Circuit board unit, circuit component, computer power supply, computer

Abstract

The present invention provides a circuit board unit, a circuit component, a computer power supply and a computer. The circuit board unit includes at least one circuit board, the circuit board includes a plurality of electrically connected layers stacked on top of each other, and the circuit board is provided with an electrical connection structure for connecting electronic components; at least one of the circuit boards is a multiplexing board. Among the outermost two electrically connected layers of the multiplexing board, at least one of the electrically connected layers is a heat-conducting layer, the heat-conducting layer is a copper foil layer, the heat-conducting layer has an exposed area, and the exposed area exposes the multiplexing board; in the multiplexing board, at least part of the electrical connection structure is located within the exposed area. The present invention reduces or even does not provide an independent heat dissipation or cooling structure on the circuit board, thereby being able to reduce the volume of the entire circuit component, being beneficial to the overall structural design of the product, especially beneficial to the structural design of small products, so as to better meet the needs of users.

Description

Technical Field

[0001] The present invention relates to the field of electronic technology, and particularly to a circuit board unit, a circuit component, a computer power supply, and a computer. Background Art

[0002] At present, circuit boards are widely used and exist in various electronic and electrical products. With the improvement of the performance of these products, many high-power electronic components need to be set on the circuit board. These electronic components generate a large amount of heat. In order to ensure the normal operation of the products, in the prior art, special heat dissipation or heat conduction structures are often arranged outside the circuit board, such as connecting aluminum sheet structures such as heat dissipation fins on the circuit board, and some even directly set special cooling devices inside the product, such as conducting heat through the flow of coolant to better ensure the normal operation of the products.

[0003] However, the existing heat dissipation or heat conduction structures need to be set independently of the circuit board, which will inevitably occupy a large space and increase the volume of the entire product. Especially for those products that originally pursue small size, the overall effect of the products is further reduced. Summary of the Invention

[0004] Based on the above situation, the main object of the present invention is to provide a circuit board unit, a circuit component, a computer power supply, and a computer to solve the problem of too large volume caused by setting an independent heat dissipation or heat conduction structure for the existing circuit board.

[0005] To achieve the above object, the technical solution adopted by the present invention is as follows:

[0006] In a first aspect of the present invention, a circuit board unit is provided, including at least one circuit board. The circuit board includes multiple electrically connected layers stacked on top of each other, and the circuit board is provided with an electrical connection structure for connecting electronic components. At least one of the circuit boards is a multiplexing board. In the outermost two electrically connected layers of the multiplexing board, at least one of the electrically connected layers is a heat conduction layer. The heat conduction layer is a copper foil layer, and the heat conduction layer has an exposed area, and the exposed area exposes the multiplexing board. In the multiplexing board, at least part of the electrical connection structure is located in the exposed area.

[0007] Preferably, multiple exposed areas are provided on the same heat conduction layer.

[0008] Preferably, at least one of the exposed areas extends to the edge of the multiplexing board, and / or at least one of the exposed areas extends along the edge of the multiplexing board.

[0009] Preferably, the electrical connection structure includes a first electrical connection structure for connecting a first electronic component among the electronic components, and the first electrical connection structures are all located in the exposed area; wherein, the first electronic component includes a transistor.

[0010] Preferably, a plurality of the first electrical connection structures are provided in the same exposed area. In a direction perpendicular to the circuit board, the area of the projection of the same exposed area is greater than or equal to ten times the sum of the areas of the projections of the transistors connected thereto. Preferably, at least two multiplexing boards are provided. Define one of them as the first board and the other as the second board. In the first board and the second board, one is provided with a first electrical slot, and the other is provided with a first electrical pin. The two can be plugged and matched through the first electrical slot and the first electrical pin to form an electrical connection.

[0011] Preferably, the first board and the second board are perpendicularly arranged; and / or a plurality of the second boards are provided.

[0012] Preferably, a plurality of circuit boards are provided, and at least one circuit board is a general-purpose board. In the general-purpose board and the multiplexing board, one is provided with a second slot, and the other is provided with a second electrical pin. The two are plugged and matched through the second electrical slot and the second electrical pin to form an electrical connection.

[0013] A second aspect of the present invention provides a circuit assembly, including electronic components and a circuit board unit as described in any one of the above, and the electronic components are connected to the electrical connection structure.

[0014] Preferably, a plurality of the electronic components are provided, wherein some of the electronic components are first electronic components, and the first electronic components include at least one of a transistor, a transformer, and a bridge; the electrical connection structure corresponding to the first electronic component is a first electrical connection structure, and each of the first electrical connection structures is located in the exposed area.

[0015] Preferably, the first electronic component includes a transistor, and a plurality of the transistors are connected to the same exposed area. In a direction perpendicular to the circuit board, the area of the projection of the exposed area is greater than or equal to ten times the sum of the areas of the projections of the transistors connected thereto.

