Die bonding apparatus

Abstract

The application discloses a die bonding equipment, which comprises a rack and a plurality of die bonding mechanisms; the plurality of die bonding mechanisms are arranged in parallel and are spaced apart from each other on the rack; each die bonding mechanism comprises a wafer disc, a top pin and a top pin; the wafer disc is movably connected to the rack and is used for bonding a wafer; the top pin is movably connected to the rack, is arranged above the wafer disc and is spaced apart from the wafer disc; a positioning member is arranged on the rack and is located on a side of the top pin which is away from the wafer disc; the positioning member has a die bonding position and is used for placing a die bonding substrate; when the wafer disc moves to above the die bonding position of the positioning member, the positioning member is provided with the die bonding substrate, and the wafer of the wafer disc is lowered by the top pin so that the wafer is in abutment with the die bonding substrate. The technical scheme of the application improves production efficiency.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of die bonding equipment, in particular to a die bonding equipment. BACKGROUND

[0002] At present, the die bonding device is single die bonding device for positioning and bonding of wafer, which leads to low production efficiency and does not meet the production capacity demand.

[0003] The above content is only used to assist in understanding the technical solutions of the present application, and does not mean that the above content is prior art. SUMMARY

[0004] The main purpose of the present application is to provide a die bonding equipment, which aims to improve the production efficiency.

[0005] In order to achieve the above purpose, the present application provides a die bonding equipment, which comprises:

[0006] A rack; and

[0007] A plurality of patch mechanisms are arranged in parallel and spaced apart on the rack;

[0008] Each patch mechanism comprises:

[0009] A wafer disc movably connected to the rack, the wafer disc being used for bonding wafer;

[0010] A thimble movably connected to the rack, the thimble being located above the wafer disc and being spaced apart from the wafer disc; and

[0011] A positioning member arranged on the rack and located on the side of the thimble away from the wafer disc, the positioning member having a patch position, the positioning member being used for placing a patch substrate;

[0012] When the wafer disc moves above the patch position of the positioning member, the positioning member has the patch substrate, and the thimble drives the wafer disc to descend, so that the wafer is in contact with the patch substrate.

[0013] In an embodiment, the patch mechanism further comprises a first driving assembly, a horizontal plate and a vertical plate; the horizontal plate is slidably connected to the rack, the vertical plate is slidably connected to the horizontal plate on the side away from the rack, and the wafer disc is detachably connected to the vertical plate on the side away from the horizontal plate.

[0014] In an embodiment, the first driving assembly comprises:

[0015] A first motor arranged on the rack;

[0016] A first screw rod is connected with an output shaft of the first motor; the horizontal plate is slidingly connected with the first screw rod;

[0017] A second motor is arranged on the horizontal plate; and

[0018] A second screw rod is connected with an output shaft of the second motor; the vertical plate is slidingly connected with the second screw rod;

[0019] The first motor drives the first screw rod to move the horizontal plate on the rack, and the second motor drives the second screw rod to move the vertical plate on the horizontal plate.

[0020] In an embodiment, the positioning member is a positioning cylinder, the positioning cylinder is provided with an inner cavity and a through hole communicating with the inner cavity, the extending direction of the through hole is consistent with the extending direction of the ejector pin, and the through hole penetrates through the positioning cylinder; an end of the through hole close to the wafer disc is provided with a transparent sheet arranged opposite to the die position, and the transparent sheet is used for abutting against the ejector pin.

[0021] In an embodiment, the die bonding apparatus further comprises an anti-collision mechanism connected with the periphery of the ejector pin, the horizontal plate and the vertical plate are both provided with a through hole, and the anti-collision mechanism is arranged in a spaced manner with the edge of the through hole, and the anti-collision mechanism is used for pre-touching the hole wall of the through hole.

[0022] In an embodiment, the die bonding apparatus further comprises a plurality of second driving assemblies, each of the second driving assemblies comprises:

[0023] A third motor is arranged on the rack, the third motor penetrates through the horizontal plate; and

[0024] A ball screw rod, one end of the ball screw rod is connected with an output shaft of the third motor, the ball screw rod penetrates through the vertical plate, and the telescopic rod of the ball screw rod is connected with the ejector pin.

[0025] In an embodiment, the die bonding apparatus further comprises a plurality of first sensors, each of the first sensors is arranged on one of the third motors, and is arranged in a spaced manner with the ejector pin and the positioning member of each of the die bonding apparatuses, and the first sensor is used for detecting the relative position between the wafer disc and the ejector pin.

