Inspection workbench

Abstract

An inspection workbench is provided to confirm the status of the device without requiring labor or skills. The inspection workbench used in the inspection of the processing device includes: a base portion that is supported on the holding surface of the chuck table or the workbench base in a manner that allows attachment and detachment; a sensor that is fixed to the base portion and driven by electricity; an information transmission portion that transmits information detected by the sensor; and a battery that supplies power to the sensor and the information transmission portion. The sensor is a pressure detection sensor, a tilt detection sensor, a temperature detection sensor, a light intensity sensor, or an image sensor. The inspection workbench uses sensors to detect or record the pressure, tilt, temperature, light intensity, or photographed appearance associated with the chuck table, processing unit, workbench base, or moving unit.

Description

Technical Field

[0001] The present invention relates to an inspection table for inspecting a processing device that processes a workpiece held by a chuck table. Background Art

[0002] There are various processing devices that use a chuck table to hold and process the workpiece (cutting, laser processing, grinding, etc. of semiconductor wafers or packaging substrates). For example, in the case of a cutting device, if the chuck table is tilted above a specified angle, the cutting depth will vary, resulting in uncut areas. In addition, in a cutting device, if the nozzle is not positioned at a specified position relative to the cutting tool, contaminants (cutting chips) will adhere to the workpiece in large quantities, and the desired processing results cannot be obtained. Therefore, it is necessary to regularly check the status of the device.

[0003] Patent Document 1: Japanese Patent Application Laid-Open No. 2017-144511

[0004] Patent Document 2: Japanese Patent Application Laid-Open No. 2017-199777

[0005] Checking the status of equipment requires both effort and skill, such as observing the equipment in a cramped space or installing various measuring instruments to confirm that it is in the desired state. For example, in cutting equipment, a mirror is sometimes installed below the cutting tool to confirm that the cutting water nozzle is positioned parallel to the cutting tool. However, this task is extremely difficult because it takes place in a dark and confined space. Summary of the Invention

[0006] Therefore, an object of the present invention is to provide an inspection workbench that enables checking the status of a device without requiring labor and skill.

[0007] According to the present invention, there is provided an inspection workbench, which is used in a processing device, and the processing device comprises: a chuck workbench, which uses a holding surface to hold a workpiece; a processing unit, which is opposite to the holding surface and processes the workpiece held by the chuck workbench; a workbench base, which supports the chuck workbench so that it can be loaded and unloaded; a moving unit, which moves the workbench base; and a camera unit, which photographs the workpiece held by the chuck workbench, wherein the inspection workbench includes: a base portion, which is supported on the holding surface of the chuck workbench in a manner that can be loaded and unloaded surface or the workbench base; a sensor, which is fixed to the base and driven by electricity; an information sending unit, which sends information detected by the sensor; and a battery, which supplies power to the sensor and the information sending unit, the sensor is selected from the group consisting of a pressure detection sensor, a tilt detection sensor, a temperature detection sensor, a light quantity sensor and an image sensor, and the inspection workbench uses the sensor to detect or record the pressure, tilt, temperature, light quantity or photographed appearance associated with the chuck workbench, the processing unit, the workbench base or the moving unit.

[0008] According to this structure, it is possible to mount various sensors on the workbench simply by fixing it to the chuck table (holding surface) of the processing device or fixing it to the workbench base instead of the chuck table. As a result, it is possible to capture and confirm the conditions around the processing unit and cutting tool (the inclination of the nozzle, the positional relationship between the nozzle and the tool), and the conditions around the laser irradiation unit (the positional relationship between the vacuum unit and the focusing lens). In addition, according to the structure of the present invention, since it has an information sending unit, it is possible to confirm the inclination of the workbench surface, the deflection and pitch of the moving unit, the intensity and offset of the camera unit's lighting, etc. even at a location far away from the workbench.

[0009] Preferably, the inspection table further includes a memory for recording detection information from the sensor. According to this configuration, the operator can obtain and use the detection information detected by the sensor as needed.

[0010] According to the present invention, it is possible to check the status of a device without requiring labor or skill. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a perspective view showing a processing device according to an embodiment of the present invention.

[0012] Figure 2 yes Figure 1 A partial side sectional view of the main parts of the processing device.

[0013] Figure 3 It is a perspective view of the processing unit in the embodiment.

[0014] Figure 4 It is right Figure 1 A partial side sectional view of the cutting operation of a workpiece held by a chuck table of a processing device.

[0015] Figure 5 It is a perspective view showing a processing device according to the embodiment.

[0016] Figure 6 yes Figure 5 A partial side sectional view of the main parts of the processing device.

[0017] Figure 7 This is a perspective view showing an inspection table according to the embodiment.

[0018] Figure 8 It is a diagram showing a configuration example of an inspection table according to an embodiment of the present invention.

[0019] Figure 9 This is a diagram showing an example of detection according to the embodiment.

[0020] Figure 10 This is a diagram showing an example of detection according to the embodiment.

[0021] Figure 11 This is a diagram showing an example of detection according to the embodiment.

