A wireless microwave rectifier antenna

Abstract

The present invention discloses a wireless microwave rectifier antenna, comprising a dielectric substrate, a microstrip feeder is arranged at the edge of the through hole, the microstrip feeder is electrically connected to an input filter, the input filter is electrically connected to a matching circuit, the matching circuit is electrically connected to a rectifier diode, and the output filter is electrically connected to a capacitor and a load respectively; the lower surface of the dielectric substrate is bonded to a metal plate, the heat absorbing plate is bonded to the lower surface of the dielectric substrate, a plurality of heat-conducting columns are fixedly arranged on the heat-absorbing plate, a plurality of side heat-conducting plates are fixedly arranged at one end of the heat-conducting column away from the heat-absorbing plate, and the side heat-conducting plates are buried in a water-absorbing plate. The present invention provides a wireless microwave rectifier antenna, which has good cooling and heat dissipation and waterproof effects, and the absorbed moisture can accelerate heat dissipation, and the absorbed heat can promote the drying of the water-absorbing plate, the two complement each other, turning harm into benefit, and is very worthy of promotion.

Description

Technical Field

[0001] The present invention relates to the technical field of antennas, and in particular to a wireless microwave rectifier antenna. Background Art

[0002] In the prior art, a multilayer microstrip rectifying antenna with application number "201910219538.4" includes an ultra-thin film layer, a first dielectric plate, a second dielectric plate, a third dielectric plate, a metal plate and a thermally conductive silicone layer connected in sequence from top to bottom; a via hole is opened at the geometric center position of the first dielectric plate, the second dielectric plate and the third dielectric plate; a ring-shaped radiation patch is attached to the upper surface of the first dielectric plate, and a feeder coupled to the radiation patch is arranged near the via hole on the lower surface of the first dielectric plate, and a compact microstrip resonant unit is embedded on the feeder; the feeder is electrically connected to the input filter and the matching circuit in sequence; the matching circuit is electrically connected to two rectifying diodes respectively; an output filter electrically connected to the rectifying diode is arranged on the upper surface of the third dielectric plate, and a load electrically connected to the output filter is arranged on the lower surface of the third dielectric plate; the second dielectric plate is a common ground for the circuits on the first dielectric plate and the third dielectric plate; a plurality of corrugated teeth are arranged at the contact position between the lower surface of the metal plate and the thermally conductive silicone layer.

[0003] However, there are still some obvious defects in its use: 1. The above-mentioned device has a single function and does not have a heat dissipation function, which makes it difficult for the heat generated by the circuit on the dielectric substrate to be quickly dissipated, and there will be heat accumulation, which will affect the service life of the rectifier antenna; 2. The above-mentioned device does not have a moisture absorption function. Under different usage environments, the rectifier antenna may be damaged by moisture due to excessive humidity in the air. The above-mentioned device lacks the necessary water absorption structure, which makes its scope of application relatively limited. Summary of the invention

[0004] The object of the present invention is to provide a wireless microwave rectifier antenna to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A wireless microwave rectifier antenna, comprising a dielectric substrate, a via hole is provided on the dielectric substrate, a microstrip feeder is arranged at the edge of the via hole, the microstrip feeder is electrically connected to an input filter, the input filter is electrically connected to a matching circuit, the matching circuit is electrically connected to a rectifier diode, the rectifier diode is electrically connected to an output filter, and the output filter is electrically connected to a capacitor and a load respectively;

[0007] The lower surface of the dielectric substrate is bonded to a metal plate, a through hole is provided on the metal plate, an operation cavity is provided in the metal plate, a heat absorbing plate is provided in the operation cavity, the heat absorbing plate is bonded to the lower surface of the dielectric substrate, a plurality of heat conducting columns are fixedly provided on the heat absorbing plate, a plurality of side heat conducting plates are fixedly provided at one end of the heat conducting column away from the heat absorbing plate, the side heat conducting plates are buried in the water absorbing plate, the water absorbing plate is fixedly provided in the operation cavity, heat dissipation holes are provided on the metal plate, and filters are provided in the heat dissipation holes.

[0008] Preferably, a microstrip resonant unit is embedded in the microstrip feed line.

[0009] Preferably, the through hole and the via hole have equal diameters and corresponding positions.

[0010] Preferably, the water absorption plate and the operating cavity are of the same shape and equal size.

