Substrate Processing Apparatus and Substrate Processing Method

Abstract

The present invention relates to a substrate processing apparatus and a substrate processing method. A technique is provided that can achieve high productivity and has a high degree of freedom in setting the substrate conveyance path. The apparatus includes: a container placement unit that places a storage container containing a plurality of substrates; a plurality of substrate processing units that respectively process substrates; a first substrate conveyance mechanism that has a movable base, a first substrate holding unit, and a second substrate holding unit. The first substrate holding unit and the second substrate holding unit are configured to be independently movable back and forth on the base, and support positions at the central portions in the left-right direction of the substrate from below in such a manner that the edge portions in the left-right direction of the substrate are open. The first substrate holding unit and the second substrate holding unit move forward together to transfer substrates to and from the storage container all at once; and a plurality of first substrate placement units that are stacked on one another, each of which places a substrate and transfers the substrate to and from each substrate processing unit. The first substrate holding unit and the second substrate holding unit move forward independently on the base to transfer substrates.

Description

Technical Field

[0001] The present disclosure relates to a substrate processing apparatus and a substrate processing method. Background Art

[0002] In a manufacturing process of a semiconductor wafer, various processes such as liquid processing and heat processing are performed on the semiconductor wafer (hereinafter referred to as a wafer) as a substrate. As a substrate processing apparatus for performing such various processes on a wafer, there is a case where it is configured as follows: including: a processing module provided with various processing components for processing a substrate; and a transfer mechanism for transferring the wafer between the processing module and a carrier that stores a plurality of wafers.

[0003] In Patent Documents 1 and 2, such a substrate processing apparatus is shown. The substrate processing apparatus of Patent Document 1 includes: a plurality of unit modules each having respective processing components and constituting the above-described processing module; and a plurality of loading / unloading components for loading / unloading a wafer with respect to each unit module. Moreover, the transfer mechanism of this substrate processing apparatus includes two substrate holding parts having different shapes, and one substrate holding part is used to transfer the wafer between the carrier and the loading / unloading component, and the other substrate holding part is used to transfer the wafer between the loading / unloading components.

[0004] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2013 - 69916

[0005] Patent Document 2: Japanese Unexamined Patent Application Publication No. 2013 - 69917 Summary of the Invention

[0006] Problems to be Solved by the Invention

[0007] Regarding a substrate processing apparatus, the present disclosure provides a technique capable of achieving high productivity and having a high degree of freedom in setting a transfer path of a substrate.

[0008] Solutions to the Problems

[0009] The substrate processing apparatus of the present disclosure includes:

[0010] a container mounting part for mounting a storage container that stores a plurality of substrates;

[0011] a plurality of substrate processing parts for respectively processing the substrate;

[0012] The first substrate transfer mechanism has a movable base, a first substrate holding portion, and a second substrate holding portion. The first substrate holding portion and the second substrate holding portion are configured to be independently movable back and forth on the base, and respectively support the positions near the center in the left-right direction of the substrate from below in a manner that the edge portions in the left-right direction of the substrate are open. The first substrate holding portion and the second substrate holding portion advance together to transfer the substrate to and from the housing container; and

[0013] A plurality of first substrate placement portions stacked on each other, which respectively place the substrate to transfer the substrate to and from each substrate processing portion. The first substrate holding portion and the second substrate holding portion advance independently on the base to transfer the substrate.

[0014] For the above substrate processing apparatus, it may also be that the substrate processing apparatus is provided by stacking a plurality of unit modules on each other. Each of the plurality of unit modules includes the substrate processing portion and a second substrate transfer mechanism that transfers the substrate between the substrate processing portion and the first substrate placement portion.

[0015] The first substrate placement portion is provided in each unit module.

[0016] For the above substrate processing apparatus, it may also be that the second substrate transfer mechanism includes a third substrate holding portion. The third substrate holding portion includes an enclosing portion that surrounds the substrate from the side and a claw portion provided on the inner peripheral edge of the enclosing portion to support the lower surface of the substrate.

[0017] For the above substrate processing apparatus, it may also be that the substrate processing apparatus includes a second substrate placement portion that is arranged longitudinally relative to the first substrate placement portion, and the substrate is transferred only by the second substrate transfer mechanism among the first substrate transfer mechanism and the second substrate transfer mechanism.

[0018] For the above substrate processing apparatus, it may also be that the second substrate placement portion is a temperature adjustment portion that adjusts the temperature of the substrate.

[0019] For the above substrate processing apparatus, it may also be that the first substrate transfer mechanism includes a detection portion that is used to detect the position of the substrate held by the first substrate holding portion and / or the second substrate holding portion.

[0020] For the above substrate processing apparatus, it may also be that the detection portion includes a light projection portion that projects light to the peripheral portion of the substrate and a light reception portion that receives the light projected by the light projection portion and passing through the side of the substrate.

[0021] The substrate processing apparatus is provided with a detection mechanism that detects the position of the peripheral edge of the substrate based on a detection signal output from the light receiving unit.

[0022] For the above-described substrate processing apparatus, it may also be that the substrate processing apparatus is provided with a position adjustment unit that, based on a detection result obtained by the detection unit when the substrate is held by the first substrate holding unit and the second substrate holding unit, temporarily places the substrate in order to re-hold each substrate using the first substrate holding unit and the second substrate holding unit, and adjusts the position of the temporarily placed substrate.

[0023] For the above-described substrate processing apparatus, it may also be that the position adjustment unit is arranged in the longitudinal direction with respect to the first substrate placement unit.

[0024] For the above-described substrate processing apparatus, it may also be that the substrate processing apparatus is provided with a control unit that outputs a control signal.

[0025] The control unit outputs the control signal based on a detection result obtained by the detection unit when the substrate is held by the first substrate holding unit or the second substrate holding unit, in order to adjust the position of transferring the substrate with respect to the first substrate placement unit.

[0026] For the above-described substrate processing apparatus, it may also be that the control unit outputs a control signal to continuously transfer the multiple substrates collected by the first substrate transfer mechanism from the storage container to the plurality of first substrate placement units.

[0027] For the above-described substrate processing apparatus, it may also be that the control unit outputs a control signal to cause the first substrate transfer mechanism to continuously collect the substrates from the plurality of first substrate placement units and transfer each collected substrate to the storage container.

[0028] For the above-described substrate processing apparatus, it may also be that the substrate processing apparatus is provided by stacking a plurality of unit modules on top of each other, and the plurality of unit modules include the substrate processing unit and a transfer path for transferring the substrate.

[0029] The first substrate placement unit is provided in each unit module.

[0030] The control unit outputs a control signal to cause the first substrate transfer mechanism to continuously collect the substrates from the plurality of first substrate placement units corresponding to one unit module and continuously transfer the substrates to the plurality of first substrate placement units corresponding to another unit module.

[0031] The substrate processing method of the present disclosure includes the following steps:

[0032] Place a storage container containing multiple substrates on the container placement unit.

[0033] Processing the substrate with a plurality of substrate processing units respectively;

[0034] Moving the base that constitutes the first substrate conveying mechanism;

[0035] The first substrate holding part and the second substrate holding part that constitute the first substrate conveying mechanism and are independently movable back and forth on the base respectively support the substrate at positions near the center in the left - right direction from below, so that the edges of the substrate in the left - right direction are open;

[0036] Advancing the first substrate holding part and the second substrate holding part together, so as to transfer the substrate to and from the storage container all at once;

[0037] Placing substrates on a plurality of first substrate placement parts stacked on top of each other;

[0038] Transferring the substrates placed on the plurality of first substrate placement parts to and from the plurality of substrate processing parts respectively; and

[0039] Advancing the first substrate holding part and the second substrate holding part separately on the base to transfer the substrate to and from the plurality of first substrate placement parts.

[0040] Effects of the invention

[0041] According to the present disclosure, regarding the substrate processing apparatus, high productivity can be obtained and the degree of freedom in setting the substrate conveying path is high. Description of the drawings

[0042] Figure 1 It is a cross - sectional top view of the coating apparatus according to the first embodiment of the present disclosure.

[0043] Figure 2 It is a longitudinal cross - sectional side view of the coating apparatus.

[0044] Figure 3 It is a front view of the carrier module that constitutes the coating apparatus.

[0045] Figure 4 It is a side view of the conveying mechanism provided in the carrier module.

[0046] Figure 5 It is a perspective view of the conveying mechanism.

[0047] Figure 6 It is a top view of the transfer assembly provided in the conveying mechanism and the coating apparatus.

[0048] Figure 7 It is a longitudinal cross - sectional front view of the transfer container conveyed to the carrier module.

[0049] Figure 8 is a perspective view of the transfer component.

[0050] Figure 9 is a perspective view of the temperature adjustment component provided in the coating device.

[0051] Figure 10 is a perspective view of the position adjustment component provided in the coating device.

[0052] Figure 11 is an explanatory diagram for explaining the detection method of the center position of the wafer.

[0053] Figure 12 is an explanatory diagram showing the transfer path of the wafer at the coating device.

[0054] Figure 13 is an explanatory diagram showing the transfer path of the wafer at the carrier module.