[0022] Figure 12 This is a diagram showing an example of detection according to the embodiment.

[0023] Figure 13 FIG. 1 is a diagram showing an example of an image captured by the image sensor according to the embodiment.

[0024] Figure 14 This is a diagram showing an example of detection information according to the embodiment.

[0025] Figure 15 This is a flowchart showing an example of processing of the inspection workstation according to the embodiment.

[0026] Figure 16 This is a diagram showing an example of a data selection screen according to the embodiment.

[0027] Description of labels

[0028] 2: Processing device; 20: Chuck table base; 23: Loading surface; 24: Chuck table suction path; 25: Workpiece suction path; 25a: Sealing member embedding portion; 30: Chuck table; 33: Holding surface; 34: Lower surface; 36: Holding surface suction path; 38: Sealing member; 39: Control unit; 60: Processing unit; 62: Camera unit; 63: First cutting fluid supply nozzle; 64: Spindle; 65: Mounting flange; 66: Cutting tool; 67: Cutting fluid supplying second nozzle; 68: Cooling water supplying nozzle; 100: Workpiece; 200: Inspection workbench; 201: Base portion; 202: Pressure detection sensor; 203: Tilt detection sensor; 204: Temperature detection sensor; 205: Light intensity sensor; 206: Image sensor; 207: Lamp; 208: Information communication portion; 209: Storage portion; 210: Detection information recording area; 211: Operation processing portion; 212: Battery. DETAILED DESCRIPTION

[0029] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The present invention is not limited to the contents described in the following embodiments. In addition, the structural elements described below include substantially the same structural elements that can be easily imagined by those skilled in the art. Moreover, the structures described below can be appropriately combined. In addition, various omissions, substitutions, or modifications of the structures can be made without departing from the scope of the present invention.

[0030] In the following embodiments, an XYZ rectangular coordinate system is used to describe the positional relationships of various components. A direction within a horizontal plane is defined as the X-axis direction, a direction perpendicular to the X-axis direction within the horizontal plane is defined as the Y-axis direction, and a direction perpendicular to both the X-axis and Y-axis directions is defined as the Z-axis direction. The XY plane, which contains the X and Y axes, is parallel to the horizontal plane. The Z-axis direction, which is perpendicular to the XY plane, is the vertical direction.

[0031] use Figures 1 to 4 The outline of the processing device 2 according to the embodiment will be described. Figure 1 It is a perspective view showing a processing device according to the embodiment. Figure 2 yes Figure 1 A partial side sectional view of the main parts of the processing device. Figure 3 It is a perspective view of the processing unit in the embodiment. Figure 4 It is right Figure 1 A partial side sectional view of the cutting operation of a workpiece held by a chuck table of a processing device.

[0032] The workpiece 100 (see, for example, Figure 1) is a disk-shaped semiconductor wafer or optical device wafer using silicon, sapphire, gallium, or the like as a substrate 101. The workpiece 100 has devices 104 formed in regions divided into a grid pattern by a plurality of planned dividing lines 103 formed on a front surface 102 of the substrate 101.

[0033] The workpiece 100 has a dicing tape 106, an adhesive tape having a larger diameter than the substrate 101, attached to its back surface 105, which is located behind the front surface 102. An annular frame 107 is attached to the outer periphery of the dicing tape 106. Specifically, the workpiece 100 is supported by the dicing tape 106 at the opening of the annular frame 107. In this embodiment, a frame unit 108 is constructed to include the workpiece 100, the dicing tape 106, and the annular frame 107. Furthermore, an annular region 106A of the dicing tape 106 is formed between the workpiece 100 and the annular frame 107.

[0034] Furthermore, the material, shape, structure, and size of the substrate 101 of the workpiece 100 are not limited. For example, a substrate of any shape made of materials such as ceramic, resin, and metal may be used as the workpiece. Furthermore, the type, number, shape, structure, size, and arrangement of the devices 104 are also not limited.

[0035] like Figure 1 As shown, the processing device 2 includes a base 4 on which various components are mounted. An X-axis moving mechanism 6, which serves as a processing feed unit, is provided on the upper surface of the base 4. The X-axis moving mechanism 6 includes a pair of X-axis guide rails 8 that are substantially parallel to the X-axis direction, which serves as the processing feed direction. An X-axis moving table 10 is slidably mounted on the X-axis guide rails 8.

[0036] A nut portion (not shown) is provided on the lower surface side of the X-axis movable table 10. This nut portion is threadedly engaged with an X-axis ball screw 12 that is parallel to the X-axis guide rail 8. An X-axis pulse motor 14 is connected to one end of the X-axis ball screw 12. By rotating the X-axis ball screw 12 using the X-axis pulse motor 14, the X-axis movable table 10 moves in the X-axis direction along the X-axis guide rail 8. The X-axis moving mechanism 6 is provided with an X-axis measurement unit (not shown) that measures the X-axis position of the X-axis movable table 10.

