A heating element and a method for preparing the same

Abstract

The present invention discloses a heating element and a preparation method thereof, wherein the heating element comprises a first substrate and a second substrate arranged in parallel, a first adhesive layer is arranged between the first substrate and the second substrate, a first groove and a second groove are molded on a side of the first adhesive layer away from the first substrate, the shape of the first groove is consistent with the pattern of the conductive circuit, the second groove is connected to the first groove, the conductive circuit is arranged in the first groove, a heating material is arranged in the second groove, and the heating material is connected to the conductive circuit to achieve electrical conduction. The heating element of the present invention has a simple structure, uniform heat generation, and low cost.

Description

Technical Field

[0001] The present invention relates to the technical field of electric heating equipment, and in particular to a heating element and a preparation method thereof. Background Art

[0002] As people's living standards improve, their requirements for living environment are getting higher and higher. Products with a single structure and function can no longer meet people's needs. Therefore, more functions that meet the needs are usually set on the products. For example, a towel rack. Conventional towel racks only have the function of hanging towels. At present, electric heating wires are set in the towel racks to make them heat up to achieve the function of drying towels. However, most of the existing heated towel racks are made of steel pipes, and electric heating wires are installed in the steel pipes to achieve the heating function. The towel racks with this structure are complicated to manufacture, high in cost, and uneven in heating. Summary of the invention

[0003] An object of an embodiment of the present invention is to provide a heating element with a simple structure, low cost, long service life, and uniform heat generation.

[0004] Another object of the embodiment of the present invention is to provide a method for preparing a heating element, which has simple operation and high production efficiency.

[0005] To achieve this purpose, the embodiment of the present invention adopts the following technical solutions:

[0006] In a first aspect, a heating element is provided, comprising a first substrate and a second substrate arranged in parallel, a first adhesive layer being arranged between the first substrate and the second substrate, a first groove and a second groove being molded on a side of the first adhesive layer away from the first substrate, a shape of the first groove being consistent with a pattern of a conductive circuit, the second groove being connected to the first groove, the conductive circuit being arranged in the first groove, a heating material being arranged in the second groove, and the heating material being connected to the conductive circuit to achieve electrical conduction.

[0007] As a preferred solution for the heating element, a second adhesive layer is provided on a side of the first adhesive layer away from the first substrate, the second adhesive layer blocks the notches of the first groove and the second groove, and the second substrate is bonded to the first adhesive layer through the second adhesive layer.

[0008] As a preferred solution of the heat generating element, the second adhesive layer extends to the edge of the first adhesive layer.

[0009] As a preferred solution for the heating element, the conductive circuit and the heating material do not protrude from a side of the first adhesive layer away from the first substrate.

[0010] As a preferred solution of the heating element, the first substrate is any one of a ceramic plate, a glass plate, an acrylic plate and an enamel plate; and / or,

[0011] The second substrate is any one of a ceramic plate, a glass plate, an acrylic plate and an enamel plate.

[0012] As a preferred solution of the heating element, the heating material is hardened heating particles, and the particle size of the particles is 1 micron to 80 microns.

[0013] As a preferred solution of the heating element, the particles are any one of graphene particles, inorganic carbon particles, organic carbon particles and carbon fibers.

[0014] As a preferred solution of the heating element, the first adhesive layer is any one of an epoxy resin layer, a silicone resin layer and a silicone layer.

[0015] As a preferred solution of the heating element, a sterilization layer is provided on a side of the first substrate away from the second substrate; and / or,

[0016] A sterilization layer is disposed on a side of the second substrate away from the first substrate.

[0017] In a second aspect, a method for preparing a heating element is provided, for preparing the heating element.

[0018] Providing a first substrate and a second substrate, and pasting a first adhesive layer on one side of the first substrate;

[0019] A first groove and a second groove are formed by pressing a mold on a side of the first adhesive layer away from the first substrate;

[0020] Filling the first groove with a conductive material and hardening the material to form a conductive circuit;

[0021] Filling the second groove with a heat-generating material and subjecting it to hardening treatment;

[0022] The second substrate is fixed to a side of the first adhesive layer away from the first substrate.