[0011] Preferably, the front third to the fifth of the heat-conducting column close to the side heat-conducting plate is buried in the water-absorbing plate.

[0012] Preferably, the surfaces of the heat-conducting columns and the side heat-conducting plates are coated with a waterproof layer.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] 1. The device is provided with a heat absorbing plate and an operating chamber, which can transfer the heat generated by the circuit and other devices on the dielectric substrate to the heat absorbing plate in time, so as to quickly dissipate the heat and avoid heat accumulation;

[0015] 2. The device is provided with heat dissipation holes and water absorption plates. While ventilating and dissipating heat, the water absorption plates can absorb moisture in the air, thereby preventing moisture from contacting the heat absorption plates, which can prevent the heat absorption plates from being corroded by moisture and also avoid the potential safety hazard of excessive moisture damaging electrical components;

[0016] 3. The side heat conduction plates and the front one-third to one-fifth of the heat conduction column in this device are buried in the water absorption plate, which can use the heat generated to quickly dry the inside of the water absorption plate and maintain the high water absorption rate of the water absorption plate. In addition, because the water absorption plate absorbs moisture inside, its cooling efficiency is much higher than that of the air medium, thereby also accelerating the cooling efficiency, killing two birds with one stone, turning harm into benefit, and promoting each other.

[0017] The present invention provides a wireless microwave rectifier antenna, which has good cooling, heat dissipation and waterproof effects, and the absorbed moisture can accelerate the heat dissipation, and the absorbed heat can promote the drying of the water absorption plate. The two complement each other, turning harm into benefit, and are very worthy of promotion. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1It is a schematic diagram of the structure on the dielectric substrate of the present invention;

[0019] Figure 2 It is a schematic diagram of the installation position and side cross-section of the metal plate of the present invention.

[0020] In the figure: 1. dielectric substrate; 2. via; 3. microstrip feed line; 4. microstrip resonant unit; 5. input filter; 6. matching circuit; 7. rectifier diode; 8. output filter; 9. capacitor; 10. load; 11. metal plate; 12. through hole; 13. operating cavity; 14. heat absorbing plate; 15. heat conducting column; 16. side heat conducting plate; 17. water absorbing plate; 18. heat dissipation hole; 19. filter. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] See also Figure 1-2 , the present invention provides a technical solution:

[0023] A wireless microwave rectifier antenna comprises a dielectric substrate 1, a via 2 is provided on the dielectric substrate 1, a microstrip feed line 3 is arranged at the edge of the via 2, the microstrip feed line 3 is electrically connected to an input filter 5, the input filter 5 is electrically connected to a matching circuit 6, the matching circuit 6 is electrically connected to a rectifier diode 7, the rectifier diode 7 is electrically connected to an output filter 8, and the output filter 8 is electrically connected to a capacitor 9 and a load 10 respectively.

[0024] The lower surface of the dielectric substrate 1 is bonded to the metal plate 11. The metal plate 11 is provided with a through hole 12. The metal plate 11 is provided with an operating cavity 13. The operating cavity 13 is provided with a heat absorbing plate 14. The heat absorbing plate 14 is bonded to the lower surface of the dielectric substrate 1 to absorb the heat generated by the circuit and other devices on the dielectric substrate 1, quickly dissipate heat, and avoid heat accumulation and damage to the components. A plurality of heat-conducting columns 15 are fixedly arranged on the heat-absorbing plate 14. The heat-conducting columns 15 can conduct the heat on the heat-absorbing plate 14. One end of the heat-conducting column 15 away from the heat-absorbing plate 14 is fixed. A plurality of side heat conducting plates 16 are fixedly provided, and the side heat conducting plates 16 are buried in the water absorbing plates 17. The side heat conducting plates 16 can conduct the heat on the heat conducting columns 15. The water absorbing plates 17 are fixedly provided in the operating chamber 13. The high temperature heat on the side heat conducting plates 16 can promote the drying of the water absorbing plates 17 and increase their water absorption capacity. Heat dissipation holes 18 are provided on the metal plate 11 to facilitate the exchange of hot and cold gases. A filter screen 19 is provided in the heat dissipation holes 18. The function of the filter screen 19 is to prevent dust and other impurities in the outside air from directly entering the operating chamber 13.

[0025] As a preferred embodiment, a microstrip resonant unit 4 is embedded in the microstrip feed line 3 .

[0026] As a preference, the diameters of the through hole 12 and the via hole 2 are equal and their positions correspond.

