Article taking-out device, article carrying-out device, and article taking-out method

Abstract

The product taking-out device is provided with an adsorption section (51a) that adsorbs a metal plate-shaped product (WP) and ascends, a touch plate (7) that moves between a separated position and a contact position with respect to the product (WP) adsorbed by the adsorption section (51a), and a vibrator (8) that vibrates the touch plate (7).

Description

Technical Field

[0001] This invention relates to a product removal device, a product handling device, and a product removal method, and particularly to a product removal device, a product handling device, and a product removal method for separating and removing a product cut from a workpiece from the remaining material (skeleton) of the workpiece. Background Technology

[0002] In Japanese Patent Publication No. 2005-272118 (Patent Document 1), a technique for separating the remaining material (skeleton) from the workpiece when drawing and removing sheet metal products by stamping is described.

[0003] The separation technique described in Patent Document 1 is a technique in which the outer shape of the product is pre-fitted slightly with the inner shape of the skeleton so that they are not separated by friction, and an impact is applied during separation to separate the two by using the vibration of the impact. Summary of the Invention

[0004] The problem that the invention aims to solve

[0005] Separation of the product from the skeleton is not limited to stamping as described in Patent Document 1; laser cutting can also be performed in the same way.

[0006] For example, in processing using a laser composite processing machine capable of performing laser processing and stamping, in most cases, the product is cut out by laser cutting. The cut product is then picked up and transported by a suction device of a loading and unloading machine and stacked on adjacent shelves.

[0007] However, the cutting width (kerf width) in laser cutting is relatively narrow. During or after processing, part of the product may sink into the underside of the skeleton, or it may bend near the cutting area due to the heat generated during processing. Depending on the degree of bending, the product and the skeleton may slightly overlap in the vertical direction.

[0008] If the product overlaps with the lower side of the frame, the frame will interfere when the product is lifted by the suction device of the loader, causing adverse conditions during the lifting and separation of the product.

[0009] In the separation technique performed by impact described in Patent Document 1, it is effective in removing the integrated state caused by friction between the outer and inner shapes. However, it is difficult to eliminate the overlap between the product and the skeleton in the vertical direction.

[0010] Therefore, efforts are expected to be made to achieve good upward separation relative to the skeleton when removing the product cut from the workpiece.

[0011] Solution for solving the problem

[0012] According to the present invention, a product removal device, a product handling device, and a product removal method are provided that can effectively perform the upward separation of the product relative to the skeleton.

[0013] According to the technical solution of the present invention, the product removal device is characterized in that it comprises an adsorption section for adsorbing and raising a metal plate-shaped product, a contact plate for moving relative to the product adsorbed by the adsorption section between a separation position and a contact position, and a vibrator for vibrating the contact plate.

[0014] According to other technical solutions, the product handling device is characterized by having a tray with a support member that supports the product cut from the metal plate-shaped workpiece and serves as a skeleton for the remaining material, an adsorption section that adsorbs and raises the product supported by the support member, a contact plate that moves between a separated position and a contact position relative to the product adsorbed by the adsorption section, a vibrator that vibrates the contact plate, and a control device that controls the adsorption section to contact the product adsorbed by the adsorption section and to operate the vibrator for a predetermined time after the adsorption section adsorbs the product supported by the support member and raises it to a predetermined distance.

[0015] In addition, the article removal method is characterized by including an adsorption and lifting step in which the article cut from the metal plate and the skeleton as remaining material are adsorbed and lifted by an adsorption part, a contact step in which a contact plate is brought into contact with the article adsorbed by the adsorption part, and a vibration application step in which the contact plate in contact with the article is vibrated by a vibrator. Attached Figure Description

[0016] Figure 1 This is a perspective view of a processing system ST including a product handling device 52 comprising a product handling loader 51 as an embodiment of the product handling device according to an embodiment of the present invention.

[0017] Figure 2 This is a block diagram representing the structure of the machining system ST.

