Flexible circuit board testing equipment and testing method thereof

Abstract

The present invention provides a flexible circuit board test device and a test method thereof, and relates to the technical field of electrical performance test devices, wherein the flexible circuit board test device comprises a test machine and a control device; the test machine comprises a test bench, a main test mechanism, an auxiliary test mechanism and a visual system; the main test mechanism comprises an upper mold assembly, a lower mold assembly and an upper mold drive module; the lower mold assembly has an installation area; the upper mold drive module is connected to the upper mold assembly; the auxiliary test mechanism comprises a test soft board and an auxiliary drive module; the auxiliary drive module is connected to the test soft board; the visual system comprises a collection component, and the collection component is used to collect image information of the installation area, and send the image information to the control device, so that a group of test points of the test soft board overlaps with another group of test points of the flexible circuit board to be tested. The technical problem that the microneedles cannot be arranged due to the too dense test points when testing using microneedles in the prior art is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of electrical performance testing devices, and in particular to a flexible circuit board testing device and a testing method thereof. Background Art

[0002] Before FPC leaves the factory, it needs to be tested for power on using an electrical test fixture. The general technical method is to perform a continuity test by contacting the test points (such as gold fingers) of the flexible circuit board with a microneedle.

[0003] With the improvement of electronic circuit integration and users' demand for lightweight products, the lines of flexible circuit boards are becoming more and more dense, and the gold finger features used for connection are also becoming more and more dense. If microneedles are still used to contact test points for testing, the microneedles cannot be arranged because the test points are too dense. Summary of the invention

[0004] The purpose of the present invention is to provide a flexible circuit board testing device and a testing method thereof, so as to alleviate the technical problem in the prior art that the microneedles cannot be arranged because the test points are too dense when testing with microneedles.

[0005] In a first aspect, an embodiment of the present invention provides a flexible circuit board testing device, comprising: a testing machine and a control device, wherein the testing machine is electrically connected to the control device;

[0006] The testing machine includes a testing platform, a main testing mechanism, an auxiliary testing mechanism and a visual system all installed on the testing platform;

[0007] The main testing mechanism comprises an upper mold assembly, a lower mold assembly and an upper mold driving module; the upper mold assembly and the lower mold assembly are arranged up and down, and the lower mold assembly has a mounting area for mounting the flexible circuit board to be tested; the upper mold driving module is connected to the upper mold assembly and can drive the upper mold assembly to move toward or away from the mounting area;

[0008] The auxiliary testing mechanism comprises a testing soft board and an auxiliary driving module connected to the testing soft board; the auxiliary driving module is connected to the testing soft board and can drive the testing soft board to move to the installation area;

[0009] The visual system includes a collection component, which is used to collect image information of the installation area and send the image information to the control device. The control device receives the image information and controls the movement of the auxiliary drive module to make a group of test points of the test soft board coincide with another group of test points of the flexible circuit board to be tested; and the control device controls the upper mold assembly to move in a direction close to or away from the installation area to make the two groups of test points pressed together or separated.

[0010] Further, the upper die driving module includes a first Z-direction driving module, the upper die assembly includes an upper die plate, and the output end of the first Z-direction driving module is fixedly connected to the upper die plate;

[0011] The upper template is slidably connected with a pressing block, and the pressing block is used to press the overlapping area of ​​the two groups of test points. The moving direction of the pressing block is the Y direction.

[0012] Furthermore, the acquisition component adopts a CCD camera, the upper template is provided with an avoidance hole for the CCD camera to pass through, and the camera port of the CCD camera is arranged toward the overlapping area of ​​the two groups of test points;

[0013] The CCD camera and the pressing block are arranged along the Y direction.

[0014] Furthermore, the test bench has a containing space;

[0015] The auxiliary driving module adopts a three-dimensional driving module, the three-dimensional driving module is installed in the accommodating space, and the output end of the three-dimensional driving module protrudes from the accommodating space;

[0016] The output end of the three-dimensional driving module is provided with a needle template and a cover plate from bottom to top, and the test soft board is clamped between the needle template and the cover plate; the area of ​​the test soft board with the test point protrudes from the side of the needle template, and the cover plate is covered on both side edges of the upper surface of the test soft board.

