Lens assembly with electrical contacts, photoelectric detector and laser radar

Abstract

The present invention discloses a lens assembly with electrical contacts, a photodetector, and a laser radar. The lens assembly comprises an optical lens and electrical contacts for connecting to an optoelectronic device corresponding to the optical lens. This invention simplifies the packaging process for optoelectronic integrated devices, improves the connection reliability of integrated optoelectronic devices, optimizes the optical path design of array-type optoelectronic integrated devices, enhances the optoelectronic signal acquisition capability of array optoelectronic devices, optimizes the spatial dimensions of the integrated devices, and improves light energy utilization efficiency. The lens assembly also provides refined zoning management for the circuit devices corresponding to the lens assembly.

Description

Technical Field

[0001] The present invention relates to the field of optoelectronics, and in particular to a lens assembly with electrical contacts, a photoelectric detector and a laser radar. Background Art

[0002] In the prior art, some optoelectronic devices have microlenses disposed above the circuit to enable the introduction of optical signals.

[0003] like Figure 1 The figure shows a schematic diagram of a circuit structure with a microlens in the prior art. Multiple circuit device units 3 are arranged on a circuit board 5. Gold wires 2 connect the different circuit device units 3, and gold wires 2 also connect the circuit device units 3 to the circuit board 5. An optical lens 1 is mounted above the multiple circuit device units 3 via a bracket 4.

[0004] Since the gold wire 2 has a height in the semiconductor process, and the gold wire 2 needs to be accommodated between the optical lenses 1, and space is reserved for the gold wire 2, especially in the height direction, it is difficult to reduce the distance H between the optical lens 1 and the circuit board 5, resulting in the device height cannot be effectively compressed, making it difficult to achieve a light, thin and short product and space-optimized setting. Summary of the Invention

[0005] The technical problem solved by the present invention is to provide a lens assembly so as to compress the overall height of the lens assembly.

[0006] Furthermore, the efficiency of light energy utilization is improved.

[0007] Furthermore, the circuit devices corresponding to the lens assembly are managed in a refined partitioning manner to enhance the product's functional richness and control sophistication.

[0008] Furthermore, the packaging process of optoelectronic integrated devices is simplified, the connection reliability of integrated optoelectronic devices is improved, and the optical path design of array-type optoelectronic integrated devices is optimized.

[0009] The present invention discloses a lens assembly with electrical contacts, comprising:

[0010] Optical lens; electrical contacts for connecting the optoelectronic device corresponding to the optical lens.

[0011] The optical lens is a microlens.

[0012] The lens assembly comprises a plurality of optical lenses to form a lens combination.

[0013] The lens combination forms a line array or a surface array.

[0014] The lens combination is obtained by an integrated molding method.

[0015] The optical lens has one or more electrical contacts.

[0016] The lens assembly has a plurality of electrical contacts to form an electrical contact array, and the electrical contact array corresponds to the lens assembly.

[0017] The electrical contacts are implanted or grown on the lens assembly by semiconductor technology.

[0018] The electrical contact is also connected to at least one conductor.

[0019] The electrical contact array and the conductor form an electrical contact network.

[0020] The electrical contact network is provided with one or more external electrical connection points.

[0021] The electrical contact network includes a plurality of sub-networks.

[0022] At least some of the sub-networks are interconnected or not interconnected.

[0023] The electrical contact is a connection bump or a connection body implemented by a conductive medium.

[0024] The optoelectronic devices corresponding to the plurality of optical lenses form an optoelectronic device combination, and the optoelectronic device combination forms a linear array or a planar array.

[0025] The present invention also discloses a photoelectric detector, comprising:

[0026] The lens assembly; the optoelectronic device, the electrical contact is also connected to the optoelectronic device.

[0027] The invention also discloses a laser radar provided with the photoelectric detector.

[0028] The technical effect achieved by the present invention is to provide a lens assembly that can reduce the overall height of a device incorporating the lens assembly, thereby achieving a lightweight, thin, and compact product and optimizing spatial configuration. Furthermore, the configuration of the present invention can simplify the packaging process of optoelectronic integrated devices, improve the connection reliability of integrated optoelectronic devices, optimize the optical path design of array-type optoelectronic integrated devices, enhance the optoelectronic signal acquisition capability of array optoelectronic devices, and improve light energy utilization efficiency. The circuit device array corresponding to the lens assembly can be meticulously zoned and managed to enhance the product's functional richness. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 FIG. 1 is a schematic cross-sectional view of a circuit structure with a microlens in the prior art.

[0030] Figure 2A 、 2B, 2D, 3, and 4A are schematic cross-sectional views of the lens assembly with electrical contacts of the present invention.

[0031] Figure 2C 、 4B Shown is a schematic cross-sectional structure diagram of a photoelectric detector of the present invention.

[0032] Figure 5 、 6 The figure shows a schematic top perspective structural diagram of a lens assembly with electrical contacts according to the present invention.

