixed by four-point glue dispensing, that is, the areas corresponding to the X direction and the Y direction between the inner side wall 131 of the support member 130 and the outer side wall 121 of the lens barrel 120 are fixed by glue. However, the four-point glue dispensing method can easily cause the lens to deviate in the X direction, which is sensitive to deviation, so that the imaging surface of an optical system of the lens assembly 100 and the position of the photosensitive area are offset, affecting the product yield.

[0185] In a preferred embodiment of the present invention, the glue 400 of the inner side wall 131 of the support member 130 and the outer side wall 121 of the lens barrel 120 allows the two to deviate in the Y direction, and limits the two to deviate in the X direction, thereby reducing the impact of the offset between the optical system of the lens assembly and the photosensitive chip of the photosensitive assembly on imaging. That is, in the present invention, the support member 130 and the lens barrel 120 are prohibited from deviating in the X direction as much as possible, thereby improving the product yield.

[0186] In a preferred embodiment of the present invention, the glue 400 between the support member 130 and the lens barrel 120 is disposed in two opposite first areas 140 therebetween corresponding to the long side areas of the photosensitive chip, so that during the baking deformation and the subsequent cooling recovery process, the X-direction forces are offset as much as possible to avoid displacement in the X-direction. Figure 5 and Fig. 6A The long side area of ​​the photosensitive chip refers to the area radiated by connecting the center of the photosensitive area 211 and the two end points of the long side of the photosensitive chip 210, as shown in FIG. Figure 5 As shown. The first area 140 between the support member 130 and the lens barrel 120 is an extension of the long side area of ​​the photosensitive chip between the support member 130 and the lens barrel 120 in the Z direction. It can be understood that, corresponding to the two opposite long sides of the photosensitive chip, the long side areas of the photosensitive chip formed are also two opposite areas, and correspondingly, the first area 140 between the support member 130 and the lens barrel 120 are also two opposite areas.

[0187] At this time, since the two opposite second areas 150 between the support member 130 and the lens barrel 120 and corresponding to the short side area of ​​the photosensitive chip are not glued, the second areas 150 will not be subjected to pulling force during baking, and will not be subjected to restoring force during the subsequent cooling process, thereby reducing the possibility of X-direction offset. Figure 5 and Figure 6BAs shown. The photosensitive chip short side area refers to the area radiated by connecting the center of the photosensitive area 211 and the two end points of the short side of the photosensitive chip 210. The second area 150 between the support member 130 and the lens barrel 120 is the extension of the photosensitive chip short side area between the support member 130 and the lens barrel 120 in the Z direction. It can be understood that the photosensitive chip short side areas formed corresponding to the two opposite short sides of the photosensitive chip are also two opposite areas, and correspondingly, the second area 150 between the support member 130 and the lens barrel 120 are also two opposite areas.

[0188] Preferably, in order to prevent the lens barrel 120 from being deflected by the X-direction force component as much as possible, the glue 400 between the support member 130 and the lens barrel 120 is applied to the middle area of ​​the first area 140 between the two. That is, between the support member 130 and the lens barrel 120, the coating areas 141 of the two opposite first areas 140 and the corresponding center positions are roughly straight lines, and the straight lines are roughly overlapped in the Y direction. In this case, the effect of the force centers offsetting each other in the X direction is better.

[0189] In order to ensure the bonding strength between the lens and the support member 130 and prevent the lens and the support member 130 from falling off when the camera module is subjected to impact, in a preferred embodiment of the present invention, between the support member 130 and the lens barrel 120, the coating area 141 of the first area 140 is coated with a strong bonding glue 400 to meet the glue strength requirement, such as a thermosetting glue.

[0190] Furthermore, in the existing lens and the support, if only glue is dispensed on the first area 140, resulting in the existence of glue dispensing holes in the second area 150, dustproof treatment is required to prevent external dust from entering the camera module through the reserved glue dispensing holes, thereby affecting imaging. In a preferred embodiment of the present invention, between the lens and the support 130, a glue with low bonding strength or low variation is coated on the second area 150 as dustproof glue 152 to achieve dustproof effect, such as UV glue (photosensitive glue, Ultraviolet Rays), such as Figures 7A to 7C shown.

[0191] Specifically, in one embodiment of the present invention, in the second area 150, the inner side wall 131 of the support member 130 is recessed to form at least one dustproof groove 151, the dustproof glue 152 is filled in the dustproof groove 151 located on the inner side wall 131, and the top outer surface of the dustproof glue 152 is spaced a preset distance from the outer side wall 121 of the lens barrel 120, so as to adhere to the dust in the gap between the outer side wall 121 of the lens barrel 120 and the inner side wall 131 of the support member 130, as shown in FIG. Fig. 8A shown.

