A silicon rod squaring, grinding and chamfering integrated machine

Abstract

The present invention relates to a silicon rod squaring, grinding and chamfering integrated machine, belonging to the field of crystalline silicon processing equipment. It includes a base and a support frame located above the base and fixedly connected to the base. Along the conveying direction of the silicon rod, a feeding mechanism, a trimming mechanism, a squaring mechanism and a grinding and polishing mechanism are sequentially arranged on the base. A rotary conveying mechanism is arranged between the squaring mechanism and the grinding and polishing mechanism. The rotary conveying mechanism is fixedly connected to the support frame and is used for transferring the silicon rod between the squaring mechanism and the grinding and polishing mechanism. A discharging mechanism connected to the support frame is arranged at the grinding and polishing mechanism and is used for transferring the processed silicon rod out of the base. The rotary conveying mechanism can transfer two silicon rods at the same time, and the squaring mechanism and the grinding and polishing mechanism do not idle, greatly improving the utilization rate of the whole machine and the processing efficiency of the silicon rod. It has a high degree of automation and broad market prospects.

Description

Technical Field

[0001] The present invention belongs to the technical field of crystalline silicon processing equipment, and particularly relates to a silicon rod squaring, grinding and chamfering integrated machine. Background Art

[0002] Photovoltaic power generation is one of the most important clean energies at present and has great development potential. The key factors restricting the development of the photovoltaic industry are, on the one hand, the low photoelectric conversion efficiency and, on the other hand, the high cost. Photovoltaic silicon wafers are the basic materials for producing solar cells and modules. The actual production process of a single silicon rod involves processes such as preparation, cutting of the edge skin, grinding of the surface, polishing, chamfering, slicing, battery cells, and modules. In the conventional crystalline silicon squaring, grinding and chamfering integrated machines, the transfer of the silicon rod between the squaring mechanism and the grinding and polishing mechanism is all carried out by a manipulator. The manipulator has the characteristic of convenient transfer. However, due to factors such as the equipment space, multiple manipulators often cause mutual interference in space. Therefore, generally only one manipulator is provided between the squaring mechanism and the grinding and polishing mechanism. In this way, one manipulator can only hold one silicon rod to perform squaring at the squaring mechanism or grinding and chamfering at the grinding and chamfering mechanism. When one of the grinding and chamfering mechanism or the squaring mechanism is working, the other is in an idle state, which restricts the utilization rate of the equipment and affects the processing efficiency of the silicon rod. At the same time, when using a manipulator to hold the silicon rod and after the squaring at the squaring mechanism is completed and the silicon rod is transported to the grinding and polishing mechanism for grinding and polishing operations, the silicon rod needs to be re-clamped. The re-clamping is extremely likely to increase the grinding allowance of the silicon rod and prolong the processing time of the silicon rod. Therefore, how to reduce the number of clamping times in the silicon rod processing process and improve the processing efficiency of the silicon rod is a problem that needs to be solved by us. Summary of the Invention

[0003] In view of various deficiencies of the prior art, a silicon rod squaring, grinding and chamfering integrated machine that can effectively improve the processing efficiency of crystalline silicon is proposed.

[0004] To achieve the above object, the present invention provides the following technical solutions:

[0005] A silicon rod squaring, grinding and chamfering integrated machine includes a base and a support frame located above the base and fixedly connected to the base. The base is sequentially provided with a loading mechanism, an edge skin cutting mechanism, a squaring mechanism, and a grinding and polishing mechanism along the conveying direction of the crystalline silicon. A rotary conveying mechanism is arranged between the cutting mechanism and the grinding and polishing mechanism. The rotary conveying mechanism is fixedly connected to the support frame and is used for transferring the crystalline silicon between the squaring mechanism and the grinding and polishing mechanism. A blanking mechanism connected to the support frame is arranged at the grinding and polishing mechanism and is used for transferring the processed crystalline silicon out of the base.

[0006] Further, the loading mechanism includes a manipulator assembly and a loading table. The manipulator assembly is fixedly connected to the support frame and is used for transferring the crystalline silicon. The loading table is fixedly connected to the base and is used for holding the crystalline silicon to be cut;

[0007] The edge skin receiving mechanism includes a material receiving box which is slidably connected to the base and is used for receiving the cut edge skins.

[0008] The squaring mechanism includes a cutting head which includes a cutting channel formed by cutting wires for the silicon wafer to pass through and cut the silicon wafer.

[0009] The grinding and polishing mechanism includes a grinding base and a grinding assembly arranged on the grinding base. The grinding assembly encloses a grinding channel for the silicon wafer to pass through and grind the surface of the silicon wafer. The cutting channel is arranged parallel to the grinding channel.