[0037] When the X-axis movable table 10 is moved in the X-axis direction by the X-axis movable mechanism 6, the chuck table 30 is processed and fed via the θ table 16 and the chuck table base 20, which are arranged above the X-axis movable table 10. The upper portion of the X-axis movable mechanism 6 including the X-axis movable table 10 is covered by a table cover 18 and a bellows cover (not shown).

[0038] A θ table 16 is provided on the front side, i.e., the upper surface side, of the X-axis movable table 10. The θ table 16 has a rotation drive source (not shown), such as a motor, and rotates the chuck table base 20 and the chuck table 30 disposed above it about a rotation axis that is substantially parallel to the Z-axis direction, which is the cutting feed direction.

[0039] like Figure 1 As shown, the processing device 2 has a chuck table base 20 provided on the upper surface side of the X-axis moving table 10 via the θ table 16. The chuck table base 20 is formed of a conductor such as metal, such as Figure 2 As shown, the chuck table base 20 includes a main body 21 on which the chuck table 30 is placed, supported, and fixed; and four clamps 22 serving as frame holding portions, which are arranged on the outer periphery of the main body 21 and hold and fix the frame 107 of the frame unit 108. The chuck table base 20 has a flat mounting surface 23 on the upper surface of the main body 21 for placing and supporting the chuck table 30.

[0040] The clamp 22 is provided to be movable in the radial direction relative to the main body 21 and is used to move appropriately according to the radial size of the chuck table 30 , which is used separately according to the radial sizes of the workpiece 100 and the frame unit 108 .

[0041] like Figure 2 As shown, the chuck table base 20 has a chuck table suction passage 24 and a workpiece suction passage 25 formed within the main body 21. The chuck table suction passage 24 applies negative pressure to the lower surface 34 of the chuck table 30 placed on the mounting surface 23 of the chuck table base 20, thereby removably securing the chuck table 30 to the chuck table base 20. The workpiece suction passage 25 communicates with a holding surface suction passage 36 of the chuck table 30 placed on the mounting surface 23, thereby applying negative pressure. The chuck table suction passage 24 and the workpiece suction passage 25 open onto the mounting surface 23 of the main body 21 of the chuck table base 20.

[0042] like Figure 2As shown, on the side of the main body 21 of the chuck table base 20 opposite the mounting surface 23, the chuck table suction path 24 is connected to a suction source 28 via a first on-off valve 26. Similarly, on the side of the main body 21 of the chuck table base 20 opposite the mounting surface 23, the workpiece suction path 25 is connected to the suction source 28 via a second on-off valve 27. The suction source 28 applies negative pressure to the mounting surface 23 of the chuck table base 20 via the chuck table suction path 24. Furthermore, the suction source 28 applies negative pressure to the holding surface 33 of the chuck table 30, which holds the workpiece 100 via the dicing tape 106, via the workpiece suction path 25 and the holding surface suction path 36.

[0043] like Figure 2 As shown, the processing device 2 includes a chuck table 30. The chuck table 30 uses a holding surface 33 on its upper surface to suction and hold the workpiece 100. Its lower surface 34 is in close contact with the mounting surface 23 of the chuck table base 20, allowing for easy attachment and removal. The chuck table 30 includes a suction portion 31, whose upper surface forms the flat holding surface 33, and a table body 32, which forms a flat lower surface 34.

[0044] The suction unit 31 is embedded in a recess 35 in the center of the upper surface of the table body 32. The suction unit 31 is made of porous ceramics having a plurality of air-permeable pores, and the entire frame unit 108 is sucked and held by the holding surface 33.

[0045] The worktable body 32 is formed into a circular plate shape from a conductor such as metal, with a recessed portion 35 formed in the center of its upper surface. Furthermore, a holding surface suction passage 36 is formed within the worktable body 32. This holding surface suction passage 36 applies negative pressure to the dicing tape 106 side of the frame unit 108 placed on the holding surface 33 via the suction portion 31, thereby holding the workpiece 100 removably on the chuck table 30. The holding surface suction passage 36 opens at the lower surface 34 of the worktable body 32 and the recessed portion 35.

[0046] An annular sealing member 38 is provided between the mounting surface 23 of the chuck table base 20 and the lower surface 34 of the chuck table 30. This sealing member 38 connects the workpiece suction passage 25 and the holding surface suction passage 36 in a sealed state. The chuck table base 20 side of the sealing member 38 is embedded in a sealing member embedding portion 25a at the opening of the workpiece suction passage 25 provided on the mounting surface 23 side, and the chuck table 30 side of the sealing member 38 is embedded in a sealing member embedding portion 36a at the opening of the holding surface suction passage 36 provided on the lower surface 34 side.

[0047] The chuck table 30 is replaced and used according to the size and type of the workpiece 100 and the frame unit 108 .

[0048] The lower surface 34 of the chuck table 30 is placed on the mounting surface 23 of the chuck table base 20 and aligned so that the negative pressure of the suction source 28 acts on the mounting surface 23 of the chuck table base 20. As a result, the flat mounting surface 23 and the flat lower surface 34 are in close contact with each other under negative pressure. Figure 2 As shown, the chuck table 30 is fixed to the chuck table base 20. Next, the frame unit 108 with the dicing tape 106 side is placed on the holding surface 33 of the chuck table 30 and aligned, so that the negative pressure of the suction source 28 acts on the holding surface 33 of the chuck table 30. As a result, the flat holding surface 33 and the lower surface of the dicing tape 106 of the frame unit 108 are in close contact with each other under negative pressure, as shown in FIG. Figure 4 As shown, the frame unit 108 is fixed to the chuck table 30 .

