Display device

By setting crack detection lines in the bending area of the flexible display panel, cracks are monitored in real time, and the crack problems that occur during bending of the flexible display panel are solved, thereby improving the reliability of the display device.

CN112018155BActive Publication Date: 2025-07-25SAMSUNG DISPLAY CO LTD
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Patent Information

Application Number
CN202010474775.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2019-05-31
Filing Date
2020-05-29
Publication Date
2025-07-25
Estimated Expiration
2040-05-29

AI Technical Summary

Technical Problem

Flexible display panels are prone to cracks during bending, resulting in moisture penetration and wiring breakage, affecting the reliability of the display device.

Method used

A crack detection line is provided in the curved area of the display panel, and the crack detection circuit part is electrically connected to the crack detection circuit part to detect and monitor the occurrence of cracks in real time to prevent defects of the display device.

Benefits of technology

Effectively detect and prevent cracks in the display panel, improve the reliability of the display device, and avoid operant defects caused by cracks.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present disclosure relates to a display device, the display device including a display panel, the display panel including a display area and a non-display area surrounding the display area, the display area including pixels. The display area may include a flat display area and at least one curved display area, and the display panel includes at least one crack detection line disposed in the at least one curved display area.
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Description

[0001] Cross - Reference to Related Applications

[0002] This application claims the priority and benefit of Korean Patent Application No. 10-2019-0064347, filed with the Korean Intellectual Property Office on May 31, 2019, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to a display device configured to be able to detect cracks between its parts. Background Art

[0004] A display device such as an organic light emitting diode display may include a display panel having a screen on which an image is displayed. The display panel may be manufactured by forming several layers and elements on a substrate.

[0005] Glass may be used as the substrate of the display panel. The glass substrate may be heavy and prone to breakage, and since the glass substrate may be rigid, it may be difficult to deform the display panel. Flexible display panels using a light, impact-resistant, and easily deformable flexible substrate have been developed. Summary of the Invention

[0006] The flexible display panel may include a bendable region. When the display panel can be bent, cracks may occur in the display panel. Moisture or the like may penetrate into the display panel, and due to the occurrence of cracks, wirings may be broken, so that defects in the flexible display panel may occur.

[0007] Embodiments provide a display device that can detect cracks that may occur in a display panel part, which may be a display area or a bending area of the display panel.

[0008] Embodiments may provide a display device including a display panel including a display area and a non-display area surrounding the display area, the display area including pixels. The display area may include a flat display area and at least one curved display area. The display panel includes at least one crack detection line disposed in the at least one curved display area.

[0009] The display device may further include a crack detection circuit part disposed in the non-display area, and the at least one crack detection line may be electrically connected to the crack detection circuit part.

[0010] The flat display area may be rectangular, and the at least one curved display area may include four curved display areas respectively adjacent to four sides of the flat display area.

[0011] The at least one crack detection line may include a first crack detection line that extends across three of the four bending display regions.

[0012] The display panel may include a pad portion disposed in the non-display region, and the at least one crack detection line may include a second crack detection line that extends in a bending display region between the flat display region and the pad portion among the four bending display regions.

[0013] The display panel may include a substrate, a light-emitting diode disposed on the substrate, a packaging layer covering the light-emitting diode, and a touch sensor unit disposed on the packaging layer. The touch sensor unit may include a first conductor, an insulating layer disposed on the first conductor, and a second conductor disposed on the insulating layer.

[0014] The first conductor may include the at least one crack detection line.

[0015] The first conductor may have a grid shape, and the at least one crack detection line may extend in an alternating pattern along the lines forming the grid shape.

[0016] The at least one crack detection line may be offset from the light-emitting diode.

[0017] The second conductor may include touch electrodes, and the first conductor may include bridges that electrically connect adjacent touch electrodes among the touch electrodes.

[0018] The display panel may further include a buffer layer disposed between the packaging layer and the touch sensor unit, and the at least one crack detection line may be disposed between the packaging layer and the buffer layer.

[0019] The at least one crack detection line may be offset from the light-emitting diode.

[0020] The display panel may include a substrate, a transistor disposed on the substrate, and a light-blocking layer disposed between the substrate and the transistor and overlapping with the semiconductor layer of the transistor, and the at least one crack detection line may be disposed in the same layer as the light-blocking layer and may be formed of the same material as the light-blocking layer.

[0021] The display panel may further include a buffer layer disposed between the substrate and the transistor, and the at least one crack detection line may be disposed between the substrate and the buffer layer.

[0022] An embodiment may provide a display device including a display panel. The display panel includes: a main panel area including a first side extending in a first direction and a second side extending in a second direction intersecting the first direction; a first sub-panel area that can contact the first side and can be bent; and a second sub-panel area that can contact the second side and can be bent. The first sub-panel area and the second sub-panel area may include a display area and a non-display area, and the display panel may include crack detection lines disposed in the display area.

[0023] The display panel may include a substrate, transistors disposed on the substrate, light-emitting diodes disposed on the transistors, a packaging layer disposed on the light-emitting diodes, and a touch sensor unit disposed on the packaging layer, and the crack detection lines may be disposed within the touch sensor unit.

[0024] The touch sensor unit may include a bridge disposed on the packaging layer, a first insulating layer disposed on the bridge, and touch electrodes disposed on the first insulating layer and electrically connected to each other through the bridge, and the crack detection lines may be disposed in the same layer as the bridge and may be formed of the same material as the bridge.

[0025] The display panel may include a substrate, transistors disposed on the substrate, light-emitting diodes disposed on the transistors, a packaging layer disposed on the light-emitting diodes, a buffer layer disposed on the packaging layer, and a touch sensor unit disposed on the buffer layer, and the crack detection lines may be disposed between the packaging layer and the buffer layer.

[0026] The display panel may include a substrate, a buffer layer disposed on the substrate, and transistors disposed on the buffer layer, and the crack detection lines may be disposed between the substrate and the buffer layer.

