Pad, display device including the pad, and method for manufacturing the display device

Abstract

Provided are a pad, a display device including the pad, and a method for manufacturing the display device. The pad includes: a first pad including a first shielding component protection portion, a first grip portion, and a connecting portion connecting the first shielding component protection portion and the first grip portion; and a second pad including a second shielding component protection portion and a second grip portion, wherein a cutoff line is included along a boundary between the first pad and the pad protection portion.

Description

Technical Field

[0001] The present invention relates to a pad and a display device comprising the same. Background Art

[0002] As multimedia develops, the importance of display devices is increasing. In response to this, various display devices such as liquid crystal display devices (LCD: Liquid Crystal Display) and organic light emitting display devices (OLED: Organic Light Emitting Display) are being used.

[0003] Various integrated circuits of a display device are factors that determine the performance of the display device. The higher the performance of the integrated circuit, the more power it consumes, which may cause heating problems or generate high-frequency electromagnetic waves in the integrated circuit. In order to prevent this situation, a shield can (shieldcan) covering the integrated circuit can be arranged when the integrated circuit is mounted on a printed circuit substrate.

[0004] The shielding can may be scratched or squeezed and deformed due to external reasons during the handling or assembly process. In order to prevent these problems, a pad can be attached to the surface of the shielding can for protection. In addition, a bar code containing information about the integrated circuit and the display device can be displayed on the shielding can. It is necessary to provide a pad that can simultaneously meet the purpose of protecting the surface of the shielding can and displaying information that is convenient for the operator. Summary of the invention

[0005] The technical problem that the present invention intends to solve is to provide a gasket and a display device including the same, which can simultaneously achieve the purpose of protecting a shielding can and providing information of an electronic component protected by the shielding can by sequentially separating the gasket according to process steps.

[0006] The technical problems of the present invention are not limited to the above-mentioned technical problems, and those skilled in the art can clearly understand other technical problems not mentioned according to the following description.

[0007] A gasket according to an embodiment for solving the technical problem includes: a first gasket including a first shielding component protection portion, a first hand grip portion, and a connection portion connecting the first shielding component protection portion and the first hand grip portion; and a second gasket including a second shielding component protection portion and a second hand grip portion. The gasket includes a cutoff line along a boundary between the first gasket and the second gasket. Preferably, the gasket includes a cutoff line along a boundary between the first gasket and the second shielding component protection portion.

[0008] The first shielding member protecting portion, the connecting portion, and the second shielding member protecting portion may be arranged to overlap with a shielding member surrounding at least one integrated circuit.

[0009] The first shielding member protecting portion may be arranged to overlap with a central region of the shielding member, and the second shielding member protecting portion may be arranged to overlap with an edge region of the shielding member.

[0010] The first gasket and the second gasket may include a film layer and a bonding layer bonding the film layer and the shielding member.

[0011] The adhesive layer may be included in at least one region of the first shielding member protecting portion and the second shielding member protecting portion.

[0012] The cutting lines may be formed by punching the film layer in a manner that the film layer is partially perforated along the corresponding positions thereof.

[0013] The cutting line may be formed by punching through the film layer and the bonding layer in a manner of partially perforating the film layer and the bonding layer along corresponding positions thereof.

[0014] A distance from an upper surface of a circuit substrate on which the integrated circuit is mounted to an upper surface of the film layer may be greater than a distance from an upper surface of the circuit substrate to an upper surface of the shielding member.

[0015] The first shielding member protecting portion may include information mark regarding the integrated circuit.

[0016] The information mark may be any one of numbers, text, barcode and QR code.

[0017] The shielding member may have a quadrilateral shape in plane.

[0018] The connection portion may be formed to overlap with a corner portion of the shielding member.

[0019] The first gripping portion may have a width equal to a transverse length of the shielding member and extend in a longitudinal direction of the shielding member.

[0020] The second grip portion may have a width equal to a longitudinal length of the shielding member and extend in a lateral direction of the shielding member.

[0021] The second grip portion may have a width equal to a lateral length of the shielding member and extend in a direction opposite to a direction in which the first grip portion extends.

[0022] An area at an upper end of the first grip portion and an area at an upper end of the second grip portion may further include a pull tab portion.

[0023] A method for manufacturing a display device according to one embodiment for solving the technical problem includes the following steps: preparing a circuit substrate on which at least one integrated circuit is mounted; arranging a shielding component around the integrated circuit; attaching a pad including a first pad and a second pad on the shielding component; displaying information marks about the integrated circuit on the first pad; combining the circuit substrate with a display panel; removing the first pad; displaying the information marks on the shielding component with the first pad removed; combining the display panel with a display device; and removing the second pad.

[0024] The first gasket and the second gasket may include a film layer and a bonding layer bonding the film layer and the shielding member.

[0025] A distance from an upper surface of the substrate to an upper surface of the film layer may be greater than a distance from an upper surface of the circuit substrate to an upper surface of the shielding component.

[0026] A display device according to an embodiment for solving the technical problem includes: a circuit substrate; an integrated circuit mounted on the circuit substrate; a shielding component formed to surround the integrated circuit; and a pad attached to the shielding component in a releasable manner, wherein the pad includes: a first pad equipped with a first shielding component protection portion, a first grip portion, and a connection portion connecting the first shielding component protection portion and the first grip portion; a second pad equipped with a second shielding component protection portion and a second grip portion. The pad includes a cutoff line along a boundary between the first pad and the second pad. Preferably, the cutoff line is included along a boundary between the first pad and the second shielding component protection portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a perspective view showing a display device according to an embodiment.

[0028] Figure 2 is an exploded perspective view of a display device according to an embodiment.

[0029] Figure 3 It is shown Figure 2 A bottom view of an example of a cover window, touch circuit board, display circuit board, and lower panel components.

[0030] Figure 4 It is shown Figure 2 A plan view of an example of a display circuit board, a second connecting cable and an intermediate frame.

[0031] Figure 5 It is shown Figure 2 A plan view of an example of a second connection cable and a main circuit board.

[0032] Figure 6 1 is a plan view showing an example of a shield case arranged on a main circuit board.

[0033] Figure 7 is a plan view showing a gasket attached to a shielding case according to an embodiment.

[0034] Figure 8 1 is a plan view showing a state in which a first gasket is removed and only a second gasket is attached to a shield case according to an embodiment.

[0035] Fig. 9 is a plan view showing a state in which a gasket is removed from a shield case according to an embodiment.

[0036] Fig.10 is along Figure 7 A cross-sectional view of a main circuit board according to an embodiment is shown taken along line II'.

[0037] Fig.11 is along Figure 8 A cross-sectional view of a main circuit board according to an embodiment is shown taken along line II-II'.

[0038] Fig.12 is a plan view showing a gasket attached to a shield case according to another embodiment.

[0039] Fig.13 is a plan view showing a state in which a first gasket is removed and only a second gasket is attached to a shield case according to another embodiment.

[0040] Fig.14 is along Fig.12 A cross-sectional view of a main circuit board according to another embodiment is shown taken along line III-III'.

[0041] Fig.15 is along Fig.13 A cross-sectional view of a main circuit board according to another embodiment is shown taken along line IV-IV'.

[0042] Fig.16 is a flowchart illustrating a method of manufacturing a display device including a spacer according to an embodiment. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] 700: Main circuit board 740: Power management integrated circuit

[0045] SH: Shielding can PT: Pull tab

[0046] LN1, LN3: first gasket LN2, LN4: second gasket

[0047] LN_FL: film layer LN_AD: bonding layer DETAILED DESCRIPTION

[0048] References and Attachments Figure 1 The advantages and features of the present invention and the methods for achieving them will be made clear by the detailed embodiments described below. However, the present invention is not limited to the embodiments disclosed below, but can also be implemented in other forms. That is, the present invention is only defined by the scope of the claims.