[0017] Furthermore, the lower mold assembly includes a lower mold plate and a first Y-direction driving module for driving the lower mold plate to move;

[0018] The first Y-direction driving module drives the lower mold assembly to move, so as to enable the lower mold assembly to have a testing station in the Y direction;

[0019] At the test station, the auxiliary driving module can drive the test soft board to move so that a group of test points on the test soft board overlaps with another group of test points on the flexible circuit board to be tested.

[0020] Furthermore, the testing machine also includes a dotting mechanism;

[0021] The dotting mechanism comprises a dotting pen, a pen holder and a dotting drive module, wherein the pen holder is used to accommodate the pen head of the dotting pen, and the dotting drive module is used to drive the dotting pen to move;

[0022] The first Y-direction driving module drives the lower mold assembly to move, so that the lower mold assembly also has a dotting station in the Y direction;

[0023] At the dotting station, the dotting drive module can drive the dotting pen to separate from the pen holder and dot the flexible circuit board to be tested at the dotting station.

[0024] Furthermore, it also includes a loading machine, which is electrically connected to the control device;

[0025] The loading machine includes a loading platform, a carrier installed on the loading platform, a second Y-direction driving module, a first X-direction driving module, a second Z-direction driving module and a rotary driving module;

[0026] The output end of the second Y-direction driving module is connected to the carrier plate, and is used to drive the carrier plate to move along the Y direction;

[0027] The output end of the first X-direction driving module is transmission-connected to the second Z-direction driving module, and the output end of the second Z-direction driving module is transmission-connected to the rotary driving module, and the rotary driving module is used to grab the flexible circuit board to be tested;

[0028] The second Y-direction driving module, the first X-direction driving module, the second Z-direction driving module and the rotary driving module cooperate to transport the flexible circuit board to be tested to the testing machine.

[0029] Furthermore, the test machine is provided with a transfer positioning module;

[0030] The feeder is used to transport the flexible circuit board to be tested to the transfer positioning module, and the transfer positioning module is used to position the flexible circuit board to be tested;

[0031] The loading machine grabs the positioned flexible circuit board to be tested and delivers it to the lower mold plate of the lower mold assembly.

[0032] Furthermore, it also includes a plate-staggering machine, and the plate-staggering machine is electrically connected to the control device;

[0033] The plate swinging machine includes a swinging table, a discharging carrier, a third Y-direction driving module, a second X-direction driving module and a third Z-direction driving module;

[0034] The third Y-direction driving module is installed on the swing table, and the output end of the third Y-direction driving module is connected to the unloading carrier to drive the unloading carrier to move along the Y direction;

[0035] The output end of the second X-direction driving module is transmission-connected to the third Z-direction driving module, and the third Z-direction driving module is used to grab the flexible circuit board to be unloaded.

[0036] Beneficial effects:

[0037] The flexible circuit board testing equipment provided by the present invention comprises a main testing mechanism including an upper mold assembly, a lower mold assembly and an upper mold driving module. The flexible circuit board to be tested is used to be installed in the installation area of ​​the lower mold assembly. Since the test soft board of the auxiliary testing mechanism can move to the installation area, and the upper mold assembly can move in a direction close to or away from the installation area; during specific use, the acquisition component can collect image information of the installation area and send the image information to the control device. The control device receives the image information and can control the movement of the auxiliary driving module to make a group of test points of the test soft board coincide with another group of test points of the flexible circuit board to be tested. After the coincidence, the control device will control the upper mold assembly to move in a direction close to the installation area so that the two groups of test points are pressed together and turned on to prepare for the test; after the test is completed, the control device will control the upper mold assembly to move in a direction away from the installation area so that the upper mold assembly is separated from the installation area to prepare for removing the flexible circuit board.