[0016] A third aspect of the present invention provides a computer power supply, including a housing and a circuit assembly as described in any one of the above, and the circuit assembly is installed in the housing.

[0017] Preferably, a first guide groove is provided in the housing, a plurality of circuit boards are provided and are connected to each other, and at least one circuit board is a multiplexing board, and one of the multiplexing boards is inserted into the first guide groove;

[0018] And / or, a gap is left between the main surface of each circuit board and the housing.

[0019] Preferably, the housing is provided with heat dissipation holes and a second guide groove, and a fluid channel is formed between the exposed area and the heat dissipation holes;

[0020] It further includes a fan to form an air flow in the fluid channel; the fan is inserted into the second guide groove.

[0021] Preferably, the electrical connection structure includes a third electrical connection structure, and at least one of the multiplexing boards forms a non-zero angle with the insertion direction of the fan, and the third electrical connection structure is provided on the multiplexing board;

[0022] The fan is provided with a driving connection part, and among the driving connection part and the third electrical connection structure, one includes spring pins and the other includes contacts, and the spring pins are pressed against the contacts to form an electrical connection.

[0023] Preferably, the multiplexing board electrically connected to the fan is arranged perpendicular to the insertion direction, and both it and the driving connection part are located at the end of the fan along the insertion direction.

[0024] Preferably, the multiplexing board electrically connected to the fan is provided with a limiting protrusion on the side facing away from the fan, and the limiting protrusion abuts against the housing.

[0025] Preferably, the housing is provided with a limiting structure in the insertion direction of the fan, and the fan abuts against the limiting structure.

[0026] Preferably, the housing includes a middle housing, a front housing and a rear housing. The middle housing is a hollow structure, and its two ends are respectively buckled with the front housing and the rear housing; the insertion direction is the same as the relative direction of the front housing and the rear housing, and the limiting structure includes a convex rib provided on the end face of the front housing or the rear housing close to the middle housing.

[0027] The fourth aspect of the present invention provides a computer, including the computer power supply as described in any one of the above.

[0028] The circuit board unit of the present invention has at least one circuit board as a multiplex board. The multiplex board has an exposed area to expose the heat conducting layer from the multiplex board, and part of the electrical connection structure is arranged in the exposed area. When in use, some electronic components such as transistors with high power and large heat generation can be connected to the electrical connection structure in the exposed area, so that these electronic components are directly in contact with the exposed area, and the heat of the electronic components is quickly conducted to the exposed area. And the exposed area is directly exposed to the outside of the entire multiplex board, so the heat can be dissipated as soon as possible. Obviously, such a multiplex board not only has functions such as electrical connection of a general circuit board, but also has functions of heat conduction and heat dissipation. Therefore, when the circuit board unit is in use, an independent heat dissipation or cooling structure can be reduced or even not provided on the circuit board, so that the volume of the entire circuit component can be reduced, which is beneficial to the overall structure design of the product, especially beneficial to the structure design of small products, so as to better meet the needs of users; and since heat dissipation structures such as aluminum sheets are omitted, the assembly process of these heat dissipation structures and the connection process with other structures can be saved, thereby improving the production efficiency of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. In the figures:

[0030] Figure 1 is a schematic structural diagram of a preferred embodiment of a computer power supply provided by the present invention;

[0031] Figure 2 is Figure 1 a schematic structural diagram of the embodiment shown with some components hidden;

[0032] Figure 3 is Figure 1 a schematic structural diagram of the embodiment shown with another part of the components hidden;

[0033] Figure 4 is Figure 1 a schematic structural diagram of the fan and the circuit component in the embodiment shown in ;

[0034] Figure 5 is a schematic structural diagram of a preferred embodiment of a circuit board unit provided by the present invention.

[0035] In the figures:

[0036] 100, computer power supply; 101, housing; 1011, middle housing; 1012, front housing; 1013, rear housing; 1014, first guide groove; 1015, heat dissipation hole; 1016, second guide groove; 1017, limiting structure; 102, circuit component; 103, fan; 1031, driving connection part;

[0037] 1, first electronic component;

[0038] 2. The second electronic component;

[0039] 3. The circuit board unit; 31. The first board; 3111. The exposed area; 312. The first electrical connection structure; 313. The second electrical connection structure; 314. The first electrical slot; 32. The second board; 322. The third electrical connection structure; 33. The limiting protrusion. Detailed implementation manners

[0040] The present invention will be described based on embodiments below, but the present invention is not limited to these embodiments only. In the following detailed description of the present invention, some specific details are described in detail. In order to avoid obscuring the essence of the present invention, well-known methods, processes, procedures, and components are not described in detail.

[0041] In addition, those of ordinary skill in the art should understand that the drawings provided herein are for illustrative purposes only, and the drawings are not necessarily drawn to scale.

