Image sensors and electronics

Abstract

The present application provides an image sensor and an electronic device, the image sensor comprising: a lens assembly, formed by splicing a plurality of first lenses along a first direction; at least one second lens, located on one side of the lens assembly, the projection area of ​​the second lens on the lens assembly is the first projection area, and the splicing point of at least two first lenses is located within the first projection area; a photosensitive chip assembly, comprising a plurality of first photosensitive chips, located on one side of the lens assembly, the plurality of first photosensitive chips are arranged along the first direction, and the plurality of first photosensitive chips are used to receive light emitted from the lens assembly; at least one second photosensitive chip, located on one side of the second lens, the second photosensitive chip is used to receive light emitted from the second lens in a one-to-one correspondence; a circuit board assembly, formed by sequentially arranging a plurality of circuit boards, the first photosensitive chip and the second photosensitive chip are both located on the circuit board. The above image sensor solves the problem of data distortion or error corresponding to the splicing point of the image sensor in the prior art.

Description

Technical Field

[0001] The present application relates to the field of image sensors, and in particular, to an image sensor and an electronic device. Background Art

[0002] The length of the lens in the current CIS (Contact Image Sensor) is limited, so when developing a longer CIS, since most of the purchased lenses are short and there are no longer lenses, lens splicing technology is needed. The yield rate of making a longer lens using lens splicing is relatively low; even if it is a good product, the data corresponding to the splicing point will be distorted or wrong.

[0003] The above information disclosed in the background technology section is only used to enhance the understanding of the background technology of the technology described in this article. Therefore, the background technology may contain certain information that does not form the prior art known in this country for those skilled in the art. Summary of the invention

[0004] The main purpose of the present application is to provide an image sensor and an electronic device to solve the problem of distortion or error in data corresponding to the joints of contact image sensors in the prior art.

[0005] In order to achieve the above-mentioned purpose, according to one aspect of the present application, an image sensor is provided, comprising: a lens assembly, formed by splicing a plurality of first lenses along a first direction; at least one second lens, located on one side of the lens assembly, the projection area of ​​the second lens on the lens assembly is a first projection area, and the splicing point of at least two spliced ​​first lenses is located within the first projection area; a photosensitive chip assembly, comprising a plurality of first photosensitive chips, located on one side of the lens assembly, the plurality of first photosensitive chips are arranged along the first direction, and the plurality of first photosensitive chips are used to receive light emitted from the lens assembly; at least one second photosensitive chip, located on one side of the second lens, and the number of the second photosensitive chips is the same as the number of the first photosensitive chips. The number of second lenses is the same, and the second photosensitive chips are used to receive the light emitted by the second lenses in a one-to-one correspondence; a circuit board assembly is formed by a plurality of circuit boards arranged in sequence, the circuit board assembly is located on the side of the first photosensitive chip away from the lens assembly, the first photosensitive chip and the second photosensitive chip are both located on the circuit board, the distance between the first lens and the surface of the circuit board is a first distance, the distance between the second lens and the surface of the circuit board is a second distance, the first distance and the second distance are the same, the distance between the first photosensitive chip and the surface of the circuit board is a third distance, the distance between the second photosensitive chip and the surface of the circuit board is a fourth distance, and the third distance and the fourth distance are the same.

[0006] Optionally, in the photosensitive chip assembly, at least two adjacent first photosensitive chips have a first interval, the projection of the first interval on a predetermined surface of the lens assembly is a second projection area, the joint of the two first lenses in the lens assembly is located within the second projection area, the predetermined surface is a surface perpendicular to a second direction, and the second direction is the thickness direction of the first lens.

[0007] Optionally, in the circuit board assembly, two adjacent circuit boards are respectively a first circuit board and a second circuit board, wherein the end face of the first end of the first circuit board is a first end face, the first end face is formed by connecting a first surface, a second surface and a third surface in sequence, the first surface is perpendicular to the second surface and parallel to the third surface, the end face of the second end of the second circuit board is a second end face, the second end face is formed by connecting a fourth surface, a fifth surface and a sixth surface in sequence, the fourth surface is perpendicular to the fifth surface and parallel to the sixth surface, and the first end of the first circuit board is adapted to the second end of the second circuit board and has a gap.

