A spectral dimming packaging structure and a manufacturing method thereof

Abstract

The present invention relates to a spectral dimming package structure, characterized in that: it includes at least one first CSP chip, the first CSP chip includes a violet chip, and a first encapsulation layer coated on the outer surface of the violet chip; at least one second CSP chip, the second CSP chip includes a blue chip, and a second encapsulation layer coated on the outer surface of the blue chip; and an outer encapsulation layer for encapsulating the first and second CSP chips; a number of blue phosphor particles disposed at least in the first encapsulation layer and not within the second encapsulation layer; a number of yellow-green phosphor particles disposed only within the second encapsulation layer; and a number of red phosphor particles disposed in the outer encapsulation layer and / or at least one of the second encapsulation layers. The spectral dimming package structure of the present invention has higher luminous efficiency and spectral integrity.

Description

Technical Field

[0001] The present invention relates to a spectral dimming packaging structure, and also relates to a method for manufacturing a spectral dimming packaging structure. Background Art

[0002] High-quality LED lighting should have characteristics such as high color rendering index, high luminous efficiency, safety and comfort for the human eye. Technically speaking, there are mainly two solutions to achieve full-spectrum LEDs.

[0003] The first solution is to use a blue chip to excite multi-color phosphors and improve the color rendering index by improving the phosphors. Technically, it is necessary to obtain a cyan phosphor with high excitation efficiency, and further improve the excitation efficiency of yellow, green, and red phosphors, while improving the related packaging technology. The advantage of this method is that the technical difficulty is relatively small, but there is still a strong emission intensity of short-wavelength blue light, which cannot compensate for the spectral intensity near 480nm, and the spectral continuity is insufficient, so there is a large difference from sunlight.

[0004] The second solution is to use a violet chip to excite multi-color phosphors to achieve a continuous spectrum, but it can achieve the maximum approximation to the solar spectrum. However, this solution has low luminous efficiency and high cost.

[0005] Currently, people are increasingly concerned about healthy lighting, that is, they hope for a wider emission spectrum and a higher color rendering index. Compared with multi-wavelength excitation, the emission spectrum of single-wavelength excitation light is relatively narrow and the color rendering index is relatively low, which cannot meet the requirements of a wide spectrum and high color rendering index. Innovating the phosphor technology to improve the luminous efficiency of LED packaging and improve the light color quality is the development trend of LED phosphor technology. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to provide a spectral dimming packaging structure that can effectively increase spectral continuity, complement the spectrum near 480nm, and improve the overall luminous efficiency; and can reduce the intensity of the violet excitation peak and the intensity of the short-wavelength blue excitation peak. The present invention also provides a preparation method for the spectral dimming packaging structure.

[0007] To solve the above technical problems, the technical solution of the present invention is: A spectral dimming packaging structure, the innovation of which lies in: including

[0008] At least one first CSP chip disposed on a substrate, the first CSP chip includes a violet chip, and a first encapsulation layer covering the outer surface of the violet chip;

[0009] At least one second CSP chip disposed on the substrate, the second CSP chip includes a blue chip, and a second encapsulation layer covering the outer surface of the blue chip;

[0010] An outer encapsulation layer for integrally encapsulating the first CSP chip and the second CSP chip on a substrate;

[0011] A number of blue phosphor particles disposed at least within the first encapsulation layer and not within the second encapsulation layer;

[0012] A number of yellow-green phosphor particles disposed only within the second encapsulation layer;

[0013] A number of red phosphor particles disposed in the outer encapsulation layer and / or at least one of the second encapsulation layers;

[0014] Define the refractive index of the first encapsulation layer as n1, the refractive index of the second encapsulation layer as n2, and the refractive index of the outer encapsulation layer as n3, where n3 ≥ n1 > n2.

[0015] Furthermore, there is at least one second CSP chip, and the red phosphor particles are disposed at least within the second encapsulation layer; the red phosphor particles in the second encapsulation layer account for 50 - 100 wt% of the total mass of all red phosphor particles.

[0016] Preferably, there are at least two second CSP chips, and the yellow-green phosphor particles and the red phosphor particles are respectively disposed in the second encapsulation layers of different second CSP chips.

[0017] Preferably, the second CSP chip provided with red phosphor particles is preferably located between the first CSP chip and the second CSP chip provided with yellow-green phosphor particles.

[0018] Preferably, the upper surface of the outer encapsulation layer has a number of arc-shaped protrusions and arc-shaped depressions disposed at intervals. The arc-shaped protrusions are directly above the top surfaces of each first CSP chip and second CSP chip, and the arc-shaped depressions are located between adjacent first CSP chips and second CSP chips; the highest point of the arc-shaped protrusion is not lower than the upper surfaces of the first CSP chip and the second CSP chip, and the lowest point of the arc-shaped depression is not higher than the upper surfaces of the first CSP chip and the second CSP chip.

[0019] Preferably, the highest point of the arc-shaped protrusion is not lower than the upper surfaces of the first CSP chip and the second CSP chip by 40 microns; the lowest point of the arc-shaped depression is not higher than the upper surfaces of the first CSP chip and the second CSP chip by 80 microns.

[0020] Preferably, the peak wavelength of the blue light chip is 430 - 460 nm, and the peak wavelength of the ultraviolet light chip is 390 - 420 nm.

[0021] Preferably, each of the first CSP chips and the second CSP chips is electrically connected to form a circuit, and one first CSP chip and one second CSP chip are connected in series; when there are parallel connections in the circuit, the total number of chips in each parallel branch is equal, and the number and connection method of the first CSP chips between the branches are the same, and the number and connection method of the second CSP chips between the branches are the same.

[0022] A method for manufacturing a spectral dimming packaging structure is also provided, which is characterized in that:

[0023] S1: Fabrication of each chip

[0024] Fabricate the first CSP chip, the first CSP chip includes a violet chip, and a first encapsulation layer coated on the outer surface of the violet chip; add blue phosphor particles in the first encapsulation layer;

[0025] Fabricate the second CSP chip, the second CSP chip includes a blue chip, and a second encapsulation layer coated on the outer surface of the blue chip;

[0026] In this step S1, the fabrication of the second CSP chip is divided into three methods:

[0027] The first method: only yellow-green phosphor particles are added in the second encapsulation layer of all the second CSP chips, and no red phosphor particles are included;

[0028] The second method: both yellow-green phosphor particles and red phosphor particles are added in the second encapsulation layer of all the second CSP chips;

[0029] The third method: only yellow-green phosphor particles are added in the second encapsulation layer of at least one second CSP chip, and only red phosphor particles are added in the second encapsulation layer of the remaining second CSP chips;

[0030] Control the refractive index n1 of the first encapsulation layer of the first CSP chip to be greater than the refractive index n2 of the second encapsulation layer of the second CSP chip;

[0031] S2: Pre-control of color temperature

[0032] Fix the first CSP chip and the second CSP chip at corresponding positions on the substrate;