[0010] The rotary conveying mechanism includes a turntable, and at least two groups of clamping assemblies are arranged on the turntable for conveying the silicon wafer.

[0011] The rotary conveying mechanism includes a rotating assembly and at least two groups of clamping assemblies fixedly connected to the rotating assembly for conveying the silicon wafer.

[0012] Furthermore, the edge skin receiving mechanism includes a material receiving box and a material receiving box fixing seat. The material receiving box is inclinedly arranged along the upper part of the material receiving box fixing seat. A first cylinder and a second cylinder are arranged below the material receiving box. The first cylinder is arranged horizontally and is used for pushing the material receiving box to slide along the silicon wafer conveying direction. The second cylinder is arranged inclinedly along the bottom surface of the material receiving box and is used for pushing the material receiving box to slide inclinedly along the material receiving box fixing seat.

[0013] Furthermore, the manipulator assembly includes a manipulator fixing seat, a manipulator support seat and a jaw assembly. The manipulator fixing seat is slidably connected to the support frame in the silicon wafer conveying direction. The manipulator support seat is arranged on the manipulator fixing seat and can be slidably connected to the manipulator fixing seat in the vertical direction. The jaw assembly is arranged below the manipulator support seat and is slidably connected to the manipulator support seat in the horizontal plane along the direction perpendicular to the silicon wafer conveying direction.

[0014] The loading table is fixedly connected to the base and straddles above the edge skin receiving mechanism. It is arranged horizontally and perpendicular to the silicon wafer conveying direction, and its longitudinal section is V-shaped for placing the silicon wafer.

[0015] Furthermore, the cutting head includes a cutting base, a left cutting assembly and a right cutting assembly arranged on the cutting base. The cutting base is slidably connected to the base through a first lead screw. The left cutting assembly and the right cutting assembly have the same structure, and the two are arranged at intervals with the central axis of the cutting base as the symmetry axis to form a cutting channel for the silicon wafer to pass through and cut the silicon wafer.

[0016] Further, the left cutting assembly includes a wire mesh bracket, a cutting motor, a cutting wheel, and a transition wheel. The bottom of the wire mesh bracket is fixedly connected to the guiding assembly to achieve stepless adjustment of the wire mesh spacing. The output end of the cutting motor is connected to the cutting wheel, and the cutting wheel and the transition wheel are rotatably connected to the wire mesh bracket. A plurality of transition wheels are provided, and the cutting wire sequentially bypasses the cutting wheel and the transition wheel to form a closed polygon.

[0017] Further, two sets of grinding assemblies are provided. The two sets of grinding assemblies are arranged at intervals with the central axis of the grinding base as the axis of symmetry to form a grinding channel for the silicon ingot to pass through and grind the surface of the silicon ingot. The grinding assembly includes a grinding head and a grinding main shaft assembly connected to the grinding head, and the grinding main shaft assembly is slidably connected to the grinding base.

[0018] Further, the grinding head includes a fine grinding wheel and a rough grinding wheel, and the fine grinding wheel is sleeved inside the rough grinding wheel;

[0019] The grinding main shaft assembly includes a fine grinding main shaft assembly and a rough grinding main shaft. The fine grinding main shaft assembly includes a fine grinding main shaft and an eccentric shaft vertically matched with the end of the fine grinding main shaft. The fine grinding main shaft is sleeved inside the rough grinding main shaft, one end of which is connected to the fine grinding wheel, and the other end is telescopically fixed to the rough grinding main shaft through a spring. One end of the rough grinding main shaft is connected to the rough grinding wheel, and the other end is connected to the main shaft driving device.

[0020] Further, the rotating assembly includes a rotating shaft and a turntable connected to the rotating shaft. The turntable is rotatably connected to the support frame through the rotating shaft. Two sets of clamping assemblies are located on both sides of the rotating shaft and are fixedly arranged below the turntable. It includes a clamping base, a headstock assembly and a tailstock assembly fixedly arranged on the clamping base. The clamping base is fixedly connected to the turntable. The headstock assembly is fixedly connected to the clamping base. The tailstock assembly is slidably connected to the clamping base through a tailstock feeding assembly, which is convenient for adjusting the distance between the headstock assembly and the tailstock assembly to clamp silicon ingots of different lengths.

[0021] Further, the blanking mechanism includes a blanking fixed seat, a blanking support frame, and a receiving table fixedly connected to the blanking support frame. The blanking fixed seat is slidably connected to the support frame along the silicon ingot conveying direction. The blanking support frame is arranged on the blanking fixed seat and is slidably connected to the blanking fixed seat in the vertical direction. The receiving table is horizontally arranged for holding the silicon ingot.

