Display Devices

Abstract

According to an embodiment of the present invention, a display device includes: a substrate, including a through hole, a peripheral area surrounding the through hole, a wiring area surrounding the peripheral area, and a display area surrounding the wiring area; a gate insulating layer, arranged on the substrate; a gate wiring, arranged in the wiring area and on the gate insulating layer; an interlayer insulating layer, arranged on the gate wiring; a data wiring, arranged in the wiring area and on the interlayer insulating layer; an intermediate insulating layer, arranged on the data wiring; and a first main insulating dam, arranged in the wiring area and on the intermediate insulating layer, wherein the first main insulating dam includes an organic material, and wherein the width of the lower surface of the first main insulating dam is narrower than the width of the upper surface of the first main insulating dam.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the priority of Korean Patent Application No. 10-2019-0034936 filed in the Korean Intellectual Property Office on March 27, 2019, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The present invention relates to a display device, and more particularly to a display device including a through hole. Background Art

[0004] Recently, as various portable electronic devices include a camera function, the case of electronic devices having a built-in camera function has rapidly increased compared to the case in which a camera is separately carried.

[0005] In the conventional art, since a camera, a flash, a speaker, a photosensor, and the like are provided outside an image display area of ​​an electronic device, there is a tendency that an image display area (an area in which an image is displayed) is reduced. Summary of the invention

[0006] According to an embodiment of the present invention, a display device includes: a substrate, including a through hole, a peripheral area surrounding the through hole, a wiring area surrounding the peripheral area, and a display area surrounding the wiring area; a gate insulating layer, arranged on the substrate; a gate wiring, arranged in the wiring area and on the gate insulating layer; an interlayer insulating layer, arranged on the gate wiring; a data wiring, arranged in the wiring area and on the interlayer insulating layer; an intermediate insulating layer, arranged on the data wiring; and a first main insulating dam, arranged in the wiring area and on the intermediate insulating layer, wherein the first main insulating dam includes an organic material, and wherein the width of the lower surface of the first main insulating dam is narrower than the width of the upper surface of the first main insulating dam.

[0007] In an embodiment of the present invention, the display device further includes: an emission layer, which is arranged on the substrate; and a cathode, which is arranged on the emission layer, wherein the emission layer and the cathode are arranged in the peripheral area and the wiring area, and the emission layer and the cathode include a disconnection point based on the first main insulating dam.

[0008] In an embodiment of the present invention, the display device further comprises: an encapsulation layer disposed on the cathode, wherein the encapsulation layer comprises an inorganic encapsulation layer and an organic encapsulation layer.

[0009] In an embodiment of the present invention, the inorganic encapsulation layer is disposed on the intermediate insulating layer at the disconnection point.

[0010] In an embodiment of the present invention, the display device further includes: a first sub-insulating dam disposed in the peripheral region and disposed on the intermediate insulating layer, wherein the first sub-insulating dam includes a plurality of organic layers.

[0011] In an embodiment of the present invention, the plurality of organic layers include: a planarization layer disposed on the intermediate insulating layer; a spacer disposed on the planarization layer; and a spacer disposed on the spacer.

[0012] In an embodiment of the present invention, the display device further includes: a second sub-insulating dam disposed in the wiring region and disposed on the intermediate insulating layer, wherein the second sub-insulating dam includes the above-mentioned plurality of organic layers.

[0013] In an embodiment of the present invention, the first main insulating dam is disposed on the same layer as one of the planarization layer, the spacer, and the spacer.

[0014] In an embodiment of the present invention, the display device further includes: at least one second main insulating dam disposed in the peripheral area.

[0015] In the embodiment of the present invention, the through hole is formed to penetrate the substrate, the gate insulating layer, the interlayer insulating layer and the intermediate insulating layer.

[0016] According to an embodiment of the present invention, a display device includes: a substrate including a through hole, a first non-display area surrounding the through hole, and a display area surrounding the first non-display area; a gate insulating layer arranged on the substrate; a gate wiring arranged in the first non-display area and on the gate insulating layer; an interlayer insulating layer arranged on the gate wiring; a data wiring arranged in the first non-display area and on the interlayer insulating layer; an intermediate insulating layer arranged on the data wiring; an emission layer arranged on the substrate; and an encapsulation layer arranged in the emission layer and on the substrate, wherein the encapsulation layer includes an inorganic encapsulation layer and an organic encapsulation layer, the emission layer includes an opening formed in the first non-display area, and the intermediate insulating layer is in direct contact with the inorganic encapsulation layer in the opening.

[0017] In an embodiment of the present invention, the display device further includes: a cathode disposed between the emission layer and the inorganic encapsulation layer, wherein the cathode includes an opening formed in the first non-display area.

[0018] In an embodiment of the present invention, the first non-display area includes a peripheral area surrounding the through hole and a wiring area surrounding the peripheral area, and wherein the gate wiring and the data wiring are disposed in the wiring area.

[0019] In an embodiment of the present invention, the display device further includes: a sub-insulating dam disposed in the peripheral region and on the intermediate insulating layer.

[0020] In an embodiment of the present invention, the sub-insulating dam includes a plurality of organic layers, and the plurality of organic layers include: a planarization layer disposed on the intermediate insulating layer; a spacer disposed on the planarization layer; and a spacer disposed on the spacer.

