A processing device for thin plates

Abstract

The present invention discloses a processing device applied to a thin plate, comprising a base plate, wherein a plurality of working cavities are arranged in the base plate, the working cavities are L-shaped and openings are arranged on both sides of the working cavities, the working cavity is formed by a first cavity arranged horizontally and a second cavity arranged vertically; a vacuum suction cup; a processing unit, the processing unit is arranged in the working cavity, the processing unit comprises a rotating rod and a lifting column, the rotating rod is arranged in the first cavity, a rotating portion is arranged on one end of the rotating rod, and an inclined first end face is arranged on the other end, the lifting column is vertically arranged in the second cavity and abuts against the rotating rod, a pressing portion is arranged on one end of the lifting column, and an inclined second end face is arranged on the other end, wherein when the rotating portion is rotated, the lifting column will extend upward along the openings on the second cavity under the action of the rotating rod, the thin plate processed by the processing device has good flatness, and the structure is simple, easy to operate, and the user experience is good, which effectively improves the overall work efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of thin plate flatness, and in particular to a processing device applied to a thin plate. Background Art

[0002] With the increasing number of precision instruments, the demand for precision thin plate parts is also increasing. Precision metal sheets are widely used, not only in mechanical production, but also in industry, life and other fields. However, due to the raw material problems of the metal sheet itself, some errors in the production process, or collisions during transportation, uneven areas may appear on the surface of the metal sheet. These convex points greatly affect the overall flatness of the sheet surface and affect the subsequent finishing.

[0003] Most of the existing processing devices for dealing with the above situation have very complex structures, are difficult to operate, and are time-consuming. They are inconvenient for users to use, which greatly affects the overall work efficiency.

[0004] Therefore, it is necessary to develop a new processing device. Summary of the invention

[0005] The purpose of the present invention is to provide a processing device for use on thin plates to solve the shortcomings of the background technology. The thin plates processed by the processing device have good flatness, simple structure, easy operation, good user experience, and effectively improve overall work efficiency.

[0006] In order to achieve the above object, the technical solutions of the present invention are:

[0007] A processing device applied to a thin plate comprises: a substrate, a plurality of working cavities are arranged in the substrate, the working cavities are L-shaped and both sides of the working cavities are provided with openings, the working cavities are formed by a first cavity arranged horizontally and a second cavity arranged vertically; a vacuum suction cup, the vacuum suction cup is arranged above the substrate, the vacuum suction cup is used to fix the workpiece to be processed at a position close to the top of the substrate; a processing unit, the processing unit is arranged in the working cavity, the processing unit comprises a rotating rod and a lifting column, the rotating rod is arranged in the first cavity, one end of the rotating rod is provided with a rotating part, and the other end has a An inclined first end face, a first farthest point is provided on the first end face at a position farthest from the rotating part, the lifting column is vertically arranged in the second cavity and abuts against the rotating rod, one end of the lifting column is provided with a pressing part, and the other end has an inclined second end face, a second farthest point is provided on the second end face at a position farthest from the pressing part, in an initial state, the second end face and the first end face are in contact with each other, and the first farthest point and the second farthest point coincide with each other; wherein, when the rotating part is rotated, the lifting column will extend upward along the opening on the second cavity under the action of the rotating rod.

[0008] The present invention is a processing device applied to a thin plate, and its beneficial effects are as follows: 1. The uneven position on the thin plate can be effectively and quickly repaired through the action of the jacking column. The whole process only requires driving the vacuum suction cup to move the thin plate workpiece to be processed to the top of the jacking column, and the raised position on the thin plate is aligned with the jacking column. The user only needs to rotate the rotating part to make the rotating rod drive the jacking column to rise and flatten the raised position on the thin plate, thereby effectively improving the flatness of the thin plate; 2. The operation is simple, and the flatness of the thin plate can be repaired by rotating the rotating rod.

[0009] Furthermore, the working chambers are arranged in a rectangular array on the substrate, and the distance between the lifting columns in the working chamber and the center of the substrate in the horizontal or vertical direction is half of the distance from the center of the substrate to the edge of the substrate.

[0010] Furthermore, a central cavity is provided on the substrate, which is L-shaped and formed by a horizontally arranged third cavity and a vertically arranged fourth cavity, the third cavity is longer than the first cavity, the fourth cavity is arranged at the center of the substrate, the processing unit is arranged in the central cavity, the rotating rod is arranged in the third cavity, the lifting column is arranged in the fourth cavity, and the lifting column is located at the center of the substrate.

[0011] Furthermore, the central cavity is arranged between two adjacent working cavities.

[0012] Furthermore, when the rotating rod is disposed in the first cavity, in an initial state, the rotating portion extends outward along an opening on the first cavity.

