A test module for three-dimensional packaged chips

Abstract

The present invention discloses a test module for a three-dimensional packaged chip, and relates to the technical fields of printed circuit boards and three-dimensional packaged chips. The test module includes a plurality of laminates stacked sequentially from top to bottom, and a signal transfer board arranged between two adjacent laminates. The laminates are each provided with at least one test point pad on both sides, and the test point pads on the front and back sides of the laminates are short-circuited in a one-to-one correspondence. The signal transfer pads are each provided with a signal transfer pad on both sides, and the signal transfer pads on the front and back sides of the signal transfer board are arranged in a one-to-one correspondence. The corresponding signal transfer pads on the front and back sides of the signal transfer board are turned on or off. The signal transfer pads are electrically connected in a one-to-one correspondence with the test point pads of the laminates opposite to them. The test module of the present invention greatly simplifies the test steps, saves development costs, and improves the pass rate of the laminates and the reliability of the laminate tests.

Description

Technical Field

[0001] The present invention relates to the technical field of printed circuit boards and three-dimensional packaged chips, and in particular to a test module for three-dimensional packaged chips. Background Art

[0002] Three-dimensional packaging is a packaging technology that stacks multiple chips (packaged or bare dies) within a single package within a three-dimensional space. Vertical interconnection types within the 3D packaging module stackup (hereafter referred to as the stackup) include direct multi-layer vertical interconnection of single-type devices, multi-layer vertical interconnection of single-type devices via a printed circuit board (PCB), and multi-layer vertical interconnection of hybrid devices via a printed circuit board (PCB).

[0003] Before stacking, each laminate needs to be tested and screened for electrical performance to ensure that the connectivity, electrical performance, and functional characteristics of the finished module meet the design requirements. Currently, laminate testing typically involves planar system joint debugging and single-layer independent testing and verification.

[0004] Planar unfolding testing involves unfolding the individual laminates of a 3D package structure on a flat surface. Each laminate is then placed on a large test board (PCB) at different locations, tested using ejector pins or connectors to verify that the individual laminates meet design requirements. When encountering complex system-level 3D package modules, testing and verification of the entire verification board becomes more complex. This testing method can lead to excessively large test board designs when the number of laminates in a 3D package structure is large.

[0005] Independent testing of single boards involves drawing a dedicated test board to test each laminated board individually. Individual testing is prone to system risks and often results in incomplete testing.

[0006] In the above two test methods, it is also necessary to use a specific fixture to fix each board, and then lead the tested signal line to the test equipment through the test interface to complete the corresponding test; the specific fixture will also make the test process more complicated. Summary of the Invention

[0007] The present invention aims to provide a test module for three-dimensional packaged chips that facilitates testing. The present invention is achieved through the following technical solutions:

[0008] A test module for a three-dimensional packaged chip, comprising a plurality of laminated boards stacked sequentially from top to bottom; characterized in that it also includes a signal transfer board disposed between two adjacent laminated boards; at least one test point pad is disposed on both the front and back sides of the laminated boards, and the test point pads on the front and back sides of the laminated boards are short-circuited in a one-to-one correspondence;

[0009] Signal transfer pads are provided on both the front and back sides of the signal transfer board. The signal transfer pads on the front and back sides of the signal transfer board are provided in a one-to-one correspondence. The corresponding signal transfer pads on the front and back sides of the signal transfer board are turned on or off; the signal transfer pads are electrically connected to the test point pads of the laminate board opposite to them in a one-to-one correspondence.

[0010] Furthermore, connection seats are provided on both the front and back sides of the signal adapter board. The connection seats are protruding from the surface of the signal adapter board, and the signal adapter pads are installed on the connection seats.

[0011] Specifically, the signal transfer pads on the front and back sides of the signal transfer board are connected to each other by connecting a 0-ohm resistor to achieve conduction.

[0012] Specifically, at least one lead bridge pad and at least one lead bridge are provided on the laminated board, each of the lead bridges is connected to at least one lead bridge pad, and the lead bridge pads are connected to the test point pads by wiring.

[0013] Furthermore, each of the lead bridges of the laminated board forms a placement area for placing a plurality of electronic components; and the test point pads are arranged outside the placement area.

[0014] Furthermore, each of the laminated boards and the signal adapter board is correspondingly provided with at least one positioning hole; the positioning holes correspondingly provided on the laminated boards and the signal adapter board are positioned relative to each other in upper and lower positions; the test module also includes a positioning rod passing through the positioning hole.