[0021] According to an embodiment of the present invention, a display device includes: a substrate including a through hole, a peripheral area surrounding the through hole, and a wiring area surrounding the peripheral area; a gate insulating layer arranged on the substrate; a gate wiring arranged in the wiring area and on the gate insulating layer; an interlayer insulating layer arranged on the gate wiring; a data wiring arranged in the wiring area and on the interlayer insulating layer; an intermediate insulating layer arranged on the data wiring; an organic layer arranged on the intermediate insulating layer; and a first inverted insulating dam arranged in the wiring area and on the organic layer, wherein the first inverted insulating dam has a conical shape.

[0022] In an embodiment of the present invention, the display device further includes: a second inverted insulating dam disposed on the intermediate insulating layer; an emission layer disposed on the substrate; and a cathode disposed on the emission layer, wherein the emission layer and the cathode include a first disconnection point based on the first inverted insulating dam.

[0023] In an embodiment of the present invention, the display device further comprises: an encapsulation layer disposed on the cathode, wherein the encapsulation layer comprises an inorganic encapsulation layer and an organic encapsulation layer.

[0024] In the embodiment of the present invention, the inorganic encapsulation layer overlaps with the first breaking point.

[0025] In an embodiment of the present invention, the display device further includes a second inverted insulating dam disposed in the peripheral area. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a schematic diagram of a display device according to an embodiment of the present invention;

[0027] Figure 2 yes Figure 1 An enlarged view of region A;

[0028] Figure 3 According to an embodiment of the present invention, Figure 2 A cross-sectional view of the display device taken along line III-III;

[0029] Figure 4 is a cross-sectional view of a display device according to an embodiment of the present invention;

[0030] Figure 5 is a cross-sectional view of a display device according to an embodiment of the present invention;

[0031] Figure 6is a cross-sectional view of a portion of a display area and a first non-display area in a display device according to an embodiment of the present invention; and

[0032] Figure 7 is a cross-sectional view of a portion of a display area and a first non-display area in a display device including a window according to an embodiment of the present invention. DETAILED DESCRIPTION

[0033] Hereinafter, the present invention will be described more fully with reference to the accompanying drawings. As will be understood, the described embodiments of the present invention may be modified in various different ways, all without departing from the spirit or scope of the present invention.

[0034] Throughout the specification, the same reference numerals may denote the same elements, and thus repeated descriptions may be omitted.

[0035] Further, in the drawings, the size and thickness of each element may be exaggerated for clarity, and the present invention is not limited thereto.

[0036] It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, the element may be directly on the other element, or intermediate elements may also be present. In addition, when an element is referred to as being "directly on" another element, there are no intermediate elements.

[0037] Further, throughout the specification, the phrase “on a plane” may mean viewing a target portion from the top, and the phrase “on a cross section” may mean viewing a cross section formed by vertically cutting the target portion from the side.

[0038] Now, refer to Figure 1 A plan view of a display panel included in a display device according to an embodiment of the present invention is described.

[0039] Figure 1 is a schematic diagram of a display device according to an embodiment of the present invention.

[0040] The substrate 100 included in the display panel of the display device according to the embodiment of the present invention includes a display area DA, a through hole 210 , a first non-display area PA1 , and a second non-display area PA2 .

[0041] The display area DA is an area where a plurality of pixels are arranged so as to be able to display an image. One pixel includes a pixel circuit and an organic light emitting element (OLED) that receives current from the pixel circuit to emit light.

[0042] The through hole 210 is provided in the display area DA. For example, the through hole 210 may be formed through the substrate 100 and a plurality of insulating layers. Figure 2Detailed description. At least one camera, flash, photoelectric sensor, etc. may be disposed in the through hole 210. The camera, flash, photoelectric sensor, etc. may be disposed in combination with a penetrating coupling member disposed in the through hole 210. Figure 1 In the embodiment, the through hole 210 is formed in a circular shape at the central area of ​​the upper portion of the display area DA, but the position, shape and number of the through hole are not limited. For example, the through hole 210 may have various shapes, such as a polygonal shape such as a quadrilateral shape or an elliptical shape.

[0043] The non-display area includes a first non-display area PA1 and a second non-display area PA2. The first non-display area PA1 is an area at least partially surrounding the periphery of the through hole 210. The first non-display area PA1 is an area between the through hole 210 and the adjacent display area DA, and the display area DA is an area at least partially surrounded by the second non-display area PA2. In the first non-display area PA1, a plurality of gate wirings GL and a plurality of data wirings DL for transmitting signals to pixels are provided. Next, referring to Figure 2 A plurality of gate wirings GL and data wirings DL disposed in the first non-display area PA1 are described.

[0044] The second non-display area PA2 is an area at least partially surrounding the periphery of the display area DA. The second non-display area PA2 is a different area spaced apart from the first non-display area PA1. A gate driver and a data driver for transmitting signals to a plurality of pixels respectively may be provided in the second non-display area PA2. The gate driver is a portion for applying a gate signal and may be provided on one side relative to the display area DA or on both sides facing each other in a horizontal direction (e.g., a lateral direction) relative to the display area DA. The data driver is a portion for applying a data signal and may be provided on one side relative to the display area DA or on both sides facing each other in a vertical direction (e.g., a longitudinal direction) relative to the display area DA.

[0045] In the following, reference Figure 2 The through hole 210 and the first non-display area PA1 are described in detail.

[0046] Figure 2 Shows Figure 1 Area A.