[0192] In another embodiment of the present invention, at least one dustproof groove 151 is formed in the outer wall 121 of the lens barrel 120 in the second area 150, and is formed by a depression of the outer wall 121 of the lens barrel 120. The dustproof glue 152 is filled in the dustproof groove 151 located on the outer wall 121, and is spaced from the inner wall 131 of the support member 130 by a preset distance, so as to adhere to the dust in the gap between the outer wall 121 of the lens barrel 120 and the inner wall 131 of the support member 130, as shown in FIG. Figure 8B shown.

[0193] That is, the dustproof glue 152 is in contact with only one of the outer wall 121 of the lens barrel 120 and the inner wall 131 of the support member 130 , and is only used to prevent dust and avoid generating a binding force in the second area 150 .

[0194] In another embodiment of the present invention, a staggered protrusion structure is used in the second area between the support member 130 and the lens barrel 120 to extend the path for dust to enter the camera module, thereby preventing dust from affecting the imaging of the photosensitive chip. FIG. 10A to FIG. 10C As shown. Specifically, the outer side wall 121 of the lens barrel 120 and the inner side wall 131 of the support member 130 are provided with mutually staggered and mutually matching protrusions. That is to say, the protrusion of the outer side wall 121 of the lens barrel 120 abuts against the bottom of the corresponding groove of the inner side wall 131 of the support member 130, or against the top surface of the inner side wall 131 of the support member 130 that is not a groove; at the same time, the protrusion of the inner side wall 131 of the support member 130 abuts against the bottom of the corresponding groove of the outer side wall 121 of the lens barrel 120, or against the top surface of the outer side wall 121 of the lens barrel 120 that is not a groove. It can be known to those skilled in the art that the attached Fig. 10C This is only an example to explain the staggered protrusion structure. The staggered protrusion structure described in the present invention can be formed by reducing or increasing the staggered protrusions, and the present invention is not limited thereto.

[0195] In another embodiment of the present invention, the structure of the lens barrel 120 is changed, that is, only the glue dispensing space 160 is reserved in the first relative area 140, and no glue dispensing space is reserved in the second area 150, so as to prevent dust from entering. Figure 2A and Figure 2B In the prior art, the lens barrel 120 has glue dispensing spaces reserved in all directions, that is, in a petal shape. In this embodiment, the lens barrel 120 has glue dispensing spaces only in the first relative region 140. Corresponding to the glue dispensing method of the present invention, glue is dispensed only in the first region 140 between the support member 130 and the lens barrel 120, which can also prevent other gaps from allowing dust to enter the internal space, such as Fig. 9 shown.

[0196] Furthermore, the above-mentioned glue dispensing solution on the long side areas on both sides can also be used to bond the support member 130 and the photosensitive component 200 to prevent the support member 130 from deviating from the original assembly position with the lens, such as Figures 11 to 13D shown.

[0197] The photosensitive component 200 includes the photosensitive chip 210, a lens holder 220 and a circuit board 230. The photosensitive chip 210 is electrically connected and attached to the circuit board 230. The lens holder 220 surrounds the photosensitive chip 210 and is attached to the circuit board 230. The lens holder 220 has a light window 221 corresponding to the photosensitive area 211 of the photosensitive chip 210. The support member 130 supports the lens, corresponding to the light window 221. The support member 130 is bonded to the top surface 222 of the lens holder 220.

[0198] In a preferred embodiment of the present invention, the glue 400 on the bottom surface 132 of the support member 130 and the top surface 222 of the lens holder 220 allows the two to offset in the Y direction, and limits the two to offset in the X direction, thereby reducing the impact of the offset between the optical system of the lens assembly 100 and the photosensitive chip 210 on imaging. That is, in the present invention, the support member 130 and the lens holder 220 are prohibited from offsetting in the X direction as much as possible, thereby improving the product yield.

[0199] The glue 400 between the support member 130 and the lens holder 220 is disposed in two opposite first regions 140 therebetween, corresponding to the long side regions of the photosensitive chip, so that during the baking deformation and the subsequent cooling recovery process, the X-direction forces are offset as much as possible to avoid displacement in the X direction. The first region 140 between the support member 130 and the lens holder 220 corresponds to the long side region of the photosensitive chip, and is the extension of the long side region of the photosensitive chip between the support member 130 and the lens holder 220 in the Z direction, as shown in FIG. Fig.11 and Fig. 12A shown.