[0022] The beneficial effects of the present invention are as follows:

[0023] 1. The present invention includes a loading mechanism, a side skin connecting mechanism, a squaring mechanism, a grinding and polishing mechanism, and a blanking mechanism. After the silicon ingot is loaded at the loading mechanism, it is clamped and rotationally conveyed by the rotation conveying mechanism to realize double-station simultaneous processing of the rotation mechanism. Compared with the previous single manipulator for conveying between the squaring mechanism and the grinding and polishing mechanism, the working efficiency of the whole machine is greatly improved.

[0024] 2. The rotary conveying mechanism includes a turntable and a clamping assembly. The clamping assembly rotates with the turntable to transfer the position of the clamped silicon wafer, greatly improving the transfer efficiency of the silicon wafer between the squaring mechanism and the grinding and polishing mechanism.

[0025] 3. The edge skin receiving mechanism includes a receiving box and a receiving box fixing seat. The receiving box is inclined along the receiving box fixing seat and can slide horizontally along the base with the receiving box fixing seat to adjust the position of the receiving box on the base for conveniently receiving the edge skin. At the same time, the receiving box can slide obliquely along the receiving box fixing seat to abut against the edge skin that has been cut but not fallen at the squaring mechanism and prompt it to fall into the receiving box.

[0026] 4. The grinding and polishing mechanism includes a fine grinding wheel and a rough grinding wheel. The fine grinding wheel is sleeved inside the rough grinding wheel, saving space for the entire equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is the overall structural schematic diagram of the present invention;

[0028] Figure 2 is the structural schematic diagram of the manipulator assembly;

[0029] Figure 3 is the structural schematic diagram of the blanking mechanism;

[0030] Figure 4 is the structural schematic diagram of the squaring mechanism;

[0031] Figure 5 is the structural schematic diagram of the grinding and polishing mechanism;

[0032] Figure 6 is the structural schematic diagram of the rotary conveying mechanism;

[0033] Figure 7 is the structural schematic diagram of the clamping assembly.

[0034] In the drawings:

[0035] 1 - base; 2 - support frame; 3 - loading mechanism;

[0036] 4 - manipulator assembly, 401 - manipulator fixing seat, 402 - manipulator support seat, 403 - jaw assembly, 4031 - jaw;

[0037] 5 - loading table;

[0038] 6 - edge skin receiving mechanism, 601 - receiving box, 602 - receiving box fixing seat;

[0039] 7 - squaring mechanism, 701 - cutting base, 702 - left cutting assembly, 7021 - wire mesh support, 7022 - cutting wheel, 7023 - idler wheel, 703 - right cutting assembly, 704 - first lead screw, 705 - guiding assembly;

[0040] 8 - Grinding and Polishing Mechanism, 801 - Grinding Base, 802 - Grinding Head, 803 - Grinding Spindle Assembly, 804 - Spindle Driving Device;

[0041] 9 - Rotary Conveyor Mechanism, 901 - Rotary Assembly, 9011 - Turntable, 9012 - Rotating Shaft, 902 - Clamping Assembly, 9021 - Clamping Base, 9022 - Headstock Assembly, 9023 - Tailstock Assembly, 9024 - Tailstock Feed Assembly;

[0042] 10 - Unloading Mechanism, 1001 - Unloading Fixed Seat, 1002 - Receiving Table. Detailed Implementation Manner

[0043] In order to enable those skilled in the art to better understand the technical solution of the present invention, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the present invention. Based on the embodiments in this application, other similar embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of this application. In addition, the directional terms mentioned in the following embodiments, such as "up", "down", "left", "right", etc., are only references to the directions in the accompanying drawings. Therefore, the directional terms used are for illustration rather than to limit the present invention.

[0044] The present invention will be further described below in conjunction with the accompanying drawings and preferred embodiments.

[0045] Refer to Figure 1 , a silicon rod squaring, grinding and chamfering integrated machine, including a base 1 and a support frame 2. The support frame 2 is fixedly arranged above the base 1. Along the conveying direction of the silicon crystal on the base 1, a feeding mechanism 3, an edge trimming structure 4, a squaring mechanism 7 and a grinding and polishing mechanism 8 are sequentially arranged. At the same time, a rotary conveyor mechanism 9 is arranged above the squaring mechanism 7 and the grinding and polishing mechanism 8 for transferring the silicon crystal between the squaring mechanism 7 and the grinding and polishing mechanism 8. An unloading mechanism 10 is arranged on one side of the grinding and polishing mechanism 8. The unloading mechanism 10 is connected to the support frame 2 for transferring the processed silicon crystal out of the base 1.

