Display device

Abstract

Systems and methods are described for a display device in which identification failure of a fingerprint recognition sensor disposed in a display area without being exposed to the outside is reduced. The display device includes a display panel, a cover window disposed above the display panel, an optical sensor, wherein at least a portion of the optical sensor is disposed below the display panel, and an infrared blocking member disposed between the optical sensor and the cover window, and at least a portion of the infrared blocking member is superposed with the optical sensor from above the optical sensor.

Description

[0001] This application claims priority to Korean Patent Application No. 10-2019-0056289, filed on May 14, 2019, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. TECHNICAL FIELD

[0002] The present disclosure relates to a display device. BACKGROUND

[0003] The demand for device display technology has increased as the use of devices with displays has become more widespread. Display devices can be found in products such as smart phones, digital cameras, notebook computers, navigation devices, and smart televisions. These devices undergo constant technological progress to keep up with consumer demand.

[0004] In some cases, a display device can include a display panel for displaying an image and a fingerprint recognition sensor for optically sensing a signal input from an external source. The design of a display device can vary based on different uses of an electronic device. For example, many smart phones include a display device having a fingerprint recognition area for recognizing a fingerprint of a user in a display area.

[0005] The fingerprint recognition area is used to automatically recognize or confirm the identity of an individual based on a comparison of an input fingerprint with a designated fingerprint. First, a user will designate a fingerprint to a device, and the device stores the fingerprint for future comparison. Then, the user applies their fingerprint to gain access to the device. Each subsequent use of the fingerprint recognition area can confirm or deny access to the device based on a comparison with the designated fingerprint. SUMMARY

[0006] Aspects of the present disclosure provide a display device in which a recognition failure of a fingerprint recognition sensor disposed in a display area without being exposed to the outside is reduced.

[0007] However, aspects of the present disclosure are not limited to one aspect set forth herein. The above and other aspects of the present disclosure will become more apparent to one of ordinary skill in the art to which the present disclosure pertains by referencing the detailed description of the present disclosure given below.

[0008] According to an embodiment of the present disclosure, a display device includes a display panel, a cover window disposed above the display panel, an optical sensor disposed below at least a portion of the display panel, and an infrared blocking member disposed between the optical sensor and the cover window, wherein at least a portion of the infrared blocking member is overlapped with the optical sensor from above the optical sensor.

[0009] In an exemplary embodiment, the display device can include a display area and a non-display area outside the display area, and a fingerprint recognition area overlapping the optical sensor from above the optical sensor.

[0010] In an exemplary embodiment, the fingerprint recognition area can be disposed in the display area.

[0011] In an exemplary embodiment, the infrared blocking member can be disposed between the optical sensor and the display panel.

[0012] In an exemplary embodiment, the display device can further include a polarizing film disposed between the display panel and the cover window.

[0013] In an exemplary embodiment, the infrared blocking member can be disposed between the polarizing film and the cover window.

[0014] In an exemplary embodiment, the display device can further include a first adhesive member disposed between the polarizing film and the cover window, wherein the first adhesive member includes the infrared blocking member.

[0015] In an exemplary embodiment, the polarizing film can include a polarizer and a hard coat layer disposed on the polarizer, and the hard coat layer can include the infrared blocking member.

[0016] In an exemplary embodiment, the display panel can include a light emitting layer and a thin film encapsulation layer disposed on the light emitting layer, and can further include a touch member disposed on the thin film encapsulation layer of the display panel.

[0017] In an exemplary embodiment, the thin film encapsulation layer can include the infrared blocking member.

[0018] In an exemplary embodiment, the display device can further include a second adhesive member disposed between the display panel and the polarizing film, wherein the second adhesive member can include the infrared blocking member.

[0019] In an exemplary embodiment, the infrared blocking member can include a material blocking transmission of infrared light and prevent light having a center wavelength in a range of 780 nm to 2500 nm from entering the optical sensor.

[0020] In an exemplary embodiment, the infrared blocking member can include a metal or a metal oxide.

[0021] In an exemplary embodiment, the metal or the metal oxide can have a diameter of 1 nm to 100 nm.

[0022] In an exemplary embodiment, the metal or the metal oxide can be nickel (Ni), chromium (Cr), niobium (Nb), tantalum (Ta), iridium (Ir), vanadium (V), or an oxide thereof.

[0023] In an exemplary embodiment, the infrared blocking component may include at least any one of diammonium dyes, polymethyl dyes, anthraquinone dyes, phthalocyanine dyes, naphthalene phthalocyanine dyes, and nickel thiolate complexes.

[0024] According to another embodiment of this disclosure, a display device includes: a display panel; a cover window disposed above the display panel; an adhesive member disposed below the display panel; a lower panel member disposed below the adhesive member and including an opening that partially exposes the lower surface of the adhesive member; an optical sensor disposed below the display panel and located in the opening of the lower panel member; and an infrared blocking member disposed between the optical sensor and the cover window, wherein at least a portion of the infrared blocking member is stacked above the optical sensor.

[0025] In an exemplary embodiment, the infrared blocking member may include a material that blocks the transmission of infrared light and prevents light with a center wavelength in the range of 780 nm to 2500 nm from entering the optical sensor.

[0026] In an exemplary embodiment, an infrared blocking member may be disposed between the cover window and the display panel.

[0027] In an exemplary embodiment, the infrared blocking member may be disposed in the opening and on the optical sensor. Attached Figure Description

[0028] These and other aspects will become apparent and more readily understood from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:

[0029] Figure 1 This is a perspective view of a display device according to an embodiment;

[0030] Figure 2 This is an exploded perspective view of the display device according to an embodiment;

[0031] Figure 3 It is a cross-sectional view showing the display area of ​​the display panel in detail;

[0032] Figure 4 yes Figure 2 A floor plan of an example of the intermediate frame;

[0033] Figure 5 yes Figure 2 A plan view of the main circuit board;

[0034] Figure 6 This is a schematic plan view of the fingerprint recognition area of ​​the display device according to an embodiment;

[0035] Figure 7 This is a schematic cross-sectional view of a display device according to an embodiment;

[0036] Figure 8 This is a schematic diagram illustrating a fingerprint recognition method using an optical sensor according to an embodiment;

[0037] Figure 9 This is a schematic cross-sectional view of a display device according to an embodiment;

[0038] Figure 10 and Figure 11 This is a schematic cross-sectional view of a display device according to an embodiment;

[0039] Figure 12 This is a schematic cross-sectional view of a display device according to an embodiment;

[0040] Figure 13 yes Figure 12 A schematic cross-sectional view of the display panel of the display device;

[0041] Figure 14 and Figure 15 This is a schematic cross-sectional view of a display device according to an embodiment;

[0042] Figure 16 This is a schematic plan view of the fingerprint recognition area of ​​the display device according to an embodiment;

[0043] Figure 17 and Figure 18 yes Figure 16 A schematic cross-sectional view of the display device; and

[0044] Figure 19 and Figure 20 This is a schematic cross-sectional view of a display device according to an embodiment. Detailed Implementation

[0045] Infrared light is a form of electromagnetic radiation with a wavelength longer than that of visible light. Fingerprint recognition devices often experience fingerprint recognition failures due to infrared light incident from external sources. Embodiments of this disclosure provide a display device that includes an infrared blocking member disposed on an optical sensor to prevent light from entering the optical sensor. Therefore, some embodiments of this disclosure can prevent fingerprint recognition failures.