[0033] Figure 7-10 FIG2 is a schematic cross-sectional view of a lens assembly with electrical contacts according to another embodiment of the present invention. DETAILED DESCRIPTION

[0034] The following describes the implementation process of the technical solution of the present invention in conjunction with specific embodiments, which are not intended to limit the present invention.

[0035] like Figure 2A 、 2B 2D is a schematic diagram of the cross-sectional structure of the lens assembly with electrical contacts of the present invention.

[0036] The lens assembly 100 includes an optical lens 1 and an electrical contact 11 .

[0037] A photoelectric device is correspondingly provided below the lens assembly 100 , and the electrical contact 11 is used to connect the photoelectric device corresponding to the optical lens.

[0038] The optoelectronic device may be a photodetector. The electrical contact 11 is electrically connected to a connecting component 30 of the optoelectronic device, which may be a pad or an electrode. The photosensitive surface 40 of the optoelectronic device faces the rear section of the optical lens 1.

[0039] The electrical contact 11 is located on the rear cross-section of the optical lens 1 and can be partially embedded in the rear cross-section of the optical lens 1 or directly connected to the rear cross-section. To avoid affecting the effective light transmission area of ​​the microlens and improve light energy utilization efficiency, the electrical contact 11 can be located at the edge of the optical lens as much as possible. The electrical contact is a connecting bump, which can be made of metal.

[0040] Each optical lens 1 has one or more electrical contacts 11. Each of the plurality of electrical contacts 11 is electrically connected to the connection component 30 of the optoelectronic device. The electrical contact 11 is also connected to at least one conductor, which is, for example, a wire 12 implemented in various forms, including a gold wire in semiconductor technology. Figure 2C As shown, the optical lens 1 has a plurality of electrical contacts 11, each of which is connected to a wire 12. Figure 2DAs shown, the optical lens 1 has an electrical contact 11, which is connected to multiple wires 12. Different wires can be connected to different external circuits, so that the optoelectronic device can be connected to different external circuits through the electrical contact and wires, and receive external signals from different sources in a time-sharing manner, thereby achieving more diverse functions.

[0041] The optical lens 1 may be a microlens.

[0042] In such Figure 3 In the illustrated embodiment, the lens assembly 100 includes a plurality of optical lenses 1, which are arranged adjacent to each other to form a lens assembly. This lens assembly can be arranged in a linear array, a planar array, or in other configurations as needed, all within the scope of this disclosure. Corresponding to this lens assembly, the lens assembly 100 is also provided with a plurality of electrical contacts, forming an electrical contact array, which corresponds to the lens assembly.

[0043] The electrical contact array can form an electrical contact network with the help of the wire. Figure 4A As shown, the electrical contact array can be connected to each other by means of the same wire 12 to form an electrical contact network. Figure 5 As shown, the electrical contact array is interconnected by means of different wires 12, and the wires 12 are further interconnected to form an electrical contact network.

[0044] like Figure 4B As shown, a plurality of the optoelectronic devices form an optoelectronic device combination, and the optoelectronic device combination forms a linear array or a planar array.

[0045] like Figure 5 、 6 The diagram shows a top perspective structural diagram of a lens assembly with electrical contacts of the present invention. The figure shows the arrangement of components on the bottom side of the optical lens while looking from the top surface of the optical lens. The figure uses four optical lenses as an example for schematic illustration, and other numbers are also within the scope of the disclosure of the present invention. The array of electrical contacts is interconnected by means of wires 12 to form an electrical contact network. The electrical contact network is provided with a plurality of external electrical connection points 13 for connecting to other controllers or external circuits to receive or send signals, and then to interact with the optoelectronic device for instructions. The external electrical connection points 13 can also be connected to resistors and / or capacitors as needed to obtain the intended circuit function. The wires extend in a straight manner.

[0046] The electrical contact network can be a unified network that is interconnected as a whole and works in coordination. In a preferred embodiment, the electrical contact network can include multiple sub-networks. The sub-networks can be partially or fully interconnected, or partially or fully disconnected.

[0047] like Figure 6As shown, the wire 12 constitutes a sub-network A, and the wire 12' constitutes a sub-network B. Networks A and B are not interconnected and can be controlled by different controllers to achieve different functions, thereby performing refined partition management of the optoelectronic device array corresponding to the lens assembly, thereby improving the product's functional richness and control sophistication.

[0048] One electrical contact can also be connected to multiple wires, so that the electrical contact (that is, the corresponding optoelectronic device) is located in different sub-networks through different wires, thereby achieving more diverse functions.

[0049] The wire 12 may be located below the optical lens or partially embedded in the optical lens 1 ( Figure 7 ), or completely embedded in the optical lens 1 ( Figure 8 ).

[0050] The wire 12 may also be located at the edge of the microlens, particularly at the junction of two microlenses, to improve light energy utilization efficiency.

[0051] Since the wire 12 does not occupy more space in the height direction than the electrical contacts, it helps to compress the overall height of the device provided with the lens assembly, and helps to achieve a light, thin and short overall product with a space-optimized setting.