[0049] In this embodiment, as the chuck worktable 30, a method is illustrated in which a worktable body 32 and an adsorption portion 31 composed of porous ceramics having multiple air-permeable holes are provided, but it is not limited to this. For example, a structure in which a suction groove is formed so that the negative pressure of the suction source 28 acts on the holding surface 33 of the chuck worktable 30 can also be adopted.

[0050] In addition, if Figure 4 As shown, when the frame unit 108 is fixed to the chuck table 30, the clamp 22 pulls the frame 107 down to a position vertically below the holding surface 33 of the chuck table 30 and holds it. As a result, the dicing tape 106 is in close contact with the holding surface 33, and the workpiece 100 is firmly supported on the holding surface 33 via the dicing tape 106.

[0051] In addition, if Figure 1 As shown, a water tank 19 is provided near the X-axis movable table 10. This water tank 19 temporarily stores waste cutting fluid, such as pure water, used during cutting. The waste liquid stored in the water tank 19 is discharged to the outside of the processing device 2 via a drain pipe (not shown). A transport mechanism (not shown) is provided near the chuck table 30 to transport the workpiece 100 to the chuck table 30.

[0052] like Figure 1 As shown, a gate-shaped support structure 40 is arranged on the upper surface of the base 4, which spans the X-axis moving mechanism 6. Two sets of processing unit moving mechanisms 42 (an example of a moving unit) are provided on the front surface of the support structure 40, which function as an indexing feed unit and a plunge feed unit. Each processing unit moving mechanism 42 is arranged on the front surface of the support structure 40 and has a common function in the indexing feed direction (i.e., as a feed unit). Figure 1A pair of Y-axis guide rails 44 are substantially parallel to each other (the Y-axis direction in the left-right direction). A Y-axis moving plate 46 constituting each machining unit moving mechanism 42 is slidably provided on the Y-axis guide rails 44.

[0053] A nut portion (not shown) is provided on the back side of each Y-axis moving plate 46, and a Y-axis ball screw 48, which is substantially parallel to the Y-axis guide rail 44, is screwed into each nut portion. A Y-axis pulse motor 50 is connected to one end of each Y-axis ball screw 48. When the Y-axis pulse motor 50 rotates the Y-axis ball screw 48, the Y-axis moving plate 46 moves along the Y-axis guide rail 44 in the Y-axis direction.

[0054] A pair of Z-axis guide rails 52 substantially parallel to the Z-axis direction is provided on the front surface of each Y-axis moving plate 46. A Z-axis moving plate 54 is slidably mounted on the Z-axis guide rails 52.

[0055] A nut portion (not shown) is provided on the back side of each Z-axis moving plate 54, and a Z-axis ball screw 56 parallel to the Z-axis guide rail 52 is screwed into each nut portion. A Z-axis pulse motor 58 is connected to one end of each Z-axis ball screw 56. When the Z-axis pulse motor 58 rotates the Z-axis ball screw 56, the Z-axis moving plate 54 moves in the Z-axis direction along the Z-axis guide rail 52.

[0056] Each machining unit moving mechanism 42 is provided with a Y-axis measuring unit (not shown) for measuring the Y-axis position of the Y-axis moving plate 46. Furthermore, each machining unit moving mechanism 42 is provided with a Z-axis measuring unit (not shown) for measuring the Z-axis position of the Z-axis moving plate 54.

[0057] A machining unit 60 for cutting a workpiece 100 held by the chuck table 30 is fixed to the bottom of each Z-axis movable plate 54. Furthermore, a camera unit 62, serving as an imaging unit for capturing an image of the workpiece 100, is provided adjacent to the machining unit 60. In each machining unit moving mechanism 42, when the Y-axis movable plate 46 is moved in the Y-axis direction, the machining unit 60 and the camera unit 62 are indexed and fed, while when the Z-axis movable plate 54 is moved in the Z-axis direction, the machining unit 60 and the camera unit 62 are plunge-fed.

[0058] The X-axis position of the chuck table 30 and the like relative to the machining unit 60 and the camera unit 62 is measured by the X-axis measuring unit. The Y-axis position of the machining unit 60 and the camera unit 62 relative to the chuck table 30 and the like is measured by the Y-axis measuring unit. The Z-axis position of the machining unit 60 and the camera unit 62 relative to the chuck table 30 and the like is measured by the Z-axis measuring unit.

