Liquid Cooling Server

Abstract

The present invention discloses a liquid-cooled heat dissipation server, which belongs to the technical field of servers, and comprises a chassis, a detachable upper cover plate arranged on the top of the chassis, at least one liquid cooling plate installed in the chassis in a horizontal upright manner; a computing board, at least two computing chips connected in series are arranged on the front of the computing board, and the back of the computing board is detachably installed on the back of the liquid cooling plate; a liquid cooling box arranged on the outside of the chassis, the liquid cooling box is connected to the liquid cooling plate; a controller installed on the side wall of the chassis and connected to the computing board for communication; a power supply installed on the cover plate, the power supply is electrically connected to the controller and the computing board. The present invention optimizes the structure of the liquid cooling plate into multiple channels that can simultaneously divert cold liquid, so that the cold liquid flowing into each channel maintains the original input cooling temperature, ensuring that all computing chips can obtain corresponding heat dissipation and cooling, greatly reducing the risk of the computing chips being easily burned, and improving the safety of server operation.

Description

Technical Field

[0001] The invention belongs to the technical field of servers, and in particular relates to a liquid-cooled heat dissipation server. Background Art

[0002] With the continuous improvement of data processing technology capabilities, servers play an important role and the market demand is increasing, but the load that servers need to bear is also increasing accordingly. For example, a server with computing functions integrates a large number of computing chip units on a circuit board. The density is high, and the power consumption generated by the computing chip operation makes the circuit board heat up, which can easily cause the computing chip to burn out and the server to stop running.

[0003] Existing servers use "S"-shaped cooling pipes installed on circuit boards to dissipate heat and cool down computing chips. However, the temperature of the coolant in this "S"-shaped cooling pipe is higher when it flows to the computing chip position corresponding to the rear section of the circuit board than that of the computing chip position corresponding to the front section. Because the coolant has been cooled in the front section and carries heat, the coolant in the rear section is preheated and difficult to dissipate heat normally, resulting in different heat dissipation and cooling effects at the front and back of the server, which can easily cause the computing chip to burn out and the server to stop running, causing certain losses.

[0004] It should be noted that the above background technology content is only used to help understand the present application, and does not represent an admission or recognition that any of the content mentioned is part of the common knowledge relative to the present application. Summary of the invention

[0005] The present invention provides a liquid-cooled heat dissipation server, which aims to solve the problem that the existing cooling mode can only dissipate heat and cool down part of the computing power chips on the server, while the reliability of heat dissipation and cooling of other computing power chips cannot be guaranteed, and there is a risk that the computing power chips on the server will burn out and stop running, causing certain losses.

[0006] To achieve the above object, the present invention provides a liquid-cooled heat dissipation server, comprising:

[0007] A chassis, wherein a detachable upper cover is provided on the top of the chassis;

[0008] Liquid cooling plate, at least one of the liquid cooling plates is inserted into the chassis and installed in a horizontally upright manner;

[0009] A computing board, wherein at least two computing chips are connected in series on the front of the computing board, and the back of the computing board can be detachably mounted on the back of the liquid cooling plate;

[0010] A liquid cooling box, the liquid cooling box is arranged outside the chassis, and the liquid cooling box is connected to the liquid cooling plate to supply cooling liquid;

[0011] A controller, the controller is mounted on the side wall of the chassis, and the controller is communicatively connected with the computing board; and

[0012] A power supply is installed on the upper cover plate, and the power supply is electrically connected to the controller and the computing board.

[0013] Preferably, the liquid cooling plate comprises a bottom plate with one side being a cavity and a cover plate, and the cover plate is sealingly covered on the bottom plate by screws.

[0014] Preferably, a water inlet joint and a water outlet joint are respectively provided on the upper and lower parts of the side surface of the liquid cooling plate, and the water inlet joint and the water outlet joint are both connected to the inner wall of the cavity to allow cooling liquid to flow in and out.

[0015] Preferably, the water inlet joint and the water outlet joint are both provided with through holes in the middle.

[0016] Preferably, an upper water divider is provided on the water inlet joint, and a lower water divider is provided on the water outlet joint. One end of the upper water divider is connected to the liquid cooling box, and the other end is connected to the through hole of the water inlet joint. One end of the lower water divider is connected to the liquid cooling box, and the other end is connected to the through hole of the water outlet joint, so as to form a circulating supply of cold liquid.