[0018] Figure 3 This is a perspective view showing the removal of loader 51.

[0019] Figure 4 This is a side view showing the removal of the adsorption unit 5 of the loader 51.

[0020] Figure 5 This is a partial cross-sectional view used to illustrate the internal structure of the adsorption pad portion 5c of the adsorption unit 5.

[0021] Figure 6 This is a schematic bottom view showing the removal of loader 51.

[0022] Figure 7 This is a perspective view showing the removal of the vibration unit 6 from the loader 51.

[0023] Figure 8 This is a first action diagram used to illustrate the workpiece removal action performed by the removal loader 51.

[0024] Figure 9 This is a second action diagram used to illustrate the workpiece removal action performed by the removal loader 51.

[0025] Figure 10 This is the third action diagram used to illustrate the workpiece removal action performed by the removal loader 51.

[0026] Figure 11 This is the fourth action diagram used to illustrate the workpiece removal action performed by the removal loader 51.

[0027] Figure 12 This is the fifth action diagram used to illustrate the workpiece removal action performed by the removal loader 51.

[0028] Figure 13 This is a flowchart illustrating the sequence of workpiece removal actions performed by the removal loader 51. Detailed Implementation

[0029] The product removal device according to an embodiment of the present invention will be described using a laser processing system ST comprising a removal loader unit 51, a product handling device 52 equipped with the removal loader unit 51, and a laser processing machine 53 as an example. Hereinafter, the removal loader unit 51 will be referred to as TK unit 51.

[0030] (Example)

[0031] The overall structure of the ST laser processing system is shown in a 3D diagram. Figure 1 And for block diagrams Figure 2 To illustrate, the following explanation will be provided. Figure 1 The arrows indicate the directions: up, down, left, right, front, and back. The up and down direction is the clamping direction, and the front direction is the side where the operator is standing.

[0032] The laser processing system ST includes a laser processing machine 53 and two components arranged adjacent to each other on either the left or right side of the laser processing machine 53. Figure 1 It consists of a product handling device 52 (located on the right side in the middle) and a control device 54 for the overall operation of the control system.

[0033] The laser processing machine 53 includes a laser oscillator 53a and a laser processing head (not shown) that emits laser light generated by the laser oscillator 53a. The laser oscillator is, for example, a fiber optic laser, and the laser light generated by the laser oscillator 53a is supplied to the laser processing head through a process optical fiber 53b.

[0034] The laser processing machine 53 can move the workpiece tray 31, which holds the workpiece W, in the left-right direction within the machine, and can also move the laser processing head forward-backward and up-down in the same direction. Furthermore, the laser processing machine 53... Figure 1 The right side has a tray inlet / outlet 53c for the workpiece tray 31 to enter and exit. The workpiece tray 31 can enter and exit through the tray inlet / outlet 53c both inside and outside the laser processing machine 53. Figure 1 In the image, the workpiece tray 31, which is discharged from the laser processing machine 53 to the workpiece transfer device 52, is shown as having the workpiece W (marked with a dotted line).

[0035] Thus, the laser processing machine 53 irradiates the workpiece W placed on the workpiece tray 31 with a laser from the laser processing head at any horizontal position (front, back, left, right position) to perform laser processing.

[0036] The product handling device 52 includes a pallet table 52a positioned corresponding to the pallet inlet / outlet 53c to the right of the laser processing machine 53, and a transfer table 52b arranged side-by-side in front of the pallet table 52a. Figure 1 In the image, the workpiece pallet 31 is shown to be being conveyed to the pallet table 52a.

[0037] Furthermore, the product handling device 52 has a pair of top frames 52c, 52d that are supported by multiple pillars 52e and wall portions 52f in an attitude in which they are separated to the left and right and extend parallel to each other in the front and back.

[0038] A pair of top frames 52c and 52d are positioned corresponding to the width of the tray table 52a, and guide rails 52g and 52h are respectively provided in a range corresponding to the front-back length of the tray table 52a and the transfer table 52b. A movable frame 52j extending in the left-right direction is supported on the guide rails 52g and 52h, which can move in the front-back direction (arrow DRa).