[0055] Figure 14 is a process diagram showing the transfer process of the wafer at the carrier module.

[0056] Figure 15 is a process diagram showing the transfer process of the wafer at the carrier module.

[0057] Figure 16 is a process diagram showing the transfer process of the wafer at the carrier module.

[0058] Figure 17 is a process diagram showing the transfer process of the wafer at the carrier module.

[0059] Figure 18 is a process diagram showing the transfer process of the wafer at the carrier module.

[0060] Figure 19 is a process diagram showing the transfer process of the wafer at the carrier module.

[0061] Figure 20 is a process diagram showing the transfer process of the wafer at the carrier module.

[0062] Figure 21 is a process diagram showing the transfer process of the wafer at the carrier module.

[0063] Figure 22 is a process diagram showing the transfer process of the wafer at the carrier module.

[0064] Figure 23 is a process diagram showing the transfer process of the wafer at the carrier module.

[0065] Figure 24It is a process diagram showing the wafer transfer process at the carrier module.

[0066] Figure 25 It is a process diagram showing the wafer transfer process at the carrier module.

[0067] Figure 26 It is a schematic diagram of the coating device according to the third embodiment.

[0068] Figure 27 It is an explanatory diagram showing the transfer path of the third coating device.

[0069] Figure 28 It is a cross-sectional top view of the coating and developing device according to the fifth embodiment.

[0070] Figure 29 It is a longitudinal cross-sectional side view of the coating and developing device.

[0071] Figure 30 It is a perspective view showing another structural example of the transfer component.

[0072] Figure 31 It is a perspective view of another structural example of the conveying mechanism. Detailed implementation mode

[0073] (The first embodiment)

[0074] Refer to Figure 1 The cross-sectional top view of Figure 2 and the longitudinal cross-sectional side view of

[0075] to describe the coating device 1 of the first embodiment of the substrate processing device of the present disclosure. The coating device 1 is constituted by connecting a carrier module D1 and a processing module D2 in the lateral direction. For the convenience of description, the connection direction between the carrier module D1 and the processing module D2 is set as the X direction, and the lateral direction orthogonal to the connection direction is set as the Y direction. In order to feed in and out the wafer W with respect to the coating device 1, a storage container 10 is placed on the carrier module D1. The storage container 10 is, for example, a carrier called FOUP (Front-Opening United Pod) for storing and transporting 25 wafers W. The processing module D2 processes the wafer W fed from the carrier module D1. Figure 1A description will be given of the unit module E1 shown. A conveyance path 11 extending in the X direction is formed in the central portion of the unit module E1 in the Y direction. When viewed in the X direction from the carrier module D1 side, a resist film forming assembly 12 is provided on the right side of the conveyance path 11, and a heating assembly 13 is provided on the left side of the conveyance path 11.

[0076] Four resist film forming assemblies 12 are provided, and they are arranged along the extending direction of the conveyance path 11. The resist film forming assembly 12 coats the entire surface of the wafer W with resist by spin coating to form a resist film. The heating assembly 13 is constituted by, for example, laminating two layers vertically, and six such laminates are arranged along the conveyance path 11, for example. The heating assembly 13 includes a hot plate, and the wafer W on which the resist film has been formed is placed on this hot plate and heated.

[0077] A conveyance mechanism F1 is provided in the conveyance path 11. The conveyance mechanism F1 includes a base 14 that can move forward and backward, move up and down, and rotate freely about a vertical axis. Two holding portions 15 are provided on the base 14 in the vertical direction, and the two holding portions 15 can move forward and backward independently between the forward position and the backward position on the base 14. When the base 14 is lifted to transfer the wafer W with respect to the assembly, the holding portion 15 serving as the third substrate holding portion is in the forward position. Except for the case of transferring the wafer W like this, the holding portion 15 is in the backward position. The holding portion 15 includes an enclosing portion 16 that surrounds the wafer W from the side. When the forward and backward direction of the holding portion 15 is set as the front and back direction, the holding portion 15 is formed in a substantially U shape in plan view from the left side of the wafer W via the rear along the right side. Four claw portions 17 are provided at intervals along the circumferential direction of the inner peripheral edge of the enclosing portion 16, and the four claw portions 17 hold the wafer W by supporting the peripheral edge portion of the lower surface of the wafer W.

[0078] The conveyance mechanisms corresponding to the conveyance mechanism F1 provided in the unit modules E2 to E6 are set as conveyance mechanisms F2 to F6. The conveyance mechanisms F1 to F6 serving as the second substrate conveyance mechanism convey the wafer W between the processing assemblies serving as the substrate processing portions provided in each unit module independently of each other. In addition, the portion on which the wafer W is placed is set as an assembly, and the assembly that processes the wafer W is set as a processing assembly. The above-mentioned resist film forming assembly 12 and the above-mentioned heating assembly 13 are processing assemblies.

[0079] Next, referring again to Figure 3The carrier module D1 will be described. The carrier module D1 includes a square housing 20. When the side of the housing 20 facing the X direction is defined as the front surface, the transfer ports 21A to 21D of the wafer W constituting the loading ports are arranged in a matrix on the front surface and are open. The transfer port arranged on the left side in the front view is set as 21A and 21B, the transfer ports arranged on the right side are set as 21C and 21D, the transfer ports arranged on the upper side are set as 21A and 21C, and the transfer ports arranged on the lower side are set as 21B and 21D. The transfer ports 21A to 21D are each opened and closed by an opening / closing unit 22. In addition, container placement parts 23A to 23D are provided at positions corresponding to the transfer ports 21A to 21D on the front side of the transfer ports 21A to 21D, and the storage containers 10 are placed and accommodated in the container placement parts 23A to 23D so as to face the transfer ports 21A to 21D respectively. For the convenience of explanation, for the storage container 10, there are cases where the same English letter as the placement table on which the storage container 10 is placed is marked. That is, there are cases where it is expressed as storage containers 10A to 10D.

[0080] In addition, in front of the carrier module D1, there is a rack for placing and accommodating the storage container 10 and a transfer mechanism for the storage container 10. The transfer mechanism for the storage container 10 exchanges the storage container 10 between the above-mentioned respective container placement parts 23 (23A to 23D) and the rack, but its illustration is omitted. The storage container 10 is fed into and out of the above-mentioned rack by a transfer mechanism in a factory where, for example, a coating device 1 is provided.

[0081] In the central part in the left-right direction inside the housing 20 of the carrier module D1, a tower T1 extending vertically is provided. The tower T1 faces each transfer path 11 of the processing module D2 in such a way that the transfer mechanisms F (F1 to F6) of the above-mentioned unit modules E (E1 to E6) can reach. The tower T1 is constituted by stacking a plurality of components. That is, the components are arranged in the longitudinal direction. As the components, it includes a temperature adjustment component SCPL, a transfer component TRS, and a position adjustment component THS.

[0082] A plurality of transfer components TRS serving as the first substrate placement part are provided at heights corresponding to the unit modules E1 to E6 respectively so as to be able to transfer the wafer W into and out of each unit module E1 to E6. That is, the transfer component TRS is provided for each unit module so that the transfer mechanisms F1 to F6 transfer each wafer W. For each transfer component TRS, the same number as the corresponding unit module E1 to E6 of the height is marked and expressed as TRS1 to TRS6. In this example, two transfer components TRS are provided at the height corresponding to one unit module. For these two transfer components, one transfer component TRS is a transfer component for feeding into the unit module E, and the other transfer component is a transfer component for feeding out of the unit module E.

[0083] The temperature adjustment component SCPL, which serves as the second substrate placement part, is a component for adjusting the temperature of the placed wafer W. This temperature adjustment component SCPL, which serves as the temperature adjustment part, is provided at the same height corresponding to the unit modules E1 to E6 respectively, just like the transfer component TRS, and is marked with the same numbers as the unit modules E1 to E6 corresponding to the height, denoted as SCPL1 to SCPL6. Regarding the position adjustment component THS, which serves as the position adjustment part, it is a component for adjusting the position of the placed wafer W, and there are, for example, multiple of them. The respective structures of these transfer components TRS, temperature adjustment components SCPL, and position adjustment components THS will be described in detail later.

[0084] When viewed along the X direction from the front side, a conveying mechanism 31 and a conveying mechanism 32 are provided on the left side and the right side of the tower T1 respectively. Figure 4 It is a side view of the conveying mechanisms 31 and 32. The conveying mechanisms 31 and 32 respectively constitute the first substrate conveying mechanism, and transfer the wafer W between the transfer component TRS of the tower T1 and the storage container 10. More specifically, the conveying mechanism 31 can reach the storage containers 10A and 10B, take out the wafer W from the storage containers 10A and 10B, and convey it to the transfer component TRS for feeding into the tower T1. The conveying mechanism 32 can reach the storage containers 10C and 10D, take out the wafer W from the transfer component TRS for sending out from the tower T1, and convey it to the storage containers 10C and 10D.