[0017] Preferably, the bottom surface of the cavity is integrally formed with a plurality of first isolation strips that are arranged at intervals and protrude upward to form a plurality of flow channels for cooling liquid diversion, and each of the flow channels faces away from the computing power chip on the computing power board to provide heat dissipation and cooling for the computing power chip.

[0018] Preferably, a first waterproof strip is laid on the upper surface of the first isolation strip.

[0019] Preferably, the bottom surface of the cavity is integrally formed with a second isolation strip protruding upward at the water outlet interface, one end of the second isolation strip is located at the water outlet interface and is integrally connected to the inner wall of the cavity, and the other end forms a cold liquid confluence with the inner wall of the cavity.

[0020] Preferably, a second waterproof strip is laid on the upper surface of the second isolation strip.

[0021] Preferably, a chain groove is provided on the bottom plate along the periphery of the cavity, and a waterproof sealing chain ring is laid on the chain groove.

[0022] The beneficial effects of the present invention compared to the prior art are as follows:

[0023] The present invention provides a liquid-cooled heat dissipation server, which optimizes the drainage structure of the liquid cooling plate into multiple flow channels that can simultaneously divert the cold liquid and converge them to a confluence port, so that the cold liquid flowing into each flow channel maintains the original input cooling temperature, ensuring that the computing power chip at each position on the computing power board can obtain corresponding heat dissipation and cooling, greatly reducing the risk of the computing power chip being easily burned, and improving the safety of server operation.

[0024] In order to more clearly illustrate the structural features and effects of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a structural schematic diagram of the liquid-cooled heat dissipation server of the present invention;

[0026] Figure 2 It is a partial structural schematic diagram of the liquid-cooled heat dissipation server of the present invention;

[0027] Figure 3 It is a schematic diagram of the assembly structure of the computing board and the liquid cooling plate in the liquid-cooled heat dissipation server of the present invention;

[0028] Figure 4 for Figure 3 Schematic diagram of the decomposition structure of the power board and liquid cooling board in the figure;

[0029] Figure 5 for Figure 3 Schematic diagram of the bottom plate structure in FIG.

[0030] Figure 6 for Figure 3 Schematic diagram of the front structure of the hashboard in the figure;

[0031] Description of the drawings: 1. Chassis; 101. Upper cover; 2. Liquid cooling plate; 201. Bottom plate; 202. Cover plate; 203. Cavity; 204. Water inlet connector; 205. Water outlet connector; 206. Through hole; 207. First isolation strip; 208. Second isolation strip; 209. Chain groove; 210. Confluence; 3. Calculating power board; 301. Calculating power chip; 4. Liquid cooling box; 5. Controller; 6. Power supply; 7. Upper water distributor; 8. Lower water distributor; 9. First waterproof strip; 10. Second waterproof strip; 11. Sealing chain ring. DETAILED DESCRIPTION

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by technicians in the technical field of this application; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0033] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0034] The embodiment of the present invention provides a liquid cooling heat dissipation server, which is generally based on Figure 1-Figure 3 As shown, it includes a chassis 1, a liquid cooling plate 2, a computing board 3, a computing chip 301, a liquid cooling box 4, a controller 5 and a power supply 6. At least two computing chips 301 are connected in series on the front of the computing board 3. The back of the computing board 3 is screwed to the back of the liquid cooling plate 2, and then the liquid cooling plate 2 is erected horizontally and installed in the chassis 1. A removable upper cover 101 is provided on the top of the chassis 1, and a power supply 6 is installed on the upper cover 101. A liquid cooling box 4 is installed on the outside of the chassis 1. The liquid cooling box 4 is connected to the liquid cooling plate 2 to supply cold liquid so that the computing chip 301 on the computing board 3 can dissipate heat and cool down. A controller 5 is installed on the side wall of the chassis 1. The controller 5 is connected to the computing board 3 for communication, and the power supply 6 is electrically connected to the controller 5 and the computing board 3.