[0027] The display panel may include a light-blocking layer disposed between the substrate and the buffer layer and overlapping with the semiconductor layer of the transistors, and the crack detection lines may be formed of the same material as the light-blocking layer.

[0028] According to an embodiment, cracks occurring in a bended display area included in a display panel may be detected, thereby preventing defects from occurring in the display device, and thus improving the reliability of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A front view of a display device according to an embodiment is shown.

[0030] Figure 2 shows a schematic cross-sectional view taken along line A-A' in Figure 1 .

[0031] Figure 3 shows a top plan view of a display device according to an embodiment.

[0032] Figure 4 shows a schematic cross-sectional view taken along line B-B' in Figure 3 .

[0033] Figure 5 shows a schematic cross-sectional view taken along line C-C' in Figure 3 .

[0034] Figure 6 shows a schematic cross-sectional view taken along line B-B' in Figure 3 .

[0035] Figure 7 shows a top plan view of a touch sensor unit of a display device according to an embodiment.

[0036] Figure 8 shows an enlarged view of region E in Figure 7 .

[0037] Figure 9 shows a schematic cross-sectional view taken along line G-G' in Figure 3 .

[0038] Figure 10 shows a top plan view of a display device according to an embodiment. DETAILED DESCRIPTION

[0039] Hereinafter, the present disclosure will be described more fully with reference to the accompanying drawings. As those skilled in the art will recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the present disclosure.

[0040] Portions unrelated to the description will be omitted to clearly describe the present disclosure, and throughout the specification, like reference numerals denote like elements.

[0041] In addition, in the drawings, for ease of description, the dimensions and thicknesses of each element are arbitrarily shown, but the present disclosure need not be limited to those embodiments shown in the drawings. In the drawings, the thicknesses of layers, films, panels, regions, etc. may be exaggerated for clarity.

[0042] It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, intervening elements may not be present. The words "above" or "on" mean located on or below a portion of an object and do not necessarily imply being on the upper side of the object portion based on the direction of gravity.

[0043] Unless explicitly described to the contrary, the words "comprise" and variations such as "comprising" or "containing" will be understood to imply the inclusion of the stated elements but not the exclusion of any other elements. As used herein, the term "and / or" can include any one or more of the one or more of the associated listed items and all combinations. Expressions such as "at least one", when preceding a list of elements, modify the entire list of elements and not individual elements of the list.

[0044] In cases where a particular embodiment can be implemented differently, a particular process order can be performed differently from the described order. For example, two consecutively described processes can be performed substantially simultaneously or in an order opposite to the described order.

[0045] Taking into account the measurements under discussion and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system), as used herein, "about" or "approximate" includes the stated value and means within an acceptable deviation of the particular value as determined by a person of ordinary skill in the art. For example, "about" can mean within one or more standard deviations, or for example within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0046] It will be understood that although the terms "first", "second", etc. may be used herein to describe various components, these components should not be limited by these terms. These terms are only used to distinguish one component from another.

[0047] As used herein, unless the context clearly indicates otherwise, the singular forms "a", "an", and "the" are also intended to include the plural forms.

[0048] In the embodiments below, it will be understood that when an element, region, or layer is referred to as being connected to another element, region, or layer, the element, region, or layer can be directly or indirectly connected to the other element, region, or layer. For example, it will be understood that in this specification, when an element, region, or layer is referred to as being in contact with or electrically connected to another element, region, or layer, the element, region, or layer can be directly or indirectly in contact with or electrically connected to the other element, region, or layer.

[0049] In addition, the phrase "in a plan view" means when observing the object part from above, and the phrase "in a sectional view" means when observing the section taken by vertically cutting the element part from the side. Additionally, the term "overlap" or "overlapping" means that the first object can be above or below the second object or on one side of the second object, and vice versa. Additionally, the term "overlap" may include laminating, stacking, facing or being oriented, extending above, covering or partially covering, or any other suitable terms as would be appreciated and understood by those of ordinary skill in the art. The terms "face" and "be oriented" mean that the first element can be directly or indirectly opposite the second element. In the case where a third element is between the first element and the second element, the first element and the second element can be understood to be indirectly opposite each other although still facing each other. When an element is described as "non-overlapping" or "not overlapping" with another element, this may include terms such as the elements being spaced apart from each other, deviating from each other or being separated from each other or any other suitable terms as would be appreciated and understood by those of ordinary skill in the art. When a layer, region, substrate or location is referred to as being "on" another layer, region, substrate or location, the layer, region, substrate or location can be directly on the other layer, region, substrate or location, or there may be intermediate layers, regions, substrates or locations therebetween. In contrast, when a layer, region, substrate or location is referred to as being "directly on" another layer, region, substrate or location, there may be no intermediate layers, regions, substrates or locations therebetween. Additionally, when a layer, region, substrate or location is referred to as being "under" another layer, region, substrate or location, the layer, region, substrate or location can be directly under the other layer, region, substrate or location, or there may be intermediate layers, regions, substrates or locations therebetween. In contrast, when a layer, region, substrate or location is referred to as being "directly under" another layer, region, substrate or location, there may be no intermediate layers, regions, substrates or locations therebetween. Additionally, "above" or "on" can include being located above or below an object and does not necessarily imply a gravity-based direction.

[0050] For ease of description, the spatial relative terms "under", "below", "lower", "above" or "upper" etc. may be used herein to describe the relationship between one element or component and another element or component as shown in the drawings. It will be understood that, in addition to the orientation depicted in the drawings, the spatial relative terms are intended to cover different orientations of the device during use or operation. For example, in the case where the device shown in the drawings is flipped, a device located "under" or "below" another device can be located "above" the other device. Thus, the exemplary term "below" can include both lower and upper positions. The device can also be oriented in other directions, and thus, the spatial relative terms can be interpreted differently depending on the orientation.

[0051] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined in the specification.

[0052] In the drawings, with respect to the direction of reference, "x" may be a first direction, "y" may be a second direction perpendicular to the first direction, and "z" may be a third direction perpendicular to the first and second directions.

