Camera module and molded photosensitive component and manufacturing method thereof and electronic device

Abstract

A camera module and a molded photosensitive component, a manufacturing method thereof, and an electronic device. The molded photosensitive component is used to be assembled with at least one optical lens into a camera module. The molded photosensitive component includes an imaging component, a molded base, and a filter component. The molded base includes a first molded portion and a second molded portion. The first molded portion covers a portion of the imaging component. The second molded portion is integrally formed on the first upper surface of the first molded portion, wherein the second molded portion has a second upper surface and a second outer side surface. The filter component is attached to the second upper surface of the second molded portion, and the filter component corresponds to the photosensitive path of the imaging component. The second upper surface of the second molded portion is higher than the first upper surface of the first molded portion, so as to define an outer space through the second outer side surface of the second molded portion and the first upper surface of the first molded portion.

Description

Technical Field

[0001] The present invention relates to the field of optical imaging technology, and in particular to a camera module and a molded photosensitive component and a manufacturing method thereof, as well as an electronic device. Background Art

[0002] In recent years, electronic products, smart devices, etc. are increasingly developing in the direction of being lighter, thinner, and smaller. This development trend of electronic products and smart devices has put forward more stringent requirements on the size of the camera module, which is one of the standard configurations of electronic products and smart devices. Under this requirement, the molding process and IOM (IR on Molding) process are gradually being applied to the packaging process of the camera module. First, the imaging component is packaged through the molding process to form a molding base, and then the filter is directly attached to the molding base to assemble into a molded photosensitive component, thereby greatly reducing the thickness of the photosensitive component and thus reducing the overall size of the camera module.

[0003] For example, Figure 1 As shown, the existing camera module 1P usually includes an optical lens 2P and a molded photosensitive component 3P, wherein the molded photosensitive component 3P includes an imaging component 31P, a molded base 32P and a filter 33P, wherein the molded base 32P covers a part of the imaging component 31P after molding, and the interior of the molded base 32P is recessed downward to form a groove 35P, wherein the filter 33P is directly attached to the groove 35P of the molded base 32P by glue, and after the glue is cured, a glue layer 34P is formed to bond the filter 33P to the molded base 32P, so as to assemble the molded photosensitive component 3P. In this way, the existing camera module 1P does not need a lens holder, and only needs to directly install the optical lens 2P to the top surface of the molded base 32P to complete the module assembly, so as to reduce the overall size of the camera module. At the same time, since the filter 33P is attached to the groove 35P of the molded base 32P, the distance between the filter 33P and the photosensitive chip 311P of the imaging component 31P is further reduced, which helps to further reduce the height of the camera module.

[0004] However, if Figure 1As shown, due to the film in the molding process, the corner of the groove 35P in the mold base 32P (i.e., the connection between the portion of the mold base 32P where the filter 33P is attached and the portion where the optical lens 2P is installed) is not a right angle, but has a certain transition arc surface 351P, which makes it difficult for the mold base 32P to provide a flat attachment surface for the filter 33P. Therefore, when attaching the filter 33P, the transition arc surface 351P of the groove 35P in the mold base 32P has to be avoided to ensure that the filter 33P is attached to a flat plane. However, this will result in a smaller attachment area between the filter 33P and the molded base 32P, that is, the bottom support area provided by the molded base 32P for the filter 33P will become smaller, which can easily reduce the connection strength between the filter 33P and the molded base 32P, thereby affecting the reliability of the camera module. Summary of the invention

[0005] One object of the present invention is to provide a camera module and a molded photosensitive component and a method for manufacturing the same, as well as an electronic device, which can eliminate the adverse effects of the transition arc on the molded base on the attached filter component by raising the portion of the molded base to which the filter component is attached.

[0006] Another object of the present invention is to provide a camera module and a molded photosensitive component, a method for manufacturing the same, and an electronic device, which can affix the filter component without avoiding the transition arc surface on the molded base, so as to increase the attachment area between the filter component and the molded base, thereby helping to improve the reliability of the camera module.

[0007] Another object of the present invention is to provide a camera module and a molded photosensitive component and a manufacturing method thereof and an electronic device, wherein, in one embodiment of the present invention, the upper mold of the molding mold is designed to form a gap between the second molding part and the third molding part, so that the filter component does not need to avoid the transition arc surface on the molding base.

[0008] Another object of the present invention is to provide a camera module and a molded photosensitive component and a manufacturing method thereof and an electronic device, wherein, in one embodiment of the present invention, the second molding part of the molding base of the molded photosensitive component is integrally formed on the first molding part of the molding base, so as to provide a flat attachment surface for the filter component through the second upper surface of the second molding part, thereby ensuring the attachment flatness of the filter component.

[0009] Another object of the present invention is to provide a camera module and a molded photosensitive component, a method for manufacturing the same, and an electronic device, wherein, in one embodiment of the present invention, the third molding part of the molding base of the molded photosensitive component is integrally formed on the first molding part to cover the electronic components on the circuit board of the molded photosensitive component, which helps to reduce the thickness of the first molding part and thereby reduce the height of the camera module.

[0010] Another object of the present invention is to provide a camera module and a molded photosensitive component and a method for manufacturing the same, as well as an electronic device, wherein, in one embodiment of the present invention, the second molded part and the third molded part of the module base of the molded photosensitive component are spaced apart to reserve an external space between the second molded part and the third molded part, so that the edge of the filter component is as close to the third molded part as possible without avoiding the transition arc surface between the third molded part and the first molded part, which helps to increase the bottom support area of ​​the filter component, thereby enhancing the attachment reliability of the filter component.

[0011] Another object of the present invention is to provide a camera module and a molded photosensitive component, a method for manufacturing the same, and an electronic device, wherein, in one embodiment of the present invention, the second molding part of the module base of the molded photosensitive component can ensure that the filter component is attached to a flat plane without avoiding the transition arc surface between the third molding part and the first molding part, which helps to improve the assembly quality of the camera module.

[0012] Another object of the present invention is to provide a camera module and a molded photosensitive component and a manufacturing method thereof and an electronic device, wherein, in one embodiment of the present invention, the second molding portion of the molding base is easily provided with a notch to form an air escape hole during the process of attaching the filter component, thereby effectively preventing the filter component from being offset or warped due to the thermal expansion of the gas in the internal space of the molding base.

[0013] Another object of the present invention is to provide a camera module and a molded photosensitive component and a method for manufacturing the same, as well as an electronic device, wherein, in one embodiment of the present invention, the notch of the molded base of the molded photosensitive component transversely penetrates the second molded portion to form a transverse air escape hole after the filter component is attached, so as to increase the difficulty of external dust entering the internal space of the molded base through the air escape hole, thereby helping to protect the photosensitive chip from contamination.

[0014] Another object of the present invention is to provide a camera module and a molded photosensitive component and a method for manufacturing the same, as well as an electronic device, wherein, in one embodiment of the present invention, the molded base of the molded photosensitive component is provided with a molded reinforcement portion at the notch, wherein the molded reinforcement portion extends outward from the second molded portion so as to facilitate glue filling at the notch after the filter component is attached, which helps to strengthen the attachment strength of the filter component at the notch, thereby enhancing the reliability of the camera module.

[0015] Another object of the present invention is to provide a camera module and a molded photosensitive component, a method for manufacturing the same, and an electronic device, wherein, in one embodiment of the present invention, the molded reinforcement portion of the module base of the molded photosensitive component can strengthen the connection strength between the second molded portion and the first molded portion at the notch, further enhancing the reliability of the camera module.

[0016] Another object of the present invention is to provide a camera module and a molded photosensitive component and a manufacturing method thereof and an electronic device, wherein, in one embodiment of the present invention, the second upper surface of the second molding part of the molding base is higher than the first upper surface of the first molding part, so as to form an external space around the second molding part, allowing the adhesive before curing to overflow to the outside, thereby ensuring the imaging quality of the camera module.

[0017] Another object of the present invention is to provide a camera module and a molded photosensitive component and a method for manufacturing the same, as well as an electronic device. In one embodiment of the present invention, the molded base of the molded photosensitive component has an external space reserved to help guide the adhesive before curing to overflow outward, so as to alleviate the adhesive before curing from overflowing inward, thereby reducing the adverse effects of the adhesive on the imaging quality of the camera module.

[0018] Another object of the present invention is to provide a camera module and a molded photosensitive component, a method for manufacturing the same, and an electronic device, wherein, in one embodiment of the present invention, the third molding part of the molding base of the molded photosensitive component is spaced apart from the second molding part so that the avoidance space between the third molding part and the second molding part is implemented as the external space, thereby preventing the third molding part from blocking the overflow of glue.

[0019] Another object of the present invention is to provide a camera module and a molded photosensitive component and a method for manufacturing the same, as well as an electronic device, wherein, in one embodiment of the present invention, the third upper surface of the third molding part of the molding base of the molded photosensitive component is higher than the upper surface of the filter component, so that the optical lens can be blocked from hitting the filter component by the third molding part, which helps to reduce the risk of breakage of the filter component.

[0020] Another object of the present invention is to provide a camera module and a molded photosensitive component and a manufacturing method thereof and an electronic device, wherein, in one embodiment of the present invention, the fourth molding part of the molding base of the molded photosensitive component is designed according to the installation height of the optical lens to meet the installation requirements of the optical lens of the camera module.

[0021] Another object of the present invention is to provide a camera module and a molded photosensitive component, a method for manufacturing the same, and an electronic device, wherein, in one embodiment of the present invention, the fourth molding portion of the molding base of the molded photosensitive component is recessed downward from the first molding portion to lower the installation height of the optical lens of the camera module, which helps to further reduce the height of the camera module.

[0022] Another object of the present invention is to provide a camera module and a molded photosensitive component and a method for manufacturing the same, and an electronic device, wherein, in order to achieve the above-mentioned object, no expensive materials or complicated structures are required in the present invention. Therefore, the present invention successfully and effectively provides a solution, which not only provides a simple camera module and a molded photosensitive component and a method for manufacturing the same, and an electronic device, but also increases the practicality and reliability of the camera module and the molded photosensitive component and a method for manufacturing the same, and an electronic device.