[0039] The TK unit 51 is supported on the movable frame 52j, which can move in the left and right directions (arrow DRb).

[0040] The product handling device 52 includes a TK unit drive unit 52m and a pallet drive unit 52n (see reference). Figure 2 The TK unit drive unit 52m, under the control of the control device 54, performs the forward and backward movement of the movable frame 52j relative to the guide rails 52g and 52h, and the left and right movement of the TK unit 51 relative to the movable frame 52j.

[0041] Through the operation of the TK unit drive unit 52m, the TK unit 51 can move above any horizontal position on the tray table 52a and the transfer table 52b.

[0042] The TK unit 51 has an adsorption section 51a at its lower part, which is an adsorption pad with multiple plate-shaped components that can adsorb products, etc. Additionally, the TK unit 51 has a lifting drive section 51b that raises and lowers the adsorption section 51a relative to the movable frame 52j. The operation of the lifting drive section 51b is controlled by a control device 54.

[0043] like Figure 2 As shown, the control device 54 is composed of a central processing unit (CPU) 54a, an interference judgment unit 54b, and a vibration control unit 54c.

[0044] With the above structure, the product handling device 52 can remove the product WP and the skeleton WS (as leftover material) from the workpiece tray 31 transported by the laser processing machine 53. Figure 8 ) Transfer product WP to transfer station 52b.

[0045] Specifically, the TK unit 51 is moved and positioned above the product WP before descending. Next, the product WP is adsorbed by the adsorption pad 51c of the adsorption section 51a and rises. After moving horizontally above the transfer table 52b, it descends, releasing the adsorption. Thus, the product WP is transported from the workpiece tray 31 to the transfer table 52b.

[0046] like Figure 1 As shown, the workpiece tray 31 is a rectangular tray in which multiple sliding members 31a are arranged side by side as metal plates with multiple pointed protrusions 31a1 at the top. The workpiece W placed on the workpiece tray 31 is supported by the multiple pointed protrusions 31a1. The multiple sliding members 31a and the fixed switch 52k (see reference) Figure 2 The electric parallel connection is used.

[0047] Secondly, refer to Figures 3-7 Explanation of TK unit 51. Figure 3 This is a perspective view of TK unit 51 viewed from slightly above and to the right of the front. The movable frame 52j supporting TK unit 51 is represented by a dotted line.

[0048] The TK unit 51 includes a lifting drive unit 51b with a servo motor (not shown) and supported by a movable frame 52j, a columnar main body 1 that uses the servo motor as a power source relative to the lifting drive unit 51b and moves up and down relative to the movable frame 52j, and an adsorption unit 51a installed at the lower part of the main body 1.

[0049] The adsorption part 51a has a base 2 with a roughly hexahedral shape, and a pair of auxiliary parts 3 and 4 that are supported on the left and right by support arms 3a and 4a respectively, and move between a basic position sealed in the base 2 and an extended position extending to the left or right (refer to arrow DRc). Figure 2 In the diagram, solid lines represent auxiliary parts 3 and 4 located in the basic position, and dotted lines represent auxiliary parts 3 and 4 located in the extended position.

[0050] Multiple adsorption units 5 are arranged in the lower part of the base 2 and the auxiliary parts 3 and 4 with the vertical direction as the axis. Figure 4 This is a side view showing the monomer of adsorption unit 5. Figure 5 is... Figure 4 A partial sectional view of part A in the image.

[0051] The adsorption unit 5 includes a cylinder 5a, a rod 5b that extends and retracts from its lower part by the action of the cylinder 5a, and an adsorption pad 5c installed at the front end of the rod 5b.

[0052] A pump 52p that generates negative pressure is connected to the adsorption pad 5c (see also [reference]). Figure 2 The pump 52p creates a negative pressure inside the rubber suction cup 5c1 at the front end, allowing it to adsorb flat components such as the product WP. The operation of the pump 52p is controlled by the control device 54.