[0046] This disclosure has been described with reference to the accompanying drawings, in which embodiments of the present disclosure are illustrated. However, the invention may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of this disclosure to those skilled in the art.

[0047] It will also be understood that when a layer is referred to as being "on" another layer or substrate, the layer may be directly on said other layer or substrate, or there may be an intermediate layer. Throughout the specification, the same reference numerals denote the same components.

[0048] In the following description, embodiments will be illustrated with reference to the accompanying drawings.

[0049] Figure 1 This is a perspective view of the display device 10 according to an embodiment.

[0050] Reference Figure 1 The display device 10 can be applied to a variety of electronic devices, including small- to medium-sized electronic devices (such as tablet PCs, smartphones, car navigation units, cameras, central information displays (CIDs) installed in vehicles, wristwatches, personal digital assistants (PDAs), portable multimedia players (PMPs), and game consoles) and medium- to large-sized electronic devices (such as televisions, billboards, monitors, PCs, and laptops). However, these are merely examples, and the display device 10 can be applied to other electronic devices without departing from the concept of this disclosure.

[0051] The display device 10 can be rectangular in a plan view. For example, as shown in the figure below. Figure 1 As shown, the display device 10 may have a rectangular planar shape, which has a shorter side along a first direction DR3 and a longer side along a second direction DR4. At the intersection of the shorter side extending along the first direction DR3 and the longer side extending along the second direction DR4, each corner may be rounded with a predetermined curvature or may be a right angle. The planar shape of the display device 10 is not limited to a rectangular shape, but may also be another polygonal shape, a circular shape, or an elliptical shape.

[0052] The display device 10 may include a flat first region DR1 and a second region DR2 extending from the right and left sides of the first region DR1. The second region DR2 may be formed in a flat shape or a curved shape. When the second region DR2 is formed in a flat shape, the angle formed by the first region DR1 and the second region DR2 may be an obtuse angle. When the second region DR2 is formed in a curved shape, the second region DR2 may have a constant curvature or a varying curvature.

[0053] exist Figure 1In this embodiment, the second region DR2 extends from both the right and left sides of the first region DR1. However, the embodiment is not limited to this. For example, the second region DR2 may also extend from either the right or left side of the first region DR1. Alternatively, the second region DR2 may extend from both the right and left sides of the first region DR1, and may also extend from at least either the upper or lower side of the first region DR1. The following will primarily describe the case where the second region DR2 is located at the left and right edges of the display device 10.

[0054] Figure 2 This is an exploded perspective view of the display device 10 according to an embodiment. Figure 3 This is a cross-sectional view showing the display area of ​​the display panel 300 in detail. Figure 4 yes Figure 2 A floor plan of an example of the intermediate frame 700. Figure 5 yes Figure 2 Plan view of the main circuit board 800.

[0055] Reference Figures 2 to 5 The display device 10 according to the embodiment includes a cover window 100, an infrared blocking member 600, a polarizing film 200, a display panel 300, a display circuit board 310, an optical sensor 500, a middle frame 700, a main circuit board 800, and a bottom cover 900.

[0056] A cover window 100 can be disposed above the display panel 300 to cover the upper surface of the display panel 300. Therefore, the cover window 100 can protect the upper surface of the display panel 300. The cover window 100 can be made of glass, sapphire, or plastic. The cover window 100 can be rigid or flexible.

[0057] The cover window 100 can be attached to the upper surface of the display panel 300 by means of an adhesive component. The adhesive component can be an optically clear adhesive film (OCA) or an optically clear resin (OCR).

[0058] A protective layer for the cover window can be disposed in front of the cover window 100. The protective layer can perform at least one of the following functions of the cover window 100: shatterproof, shock-absorbing, dent-resistant, fingerprint-resistant, and anti-glare. The protective layer may include a transparent polymer film. The transparent polymer film may include at least one of the following resins: polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyethersulfone (PES), polyimide (PI), polyarylate (PAR), polycarbonate (PC), polymethyl methacrylate (PMMA), and cyclic olefin copolymer (COC).

[0059] The cover window 100 may include a light-transmitting portion DA100 corresponding to the display panel 300 and a light-shielding portion NDA100 corresponding to areas other than the display panel 300. The cover window 100 may be disposed in a first region DR1 and a second region DR2. The light-transmitting portion DA100 may be disposed in a portion of the first region DR1 and a portion of each of the second regions DR2. The light-shielding portion NDA100 may be formed to be opaque. Optionally, the light-shielding portion NDA100 may be formed as a decorative layer having a pattern that can be displayed to the user when no image is displayed. For example, the light-shielding portion NDA100 may be patterned with a company logo or various characters. In addition, a hole HH for exposing a front-facing camera, iris recognition sensor, illuminance sensor, etc., may be formed in the light-shielding portion NDA100. However, the embodiment is not limited to this. For example, some or all of the front-facing camera, iris recognition sensor, and illuminance sensor may be embedded in the display panel 300. In this case, some or all of the hole HH may be removed.

[0060] The infrared blocking member 600 can be positioned between the cover window 100 and the optical sensor 500. Although in Figure 2 The mid-infrared blocking member 600 is disposed between the cover window 100 and the polarizing film 200, but the embodiment is not limited to this. The infrared blocking member 600 may include a material that blocks the transmission of infrared light incident from the outside. However, the infrared blocking member 600 may be transparent in other cases. For example, the infrared blocking member 600 may allow the transmission of visible light.

[0061] The infrared blocking member 600 according to the embodiment can block infrared light incident from outside the display device 10, thereby preventing infrared light from entering the optical sensor 500. The infrared blocking member 600 and the optical sensor 500 will be described in more detail later with reference to other figures.

[0062] A polarizing film 200 is disposed between the display panel 300 and the cover window 100. The polarizing film 200 serves to prevent reduced visibility due to reflection of external light. The polarizing film 200 may consist of at least one layer. In an exemplary embodiment, the polarizing film 200 may include a polarizer 210_1 (see...) Figure 9 ) and hard coating 260_1 (see Figure 9Polarizer 210_1 may be a retardation film, which includes at least one of a half-wave (λ / 2) plate and a quarter-wave (λ / 4) plate to delay the phase of light incident from the outside. A hard coating 260_1 of polarizer 200 may be disposed on polarizer 210_1. Hard coating 260_1 serves to protect polarizer 210_1. Hard coating 260_1 may be made of, but is not limited to, cellulose resins such as cellulose triacetate or polyester resins. According to an embodiment, the hard coating 260_1 of polarizer 200 may prevent infrared light from entering optical sensor 500 by including a material that blocks the transmission of infrared light. In some cases, hard coating 260_1 of polarizer 200 may include or be integrated with an infrared blocking member 600. In some cases, the infrared blocking member 600 may be disposed separately, or polarizer 200 may be omitted.

[0063] The display panel 300 and the touch component TSL can be disposed below the cover window 100. The display panel 300 can be stacked with the light-transmitting portion DA100 of the cover window 100. The display panel 300 can be disposed in the first region DR1 and the second region DR2. Therefore, the image of the display panel 300 can be viewed in the first region DR1 and also in the second region DR2.