[0015] Furthermore, each of the laminated boards and the signal adapter board is correspondingly provided with at least one mounting hole; the mounting holes correspondingly provided on the laminated boards and the signal adapter board are positioned opposite to each other in upper and lower positions.

[0016] Specifically, each of the laminated boards and the signal adapter board is a rectangular structure, the mounting holes of the laminated boards are arranged at the four corners of the laminated boards, and the mounting holes of the signal adapter board are arranged at the four corners of the signal adapter board.

[0017] Specifically, the signal transfer pad is electrically connected to the test point pad in a contact manner.

[0018] Beneficial technical effects of the present invention:

[0019] The test module of the three-dimensional packaging structure of the present invention can realize the vertical interconnection test of the three-dimensional packaged chip; compared with the traditional single-piece laminate test and plane unfolding test, the test module of the present invention greatly simplifies the test steps, shortens the design cycle of the test base plate, saves development costs, and improves the pass rate of the laminate and the reliability of the laminate test. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is one of the structural schematic diagrams of the test module for the three-dimensional packaged chip provided by an embodiment of the present invention (each layer is in an electrically disconnected state);

[0021] Figure 2 This is the second structural diagram of the test module for the three-dimensional packaged chip provided by an embodiment of the present invention (each layer is in an electrically disconnected state);

[0022] Figure 3 A side view of a test module for a three-dimensional packaged chip provided by an embodiment of the present invention (with the layers not electrically connected);

[0023] Figure 4 is a top view of a first laminate provided by an embodiment of the present invention;

[0024] Figure 5 is a top view of a first signal adapter board provided in an embodiment of the present invention;

[0025] Description of Figure Numbers:

[0026] 110-first laminate, 111-test point pad, 112-lead bridge pad, 113-lead bridge, 114-positioning hole, 115-electronic component, 116-mounting hole, 117-first PCB substrate, 120-second laminate, 130-third laminate, 140-fourth laminate; 210-first signal transfer board, 211-signal transfer pad, 212-0 ohm resistor, 213-connecting seat, 214-positioning hole, 216-mounting hole, 220-second signal transfer board, 230-third signal transfer board, 310-positioning rod. DETAILED DESCRIPTION

[0027] The present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments.

[0028] It should be noted that, unless otherwise specified, all technical and scientific terms used in this solution have the same meanings as commonly understood by ordinary technicians in the technical field to which this solution belongs.

[0029] Combine Figures 1 to 3This embodiment provides a three-dimensional packaging structure, which includes, from top to bottom, a first laminate 110, a first signal transfer board 210, a second laminate 120, a second signal transfer board 220, a third laminate 130, a third signal transfer board 230, and a fourth laminate 140 stacked together.

[0030] Combine Figure 4 , taking the first laminate 110 as an example, the structure of each laminate is explained; the first laminate 110 includes a first PCB substrate 117 and a plurality of electronic components 115 soldered on the first PCB substrate 117; at least one test point pad 111 is provided on both the front and back sides of the first laminate 110, and the front and back sides of the first laminate 110 mentioned here are also the front and back sides of the first PCB substrate 117. The test point pads 111 on the front and back sides of the first laminate 110 are short-circuited one by one, so that the first laminate 110 can be connected to other structures for signals on both the front and back sides.

[0031] The first laminate 110 is provided with at least one lead bridge pad 112 and at least one lead bridge 113. Each lead bridge 113 is connected to at least one lead bridge pad 112. The lead bridge pads 112 are electrically connected to the test point pads 111 on the first PCB substrate 117. Specifically, the lead bridge 113 is connected to the lead bridge pads 112 at both ends; the lead bridge 113 is used to achieve electrical connection between the lead bridge pads 112 at both ends; the test point pads 111 are used for electrical testing of the first laminate 110 to ensure the integrity of the electrical assembly.

[0032] In this embodiment, each lead bridge 113 forms a rectangular placement area for placing a plurality of electronic components 115. Each lead bridge pad 112 is distributed on both sides of the placement area, and each test point pad 111 is arranged outside the placement area. Specifically, the test point pads 111 are arranged in two rows or columns on the upper, lower, left, and right sides of the outside of the placement area. The shape, number, and placement relationship of the test point pads 111, lead bridge pads 112, and lead bridge 113 can be determined according to actual conditions. For example, the lead bridge 113 can form a circle, and the test point pads 111 can be arranged in any number of rows or columns, or can form one or more arcs.