[0038] From the foregoing, it can be seen that the flexible circuit board testing equipment can make a group of test points of the test soft board overlap with another group of test points of the flexible circuit board to be tested, and achieve conduction for testing. This method replaces the method of testing by microneedles contacting the test points in the prior art. Even if the test points are dense, there will be no problem of microneedles being unable to be arranged.

[0039] In a second aspect, an embodiment of the present invention provides a testing method for a flexible circuit board testing device using any one of the aforementioned embodiments, comprising the following steps:

[0040] Acquire image information of two groups of test points collected by the visual system;

[0041] Based on the image information, controlling the auxiliary driving module to move so that the two groups of test points overlap;

[0042] The upper mold assembly is controlled to move toward an overlapping area close to the two groups of test points, so that the two groups of test points are pressed and connected between the upper mold assembly and the lower mold assembly.

[0043] Beneficial effects:

[0044] The technical advantages and effects achieved by the testing method of the flexible circuit board testing device provided by the present invention are the same as the technical advantages and effects achieved by the flexible circuit board testing device, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0046] Figure 1 A schematic diagram of the structure of a flexible circuit board testing device provided by an embodiment of the present invention;

[0047] Figure 2 A schematic diagram of the structure of a feeder in a flexible circuit board testing device provided in an embodiment of the present invention;

[0048] Figure 3 A schematic diagram of the structure of a testing machine in a flexible circuit board testing device provided by an embodiment of the present invention;

[0049] Figure 4 A schematic diagram of the structure of a feeder in a flexible circuit board testing device provided in an embodiment of the present invention, wherein some components are not shown;

[0050] Figure 5 for Figure 4 A local enlarged schematic diagram of point A shown;

[0051] Figure 6 for Figure 4 A local enlarged schematic diagram of point B is shown;

[0052] Figure 7 A schematic structural diagram of a plate-stirring machine in a flexible circuit board testing device provided in an embodiment of the present invention.

[0053] icon:

[0054] 100-loading machine; 110-loading platform; 120-carrying plate; 130-first X-direction driving module; 140-second Z-direction driving module; 150-rotation driving module;

[0055] 200-testing machine; 210-testing table; 221-upper mold driving module; 222-upper mold plate; 223-pressing block; 224-lower mold plate; 231-test soft board; 232-needle mold plate; 233-cover plate; 241-collection piece; 251-dotting pen; 252-pen holder; 253-dotting driving module; 260-transfer positioning module;

[0056] 300 - plate placing machine; 310 - placing table; 320 - unloading carrier; 330 - second X-direction driving module; 340 - third Z-direction driving module. DETAILED DESCRIPTION

[0057] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0058] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0059] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0060] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0061] In addition, the terms "horizontal" and "vertical" do not mean that the components must be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", which does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0062] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0063] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0064] This embodiment provides a flexible circuit board testing device, such as Figure 1 As shown, the flexible circuit board testing equipment includes a loading machine 100, a testing machine 200, a plate-staggering machine 300 and a control device, and the loading machine 100, the testing machine 200 and the plate-staggering machine 300 are all electrically connected to the control device.

[0065] It should be noted that the loading machine 100, the testing machine 200 and the plate placing machine 300 can share a control device; or, the control devices of the three are separately set, such as separately setting a loading control box, a testing control box, a plate placing control box, etc. Of course, as long as the form can meet the control requirements, it is within the protection scope of the present invention.

[0066] like Figure 2 As shown, the loading machine 100 includes a loading platform 110, a carrier plate 120 installed on the loading platform 110, a second Y-axis driving module (not shown in the drawings), a first X-axis driving module 130, a second Z-axis driving module 140 and a rotary driving module 150; the output end of the second Y-axis driving module is connected to the carrier plate 120, and is used to drive the carrier plate 120 to move along the Y direction; the output end of the first X-axis driving module 130 is transmission-connected to the second Z-axis driving module 140, and the output end of the second Z-axis driving module 140 is transmission-connected to the rotary driving module 150, and the rotary driving module 150 is used to grab the flexible circuit board to be tested; the second Y-axis driving module, the first X-axis driving module 130, the second Z-axis driving module 140 and the rotary driving module 150 are used to transport the flexible circuit board to be tested to the testing machine 200.