[0064] Display panel 300 can be a light-emitting display panel that includes light-emitting elements. For example, display panel 300 can be an organic light-emitting display panel using organic light-emitting diodes, a micro light-emitting diode display panel using micro light-emitting diodes, or a quantum dot light-emitting display panel that includes quantum dot light-emitting diodes. The following will mainly describe the case where display panel 300 is an organic light-emitting display panel.

[0065] Reference Figure 3 The display panel 300 may include a first substrate 301 and a pixel array layer. The pixel array layer may include a thin-film transistor layer (TFTL), a light-emitting element layer (EML), and a thin-film encapsulation layer (TFEL). The TFTL may be disposed on the first substrate 301. The touch element (TSL) may be disposed on the TFEL. The display area DA of the display panel 300 (see...) Figure 6 ) can be the area where an EML layer of light-emitting elements is formed to display an image, and the non-display area NDA (see Figure 6 () can be the area surrounding the display area DA.

[0066] The first substrate 301 can be a rigid substrate or a flexible substrate capable of being bent, folded, and rolled up. The first substrate 301 can be made of an insulating material such as glass, quartz, or a polymeric resin. The polymeric material can be, for example, polyethersulfone (PES), polyacrylate (PA), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallyl ester, polyimide (PI), polycarbonate (PC), cellulose triacetate (CAT), cellulose acetate propionate (CAP), or combinations thereof. The first substrate 301 may also include a metallic material.

[0067] A thin-film transistor layer (TFTL) is formed on a first substrate 301. The TFTL includes a thin-film transistor 335, a gate insulating layer 336, an interlayer insulating film 337, a protective layer 338, and a planarization layer 339.

[0068] A buffer layer 302 may be formed on the first substrate 301. The buffer layer 302 is formed on the first substrate 301 to protect the thin-film transistor 335 and the light-emitting element from moisture introduced through the moisture-permeable first substrate 301. The buffer layer 302 may consist of multiple alternately stacked inorganic layers. For example, the buffer layer 302 may be one or more inorganic layers selected from silicon oxide (SiO2). x ) layer, silicon nitride (SiN) x A multilayer structure consisting of alternating layers of SiON and SiON. Buffer layer 302 can be omitted.

[0069] Thin-film transistors 335 are formed on buffer layer 302. Each of the thin-film transistors 335 includes an active layer 331, a gate electrode 332, a source electrode 333, and a drain electrode 334. Figure 3 In this embodiment, each of the thin-film transistors 335 is formed as a top-gate type, wherein the gate electrode 332 is located above the active layer 331. However, the embodiments are not limited to this. For example, each of the thin-film transistors 335 may also be formed as a bottom-gate type, wherein the gate electrode 332 is located below the active layer 331, or as a dual-gate type, wherein the gate electrode 332 is located both above and below the active layer 331.

[0070] An active layer 331 is formed on a buffer layer 302. The active layer 331 can be made of silicon-based semiconductor material or oxide-based semiconductor material. A light-shielding layer can be formed between the buffer layer 302 and the active layer 331 to block external light from entering the active layer 331.

[0071] The gate insulating layer 336 can be formed on the active layer 331. The gate insulating layer 336 can be an inorganic layer, such as SiO2. x Layer, SiN xLayers or multiple layers composed of these layers.

[0072] The gate electrode 332 and the gate line may be formed on the gate insulating layer 336. Each of the gate electrode 332 and the gate line may be a single layer or multiple layers made of any one or more of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and their alloys.

[0073] An interlayer insulating film 337 can be formed on the gate electrode 332 and the gate line. The interlayer insulating film 337 can be an inorganic layer, such as SiO₂. x Layer, SiN x Layers or multiple layers composed of these layers.

[0074] The source electrode 333, drain electrode 334, and data line can be formed on the interlayer insulating film 337. Each of the source electrode 333 and drain electrode 334 can be connected to the active layer 331 through a contact hole passing through the gate insulating layer 336 and the interlayer insulating film 337. Each of the source electrode 333, drain electrode 334, and data line can be a single layer or multiple layers made of any one or more of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and their alloys.

[0075] A protective layer 338 for insulating the thin-film transistor 335 can be formed on the source electrode 333, drain electrode 334, and data lines. The protective layer 338 can be an inorganic layer, such as SiO2. x Layer, SiN x Layers or multiple layers composed of these layers.

[0076] A planarization layer 339 may be formed on the protective layer 338 to planarize the steps caused by the thin-film transistor 335. The planarization layer 339 may be made of an organic layer such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0077] The light-emitting element layer (EML) is formed on the thin-film transistor layer (TFTL). The EML includes a light-emitting element and a pixel defining layer 344.

[0078] The light-emitting element and pixel defining layer 344 are formed on the planarization layer 339. The light-emitting element can be an organic light-emitting device that includes an anode 341, a light-emitting layer 342, and a cathode 343.

[0079] The anode 341 can be formed on the planarization layer 339. The anode 341 can be connected to the drain electrode 334 of the thin-film transistor 335 through contact holes passing through the protective layer 338 and the planarization layer 339.

[0080] The pixel defining layer 344 can be formed on the planarization layer 339 and can cover the edge of the anode 341 to define a pixel. For example, the pixel defining layer 344 serves as a pixel defining layer for defining a pixel. Each pixel emits light in the light-emitting layer 342 in the region where the anode 341, the light-emitting layer 342, and the cathode 343 are sequentially stacked, such that holes from the anode 341 and electrons from the cathode 343 combine.

[0081] A light-emitting layer 342 is formed on the anode 341 and the pixel defining layer 344. The light-emitting layer 342 can be an organic light-emitting layer. Each of the light-emitting layers 342 can emit one of red, green, and blue light. Optionally, the light-emitting layer 342 can be a white light-emitting layer that emits white light. In this case, the light-emitting layer 342 can be a stack of red, green, and blue light-emitting layers, and can be a common layer shared by multiple pixels. In this case, the display panel 300 may also include color filters for displaying red, green, and blue.

[0082] Each of the light-emitting layers 342 may include a hole transport layer, a light-emitting layer, and an electron transport layer. Additionally, each of the light-emitting layers 342 may be formed in a series structure of two or more stacked bodies, in which case a charge-generating layer may be formed between the stacked bodies.

[0083] The cathode 343 is formed on the light-emitting layer 342. The cathode 343 can be formed to cover the light-emitting layer 342. The cathode 343 can be a common layer shared by multiple pixels.

[0084] When the light-emitting element layer (EML) is formed as a top-emitting type emitting light in an upward direction, the anode 341 can be made of a metallic material with high reflectivity. Examples of metallic materials with high reflectivity are stacked structures of aluminum and titanium (Ti / Al / Ti), stacked structures of aluminum and indium tin oxide (ITO / Al / ITO), APC alloys, or stacked structures of APC alloys and indium tin oxide (ITO / APC / ITO). The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu). Additionally, the cathode 343 can be made of a transparent conductive material (TCO) capable of transmitting light (such as indium tin oxide (ITO) or indium zinc oxide (IZO)) or a semi-transmissive conductive material (such as magnesium (Mg), silver (Ag), or an alloy of Mg and Ag). When the cathode 343 is made of a semi-transmissive conductive material, the light output efficiency can be improved through the microcavity.