[0200] Similarly, at this time, the two opposite second areas 150 between the support member 130 and the lens holder 220, corresponding to the short side area of ​​the photosensitive chip, are not glued, and the second areas 150 will not be subjected to pulling force during baking, and will not be subjected to restoring force during the subsequent cooling process, thereby reducing the possibility of X-direction offset. The second area 150 between the support member 130 and the lens holder 220 corresponds to the short side area of ​​the photosensitive chip, and is the extension of the short side area of ​​the photosensitive chip between the support member 130 and the lens holder 220 in the Z direction.

[0201] Preferably, since the mirror base structure is mostly rectangular in shape, the coating areas 141 of the two opposite first areas 140 between the support member 130 and the mirror base 220 are respectively arranged on the two long sides of the mirror base 220 , that is, extending along the long sides of the mirror base 220 .

[0202] In order to ensure the bonding strength between the lens holder 220 and the support member 130 and prevent the lens holder 220 and the support member 130 from falling off when the camera module is subjected to impact, in a preferred embodiment of the present invention, between the support member 130 and the lens holder 220, the coating area 141 of the first area 140 is coated with a glue 400 with strong bonding strength to meet the glue strength requirement, such as a thermosetting glue.

[0203] Furthermore, in order to prevent external dust from entering the camera module through the gap between the lens holder 220 and the support member 130, thereby affecting imaging, in a preferred embodiment of the present invention, between the lens holder 220 and the support member 130, the second area 150 is coated with glue with low bonding strength or low variation as dustproof glue 152 to achieve dustproof effect, such as UV glue (photosensitive glue, Ultraviolet Rays), such as Fig.11 , Fig. 12B and Fig.13A shown.

[0204] In one embodiment of the present invention, at least one dustproof groove 151 is formed on the top surface 222 of the mirror holder 220 in the second area 150. Fig.13D As shown. The dustproof groove 151 is formed by the top surface 222 being recessed. The dustproof glue 152 is filled into the dustproof groove 151 located on the top surface 222, and is spaced a preset distance from the bottom surface 132 of the support member 130. The dustproof glue 152 located on the top surface 222 does not contact the bottom surface 132 of the support member 130, but uses stickiness to prevent dust from entering.

[0205] In another embodiment of the present invention, Fig. 13CAs shown, in the second area 150, the top surface 222 of the mirror base 220 forms at least one dustproof groove 223, and correspondingly, the bottom surface of the bottom surface 132 of the support member 130 forms a matching dustproof protrusion 133. That is to say, in the second area 150, the mirror base 220 and the support member 130 are fixed by matching the dustproof groove 223 and the dustproof protrusion 133. At this time, the dustproof protrusion 133 not only prolongs the path for dust to enter the internal space, but also blocks dust from entering. Between the mirror base 220 and the support member 130, the first area 140 is fixed by dispensing glue, and the second area 150 is prevented from entering by a protruding structure. Alternatively, the bottom surface 132 of the support member 130 is provided with a dustproof groove, and the top surface 222 of the mirror base 220 forms a corresponding dustproof protrusion, which can also play a dustproof role in cooperation with each other, which is not limited here.

[0206] Furthermore, between the mirror base 220 and the support member 130, in the second region 150, the protruding structure and the dustproof glue 152 can be used in combination, such as Fig. 13B As shown. In one embodiment of the present invention, between the mirror base 220 and the support member 130, the dustproof glue 152 is coated on the relatively outer area of ​​the second area 150, and a protrusion structure is provided on the relatively inner area, so as to play a dual dustproof role. For example, in the second area 150, the dustproof glue 152 can be coated on the outer area of ​​the top surface 222 of the mirror base 220, and a dustproof protrusion is formed on the inner side thereof, and a dustproof groove is correspondingly formed on the bottom surface 132 of the support member 130. It can be known by those skilled in the art that the combination used here is only an example and not a limitation. In the art, the dustproof glue 152 can also be coated on the bottom surface 132 of the support member 130 and used in combination with the protrusion structure, and so on.

[0207] Furthermore, the above-mentioned glue-dispensing solution of the long side regions on both sides can also be applied to bonding the lens holder 220 and the circuit board 230 to prevent the lens holder 220 from deviating from the original assembly position with the lens. In other words, when the lens holder 220 and the circuit board 230 are fixed with glue 400, the technical solution of the present invention can be adopted. Fig. 12A shown.