[0033] Light up the first CSP chip, and obtain the color point position corresponding to it on the CIE chromaticity diagram after the first CSP chip is lit, denoted as point A (X1; Y1);

[0034] Light up all the second CSP chips at the same time, and obtain the color point position or the mixed color point position corresponding to them on the CIE chromaticity diagram after all the second CSP chips are lit, denoted as point B (X2; Y2);

[0035] Light up all the chips simultaneously, and obtain the position of the mixed color point corresponding to each chip after lighting up on the CIE chromaticity diagram, denoted as point C (X3; Y3);

[0036] S3: Fabrication of the outer encapsulation layer, which is divided into two steps: step S3a and step S3b:

[0037] S3a: First, according to the color temperature requirement of the final spectral dimming encapsulation structure, find the color point coordinates corresponding to this final color temperature on the Planckian locus of the CIE chromaticity diagram, denoted as point D (X4; Y4);

[0038] Based on the known point C (X3; Y3) and point D (X4; Y4), obtain the specific coordinate values or coordinate ranges of the color point position E point (X5; Y5) corresponding to the outer encapsulation layer on the CIE chromaticity diagram;

[0039] S3b: Then, according to the need, choose to add blue phosphor particles and red phosphor particles, or only add blue phosphor particles, or only add red phosphor particles into the encapsulation material of the outer encapsulation layer;

[0040] Then, control the peak wavelengths and powder amounts of the blue phosphor particles and red phosphor particles respectively according to the coordinate values or coordinate ranges of this E point (X5; Y5) to fabricate the outer encapsulation layer, and control the refractive index n3 of the outer encapsulation layer to be n3≥n1;

[0041] If only blue phosphor particles are added into the encapsulation material of the outer encapsulation layer, it is necessary to first judge whether the specific coordinate values or coordinate ranges of the E point (X5; Y5) fall within the color coordinate range corresponding to the peak wavelength range of the blue phosphor particles. If they do not fall within the color coordinate range corresponding to the peak wavelength range of the blue phosphor particles, then take the known point A (X1; Y1) and point B (X2; Y2) as references, readjust the peak wavelengths and powder amounts of various phosphor particles in the first encapsulation layer and the second encapsulation layer, and then repeat S3a to make the specific coordinate values or coordinate ranges of the E point (X5; Y5) fall within the color coordinate range corresponding to the peak wavelength range of the blue phosphor particles;

[0042] If only red phosphor particles are added into the encapsulation material of the outer encapsulation layer, it is necessary to first judge whether the specific coordinate values or coordinate ranges of the E point (X5; Y5) fall within the color coordinate range corresponding to the peak wavelength range of the red phosphor particles. If they do not fall within the color coordinate range corresponding to the peak wavelength range of the red phosphor particles, then take the known point A (X1; Y1) and point B (X2; Y2) as references, readjust the peak wavelengths and powder amounts of various phosphor particles in the first encapsulation layer and the second encapsulation layer, and then repeat S3a to make the specific coordinate values or coordinate ranges of the E point (X5; Y5) fall within the color coordinate range corresponding to the peak wavelength range of the red phosphor particles;

[0043] S4: Testing.

[0044] Preferably, in the above step S3, the upper surface of the outer encapsulation layer is integrally formed with a plurality of arc-shaped protrusions and arc-shaped pits arranged at intervals. The arc-shaped protrusions are directly above the top surfaces of each first CSP chip and the second CSP chip, and the arc-shaped pits are located between adjacent first CSP chips and the second CSP chip, or between adjacent first CSP chips, or between adjacent second CSP chips.

[0045] The advantages of the present invention are as follows:

[0046] In the present invention, by selecting the distribution of phosphor particles with corresponding peak wavelengths in the first CSP chip, the second CSP chip and the outer encapsulation layer, and combining the optical refractive index to control the propagation of light, the blue light of the first CSP chip enters the second CSP chip as little as possible, avoiding the absorption of blue light in the range of 450 nm to 480 nm by the yellow-green phosphor particles, especially the blue light around 480 nm; and the light at a part of the angles of the first CSP chip and the second CSP chip can be avoided from entering the outer encapsulation layer and undergoing total reflection, with higher light efficiency and higher spectral integrity.

[0047] Only the blue phosphor near 480 nm is used to wrap the 5 light-emitting surfaces of the violet chip except the electrode surface in the first CSP chip, which can maximize the utilization of the 480 nm fluorescence spectrum generated by the excitation of the violet chip and can also maximize the limitation of the emission of violet light. The second CSP chip contains all the yellow-green phosphor particles, while the outer encapsulation layer does not contain yellow-green phosphor particles. The second CSP chip contains more than 50% of the red phosphor particles, while the outer encapsulation layer contains the remaining red phosphor particles. At the same time, the remaining blue phosphor near 480 nm can be added to the outer encapsulation layer as needed. The refractive index of the first encapsulation layer is n1, the refractive index of the second encapsulation layer is n2, and the refractive index of the outer encapsulation layer is n3, and n3≥n1>n2 is satisfied. The first CSP chip and the second CSP chip are one or more in series, and if necessary, they are connected in parallel after being connected in series. This packaging form has the following advantages:

[0048] 1. The peak value of violet light can be limited to the maximum extent.

[0049] 2. The long-wavelength blue fluorescence near 480 nm generated by the excitation of the violet chip can be utilized with the highest efficiency as much as possible.

[0050] 3. The refractive index n2 of the second encapsulation layer is simultaneously less than the refractive index n1 of the first encapsulation layer and the refractive index n3 of the outer encapsulation layer, which can maximize the emission of the long-wavelength blue light near 480 nm.

[0051] 4. The upper surface is integrally formed with arc-shaped protrusions and arc-shaped depressions, which reduces the optical waveguide path between the first CSP chip and the second CSP chip, thereby reducing the absorption of the second encapsulation layer for long-wavelength 480-nm blue light; and the arc-shaped structure is conducive to the emission of the light beams of the first and second CSP chips respectively.

[0052] 5. It can minimize harmful short-wavelength blue light of 400 - 460 nm. Since white light is formed by the three primary colors of blue, green, and red. And this solution can generate rich long-wavelength blue light. At the same time, the short-wavelength blue light in the second CSP chip can independently adjust the emission intensity by the yellow, green, red, and pink phosphors therein. Therefore, it can maximize the use of beneficial long-wavelength blue light near 480 nm to replace harmful short-wavelength blue light of 400 - 460 nm.

[0053] 6. Since there are significant differences in the relationship between the voltage and current of the violet and blue chips respectively, when there is a parallel connection in the circuit, the total number of chips in each parallel branch is controlled to be equal, and the number and connection method of the first and second CSP chips between the branches are the same, avoiding instability of the synthesized spectrum, color temperature, and color point when the power changes.

[0054] 7. The color temperature distribution of the package is more uniform at different emission angles. Description of the Drawings

[0055] Figure 1 It is a schematic diagram of the spectral dimming package structure of the present invention.