[0008] Optionally, a joint between two circuit boards is located between two adjacent first photosensitive chips having the first interval, and a length direction of the second photosensitive chip is parallel to the second surface.

[0009] Optionally, the length extension direction of the first lens is the same as the first direction, the length extension direction of the second lens is the same as the first direction, and the first lens and the second lens have a second interval in a third direction, and the first direction is perpendicular to the third direction.

[0010] Optionally, the length direction of the first photosensitive chip is parallel to the first direction, the length direction of the second photosensitive chip is parallel to the first direction, and the first photosensitive chip and the second photosensitive chip have a third interval in the third direction.

[0011] Optionally, the second interval and the third interval are the same and equal to an integer multiple of the diameter of a photosensitive hole, and the photosensitive chip includes a plurality of the photosensitive holes.

[0012] Optionally, the image sensor further includes: a frame having a accommodating cavity, and the circuit board, the first lens, the second lens, the first photosensitive chip and the second photosensitive chip are all located in the accommodating cavity.

[0013] Optionally, the image sensor further includes: a light source located in the accommodating cavity and on a side of the first photosensitive chip away from the circuit board, and the reflected light after the light emitted by the light source irradiates the object to be measured enters the first lens and the second lens.

[0014] According to one aspect of the present application, an electronic device is provided, including an image sensor, wherein the image sensor is any one of the image sensors described above.

[0015] By applying the technical solution of the present application, in the above-mentioned image sensor, a second lens is arranged on one side of the lens assembly and a second photosensitive chip is arranged on one side of the photosensitive chip assembly, so that the reflected light at the joint of the two first lenses is received by the second photosensitive chip through the second lens, and the first distance and the second distance are the same, and the third distance and the fourth distance are the same, so that the distance between the first lens and the corresponding first photosensitive chip is equal to the distance between the second lens and the corresponding second photosensitive chip, ensuring that the first photosensitive chip and the second photosensitive chip output images with the same resolution, facilitating subsequent image synthesis to obtain a continuous image, that is, the image output by the second photosensitive chip is used to replace the image output by the corresponding photosensitive chip at the joint of the two first lenses, thereby avoiding distortion or error in the image data corresponding to the joint of the first lenses, and solving the problem of distortion or error in the data corresponding to the joint of the contact image sensor in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings constituting part of the present application are used to provide a further understanding of the present application. The exemplary embodiments and descriptions of the present application are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0017] Figure 1 A schematic diagram showing the structure of two spliced ​​first lenses and second lenses according to an embodiment of the present application is shown;

[0018] Figure 2 A schematic structural diagram of two first photosensitive chips and a second photosensitive chip having a first interval and being adjacent to each other according to an embodiment of the present application is shown;

[0019] Figure 3 Shows Figure 2 A schematic diagram of the structure of the first wiring board, the second wiring board, the first photosensitive chip and the second photosensitive chip;

[0020] Figure 4 Shows Figure 2 The enlarged view of the dotted box part;

[0021] Figure 5 Shows Figure 2 A schematic structural diagram of a first photosensitive chip being arranged in a first interval;

[0022] Figure 6 shows an image output by a photosensitive chip assembly and an image output by a second photosensitive chip according to an embodiment of the present application; and

[0023] Figure 7 A complete image of an object to be tested according to an embodiment of the present application is shown.

[0024] The above drawings include the following reference numerals:

[0025] 10. First lens; 20. Second lens; 30. Joint; 40. First photosensitive chip; 50. Second photosensitive chip; 60. Circuit board assembly; 61. First circuit board; 611. First surface; 612. Second surface; 613. Third surface; 62. Second circuit board; 621. Fourth surface; 622. Fifth surface; 623. Sixth surface; 70. Second interval; 80. First interval; 90. Third interval; 100. First image; 200. Second image; 300. Third image. DETAILED DESCRIPTION

[0026] It should be noted that the following detailed descriptions are illustrative and are intended to provide further explanation of the present application. Unless otherwise specified, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art to which the present application belongs.

[0027] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0028] It should be understood that when an element (such as a layer, film, region, or substrate) is described as being "on" another element, the element may be directly on the other element, or there may be intermediate elements. Moreover, in the specification and claims, when an element is described as being "connected" to another element, the element may be "directly connected" to the other element, or "connected" to the other element through a third element.