[0049] When an element or layer is referred to as being "on" or "above" another element or layer, it includes not only the case where the element or layer is located immediately above the other element or layer, but also the case where other layers or other elements are present between the two. Conversely, when an element is referred to as being "directly on" or "immediately above", it means that no other element or layer is present between the two.

[0050] Throughout the specification, the same reference numerals are used to refer to the same or like parts.

[0051] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0052] Figure 1 is a perspective view showing a display device according to an embodiment. Figure 2 is an exploded perspective view of a display device according to an embodiment.

[0053] Reference Figure 1 and Figure 2 According to an embodiment, a display device 10 includes a cover window 100, a touch sensing device 200, a touch circuit board 210, a touch driving unit 220, a display panel 300, a display circuit board 310, a display driving unit 320, a panel lower part 400, a sound generating device (not shown), a middle frame 600, a main circuit board 700, an auxiliary circuit board 800 and a lower cover 900.

[0054] In this specification, "upper", "top", and "above" refer to the direction in which the cover window 100 is arranged based on the display panel 300, that is, the Z-axis direction; "lower", "bottom", and "below" refer to the direction in which the intermediate frame 600 is arranged based on the display panel 300, that is, the opposite direction of the Z-axis direction. In addition, "left", "right", "upper", and "lower" refer to directions when the display panel 300 is viewed from a plane. For example, "left" refers to the opposite direction of the X-axis direction, "right" refers to the X-axis direction, "upper" refers to the Z-axis direction, and "lower" refers to the opposite direction of the Z-axis direction.

[0055] The display device 10 may be configured in a rectangular shape on a plane. Figure 1 and Figure 2 As shown, the display device 10 may have a rectangular planar shape with short sides in the first direction (X-axis direction) and long sides in the second direction (Y-axis direction). The corners where the short sides in the first direction (X-axis direction) and the long sides in the second direction (Y-axis direction) intersect may be formed into an arc shape with a curvature, or may be formed into a right angle. The planar shape of the display device 10 is not limited to a rectangle, and may be formed into other polygonal shapes, a circle, or an ellipse.

[0056] The display device 10 may include a first region DR1 formed flatly and a second region DR2 extending from the left and right sides of the first region DR1. The second region DR2 may be formed flatly or in a curved surface. In the case where the second region DR2 is formed flatly, the angle formed by the first region DR1 and the second region DR2 may be an obtuse angle. In the case where the second region DR2 is formed in a curved surface, the second region DR2 may have a predetermined curvature or a varying curvature.

[0057] Although Figure 1 The second region DR2 is shown to extend from the left and right sides of the first region DR1, but is not limited thereto. That is, the second region DR2 may extend from only one of the left and right sides of the first region DR1. Alternatively, the second region DR2 may extend not only from the left and right sides of the first region DR1, but also from at least one of the upper and lower sides. The following description will focus on the case where the second region DR2 is arranged at the left and right side edges of the display device 10.

[0058] The cover window 100 may be arranged on the upper portion of the display panel 300 to cover the upper surface of the display panel 300. Therefore, the cover window 100 may play a function of protecting the upper surface of the display panel 300. The cover window 100 may be attached to the touch sensing device 200 by an adhesive component. The adhesive component may be a transparent adhesive film (OCA: optically cleared adhesive film) or a transparent adhesive resin (OCR: optically cleared resin).

[0059] The cover window 100 may include a transmissive portion DA100 corresponding to the display panel 300 and a light shielding portion NDA100 corresponding to an area other than the display panel 300. The cover window 100 may be arranged in the first area DR1 and the second area DR2. The transmissive portion DA100 may be arranged in a portion of the first area DR1 and a portion of the second area DR2. The light shielding portion NDA100 may be formed to be opaque. Alternatively, the light shielding portion NDA100 may be formed by a decorative layer having a pattern that can be shown to a user when an image is not displayed. For example, the light shielding portion NDA100 may be patterned with a company logo or a variety of text. In addition, although a hole HH for exposing a front camera, an iris recognition sensor, a brightness sensor, etc. may be formed in the light shielding portion NDA100, it is not limited thereto. For example, a part or all of the front camera, the iris recognition sensor, and the brightness sensor may be built into the display panel 300, in which case a part or all of the hole HH may be deleted.

[0060] The cover window 100 may be formed of glass, sapphire, and / or plastic. The cover window 100 may be formed to have rigidity or flexibility.

[0061] The touch sensing device 200 may be disposed between the cover window 100 and the display panel 300. The touch sensing device 200 may be disposed in the first region DR1 and the second region DR2. Therefore, the user's touch may be sensed not only in the first region DR1 but also in the second region DR2.

[0062] The touch sensing device 200 may be attached to the lower side of the cover window 100 by an adhesive member. In order to prevent visibility reduction due to external light reflection, a polarizing film may be added to the touch sensing device 200. In this case, the polarizing film may be attached to the lower side of the cover window 100 by an adhesive member.

[0063] The touch sensing device 200 is a device for sensing the touch position of the user, and can be implemented by a capacitance method such as a self-capacitance method or a mutual capacitance method. The touch sensing device 200 includes only a touch drive electrode when implemented in a self-capacitance method, and on the contrary, it can include a touch drive electrode and a touch sensing electrode when implemented in a mutual capacitance method. The following description is centered on the case where the touch sensing device is implemented in a mutual capacitance method.

[0064] The touch sensing device 200 may be formed in a plate form or a film form. In this case, the touch sensing device 200 may be attached to the thin film encapsulation film of the display panel 300 by an adhesive member. The adhesive member may be a transparent adhesive film (OCA) or a transparent adhesive resin (OCR).

[0065] Alternatively, the touch sensing device 200 may be integrally formed with the display panel 300. In this case, the touch driving electrodes and the touch sensing electrodes of the touch sensing device 200 may be formed on a thin film packaging film of the display panel 300, or a packaging substrate or packaging film covering a light emitting element layer of the display panel 300.

[0066] A touch circuit board 210 may be attached to one side of the touch sensing device 200. Specifically, one end of the touch circuit board 210 may be attached to a pad provided on one side of the touch sensing device 200 using an anisotropic conductive film. In addition, a touch connection portion may be provided at the other end of the touch circuit board 210, and the touch connection portion may be connected to a touch connector 312a (see FIG. 3 ) of the display circuit board 310. Figure 3 The touch circuit board 210 may be a flexible printed circuit board.

[0067] The touch driving unit 220 may apply a touch driving signal to the touch driving electrodes of the touch sensing device 200, sense a sensing signal from the touch sensing electrodes of the touch sensing device 200, and analyze the sensing signal to calculate touch information such as a user's touch position and touch pressure. The touch driving unit 220 may be formed as an integrated circuit and mounted on the touch circuit board 210.

[0068] The display panel 300 may be disposed at a lower portion of the touch sensing device 200. The display panel 300 may be disposed to overlap the transmission portion DA100 of the cover window 100. The display panel 300 may be disposed in the first region DR1 and the second region DR2. Therefore, an image of the display panel 300 may be seen not only in the first region DR1 but also in the second region DR2.

[0069] The display panel 300 may be a light emitting display panel including a light emitting element. For example, the display panel 300 may be an organic light emitting display panel using an organic light emitting diode, an ultra-small light emitting diode display panel using a micro LED, and a quantum dot light emitting display panel including a quantum dot light emitting element.

[0070] The display panel 300 may include: a substrate; a thin film transistor layer disposed on the substrate; a light emitting element layer; and a thin film encapsulation layer.