[0053] Figure 1 A front view of a display device 1 according to an embodiment is shown, and Figure 2 is shown along Figure 1 a schematic cross-sectional view taken along line A-A' in

[0054] Referring to Figure 1 and Figure 2 , the display device 1 may include a window 10 and a display panel 20 disposed on a rear surface of the window 10. The display device 1 may be an electronic device such as a smart phone, a mobile phone, a tablet computer, a multimedia player, or a portable information terminal, or a module for an electronic device. Four edge regions of each of the window 10 and the display panel 20 may be curved. In another example, one or two of the four edge regions of each of the window 10 and the display panel 20 may not be curved.

[0055] The window 10 may be implemented as a cover that can protect the display panel 20 from the external environment, impacts, etc. The window 10 may support maintaining the curved state of the display panel 20. The window 10 may be made of a transparent and rigid material such as glass or plastic so that an image displayed on the screen of the display panel 20 can be viewed. The window 10 may be curved by thermoforming a glass plate, a plastic plate, or the like.

[0056] The display panel 20 may be a light-emitting display panel including light-emitting elements. At least a part of the display panel 20 may be flexible. The display panel 20 may mainly include a display area DA corresponding to a screen on which an image can be displayed and a non-display area NA on which an image may not be displayed. Pixels may be arranged in the display area DA, and an image may be displayed by a combination of the pixels. Signal lines for transmitting signals for driving the pixels may be arranged in the display area DA. For example, data lines for transmitting data signals may extend in a first direction x, and gate lines for transmitting gate signals may extend in a second direction y. Each pixel may be connected to a transistor that is connected to the data line and the gate line, and the pixel may receive a data signal (voltage) for controlling the brightness of the pixel at a predetermined timing.

[0057] The non-display area NA may be set near the edge of the display panel 20 and may surround or be near the periphery of the display area DA. The non-display area NA may be an area in which circuits and / or wirings for generating and / or transmitting various signals applied to the display area DA may be provided. The non-display area NA may be provided with a pad portion including pads for receiving signals from the outside of the display panel 20 or for outputting signals to the outside of the display panel 20. The pad portion may be provided in the non-display area NA at the upper edge or the lower edge of the display panel 20, and a flexible printed circuit film may be bonded to the pad portion.

[0058] Since the four edge regions of the display panel 20 can be bent, the non-display area NA may be almost invisible when the display device 1 is viewed from the front. Since the four edge regions of the display panel 20 can be bent, the screen can occupy most of the area that can be viewed when the display device 1 is viewed from the front, and thus the screen-to-body ratio of the display device 1 can be maximized.

[0059] In the display device 1, the window 10 and the display panel 20 may be bent and attached together. An adhesive such as an optically transparent adhesive may be used for bonding between the window 10 and the display panel 20, and an adhesion layer may be provided between the window 10 and the display panel 20.

[0060] In the case where the window 10 can be divided into a plurality of parts, the window 10 may include a substantially flat main window portion 110 and a first sub-window portion 121, a second sub-window portion 122, a third sub-window portion 123, and a fourth sub-window portion 124 that may be set to contact the main window portion 110.

[0061] The main window portion 110 may be generally rectangular and may include four sides 111 to 114. In the main window portion 110, the edges of its corners may be rounded. The first side 111 and the third side 113 may extend in a first direction x, and the second side 112 and the fourth side 114 may extend in a second direction y. The first sub-window portion 121 to the fourth sub-window portion 124 may be portions that can be bent with a predetermined curvature relative to the main window portion 110. The first side 111 to the fourth side 114 of the main window portion 110 may represent reference lines for bending the first sub-window portion 121 to the fourth sub-window portion 124 relative to the main window portion 110. The first side 111 to the fourth side 114 of the main window portion 110 may be the bending start lines of the first sub-window portion 121 to the fourth sub-window portion 124. In other words, the first side 111 to the fourth side 114 of the main window portion 110 may be the start lines from which the bending of the first sub-window portion 121 to the fourth sub-window portion 124 can begin.

[0062] Similar to the window 10, the display panel 20 may include a substantially flat main panel area 210 and a first sub-panel area 221, a second sub-panel area 222, a third sub-panel area 223, and a fourth sub-panel area 224 that may be arranged to contact the main panel area 210.

[0063] The main panel area 210 may be generally rectangular and may include four sides 211 to 214. In the main panel area 210, the edges of its corners may be rounded. The first side 211 and the third side 213 may extend in a first direction x, and the second side 212 and the fourth side 214 may extend in a second direction y. The first sub-panel area 221 to the fourth sub-panel area 224 may be areas that can be bent with a predetermined curvature relative to the main panel area 210. The first side 211 to the fourth side 214 of the main panel area 210 may be reference lines for bending the first sub-panel area 221 to the fourth sub-panel area 224 relative to the main panel area 210. The first side 211 to the fourth side 214 of the main panel area 210 may be the bending start lines of the first sub-panel area 221 to the fourth sub-panel area 224. In other words, the first side 211 to the fourth side 214 of the main panel area 210 may be the start lines from which the bending of the first sub-panel area 221 to the fourth sub-panel area 224 can begin.

[0064] The first to fourth sub-window portions 121 to 124 of the window 10 and the first to fourth sub-panel regions 221 to 224 of the display panel 20 can be bent. The first sub-window portion 121 can be bent based on a bending axis that can be parallel to the first side 111. The second sub-window portion 122 can be bent based on a bending axis that can be parallel to the second side 112. The third sub-window portion 123 can be bent based on a bending axis that can be parallel to the third side 113. The fourth sub-window portion 124 can be bent based on a bending axis that can be parallel to the fourth side 114. The first sub-panel region 221 can be bent based on a bending axis that can be parallel to the first side 211. The second sub-panel region 222 can be bent based on a bending axis that can be parallel to the second side 212. The third sub-panel region 223 can be bent based on a bending axis that can be parallel to the third side 213. The fourth sub-panel region 224 can be bent based on a bending axis that can be parallel to the fourth side 214.