[0067] Specifically, the loading platform 110 has a storage space, and the second Y-axis driving module includes an electric cylinder, which is installed in the storage space. The electric cylinder is not shown in the drawings. The use of the electric cylinder to drive the carrier 120 to move along the Y direction is a conventional technology in the art and will not be described in detail here.

[0068] Optionally, the first X-axis driving module 130 and the second Z-axis driving module 140 can both be driven by electric cylinders. Specifically, the first X-axis driving module 130 is horizontally arranged, and the second Z-axis driving module 140 is vertically arranged. The rotary driving module 150 can be in the form of a motor plus a suction cup, and the suction cup can be driven to rotate by the motor, and the suction cup can absorb or grab the flexible circuit board to be tested on the carrier 120.

[0069] By disposing the second Y-axis driving module (not shown in the drawings), the first X-axis driving module 130, the second Z-axis driving module 140 and the rotary driving module 150, the structure layout of the loading machine 100 is relatively compact and occupies less space.

[0070] In this embodiment, a loading control box is provided on the loading platform 110, and the loading control box can control the coordination and division of labor among the various components of the loading machine 100.

[0071] Reference Figure 1 and Figure 2 Since the first X-direction driving module 130 is horizontally arranged, the right side portion of the first X-direction driving module 130 extends into the working area of ​​the testing machine 200 to ensure that the flexible circuit board to be tested can be delivered to the working area of ​​the testing machine 200 by relying on the driving module of the loader 100.

[0072] The specific structure of the loading machine 100 has been introduced above, and the specific structure of the testing machine 200 will be introduced next.

[0073] like Figures 3 to 5 As shown, the test machine 200 includes a test bench 210, a main test mechanism, an auxiliary test mechanism, and a visual system all installed on the test bench 210. In this embodiment, a test control box is provided on the test bench 210, and the coordination and division of labor between the various components of the test machine 200 can be controlled by the test control box.

[0074] Specifically, the main testing mechanism includes an upper mold assembly, a lower mold assembly and an upper mold driving module 221; the upper mold assembly and the lower mold assembly are arranged up and down, and the lower mold assembly has an installation area for installing the flexible circuit board to be tested; the upper mold driving module 221 is connected to the upper mold assembly, and can drive the upper mold assembly to move in a direction close to or away from the installation area; the auxiliary testing mechanism includes a test soft board 231 and an auxiliary driving module connected to the test soft board 231; the auxiliary driving module is connected to the test soft board 231, and can drive the test soft board 231 to move to the installation area; the visual system includes a collection component 241, the collection component 241 is used to collect image information of the installation area and send the image information to the control device, the control device receives the image information and controls the movement of the auxiliary driving module to make a group of test points of the test soft board 231 coincide with another group of test points of the flexible circuit board to be tested; and the control device controls the upper mold assembly to move in a direction close to or away from the installation area, so that the two groups of test points are pressed together or separated.

[0075] The flexible circuit board testing equipment provided in this embodiment comprises a main testing mechanism including an upper mold assembly, a lower mold assembly and an upper mold driving module 221. The flexible circuit board to be tested is used to be installed in the installation area of ​​the lower mold assembly. Since the test soft board 231 of the auxiliary testing mechanism can move to the installation area, and the upper mold assembly can move in a direction close to or away from the installation area; during specific use, the acquisition component 241 can acquire image information of the installation area and send the image information to the control device. The control device receives the image information and can control the movement of the auxiliary driving module to make a group of test points of the test soft board 231 coincide with another group of test points of the flexible circuit board to be tested. After the coincidence, the control device will control the upper mold assembly to move in a direction close to the installation area so that the two groups of test points are pressed together and turned on to prepare for the test; after the test is completed, the control device will control the upper mold assembly to move in a direction away from the installation area so that the upper mold assembly is separated from the installation area to prepare for removing the flexible circuit board.