[0026] In an embodiment, the die bonding apparatus further comprises a plurality of second sensors arranged on the rack, each of the second sensors is arranged in a spaced manner with the ejector pin and the wafer disc of each of the die bonding apparatuses, and each of the second sensors is arranged opposite to the wafer disc; the second sensor is used for detecting whether there is a wafer in the wafer disc opposite to the die position.

[0027] In one embodiment, the die bonding apparatus further comprises a plurality of third sensors disposed on the frame, each of the third sensors is disposed opposite to one of the die bonding positions for detecting whether a wafer is present on the die bonding position.

[0028] In one embodiment, the die bonding apparatus further comprises a plurality of fourth sensors disposed on the frame, each of the fourth sensors is configured to detect whether a die bonding substrate is present on the die bonding position when the fourth sensor is disposed opposite to the die bonding position.

[0029] The die bonding apparatus of the present application is characterized in that a plurality of die bonding mechanisms are disposed on the frame in parallel and at intervals; the wafer disc and the needle of each of the die bonding mechanisms are movably connected to the frame, the needle is disposed above the wafer disc at intervals; a positioning member is disposed on the frame below the needle, the positioning member has a die bonding position; when the wafer disc is moved above the die bonding position of the positioning member, the needle drives the wafer disc to lower and abut against the die bonding substrate on the die bonding position, thereby eliminating the steps of sucking the wafer, turning the wafer and positioning the die bonding position in the existing die bonding apparatus, improving the die bonding efficiency and the die bonding precision. BRIEF DESCRIPTION OF DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from the structures shown in the drawings without creative labor.

[0031] Figure 1 FIG. 1 is a structure schematic view of one embodiment of the die bonding apparatus of the present application from one perspective;

[0032] Figure 2 FIG. 2 is a structure schematic view of another embodiment of the die bonding apparatus of the present application from another perspective;

[0033] Figure 3 FIG. 3 is a left view of the die bonding apparatus of the present application.

[0034] BRIEF DESCRIPTION OF DRAWINGS

[0035] Reference Name Reference Name 10 Patch mechanism 142 Second screw rod 11 Wafer disc 15 Horizontal plate 12 Top pin 16 Vertical plate 13 Positioning member / positioning cylinder 17 Support 13a Patch position 17a Mounting position 13b Inner cavity 50 First sensor 13c Perforation 60 Second sensor 14 First driving assembly 70 Third sensor 141 First screw rod 80 Fourth sensor

[0036] The implementation, functional features and advantages of the present application will be further described with reference to the embodiments and the drawings. DETAILED DESCRIPTION

[0037] Clearly, the described embodiments are only a part of the embodiments of the present application, but not all the embodiments. Based on the embodiments of the present application, all the other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present application.

[0038] It should be noted that all the direction indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are only used to explain the relative position relationship, movement condition, etc. between components in a certain posture (as shown in the drawings), and if the certain posture changes, the direction indications also change accordingly.

[0039] In addition, the descriptions involving "first", "second", etc. in the present application are only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In addition, the technical solutions of various embodiments can be combined with each other, but it must be based on the realization of those skilled in the art, and when the combination of technical solutions contradicts each other or cannot be realized, it should be considered that the combination of technical solutions does not exist, and is not within the protection scope of the present application.

[0040] The present application provides a die bonding equipment.

[0041] In the embodiments of the present application, with reference to Figures 1 to 3 The die bonding equipment comprises a rack and a plurality of die bonding mechanisms 10, the plurality of die bonding mechanisms 10 are arranged side by side and spaced apart on the rack; each die bonding mechanism 10 comprises a wafer disc 11, a thimble 12 and a positioning member 13; the wafer disc 11 is movably connected to the rack, and the wafer disc 11 is used for bonding a wafer; the thimble 12 is movably connected to the rack, and the thimble 12 is located above the wafer disc 11 and is spaced apart from the wafer disc 11; the positioning member 13 is arranged on the rack and located on the side of the thimble 12 away from the wafer disc 11, and the positioning member 13 has a die bonding position 13a, and the positioning member 13 is used for placing a die bonding substrate; when the wafer disc 11 moves above the die bonding position 13a of the positioning member 13, the thimble 12 drives the wafer of the wafer disc 11 to descend, so that the wafer abuts against the die bonding substrate.