[0065] The bending axis of the first sub-window portion 121 and the bending axis of the first sub-panel region 221 can be the same. The bending axis of the second sub-window portion 122 and the bending axis of the second sub-panel region 222 can be the same. The bending axis of the third sub-window portion 123 and the bending axis of the third sub-panel region 223 can be the same. The bending axis of the fourth sub-window portion 124 and the bending axis of the fourth sub-panel region 224 can be the same. The first to fourth sides 111 to 114 of the main window portion 110 can overlap or face the first to fourth sides 211 to 214 of the main panel region 210, and when viewed from the front, the first to fourth sides 111 to 114 of the main window portion 110 and the first to fourth sides 211 to 214 of the main panel region 210 can be matched so as to coincide. Since the first to fourth sub-panel regions 221 to 224 of the display panel 20 can be bent, in front of the display device 1, the non-display area NA provided at one or more edges of the display panel 20 can be invisible or almost invisible.

[0066] The window 10 includes a flat area FA that can be bent internally without facing the first to fourth sides 111 to 114 of the main window portion 110. Bending areas BA corresponding to the first to fourth sub-window portions 121 to 124 can be provided outside the first to fourth sides 111 to 114 of the main window portion 110. Similarly, the display panel 20 can include a flat area FA that can be bent internally without facing the first to fourth sides 211 to 214 of the main panel region 210. Bending areas BA corresponding to the first to fourth sub-panel regions 221 to 224 can be provided outside the first to fourth sides 211 to 214 of the main panel region 210.

[0067] In the first sub-panel region 221 to the fourth sub-panel region 224 of the display panel 20, the regions other than the non-display region NA (i.e., one or more regions near the edge) can represent parts of the display region DA or be included as parts of the display region DA. Therefore, the display region DA of the display panel 20 can include a flat display region FDA corresponding to the main panel region 210 and a curved display region BDA corresponding to the first sub-panel region 221 to the fourth sub-panel region 224. The flat display region FDA and the curved display region BDA can be continuous so that no non-display region is included between the flat display region FDA and the curved display region BDA.

[0068] The first sub-window part 121 to the fourth sub-window part 124 can be completely curved. However, the parts of the first sub-window part 121 to the fourth sub-window part 124 adjacent to the first side 111 to the fourth side 114 can be curved, while the parts of the first sub-window part 121 to the fourth sub-window part 124 away from the first side 111 to the fourth side 114 can be flat. The first sub-panel region 221 to the fourth sub-panel region 224 can be completely curved. However, the parts of the first sub-panel region 221 to the fourth sub-panel region 224 adjacent to the first side 211 to the fourth side 214 can be curved, while the parts of the first sub-panel region 221 to the fourth sub-panel region 224 away from the first side 211 to the fourth side 214 can be flat.

[0069] Once the first sub-window part 121 to the fourth sub-window part 124 of the window 10 can be curved, the display panel 20 can be attached to the window 10. In the case where the display panel 20 can be attached to the window 10, the first sub-panel region 221 to the fourth sub-panel region 224 of the display panel 20 can already be curved. Therefore, in a state where the first sub-panel region 221 to the fourth sub-panel region 224 can be curved to match the curvature of the first sub-window part 121 to the fourth sub-window part 124 of the window 10, the display panel 20 can be joined to the window 10.

[0070] Since the first sub-panel region 221 to the fourth sub-panel region 224 of the display panel 20 can be bent, the stress on the first sub-panel region 221 to the fourth sub-panel region 224 will increase. When the stress increases, cracks may occur in the display panel 20. Cracks may occur in the inorganic insulating layer having a large modulus and high brittleness among the various layers that can be included in the first sub-panel region 221 to the fourth sub-panel region 224 of the display panel 20, and cracks may also occur in layers that may not be inorganic insulating layers, or cracks may additionally occur in the wirings. The stress may further increase in the region adjacent to the first side 211 to the fourth side 214 along the bending start line. Therefore, the region adjacent to the first side 211 to the fourth side 214 is very likely to break. Since the stress may increase in the bent display area BDA, cracks may occur in all parts of the first sub-panel region 221 to the fourth sub-panel region 224. Therefore, since cracks may occur in the bent display area BDA, an element for detecting cracks in the bent display area BDA can be obtained to avoid defects in the operability of the display device 1.

[0071] Figure 3 A top plan view of a display device 1 according to an embodiment is shown. Figure 4 It shows along Figure 3 A schematic cross-sectional view taken along line B - B' in, and Figure 5 It shows along Figure 3 A schematic cross-sectional view taken along line C - C' in. Figure 3 It shows before the display panel 20 can be bent and before the display panel 20 is bonded to Figure 1 and Figure 2 The window 10 of the display device 1 shown in.

[0072] Referring to Figure 3 , the display device 1 may include a display panel 20, an integrated circuit chip 30 disposed in a non-display area NA of the display panel 20, and a flexible printed circuit film 40 bonded to a pad portion PP in the non-display area NA of the display panel 20. The integrated circuit chip 30 may be mounted on the flexible printed circuit film 40 and may be electrically connected to the display panel 20.

[0073] The display device 1 may include a driving unit that can be disposed in a non-display area NA of the display panel 20. The driving unit may generate and / or process various signals for driving the display panel 20. The driving unit may include a data driver for applying data signals to data lines, a gate driver for applying gate signals to gate lines, and a signal controller for controlling the data driver and the gate driver. The gate driver may be integrated in the non-display area NA of the display panel 20. The data driver and the signal controller may be implemented by an integrated circuit chip 30.

[0074] The display panel 20 may include a bent portion BR between a fourth sub-panel region 224 and a pad portion PP. The bent portion BR may be disposed in the non-display area NA. The bent portion BR may be bent such that the integrated circuit chip 30 and the flexible printed circuit film 40 can be disposed on the rear surface of the display panel 20.