[0053] like Figure 5 As shown, a helical spring 5d, made of conductive material and compressible in the vertical direction, is installed inside the adsorption pad 5c. The helical spring 5d achieves conductivity by pressing into contact with the metal plate when the adsorption pad 5c adsorbs the metal plate.

[0054] The multiple adsorption pads 5c each have their own spiral springs 5d and fixed switches 52k (see reference). Figure 2 They are electrically connected in parallel and function as contacts for detecting continuity. Hereinafter, the helical spring 5d will also be referred to as contact 5d.

[0055] When the fixed switch 52k achieves conduction between the sliding member 31a and the contact member 5d (coil spring 5d), it sends an on signal to the interference judgment unit 54b of the control device 54; when it does not achieve conduction, it sends an off signal.

[0056] like Figure 3 As shown, the height positions of the adsorption surfaces of the adsorption pads of the multiple adsorption units 5 are aligned at a predetermined distance Ha from the bottom of the base 2 downwards. The adsorption part 51a is conductive only to the contact part 5d relative to the product WP, while other parts are insulated.

[0057] Additionally, a vibration unit 6 is provided on the base 2. For example... Figure 6 as well as Figure 7 As shown, the vibration unit 6 includes a contact plate 7, which is a rectangular resin plate with an R-shape at the corners, and four lifting cylinders 9 that are connected to the top front end of rods 9a near the corners of the contact plate 7 and fixed to the base 2 at the root side of the main body. Additionally, the vibration unit 6 has two vibrators 8 (8a, 8b) mounted offset in the left-right direction near the edges of opposite sides of the contact plate 7. Openings 7a are provided on the contact plate 7 for insertion of suction pads 5c located at positions coinciding with the contact plate 7.

[0058] Multiple lifting cylinders 9 synchronously move the lever 9a in and out. That is, the contact plate 7 is raised and lowered in a horizontal position by the action of the lifting cylinders 9, and this raising and lowering action is controlled by the control device 54. The lowest position of the contact plate 7 in the raising and lowering action is as described above, and the bottom 7b of the contact plate 7 is a position that is a predetermined distance Ha from the bottom 2a of the base 2 downwards.

[0059] The touch plate 7 has a planar portion 7d as a plane of a predetermined area in at least a portion of the plane below 2a. Figure 6 In this example, the lower 2a is entirely a flat portion 7d. The touch plate 7 is raised and lowered while maintaining a horizontal position by the action of the lifting cylinder 9.

[0060] Vibrator 8 is an air vibrator that generates vibration using compressed air. More specifically, it is a general-purpose turbine vibrator that generates vibration by rotating an impeller with an eccentric hammer using compressed air, and is mounted on the upper part 7c of the contact plate 7 by bolts (not shown). The amplitude and vibration frequency can be changed according to the pressure of the supplied compressed air (e.g., 0.2 to 0.6 MPa), and the variable range of the vibration frequency is approximately 100 to several hundred Hz.

[0061] Regarding the detailed description above of the product handling device 52 of the laser processing system ST, the product WP removal sequence relative to the skeleton WS is mainly referred to... Figures 8-12 Schematic diagram and Figure 13 The flowchart will be used for explanation. First, refer to... Figure 8 , Figure 9 as well as Figure 13 This section explains how the product WP and the skeleton WS can be removed without interference.

[0062] Figure 8 This is a front sectional view of the product WP and the skeleton WS after the product WP has been cut from the workpiece on the sliding member 31a by the cutting process of the laser processing machine 53. Figure 8 The components, such as the adsorption unit 5, are schematically shown in the diagram.

[0063] First, if the cutting process is completed, the CPU 54 of the control device 54 moves the TK unit 51 above the product WP and then lowers it, using the adsorption pad 5c of the adsorption unit 5 to adsorb the product WP (step 1).