[0042] Unless the context clearly requires otherwise, the words such as "including", "comprising" and the like in the whole specification and claims should be interpreted as the meaning of including rather than exclusive or exhaustive; that is, the meaning of "including but not limited to".

[0043] In the description of the present invention, it should be understood that the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, in the description of the present invention, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0044] This application provides a computer, including a computer power supply 100, as Figures 1-5 shown, the computer power supply includes a housing 101 and a circuit component 102, and the circuit component 102 is installed in the housing 101.

[0045] The circuit component 102 includes electronic components (such as the first electronic component 1 and the second electronic component 2) and a circuit board unit 3. The circuit board unit 3 includes at least one circuit board, that is, it can include only one circuit board, or can include two, three or more circuit boards. Each circuit board can be a rigid printed circuit board or a flexible circuit board. Specifically, each circuit board includes multiple stacked electrical connection layers, such as two, three or more electrical connection layers are provided. It can be understood that a silk screen layer, such as a green paint layer, can also be provided on the outermost side of the multiple electrical connection layers to form an insulating layer, and other layer structures can also be provided between two adjacent electrical connection layers. Electrical connection structures for connecting electronic components are provided on the circuit board. The electrical connection structures can specifically be connection structures such as pads, pins, and via holes. When forming the circuit component 102, the electronic components are correspondingly connected to the electrical connection structures.

[0046] Among them, the electronic components include the first electronic component 1 and the second electronic component 2. The first electronic component 1 includes at least one of a transistor, a transformer, a bridge, etc. Among them, the transistor can be a field-effect transistor (FET, Field-effect transistor), specifically a metal-oxide-semiconductor field-effect transistor (MOSFET, metal-oxide-semiconductor field-effect transistor), usually in a surface mount structure. The power of these electronic components is relatively high and the heat generation is relatively serious. The electrical connection structures connected to them on the circuit board are defined as the first electrical connection structures 312; the second electronic component 2 includes at least one of a resistor, a capacitor, an inductor, etc. The power of these electronic components is relatively low and the heat generation is also relatively small, and can even be ignored. Correspondingly, the electrical connection structures connected to them on the circuit board are defined as the second electrical connection structures 313. That is to say, some of the electrical connection structures are the first electrical connection structures, and some are the second electrical connection structures. On any circuit board, only the first electrical connection structures or the second electrical connection structures can be provided, or both the first electrical connection structures and the second electrical connection structures can be provided at the same time. Of course, other electrical connection structures, such as the third electrical connection structures, can also be provided on the circuit board.

[0047] Reference Figure 5, at least one of the circuit boards in the circuit board unit 3 is a multiplexed board. Among the outermost two electrical connection layers of the multiplexed board, at least one electrical connection layer is a heat conduction layer, and specifically, the heat conduction layer is a copper foil layer. The heat conduction layer has an exposed area 3111, and the exposed area 3111 exposes the multiplexed board (such as the first board 31 and the second board 32), that is, when there is a silk screen layer or other structural layers on the outside of the outermost electrical connection layer, these structural layers are in a hollow structure at the position corresponding to the exposed area 3111. In the embodiment where a green paint layer is applied on the outside of the outermost electrical connection layer, there is no such green paint layer on the outside of the exposed area 3111, so as to completely expose the exposed area 3111. In the multiplexed board, at least part of the electrical connection structure is located in the exposed area 3111. When forming the circuit component 102, the electronic components are connected to the electrical connection structure.

[0048] In the above circuit board unit 3, at least one circuit board is a multiplexed board, and the multiplexed board is provided with an exposed area 3111. The electrical connection layer in the circuit board is multiplexed as a heat conduction layer. When in use, especially for high-power and high-heat-generating electronic components such as transistors, they are connected to the electrical connection structure in the exposed area, so that these electronic components are directly in contact with the copper foil layer in the exposed area 3111. Since the heat conduction efficiency of copper is relatively high and the exposed area 3111 is directly exposed to the outside of the entire multiplexed board, most of the heat of the first electronic component 1 can be quickly conducted out of the circuit board directly through the exposed area 3111 to dissipate the heat as soon as possible. Obviously, such a multiplexed board not only has functions such as electrical connection of a general circuit board, but also has functions of heat conduction and heat dissipation. Therefore, when using the circuit board unit 3, the setting of independent heat dissipation or cooling structures on the circuit board can be reduced, thereby reducing the volume of the entire circuit component 102, which is beneficial to the overall structure design of the product, especially beneficial to the structure design of small products, and can better meet the needs of users; and since heat dissipation structures such as aluminum sheets are omitted, the assembly process of these heat dissipation structures and their connection processes with other structures can be saved, thereby improving the production efficiency of the product.