[0013] Furthermore, the exterior of the rotating part has a threaded structure.

[0014] Furthermore, the pressing portion is hemispherical.

[0015] Furthermore, the first end surface is elliptical.

[0016] Furthermore, the second end surface is elliptical. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is the structural diagram of the processing device;

[0018] Figure 2 This is a schematic diagram of the installation of the processing unit in the working chamber. DETAILED DESCRIPTION

[0019] A processing device for thin plates according to the present invention will be described with reference to the accompanying drawings.

[0020] like Figure 1-Figure 2 As shown, as a preferred embodiment of the present invention:

[0021] A processing device applied to a thin plate comprises: a substrate 1, wherein a plurality of working cavities 2 are arranged in the substrate 1, wherein the working cavities 2 are L-shaped and openings are arranged on both sides of the working cavities 2, wherein the working cavities 2 are formed by a horizontally arranged first cavity 21 and a vertically arranged second cavity 22, wherein the first cavity 21 and the second cavity 22 are connected to each other; a vacuum suction cup (not shown), wherein the vacuum suction cup is arranged above the substrate 1, and wherein the vacuum suction cup is used to fix a workpiece to be processed at a position close to the top of the substrate 1; and a processing unit, wherein the processing unit is arranged in the working cavity 2, and wherein the processing unit comprises a rotating rod 3 and a lifting column 4, wherein the rotating rod 3 is arranged in the first cavity 21, wherein one end of the rotating rod 3 is provided with a rotating portion 31, and the other end of the rotating rod 3 is provided with a rotating portion 31. It has an inclined first end face 32, and a first farthest point 33 is provided on the first end face 32 at a position farthest from the rotating part 31. The lifting column 4 is vertically arranged in the second cavity 22 and abuts against the rotating rod 3. A pressing portion 41 is provided at one end of the lifting column 4, and an inclined second end face 42 is provided on the other end, and a second farthest point 43 is provided on the second end face 42 at a position farthest from the pressing portion 41. In an initial state, the second end face 42 and the first end face 32 are in contact with each other, and the first farthest point 33 and the second farthest point 43 are overlapped; wherein, when the rotating part 31 is rotated, the lifting column 4 will extend upward along the opening on the second cavity 22 under the action of the rotating rod 3.

[0022] Among them, the matching relationship between the rotating rod 3 and the lifting rod is as follows: first, the first end face 32 rotates with the rotating rod 3, and the first end face 32 is elliptical. During the rotation process, the position on the first end face 32 close to the first farthest point 33 (here the position is referred to as position A), position A makes a circular motion driven by the rotating rod 3, and in addition, the first end face 32 and the second end face 42 are in contact with each other in the initial state, that is, position A is against the second end face 42 of the lifting rod, so position A will lift the lifting column 4 during the circular motion, when position A moves to the highest point, the lifting column 4 will be pushed upward to the highest point, when position A moves to the lowest point, the position of the lifting column 4 is at the top, at this time, the first farthest point 33 and the second farthest point 43 coincide.

[0023] It should be noted that the inner diameter of the second cavity 22 is equivalent to the diameter of the jacking column 4, so that the jacking column 4 can be compactly installed in the second cavity 22, ensuring that the first end surface 32 of the rotating rod 3 can effectively lift the jacking column 4 when rotating.

[0024] The workpiece to be processed refers to a thin plate.

[0025] The first end surface 32 is elliptical.

[0026] In addition, in order to make the lifting column 4 better cooperate with the rotating rod 3, the second end surface 42 is also elliptical.

[0027] The working process of this processing device is as follows:

[0028] First, determine the uneven position on the thin plate, where the uneven position refers to the convex part;

[0029] Then, under the action of the vacuum suction cup, the raised part is aligned with the lifting column 4. The principle here is: since the thin plate under the vacuum suction cup is fixed, the lifting column 4 can press down the raised part to form a flat surface on the surface of the thin plate. Moreover, if the problem cannot be repaired by pressing once, the problem can be solved by pressing multiple times.

[0030] Finally, the rotating rod 3 is rotated to lift up the lifting column 4, and the uneven position on the thin plate is pressed to realize the repair process of the thin plate.

[0031] In this embodiment, the working chamber 2 is arranged in a rectangular array on the substrate 1, and the distance between the lifting column 4 in the working chamber 2 and the center of the substrate 1 in the horizontal or vertical direction is half of the distance from the center of the substrate 1 to the edge of the substrate 1. The purpose of this arrangement is to increase the processable area so that the protrusions at various positions of the thin plate can have corresponding lifting columns 4 corresponding to them, thereby effectively improving work efficiency.