[0064] If the absorbent pad 5c is used to absorb the product WP, then the TK unit 51 will rise to a predetermined height Hb (e.g., about 30 mm). Figure 9 (arrow DRf)(step 2).

[0065] Therefore, the product WP also increases along with the adsorption pad portion 5c, provided that it does not interfere with the skeleton WS, such as Figure 9 As shown, the product WP rises independently. On the other hand, the skeleton WS is placed on the sliding member 31a without floating.

[0066] Secondly, the interference judgment unit 54b of the control unit 54 confirms whether the output of the fixed switch 52k is on or off.

[0067] like Figure 9 As mentioned above, multiple sliding components 31a and multiple adsorption units 5 are connected in parallel on the fixed switch 52k.

[0068] Therefore, if the workpiece WP and the skeleton WS are in contact at one position and conduction occurs, conduction is achieved between the contact member 5d and the sliding member 31a, and the output of the fixed switch 52k is "on". On the other hand, if the workpiece WP and the skeleton WS are not in contact and no conduction occurs, the output of the fixed switch 52k is "off". Thus, the interference judgment unit 54b can determine whether the output of the fixed switch 52k is "on" or "off" and is "conducting" respectively (step 3).

[0069] because Figure 8 This indicates that the product WP is lifted without interference or contact relative to the skeleton WS. Therefore, the output of the fixed switch 52k is off, and the interference judgment unit 54b judges it as "not conducting" (step 3: no).

[0070] Accepting the "not conducting" judgment, CPU54a, as not generating interference between the product WP and the skeleton WS, rises to the highest position together with the product WP adsorbed by TK unit 51 (step 4).

[0071] Next, the product WP is moved horizontally and then lowered to a transfer position such as the transfer table 52b (step 5).

[0072] Next, we will explain the case where step (2) is performed when the workpiece WP interferes with the skeleton WS, and a portion of the workpiece WP, specifically part WPa, coincides with the lower side of the skeleton WS. In this case, step (2) becomes... Figure 10 The state shown.

[0073] That is, at part WPa of the product WP, the skeleton WS is in a lifted state. In this case, since part WPa is in contact with the skeleton WS, the contact member d in the adsorption pad part 5c that is in contact with the product WP and the sliding member 31a that is in contact with the skeleton WS are connected. As a result, since the output of the fixed switch 52k is turned on, the interference judgment unit 54b judges that it is "connected" (step 3: yes).

[0074] Upon receiving the "conduction" judgment, the vibration control unit 54c activates the lifting cylinder 9, causing the vibration unit 6 to descend. Figure 11(arrow DRg) to bring the flat portion 7d of the contact plate 7 into contact with the upper surface WPb of the product WP (step 6). The predetermined area of ​​the flat portion 7d in the contact plate 7 is preset to be an area that can reliably contact other parts even if the product WP has partial detachment such as holes.

[0075] The force with which the contact plate 7 presses down on the product WP is set to be lower than the adsorption force of the product WP generated by the adsorption unit 5. Therefore, the product WP will not fall off due to the contact of the contact plate 7 and release from the adsorption of the adsorption unit 5.

[0076] Furthermore, since the contact plate 7 is made of resin, it will not damage the product WP. Of course, it is also possible to avoid damage to the product WP by using a hard material such as metal as the substrate and forming the contact area with the product WP with a resin or rubber that is softer than metal.

[0077] The contact between the contact plate 7 and the product WP is controlled, for example, by the extension amount of the rod 9a of the lifting cylinder 9.

[0078] After the flat portion 7d of the contact plate 7 comes into contact with the product WP, the vibration control unit 54c causes the vibrator 8 to operate for a predetermined time t1 to apply vibration to the product WP and the skeleton WS that is in contact with it at its portion WPa (step 7).

[0079] As described above, the two vibrators 8a and 8b, which are the vibrators 8, are, for example, structures that apply a small amplitude reciprocating motion of about 100 to several hundred Hz to the contact plate 7. The predetermined time t1 is preset. For example, it is 2 to 3 seconds.