[0208] The glue 400 between the top surface 231 of the circuit board 230 and the bottom surface 223 of the lens holder 220 allows the two to be offset in the Y direction, and limits the two to be offset in the X direction, thereby reducing the impact of the offset between the optical system of the lens assembly 100 and the photosensitive chip 210 on imaging. That is, in the present invention, the circuit board 230 and the lens holder 220 are prohibited from offsetting in the X direction as much as possible, thereby improving the product yield.

[0209] The glue 400 between the circuit board 230 and the mirror base 220 is disposed in two opposite first areas 140 between the two, corresponding to the long side area of ​​the photosensitive chip, so that during the baking deformation and the subsequent cooling recovery process, the X-direction force is offset as much as possible to avoid displacement in the X direction. The first area 140 between the circuit board 230 and the mirror base 220 corresponds to the long side area of ​​the photosensitive chip, and is the extension of the long side area of ​​the photosensitive chip between the circuit board 230 and the mirror base 220 in the Z direction, such as Fig.11 and Fig. 12A shown.

[0210] Similarly, at this time, the two opposite second areas 150 between the circuit board 230 and the lens holder 220, corresponding to the short side area of ​​the photosensitive chip, are not glued, and the second areas 150 will not be subjected to pulling force during baking, and will not be subjected to restoring force during the subsequent cooling process, thereby reducing the possibility of X-direction offset. The second area 150 between the circuit board 230 and the lens holder 220 corresponds to the short side area of ​​the photosensitive chip, and is the extension of the short side area of ​​the photosensitive chip between the circuit board 230 and the lens holder 220 in the Z direction.

[0211] Preferably, since the mirror base and the circuit board are mostly rectangular in shape, the coating areas 141 of the two opposite first areas 140 between the circuit board 230 and the mirror base 220 are respectively arranged on the two long sides of the mirror base 220 , that is, extending along the long sides of the mirror base 220 .

[0212] Furthermore, in order to prevent external dust from entering the camera module through the gap between the lens holder 220 and the circuit board 230, thereby affecting the imaging, in a preferred embodiment of the present invention, between the lens holder 220 and the circuit board 230, the second area 150 is coated with a glue with low bonding strength or low variation as a dustproof glue 152 to achieve a dustproof effect, such as UV glue (photosensitive glue, Ultraviolet Rays), such as Fig.11 and Fig. 12B shown.

[0213] Furthermore, the above-mentioned glue dispensing solution on the long side areas of both sides can also be used to bond the photosensitive chip 210 and the circuit board 230 to prevent the photosensitive chip 210 from deviating from the original assembly position. In other words, when the photosensitive chip 210 and the circuit board 230 are fixed with glue 400, the technical solution of the present invention can be adopted. Fig.11 and Fig. 12A shown.

[0214] The glue 400 between the top surface 231 of the circuit board 230 and the photosensitive chip 210 allows the two to be offset in the Y direction, and limits the offset between the two in the X direction, thereby reducing the impact of the offset between the optical system of the lens assembly 100 and the photosensitive chip 210 on imaging. That is, in the present invention, the circuit board 230 and the photosensitive chip 210 are prohibited from offsetting in the X direction as much as possible, thereby improving the product yield.

[0215] The glue 400 between the circuit board 230 and the photosensitive chip 210 is disposed in two opposite first regions 140 therebetween, corresponding to the long side regions of the photosensitive chip, so that during the baking deformation and the subsequent cooling recovery process, the components of force in the X direction are offset as much as possible to avoid displacement in the X direction. The first region 140 between the circuit board 230 and the photosensitive chip 210 corresponds to the long side region of the photosensitive chip, and is an extension of the long side region of the photosensitive chip between the circuit board 230 and the photosensitive chip 210 in the Z direction.

[0216] Similarly, at this time, the two opposite second areas 150 between the circuit board 230 and the photosensitive chip 210, corresponding to the short side area of ​​the photosensitive chip, are not glued, and the second areas 150 will not be subjected to pulling force during baking, and will not be subjected to restoring force during the subsequent cooling process, thereby reducing the possibility of X-direction offset. The second area 150 between the circuit board 230 and the photosensitive chip 210 corresponds to the short side area of ​​the photosensitive chip, and is the extension of the short side area of ​​the photosensitive chip between the circuit board 230 and the photosensitive chip 210 in the Z direction.

[0217] Preferably, since the photosensitive chips are mostly rectangular in shape, the coating areas 141 of the two opposite first areas 140 between the circuit board 230 and the photosensitive chip 210 are respectively arranged on the two long sides of the photosensitive chip 210 , that is, extending along the long sides of the photosensitive chip 210 .