[0046] Embodiment 1

[0047] Refer to Figure 1 , Figure 3, the edge skin receiving mechanism 6 includes a material receiving box 601 and a material receiving box fixing seat 602. The material receiving box 601 is inclined and arranged on the upper part of the material receiving box fixing seat 602, and is slidably connected to the material receiving box fixing seat 602. The material receiving box fixing seat 602 is arranged on the base 1 and is slidably connected to the base 1. Specifically, two feeding slide rails are arranged on the base 1 along the conveying direction of the silicon wafer. A first cylinder is horizontally arranged between the feeding slide rails. The first cylinder is arranged parallel to the feeding slide rails. The material receiving box fixing seat 602 is slidably matched with the feeding slide rail through the first cylinder. That is to say, the first cylinder drives the material receiving box 601 to generate a displacement along the conveying direction of the silicon wafer. At the same time, a slide way for the material receiving box 601 to slide is inclinedly arranged on the material receiving box fixing seat 602, and the opening of the slide way is inclined towards the side of the squaring mechanism 7.

[0048] In this embodiment, two material receiving box fixing seats 602 are oppositely arranged. A cylinder fixing seat for fixing the second cylinder is fixedly arranged between the two material receiving box fixing seats 602. The cylinder body end of the second cylinder is fixedly connected to the cylinder fixing seat, and its piston end is inclined upwards and fixedly connected to the bottom of the material receiving box 601, and is used to drive the material receiving box 601 to slide along the slide way. That is to say, under the coordinated cooperation of the first cylinder and the second cylinder, the material receiving box 601 can not only move along the conveying direction of the silicon wafer to facilitate receiving edge skins at different positions, but also move along the slide way to abut against the edge skins that have been cut but not fallen at the squaring mechanism 7 and prompt them to fall into the material receiving box 601.

[0049] Embodiment Two

[0050] Refer to Figure 1 、 Figure 2 , the feeding mechanism 3 includes a manipulator assembly 4 and a feeding table 5. The feeding table 5 straddles above the edge skin receiving mechanism 6 and is fixedly connected to the base 1 through a feeding table support. The manipulator assembly 4 is arranged above the feeding table 5 and is slidably connected to the support frame 2.

[0051] Specifically, the manipulator assembly 4 includes a manipulator fixing seat 401, a manipulator support seat 402 and a jaw assembly 403. The manipulator fixing seat 401 is slidably connected to the support frame 2 in the horizontal direction. The manipulator support seat 402 is slidably connected to the manipulator fixing seat 401 in the vertical direction. The jaw assembly 403 is arranged below the manipulator support seat 402 and is slidably connected to the manipulator support seat 402 in the horizontal direction.

[0052] In this embodiment, the conveying direction of the crystalline silicon in the horizontal plane is set as the X-axis, the direction perpendicular to the crystalline silicon conveying direction in the horizontal plane is set as the Z-axis, and the vertical direction is the Y-axis. The X-axis, Y-axis, and Z-axis are perpendicular and orthogonal. Above the support frame 2, a first feeding assembly and a first sliding rail are arranged along the X-axis. The manipulator fixing seat 401 slides along the first sliding rail through the first feeding assembly, realizing the displacement of the manipulator fixing seat 401 in the X-axis direction. At the same time, a second sliding rail and a second feeding assembly arranged in the Y-axis direction are provided on the manipulator fixing seat 401. The manipulator support seat 402 slides along the second sliding rail through the second feeding assembly, realizing the displacement in the Y-axis direction. A third sliding rail in the Z-axis direction is provided on the lower bottom surface of the manipulator support seat 402. The jaw assembly 403 is fixedly arranged on the jaw fixing seat 404 and slides along the third sliding rail through the jaw fixing seat 404, realizing the displacement of the jaw assembly 403 in the Z-axis direction. That is to say, the manipulator assembly 4 can generate displacements along the X-axis, Y-axis, and Z-axis to facilitate the conveying of crystalline silicon.

[0053] The jaw assembly 403 includes two oppositely arranged jaws 4031 and a jaw feeding lead screw connected to the jaws 4031. The longitudinal section of the jaws 4031 is V-shaped for accommodating the crystalline silicon. A sliding groove for the relative sliding of the jaws 4031 is provided below the jaw fixing seat 404. The jaw driving assembly drives the jaws 4031 to slide along the sliding groove to adjust the distance between the two jaws 4031, facilitating the clamping of the crystalline silicon. In this embodiment, the first feeding assembly and the second feeding assembly adopt air cylinders.