[0052] The lens assembly of the present invention is obtained through an integrated molding process. Specifically, the lens assembly comprising multiple optical lenses is first integrally molded, and then the electrical contact array is implanted or grown on the lens assembly using a semiconductor process. The electrical contact array is then connected to an optoelectronic device assembly comprising multiple optoelectronic devices and wires through welding or other connection methods. This simplifies the packaging process for optoelectronic integrated devices, improves the connection reliability of integrated optoelectronic devices, and optimizes the optical path design of array-type optoelectronic integrated devices.

[0053] like Figure 9 FIG2 is a schematic cross-sectional view of a lens assembly with electrical contacts according to another embodiment of the present invention. The electrical contacts are connectors implemented by a conductive medium.

[0054] The conductive medium is, for example, a conductive connector. The optical lens has a through-hole 14. The connector formed by the conductive connector poured into the through-hole 14 directly serves as the electrical contact. Part of the conductive connector flowing out of the through-hole 14 can be connected to the pad of the optoelectronic device. At the same time, the wire 12 is located below the optical lens and connected to the conductive connector, thereby achieving an electrical connection between the wire 12 and the optoelectronic device.

[0055] like Figure 10 FIG2 is a schematic cross-sectional view of a lens assembly with electrical contacts according to another embodiment of the present invention. Figure 10The difference is that wires 12 are inserted directly into the through-holes 14, forming a conductive network above the optical lens. The wires are connected to the pads of the optoelectronic device below the optical lens via a conductive connector injected into the through-holes 14. Because the electrical contact network is located above the optical lens, the gaps between adjacent optical lenses can be fully utilized, resulting in the apex of the electrical contact network being lower in height than the apex of the lens assembly.

[0056] The present invention also discloses a photoelectric detector, such as Figure 2C As shown, the electrical contacts of the lens assembly are connected to the optoelectronic device.

[0057] The invention also discloses a laser radar provided with the photoelectric detector.

[0058] The technical effect achieved by the present invention is to provide a lens assembly that can reduce the overall height of the device containing the lens assembly, thereby achieving a lightweight, thin, and compact product and optimizing spatial configuration. Furthermore, the configuration of the present invention can simplify the packaging process of optoelectronic integrated devices, improve the connection reliability of integrated optoelectronic devices, optimize the optical path design of array-type optoelectronic integrated devices, enhance the optoelectronic signal acquisition capability of array optoelectronic devices, and improve light energy utilization efficiency. The optoelectronic device combination corresponding to the lens assembly can be meticulously zoned to enhance the product's functional richness.

[0059] The above embodiments are merely exemplary descriptions for implementing the present invention and are not intended to limit the scope of protection of the present invention. Those skilled in the art may make various obvious modifications and equivalent replacement technical solutions based on the above embodiments, which are all included in the scope of disclosure of the present invention. The scope of protection of the present invention shall be determined by referring to the appended claims.

Claims

1. A lens assembly with electrical contacts for a laser radar, characterized in that: include: Optical lenses; An electrical contact is used to connect the optoelectronic device for the laser radar corresponding to the optical lens. The electrical contact is located at the edge of the optical lens. The optical lens has a through hole and the electrical contact is located in the through hole.

2. The lens assembly according to claim 1, wherein The optical lens is a microlens.

3. The lens assembly according to claim 1, wherein The lens assembly comprises a plurality of optical lenses to form a lens combination.

4. The lens assembly according to claim 3, wherein: The lens combination forms a line array or a surface array.

5. The lens assembly according to claim 3, wherein: The lens combination is obtained by an integrated molding method.

6. The lens assembly according to claim 1, 2, 3, 4 or 5, wherein: The optical lens has one or more electrical contacts.

7. The lens assembly according to claim 3, wherein: The lens assembly has a plurality of electrical contacts to form an electrical contact array, and the electrical contact array corresponds to the lens assembly.

8. The lens assembly according to claim 3 or 7, wherein: The electrical contacts are implanted or grown on the lens assembly by semiconductor technology.

9. The lens assembly according to claim 1 or 7, wherein: The electrical contact is also connected to at least one conductor, which is inserted into the through hole and located above the optical lens.

10. The lens assembly according to claim 9, wherein The electrical contact array and the conductor form an electrical contact network, and the electrical contact network is provided with one or more external electrical connection points.

11. The lens assembly according to claim 10, wherein: The electrical contact network includes a plurality of sub-networks.

12. The lens assembly according to claim 11, wherein At least some of the sub-networks are interconnected or not interconnected.

13. The lens assembly according to claim 1, wherein The electrical contact is a connection bump or a connection body implemented by a conductive medium.

14. A photoelectric detector for laser radar, characterized in that: include: The lens assembly according to any one of claims 1 to 13; The electrical contact is further connected to the optoelectronic device.

15. A laser radar provided with the photoelectric detector according to claim 14.

16. An intelligent vehicle or unmanned aerial vehicle equipped with the laser radar according to claim 15.

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