[0075] The display panel 20 may include crack detection lines for detecting cracks that may occur in the display panel 20. The crack detection lines may include first crack detection lines CD1a and CD1b, second crack detection lines CD2a and CD2b, third crack detection lines CD3a and CD3b, and fourth crack detection lines CD4a and CD4b, and the first crack detection lines CD1a and CD1b, second crack detection lines CD2a and CD2b, third crack detection lines CD3a and CD3b, and fourth crack detection lines CD4a and CD4b may correspond to the positions where they are respectively provided. Each of the crack detection lines CD1a, CD1b, CD2a, CD2b, CD3a, CD3b, CD4a, and CD4b may be configured in a loop form, in which opposite ends may be electrically connected to a crack detection circuit portion CDC. The integrated circuit chip 30 may include the crack detection circuit portion CDC, and each of the crack detection lines CD1a, CD1b, CD2a, CD2b, CD3a, CD3b, CD4a, and CD4b may be electrically connected to the integrated circuit chip 30. One end of at least one of the crack detection lines CD1a, CD1b, CD2a, CD2b, CD3a, CD3b, CD4a, and CD4b may be electrically connected to the pad portion PP, and the other end of at least one of the crack detection lines CD1a, CD1b, CD2a, CD2b, CD3a, CD3b, CD4a, and CD4b may be electrically connected to the integrated circuit chip 30. In another example, the crack detection circuit portion CDC may not be integrated in the integrated circuit chip 30 but may be provided separately.

[0076] The crack detection circuit part CDC can apply signals to the crack detection lines CD1a, CD1b, CD2a, CD2b, CD3a, CD3b, CD4a, and CD4b and can receive the signals output from the crack detection lines CD1a, CD1b, CD2a, CD2b, CD3a, CD3b, CD4a, and CD4b to detect whether cracks have occurred. In the case where cracks may occur at the positions where the crack detection lines can be provided, the crack detection lines may break or the resistance may increase. Therefore, when the crack detection circuit part CDC does not receive the output signal of the crack detection lines or only receives a slight output signal, the crack detection circuit part CDC can detect that cracks may have occurred in the area where the crack detection lines can be provided.

[0077] The first crack detection lines CD1a and CD1b, which can help detect cracks generated in the bending display area BDA of the first sub-panel area 221 to the third sub-panel area 223, can be provided in the first sub-panel area 221 to the third sub-panel area 223. The first crack detection lines CD1a and CD1b can include portions provided in the fourth sub-panel area 224 for electrically connecting to the crack detection circuit part CDC. The portions of the first crack detection lines CD1a and CD1b provided in the fourth sub-panel area 224 can be provided in the bending display area BDA or can be provided in the non-display area NA. The first crack detection lines CD1a and CD1b can include portions overlapping or facing the first side 211 to the third side 213 of the main panel area 210 that can represent the bending start line.

[0078] The first crack detection lines CD1a and CD1b can include the first crack detection line CD1a provided on the left side of the substantial center of the display panel 20 and the first crack detection line CD1b provided on the right side of the substantial center of the display panel 20 to confirm whether cracks have occurred in the left area or the right area of the display panel 20. The first crack detection line CD1a and the first crack detection line CD1b can be separated from the second sub-panel area 222.

[0079] The second crack detection lines CD2a and CD2b, which can help detect cracks generated in the bending display area BDA of the fourth sub-panel area 224, can be mainly provided in the fourth sub-panel area 224. The second crack detection lines CD2a and CD2b can include portions overlapping or facing the fourth side 214 of the main panel area 210 that can represent the bending start line.

[0080] For similar reasons as discussed above regarding the first crack detection lines CD1a and CD1b, the second crack detection lines CD2a and CD2b may include a second crack detection line CD2a disposed on the left side of the substantial center of the display panel 20 and a second crack detection line CD2b disposed on the right side of the substantial center of the display panel 20. The second crack detection line CD2a and the second crack detection line CD2b may be separated from the fourth sub-panel region 224.

[0081] Accordingly, cracks occurring in the bent display area BDA of the first sub-panel region 221 to the fourth sub-panel region 224 can be detected.

[0082] Third crack detection lines CD3a and CD3b that can assist in detecting cracks occurring in the non-display area NA may be disposed in the non-display area NA. Accordingly, the third crack detection lines CD3a and CD3b may be disposed in the first sub-panel region 221 to the fourth sub-panel region 224, and may also be disposed in the non-display area NA along the edge of the display panel 20 without being disposed in the bent display area BDA. The third crack detection lines CD3a and CD3b may include a third crack detection line CD3a disposed on the left side of the substantial center of the display panel 20 and a third crack detection line CD3b disposed on the right side of the substantial center of the display panel 20. The third crack detection line CD3a and the third crack detection line CD3b may be separated from the second sub-panel region 222.

[0083] Fourth crack detection lines CD4a and CD4b that can assist in detecting cracks occurring between the fourth sub-panel region 224 and the pad portion PP (i.e., in and near the bent portion BR) may be disposed in the non-display area NA. The fourth crack detection lines CD4a and CD4b may include a portion extending substantially in the first direction x and a portion extending substantially in the second direction y. The portion extending substantially in the second direction y may be disposed between the fourth sub-panel region 224 and the bent portion BR, and the portion extending substantially in the first direction x may be disposed in the bent portion BR. The fourth crack detection lines CD4a and CD4b may include a fourth crack detection line CD4a disposed on the left side of the substantial center of the display panel 20 and a fourth crack detection line CD4b disposed on the right side of the substantial center of the display panel 20.

[0084] Accordingly, cracks occurring in the non-display area NA of the display panel 20 can be detected.

[0085] In order to more accurately detect the crack occurrence region, the display panel 20 includes two or more first crack detection lines CD1a and CD1b, two or more second crack detection lines CD2a and CD2b, two or more third crack detection lines CD3a and CD3b, and two or more fourth crack detection lines CD4a and CD4b.

[0086] The following will refer to Figure 4 and Figure 5 to illustrate the positions of the crack detection lines and the schematic cross-sectional structure of the display panel 20. The schematic cross-sectional structure of the right region of the display panel 20 may be symmetric to the schematic cross-sectional structure of the left region of the display panel 20 shown.

