A single-drive two-side clamping device and a whole-piece mechanism

Abstract

The present invention discloses a single-drive two-side clamping device and a whole-piece mechanism, wherein the single-drive two-side clamping device comprises a lifting plate, a second cylinder installed on the lifting plate, and a driving plate installed on the second cylinder and capable of moving along the Y direction under the drive of the second cylinder, wherein the driving plate is a wedge-shaped structure, and the front and rear sides of the driving plate have a bevel, the small end of the driving plate is located in the extending direction of the driving plate, and the large end of the driving plate is located in the retracting direction of the driving plate, the lifting plate is provided with a slide rail extending along the X direction, and two clamping assemblies respectively located at the front and rear sides of the driving plate, and the front and rear sides of the driving plate are also respectively provided with spring tension mechanisms, one end of the spring tension mechanism is fixed to the lifting plate, and the other end is fixed to the clamping assembly.

Description

Technical Field

[0001] The invention relates to the field of silicon wafer processing, and in particular to a single-drive two-side clamping device and a whole-wafer mechanism. Background Art

[0002] Silicon wafers are the carriers of solar cells. The quality of silicon wafers directly determines the conversion efficiency of solar cells. Solar cells require a large area of ​​PN junction to realize the conversion of light energy to electrical energy, and the diffusion furnace is a special equipment for manufacturing PN junctions of solar cells. The tubular diffusion furnace is mainly composed of four parts: the upper and lower parts of the quartz boat, the exhaust chamber, the furnace body and the gas cabinet. Diffusion generally uses a liquid source of phosphorus oxychloride as a diffusion source. Put the P-type silicon wafer in the quartz container of the tubular diffusion furnace, use nitrogen to bring phosphorus oxychloride into the quartz container at a high temperature of 850-900 degrees Celsius, and react with phosphorus oxychloride and silicon wafers to obtain phosphorus atoms. After a certain period of time, phosphorus atoms enter the surface layer of the silicon wafer from all sides, and penetrate and diffuse into the silicon wafer through the gaps between silicon atoms, forming the interface between N-type semiconductor and P-type semiconductor, that is, PN junction.

[0003] In the prior art, when a silicon wafer is straightened in the front-to-back or left-to-right direction, two cylinders are usually used to drive two front-to-back or left-to-right push plates to straighten the silicon wafer. A large number of cylinders are used, and the error in synchronously controlling the two cylinders is large. If the cylinders are used directly for driving, collisions are likely to occur between the push plates and the silicon wafer, causing damage to the silicon wafer. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide a single-drive two-side clamping device and a whole-piece mechanism.

[0005] In order to solve the above technical problems, the present invention provides a single-drive double-sided clamping device, which includes a lifting plate, a second cylinder installed on the lifting plate, and a driving plate installed on the second cylinder and capable of moving along the Y direction under the drive of the second cylinder. The driving plate is a wedge-shaped structure, and the front and rear sides of the driving plate have a beveled edge. The small end of the driving plate is located in the extension direction of the driving plate, and the large end of the driving plate is located in the retraction direction of the driving plate. The lifting plate is provided with a slide rail extending along the X direction and two clamping assemblies respectively located on the front and rear sides of the driving plate. The front and rear sides of the driving plate are also respectively provided with spring tension mechanisms, one end of the spring tension mechanism is fixed to the lifting plate, and the other end is fixed to the clamping assembly.

[0006] Preferably, the clamping assembly includes a slider that can slide along the slide rail, a pulley arranged on the slider, and a stop arm arranged along the Y direction on the slider, and a first push plate is arranged on the stop arm, and the first push plates of the two clamping assemblies are arranged opposite to each other.

[0007] Preferably, the single-driven two-sided clamping device has a clamping position and an opening position. When the single-driven two-sided clamping device is in the clamping position, the two pulleys are respectively located on both sides of the small head of the driving block, and the two clamping assemblies are relatively close. The two spring tension mechanisms respectively apply a pulling force to the two clamping assemblies, so that the clamping assemblies clamp the silicon wafer loading device from the front and back sides to complete the silicon wafers on the silicon wafer loading device. When the single-driven two-sided clamping device is in the opening position, the driving plate extends along the Y direction under the drive of the second cylinder and is inserted between the two pulleys. The two pulleys slide along the two sides of the driving plate to separate from each other, so that the two clamping assemblies are in the opening position, the first push plate is separated from the silicon wafer loading device, and the spring tension mechanism applies a restoring force to the clamping assembly, so that the clamping assembly has a tendency to return to the clamping position.