[0085] The conveying mechanisms 31 and 32 are configured in the same way. Referring to the perspective view of Figure 5 and the top view of Figure 6 as representatives, the conveying mechanism 31 will be described. The conveying mechanism 31 includes: a frame 33, a lifting part 34, a base 35, a holding part 36, a holding part 37, and a detection part 4. The frame 33 is a vertically long and standing square frame, and is configured such that the lifting part 34 can vertically move up and down freely within the frame 33. The base 35 is provided on the lifting part 34 so as to be rotatable about a vertical axis. On the base 35, holding parts for holding the wafer W are provided in the vertical direction. The lower holding part is set as the holding part 36, and the upper holding part is set as the holding part 37. For the convenience of illustration, in Figure 5 the holding part 37 is shown separately from the base 35.

[0086] The holding part 36 and the holding part 37 respectively constitute the first substrate holding part and the second substrate holding part. The holding parts 36 and 37 can move forward and backward independently between the forward position and the backward position on the base 35. When the base 35 is lifted or lowered to transfer the wafer W relative to the storage container 10 or the component, the holding parts 36 and 37 are in the forward position. Except for such a situation, the holding parts 36 and 37 are in the backward position. In Figure 6 the state where the holding part 36 is in the backward position and the holding part 37 is in the forward position is shown.

[0087] The holding portions 36 and 37 include a base portion 38 and two tip portions 39 formed by bifurcating the base portion 38 and extending in the traveling direction. The holding portions 36 and 37 form an elongated and flat fork shape that is the same as each other. The wafer W is held by supporting the wafer W from below on the front end side of the base portion 38 and the tip portions 39. When holding the wafer W in this way, if the advancing and retreating direction of the holding portions 36 and 37 is set as the front-rear direction, the holding portions 36 and 37 overlap the wafer W at a position closer to the center than the edge portions in the left-right direction of the wafer W, and the edge portions in the left-right direction of the wafer W protrude outward from the holding portions 36 and 37. That is, the holding portions 36 and 37 hold the wafer W in such a way that they do not surround the wafer W from the left and right and do not overlap the edge portions in the left-right direction of the wafer W, so that the edge portions in the left-right direction of the held wafer W are in an open state.

[0088] Figure 7 It is a longitudinal sectional front view of the housing container 10. In the figure, the reference numeral 24 is a supporting portion of the wafer W in the housing container 10, and is provided in multiple layers so as to support the edge portions in the left-right direction of the wafer W respectively. Therefore, the upper side of each supporting portion 24 is a storage area (groove) for the wafer W. By configuring the holding portions 36 and 37 of the transfer mechanism 31 as described above, the holding portions 36 and 37 can enter the housing container 10 together and transfer the wafer W to two vertically continuous grooves at the same time.

[0089] Return Figures 4 to 6 Continuing the description of the transfer mechanism 31. A detection portion 4 is provided on the base 35. The detection portion 4 is composed of four optical sensors 40. The optical sensors 40 are supported on the base 35 by the supporting portions 43 and move together with the base 35. In addition, regarding the supporting portion 43, in order to avoid complication of the drawing, it is omitted in Figure 4 and Figure 6 The optical sensor 40 is composed of a set of a light projection portion 41 and a light reception portion 42. The light projection portion 41 and the light reception portion 42 are provided so as to overlap each other vertically. For example, the light projection portion 41 is disposed on the upper side and the light reception portion 42 is disposed on the lower side. The light projection portion 41 and the light reception portion 42 constituting the same set are provided so as to sandwich the peripheral edge portion of the wafer W held by the holding portion 36 and the holding portion 37 in the retracted position from above and below, and the sets are provided at intervals in the circumferential direction of the wafer W. In addition, the light reception portion 42 is composed of a plurality of light receiving elements, and the plurality of light receiving elements are linearly arranged in a direction from the center side of the wafer W held by the holding portion 36 and the holding portion 37 toward the outer peripheral side.

[0090] While the holding units 36 and 37 holding the wafer W are in the retracted positions, the light projection unit 41 irradiates light downward. A part of the light projected from the light projection unit 41 is blocked by the peripheral portion of the wafer W held by the retracted holding unit 36 and / or the holding unit 37, and the other part of the light passes through the side of the wafer W and irradiates the light receiving unit 42. Therefore, according to the peripheral position of the wafer W, the size of the area irradiated with light in the light receiving unit 42, that is, the number of light receiving elements receiving light changes. The light receiving unit 42 sends a detection signal corresponding to the size of the irradiated area to a control unit 100 described below. The control unit 100 constituting the detection mechanism detects each peripheral position of the wafer W based on this detection signal, and also detects the center position of the wafer W based on each of these peripheral positions.

[0091] Next, with reference to the above-described Figure 6 plan view showing the transfer assembly TRS1 Figure 8 and the perspective view, the transfer assembly TRS1 will be described in more detail. In addition to being able to transfer the wafer W to and from the transfer assembly TRS1 by the transfer mechanism F1 of the unit module E1 as described above, the wafer W can also be transferred to and from the transfer assembly TRS1 by the transfer mechanisms 31 and 32 respectively. In the figure, reference numeral 51 is a support portion for supporting the flat plate 52 at the tower T1. By overlappingly extending two flat plates 52 from this support portion 51, two transfer assemblies TRS1 stacked on each other are formed. That is, each transfer assembly TRS1 is constituted by a flat plate 52. Three vertical pins 53 are provided at the top end of each extended flat plate 52, and the wafer W is horizontally placed on the pins 53. The pins 53 are arranged so as not to interfere with the holding units 36 and 37 of the transfer mechanisms 31 and 32 and the holding unit 15 of the transfer mechanism F1 when the holding units 36, 37 and the holding unit 15 are lifted and lowered for transferring the wafer W. In addition, Figure 6 the holding unit 37 and the holding unit 15 when lifted and lowered for transferring the wafer W are shown.

[0092] The structure of the transfer assembly TRS1 has been described as a representative, but the transfer assemblies TRS2 to TRS6 are also configured in the same manner as the transfer assembly TRS1. Therefore, the wafer W can be transferred between the transfer mechanisms 31 and 32 and the transfer mechanisms F2 to F6 by means of the transfer assemblies TRS2 to TRS6.

[0093] Next, for Figure 9A description will be given of the temperature adjustment component SCPL1 shown. The temperature adjustment component SCPL1 includes a plurality of circular plates 54 that overlap each other, and wafers W can be placed on each plate 54. An unillustrated flow path for supplying refrigerant whose temperature has been adjusted by a cooler is formed in the temperature adjustment component SCPL1, and the refrigerant is used to adjust the temperature of the plate 54, and thus also adjust the temperature of the wafer W placed on the plate 54. Notches corresponding to the claw portions 17 of the holding portion 15 of the transfer mechanism F1 are provided in the plate 54, and the wafer W is transferred relative to the plate 54 by the lifting and lowering of the holding portion 15.

[0094] The temperature adjustment components SCPL2 to SCPL6 also have the same structure as the temperature adjustment component SCPL1. With such a structure, only the transfer mechanism F among the transfer mechanisms 31, 32 and the transfer mechanisms F (F1 to F6) can transfer the wafer W relative to the temperature adjustment component SCPL (SCPL1 to SCPL6). In this first embodiment, wafers W before resist film formation are transferred to each temperature adjustment component SCPL and the temperature is adjusted.

[0095] Next, reference will be made to Figure 10 A description will be given of the position adjustment component THS. The wafer W is transferred relative to this position adjustment component THS by the transfer mechanisms 31, 32. The position adjustment component THS includes four position restricting portions 55, and the position restricting portions 55 are arranged in a matrix shape when viewed from above. The position restricting portions 55 are configured as circular shapes that expand in diameter toward the lower side, and inclined surfaces 56 are formed on the side surfaces of the position restricting portions 55. The area surrounded by the four position restricting portions 55 is the placement area 57 for the wafer W. The wafer W is transferred to the placement area 57 by the lifting and lowering of the holding portions 36, 37 of the transfer mechanisms 31, 32, and the peripheral edge of the wafer W is supported by the inclined surfaces 56 of the respective position restricting portions 55. The peripheral edge of the supported wafer W slides and descends along the inclined surface 56 under the action of gravity. Therefore, in the position adjustment component THS, the position of the placed wafer W can be automatically adjusted.

[0096] After the transfer mechanism 31 or the transfer mechanism 32 temporarily places the wafer W at the position adjustment component THS, the holding unit 36 or the holding unit 37 picks up the wafer W, and the center position of the wafer W is detected using the detection unit 4 described above. When the center position of the wafer W at the holding unit 36 or the holding unit 37 exceeds the allowable range, the wafer W is placed on the position adjustment component THS again. In order to adjust the position of the placed wafer W, the wafer W is picked up by adjusting the orientation of the base 35 and the forward position of the holding unit 36 or the holding unit 37 based on the detected center position of the wafer W, so that the center position of the wafer W at the holding unit 36 or the holding unit 37 becomes the desired position. That is to say, the position adjustment component THS is a component for temporarily placing the wafer W in order to re-hold the held wafer W so that the position of the wafer W is appropriate.