[0023] In order to achieve at least one of the above-mentioned invention objects or other objects and advantages, the present invention provides a molded photosensitive component for assembling with at least one optical lens into a camera module, wherein the molded photosensitive component comprises:

[0024] an imaging component;

[0025] A molded base, wherein the molded base comprises:

[0026] a first molding part, wherein the first molding part covers a portion of the imaging component, wherein the first molding part has a first upper surface; and

[0027] a second molding part, wherein the second molding part is integrally formed on the first upper surface of the first molding part, wherein the second molding part has a second upper surface and a second outer side surface; and

[0028] a light filtering member, wherein the light filtering member is correspondingly disposed on the second upper surface of the second molding part;

[0029] The second upper surface of the second molding part is higher than the first upper surface of the first molding part, so that an outer space is defined by the second outer side surface of the second molding part and the first upper surface of the first molding part.

[0030] In one embodiment of the present invention, the molding base also includes a third molding part, wherein the third molding part is integrally formed on the first upper surface of the first molding part, wherein the third molding part is located on the outside of the second molding part, and the third molding part is spaced apart from the second molding part.

[0031] In one embodiment of the present invention, the second upper surface of the second molding portion is a flat surface.

[0032] In one embodiment of the present invention, a distance between the third inner side surface of the third molding portion and the second outer side surface of the second molding portion is not less than 0.01 mm.

[0033] In an embodiment of the present invention, a height difference between the second upper surface of the second molding portion and the first upper surface of the first molding portion is between 0.03 mm and 0.2 mm.

[0034] In one embodiment of the present invention, the molded photosensitive component further includes an adhesive layer, wherein the adhesive layer is formed after the adhesive is cured, wherein the adhesive layer is located between the lower surface of the filter component and the second upper surface of the second molding part to attach the filter component to the second upper surface of the second molding part.

[0035] In one embodiment of the present invention, the second inner side surface of the second molding portion is located outside the first inner side surface of the first molding portion, so as to form an inner space inside the second molding portion.

[0036] In one embodiment of the present invention, the imaging component includes a circuit board, a photosensitive element conductively attached to the circuit board, and a group of electronic components conductively connected to the circuit board, wherein the third molding portion corresponds to the electronic components, and the third upper surface of the third molding portion is higher than the top surface of the electronic components.

[0037] In an embodiment of the present invention, the first upper surface of the first molding portion of the molding base is lower than the top surface of the electronic component.

[0038] In one embodiment of the present invention, the third outer side surface of the third molding part of the molding base is located on the inner side of the first outer side surface of the first molding part, so that the portion of the first upper surface of the first molding part located outside the third molding part is used to install the optical lens.

[0039] In one embodiment of the present invention, the molding base also includes a fourth molding part, wherein the fourth molding part is recessed downward from the first upper surface of the first molding part to form a peripheral groove on the outer periphery of the first molding part, wherein the fourth upper surface of the fourth molding part is used to provide a mounting surface for mounting the optical lens.

[0040] In one embodiment of the present invention, the molding base also includes a fourth molding part, wherein the fourth molding part extends upward from the first upper surface of the first molding part to form a peripheral protrusion on the outer periphery of the first molding part, wherein the fourth upper surface of the fourth molding part is used to provide a mounting surface for mounting the optical lens.

[0041] In one embodiment of the present invention, the third upper surface of the third molding portion of the molding base is higher than the second upper surface of the second molding portion.

[0042] In one embodiment of the present invention, the third upper surface of the third molding part is higher than the upper surface of the filter member, and the third upper surface of the third molding part is suitable for corresponding to the optical lens.

[0043] In an embodiment of the present invention, the third molding part is designed according to the size and position of the electronic component.

[0044] In one embodiment of the present invention, the adhesive layer is formed by curing a light-curing adhesive or a heat-curing adhesive.

[0045] In one embodiment of the present invention, the second molding portion of the molding base is provided with at least one notch, so that when the filter component is attached to the second upper surface of the second molding portion, an air escape hole is formed at the notch of the second molding portion, so as to connect the internal space of the molded photosensitive component with the outside of the molded photosensitive component through the air escape hole.

[0046] In one embodiment of the present invention, the second molding part of the molding base is provided with at least one notch, so that when the filter component is bonded to the second upper surface of the second molding part through the adhesive layer, an air escape hole is formed at the notch of the second molding part, so as to connect the internal space of the molded photosensitive component with the outside of the molded photosensitive component through the air escape hole.

[0047] In one embodiment of the present invention, the notch of the second molding portion extends transversely from the second inner side surface of the second molding portion to the second outer side surface of the second molding portion, so as to form the transversely arranged air escape holes.

[0048] In one embodiment of the present invention, the molded photosensitive component, wherein the molded base further includes a molded reinforcement portion, wherein the molded reinforcement portion is integrally extended outward from the second molded portion at the notch of the second molded portion.

[0049] In one embodiment of the present invention, the molded photosensitive component, wherein the molded reinforcement portion is integrally connected to the first molded portion to form a reinforcement rib between the second outer side surface of the second molded portion and the first upper surface of the first molded portion.

[0050] In one embodiment of the present invention, the molded photosensitive component further includes a reinforcing adhesive block, wherein the reinforcing adhesive block is formed by curing the adhesive applied to the notch of the second molding part.

[0051] According to another aspect of the present invention, the present invention further provides a camera module, at least one optical lens; and

[0052] Any of the molded photosensitive components described above, wherein each optical lens is correspondingly arranged in the molded photosensitive component, and the optical lens corresponds to the photosensitive path of the imaging component of the molded photosensitive component.

[0053] In one embodiment of the present invention, the camera module further includes at least one driver, wherein each of the drivers is assembled to the molded base of the molded photosensitive component, and each of the optical lenses is respectively assembled to the driver to assemble into a zoom camera module.

[0054] In one embodiment of the present invention, each of the optical lenses comprises a lens barrel and a lens group, wherein the lens barrel is disposed on the molded base of the molded photosensitive component, and each of the optical lenses is respectively assembled to the lens barrel to assemble into a fixed-focus camera module.

[0055] According to another aspect of the present invention, the present invention further provides an electronic device, comprising:

[0056] an electronic device body; and

[0057] At least one camera module as described above, wherein each camera module is arranged on the electronic device body to acquire images.

[0058] According to another aspect of the present invention, the present invention further provides a method for manufacturing a camera module, comprising the steps of:

[0059] A photosensitive element can be conductively mounted on a circuit board to form an imaging assembly;

[0060] A molding base is molded on the imaging component by a molding die, wherein the molding base includes a first molding part and a second molding part, wherein the first molding part covers a portion of the imaging component, wherein the second molding part is integrally formed on a first upper surface of the first molding part, and the second upper surface of the second molding part is higher than the first upper surface of the first molding part, so that an outer space is defined by a second outer side surface of the second molding part and the first upper surface of the first molding part;

[0061] Attaching the filter component to the second upper surface of the second molding part, and the filter component corresponds to the photosensitive path of the imaging component to assemble the molded photosensitive component; and

[0062] At least one optical lens is correspondingly arranged on the molded photosensitive component.

[0063] In one embodiment of the present invention, before the step of molding a molded base on the imaging component by a molding mold, the method further includes the following steps:

[0064] A group of electronic components are installed on the circuit board at intervals, wherein each of the electronic components is conductively connected to the circuit board.

[0065] In one embodiment of the present invention, in the step of molding a molded base on the imaging component by means of a molding mold:

[0066] The molding base further includes a third molding part, wherein the third molding part is integrally formed on the first upper surface of the first molding part, wherein the third molding part is located outside the second molding part, and the third molding part is spaced apart from the second molding part.

[0067] In one embodiment of the present invention, in the step of molding a molded base on the imaging component by means of a molding mold:

[0068] The second molding portion of the molding base is provided with at least one notch, wherein the notch extends from the second inner side surface of the second molding portion to the second outer side surface of the second molding portion.

[0069] In one embodiment of the present invention, the step of attaching the filter component to the second upper surface of the second molding portion to assemble the molded photosensitive component comprises the following steps:

[0070] applying adhesive to the second upper surface of the second molding portion;

[0071] The filter member is correspondingly arranged on the second mold part, and an air escape hole connecting the overflow space of the second mold part and the inner space of the first mold part is formed through the notch of the second mold part; and

[0072] The adhesive is heated or irradiated with light to form the adhesive layer between the lower surface of the filter member and the second upper surface of the second molding part.

[0073] In one embodiment of the present invention, the step of attaching the filter component to the second upper surface of the second molding portion to assemble the molded photosensitive component comprises the following steps:

[0074] Applying adhesive to the lower surface of the filter component;

[0075] The filter member is correspondingly arranged on the second mold part, and an air escape hole connecting the overflow space of the second mold part and the inner space of the first mold part is formed through the notch of the second mold part; and

[0076] The adhesive is heated or irradiated with light to form the adhesive layer between the lower surface of the filter member and the second upper surface of the second molding part.

[0077] In one embodiment of the present invention, the step of correspondingly arranging at least one optical lens on the molded photosensitive component comprises the steps of:

[0078] Assembling the optical lens to a driver; and

[0079] The driver is correspondingly assembled to the molded base of the molded photosensitive component to assemble into a zoom camera module.

[0080] In one embodiment of the present invention, the step of correspondingly arranging at least one optical lens on the molded photosensitive component comprises the steps of:

[0081] A lens barrel of the optical lens is assembled on the molded base of the molded photosensitive component, and a lens group of the optical lens corresponds to the photosensitive path of the imaging component to assemble into a fixed-focus camera module.

[0082] Further objects and advantages of the present invention will be fully apparent from an understanding of the following description and the accompanying drawings.

[0083] These and other objects, features and advantages of the present invention will be more fully understood from the following detailed description, accompanying drawings and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0084] Figure 1 A cross-sectional schematic diagram of an existing camera module is shown.

[0085] Figure 2 It is a stereoscopic schematic diagram of a camera module according to a first embodiment of the present invention.

[0086] Figure 3 A cross-sectional schematic diagram of the camera module according to the first embodiment of the present invention is shown.

[0087] Figure 4 A three-dimensional exploded schematic diagram of the molded photosensitive component of the camera module according to the first embodiment of the present invention is shown.

[0088] Figure 5A and 5B A first variant implementation of the camera module according to the above-mentioned first embodiment of the present invention is shown.