[0087] The display panel 20 may include a substrate SB and various layers, wirings, and components formed on the substrate SB.

[0088] The substrate SB may be a flexible substrate and may be made of a polymer such as polyimide, polyamide, polycarbonate, or polyethylene terephthalate.

[0089] A barrier layer BRR for preventing the penetration of moisture, etc. may be provided on the substrate SB. The barrier layer BRR may be made of an inorganic insulating material such as silicon oxide (SiO x ) and silicon nitride (SiN x ).

[0090] A buffer layer BF may be provided on the barrier layer BRR. The buffer layer BF may be used to block the diffusion of impurities from the substrate SB to the semiconductor layer A during the process of forming the semiconductor layer A and to reduce the stress that may be applied to the substrate SB. The buffer layer BF may include an inorganic insulating material such as silicon oxide or silicon nitride.

[0091] The semiconductor layer A may be provided on the buffer layer BF. The semiconductor layer A may include a channel region overlapping with the gate electrode G and source and drain regions located on opposite sides of the channel region. The semiconductor layer A may include polysilicon, amorphous silicon, or an oxide semiconductor.

[0092] A first insulating layer IN1 including an inorganic insulating material such as silicon oxide or silicon nitride may be provided on the semiconductor layer A. The first insulating layer IN1 may be a gate insulating layer.

[0093] A gate conductor including a gate line and the gate electrode G may be provided on the first insulating layer IN1. The gate conductor may include a metal such as molybdenum (Mo), copper (Cu), aluminum (Al), silver (Ag), chromium (Cr), tantalum (Ta), or titanium (Ti).

[0094] The second insulating layer IN2 may be disposed on the first insulating layer IN1 and the gate conductor. The second insulating layer IN2 may include an inorganic insulating material such as silicon oxide or silicon nitride. The second insulating layer IN2 may be an interlayer insulating layer.

[0095] A data conductor including a data line, a source electrode S, and a drain electrode D may be disposed on the second insulating layer IN2. The source electrode S and the drain electrode D may be connected to the source region and the drain region of the semiconductor layer A through contact holes formed in the second insulating layer IN2 and the first insulating layer IN1, respectively. The data conductor may include a metal such as aluminum (Al), copper (Cu), silver (Ag), gold (Au), platinum (Pt), palladium (Pd), nickel (Ni), molybdenum (Mo), tungsten (W), titanium (Ti), chromium (Cr), and tantalum (Ta). The source electrode S and the drain electrode D together with the gate electrode G and the semiconductor layer A may form a transistor TR.

[0096] A third insulating layer IN3 may be disposed on the second insulating layer IN2 and the data conductor. The third insulating layer IN3 may include an organic insulating material such as polyimide, acrylic polymer, or silicone polymer.

[0097] A first electrode E1 of the light-emitting diode LED may be disposed on the third insulating layer IN3. The first electrode E1 may be connected to the drain electrode D through a contact hole formed in the third insulating layer IN3. The first electrode E1 may include a metal such as Ag, Ni, Au, Pt, Al, Cu, AlNd, and AlNiLa. The first electrode E1 may include a transparent conductive material such as indium tin oxide (ITO) and indium zinc oxide (IZO). The first electrode E1 may be a multilayer such as ITO / Ag / ITO and ITO / Al.

[0098] The fourth insulating layer IN4 may have an opening overlapping or facing the first electrode E1 and may be disposed on the third insulating layer IN3. The opening of the fourth insulating layer IN4 may define each pixel region and may be a pixel defining layer. The fourth insulating layer IN4 may include an organic insulating material.

[0099] The light-emitting layer EL can be disposed on the first electrode E1, and the second electrode E2 can be disposed on the light-emitting layer EL. The second electrode E2 can have a light-transmitting property by forming a thin layer of a metal having a low work function such as calcium (Ca), barium (Ba), magnesium (Mg), aluminum (Al), and silver (Ag). The second electrode E2 can include a transparent conductive material such as ITO or IZO. The first electrode E1, the light-emitting layer EL, and the second electrode E2 of each pixel PX can form a light-emitting diode LED such as an organic light-emitting diode. One of the first electrode E1 and the second electrode E2 can be a cathode, and the other of the first electrode E1 and the second electrode E2 can be an anode. The light-emitting diode LED corresponding to the pixel PX can be disposed not only in the flat display area FDA but also in the curved display area BDA.

[0100] The encapsulation layer EN can be disposed on the second electrode E2. The encapsulation layer EN can encapsulate the light-emitting diode LED to prevent moisture or oxygen from penetrating from the outside. The encapsulation layer EN can be a thin-film encapsulation layer including a first inorganic layer 371, an organic layer 372, and a second inorganic layer 373. The first inorganic layer 371 and the second inorganic layer 373 can include inorganic insulating materials such as silicon nitride, silicon oxide, and aluminum oxide (AlO x )). The organic layer 372 can include acrylic resins, methacrylic resins, polyisoprene, vinyl resins, epoxy resins, polyurethane resins, cellulose resins, or perylene resins, etc.

[0101] A buffer layer 380 that can include inorganic insulating materials such as silicon nitride and silicon oxide can be disposed on the encapsulation layer EN. The buffer layer 380 can be omitted.

[0102] The touch sensor unit can be disposed on the buffer layer 380. The touch sensor unit can include a first conductor, a first insulating layer 391, a second conductor, and a second insulating layer 392 that can be sequentially disposed on the buffer layer 380. The first insulating layer 391 can electrically insulate the first conductor and the second conductor, and the second insulating layer 392 can cover the second conductor to protect the second conductor.

[0103] The first conductor and the second conductor can have a grid structure with openings provided to overlap or face the pixel PX. The first conductor and the second conductor can include metals such as aluminum (Al), copper (Cu), titanium (Ti), molybdenum (Mo), silver (Ag), chromium (Cr), and nickel (Ni). The first conductor and the second conductor can include conductive nanomaterials such as silver nanowires and carbon nanotubes. At least one of the first insulating layer 391 and the second insulating layer 392 can include an inorganic insulating material and / or an organic insulating material.