[0054] The loading table 5 is arranged along the horizontal plane and is perpendicular to the crystalline silicon conveying direction. To facilitate the placement of the cylindrical silicon rod, the longitudinal section of the loading table 5 is set as V-shaped to facilitate the fixation of the silicon rod.

[0055] Embodiment Three

[0056] Referring to Figure 1 、 Figure 4 The squaring mechanism 7 includes a cutting head. The cutting head includes a cutting channel formed by a cutting wire for the passage and cutting of the crystalline silicon.

[0057] Specifically, the cutting head includes a cutting base 701, a left cutting assembly 702, and a right cutting assembly 703. The left cutting assembly 702 and the right cutting assembly 703 are arranged on the cutting base 701 at intervals with the central axis of the cutting base 701 as the axis of symmetry, and a cutting channel for the passage of the crystalline silicon is formed between the two. The cutting base 701 is slidably connected to the base 1 through a first lead screw 704. Specifically, the first lead screw 704 is arranged horizontally on the base 1 and is located below the cutting base 701. At the same time, the first lead screw 704 is perpendicular to the crystalline silicon conveying direction. The cutting base 701 is fixedly connected to the first lead screw 704, realizing the sliding connection between the cutting base 701 and the base 1.

[0058] The left cutting assembly 702 and the right cutting assembly 703 have the same structure, and both are slidably connected to the cutting base 701 through a guiding assembly 705 provided at their bottoms.

[0059] Specifically, taking the left cutting assembly 702 as an example, it includes a wire mesh bracket 7021, a cutting motor, a cutting wheel 7022, and a plurality of idler wheels 7023. The guiding assembly 705 includes a guiding seat and a driving element. The wire mesh bracket 7021 is vertically and fixedly connected to the guiding seat, and its bottom is slidably connected to the cutting base 701, that is, the distance between the two wire meshes can be adjusted steplessly. In this embodiment, the guiding assembly 705 adopts a lead screw, and the lead screw is arranged along the conveying direction of the crystalline silicon.

[0060] The cutting motor is arranged perpendicular to the wire mesh bracket 7021, and its output end is connected to the cutting wheel 7022 for driving the cutting wheel 7022 to rotate. A plurality of idler wheels 7023 are provided, and the cutting wheel 7022, the idler wheels 7023 are rotatably connected to the wire mesh bracket 7021. The cutting wire bypasses the cutting wheel 7022 and the idler wheels 7023 to form a cutting channel for the crystalline silicon to pass through and cut the crystalline silicon. The longitudinal section of the cutting wire forms a closed polygon with at least 3 sides for cutting the crystalline silicon located in the cutting channel.

[0061] That is to say, the squaring mechanism 7 can generate a displacement in a horizontal plane along a direction perpendicular to the conveying direction of the crystalline silicon. At the same time, the distance between the left cutting assembly 702 and the right cutting assembly 703 can also be adjusted along the conveying direction of the crystalline silicon for the wire mesh bracket 7021.

[0062] Embodiment Four

[0063] Referring to Figure 1 、 Figure 5 The grinding and polishing mechanism 8 includes a grinding base 801 and a grinding assembly fixed on the grinding base 801. The grinding assemblies are arranged in two groups at intervals with the central axis of the grinding base 801 as the axis of symmetry, enclosing a grinding channel for the crystalline silicon to pass through and grind the surface of the crystalline silicon, and the grinding channel is arranged parallel to the cutting channel.

[0064] The grinding assembly includes a grinding head 802 and a grinding spindle assembly 803. The grinding spindle assembly 803 is driven to rotate by a spindle driving device 804 fixed above the grinding spindle assembly 803. The grinding spindle assembly 803 is connected to the grinding head 802. At the same time, the bottom of the grinding spindle assembly 803 is slidably connected to the grinding base 801 through a grinding feed screw 804 to realize the adjustment of the distance between the grinding heads 802.

[0065] The grinding head 802 includes a fine grinding wheel and a rough grinding wheel. The fine grinding wheel is sleeved inside the rough grinding wheel. In the initial state, the rough grinding wheel protrudes from the plane where the fine grinding wheel is located. That is to say, in the initial state, the rough grinding wheel contacts the crystalline silicon first. The grinding spindle assembly 803 includes a fine grinding spindle assembly and a rough grinding spindle. The fine grinding spindle assembly includes a fine grinding spindle and an eccentric shaft. The fine grinding spindle is sleeved inside the rough grinding spindle. One end of the fine grinding spindle is connected to the fine grinding wheel, and one end of the rough grinding spindle is connected to the rough grinding wheel.