[0089] Figure 6 A second variant implementation of the camera module according to the above-mentioned first embodiment of the present invention is shown.

[0090] Figure 7 A third variant implementation of the camera module according to the first embodiment of the present invention is shown.

[0091] Figure 8 A fourth variant implementation of the camera module according to the first embodiment of the present invention is shown.

[0092] Fig. 9 A fifth variant implementation of the camera module according to the above-mentioned first embodiment of the present invention is shown.

[0093] Fig. 10A It is a cross-sectional schematic diagram of a camera module according to a second embodiment of the present invention.

[0094] Fig. 10B A three-dimensional exploded schematic diagram of the molded camera module of the camera module according to the above-mentioned second embodiment of the present invention is shown.

[0095] Fig.11A and 11B A modified implementation of the camera module according to the above-mentioned second embodiment of the present invention is shown.

[0096] Fig.12 A schematic diagram showing one of the manufacturing steps of a camera module according to a third embodiment of the present invention.

[0097] Fig.13A A schematic diagram showing the second manufacturing step of the camera module according to the third embodiment of the present invention is shown.

[0098] Fig. 13BA variant implementation of the second manufacturing step of the camera module according to the third embodiment of the present invention is shown.

[0099] Fig.14 A schematic diagram is shown of the third manufacturing step of the camera module according to the third embodiment of the present invention.

[0100] Fig.15 It is a schematic flow chart of a method for manufacturing a camera module according to an embodiment of the present invention.

[0101] Fig.16 A schematic diagram of the process of bonding the filter component in the manufacturing method of the camera module according to the present invention is shown.

[0102] Fig.17 A schematic diagram of the process of assembling an optical lens in the manufacturing method of the camera module according to the present invention is shown.

[0103] Fig.18 The present invention is an example of an electronic device equipped with the camera module according to the present invention. DETAILED DESCRIPTION

[0104] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not deviate from the spirit and scope of the present invention.

[0105] Those skilled in the art should understand that, in the disclosure of the present invention, the orientation or position relationship indicated by the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. are based on the orientation or position relationship shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0106] In the present invention, the term "one" in the claims and the specification should be understood as "one or more", that is, in one embodiment, the number of an element can be one, while in another embodiment, the number of the element can be multiple. Unless it is clearly indicated in the disclosure of the present invention that the number of the element is only one, the term "one" cannot be understood as unique or single, and the term "one" cannot be understood as a limitation on the quantity.

[0107] In the description of the present invention, it should be understood that "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through a medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0108] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0109] As the molding process becomes more mature, IOM (IR on Molding) technology is gradually being applied to the packaging process of camera modules to keep up with the trend of miniaturization and thinness. Figure 1 As shown, in order to further reduce the height of the existing camera module 1P, the portion of the molded base 32P where the filter 33P is attached is usually recessed downward to form the groove 35P, so that the portion of the molded base 32P where the filter 33P is attached is lower than the portion where the optical lens 2P is installed, so that the molded base 32P forms an inwardly concave stepped structure, so as to minimize the distance between the filter 33P and the photosensitive chip 311P of the imaging component 31P.

[0110] However, since the corner of the groove 35P of the molding base 32P is not a right angle, a transition arc surface 351P will be formed at the corner of the groove 35P due to the coating process during the molding process, so that the transition arc surface 351P will inevitably affect the molding base 32P to provide a flat attachment surface. Therefore, when attaching the filter 33P, the filter 33P has to avoid the transition arc surface 351P on the molding base 32P to ensure that the filter 33P is flatly attached to the molding base 32P. However, in order to avoid the transition arc surface 351P of the groove 35P, the edge of the filter 22P will have to move away from the outer wall of the groove 35P, so that the contact area between the filter 33P and the molded base 32P has to be reduced, that is, the bottom support area of ​​the filter 33P has to become smaller, resulting in a significant reduction in the connection strength between the filter 33P and the molded base 32P, thereby affecting the reliability of the camera module.

[0111] Therefore, in order to solve the above problems, the present invention provides a camera module and a molded photosensitive component and a manufacturing method thereof, so as to eliminate the adverse effects of the transition arc surface generated by the coating on the filter component during the molding process. Figures 2 to 4 As shown, a camera module 1 according to a first embodiment of the present invention is illustrated, wherein the camera module 1 includes a molded photosensitive component 10 and at least one optical lens 20, wherein the molded photosensitive component 10 includes an imaging component 11, a molded base 12 and a filter component 13, wherein the molded base 12 is molded on the imaging component 11, and the filter component 13 is attached to the molded base 12; wherein the optical lens 20 is correspondingly arranged on the molded photosensitive component 10, and the optical lens 20 corresponds to the light-sensitive path 110 of the imaging component 11, so as to be assembled into the camera module 1.

[0112] It is worth mentioning that although Figures 2 to 4 In the following description, the camera module includes only one optical lens 20 as an example to illustrate the features and advantages of the camera module of the present invention. It can be understood by those skilled in the art that the attached Figures 2 to 4 The camera module disclosed in the following description is only an example and does not constitute a limitation on the content and scope of the present invention. For example, in other examples of the camera module, the number of the optical lenses 20 may exceed one to form an array camera module.

[0113] In particular, if Figure 3As shown, the molded base 12 of the molded photosensitive component 10 includes a first molded portion 121, a second molded portion 122 and a third molded portion 123. The first molded portion 121 covers a portion of the imaging component 11. The second molding part 122 is integrally formed on the first upper surface 1211 of the first molding part 121, wherein the second molding part 122 has a second upper surface 1221, and the second upper surface 1221 of the second molding part 122 is higher than the first upper surface 1211 of the first molding part 121, so as to define an outer space 1201 through the second outer side surface 1222 of the second molding part 122 and the first upper surface 1211 of the first molding part 121, that is, the molding base 12 provides an attachment surface higher than the first upper surface 1211 for the filter component 13 through the second upper surface 1221 of the second molding part 122, so as to facilitate the attachment of the filter component 13 to the second molding part 122 of the molding base 12. The third molding part 123 is integrally formed on the first upper surface 1211 of the first molding part 121, wherein the third molding part 123 is located on the outer side of the second molding part 122, and the third molding part 123 and the second molding part 122 are spaced apart to form the outer space 1201 between the third molding part 123 and the second molding part 122.

[0114] In other words, in this embodiment of the present invention, the second molded portion 122 and the third molded portion 123 are integrally extended upward from the first upper surface 1211 of the first molded portion 121 to form the molded base 12 with an integrated structure. That is, the second molded portion 122 and the third molded portion 123 can be integrally formed on the first upper surface 1211 of the first molded portion 121 through a molding process, so that the entire molded base 12 has an integrated structure. It can be understood that the interior of the first molded portion 121 is penetrated from top to bottom to form the light window 120 of the molded base 12, wherein the second molded portion 122 surrounds the light window 120 of the molded base 12, and the light window 120 of the molded base 12 corresponds to the photosensitive path 110 of the imaging component 11.

[0115] In this way, although a transition arc surface is still formed at the connection between the third inner side surface 1233 of the third molding part 123 and the first upper surface 1211 of the first molding part 121 due to the coating during the molding process, since the second upper surface 1221 of the second molding part 122 is higher than the transition arc surface on the molding base 12, that is, the attachment surface of the filter component 13 is higher than the transition arc surface on the molding base 12, when the filter component 13 is attached to the attachment surface of the molding base 12 The edge of the filter component 13 can be within the outer space 1201 without avoiding the transition arc surface on the molding base 12, so that the edge of the filter component 13 can be as close to the third inner surface 1233 of the third molding part 123 as possible, which helps to increase the attachment area of ​​the filter component 13, that is, the bottom support area of ​​the filter component 13 is enlarged, which helps to enhance the connection strength between the filter component 13 and the molding base 12, thereby improving the reliability of the camera module 1.

[0116] Furthermore, if Figure 3 As shown, since the second upper surface 1221 of the second molding part 122 of the molding base 12 is higher than the first upper surface 1211 of the first molding part 121, and there is no border between the second upper surface 1221 of the second molding part 122 and the transition arc surface on the molding base 12, the molding base 12 can provide a flat attachment surface for the filter component 13 through the second upper surface 1221 of the second molding part 122.

[0117] Preferably, the second upper surface 1221 of the second molding part 122 is a flat surface, so that the filter component 13 can be flatly attached to the molding base 12, ensuring that the filter component 13 has good attachment quality. It is worth noting that, limited by the size of the mold pressure head of the molding process and the height of the camera module 1 itself, the height range of the second upper surface 1221 of the second molding part 122 relative to the first upper surface 1211 of the first molding part 121 is preferably implemented as 0.03 mm to 0.2 mm, that is, the height difference h between the second upper surface 1221 of the second molding part 122 and the first upper surface 1211 of the first molding part 121 is between 0.03 mm and 0.2 mm (e.g., Figure 3 This can not only meet the mold head size requirements of the molding process, but also avoid the installation height of the filter component 13 being too high due to the second upper surface 1221 of the second molding part 122 being too high, thereby increasing the height of the camera module 1 itself.

[0118] In addition, if Figure 3 and Figure 4 As shown, the third molding part 123 of the molding base 12 is located on the outside of the second molding part 122, and the third molding part 123 and the second molding part 122 are spaced apart to reserve the outer space 1201 of the molding base 12 between the third molding part 123 and the second molding part 122. In other words, the third inner side surface 1233 of the third molding part 123 is located outside the second outer side surface 1222 of the second molding part 122, that is, the minimum distance r3 between the third inner side surface 1233 of the third molding part 123 and the light sensing path 110 of the imaging component 11 is greater than the maximum distance R2 between the second outer side surface 1222 of the second molding part 122 and the light sensing path 110 of the imaging component 11, that is, r3>R2, so as to pass through the first upper surface 1211 of the first molding part 121 and the second upper surface 1221 of the second molding part 122 and the third molding part 123. The height difference between the third upper surface 1231 forms a groove on the molding base 12, that is, the outer space 1201 of the molding base 12 is formed between the third inner side surface 1233 of the third molding part 123 and the second outer side surface 1222 of the second molding part 122, so that when the filter component 13 is attached, the edge of the filter component 13 can extend into the outer space 1201 to approach the third inner side surface 1233 of the third molding part 123 without being affected by the transition arc surface between the third inner side surface 1233 of the third molding part 123 and the first upper surface 1211 of the first molding part 121.