[0071] Since the display panel 300 is implemented to be flexible, it can be formed using plastic. In this case, the substrate may include a flexible substrate and a supporting substrate. The supporting substrate is used to support the flexible substrate, so its flexibility may be poorer than that of the flexible substrate. The flexible substrate and the supporting substrate may respectively include a flexible polymer substance. For example, the flexible substrate and the supporting substrate may respectively include polyethersulfone (PES: polyethersulfone), polyacrylate (PA: polyacrylate), polyarylate (PAR: polyarylate), polyetherimide (PEI: polyetherimide), polyethylene naphthalate (PEN: polyethylenenapthalate), polyethylene terephthalate (PET: polyethyeleneterepthalate), polyphenylene sulfide (PPS: polyphenylenesulfide), polyallylate (polyallylate), polyimide (PI: polyimide), polycarbonate (PC: polycarbonate), cellulose triacetate (CAT: cellulosetriacetate), cellulose acetate propionate (CAP: cellulose acetate propionate) or a combination thereof.

[0072] A thin film transistor layer is arranged on the substrate. The thin film transistor layer may include a scan line, a data line and a thin film transistor. The thin film transistor includes a gate electrode, a semiconductor layer, a source electrode and a drain electrode respectively. In the case where the scan drive unit is directly formed on the substrate, it can be formed together with the thin film transistor layer.

[0073] A light emitting element layer is arranged on the thin film transistor layer. The light emitting element layer includes an anode electrode, a light emitting layer, a cathode electrode and a bank. The light emitting layer may include an organic light emitting layer containing an organic substance. For example, the light emitting layer may include a hole injection layer, a hole transporting layer, an organic light emitting layer, an electron transporting layer and an electron injection layer. The hole injection layer and the electron injection layer may be omitted. If a voltage is applied to the anode electrode and the cathode electrode, the holes and electrons move to the organic light emitting layer through the hole transporting layer and the electron transporting layer, respectively, and emit light by combining with each other in the organic light emitting layer. The light emitting element layer may be a pixel array layer formed with pixels, and therefore, the area formed with the light emitting element layer may be defined as a display area for displaying an image. The surrounding area of ​​the display area may be defined as a non-display area.

[0074] A thin film encapsulation layer is arranged on the light emitting element layer. The thin film encapsulation layer plays a role in preventing oxygen or moisture from penetrating into the light emitting element layer. The thin film encapsulation layer may include at least one inorganic film and at least one organic film.

[0075] A display circuit board 310 may be attached to one side of the display panel 300. Specifically, one end of the display circuit board 310 may be attached to a pad provided on one side of the display panel 300 using an anisotropic conductive film. The display circuit board 310 may be bent toward the bottom of the substrate of the display panel 300. The touch circuit board 210 may also be bent toward the bottom of the display panel 300. Therefore, the touch connection portion provided at one end of the touch circuit board 210 may be connected to the touch connector 312a of the display circuit board 310. The detailed description of the display circuit board 310 will be combined with the Figures 3 to 5 And then described.

[0076] The display driver 320 outputs signals and voltages for driving the display panel 300 through the display circuit board 310. The display driver 320 may be formed as an integrated circuit and mounted on the display circuit board 310, but is not limited thereto. For example, the display driver 320 may be directly attached to the substrate of the display panel 300, in which case, it may be attached to the upper or lower side of the substrate of the display panel 300.

[0077] A panel lower member 400 may be disposed at a lower portion of the display panel 300. The panel lower member 400 may be attached to the lower side of the display panel 300 by an adhesive member. The adhesive member may be a transparent adhesive film (OCA) or a transparent adhesive resin (OCR).

[0078] The panel lower part 400 may include at least one of a light absorbing part for absorbing light incident from the outside, a buffer part for absorbing impact from the outside, a heat dissipating part for effectively dissipating heat of the display panel 300, and a light shielding layer for blocking light incident from the outside.

[0079] The light absorbing member may be disposed at the lower portion of the display panel 300. The light absorbing member may block the transmission of light and prevent the components disposed at the lower portion of the light absorbing member (i.e., the display circuit board 310, etc.) from being visible at the upper portion of the display panel 300. The light absorbing member may include a light absorbing substance such as a black pigment or dye.

[0080] The buffer component may be arranged at the lower part of the light absorbing component. The buffer component absorbs external impact to prevent the display panel 300 from being damaged. The buffer component may be formed into a single layer or multiple layers. For example, the buffer component may be formed using a polymer resin such as polyurethane, polycarbonate, polypropylene, polyethylene, or may be formed to include elastic materials such as rubber, polyurethane-based materials, and sponges formed by foaming acrylic materials. The buffer component may be a cushion layer.

[0081] The heat dissipation component may be arranged at the bottom of the buffer component. The heat dissipation component may include: a first heat dissipation layer, including graphite or carbon nanotubes, etc.; and a second heat dissipation layer, which can shield electromagnetic waves and is formed by using a metal film such as copper, nickel, ferrite, silver, etc. with excellent thermal conductivity.

[0082] The lower portion of the panel lower part 400 may be disposed with a middle frame 600. The middle frame 600 may include synthetic resin or metal, or may include both synthetic resin and metal.

[0083] The middle frame 600 may include a first camera hole CMH1 for inserting the camera device 720 , a battery hole BH for heat dissipation of a battery, and a through hole CAH for passing the second connection cable 314 connected to the display circuit board 310 .

[0084] A waterproof member 610 may be disposed at the edge of the middle frame 600. The waterproof member 610 may be bonded to the upper surface of the panel lower member 400 and the lower surface of the middle frame 600, so that moisture or dust may be prevented from penetrating between the display panel 300 and the middle frame 600 by the waterproof member 610. That is, a display device 10 capable of achieving waterproof and dustproof may be provided.

[0085] Specifically, the waterproof component 610 may include: a base film; a first adhesive film arranged on one side of the base film, and a second adhesive film arranged on the other side of the base film. The base film may be a cushion layer such as polyethylene terephthalate (PET) or polyethylene foam (PE-foam). The first adhesive film and the second adhesive film may be pressure sensitive adhesives (PSA). The first adhesive film may be bonded to the bottom of the panel lower component 400, and the second adhesive film may be bonded to the top of the middle frame 600.

[0086] A main circuit board 700 may be disposed at a lower portion of the middle frame 600. The main circuit board 700 may be a printed circuit board or a flexible printed circuit board.

[0087] The main circuit board 700 may include a main processor 710, a shielding can SH, a camera device 720, a main connector 730, a power management integrated circuit (PMIC: Power management IC) 740, a first microphone 780, and a first auxiliary connector 790. The main processor 710, the main connector 730, the first microphone 780, and the first auxiliary connector 790 may be arranged on the lower surface of the main circuit board 700 facing the lower cover 900. Also, the camera device 720 may be arranged both above and below the main circuit board 700.

[0088] The main processor 710 can control all functions of the display device 10. For example, the main processor 710 can output image data to the display driver 320 of the display circuit board 310 so that the display panel 300 displays an image. In addition, the main processor 710 can receive touch data from the touch driver 220 to determine the user's touch position and then run an application indicated by an icon displayed at the user's touch position. In addition, the main processor 710 can receive touch data from the touch driver 220 and run an application indicated by an icon displayed at the user's touch position according to the touch data.

[0089] The main processor 710 may be an application processor, a central processing unit, or a system chip constructed using an integrated circuit.