[0066] The other end of the fine grinding spindle is telescopically fixed to the rough grinding spindle through a spring. Specifically, a spring is sleeved around the fine grinding spindle and located between the rough grinding spindles. At the same time, a spring fixing groove for accommodating the spindle is provided at the position corresponding to the spring on the rough grinding spindle, and the longitudinal section of the spring fixing groove is circularly arranged. The fine grinding spindle and the rough grinding spindle are rotationally connected through a spline or a flat key to assist the rotation between the two. In this embodiment, a spline is provided between the fine grinding spindle and the rough grinding spindle to realize the rotational drive between the fine grinding spindle and the rough grinding spindle. A thrust bearing is fixedly provided at one end of the fine grinding spindle away from the fine grinding wheel. The eccentric shaft cooperates with the thrust bearing to compress the spring, pushing the fine grinding spindle and the rough grinding spindle to generate relative displacement. At this time, the fine grinding wheel protrudes from the rough grinding wheel to finely grind the crystalline silicon. A tension wheel and a pulley are sequentially arranged on the periphery of one end of the rough grinding spindle away from the rough grinding wheel. The pulley cooperates with the spindle driving device 804 to drive the rough grinding spindle to rotate.

[0067] The spindle driving device 804 includes a grinding wheel driving motor and a fine grinding wheel control motor. The output end of the grinding wheel control motor drives the pulley to rotate through a belt, driving the rough grinding wheel and the fine grinding wheel to rotate simultaneously. At this time, the rough grinding wheel coarsely grinds the crystalline silicon. The output end of the fine grinding wheel control motor is connected to the eccentric shaft, which is used to drive the eccentric shaft to rotate. The eccentric shaft abuts against the thrust bearing, pushing the fine grinding wheel to protrude from the rough grinding wheel for finely grinding the crystalline silicon.

[0068] Embodiment Five

[0069] Refer to Figure 1 、 Figure 6 、 Figure 7 As shown in FIGS., a rotary conveying mechanism 9 is arranged above the squaring mechanism 7 and the grinding and polishing mechanism 8. It includes a rotary assembly 901 and at least one set of clamping assemblies 902. The clamping assemblies 902 are fixedly arranged below the rotary assembly 901. The rotary assembly 901 is fixedly connected to the support frame 2. It includes a turntable 9011 and a rotating shaft 9012. The turntable 9011 is vertically fixedly connected to the rotating shaft 9012 and is fixedly connected to the support frame 2 through the rotating shaft 9012. The rotating shaft 9012 is connected to the output end of a rotary motor fixedly arranged on the support frame 2, and the rotary motor drives the rotary assembly 901 to rotate.

[0070] The clamping assembly 902 includes a clamping base 9021, a headstock assembly 9022 and a tailstock assembly 9023 which are oppositely arranged. The clamping base 9021 is fixedly arranged below the turntable 9011 and can rotate with the turntable 9011. The headstock assembly 9022 is fixedly connected to the clamping base 9021. The tailstock assembly 9023 is slidably connected to the clamping base 9021 through a tailstock feed assembly 9024.

[0071] Specifically, the headstock assembly 9022 includes a headstock fixing frame, a headstock chuck and a headstock rotating motor. The headstock fixing frame is fixedly connected to the clamping base 9021. The headstock rotating motor is fixedly arranged on the headstock fixing frame, and its output end is connected to the horizontally arranged headstock chuck to drive the headstock chuck to act. The tailstock feed assembly 9024 includes a tailstock feed screw which is fixedly connected to the clamping base 9021. The tailstock assembly 9023 includes a tailstock fixing frame, a tailstock chuck and a tailstock rotating motor. The tailstock fixing frame is connected to the tailstock feed screw and is slidably connected to the clamping base 9021 through the tailstock feed screw. The tailstock rotating motor is fixedly connected to the tailstock fixing frame, and its output end is connected to the horizontally arranged tailstock chuck to drive the tailstock chuck to act. The tailstock feed assembly 9024 adjusts the distance between the tailstock assembly 9023 and the headstock assembly 9022 to facilitate clamping silicon rods of different lengths.

[0072] In this embodiment, two groups of clamping assemblies 902 are provided, and the two groups of clamping assemblies 902 are symmetrically arranged on both sides of the rotating shaft 9012. The clamping assemblies 902 on both sides can simultaneously clamp two silicon rods for squaring and grinding and polishing at the squaring mechanism 7 and the grinding and polishing mechanism 8, improving the use efficiency of the equipment.