[0076] From the foregoing, it can be seen that the flexible circuit board testing equipment can make a group of test points of the test soft board 231 overlap with another group of test points of the flexible circuit board to be tested, and achieve conduction for testing. This method replaces the method of testing by microneedles contacting the test points in the prior art. Even if the test points are dense, there will be no problem of microneedles being unable to be arranged.

[0077] Specifically, the upper mold driving module 221 includes a first Z-direction driving module, the upper mold assembly includes an upper mold plate 222, and the output end of the first Z-direction driving module is fixedly connected to the upper mold plate 222; the upper mold plate 222 is slidably connected with a pressure block 223, and the pressure block 223 is used to press the overlapping area of ​​the two groups of test points, and the moving direction of the pressure block 223 is the Y direction.

[0078] Optionally, a slide rail is provided on the upper template 222, and the pressing block 223 is slidably connected to the slide rail. The pressing block 223 is connected to a cylinder or an electric cylinder, and the action of the cylinder or the electric cylinder can drive the pressing block 223 to slide along the slide rail. The layout direction of the slide rail is the Y direction. In this way, the pressing block 223 can avoid the collecting member 241 when it is not pressed, so as to prevent the pressing block 223 from interfering with the collecting member 241.

[0079] In order to enable the acquisition component 241 to better collect image information, further, the acquisition component 241 adopts a CCD camera, and the upper template 222 is provided with an avoidance hole for the CCD camera to pass through, and the camera port of the CCD camera is set toward the overlapping area of ​​the two groups of test points; the CCD camera and the pressing block 223 are set along the Y direction.

[0080] During specific operation, the CCD camera is fixedly mounted on the test bench 210, and its relative position to the test bench 210 remains unchanged; before the upper template 222 is pressed down, the position of the pressing block 223 can be appropriately adjusted so that the pressing block 223 presses the overlapping area of ​​the two groups of test points.

[0081] In this embodiment, Figure 4 and Figure 5 As shown, the test bench 210 has an accommodating space; the auxiliary driving module adopts a three-dimensional driving module (not shown in the drawings), the three-dimensional driving module is installed in the accommodating space, and the output end of the three-dimensional driving module protrudes from the accommodating space; the output end of the three-dimensional driving module is provided with a needle template 232 and a cover plate 233 from bottom to top, and the test soft board 231 is clamped between the needle template 232 and the cover plate 233; the area of ​​the test soft board 231 with the test point protrudes from the side of the needle template 232, and the cover plate 233 is covered on the two side edges of the upper surface of the test soft board 231.

[0082] Optionally, the three-dimensional module adopts a three-dimensional module that can realize movement in the X direction, the Y direction and the Z direction. This technology is a conventional technology in this field and will not be described in detail here.

[0083] like Figure 3 and Figure 6 As shown, the lower mold assembly includes a lower mold plate 224 and a first Y-direction driving module (not shown in the drawings) that drives the lower mold plate 224 to move; the first Y-direction driving module drives the lower mold assembly to move, so that the lower mold assembly has a test station in the Y direction; at the test station, the auxiliary driving module can drive the test soft board 231 to move, so that a group of test points on the test soft board 231 coincide with another group of test points on the flexible circuit board to be tested. Optionally, the test bench 210 has a receiving space, and the first Y-direction driving module includes an electric cylinder, which is installed in the receiving space.

[0084] like Figure 3 and Figure 6 As shown, the test machine 200 also includes a dotting mechanism; the dotting mechanism includes a dotting pen 251, a pen holder 252 and a dotting drive module 253, the pen holder 252 is used to accommodate the pen head of the dotting pen 251, and the dotting drive module 253 is used to drive the dotting pen 251 to move; the first Y-direction drive module drives the lower mold assembly to move, so that the lower mold assembly also has a dotting station in the Y direction; at the dotting station, the dotting drive module can drive the dotting pen 251 to separate from the pen holder and dot the flexible circuit board to be tested at the dotting station. Among them, Figure 3 As shown, the lower die assembly is in the dotting station.