[0008] Preferably, the spring tension mechanism comprises a first fixing rod fixed on the lifting plate, a second fixing rod fixed on the sliding block, and a spring connected between the first fixing rod and the second fixing rod.

[0009] Preferably, the first push plate is provided with two first baffles extending in the up-down direction and parallel to each other.

[0010] Preferably, the first push plate also includes a C-shaped adjusting plate installed on the first baffle, the C-shaped adjusting plate includes an adjusting plate body parallel to the first baffle, an upper plate and a lower plate arranged on the upper and lower sides of the adjusting plate body, the upper plate and the lower plate of the adjusting plate are respectively provided with long holes arranged along the Y direction, the upper plate is located at the top of the first baffle, and the lower plate is located at the bottom of the first baffle, the upper plate and the lower plate are respectively fixed to the top and the bottom of the first baffle by fastening screws, and the fastening screws pass through the long holes.

[0011] Preferably, the adjusting piece is made of metal material, the structure of the first baffle is also a C-shaped structure, the first baffle is arranged opposite to the opening of the adjusting piece, and there is a gap between the adjusting piece body and the first baffle.

[0012] The present application also provides a whole piece mechanism, and the whole piece mechanism includes the single-drive two-side clamping device.

[0013] Preferably, the whole-wafer mechanism includes a silicon wafer loading device for stacking silicon wafers, a conveying device for transporting the silicon wafer loading device along the X direction, an X-direction positioning device for the whole silicon wafer from the X direction, and a pair of Y-direction positioning devices for the whole silicon wafer from the Y direction. The conveying device has a whole-wafer workstation, the X-direction positioning device includes a first cylinder, and the single-drive two-side clamping device is arranged on the upper side of the first cylinder and can move along the Z direction under the drive of the first cylinder.

[0014] Preferably, the silicon wafer assembly mechanism further comprises a pair of base positioning devices capable of positioning the silicon wafer loading device on the wafer assembly station.

[0015] The single-drive two-side clamping device and the whole-piece mechanism of the present invention have the following beneficial effects:

[0016] The first cylinder of the X-axis positioning device of the present application can drive the second cylinder and the clamping assembly to move up and down, and can avoid the silicon wafer loading device in transit. The mutual approach and separation of the single-driven two-side clamping devices are achieved by a second cylinder, and the clamping of the clamping assembly is achieved by the elastic force of the spring. The advantage of this structure over direct clamping by the cylinder is that the spring clamping can have a buffer force, while the cylinder direct drive clamping has no buffer force. Therefore, the single-driven two-side clamping device of the present application can prevent the silicon wafer from being damaged during the whole process.

[0017] The first push plate of the single-drive double-sided clamping device of the present application also includes a C-shaped adjustment plate installed on the first baffle, which can be fine-tuned relative to the first baffle along the Y direction to change the relative distance between the two clamping components and change the clamping force between the clamping components.

[0018] The structure of the first stopper of the first push plate of the single-drive double-side clamping device of the present application is also a C-shaped structure, the first stopper is arranged opposite to the opening of the adjustment sheet, and there is a gap between the adjustment sheet body and the first stopper. This structure makes the adjustment sheet body an elastic structure, and when the adjustment sheet body touches the silicon wafer, it is a flexible contact, and will not cause damage to the edge of the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic structural diagram of the four-side integrated structure of the silicon wafer of the present application;

[0020] Figure 2 It is a structural schematic diagram of the X-axis positioning device of the present application;

[0021] Figure 3 It is a schematic diagram of the top view of the X-axis positioning device of the present application;

[0022] Figure 4 It is a structural schematic diagram of the first push plate of the present application;

[0023] Figure 5 It is a structural schematic diagram of the second Y-axis positioning device of the present application;

[0024] Figure 6 It is a schematic structural diagram of the first Y-axis positioning device of the present application;

[0025] Figure 7 is a structural schematic diagram of the first base positioning device of the present application;

[0026] Figure 8 is a structural schematic diagram of the second base positioning device of the present application;

[0027] Fig. 9 It is a schematic structural diagram of the silicon wafer loading device of the present application;

[0028] Fig.10 It is a schematic diagram of the structure of the conveying device of the present application;

[0029] Fig.11 It is a schematic diagram of the top view of the entire mechanism of the present application.