[0059] like Figure 3 As shown, the machining unit 60 is a cutting unit in which a cutting tool 66 having an annular cutting edge on the outer periphery is mounted on a spindle 64 whose rotating axis is roughly parallel to the holding surface 33 of the chuck table 30. The machining unit 60 performs cutting processing on the workpiece 100 held by the chuck table 30. The rotating axis of the spindle 64 is roughly perpendicular to the X-axis direction and the Z-axis direction, and roughly parallel to the Y-axis direction. A cutting tool 66 is mounted on one end side of the spindle 64, and the cutting tool 66 is clamped by a fixing nut together with a mounting flange 65. A rotation drive source (not shown) such as an electric motor is connected to the other end side of the spindle 64. As shown in FIG. Figure 4 As shown, the cutting tool 66 is rotated by the torque of the rotation drive source transmitted via the spindle 64. The rotation of the cutting tool 66 forms cut grooves along the planned dividing lines 103 in the workpiece 100, thereby singulating the workpiece 100 into individual devices 104.

[0060] In addition, if Figure 3 As shown, near the cutting tool 66, there are provided a first cutting fluid supply nozzle 63 for supplying a cutting fluid such as pure water to the workpiece 100; a second cutting fluid supply nozzle 67 for supplying a cutting fluid such as pure water to the workpiece 100 or the cutting tool 66; and a pair of cooling water supply nozzles 68 for spraying cooling water onto the sides of the cutting tool 66 (the cooling water nozzles on the opposite side are not shown). Below the cutting tool 66, a tool position detection unit 69 is disposed. This tool position detection unit 69 detects the height (i.e., position) of the lower end, i.e., the front end, of the lower side of the cutting tool 66, in the Z-axis direction. The control unit 39, described later, controls the various components of the machining unit 60 based on, for example, the conditions for cutting the workpiece 100.

[0061] like Figure 1 As shown, the processing device 2 includes a control unit 39 that controls the components of the processing device 2 according to the processing conditions of the workpiece 100. The control unit 39 is a computer capable of executing computer programs and includes: an arithmetic processing unit including a microprocessor such as a CPU (central processing unit); a storage device including a memory such as a ROM (read only memory) or a RAM (random access memory); and an input / output interface device.

[0062] The size and type of the chuck table 30, input by the operator via the input unit, are registered in the control unit 39. The control unit 39 controls the opening and closing of the first on-off valve 26 to switch between suction in the chuck table suction passage 24 and whether the chuck table 30 is secured to the mounting surface 23 of the chuck table base 20. Furthermore, the control unit 39 controls the opening and closing of the second on-off valve 27 to switch between suction in the workpiece suction passage 25 and whether the workpiece 100 is retained on the retaining surface 33 of the chuck table 30.

[0063] Next, use Figures 5 to 9 The inspection table 200 used in the processing apparatus 2 according to the embodiment will be described. Figure 5 It is a perspective view showing a processing device according to the embodiment. Figure 6 yes Figure 5 A partial side sectional view of the main parts of the processing device. Figure 7 This is a perspective view showing an inspection table according to the embodiment. Figure 8 It is a diagram showing a configuration example of an inspection table according to an embodiment. Figures 9 to 12 This is a diagram showing an example of detection according to the embodiment. Figure 13 FIG. 1 is a diagram showing an example of an image captured by the image sensor according to the embodiment. Figure 14 This is a diagram showing an example of detection information according to the embodiment.

[0064] like Figure 5 As shown, when inspecting the processing device 2, the operator places the inspection table 200 on the holding surface 33 of the chuck table 30 and aligns the table, and applies negative pressure from the suction source 28 to the holding surface 33 of the chuck table 30. As a result, the flat holding surface 33 of the chuck table 30 and the lower surface of the inspection table 200 are in close contact with each other under negative pressure, as shown in FIG. Figure 6 As shown, the inspection table 200 is fixed to the chuck table 30 .

[0065] Next, the operator operates the control unit 39 to operate the processing device 2, thereby performing an inspection of the processing device 2. When performing the inspection of the processing device 2, the operator can manually operate the processing device 2 to a desired position, or can automatically operate the processing device 2 in a predetermined mode prepared in advance for the inspection.

[0066] The operator obtains detection information detected by the inspection table 200 during the inspection of the processing device 2 through the terminal device 300. As the terminal device 300, for example, a mobile terminal such as a smartphone or a tablet is exemplified.

[0067] The control unit 39 operates the processing device 2 based on input from the operator. For example, the control unit 39 controls the opening and closing of the second on-off valve 27 to switch whether the workpiece suction passage 25 is suctioned, thereby executing the holding or release of the inspection table 200 on the holding surface 33 of the chuck table 30.

[0068] like Figure 7 As shown, the inspection workbench 200 has a base portion 201, which is supported on the holding surface 33 of the chuck workbench 30 in a manner that allows it to be loaded and unloaded. In this embodiment, an example in which the lower surface of the inspection workbench 200 and the flat holding surface 33 of the chuck workbench 30 are tightly attached to each other by negative pressure so that the inspection workbench 200 is supported on the chuck workbench 30 in a manner that allows it to be loaded and unloaded is described, but it is not particularly limited to this example. For example, the inspection workbench 200 can also be supported on the chuck workbench base 20 (an example of a workbench base) in a manner that allows it to be loaded and unloaded. That is, after the chuck workbench 30 is removed from the chuck workbench base 20, the lower surface of the inspection workbench 200 is placed on the loading surface 23 of the chuck workbench base 20 for alignment, and the negative pressure of the suction source 28 is applied to the loading surface 23 of the chuck workbench base 20. As a result, the flat mounting surface 23 of the chuck table base 20 and the lower surface of the inspection table 200 are in close contact with each other under negative pressure, and the inspection table 200 can be directly fixed to the chuck table base 20 .