[0056] Figure 2 It is a schematic diagram of the spectral dimming package structure of Embodiment 1 of the present invention.

[0057] Figure 3 It is a spectrogram of the spectral dimming package structure of Embodiment 1 of the present invention.

[0058] Figure 4 It is a schematic diagram of the spectral dimming package structure of Embodiment 2 of the present invention.

[0059] Figure 5 It is a spectrogram of the spectral dimming package structure of Embodiment 2 of the present invention.

[0060] Figure 6 It is a color temperature spatial distribution diagram of the package structure of Embodiment 2 of the present invention.

[0061] Figure 7 It is a schematic diagram of the spectral dimming package structure of Embodiment 3 of the present invention.

[0062] Figure 8 It is a spectrogram of the spectral dimming package structure of Embodiment 3 of the present invention.

[0063] Figure 9It is the color temperature space distribution diagram of the encapsulation structure in the third embodiment of the present invention.

[0064] Figure 10 It is the schematic diagram of the spectral dimming encapsulation structure in the fourth embodiment of the present invention.

[0065] Figure 11 It is the schematic diagram of the spectral dimming encapsulation structure in the fifth embodiment of the present invention.

[0066] Figure 12 It is the spectrogram of the spectral dimming encapsulation structure in the fifth embodiment of the present invention.

[0067] Figure 13 It is the color temperature space distribution diagram of the encapsulation structure in the fifth embodiment of the present invention.

[0068] Figure 14 It is the schematic diagram of the spectral dimming encapsulation structure in Comparative Example 1 of the present invention.

[0069] Figure 15 It is the spectrogram of the spectral dimming encapsulation structure in Comparative Example 1 of the present invention.

[0070] Figure 16 It is the schematic diagram of the spectral dimming encapsulation structure in Comparative Example 2 of the present invention.

[0071] Figure 17 It is the spectrogram of the spectral dimming encapsulation structure in Comparative Example 2 of the present invention.

[0072] Figure 18 It is the schematic diagram of the spectral dimming encapsulation structure in Comparative Example 3 of the present invention.

[0073] Figure 19 It is the spectrogram of the spectral dimming encapsulation structure in Comparative Example 2 of the present invention.

[0074] Figure 20 It is the schematic diagram of one of the ways of electrically connecting the first and second CSP chips of the present invention. Detailed implementation manners

[0075] The spectral dimming encapsulation structure in the present invention, as Figure 1 shown, includes

[0076] at least one first CSP chip disposed on the substrate 4, the first CSP chip includes a violet chip 11, and a first encapsulation layer 12 covering the outer surface of the violet chip 11;

[0077] at least one second CSP chip disposed on the substrate 4, the second CSP chip includes a blue chip 21, and a second encapsulation layer 22 covering the outer surface of the blue chip 21;

[0078] An outer encapsulation layer 5 for integrally encapsulating the first CSP chip and the second CSP chip on a substrate 4;

[0079] A number of blue phosphor particles 6, the blue phosphor particles 6 are disposed at least within the first encapsulation layer 12 and not within the second encapsulation layer 22; the peak wavelength of the blue phosphor particles is between 470 and 500 nm;

[0080] A number of yellow-green phosphor particles 7, the yellow-green phosphor particles 7 are only disposed within the second encapsulation layer 22; the reason is that since the yellow-green phosphor particles 7 absorb blue light with a short wavelength such as 450 nm, but also absorb blue light with a long wavelength such as 480 nm, and absorb less violet light, so by adopting the method of accumulating the yellow-green phosphor particles 7 within the second encapsulation layer 22 rather than the outer encapsulation layer 5, the blue light emitted by the first CSP chip absorbed by the yellow-green phosphor particles can be minimized, especially the blue light around 480 nm, avoiding the depression in the spectral range around 480 nm, and at the same time further reducing the proportion of violet light in the spectrum.

[0081] A number of red phosphor particles 8, the red phosphor particles 8 are disposed in the outer encapsulation layer 5 and / or at least one second encapsulation layer 22;

[0082] Define the refractive index of the first encapsulation layer 12 as n1, the refractive index of the second encapsulation layer 22 as n2, and the refractive index of the outer encapsulation layer 5 as n3, where n3 ≥ n1 > n2.

[0083] As a specific embodiment of the present invention: there is at least one second CSP chip, and the red phosphor particles 8 are at least disposed in the second encapsulation layer 22, and the red phosphor particles 8 in the second encapsulation layer 22 account for 50 to 100 wt% of the total mass of all red phosphor particles.

[0084] That is, in the entire encapsulation structure, as much as possible, most or even all of the red phosphor particles 8 are placed within the second encapsulation layer 22 of the second CSP chip. Avoid a large number of red phosphor particles in the outer encapsulation layer 5 from absorbing violet light. Of course, as a preference, most of the red phosphor particles 8 are preferably placed within the second encapsulation layer 22 and a small part is located within the outer encapsulation layer 5, so as to avoid the problem of poor color temperature consistency at different angles caused by all the red phosphor particles 8 being wrapped on the surface of the blue light chip. As a further preference, the content of the red phosphor particles 8 within the outer encapsulation layer accounts for 20 to 30 wt% of the total red phosphor particles, and the content of the red phosphor particles 8 within the second encapsulation layer 22 accounts for 70 to 80 wt% of the total red phosphor particles, which can solve the problem of poor color temperature consistency at different angles.

[0085] As another specific embodiment of the present invention: there are at least two second CSP chips, and the yellow-green phosphor particles 7 and the red phosphor particles 8 are respectively located in the second encapsulation layers 22 of different second CSP chips, which is beneficial to achieving the purpose of spectrum adjustment by directly controlling the number of the second CSP chips containing only yellow-green phosphor particles 7 and the second CSP chips containing only red phosphor particles 8 in the COB encapsulation.

[0086] In addition, it is convenient to place the second CSP chip provided with red phosphor particles as much as possible between the first CSP chip and the second CSP chip provided with yellow-green phosphor particles, reducing the amount of blue light with a wavelength of 450 nm to 480 nm emitted by the first CSP chip entering the second encapsulation layer containing yellow-green phosphor particles, so that the blue light emitted by the first CSP chip is absorbed by the yellow-green phosphor particles as little as possible, improving the integrity of the spectrum.

[0087] In the present invention, a plurality of arc-shaped protrusions 5a and arc-shaped pits 5b arranged at intervals can be integrally formed on the upper surface of the outer encapsulation layer 5. The arc-shaped protrusions 5a are directly above the top surfaces of the first CSP chips and the second CSP chips, and the arc-shaped pits 5b are located between adjacent first CSP chips and second CSP chips. And the highest point of the arc-shaped protrusion 5a is higher than the upper surfaces of the first CSP chip and the second CSP chip, and the lowest point of the arc-shaped pit 5b is lower than the upper surfaces of the first CSP chip and the second CSP chip. Of course, the lowest point of the arc-shaped pit 5b needs to be higher than the upper surface of the substrate 4 to protect the upper surface of the substrate 4.