[0030] Wherein: 1. conveying device; 2. silicon wafer loading device; 31. first Y-direction positioning device; 32. second Y-direction positioning device; 4. X-direction positioning device; 5. first base positioning device; 6. second base positioning device;

[0031] 11. Top plate; 12. Side plate; 13. Conveyor belt; 14. Support plate; 15. First bottom plate; 16. Second bottom plate; 17. Fixing bar; 18. First sensor; 19. Second sensor;

[0032] 21. Base; 22. Carrier plate; 23. Fence; 221. Recessed area.

[0033] 311, second mounting frame; 313, fifth cylinder; 314, third push plate; 3141, third stop bar; 315, second fixing seat;

[0034] 321, first mounting frame; 322, third cylinder; 323, fourth cylinder; 324, second push plate; 325, first fixing seat; 326, first limiting block; 3241, second stop bar;

[0035] 41. first cylinder; 42. lifting plate; 43. second cylinder; 44. slider; 441. pulley; 45. stop arm; 46. first push plate; 461. first stop bar; 462. adjustment sheet; 463. long hole; 464. fastening screw; 471. first fixing rod; 472. spring; 473. second fixing rod; 48. slide rail; 49. drive plate;

[0036] 51. third fixing seat; 52. sixth cylinder; 53. seventh cylinder; 54. first base stopper;

[0037] 61. Fourth fixing seat; 62. Eighth cylinder; 63. Second base blocking member. DETAILED DESCRIPTION

[0038] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

[0039] like Figure 1 As shown, the whole wafer mechanism of the present application includes a silicon wafer loading device 2 for stacking silicon wafers, a conveying device 1 for transporting the silicon wafer loading device 2 along the X direction, an X-direction positioning device 4 for positioning the whole silicon wafer from the X direction, and a pair of Y-direction positioning devices for positioning the whole silicon wafer from the Y direction.

[0040] The conveying device 1 has a wafer-forming station. When the silicon wafer loading device 2 is conveyed to the wafer-forming station, the X-direction positioning device 4 respectively forms the silicon wafer from the front and back sides, and the pair of Y-direction positioning devices respectively form the silicon wafer from the left and right sides.

[0041] The wafer integration mechanism further comprises a pair of base positioning devices capable of positioning the silicon wafer loading device 2 on the wafer integration station.

[0042] like Figure 2 and 3 As shown, the X-axis positioning device 4 of the present application includes a first cylinder 41 and a single-drive two-side clamping device connected to the upper side of the first cylinder 41 and capable of moving along the Z-axis under the drive of the first cylinder 41 .

[0043] The single-drive two-side clamping device comprises a lifting plate 42, a second cylinder 43 mounted on the lifting plate 42, and a driving plate 49 mounted on the second cylinder 43 and capable of moving along the Y direction under the drive of the second cylinder 43.

[0044] The driving plate 49 is a wedge-shaped structure, and the front and rear sides of the driving plate 49 have a bevel. The small end of the driving plate 49 is located in the extension direction of the driving plate 49, and the large end of the driving plate 49 is located in the retraction direction of the driving plate 49.

[0045] The lifting plate 42 is provided with a slide rail 48 extending along the X direction and two clamping assemblies respectively located at the front and rear sides of the driving plate 49.

[0046] The clamping assembly includes a slider 44 that can slide along a slide rail 48, a pulley 441 provided on the slider 44, and a stop arm 45 provided along the Y direction on the slider 44. The stop arm 45 is provided with a first push plate 46. The first push plates 46 of the two clamping assemblies are arranged opposite to each other.