[0042] In the embodiment, the wafer discs 11 of the plurality of patch mechanisms 10 are simultaneously moved to the specified positions, when it is determined that the wafer discs 11 are located at the specified positions, the plurality of ejector pins 12 corresponding to the wafer discs 11 are controlled, the plurality of wafers in the wafer discs 11 are simultaneously ejected and simultaneously attached to the patch substrate, and the attached product is obtained. That is, after the positions of the patch substrate and the wafer discs 11 are determined, the wafer discs 11 are moved to the specified positions, and the wafers in the wafer discs 11 are directly ejected to the patch substrate by the ejector pins 12, thereby eliminating the steps of sucking the wafers, turning over the wafers and positioning the attached positions in the existing die bonding equipment, improving the wafer attachment efficiency and improving the attachment precision.

[0043] The die bonding equipment of the embodiment further comprises a suction disc corresponding to the ejector pin 12. When the position of the wafer to be ejected is determined, the wafer attachment device further determines the size of the wafer to be ejected. It can be understood that there are various specifications of wafers, and each specification has different sizes. In actual application, common wafer specifications include 6-inch, 8-inch, 12-inch and the like. Since the size of the wafer is determined according to actual production needs, there are 6-inch wafers as one of raw materials this month and 8-inch wafers as one of raw materials next month, that is, there is a situation of changing wafers in actual production. In order to ensure that the production equipment is not affected, the die bonding equipment provided in the embodiment is modularized and has good universality when designed to adapt to wafers of various specifications. The production of wafers in the range of 0.2*0.2 to 2*2 mm does not require replacement of equipment components, thereby saving equipment costs.

[0044] The technical scheme of the present application comprises that a plurality of the patch mechanisms 10 are arranged side by side and spaced apart on the rack; the wafer disc 11 and the ejector pin 12 of each patch mechanism 10 are movably connected to the rack, and the ejector pin 12 is located above the wafer disc 11 and is spaced apart; the positioning member 13 is arranged below the ejector pin 12 on the rack, and the positioning member 13 has a patch position 13a; in this way, when the wafer disc 11 moves above the patch position 13a of the positioning member 13, the ejector pin 12 drives the wafer of the wafer disc 11 to descend and abut against the patch substrate located at the patch position 13a, thereby eliminating the steps of sucking the wafers, turning over the wafers and positioning the attached positions in the existing die bonding equipment, improving the wafer attachment efficiency and improving the attachment precision.

[0045] In an embodiment, referring to Figures 1 to 3 , the patch mechanism further comprises a first driving assembly 14, a horizontal plate 15 and a vertical plate 16; the horizontal plate 15 is slidably connected to the rack, the vertical plate 16 is slidably connected to a side of the horizontal plate 15 away from the rack, and the wafer disc 11 is detachably connected to a side of the vertical plate 16 away from the horizontal plate 15.

[0046] The first driving assembly 14 comprises a first motor, a first screw rod 141, a second motor and a second screw rod 142; the first motor is arranged on the frame; the first screw rod 141 is connected with the output shaft of the first motor, and the horizontal plate 15 is slidably connected with the first screw rod 141; the second motor is arranged on the horizontal plate 15, and the second screw rod is connected with the output shaft of the second motor; the vertical plate 16 is slidably connected with the second screw rod 142; the first motor drives the first screw rod 141 to drive the horizontal plate 15 to move on the frame, and the second motor drives the second screw rod 142 to drive the vertical plate 16 to move on the horizontal plate 15.