[0047] Figure 2 The area A includes the through hole 210, a portion of the display area DA, and the first non-display area PA1.

[0048] The first non-display area PA1 includes a peripheral area RA and a wiring area LA.

[0049] The peripheral area RA is an inner area of ​​the first non-display area PA1 around the periphery of the through hole 210. The gate wiring GL or the data wiring DL is not disposed in the peripheral area RA. The peripheral area RA is an area to prevent the wiring from being damaged during laser irradiation to form the through hole 210, so it is desirable to keep the minimum width constant.

[0050] The wiring area LA is an outer (eg, remaining) area surrounding the peripheral area RA in the first non-display area PA1. A plurality of gate wirings GL and a plurality of data wirings DL are disposed in the wiring area LA.

[0051] The gate wiring GL and the data wiring DL have a semicircular structure around the through hole 210 and bypass the through hole 210. A plurality of gate wirings GL extend in the horizontal direction along the periphery of the through hole 210. Here, according to the supplied signal, the plurality of gate wirings GL may include a scan line, an emission control line, an initialization voltage line, etc. A plurality of data wirings DL extend in the vertical direction along the periphery of the through hole 210. According to the supplied signal, the plurality of data wirings DL may include a data line, a drive voltage line, and a drive low voltage line. According to an embodiment of the present invention, the voltage lines in the plurality of gate wirings GL and the plurality of data wirings DL may be changed. For example, the gate wiring GL and the data wiring DL may be arranged on different layers, with an insulating layer between the gate wiring GL and the data wiring DL.

[0052] In addition, refer to Figure 3 A peripheral area RA and a wiring area LA surrounding the through hole 210 are described.

[0053] Figure 3 is along Figure 2 A cross-sectional view taken along line III-III.

[0054] refer to Figure 3 According to an embodiment of the present invention, the organic light-emitting display device includes a substrate 100, a barrier layer 110, a buffer layer 120, a gate wiring layer, a gate insulating layer 130, a data wiring layer, an interlayer insulating layer 140, an intermediate insulating layer 150, an emission layer 370, a cathode 270, a planarization layer 160, an insulator 170, a spacer 180 and an encapsulation layer 300.

[0055] The substrate 100 may be made of a material such as glass, metal or an organic material. According to an embodiment of the present invention, the substrate 100 is made of flexible polyimide (PI). The substrate 100 includes a through hole 210. Here, the through hole 210 penetrates a plurality of layers disposed on the substrate 100 and the substrate 100, and the plurality of layers include a barrier layer 110, a buffer layer 120, a gate insulating layer 130, an interlayer insulating layer 140, an intermediate insulating layer 150, an emission layer 370, a cathode 270, an encapsulation layer 300, etc. described later.

[0056] The barrier layer 110 is disposed on the substrate 100, and the buffer layer 120 is disposed on the barrier layer 110. The barrier layer 110 and the buffer layer 120 may be made of, for example, silicon oxide (SiO x ). The semiconductor layer may be disposed on the buffer layer 120. On the substrate 100, one of the barrier layer 110 and the buffer layer 120 may be omitted.

[0057] The gate insulating layer 130 is disposed on the buffer layer 120. The gate insulating layer 130 may be made of, for example, silicon oxide (SiO x ) or silicon nitride (SiN x ) etc. The gate insulating layer 130 may be provided to cover the semiconductor layer.

[0058] The gate wiring layer is disposed on the gate insulating layer 130. The gate wiring layer includes a plurality of gate wirings GL, and the plurality of gate wirings GL include a scan line to which a scan signal is applied, an emission control line to which an emission control signal is applied, and an initialization voltage line to which an initialization voltage is applied.

[0059] The interlayer insulating layer 140 is disposed on the gate wiring layer. The interlayer insulating layer 140 may be made of, for example, silicon oxide (SiO x ) or silicon nitride (SiN x ) of inorganic materials.

[0060] The data wiring layer is disposed on the interlayer insulating layer 140. The data wiring layer includes a plurality of data wirings DL, and the plurality of data wirings DL include a data line to which a data voltage is applied, a driving voltage line to which a driving voltage is applied, a driving low voltage line to which a driving low voltage is applied, and the like. In addition, in the data wiring layer, the source electrode (hereinafter, Figure 6 156) and / or a drain electrode (hereinafter, Figure 6 According to an embodiment of the present invention, the data wiring layer may include a first data wiring layer and a second data wiring layer. The first data wiring layer may be disposed on the interlayer insulating layer 140, and the second data wiring layer may be disposed on the intermediate insulating layer 150, as described below.

[0061] The intermediate insulating layer 150 is disposed on the data wiring layer. The intermediate insulating layer 150 may be made of an inorganic material. The intermediate insulating layer 150 may directly contact the encapsulation layer 300 described later, thereby preventing moisture from penetrating into the organic light emitting element.

[0062] A planarization layer 160, an insulator 170, a spacer 180, etc., each made of an organic material, are disposed on the intermediate insulating layer 150. Figure 3In FIG. 1 , the planarization layer 160, the spacer 170, and the spacer 180 are sequentially disposed on both edges of the wiring area LA. The planarization layer 160, the spacer 170, and the spacer 180 shown as being only partially located on both edges are portions extending from the wiring area LA toward the display area DA and are Figure 6 and Figure 7 Detailed description is given in the cross-sectional view of the display area DA shown in FIG.