[0035] Specifically, refer to Figure 6 As shown, a plurality of computing chips 301 are embedded on the computing board 3, and the plurality of computing chips 301 are connected in series. The computing chip 301 is a computing chip 301 with certain computing functions, such as an FPGA computing chip 301 with super computing functions that integrates multiple crystals. Since the computing board 3 is integrated with a plurality of computing chips 301, heat will be continuously generated during operation, and the heat needs to be discharged in time. Therefore, a liquid cooling plate 2 is installed on the back of the computing board 3 to cool down the heat generated on the computing board 3 to protect the computing chip 301 from being burned.

[0036] For further reference, Figure 5As shown, a bottom plate 201 with one side being a cavity 203 is made of aluminum profile by die-casting process, and a water inlet joint 204 and a water outlet joint 205 connected to the inner wall of the cavity 203 are respectively provided at the upper and lower parts of one side of the bottom plate 201, and a confluence port 210 is provided at one place of the cavity 203, and the confluence port 210 is connected to the water outlet joint 205, and the water cooling that flows into the cavity 203 through the water inlet joint 204 is evenly distributed to each flow channel, and is gathered at the confluence port 210 and discharged from the water outlet joint 205. Among them, since the distance of each flow channel is short (for example, length = 180mm), compared with the existing "S"-shaped water tank structure (for example, length = 1000mm), the time for the cold liquid to flow from one end of the flow channel to the other end is very short, that is, in each flow channel, the same cold liquid temperature can be used to dissipate heat and cool down all the computing chips 301 on the computing board 3, effectively avoiding the defect of the existing "S"-shaped water tank structure with a large temperature difference between the cold liquid before and after, reducing the risk of the computing board 3 being burned, and further improving the reliability of the normal operation of the computing board 3.

[0037] The bottom plate 201 is made of aluminum, which has a significant heat conduction effect. The thickness between the bottom surface of the cavity 203 and the back surface of the locked liquid cooling plate 2 should not be too thick. The thickness is usually set to 3-10 mm, and the preferred thickness is 5 mm, so that the computing power chip 301 can be better cooled and dissipated.

[0038] It should be noted that, due to the short length of the flow channel, the computing chip 301 of the computing board 3 corresponding to the back side of the same flow channel is cooled by the cold liquid on the entire flow channel. The temperature difference of the cold liquid in the front and rear sections of the flow channel is very small and can be ignored here.

[0039] refer to Figure 4 As shown, the specific structure of the above-mentioned liquid cooling plate 2 is as follows: the liquid cooling plate 2 includes a bottom plate 201, a cover plate 202, a water inlet joint 204, a water outlet joint 205, a first isolation strip 207, a first waterproof strip 9, a second isolation strip 208, a second waterproof strip 10, and a sealing chain ring 11. The cover plate 202 is sealed on the bottom plate 201 by screws, and the bottom plate 201 is set to form a cavity 203 structure on the side covered by the cover plate 202; the upper and lower parts of the side of the liquid cooling plate 2 are respectively provided with a water inlet joint 204 and a water outlet joint 205, and the water inlet joint 204 and the water outlet joint 205 are both connected to the inner wall of the cavity 203 for cooling Liquid flows in and out; the bottom surface of the cavity 203 is integrally formed with a plurality of first isolation strips 207 that are arranged at intervals and protrude upward to form a plurality of flow channels for cold liquid diversion, and each flow channel faces away from the computing chip 301 on the computing board 3, so as to provide heat dissipation and cooling for the computing chip 301; the bottom surface of the cavity 203 is integrally formed with a second isolation strip 208 that protrudes upward at the water outlet interface, one end of the second isolation strip 208 is located at the water outlet interface and is integrally connected to the inner wall of the cavity 203, and the other end forms a cold liquid confluence 210 with the inner wall of the cavity 203; a chain groove 209 is provided on the bottom plate 201 along the periphery of the cavity 203.

[0040] Of course, the first waterproof strip 9, the second waterproof strip 10 and the sealing chain ring 11 are laid on the first isolation strip 207, the second isolation strip 208 and the chain groove 209 respectively to prevent the cold liquid in the liquid cooling plate 2 from seeping out or leaking out, and to maintain the diverted cold liquid flowing in the corresponding flow channel.

