A data center immersion heat dissipation device

Abstract

The present invention relates to an immersion heat dissipation device for a data center, comprising a liquid cooling cabinet, a cooling liquid, and a plurality of oscillating heat pipes. The cooling liquid is filled in the liquid cooling cabinet, the evaporation zones of the plurality of oscillating heat pipes extend into the liquid cooling cabinet, the condensation zone of the oscillating heat pipes is located outside the liquid cooling cabinet, the tube bundle of the oscillating heat pipes is filled with a medium, the medium is an organic solvent, the connection area between the oscillating heat pipe and the side wall of the liquid cooling cabinet is an insulating zone, and the insulating zone is located between the condensation zone and the evaporation zone. The heat entering the cooling liquid through the oscillating heat pipe is transferred to the outside of the liquid cooling cabinet. The heating element transfers the heat to the cooling liquid, the evaporation zone of the heat pipe bundle is immersed in the cooling liquid, and absorbs the heat of the cooling liquid. The heat pipe bundle is filled with an organic solvent with a certain pressure as a medium. The medium evaporates after being heated, and a plunger-type fluid between gas and liquid phases is formed in the heat pipe bundle, and the plunger-type fluid quickly transfers the heat to the condensation zone of the heat pipe bundle. The heat transfer coefficient is high, the energy consumption is low, and it is energy-saving and environmentally friendly.

Description

Technical Field

[0001] The invention belongs to the technical field of liquid cooling, and in particular relates to an immersion heat dissipation device for a data center. Background Art

[0002] The information disclosed in this background technology section is only intended to enhance the understanding of the overall background of the invention, and should not necessarily be regarded as an admission or any form of suggestion that the information constitutes the prior art already known to a person skilled in the art.

[0003] With the continuous development of the Internet and computer technology, the construction of data centers in the era of big data is also developing rapidly. The rapid development of big data has brought both opportunities and new challenges to the development of computers. As the global demand for data processing continues to heat up, high energy consumption indicators have also brought new challenges to the rapid development of data centers. According to a research report by Global Market Insights (GMI), data centers currently account for about 3% of the world's total electricity consumption, and this figure is expected to rise to 8% by 2030. Since the energy consumption of cooling systems accounts for about 40% of the total energy consumption of data centers, the demand for intelligent energy-saving solutions is expected to drive the continuous growth of the data center cooling market.

[0004] Christian Belady proposed the concept of data center power utilization efficiency (PUE) in 2006. The PUE value of a data center is equal to the ratio of the total energy consumption of the data center to the energy consumption of IT equipment. The smaller the ratio, the higher the energy utilization rate of the data center, and the more the data center meets the standards of low carbon and energy saving. At present, some small-scale domestic data centers may have a value of up to 3. Compared with international IT companies, Yahoo Data Center (PUE = 1.08), Facebook Data Center (PUE = 1.15), Google Belgium Data Center (PUE = 1.16), HP UK Wynyard Data Center (PUE = 1.16), Microsoft Dublin Data Center (PUE = 1.25), Microsoft Ireland Dublin Data Center, adopts an innovatively designed "free cooling" system and hot channel control, making its PUE value much lower than 1.6 of Microsoft's other data centers. However, domestic IT companies with leading technology levels, such as Alibaba, have an average PUE value of less than 1.3 for all self-developed data centers. In 2018, the measured annual PUE value of Tencent Shenzhen Guangming Data Center was 1.26, which is still a certain distance from international advanced companies.

[0005] The traditional data center cooling system uses precision air conditioning (i.e. air cooling technology) to cool the room where the cabinets are located. Since the data center generates a lot of heat and requires constant temperature and humidity to operate continuously forever, the air conditioning system suitable for its use requires high reliability (generally designed with redundant backup machines), large cooling capacity, small temperature difference and large air volume. The air conditioning system of the data center has its own significant particularity. First, it runs uninterruptedly throughout the year, and the working conditions vary greatly; second, the temperature and humidity control accuracy is high, and dehumidification, humidification, heating, small temperature difference and large air volume consume more additional energy than general civilian air conditioning systems, which is mainly reflected in the high power consumption of the wind system, and will cause local high temperature areas in some cabinets of the data center. IT equipment in the high temperature area cannot work properly or even stop working, and the high temperature environment will shorten the service life of the equipment, causing immeasurable economic losses. However, due to the low cost and simpler installation and deployment of air cooling technology, it is still the mainstream heat dissipation technology in the current data center field.