[0069] In addition, if Figure 7 and Figure 8 As shown, the inspection table 200 includes a pressure detection sensor 202, a tilt detection sensor 203, a temperature detection sensor 204, a light sensor 205, an image sensor 206, and a lamp 207. The pressure detection sensor 202, the tilt detection sensor 203, the temperature detection sensor 204, the light sensor 205, the image sensor 206, and the lamp 207 are fixed to the base 201 and driven by power supplied from a battery 212.

[0070] The pressure detection sensor 202 detects the pressure applied to the inspection table 200. Figure 9 As shown, the pressure detection sensor 202 positioned directly below the camera unit 62 detects information such as the pressure of the air 62a ejected from the camera unit 62. The air 62a is ejected when removing cutting fluid and the like from the front surface of the workpiece 100. Furthermore, the pressure detection sensor 202 can also detect information such as the pressure of the cutting fluid when it is supplied to the front surface of the workpiece 100.

[0071] The tilt detection sensor 203 detects the tilt of the inspection table 200 about both the X and Z axes. The tilt detection sensor 203 detects, for example, the tilt of the table surface of the chuck table 30 and information on yaw and pitch associated with movement of the chuck table 30 .

[0072] The temperature detection sensor 204 detects the front surface temperature of the inspection table 200. Figure 10 As shown, the temperature detection sensor 204 positioned directly below the cutting tool 66 of the machining unit 60 detects information such as the room temperature of the machining chamber during cutting or the temperature of the cooling water 68a supplied from the cooling water supply nozzle 68 to the cutting tool 66. Furthermore, the temperature detection sensor 204 also detects information such as the temperature of the cutting fluid supplied from the first and second cutting fluid supply nozzles 67 during cutting.

[0073] The light quantity sensor 205 detects the light quantity of the light irradiated to the inspection table 200. Figure 11 As shown, the image sensor unit 621 included in the camera unit 62 captures, for example, the processing status of the workpiece 100. The light intensity sensor 205 positioned directly below the image sensor unit 621 detects information such as the amount of incident light emitted from the incident light unit 622 via the condenser lens 623, and the amount of autofocus light and angle recognition light intensity based on the oblique light emitted from the oblique light unit 624. Furthermore, based on the light intensity information acquired by the light intensity sensor 250, the operator can also check for contamination of the lens or lamp cover of the camera of the image sensor unit 621.

[0074] The image sensor 206 obtains an image of the upper portion of the inspection table 200. Figure 12 As shown, the image sensor 206 positioned directly below the processing unit 60 is used to obtain the image as shown in FIG. Figure 13 For example, the image G1 shows the positional relationship between the cutting tool 66 and the cooling water supply nozzle 68. Figure 13 The image G1 shown shows that the cutting tool 66 is not positioned parallel to one side (the lower side) of the cooling water supply nozzle 68. The lamp 207 emits light in conjunction with the imaging timing of the image sensor 206.

[0075] In addition, the inspection workbench 200 has an information communication unit 208 (an example of an information transmission unit). The information communication unit 208 transmits the detection information detected by the pressure detection sensor 202, the tilt detection sensor 203, the temperature detection sensor 204, the light quantity sensor 205, and the image sensor 206 to the outside. The information communication unit 208 can, for example, transmit the detection information to the control unit 39 or the terminal device 300. The information communication unit 208 can transmit the detection information wirelessly or by wire. The information communication unit 208 can support a short-range wireless communication standard for communicating with the control unit 39 or the terminal device 300. Examples of short-range wireless communication standards that the information communication unit 208 can support include WiMAX (registered trademark) (Worldwide interoperability for Microwave Access), IEEE802.11, and Bluetooth (registered trademark). The information communication unit 208 can have a terminal connected to the control unit 39 or the terminal device 300 via a communication cable corresponding to the communication standard of the control unit 39 or the terminal device 300. Examples of terminals that the information communication unit 208 can have include USB (Universal Serial Bus), HDMI (registered trademark) (High-Definition Multimedia Interface), MHL (Mobile High-definition Link), and LAN (Local Area Network) connectors.

[0076] Furthermore, the inspection workbench 200 includes a storage unit 209 and a calculation processing unit 211 .

[0077] The storage unit 209 stores programs that implement the functions of the various processes performed by the inspection workbench 200 according to the embodiment, as well as data used in the processes executed by the programs. The storage unit 209 includes non-volatile or volatile semiconductor memories such as RAM (Random Access Memory), ROM (Read Only Memory), flash memory, EPROM (Erasable Programmable Read Only Memory), and EEPROM (Electrically Erasable Programmable Read Only Memory). The programs stored in the storage unit 209 can also be said to be program products having a non-transitory recording medium that can be read by the processor of the arithmetic processing unit 211 and contains multiple instructions for performing data processing that can be executed by the processor. The storage unit 209 can also be used as a temporary workspace when the processor of the arithmetic processing unit 211 executes the instructions written in the program.