[0097] In addition, as Figure 1 shown, the coating device 1 includes a control unit 100. The control unit 100 is composed of a computer and includes a program, a memory, and a CPU. In the program, a set of steps is incorporated so as to be able to implement a series of operations in the coating device 1. Using this program, the control unit 100 outputs control signals to each part of the coating device 1 to control the operation of each part. Thereby, the transfer of the wafer W and the processing of the wafer W described later are performed. The above program is stored in a storage medium such as an optical disc, a hard disk, or a DVD, and is loaded into the control unit 100.

[0098] In addition, the above program is configured such that, for each of the transfer mechanisms 31 and 32, when both the holding units 36 and 37 are holding the wafer W, it is possible to judge whether the holding position of the wafer W is abnormal based on the detection signals received from the respective optical sensors 40. When the peripheral position of the wafer W is detected within the specified range by each of the optical sensors 40, it is assumed that the holding position of the wafer W is normal. On the other hand, when any one of the four optical sensors 40 cannot detect the wafer W, when the peripheral position of the wafer W detected by any one of the four optical sensors 40 is abnormal, or when the center position of the imaginary wafer W described later is abnormal, it is assumed that the holding position is abnormal.

[0099] Regarding the judgment of the abnormality based on the center position of the above-mentioned imaginary wafer W, reference is made to the Figure 11 showing the XY coordinates for explanation. In addition, the X direction and the Y direction in this coordinate do not necessarily coincide with the X direction and the Y direction used in the description of the coating device 1. In Figure 11In this case, the wafers W held by the holding parts 36 and 37 are shown by dashed lines and dotted lines, respectively. The peripheral positions of the wafer W are obtained by four optical sensors 40. Then, the peripheral positions of the wafer W detected by two adjacent optical sensors 40 are set as the peripheral positions of one wafer W (as an imaginary wafer W1, shown by a solid line in the figure). Based on the peripheral positions of the imaginary wafer W1 and the diameter of the wafer W as known data, the central position of the imaginary wafer W1 is calculated. In Figure 11 this case, the central position is illustrated as the origin of the XY coordinates. The central positions of the imaginary wafer W1 corresponding to the number of combinations of adjacent optical sensors 40 (= 4) are calculated. In the case where any of the central positions is abnormal, it is assumed that the central position of the actual wafer W is also abnormal.

[0100] The above program is configured such that when both the holding parts 36 and 37 hold the wafer W and it is determined as described above that the holding position of the wafer W is abnormal, the wafer W is re-held using the position adjustment component THS that has been described. Moreover, this program calculates the central position of the wafer W based on the peripheral positions of the wafer W detected when either of the holding parts 36 and 37 holds the wafer W. Moreover, the program is configured to adjust the forward movement amount of the holding part that holds the wafer W and the orientation of the base 35 so that the central position is located at a specified position at the component at the conveyance destination of the wafer W. That is, based on the detected central position of the wafer W, the position of the wafer W at the component at the conveyance destination is corrected.

[0101] Figure 12 The conveyance path of the wafer W in this coating apparatus 1 is shown by arrows. After the wafer W sent out from the storage containers 10A and 10B is conveyed to the transfer components TRS (TRS1 to TRS6) for feeding, the wafer W is conveyed by the conveyance mechanisms F (F1 to F6) of the unit modules E (E1 to E6). The conveyance mechanisms F (F1 to F6) convey the wafer W in the order of the temperature adjustment components SCPL (SCPL1 to SCPL6) → the resist film forming component 12 → the heating component 13 → the transfer components TRS (TRS1 to TRS6) for sending out. Then, the wafer W is conveyed from the transfer components TRS1 to TRS6 for sending out to the storage containers 10C and 10D.

[0102] Figure 13 The conveyance paths of the wafer W by the conveyance mechanisms 31 and 32 are shown respectively. The conveyance mechanism 31 collectively picks up two wafers W from the storage container 10A or 10B and continuously conveys one wafer W each to the transfer component TRS for feeding corresponding to one unit module E and the transfer component TRS for feeding corresponding to another unit module E. That is, the wafer W is conveyed separately to two transfer components TRS for feeding. The conveyance mechanism 31 sets this series of conveyances as one cycle and repeats this cycle.

[0103] On the other hand, the conveying mechanism 32 successively picks up the wafers W one by one from the delivery transfer module TRS corresponding to one unit module E and the delivery transfer module TRS corresponding to another unit module E. That is, the wafers W are picked up separately from the two delivery transfer modules TRS. After that, the conveying mechanism 32 conveys the total of two picked-up wafers W to the storage containers 10C or 10D all at once. The conveying mechanism 32 sets such a series of conveyances as one cycle and repeats this cycle. In addition, successively picking up the wafers W means picking up the wafers W without reaching other components and the storage container 10 in the middle. Similarly, successively conveying the wafers W means conveying the wafers W without reaching other components and the storage container 10 in the middle.

[0104] Hereinafter, Figures 14 to 25 , taking the conveyance of the wafer W between the storage container 10A, the storage container 10C, and the transfer modules TRS1 and TRS2 as an example, the conveyance of the wafer W by the above-mentioned conveying mechanisms 31 and 32 will be further described in detail. The base 35 of the conveying mechanism 31 moves forward to the vicinity of the storage container 10A. Then, the holding parts 36 and 37 move forward together to the forward position and enter the storage container 10A ( Figure 14 , Figure 15 ), the base 35 rises to make the holding parts 36 and 37 pick up the wafer W. Then, when the holding parts 36 and 37 move together to the backward position, light is irradiated from the optical sensor 40 to detect the peripheral position of the wafer W ( Figure 16 ). Based on this peripheral position, as described above, the presence or absence of an abnormality in the holding position of the wafer W is judged. This judgment is set as the first abnormality judgment.

[0105] When the above-mentioned first abnormality judgment is normal, the base 35 moves forward to the vicinity of the feeding transfer module TRS1, light is irradiated from the optical sensor 40 to detect the peripheral position of the wafer W ( Figure 17 ). Based on this peripheral position, the presence or absence of an abnormality in the holding position of the wafer W is judged. This judgment is set as the second abnormality judgment. When the second abnormality judgment is normal, after only the holding part 36 of the holding parts 36 and 37 moves to the forward position, the base 35 descends to transfer the wafer W to the transfer module TRS1 ( Figure 18 ). Then, the base 35 moves forward to the vicinity of the feeding transfer module TRS2, light is irradiated from the optical sensor 40 to detect the peripheral position of the wafer W ( Figure 19 ). Then, only the holding part 37 of the holding parts 36 and 37 moves to the forward position. As described above, based on the peripheral position of the wafer W, the forward movement amount is adjusted, and the orientation is adjusted by rotating the base 35. Then, the base 35 descends to place the wafer W at a specified position of the transfer module TRS2 ( Figure 20), and move the holding part 37 backward to a retracted position ( Figure 21 ).

[0106] In this way, each wafer W transferred to the transfer components TRS1 and TRS2 for feeding is received by the unit modules E1 and E2 as described above and processed, and then conveyed to the transfer components TRS1 and TRS2 for discharging. Then, the base 35 of the conveying mechanism 32 moves forward to the vicinity of the transfer component TRS1 for discharging, and only the holding part 36 among the holding parts 36 and 37 moves to the advanced position. The base 35 rises to make the holding part 36 pick up the wafer W ( Figure 22 ), and moves backward to the retracted position. Next, the base 35 of the conveying mechanism 32 moves forward to the vicinity of the transfer component TRS2, and only the holding part 37 among the holding parts 36 and 37 moves to the advanced position. The base 35 rises to make the holding part 37 pick up the wafer W ( Figure 23 ), and moves backward to the retracted position.

[0107] After that, the base 35 moves forward to the vicinity of the storage container 10C, light is irradiated from the optical sensor 40, and the peripheral position of the wafer W is detected ( Figure 24 ). Based on this peripheral position, the presence or absence of an abnormality in the holding position of the wafer W is judged. This judgment is set as the third abnormality judgment. When the third abnormality judgment shows no abnormality, the holding parts 36 and 37 move together to the advanced position ( Figure 25 ). After the base 35 descends and two wafers W are transferred to the storage container 10C together, the holding parts 36 and 37 move backward together.

[0108] Regarding the above-mentioned first abnormality judgment and second abnormality judgment performed while the wafers W are held by the holding parts 36 and 37 of the conveying mechanism 31, when it is judged that the holding position of the wafer W is abnormal, the conveying mechanism 31 moves to the position adjustment component THS, and each wafer W is re-held one by one so that the center of each wafer W is located at the specified position of the holding parts 36 and 37 as described above. In addition, during this re-holding process, when the peripheral position of any one of the wafers W is detected by projecting light from the optical sensor 40 while both the holding parts 36 and 37 hold the wafers W, for example, the holding part holding the other wafer W is moved to the advanced position to prevent light from irradiating both wafers W. After the holding parts 36 and 37 re-hold the wafers W, the conveyance of the wafers W along the Figure 13 path described in is continued. In addition, regarding the above-mentioned third abnormality judgment performed while the wafers W are held by the holding parts 36 and 37 of the conveying mechanism 32, when it is judged that the holding position of the wafer W is abnormal, the wafer W is also re-held in the same manner, and the conveyance of the wafer W is continued after the re-holding.