[0090] The power management integrated circuit 740 may be electrically connected to the touch circuit board 210, the touch driving unit 220, the display circuit board 310, the display driving unit 320, and the main processor 710. The power management integrated circuit 740 may control the power supplied to the touch circuit board 210, the touch driving unit 220, the display circuit board 310, the display driving unit 320, and the main processor 710. According to an embodiment, the power management integrated circuit 740 may control the power supplied to the display panel 300 during the period when the display panel 300 is driven in the normal power mode. In the present application, the normal power mode refers to a mode in which the main processor 710 drives the display panel 300 during an awake state.

[0091] The camera device 720 may process image frames such as still images or videos obtained by an image sensor in a camera mode and output the processed images to the main processor 710 .

[0092] The main connector 730 may be connected with the second connection cable 314 passing through the through hole CAH of the middle frame 600. Thus, the main circuit board 700 may be electrically connected to the display circuit board 310 and the touch circuit board 210.

[0093] The first microphone 780 may be disposed on one side of the display device 10. The first microphone 780 may sense sound waves and ultrasonic waves. For example, the first microphone 780 may sense sound waves having a frequency lower than 20 kHz and ultrasonic waves having a frequency of 20 kHz to 50 kHz. Therefore, when the sound generating device (not shown) vibrates the display panel 300 in the proximity sensor mode to output ultrasonic waves, the ultrasonic waves reflected by the object may be sensed by the first microphone 780. The first microphone 780 may convert the sensed ultrasonic waves into a first electrical signal and output it to the main processor 710.

[0094] A third connection cable 890 connected to the auxiliary circuit board 800 may be connected to the first auxiliary connector 790. The main circuit board 700 and the auxiliary circuit board 800 may be electrically connected through the third connection cable 890.

[0095] In addition, a mobile communication module capable of transmitting and receiving wireless signals with at least one of a base station, an external terminal, and a server on a mobile communication network may be installed on the main circuit board 700. The wireless signal may include a voice signal, a video call signal, or data in various forms based on text / multimedia message transmission and reception.

[0096] The auxiliary circuit board 800 may include a second microphone 810 and a second auxiliary connector 820. The second microphone 810 and the second auxiliary connector 820 may be disposed on a lower surface of the main circuit board 700 facing the lower cover 900.

[0097] The second microphone 810 may be arranged on the opposite side of the display device 10 to the side on which the first microphone 780 is arranged. The second microphone 810 may sense sound waves and ultrasonic waves. For example, the second microphone 810 may sense sound waves having a frequency lower than 20 kHz and ultrasonic waves having a frequency of 20 kHz to 50 kHz. Therefore, when the sound generating device (not shown) vibrates the display panel 300 in the proximity sensor mode to output ultrasonic waves, the ultrasonic waves reflected by the object may be sensed by the second microphone 810. The second microphone 810 may convert the sensed ultrasonic waves into a second electrical signal and output it to the main processor 710.

[0098] The main processor 710 may determine whether an object is close to the display device 10 based on the first electrical signal of the first microphone 780 and the second electrical signal of the second microphone 810. A third connection cable 890 connected to the main circuit board 700 may be connected to the second auxiliary connector 820. The main circuit board 700 and the auxiliary circuit board 800 may be electrically connected through the third connection cable 890.

[0099] The lower cover 900 may be disposed at the lower portion of the middle frame 600 and the main circuit board 700. The lower cover 900 may be fastened to the middle frame 600 to be fixed. The lower cover 900 may form the lower appearance of the display device 10. The lower cover 900 may include plastic and / or metal.

[0100] In the lower cover 900, in order to allow the first microphone 780 to sense sound waves or ultrasonic waves from the outside, a first microphone hole MH1 may be formed at the position where the first microphone 780 is arranged. In addition, in the lower cover 900, in order to allow the second microphone 810 to sense sound waves or ultrasonic waves from the outside, a second microphone hole MH2 may be formed at the position where the second microphone 810 is arranged.

[0101] Furthermore, the lower cover 900 may be formed with a second camera hole CMH2 into which the camera device 720 is inserted and protrudes to the outside. The position of the camera device 720 and the positions of the first camera hole CMH1 and the second camera hole CMH2 corresponding to the camera device 720 are not limited to Figure 2 The embodiment shown.

[0102] Figure 3 It is shown Figure 2 A bottom view of an example of a cover window, touch circuit board, display circuit board, and lower panel components. Figure 4 It is shown Figure 2 A plan view of an example of a display circuit board, a second connecting cable and an intermediate frame. Figure 5 It is shown Figure 2 A plan view of an example of a second connecting cable. Figure 4 and Figure 5 is a planar graph, on the contrary, Figure 3 This is a bottom view, so please note Figure 4 and Figure 5 The left and right sides of the display device 10 are shown oppositely.

[0103] The following, combined Figures 3 to 5 A method of connecting the second connection cable 314 connected to the display circuit board 310 to the main connector 730 of the main circuit board 700 will be described in detail.

[0104] Reference Figures 3 to 5 The display circuit board 310 may include a first circuit board 311 , a second circuit board 312 , and a first connection cable 313 .

[0105] The first circuit board 311 may be attached to one side of the upper or lower side of the substrate of the display panel 300, and may be bent toward the lower side of the display panel 300. The first circuit board 311 may be fixed by a fixing member such as Figure 4 As shown, it is fixed to the fixing hole FH formed in the middle frame 600.

[0106] The first circuit board 311 may include a display driving unit 320 and a first connector 311 a. The display driving unit 320 and the first connector 311 a may be arranged on one surface of the first circuit board 311 .

[0107] The first connector 311a may be connected to one end of a first connection cable 313 connected to the second circuit board 312. Accordingly, the display driving part 320 mounted on the first circuit board 311 may be electrically connected to the second circuit board 312 through the first connection cable 313.

[0108] The second circuit board 312 may include a touch connector 312a, a first connection connector 312b, and a second connection connector 312c. The first connection connector 312b and the second connection connector 312c may be arranged on one side of the second circuit board 312, and the touch connector 312a may be arranged on the other side of the second circuit board 312.

[0109] The touch connector 312a may be connected to a touch connection portion provided at one end of the touch circuit board 210. Therefore, the touch driving portion 220 may be electrically connected to the second circuit board 312.

[0110] The first connection connector 312b may be connected to the other end of the first connection cable 313 connected to the first circuit board 311. Therefore, the display driving part 320 mounted on the first circuit board 311 may be electrically connected to the second circuit board 312 through the first connection cable 313.

[0111] The second connection connector 312c may be connected to one end of the second connection cable 314 connected to the main connector 730 of the main circuit board 700. Therefore, the second circuit board 312 may be electrically connected to the main circuit board 700 through the second connection cable 314.

[0112] A connector connection portion 315 may be formed at the other end of the second connection cable 314. The connector connection portion 315 of the second connection cable 314 may be formed as shown in FIG. Figure 4 As shown in FIG. 1 , the central frame 600 extends toward the lower portion of the central frame 600 through the through hole CAH of the central frame 600. Figure 5 As shown in FIG. 1 , the connector connection portion 315 of the second connection cable 314 passing through the through hole CAH can pass through the gap between the middle frame 600 and the main circuit board 700 and extend toward the lower part of the main circuit board 700. Finally, the connector connection portion 315 of the second connection cable 314 can be as shown in FIG. Figure 5 As shown, it is connected to a main connector 730 arranged on the underside of the main circuit board 700.

[0113] according to Figures 3 to 5 In the illustrated embodiment, the second connection cable 314 connected to the display circuit board 310 can extend to the lower portion of the middle frame 600 through the through hole CAH of the middle frame 600, thereby being connected to the main connector 730 of the main circuit board 700. Therefore, the display circuit board 310 and the main circuit board 700 can be stably connected.