[0085] When the light-emitting element layer (EML) is formed as a bottom-emitting type emitting light in the downward direction, the cathode 343 can be made of a metallic material with high reflectivity. The metallic material with high reflectivity can be a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and indium tin oxide (ITO / Al / ITO), an APC alloy, or a stacked structure of APC alloy and indium tin oxide (ITO / APC / ITO). The anode 341 can be made of a transparent conductive material (TCO) capable of transmitting light or a semi-transmissive conductive material. When the anode 341 is made of a semi-transmissive conductive material, the light output efficiency can be improved through a microcavity.

[0086] A thin-film encapsulation layer (TFEL) is formed on the light-emitting element layer (EML). The TFEL serves to prevent oxygen or moisture from penetrating into the light-emitting layer 342 and the cathode 343. For this purpose, the TFEL may include at least one inorganic layer. The inorganic layer may be made of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide. Additionally, the TFEL may also include at least one organic layer. The organic layer may be formed to a sufficient thickness to prevent particles from penetrating the TFEL and entering the light-emitting layer 342 and the cathode 343. The organic layer may include any one of epoxy resin, acrylate, and polyurethane acrylate. The TFEL may have, but is not limited to, a thickness of 1 × 10⁻⁶. -6 Water vapor transmission rate (WVTR) of g / day or less.

[0087] The thin-film encapsulation layer TFEL can be integrally disposed, independent of the pixels of the light-emitting element layer EML. The thin-film encapsulation layer TFEL can cover the light-emitting element layer EML, including the cathode 343 disposed below the thin-film encapsulation layer TFEL. Therefore, the light-emitting element layer EML can be surrounded and sealed by the thin-film encapsulation layer TFEL. Furthermore, although not shown in the accompanying drawings, if a capping layer is further disposed between the thin-film encapsulation layer TFEL and the cathode 343 to cover the cathode 343, the thin-film encapsulation layer TFEL can directly cover the capping layer.

[0088] According to an embodiment, the thin-film encapsulation layer TFEL may include a first encapsulation inorganic layer TFEL1, an encapsulation organic layer TFEL2, and a second encapsulation inorganic layer TFEL3 sequentially stacked on the cathode 343.

[0089] The first encapsulation inorganic layer TFEL1 can be disposed on the surface of the cathode 343. The cathode 343 will have irregularities in its surface due to conformally reflecting the step disposed beneath it. The first encapsulation inorganic layer TFEL1 can be made of inorganic material and conformally reflects at least some of the irregularities in the cathode 343 disposed beneath it. Therefore, the first encapsulation inorganic layer TFEL1, like the cathode 343, will also have irregularities in its surface. The first encapsulation inorganic layer TFEL1 can cover the cathode 343 to protect it.

[0090] The second encapsulation inorganic layer TFEL3 can be disposed on the surface of the encapsulation organic layer TFEL2.

[0091] The first inorganic encapsulation layer TFEL1 and the second inorganic encapsulation layer TFEL3 can be in direct contact with each other at their edge portions. For example, when the first inorganic encapsulation layer TFEL1 and the second inorganic encapsulation layer TFEL3 are larger than the encapsulation organic layer TFEL2 in the plan view, the first inorganic encapsulation layer TFEL1 and the second inorganic encapsulation layer TFEL3 can be in contact with each other at their ends. Therefore, the encapsulation organic layer TFEL2 can be sealed by the first inorganic encapsulation layer TFEL1 and the second inorganic encapsulation layer TFEL3. Although not shown in the figures, the second inorganic encapsulation layer TFEL3 can protrude more outward than the first inorganic encapsulation layer TFEL1. In some cases, the first inorganic encapsulation layer TFEL1 can protrude more outward than the second inorganic encapsulation layer TFEL3. In addition, the first inorganic encapsulation layer TFEL1 and the second inorganic encapsulation layer TFEL3 can have the same planar dimensions, such that their ends are aligned with each other.

[0092] Each of the first encapsulation inorganic layer TFEL1 and the second encapsulation inorganic layer TFEL3 may be made of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide, cerium oxide, silicon oxynitride (SiON), or lithium fluoride.

[0093] The encapsulation organic layer TFEL2 can be disposed between the first encapsulation inorganic layer TFEL1 and the second encapsulation inorganic layer TFEL3. The encapsulation organic layer TFEL2 can fill the surface irregularities of the first encapsulation inorganic layer TFEL1 to reduce or flatten the underlying steps.

[0094] The encapsulation organic layer TFEL2 may cover the first encapsulation inorganic layer TFEL1 and may be thicker than the first encapsulation inorganic layer TFEL1. The encapsulation organic layer TFEL2, which includes organic material, may cover the first encapsulation inorganic layer TFEL1, which has steps or irregularities, and may have a substantially flat upper surface. For example, the encapsulation organic layer TFEL2 may compensate for the steps of the first encapsulation inorganic layer TFEL1.

[0095] The encapsulating organic layer TFEL2 can be made of, but is not limited to, acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, or perylene resin. Additionally, in an exemplary embodiment, the encapsulating organic layer TFEL2 may include a material that blocks infrared light to prevent infrared light from entering the optical sensor 500. For example, when the thin-film encapsulation layer TFEL of the display panel 300 includes an infrared-blocking material, the infrared blocking member 600 can be omitted. Since the thin-film encapsulation layer TFEL has an infrared-blocking function, the infrared blocking member 600 can be integrated into the display panel 300 and disposed below the touch member TSL. This will be described in detail later with reference to other accompanying drawings.

[0096] A touch component (TSL) is disposed on a thin-film encapsulation layer (TFEL). The TSL may include touch electrodes for sensing user touch using a capacitive method, and touch lines for connecting pads (or "soldering pads") and the touch electrodes. For example, the TSL may sense user touch using a self-capacitance method or a mutual capacitance method. Although not shown, a touch circuit board may be attached to one side of the TSL. The touch circuit board may include a touch driver electrically connected to the touch drive electrodes and touch sensing electrodes of the TSL. The touch circuit board may be a flexible printed circuit board. The touch driver may be formed as an integrated circuit.

[0097] Despite Figure 2 The touch component TSL is shown as a component separate from the display panel 300, but the embodiment is not limited to this. Figure 3 As shown, the touch component TSL can also be embedded in the display panel 300 by being disposed on the thin-film encapsulation layer TFEL of the display panel 300. In this case, the touch driving electrode and touch sensing electrode of the touch component TSL can be formed on the thin-film encapsulation layer TFEL of the display panel 300. When the touch component TSL is directly disposed on the thin-film encapsulation layer TFEL, the thickness of the display device 10 can be reduced. The reduction in the thickness of the display device 10 is compared with the case when a separate touch panel including the touch component TSL is attached to the thin-film encapsulation layer TFEL. Although the touch component TSL is shown in the following figures as embedded in the display panel 300 to form a component, the embodiment is not limited to this case.

[0098] The display circuit board 310 and the display driver unit 320 can be attached to a protruding area PA disposed on one side of the display panel 300. The end of the display circuit board 310 can be attached to a pad disposed in the protruding area PA of the display panel 300 using an anisotropic conductive film. The protruding area PA of the display panel 300 and the display circuit board 310 can be bent toward the lower surface of the display panel 300.

[0099] The display driver unit 320 receives control signals and power supply voltages through the display circuit board 310, and generates and outputs signals and voltages for driving the display panel 300. The display driver unit 320 can be formed as an integrated circuit and attached to the protruding area PA of the display panel 300 using a chip-on-glass (COG) method, a chip-on-plastic (COP) method, or an ultrasonic method. However, the embodiments are not limited to this. For example, the display driver unit 320 can be attached to the display circuit board 310.