[0218] Furthermore, in order to prevent external dust from entering the camera module through the gap between the photosensitive chip 210 and the circuit board 230, thereby affecting the imaging, in a preferred embodiment of the present invention, between the photosensitive chip 210 and the circuit board 230, the second area 150 is coated with a glue with low bonding strength or low variation as a dustproof glue 152 to achieve a dustproof effect, such as UV glue (photosensitive glue, Ultraviolet Rays), such as Fig.11 and Fig. 12B shown.

[0219] Further, when the camera module 300 is implemented as an array camera module, the array camera module includes at least two lens assemblies 100, at least two photosensitive chips 210, an integrated lens holder 240 and a circuit board 230. Each of the photosensitive chips 210 is correspondingly and electrically attached to the circuit board 230. The integrated lens holder surrounds the circumference of each photosensitive chip and is attached to the circuit board. The integrated lens holder has at least two light windows, which correspond to the photosensitive areas of the photosensitive chip respectively. The support member supports the lens and corresponds to the light window. The support member extends from the integrated lens holder. It can be known to those skilled in the art that in the array camera module, the circuit board 230 can be an integrated circuit board or a split circuit board, which is not limited at this time.

[0220] At this time, each photosensitive chip 210 corresponds to two photosensitive chip long side areas, thus corresponding to two opposite first areas 140, and two photosensitive chip short side areas, thus corresponding to two opposite second areas 150. That is to say, in the array camera module, corresponding to the distribution and number of the photosensitive chips, the first areas 140 and the second areas 150 of the array camera module are correspondingly arranged and distributed.

[0221] The array camera module also adopts the glue dispensing scheme of the present invention. The glue dispensing scheme in the preferred embodiment can still be adopted between the lens barrel 120 and the support member 130 of each lens assembly 100, between each lens assembly 100 and the integrated lens holder 240 of the array camera module, between the integrated lens holder 240 and the circuit board 230, and between each photosensitive chip 210 and the corresponding circuit board 230 area. Glue is only dispensed in the first area 140, such as FIG. 14A to FIG. 14D In addition, the second area 150 can be provided with dustproof glue 152, a convex structure or a staggered convex structure, or a combination thereof to prevent dust from entering the internal space.

[0222] Or when the camera module 300 is implemented as an array camera module, the array camera module includes at least two lens assemblies 100, at least two photosensitive chips 210, at least two lens holders 220 and a circuit board 230. Each of the photosensitive chips 210 is correspondingly and electrically attached to the circuit board 230. Each of the lens holders has a light window corresponding to the photosensitive area of ​​the photosensitive chip. Each of the lens holders surrounds the circumference of the corresponding photosensitive chip and is attached to the circuit board. The support member supports the lens, corresponding to the light window. The support member extends from the corresponding lens holder. Those skilled in the art may know that in the array camera module, the circuit board 230 may be an integrated circuit board or a split circuit board, which is not limited at this time.

[0223] At this time, the array camera module can also adopt the dispensing solution of the present invention. The dispensing solution in the preferred embodiment can still be adopted between the lens barrel 120 and the support member 130 of each lens assembly 100, between each lens assembly 100 and the corresponding lens holder 220 assembly, between each lens holder 220 and the circuit board 230, and between each photosensitive chip 210 and the corresponding circuit board 230 area. Dispensing is only performed in the first area 140, such as FIG. 22A to FIG. 22C In addition, the second area 150 can be provided with dustproof glue 152, a convex structure or a staggered convex structure, or a combination thereof to prevent dust from entering the internal space.

[0224] like FIG. 15A to FIG. 18B As shown, the lens assembly 100, the photosensitive assembly 200 and the camera module 300 of the second embodiment of the present invention are described. Different from the above preferred embodiment, in the second embodiment, glue 400A is applied to a group of adjacent first areas 140A and second areas 150A between the lens barrel 120 and the support 130, between the lens assembly 100 and the lens holder 220, between the lens holder 220 and the circuit board 230, or between the photosensitive chip 210 and the circuit board 230 for fixing, so that each component is only subjected to force on one side in the X direction and the Y direction, avoiding the occurrence of mutual pulling phenomenon in the four-point glue dispensing in the prior art, reducing the influence of glue deformation on offset, and avoiding the occurrence of glue cracking.

[0225] In the second embodiment, the first region 140A is still the region corresponding to the long side region of the photosensitive chip extending along the Z axis. The second region 150A is still the region corresponding to the short side region of the photosensitive chip extending along the Z axis. For the sake of convenience, one adjacent first region 140A and one adjacent second region 150A are referred to as a group.