[0078] The storage unit 209 (an example of a memory) has a detection information recording area 210. Figure 14 As shown, detection information detected by the pressure detection sensor 202 , the tilt detection sensor 203 , the temperature detection sensor 204 , the light amount sensor 205 , and the image sensor 206 included in the inspection table 200 is recorded in the detection information recording area 210 .

[0079] The arithmetic processing unit 211 operates according to the program stored in the storage unit 209 to execute various processes for the inspection workbench 200. The arithmetic processing unit 211 includes processors such as a CPU (Central Processing Unit), a microprocessor, a microcomputer, a DSP (Digital Signal Processor), and a system LSI (Large Scale Integration).

[0080] The processor included in the arithmetic processing unit 211 executes the program downloaded to the RAM included in the storage unit 209. This enables various processing functions performed by the inspection workstation 200. Examples of various processing functions performed by the inspection workstation 200 include a function of enabling communication with the control unit 39 or the terminal device 300 via a wireless or wired connection, a function of providing a data selection screen to the control unit 39 or the terminal device 300, and a function of providing detection information to the control unit 39 or the terminal device 300.

[0081] Alternatively, the processing unit 211 may be implemented as dedicated hardware. In this case, the processing unit 211 may be implemented as a single circuit, a composite circuit, a programmed processor, a parallel programmed processor, an ASIC (Application Specific Integrated Circuit), an FPGA (Field Programmable Gate Array), or a combination thereof.

[0082] The inspection workbench 200 also includes a battery 212. The battery 212 supplies power to various components of the inspection workbench 200. The battery 212 can be detachably mounted on the inspection workbench 200 or can be internally mounted on the inspection workbench 200. When the battery 212 is detachably mounted on the inspection workbench 200, either a primary battery or a secondary battery can be used. When the battery 212 is internally mounted on the inspection workbench 200, a secondary battery is preferred over a primary battery.

[0083] use Figure 15 An example of processing performed by the inspection workbench 200 according to the embodiment will be described. Figure 15 This is a flowchart showing an example of processing of the inspection workstation according to the embodiment. Figure 15 The processing shown is executed by the calculation processing unit 211 included in the inspection workbench 200 .

[0084] like Figure 15 As shown, the calculation processing unit 211 executes connection processing (step S101) in response to a request from the terminal device 300, for example.

[0085] When the connection process is completed, the calculation processing unit 211 transmits a data selection screen to the terminal device 300 as the connection destination (step S102). Figure 16 FIG. 1 is a diagram showing an example of a data selection screen according to an embodiment of the present invention. Figure 16As shown, a data selection screen 311 transmitted from the inspection table 200 to the terminal device 300 is displayed on the display 310 of the terminal device 300. Data selection screen 311 includes an operator-accessible item 312 for pressure data, an item 313 for tilt data, an item 314 for light intensity data, an item 315 for image data, an item 316 for temperature data, and a data acquisition button 317. Furthermore, data selection screen 311 includes check boxes 322 to 326 for accepting requests from the operator for each of items 312 to 316. To obtain pressure data from the inspection table 200, the operator selects check box 322 and then presses data acquisition button 317. This transmits a request to obtain pressure data to the inspection table 200.

[0086] Return to Figure 15 , the arithmetic processing unit 211 determines whether a data acquisition request is received from the terminal device 300 (step S103).

[0087] When receiving a data acquisition request from the terminal device 300 (step S103 , Yes), the arithmetic processing unit 211 reads the detection information corresponding to the item selected in the data acquisition request from the detection information recording area 210 (step S104 ).

[0088] Next, the calculation processing unit 211 transmits the detection information read from the detection information recording area 210 to the terminal device 300 (step S105 ).

[0089] Next, the calculation processing unit 211 determines whether a connection release request has been received from the terminal device 300 (step S106 ).

[0090] When receiving a connection release request from the terminal device 300 (step S106, yes), the processing unit 211 executes the connection release process (step S107), and ends Figure 15 The processing shown.

[0091] On the other hand, when it is determined that the connection release request has not been received from the terminal device 300 (step S106 , No), the calculation processing unit 211 returns to the determination of the above-mentioned step S103 .

[0092] In the above-mentioned step S103 , when it is determined that the data acquisition request has not been received from the terminal device 300 (step S103 , No), the calculation processing unit 211 moves on to the determination of the above-mentioned step S106 .

[0093] exist Figure 15In the example shown, the processing unit 211 provides the terminal device 300 with the detection information of the item selected by the operator. However, the processing unit 211 can also be configured to transmit all the detection information. In this case, after the connection with the terminal device 300 is completed, the processing unit 211 can read all the detection information recorded in the detection information recording area 210 and transmit it to the terminal device 300.