[0023] The beneficial effects of the present invention are as follows: by arranging a first adhesive layer between two substrates, a first groove consistent with the conductive circuit pattern and a second groove for accommodating the heating material can be molded on the first adhesive layer by a mold, so that the first adhesive layer, the conductive circuit and the heating material together form a heating sheet. After the heating sheet is energized, heat is generated and dissipated from the first substrate and the second substrate. This heating element does not need to pre-form the conductive circuit and the heating material into a film structure, which shortens the manufacturing cycle of the heating element, and a heating element of a specific shape can be formulated according to substrates of different shapes, so that the heating uniformity of the heating element is high, and the comfort of use is effectively improved; by arranging the conductive circuit and the heating material in the first adhesive layer, the conductive circuit and the heating material are not exposed at all, the sealing effect is good, and leakage is completely prevented, which is safe and reliable. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present invention is further described in detail below based on the accompanying drawings and embodiments.

[0025] Figure 1 FIG. 4 is a top view of the first adhesive layer according to an embodiment of the present invention.

[0026] Figure 2 1 is a top view of a heat generating element according to an embodiment of the present invention (the second substrate is not shown).

[0027] Figure 3 for Figure 2 AA cross-sectional schematic diagram of (showing the second substrate).

[0028] In the figure:

[0029] 1. First substrate; 2. Second substrate; 3. First adhesive layer; 31. First groove; 32. Second groove; 4. Conductive circuit; 5. Heat-generating material. DETAILED DESCRIPTION

[0030] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0031] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0033] like Figures 1 to 3 As shown, the heating element of the embodiment of the present invention includes a first substrate 1 and a second substrate 2 arranged in parallel, a first adhesive layer 3 is arranged between the first substrate 1 and the second substrate 2, and a first groove 31 and a second groove 32 are molded on a side of the first adhesive layer 3 away from the first substrate 1, the shape of the first groove 31 is consistent with the pattern of the conductive circuit 4, the second groove 32 is connected to the first groove 31, the conductive circuit 4 is arranged in the first groove 31, and a heating material 5 is arranged in the second groove 32, and the heating material 5 is connected to the conductive circuit 4 to achieve electrical conduction. By setting a first adhesive layer 3 between the two substrates, a first groove 31 consistent with the pattern of the conductive circuit 4 and a second groove 32 for accommodating the heating material 5 can be molded on the first adhesive layer 3 by a mold, so that the first adhesive layer 3, the conductive circuit 4 and the heating material 5 together form a heating sheet. After the heating sheet is energized, heat is generated and dissipated from the first substrate 1 and the second substrate 2. This heating element does not need to pre-form the conductive circuit 4 and the heating material 5 into a film structure, which shortens the manufacturing cycle of the heating element, and can formulate a heating element of a specific shape according to substrates of different shapes, so that the heating uniformity of the heating element is high, which effectively improves the comfort of use; by setting the conductive circuit 4 and the heating material 5 in the first adhesive layer 3, the conductive circuit 4 and the heating material 5 are not exposed at all, the sealing effect is good, and the leakage of electricity is completely eliminated, which is safe and reliable.

[0034] The second substrate 2 can be bonded to the first substrate 1 through the first adhesive layer 3. When the first groove 31 and the second groove 32 are molded, the first adhesive layer 3 is in a semi-cured state. After the second substrate 2 is attached to the first adhesive layer 3, the first adhesive layer 3 is completely cured to achieve connection. The semi-cured state here refers to the state between the room temperature solidification state and the fully cured state of the first adhesive layer 3, and can be squeezed by the mold to form a non-rebound groove structure. This design can reduce the amount of adhesive layer used, and use the first adhesive layer 3 to fix the conductive circuit 4 and the heating material 5 as well as the first substrate 1 and the second substrate 2, which greatly reduces the cost and also makes the overall thickness of the heating element thinner.