[0088] Generally, the highest point of the arc-shaped protrusion is not lower than 40 microns above the upper surfaces of the first CSP chip and the second CSP chip; the lowest point of the arc-shaped pit is not higher than 80 microns above the upper surfaces of the first CSP chip and the second CSP chip.

[0089] In addition, the projected outlines of the outer surfaces of the arc-shaped protrusions 5a on the top surfaces of the first CSP chip and the second CSP chip completely cover and exceed the edges of the top surfaces of the first CSP chip and the second CSP chip respectively.

[0090] This method can reduce the optical waveguide path between the first CSP chip and the second CSP chip, and the amount of light emitted by the violet chip exciting the blue phosphor entering the second encapsulation layer containing yellow-green phosphor particles will be reduced; and the waveguide surface on the top surface of the outer encapsulation layer is damaged, which is not conducive to forming continuous total reflection, and is beneficial to the emission of the light beams of the first and second CSP chips.

[0091] In addition, in the packaging structure of the present invention, each first CSP chip and the second CSP chip are electrically connected to form a circuit, and one first CSP chip and the second CSP chip are connected in series with each other; when there is a parallel connection in the circuit, the total number of chips in each parallel branch is equal, and the number and connection method of the first CSP chips between the branches are the same, and the number and connection method of the second CSP chips between the branches are the same. Figure 20 Figure 20 shows one of the connection methods. The circuit includes two main branches Z1 and Z2 connected in parallel with each other. The two main branches Z1 and Z2 have the same number and the same connection method of the first CSP chips 1 and the second CSP chips 2. When there are two branch roads F11 and F12 connected in parallel on the main branch Z1 or Z2, if there are two second CSP chips 2 connected in series on the branch road F11, then there are also only two second CSP chips 2 on the branch road F12, and the two second CSP chips 2 on the branch road F12 are also connected in series.

[0092] The top surface of the outer encapsulation layer 5 can also be provided with microstructures.

[0093] The manufacturing method of the spectral dimming packaging structure of the present invention is as follows:

[0094] S1: Fabrication of each chip

[0095] Fabricate the first CSP chip. The first CSP chip includes a violet chip and a first encapsulation layer covering the outer surface of the violet chip; add blue phosphor particles in the first encapsulation layer;

[0096] Fabricate the second CSP chip. The second CSP chip includes a blue chip and a second encapsulation layer covering the outer surface of the blue chip;

[0097] In this step S1, the fabrication of the second CSP chip is divided into three methods:

[0098] The first method: Only yellow-green phosphor particles are added in the second encapsulation layer of all the second CSP chips, and no red phosphor particles are included;

[0099] The second method: Both yellow-green phosphor particles and red phosphor particles are added in the second encapsulation layer of all the second CSP chips;

[0100] The third method: Only yellow-green phosphor particles are added in the second encapsulation layer of at least one second CSP chip, and only red phosphor particles are added in the second encapsulation layer of the remaining second CSP chips;

[0101] Control the refractive index n1 of the first encapsulation layer of the first CSP chip to be greater than the refractive index n2 of the second encapsulation layer of the second CSP chip;

[0102] S2: Pre-control of color temperature

[0103] Fix the first CSP chip and the second CSP chip at the corresponding positions on the substrate;

[0104] Light up the first CSP chip, and obtain the color point position corresponding to it on the CIE chromaticity diagram after the first CSP chip is lit, denoted as point A (X1; Y1);

[0105] Light up all the second CSP chips simultaneously, and obtain the color point positions or mixed color point positions corresponding to them on the CIE chromaticity diagram after all the second CSP chips are lit, denoted as point B (X2; Y2);

[0106] Light up all the chips simultaneously, and obtain the mixed color point position corresponding to them on the CIE chromaticity diagram after all the chips are lit, denoted as point C (X3; Y3);

[0107] S3: Fabrication of the outer encapsulation layer, which is divided into two steps: step S3a and step S3b:

[0108] S3a: First, according to the color temperature requirement of the final spectral dimming encapsulation structure, find the color point coordinates corresponding to this final color temperature on the Planck locus of the CIE chromaticity diagram, denoted as point D (X4; Y4);

[0109] Based on the known point C (X3; Y3) and point D (X4; Y4), obtain the specific coordinate values or coordinate ranges of the color point position E (X5; Y5) corresponding to the outer encapsulation layer on the CIE chromaticity diagram;

[0110] S3b: Then, according to the need, choose to add blue phosphor particles and red phosphor particles, or only add blue phosphor particles, or only add red phosphor particles to the encapsulation material of the outer encapsulation layer;

[0111] Then, control the peak wavelengths and powder amounts of the blue phosphor particles and red phosphor particles respectively according to the coordinate values or coordinate ranges of this point E (X5; Y5) to fabricate the outer encapsulation layer, and control the refractive index n3 of the outer encapsulation layer to be n3 ≥ n1;

[0112] If only blue phosphor particles are chosen to be added to the encapsulation material of the outer encapsulation layer, it is necessary to first determine whether the specific coordinate values or coordinate ranges of point E (X5; Y5) fall within the color coordinate range corresponding to the peak wavelength range of the blue phosphor particles. If they do not fall within the color coordinate range corresponding to the peak wavelength range of the blue phosphor particles, then, with the known point A (X1; Y1) and point B (X2; Y2) as references, readjust the peak wavelengths and powder amounts of various phosphor particles in the first encapsulation layer and the second encapsulation layer, and then repeat S3a to make the specific coordinate values or coordinate ranges of point E (X5; Y5) fall within the color coordinate range corresponding to the peak wavelength range of the blue phosphor particles;

[0113] When only red phosphor particles are added to the encapsulation material of the outer encapsulation layer, it is necessary to first determine whether the specific coordinate value or coordinate range of point E (X5; Y5) falls within the color coordinate range corresponding to the peak wavelength range of the red phosphor particles. If it does not fall within the color coordinate range corresponding to the peak wavelength range of the red phosphor particles, then, with reference to the known points A (X1; Y1) and B (X2; Y2), the peak wavelengths and powder amounts of various phosphor particles in the first encapsulation layer and the second encapsulation layer are readjusted, and then S3a is repeated to make the specific coordinate value or coordinate range of point E (X5; Y5) fall within the color coordinate range corresponding to the peak wavelength range of the red phosphor particles;

[0114] S4: Testing.

[0115] Example 1

[0116] As shown in this example Figure 2 All include

[0117] A first CSP chip disposed on the substrate 4, the first CSP chip includes a violet chip 11, and a first encapsulation layer 12 coated on the outer surface of the violet chip 11;

[0118] A second CSP chip disposed on the substrate 4, the second CSP chip includes a blue chip 21, and a second encapsulation layer 22 coated on the outer surface of the blue chip 21;

[0119] An outer encapsulation layer 5, which is used to integrally encapsulate the first CSP chip and the second CSP chip on the substrate 4.