[0029] As introduced in the background art, the data corresponding to the joints of the contact image sensor in the prior art are distorted or erroneous. To solve the above problems, the present application proposes an image sensor and an electronic device.

[0030] In a typical embodiment of the present application, an image sensor is provided, the image sensor comprising:

[0031] The lens assembly is formed by splicing a plurality of first lenses 10 along a first direction, such as Figure 1 As shown;

[0032] At least one second lens 20 is located on one side of the lens assembly, the projection area of ​​the second lens 20 on the lens assembly is the first projection area, and the joint 30 of at least two of the first lenses 10 is located in the first projection area. The second lens 20 is not formed by splicing. Figure 1 As shown;

[0033] The photosensitive chip assembly includes a plurality of first photosensitive chips 40, which are located on one side of the lens assembly. The plurality of first photosensitive chips 40 are arranged along the first direction, and the plurality of first photosensitive chips 40 are used to receive the light emitted by the lens assembly. Figure 2 As shown;

[0034] At least one second photosensitive chip 50 is located on one side of the second lens. The number of the second photosensitive chips 50 is the same as the number of the second lenses. The second photosensitive chips 50 are used to receive the light emitted by the second lenses in a one-to-one correspondence. Figure 2 As shown;

[0035] The circuit board assembly 60 is formed by arranging a plurality of circuit boards in sequence. The circuit board assembly is located on a side of the first photosensitive chip 40 away from the lens assembly. The first photosensitive chip 40 and the second photosensitive chip 50 are both located on the circuit board. Figure 2 As shown, the distance between the first lens and the surface of the circuit board is a first distance, the distance between the second lens and the surface of the circuit board is a second distance, the first distance and the second distance are the same, the distance between the first photosensitive chip and the surface of the circuit board is a third distance, the distance between the second photosensitive chip and the surface of the circuit board is a fourth distance, and the third distance and the fourth distance are the same.

[0036] In the above-mentioned image sensor, by arranging a second lens on one side of the lens assembly and a second photosensitive chip on one side of the photosensitive chip assembly, the reflected light at the joint of the two first lenses is received by the second photosensitive chip through the second lens, and the first distance and the second distance are the same, and the third distance and the fourth distance are the same, so that the distance between the first lens and the corresponding first photosensitive chip is equal to the distance between the second lens and the corresponding second photosensitive chip, ensuring that the first photosensitive chip and the second photosensitive chip output images with the same resolution, facilitating subsequent image synthesis to obtain a continuous image, that is, the image output by the second photosensitive chip is used to replace the image output by the corresponding photosensitive chip at the joint of the two first lenses, thereby avoiding distortion or error in the image data corresponding to the joint of the first lenses, and solving the problem of distortion or error in the data corresponding to the joint of the contact image sensor in the prior art.

[0037] It should be noted that the above-mentioned first projection area is the projection of the above-mentioned second lens on the surface of the lens assembly that is perpendicular to the third direction. The above-mentioned third direction is perpendicular to the thickness direction and to the above-mentioned first direction. The joint of the two spliced ​​first lenses is located in the above-mentioned first projection area, so that the reflected light at the joint of the two spliced ​​first lenses can be emitted through the second lens.

[0038] It should also be noted that the first lens and the second lens are of the same model, and the first photosensitive chip and the first photosensitive chip are of the same model, which further ensures that the image resolutions output by the first photosensitive chip and the second photosensitive chip are the same, facilitating subsequent image synthesis.

[0039] In one embodiment of the present application, in the photosensitive chip assembly, at least two adjacent first photosensitive chips 40 have a first interval 80 between them. Figure 2 As shown, the projection of the first interval on the predetermined surface of the lens assembly is the second projection area, the joint of the two first lenses in the lens assembly is located in the second projection area, the predetermined surface is a surface perpendicular to the second direction, and the second direction is the thickness direction of the first lens. Specifically, the joint of the two first lenses in the lens assembly is located in the second projection area, which can ensure that the reflected light at the joint of the two first lenses will not be received by the first photosensitive chip, thereby avoiding the overlap of the images output by the first photosensitive chip and the second photosensitive chip, and reducing the workload of image processing.