[0114] Figure 6 1 is a plan view showing an example of a shielding can arranged on a main circuit board. Figure 6 , the shielding can SH may be arranged to cover the power management integrated circuit 740. At least one shielding can SH may be arranged on the main circuit board 700, and may transfer the heat generated from the power management integrated circuit 740 to the heat dissipation component or shield the electromagnetic waves generated from the external electronic components such as the main processor 710. According to one embodiment, the shielding can SH may cover the outside of the power management integrated circuit 740 in a can or box form using a metal plate or a synthetic resin added with a conductive metal, so that the heat generated from the power management integrated circuit 740 can be transferred to the heat dissipation component or the electromagnetic waves generated from the external electronic components such as the main processor 710 can be shielded. According to one embodiment, the shielding can SH may be provided in a box shape with an opening at the bottom so as to cover the power management integrated circuit 740. The form of the shielding can SH is not limited to the can or box form described above, and may also be formed in other forms that can transfer the heat generated from the power management integrated circuit 740 to the heat dissipation component or shield the electromagnetic waves generated from the external electronic components such as the main processor 710, and therefore may also be referred to as a shielding component.

[0115] In addition, although Figure 6 7. The shielding can SH is shown to be arranged to cover the power management integrated circuit 740, but the shielding can SH may also be arranged to cover other electronic components such as the main processor 710.

[0116] like Fig.10 As shown, the shielding tank SH can be welded and combined with the main circuit board 700. For example, the main circuit board 700 may include a solder portion SD to electrically connect the shielding tank SH and the main circuit board 700. According to one embodiment, the shielding tank SH may include a conductive shielding layer CL. The conductive shielding layer CL may be formed using a metal material such as copper (Cu). For example, the conductive shielding layer CL may have a metal film form formed using a copper material. According to one embodiment, the conductive shielding layer CL may be formed using a copper material strip. The conductive shielding layer CL may shield electromagnetic waves generated from the power management integrated circuit 740.

[0117] Refer again Figure 6 , an information mark IM including information about the power management integrated circuit 740 may be displayed on the shielding can SH. The information mark IM may include information about the product name, model name, manufacturer name, serial number (S / N), part number (P / N), firmware number, interface mode, operating conditions, etc. The information mark IM may be, for example, at least one of a number, text, number and unit, a bar code, and a QR code containing information about the operating conditions. In some embodiments, the information mark IM may also include symbols and / or graphics. The information mark IM may be formed, for example, by a screen printing method, an imprint method, a roll off-set print method, or a laser marking method, or may be formed by filling ink or paints in a groove formed by a laser marking method.

[0118] Hereinafter, a gasket according to an embodiment will be described.

[0119] Figure 7 is a plan view showing a gasket attached to a shielding can. Figure 8 It is a plan view showing a state in which the first gasket is removed and only the second gasket is attached to the shield can. Fig. 9 It is a plan view showing a state where the gasket is removed from the shield can.

[0120] Reference Figures 7 to 9 In order to prevent the shielding tank SH from being scratched or squeezed and deformed due to external force, a liner LN may be attached to the shielding tank SH.

[0121] The gasket LN may be attached to one side of the shielding can SH. Although the gasket LN is attached to one side of the shielding can SH for protection during the process of transporting or loading the display panel 300, it is peeled off and removed during the process of installing the display panel 300 in the component of the electronic device. In addition, an information mark IM including information about the power management integrated circuit 740 may be displayed on an area of ​​the gasket LN. Therefore, the information about the power management integrated circuit 740 can be easily confirmed before the gasket LN is removed from the shielding can SH.

[0122] The overall planar shape of the liner LN may be an "L" shape. For example, the liner LN may be a film formed integrally of a first liner LN1 and a second liner LN2, that is, the first liner LN1 has a width the same as the lateral length of the shielding tank SH and extends toward the upper side of the shielding tank SH, and the second liner LN2 has a width the same as the longitudinal length of the shielding tank SH and extends toward the right side of the shielding tank SH. In order to easily separate the first liner LN1 and the second liner LN2, a cutoff line may be formed in the boundary area between the first liner LN1 and the second liner LN2. Here, the cutoff line may be formed by punching through the film layer LN_FL along its corresponding position in a manner of partially perforating the film layer LN_FL described later, or by punching through the film layer LN_FL and the bonding layer LN_AD described later along its corresponding position in a manner of partially perforating the film layer LN_FL and the bonding layer LN_AD described later. The first liner LN1 may include: a first grip portion LN1_a for easily removing a film; a first shielding can protection portion LN1_b for protecting a surface of a central region of the shielding can SH; and a connecting portion LN1_c connecting the first grip portion LN1_a and the first shielding can protection portion LN1_b.

[0123] According to an embodiment, an information mark IM including information about the power management integrated circuit 740 may be displayed on the first shielding can protection part LN1_b. The first shielding can protection part LN1_b may have a quadrilateral shape that is the same as the shape of the shielding can SH and has a reduced area at a predetermined ratio. However, it is not limited thereto, and may also be a polygon or a circle as long as it has a shape and area that can cover the area where the information mark IM including information about the power management integrated circuit 740 is displayed.

[0124] The first grip portion LN1_a may be a quadrilateral shape having the same width as the lateral length of the shielding can SH and extending toward the upper side of the shielding can SH. However, it is not limited thereto and may be formed in various shapes and patterns in a manner that enables an operator to easily remove the first liner LN1. For example, the width of the first grip portion LN1_a may be formed to be the same as the width of the connecting portion LN1_c.

[0125] The connection portion LN1_c allows the operator to remove the first shielding tank protection portion LN1_b and the first grip portion LN1_a simultaneously when removing the first liner LN1. According to one embodiment, the operator can grasp the left upper end of the first grip portion LN1_a and try to peel off the first liner LN1 toward the right lower end. Therefore, the connection portion LN1_c can be formed to overlap the corner portion located at the left upper end of the shielding tank SH.

[0126] After the first pad LN1 is removed, the information mark IM including information on the power management integrated circuit 740 may be represented on one side of the shield can SH. Therefore, the information on the power management integrated circuit 740 may be confirmed even after the first pad LN1 is removed from the shield can SH.

[0127] The second gasket LN2 may include: a second gripping portion LN2_a for easily removing the film; and a second shielding can protecting portion LN2_b for protecting the surface of the edge region of the shielding can SH.

[0128] The second grip portion LN2_a may be a quadrilateral shape having the same width as the longitudinal length of the shielding tank SH and extending toward the right side of the shielding tank SH. However, it is not limited thereto and may be formed into a variety of shapes and patterns in a manner that enables an operator to easily remove the second liner LN2. For example, the width of the second grip portion LN2_a may be formed to be the same as the width of the second shielding tank protection portion LN2_b.

[0129] The second shielding can protection portion LN2_b may have a quadrilateral band shape having a predetermined width formed along an edge region of the shielding can SH. In other words, the second pad LN2 may be a region remaining after the first pad LN1 is removed from the pad LN in the "L" shape formed integrally. The second shielding can protection portion LN2_b may protect the surface of the shielding can SH and the information mark IM including information about the power management integrated circuit 740 displayed on the upper surface of the shielding can SH.

[0130] Fig.10 is along Figure 7 A cross-sectional view of a main circuit board according to an embodiment is shown taken along line II'. Fig.11 is along Figure 8 A cross-sectional view of a main circuit board according to an embodiment is shown taken along line II-II'.

[0131] Reference Figures 7 to 11 The liner LN may include a film layer LN_FL and an adhesive layer LN_AD. The film layer LN_FL may include a region arranged overlapping with the shielding can SH to protect the surface of the shielding can SH and a hand grip region for easily removing the liner LN from the shielding can SH.