[0120] Define the refractive index of the first encapsulation layer 12 as n1, the refractive index of the second encapsulation layer 22 as n2, and the refractive index of the outer encapsulation layer 5 as n3, where n3 ≥ n1 > n2.

[0121] In this example,

[0122] The yellow-green phosphor particles 7 are only disposed in the second encapsulation layer 22;

[0123] The blue phosphor particles 6 are disposed in both the first encapsulation layer 12 and the outer encapsulation layer 5; the content of the blue phosphor particles 6 in the first encapsulation layer 12 accounts for 70wt% of the total blue phosphor particles, and the content of the blue phosphor particles 6 in the outer encapsulation layer accounts for 30wt% of the total blue phosphor particles.

[0124] The red phosphor particles 8 are disposed in both the outer encapsulation layer 5 and the second encapsulation layer 22, and the content of the red phosphor particles 8 in the outer encapsulation layer accounts for 70wt% of the total red phosphor particles, and the content of the red phosphor particles 8 in the second encapsulation layer 22 accounts for 30wt% of the total red phosphor particles.

[0125] In this embodiment, the peak wavelength of the purple chip 11 is 407-412 nm, the peak wavelength of the blue chip 21 is 452.5-455 nm, the peak wavelength of the blue phosphor particles 6 is 480 nm, the peak wavelength of the yellow-green phosphor particles 7 is 565 nm, and the peak wavelength of the red phosphor particles 8 is 660 nm.

[0126] In this embodiment,

[0127] The first CSP chip: a purple chip with a size of 10mil x 21mil, a wavelength of 407-412nm, and blue phosphor particles with a peak wavelength of 480nm. The weight ratio of phosphor to colloid in the first encapsulation layer is 3.5:1, and the refractive index of silica gel n1=1.54;

[0128] The second CSP chip: a blue light chip with a size of 13mil x 30mil, a peak wavelength of 452.5-455nm, and the encapsulation layer phosphor is a yellow-green phosphor particle with a peak wavelength of 565nm and a red phosphor particle with a peak wavelength of 660nm. The weight ratio of the phosphor to silica gel in the second encapsulation layer 22 is 6:1, and the refractive index of silica gel n2=1.42;

[0129] Outer packaging layer 5: The refractive index of the outer packaging layer silicone is n3=1.54, the phosphors are red phosphors with a peak wavelength of 660nm and blue phosphors with a peak wavelength of 480nm, and the ratio of phosphors to silicone in the outer packaging layer 5 is 1:100.

[0130] Figure 3 The spectrum diagram of the packaging structure of this embodiment is shown. It can be seen from the figure that when the content of red phosphor particles 8 in the outer packaging layer accounts for 70wt% of the total red phosphor particles, the luminous efficiency of the overall package is: 83.49 (lm / W). However, compared with the conventional technical solution, the depression of the spectrum between 470-480nm is significantly reduced, and the purple light peak is significantly reduced.

[0131] Example 2 (3.1)

[0132] The structure of this embodiment is basically the same as that of the first embodiment. Figure 4 As shown, they all include a substrate 4, an outer packaging layer 5, a first CSP chip, a second CSP chip, blue phosphor particles 6, yellow-green phosphor particles 7, and red phosphor particles 8.

[0133] The first CSP chip is arranged on the substrate 4, and the first CSP chip includes a Ziguang chip 11 and a first packaging layer 12 coated on the outer surface of the Ziguang chip 11;

[0134] The second CSP chip is disposed on the substrate 4. The second CSP chip includes a blue light chip 21 and a second encapsulation layer 22 coated on the outer surface of the blue light chip 21;

[0135] The outer encapsulation layer 5 encapsulates the first CSP chip and the second CSP chip as a whole on the substrate 4.

[0136] Define the refractive index of the first encapsulation layer 12 as n1, the refractive index of the second encapsulation layer 22 as n2, and the refractive index of the outer encapsulation layer 5 as n3, where n3 ≥ n1 > n2.

[0137] The yellow-green phosphor particles 7 are only disposed within the second encapsulation layer 22.

[0138] The blue phosphor particles 6 are disposed within both the first encapsulation layer 12 and the outer encapsulation layer 5; the content of the blue phosphor particles 6 within the first encapsulation layer 12 accounts for 70 wt% of the total blue phosphor particles, and the content of the blue phosphor particles 6 within the outer encapsulation layer accounts for 30 wt% of the total blue phosphor particles.

[0139] The red phosphor particles 8 are disposed within both the outer encapsulation layer 5 and the second encapsulation layer 22.

[0140] The difference lies in that: in this embodiment,

[0141] The upper surface of the outer encapsulation layer 5 is provided with a microstructure, and the content of the red phosphor particles 8 within the outer encapsulation layer accounts for 30 wt% of the total red phosphor particles, and the content of the red phosphor particles 8 within the second encapsulation layer 22 accounts for 70 wt% of the total red phosphor particles.

[0142] In this embodiment, the peak wavelength of the ultraviolet chip 11 is 390 - 420 nm, the peak wavelength of the blue light chip 21 is 452 nm, the peak wavelength of the blue phosphor particles 6 is 480 nm, the peak wavelength of the yellow-green phosphor particles 7 is 555 nm, the peak wavelength of the red phosphor particles located within the outer encapsulation layer 5 is 660 nm, and the peak wavelength of the red phosphor particles located within the second encapsulation layer 22 is 660 nm.

[0143] In this embodiment, the first CSP chip: an ultraviolet chip with a size of 10 mil X 21 mil, a wavelength of 407 - 412 nm, the blue phosphor particles use a phosphor with a peak wavelength of 480 nm, the weight ratio of the phosphor to the colloid within the first encapsulation layer is 3.5:1, and the refractive index of the silica gel n1 = 1.54;

[0144] Second CSP chip: a blue light chip with a size of 13 mil X 30 mil, a peak wavelength of 452.5 - 455 nm, and the phosphor in the encapsulation layer is yellow-green phosphor particles with a peak wavelength of 565 nm and red phosphor particles with a peak wavelength of 660 nm. The weight ratio of the phosphor and silica gel in the second encapsulation layer 22 is 13:1, and the refractive index of the silica gel n2 = 1.42;

[0145] Outer encapsulation layer 5: The refractive index of the silica gel in the outer encapsulation layer n3 = 1.54, and the phosphor is red phosphor particles with a peak wavelength of 660 nm and blue phosphor particles with a peak wavelength of 480 nm. The ratio of the phosphor to silica gel in the outer encapsulation layer 5 is 1:160.

[0146] Figure 5 The spectral diagram of the encapsulation structure of this embodiment is shown, Figure 6 which is the color temperature spatial distribution diagram of the encapsulation structure of this embodiment. It can be seen from the figure that the advantage of more red phosphor being wrapped on the surface of the blue light CSP is that it can reduce the absorption of short-wavelength violet light by the red phosphor. The luminous efficacy of the overall encapsulation is: 81.13 (lm / W). It can be seen from the spectrum that the blue light at 480 nm is not absorbed and there is no serious depression; the color temperature consistency of the light source is better.