[0040] In one embodiment of the present application, Figure 3 As shown, in the above-mentioned circuit board assembly, the two adjacent circuit boards are respectively a first circuit board 61 and a second circuit board 62, wherein the end face of the first end of the above-mentioned first circuit board 61 is the first end face, the above-mentioned first end face is formed by connecting the first surface 611, the second surface 612 and the third surface 613 in sequence, the above-mentioned first surface 611 is perpendicular to the above-mentioned second surface 612 and parallel to the above-mentioned third surface 613, the end face of the second end of the above-mentioned second circuit board 62 is the second end face, the above-mentioned second end face is formed by connecting the fourth surface 621, the fifth surface 622 and the sixth surface 623 in sequence, the above-mentioned fourth surface 621 is perpendicular to the above-mentioned fifth surface 622 and parallel to the above-mentioned sixth surface 623, the first end of the above-mentioned first circuit board 61 is adapted to the second end of the above-mentioned second circuit board 62 and has a gap. Specifically, the first end of the above-mentioned first circuit board is spliced ​​with the second end of the above-mentioned second circuit board, the above-mentioned first surface coincides with the above-mentioned fourth surface, the above-mentioned second surface coincides with the above-mentioned fifth surface, and the above-mentioned third surface coincides with the above-mentioned sixth surface, so that the splicing part is Z-shaped.

[0041] In another embodiment of the present application, the distance between the first surface and the fourth surface is the fifth distance, the distance between the second surface and the fifth surface is the sixth distance, the distance between the third surface and the sixth surface is the seventh distance, and the fifth distance, the sixth distance and the seventh distance are all equal, that is, the first end of the first circuit board and the second end of the second circuit board are not spliced ​​to reduce the impact of changes in the spacing between adjacent first photosensitive chips caused by thermal expansion and contraction, so as to avoid mutual squeezing and damaging the chips.

[0042] In one embodiment of the present application, Figure 3 As shown, the joint of the two circuit boards is located between the two adjacent first photosensitive chips 40 having the first interval, and the length direction of the second photosensitive chip 50 is parallel to the second surface 612, so that the projection of the second photosensitive chip on the photosensitive chip assembly covers the first interval, ensuring that the light emitted by the corresponding second lens can be completely received, thereby avoiding discontinuity of the image output by the image sensor.

[0043] In one embodiment of the present application, Figure 4 As shown, the projection of the second photosensitive chip 50 on the photosensitive chip assembly completely overlaps with the first interval 80 to improve the utilization rate of the light receiving area of ​​the second photosensitive chip.

[0044] In one embodiment of the present application, Figure 5 As shown, a first photosensitive chip 40 is arranged in the first interval 80, so that the image output by the first photosensitive chip 40 is compared with the image output by the corresponding second photosensitive chip 50 to detect whether the image output by the second photosensitive chip 50 solves the problem of distortion or error.

[0045] In one embodiment of the present application, Figure 1 As shown, the length extension direction of the first lens 10 is the same as the first direction, the length extension direction of the second lens 20 is the same as the first direction, and the first lens 10 and the second lens 20 have a second interval 70 in the third direction, and the first direction is perpendicular to the third direction. Specifically, the length extension directions of the first lens and the second lens are parallel, the third direction is the moving direction of the object to be measured, and the first lens and the second lens have a second interval in the third direction. When the first lens emits the reflected light of the object to be measured, the reflected light of the object to be measured corresponding to the first interval is not emitted through the first lens. After the object to be measured moves the second interval, the reflected light of this part of the object to be measured is emitted through the second lens, so that the emitted light of the first lens and the second lens is respectively received by the corresponding photosensitive chip, so that the image sensor outputs a complete image of the object to be measured.

[0046] In one embodiment of the present application, Figure 2As shown, the length direction of the first photosensitive chip 40 is parallel to the first direction, the length direction of the second photosensitive chip 50 is parallel to the first direction, and the first photosensitive chip 40 and the second photosensitive chip 50 have a third interval 90 in the third direction. Specifically, since the first photosensitive chip corresponds to the first lens one-to-one, the second photosensitive chip corresponds to the second lens one-to-one, and the length direction of the first photosensitive chip is parallel to the length extension direction of the first lens, the length direction of the second photosensitive chip is parallel to the length extension direction of the second lens, and the first lens and the second lens have a second interval in the third direction, the first photosensitive chip corresponding to the first lens and the second photosensitive chip corresponding to the second lens have a third interval in the third direction, so that the first photosensitive chip receives the corresponding light emitted from the first lens, and the second photosensitive chip receives the corresponding light emitted from the second lens.