[0032] Moreover, the arrangement of the working chamber is not limited to a rectangular array arrangement, and a circular array, a square array or even an irregular arrangement is also possible. This arrangement needs to be determined according to the needs of the user.

[0033] In order to further increase the processable area, a central cavity is further provided on the substrate 1. The central cavity is L-shaped and is formed by a third cavity arranged horizontally and a fourth cavity arranged vertically. The third cavity is longer than the first cavity 21. The fourth cavity is arranged at the center of the substrate 1. The processing unit is arranged in the central cavity. The rotating rod 3 is arranged in the third cavity. The length of the rotating rod 3 in the third cavity is longer than the rotating rod 3 in the first cavity 21. The lifting column 4 is arranged in the fourth cavity and is located at the center of the substrate 1. The length of the lifting column 4 in the fourth cavity is the same as that of the lifting column 4 in the second cavity 22. Arranging the processing unit at the center of the substrate 1 can effectively make up for the processing dead angle and improve efficiency.

[0034] Furthermore, the central cavity is disposed between two adjacent working cavities 2 , and in this embodiment, only one central cavity is provided.

[0035] Among them, the central cavity is similar to the working cavity 2. The difference between the two is the size and location of the cavity for installing the rotating rod 3. Moreover, there is only one central cavity, and the position of the fourth cavity is exactly located at the center of the substrate 1.

[0036] Preferably, when the rotating rod 3 is disposed in the first cavity 21 , in an initial state, the rotating portion 31 extends outward along an opening on the first cavity 21 .

[0037] In order to facilitate the rotation of the user, the rotating part 31 has a thread structure on the outside. In addition, the thread structure can be used in conjunction with other tools to increase the power during rotation, so that the jacking column 4 can flatten the thin plate more powerfully and effectively.

[0038] Since the surface area of ​​the protrusion on the thin plate is very small, in order to improve the accuracy of pressing, the pressing portion 41 is hemispherical. The hemispherical surface can effectively press down the protrusion on the thin plate.

[0039] According to the disclosure and teaching of the above description, those skilled in the art to which the present invention belongs may also make changes and modifications to the above embodiments. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and some modifications and changes to the present invention should also fall within the scope of protection of the claims of the present invention. In addition, although some specific terms are used in this specification, these terms are only for the convenience of description and do not constitute any limitation to the present invention.

Claims

1. A processing device applied to a thin plate, characterized in that: include: A substrate, wherein a plurality of working cavities are arranged in the substrate, the working cavities are L-shaped and both sides of the working cavities are provided with openings, and the working cavities are formed by a horizontally arranged first cavity and a vertically arranged second cavity; A vacuum suction cup, which is arranged above the substrate and is used to fix the workpiece to be processed at a position close to the top of the substrate; A processing unit, wherein the processing unit is arranged in the working chamber, and the processing unit comprises a rotating rod and a lifting column, wherein the rotating rod is arranged in the first chamber, a rotating portion is arranged on one end of the rotating rod, and a first inclined end face is arranged on the other end, and a first farthest point is arranged on the first end face at a position farthest from the rotating portion, the lifting column is vertically arranged in the second chamber and abuts against the rotating rod, a pressing portion is arranged on one end of the lifting column, and a second inclined end face is arranged on the other end, and a second farthest point is arranged on the second end face at a position farthest from the pressing portion, and in an initial state, the second end face and the first end face are in contact with each other, and the first farthest point and the second farthest point are overlapped; Wherein, when the rotating part is rotated, the lifting column will extend upward along the opening on the second cavity under the action of the rotating rod, the working cavity is arranged in a rectangular array on the substrate, and the distance between the lifting column in the working cavity and the center of the substrate in the horizontal or vertical direction is half of the distance from the center of the substrate to the edge of the substrate. A central cavity is also provided on the substrate, which is L-shaped and formed by a horizontally arranged third cavity and a vertically arranged fourth cavity. The third cavity is longer than the first cavity, and the fourth cavity is arranged at the center of the substrate. The processing unit is arranged in the central cavity, the rotating rod is arranged in the third cavity, the lifting column is arranged in the fourth cavity, and the lifting column is located at the center of the substrate. When the rotating rod is arranged in the first cavity, in the initial state, the rotating part extends outward along the opening on the first cavity.

2. The processing device for thin plates according to claim 1, characterized in that: The central cavity is arranged between two adjacent working cavities.

3. The processing device for thin plates according to claim 1, characterized in that: The rotating part has a thread structure on the outside.

4. The processing device for thin plates according to claim 1, characterized in that: The pressing portion is hemispherical.

5. The processing device for thin plates according to claim 1, characterized in that: The first end surface is elliptical.

6. The processing device for thin plates according to claim 1, characterized in that: The second end surface is elliptical.

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