[0109] The wafers W in the accommodation container 10A are sequentially sent out. When there is one wafer W remaining, only one of the holding parts 36 and 37 of the conveying mechanism 31 picks up the wafer W and conveys it to the transfer unit TRS1 or TRS2. Similarly, when there is one empty slot in the accommodation container 10C, only one of the holding parts 36 and 37 of the conveying mechanism 32 picks up the wafer W from the transfer unit TRS and conveys the wafer W to the above-mentioned empty slot in the accommodation container 10C. In addition, the transfer of the wafer W with respect to the accommodation containers 10A and 10C and the transfer with respect to the transfer units TRS1 and TRS2 have been described, but the transfer of the wafer W with respect to the accommodation containers 10B and 10D is also carried out in the same manner as the transfer of the wafer W with respect to the accommodation containers 10A and 10C. Moreover, the transfer of the wafer W with respect to other unit modules other than the unit modules E1 and E2 is also carried out in the same manner as the transfer of the wafer W with respect to the unit modules E1 and E2.

[0110] According to this coating device 1, the conveying mechanisms 31 and 32 provided in the carrier module D1 both have holding parts 36 and 37, and these holding parts 36 and 37 are both shaped so as to be able to reach the accommodation container 10. Moreover, the holding parts 36 and 37 transfer two wafers W to and from the accommodation container 10 together, and the holding parts 36 and 37 transfer the wafers W to and from the transfer unit TRS, which is a feeding and discharging component of the unit module E, one by one separately. With such a structure, two wafers W are conveyed together between the accommodation container 10 and the transfer unit TRS. Therefore, the conveying time for each wafer W in the carrier module D1 can be shortened. As a result, an improvement in productivity can be achieved.

[0111] In addition, regarding the structure of the above-mentioned coating device 1, two wafers W are conveyed between the transfer unit TRS corresponding to each of the two unit modules E and the accommodation container 10. However, it is assumed that there are two feeding transfer units TRS and two discharging transfer units TRS corresponding to one unit module respectively. Moreover, it is also possible to convey two wafers W together to the feeding transfer unit TRS corresponding to the same unit module or pick up two wafers W from the discharging transfer unit TRS corresponding to the same unit module. In this way, since the conveying mechanisms 31 and 32 also transfer the wafers W to the transfer unit TRS one by one in the case of a change in the conveying path due to a change in the device structure, no special design change is required. That is to say, since the holding parts 36 and 37 transfer the wafers W to and from each transfer unit TRS separately, there is an advantage that the degree of freedom in setting the conveying path is relatively high.

[0112] In addition, as described above, when the second wafer W out of the two wafers W held by the transfer mechanism 31 is transferred to the transfer unit TRS, the center position of the wafer W is detected by the optical sensor 40. Then, based on this center position, the placement position of the wafer W at the transfer unit TRS is adjusted. That is, since the wafers W are transferred to the transfer unit TRS one by one, the wafer W can be transferred to the desired position of the transfer unit TRS with relatively high accuracy for the second wafer W by using the detection result obtained by the detection unit 4. Therefore, compared with the case where the two wafers W are transferred to the transfer unit TRS together, there is an advantage that it is possible to more reliably suppress abnormalities in the processing of the wafer W caused by defective transfer positions. However, as already described, when the transfer mechanism 31 holds two wafers W, the first abnormality determination and the second abnormality determination are performed as already described, so the adjustment of the placement position of the second wafer W may not be performed.

[0113] In addition, for the temperature adjustment unit SCPL provided in the tower T1, the transfer mechanisms 31 and 32 do not reach, and only the transfer mechanisms F1 to F6 reach. Therefore, the load on the transfer mechanisms 31 and 32 can be suppressed, and the productivity can be improved more reliably.

[0114] In addition, the fact that the holding units 36 and 37 transfer the wafer W to and from the storage container 10 together means that the wafer W is transferred between the storage container 10 and the holding units 36 and 37 while the holding units 36 and 37 enter the storage container 10 together. That is, when the base 35 is lifted and the wafer W is transferred between the holding units 36 and 37 located at the forward positions and the storage container 10, the moments when the holding units support the wafer W and when the wafer W separates from the holding parts can be either simultaneous or staggered between the holding unit 36 and the holding unit 37. Moreover, the fact that the holding units 36 and 37 advance relative to the storage container 10 together means that when observing a certain period, both the holding units 36 and 37 advance relative to the storage container 10 simultaneously. That is, between the holding units 36 and 37, the moments when they start advancing relative to the storage container 10 can be either simultaneous or staggered. Similarly, the moments when they end advancing can also be either simultaneous or staggered.

[0115] In addition, in the above transfer example, it is shown that the position adjustment unit THS is used for re-grasping only when the holding position is determined to be abnormal when two wafers W are held, but it is not limited to this. For example, it is also possible to judge the presence or absence of an abnormality in the peripheral position of the acquired wafer W and the center position obtained from the peripheral position when only the holding unit 37 holds the wafer W. When it is judged to be abnormal, this re-grasping is performed, and the transfer is continued after the re-grasping.

[0116] (Second Embodiment)

[0117] As the liquid processing performed in each unit module E, it is not limited to the formation of a resist film. Other structural examples of the unit module E will be described. For example, a developing component is provided in each of the unit modules E1 to E6 instead of the resist film forming component 12. This developing component supplies a developing solution to the wafer W to develop the exposed resist film formed on the surface of the wafer W. Moreover, it can be set that each transfer mechanism F transfers the wafer W in the order of the heating component 13 → the temperature adjustment component SCPL → the developing component. Different from the first embodiment, this heating component 13 is used for post-exposure baking. Except for this point, the substrate processing apparatus of this second embodiment has the same structure as the apparatus of the first embodiment. That is, in this second embodiment, the substrate processing apparatus is configured as a developing apparatus. When configured as a developing apparatus in this way, it is also possible to transfer the wafer W in the same manner as the coating apparatus 1 and obtain the same effects as those described for the coating apparatus 1.

[0118] (Third Embodiment)

[0119] Next, with reference to Figure 26 The coating apparatus 5 of the third embodiment will be described centering on the differences from the coating apparatus 1. The coating apparatus 5 sequentially forms an anti-reflection film, a resist film, and a protective film on the wafer W in such a way that the films are stacked on each other. The protective film is used to protect the resist film during immersion exposure.

[0120] For the unit modules E1 and E2, an anti-reflection film forming component 18 is provided as a liquid processing component instead of the resist film forming component 12. The anti-reflection film forming component 18 spin-coats a chemical solution for forming an anti-reflection film on the wafer W to form an anti-reflection film. The transfer mechanisms F1 and F2 of the unit modules E1 and E2 transfer the wafer W in the order of the incoming transfer components TRS1 and TRS2 → the temperature adjustment components SCPL1 and SCPL2 → the anti-reflection film forming component 18 → the heating component 13 → the outgoing transfer components TRS1 and TRS2.

[0121] The unit modules E3 and E4 are the same as the unit modules E3 and E4 of the coating apparatus 1. In addition, for the unit modules E5 and E6, a protective film forming component 19 is provided as a liquid processing component instead of the resist film forming component 12. The protective film forming component 19 spin-coats a chemical solution for forming a protective film on the wafer W to form a protective film. The transfer mechanisms F5 and F6 of the unit modules E5 and E6 transfer the wafer W in the order of the incoming transfer components TRS5 and TRS6 → the temperature adjustment components SCPL5 and SCPL6 → the protective film forming component 19 → the heating component 13 → the outgoing transfer components TRS5 and TRS6. In addition, between the unit modules E1 to E6, the liquid processing components and the heating components are arranged in the same layout as each other.

[0122] Figure 26The solid-line arrow and the dash-dotted arrow respectively show the conveyance paths by the conveyance mechanism 31 and the conveyance paths by the conveyance mechanism 32. In addition, Figure 27 and Figure 13 similarly show the conveyance paths of the wafer W by the conveyance mechanisms 31 and 32, respectively. The conveyance mechanism 31 picks up the wafer W from the storage container 10A or 10B and conveys it to the transfer modules TRS1 and TRS2 for feeding. Then, the conveyance mechanism 31 continuously picks up the wafer W from the transfer modules TRS1 and TRS2 for discharging and continuously conveys the wafer W to the transfer modules TRS3 and TRS4 for feeding. Such a conveyance cycle is repeated. In addition, in the third embodiment, the unit modules E1 and E2 correspond to one unit module, and the unit modules E3 and E4 correspond to another unit module. Moreover, the wafer W is continuously conveyed from the transfer module TRS corresponding to one unit module to the transfer module TRS corresponding to another unit module.

[0123] The conveyance mechanism 32 continuously picks up the wafer W from the transfer modules TRS5 and TRS6 for discharging and conveys the wafer W to the storage container 10C or 10D. Then, the conveyance mechanism 32 continuously picks up the wafer W from the transfer modules TRS3 and TRS4 for discharging and continuously conveys the wafer W to the transfer modules TRS5 and TRS6 for feeding. Such a conveyance cycle is repeated.