[0119] Preferably, limited by the minimum mold head size of the molding process, the distance d between the third inner side surface 1233 of the third molding portion 123 and the second outer side surface 1222 of the second molding portion 122 is not less than 0.01 mm (e.g. Figure 3 As shown), that is, the width of the outer space 1201 of the molding base 12 is not less than 0.01 mm.

[0120] Of course, in this embodiment of the present invention, since the interior of the first molding part 121 penetrates vertically, the first inner side surface 1213 of the first molding part 121 defines the light window 120 of the molding base 12. Figure 3As shown, the minimum distance r2 between the second inner side surface 1223 of the second molding part 122 and the light-sensitive path 110 of the imaging component 11 is not less than the maximum distance r1 between the first inner side surface 1213 of the first molding part 121 and the light-sensitive path 110 of the imaging component 11, that is, r2 ≥ r1, to prevent the second molding part 122 from blocking the light-sensitive path 110 of the imaging component 11.

[0121] It is worth mentioning that in the first embodiment of the present invention, Figure 3 and Figure 4 As shown, the imaging component 11 includes a circuit board 111 and at least one photosensitive element 112, wherein each of the photosensitive elements 112 is respectively mounted on different positions of the circuit board 111 in a conductive manner, and the photosensitive area of ​​each of the photosensitive elements 112 corresponds to the corresponding optical lens 20. In addition, when the filter component 13 is correspondingly attached to the second molding portion 122 of the molding base 12, the filter component 13 corresponds to the photosensitive element 112, and an internal space 100 of the molded photosensitive component 10 is formed between the filter component 13 and the photosensitive element 112.

[0122] Furthermore, if Figure 3 and Figure 4 As shown, the molded photosensitive component 10 may further include an adhesive layer 14, wherein the adhesive layer 14 is formed after the adhesive is cured, and the adhesive layer 14 is located between the lower surface 131 of the filter component 13 and the second upper surface 1221 of the second molded portion 122, so as to firmly attach the filter component 13 to the molded base 12, so that the filter component 13 corresponds to the photosensitive path 110 of the imaging component 11. More specifically, when the filter component 13 is attached to the second molded portion 122 of the molded base 12, the lower surface 131 of the filter component 13 faces downward to face the imaging component 11, and the upper surface 132 of the filter component 13 faces upward to face the optical lens 20 accordingly.

[0123] Since the adhesive forming the bonding layer 14 has a certain fluidity before curing, especially when attaching the filter component 13, the filter component 13 will exert pressure on the adhesive before curing, causing the adhesive before curing to inevitably overflow. Therefore, the existence of the external space 1201 can also guide the adhesive to overflow outward, thereby reducing the inward overflow of the adhesive to a certain extent, so as to prevent the adhesive from flowing inward to the first inner side surface 1213 of the first molding part 121 and the photosensitive element 112 of the imaging component 11, thereby helping to reduce the risk of the adhesive affecting the imaging quality of the camera module 1.

[0124] In other words, it is precisely because the second upper surface 1221 of the second molding part 122 of the molding base 12 is higher than the first upper surface 1211 of the first molding part 121 that the outer space 1201 of the molding base 12 is located around the second molding part 122 and serves as an overflow space on the molding base 12 for accommodating the adhesive. Therefore, when the filter component 13 is attached to the second upper surface 1221 of the second molding part 122 by the adhesive, The outer periphery of the second molding part 122 can be located in the outer space 1201 of the molding base 12, so that the adhesive before curing can overflow outward to the outer space 1201 of the molding base 12 (that is, the outer space 1201 of the molding base 12 can serve as the overflow glue space of the molding base 12) to reduce the amount of the adhesive overflowing inward, which helps to reduce the risk of affecting the imaging quality of the camera module 1 due to the adhesive overflowing inward to the photosensitive element 112.

[0125] It is understandable that, for the existing camera module 1P, Figure 1 As shown, although the groove 35P provided on the molded base 32P can further reduce the distance between the filter 33P and the photosensitive chip 311P so as to minimize the thickness of the photosensitive component 30P, after the filter 33P is attached to the groove 35P of the molded base 32P, not only is there no space for glue overflow around the filter 33P, but the transition arc surface 351P of the groove 35P of the molded base 32P will inevitably block the glue used to bond the filter 33P from overflowing outwards, causing more glue to overflow inwards, which can easily cause the glue to overflow inwards to the photosensitive chip 311P of the imaging component 31P, causing contamination to the photosensitive chip 311P, thereby affecting the imaging quality of the camera module. In the camera module 1 of the first embodiment of the present invention, the molded base 12 of the molded photosensitive component 10 can not only provide a sufficiently large and flat attachment surface for securely and flatly attaching the filter component 13 without avoiding the transition arc surface; but also provide an overflow space for the adhesive to overflow outward, so as to alleviate the overflow of the adhesive before curing and affect the imaging quality of the camera module.

[0126] It is worth noting that in the above-mentioned first embodiment of the present invention, the adhesive layer 14 of the molded photosensitive component 10 can be, but is not limited to, formed by curing glue such as heat-curing glue, etc. In other words, the adhesive forming the adhesive layer 14 can be, but is not limited to, implemented as glue such as heat-curing glue, etc. Of course, in other examples of the present invention, the adhesive forming the adhesive layer 14 can also be implemented as other types of viscous materials such as light-curing glue, as long as the adhesive layer 14 can be formed to firmly attach the filter component 13 to the second upper surface 1221 of the second molding part 122, and the present invention will not repeat this.

[0127] According to the above first embodiment of the present invention, Figure 3 As shown, the imaging component 11 of the molded photosensitive component 10 of the present invention generally also includes a group of electronic components 113, wherein each of the electronic components 113 can be installed at intervals on the edge area of ​​the circuit board 111 through a process such as SMT (Surface Mount Technology), and each of the electronic components 113 is conductively connected to the circuit board 111. It can be understood that each of the electronic components 113 can be located around the photosensitive element 112, or on the same side or opposite sides of the photosensitive element 112. For example, in a specific example, all of the electronic components 113 can be divided into two columns and symmetrically arranged on both sides of the photosensitive element 112.

[0128] However, since there is a minimum thickness in the molding process, too small a molding thickness will lead to difficulties in molding imaging. Therefore, in order to ensure that the molding base 12 can completely cover the electronic component 113, the third molding portion 123 of the molding base 12 preferably corresponds to the electronic component 113 of the imaging component 11, and the third upper surface 1231 of the third molding portion 123 is higher than the top surface of the electronic component 113, corresponding to the electronic component 113 of the imaging component 11, so as to ensure that there is sufficient molding thickness above the electronic component 113 through the third molding portion 123.

[0129] In other words, Figure 3 and Figure 4As shown, the third molding part 123 is integrally formed on the first upper surface 1211 of the first molding part 121, so that the third upper surface 1231 of the third molding part 123 is higher than the first upper surface 1211 of the first molding part 121. In addition, since the third molding part 123 corresponds to the electronic component 113 of the imaging assembly 11, the first upper surface 1211 of the first molding part 121 does not need to be higher than the top surface of the electronic component 113, so that the electronic component 113 is completely covered by the third molding part 123 and the first molding part 121. It is understandable that the molded base 12 covers each of the electronic components 113 after molding, so as to isolate adjacent electronic components 113 and isolate the electronic components 113 from the photosensitive element 112 through the molded base 12, so that there will be no adverse phenomenon of mutual interference between adjacent electronic components 113, and the imaging quality of the camera module 1 can be guaranteed even when the distance between adjacent electronic components 113 is relatively close. In this way, more electronic components 113 can be mounted on the circuit board 111 with a small area, so that the structure of the molded photosensitive component 10 is more compact, which is conducive to improving the imaging quality of the camera module 1 on the basis of controlling the size of the camera module 1.

[0130] It is worth noting that, precisely because the first upper surface 1211 of the first molding part 121 can be lower than the top surface of the electronic component 113, the second upper surface 1221 of the second molding part 122 can be unaffected by the size of the electronic component 113, that is, the second upper surface 1221 of the second molding part 122 can also be lower than the top surface of the electronic component 113, so the second upper surface 1221 of the second molding part 122 can also be lowered, so that the attachment height of the filter component 13 can be reduced, which helps to shorten the distance between the filter component 13 and the photosensitive element 112 of the imaging component 11, so as to reduce the back focus of the camera module 1, which is beneficial to reduce the height of the camera module 1.

[0131] It is worth mentioning that in this first embodiment of the present invention, the filter component 13 includes at least one filter element, wherein each of the filter elements is respectively correspondingly arranged at the photosensitive element 112 of the imaging component 11, so as to form each of the internal spaces 100 respectively between each of the filter elements and the photosensitive element 112. In addition, the filter element is located between the optical lens 20 and the photosensitive element 112, so that the light entering the interior of the camera module 1 from the optical lens 20 can be received and photoelectrically converted by the photosensitive area of ​​the photosensitive element 112 only after passing through the filtering of the filter element, thereby improving the imaging quality of the camera module. For example, the filter element can filter the infrared part of the light entering the interior of the camera module 1 from the optical lens 20. Of course, in other examples of the present invention, the filter component 13 may also include an attachment frame (not shown in the figure), wherein the attachment frame is located at the edge of the filter element, so as to avoid direct contact between the filter element and the adhesive layer 14 through the attachment frame, so as to avoid the filter element being contaminated or corroded by the adhesive layer 14, thereby effectively extending the service life of the filter element. It is understandable that in different examples of the camera module 1, the filter element can be implemented as different types, for example, the filter element can be implemented as an infrared cutoff filter, a full spectrum filter, and other filters or a combination of multiple filters.