[0049] For the convenience of description, in the same multiplexed board, the outermost two electrical connection layers can be defined as the top layer and the bottom layer respectively. It can be that only the top layer or the bottom layer is a heat conduction layer. In a preferred embodiment, both the top layer and the bottom layer are heat conduction layers, that is, in the outermost two electrical connection layers among the multiple electrical connection layers, both are heat conduction layers and are both provided with an exposed area 3111. In this way, the heat can be transferred out faster. In this preferred embodiment, electrical connection structures can be provided only in the exposed area 3111 located in the top layer or the bottom layer, or electrical connection structures can be provided in the exposed areas 3111 located in both the top layer and the bottom layer at the same time. That is to say, in the same multiplexed board, some exposed areas 3111 can only expose the multiplexed board, and no electronic components are connected in this area. Among them, the above top and bottom are based on Figure 4The description of the placement position in the figure, the upper part of the figure is the top, and the lower part of the figure is the bottom.

[0050] It should be noted that there can be one, two or more exposed areas 3111. Each exposed area 3111 can be provided with only one electrical connection structure or multiple electrical connection structures; the same exposed area 3111 can be provided with only the first electrical connection structure 312 or the second electrical connection structure 313, or can be provided with both the first electrical connection structure 312 and the second electrical connection structure 313 at the same time. Refer to Figure 5 ; Of course, other electrical connection structures can also be provided in the exposed area 3111. When the first electrical connection structure 312 is provided on the reuse board, preferably, each first electrical connection structure 312 is located within the exposed area 3111. In this way, on the reuse board, a dedicated installation area (i.e., the exposed area 3111) for the first electronic components 1 with high power and serious heat generation is provided to improve the heat dissipation efficiency of these electronic components, and thus ensure the performance of the entire circuit assembly 102.

[0051] Furthermore, there can be only one exposed area 3111 on the same heat conduction layer, or multiple exposed areas 3111 can be provided. Similarly, in this embodiment, among the same heat conduction layers, some exposed areas 3111 can be provided with electrical connection structures, and some exposed areas 3111 can be not provided with electrical connection structures.

[0052] It should be noted that when the heat of the electronic components is transferred to the exposed area 3111, part of the heat will not be directly dissipated through the exposed area 3111, but will first be conducted to the unexposed part of the heat conduction layer and then dissipated from the edge of the heat conduction layer. Although this part of the heat is relatively small, it still prolongs the heat dissipation path and affects the heat dissipation efficiency. To solve this problem, in a preferred embodiment of the present invention, refer to Figure 4 、 Figure 5 , at least one exposed area 3111 extends to the edge of the reuse board. After such a setting, the heat transferred to the exposed area 3111 can not only dissipate the heat as soon as possible through its main surface, but also enable as much heat as possible to reach the edge of the heat conduction layer without passing through the unexposed part of the heat conduction layer, so as to further improve the heat dissipation efficiency of the entire reuse board. Preferably, each exposed area 3111 extends to the edge of the reuse board, especially the exposed areas 3111 provided with the first electrical connection structure 312 extend to the edge of the reuse board to better improve the heat dissipation efficiency of the entire reuse board.

[0053] Each of the above-mentioned exposed areas 3111 can be of any shape, such as circular, square, strip-shaped, oval or other irregular-shaped structures. Preferably, at least one exposed area 3111 extends along the edge of the reuse board. That is to say, at least one exposed area 3111 is of a strip-shaped structure, and its length direction is the same as the extension direction of the edge of the reuse board. For example, when the reuse board is circular, the extension direction of its edge is the direction where the edge arc of the reuse board is located; when the reuse board is square, the extension direction of its edge is the extension direction of one side of the square or the direction from one side to another side. Obviously, this structure of the exposed area 3111 is more conducive to the arrangement of electronic components when multiple electrical connection structures are provided at the same time.

[0054] Preferably, a plurality of first electrical connection structures 312 are provided in the same exposed area 3111. Especially in the embodiment where the first electrical connection structure 312 includes transistors, a plurality of transistors are connected simultaneously on the same exposed area 3111. In the actual production of circuit components, multiple transistors are often concentrated together to form a transistor group, and the transistor group is surface-mounted on the exposed area 3111 using SMT technology. Generally, this surface-mounted transistor itself has a metal heat dissipation structure, and after surface mounting, the metal heat dissipation structure is attached to the first electrical connection structure 312 to more directly transfer the heat of the transistor.

[0055] In order to better improve the heat dissipation efficiency of the transistor group, in the direction perpendicular to the circuit board, the area of the projection of the same exposed area 3111 is greater than or equal to ten times the sum of the areas of the projections of each transistor connected thereto. That is to say, the area of the projection of the exposed area 3111 can be defined as the first area, and the sum of the areas of the projections of each transistor connected to the exposed area 3111 (i.e., the projection area of the transistor group or it can also be only the projection area of one transistor) is defined as the second area, then the first area is equal to or greater than ten times the second area.

[0056] It should be noted that although the heat dissipation efficiency of the transistor is significantly improved through the exposed area 3111, other first electronic components 1 such as transformers and bridges can also be directly connected to the first electrical connection structure 312 of the exposed area 3111 to improve their heat dissipation efficiency. Specifically, the area of the exposed area 3111 can be set according to information such as the power of the electronic components connected thereto.