[0226] Specifically, the glue 400A between the lens barrel 120 and the support member 130 is disposed in a group of the first area 140A and the second area 150A therebetween, so that during the baking deformation and subsequent cooling recovery process, the lens barrel 120 and the support member 130 are only subjected to force on one side in the X direction and the Y direction, and the other group of the first area 140A and the second area 150A are not restricted by the glue 400A, are relatively free, and do not generate pulling force and restoring force, thus avoiding the mutual pulling phenomenon in the four-point glue dispensing in the prior art, such as FIG. 15A to FIG. 15C .

[0227] Preferably, the glue 400A between the support member 130 and the lens barrel 120 is applied to the middle area of ​​a group of adjacent first areas 140A and second areas 150A between the support member 130 and the lens barrel 120, so as to reduce and avoid the possibility of offset. That is, between the support member 130 and the lens barrel 120, the coated area of ​​the first area 140A roughly overlaps with the straight line of the corresponding center position in the Y direction; the coated area of ​​the second area 150A roughly overlaps with the straight line of the corresponding center position in the X direction.

[0228] Further, in order to prevent dust from entering the interior of the camera module from the extra glue dispensing holes, in the second embodiment, between the lens and the support member 130, another group of the first area 140A and the second area 150A that are not coated with adhesive glue are coated with glue with low bonding strength or low variation as dustproof glue 152A to achieve dustproof effect, such as UV glue (photosensitive glue, Ultraviolet Rays), such as FIG. 15A to FIG. 15C .

[0229] Those skilled in the art may know that the dustproof scheme in the above preferred embodiment, such as setting dustproof grooves filled with dustproof glue, convex structures, etc., can also be applied to another group of the first area 140A and the second area 150A that are not coated with adhesive to prevent dust from entering the interior, which will not be described in detail here. Alternatively, by changing the structure of the lens barrel 120A, only one group of the first area 140A and the second area 150A is reserved for glue dispensing space 160A, while the other group of the first area 140A and the second area 150A is not reserved for glue dispensing space, thereby preventing dust from entering, such as Fig.18A and Fig.18B shown.

[0230] Furthermore, in the second embodiment, a solution of dispensing glue in a set of the first area 140A and the second area 150A can also be used to bond the support member 130 and the photosensitive component 200 to prevent the support member 130 from deviating from the original assembly position with the lens, such as Fig.16A and Fig. 16B shown.

[0231] Specifically, the glue 400A between the support member 130 and the photosensitive component 200 is disposed in a group of the first area 140A and the second area 150A therebetween. Preferably, since the lens holder 220 is mostly a rectangular structure, the glue 400A located in one of the first areas 140A between the support member 130 and the photosensitive component 200 is coated along the long side of the lens holder 220; and the glue 400A located in the adjacent second area 150A is coated along the short side of the lens holder 220.

[0232] Those skilled in the art may know that the dust-proof scheme in the above-mentioned preferred embodiment, such as coating dust-proof glue, setting dust-proof grooves and filling dust-proof glue, raised structures or a combination of the two, may also be applied to another set of the first area 140A and the second area 150A between the support member 130 and the photosensitive component 200 of the second embodiment to prevent dust from entering the interior, which will not be elaborated here.

[0233] Furthermore, in the second embodiment, the solution of dispensing glue in the first area 140A and the second area 150A can also be used to bond the lens holder 220 and the circuit board 230 to prevent the lens holder 220 from deviating from the original assembly position with the lens, such as Fig.16A and Fig. 16B shown.

[0234] Specifically, the glue 400A between the mirror base 220 and the circuit board 230 is disposed in a group of the first area 140A and the second area 150A therebetween. Preferably, since the mirror base 220 and the circuit board 230 are mostly rectangular structures, the glue 400A located in one of the first areas 140A between the mirror base 220 and the circuit board 230 is coated along the long side of the mirror base 220; and the glue 400A located in the adjacent second area 150A is coated along the short side of the mirror base 220.

[0235] Those skilled in the art may know that the dust-proof scheme in the above-mentioned preferred embodiments, such as coating dust-proof glue, setting dust-proof grooves and filling dust-proof glue, a raised structure or a combination of the two, may also be applied to another set of the first area 140A and the second area 150A between the mirror holder 220 and the circuit board 230 in the second embodiment to prevent dust from entering the interior, which will not be elaborated here.

[0236] Furthermore, in the second embodiment, a solution of dispensing glue in a set of the first area 140A and the second area 150A can also be used to bond the photosensitive chip 210 and the circuit board 230 to prevent the photosensitive chip from deviating from the original assembly position, such as Fig.16A and Fig. 16B .