[0124] Thus, in addition to conveying between the storage container 10 and the transfer module TRS, the conveyance mechanisms 31 and 32 of the coating apparatus 5 also convey between the transfer modules TRS corresponding to different unit modules E. Moreover, similar to the coating apparatus 1, the coating apparatus 5 moves forward together with the holding parts 36 and 37 of the conveyance mechanisms 31 and 32 to simultaneously transfer the wafer W with respect to the storage container 10, and when transferring the wafer W with respect to the transfer module TRS, the holding parts 36 and 37 transfer the wafer W individually. Therefore, the coating apparatus 5 can also obtain the same effects as the coating apparatus 1.

[0125] (Fourth Embodiment)

[0126] Next, the substrate processing apparatus according to the fourth embodiment will be described centering on the differences from the coating apparatus 5 of the third embodiment. The unit modules E2 to E4 are configured in the same manner as the unit modules E1 and E2 of the coating apparatus 5, and an antireflection film is formed on the wafer W respectively. In addition, the unit modules E5 and E6 are configured in the same manner as the unit module E in the second embodiment, and the wafers W are developed respectively. Regarding the unit module E1, for example, a liquid processing component and a heating component are not provided, and an imaging component is provided at the position where the heating component is provided in the other unit modules E. The imaging component includes, for example, a stage on which the wafer W is placed and a camera that images the surface of the wafer W on the stage. The camera transmits the acquired image to the control unit 100, and the control unit 100 performs an inspection to determine whether there is an abnormality on the surface of the wafer W.

[0127] For convenience of explanation, three different storage containers 10 are designated as the first to third storage containers 10. For example, the wafer W sent out from the first storage container 10 is conveyed to the unit modules E2 to E4 to form an antireflection film, and the wafer W sent out from the second storage container 10 is conveyed to the unit modules E5 and E6 to be developed. The wafer W sent out from the third storage container 10 is conveyed to the unit module E1 to be imaged for inspection. The transfer of the wafer W between each storage container 10 and the unit modules E1 to E6 is performed as described in the first embodiment.

[0128] In addition, as exemplified in the third embodiment, in the fourth embodiment, the wafer W can also be transferred between the unit modules E. That is to say, in this fourth embodiment, the wafer W that has been processed in the unit modules E2 to E4 or the unit modules E5 and E6 and has been conveyed to the transfer components TRS2 to TRS5 for sending out can be conveyed to the transfer component TRS1 for feeding by the conveying mechanisms 31 or 32. Then, after imaging, the wafer W conveyed to the transfer component TRS1 for sending out is sent back to the storage container 10 by the conveying mechanisms 31 or 32.

[0129] As shown in this fourth embodiment, the processing of the wafer W performed by the processing component is not limited to liquid processing and heat processing, but also includes imaging. In addition, as shown in the first to fourth embodiments, as the multiple unit modules E constituting the processing module D2, the same type of processing can be performed on the wafer W, or different types of processing can be performed.

[0130] (Fifth Embodiment)

[0131] Next, with reference to Figure 28 the top view of Figure 29The longitudinal sectional side view of [the device] will explain the coating and developing apparatus 6 of the fifth embodiment centered on the differences from the coating apparatus 5. The coating and developing apparatus 6 is successively connected with a carrier module D1, a processing module D2, and an interface module D3 along the X direction. An exposure machine D4 is connected to the side of the interface module D3 opposite to the side connected to the processing module D2.

[0132] The processing module D2 of the coating and developing apparatus 6 is composed of unit modules E1 to E5. The unit modules E1 to E3 are constructed in the same way as each other, and the unit modules E4 and E5 are constructed in the same way as each other. The unit modules E1 to E3 of the coating and developing apparatus 6 are constructed substantially the same as the unit modules E1 to E3 of the coating apparatus 1. However, as a difference, in addition to the resist film forming assembly 12, the unit modules E1 to E3 of the coating and developing apparatus 6 are also provided with an anti-reflection film forming assembly 18. In addition, the unit modules E4 and E5 of the coating and developing apparatus 6 are constructed in the same way as the unit modules E4 and E5 in the second embodiment, and develop the wafer W.

[0133] Next, the interface module D3 will be explained. The interface module D3 includes towers T2 to T4 that extend vertically across the unit modules E1 to E6. The tower T2 is formed by stacking a plurality of transfer components TRS. The towers T3 and T4 are arranged so as to sandwich the tower T2 in the Y direction. The towers T3 and T4 include various components, but their illustration and description are omitted. In addition, the interface module D3 includes transfer mechanisms 61 to 63 for transferring the wafer W with respect to the respective towers T2 to T4. The transfer mechanism 61 transfers the wafer W between the tower T2 and the tower T3. The transfer mechanism 62 transfers the wafer W between the tower T2 and the tower T4. The transfer mechanism 63 transfers the wafer W between the tower T2 and the exposure machine D4.

[0134] The transfer path of the wafer W in the coating and developing apparatus 6 will be explained. The wafers W sent out from the storage containers 10A and 10B are transferred to the transfer components TRS1 to TRS3 by the transfer mechanism 31. Then, the wafers W are transferred by the transfer mechanisms F1 to F3 in the order of the temperature adjustment components SCPL1 to SCPL3 → the anti-reflection film forming assembly 18 → the heating assembly 13 → the temperature adjustment components SCPL1 to SCPL3 → the resist film forming assembly 12 → the heating assembly 13. Thus, an anti-reflection film and a resist film are successively formed on the wafers W. After that, [the wafers] are transferred to the transfer component TRS at the height corresponding to the unit modules E1 to E3 of the tower T2. Then, after being transferred between the towers T2 and T3 by the transfer mechanism 61, [the wafers] are transferred to the exposure machine D4 by the transfer mechanism 63 and are exposed.

[0135] Thereafter, the wafer W is conveyed by the conveying mechanism 63 from the exposure machine D4 to the tower T2. After being conveyed between the towers T2 and T4, it is conveyed to the transfer assembly TRS at the height corresponding to the unit modules E4 and E5 of the tower T2. Then, as described in the second embodiment, after being conveyed to the unit modules E4 and E5 and successively subjected to PEB and development processing, it is conveyed to the transfer assemblies TRS4 and TRS5, and is conveyed from the transfer assemblies TRS4 and TRS5 to the storage containers 10C and 10D by the conveying mechanism 32.

[0136] The conveyance between the above-described storage containers 10 and the transfer assemblies TRS1 to TRS5 is performed in the same manner as in the first embodiment. That is, the conveying mechanisms 31 and 32 transfer two wafers W to the storage container 10 together, and transfer the wafers W to each transfer assembly TRS individually one by one. Therefore, the coating and developing apparatus 6 can also obtain the same effect as the coating apparatus 1.

[0137] In addition, in the coating and developing apparatus 6 and the processing module D2 of each coating apparatus, actually various components are provided in addition to the liquid processing component and the heating component, but they are omitted in order to prevent complication of the description. In addition, as the processing module D2, it may also have a structure that is not divided into each unit module, that is, not divided vertically. In addition, regarding the processing components, the processing described above is also an example. In addition to the examples described above, as the processing components, for example, a coating component for coating a chemical solution for forming an insulating film, a cleaning component for supplying a chemical solution (cleaning liquid) to clean the wafer W, and a coating component for coating an adhesive for bonding a plurality of wafers W to each other may be provided.

[0138] Moreover, regarding the transfer assembly TRS provided in the tower T1, as long as the conveying mechanisms 31 and 32 and the conveying mechanism F can transfer the wafer W respectively, it is not limited to the above-described structural example. Figure 30 Another structural example of the transfer assembly TRS is shown. The transfer assembly TRS includes a circular plate 71 connected to the support portion 51. A plurality of circular plates 71 are stacked one above the other, and each constitutes the transfer assembly TRS.

[0139] At the peripheral portion of the plate 71, notches 72 corresponding to the claw portions 17 of the conveying mechanism F are provided in the same manner as the plate 71 constituting the temperature adjustment component SCPL. By means of the notches 72, the conveying mechanism F can transfer the wafer W with respect to the plate 71. In addition, grooves 73 corresponding to the shapes of the holding portions 36 and 37 of the conveying mechanisms 31 and 32 are formed on the surface of the plate 71, and the wafer W is supported by the outside of the grooves 73. The grooves 73 are open to the outside of the plate 71, and the holding portions 36 and 37 can move between the outside of the plate 71 and the grooves 73, whereby the wafer W can be transferred with respect to the plate 71.

[0140] In addition, regarding the holding parts 36 and 37 described above, the shape is not limited to the one already described. Specifically, for example, the tip may be formed in a tongue shape that is not bifurcated. In this case, for the transfer assembly TRS, the distance between them may be arranged to be relatively large so that the pin 53 does not interfere with the holding parts 36 and 37.