[0057] In the above embodiments, there may be only one reuse board in the circuit board unit 3, or there may be multiple ones, such as two, three or more. In a preferred embodiment, there are at least two reuse boards. One of them is defined as the first board 31, and the other is defined as the second board 32. The first board 31 and the second board 32 can be electrically connected through wires. However, in this way, it is inevitable that multiple wires will come into contact with each other, which may cause signal interference between the two; especially when there are many connecting wires between the first board 31 and the second board 32, this problem is particularly prominent and is not conducive to the overall layout of the entire space. To solve the above problems, in a preferred embodiment of the present invention, as Figure 5 shown, in the first board 31 and the second board 32, one is provided with a first electrical slot 314, and the other is provided with a first electrical pin (not shown in the figure). The first board 31 and the second board 32 can be plugged and matched through the first electrical slot 314 and the first electrical pin to form an electrical connection, as Figure 5 shown in the embodiment, the first board 31 is provided with a first electrical slot 314, and the second board 32 is provided with a first electrical pin. After such a setting, there are no wires between the interconnected reuse boards, and the signal connection is directly achieved through the plugging method, thereby avoiding signal interference due to wire entanglement and being conducive to the overall layout of the circuit components 102. Among them, the first electrical slot 314 has a plurality of jacks, and the first electrical pin has a plurality of pins. When the first electrical slot 314 and the first electrical pin are plugged and matched, the plurality of jacks and the plurality of pins are plugged and matched one by one. The specific structures of the jacks and the pins are not limited in the present invention, as long as the two can cooperate with each other to achieve signal connection.

[0058] The extended surfaces of the first board 31 and the second board 32 can be coplanar, or the extended surfaces of the two can be perpendicular or inclined to each other. Preferably, the extended surfaces of the two are perpendicular to each other, that is, the first board 31 and the second board 32 are perpendicularly arranged, as Figure 5 shown. Especially when the circuit board unit 3 is applied to the computer power supply 100, the first board 31 can be arranged parallel to the bottom surface of the housing 101. Correspondingly, the second board 32 is parallel to the height direction of the housing 101. Refer to Figure 2 、 Figure 3 . In this way, the two reuse boards can form a relatively large space to facilitate the arrangement of electronic components thereon and the setting of other components in the computer power supply 100. Further, among the first board 31 and the second board 32, the second board 32 is vertically arranged and located above the first board 31 so that the second board 32 is more reliably connected to the first board 31 under the action of gravity.

[0059] Regardless of how the second boards 32 are arranged, there can be one or multiple second boards 32. When there are multiple second boards 32, they can be parallel to each other, perpendicular to each other in pairs, or arranged in other ways. In this embodiment, multiple first electrical slots or first electrical pins are provided on the first board 31 to be respectively connected to the multiple second boards 32. In this way, especially when the circuit component 102 includes multiple first electronic components 1, the multiple first electronic components 1 can be dispersed on different multiplex boards to avoid over-concentration of heat, further improving the heat dissipation efficiency of the entire circuit component 102; and it can minimize the mutual interference between the first electronic components 1 as much as possible and is beneficial to the spatial arrangement of the entire circuit component 102.

[0060] It can be understood that in the embodiment where there are multiple circuit boards, all the circuit boards can be multiplex boards. However, for some circuit boards, all the electronic components on them are second electronic components 2 with relatively low heat generation. To save costs, these circuit boards can be made of general-purpose boards, that is, among the multiple circuit boards, some are multiplex boards and some are general-purpose boards (not shown in the figure). That is, in the above embodiments, there is at least one circuit board that is a general-purpose board. A general-purpose board refers to an existing ordinary circuit board without a heat dissipation function's exposed area. The general-purpose board can be connected to the first board 31 or the second board 32. Specifically, among the general-purpose board and the multiplex board, one is provided with a second electrical slot (not shown in the figure), and the other is provided with a second electrical pin (not shown in the figure). The two are plugged and matched through the second electrical slot and the second electrical pin to form an electrical connection. For example, the general-purpose board is provided with a second electrical slot and the multiplex board is provided with a second electrical pin; or the general-purpose board is provided with a second electrical pin and the multiplex board is provided with a second electrical slot. Among them, the specific structures of the second electrical slot and the second electrical pin can refer to the structures of the first electrical slot and the first electrical pin, and will not be elaborated here.

[0061] Continue to refer to Figure 1 、 Figure 2 As shown in, the housing 101 includes a middle housing 1011, a front housing 1012, and a rear housing 1013. The middle housing 1011 is a hollow structure, such as a cylindrical or square tube structure, and its two end faces can be flat or inclined. Among them, the inclined face refers to being inclined relative to its through direction. Of course, other structures can also be provided on the end faces of the middle housing 1011. The two ends of the middle housing 1011 are respectively buckled with the front housing 1012 and the rear housing 1013. Specifically, the front housing 1012 and the rear housing 1013 can be connected to the middle housing 1011 by means of screws or snap connections.