[0035] In other embodiments, a second adhesive layer (not shown in the figure) is provided on the side of the first adhesive layer 3 away from the first substrate 1, the second adhesive layer blocks the notches of the first groove 31 and the second groove 32, and the second substrate 2 is bonded to the first adhesive layer 3 through the second adhesive layer. By providing an additional second adhesive layer to bond the second substrate 2, not only can the fixing effect of the second substrate 2 be increased, but also the first groove 31 and the second groove 32 can be sealed, ensuring that the conductive circuit 4 and the heating material 5 can be sealed between the first substrate 1 and the second substrate 2.

[0036] Preferably, the second adhesive layer extends to the edge of the first adhesive layer 3. This design can improve the sealing effect, and at the same time, the second adhesive layer can be used to smooth the periphery of the first adhesive layer 3, so that the appearance of the heating element is more beautiful. When the first adhesive layer 3 is molded, since the first adhesive layer 3 needs to form the first groove 31 and the second groove 32, it is not in a completely solidified state. If molded at this time, the periphery of the first adhesive layer 3 may be deformed due to the extrusion of the mold, so the second adhesive layer can smooth the uneven area of ​​the periphery of the first adhesive layer 3.

[0037] Specifically, the conductive circuit 4 and the heating material 5 do not protrude from the side of the first adhesive layer 3 away from the first substrate 1. This design can prevent the conductive circuit 4 and the heating material 5 from directly contacting the rigid second substrate 2. If the first adhesive layer 3 is not provided between the first adhesive layer 3 and the second substrate 2, this design can prevent a gap between the first adhesive layer 3 and the second substrate 2, thereby ensuring a sealing effect. If a second adhesive layer is provided between the first adhesive layer 3 and the second substrate 2, the thickness of the second adhesive layer can be reduced, that is, a thinner second adhesive layer can be used to connect the first adhesive layer 3 and the second substrate 2, and achieve good sealing, thereby effectively reducing the manufacturing cost.

[0038] The heating element of the present invention can be used as a sterilizing dryer (such as a towel rack), a tabletop, a floor, a partition of a shower room or a sauna room, etc., and the heating element can be set at any location where heating is required.

[0039] In one embodiment, the first substrate 1 and the second substrate 2 are both ceramic substrates. The ceramic substrate has high high temperature resistance, no rust, good heat dissipation effect, etc., and the cost of the ceramic substrate is lower than that of steel and other structures, which can reduce the cost of the heating element.

[0040] Of course, the first substrate 1 and the second substrate 2 are not limited to being made of ceramics, but may also be made of heat-resistant hard materials such as glass, acrylic, enamel, etc.

[0041] The materials of the first substrate 1 and the second substrate 2 can be the same or different. For example, the first substrate 1 is a ceramic plate, and the second substrate 2 is a glass plate.

[0042] The heating material 5 is a hardened heating particle, and the particle size of the particle is 20nm-50nm. The particle structure is easier to mix with a solvent or a binder to form a liquid slurry, and then fill it in the second groove 32. The particle size is 20nm-50nm, which can ensure that the heat emitted by the heating material 5 is more uniform when powered. The binder can be silicone rubber, silicone resin, resin, PVC and other materials. After the binder and graphene particles are evenly mixed according to a certain specific gravity, they are formed in the second groove 32 of the first adhesive layer 3 by filling, and hardened by heating.

[0043] In this embodiment, the particles are graphene particles. Graphene is a kind of carbon atom in the form of sp 2 Hybrid orbitals form a two-dimensional carbon nanomaterial with a hexagonal honeycomb lattice. Graphene has excellent optical, electrical, and mechanical properties, and has important application prospects in materials science, micro-nano processing, energy, biomedicine, and drug delivery. The common methods for producing graphene powders are mechanical exfoliation, redox, and SiC epitaxial growth, and the thin film production method is chemical vapor deposition (CVD).