[0141] Furthermore, regarding the position adjustment assembly THS, it may be arranged at a position within the carrier module D1 that can be reached by the conveying mechanisms 31 and 32 respectively, and is not limited to the above-described arrangement example. However, by arranging it on the tower T1 as described above, an increase in the floor area of the carrier module D1 can be suppressed. In addition, in the example already described, the conveying mechanism 31 is used to send out the wafer W from the storage container 10, and the conveying mechanism 32 is used to send the wafer W into the storage container 10, but it is not limited to using the functions of the conveying mechanisms 31 and 32 separately in this way. For example, the conveying mechanisms 31 and 32 may be used to send out the wafers W from the storage containers 10A and 10C respectively, and the conveying mechanisms 31 and 32 may be used to send the wafers W into the storage containers 10B and 10D respectively.

[0142] In addition, Figure 31 Another structural example of the conveying mechanism 31 is shown. As a difference from the example already described, four lower holding parts 36 are provided overlapping each other. That is to say, together with the upper holding part 37, five holding parts are provided on the base 35. Similar to the example already described, the holding parts 36 and 37 can move forward and backward independently of each other on the base 35. Moreover, for example, the base sides of the four holding parts 36 are connected to each other and move forward and backward together on the base 35. In addition, although not shown in the figure, a light sensor 40 is provided on the base 35 where the four holding parts 36 are provided in the same way as the example already described where only one holding part 36 is provided.

[0143] When transferring the wafer W relative to the transfer container 10, the four holding parts 36 and the holding part 37 move forward and backward together on the base 35, and transfer five wafers W at a time. Further, relative to the transfer unit TRS, the wafer W is transferred by a separate forward and backward movement between the holding part 37 and the four holding parts 36. The four holding parts 46 can transfer four wafers W to the four transfer units TRS at a time, or can transfer them in multiple times. That is, 1 to 3 wafers W can be transferred to the transfer unit TRS by one forward and backward movement. In addition, similar to the example described above, when transferring the wafer W relative to the transfer unit TRS and the transfer container 10, the optical sensors 40 are respectively used to determine whether there is an abnormality in the holding position of the wafer W. In this determination, in the case where the holding position of the wafer W is determined to be abnormal when the wafer W is held by the plurality of holding parts 36, the above-described re-grasping is performed on each wafer W held by the holding part 36. Therefore, in the case where the holding position is determined to be abnormal when the wafer W is held by the four holding parts 36, the four wafers W are re-grasped.

[0144] In addition, the transfer mechanism 32 may also be configured to include a plurality of holding parts 36 in the same manner. Further, for the upper holding part 37 of each of the transfer mechanisms 31 and 32, a plurality of them may be provided in the same manner as the holding part 36, and these holding parts 36 may be moved forward and backward together on the base 35. That is, the first substrate holding part and the second substrate holding part are not limited to being configured to hold only one substrate respectively, and can also be configured to hold a plurality of substrates.

[0145] In addition, it should be considered that the embodiments disclosed herein are illustrative in all respects and not restrictive. The above embodiments can be omitted, replaced, and changed in various ways without departing from the appended claims and their gist.

Claims

1. A substrate processing apparatus, characterized in that: The substrate processing apparatus includes: A container placement unit that places a container for accommodating a plurality of substrates; A first unit module, a second unit module, a third unit module, and a fourth unit module that are stacked on top of each other. Each unit module includes a plurality of substrate processing units that respectively process the substrate, and a transport path for transporting the substrate; A first substrate transport mechanism having a movable base, a first substrate holding unit, and a second substrate holding unit. The first substrate holding unit and the second substrate holding unit are configured to be independently movable back and forth on the base, and support the central positions in the left and right directions of the substrate from below in a manner that the edges in the left and right directions of the substrate are open; A plurality of first substrate placement units that are stacked on top of each other, and are provided in each unit module in a manner that respectively place the substrate to transfer the substrate to and from the substrate processing units of the respective unit modules; and A control unit that controls the operation of the first substrate transport mechanism, wherein the first substrate placement units corresponding to the first unit module and the second unit module respectively include one first substrate placement unit and another first substrate placement unit, The control unit outputs a control signal to perform the following steps: Advance the first substrate holding unit and the second substrate holding unit together on the base to pick up the substrate from the container together, and then advance the first substrate holding unit and the second substrate holding unit separately on the base and transport the substrate to the one first substrate placement unit corresponding to the first unit module and the second unit module respectively; and Advance the first substrate holding unit and the second substrate holding unit separately on the base and pick up the substrate from the other first substrate placement unit corresponding to the first unit module and the second unit module respectively, and then advance the first substrate holding unit and the second substrate holding unit separately on the base and transport the substrate to the first substrate placement units corresponding to the third unit module and the fourth unit module respectively.

2. A substrate processing apparatus, characterized in that: The substrate processing apparatus includes: A container placement unit that places a container for accommodating a plurality of substrates; A first unit module, a second unit module, a third unit module, and a fourth unit module that are stacked on top of each other. Each unit module includes a plurality of substrate processing units that respectively process the substrate, and a transport path for transporting the substrate; A first substrate transport mechanism having a movable base, a first substrate holding unit, and a second substrate holding unit. The first substrate holding unit and the second substrate holding unit are configured to be independently movable back and forth on the base, and support the central positions in the left and right directions of the substrate from below in a manner that the edges in the left and right directions of the substrate are open; A plurality of first substrate placement units that are stacked on top of each other, and are provided in each unit module in a manner that respectively place the substrate to transfer the substrate to and from the substrate processing units of the respective unit modules; and A control unit that controls the operation of the first substrate transport mechanism, Among them, the first substrate placement parts corresponding to the third unit module and the fourth unit module respectively include one first substrate placement part and another first substrate placement part. The control part outputs a control signal to perform the following steps. Advance the first substrate holding part and the second substrate holding part separately on the base and pick up the substrate from the one first substrate placement part corresponding to the third unit module and the fourth unit module respectively, and then advance the first substrate holding part and the second substrate holding part together on the base to convey the substrate to the storage container together; and Advance the first substrate holding part and the second substrate holding part separately on the base and pick up the substrate from the first substrate placement part corresponding to the first unit module and the second unit module respectively, and then advance the first substrate holding part and the second substrate holding part separately on the base and convey the substrate to the other first substrate placement part corresponding to the third unit module and the fourth unit module respectively.

3. A substrate processing apparatus, characterized in that the substrate processing apparatus includes: a container placement part for placing a storage container for storing a plurality of substrates; a first unit module, a second unit module, a third unit module, a fourth unit module, a fifth unit module, and a sixth unit module that are stacked on top of each other, and each unit module includes a plurality of substrate processing parts for processing the substrate respectively, and a transfer path for transferring the substrate; a first substrate transfer mechanism having a movable base, a first substrate holding part, and a second substrate holding part, the first substrate holding part and the second substrate holding part are configured to be independently movable back and forth on the base, and support the substrate from below at positions near the center in the left-right direction of the substrate in such a manner that the edges in the left-right direction of the substrate are open; a plurality of first substrate placement parts that are stacked on top of each other, and are provided in each unit module in such a manner that the substrate is placed respectively to transfer the substrate to and from the substrate processing part of each unit module; and a control part for controlling the operation of the first substrate transfer mechanism, wherein the first substrate placement parts corresponding to the first unit module, the second unit module, the third unit module, the fourth unit module, the fifth unit module, and the sixth unit module respectively include one first substrate placement part and another first substrate placement part, the first substrate transfer mechanism includes one first substrate transfer mechanism and another first substrate transfer mechanism, the control part outputs a control signal to perform the following steps. Using the one first substrate transfer mechanism, advance the first substrate holding part and the second substrate holding part together on the base to pick up the substrate from the storage container together, and then advance the first substrate holding part and the second substrate holding part separately on the base and convey the substrate to the one first substrate placement part corresponding to the first unit module and the second unit module respectively. Advance the first substrate holding part and the second substrate holding part separately on the base table, and pick up the substrates from the other first substrate placement parts corresponding to the first unit module and the second unit module respectively. Then, advance the first substrate holding part and the second substrate holding part separately on the base table and convey the substrates to the one first substrate placement parts corresponding to the third unit module and the fourth unit module respectively; and Using the other first substrate conveying mechanism, Advance the first substrate holding part and the second substrate holding part separately on the base table, and pick up the substrates from the one first substrate placement parts corresponding to the fifth unit module and the sixth unit module respectively. Then, advance the first substrate holding part and the second substrate holding part together on the base table to convey the substrates to the storage container all at once; Advance the first substrate holding part and the second substrate holding part separately on the base table, and pick up the substrates from the other first substrate placement parts corresponding to the third unit module and the fourth unit module respectively. Then, advance the first substrate holding part and the second substrate holding part separately on the base table and convey the substrates to the other first substrate placement parts corresponding to the fifth unit module and the sixth unit module respectively.

4. The substrate processing apparatus according to any one of claims 1 to 3, wherein Each of the unit modules includes a second substrate conveying mechanism for conveying the substrate between the substrate processing part and the first substrate placement part.

5. The substrate processing apparatus according to claim 4, wherein The second substrate conveying mechanism includes a third substrate holding part, and the third substrate holding part includes an enclosing part that encloses the substrate from the side and a claw part that is provided on the inner peripheral edge of the enclosing part and supports the lower surface of the substrate.