[0047] The front and rear sides of the driving plate 49 are also provided with spring tension mechanisms, one end of the spring tension mechanism is fixed to the lifting plate 42, and the other end is fixed to the clamping assembly.

[0048] The single-drive two-side clamping device has a clamping position and an open position.

[0049] When the single-drive two-side clamping device is in the clamping position, the two pulleys 441 are respectively located on the two sides of the small head of the driving block, and the two clamping components are relatively close. The two spring tension mechanisms respectively apply a pulling force to the two clamping components, so that the clamping components clamp the silicon wafer loading device 2 from the front and back sides, and the silicon wafers on the silicon wafer loading device 2 are integrated.

[0050] When the single-drive double-sided clamping device is in the open position, the drive plate 49 is extended along the Y direction under the drive of the second cylinder 43 and inserted between the two pulleys 441. The two pulleys 441 slide along the two sides of the drive plate 49 to separate from each other, so that the two clamping assemblies are in the open position, the first push plate 46 is separated from the silicon wafer loading device 2, and the spring tension mechanism applies a restoring force to the clamping assembly, so that the clamping assembly has a tendency to return to the clamping position.

[0051] The spring tension mechanism includes a first fixing rod 471 fixed on the lifting plate 42 , a second fixing rod 473 fixed on the slider 44 , and a spring 472 connected between the first fixing rod 471 and the second fixing rod 473 .

[0052] The pair of Y-axis positioning devices are a first Y-axis positioning device 31 and a second Y-axis positioning device 32, which are respectively installed on the left and right sides of the whole workstation.

[0053] like Figure 6 As shown, the first Y-direction positioning device 31 includes a second fixed seat 315 fixedly mounted on the conveying device 1, a second mounting frame 311 mounted on the second fixed seat 315, a fifth cylinder 313 mounted on the second mounting frame 311, and a third push plate 314 driven by the fifth cylinder 313 along the Y-direction.

[0054] like Figure 5As shown, the second Y-direction positioning device 32 includes a first fixed seat 325 installed on the conveying device 1, a first mounting frame 321 installed on the first fixed seat 325, and the first mounting frame 321 includes an upper mounting plate and a lower mounting plate. The upper mounting plate is mounted with a fourth cylinder 323, and the lower mounting plate is mounted with a third cylinder 322. The second Y-direction positioning device 32 also includes a second push plate 324 driven along the Y direction by the fourth cylinder 323 and a first limit block 326 driven along the Y direction by the third cylinder 322. The second push plate 324 and the third push plate 314 respectively carry out whole wafers from the left and right sides.

[0055] like Fig. 9 As shown, the silicon wafer loading device 2 of the present application includes a base 21, a carrier 22 installed on the base 21 for stacking silicon wafers, and a plurality of fences 23 arranged around the carrier 22 and fixed on the base 21, wherein the fences 23 are used to prevent the silicon wafers from falling from the carrier 22.

[0056] like Fig.10 As shown, the conveying device 1 includes two side panels 12 arranged in a left-right direction, and synchronously moving conveyor belts 13 are respectively installed on the side panels 12. Top panels 11 are respectively installed on the tops of the side panels 12, and the height of the top panels 11 is greater than the height of the conveyor belt 13. When the silicon wafer loading device 2 is transported on the conveyor belt 13, the base 21 is located between the two top panels 11. The first fixing seat 325 of the first Y-direction positioning device 31 and the second fixing seat 315 of the second Y-direction positioning device 32 are respectively installed on the outer walls of the two side panels 12.

[0057] The pair of base positioning devices are respectively a first base positioning device 5 and a second base positioning device 6 .

[0058] like Figure 7 As shown, the first base positioning device 5 includes a third fixed seat 51 installed on the conveying device 1, a sixth cylinder 52 installed on the third fixed seat 51, a seventh cylinder 53 driven by the sixth cylinder 52 along the Y direction, and a first base blocking member 54 that can be raised and lowered under the drive of the seventh cylinder 53.

[0059] like Figure 8 As shown, the second base positioning device 6 includes a fourth fixed seat 61 installed on the conveying device 1, an eighth cylinder 62 installed on the fourth fixed seat 61, and a second base blocking member 63 that can be raised and lowered under the drive of the eighth cylinder 62.