[0085] like Figure 6 As shown, the opening of the pen holder 252 faces upward. After the dotting pen 251 is used, the dotting pen 251 is driven to move by the dotting drive module 253, and the pen tip of the dotting pen 251 can be inserted into the pen holder 252 to prevent water loss from the pen tip affecting the marking.

[0086] The dotting drive module 253 can realize movement in two directions, the X direction and the Z direction, such as by using an electric cylinder or a pneumatic cylinder.

[0087] During specific work, for flexible circuit boards that have passed the test, the plate-turning machine 300 can be used to realize plate-turning unloading; for flexible circuit boards that have failed the test, the first Y-axis driving module needs to drive the lower template 224 to move, so that the lower template 224 moves to the dotting station, and the dotting pen 251, driven by the dotting driving module 253, marks the unqualified products. After the dotting operation is completed, the first Y-axis driving module drives the lower template 224 to move in the opposite direction to the test station, and the plate-turning machine 300 is used to realize plate-turning unloading.

[0088] like Figure 3 As shown, the testing machine 200 is provided with a transfer positioning module 260; the loader 100 is used to convey the flexible circuit board to be tested to the transfer positioning module 260, and the transfer positioning module 260 is used to position the flexible circuit board to be tested; the loader grabs the positioned flexible circuit board to be tested and delivers it to the lower template 224 of the lower mold assembly.

[0089] Specifically, with the cooperation of the first X-axis drive module 130, the second Z-axis drive module 140 and the rotary drive module 150, the flexible circuit board to be tested can be sent to the transfer positioning module 260. After the transfer positioning module 260 positions the flexible circuit board to be tested, the first X-axis drive module 130, the second Z-axis drive module 140 and the rotary drive module 150 can be used to cooperate with each other to send the flexible circuit board to be tested to the lower template 224 at the test station.

[0090] The specific structure of the testing machine 200 has been introduced above, and the specific structure of the plate placing machine 300 will be introduced next.

[0091] like Figure 1 and Figure 7 As shown; the plate-staging machine 300 includes a swing table 310, a discharge carrier 320, a third Y-axis drive module, a second X-axis drive module and a third Z-axis drive module; the third Y-axis drive module is installed on the swing table 310, and the output end of the third Y-axis drive module is connected to the discharge carrier 320, for driving the discharge carrier to move along the Y direction; the second X-axis drive module is installed on the loading table 110, and the output end of the second X-axis drive module is transmission-connected to the third Z-axis drive module, and the third Z-axis drive module is used to grab the flexible circuit board to be unloaded.

[0092] In this embodiment, the third Y-axis driving module is disposed in the accommodation space of the swing table 310; Figure 3 As shown, the second X-axis driving module is fixedly installed on the test bench 210 , and the output end of the third Z-axis driving module can extend above the lower template 224 to grab the flexible circuit board after the test and put it into the unloading carrier 320 .

[0093] Exemplarily, the third Y-direction driving module, the second X-direction driving module and the third Z-direction driving module may all adopt electric cylinders or pneumatic cylinders, which will not be described in detail here.

[0094] This embodiment also provides a testing method using the above-mentioned flexible circuit board testing device, comprising the following steps:

[0095] Obtain image information of two groups of test points collected by the visual system;

[0096] Based on the image information, the auxiliary drive module is controlled to move so that the two groups of test points coincide with each other;

[0097] The upper die assembly is controlled to move toward the direction close to the overlapping area of ​​the two groups of test points, so that the two groups of test points are pressed and connected between the upper die assembly and the lower die assembly.