[0132] In addition, according to the above-mentioned first embodiment of the present invention, referring to the attached Figure 2 and Figure 3The camera module 1 may further include at least one driver 30, wherein each of the optical lenses 20 is respectively assembled to each of the drivers 30, and each of the drivers 30 is respectively assembled to the third upper surface 1231 of the third molding portion 123 of the molding base 12, so that each of the optical lenses 20 is respectively maintained in the light-sensitive path 110 of the imaging component 11 of the molded photosensitive component 10 to assemble into a zoom camera module. In addition, when the camera module 1 is used, the driver 30 can drive the optical lens 20 to move back and forth along the light-sensitive path 110 of the imaging component 11, so as to adjust the focal length of the camera module 1 by adjusting the distance between the optical lens 20 and the photosensitive element 112. The type of the driver 30 of the camera module of the present invention is not limited, and the driver 30 can be implemented as a voice coil motor, which can be electrically connected to the circuit board 111, so as to be in a working state after receiving power and a control signal, and drive the optical lens 20 to move back and forth along the light-sensitive path 110 of the imaging component 11. Nevertheless, it can be understood by those skilled in the art that the type of the driver 30 is not limited, as long as it can drive the optical lens 20 to move back and forth along the light-sensitive path 110 of the imaging component 11.

[0133] Specifically, if Figure 2 and Figure 3 As shown, the optical lens 20 of the camera module 1 includes a lens barrel 22 and a lens group 21, wherein the lens barrel 22 is assembled to the driver 30, and the lens group 21 is assembled to the lens barrel 22, wherein the driver 30 is installed on the third upper surface 1231 of the third molding portion 123 of the molding base 12, so that the lens group 21 of the optical lens 20 is maintained in the photosensitive path 110 of the imaging component 11 of the molded photosensitive component 10 by the driver 30.

[0134] It is understandable that in other examples of the present invention, the camera module 1 may not include any driver 30. In other words, the lens barrel 22 of the optical lens 20 is directly assembled to the third upper surface 1231 of the third molding portion 123 of the molding base 12, wherein the lens group 21 is assembled to the lens barrel 22, so that the lens group 21 of the optical lens 20 is maintained in the light-sensitive path 110 of the imaging component 11 of the molded photosensitive component 10 by the lens barrel 22. Of course, in another example of the present invention, the lens barrel 22 of the optical lens 20 may also be integrally solidified and molded with the third molding portion 123 of the molding base 12 through a molding process by molding materials, thereby enhancing the stability and reliability of the camera module 1, which will not be described in detail in the present invention.

[0135] Attached Figure 5A and 5B The first variant implementation of the camera module 1 according to the first embodiment of the present invention is shown. Specifically, compared with the first embodiment of the present invention, the difference of the camera module 1 according to the first variant implementation of the present invention is that the third outer side surface 1232 of the third molding part 123 of the molding base 12 is located on the inner side of the first outer side surface 1212 of the first molding part 121, that is, the maximum distance R3 between the third outer side surface 1232 of the third molding part 123 and the photosensitive path 110 of the imaging component 11 is less than the minimum distance R1 between the first outer side surface 1212 of the first molding part 121 and the photosensitive path 110 of the imaging component 11, that is, R3<R1, so as to reserve installation space for the driver 30 on the first upper surface 1211 of the first molding part 121 and the outer side of the third molding part 123, so as to install the driver 30 to the first upper surface 1211 of the first molding part 121, which helps to reduce the overall height of the camera module 1.

[0136] In other words, Figure 5A As shown, the third outer side surface 1232 of the third molding part 123 of the molding base 12 is located inside the first outer side surface 1212 of the first molding part 121, so that the driver 30 can be directly mounted on the first upper surface 1211 of the first molding part 121 of the molding base 12. Since the first upper surface 1211 of the first molding part 121 is lower than the third upper surface 1231 of the third molding part 123, the installation height of the driver 30 is reduced, which helps to reduce the overall height of the camera module 1.

[0137] It is worth mentioning that in this variant embodiment of the present invention, since the third molded part 123 only needs to cover the top of the electronic component 113, that is, the position of the third molded part 123 only corresponds to the electronic component 113 of the imaging assembly 11, the third molded part 123 does not need to have a ring structure, and the position and size of the third molded part 123 can be designed according to the position and size of the electronic component 113. For example, Figure 5BAs shown, when all of the electronic components 113 are located only outside the long sides of the filter component 13, the third molded portion 123 can be implemented as two strip-shaped protrusions located outside the long sides of the filter component 13, so that all of the electronic components 113 can be covered by the strip-shaped protrusions, and the third molded portion 123 is not arranged outside the short sides of the filter component 13 to reduce the weight of the molding base 12.

[0138] Preferably, if Figure 5A As shown, the height of the third molding part 123 is greater than that of the second molding part 122, that is, the third upper surface 1231 of the third molding part 123 is higher than the second upper surface 1221 of the second molding part 122, so that the third molding part 123 is easier to mold. Figure 1 In the existing camera module shown, although there is still a transition arc surface at the connection between the third inner side surface 1233 of the third molding part 123 and the first upper surface 1211 of the first molding part 121, the second upper surface 1221 of the second molding part 122 is higher than the first upper surface 1211 of the first molding part 121 (i.e., the second upper surface 1221 of the second molding part 122 is located above the transition arc surface). In this way, when the filter component 13 is attached to the second upper surface 1221 of the second molding part 122, the edge of the filter component 13 does not need to avoid the transition arc surface, so that the edge of the filter component 13 can be closer to the third molding part 123, so as to maximize the bottom support area of ​​the filter component 13, which helps to improve the reliability of the camera module 1.

[0139] More preferably, if Figure 5A As shown, the third upper surface 1231 of the third molding part 123 is higher than the upper surface 132 of the filter member 13, and the third upper surface 1231 of the third molding part 123 corresponds to the optical lens 20, so that the minimum distance between the third upper surface 1231 of the third molding part 123 and the optical lens 20 is smaller than the minimum distance between the upper surface 132 of the filter member 13 and the optical lens 20. In this way, during the process of focusing or adjusting the focus of the camera module 1, when the optical lens 20 is driven by the driver 30 to approach the photosensitive element 112 of the imaging component 11, the third molding part 123 can also block the optical lens 20 from contacting the filter member 13 to prevent the optical lens 20 from colliding with the filter member 13, thereby effectively protecting the filter member 13 and the optical lens 20 from damage.

[0140] Most preferably, Figure 5AAs shown, the third upper surface 1231 of the third molded portion 123 only corresponds to the lens barrel 22 of the optical lens 20, so that when the optical lens 20 is driven by the driver 30 to approach the photosensitive element 112 of the imaging component 11, the third molded portion 123 can only contact with the lens barrel 22 of the optical lens 20 to block the optical lens 20 from contacting the filtering component 13, thereby avoiding the third molded portion 123 from colliding with the lens group 21 of the optical lens 20, which helps to protect the lens group 21 of the optical lens 20.

[0141] Attached Figure 6 The second variant embodiment of the camera module 1 according to the first embodiment of the present invention is shown. Specifically, compared with the first variant embodiment of the present invention, the difference of the camera module 1 according to the second variant embodiment of the present invention is that the molded base 12 of the molded photosensitive component 10 may also include a fourth molded portion 124, wherein the fourth molded portion 124 is recessed downward from the first upper surface 1211 of the first molded portion 121, and the fourth molded portion 124 is located on the outer side of the third molded portion 123, so as to form a peripheral groove on the outer periphery of the first molded portion 121, so that the bottom surface of the peripheral groove serves as the fourth upper surface 1241 of the fourth molded portion 124, so as to provide a mounting surface of the driver 30 (or the optical lens 20) through the fourth upper surface 1241 of the fourth molded portion 124, so that the driver 30 (or the optical lens 20) can be installed on the fourth upper surface 1241 of the fourth molded portion 124.

[0142] In other words, the fourth upper surface 1241 of the fourth molded part 124 is lower than the first upper surface 1211 of the first molded part 121, which helps to further reduce the installation height of the driver 30, thereby further reducing the overall height of the camera module 1. In particular, in this second variant embodiment of the present invention, the fourth molded part 124 is located at the outer periphery of the first molded part 121, so that the fourth upper surface 1241 of the fourth molded part 124 can be significantly lower than the top surface of the electronic component 113, which helps to minimize the installation height of the driver 30, so that the height of the camera module 1 is minimized.

[0143] Preferably, if Figure 6As shown, the fourth upper surface 1241 of the fourth molding part 124 matches the end face of the driver 30, so that when the driver 30 is installed to the fourth upper surface 1241 of the fourth molding part 124, the outer peripheral surface of the driver 30 is flush with the first outer surface 1212 of the first molding part 121 of the molding base 12, which helps to minimize the size of the camera module 1 and also helps to beautify the appearance of the camera module 1.

[0144] Attached Figure 7 The third variant implementation of the camera module 1 according to the first embodiment of the present invention is shown. Specifically, compared with the first variant implementation of the present invention, the difference of the camera module 1 according to the third variant implementation of the present invention is that the molded base 12 of the molded photosensitive component 10 may also include a fourth molded portion 124', wherein the fourth molded portion 124 extends upward from the first upper surface 1211 of the first molded portion 121, and the fourth molded portion 124' is located on the outer side of the third molded portion 123 to form a peripheral protrusion on the outer periphery of the first molded portion 121, so as to provide a mounting surface for the driver 30 (or the optical lens 20) through the fourth upper surface 1241' of the fourth molded portion 124', so as to meet the installation requirements of the driver 30. In other words, limited by the installation requirements of the driver 30 and the optical lens 20, the height of the fourth upper surface 1241' of the fourth molding part 124' needs to be designed according to the installation requirements of the driver 30, so that the driver 30 can be adaptively installed on the fourth upper surface 1241' of the fourth molding part 124'. For example, the fourth upper surface 1241' of the fourth molding part 124' can be higher than the first upper surface 1211 of the first molding part 121, and lower than the third upper surface 1231 of the third molding part 123. Of course, in other examples of the present invention, the fourth upper surface 1241' of the fourth molding part 124' can also be higher than the third upper surface 1231 of the third molding part 123 to meet the installation requirements of the driver 30.

[0145] Attached Figure 8The fourth variant implementation of the camera module 1 according to the first embodiment of the present invention is shown. Specifically, compared with the first embodiment of the present invention, the difference of the camera module 1 according to the fourth variant implementation of the present invention is that the molded base 12 of the molded photosensitive component 10 does not include the third molded part 123, wherein the first upper surface 1211 of the first molded part 121 of the molded base 12 is higher than the top surface of the electronic component 113 of the imaging component 11, so as to completely cover the electronic component 113 through the first molded part 121, wherein the driver 30 is directly mounted to the first upper surface 1211 of the first molded part 121.