[0063] exist Figure 3 In the embodiment, except for a plurality of organic material layers at both edges of the wiring area LA, in the wiring area LA and the peripheral area RA, a first sub-insulating dam DAM1, a second sub-insulating dam DAM2, and a main insulating dam 55 made of an organic material are disposed on the intermediate insulating layer 150. Here, the first sub-insulating dam DAM1 and the second sub-insulating dam DAM2 provide a step, thereby preventing moisture from penetrating from the through hole 210 into the organic light emitting element.

[0064] The first sub-insulating dam DAM1 is disposed in the peripheral area RA. The first sub-insulating dam DAM1 includes a first planarizing portion 160a, a first spacer portion 170a, and a first spacer portion 180a. The first planarizing portion 160a is disposed on the intermediate insulating layer 150. In addition, the first spacer portion 170a is disposed on the first planarizing portion 160a, and the first spacer portion 180a is disposed on the first spacer portion 170a. The first planarizing portion 160a may be disposed on the same layer as the planarizing layer 160. In addition, the first spacer portion 170a may be disposed on the same layer as the spacer 170, and the first spacer portion 180a may be disposed on the same layer as the spacer 180. According to an embodiment of the present invention, the first sub-insulating dam DAM1 may include a first spacer portion 170a and a first spacer portion 180a, a first planarizing portion 160a and a first spacer portion 180a, or a first planarizing portion 160a and a first spacer portion 170a.

[0065] The second sub-insulating dam DAM2 is disposed in the wiring area LA. The second sub-insulating dam DAM2 includes a second planarizing portion 160b, a second spacer portion 170b, and a second spacer portion 180b. The second planarizing portion 160b may be disposed on the same layer as the first planarizing portion 160a. In addition, the second spacer portion 170b may be disposed on the same layer as the first spacer portion 170a, and the second spacer portion 180b may be disposed on the same layer as the first spacer portion 180a. According to an embodiment of the present invention, the second sub-insulating dam DAM2 may include a second spacer portion 170b and a second spacer portion 180b. In addition, according to an embodiment of the present invention, in the wiring area LA, a plurality of insulating dams may be formed on the same layer as an organic material layer of one of the planarizing layer 160, the spacer 170, and the spacer 180. According to an embodiment of the present invention, the spacer 180 may be formed when the spacer 170 is formed.

[0066] The main insulating dam 55 is disposed in the wiring area LA. The main insulating dam 55 in the wiring area LA is referred to as a first main insulating dam. The main insulating dam 55 disconnects the emission layer 370 extending in the wiring area LA and disconnects the cathode 270 extending in the wiring area LA, thereby preventing moisture flowing in from the through hole 210 from being transmitted to the organic light emitting element (OLED) of the display area DA. For example, in an embodiment of the present invention, the main insulating dam 55 can separate the emission layer 370 to form a disconnection in the emission layer 370 to further prevent moisture from flowing into the organic light emitting element (OLED) from the through hole 210. For example, the disconnection portion SA formed in the emission layer 370 and the cathode 270 by the main insulating dam 55 disposed in the wiring area LA can prevent moisture from penetrating into the organic emission layer located in the display area DA. The main insulating dam 55 can be formed together with one of the planarization layer 160, the spacer 170 and the spacer 180, and can be formed of a single layer or a plurality of organic layers. For example, the main insulating dam 55 is implemented as a shape having a width of a lower surface narrower than a width of an upper surface. For example, an inverted tapered shape, an inverted trapezoidal shape, a “T” shape, or an undercut shape may be formed. According to an embodiment of the present invention, the main insulating dam 55 may be formed as a plurality of dams having shapes of different sizes and / or different shapes.

[0067] The emission layer 370 is disposed on the main insulating dam 55, the first sub-insulating dam DAM1 and the second sub-insulating dam DAM2. The cathode 270 is disposed on the emission layer 370. Here, the emission layer 370 and the cathode 270 may be connected to the anode (hereinafter, Figure 6191) together form an organic light emitting element (OLED). An emission layer 370 and a cathode 270 are formed over the substrate 100 to cover the main insulating dam 55 provided on the intermediate insulating layer 150. In addition, the emission layer 370 and the cathode 270 are formed over the first sub-insulating dam DAM1 and the second sub-insulating dam DAM2. Further, as an example, the emission layer 370 and the cathode 270 may be formed over the entire surface of the substrate 100. According to an embodiment of the present invention, the emission layer 370 may be formed in some areas of the substrate 100.

[0068] According to an embodiment of the present invention, the emission layer 370 and the cathode 270 are formed on the upper surface of the main insulating dam 55, but not on the side surface of the main insulating dam 55 having an inverted tapered shape. Due to the main insulating dam 55, the emission layer 370 and the cathode 270 include a disconnection portion SA. Therefore, the main insulating dam 55 disconnects the emission layer 370 or the cathode 270 extending from the display area DA to the wiring area LA, thereby preventing moisture flowing from the through hole 210 from being transmitted to the organic light emitting element (OLED) of the display area DA. The disconnection portion SA is a portion where the intermediate insulating layer 150 and the encapsulation layer 300 described later are in direct contact with each other. The disconnection portion SA can prevent moisture (H 2 O) penetrates along the interface direction between the layers (eg, a direction parallel to the upper surface of the substrate 100).

[0069] In the display device according to the comparative example, when the first non-display area PA1 is located around the through hole 210 , relatively large-sized insulating dams are provided in the peripheral area RA and the wiring area LA to form disconnected portions of the cathode 270 or the emission layer 370 .