[0098] The specific testing process is:

[0099] The flexible circuit board to be tested is placed on the carrier 120, and the first X-axis driving module 130, the second Z-axis driving module 140 and the rotary driving module 150 cooperate to send the flexible circuit board to be tested to the transfer positioning module 260, accurately position the flexible circuit board to be tested, and then send the flexible circuit board to be tested to the lower template 224 located at the test station;

[0100] The auxiliary driving module (three-dimensional module) drives the test soft board 231 to move above the test point (thin finger) of the flexible circuit board to be tested. Since the thickness of the flexible circuit board to be tested is small and the material has a certain light transmittance, a light source is set below the flexible circuit board to be tested. The test point of the metal material will form a projection and be captured by the CCD camera. The CCD camera will upload the image to the host computer. The host computer will compare and calculate the relative positions of the two groups of test points (thin fingers), and then send the calculation results to the PLC. The PLC controls the movement of the auxiliary driving module to completely overlap the two groups of test points (thin fingers); then, the pressing block 223 set on the upper template 222 moves to the top of the two groups of test points under the drive of the cylinder and the guidance of the slide rail. The upper template 222 is pressed down, and the pressing block 223 presses the two groups of test points of the two flexible circuit boards to make them contact and conduct, that is, the test soft board 231 is connected to the flexible circuit board to be tested, and the test is carried out;

[0101] When unqualified products appear, the lower template 224 moves along the Y direction to the dotting station, the dotting pen 251 moves under the drive of the dotting drive module 253, and marks the unqualified products with dots, and then the lower template 224 reacts and returns to the testing station along the Y direction; with the cooperation of the second X-direction drive module 330 and the third Z-direction drive module 340, the tested products are moved to the plate placing machine 300, and the product array is placed on the discharge tray in cooperation with the unloading carrier 320 of the plate placing machine 300 moving in the Y direction.

[0102] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A flexible circuit board testing device, characterized in that: include: A testing machine (200) and a control device, the testing machine (200) being electrically connected to the control device; The testing machine (200) comprises a testing table (210), a main testing mechanism, an auxiliary testing mechanism and a visual system, all of which are installed on the testing table (210); The main testing mechanism comprises an upper mold assembly, a lower mold assembly and an upper mold driving module (221); the upper mold assembly and the lower mold assembly are arranged one above the other, and the lower mold assembly has a mounting area for mounting a flexible circuit board to be tested; the upper mold driving module (221) is connected to the upper mold assembly and is capable of driving the upper mold assembly to move in a direction close to or away from the mounting area; The auxiliary testing mechanism comprises a testing soft board (231) and an auxiliary driving module connected to the testing soft board (231); the auxiliary driving module is connected to the testing soft board (231) and is capable of driving the testing soft board (231) to move to the installation area; The visual system comprises a collection component (241), the collection component (241) is used to collect image information of the installation area and send the image information to the control device, the control device receives the image information and controls the auxiliary drive module to move so that a group of test points of the test soft board (231) coincide with another group of test points of the flexible circuit board to be tested; and the control device controls the upper mold assembly to move in a direction close to or away from the installation area so that the two groups of test points are pressed together, connected or separated; The upper die drive module (221) comprises a first Z-direction drive module, the upper die assembly comprises an upper die plate (222), the output end of the first Z-direction drive module is fixedly connected to the upper die plate (222); the upper die plate (222) is slidably connected to a pressing block (223), the pressing block (223) is used to press the overlapping area of ​​the two groups of test points, and the moving direction of the pressing block (223) is the Y direction; The test bench (210) has an accommodating space; the auxiliary drive module adopts a three-dimensional drive module, the three-dimensional drive module is installed in the accommodating space, and the output end of the three-dimensional drive module protrudes from the accommodating space; the output end of the three-dimensional drive module is provided with a needle template (232) and a cover plate (233) from bottom to top, and the test soft board (231) is clamped between the needle template (232) and the cover plate (233); the area of ​​the test soft board (231) provided with the test point protrudes from the side of the needle template (232), and the cover plate (233) is covered on both side edges of the upper surface of the test soft board (231).