[0146] In addition, if Figure 8 As shown, the second outer side surface 1222 of the second molding part 122 is located within the first outer side surface 1212 of the first molding part 121, that is, the maximum distance R2 between the second outer side surface 1222 of the second molding part 122 and the photosensitive path 110 of the imaging component 11 is smaller than the minimum distance R1 between the first outer side surface 1212 of the first molding part 121 and the photosensitive path 110 of the imaging component 11, that is, R2<R1, so as to form an outer step structure on the molding base 12 through the first molding part 121 and the second molding part 122. In this way, the outer step structure of the molding base 12 will form the outer space 1201 of the molding base 12, that is, the second outer side surface 1222 of the second molding part 122 and the first upper surface 1211 of the first molding part 121 will define the outer space 1201 of the molding base 12, so that when the filter component 13 is attached to the second upper surface 1221 of the second molding part 122, the adhesive before curing can overflow outward to the outer space 1201 of the molding base 12 (serving as the overflow glue space of the molding base 12) to reduce the risk of affecting the imaging quality of the camera module 1 due to the overflow of the adhesive inward to the photosensitive element 112.

[0147] Attached Fig. 9The fifth variant implementation of the camera module 1 according to the first embodiment of the present invention is shown. Specifically, compared with the fourth variant implementation of the present invention, the difference of the camera module 1 according to the fifth variant implementation of the present invention is that the second inner side surface 1223 of the second molded portion 122 of the molded base 12 of the molded photosensitive component 10 is located outside the first inner side surface 1213 of the first molded portion 121, that is, the minimum distance r2 between the second inner side surface 1223 of the second molded portion 122 and the photosensitive path 110 of the imaging component 11 is greater than the minimum distance r2 between the first inner side surface 1213 of the first molded portion 121 and the photosensitive path 110 of the imaging component 11. The maximum distance r1 between the light paths 110, i.e., r2>r1, is to form an inner space 1202 of the molding base 12 through the second inner side surface 1223 of the second molding part 122 and the first upper surface 1211 of the first molding part 121, wherein the inner space 1202 is located on the inner side of the second molding part 122 (to serve as an inner overflow glue space of the molding base 12), and is used to store the adhesive overflowing inward from the second upper surface 1221 of the second molding part 122 to prevent the adhesive from overflowing inward to the photosensitive area of ​​the photosensitive element 112, which helps to ensure the imaging quality of the camera module 1.

[0148] It is worth mentioning that, since the filter component 13 is adhered to the second upper surface 1221 of the second molding part 122 through the adhesive layer 14, the filter component 13 will seal the light window 120 of the molding base 12, so the internal space 100 between the filter component 13 and the photosensitive element 112 of the imaging assembly 11 will form a closed space. When the adhesive forming the adhesive layer 14 is a thermosetting adhesive, after applying a circle of the thermosetting adhesive between the filter component 13 and the second upper surface 1221 of the second molding part 122 of the molding base 12, the thermosetting adhesive needs to be heated or baked so that the thermosetting adhesive can be completely cured to form the adhesive layer 14 with a ring structure. Thus, when the heat-curing adhesive is heated, the gas in the enclosed space between the filter component 13 and the imaging assembly 11 will expand due to the heat, exerting an outward force on the filter component 13, which may cause the filter component 13 to deflect or warp, and in severe cases, may cause the filter component 13 to rupture. At the same time, the expansion of the gas in the enclosed space will also exert pressure on the photosensitive element 112, which may also cause damage to the photosensitive element 112, making it difficult to assemble the camera module 1 and greatly reducing the reliability of the camera module 1.

[0149] Therefore, in order to solve the above problems, a second embodiment of the present invention provides a camera module and a molded photosensitive component. Specifically, Fig. 10A and Fig. 10B As shown, compared with the above-mentioned first embodiment of the present invention, the difference of the camera module 1 of the second embodiment of the present invention is that the second molding part 122 of the molding base 12 of the molded photosensitive component 10 is that: when the filter component 13 is attached to the second upper surface 1221 of the second molding part 122, an escape hole 1203 of the module base 12 is formed at the notch 1224 of the second molding part 122, so that the internal space 100 of the molded photosensitive component 10 is connected with the outside of the molded photosensitive component 10 through the escape hole 1203, so that the internal space 100 of the molded photosensitive component 10 forms a non-enclosed space.

[0150] In this way, when the adhesive is heated to cure, the gas in the internal space 100 of the molded photosensitive component 10 can escape through the escape hole 1203, so that the gas pressure in the internal space 100 of the molded photosensitive component 10 remains constant (equal to atmospheric pressure), avoiding the application of force to the filter component 13 and the photosensitive element 112, and helping to protect the filter component 13 and the photosensitive element 112 from being damaged by gas expansion. Of course, after the adhesive is heated to cure, the gas in the internal space 100 of the molded photosensitive component 10 will shrink in volume due to cooling, and at this time, the gas outside the molded photosensitive component 10 can enter the internal space 100 of the molded photosensitive component 10 through the escape hole 1203, so as to keep the gas pressure in the internal space 100 constant, and avoid the filter component 13 and the photosensitive element 112 from being damaged by heating or cooling.

[0151] It is understandable that in Figure 1 In the existing camera module 1P shown, since the filter 33P is directly attached to the groove 35P of the mold base 32P, it is extremely difficult to set a notch on the mold base 32P to form an air escape hole, which makes it difficult for the internal space of the molded photosensitive component 3P to form a non-enclosed space. In the camera module 1 of the present invention, it is precisely because the second molded part 122 extends upward from the first molded part 121 to form a protrusion on the first upper surface 1211 of the first molded part 121, so that the second molded part 122 is easy to set a notch, so the second molded part 122 can not only provide a flat attachment surface for the filter component 13, but also provide convenient conditions for forming the air escape hole 1203 on the molded base 12.

[0152] Furthermore, if Fig. 10A and Fig. 10B As shown, the notch 1224 of the second molded part 122 extends transversely from the second inner side surface 1223 of the second molded part 122 to the second outer side surface 1222 of the second molded part 122, so as to form a transverse notch in the second molded part 122. In this way, when the filter component 13 is bonded to the second upper surface 1221 of the second molded part 122 through the adhesive layer 14, the notch 1224 of the second molded part 122 will form a transversely arranged air escape hole 1203, so as to increase the difficulty of dust entering the internal space 100 of the molded photosensitive component 10 through the air escape hole 1203, which helps to ensure the working performance of the camera module 1.

[0153] Preferably, if Fig. 10A As shown, the notch 1224 of the second molded part 122 corresponds to the long side of the filter component 13, so that the two sides of the notch 1224 have the longer adhesive layer 14 to adhere the filter component 13, so as to enhance the bonding strength between the filter component 13 and the second molded part 122. Of course, in other examples of the present invention, the notch 1224 of the second molded part 122 can also be located at other positions corresponding to the filter component 13, as long as the escape hole 1203 that connects the internal space 100 of the molded photosensitive component 10 with the outside of the molded photosensitive component 10 can be formed, and the present invention will not repeat it.

[0154] More preferably, if Fig. 10AAs shown, after the adhesive is cured to form the adhesive layer 14, the adhesive may be applied again at the notch 1224 of the second molded part 122 to form a reinforcing adhesive block 15 after the adhesive is cured, so as to enhance the bonding strength between the filter component 13 and the second molded part 122 at the notch 1224 through the reinforcing adhesive block 15, so as to ensure that the filter component 13 is firmly attached to the second molded part 122. In other words, the adhesive may be applied at the air escape hole 1203 of the molded base 12 to form the reinforcing adhesive block 15 for enhancing the bonding strength between the filter component 13 and the second molded part 122. In addition, the reinforcing adhesive block 15 may also block the air escape hole 1203 to prevent external dust from entering the internal space 100 of the molded photosensitive component 10 through the air escape hole 1203, which helps to ensure the imaging quality of the camera module 1. It can be understood that although the reinforced adhesive block 15 will block the escape hole 1203, the filter component 13 has been firmly attached to the molded base 12 by the adhesive layer 14, and the temperature changes little during the subsequent assembly and use process, so that the air pressure change in the internal space 100 of the molded photosensitive component 10 is also small, so the temperature change is not enough to cause a substantial impact on the filter component 13.

[0155] Attached Fig.11A and Fig. 11B A modified implementation of the camera module 1 according to the above-mentioned second embodiment of the present invention is shown, wherein the molded base 12 of the molded photosensitive component 10 may also include a molded reinforcement portion 125, wherein the molded reinforcement portion 125 integrally extends outward from the second outer side surface 1222 of the second molded portion 122 at the notch 1224 of the second molded portion 122, so that the bonding area of ​​the adhesive layer 14 at the notch 1224 becomes larger, which helps to increase the bonding strength between the filter component 13 and the second molded portion 122 at the notch 1224, so as to prevent the filter component 13 from cracking at the notch 1224 of the second molded portion 122 due to insufficient bonding strength of the adhesive layer 14.

[0156] Preferably, if Fig.11A As shown, the molded reinforcement portion 125 is integrally connected to the first molded portion 121 to form a reinforcement rib between the second outer side surface 1222 of the second molded portion 122 and the first upper surface 1211 of the first molded portion 121, which helps to enhance the connection strength between the second molded portion 122 and the first molded portion 121 at the notch 1224.

[0157] It is worth mentioning that in other examples of the present invention, the molded reinforcement portion 125 can be integrally extended from the second molded portion 122 to the third molded portion 123, so that one end of the molded reinforcement portion 125 is integrally connected to the second molded portion 122, and the other end of the molded reinforcement portion 125 is integrally connected to the third molded portion 123, which helps to further enhance the connection strength of the second molded portion 122 at the notch 1224.