[0237] Specifically, the glue 400A between the photosensitive chip 210 and the circuit board 230 is disposed in a group of the first area 140A and the second area 150A between the two. Preferably, since the photosensitive chip 210 is mostly a rectangular structure, the glue 400A located in one of the first areas 140A between the photosensitive chip 210 and the circuit board 230 is coated along the long side of the photosensitive chip 210; and the glue 400A located in the adjacent second area 150A is coated along the short side of the photosensitive chip 210.

[0238] Those skilled in the art may know that the dust-proof scheme in the above-mentioned preferred embodiments, such as coating dust-proof glue, setting dust-proof grooves and filling dust-proof glue, raised structures or a combination of the two, may also be applied to another set of the first area 140A and the second area 150A between the photosensitive chip 210 and the circuit board 230 in this second embodiment to prevent dust from entering the interior, which will not be elaborated here.

[0239] Further, when the camera module 300 is implemented as an array camera module, the glue dispensing scheme in the second embodiment can still be used between the lens barrel 120 and the support 130 of each lens assembly 100, between each lens assembly 100 and the integrated lens holder 240 of the array camera module, between the integrated lens holder 240 and the circuit board 230, and between each photosensitive chip 210 and the corresponding circuit board 230 area, and glue is only dispensed in one group of the first area 140A and the second area 150A. In addition, glue can also be dispensed in another group of the first area 140A and the second area 150A, and dust can be prevented from entering the internal space by applying dust-proof glue, convex structures or staggered convex structures, and using them in combination, such as FIG. 17A to FIG. 17D shown.

[0240] Alternatively, when the array camera module adopts a split lens mount, the glue dispensing scheme in the second embodiment can still be used between the lens barrel 120 and the support member 130 of each lens assembly 100, between each lens assembly 100 and the corresponding lens mount 220 assembly, between each lens mount 2200 and the circuit board 230, and between each photosensitive chip 210 and the corresponding circuit board 230 area, with glue dispensing only in a group of the first area 140A and the second area 150A, as shown in Figures 23A to 23C.

[0241] According to another aspect of the present invention, the present invention further provides a camera module assembly method. The camera module assembly method can be applied to the assembly of the camera module 300 described above to achieve at least one purpose and advantage of the present invention. Specifically, Fig.19 Shown is a flow chart of the camera module assembly method.

[0242] Step 410: Assemble a set of optical lenses and a lens barrel to form a lens.

[0243] Step 420: Attach a support member to a reserved position on the top side of a photosensitive component.

[0244] Specifically, the step 420 may further include the step of fixing the support member and the photosensitive component by dispensing glue in two relative first areas between the support member and the photosensitive component and along two long sides of the lens mount of the photosensitive component.

[0245] Alternatively, step 420 may also include the step of fixing the support member and the photosensitive component by respectively applying glue along the long side of the lens mount of the photosensitive component in a first area between the support member and the photosensitive component, and applying glue along the short side of the lens mount of the photosensitive component in a second area between the two.

[0246] It can be known that the order of step 410 and step 420 is not limited.

[0247] Step 430: Fix the support member and the lens barrel by dispensing glue in the middle areas of two opposite first areas between the support member and the lens barrel, wherein the lens corresponds to the photosensitive path of the photosensitive component.

[0248] Step 450: Prevent dust by applying dust-proof glue to two opposite second areas between the support member and the lens barrel.

[0249] Alternatively, after step 420, perform step 440: fix the support member and the lens barrel by dispensing glue in a middle area of ​​a first area and a middle area of ​​a second area between the support member and the lens barrel, respectively, wherein the lens corresponds to the photosensitive path of the photosensitive component.

[0250] Step 460: Prevent dust by applying dust-proof glue to another set of first areas and second areas between the support member and the lens barrel.

[0251] like Fig. 20 Shown is a flow chart of the method for assembling the photosensitive component of the camera module of the present invention.

[0252] Step 510: Adhere glue along two long sides of the photosensitive chip in two opposite first areas between the photosensitive chip and the circuit board, and electrically attach the photosensitive chip to the circuit board.

[0253] Step 520: Fix the mirror base to the circuit board by dispensing glue along the two long sides of the mirror base in two opposite first areas between the mirror base and the circuit board, wherein the mirror base surrounds the photosensitive chip and has a light window corresponding to the photosensitive area of ​​the photosensitive chip.

[0254] like Fig.21 Shown is a flow chart of another method for assembling the photosensitive component of the camera module of the present invention.