[0073] Embodiment Six

[0074] Refer to Figure 1 , the blanking mechanism 10 includes a blanking fixing seat 1001 and a receiving table 1002. The receiving table 1002 is arranged horizontally and is fixedly arranged below the blanking fixing seat 1001. The blanking fixing seat 1001 is slidably connected to the support frame 2 through a horizontal feed assembly, and the horizontal feed assembly is arranged along the direction of crystalline silicon transportation; meanwhile, one side of the blanking fixing seat 1001 is slidably connected to the support frame 2 in the vertical direction through a vertical feed assembly arranged on the blanking fixing seat 1001. That is to say, the receiving table 1002 can be displaced in the vertical direction and the direction of crystalline silicon transportation to facilitate holding the cut crystalline silicon. In this embodiment, both the horizontal feed assembly and the vertical feed assembly adopt synchronous belts. The blanking fixing seat 1001 is of a frame structure and its cross-section is rectangular.

[0075] When using the device, a silicon rod is placed on the loading table 5 manually or by a manipulator. The manipulator assembly 4 clamps the crystalline silicon and moves it towards the rotary conveying mechanism 9. The clamping assembly 902 clamps the crystalline silicon. The squaring mechanism 7 moves to the clamping assembly 902 to perform the operation of removing the edge skin of the crystalline silicon. The cut edge skin falls into the edge skin receiving mechanism 6 for collection. After the edge skin cutting is completed, the turntable 9011 rotates to convey the crystalline silicon to the grinding and chamfering mechanism 8 for grinding the surface and chamfering operations. At this time, the idle clamping assembly 902 clamps another silicon rod for squaring operation. After the squaring of the crystalline silicon on one side is completed and the grinding and chamfering of the crystalline silicon on the other side are completed, the turntable 9011 rotates 180 degrees again, and then the edge skin of the other pair of opposite sides of the ground and chamfered crystalline silicon is cut, and at the same time, the grinding and chamfering mechanism 8 performs the grinding and chamfering operations on the crystalline silicon. After the grinding and chamfering are completed, the unloading mechanism 10 moves to the clamping assembly 902, catches the crystalline silicon and removes it from the device.

[0076] The present invention has been described in detail above. The above description is only the preferred embodiment of the present invention, and it cannot limit the scope of implementation of the present invention. That is, all equivalent changes and modifications made according to the scope of this application should still fall within the scope covered by the present invention.

Claims

1. A silicon rod squaring, grinding and chamfering integrated machine, characterized in that it includes a base (1) and a support frame (2) located above the base (1) and fixedly connected to the base (1). Along the conveying direction of the silicon rod, a feeding mechanism (3), an edge skin receiving mechanism (6), a squaring mechanism (7) and a grinding and polishing mechanism (8) are sequentially arranged on the base (1). A rotary conveying mechanism (9) is arranged between the squaring mechanism (7) and the grinding and polishing mechanism (8). The rotary conveying mechanism (9) is fixedly connected to the support frame (2) and is used for transferring the silicon rod between the squaring mechanism (7) and the grinding and polishing mechanism (8). A discharging mechanism (10) connected to the support frame (2) is arranged at the grinding and polishing mechanism (8) and is used for transferring the processed silicon rod out of the base (1); The feeding mechanism (3) includes a manipulator assembly (4) and a feeding table (5). The manipulator assembly (4) is connected to the support frame (2) and is used for transferring the silicon rod. The feeding table (5) is fixedly connected to the base (1) and is used for holding the silicon rod to be cut; The edge skin receiving mechanism (6) includes a material receiving box (601). The material receiving box (601) is slidably connected to the base (1) and is used for receiving the cut edge skin; The squaring mechanism (7) includes a cutting head. The cutting head includes a cutting channel surrounded by a cutting wire for the silicon rod to pass through and cut the silicon rod; The grinding and polishing mechanism (8) includes a grinding base (801) and a grinding assembly arranged on the grinding base (801). The grinding assembly surrounds a grinding channel for the silicon rod to pass through and grind the surface of the silicon rod. The cutting channel and the grinding channel are arranged in parallel; The rotary conveying mechanism (9) includes a rotary assembly (901) and at least two groups of clamping assemblies (902) fixedly connected to the rotary assembly (901) and is used for conveying the silicon rod; The discharging mechanism (10) includes a receiving table (1002) and is used for receiving the processed silicon rod; The manipulator assembly (4) includes a manipulator fixed seat (401), a manipulator support seat (402) and a jaw assembly (403). The manipulator fixed seat (401) is slidably connected to the support frame (2) in the silicon rod conveying direction. The manipulator support seat (402) is arranged on the manipulator fixed seat (401) and can be slidably connected to the manipulator fixed seat (401) in the vertical direction. The jaw assembly (403) is arranged below the manipulator support seat (402) and is slidably connected to the manipulator support seat (402) in the horizontal plane along the direction perpendicular to the silicon rod conveying; The feeding table (5) is fixedly connected to the base (1) and straddles above the edge skin receiving mechanism (6), and is arranged horizontally and perpendicular to the silicon rod conveying direction. Its longitudinal section is V-shaped and is used for holding the silicon rod; Two groups of grinding assemblies are arranged. The two groups of grinding assemblies are arranged at intervals with the central axis of the grinding base (801) as the symmetry axis to form a grinding channel for the silicon rod to pass through and grind the surface of the silicon rod. The grinding assembly includes a grinding head (802) and a grinding spindle assembly (803) connected to the grinding head (802), and the grinding spindle assembly (803) is slidably connected to the grinding base (801); The grinding head (802) includes a fine grinding wheel and a coarse grinding wheel. The fine grinding wheel is sleeved inside the coarse grinding wheel; The grinding spindle assembly (803) includes a fine grinding spindle assembly and a rough grinding spindle. The fine grinding spindle assembly includes a fine grinding spindle and an eccentric shaft vertically and cooperatively arranged at the end of the fine grinding spindle. The fine grinding spindle is sleeved in the rough grinding spindle, one end of which is connected to a fine grinding wheel, and the other end is telescopically fixed to the rough grinding spindle through a spring. One end of the rough grinding spindle is connected to a rough grinding wheel, and the other end is connected to a spindle driving device (804). The rotating assembly (901) includes a rotating shaft (9012) and a turntable (9011) connected to the rotating shaft (9012). The turntable (9011) is rotatably connected to the support frame (2) through the rotating shaft (9012). Two sets of clamping assemblies (902) are located on both sides of the rotating shaft (9012) and are fixedly arranged below the turntable (9011). The clamping assembly (902) includes a clamping base (9021), a headstock assembly (9022) fixedly arranged on the clamping base (9021), and a tailstock assembly (9023). The clamping base (9021) is fixedly connected to the turntable (9011). The headstock assembly (9022) is fixedly connected to the clamping base (9021). The tailstock assembly (9023) is slidably connected to the clamping base (9021) through a tailstock feeding assembly (9024), which is convenient for adjusting the distance between the headstock assembly (9022) and the tailstock assembly (9023) to clamp silicon rods of different lengths.