[0006] In recent years, with the rapid increase in heat flux density in data centers, liquid cooling technology has gradually become one of the key technologies to solve the future heat dissipation problems of data centers with its outstanding cooling effect and low energy consumption. Among them, coolants such as fluorinated liquids can directly contact IT equipment. This immersion cooling technology has good heat dissipation effect and obvious energy-saving advantages. This technology helps to further improve the data density and computing power of the server, but the existing cooling technology still has related problems such as uneven temperature distribution and high energy consumption. The immersion liquid cooling server cooling system disclosed in the prior art includes a server chassis, a case cover, a heat dissipation assembly, a radiator, an oil collection tank and an oil pump. The system has high heat transfer efficiency, achieves energy-saving and environmental protection effects, can effectively target local flow cooling of heat-generating components such as chips, and is easy to even out the temperature, which is conducive to more effective heat dissipation of heat-generating chips. Its disadvantages are that the oil pump makes a lot of noise during operation and increases energy consumption. Its vibration is also a hidden danger to the safe and stable operation of the system. The choice of radiator and refrigerant also increases the cost.

[0007] Both direct cooling and immersion cooling systems have the disadvantages of high cost, high vibration or noise, and layout limited by the space in the computer room. Summary of the invention

[0008] In view of the above problems existing in the prior art, an object of the present invention is to provide an immersion cooling system for a data center.

[0009] In order to solve the above technical problems, the technical solution of the present invention is:

[0010] In a first aspect, an immersion heat dissipation device for a data center includes a liquid cooling cabinet, a coolant, and a plurality of oscillating heat pipes, wherein the coolant is filled in the liquid cooling cabinet, evaporation zones of the plurality of oscillating heat pipes extend into the liquid cooling cabinet, condensation zones of the oscillating heat pipes are located outside the liquid cooling cabinet, a medium is filled in a tube bundle of the oscillating heat pipe, the medium is an organic solvent, and a connection area between the oscillating heat pipe and a side wall of the liquid cooling cabinet is an insulating zone, and the insulating zone is located between the condensation zone and the evaporation zone.

[0011] The present invention utilizes an oscillating heat pipe to dissipate heat from a liquid cooling cabinet. The heat dissipation characteristics of the oscillating heat pipe are fully utilized to achieve a better heat dissipation effect of the liquid cooling cabinet without the need for external power. The vibration and noise are small. The installation form of the oscillating heat pipe is relatively flexible and is not limited by the space of the machine room.

[0012] When the tube is evacuated, a certain amount of organic solvent is poured in as the medium, and the liquid does not fill the entire internal cavity of the oscillating heat pipe bundle. Under the action of the temperature difference between the hot and cold ends and the surface tension, the medium forms a plunger-type fluid between gas and liquid phases and appears randomly in the pipeline.

[0013] The heat generated in the liquid cooling cabinet is transferred to the oscillating heat pipe through the coolant. In the evaporation zone of the oscillating heat pipe, the organic solvent is heated and evaporated, and then a plunger-type fluid of gas-liquid phase is formed in the tube bundle of the oscillating heat pipe. The liquid film between the gas-liquid column and the tube wall evaporates continuously due to the heat, causing the bubbles to expand and push the gas-liquid plunger to flow to the condensation zone for condensation and contraction, thereby forming a large pressure difference between the cold and hot ends. Due to the staggered distribution of the gas-liquid plungers, a strong reciprocating oscillation motion is generated in the tube, thereby achieving efficient heat transfer. The condensation zone of the oscillating heat pipe dissipates the heat, and the heat in the condensation zone can be taken away by the cooling effect of natural wind. The entire heat transfer process does not require the consumption of external mechanical and electrical work, and does not require energy-consuming equipment such as fans and pumps.

[0014] In a second aspect, the above-mentioned data center immersion heat dissipation device is used in data center immersion heat dissipation.

[0015] Beneficial effects of the present invention:

[0016] (1) The coolant is in direct contact with the heat generating equipment, has a low convection thermal resistance, a high heat transfer coefficient, uniform heat dissipation, and can quickly take away heat, with good heat dissipation effect;

[0017] (2) The oscillating heat pipe has a small thermal resistance, excellent heat transfer performance, simple structure, flexible layout, no direction influence, can be bent arbitrarily, and is not affected by the space of the machine room. In addition, the medium in the heat pipe is an organic solvent, and the working start-up temperature is low, which can ensure that the coolant maintains a low temperature.