[0255] Step 610: The photosensitive chip is electrically attached to the circuit board by dispensing glue along the long side of the photosensitive chip in the first area between the photosensitive chip and the circuit board, and dispensing glue along the short side of the photosensitive chip in the second area between the two.

[0256] Step 620: Fix the mirror base to the circuit board by dispensing glue along the long side of the mirror base in a first area between the mirror base and the circuit board, and dispensing glue along the short side of the mirror base in a second area therebetween, wherein the mirror base surrounds the photosensitive chip and has a light window corresponding to the photosensitive area of ​​the photosensitive chip.

[0257] Those skilled in the art may know that the dispensing position schemes between the various components in the preferred embodiment and the second embodiment may be combined or mixed for use, that is, the above-mentioned step 510 and step 620 may be combined, and step 610 and step 520 may be combined, which may also achieve at least one purpose and advantage of the present invention.

[0258] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. A camera module, characterized in that: include: a photosensitive component; and A lens assembly, wherein the photosensitive assembly includes a photosensitive chip, a lens holder and a circuit board, the lens assembly includes an optical lens group, a lens barrel and a support member, wherein the photosensitive chip is electrically connected to the circuit board, the optical lens group is installed in the lens barrel to form a lens, wherein the lens holder surrounds the photosensitive chip and is attached to the circuit board, wherein the lens holder has a light window corresponding to the photosensitive area of ​​the photosensitive chip, wherein the support member supports the lens corresponding to the light window, wherein the support member extends from the lens holder, wherein the photosensitive chip and the photosensitive area of ​​the photosensitive chip are both rectangular, so that the photosensitive chip has a long side direction and a short side direction, the optical system imaging surface of the lens assembly is circular, wherein glue is only provided in two relative first areas between the support member and the lens barrel corresponding to the long side direction of the photosensitive chip.

2. The camera module according to claim 1, wherein the support member is fixed to the top side of the lens mount by dispensing glue on two opposite first areas between the lens mount and the support member.

3. The camera module according to claim 2, wherein the glue between the support member and the lens mount is coated along two long sides of the lens mount respectively.

4. The camera module according to claim 2 further comprises dust-proof glue, wherein the dust-proof glue is applied to two opposite second areas between the lens mount and the support member.

5. The camera module according to claim 2, wherein at least one dustproof groove and a dustproof protrusion matching therewith are arranged on the lens holder and the support member, wherein the dustproof protrusion is fixed to the dustproof groove to prevent dust from entering the internal space.

6. The camera module according to claim 1, wherein the lens holder is fixed to the circuit board by dispensing glue on two opposite first areas between the lens holder and the circuit board.

7. The camera module according to claim 6, wherein the glue between the lens holder and the circuit board is respectively coated along two long sides of the lens holder.

8. The camera module according to claim 1, wherein the photosensitive chip is fixed to the top side of the circuit board by dispensing glue in two opposite first areas between the photosensitive chip and the circuit board.

9. The camera module according to claim 8, wherein the glue between the photosensitive chip and the circuit board is coated along the two long sides of the photosensitive chip respectively.

10. A method for assembling a camera module, characterized in that: include: (a) assembling a set of optical lenses and a lens barrel to form a lens; (b) supporting the lens on a support member to form a lens assembly; as well as (c) The support member and the lens barrel are fixed by dispensing glue in the middle areas of two relative first areas between the support member and the lens barrel, wherein the lens corresponds to the photosensitive path of the photosensitive component of the camera module, wherein the photosensitive chip of the photosensitive component and the photosensitive area of ​​the photosensitive chip are both rectangular, so that the photosensitive chip has a long side direction and a short side direction, and the optical system imaging surface of the lens assembly is circular, wherein the glue is only arranged in the two relative first areas between the support member and the lens barrel corresponding to the long side direction of the photosensitive chip.

11. The assembly method according to claim 10, wherein the step (c) further comprises: (c1) Adhere glue along two long sides of a photosensitive chip by dispensing glue in two opposite first areas between a photosensitive chip and a circuit board, and electrically attach the photosensitive chip to the circuit board.

12. The assembly method according to claim 11, wherein the step (c) further comprises: (c2) Fixing the mirror holder to the circuit board by dispensing glue along two long sides of the mirror holder at two opposite first areas between the mirror holder and the circuit board, wherein the mirror holder surrounds the photosensitive chip and has a light window corresponding to the photosensitive area of ​​the photosensitive chip.

13. The assembly method according to claim 10 further comprises the steps of: (d) Dust is prevented by coating dust-proof glue on two opposite second areas between the support member and the lens barrel, wherein the second areas correspond to the short side areas of a photosensitive chip of the photosensitive component.

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