[0047] Specifically, the first screw rod 141 is slidably connected with a first sliding block, the first sliding block is connected with the horizontal plate 15; the second motor is arranged on the horizontal plate 15; the second screw rod 142 is connected with the output shaft of the second motor; the second screw rod 142 is slidably connected with a second sliding block, and the second sliding block is connected with the vertical plate 16; the first motor drives the horizontal plate 15 to move on the frame, and the second motor drives the vertical plate 16 to move on the horizontal plate 15. When the distance that the wafer disc 11 needs to move is detected, the first motor is controlled to rotate to drive the first screw rod 141 to rotate, and then drive the first sliding block to move along the first screw rod 141, so as to drive the horizontal plate 15 to move, thereby completing the adjustment of the wafer disc 11 in the horizontal direction; the second motor is controlled to rotate to drive the second screw rod 142 to rotate, and then drive the second sliding block to move along the second screw rod 142, so as to drive the vertical plate 16 to move, thereby completing the adjustment of the wafer disc 11 in the vertical direction, so that the wafer disc 11 and the patch substrate on the positioning member 13 are opposite. It can be understood that the first screw rod 141 extends along the horizontal direction of the horizontal plate 15, and the second screw rod 142 extends along the vertical direction of the horizontal plate 15, wherein the horizontal direction and the vertical direction are arranged at an angle of 90 degrees. The first driving assembly 14 further comprises a horizontal sliding rail and a vertical sliding rail; the horizontal sliding rail is arranged on the frame; the horizontal plate 15 is provided with a horizontal sliding block which is slidably connected with the horizontal sliding rail; the vertical sliding rail is arranged on the side of the horizontal plate 15 away from the horizontal sliding rail; the vertical plate 16 is provided with a vertical sliding block which is slidably connected with the vertical sliding rail. When the first motor drives the horizontal plate 15 to move and the second motor drives the vertical plate 16 to move, the horizontal sliding block of the horizontal plate 15 can slide relative to the horizontal sliding rail arranged on the frame, so that the horizontal plate 15 moves smoothly; and the vertical sliding block of the vertical plate 16 can slide relative to the vertical sliding rail arranged on the horizontal plate 15, so that the vertical plate moves more smoothly. It can be understood that the horizontal sliding rail extends along the horizontal direction of the horizontal plate 15, and the extending direction of the horizontal sliding rail is consistent with the extending direction of the first screw rod 141; the vertical sliding rail extends along the vertical direction of the horizontal plate 15, and the extending direction of the vertical sliding rail is consistent with the extending direction of the second screw rod 142.

[0048] In an embodiment, referring to Figures 1 to 3 , the patch mechanism 10 further comprises a support 17 arranged on the vertical plate 16 away from the horizontal plate 15, the support 17 is provided with a mounting position 17a, and the wafer disc 11 is detachably mounted at the mounting position 17a. In this way, different sizes of wafer discs 11 can be mounted through the mounting position 17a to increase the patching range of the die bonding equipment.

[0049] In an embodiment, referring to Figures 1 to 3 , the positioning member 13 is a positioning cylinder, the positioning cylinder is provided with an inner cavity 13b and a through hole 13c communicating with the inner cavity 13b, the extension direction of the through hole 13c is consistent with the extension direction of the thimble 12, and the through hole 13c penetrates through the positioning cylinder 13; the end of the through hole 13c close to the wafer disc 11 is provided with a transparent sheet arranged opposite to the patching position 13a, and the transparent sheet is used for abutting with the thimble 12.

[0050] In the embodiment, the positioning member 13 is arranged in the shape of a positioning cylinder, so that the patching substrate is easy to be driven on the surface of the positioning cylinder. The positioning cylinder is provided with an inner cavity 13b and a through hole 13c, and the extension direction of the positioning cylinder is consistent with the extension direction of the vertical plate 16, i.e. consistent with the horizontal direction.

[0051] The hole depth direction of the through hole 13c is arranged at an angle of 90 degrees with the extension direction of the positioning cylinder, so that the thimble 12 is driven to rise and fall by the nut of the ball screw, one end of the thimble 12 is driven to abut on the transparent sheet of the through hole 13c, the transparent sheet is arranged opposite to the patching position 13a, so that the transparent sheet can support the patching substrate driven to this position, at this time the thimble 12 can push out one wafer on the wafer disc 11, so that the wafer can be attached with the patching substrate. The transparent sheet not only plays a supporting role for the patching substrate, but also makes it easy for the user to see whether there is a wafer on the wafer disc at this position.

[0052] In an embodiment, referring to Figures 1 to 3 , the die bonding equipment further comprises an anti-collision mechanism connected with the periphery of the thimble 12, the horizontal plate 15 and the vertical plate 16 are both provided with a through hole 10a, and the anti-collision mechanism is located between the thimble 12 and the hole wall of the through hole 10a, and the anti-collision mechanism is used for pre-touching the hole wall of the through hole 10a. In the embodiment, an anti-collision mechanism is arranged on the periphery of the thimble 12, which avoids the collision of the horizontal plate 15, the vertical plate 16 and the thimble 12 during relative movement, and the anti-collision mechanism pre-touches the hole wall of the through hole 10a to reduce the damage of the thimble 12.