6. The substrate processing apparatus according to claim 4, wherein This substrate processing apparatus includes a second substrate placement part that is arranged in the longitudinal direction relative to the first substrate placement part, and the substrate is transferred only by the second substrate conveying mechanism among the first substrate conveying mechanism and the second substrate conveying mechanism.

7. The substrate processing apparatus according to claim 6, wherein The second substrate placement part is a temperature adjustment part for adjusting the temperature of the substrate.

8. The substrate processing apparatus according to any one of claims 1 to 3, wherein The first substrate conveying mechanism includes a detection part for detecting the position of the substrate held by the first substrate holding part and / or the second substrate holding part.

9. The substrate processing apparatus according to claim 8, wherein The detection part includes a light projection part that projects light to the peripheral part of the substrate and a light reception part that receives the light projected by the light projection part and passing through the side of the substrate, This substrate processing apparatus is provided with a detection mechanism that detects the position of the peripheral end of the substrate based on the detection signal output by the light reception part.

10. The substrate processing apparatus according to claim 8, wherein: the substrate processing apparatus is provided with a position adjustment unit, which, based on the detection results obtained by the detection unit when the substrate is held by the first substrate holding unit and the second substrate holding unit, temporarily places the substrate in order to re-hold each substrate using the first substrate holding unit and the second substrate holding unit, and adjusts the position of the temporarily placed substrate.

11. The substrate processing apparatus according to claim 10, wherein: the position adjustment unit is arranged in a longitudinal direction with respect to the first substrate placement unit.

12. The substrate processing apparatus according to claim 8, wherein: the control unit outputs the control signal based on the detection results obtained by the detection unit when the substrate is held by the first substrate holding unit or the second substrate holding unit, so as to adjust the position of handing over the substrate with respect to the first substrate placement unit.

13. The substrate processing apparatus according to claim 12, wherein: the control unit outputs a control signal to continuously convey the multiple substrates collected by the first substrate conveying mechanism from the storage container to the multiple first substrate placement units.

14. The substrate processing apparatus according to claim 12, wherein: the control unit outputs a control signal to cause the first substrate conveying mechanism to continuously collect the substrates from the multiple first substrate placement units and convey each collected substrate to the storage container.

15. A substrate processing method, wherein: the substrate processing method includes the following steps: placing a storage container containing multiple substrates on a container placement unit; processing the substrates respectively using multiple substrate processing parts; moving a base forming a first substrate conveying mechanism; causing a first substrate holding unit and a second substrate holding unit, which form the first substrate conveying mechanism and are independently movable back and forth on the base, to support the substrate from below at positions near the center in the left-right direction of the substrate, so that the edges of the substrate in the left-right direction are open; causing the first substrate holding unit and the second substrate holding unit to move forward together, so as to hand over the substrate to / from the storage container all at once; placing the substrates respectively on multiple mutually stacked first substrate placement units; handing over the substrates placed on the multiple first substrate placement units to / from the multiple substrate processing parts respectively; and causing the first substrate holding unit and the second substrate holding unit to move forward independently on the base to hand over the substrate to / from the multiple first substrate placement units, wherein, a first unit module, a second unit module, a third unit module, and a fourth unit module that are mutually stacked, and multiple mutually stacked first substrate placement units are provided. Each unit module includes multiple substrate processing parts for respectively processing the substrate and a conveying path for conveying the substrate. Each first substrate placement unit is provided in each unit module in such a way that it places the substrate respectively to hand over the substrate to / from the substrate processing parts of each unit module. The first substrate placement parts corresponding to the first unit module and the second unit module respectively include one first substrate placement part and another first substrate placement part. The substrate processing method further includes the following steps: Advancing the first substrate holding part and the second substrate holding part together on the base to pick up the substrate from the storage container all at once, and then advancing the first substrate holding part and the second substrate holding part separately on the base and transporting the substrate to the one first substrate placement part corresponding to the first unit module and the second unit module respectively. And Advancing the first substrate holding part and the second substrate holding part separately on the base and picking up the substrate from the other first substrate placement part corresponding to the first unit module and the second unit module respectively, and then advancing the first substrate holding part and the second substrate holding part separately on the base and transporting the substrate to the first substrate placement part corresponding to the third unit module and the fourth unit module respectively.

16. A substrate processing method, characterized in that The substrate processing method includes the following steps: Placing a storage container containing a plurality of substrates on a container placement part; Processing the substrates respectively by a plurality of substrate processing parts; Moving a base constituting a first substrate transport mechanism; Making a first substrate holding part and a second substrate holding part, which constitute the first substrate transport mechanism and are independently movable back and forth on the base, support the positions near the center in the left-right direction of the substrate from below, so that the edges of the substrate in the left-right direction are open; Advancing the first substrate holding part and the second substrate holding part together to transfer the substrate to and from the storage container all at once; Placing the substrates on a plurality of first substrate placement parts stacked on each other respectively; Transferring the substrates placed on the plurality of first substrate placement parts to and from the plurality of substrate processing parts respectively; And Advancing the first substrate holding part and the second substrate holding part separately on the base to transfer the substrate to and from the plurality of first substrate placement parts, Wherein, a first unit module, a second unit module, a third unit module and a fourth unit module stacked on each other, and a plurality of first substrate placement parts stacked on each other are provided. Each unit module includes a plurality of substrate processing parts for processing the substrates respectively and a transport path for transporting the substrates. Each first substrate placement part is provided in each unit module in such a way as to place the substrates respectively and transfer the substrates to and from the substrate processing parts of each unit module. The first substrate placement parts corresponding to the third unit module and the fourth unit module respectively include one first substrate placement part and another first substrate placement part. The substrate processing method further includes the following steps: Advance the first substrate holding part and the second substrate holding part separately on the base table, pick up the substrates from one first substrate placing part corresponding to the third unit module and the fourth unit module respectively, and then advance the first substrate holding part and the second substrate holding part together on the base table to convey the substrates to the receiving container all at once; and Advance the first substrate holding part and the second substrate holding part separately on the base table, pick up the substrates from the first substrate placing parts corresponding to the first unit module and the second unit module respectively, and then advance the first substrate holding part and the second substrate holding part separately on the base table and convey the substrates to the other first substrate placing part corresponding to the third unit module and the fourth unit module respectively.

17. A substrate processing method, characterized in that the substrate processing method includes the following steps: Place a receiving container containing a plurality of substrates on a container placing part; Process the substrates respectively using a plurality of substrate processing parts; Move the base table constituting the first substrate conveying mechanism; Make the first substrate holding part and the second substrate holding part, which constitute the first substrate conveying mechanism and are independently movable back and forth on the base table, support the substrate from below at positions near the center in the left-right direction of the substrate, so that the edges of the substrate in the left-right direction are open; Advance the first substrate holding part and the second substrate holding part together to transfer the substrates to and from the receiving container all at once; Place the substrates on a plurality of first substrate placing parts stacked on top of each other respectively; Transfer the substrates placed on the plurality of first substrate placing parts to and from the plurality of substrate processing parts respectively; and Advance the first substrate holding part and the second substrate holding part separately on the base table to transfer the substrates to and from the plurality of first substrate placing parts, wherein a first unit module, a second unit module, a third unit module, a fourth unit module, a fifth unit module, and a sixth unit module stacked on top of each other, and a plurality of first substrate placing parts stacked on top of each other are provided. Each unit module has a plurality of substrate processing parts for processing the substrates respectively and a conveying path for conveying the substrates. Each first substrate placing part is provided in each unit module in such a way that it places the substrates respectively to transfer the substrates to and from the substrate processing parts of each unit module; The first substrate placing parts corresponding to the first unit module, the second unit module, the third unit module, the fourth unit module, the fifth unit module, and the sixth unit module respectively include one first substrate placing part and the other first substrate placing part; The first substrate conveying mechanism includes one first substrate conveying mechanism and the other first substrate conveying mechanism; The substrate processing method further includes the following steps: Use the one first substrate conveying mechanism Advance the first substrate holding part and the second substrate holding part together on the base table to pick up the substrate from the accommodation container all at once, and then advance the first substrate holding part and the second substrate holding part separately on the base table and convey the substrate to the one first substrate placement part corresponding to the first unit module and the second unit module respectively; Advance the first substrate holding part and the second substrate holding part separately on the base table and pick up the substrate from the other first substrate placement part corresponding to the first unit module and the second unit module respectively, and then advance the first substrate holding part and the second substrate holding part separately on the base table and convey the substrate to the one first substrate placement part corresponding to the third unit module and the fourth unit module respectively; and Use the other first substrate conveying mechanism, Advance the first substrate holding part and the second substrate holding part separately on the base table and pick up the substrate from the one first substrate placement part corresponding to the fifth unit module and the sixth unit module respectively, and then advance the first substrate holding part and the second substrate holding part together on the base table to convey the substrate to the accommodation container all at once; Advance the first substrate holding part and the second substrate holding part separately on the base table and pick up the substrate from the other first substrate placement part corresponding to the third unit module and the fourth unit module respectively, and then advance the first substrate holding part and the second substrate holding part separately on the base table and convey the substrate to the other first substrate placement part corresponding to the fifth unit module and the sixth unit module respectively.

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