[0070] In comparison, in the display device according to the embodiment of the present invention, by forming the disconnected portion SA of the cathode 270 or the emission layer 370 in the wiring area LA, the first non-display area PA1 around the through hole 210 may be reduced.

[0071] The encapsulation layer 300 is disposed on the cathode 270. The encapsulation layer 300 includes a first inorganic encapsulation layer 310, an organic encapsulation layer 320, and a second inorganic encapsulation layer 330. The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 are formed through the non-display areas PA1 and PA2 and the display area DA. In addition, the organic encapsulation layer 320 may be formed in a portion of the display area DA and a portion of the wiring area LA. For example, the organic encapsulation layer 320 may not be formed in the peripheral area RA. In a portion of the wiring area LA and the peripheral area RA, the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 are in direct contact with each other. According to an embodiment of the present invention, a plurality of inorganic layers and organic layers may be included to prevent moisture from penetrating.

[0072] The first inorganic encapsulating layer 310 may directly contact the intermediate insulating layer 150 in the disconnected portion SA to prevent moisture, which may penetrate along an interface between layers, from flowing into the organic light emitting element (OLED).

[0073] In the following, reference Figure 4 Description does not include Figure 3 A display device having a main insulating dam 55 is provided.

[0074] Figure 4 is a cross-sectional view of a display device according to an embodiment of the present invention.

[0075] exist Figure 4 In addition to the opening OP of the emission layer 370 and the cathode 270, the display device according to the embodiment of the present invention is Figure 3 The display devices described in are the same, so the differences are mainly described.

[0076] First and second sub-insulating dams DAM1 and DAM2 made of an organic material are disposed on the intermediate insulating layer 150. Here, the first and second sub-insulating dams DAM1 and DAM2 provide a step to prevent moisture from penetrating from the through hole 210 into the organic light emitting element (OLED).

[0077] The emission layer 370 is disposed on the first sub-insulating dam DAM1 and the second sub-insulating dam DAM2, and the cathode 270 is disposed on the emission layer 370. The emission layer 370 and the cathode 270 are formed over the substrate 100 to cover the entirety of the first sub-insulating dam DAM1 and the second sub-insulating dam DAM2 on the intermediate insulating layer 150. In addition, a portion of the emission layer 370 and a portion of the cathode 270 disposed in the wiring area LA are disconnected by a laser irradiation process. Therefore, the emission layer 370 and the cathode 270 include an opening OP. Here, both sides of the opening OP may be referred to as a disconnection portion SA. The disconnection portion SA is a portion in which the intermediate insulating layer 150 and the first inorganic encapsulation layer 310 described later are in direct contact with each other. In the disconnection portion SA formed in the wiring area LA, since the cathode 270 and the emission layer 370 are disconnected, moisture flowing in from the through hole 210 may not be transmitted to the organic light emitting element (OLED) in the display area DA. For example, the disconnection portion SA formed in the wiring area LA may prevent moisture from being transferred to the organic emission layer 370 located in the display area DA.

[0078] In addition, the display device according to the embodiment of the present invention may reduce the first non-display area PA1 around the periphery of the through hole 210 by forming the disconnection portion SA of the cathode 270 and / or the emission layer 370 in the wiring area LA.

[0079] In the following, reference Figure 5The peripheral region RA includes a plurality of main insulating dams 55a, 55b, 55c, and 55d. Figure 3 A display device other than the first sub-insulating dam DAM1 is not included.

[0080] Figure 5 is a cross-sectional view of a display device according to an embodiment of the present invention.

[0081] exist Figure 5 In the embodiment of the present invention, since the display device includes a plurality of main insulating dams 55a, 55b, 55c and 55d having relatively small sizes in the peripheral area RA and the wiring area LA, the main description is mainly made except for the main insulating dams 55a, 55b, 55c and 55d. Figure 3 The differences are other than the same contents mentioned in the content.

[0082] A second sub-insulating dam DAM2 and a plurality of main insulating dams 55a, 55b, 55c and 55d made of an organic material are disposed on the intermediate insulating layer 150. The second sub-insulating dam DAM2 and the plurality of main insulating dams 55a, 55b, 55c and 55d provide a step to block a path of moisture infiltrating from the through hole 210 to the organic light emitting element (OLED).

[0083] The second sub-insulating dam DAM2 is disposed in the wiring area LA and includes a second planarizing portion 160b, a second spacer portion 170b, and a second spacer portion 180b. According to an embodiment of the present invention, the second sub-insulating dam DAM2 may include a second spacer portion 170b and a second spacer portion 180b.

[0084] A plurality of main insulating dams 55a, 55b, 55c, and 55d are provided in the wiring area LA and the peripheral area RA. The main insulating dams 55c and 55d in the peripheral area RA are referred to as second main insulating dams. Figure 5 In the embodiment, two main insulating dams 55a and 55b of the same size are arranged in the wiring area LA, and two main insulating dams 55c and 55d of the same size are arranged in the peripheral area RA. The main insulating dams 55a, 55b, 55c and 55d disconnect the emission layer 370 and disconnect the cathode 270 so that moisture flowing in from the through hole 210 may not be transmitted to the organic light emitting element (OLED) of the display area DA. The main insulating dams 55a, 55b, 55c and 55d may be formed together with any one of the planarization layer 160, the spacer 170 and the spacer 180, and may be formed of a single layer or a plurality of organic layers. The main insulating dams 55a, 55b, 55c and 55d are formed in a shape having a width of the lower surface narrower than the width of the upper surface. For example, an inverted conical shape, an inverted trapezoidal shape, a "T" shape or an undercut shape, etc. may be formed. According to an embodiment of the present invention, the main insulating dams 55 a , 55 b , 55 c , and 55 d may be formed of organic layers of different sizes and shapes.