[0053] The die bonding apparatus further comprises a second driving assembly for driving the movement of the needle 12, the second driving assembly comprising a third motor and a ball screw, the third motor being arranged on the frame and penetrating through the horizontal plate; one end of the ball screw is connected with the output shaft of the third motor and penetrates through the vertical plate, and the telescopic rod of the ball screw is connected with the needle; so that the third motor can drive the rotation of the ball screw, and then the needle 12 is lifted by the telescopic rod of the ball screw, so as to realize the lifting of the needle 12 and the ejection of the wafer on the wafer disc 11, so that the wafer can be abutted and attached to the patch substrate of the positioning member 13.

[0054] In an embodiment, referring to Figures 1 to 3 , the die bonding apparatus further comprises a plurality of first sensors 50, each of which is arranged on one of the third motors and is arranged at intervals between the needle 12 and the positioning member 13 of each patch mechanism; when the second driving assembly moves to a designated position, the first sensor 50 is arranged opposite to the patch position 13a; the first sensor 50 is used to detect the relative position of the wafer disc 11 and the needle 12.

[0055] In this embodiment, the first sensor 50 is arranged on the mounting bracket of the third motor and is arranged at intervals between the needle 12 and the third motor; a detection light source is arranged on the opposite side of the third motor and is symmetrically arranged with the first sensor 50, which provides a better detection environment for the first sensor 50 to improve the detection accuracy of the first sensor 50; when the first sensor 50 detects the relative position of the wafer disc 11 and the positioning member 13, if it is determined that the wafer disc 11 is opposite to the patch position 13a of the positioning member 13, the main control unit controls the movement of other components at this time to accelerate the alignment of the wafer of the wafer disc 11 and the patch position 13a of the positioning member 13.

[0056] In an embodiment, referring to Figures 1 to 3 , the die bonding apparatus further comprises a plurality of second sensors 60 arranged on the frame, each of which is arranged at intervals between the needle 12 and the wafer disc 11 of each patch mechanism 10, and the second sensor 60 is arranged opposite to the wafer disc 11; the second sensor 60 is used to detect whether there is a wafer opposite to the patch position 13a.

[0057] In the embodiment, the second sensor 60 is arranged on the rack and is spaced apart from the pin 12 and the wafer disc 11. Optionally, the positioning member 13 is a positioning cylinder, and the positioning cylinder 13 is provided with an inner cavity 13b and a through hole 13c communicating with the inner cavity 13b, and the second sensor 60 is fixed in the inner cavity 13b through the through hole 13c. When the first driving assembly 14 drives the wafer disc 11 to move to the position opposite to the patch pre-set position of the patch substrate on the positioning member 13, the main controller of the die bonding device controls the second sensor 60 to detect the position of the patch position 13a of the positioning member 13 opposite to the wafer disc 11. If one of the wafers on the wafer disc 11 is opposite to the patch position 13a of the positioning member 13, the main controller controls the second driving assembly to drive the pin 12 to descend and eject the wafer on the wafer disc 11. If the wafer disc 11 has no wafer opposite to the patch position 13a of the positioning member 13, the main controller continues to control the first driving assembly to drive the wafer disc 11 to adjust the position.

[0058] In an embodiment, referring to Figures 1 to 3 , the die bonding device further comprises a transmission mechanism arranged on the rack, and the transmission mechanism is used to drive the patch substrate to the patch position 13a of the positioning member 13. In the embodiment, the transmission mechanism is arranged on the rack. Optionally, the transmission mechanism is a transmission motor and a transmission gear. The transmission motor is arranged on the rack, and the output shaft of the transmission motor is connected with the transmission gear. The patch substrate is wound on the transmission gear. The transmission motor is used to drive the transmission gear to rotate, so that the patch substrate is driven by the transmission gear on the positioning member 13, thereby improving the patch efficiency of the die bonding device.

[0059] In an embodiment, referring to Figures 1 to 3 , the die bonding device further comprises a plurality of third sensors 70 arranged on the rack. Each third sensor 70 is arranged opposite to the patch position 13a and is used to detect whether the patch position 13a has a wafer.

[0060] In the embodiment, the third sensor 70 is located on one side of the positioning member 13, and the detection element of the third sensor 70 is opposite to the patch position 13a of the positioning member 13. When the third sensor 70 detects that the patch substrate of the patch position 13a has no wafer, the third sensor 70 sends an electric signal to the main controller. The main controller controls the second driving assembly to drive the pin 12 to descend, and the pin 12 is used to eject the wafer on the wafer disc 11.

[0061] In an embodiment, referring to Figures 1 to 3 , the die bonding device further comprises a plurality of fourth sensors 80 arranged on the rack. Each fourth sensor 80 is used to detect whether the patch substrate is completed when the fourth sensor 80 is arranged opposite to the patch substrate.