[0060] The working process of the whole mechanism of this application is as follows:

[0061] (i) Positioning of the silicon wafer loading device 2 in the X direction: When the silicon wafer loading device 2 moves on the conveyor belt 13, the first base blocking portion of the first base positioning device 5 and the second base blocking portion of the second base positioning device 6 are located at the lower side of the conveyor belt 13. When the silicon wafer loading device 2 is conveyed to the whole wafer workstation by the conveying device 1, the conveyor belt 13 stops transmitting, and the seventh cylinder 53 of the first base positioning device 5 located on the front side of the silicon wafer loading device 2 drives the first base stopper 54 to rise, and the eighth cylinder of the second base positioning device 6 located on the rear side of the silicon wafer loading device 2 drives the second base stopper 63 to rise until the base of the silicon wafer loading device 2 is between the first base stopper 54 and the second base stopper 63, and then, the sixth cylinder 52 drives the seventh cylinder 53 to move toward the silicon wafer loading device 2 along the X direction, so that the first base stopper 54 pushes the base 21 of the silicon wafer loading device 2 until the base 21 of the silicon wafer loading device 2 touches the second base stopper 63, at which time, the silicon wafer loading device 2 is limited between the first base stopper 54 and the second base stopper 63 in the X direction.

[0062] (ii) Positioning of the silicon wafer loading device 2 in the Y direction: the third cylinder 322 of the second Y-direction positioning device 32 drives the first limit block 326 to move along the Y direction, so that the first limit block 326 pushes the base 21 of the silicon wafer loading device 2 until the other side of the base 21 of the silicon wafer loading device 2 touches the top plate 11. At this time, the silicon wafer loading device 2 is limited in the Y direction between the first limit block 326 and the top plate 11.

[0063] (III) Whole wafer in X direction: When the wafer loading device 2 moves on the conveyor belt 13, the first push plate 46 that drives the clamping devices on both sides is located on the upper side of the wafer loading device 2, and the wafer loading device 2 can pass through the lower part of the X-direction positioning device 4. When the wafer loading device 2 is transferred to the whole wafer station and completes the positioning in the X and Y directions, the first cylinder 41 drives the second cylinder 43 and the clamping assembly to descend until the wafer loading device 2 is located between the two first push plates 46. At this time, the two clamping assemblies are in an open state, and the first push plate 46 and the wafer loading device 2 are separated from each other. Then, the second cylinder 43 controls the drive plate 49 to retract, and the two clamping assemblies approach each other under the action of the spring 472, clamping the wafer loading device 2, and completing the whole wafer in X direction.

[0064] (IV) Whole-piece silicon wafer in Y direction: The fifth cylinder 313 of the first Y-direction positioning device 31 and the fourth cylinder 323 of the second Y-direction positioning device 32 respectively drive the third push plate 314 and the second push plate 324 to move toward each other along the Y direction, thereby completing the whole-piece silicon wafer in Y direction.

[0065] (V) Move the completed wafer loading device 2 to the next workstation: (1) The fifth cylinder 313 of the first Y-axis positioning device 31 and the fourth cylinder 323 of the second Y-axis positioning device 32 respectively drive the third push plate 314 and the second push plate 324 to withdraw to their original positions along the Y-axis, and the third cylinder 322 of the second Y-axis positioning device 32 controls the first limit block 326 to withdraw to its original position; (2) The second cylinder 43 of the clamping device 4 on both sides is driven to extend the drive plate 49 and insert it between the two pulleys 441. The two clamping assemblies are relatively separated, and the first push plate 46 is separated from the wafer loading mechanism. The first cylinder 41 drives the second cylinder 43 and the clamping assembly to rise to the upper side of the wafer loading mechanism.

[0066] (3) The sixth cylinder 52 of the first base positioning device 5 drives the seventh cylinder 53 to return to its original position. The seventh cylinder 53 of the first base positioning device 5 and the eighth cylinder 62 of the second base positioning device 6 respectively drive the first base blocking member 54 and the second base blocking member 63 to descend to the lower side of the silicon wafer loading device 2. The conveyor belt 13 restarts to move the silicon wafer loading device 2 to the next workstation.