[0100] like Figure 4 and Figure 5 As shown, the end of cable 314 can be connected to the main connector 830 of the main circuit board 800 located below the intermediate frame 700 through the cable hole CAH penetrating the intermediate frame 700.

[0101] Although not shown in the accompanying drawings, a touch driver unit (not shown) may be disposed on the display circuit board 310. The touch driver unit may be formed as an integrated circuit and attached to the upper surface of the display circuit board 310. The touch driver unit can be connected via the display circuit board 310 to the touch electrodes and touch lines of the touch component TSL of the display panel 300. In the mutual capacitance method, the touch driver unit can transmit a touch drive signal to the drive electrode in the touch electrode, and sense the touch by detecting the amount of charge change in the capacitance between the drive electrode and the sensing electrode in the touch electrode via the sensing electrode.

[0102] The optical sensor 500 can be disposed below the display panel 300. According to an embodiment, the optical sensor 500 can be disposed below the entire display panel 300. In this case, the optical sensor 500 can be located in the display area DA of the display panel 300 of the display device 10 (see [reference]). Figure 6 The optical sensor 500 senses a predetermined input. According to an embodiment, the optical sensor 500 may be an optical fingerprint recognition sensor capable of recognizing a user's fingerprint using optical methods. As will be described later, when the optical sensor 500 is an optical fingerprint recognition sensor and the display area DA may be a fingerprint recognition area FA (see...),... Figure 6When the fingerprint is reflected from the display panel 300, the optical sensor 500 can receive light emitted from the display panel 300 and reflected by the user's fingerprint, and identify the user's fingerprint based on the received light. The optical sensor 500, which can function as an optical fingerprint recognition sensor, and the infrared blocking member 600 will be described in detail later with reference to other accompanying drawings.

[0103] Although not shown in the accompanying drawings, the lower panel member 400 (see...) Figure 7 The lower plate component 400 can be positioned below the optical sensor 500. The lower plate component 400 can be attached via an adhesive component (see...). Figure 8 The fifth adhesive member (AM5) is attached to the lower surface of the optical sensor 500. The adhesive member can be OCA, OCR, or pressure-sensitive adhesive (PSA). However, the embodiments are not limited to this. In some cases, the lower panel member 400 can be directly disposed on the lower surface of the display panel 300 and may include an opening that partially exposes the lower surface of the display panel 300. The optical sensor 500 can be disposed in said opening.

[0104] The intermediate frame 700 may be disposed below the lower plate member 400. The intermediate frame 700 may be made of plastic, metal, or both plastic and metal.

[0105] The first camera hole CMH1, battery hole BH, and cable hole CAH can be formed in the intermediate frame 700. The camera device 820 is inserted into the first camera hole CMH1, and the battery is placed in the battery hole BH. In addition, the cable 314 connected to the display circuit board 310 passes through the cable hole CAH.

[0106] The main circuit board 800 can be located below the intermediate frame 700. The main circuit board 800 can be a printed circuit board or a flexible printed circuit board.

[0107] The main circuit board 800 may include a main processor 810, a camera device 820, and a main connector 830. The camera device 820 may be disposed on both the upper and lower surfaces of the main circuit board 800, and the main processor 810 may be disposed on the upper surface of the main circuit board 800. Additionally, the main connector 830 may be disposed on the lower surface of the main circuit board 800.

[0108] The main processor 810 can control various functions of the display device 10. For example, the main processor 810 can output digital video data to the display driver unit 320 via the display circuit board 310, enabling the display panel 300 to display images. In addition, the main processor 810 can receive touch data from the touch driver unit, determine the user's touch position, and then execute the application indicated by the icon displayed at the user's touch position.

[0109] The main processor 810 may be an application processor, a central processing unit, or a system chip formed as an integrated circuit.

[0110] The camera device 820 processes image frames, such as still images or moving images, obtained through the image sensor in camera mode, and outputs the processed image frames to the main processor 810.

[0111] Cable 314, passing through cable hole CAH in intermediate frame 700, can be connected to main connector 830. Therefore, main circuit board 800 can be electrically connected to display circuit board 310.

[0112] Additionally, the main circuit board 800 may also include a mobile communication module capable of transmitting wireless signals to at least one of a base station, an external terminal, and a server via a mobile communication network, or receiving wireless signals from at least one of the base station, an external terminal, and a server. The wireless signals may include voice signals, video call signals, or various types of data transmitted / received according to text / multimedia messages.

[0113] The bottom cover 900 can be disposed below the intermediate frame 700 and the main circuit board 800. The bottom cover 900 can be fastened and secured to the intermediate frame 700. The bottom cover 900 can form the lower appearance of the display device 10. The bottom cover 900 can include plastic and / or metal.

[0114] The second camera hole CMH2 can be formed in the bottom cover 900, and the camera device 820 is inserted into the second camera hole CMH2 and protrudes outward. The position of the camera device 820 and the positions of the corresponding first camera hole CMH1 and second camera hole CMH2 are not limited to... Figure 2 The embodiment shown.

[0115] Figure 6 This is a schematic plan view of the fingerprint recognition area FA of the display device 10 according to an embodiment.

[0116] Reference Figure 6 The display device 10 may include a display area DA and a non-display area NDA, wherein the display area DA and Figure 1 The light-transmitting portion DA100 of the cover window 100 corresponds to the light-shielding portion NDA100 of the cover window 100, and the image of the display panel 300 is displayed in the display area DA. The non-display area NDA corresponds to the light-shielding portion NDA100 of the cover window 100, and the image of the display panel 300 is not displayed in the non-display area NDA. The display panel 300 may be superimposed on each of the light-transmitting portion DA100 and the light-shielding portion NDA100 of the cover window 100. The display area DA and the non-display area NDA may also be limited within the display panel 300.

[0117] According to an embodiment, since the display device 10 includes an optical sensor 500, the display device 10 can include a fingerprint recognition area FA within the display area DA. The optical sensor 500 is an optical fingerprint recognition sensor. The fingerprint recognition area FA can be an area superimposed on the optical sensor 500 disposed below the display panel 300, allowing the user's fingerprint to be recognized. Since the optical sensor 500 can be disposed below the entire display panel 300, the fingerprint recognition area FA can be formed within substantially the entire display area DA. Therefore, the display device 10 can recognize the user's fingerprint regardless of location.

[0118] When the optical sensor 500 is an optical fingerprint recognition sensor that uses optical methods to identify a user's fingerprint, infrared light IR incident from the outside (see...) Figure 8 Infrared light (IR) incident from the outside can hinder the optical sensor 500 from recognizing the user's fingerprint. Infrared light (IR) incident from the outside can increase the false recognition rate and unrecognized rate of the optical sensor 500. However, according to an embodiment, the display device 10 includes an infrared blocking member 600 disposed on the optical sensor 500 to prevent infrared light from entering the optical sensor 500.

[0119] Figure 7 This is a schematic cross-sectional view of the display device 10 according to an embodiment. Figure 8 This is a schematic diagram illustrating a fingerprint recognition method using an optical sensor 500 according to an embodiment.