[0062] In the embodiment, the fourth sensor 80 is arranged on the rack and is arranged opposite to the die substrate. When the die substrate is attached with the wafer and is moved by the transmission mechanism, the fourth sensor 80 detects the die substrate. When the fourth sensor 80 does not detect the wafer at the preset die attaching position of the die substrate, the main control unit controls the transmission mechanism to move reversely and return the die substrate to the 13 die attaching position of the positioning member to attach the die, so as to improve the die attaching correctness of the die bonding device.

[0063] The above description is only the preferred embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structural transformation, direct / indirect application in other related technical fields, or the like within the inventive concept of the present application and the content of the specification and drawings are included in the patent protection scope of the present application.

Claims

1. A die bonding device, characterized in that, The die bonding equipment includes: rack; and Multiple placement mechanisms are arranged side-by-side and spaced apart on the frame; Each of the aforementioned patch mechanisms includes: A wafer disk is movably connected to the rack and is used to bond wafers. A ejector pin, movably connected to the rack, is positioned above the wafer disk and spaced apart from it; and A positioning element is disposed on the frame and located on the side of the ejector pin facing away from the wafer disk. The positioning element has a patch position and is used to place the patch substrate. When the wafer disk moves above the patch position, the ejector pin drives the wafer of the wafer disk to descend, so that the wafer comes into contact with the patch substrate; The chip mounting mechanism further includes a first driving assembly, a horizontal plate, and a vertical plate; the horizontal plate is slidably connected to the frame, the vertical plate is slidably connected to the side of the horizontal plate facing away from the frame, and the wafer disk is detachably connected to the side of the vertical plate facing away from the horizontal plate; The die bonding equipment also includes an anti-collision mechanism connected to the periphery of the ejector pin. Both the horizontal plate and the vertical plate are provided with through holes. The anti-collision mechanism is spaced apart from the edge of the through hole and is used to contact the hole wall of the through hole in advance.

2. The die bonding equipment as described in claim 1, characterized in that, The first driving component includes: A first motor is mounted on the frame; The first lead screw is connected to the output shaft of the first motor, and the horizontal plate is slidably connected to the first lead screw; A second motor is installed on the horizontal plate; and The second lead screw is connected to the output shaft of the second motor; the vertical plate is slidably connected to the second lead screw. The first motor drives the first lead screw to move the horizontal plate on the frame, and the second motor drives the second lead screw to move the vertical plate on the horizontal plate.

3. The die bonding equipment as described in claim 2, characterized in that, The positioning element is a positioning cylinder, which has an inner cavity and a through hole communicating with the inner cavity. The extension direction of the through hole is consistent with the extension direction of the ejector pin, and the through hole penetrates the positioning cylinder. A transparent sheet is provided at one end of the through hole near the wafer disk, which is positioned opposite to the patch position. The transparent sheet is used to abut against the ejector pin.

4. The die bonding apparatus as described in claim 1, characterized in that, The patching mechanism further includes a plurality of second driving components, each of the second driving components comprising: A third motor is mounted on the frame and extends through the horizontal plate; and A ball screw, one end of which is connected to the output shaft of the third motor, the ball screw passing through the vertical plate, and the telescopic rod of the ball screw connected to the ejector pin.

5. The die bonding apparatus as described in claim 4, characterized in that, The die bonding equipment further includes a plurality of first sensors, each of which is mounted on a third motor and spaced apart from the ejector pin and the positioning element of each of the bonding mechanisms. The first sensors are used to detect the relative position of the wafer disk and the ejector pin.

6. The die bonding apparatus according to any one of claims 1 to 3, characterized in that, The die bonding equipment also includes a plurality of second sensors disposed on the rack, each second sensor being disposed opposite to a wafer disk; the second sensors are used to detect whether there is a wafer at the position of the wafer disk facing the bonding pad.

7. The die bonding apparatus according to any one of claims 1 to 3, characterized in that, The die bonding equipment also includes a plurality of third sensors disposed on the rack, each of the third sensors being disposed opposite to a die bonding position, for detecting whether there is a wafer at the die bonding position.

8. The die bonding apparatus according to any one of claims 1 to 3, characterized in that, The die bonding equipment also includes a plurality of fourth sensors disposed on the rack, each of the fourth sensors being used to detect whether the die bonding substrate has been completed when it is positioned opposite to a die bonding substrate.

Images