[0147] Example three (3.2)

[0148] This embodiment has basically the same structure as Example two, as Figure 7 shown, and both include a substrate 4, an outer encapsulation layer 5, a first CSP chip, a second CSP chip, blue phosphor particles 6, yellow-green phosphor particles 7, and red phosphor particles 8.

[0149] The chip specifications and parameters used are exactly the same, and the peak wavelengths of the blue phosphor particles 6, yellow-green phosphor particles 7, and red phosphor particles 8 and their contents in the first encapsulation layer, second encapsulation layer, and outer encapsulation layer are also the same as those in Example two.

[0150] The only difference is that: the upper surface of the outer encapsulation layer 5 is integrally formed with a plurality of arc-shaped protrusions 5a and arc-shaped pits 5b arranged at intervals. The arc-shaped protrusions 5a are directly above the top surfaces of each first CSP chip and second CSP chip, and the arc-shaped pits 5b are located between adjacent first CSP chips and second CSP chips. And the highest point of the arc-shaped protrusion 5a is higher than the upper surfaces of the first CSP chip and the second CSP chip, and the lowest point of the arc-shaped pit 5b is lower than the upper surfaces of the first CSP chip and the second CSP chip. The projected outlines of the outer surfaces of the arc-shaped protrusions 5a on the top surfaces of the first CSP chip and the second CSP chip completely cover and exceed the edges of the top surfaces of the first CSP chip and the second CSP chip.

[0151] In this embodiment, the highest point of the arc-shaped protrusion 5a is just 40 μm higher than the upper surfaces of the first CSP chip and the second CSP chip; the lowest point of the arc-shaped pit 5b is just 80 μm lower than the upper surfaces of the first CSP chip and the second CSP chip.

[0152] Figure 8 The spectral diagram of the packaging structure of this embodiment is shown, Figure 9 which is the color temperature spatial distribution diagram of the packaging structure of this embodiment.

[0153] It can be seen from the figure that the wavy surface structure reduces the total reflection of light, helps the light to exit, and thus can improve the light extraction efficiency of the package. The advantage of having more red phosphor on the CSP surface is that it reduces the absorption of violet light by the red phosphor. The luminous efficacy of the overall package is: 89.96 (lm / W). It can be seen from the spectrum that the blue light at 480 nm is not absorbed and there is no serious depression; the color temperature consistency of the light source is better.

[0154] Example Four (3.3)

[0155] This embodiment is basically the same as that of Example Two, and the chip specifications and parameters used are exactly the same. The peak wavelengths of the blue phosphor particles 6, yellow-green phosphor particles 7, and red phosphor particles 8 are also the same as those of Example Three. The difference is that the red phosphor particles 8 are not simultaneously arranged in the outer encapsulation layer 5 and the second encapsulation layer 22. Instead, they are only arranged in the second encapsulation layer 22, that is, only blue phosphor particles are contained in the outer encapsulation layer 5.

[0156] Example Five

[0157] As Figure 11 shown, the spectral dimming packaging structure of this embodiment adopts the COB packaging form, which includes:

[0158] 10 first CSP chips arranged on the substrate 4. The first CSP chip includes a violet chip 11 and a first encapsulation layer 12 covering the outer surface of the violet chip 11;

[0159] 15 second CSP chips arranged on the substrate 4. The second CSP chip includes a blue chip 21 and a second encapsulation layer 22 covering the outer surface of the blue chip 21;

[0160] An outer encapsulation layer 5, which is used to integrally package the first CSP chip and the second CSP chip on the substrate 4;

[0161] Several blue phosphor particles 6, and the blue phosphor particles 6 are only arranged in the first encapsulation layer 12;

[0162] Several yellow-green phosphor particles 7, and the yellow-green phosphor particles 7 are only arranged in the second encapsulation layer 22;

[0163] A number of red phosphor particles 8 are disposed in both the outer encapsulation layer 5 and the second encapsulation layer 22 simultaneously.

[0164] In this embodiment, the peak wavelength of the violet chip 11 is 407 - 412 nm, the peak wavelength of the blue chip 21 is 452.5 - 455 nm, the peak wavelength of the blue phosphor particles 6 is 480 nm, the peak wavelength of the yellow-green phosphor particles 7 is 565 nm, and the peak wavelength of the red phosphor particles 8 is 660 nm.

[0165] In this embodiment, the yellow-green phosphor particles 7 and the red phosphor particles 8 are respectively located in the second encapsulation layers 22 of different second CSP chips. And the second CSP chip provided with the red phosphor particles is located between the first CSP chip and the second CSP chip provided with the yellow-green phosphor particles, for blocking the path of the blue light in the first CSP chip from entering the second encapsulation layer containing the yellow-green phosphor particles.

[0166] In this embodiment, it is defined that the refractive index of the first encapsulation layer 12 is n1, the refractive index of the second encapsulation layer 22 is n2, wherein the refractive index of the second encapsulation layer 22a provided with the yellow-green phosphor particles is denoted as n2a, and the refractive index of the second encapsulation layer 22b provided with the red phosphor particles is denoted as n2b; the refractive index of the outer encapsulation layer 5 is n3, and n3 ≥ n1 > n2a > n2b.

[0167] In this embodiment, the first CSP chip: a violet chip with a size of 10 mil X 21 mil, a wavelength of 407 - 412 nm, an encapsulation layer refractive index of 1.54, the blue phosphor particles use phosphors with a peak wavelength of 480 nm, the weight ratio of the phosphor to the colloid is 3.5:1, and the refractive index of the silica gel n1 = 1.54;

[0168] The second CSP chip: a blue chip with a size of 13 mil X 30 mil, a peak wavelength of 452.5 - 455 nm; the peak wavelength of the yellow-green phosphor particles is 565 nm, and the peak wavelength of the red phosphor particles is 660 nm.

[0169] The weight ratio of the phosphor particles to the silica gel in the second encapsulation layer 22a provided with the yellow-green phosphor particles is 10:1, and the refractive index of the silica gel n2a = 1.42;

[0170] The weight ratio of the phosphor particles to the silica gel in the second encapsulation layer 22b provided with the red phosphor particles is 12:1, and the refractive index of the silica gel n2b = 1.40.

[0171] Outer encapsulation layer 5: The refractive index of the outer encapsulation layer silicone is n3 = 1.54, the phosphor is a red phosphor with a peak wavelength of 660 nm, and the ratio of the phosphor to silicone in the outer encapsulation layer 5 is 1:130.