[0080] After the vibration of vibrators 8a and 8b at time t1, the interference judgment unit 54b determines whether the product WP and the skeleton WS are connected based on the signal from the fixed switch 52k (step 8).

[0081] The product WP is subjected to minute vibrations generated by vibrators 8a and 8b, which change the relative position of the product and the skeleton WS. As a result, in most cases, the degree of interference is reduced and interference is eliminated.

[0082] In particular, since the vibration of vibrators 8a and 8b causes the product WP to be lifted to a predetermined height through the execution of (step 2), the interference skeleton WS is in an unstable state where only a part is lifted by part WPa.

[0083] If a small vibration is applied to an unstable object, it will often transition to a stable state. Therefore, the skeleton WS, due to the application of vibration, transitions from an unstable state in which it is locally lifted by part WPa to a stable state in which it is supported by the sliding part 31a as a whole, and thus has the tendency to eliminate interference with the product WP.

[0084] In (step 8), if the interference judgment unit 54 determines that it is conducting (yes), then the CPU 54a will release the product WP by releasing the adsorption of the product WP by the adsorption pad unit 5c as it will not eliminate the interference and will produce a defective state (step 9).

[0085] Secondly, the CPU54a outputs an alarm via sound or image from the output unit not shown in the figure (step 10).

[0086] On the other hand, in (step 8), the interference judgment unit 54b determines that it is not conducting (no), the CPU 54a eliminates the interference between the product WP and the skeleton WS, the product WP is in a good state of being cut off, and the vibration controller 54c causes the vibration unit 6 to rise and the contact plate 7 to leave the product WP (step 11). Then, it moves to (step 4) and performs the above-mentioned product transport.

[0087] If the interference judgment unit 54b determines that the circuit is conducting in step 8, it can return to step 7 and make the vibrators 8a and 8b operate again to apply vibration to the product WP and the interference skeleton WS.

[0088] That is, a judgment step is set between (step 8) and (step 9) to determine whether the vibration application has reached a predetermined number of times. If it is determined to be on in (step 8), the vibration application action can be set to repeat before reaching the upper limit of the predetermined number of times.

[0089] As a result, the duration of vibration and the processing efficiency of each product will decrease, but the probability of eliminating the hooking (interference) between the product WP and the skeleton WS will increase. Therefore, the number of alarms generated will decrease, and the overall efficiency of the processing operation will also improve. The number of vibration actions can be appropriately set according to the interference situation.

[0090] The vibrator 8 installed on the contact plate 7 can be one, or as mentioned above, two, or more than three.

[0091] In the case of multiple vibrators 8, it is preferable to arrange them at random positions in the contact plate 7. If there are two vibrators 8a and 8b, they can be arranged at positions offset in the left and right directions near the opposite edges of the contact plate 7 in the front-back direction.

[0092] By setting at least two contact plates 7, the vibration pattern generated by the contact plates 7 is irregular, which better and for a shorter time eliminates the overlap of interference between the product WP and the skeleton WS.

[0093] Furthermore, since the vibration of the contact plate 7 via the vibrator 8 is minimal, its effect on the adsorption force of the product WP generated by the adsorption pad portion 5c can be ignored.

[0094] Furthermore, due to the vibration of the vibrator 8, the contact plate 7 does not move in one direction, but rather reciprocates with a small displacement. Therefore, even if the displacement point is offset, the effect of adsorption by the adsorption pad 5c can be ignored.

[0095] In addition, when the laser processing machine 53 is a laser composite processing machine, it has always been possible to avoid interference between the product WP and the skeleton WS by punching a hole along the cut width after the product shape processing is performed by laser.

[0096] In this situation, there would be issues of reduced work efficiency and increased costs. However, if the aforementioned product handling device 52 is used, the product WP can be effectively separated from the skeleton WS without the need for stamping after laser processing. Therefore, compared to the case of performing stamping, work efficiency is significantly optimized while suppressing cost increases.