[0047] In one embodiment of the present application, the second interval and the third interval are the same and are equal to an integer multiple of the diameter of the photosensitive hole, and the photosensitive chip includes a plurality of the photosensitive holes. Specifically, the second interval and the third interval are the same, so that the first photosensitive chip and the second photosensitive chip receive all the emitted light of the corresponding lens, and the second interval and the third interval are equal to an integer multiple of the diameter of the photosensitive hole, so that the image output by the first photosensitive chip and the image output by the second photosensitive chip are synthesized, thereby reducing the workload of image processing.

[0048] In one embodiment of the present application, the image sensor further includes: a frame having a housing cavity, wherein the circuit board, the first lens, the second lens, the first photosensitive chip, and the second photosensitive chip are all located in the housing cavity. Specifically, the circuit board, the first lens, the second lens, the first photosensitive chip, and the second photosensitive chip are all located in the housing cavity, so that the frame can protect the components and reduce the probability of damage to the image sensor or external interference.

[0049] In one embodiment of the present application, the image sensor further includes: a light source, which is located in the accommodating cavity and on a side of the first photosensitive chip away from the circuit board, and the reflected light after the light emitted by the light source irradiates the object to be measured enters the first lens and the second lens. Specifically, the reflected light after the light emitted by the light source irradiates the object to be measured enters the first lens and the second lens, the first photosensitive chip receives the corresponding emitted light of the first lens, the second photosensitive chip receives the corresponding emitted light of the second lens, and the image sensor outputs a composite image of the image output by the first photosensitive chip and the image output by the second photosensitive chip, so as to obtain a complete image of the object to be measured. For example, the images output by the two adjacent first photosensitive chips having the first interval are the first image 100 and the second image 200, respectively, and the image output by the second photosensitive chip corresponding to the first interval is the third image 300, as shown in FIG. Figure 6 As shown, the first image 100, the second image 200 and the third image 300 are synthesized to obtain a complete image of the object to be tested, such as Figure 7 shown.

[0050] In one embodiment of the present application, an electronic device is provided, including an image sensor, wherein the image sensor is any one of the above-mentioned image sensors.

[0051] The above-mentioned electronic device includes an image sensor. By arranging a second lens on one side of the lens assembly and a second photosensitive chip on one side of the photosensitive chip assembly, the reflected light at the joint of the two first lenses is received by the second photosensitive chip through the second lens, and the first distance and the second distance are the same, and the third distance and the fourth distance are the same, so that the distance between the first lens and the corresponding first photosensitive chip is equal to the distance between the second lens and the corresponding second photosensitive chip, ensuring that the first photosensitive chip and the second photosensitive chip output images with the same resolution, facilitating subsequent image synthesis to obtain a continuous image, that is, the image output by the second photosensitive chip is used to replace the image output by the corresponding photosensitive chip at the joint of the two first lenses, thereby avoiding distortion or error in the image data corresponding to the joint of the first lenses, and solving the problem of distortion or error in the data corresponding to the joint of the contact image sensor in the prior art.

[0052] From the above description, it can be seen that the above embodiments of the present application achieve the following technical effects:

[0053] 1) In the image sensor of the present application, a second lens is arranged on one side of the lens assembly and a second photosensitive chip is arranged on one side of the photosensitive chip assembly, so that the reflected light at the joint of the two first lenses is received by the second photosensitive chip through the second lens, and the first distance and the second distance are the same, and the third distance and the fourth distance are the same, so that the distance between the first lens and the corresponding first photosensitive chip is equal to the distance between the second lens and the corresponding second photosensitive chip, ensuring that the first photosensitive chip and the second photosensitive chip output images with the same resolution, facilitating subsequent image synthesis to obtain a continuous image, that is, the image output by the second photosensitive chip is used to replace the image output by the corresponding photosensitive chip at the joint of the two first lenses, thereby avoiding distortion or error in the image data corresponding to the joint of the first lenses, and solving the problem of distortion or error in the data corresponding to the joint of the contact image sensor in the prior art.