[0044] Graphene as the heating material 5 can generate far-infrared light waves with a wavelength of 5μm-15μm when powered on, which is consistent with the infrared light band emitted by the human body. Therefore, this heating element also has a therapeutic function when generating heat. In addition, when this heating element is working, the leakage current is small and the safety is very high.

[0045] Of course, the heat generating material 5 is not limited to graphene particles, but may also be any one of inorganic carbon particles, organic carbon particles and carbon fibers.

[0046] The first adhesive layer 3 and the second adhesive layer are any one of an epoxy resin layer, a silicone resin layer and a silicone layer.

[0047] Epoxy resin is a general term for a class of polymers containing more than two epoxy groups in the molecule. It is a condensation product of epichlorohydrin and bisphenol A or polyol. Due to the chemical activity of the epoxy group, it can be opened with a variety of compounds containing active hydrogen, hardened and cross-linked to form a network structure, so it is a thermosetting resin. There are 16 main varieties of epoxy resin, including general glue, structural glue, high temperature resistant glue, low temperature resistant glue, glue for water and wet surfaces, conductive glue, optical glue, spot welding glue, epoxy resin film, foam glue, strain glue, soft material bonding glue, sealant, special glue, latent hardening glue, civil engineering glue, etc. As an anti-corrosion material, epoxy resin not only has the characteristics of density, water resistance, good leakage resistance, high strength, but also has good processability such as strong adhesion, room temperature operation, and simple construction, and the price is moderate.

[0048] Silicone resin is a thermosetting polysiloxane polymer with a highly cross-linked structure. It has the dual characteristics of organic resin and inorganic material, unique physical and chemical properties, good electrical insulation, heat resistance and waterproof effect. Silicone resin has better weather resistance than general organic resin. Therefore, it is an ideal material for coating the surface of heat-resistant, heat-resistant and moisture-proof treatment. Silicone resin has good bonding performance to metals such as iron, aluminum and tin, and is also easy to bond to glass and ceramics.

[0049] Silica gel (Silica) is also known as silica gel. It is a highly active adsorption material and an amorphous substance. Its chemical formula is mSiO2·nH2O. It does not react with any substance except strong alkali and hydrofluoric acid. It is insoluble in water and any solvent. It is non-toxic and tasteless and has stable chemical properties. Various types of silica gel form different microporous structures due to their different manufacturing methods. The chemical composition and physical structure of silica gel determine that it has many characteristics that are difficult to replace by other similar materials: high adsorption performance, good thermal stability, stable chemical properties, high mechanical strength, etc. Silica gel is divided into: macroporous silica gel, coarse-porous silica gel, B-type silica gel, fine-porous silica gel, etc. according to the size of its pore size.

[0050] In one embodiment, a sterilization layer is provided on one side of the first substrate 1 away from the second substrate 2, and a sterilization layer is also provided on one side of the second substrate 2 away from the first substrate 1. By providing the sterilization layer, the surrounding air or objects attached to the two substrates can be sterilized at the same time when the heating element is heating.

[0051] In addition, a pattern layer may be printed or pasted on a side of the first substrate 1 away from the second substrate 2 or a side of the second substrate 2 away from the first substrate 1 to improve the appearance of the heating element.

[0052] The embodiment of the present invention also provides a method for preparing a heating element, which is used to prepare a heating element as described in any of the above embodiments, providing a first substrate 1 and a second substrate 2, pasting a first adhesive layer 3 on one side of the first substrate 1; pressing a first groove 31 and a second groove 32 on the side of the first adhesive layer 3 away from the first substrate 1 by a mold; filling the first groove 31 with a conductive material and hardening it to form a conductive circuit 4; filling the second groove 32 with a heating material 5 and hardening it; fixing the second substrate 2 on the side of the first adhesive layer 3 away from the first substrate 1. The preparation method is simple to operate and has high production efficiency, and can manufacture a heating element with uniform heating and high safety, and the cost of the heating element is low.