[0027] As a preference, the water absorption plate 17 and the operating chamber 13 have the same shape and are equal in size, so that the water absorption plate 17 can completely block the transverse section of the operating chamber 13, thereby preventing moisture in the air from directly contacting the heat absorption plate 14 and preventing the heat absorption plate 14 from rusting.

[0028] As a preferred embodiment, the front third to one fifth of the heat-conducting column 15 near the side heat-conducting plate 16 is buried in the water-absorbing plate 17. The advantages of this are, firstly, the high temperature heat on the heat-conducting column 15 can promote the drying of the water-absorbing plate 17, so that the water-absorbing plate 17 maintains a good water-absorbing state; secondly, because the water-absorbing plate 17 may contain a small amount of absorbed moisture, its heat dissipation efficiency is much better than the heat dissipation efficiency of the air medium, thereby accelerating the dissipation of heat. The two promote each other and complement each other.

[0029] As a preferred embodiment, the surfaces of the heat-conducting columns 15 and the side heat-conducting plates 16 are coated with a waterproof layer, which can prevent the surfaces of some heat-conducting columns 15 and all side heat-conducting plates 16 buried in the water-absorbing plate 17 from rusting and oxidation due to water immersion.

[0030] Working principle: During the use of the wireless microwave rectifier antenna, the heat generated by the circuit and other devices on the dielectric substrate 1 will be quickly transferred to the heat absorbing plate 14, and the heat absorbing plate 14 will transfer the heat to the heat-conducting column 15, and the heat-conducting column 15 will transfer the heat to the side heat-conducting plate 16 again. The front one-third to one-fifth of the heat-conducting column 15 close to the side heat-conducting plate 16 is buried in the water-absorbing plate 17, and the side heat-conducting plate 16 is completely buried in the water-absorbing plate 17. On the one hand, the heat-conducting column 15 outside the water-absorbing plate 17 can dissipate heat through the air medium, and finally exchange hot and cold gases through the heat dissipation holes 18. On the other hand, some of the heat-conducting columns 15 and the side heat-conducting plates 16 buried in the water-absorbing plate 17 can dissipate heat through the moisture in the water-absorbing plate 17, which has a higher heat dissipation efficiency than the air medium. At the same time, it can also promote the drying of the water-absorbing plate 17, so that the water-absorbing plate 17 maintains a good water absorption state, turning harm into benefit and complementing each other.

[0031] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wireless microwave rectifier antenna, comprising a dielectric substrate (1), characterized in that: The dielectric substrate (1) is provided with a via (2), a microstrip feed line (3) is arranged at the edge of the via (2), the microstrip feed line (3) is electrically connected to an input filter (5), the input filter (5) is electrically connected to a matching circuit (6), the matching circuit (6) is electrically connected to a rectifier diode (7), the rectifier diode (7) is electrically connected to an output filter (8), and the output filter (8) is electrically connected to a capacitor (9) and a load (10) respectively; The lower surface of the dielectric substrate (1) is bonded to a metal plate (11), a through hole (12) is provided on the metal plate (11), an operating cavity (13) is provided in the metal plate (11), a heat absorbing plate (14) is provided in the operating cavity (13), the heat absorbing plate (14) is bonded to the lower surface of the dielectric substrate (1), a plurality of heat conducting columns (15) are fixedly provided on the heat absorbing plate (14), a plurality of side heat conducting plates (16) are fixedly provided at one end of the heat conducting column (15) away from the heat absorbing plate (14), the side heat conducting plates (16) are buried in a water absorbing plate (17), the water absorbing plate (17) is fixedly provided in the operating cavity (13), a heat dissipation hole (18) is provided on the metal plate (11), a filter screen (19) is provided in the heat dissipation hole (18); A microstrip resonant unit (4) is embedded in the microstrip feed line (3); The through hole (12) and the via hole (2) have the same diameter and corresponding positions.

2. A wireless microwave rectenna according to claim 1, characterized in that: The water absorption plate (17) and the operating chamber (13) have the same shape and are equal in size.

3. The wireless microwave rectenna according to claim 1, characterized in that: The front third to the fifth of the heat-conducting column (15) close to the side heat-conducting plate (16) is buried in the water-absorbing plate (17).

4. The wireless microwave rectenna according to claim 1, characterized in that: The surfaces of the heat-conducting column (15) and the side heat-conducting plate (16) are both coated with a waterproof layer.

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