[0097] The embodiments of the present invention are not limited to the structure and sequence described above, and can be considered variations without departing from the spirit of the invention. The shape and size of the contact plate 7 are not limited. It can be appropriately set according to the shape of the product WP. In addition, the type of vibrator 8 is not limited. It does not necessarily have to be the pneumatic type described above, and can also be electric.

[0098] In step 2, the predetermined height Hb is preferably set to a small or large value based on the thickness of the workpiece W, i.e., the product WP and the thickness of the skeleton WS.

[0099] For example, the thicker the skeleton WS is, the more difficult it is to deform, and the greater the deformation resistance will be. Therefore, in the adsorption and rise of product WP when there is interference between product WP and skeleton WS, the thicker the plate, the greater the deformation resistance it receives from skeleton WS, and there is also a possibility that product WP may fall off from the adsorption pad 5c.

[0100] Therefore, it is preferable to set the predetermined height Hb, which is the rising height of the product WP in (step 2), as the plate thickness is greater and smaller.

[0101] Furthermore, the larger the product WP, the farther the outer edge of the interference with the skeleton WS is from the adsorption part 51a. Since the torque of the resistance borne by the skeleton WS becomes larger, it is detrimental to adsorption.

[0102] Therefore, the predetermined height Hb in step 2 is set to be larger and smaller, which reduces the torque of the resistance borne by the skeleton WS.

[0103] The contact plate 7 is not limited to a structure that contacts the top of the workpiece WP, but can also be a structure that rises from the side of the workpiece tray 31 and contacts the bottom.

[0104] The shape cutting of a product (WP) is not limited to laser cutting. It can also be done using other thermal cutting devices such as lasers or stamping machines.

[0105] According to the present invention, a good effect of upward separation of the article relative to the skeleton can be obtained.

[0106] (Formulated by the United States)

[0107] This international patent application relates to a U.S. designation and references the disclosure of Japanese Patent Application No. 2017-216316, filed November 9, 2017, which cites an interest based on priority under Section 119(a) of the U.S. Patent Act.

Claims

1. A product handling device, characterized in that, have: A tray having supporting components that support the products cut from sheet metal workpieces and serve as a skeleton for the remaining material. The adsorption section adsorbs the aforementioned article supported by the aforementioned support member and rises; The contact plate moves between the separation position and the contact position relative to the above-mentioned product adsorbed by the above-mentioned adsorption section; A vibrator that causes the aforementioned contact plate to vibrate; as well as The control device controls the process in the following manner: after the adsorption part adsorbs the article supported by the support member and raises it a predetermined distance, the contact plate contacts the article adsorbed by the adsorption part, and the vibrator operates for a predetermined time. The aforementioned support component is in communication with the aforementioned frame it supports. The aforementioned adsorption section has a contact element that is in communication with the adsorbed product. The aforementioned control device controls the operation of the vibrator based on whether or not there is continuity between the aforementioned support component and the aforementioned contact component.

2. The product handling device according to claim 1, characterized in that, The aforementioned vibrator is an air vibrator that vibrates at a frequency corresponding to the pressure of the supplied compressed air. The control device changes the pressure during the predetermined time during which the vibrator is operated.

3. A method for removing a product, characterized in that, Includes the following steps: An adsorption-lifting step in which the product, cut from a metal plate and supported by a supported component, is adsorbed and lifted from the skeleton, which is the remaining material, by an adsorption section; and A contact element is provided that is in communication with the product adsorbed by the adsorption unit. After the product adsorbs by the adsorption unit and rises, a step is taken to determine whether or not there is communication between the contact element and the support member supporting the frame. If the above steps for determining whether conduction is successful are confirmed, proceed with the following steps: The contact step of bringing the contact plate into contact with the article adsorbed by the adsorption part; and The vibration application step involves vibrating the contact plate that comes into contact with the aforementioned article using a vibrator.

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