[0158] In addition, in this modified embodiment of the present invention, the molded reinforcement portion 125 will extend the length of the notch 1224 of the second molded portion 122, so that the length of the vent hole 1203 of the molded base 12 is also lengthened, which helps to further increase the difficulty of external dust entering the internal space 100 of the molded photosensitive component 10 through the vent hole 1203. It can be understood that if Fig. 11B As shown, since the molded reinforcement part 125 protrudes from the second outer side surface 1222 of the second molded part 122, it helps to guide workers or machines to apply adhesive (such as glue filling) at the molded reinforcement part 125 to form the reinforced bonding block 15. In addition, the molded reinforcement part 125 can also prevent the adhesive before curing from flowing freely, so as to completely block the air escape hole 1203 and maximize the bonding strength between the filter component 13 and the second molded part 122 at the notch 1224. It is worth noting that in the second embodiment of the present invention, except for the above-mentioned structural differences, the other structures of the camera module 1 are the same as the structures of the camera module 1 according to the first embodiment of the present invention, and the camera module 1 also has various deformation implementations similar to or the same as the various deformation implementations of the camera module 1 of the first embodiment, which will not be repeated here.

[0159] It is worth mentioning that the reference Figure 12 to Figure 14 FIG. 1 is a schematic diagram of a manufacturing process of a molded photosensitive component 10 and a manufacturing process of a camera module 1 according to a third embodiment of the present invention. It should be understood by those skilled in the art that Figure 12 to Figure 14 The manufacturing process of the molded photosensitive component 10 and the manufacturing process of the camera module 1 shown in the figure are only used as examples to illustrate the features and advantages of the present invention, and do not constitute a limitation on the content and scope of the present invention.

[0160] Specifically, in the attached Fig.12In the process, the photosensitive element 112 is firstly conductively mounted on the circuit board 111 to assemble the imaging component 11; and then the first molding part 121 of the molding base 12, the second molding part 122 having the notch 1224, and the third molding part 123 located on the outer side of the second molding part 122 are molded on the imaging component 11 by means of a molding mold, wherein the first upper surface 1211 of the first molding part 121 is lower than the second upper surface 1221 of the second molding part 122 in the height direction, and the third molding part 123 is spaced from the second molding part 122 to form an outer space 1201 between the third molding part 123 and the second molding part 122. It can be understood that the present invention can design the upper mold of the forming mold (such as the position distribution and size of the protrusions in the upper mold, etc.) so that when the molding base 12 is molded, a gap or groove (i.e., the outer space 1201) is formed between the second molding part 122 and the third molding part 123, so that the edge of the filter component 13 can be accommodated in the outer space 1201 without avoiding the transition arc surface on the molding base 12, which can effectively eliminate the adverse effects of the transition arc surface on the molding base 12 on the attached filter component 13.

[0161] In the attached Fig.13A In the process, an adhesive is first applied on the second upper surface 1221 of the second molding part 122 of the molding base 12, and after the filter component 13 is correspondingly arranged on the light window 120 of the molding base 12, the adhesive is cured to form an adhesive layer 14 located between the lower surface 131 of the filter component 13 and the second upper surface 1221 of the second molding part 122, so that the filter component 13 is firmly bonded to the second molding part 122 of the molding base 12 through the adhesive layer 14, so as to be assembled into the molded photosensitive component 10. At the same time, the escape hole 1203 of the molding base 12 is formed at the notch 1224 of the second molding part 122, so that the internal space 100 of the molded photosensitive component 10 is connected with the outside of the molded photosensitive component 10 through the escape hole 1203, so that the internal space 100 of the molded photosensitive component 10 is implemented as a non-enclosed space.

[0162] In the attached Fig. 13BIn a variant embodiment shown, an adhesive may be first applied correspondingly to the lower surface 131 of the filter component 13, so that after the filter component 13 is correspondingly arranged on the light window 120 of the molding base 12, the adhesive is cured to form an adhesive layer 14 located between the lower surface 131 of the filter component 13 and the second upper surface 1221 of the second molding part 122, so that the filter component 13 can be firmly bonded to the second molding part 122 of the molding base 12 through the adhesive layer 14 to assemble the molded photosensitive component 10. At the same time, the escape hole 1203 of the molding base 12 is formed at the notch 1224 of the second molding part 122, so that the internal space 100 of the molded photosensitive component 10 is connected with the outside of the molded photosensitive component 10 through the escape hole 1203, so that the internal space 100 of the molded photosensitive component 10 is implemented as a non-enclosed space.

[0163] It is worth noting that in this embodiment of the present invention, a whole circle of adhesive may be continuously applied to the second molded part 122 or the filter member 13, but is not limited to, to form the adhesive layer 14 having an annular structure after the adhesive is cured. Of course, in other examples of the present invention, adhesive may be intermittently applied to the second molded part 122 or the filter member 13, to form the adhesive layer 14 having a non-annular structure after the adhesive is cured, so that air escape holes will also be formed at the discontinuities of the adhesive layer 14.

[0164] In the attached Fig.14 In the process, the adhesive is first applied again at the escaping hole 1203 of the molding base 12 to form the reinforcing adhesive block 15 for sealing the escaping hole 1203 after the adhesive is cured, so as to enhance the bonding strength of the adhesive layer 14 at the notch 1224 of the second molding part 122 through the reinforcing adhesive block 15; and then the optical lens 20 is assembled to the driver 30, and the driver 30 is assembled to the third upper surface 1231 of the third molding part 123 of the molding base 12, so that the optical lens 20 is maintained in the light-sensitive path 110 of the imaging component 11, thereby assembling the camera module 1.

[0165] According to another aspect of the present invention, Figures 15 to 17 As shown, an embodiment of the present invention further provides a method for manufacturing a camera module. Specifically, Fig.15 As shown, the manufacturing method of the camera module 1 includes the steps of:

[0166] S410: conductively mounting a photosensitive element 112 on a circuit board 111 to form an imaging component 11;

[0167] S420: Using a molding mold, a mold base 12 is molded on the imaging component 11, wherein the mold base 12 includes a first mold portion 121 and a second mold portion 122, wherein the first mold portion 121 covers a portion of the imaging component 11, wherein the second mold portion 122 is integrally formed on a first upper surface 1211 of the first mold portion 121, and the second upper surface 1221 of the second mold portion 122 is higher than the first upper surface 1211 of the first mold portion 121, so that an outer space 1201 is defined by a second outer side surface 1222 of the second mold portion 122 and the first upper surface 1211 of the first mold portion 121;

[0168] S430: attaching the filter component 13 to the second upper surface 1221 of the second molding portion 122 to assemble the molded photosensitive component 10; and

[0169] S440: correspondingly disposing at least one optical lens 20 on the molded photosensitive component 10.

[0170] It is worth noting that in this example of the present invention, Fig.15 As shown, before step S420, the manufacturing method of the camera module 1 may further include the following steps:

[0171] S400 : Installing a group of electronic components 113 on the circuit board 111 at intervals, wherein each of the electronic components 113 is conductively connected to the circuit board 111 .

[0172] Furthermore, in an example of the present invention, the molding base 12 also includes a third molding part 123, wherein the third molding part 123 is integrally formed on the first upper surface 1211 of the first molding part 121, wherein the third molding part 123 is located on the outer side of the second molding part 122, and the third molding part 123 and the second molding part 122 are spaced apart to form the outer space 1201 between the third inner side surface 1233 of the third molding part 123 and the second outer side surface 1222 of the second molding part 122.

[0173] In an example of the present invention, the second molding portion 122 of the molding base 12 is provided with at least one notch 1224 , wherein the notch 1224 extends from the second inner side surface 1223 of the second molding portion 122 to the second outer side surface 1222 of the second molding portion 122 .

[0174] It is worth mentioning that, in one example of the present invention, Fig.16 As shown, the step S430 of the manufacturing method of the camera module 1 may include the steps of:

[0175] S431: applying adhesive to the second upper surface 1221 of the second molding part 122;

[0176] S432: correspondingly arranging the filter component 13 on the second molding part 122, and forming an air escape hole 1203 connecting the inner space 100 of the molded photosensitive component 10 with the outside of the molded photosensitive component 10 through the notch 1224 of the second molding part 122; and

[0177] S433 : heating or irradiating the adhesive to form the adhesive layer 14 between the lower surface 131 of the filter member 13 and the second upper surface 1221 of the second molding part 122 .

[0178] Furthermore, in another example of the present invention, Fig.16 As shown, the step S430 of the manufacturing method of the camera module 1 may also include the steps of:

[0179] S431′: applying adhesive to the lower surface 131 of the filter component 13;

[0180] S432′: correspondingly arranging the filter component 13 on the second molding part 122, and forming an air escape hole 1203 connecting the inner space 100 of the molded photosensitive component 10 with the outside of the molded photosensitive component 10 through the notch 1224 of the second molding part 122; and

[0181] S433 ′: heating or irradiating the adhesive to form the adhesive layer 14 between the lower surface 131 of the filter member 13 and the second upper surface 1221 of the second molding part 122 .

[0182] It is worth noting that in one example of the present invention, Fig.17 As shown, the step S440 of the manufacturing method of the camera module 1 may include the steps of:

[0183] S441: Assembling the optical lens 20 to a driver 30; and

[0184] S442: Assemble the driver 30 to the molding base 12 accordingly to assemble into a zoom camera module.

[0185] In addition, in another example of the present invention, Fig.17 As shown, the step S440 of the manufacturing method of the camera module 1 may also include the steps of:

[0186] S441 ′: Assemble a lens barrel 22 of the optical lens 20 on the mold base 12 , and assemble a lens group 21 of the optical lens 20 to correspond to the light sensing path 110 of the imaging component 11 to form a fixed-focus camera module.

[0187] Reference Fig.18 According to another aspect of the present invention, the present invention further provides an electronic device, wherein the electronic device comprises an electronic device body 500 and at least one camera module 1, wherein each camera module 1 is respectively arranged on the electronic device body 500 for acquiring images. It is worth mentioning that the type of the electronic device body 500 is not limited. For example, the electronic device body 500 can be any electronic device that can be configured with the camera module 1, such as a smart phone, a tablet computer, a laptop computer, an e-book, a personal digital assistant, a camera, etc. It can be understood by those skilled in the art that although the attached Fig.18 The electronic device body 500 is implemented as a smart phone as an example, but it does not constitute a limitation on the content and scope of the present invention.