[0120] Reference Figure 7 and Figure 8 The display device 10 according to the embodiment may include a display panel 300, a cover window 100 disposed on the display panel 300, an optical sensor 500 disposed below the display panel 300, and an infrared blocking member 600 disposed between the optical sensor 500 and the cover window 100. In addition to the above-mentioned components, the display device 10 may also include a polarizing film 200, a lower panel member 400, etc.

[0121] The lower panel member 400 can be disposed below the optical sensor 500 to prevent a decrease in the recognition rate of the optical sensor 500. The lower panel member 400 may include a buffer member for absorbing external impacts, a film layer, a shielding member for shielding electromagnetic waves, and a heat dissipation member for dissipating heat from the display panel 300. However, the embodiment is not limited to this; the lower panel member 400 may also include a light-shielding layer for blocking light incident from the outside and a light-absorbing member. The light-absorbing member may be disposed below the display panel 300. The light-absorbing member can block light transmission to prevent elements disposed below the light-absorbing member from being seen from above the display panel 300. For example, the light-absorbing member may include a light-absorbing material such as black pigment or dye.

[0122] A buffer member can be positioned below the fifth adhesive member AM5 or the light-absorbing member. The buffer member absorbs external impacts to prevent damage to the display panel 300. The buffer member can consist of a single layer or multiple layers. For example, the buffer member can be made of a polymer resin (such as polyurethane, polycarbonate, polypropylene, or polyethylene) or of an elastic material (such as a sponge formed from foamed rubber, polyurethane-based materials, or acrylic-based materials). The buffer member can be a cushioning pad.

[0123] The membrane layer can be disposed below the buffer member. The membrane layer can be made of a flexible film. For example, the membrane layer may include polyallyl ester, polyimide (PI), polycarbonate (PC), cellulose triacetate (CAT), cellulose acetate propionate (CAP), or combinations thereof.

[0124] The shielding component can be placed beneath the membrane layer. The shielding component can be made of graphite or carbon nanotubes to shield electromagnetic waves.

[0125] The heat dissipation component can be disposed below the shielding component. The heat dissipation component can be made of a thin metal film (such as copper) with excellent thermal conductivity. However, the embodiments are not limited to this; the heat dissipation component can also be made of a metal with electrical conductivity.

[0126] Reference Figure 7 and Figure 8 The cover window 100, infrared blocking member 600, polarizing film 200, display panel 300, optical sensor 500, and lower panel member 400 can be bonded together by adhesive members. First adhesive member AM1 can bond the cover window 100 and infrared blocking member 600 together; second adhesive member AM2 can bond the infrared blocking member 600 and polarizing film 200 together; third adhesive member AM3 can bond the polarizing film 200 and display panel 300 together; fourth adhesive member AM4 can bond the display panel 300 and optical sensor 500 together; and fifth adhesive member AM5 can bond the optical sensor 500 and lower panel member 400 together. The adhesive members can be optically transparent. For example, each of the adhesive members can be OCA, OCR, or PSA.

[0127] although Figure 7 and Figure 8 The diagram shows first adhesive members AM1 to fifth adhesive members AM5 that join the components together, but some of them may be omitted. When the infrared blocking member 600 is integrated or embedded in other components, some of the first adhesive members AM1 to fifth adhesive members AM5 may be omitted or may be integrated with the infrared blocking member 600.

[0128] The optical sensor 500 can be disposed between the display panel 300 and the lower panel member 400. Light L1 emitted upwards from the display panel 300 towards the cover window 100 can be reflected towards the display panel 300 by the user's fingerprint areas RP and VP. Figure 8 The light L2 reflected by the user's fingerprint regions RP and VP can pass through the display panel 300 and enter the optical sensor 500 disposed below the display panel 300. The optical sensor 500 can receive the light L2 emitted from the display panel 300 and then identify the user's fingerprint based on the received light L2. The user's fingerprint regions RP and VP are reflected by the received light L2. The optical sensor 500 can identify the user's fingerprint shape by receiving information on the different positions of the light L2 reflected by the user's valley region VP, ridge region RP, and the area between the valley region VP and ridge region RP. The optical sensor 500 may also include an imaging device to identify the user's fingerprint shape by taking an image of the user's fingerprint shape.

[0129] An infrared blocking member 600 can be positioned above the optical sensor 500 to block the transmission of infrared light IR incident from the outside through the cover window 100. For example, it can block light with a center wavelength in the range of approximately 780 nm to 2500 nm. Light with other center wavelengths can transmit through the infrared blocking member 600.

[0130] An infrared blocking member 600 may be disposed in a region on the third-direction DR5 (e.g., in the thickness direction) at least overlapping with the optical sensor 500. Infrared light IR incident from the outside will prevent the optical sensor 500 from recognizing the user's fingerprint. In some cases, the display device 10 may include more than one infrared blocking member 600 that blocks the transmission of infrared light. Figure 8 As shown, the display device 10 may include an infrared blocking member 600 to prevent infrared light IR incident from the outside from entering the optical sensor 500, thereby reducing the unrecognized rate and false recognition rate of the optical sensor 500.

[0131] In an exemplary embodiment, the material blocking the transmission of infrared light may include a metal or its oxide. For example, materials blocking the transmission of infrared light may include nickel (Ni), chromium (Cr), niobium (Nb), tantalum (Ta), iridium (Ir), vanadium (V), or their oxides. The infrared blocking member 600 may include the aforementioned metals or their oxides to block the transmission of infrared light. The metal or its oxide may have a diameter of 1 nm to 100 nm and reflect the incident infrared light IR. However, the embodiments are not limited to this.

[0132] Additionally, materials that block the transmission of infrared light may include dyes (such as diammonium dyes, polymethyl dyes, anthraquinone dyes, phthalocyanine dyes, naphthalene phthalocyanine dyes, or nickel thiolate complexes). If included, the dye can block the transmission of incident infrared light IR by absorbing infrared light IR. However, the embodiments are not limited to this; the infrared blocking member 600 may also include mixtures of the metals mentioned above. Alternatively, the infrared blocking member 600 may also include oxides of the aforementioned metals and dyes as materials for blocking the transmission of infrared light.

[0133] In an embodiment, the infrared blocking material included in the infrared blocking member 600 may be dispersed in a resin. For example, the resin may include one or more of ethyl acrylate, butyl acrylate, ethylhexyl acrylate, vinyl acetate, acrylonitrile, acrylamide, styrene, methyl methacrylate, and methacrylate. The resin may further include an adhesive in the type of resin mentioned above. For example, the adhesive may include at least any one of functional monomers (such as methacrylic acid, acrylic acid, itaconic acid, hydroxyethyl methacrylate, hydroxypropyl methacrylate, dimethylaminoethyl, acrylamide, hydroxymethylacrylamide, glycidylmethacrylamide, and maleic acid) and crosslinking agents (such as melamine, urea, polyisocyanate, epoxy resin, metal chelate, and polyamine).

[0134] According to an embodiment, the display device 10 may include an infrared blocking member 600 to block incident infrared light IR from entering the optical sensor 500. Therefore, if the optical sensor 500 is disposed below the entire display panel 300, the optical sensor 500 can have a high recognition rate, such that the fingerprint recognition area FA is formed throughout the entire display area DA.

[0135] The display device 10 may not necessarily include a separate infrared blocking member 600, but may include an infrared blocking member 600 integrated with the adhesive member, polarizing film 200, display panel 300, etc. Since the infrared blocking member 600, as described above, may include infrared blocking material dispersed in resin, it can be integrated with other components of the display device 10 by adding the infrared blocking material. Various components of the display device 10 can perform infrared blocking functions.