2. The integrated silicon rod squaring, grinding and chamfering machine according to claim 1, characterized in that The edge connecting and skinning mechanism (6) includes a receiving box (601) and a receiving box fixing seat (602). The receiving box (601) is inclinedly arranged along the upper part of the receiving box fixing seat (602). A first cylinder and a second cylinder are arranged below the receiving box (601). The first cylinder is arranged horizontally and is used for pushing the receiving box (601) to slide along the silicon rod conveying direction. The second cylinder is inclinedly arranged along the bottom surface of the receiving box (601) and is used for pushing the receiving box (601) to slide inclinedly along the receiving box fixing seat (602).

3. The integrated silicon rod squaring, grinding and chamfering machine according to claim 1, characterized in that The cutting head includes a cutting base (701), a left cutting assembly (702) and a right cutting assembly (703) arranged on the cutting base (701). The cutting base (701) is slidably connected to the base (1) through a first lead screw (704). The left cutting assembly (702) and the right cutting assembly (703) have the same structure, and the two are arranged at intervals with the central axis of the cutting base (701) as the symmetry axis to form a cutting channel for the silicon rod to pass through and cut the silicon rod.

4. The integrated silicon rod squaring, grinding and chamfering machine according to claim 3, characterized in that The left cutting assembly (702) includes a wire mesh support (7021), a cutting motor, a cutting wheel (7022) and a transition wheel (7023). The bottom of the wire mesh support (7021) is fixedly connected to the guiding assembly (705) to achieve stepless adjustment of the wire mesh spacing. The output end of the cutting motor is connected to the cutting wheel (7022), and the cutting wheel (7022) and the transition wheel (7023) are rotatably connected to the wire mesh support (7021). A plurality of transition wheels (7023) are provided, and the cutting wire sequentially bypasses the cutting wheel (7022) and the transition wheel (7023) to form a closed polygon.

5. The one-piece silicon rod squaring, grinding and chamfering machine according to claim 1, wherein The blanking mechanism (10) includes a blanking fixed seat (1001), a blanking support frame and a receiving table (1002) fixedly connected to the blanking support frame. The blanking fixed seat (1001) is slidably connected to the support frame (2) along the silicon rod conveying direction. The blanking support frame is arranged on the blanking fixed seat (1001) and is slidably connected to the blanking fixed seat (1001) in the vertical direction. The receiving table (1002) is horizontally arranged for holding the silicon rod.

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