[0033] In this embodiment, the first laminate 110 has a rectangular structure. The first laminate 110 is further provided with two symmetrical positioning holes 114 and mounting holes 116 disposed at four corners of the first laminate 110 . The mounting holes 110 are located outside the placement area.

[0034] The electronic components 115 on the first laminate 110 may be, but are not limited to, one or more of a resistor, a capacitor, a CPU, a FLASH, a crystal oscillator, and a reset chip.

[0035] The structures of the other laminated boards are identical to those of the first laminated board 110, except that the electronic components 115 soldered thereto are different (although they may be identical electronic components). The structures of the other laminated boards are not further described here. Preferably, the positions and sizes of the test point pads on each laminated board in this embodiment are identical, so that the upper and lower positions are aligned when stacked.

[0036] Combine Figure 5 , taking the first signal transfer board 210 as an example, the structure of each signal transfer board is explained: the first signal transfer board 210 is provided with a connection seat 213 on both the front and back sides, and each connection seat 213 is installed with at least one signal transfer pad 211; the signal transfer pads 211 on the front and back sides of the first signal transfer board 210 are provided in a one-to-one correspondence, and the signal transfer pads 211 on the front and back sides correspondingly provided on the first signal transfer board 210 are turned on or off; specifically, the signal transfer pads 211 on the front and back sides correspondingly provided on the first signal transfer board 210 are connected by a 0 ohm resistor 212 to achieve conduction. In actual applications, whether to connect a 0-ohm resistor to the signal transfer pads 211 on the front and back sides of the first signal transfer board 210 is determined based on the laser engraving pattern or schematic diagram of the three-dimensional packaged chip. The signal transfer pads are electrically connected in a one-to-one correspondence with the test point pads on the corresponding laminated board. That is, the signal transfer pads 211 on the front side of the first signal transfer board 210 are electrically connected in a one-to-one correspondence with the test point pads 111 on the back side of the first laminated board 110, and the signal transfer pads 211 on the back side of the first signal transfer board 210 are electrically connected in a one-to-one correspondence with the test point pads on the front side of the second laminated board 120.

[0037] The first signal adapter board further includes two symmetrical positioning holes 214 and mounting holes 216 disposed at four corners.

[0038] The structures of the other signal transfer boards are the same as the structure of the first signal transfer board 210, and the shapes of the various signal transfer boards are the same as the shapes of the various laminates, and are all rectangular structures; the positions of the positioning holes of the various signal transfer boards are vertically opposite to the positions of the positioning holes of the various laminates, so that when the positioning holes are inserted into the positioning rods 310, the edges of the various signal transfer boards and the various laminates are aligned; the positions of the mounting holes of the various signal transfer boards are vertically opposite to the positions of the mounting holes of the various laminates, so that it is convenient to insert bolts to achieve the fixation of each layer of the boards and the electrical connection of adjacent boards, that is, the signal transfer pads on the front of each layer of the signal transfer board are electrically connected to the test point pads on the back of the upper layer of the laminate, and the signal transfer pads on the back of each layer of the signal transfer board are electrically connected to the test point pads on the front of the laminate on the next layer; the signal transfer board plays the role of signal transfer of each layer of the laminate. Specifically, the signal transfer pads are electrically connected to the test point pads in a contact manner. In other embodiments, the signal transfer pad and the test point pad may also be connected by plug-in electrical connection or other electrical connection means commonly used in the art.

[0039] The three-dimensional packaging structure also includes two positioning rods 310 passing through each positioning hole (including the positioning holes of the signal transfer board and the positioning holes of the laminate board). The positioning rods 310 can achieve precise positioning of each layer of signal transfer board and the laminate board, thereby facilitating contact electrical connection of each layer of board.

[0040] The production and assembly process of the three-dimensional packaged chip of this embodiment is as follows:

[0041] (1) Assembly of the test module.

[0042] From bottom to top (or top to bottom), the positioning holes of each stacked board and the signal transfer board are sequentially inserted into the two positioning rods 310 to achieve vertical alignment of the pads on each board. Bolts (not shown) are then inserted into the mounting holes of each board and tightened to secure the boards. Once installed, the test signals of each board are vertically interconnected via the signal transfer pads and test point pads. Once the bolts are installed, the positioning rods 310 can be removed.