[0136] Therefore, according to another embodiment of the present disclosure, a fingerprint recognition method includes: transmitting light L1 from a display panel 300 toward a cover window 100 of a display device 10; receiving reflected light L2 at an optical sensor 500, wherein at least a portion of the display panel 300 is located between the optical sensor 500 and the cover window 100; blocking a portion of infrared light IR reaching the optical sensor 500, wherein the infrared light IR includes a portion of incident light on the cover window 100, and the ratio of blocked infrared light to transmitted infrared light is higher than the ratio of blocked visible light to transmitted visible light of the incident light; and recognizing a user's fingerprint based at least in part on the reflected light L2.

[0137] Figure 9 This is a schematic cross-sectional view of the display device 10_1 according to an embodiment.

[0138] Reference Figure 9 The display device 10_1 according to the embodiment may include a polarizing film 200_1 and an infrared blocking member 600 integrated with each other. Therefore, the polarizing film 200_1 may include a material that blocks the transmission of infrared light. Figure 9 The display device 10_1, except that the infrared blocking member 600, which is set as a separate component, is similar to... Figure 7 The display device 10 is identical, and the polarizing film 200_1 includes an infrared blocking material, such that the hard coating 260_1 of the polarizing film 200_1 includes an infrared blocking member 600. Therefore, any redundant description will be omitted, and the differences will be mainly described below. Additionally, for ease of description, when a member other than the infrared blocking member 600 includes a material that blocks the transmission of infrared light, the member will be described as "including" the infrared blocking member 600. In this case, it can be understood that the member has an infrared blocking function, or... Figure 7 The infrared blocking component 600 is integrated with the component.

[0139] exist Figure 9 In the display device 10_1, the polarizing film 200_1 may include a hard coating 260_1 and a polarizer 210_1, and the hard coating 260_1 may include a material that blocks the transmission of infrared light. For example, in Figure 9 In the display device 10_1, the hard coating 260_1 of the polarizing film 200_1 may include an infrared blocking member 600. Since the hard coating 260_1 includes an infrared blocking material, it can prevent externally incident infrared light from entering the optical sensor 500. Figure 7 Similar to the infrared blocking member 600, the hard coating 260_1 of the polarizing film 200_1 may include an OCR to protect the polarizer 210_1. Figure 9In the polarizing film 200_1, metal, its oxide, or dye as an infrared blocking material can be mixed with the hard coating 260_1, and the hard coating 260_1 can block the transmission of infrared light.

[0140] According to an embodiment, in the display device 10_1, since the infrared blocking member 600 is integrated with the polarizing film 200_1, the second adhesive member AM2 used to bond the infrared blocking member 600 and the polarizing film 200_1 can be omitted.

[0141] As described above, in the infrared blocking member 600, the infrared blocking material dispersed in the resin may include a metal, its oxide, or a dye. Each adhesive member may include an OCA, OCR, or PSA to include a resin in which the infrared blocking material may be dispersed. In an exemplary embodiment, each adhesive member may include an infrared blocking material to block infrared light from entering the optical sensor 500. For example, the infrared blocking member 600 may be integrated with each adhesive member.

[0142] Figure 10 and Figure 11 These are schematic cross-sectional views of display devices 10_2 and 10_3 according to embodiments.

[0143] Reference Figure 10 and Figure 11 According to the embodiments, display devices 10_2 and 10_3 may respectively include adhesive members AM600_2 and AM600_3 having infrared blocking material. (The last part, "can be omitted," is a separate, unrelated instruction and can be omitted.) Figure 7 The infrared blocking component 600, and Figure 10 and Figure 11 The adhesive components AM600_2 and AM600_3 can be integrated with the infrared blocking component 600. Figure 10 In this configuration, the adhesive component AM600_2 is integrated with the infrared blocking component 600. The adhesive component AM600_2 can be located between the cover window 100 and the polarizing film 200. Figure 11 In the middle, the adhesive component AM600_3 between the polarizing film 200 and the display panel 300 is integrated with the infrared blocking component 600. Now, the... Figure 10 As an example, it is clear that the same description applies to Figure 11 The situation.

[0144] exist Figure 10In the display device 10_2, the adhesive member AM600_2 used to bond the cover window 100 and the polarizing film 200 may include a material that blocks the transmission of infrared light. For example, the adhesive member AM600_2 may include an infrared blocking member 600 or may be integrated with an infrared blocking member 600. The adhesive member AM600_2 may include OCR or PSA, and the infrared blocking material may be mixed with OCR or PSA. Therefore, in Figure 10 In the display device 10_2, the adhesive member AM600_2 can perform an infrared blocking function to prevent external infrared light from entering the optical sensor 500.

[0145] exist Figure 11 In the display device 10_3, the adhesive member AM600_3 used to bond the polarizing film 200 and the display panel 300 can perform an infrared blocking function. For example, the adhesive member AM600_3 may include an infrared blocking member 600. In this case, the adhesive member AM600_3 performing the function of the infrared blocking member 600 can be disposed between the polarizing film 200 and the display panel 300.

[0146] Figure 12 This is a schematic cross-sectional view of the display device 10_4 according to an embodiment. Figure 13 yes Figure 12 A schematic cross-sectional view of the display panel 300_4 of the display device 10_4.

[0147] Reference Figure 12 and Figure 13 In the display device 10_4 according to the embodiment, the display panel 300_4 and the infrared blocking member 600 can be integrated with each other. In an exemplary embodiment, the encapsulation organic layer TFE 600_4 of the thin-film encapsulation layer TFEL of the display panel 300_4 may include a material that blocks the transmission of infrared light. For example, the thin-film encapsulation layer TFEL of the display panel 300_4 may include the infrared blocking member 600. In this case, the encapsulation organic layer TFE 600_4 that performs the function of the infrared blocking member 600 may be disposed in the display device 10_4 between the touch member TSL and the light-emitting element layer EML of the display panel 300_4.

[0148] Since the optical sensor 500 is located below the display panel 300_4, the infrared blocking member 600 does not need to be located on the display panel 300_4. For example, the infrared blocking member 600 can be located anywhere between the optical sensor 500 and the cover window 100, as long as the infrared blocking member 600 is superimposed on the optical sensor 500 in the thickness direction (e.g., in the third direction DR5).

[0149] Figure 14 and Figure 15These are schematic cross-sectional views of display devices 10_5 and 10_6 according to embodiments.

[0150] First, refer to Figure 14 The display device 10_5 may include an infrared blocking member 600_5 disposed between the display panel 300 and the optical sensor 500_5. The infrared blocking member 600_5 can be bonded to the underside of the display panel 300 via a third adhesive member AM3 and to the optical sensor 500_5 via a fourth adhesive member AM4. Figure 14 In the display device 10_5, unlike the display device 10 described above, the infrared blocking member 600_5 can be disposed relatively close to the optical sensor 500_5. The infrared blocking member 600_5 can be stacked with the optical sensor 500_5 to block infrared light from entering the optical sensor 500_5.

[0151] exist Figure 15 In the display device 10_6, the infrared blocking member 600 is integrated with the adhesive member AM600_6 for bonding the display panel 300 with the optical sensor 500_6. Since this is the same as the case described above, a detailed description thereof is omitted.