[0067] In a preferred embodiment, the carrier 22 is a rectangular structure, and each edge of the carrier 22 has two recessed areas 221 . When the silicon wafer is placed on the carrier 22 , the edge of the silicon wafer is located in the recessed area 221 .

[0068] The first push plate 46 of the single-drive two-side clamping device is provided with two first baffles 461 extending in the up-down direction and parallel to each other, the third push plate 314 of the first Y-direction positioning device 31 is provided with two third baffles 3141 extending in the up-down direction and parallel to each other, and the second push plate 324 of the second Y-direction positioning device 32 is provided with two second baffles 3241 extending in the up-down direction and parallel to each other. In step (iii), the first baffles 461 of the two first push plates 46 are respectively inserted into the corresponding recessed areas 221 to perform the whole wafer. In step (iv), the second baffles 3241 on the second push plate 324 and the third baffles on the third push plate 314 are respectively inserted into the corresponding recessed areas 221 to perform the whole wafer. Since the edge of the silicon wafer is smaller than the edge of the carrier 22, the deviation caused by the collision of the silicon wafer during the transportation process can be prevented. At the same time, each edge of the silicon wafer is respectively sliced ​​by two baffles, which can prevent the silicon wafer from twisting during the whole wafer process, and the whole wafer effect is better.

[0069] Preferably, the first push plate 46 of the X-axis positioning device 4 also includes a C-shaped adjusting plate 462 installed on the first baffle 461, the C-shaped adjusting plate 462 includes an adjusting plate 462 body parallel to the first baffle 461, an upper plate and a lower plate arranged on the upper and lower sides of the adjusting plate body, the upper plate and the lower plate of the adjusting plate are respectively provided with long holes 463 arranged along the Y direction, the upper plate is located at the top of the first baffle 461, and the lower plate is located at the bottom of the first baffle 461, the upper plate and the lower plate are respectively fixed to the top and bottom of the first baffle 461 by fastening screws 464, and the fastening screws 464 pass through the long holes 463.

[0070] The C-shaped adjustment piece can be fine-tuned relative to the first stop bar 461 along the Y direction to change the relative distance between the two clamping components and change the clamping force between the clamping components. In addition, the adjustment piece 462 is made of metal material, and the structure of the first stop bar 461 is also a C-shaped structure. The first stop bar 461 is arranged opposite to the opening of the adjustment piece, and there is a gap between the adjustment piece body and the first stop bar 461. This structure makes the adjustment piece body an elastic structure, and when the adjustment piece body touches the silicon wafer, it is a flexible contact and will not cause damage to the edge of the silicon wafer.

[0071] In another preferred embodiment, a first bottom plate 15 and a second bottom plate 16 are installed between the bottoms of the two side plates 12 of the conveyor 1 along the front-to-back direction, the first base positioning device 5 is installed on the second base plate 16, and the second base positioning device 6 is installed on the first bottom plate 15. A support plate 14 is installed on the inner side of the two side plates 12, respectively. The support plate 14 is arranged on the lower side of the upper belt surface of the conveyor belt 13, and is used to support the upper belt surface of the conveyor belt 13. A fixing bar 17 is also installed on the inner side of one of the side plates 12 of the conveyor 1 along the front-to-back direction, and a first sensor 18 and a second sensor 19 are respectively arranged on the fixing bar 17 along the front-to-back direction. The first sensor 18 and the second sensor 19 are used to detect the position of the silicon wafer loading device 2. When the silicon wafer loading device 2 is transferred to the whole wafer station, the conveyor belt 13 is controlled to stop working.

[0072] In the present application, the X direction is the running direction of the silicon wafer loading device 2 on the conveying device 1, that is, the front-to-back direction; the Y direction in the present application refers to the direction perpendicular to the X direction on the horizontal plane, that is, the left-right direction; the Z direction in the present application refers to the up-down direction.

[0073] The above-described embodiments are only preferred embodiments for fully illustrating the present invention, and the protection scope of the present invention is not limited thereto. Equivalent substitutions or changes made by those skilled in the art based on the present invention are within the protection scope of the present invention. The protection scope of the present invention shall be subject to the claims.