[0104] The first conductor may include a bridge BD, first crack detection lines CD1a and CD1b, and second crack detection lines CD2a and CD2b. The first conductor may further include first crack detection line CD1a' and / or second crack detection line CD2a'. The second conductor may include a touch electrode TE.

[0105] As described with reference to Figure 7 the touch electrode TE may include a first touch electrode and a second touch electrode that may form a mutual inductance capacitor. The bridge BD may be electrically connected to the first touch electrode or the second touch electrode. For example, the second touch electrodes that may be adjacent to and separated from each other may be connected to the bridge BD through contact holes formed in the first insulating layer 391 and may be electrically connected through the bridge BD. The first crack detection lines CD1a and CD1b and the second crack detection lines CD2a and CD2b may be formed at positions where the bridge BD may not be formed, and may be formed at positions where they do not overlap or face the pixel PX. In other words, the first crack detection lines CD1a and CD1b and the second crack detection lines CD2a and CD2b may be formed at positions where the bridge BD may not be formed and may be offset from the pixel PX. The first crack detection lines CD1a and CD1b and the second crack detection lines CD2a and CD2b may be formed of the same material as the bridge BD and may be formed in the same process as the bridge BD. Therefore, the first crack detection lines CD1a and CD1b and the second crack detection lines CD2a and CD2b may be formed without covering the pixel PX and without a separate formation process for them.

[0106] In another example, the first conductor may include the touch electrode TE, and the second conductor may include the bridge BD, the first crack detection lines CD1a and CD1b, and the second crack detection lines CD2a and CD2b. An antireflection layer for reducing external light reflection may be provided on the touch sensor unit, and the antireflection layer may include a polarizer.

[0107] Figure 6 A schematic cross-sectional view taken along line B-B' in Figure 3 is shown.

[0108] With reference to Figure 6, the positions where the first crack detection lines CD1a and CD1b can be formed are different from those in the above-described embodiments. For example, the first crack detection lines CD1a and CD1b can be disposed between the encapsulation layer EN and the buffer layer 380. Since the first crack detection lines CD1a and CD1b can be disposed in the bending display area BDA, the first crack detection lines CD1a and CD1b may not overlap with or face the pixels PX, that is, the first crack detection lines CD1a and CD1b can be disposed in the bending display area BDA to be offset from the pixels PX. Therefore, the first crack detection line CD1a' disposed as described above can effectively contribute to detecting cracks generated in the encapsulation layer EN and the buffer layer 380. The first crack detection lines CD1a and CD1b can include metals such as aluminum (Al), copper (Cu), titanium (Ti), molybdenum (Mo), silver (Ag), chromium (Cr), and nickel (Ni). The second crack detection lines CD2a and CD2b disposed in the fourth sub-panel area 224 can also be disposed between the encapsulation layer EN and the buffer layer 380 without overlapping with or facing the pixels PX.

[0109] Figure 7 A top plan view showing a touch sensor unit included in a display device according to an embodiment, and Figure 8 shows Figure 7 an enlarged view of area E in

[0110] Referring to Figure 7 and Figure 8 , the touch sensor unit can include a first touch electrode TE1 and a second touch electrode TE2. The touch sensor unit can include a first bridge BD1 connecting the first touch electrodes TE1 arranged in the second direction y and a second bridge BD2 connecting the second touch electrodes TE2 arranged in the first direction x. The touch sensor unit can also include a first touch line W10 connected to the first touch electrode TE1 to transmit signals and a second touch line W20 connected to the second touch electrode TE2 to transmit signals.

[0111] The first touch electrode TE1 and the second touch electrode TE2 may be disposed in the touch sensing area TA. As an area capable of sensing the touch of an object, the touch sensing area TA may correspond to a display area DA including the flat display area FDA and the curved display area BDA described above. The first touch electrode TE1 and the second touch electrode TE2 may be disposed adjacent to each other to form a mutual capacitance capacitor, so as to sense a capacitance change caused by the touch of an external object, thereby sensing touch information such as a touch and a touch position. A capacitance change signal caused by a touch may be transmitted to the touch controller through the first touch line W10 and / or the second touch line W20. A dummy electrode (not shown) in a floating state may be disposed between the first touch electrode TE1 and the second touch electrode TE2.

[0112] The first touch electrode TE1 and the second touch electrode TE2 may be in a grid shape in structure, wherein the first touch electrode TE1 and the second touch electrode TE2 are disposed adjacent to each other. The grid formed by the first touch electrode TE1 and the second touch electrode TE2 may not overlap or face the light emitting diode LED and the pixel PX, so that the light emitted from the light emitting diode LED and the pixel PX is not covered by the first touch electrode TE1 and the second touch electrode TE2. In other words, the grid formed by the first touch electrode TE1 and the second touch electrode TE2 may not overlap or face the light emitting diode LED and the pixel PX, so that they are deviated from the light emitting diode LED and the pixel PX, and thus the light emitted from the light emitting diode LED and the pixel PX is not covered by the first touch electrode TE1 and the second touch electrode TE2.

[0113] Figure 4 The schematic cross-sectional view of the display panel 20 shown in may correspond to a schematic cross-sectional view taken along the Figure 8 line F-F' in. Referring to Figure 8 and Figure 4 , the first touch electrode TE1 and the second touch electrode TE2 may be a second conductor that may be disposed between the first insulating layer 391 and the second insulating layer 392. The first bridge BD1 connecting adjacent first touch electrodes TE1 may be a second conductor and may be disposed on the same layer as the first touch electrode TE1.

[0114] The second bridge BD2 connecting adjacent second touch electrodes TE2 may be a first conductor and may be disposed between the buffer layer 380 and the first insulating layer 391. Since the second bridge BD2 may be disposed on a different layer from the second touch electrode TE2 and the second touch electrode TE2 may be a second conductor, the second touch electrode TE2 may be connected to the second bridge BD2 through a contact hole in the first insulating layer 391.