[0085] The emission layer 370 is disposed on the main insulating dams 55a, 55b, 55c and 55d and the second sub-insulating dam DAM2. The cathode 270 is disposed on the emission layer 370. Here, the emission layer 370 and the cathode 270 may be connected to the anode (hereinafter, Figure 6 191) together form an organic light emitting element (OLED). The emission layer 370 and the cathode 270 are formed above the substrate 100 to cover the main insulating dams 55a, 55b, 55c and 55d and the second sub-insulating dam DAM2 on the intermediate insulating layer 150. However, by the inverted tapered shape of the main insulating dams 55a, 55b, 55c and 55d, the emission layer 370 and the cathode 270 are only formed on the upper surface of the main insulating dams 55a, 55b, 55c and 55d, and are not formed on the side surfaces of the main insulating dams 55a, 55b, 55c and 55d. Due to the main insulating dams 55a, 55b, 55c and 55d, the emission layer 370 and the cathode 270 include a disconnected portion SA. Therefore, in the peripheral area RA and the wiring area LA, the main insulating dams 55a, 55b, 55c and 55d partially disconnect the emission layer 370 or the cathode 270, thereby preventing moisture flowing from the through hole 210 from penetrating into the organic light emitting element (OLED). In the embodiment of the present invention, the disconnection portion SA is a portion where the intermediate insulating layer 150 and the first inorganic encapsulation layer 310 can directly contact each other. The disconnection portion SA can prevent moisture (H 2 O) The organic light emitting element (OLED) penetrates into the display area DA along the interface direction between the layers.

[0086] In addition, the display device according to an embodiment of the present invention can reduce the first non-display area PA1 around the periphery of the through hole 210 by setting a main insulating dam 55 having a size smaller than the first sub-insulating dam DAM1 and the second sub-insulating dam DAM2 in the peripheral area RA and the wiring area LA to form a disconnected portion of the cathode 270 or the emission layer 370.

[0087] The encapsulation layer 300 is disposed on the cathode 270. The encapsulation layer 300 includes a first inorganic encapsulation layer 310, an organic encapsulation layer 320, and a second inorganic encapsulation layer 330. The encapsulation layer 300 is a layer that covers the substrate 100 to prevent moisture from penetrating into the organic light emitting element (OLED), and may have a structure that blocks moisture penetration by including a plurality of inorganic layers and organic layers according to an embodiment.

[0088] The first inorganic encapsulating layer 310 may directly contact the intermediate insulating layer 150 in the disconnected portion SA to prevent the inflow of moisture that may penetrate into the organic light emitting element (OLED) along an interface between the layers.

[0089] In the following, reference Figure 6A display device including the through hole 210 , the first non-display area PA1 , and the display area DA is described.

[0090] Figure 6 is a cross-sectional view illustrating a portion of a display area and a first non-display area in a display device according to an embodiment of the present invention.

[0091] refer to Figure 6 , the display device according to the embodiment of the present invention includes a barrier layer 110, a buffer layer 120, a semiconductor layer 121, a gate wiring layer, a gate insulating layer 130, a data wiring layer, an interlayer insulating layer 140, an intermediate insulating layer 150, an emission layer 370, a cathode 270, a plurality of organic layers and an encapsulation layer 300 sequentially disposed on a substrate 100. The substrate 100, the barrier layer 110, the buffer layer 120, the gate insulating layer 130, the interlayer insulating layer 140, the intermediate insulating layer 150, the emission layer 370, the cathode 270 and the encapsulation layer 300 are formed across the peripheral area RA, the wiring area LA and the display area DA. Here, the substrate 100, the barrier layer 110, the buffer layer 120, the gate insulating layer 130, the interlayer insulating layer 140 and the intermediate insulating layer 150 are connected to the substrate 100. Figure 3 and therefore further description thereof may be omitted.

[0092] The substrate 100 includes a through hole 210. Here, in addition to the substrate 100, the through hole 210 also penetrates a plurality of layers disposed on the substrate 100, the plurality of layers including a barrier layer 110, a buffer layer 120, a gate insulating layer 130, an interlayer insulating layer 140, an intermediate insulating layer 150, an emission layer 370, a cathode 270, an encapsulation layer 300, etc. described later.

[0093] The barrier layer 110 is disposed on the substrate 100 , and the buffer layer 120 is disposed on the barrier layer 110 .

[0094] In the display area DA, a thin film transistor is disposed on the buffer layer 120. The thin film transistor includes a semiconductor layer 121, a gate electrode 131, a source electrode 156, and a drain electrode 155. The gate insulating layer 130 is disposed between the semiconductor layer 121 and the gate electrode 131. The interlayer insulating layer 140 is disposed on the gate electrode 131, and the source electrode 156 and the drain electrode 155 are disposed on the interlayer insulating layer 140. The intermediate insulating layer 150 is disposed over the interlayer insulating layer 140 to cover the source electrode 156 and the drain electrode 155.