[0018] (3) The heat transfer process of the entire system does not require external mechanical and electrical work, and is a self-excited oscillation heat transfer under thermal drive. It can effectively reduce system energy consumption and save energy and protect the environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings in the specification, which constitute a part of the present invention, are used to provide a further understanding of the present application. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0020] Figure 1 It is a structural diagram of the data center immersion heat dissipation device of the present invention;

[0021] Figure 2 is a front view of an oscillating heat pipe of the present invention;

[0022] Figure 3 is a side view of an oscillating heat pipe of the present invention;

[0023] Figure 4 is a side view of an oscillating heat pipe of the present invention;

[0024] Among them, 1. computer room, 2. first liquid cooling cabinet, 3. second liquid cooling cabinet, 4. third liquid cooling cabinet, 5. server, 6. oscillating heat pipe, 7. condensation area, 8. insulation area, 9. evaporation area. DETAILED DESCRIPTION

[0025] It should be noted that the following detailed descriptions are all illustrative and intended to provide further explanation of the present invention. Unless otherwise specified, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art to which the present invention belongs.

[0026] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0027] In a first aspect, an immersion heat dissipation device for a data center includes a liquid cooling cabinet, a coolant, and a plurality of oscillating heat pipes, wherein the coolant is filled in the liquid cooling cabinet, evaporation zones of the plurality of oscillating heat pipes extend into the liquid cooling cabinet, condensation zones of the oscillating heat pipes are located outside the liquid cooling cabinet, a medium is filled in a tube bundle of the oscillating heat pipe, the medium is an organic solvent, and a connection area between the oscillating heat pipe and a side wall of the liquid cooling cabinet is an insulating zone, and the insulating zone is located between the condensation zone and the evaporation zone.

[0028] The heat in the coolant is transferred to the outside of the liquid cooling cabinet by using an oscillating heat pipe. The inside of the liquid cooling cabinet is a heat generating component because of the servers and other equipment. The heat generating components transfer the heat to the coolant. The evaporation area of ​​the heat pipe bundle is immersed in the coolant and absorbs the heat of the coolant. The heat pipe bundle is filled with an organic solvent with a certain pressure as a medium. The medium evaporates after being heated, forming a gas-liquid phase plunger-type fluid in the heat pipe bundle. The plunger-type fluid quickly transfers the heat to the condensation area of ​​the heat pipe bundle.

[0029] In some embodiments of the present invention, the oscillating heat pipe is a serpentine closed loop structure. The oscillating heat pipe involved in the present invention is a serpentine loop pipe, in which the medium is pre-injected, and the medium can flow freely from one end to the other end.

[0030] The evaporation area in the tube bundle of the oscillating heat pipe is heated, and the liquid in the tube bundle undergoes bubbling boiling. The whole process occurs very quickly, and the tube is in a vacuum state, so no noise is generated.

[0031] In some embodiments of the present invention, the organic solvent is ethanol. Different organic solvents have different physical properties. Methanol, ethanol, acetone and other organic solvents have large specific heat capacity and latent heat of vaporization. As working fluids, they can make the heat transfer effect of the oscillating heat pipe good. At the same time, the dynamic viscosity is small, and the effect of forming a plunger during flow is good. The boiling point of ethanol is higher than that of the other two organic solvents, which avoids the phenomenon of drying out.

[0032] In some embodiments of the present invention, the diameter of the oscillating heat pipe is 1-3 mm. When the diameter is within the above range, the coexistence of liquid plug and gas bubble can be achieved. The size of the diameter affects the formation of gas-liquid plug flow, so the present application selects a suitable diameter range, which helps to achieve the formation of gas-liquid plug flow without causing excessive flow resistance and affecting the oscillation effect.

[0033] In some embodiments of the present invention, the tube bundle of the oscillating heat pipe is a branch tube bundle or a curved tube bundle. The oscillating heat pipe has the advantage of being variable in shape.

[0034] In some embodiments of the present invention, there is no specific limit on the number of channel elbows of the oscillating heat pipe, but it should not be less than 15. The oscillating heat pipe is a serpentine loop structure. Too few elbows will affect the start-up of the heat pipe. As the number of elbows increases, the heat exchange area can be increased, the heat pipe is easier to start, the heat transfer performance is better, and the operation is more stable. The specific arrangement can be made according to the actual situation.

[0035] In some embodiments of the present invention, the length (or area) ratio of the evaporation zone to the condensation zone of the oscillating heat pipe is 1:1.5-2.5, preferably 1:2.

[0036] In some embodiments of the present invention, the filling rate of the oscillating heat pipe is 35-50%. The filling rate is the percentage of the total volume of the working medium to the total volume inside the oscillating heat pipe. A suitable filling rate can improve the heat exchange performance and reduce the heat transfer resistance. In the present invention, the above filling rate range helps to improve the heat exchange performance.