[0062] When the circuit component 102 is installed in the housing 101, it can be connected by means of screws, snap connections, adhesives, etc. For example, first install the circuit component 102 on the middle housing 1011, and then buckle the front housing 1012 and the rear housing 1013.

[0063] In a preferred embodiment, a first guide groove 1014 is provided in the housing 101. There are multiple circuit boards which are connected to each other. At least one of them is a multiplexing board, and one of the multiplexing boards is inserted into the first guide groove 1014. That is, the circuit component 102 is inserted and fitted with the housing 101 to facilitate the installation of the circuit component 102, thereby improving the stability of the circuit component 102. As Figure 2 shown, when the middle housing 1011 is provided, the first guide groove 1014 can be provided in the middle housing 1011. Specifically, the first guide grooves 1014 can be respectively provided on two opposite side walls of the middle housing 1011, and the openings of the two first guide grooves 1014 are oppositely arranged so that the multiplexing board (such as the first board 31 in the figure) can be inserted into the two first guide grooves 1014 at the same time, further increasing the reliability of the installation of the circuit component 102. It is also possible to provide the first guide groove 1014 only on one side wall of the middle housing 1011 and provide a support structure on the opposite side wall. At this time, one side of the first board 31 is inserted into the first guide groove 1014, and the other side is supported on the support structure. Of course, the first guide groove 1014 can also adopt other structures, such as being directly formed by the support structure.

[0064] When installing the circuit component 102 in the housing 101, in order to conduct the heat of the circuit board, especially the heat conducted to the exposed area 3111, out as soon as possible, a gap is left between the main surfaces of each circuit board (referring to the two relatively large opposite surfaces of the circuit board, and usually the electrical connection structure is arranged on these two surfaces) and the housing 101. Especially when the top layer and the bottom layer of the first board 31 are both heat-conducting layers, referring to Figure 2 , a gap is left between the first board 31 and the bottom surface of the housing 101. In this way, the heat conducted out from the exposed area 3111 at the bottom layer can circulate as soon as possible, thereby increasing the heat dissipation efficiency of the circuit component 102. Of course, some circuit boards can also be directly attached to the housing 101. Especially when the housing 101 is a metal housing, the heat can be transferred to the housing 101 as soon as possible.

[0065] To increase the heat dissipation efficiency of the circuit component 102, heat dissipation holes 1015 are provided on the housing 101. For example, the heat dissipation holes 1015 can be provided in the middle housing 1011 and the rear housing 1013. Referring to Figure 1 、 Figure 2 shown, a fluid channel is formed between the exposed area 3111 of the circuit component 102 and the heat dissipation holes 1015 to conduct the heat conducted out from the exposed area 3111 out of the housing 101 as soon as possible.

[0066] Furthermore, the computer power supply 100 further includes a fan 103 to form an air flow in the fluid channel and accelerate the air flow in the housing 101. Specifically, the fan 103 can be connected to the housing 101 by means of screw connection, snap connection, etc. In one embodiment, referring to Figure 2, the housing 101 is provided with a second guide groove 1016; the fan 103 is inserted into the second guide groove 1016. Among them, the structure of the second guide groove 1016 can refer to the structure of the first guide groove 1014, and the installation method of the housing 101 and the fan 103 can refer to the installation method of the housing 101 and the circuit component 102.

[0067] In one embodiment, the fan 103 and the circuit component 102 are connected by wires to provide power for the fan 103 through the circuit component 102. However, this wire connection will increase the wire harness in the housing 101, which may cause interference between the signals transmitted by each wire. Especially when there are too many wires, the wires will be entangled with each other, resulting in failures and affecting the normal operation of the computer power supply 100. Therefore, in another embodiment, the fan 103 and the circuit component 102 are connected in a wire-free manner. Specifically, at least one multiplexing board forms a non-zero angle with the insertion direction of the fan 103. For example, the multiplexing board is perpendicular to the insertion direction or is inclined relative to the insertion direction, and a third electrical connection structure 322 is provided on the multiplexing board, such as Figure 4 , Figure 5 As shown, a third electrical connection structure 322 is provided on the second board 32; correspondingly, the fan 103 is provided with a driving connection portion 1031. Among the driving connection portion 1031 and the third electrical connection structure 322, one includes spring pins and the other includes contacts. That is to say, spring pins can be provided on the second board 32 and contacts can be provided on the fan 103; or contacts can be provided on the second board 32 and spring pins can be provided on the fan 103. When the fan 103 is inserted into the second guide groove 1016, the spring pins and the contacts are pressed against each other so that the fan 103 forms an electrical connection with the multiplexing board. Obviously, by using this method of pressing the spring pins against the contacts, not only can the number of wires in the housing 101 be reduced, but also the contact reliability between the fan 103 and the circuit component 102 can be ensured through the elastic deformation of the spring pins.