[0132] The film layer LN_FL can be composed of polyethylene terephthalate (PET), polyurethane (PU), polyimide (PI), polycarbonate (PC), polyethylene (PE), polypropylene (PP), polysulfone (PSF), polymethyl methacrylate (PMMA), triacetyl cellulose (TAC), cycloolefin polymer (COP), etc.

[0133] Depending on the type and thickness of the material as described above, the degree of bending (bending strength) of the film layer LN_FL may be different. In order to protect the shielding tank SH, the film layer LN_FL of the liner LN may have a bending strength above a predetermined reference. According to the bending strength, the curvature of the bent portion of the film layer LN_FL may be different. In some embodiments, the greater the bending strength of the film layer LN_FL, the greater the curvature of the bent portion. As the curvature of the bent portion increases, the reaction force of the bent portion will be dispersed, and thus the pressure applied to the shielding tank SH may be reduced.

[0134] The adhesive layer LN_AD may be arranged on the other side of the film layer LN_FL to combine (bond) the film layer LN_FL to one side of the shielding tank SH. That is, the film layer LN_FL may be attached to one side of the shielding tank SH through the adhesive layer LN_AD. For example, in the first liner LN1, the adhesive layer LN_AD may be arranged only on a part of the first shielding tank protection part LN1_b. In other words, the adhesive layer LN_AD may not be arranged on the gripping part and the connecting part. In addition, in the second liner LN2, the adhesive layer LN_AD may be arranged on the entire area of ​​the second shielding tank protection part LN2_b. In other words, the adhesive layer LN_AD may be arranged on the entire area except the gripping part.

[0135] The adhesive force or bonding force of the adhesive layer LN_AD to the shielding can SH is sufficient as long as the film layer LN_FL is not separated from the shielding can SH during storage or transportation and remains attached. When the liner LN is peeled off, the adhesive layer LN_AD is preferably separated from the shielding can SH in a state of being attached to the film layer LN_FL, and preferably does not remain on the surface of the shielding can SH. In this regard, the bonding force of the adhesive layer LN_AD to the shielding can SH can be smaller than the bonding force of the adhesive layer LN_AD to the film layer LN_FL.

[0136] The adhesive layer LN_AD may be formed by using a low adhesive layer. For example, the adhesive layer LN_AD may be formed by including acrylic, polyurethane, and silicon adhesive materials.

[0137] Reference Fig.11After the first pad LN1 is removed from the shielding can SH, a gap equivalent to the distance H from the top of the shielding can SH to the top of the second pad LN2 may be generated due to a portion of the second pad LN2 remaining on the top of the shielding can SH. During the transportation and operation process of the display module, there is a risk that one side of the display module may be scratched or squeezed and deformed due to external factors. According to an embodiment, while ensuring a separation space equivalent to the distance H from the top of the shielding can SH to the top of the second pad LN2, the probability that the top of the shielding can SH and the information mark IM including information about the power management integrated circuit 740 displayed on the top of the shielding can SH are scratched or squeezed and deformed due to external factors can be reduced.

[0138] In the following embodiments, descriptions of the same structures as those in the embodiments already described will be omitted or will be mainly based on the differences.

[0139] Fig.12 is a plan view showing a gasket attached to a shielding can according to another embodiment. Fig.13 is a plan view showing a state in which a first gasket is removed and only a second gasket is attached to a shield can according to another embodiment. Fig.14 is along Fig.12 A cross-sectional view of a main circuit board according to another embodiment is shown taken along line III-III'. Fig.15 is along Fig.13 A cross-sectional view of a main circuit board according to another embodiment is shown taken along line IV-IV'.

[0140] Reference Figures 12 to 15 The liner according to this embodiment is similar to the liner in that it has a "1" shape, the grip portion also includes a pull tap portion, and the entire area of ​​the first shielding tank protection portion LN3_b and the second shielding tank protection portion LN4_b is provided with an adhesive layer. Figure 7 and Figure 8 The embodiments are different.

[0141] More specifically, the overall planar shape of the liner LN may be a "1" shape. For example, the liner LN may be a film formed integrally of a first liner LN3 and a second liner LN4, that is, the first liner LN3 has the same width as the lateral length of the shielding tank SH and extends toward the upper side of the shielding tank SH, and the second liner LN4 has the same width as the lateral length of the shielding tank SH and extends toward the lower side of the shielding tank SH. In order to easily separate the first liner LN3 and the second liner LN4, a cutoff line may be formed in the boundary area between the first liner LN3 and the second liner LN4. Here, the cutoff line may be formed by punching through the film layer LN_FL along its corresponding position in a manner that partially perforates the film layer LN_FL, or by punching through the film layer LN_FL and the bonding layer LN_AD along its corresponding position in a manner that partially perforates the film layer LN_FL and the bonding layer LN_AD.

[0142] The first liner LN3 may include: a first grip portion LN3_a for easily removing the film; a first shielding can protection portion LN3_b for protecting the surface of the central area of ​​the shielding can SH; and a connecting portion LN3_c connecting the first grip portion LN3_a and the first shielding can protection portion LN3_b.

[0143] According to an embodiment, the first shielding can protection part LN3_b may display an information mark IM including information about the power management integrated circuit 740. The first shielding can protection part LN3_b may have a quadrilateral shape that is the same as the shape of the shielding can and has a reduced area at a predetermined ratio. For example, the area of ​​the first shielding can protection part LN3_b may be consistent with the area of ​​the area where the information mark IM including information about the power management integrated circuit 740 is to be displayed.

[0144] The first grip portion LN3_a may be a quadrilateral shape having the same width as the lateral length of the shielding can SH and extending toward the upper side of the shielding can SH. However, it is not limited thereto and may be formed in various shapes and patterns in a manner that enables an operator to easily remove the first liner LN3. For example, the width of the first grip portion LN3_a may be formed to be the same as the width of the connecting portion LN3_c.

[0145] At least one pull-tab portion PT protruding outward from the first grip portion LN3_a may be arranged in an area at the upper end of the first grip portion LN3_a. Therefore, when peeling off the first liner LN3 and the shielding can SH, the first grip portion LN3_a can be easily grasped by the pull-tab portion PT. Therefore, the peeling process of the first liner LN3 can be quickly performed. Although the figure shows a situation where the pull-tab portion PT is arranged at the center of the upper end of the first grip portion LN3_a, the number and position of the pull-tab portions PT are not limited.

[0146] The connection portion LN3_c enables the operator to remove the first shielding tank protection portion LN3_b and the first grip portion LN3_a simultaneously when removing the first liner LN3. According to one embodiment, the operator can grab the pull-tab portion PT of the first grip portion LN3_a and try to peel off the first liner LN3 from the center of the upper end to the center of the lower end. Therefore, the connection portion LN3_c can be formed to overlap with the upper end center area of ​​the shielding tank SH.

[0147] After the first pad LN3 is removed, the information mark IM including information about the power management integrated circuit 740 may be displayed on one side of the shield can SH. Therefore, the information about the power management integrated circuit 740 may be confirmed even after the first pad LN3 is removed from the shield can SH.

[0148] The second gasket LN4 may include: a second gripping portion LN4_a for easily removing the film; and a second shielding can protecting portion LN4_b for protecting the surface of the edge region of the shielding can SH.

[0149] The second grip portion LN4_a may be a quadrilateral shape having the same width as the lateral length of the shielding tank SH and extending toward the lower side of the shielding tank SH. However, it is not limited thereto and may be formed into a variety of shapes and patterns in a manner that enables an operator to easily remove the second liner LN4. For example, the width of the second grip portion LN4_a may be formed to be the same as the width of the second shielding tank protection portion LN4_b.