[0053] In this embodiment, after the first adhesive layer 3 is pasted, the first adhesive layer 3 is semi-cured to achieve a certain shaping, and then the first adhesive layer 3 is molded by a mold. After the molding is completed, the first groove 31 and the second groove 32 are filled with the conductive circuit 4 and the heating material 5 in turn. After the conductive circuit 4 and the heating material 5 are hardened and the first adhesive layer 3 is pasted with the second substrate 2, the first adhesive layer 3 is completely cured.

[0054] Before the second substrate 2 is attached, glue is applied to the surface of the first adhesive layer 3 to form a second adhesive layer, and then the second substrate 2 is attached to the first adhesive layer 3 through the second adhesive layer.

[0055] Specifically, after the second substrate 2 is attached, sealant is applied to the periphery of the first adhesive layer 3 between the first substrate 1 and the second substrate 2. This method can make the area between the first substrate 1 and the second substrate 2 more flat and further improve the sealing effect.

[0056] In the description of this article, it is necessary to understand that the term "upper" and other orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0057] In the description of this specification, the description of reference term "an embodiment" etc. means that the specific features, structures, materials or characteristics of the embodiment are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment.

[0058] In addition, it should be understood that although this specification is described according to implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0059] The technical principle of the present invention is described above in conjunction with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanations herein, those skilled in the art can associate other specific implementations of the present invention without paying creative labor, and these methods will fall within the scope of protection of the present invention.

Claims

1. A heating element, characterized in that: It includes a first substrate and a second substrate arranged in parallel, a first adhesive layer is arranged between the first substrate and the second substrate, a first groove and a second groove are molded on a side of the first adhesive layer away from the first substrate, the shape of the first groove is consistent with the pattern of the conductive circuit, the second groove is connected to the first groove, the conductive circuit is arranged in the first groove, a heating material is arranged in the second groove, the heating material is connected to the conductive circuit to achieve electrical conduction, and the conductive circuit and the heating material do not protrude from the side of the first adhesive layer away from the first substrate.

2. The heating element according to claim 1, characterized in that: A second adhesive layer is disposed on a side of the first adhesive layer away from the first substrate, the second adhesive layer blocks the notches of the first groove and the second groove, and the second substrate is bonded to the first adhesive layer through the second adhesive layer.

3. The heating element according to claim 2, characterized in that: The second adhesive layer extends to an edge of the first adhesive layer.

4. The heating element according to claim 1, characterized in that: The first substrate is any one of a ceramic plate, a glass plate, an acrylic plate and an enamel plate; and / or, The second substrate is any one of a ceramic plate, a glass plate, an acrylic plate and an enamel plate.

5. The heating element according to claim 1, characterized in that: The heat-generating material is hardened heat-generating particles, and the particle size of the particles is 1 micron to 80 microns.

6. The heating element according to claim 5, characterized in that: The particles are any one of graphene particles, inorganic carbon particles, organic carbon particles and carbon fibers.

7. The heating element according to claim 1, characterized in that: The first adhesive layer is any one of an epoxy resin layer, a silicone resin layer and a silicone layer.

8. The heating element according to any one of claims 1 to 7, characterized in that: A sterilization layer is disposed on a side of the first substrate away from the second substrate; and / or, A sterilization layer is disposed on a side of the second substrate away from the first substrate.

9. A method for preparing a heating element, characterized in that: Used for preparing the heating element as claimed in any one of claims 1 to 8, Providing a first substrate and a second substrate, and pasting a first adhesive layer on one side of the first substrate; A first groove and a second groove are formed by pressing a mold on a side of the first adhesive layer away from the first substrate; Filling the first groove with a conductive material and hardening the material to form a conductive circuit; Filling the second groove with a heat-generating material and subjecting it to hardening treatment; The second substrate is fixed to a side of the first adhesive layer away from the first substrate.

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