[0043] (2) Testing of test modules.

[0044] During the test, the bottom layer of laminated board (the fourth laminated board 140 in this embodiment) is connected to the test socket of the test base plate (not shown in the figure), and the test point pads of the bottom layer of laminated board are electrically connected to the test receiving pads on the test socket of the test base plate; the test base plate is also provided with a power input interface, JTAG and serial port, etc., and finally a full-function test is written to verify whether there is any abnormality in the three-dimensional test module placed on the test base plate; the invention is to conduct electrical performance and functional tests on the three-dimensional packaging structure as a whole, and can complete the test at one time without occupying a large space, which not only saves the occupied area of ​​the test base plate, but also greatly shortens the design cycle of the test base plate.

[0045] (3) The test module is prepared into a finished three-dimensional packaged chip through processes such as glue filling, cutting, and laser engraving. The process of this step is the conventional process flow of three-dimensional packaged chips, and the details will not be repeated here.

[0046] The test module for the three-dimensional packaged chip of this embodiment realizes three-dimensional interconnected vertical testing of multiple laminated boards by adding signal adapter boards between the laminated boards; a signal adapter board is added between the laminated boards, and the upper and lower layer signals are turned on and off by whether a 0-ohm resistor is connected on the signal adapter board, thereby realizing three-dimensional interconnected vertical testing; compared with traditional related applications, this embodiment greatly simplifies the test steps, shortens the design cycle of the test baseboard, saves development costs, and improves the pass rate of the laminated boards and the reliability of the laminated board testing.

[0047] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements that fall within the spirit and principles of the present invention and do not involve inventive steps shall be included within the scope of protection of the present invention.

Claims

1. A test module for a three-dimensional packaged chip, comprising a plurality of laminated boards stacked in sequence from top to bottom; characterized in that: It also includes a signal transfer board arranged between two adjacent laminated boards; at least one test point pad is provided on both the front and back sides of the laminated board, and the test point pads on the front and back sides of the laminated board are short-circuited in a one-to-one correspondence; The signal transfer pads are provided on both the front and back sides of the signal transfer board. The signal transfer pads on the front and back sides of the signal transfer board are provided in a one-to-one correspondence. The corresponding signal transfer pads on the front and back sides of the signal transfer board are connected or disconnected. The signal transfer pads are electrically connected to the test point pads on the laminate board opposite to them in a one-to-one correspondence. It also includes a test seat, and each test point pad of the bottom layer of the laminated board is electrically connected to the test receiving pad on the test seat.

2. The test module according to claim 1, wherein: Connecting seats are further provided on both the front and back sides of the signal adapter board. The connecting seats protrude from the surface of the signal adapter board, and the signal adapter pads are mounted on the connecting seats.

3. The test module according to claim 1, wherein: The signal transfer pads on the front and back sides of the signal transfer board are connected to each other by connecting a 0-ohm resistor to achieve conduction.

4. The test module according to claim 1, wherein: At least one lead bridge pad and at least one lead bridge are provided on the laminated board, each of the lead bridges is connected to at least one lead bridge pad, and the lead bridge pads are connected to the test point pads by wiring.

5. The test module according to claim 4, characterized in that: Each of the lead bridges of the laminated board forms a placement area for placing a plurality of electronic components; the test point pads are arranged outside the placement area.

6. The test module according to claim 1, wherein: Each of the laminated boards and the signal transfer board is correspondingly provided with at least one positioning hole; the positioning holes correspondingly provided on the laminated boards and the signal transfer board are positioned opposite to each other in upper and lower positions; the test module further includes a positioning rod passing through the positioning hole.

7. The test module according to claim 1, wherein: At least one mounting hole is correspondingly provided on each of the laminated boards and the signal adapter board; the mounting holes correspondingly provided on the laminated boards and the signal adapter board are positioned opposite to each other in upper and lower positions.

8. The test module according to claim 7, wherein: Each of the laminated boards and the signal adapter board is a rectangular structure. The mounting holes of the laminated boards are arranged at the four corners of the laminated boards, and the mounting holes of the signal adapter board are arranged at the four corners of the signal adapter board.

9. The test module according to any one of claims 1 to 8, wherein: The signal transfer pad is electrically connected to the test point pad in a contact manner.

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