[0150] At least one pull-tab portion PT protruding to the outside of the second grip portion LN4_a may be arranged in an area at the lower end of the second grip portion LN4_a. Therefore, when peeling off the second liner LN4 and the shielding can SH, the second grip portion LN4_a can be easily grasped by the pull-tab portion PT. Therefore, the peeling process of the second liner LN4 can be quickly performed. Although the figure shows a situation in which the pull-tab portion PT is arranged in the center of the lower end of the second grip portion LN4_a, the number and position of the pull-tab portions PT are not limited. According to one embodiment, the operator can grasp the pull-tab portion PT of the second grip portion LN4_a and try to peel off the second liner LN4 from the center of the lower end to the center of the upper end.

[0151] The second shielding can protection portion LN4_b may have a quadrilateral band shape having a predetermined width formed along an edge region of the shielding can SH. In other words, the second pad LN4 may be a remaining area after removing the first pad LN3 from the pad LN in the shape of the letter "1" formed integrally. The second shielding can protection portion may protect the surface of the shielding can SH and the information mark IM including information about the power management integrated circuit 740 displayed on the shielding can SH.

[0152] Fig.14 is along Fig.12A cross-sectional view of a main circuit board according to another embodiment is shown taken along line III-III'. Fig.15 is along Fig.13 A cross-sectional view of a main circuit board according to another embodiment is shown taken along line IV-IV'.

[0153] Reference Figures 12 to 15 The liner LN may include a film layer LN_FL and an adhesive layer LN_AD. The film layer LN_FL may include a region arranged overlapping with the shielding can SH to protect the surface of the shielding can SH and a hand grip region for easily removing the liner LN from the shielding can SH.

[0154] The film layer LN_FL can be composed of polyethylene terephthalate (PET), polyurethane (PU), polyimide (PI), polycarbonate (PC), polyethylene (PE), polypropylene (PP), polysulfone (PSF), polymethyl methacrylate (PMMA), triacetyl cellulose (TAC), cycloolefin polymer (COP), etc.

[0155] Depending on the type and thickness of the material as described above, the degree of bending (bending strength) of the film layer LN_FL may be different. In order to protect the shielding tank SH, the film layer LN_FL of the liner LN may have a bending strength above a predetermined reference. According to the bending strength, the curvature of the bent portion of the film layer LN_FL may be different. In some embodiments, the greater the bending strength of the film layer LN_FL, the greater the curvature of the bent portion. As the curvature of the bent portion increases, the reaction force of the bent portion will be dispersed, and thus the pressure applied to the shielding tank SH may be reduced.

[0156] The adhesive layer LN_AD may be arranged on the other side of the film layer LN_FL to combine (bond) the film layer LN_FL to one side of the shielding tank SH. That is, the film layer LN_FL may be attached to one side of the shielding tank SH through the adhesive layer LN_AD. For example, in the first liner LN3, the adhesive layer LN_AD may be arranged in the entire area of ​​the first shielding tank protection part LN3_b and the connecting part LN3_c. In other words, the adhesive layer LN_AD may not be arranged on the first hand grip part LN3_a. In addition, in the second liner LN4, the adhesive layer LN_AD may be arranged in the entire area of ​​the second shielding tank protection part LN4_b. In other words, the adhesive layer LN_AD may be arranged in the entire area except the second hand grip part LN4_a.

[0157] The adhesive force or bonding force of the adhesive layer LN_AD to the shielding can SH is sufficient as long as the film layer LN_FL can be attached to the shielding can SH without being separated during storage or transportation. When the liner LN is peeled off, the adhesive layer LN_AD is preferably separated from the shielding can SH while being attached to the film layer LN_FL, and preferably does not remain on the surface of the shielding can SH. In this regard, the bonding force of the adhesive layer LN_AD to the shielding can SH can be smaller than the bonding force of the adhesive layer LN_AD to the film layer LN_FL.

[0158] The adhesive layer LN_AD may be formed by using a low adhesive layer. For example, the adhesive layer LN_AD may be formed by including acrylic, polyurethane, and silicon adhesive materials.

[0159] Reference Fig.15 After the first pad LN3 is removed from the shielding can SH, a gap corresponding to the distance H_1 from the top of the shielding can SH to the top of the second pad LN4 may be generated due to a portion of the second pad LN4 remaining on the top of the shielding can SH. In addition, according to the present embodiment, since the area of ​​the first pad LN3 is consistent with the area of ​​the information mark IM including the information about the power management integrated circuit 740, Fig.15 The width W_1 of the first pad LN3 shown may be smaller than Fig.11 In this case, since the area of ​​the second liner LN4 remaining on the shielding can SH is larger than that of the first liner LN1, the area of ​​the second liner LN4 remaining on the shielding can SH is larger than that of the first liner LN1. Fig.11 The area of ​​the second pad LN2 shown can further reduce the probability that the upper surface of the shielding can SH and the information mark IM including information about the power management integrated circuit 740 displayed on the upper surface of the shielding can SH are scratched or squeezed and deformed due to external factors.

[0160] Hereinafter, a method for manufacturing the display device will be described.

[0161] Fig.16 is a flowchart illustrating a method of manufacturing a display device including a spacer according to an embodiment.

[0162] First, a printed circuit board on which at least one integrated circuit is mounted is prepared (S100). Figure 2 , Figure 7 and Fig.16 The printed circuit substrate (ie, the main circuit board 700 ) may include a main processor 710 , a camera device 720 , a main connector 730 , a power management integrated circuit (PMIC: Power management IC) 740 , a first microphone 780 , and a first auxiliary connector 790 .

[0163] A shielding can is arranged around the integrated circuit (S200). Here, the integrated circuit may be a power management integrated circuit 740. The power management integrated circuit 740 may be electrically connected to the touch circuit board 210, the touch drive unit 220, the display circuit board 310, the display drive unit 320, and the main processor 710. The power management integrated circuit 740 may control the power supplied to the touch circuit board 210, the touch drive unit 220, the display circuit board 310, the display drive unit 320, and the main processor 710. The shielding can SH may be arranged to cover the power management integrated circuit 740 and the main processor 710. At least one shielding can SH may be arranged on the main circuit board 700, and the heat generated from the power management integrated circuit 740 and the main processor 710 may be transferred to the heat dissipation component, or the electromagnetic wave generated from the main processor 710 may be shielded. According to one embodiment, the shielding can SH covers the outside of the main processor 710 and the power management integrated circuit 740 in the form of a can or a box by using a metal plate or a synthetic resin added with a conductive metal, so that the heat generated from the main processor 710 and the power management integrated circuit 740 can be transferred to the heat dissipation component, or the electromagnetic waves generated from the main processor 710 and the power management integrated circuit 740 can be shielded.

[0164] A gasket including a first gasket and a second gasket is attached on the upper surface of the shielding can (S300).

[0165] The liner LN may be arranged on one side of the shielding tank SH. The overall planar shape of the liner LN may be an "L" shape. For example, the liner LN may be a film formed integrally of a first liner LN1 and a second liner LN2 as follows, wherein the first liner LN1 has the same width as the lateral length of the shielding tank SH and extends toward the upper side of the shielding tank SH, and the second liner LN2 has the same width as the longitudinal length of the shielding tank SH and extends toward the right side of the shielding tank SH. In order to easily separate the first liner LN1 and the second liner LN2, a cutoff line may be formed in the boundary area between the first liner LN1 and the second liner LN2. Here, the cutoff line may be formed by punching through the film layer LN_FL along its corresponding position in a manner that partially perforates the film layer LN_FL, or by punching through the film layer LN_FL and the bonding layer LN_AD described later along its corresponding position in a manner that partially perforates the film layer LN_FL and the bonding layer LN_AD.

[0166] An information mark on the integrated circuit is indicated on the first pad (S400).