2. The flexible circuit board testing device according to claim 1, characterized in that: The acquisition component (241) adopts a CCD camera, the upper template (222) is provided with an avoidance hole for the CCD camera to pass through, and the camera port of the CCD camera is arranged toward the overlapping area of ​​the two groups of test points; The CCD camera and the pressing block (223) are arranged along the Y direction.

3. The flexible circuit board testing device according to claim 1, characterized in that: The lower mold assembly comprises a lower mold plate (224) and a first Y-direction driving module for driving the lower mold plate (224) to move; The first Y-direction driving module drives the lower mold assembly to move, so as to enable the lower mold assembly to have a testing station in the Y direction; At the test station, the auxiliary drive module can drive the test soft board (231) to move, so that a group of test points on the test soft board (231) overlap with another group of test points on the flexible circuit board to be tested.

4. The flexible circuit board testing device according to claim 3, characterized in that: The testing machine (200) further comprises a dot-marking mechanism; The dotting mechanism comprises a dotting pen (251), a pen holder (252) and a dotting drive module (253); the pen holder (252) is used to accommodate the pen head of the dotting pen (251); and the dotting drive module (253) is used to drive the dotting pen (251) to move; The first Y-direction driving module drives the lower mold assembly to move, so that the lower mold assembly also has a dotting station in the Y direction; At the dotting station, the dotting drive module (253) can drive the dotting pen (251) to separate from the pen holder (252) and perform dotting on the flexible circuit board to be tested at the dotting station.

5. The flexible circuit board testing device according to claim 1, characterized in that: It also includes a loading machine (100), the loading machine (100) being electrically connected to the control device; The loading machine (100) comprises a loading platform (110), a carrier plate (120) mounted on the loading platform (110), a second Y-direction driving module, a first X-direction driving module (130), a second Z-direction driving module (140) and a rotary driving module (150); The output end of the second Y-direction driving module is connected to the carrier (120) and is used to drive the carrier (120) to move along the Y direction; The output end of the first X-direction driving module (130) is transmission-connected to the second Z-direction driving module (140), and the output end of the second Z-direction driving module (140) is transmission-connected to the rotary driving module (150), and the rotary driving module (150) is used to grab the flexible circuit board to be tested; The second Y-direction drive module, the first X-direction drive module (130), the second Z-direction drive module (140) and the rotary drive module (150) are used in cooperation to transport the flexible circuit board to be tested to the testing machine (200).

6. The flexible circuit board testing device according to claim 5, characterized in that: The testing machine (200) is provided with a transfer positioning module (260); The loading machine (100) is used to transport the flexible circuit board to be tested to the transfer positioning module (260), and the transfer positioning module (260) is used to position the flexible circuit board to be tested; The loading machine (100) grabs the positioned flexible circuit board to be tested and delivers it to the lower mold plate (224) of the lower mold assembly.

7. The flexible circuit board testing device according to any one of claims 1 to 6, characterized in that: It also includes a plate-staggering machine (300), the plate-staggering machine (300) being electrically connected to the control device; The plate-staggering machine (300) comprises a staggering table (310), a material unloading carrier (320), a third Y-direction driving module, a second X-direction driving module (330), and a third Z-direction driving module (340); The third Y-direction driving module is installed on the swing table (310), and the output end of the third Y-direction driving module is connected to the unloading carrier (320) for driving the unloading carrier (320) to move along the Y direction; The output end of the second X-direction driving module (330) is transmission-connected to the third Z-direction driving module (340), and the third Z-direction driving module (340) is used to grab the flexible circuit board to be removed.

8. A testing method using the flexible circuit board testing device according to any one of claims 1 to 7, characterized in that: The following steps are involved: Acquire image information of two groups of test points collected by the visual system; Based on the image information, controlling the auxiliary driving module to move so that the two groups of test points overlap; The upper mold assembly is controlled to move toward an overlapping area close to the two groups of test points, so that the two groups of test points are pressed and connected between the upper mold assembly and the lower mold assembly.

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