[0054] 2) The electronic device of the present application includes an image sensor. By arranging a second lens on one side of the lens assembly and a second photosensitive chip on one side of the photosensitive chip assembly, the reflected light at the joint of the two first lenses is received by the second photosensitive chip through the second lens, and the first distance and the second distance are the same, and the third distance and the fourth distance are the same, so that the distance between the first lens and the corresponding first photosensitive chip is equal to the distance between the second lens and the corresponding second photosensitive chip, ensuring that the first photosensitive chip and the second photosensitive chip output images with the same resolution, facilitating subsequent image synthesis to obtain a continuous image, that is, the image output by the second photosensitive chip is used to replace the image output by the corresponding photosensitive chip at the joint of the two first lenses, thereby avoiding distortion or error in the image data corresponding to the joint of the first lenses, and solving the problem of distortion or error in the data corresponding to the joint of the contact image sensor in the prior art.

[0055] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An image sensor, characterized in that: include: A lens assembly, formed by splicing a plurality of first lenses along a first direction; At least one second lens is located at one side of the lens assembly, the projection area of ​​the second lens on the lens assembly is a first projection area, and the joint of at least two spliced ​​first lenses is located within the first projection area; A photosensitive chip assembly, comprising a plurality of first photosensitive chips, located on one side of the lens assembly, the plurality of first photosensitive chips are arranged along the first direction, and the plurality of first photosensitive chips are used to receive light emitted by the lens assembly; At least one second photosensitive chip is located on one side of the second lens, the number of the second photosensitive chips is the same as the number of the second lenses, and the second photosensitive chips are used to receive the light emitted by the second lens in a one-to-one correspondence; A circuit board assembly is formed by arranging a plurality of circuit boards in sequence, wherein the circuit board assembly is located on a side of the first photosensitive chip away from the lens assembly, the first photosensitive chip and the second photosensitive chip are both located on the circuit board, the distance between the first lens and the surface of the circuit board is a first distance, the distance between the second lens and the surface of the circuit board is a second distance, the first distance and the second distance are the same, the distance between the first photosensitive chip and the surface of the circuit board is a third distance, the distance between the second photosensitive chip and the surface of the circuit board is a fourth distance, the third distance and the fourth distance are the same, In the circuit board assembly, two adjacent circuit boards are respectively a first circuit board and a second circuit board, wherein the end face of the first end of the first circuit board is the first end face, the first end face is formed by sequentially connecting the first surface, the second surface and the third surface, the first surface is perpendicular to the second surface and parallel to the third surface, the end face of the second end of the second circuit board is the second end face, the second end face is formed by sequentially connecting the fourth surface, the fifth surface and the sixth surface, the fourth surface is perpendicular to the fifth surface and parallel to the sixth surface, the first end of the first circuit board is adapted to the second end of the second circuit board and has a gap, The joint of the two circuit boards is located between two adjacent first photosensitive chips with a first interval, and the length direction of the second photosensitive chip is parallel to the second surface. In the photosensitive chip assembly, at least two adjacent first photosensitive chips have a first interval between them, the projection of the first interval on the predetermined surface of the lens assembly is a second projection area, the joint of the two first lenses in the lens assembly is located within the second projection area, the predetermined surface is a surface perpendicular to a second direction, and the second direction is a thickness direction of the first lens, The length extension direction of the first lens is the same as the first direction, the length extension direction of the second lens is the same as the first direction, and the first lens and the second lens have a second interval in a third direction, and the first direction is perpendicular to the third direction. The length direction of the first photosensitive chip is parallel to the first direction, the length direction of the second photosensitive chip is parallel to the first direction, and the first photosensitive chip and the second photosensitive chip have a third interval in the third direction. The second interval is the same as the third interval and is equal to an integral multiple of the diameter of a photosensitive hole, and the photosensitive chip includes a plurality of the photosensitive holes.

2. The image sensor according to claim 1, characterized in that The image sensor further comprises: The frame has a containing cavity, and the circuit board, the first lens, the second lens, the first photosensitive chip and the second photosensitive chip are all located in the containing cavity.

3. The image sensor according to claim 2, characterized in that The image sensor further comprises: A light source is located in the accommodating cavity and on a side of the first photosensitive chip away from the circuit board. The reflected light after the light emitted by the light source irradiates the object to be measured enters the first lens and the second lens.

4. An electronic device comprising an image sensor, characterized in that: The image sensor is the image sensor according to any one of claims 1 to 3.

Images