[0037] In a second aspect, the above-mentioned data center immersion heat dissipation device is used in data center immersion heat dissipation.

[0038] The present invention is further described below in conjunction with embodiments

[0039] Example 1

[0040] Three liquid cooling cabinets are arranged in a machine room 1, and a number of servers 5 are arranged in the liquid cooling cabinets. The servers 5 are arranged in layers. The three liquid cooling cabinets are the first liquid cooling cabinet 2, the second liquid cooling cabinet 3, and the third liquid cooling cabinet 4. The oscillating heat pipes arranged in the first liquid cooling cabinet 2 are arranged in an L shape. The evaporation area 9 is located in the liquid cooling cabinet, the condensation area 7 is located outside the machine room, and the insulation area 8 is located in the connection area with the machine room and the liquid cooling cabinet. The side view of the oscillating heat pipe 6 of the first liquid cooling cabinet 1 is shown in FIG. Figure 3 As shown, the oscillating heat pipe is arranged in an L shape. The evaporation area 9 of the oscillating heat pipe 6 absorbs the heat of the liquid cooling cabinet, and then dissipates the heat into the air in the condensation area 7. In the condensation area 7, the air flows and exchanges heat with the oscillating heat pipe 6.

[0041] The oscillating heat pipe 6 provided in the second liquid cooling cabinet 3 extends into the liquid cooling cabinet from the top of the liquid cooling cabinet. Figure 2 The bundle of the oscillating heat pipe 6 is a straight pipe. The condensation zone 7 and the insulation zone 8 of the oscillating heat pipe 6 arranged in the third liquid cooling cabinet 4 are arranged in an L-shape, and the oscillating heat pipe 9 in the evaporation zone is in the form of a curved pipe. Figure 4 As shown. The arrangement of the oscillating heat pipes 6 of the third liquid cooling cabinet 4 is different from that of the oscillating heat pipes of the first liquid cooling cabinet 2. The insulation area of ​​the third liquid cooling cabinet 4 is concentrated in the middle of the third liquid cooling cabinet 4, and then the oscillating heat pipes 6 of the evaporation area 9 are radially arranged inside the liquid cooling cabinet.

[0042] The height of the first liquid cooling cabinet 2, the second liquid cooling cabinet 3, and the third liquid cooling cabinet 4 is 2m, and the diameter of the oscillating heat pipe 6 is 2mm. The organic solvent medium in the tube bundle is ethanol, and the liquid filling rate is 40%. There is no specific limit on the number of channel elbows of the oscillating heat pipe, but it should not be less than 15.

[0043] The heat flux density of this embodiment is 1000W / cm 2 .

[0044] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A data center immersion heat dissipation device, characterized in that: It includes a liquid cooling cabinet, a coolant, and a plurality of oscillating heat pipes. The coolant is filled in the liquid cooling cabinet. The evaporation zones of the plurality of oscillating heat pipes extend into the liquid cooling cabinet. The condensation zones of the oscillating heat pipes are located outside the liquid cooling cabinet. A medium is filled in the tube bundle of the oscillating heat pipes. The medium is an organic solvent. The medium evaporates after being heated to form a plunger-type fluid of gas-liquid phase in the heat pipe bundle. The plunger-type fluid quickly transfers heat to the condensation zone of the heat pipe bundle. The connection area between the oscillating heat pipe and the side wall of the liquid cooling cabinet is an insulation zone. The insulation zone is located between the condensation zone and the evaporation zone. The oscillating heat pipe is a serpentine closed loop structure; The organic solvent is ethanol; The diameter of the oscillating heat pipe is 1-3 mm.

2. The data center immersion heat dissipation device according to claim 1, characterized in that: The tube bundle of the oscillating heat pipe is a branch tube bundle or a bent tube bundle.

3. The data center immersion heat dissipation device according to claim 1, characterized in that: The number of channel elbows of the oscillating heat pipe shall not be less than 15.

4. The data center immersion heat dissipation device according to claim 1, characterized in that: The length ratio of the evaporation zone to the condensation zone of the oscillating heat pipe is 1:1.5-2.

5.

5. The data center immersion heat dissipation device according to claim 4, characterized in that: The length ratio of the evaporation zone to the condensation zone of the oscillating heat pipe is 1:

2.

6. The data center immersion heat dissipation device according to claim 1, characterized in that: The filling rate of the oscillating heat pipe is 35-50%.

7. Application of the data center immersion heat dissipation device as described in any one of claims 1 to 6 in immersion heat dissipation in a data center.

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