[0172] Figure 12 The spectral diagram of the encapsulation structure of this embodiment is shown. Figure 13 This is the color temperature spatial distribution diagram of the encapsulation structure of this embodiment. It can be seen from the figure the advantage that more red phosphor is on the CSP surface, reducing the absorption of red phosphor for ultraviolet light. The luminous efficacy of the overall package is: 95.51 (lm / W). It can be seen from the spectrum that the blue light at 480 nm is not absorbed and there is no obvious depression; the color temperature consistency of the light source is better.

[0173] Comparative Example 1

[0174] This embodiment is a comparative example, as Figure 14 shown, it includes a substrate 4, and two ultraviolet chips 11 disposed on the substrate 4. An outer encapsulation layer 5 for encapsulation is disposed outside the ultraviolet chips 11. Blue phosphor particles 6, yellow-green phosphor particles 7, and red phosphor particles 8 are all disposed inside the outer encapsulation layer 5. The peak wavelength of the ultraviolet chips 11 is 390 - 420 nm, and the peak wavelengths of the blue phosphor particles 6, yellow-green phosphor particles 7, and red phosphor particles 8 are 480 nm, 602 nm, and 660 nm respectively.

[0175] In this embodiment, the size of the ultraviolet chip is 10 mil X 21 mil, the peak wavelength is 407 - 412 nm, the phosphor particles inside the outer encapsulation layer 5 are blue phosphor particles with a peak wavelength of 480 nm, yellow-green phosphor particles with a peak wavelength of 565 nm, and red phosphor particles with a peak wavelength of 660 nm. The weight ratio of the phosphor particles to silicone inside the outer encapsulation layer 5 is 3:16, and the refractive index of the silicone is n = 1.54.

[0176] From Figure 14 、 15 it can be seen that due to the short-wavelength fluorescence generated by the short-wavelength phosphor being re-excited by the long-wavelength phosphor and then re-absorbed, that is: there is a problem of secondary absorption of blue and green fluorescence by the red phosphor. Therefore, the luminous efficacy of the overall package is: 53.38 (lm / W), which is relatively low. At the same time, the spectral components are not saturated and the spectral loss is serious.

[0177] Comparative Example 2

[0178] This embodiment is a comparative example, as Figure 16As shown in the figure, it includes a substrate 4 and two blue light chips 21 disposed on the substrate 4. An outer encapsulation layer 5 for encapsulation is disposed outside the blue light chips 21. Blue phosphor particles 6, yellow-green phosphor particles 7, and red phosphor particles 8 are all disposed inside the outer encapsulation layer 5. The peak wavelength of the blue light chips 21 is 390 - 420 nm, and the peak wavelengths of the blue phosphor particles 6, yellow-green phosphor particles 7, and red phosphor particles 8 are 480 nm, 565 nm, and 660 nm respectively.

[0179] In this embodiment, the chip size is a blue light chip of 13 mil X 30 mil, the peak wavelength of the blue light chip is 452.5 - 455 nm, the phosphor particles inside the outer encapsulation layer 5 are blue phosphor particles with a peak wavelength of 480 nm, yellow-green phosphor particles with a peak wavelength of 565 nm, and red phosphor particles with a peak wavelength of 660 nm. The weight ratio of the phosphor particles and silicone inside the outer encapsulation layer 5 is 3:16, and the refractive index of the silicone n = 1.54.

[0180] As Figure 17 shown in the figure, although the luminous efficacy brought by exciting the hybrid phosphor with the blue light chip is 98.48 (lm / W), since the excitation efficiency of the blue light chip for the blue phosphor is extremely low, and the excited blue light and yellow-green light will be absorbed by the red phosphor, resulting in serious spectral component loss, especially serious spectral loss near 480 nm.

[0181] Comparative Example 3

[0182] This embodiment as Figure 18 shown in the figure, all includes

[0183] A first CSP chip disposed on the substrate 4, the first CSP chip includes a violet light chip 11 and a first encapsulation layer 12 coated on the outer surface of the violet light chip 11;

[0184] A second CSP chip disposed on the substrate 4, the second CSP chip includes a blue light chip 21 and a second encapsulation layer 22 coated on the outer surface of the blue light chip 21;

[0185] An outer encapsulation layer 5, which is used to integrally encapsulate the first CSP chip and the second CSP chip on the substrate 4.

[0186] It further includes a number of blue phosphor particles 6, a number of yellow-green phosphor particles 7, and a number of red phosphor particles 8.

[0187] The blue phosphor particles 6 are only disposed inside the first encapsulation layer 12;

[0188] The yellow-green phosphor particles 7 are only disposed inside the outer encapsulation layer 5.

[0189] The red phosphor particles 8 are only disposed within the second encapsulation layer 22.

[0190] In this embodiment,

[0191] The first CSP chip: a violet chip with a size of 10 mil X 21 mil, a wavelength of 407 - 412 nm, an encapsulation layer refractive index of 1.54, the blue phosphor particles are phosphor particles with a peak wavelength of 480 nm, and the weight ratio of the phosphor particles to the colloid within the first encapsulation layer is 3.5:1, and the refractive index of the silica gel n1 = 1.54;

[0192] The second CSP chip: a blue chip with a size of 13 mil X 30 mil, a peak wavelength of 452.5 - 455 nm, and the phosphor particles in the encapsulation layer are red phosphor particles with a peak wavelength of 660 nm. The weight ratio of the phosphor particles to the silica gel within the second encapsulation layer is 10:1, and the refractive index of the silica gel n2 = 1.42;

[0193] The outer encapsulation layer: the refractive index of the silica gel in the outer encapsulation layer n3 = 1.54, the phosphor particles are red phosphor particles with a peak wavelength of 660 nm and blue phosphor particles with a peak wavelength of 480 nm, and the yellow-green phosphor particles in the outer encapsulation layer are phosphor particles with a peak wavelength of 565 nm. The weight ratio of the yellow-green phosphor particles to the silica gel in the outer encapsulation layer is: 1:120.

[0194] As Figure 19 shown, although a violet chip is used to excite the blue phosphor, a blue chip excites the red phosphor CSP, and then the yellow-green phosphor is dispensed within the external overall encapsulation layer, the resulting luminous efficacy is 80.12 (lm / W). However, since the yellow-green phosphor in the outermost encapsulation layer will absorb blue light with a short wavelength such as 450 nm, but will also absorb blue light with a long wavelength such as 480 nm, there is an obvious depression in the spectrum at 480 nm.

Claims

1. A spectral dimming package structure, characterized in that: It includes at least one first CSP chip disposed on a substrate, the first CSP chip includes a violet chip, and a first encapsulation layer covering the outer surface of the violet chip; at least one second CSP chip disposed on the substrate, the second CSP chip includes a blue chip, and a second encapsulation layer covering the outer surface of the blue chip; an outer encapsulation layer for integrally encapsulating the first CSP chip and the second CSP chip on the substrate; a number of blue phosphor particles, the blue phosphor particles are at least disposed in the first encapsulation layer and not in the second encapsulation layer; a number of yellow-green phosphor particles, the yellow-green phosphor particles are only disposed in the second encapsulation layer; a number of red phosphor particles, the red phosphor particles are disposed in the outer encapsulation layer and / or at least one second encapsulation layer; Define the refractive index of the first encapsulation layer as n1, the refractive index of the second encapsulation layer as n2, and the refractive index of the outer encapsulation layer as n3, where n3≥n1>n2.