[0068] Preferably, the multiplexing board electrically connected to the fan 103 is perpendicular to the insertion direction, and the multiplexing board (such as Figure 2 the second board 32 therein) and the driving connection portion 1031 are both located at the end of the fan 103 along the insertion direction, that is, the relative direction of the spring pins and the contacts is the same as the insertion direction, and at the end of the second guide groove 1016 along the insertion direction. In this way, the direction of the elastic deformation force of the spring pins is parallel to the insertion direction of the fan 103, so that the contact between the contacts and the spring pins is more reliable. Of course, the contacts and the spring pins can also be provided in the middle part of the second guide groove 1016.

[0069] When the circuit component 102 includes the first board 31 and the second board 32 at the same time, the circuit board electrically connected to the fan 103 is the second board 32. In the embodiment where the first guide groove 1014 is provided on the housing 101, it is preferred that the extending directions of the first guide groove 1014 and the second guide groove 1016 are parallel, and both are parallel to the insertion direction of the fan 103, so that the connection of the first board 31, the second board 32 and the fan 103 can be more reliable.

[0070] After the fan 103 is completely inserted into the second guide groove 1016, the fan 103 can be directly locked with the housing 101 through structures such as hooks, or the fan 103 can be pressed by the part of the housing 101 opposite to the second board 32, such as pressing it by the front housing 1012 or the rear housing 1013.

[0071] When the fan 103 is inserted into the second guide groove 1016, it is possible that the fan 103 is inserted too deep, causing excessive extrusion of the second board 32, resulting in deformation of the second board 32, affecting the reliability of the connection of the electronic components thereon, and even causing loosening or deformation of the connection position between the second board 32 and the first board 31, making the two unable to transmit electrical signals. To avoid the occurrence of the above problems, in a preferred embodiment of the present invention, the housing 101 is provided with a limiting structure 1017 in the insertion direction of the fan 103. When the fan 103 is completely inserted into the second guide groove 1016, that is, at the end of the stroke of the fan 103, the fan 103 abuts against the limiting structure 1017 to prevent the fan 103 from over-extruding the second board 32.

[0072] When the front housing 1012 is provided, the insertion direction is the same as the relative direction between the front housing 1012 and the rear housing 1013. The limiting structure 1017 may include a convex rib provided on the end face of the front housing 1012 or the rear housing 1013 close to the middle housing 1011. The convex rib may extend along the circumferential direction of the middle housing 1011. That is, when the insertion direction is the direction in which the rear housing 1013 points to the front housing 1012, the convex rib is provided on the front housing 1012, refer to Figure 3 ; when the insertion direction is the direction in which the front housing 1012 points to the rear housing 1013, the convex rib is provided on the rear housing 1013. In this setting method, the limiting structure 1017 is directly set as a convex rib, and the structure is simple and easy to manufacture.

[0073] Furthermore, the circuit board unit 3 further includes a limiting protrusion 33, and a multiplexing board electrically connected to the fan 103 (such as Figure 2The second board 32) in it is provided with a limiting protrusion 33, such as a limiting post, on the side facing away from the fan 103. It can be connected to the multiplex board by means such as welding, or can be installed on the second board 32 by means such as bonding and snap connection. When the circuit board unit 3 is installed in the housing 101, the limiting protrusion 33 abuts against the housing 101. With this structure, not only can the excessive extrusion of the fan 103 on the second board 32 be prevented, but also when the circuit board unit 3 is inserted into the first guide groove 1014, the insertion position can be restricted, which is beneficial to the assembly of other components.

[0074] It should be noted that the circuit board connected to the fan 103 can also be the first board 31, or directly a general board, and the electrical connection can also be achieved by the way of pressing the spring feet against the contacts. In the embodiment where the circuit board unit 3 includes a general board, the general board can also be inserted and matched with the first guide groove 1014.

[0075] In addition, the housing 101 can also be integrally formed by one of the front housing 1012 and the rear housing 1013 and the middle housing 1011, and then connected to the other by means such as screw connection or snap connection; of course, the housing 101 can also adopt other structures.

[0076] In addition, the circuit board unit 3 and the circuit assembly 102 described in the present invention are not limited to being applied to the computer power supply 100, and it can also be applied to other electronic devices.

[0077] Those skilled in the art can understand that on the premise of no conflict, the above preferred solutions can be freely combined and superimposed.

[0078] It should be understood that the above embodiments are merely exemplary and not restrictive. Without departing from the basic principles of the present invention, various obvious or equivalent modifications or substitutions made by those skilled in the art to the above details will be included within the scope of the claims of the present invention.