[0167] An information mark IM including information about the power management integrated circuit 740 may be displayed on the first shielding tank protection portion LN1_b. The information mark IM may include information about the product name, model name, manufacturer name, serial number (S / N), part number (P / N), firmware number, interface mode, operating conditions, etc. The information mark IM may be, for example, at least one of a number, text, number and unit, a bar code, and a QR code containing information about the operating conditions. In some embodiments, the information mark IM may also include symbols and / or graphics. The information mark IM may be formed, for example, by a screen printing method, an imprint method, a roll off-set print method, or a laser marking method, or may be formed by filling ink or paints in a groove formed by a laser marking method.

[0168] The printed circuit substrate is combined with the display panel (S500). The printed circuit substrate with the gasket LN attached thereto can be combined with the display panel. Since the gasket LN protects the surface of the shielding can SH, the surface of the shielding can SH can be prevented from being scratched or squeezed and deformed due to external factors.

[0169] The first liner is removed (S600). The first grip LN1_a may be a quadrilateral shape having the same width as the lateral length of the shielding tank SH and extending toward the upper side of the shielding tank SH. However, it is not limited thereto and may be formed into a variety of shapes and patterns in a manner that enables the operator to easily remove the first liner LN1. For example, the width of the first grip LN1_a may be formed to be the same as the width of the connection portion LN1_c. The connection portion LN1_c may enable the operator to remove the first shielding tank protection portion LN1_b and the first grip LN1_a simultaneously when removing the first liner LN1. According to one embodiment, the operator may grasp the upper left end of the first grip LN1_a and attempt to peel off the first liner LN1 toward the lower right end. Therefore, the connection portion LN1_c may be formed to overlap with the corner portion located at the upper left end of the shielding tank SH.

[0170] An information mark is displayed on the shielding tank from which the first pad LN1 is removed (S700). After the first pad LN1 is removed, an information mark IM including information about the main processor 710 and the power management integrated circuit 740 can be displayed on one side of the shielding tank SH. The information mark IM may include information about the product name, model name, manufacturer name, serial number (S / N), part number (P / N), firmware number, interface mode, operating conditions, etc. The information mark IM may be, for example, at least one of a number, text, number and unit, a bar code, and a QR code containing information about the operating conditions. In some embodiments, the information mark IM may also include symbols and / or graphics. The information mark IM may be formed, for example, by a screen printing method, an imprint method, a roll off-set printing method, or a laser marking method, or may be formed by filling ink or paints in a groove formed by a laser marking method. Therefore, information about the display panel may also be confirmed after the first pad LN1 is removed from the shielding tank SH.

[0171] After the display panel is combined with the display device, the second gasket LN2 is removed (S800, S900). The display panel with the second gasket LN2 attached thereto can be combined with the display device. Since the second gasket LN2 protects the surface of the shielding can SH, the surface of the shielding can SH can be prevented from being scratched or squeezed and deformed due to external factors. Fig.11 While ensuring a spacing space equivalent to the distance H from the top of the shielding can SH to the top of the second pad LN2, the probability of the top of the shielding can SH and the information mark IM including information about the power management integrated circuit 740 displayed on the top of the shielding can SH being scratched or squeezed and deformed due to external factors can be reduced.

[0172] The above description is centered on the embodiments of the present invention, but this is only an example and does not limit the present invention. A person with ordinary knowledge in the field to which the present invention belongs can know that various modifications and applications not illustrated above can be performed within the scope of the essential characteristics of the embodiments of the present invention. For example, each component that specifically appears in the embodiments of the present invention can be implemented in a modified manner. Moreover, the differences in these modifications and applications should be interpreted as being included in the scope of the present invention defined by the claims.

Claims

1. A pad comprising: A first gasket, comprising a first shielding component protection portion, a first hand grip portion, and a connecting portion connecting the first shielding component protection portion and the first hand grip portion; as well as The second gasket includes a second shielding component protection portion and a second hand grip portion, wherein the pad includes a cut-off line along a boundary of the first pad and the second pad, The first shielding member protecting portion, the connecting portion, and the second shielding member protecting portion are arranged to overlap with a shielding member surrounding at least one integrated circuit, The first shielding member protecting portion is arranged to overlap with a central region of the shielding member, and the second shielding member protecting portion is arranged to overlap with an edge region of the shielding member.

2. The pad according to claim 1, wherein The first gasket and the second gasket include a film layer and a bonding layer bonding the film layer and the shielding member.

3. The pad according to claim 2, wherein: The adhesive layer is included in at least one region of the first shielding member protecting portion and the second shielding member protecting portion.

4. The pad according to claim 2, wherein: The cutting lines are formed by punching the film layer in a manner that the film layer is partially perforated along the corresponding positions thereof.

5. The pad according to claim 2, wherein: The cutting line is formed by punching through the film layer and the bonding layer in a manner of partially perforating the film layer and the bonding layer along corresponding positions thereof.

6. The pad according to claim 2, wherein: The distance from the upper surface of the circuit substrate on which the integrated circuit is mounted to the upper surface of the film layer is greater than the distance from the upper surface of the circuit substrate to the upper surface of the shielding component.

7. The pad according to claim 1, wherein: The first shield member protection portion includes information marking regarding the integrated circuit.

8. The pad according to claim 7, wherein: The information mark is at least one of numbers, text, a barcode and a QR code.

9. The pad according to claim 1, wherein: The shielding member has a quadrilateral shape in a plane.

10. The pad according to claim 9, wherein The connection portion is formed to overlap with a corner portion of the shielding member.

11. The pad according to claim 9, wherein The first grip portion has a width equal to a transverse length of the shielding component and extends along a longitudinal direction of the shielding component.

12. The pad according to claim 11, wherein The second grip portion has a width equal to a longitudinal length of the shielding component and extends in a lateral direction of the shielding component.

13. The pad of claim 11, wherein: The second grip portion has a width that is the same as a lateral length of the shielding member, and extends in a direction opposite to a direction in which the first grip portion extends.

14. The pad of claim 1, wherein: An area at the upper end of the first grip portion and the upper end of the second grip portion further includes a pull tab portion.

15. The pad according to any one of claims 1 to 14, wherein The cut-off line is formed along a boundary between the first pad and the second shield member protection portion.

16. A method for manufacturing a display device, comprising the following steps: preparing a circuit substrate having at least one integrated circuit mounted thereon; disposing a shielding member around the integrated circuit; Attaching a gasket according to any one of claims 1 to 15, comprising a first gasket and a second gasket, on the shielding component; displaying information indicia about the integrated circuit on the first pad; combining the circuit substrate with a display panel; removing the first liner along the cut line; displaying the information mark on the upper surface of the shielding member with the first liner removed; combining the display panel with a display device; The second liner is removed.

17. A display device, comprising: Circuit board; an integrated circuit mounted on the circuit substrate; a shielding member formed to surround the integrated circuit; as well as a liner releasably attached to the shielding member, Wherein, the liner comprises: A first gasket is provided with a first shielding component protection portion, a first hand grip portion, and a connecting portion connecting the first shielding component protection portion and the first hand grip portion; The second pad is provided with a second shielding member protection portion and a second hand grip portion, wherein the pad includes a cut-off line along a boundary of the first pad and the second pad, The first shielding member protecting portion, the connecting portion, and the second shielding member protecting portion are arranged to overlap with a shielding member surrounding at least one integrated circuit, The first shielding member protecting portion is arranged to overlap with a central region of the shielding member, and the second shielding member protecting portion is arranged to overlap with an edge region of the shielding member.

18. The display device according to claim 17, wherein: The cut-off line is formed along a boundary between the first pad and the second shield member protection portion.

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