[0152] The optical sensor 500_6 does not need to be located below the entire display panel 300, but can be located below a portion of the display panel 300. In this case, the fingerprint recognition area FA can be formed in the portion of the display area DA corresponding to the optical sensor 500_6.

[0153] Figure 16 This is a schematic plan view of the fingerprint recognition area FA_7 of the display device 10_7 according to an embodiment. Figure 17 and Figure 18 yes Figure 16 A schematic cross-sectional view of the display device 10_7.

[0154] Reference Figures 16 to 18 In the display device 10_7 according to an embodiment, the lower panel member 400_7 may include an opening that partially exposes the fourth adhesive member AM4, and the optical sensor 500_7 may be disposed below the display panel 300 and within said opening. Therefore, the fingerprint recognition area FA_7 may not be formed within the entire display area DA of the display device 10_7. Instead, the fingerprint recognition area FA_7 may be formed in the portion of the display area DA corresponding to the area where the optical sensor 500_7 is disposed.

[0155] The embodiment is not limited to the fingerprint recognition area FA_7 disposed adjacent to the lower surface of the display device 10_7, but may also be adjacent to other sides in the second direction DR4 as shown in the figures. The fingerprint recognition area FA_7 can vary depending on the position of the optical sensor 500_7. For example, the fingerprint recognition area FA_7 can vary depending on the position of the opening in the lower panel member 400_7. Because the optical sensor 500_7 is disposed in the opening of the lower panel member 400_7, Figures 16 to 18 The display device 10_7, except that the fingerprint recognition area FA_7 is located in a part of the display area DA, is otherwise connected to... Figures 6 to 8 The display device 10 is the same.

[0156] Because the fingerprint recognition area FA_7 superimposed on the optical sensor 500_7 is reduced, the display device 10_7 can sense the user's fingerprint input in the fingerprint recognition area FA_7 through the optical sensor 500_7. If the optical sensor 500_7 is disposed below a portion of the display panel 300, the infrared blocking member 600_7 disposed between the optical sensor 500_7 and the cover window 100 can prevent externally incident infrared light IR from entering the optical sensor 500_7. Specifically, since the infrared blocking member 600_7 is partially superimposed on the optical sensor 500_7 and disposed in an area wider than the optical sensor 500_7, the infrared light incident on the optical sensor 500_7 can be minimized.

[0157] Figure 19 and Figure 20 This is a schematic cross-sectional view of the display device 10_8 according to an embodiment.

[0158] Reference Figure 19 and Figure 20 In the display device 10_8 according to the embodiment, the infrared blocking member 600_8 may be disposed in the opening of the bottom plate member 400_8 and may be disposed on the optical sensor 500_8. For example, the infrared blocking member 600_8 may be disposed between the optical sensor 500_8 and the cover window 100, and may be disposed in the area overlapping with the optical sensor 500_8.

[0159] In this case, the infrared blocking member 600_8 can block a portion of the infrared light IR incident on the display device 10_8. However, since the infrared blocking member 600_8 is directly disposed on the optical sensor 500_8, it can prevent infrared light IR incident from outside the display device 10_8 from entering the optical sensor 500_8.

[0160] The display device according to an embodiment includes an optical sensor disposed below a display panel and forming a fingerprint recognition area in the display area, and an infrared blocking member that blocks infrared light from entering the optical sensor. The infrared blocking member is disposed between the optical sensor and a cover window, and in some cases can be integrated with an adhesive member, the display panel, a polarizing film, etc. Therefore, according to the embodiment, the display device can improve the fingerprint recognition rate of the optical sensor by blocking infrared light from entering the optical sensor.

[0161] In concluding this detailed description, those skilled in the art will understand that many variations and modifications can be made to the embodiments without departing substantially from the principles of the invention. Therefore, the disclosed embodiments are used only in a general and descriptive sense, and not for purposes of limitation.

Claims

1. A display device, the display device comprising: Display panel; A cover window is positioned above the display panel; An optical sensor, wherein the optical sensor is disposed beneath the entire area of ​​the display panel; A fourth adhesive member is disposed between the display panel and the optical sensor, and respectively contacts the surfaces of the display panel and the optical sensor facing the fourth adhesive member; An infrared blocking member is disposed between the optical sensor and the cover window. The infrared blocking member has no holes, and at least a portion of the infrared blocking member overlaps with the optical sensor from above. The lower plate component is disposed below the optical sensor and includes a light-absorbing component.

2. The display device according to claim 1, wherein the display device comprises: Display area and non-display area, wherein the non-display area is outside the display area; as well as The fingerprint recognition area is stacked above the optical sensor.

3. The display device according to claim 2, wherein, The fingerprint recognition area is located in the display area.

4. The display device according to claim 2, further comprising a polarizing film disposed between the display panel and the cover window.

5. The display device according to claim 4, wherein, The infrared blocking component is disposed between the polarizing film and the cover window.

6. The display device according to claim 5, further comprising a second adhesive member disposed between the polarizing film and the cover window, wherein, The second adhesive component includes the infrared blocking component.

7. The display device according to claim 4, wherein, The polarizing film includes a polarizer and a hard coating disposed on the polarizer, and the hard coating includes the infrared blocking member.

8. The display device according to claim 4, wherein, The display panel includes a light-emitting layer and a thin-film encapsulation layer disposed on the light-emitting layer, and also includes a touch component disposed on the thin-film encapsulation layer of the display panel.

9. The display device according to claim 8, wherein, The thin-film encapsulation layer includes the infrared blocking component.

10. The display device according to claim 8, further comprising a third adhesive member disposed between the display panel and the polarizing film, wherein, The third adhesive component includes the infrared blocking component.

11. The display device according to claim 2, wherein, The infrared blocking component includes a material that blocks the transmission of infrared light and prevents light with a center wavelength in the range of 780nm to 2500nm from entering the optical sensor.

12. The display device according to claim 11, wherein, The infrared blocking component comprises metal or metal oxide.

13. The display device according to claim 12, wherein, The metal or the metal oxide has a diameter of 1 nm to 100 nm.

14. The display device according to claim 13, wherein, The metal or the metal oxide is nickel, chromium, niobium, tantalum, iridium, vanadium, or oxides thereof.

15. The display device according to claim 11, wherein, The infrared blocking component includes at least one of diammonium dyes, polymethyl dyes, anthraquinone dyes, phthalocyanine dyes, naphthalene phthalocyanine dyes, and nickel thiolate complexes.

16. A display device, the display device comprising: Display panel; A cover window is positioned above the display panel; An adhesive component is disposed below the display panel; The lower plate member is disposed below the adhesive member and includes an opening that partially exposes the lower surface of the adhesive member; An optical sensor is disposed below the display panel, located in the opening of the lower panel member, and spaced apart from the lower panel member; as well as An infrared blocking member is disposed in the opening and between the optical sensor and the adhesive member. The infrared blocking member has no holes, and it is completely overlapped with the optical sensor from above. The adhesive member contacts the surface of the display panel facing the adhesive member, as well as the surfaces of the optical sensor and the lower panel member facing the adhesive member.

17. The display device according to claim 16, wherein, The infrared blocking component includes a material that blocks the transmission of infrared light and prevents light with a center wavelength in the range of 780nm to 2500nm from entering the optical sensor.

Images