Claims

1. A circuit board unit includes at least one circuit board, the circuit board includes multiple electrically connected layers stacked on top of each other, and the circuit board is provided with an electrical connection structure for connecting electronic components; characterized in that, At least one of the circuit boards is a multiplexing board. Among the outermost two electrical connection layers of the multiplexing board, at least one of the electrical connection layers is a heat-conducting layer. The heat-conducting layer is a copper foil layer, and the heat-conducting layer has an exposed area that exposes the multiplexing board. In the multiplexing board, at least part of the electrical connection structure is located within the exposed area. There are multiple exposed areas provided on the same heat-conducting layer, and each of the exposed areas extends to the edge of the multiplexing board. Some of the exposed areas are provided with electrical connection structures, and some of the exposed areas are not provided with electrical connection structures. The electrical connection structure includes a first electrical connection structure, which is used to connect a first electronic component among the electronic components. The first electronic component includes a transistor. Multiple transistors are connected to the same exposed area simultaneously. In the direction perpendicular to the circuit board, the area of the projection of the same exposed area is greater than or equal to ten times the sum of the areas of the projections of the transistors connected thereto.

2. The circuit board unit according to claim 1, wherein At least one of the exposed areas extends along the edge of the multiplexing board.

3. The circuit board unit according to claim 1, wherein At least two multiplexing boards are provided. Define one of them as the first board and the other as the second board. Among the first board and the second board, one is provided with a first electrical socket, and the other is provided with a first electrical pin. The two can be plugged and matched through the first electrical socket and the first electrical pin to form an electrical connection.

4. The circuit board unit according to claim 3, characterized in that The first board and the second board are perpendicularly arranged. And / or Multiple second boards are provided.

5. The circuit board unit according to any one of claims 1-4, characterized in that, Multiple circuit boards are provided. At least one circuit board is a general-purpose board. Among the general-purpose board and the multiplexing board, one is provided with a second electrical socket, and the other is provided with a second electrical pin. The two are plugged and matched through the second electrical socket and the second electrical pin to form an electrical connection.

6. A circuit component, characterized in that, It includes electronic components and the circuit board unit according to any one of claims 1-5, and the electronic components are connected to the electrical connection structure.

7. The circuit component according to claim 6, wherein A plurality of electronic components are provided. Among them, some of the electronic components are first electronic components. The first electronic components include at least one of a transistor, a transformer, and a bridge. The electrical connection structure corresponding to the first electronic components is a first electrical connection structure, and each of the first electrical connection structures is located within the exposed area.

8. The circuit component according to claim 7, wherein The first electronic component includes a transistor. Multiple transistors are connected to the same exposed area. In the direction perpendicular to the circuit board, the area of the projection of the exposed area is greater than or equal to ten times the sum of the areas of the projections of the transistors connected thereto.

9. A computer power supply, characterized in that, It includes a housing and the circuit assembly according to any one of claims 6-8, and the circuit assembly is installed within the housing.

10. The computer power supply according to claim 9, characterized in that, A first guide groove is provided within the housing. Multiple circuit boards are provided and are interconnected. At least one circuit board is a multiplexing board, and one of the multiplexing boards is inserted into the first guide groove. And / or, a gap is left between the main surface of each circuit board and the housing.

11. The computer power supply according to claim 9 or 10, characterized in that, The shell is provided with a heat dissipation hole and a second guide groove, and a fluid channel is formed between the exposed area and the heat dissipation hole; It also includes a fan to form an airflow in the fluid channel; the fan is inserted into the second guide groove.

12. The computer power supply according to claim 11, wherein The electrical connection structure includes a third electrical connection structure, at least one of the multiplexing boards forms a non-zero angle with the insertion direction of the fan, and the third electrical connection structure is provided on the multiplexing board; The fan is provided with a driving connection part, wherein one of the driving connection part and the third electrical connection structure includes a spring foot and the other includes a contact point, and the spring foot presses against the contact point to form an electrical connection.

13. The computer power supply according to claim 12, wherein, The multiplexing board electrically connected to the fan is arranged perpendicular to the insertion direction, and the multiplexing board and the driving connection part are both located at the end of the fan along the insertion direction.

14. The computer power supply according to claim 13, wherein A multiplexing board electrically connected to the fan is provided with a limiting protrusion on a side facing away from the fan, and the limiting protrusion abuts against the shell.

15. The computer power supply according to claim 11, wherein The shell is provided with a limiting structure in the insertion direction of the fan, and the fan abuts against the limiting structure.

16. The computer power supply according to claim 15, characterized in that, The shell includes a middle shell, a front shell and a rear shell. The middle shell is a hollow structure, and its two ends are respectively buckled with the front shell and the rear shell; the insertion direction is consistent with the relative direction of the front shell and the rear shell, and the limiting structure includes a convex ridge arranged on the end surface of the front shell or the rear shell close to the middle shell.

17. A computer, characterized in that, Comprising a computer power supply as described in any one of claims 9-16.

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