[0095] The semiconductor layer 121 may include, for example, amorphous silicon, polycrystalline silicon, or an oxide semiconductor.

[0096] The gate insulating layer 130 and the interlayer insulating layer 140 may include, for example, an inorganic material including oxide or nitride.

[0097] The gate electrode 131 , the source electrode 156 , and the drain electrode 155 may include, for example, a low-resistance metal material.

[0098] The gate electrode 131 is included in a gate wiring layer, and the gate wiring layer in the first non-display area PA1 includes a plurality of gate wirings GL.

[0099] The source electrode 156 and the drain electrode 155 are connected to the semiconductor layer 121 through contact holes formed in the interlayer insulating layer 140. The source electrode 156 and the drain electrode 155 are included in a data wiring layer, and the data wiring layer in the first non-display area PA1 includes a plurality of data wirings DL.

[0100] The intermediate insulating layer 150 is disposed on the interlayer insulating layer 140 to cover the source electrode 156, the drain electrode 155 and the plurality of data wirings DL. The intermediate insulating layer 150 may be made of an inorganic material and may include a portion directly contacting the encapsulation layer 300 to prevent moisture from penetrating into the organic light emitting element (OLED).

[0101] The planarization layer 160 made of an organic material is disposed on the intermediate insulating layer 150. The planarization layer 160 is formed through the display area DA and the non-display areas PA1 and PA2. The planarization layer 160 includes a first planarization layer 161 and a second planarization layer 162.

[0102] The first planarization layer 161 is disposed on the intermediate insulating layer 150 .

[0103] The upper data wiring layer is disposed on the first planarization layer 161. The upper data wiring layer includes a plurality of upper data electrodes. Among the plurality of upper data electrodes, the first upper data electrode 41 is electrically connected to the data wiring DL through a contact hole formed in the first planarization layer 161, and the second upper data electrode 42 is electrically connected to the drain electrode 155 and / or the source electrode 156 through a contact hole 63 formed in the first planarization layer 161.

[0104] The second planarization layer 162 is disposed on the first planarization layer 161 and is formed to cover the upper data wiring layer including the first upper data electrode 41. The first upper data electrode 41 is disposed so that the upper surface thereof is exposed through the opening 61 formed in the second planarization layer 162.

[0105] The anode 191 is disposed on the second planarization layer 162. The anode 191 forms an organic light emitting element (OLED) together with the emission layer 370 and the cathode 270. The first anode 191a directly contacts the upper surface of the first upper data electrode 41 through the opening 61 formed in the second planarization layer 162 to be electrically connected to each other. The second anode 191b is electrically connected to the second upper data electrode 42 through the contact hole 62 formed in the second planarization layer 162. The second upper data electrode 42 is connected to the drain electrode 155 through the contact hole 63 formed in the first planarization layer 161. Therefore, the anode 191 can be connected to the drain electrode 155 of the thin film transistor.

[0106] The spacer 170 is disposed on the anode 191. The spacer 170 includes an opening 64 exposing the anode 191. The red, blue, and green emission layers 370R, 370B, and 370G are disposed in the opening 64 of the spacer 170 disposed in the display area DA. The red, blue, and green emission layers 370R, 370B, and 370G may include an organic light emitting material or an inorganic light emitting material. Figure 6 , red, blue and green emission layers 370R, 370B and 370G are shown, but the positions of the red, blue and green emission layers 370R, 370B and 370G can be changed according to the embodiments of the present invention. In addition, the red, blue and green emission layers 370R, 370B and 370G can refer to some areas of the emission layer 370 formed in the display area DA among the emission layers 370.

[0107] In the first non-display area PA1, the spacer 170 includes a first spacer portion 170a and a third spacer portion 170c. The first spacer portion 170a is disposed on the second planarization layer 162, and the third spacer portion 170c is disposed on the first anode 191a. The first spacer portion 170a may form an insulating dam together with the first planarization portion 160a. For example, the first planarization portion 160a may be a portion of the first planarization layer 161 and a portion of the second planarization layer 162.

[0108] The upper spacers 181, 182 and 183 are disposed on a portion of the spacer 170. The upper spacers 181, 182 and 183 are disposed in a portion of the display area DA and in a non-display area (e.g., PA1). The upper spacers 181, 182 and 183 partially disconnect the emission layer 370 and partially disconnect the cathode 270 to prevent moisture flowing in from the through hole 210 from penetrating into the organic light emitting element (OLED) in the display area DA. The upper spacers 181, 182 and 183 are implemented as a shape having a width of a lower surface narrower than a width of an upper surface. For example, the upper spacers 181, 182 and 183 may be formed to have an inverted conical shape, an inverted trapezoidal shape, a "T" shape or an undercut shape, etc. According to an embodiment of the present invention, the upper spacers 181, 182 and 183 may be formed into different shapes having different sizes, respectively.

[0109] exist Figure 6 , the upper spacers 181, 182, and 183 include a first upper spacer 181, a second upper spacer 182, and a third upper spacer 183 respectively disposed in the peripheral area RA, the wiring area LA, and the display area DA. The first upper spacer 181 is included in the first inverted insulating dam DAM1 in the peripheral area RA together with the first planarization portion 160a and the first spacer portion 170a. The second upper spacer 182 is included in the inverted insulating dam in the wiring area LA together with the third spacer portion 170c. The third upper spacer 183 may form a single layer of the inverted insulating dam in the display area DA.