2. The spectral dimming package structure according to claim 1, characterized in that: There is at least one second CSP chip, and the red phosphor particles are at least disposed in the second encapsulation layer; The red phosphor particles in the second encapsulation layer account for 50-100wt% of the total mass of all red phosphor particles.

3. The spectral dimming package structure according to claim 1 or 2, characterized in that: There are at least two second CSP chips, and the yellow-green phosphor particles and the red phosphor particles are respectively located in the second encapsulation layers of different second CSP chips.

4. The spectral dimming package structure according to claim 1, characterized in that: The upper surface of the outer encapsulation layer has a number of arc-shaped protrusions and arc-shaped pits arranged at intervals. The arc-shaped protrusions are directly above the top surfaces of each first CSP chip and the second CSP chip, and the arc-shaped pits are located between adjacent first CSP chips and second CSP chips; The highest point of the arc-shaped protrusion is not lower than the upper surface of the first CSP chip and the second CSP chip, and the lowest point of the arc-shaped pit is not higher than the upper surface of the first CSP chip and the second CSP chip.

5. The spectral dimming package structure according to claim 4, characterized in that: The highest point of the arc-shaped protrusion is not lower than the upper surface of the first CSP chip and the second CSP chip by 40 microns; the lowest point of the arc-shaped pit is not higher than the upper surface of the first CSP chip and the second CSP chip by 80 microns.

6. The spectral dimming package structure according to claim 1, characterized in that: The peak wavelength of the blue chip is 430-460nm, and the peak wavelength of the violet chip is 390-420nm.

7. The spectral dimming package structure according to claim 1, characterized in that: Each of the first CSP chips and the second CSP chips is electrically connected to form a circuit, and one first CSP chip and the second CSP chip are connected in series; when there is a parallel connection in the circuit, the total number of chips in each parallel branch is equal, and the number and connection mode of the first CSP chips between the branches are the same, and the number and connection mode of the second CSP chips between the branches are the same.

8. A method for manufacturing the spectral dimming package structure according to any one of the above claims 1 to 7, characterized in that: S1: Fabrication of each chip, Fabricate the first CSP chip, the first CSP chip includes a violet chip, and a first encapsulation layer coated on the outer surface of the violet chip; add blue phosphor particles in the first encapsulation layer; Fabricate the second CSP chip, the second CSP chip includes a blue chip, and a second encapsulation layer coated on the outer surface of the blue chip; In this step S1, the fabrication of the second CSP chip is divided into three methods: The first: Only yellow-green phosphor particles are added in the second encapsulation layer of all the second CSP chips, and no red phosphor particles are included; The second: Both yellow-green phosphor particles and red phosphor particles are added in the second encapsulation layer of all the second CSP chips; The third: Only yellow-green phosphor particles are added in the second encapsulation layer of at least one second CSP chip, and only red phosphor particles are added in the second encapsulation layer of the remaining second CSP chips; Control the refractive index n1 of the first encapsulation layer of the first CSP chip to be greater than the refractive index n2 of the second encapsulation layer of the second CSP chip; S2: Pre-control of color temperature, Fix the first CSP chip and the second CSP chip at the corresponding positions on the substrate; Light up the first CSP chip, and obtain the color point position corresponding to it on the CIE chromaticity diagram after the first CSP chip is lit, denoted as point A (X1; Y1); Light up all the second CSP chips at the same time, and obtain the color point position or the mixed color point position corresponding to them on the CIE chromaticity diagram after all the second CSP chips are lit, denoted as point B (X2; Y2); Light up all the chips at the same time, and obtain the mixed color point position corresponding to them on the CIE chromaticity diagram after all the chips are lit, denoted as point C (X3; Y3); S3: Fabrication of the outer encapsulation layer, which is divided into two steps of step S3a and step S3b: S3a: First, according to the color temperature requirement of the final spectral dimming package structure, find the color point coordinates corresponding to the color temperature of the final spectral dimming package structure on the Planck locus of the CIE chromaticity diagram, denoted as point D (X4; Y4); Based on the known point C (X3; Y3) and point D (X4; Y4), obtain the specific coordinate value or coordinate range of the color point position E point (X5; Y5) corresponding to the outer encapsulation layer on the CIE chromaticity diagram; S3b: Then, according to the need, choose to add blue phosphor particles and red phosphor particles, or only add blue phosphor particles, or only add red phosphor particles in the encapsulation material of the outer encapsulation layer; Then, according to the coordinate value or coordinate range of this point E (X5; Y5), control the peak wavelength and powder amount of the blue phosphor particles and the red phosphor particles respectively to fabricate the outer encapsulation layer, and control the refractive index n3 of the outer encapsulation layer to be n3≥n1; If only blue phosphor particles are added to the encapsulation material of the outer encapsulation layer, it is necessary to first determine whether the specific coordinate value or coordinate range of point E (X5; Y5) falls within the chromaticity coordinate range corresponding to the peak wavelength range of the blue phosphor particles. If it does not fall within the chromaticity coordinate range corresponding to the peak wavelength range of the blue phosphor particles, then, with reference to the known points A (X1; Y1) and B (X2; Y2), readjust the peak wavelengths and powder amounts of various phosphor particles in the first encapsulation layer and the second encapsulation layer, and then repeat S3a to make the specific coordinate value or coordinate range of point E (X5; Y5) fall within the chromaticity coordinate range corresponding to the peak wavelength range of the blue phosphor particles; If only red phosphor particles are added to the encapsulation material of the outer encapsulation layer, it is necessary to first determine whether the specific coordinate value or coordinate range of point E (X5; Y5) falls within the chromaticity coordinate range corresponding to the peak wavelength range of the red phosphor particles. If it does not fall within the chromaticity coordinate range corresponding to the peak wavelength range of the red phosphor particles, then, with reference to the known points A (X1; Y1) and B (X2; Y2), readjust the peak wavelengths and powder amounts of various phosphor particles in the first encapsulation layer and the second encapsulation layer, and then repeat S3a to make the specific coordinate value or coordinate range of point E (X5; Y5) fall within the chromaticity coordinate range corresponding to the peak wavelength range of the red phosphor particles; S4: Testing.

9. The method for a spectral dimming encapsulation structure according to claim 8, characterized in that: In step S3, a plurality of arc-shaped protrusions and arc-shaped pits are integrally formed on the upper surface of the outer encapsulation layer, the arc-shaped protrusions are directly above the top surfaces of the first CSP chips and the second CSP chips, and the arc-shaped pits are located between adjacent first CSP chips and second CSP chips, or between adjacent first CSP chips, or between adjacent second CSP chips.

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