[0041] In an optional embodiment, when multiple liquid cooling plates 2 (for example, 3) are installed in the chassis 1, in order to better transport the cold water and reduce the complexity of installing the cold water hose, a through hole 206 is provided in the middle of the water inlet joint 204 and the water outlet joint 205. After the through hole 206 is connected to the water distributor structure, it can simultaneously divert and supply multiple liquid cooling plates 2. Specifically, the upper water distributor 7 and the lower water distributor 8 are used in this embodiment. One end of the upper water distributor 7 is connected to the liquid cooling box 4, and the other end is connected to the through hole 206 of the water inlet joint 204; one end of the lower water distributor 8 is connected to the liquid cooling box 4, and the other end is connected to the through hole 206 of the water outlet joint 205, so as to form a circulating supply of cold liquid.

[0042] According to the above-mentioned embodiment of the liquid-cooled heat dissipation server of the present invention, other components of the server (eg, the controller 5, the power supply 6, etc.) are known to those skilled in the art and will not be described in detail here.

[0043] The technical principle of the present invention is described above in combination with the specific embodiments, which are only preferred implementations of the present invention. The protection scope of the present invention is not limited to the above embodiments, and all technical solutions under the idea of ​​the present invention belong to the protection scope of the present invention. Those skilled in the art can think of other specific implementations of the present invention without creative work, and these methods will fall within the protection scope of the present invention.

Claims

1. A liquid-cooled heat dissipation server, characterized in that: include: A chassis, wherein a detachable upper cover is provided on the top of the chassis; A liquid cooling plate, at least one of the liquid cooling plates is inserted into the chassis and installed in a horizontally upright manner, the liquid cooling plate includes a bottom plate and a cover plate with one side being a cavity, a water inlet joint and a water outlet joint are respectively provided at the upper and lower parts of the side of the liquid cooling plate, the water inlet joint and the water outlet joint are both connected to the inner wall of the cavity for the flow of cooling liquid in and out, the bottom surface of the cavity is integrally formed with a plurality of first isolation strips that are arranged at intervals and protrude upward to form a plurality of flow channels for cooling liquid diversion, the bottom surface of the cavity is integrally formed with a second isolation strip that protrudes upward at the water outlet interface, one end of the second isolation strip is located at the water outlet interface and is integrally connected to the inner wall of the cavity, and the other end forms a cooling liquid confluence port with the inner wall of the cavity; A computing board, wherein at least two computing chips are connected in series on the front of the computing board, and the back of the computing board can be detachably mounted on the back of the liquid cooling plate; A liquid cooling box, the liquid cooling box is arranged outside the chassis, and the liquid cooling box is connected to the liquid cooling plate to supply cooling liquid; A controller, the controller is mounted on the side wall of the chassis, and the controller is communicatively connected with the computing board; and A power supply is installed on the upper cover plate, and the power supply is electrically connected to the controller and the computing board.

2. The liquid-cooled heat dissipation server according to claim 1, characterized in that: The cover plate is sealingly covered on the bottom plate by screws.

3. The liquid-cooled heat dissipation server according to claim 1, characterized in that: The middle parts of the water inlet joint and the water outlet joint are both provided with through holes.

4. The liquid-cooled heat dissipation server according to claim 3, characterized in that: An upper water distributor is provided on the water inlet joint, and a lower water distributor is provided on the water outlet joint. One end of the upper water distributor is connected to the liquid cooling box, and the other end is communicated with the through hole of the water inlet joint. One end of the lower water distributor is connected to the liquid cooling box, and the other end is communicated with the through hole of the water outlet joint, so as to form a circulating supply of cold liquid.

5. The liquid-cooled heat dissipation server according to claim 1, characterized in that: Each of the flow channels faces away from the computing chip on the computing board to dissipate heat and cool the computing chip.

6. The liquid-cooled heat dissipation server according to claim 5, characterized in that: A first waterproof strip is laid on the upper surface of the first isolation strip.

7. The liquid-cooled heat dissipation server according to claim 1, characterized in that: A second waterproof strip is laid on the upper surface of the second isolation strip.

8. The liquid-cooled heat dissipation server according to any one of claims 2 to 7, characterized in that: A chain groove is arranged on the bottom plate along the periphery of the cavity, and a waterproof sealing chain ring is laid on the chain groove.

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