[0188] It is worth noting that the orientations or positional relationships indicated by “upper”, “lower”, “inner”, “outer”, etc. mentioned in the present invention are based on the orientations or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. For example, the surface of the first molding part 121 away from the imaging component 11 is the first upper surface 1211 of the first molding part 121, and the surface of the first molding part 121 contacting the imaging component 11 is the lower surface of the first molding part 121 (e.g., Figure 3 As shown); For another example, the side of the first molding part 121 adjacent to the light window 120 is the first inner side 1213 of the first molding part 121, and the side of the first molding part 121 away from the light window 120 is the first outer side 1212 of the first molding part 121 (as shown Figure 3 shown).

[0189] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. A molded photosensitive component, characterized in that: The molded photosensitive component comprises: an imaging component; A molded base, wherein the molded base comprises: a first molding part, wherein the first molding part covers a portion of the imaging component, wherein the first molding part has a first upper surface; and a second molding part, wherein the second molding part is integrally formed on the first upper surface of the first molding part, wherein the second molding part has a second upper surface and a second outer side surface; a light filtering member, wherein the light filtering member is correspondingly disposed on the second upper surface of the second molding part; and an adhesive layer, wherein the adhesive layer is located between the lower surface of the filter component and the second upper surface of the second molding part, so as to attach the filter component to the second upper surface of the second molding part; The second upper surface of the second molding part is higher than the first upper surface of the first molding part, so that an outer space is defined by the second outer side surface of the second molding part and the first upper surface of the first molding part, and the outer space is configured to prevent the edge of the filter component from shrinking due to avoiding the transition arc surface of the molding base, wherein the edge of the filter component extends into the outer space.

2. The molded photosensitive component according to claim 1, wherein: The second upper surface of the second molding portion is a flat surface.

3. The molded photosensitive component according to claim 1, wherein: The molding base further includes a third molding part, wherein the third molding part integrally extends upward from the first upper surface of the first molding part, wherein the third molding part is located outside the second molding part, and the third molding part is spaced apart from the second molding part.

4. The molded photosensitive component according to claim 3, wherein: A distance between the third inner side surface of the third molding part and the second outer side surface of the second molding part is not less than 0.01 mm.

5. The molded photosensitive component according to claim 1, wherein: A height difference between the second upper surface of the second molding part and the first upper surface of the first molding part is between 0.03 mm and 0.2 mm.

6. The molded photosensitive component as claimed in claim 1, wherein the adhesive layer is formed after the adhesive is cured.

7. The molded photosensitive component according to claim 6, wherein: The second inner side surface of the second molding part is located outside the first inner side surface of the first molding part to form an inner space inside the second molding part.

8. The molded photosensitive component according to claim 3, wherein: The imaging assembly includes a circuit board, a photosensitive element conductively attached to the circuit board, and a group of electronic components conductively connected to the circuit board, wherein the third molding part corresponds to the electronic components, and the third upper surface of the third molding part is higher than the top surface of the electronic components.

9. The molded photosensitive component according to claim 8, wherein: The first upper surface of the first molding portion of the molding base is lower than the top surface of the electronic component.

10. The molded photosensitive component according to claim 8, wherein: The third outer side surface of the third molding part of the molding base is located inside the first outer side surface of the first molding part, so that a portion of the first upper surface of the first molding part outside the third molding part is used to mount at least one optical lens.

11. The molded photosensitive component according to claim 10, wherein: The molding base also includes a fourth molding part, wherein the fourth molding part is recessed downward from the first upper surface of the first molding part to form a peripheral groove on the outer periphery of the first molding part, wherein the fourth upper surface of the fourth molding part is used to provide a mounting surface for mounting the optical lens.

12. The molded photosensitive component of claim 10, wherein: The molding base also includes a fourth molding part, wherein the fourth molding part extends upward from the first upper surface of the first molding part to form a peripheral protrusion on the outer periphery of the first molding part, wherein the fourth upper surface of the fourth molding part is used to provide a mounting surface for mounting the optical lens.

13. The molded photosensitive component according to claim 8, wherein: The third upper surface of the third molding part of the molding base is higher than the second upper surface of the second molding part.

14. The molded photosensitive component of claim 13, wherein: The third upper surface of the third molding part is higher than the upper surface of the filter member, and the third upper surface of the third molding part is suitable for corresponding to at least one optical lens.

15. The molded photosensitive component of claim 8, wherein: The third molding part is designed according to the size and position of the electronic component.

16. The molded photosensitive component according to claim 6 or 7, wherein: The adhesive layer is formed by curing light-curing adhesive or heat-curing adhesive.

17. The molded photosensitive component according to any one of claims 1 to 15, wherein: The second molding part of the molding base is provided with at least one notch, so that when the filter component is attached to the second upper surface of the second molding part, an air escape hole is formed at the notch of the second molding part, so as to connect the internal space of the molded photosensitive component with the outside of the molded photosensitive component through the air escape hole.

18. The molded photosensitive component of claim 16, wherein: The second molding part of the molding base is provided with at least one notch, so that when the filter component is bonded to the second upper surface of the second molding part through the adhesive layer, an air escape hole is formed at the notch of the second molding part, so as to connect the internal space of the molded photosensitive component with the outside of the molded photosensitive component through the air escape hole.

19. The molded photosensitive component of claim 18, wherein: The notch of the second molding portion extends transversely from the second inner side surface of the second molding portion to the second outer side surface of the second molding portion, so as to form the transversely arranged air escape holes.

20. The molded photosensitive component of claim 19, wherein: The molding base further includes a molding reinforcement portion, wherein the molding reinforcement portion is integrally extended outward from the second molding portion at the notch of the second molding portion.

21. The molded photosensitive component of claim 20, wherein: The mold reinforcement portion is integrally connected to the first mold portion to form a reinforcement rib between the second outer side surface of the second mold portion and the first upper surface of the first mold portion.

22. The molded photosensitive component as described in claim 18 further includes a reinforcing adhesive block, wherein the reinforcing adhesive block is formed by curing the adhesive applied at the notch of the second molding part.

23. A camera module, characterized in that: include: at least one optical lens; and A molded photosensitive component as described in any one of claims 1 to 22, wherein each of the optical lenses is correspondingly arranged in the molded photosensitive component, and the optical lens corresponds to the photosensitive path of the imaging component of the molded photosensitive component.

24. The camera module as described in claim 23 further includes at least one driver, wherein each of the drivers is assembled to the molded base of the molded photosensitive component, and each of the optical lenses is respectively assembled to the driver to assemble into a zoom camera module.

25. The camera module according to claim 23, wherein: Each of the optical lenses comprises a lens barrel and a lens group, wherein the lens barrel is disposed on the molded base of the molded photosensitive component, and each of the optical lenses is respectively assembled to the lens barrel to form a fixed-focus camera module.

26. An electronic device, characterized in that: include: An electronic device body; and At least one camera module as described in any one of claims 23 to 25, wherein each camera module is arranged on the electronic device body to acquire images.

27. A method for manufacturing a camera module, characterized in that: Includes steps: A photosensitive element can be conductively mounted on a circuit board to form an imaging assembly; A molding base is molded on the imaging component by a molding die, wherein the molding base includes a first molding part and a second molding part, wherein the first molding part covers a part of the imaging component, wherein the second molding part is integrally formed on a first upper surface of the first molding part, and the second upper surface of the second molding part is higher than the first upper surface of the first molding part, so that an outer space is defined by the second outer side surface of the second molding part and the first upper surface of the first molding part, and the outer space is configured to prevent the edge of the filter component from shrinking due to avoiding the transition arc surface of the molding base; Attaching the filter member to the second upper surface of the second molding part to assemble a molded photosensitive assembly, wherein an adhesive layer is provided between the lower surface of the filter member and the second upper surface of the second molding part to attach the filter member to the second upper surface of the second molding part, wherein an edge of the filter member extends into the outer space; and At least one optical lens is correspondingly arranged on the molded photosensitive component.

28. The method for manufacturing a camera module according to claim 27, wherein: Before the step of molding a molded base on the imaging component by means of a molding mold, the step further includes: A group of electronic components are installed on the circuit board at intervals, wherein each of the electronic components is conductively connected to the circuit board.

29. The method for manufacturing a camera module according to claim 28, wherein: In the step of molding a molded base on the imaging component by means of a molding mold: The molding base further includes a third molding part, wherein the third molding part is integrally formed on the first upper surface of the first molding part, wherein the third molding part is located outside the second molding part, and the third molding part is spaced apart from the second molding part.

30. The method for manufacturing a camera module according to claim 29, wherein: In the step of molding a molded base on the imaging component by means of a molding mold: The second molding portion of the molding base is provided with at least one notch, wherein the notch extends from the second inner side surface of the second molding portion to the second outer side surface of the second molding portion.

31. The method for manufacturing a camera module according to claim 30, wherein: The step of attaching the filter component to the second upper surface of the second molding part to assemble the molded photosensitive component comprises the steps of: applying adhesive to the second upper surface of the second molding portion; The filter member is correspondingly arranged on the second molded part, and an air escape hole connecting the inner space of the molded photosensitive component and the outside of the molded photosensitive component is formed through the notch of the second molded part; as well as The adhesive is heated or irradiated with light to form the adhesive layer between the lower surface of the filter member and the second upper surface of the second molding part.

32. The method for manufacturing a camera module according to claim 30, wherein: The step of attaching the filter component to the second upper surface of the second molding part to assemble the molded photosensitive component comprises the steps of: Applying adhesive to the lower surface of the filter component; The filter member is correspondingly arranged on the second molded part, and an air escape hole connecting the inner space of the molded photosensitive component and the outside of the molded photosensitive component is formed through the notch of the second molded part; as well as The adhesive is heated or irradiated with light to form the adhesive layer between the lower surface of the filter member and the second upper surface of the second molding part.

33. The method for manufacturing a camera module according to any one of claims 27 to 32, wherein: The step of correspondingly arranging at least one optical lens on the molded photosensitive component comprises the steps of: Assembling the optical lens to a driver; and The driver is correspondingly assembled to the molded base of the molded photosensitive component to assemble into a zoom camera module.

34. The method for manufacturing a camera module according to any one of claims 27 to 32, wherein: The step of correspondingly arranging at least one optical lens on the molded photosensitive component comprises the steps of: A lens barrel of the optical lens is assembled on the molded base of the molded photosensitive component, and a lens group of the optical lens corresponds to the photosensitive path of the imaging component to assemble into a fixed-focus camera module.

Images