[0110] The emission layer 370 is provided to cover the upper spacers 181, 182 and 183, the spacer 170, the planarization layer 160, the anode 191, and the red, blue and green emission layers 370R, 370B and 370G. The cathode 270 is provided on the emission layer 370. The emission layer 370 and the cathode 270 are formed to cover the surface of the substrate 100. However, the emission layer 370 and the cathode 270 are formed only on the upper surfaces of the upper spacers 181, 182 and 183 having an inverted tapered shape, and the emission layer 370 and the cathode 270 are not formed on the sides of the upper spacers 181, 182 and 183. The emission layer 370 and the cathode 270 include a plurality of disconnected portions SA based on the upper spacers 181, 182 and 183. Therefore, the upper spacers 181, 182, and 183 disconnect the emission layer 370 or the cathode 270 extending to the display area DA to protect the display element from moisture. In the embodiment of the present invention, at the disconnection portion SA, the intermediate insulating layer 150 and the encapsulation layer 300 may be in direct contact with each other. The disconnection portion SA can prevent moisture (H 2 O) penetrates along the interface between the layers.

[0111] The encapsulation layer 300 is disposed on the cathode 270. The encapsulation layer 300 includes a first inorganic encapsulation layer 310, an organic encapsulation layer 320, and a second inorganic encapsulation layer 330. The encapsulation layer 300 is a layer that can prevent moisture from penetrating into the organic light emitting element (OLED) and covers the substrate 100. According to an embodiment of the present invention, the encapsulation layer 300 may have a structure that prevents moisture from penetrating by including a plurality of inorganic layers and organic layers.

[0112] The first inorganic encapsulation layer 310 may overlap the intermediate insulating layer 150 at the disconnection portion SA. For example, at the disconnection portion SA, the first inorganic encapsulation layer 310 may directly contact the intermediate insulating layer 150 to prevent moisture that may penetrate along the interface between the layers from flowing into the organic light emitting element (OLED). Therefore, moisture is prevented from penetrating into the organic light emitting element (OLED) from the through hole 210.

[0113] Next, with Figure 6 Different display devices, Figure 7 In the embodiment of the present invention, the display device further includes a window 200 .

[0114] Figure 7 is a cross-sectional view of a portion of a display area and a first non-display area of ​​a display device including a window according to an embodiment of the present invention.

[0115] refer to Figure 7 , the window 200 is disposed at the top of the display device and can protect various structures disposed in the lower part of the display device. In addition, the window 200 is made of a transparent material to transmit the internal light generated inside the display device to the outside so that the image can be visually recognized from the outside. The window 200 is disposed on the upper surface of the second inorganic encapsulation layer 330. For example, the window 200 can be attached to the second inorganic encapsulation layer 330 by an adhesive layer. Since the window 200 is formed above the upper surface of the display device, the opening area of ​​the through hole 210 can be protected by the window 200. In addition, light generated from a camera, a flash, a photoelectric sensor, etc., which may be disposed in the through hole 210, can be transmitted to the outside through the window 200.

[0116] While the invention has been shown and described with reference to embodiments thereof, it will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.

Claims

1. A display device, comprising: A substrate comprising a through hole, a peripheral area surrounding the through hole, a wiring area surrounding the peripheral area, and a display area surrounding the wiring area; A gate insulating layer is disposed on the substrate; a gate wiring disposed in the wiring region and on the gate insulating layer; an interlayer insulating layer, disposed on the gate wiring; a data wiring disposed in the wiring region and on the interlayer insulating layer; An intermediate insulating layer is provided on the data wiring; a first main insulating dam disposed in the wiring region and on the intermediate insulating layer, wherein the first main insulating dam includes an organic material, and wherein a width of a lower surface of the first main insulating dam is narrower than a width of an upper surface of the first main insulating dam; An emission layer is disposed on the substrate; as well as a cathode disposed on the emission layer, wherein the emission layer and the cathode are disposed in the peripheral region and the wiring region, and The emission layer and the cathode include a disconnection point based on the first main insulating dam, at which the emission layer and the cathode are disconnected.

2. The display device according to claim 1, further comprising: an encapsulation layer disposed on the cathode, The encapsulation layer includes an inorganic encapsulation layer and an organic encapsulation layer.

3. The display device according to claim 2, wherein: The intermediate insulating layer and the inorganic encapsulation layer are in direct contact at the disconnection point.

4. The display device according to claim 1, further comprising: a first sub-insulating dam disposed in the peripheral region and on the intermediate insulating layer, The first sub-insulating dam includes a plurality of organic layers.

5. The display device according to claim 4, wherein: The plurality of organic layers include: A planarization layer, disposed on the intermediate insulating layer; a spacer disposed on the planarization layer; and A spacer is disposed on the spacer.

6. The display device according to claim 5, further comprising: a second sub-insulating dam disposed in the wiring region and on the intermediate insulating layer, The second sub-insulating dam includes the plurality of organic layers.

7. The display device according to claim 5, wherein: The first main insulating dam is disposed on the same layer as one of the planarization layer, the spacer, and the spacer.

8. The display device according to claim 1, further comprising: At least one second main insulating dam is disposed in the peripheral region.

9. The display device according to claim 1, wherein: The through hole is formed to penetrate the substrate, the gate insulating layer, the interlayer insulating layer, and the intermediate insulating layer.

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