Claims

1. A single-drive two-side clamping device, characterized in that: The single-drive double-sided clamping device comprises a lifting plate, a second cylinder mounted on the lifting plate, a driving plate mounted on the second cylinder and capable of moving in the Y direction under the drive of the second cylinder, the driving plate being a wedge-shaped structure, and having a beveled edge on the front and rear sides of the driving plate, the small end of the driving plate being located in the extending direction of the driving plate, and the large end of the driving plate being located in the retracting direction of the driving plate, the lifting plate being provided with a slide rail extending in the X direction, and two clamping assemblies respectively located in the front and rear sides of the driving plate, the front and rear sides of the driving plate being further provided with a spring tension mechanism, one end of the spring tension mechanism being fixed to the lifting plate, and the other end being fixed to the clamping assembly, the clamping assembly comprising a slider capable of sliding along the slide rail, a pulley arranged on the slider, and a stop arm arranged in the Y direction on the slider, the stop arm being provided with a first push plate, and the first push plates of the two clamping assemblies being arranged opposite to each other, The single-drive two-side clamping device has a clamping position and an open position. When the single-drive two-side clamping device is in the clamping position, the two pulleys are respectively located on the two sides of the small head of the driving block, and the two clamping components are relatively close to each other. The two spring tension mechanisms respectively apply a pulling force to the two clamping components, so that the clamping components clamp the silicon wafer loading device from the front and back sides, and the silicon wafers on the silicon wafer loading device are integrated. When the single-drive double-sided clamping device is in the open position, the drive plate extends in the Y direction under the drive of the second cylinder and is inserted between the two pulleys. The two pulleys slide along the two sides of the drive plate to separate from each other, so that the two clamping assemblies are in the open position, the first push plate is separated from the silicon wafer loading device, and the spring tension mechanism applies a restoring force to the clamping assembly, so that the clamping assembly has a tendency to return to the clamping position; The spring tension mechanism comprises a first fixing rod fixed on the lifting plate, a second fixing rod fixed on the sliding block, and a spring connected between the first fixing rod and the second fixing rod.

2. The single-drive two-side clamping device according to claim 1, characterized in that: The first push plate is provided with two first blocking strips extending in the up-down direction and parallel to each other.

3. The single-drive double-side clamping device according to claim 2, characterized in that: The first push plate also includes a C-shaped adjustment plate installed on the first baffle, the C-shaped adjustment plate includes an adjustment plate body parallel to the first baffle, an upper plate and a lower plate arranged on the upper and lower sides of the adjustment plate body, the upper plate and the lower plate of the adjustment plate are respectively provided with long holes arranged along the Y direction, the upper plate is located at the top of the first baffle, and the lower plate is located at the bottom of the first baffle, the upper plate and the lower plate are respectively fixed to the top and the bottom of the first baffle by fastening screws, and the fastening screws pass through the long holes.

4. The single-drive double-side clamping device according to claim 3, characterized in that: The regulating piece is made of metal material, the structure of the first baffle is also a C-shaped structure, the first baffle is arranged opposite to the opening of the regulating piece, and there is a gap between the regulating piece body and the first baffle.

5. A whole piece mechanism, characterized in that: The whole piece mechanism comprises the single-drive double-sided clamping device as described in any one of claims 1 to 4.

6. The whole piece mechanism according to claim 5, characterized in that: The whole-wafer mechanism comprises a silicon wafer loading device for stacking silicon wafers, a conveying device for transporting the silicon wafer loading device along the X direction, an X-direction positioning device for the whole silicon wafer from the X direction, and a pair of Y-direction positioning devices for the whole silicon wafer from the Y direction. The conveying device has a whole-wafer workstation, the X-direction positioning device comprises a first cylinder, and the single-drive two-side clamping device is arranged on the upper side of the first cylinder and can move along the Z direction under the drive of the first cylinder.

7. The whole piece mechanism according to claim 6, characterized in that: The silicon wafer whole-wafer mechanism also includes a pair of base positioning devices capable of positioning the silicon wafer loading device on the whole-wafer workstation.

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