[0094] As described above, the inspection table 200 of the embodiment is used in the processing apparatus 2, which includes: the chuck table 30 that holds the workpiece 100 using its holding surface 33; the processing unit 60 that faces the holding surface 33 and processes the workpiece 100 held by the chuck table 30; the chuck table base 20 (an example of a table base) that detachably supports the chuck table 30; the processing unit moving mechanism 42 (an example of a moving unit) that moves the chuck table base 20 (an example of a table base); and the camera unit 62 that captures an image of the workpiece 100 held by the chuck table 30. The inspection table 200 includes a base portion 201 that is detachably supported on the holding surface 33 of the chuck table 30. The inspection workbench 200 also includes sensors (a pressure detection sensor 202, a tilt detection sensor 203, a temperature detection sensor 204, a light intensity sensor 205, and an image sensor 206) fixed to the base 201 and driven by power supplied from a battery 212. The inspection workbench 200 also includes an information communication unit 208 (an example of an information transmission unit) that transmits information detected by the sensors, and a battery 212 that supplies power to the sensors and the information communication unit 208.

[0095] Therefore, according to the inspection table 200 of the embodiment, for example, the pressure detection sensor 202 can detect information on the pressure of the air 62 a ejected from the camera unit 62 and information on the pressure of the cutting fluid supplied to the front surface of the workpiece 100 .

[0096] Furthermore, according to the inspection table 200 of the embodiment, for example, the tilt detection sensor 203 can detect information such as the tilt of the table surface of the chuck table 30 and the yaw and pitch associated with the movement of the chuck table 30 .

[0097] In addition, according to the embodiment, the inspection workbench 200 can, for example, detect the room temperature of the processing chamber or the temperature of the cooling water 68a supplied from the cooling water supply nozzle 68 to the cutting tool 66, the temperature of the cutting fluid supplied from the first and second cutting fluid supply nozzles 67, etc. through the temperature detection sensor 204.

[0098] Furthermore, according to the inspection stage 200 of the embodiment, for example, the light quantity sensor 205 can detect information such as the autofocus light quantity by incident light and oblique light, and the angle recognition light quantity.

[0099] Furthermore, according to the inspection workbench 200 of the embodiment, for example, the conditions around the machining unit 60 and the cutting tool 66 (the inclination of the cooling water supply nozzle 68 and the positional relationship between the cooling water supply nozzle 68 and the cutting tool 66) can be captured using the image sensor 206. By referring to the image captured by the inspection workbench 200, the operator can confirm the conditions around the machining unit 60 and the cutting tool 66 (the inclination of the cooling water supply nozzle 68 and the positional relationship between the cooling water supply nozzle 68 and the cutting tool 66).

[0100] Furthermore, according to the inspection workbench 200 of the embodiment, detection information detected by, for example, the pressure detection sensor 202, the tilt detection sensor 203, the temperature detection sensor 204, the light intensity sensor 205, and the image sensor 206 can be transmitted to the outside via the information communication unit 208. This allows, for example, an operator to check the status of the processing device 2 from a location away from a dark and narrow space without having to perform the check operation in the space.

[0101] The inspection workbench 200 of the embodiment also includes a storage unit 209 (an example of a memory) that stores detection information from the sensors (the pressure detection sensor 202, the tilt detection sensor 203, the temperature detection sensor 204, the light intensity sensor 205, and the image sensor 206). This allows the operator to obtain and use the detection information detected by the sensors as needed.

[0102] [Other implementation methods]

[0103] The inspection table 200 of the present invention is not limited to the above-described embodiment, and can be implemented in various modifications without departing from the spirit of the present invention. For example, the chuck table 30 may also include various sensors that the inspection table 200 includes.

[0104] Furthermore, by using the inspection table 200 for inspecting the laser irradiation unit, the surrounding conditions of the laser irradiation unit (the positional relationship between the vacuum unit that removes debris and the focusing lens) can be photographed and recorded. Therefore, the operator does not need to expend the effort of confirming the surrounding conditions of the laser irradiation unit (the positional relationship between the vacuum unit and the focusing lens) and can check the conditions from a location far away from the laser irradiation unit.

Claims

1. An inspection table used in a processing device, the processing device comprising: a chuck table that uses a holding surface to hold a workpiece; a processing unit that faces the holding surface and processes the workpiece held by the chuck table; a table base that supports the chuck table so that it can be loaded and unloaded; a moving unit that moves the table base; and a camera unit that photographs the workpiece held by the chuck table, wherein: The inspection workbench includes: a base portion detachably supported on the holding surface of the chuck table or the table base; a sensor fixed to the base portion and driven by electricity; an information transmitting unit for transmitting information detected by the sensor; as well as a battery that supplies power to the sensor and the information transmitting unit, The sensor includes at least a light quantity sensor and an image sensor. The light quantity sensor can detect the light quantity of the camera unit. The image sensor acquires an image above the inspection table. The information transmitting section transmits information detected by at least the light amount sensor and the image sensor.

2. The inspection workbench according to claim 1, wherein: The inspection table further includes a memory for recording detection information from the sensor.

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