[0115] The first crack detection lines CD1a and CD1a' can be first conductors, which can be formed on the same layer as the second bridge BD2 and made of the same material as the second bridge BD2. The first crack detection lines CD1a and CD1a' can be physically and electrically isolated from the second bridge BD2. The first crack detection lines CD1a and CD1a' can overlap or face the first touch electrode TE1 and / or the second touch electrode TE2. The first crack detection lines CD1a and CD1a' can extend in a zigzag pattern or an alternating pattern along the lines of the grid forming the first touch electrode TE1 and can have openings that overlap or face the pixels PX. Figure 8 The first crack detection lines CD1a and CD1a' shown in can include portions that repeatedly extend in a direction forming an angle of approximately -45 degrees with the first direction x and portions that repeatedly extend in a direction forming an angle of approximately +45 degrees with the first direction x.

[0116] In the case where the first crack detection lines CD1a and CD1a' can be arranged as described above, during the formation of the touch sensor unit, the first crack detection lines CD1a and CD1a' can be formed in the curved display area BDA without the need for a mask or a separate processing step and can detect cracks generated in the curved display area BDA. Since the first crack detection lines CD1a and CD1a' are formed in the curved display area BDA, the pixels PX can not be covered. Similarly, it is not necessary to force a change in the design of the touch sensor unit, for example, the arrangement of the touch electrodes TE1 and TE2 and the bridges BD1 and BD2.

[0117] In Figure 8 The first conductor (i.e., the conductor disposed between the buffer layer 380 and the first insulating layer 391 of the touch sensor unit) can be shown by a thick solid line. The first conductor can be offset from the pixels PX so as not to overlap the pixels PX, but can overlap the second conductor. For example, the second conductor can also be disposed in the area where the first conductor can be shown in a top plan view. In another example, the first bridge BD1 can be the first conductor and the second bridge BD2 can be the second conductor. The first touch electrode TE1 and the first bridge BD1 can be the first conductor, the second touch electrode TE2 and the second bridge BD2 can be the second conductor, or conversely, the second touch electrode TE2 and the second bridge BD2 can be the first conductor and the first touch electrode TE1 and the first bridge BD1 can be the second conductor.

[0118] Although the first crack detection lines CD1a and CD1a' disposed in the first sub-panel region 221 of the display panel 20 have been shown and described above, one or more crack detection lines among the crack detection lines CD1a, CD1a', CD1b, CD2a, CD2a' and CD2b that can be disposed in the bent display area BDA of the first sub-panel region 221 to the fourth sub-panel region 224 may be similarly disposed.

[0119] Figure 9 A schematic cross-sectional view taken along line G-G' in Figure 3 is shown.

[0120] Referring to Figure 9 , a schematic cross-section of the non-display area NA and the bent display area BDA can be shown.

[0121] The light-blocking layer LB overlapping or facing the semiconductor layer A may be disposed between the substrate SB and the buffer layer BF, or may be disposed between the barrier layer BRR and the buffer layer BF. The light-blocking layer LB can prevent external light from reaching the semiconductor layer A of the transistor TR, thereby preventing deterioration of the characteristics of the semiconductor layer A. Therefore, the leakage current of the driving transistor can be controlled. The light-blocking layer LB may include a material that does not transmit light in a predetermined wavelength band. The light-blocking layer LB may include metals such as aluminum (Al), copper (Cu), silver (Ag), gold (Au), platinum (Pt), palladium (Pd), nickel (Ni), molybdenum (Mo), tungsten (W), titanium (Ti), chromium (Cr), and tantalum (Ta).

[0122] The first crack detection line CD1a may be disposed between the substrate SB and the buffer layer BF, or may be disposed between the barrier layer BRR and the buffer layer BF. The first crack detection line CD1a may be formed of the same material as the light-blocking layer LB and in the same process of forming the light-blocking layer LB. Therefore, an additional process required to form the first crack detection line CD1a may not be needed. Therefore, the first crack detection line CD1a disposed between the barrier layer BRR and the buffer layer BF can effectively contribute to detecting cracks that may occur in the barrier layer BRR and the buffer layer BF.

[0123] Although the first crack detection line CD1a that can be disposed in the first sub-panel region 221 has been discussed, one or more crack detection lines among the crack detection lines CD1a, CD1a', CD1b, CD2a, CD2a' and CD2b that can be disposed in the bent display area BDA of the first sub-panel region 221 to the fourth sub-panel region 224 may be similarly disposed between the barrier layer BRR and the buffer layer BF, and may be formed of the same material as the light-blocking layer LB and in the same process of forming the light-blocking layer LB.

[0124] The third crack detection lines CD3a and CD3a' can be disposed in the non-display area NA. The third crack detection line CD3a can be disposed between the first insulating layer IN1 and the second insulating layer IN2, and can be formed of the same material as the gate electrode G and in the same process as the process of the gate electrode G. The third crack detection line CD3a can be disposed between the second insulating layer IN2 and the first inorganic layer 371 of the encapsulation layer EN. The third crack detection line CD3a' can be disposed between the buffer layer 380 and the first insulating layer 391 of the touch sensor unit, and can be formed of the same material as the touch sensor unit and in the same process as the process of forming the first conductor of the touch sensor unit.

[0125] The third crack detection line CD3a' can be disposed between the first insulating layer 391 and the second insulating layer 392 of the touch sensor unit.

[0126] As described above, the first crack detection line CD1a' can be disposed between the buffer layer 380 and the first insulating layer 391 of the touch sensor unit, and can be disposed in the bent display area BDA. Therefore, the first crack detection line CD1a' can effectively contribute to detecting cracks that may occur in the touch sensor unit.

[0127] The voltage transmission line 177 for transmitting the common voltage can be disposed in the non-display area NA, and the second electrode E2 of the light-emitting diode LED can be electrically connected to the voltage transmission line 177 through the connection member 197. The transistor TRd forming the gate driver can be disposed in the non-display area NA.

[0128] The dam member DM can be disposed on the second insulating layer IN2 and in the non-display area NA. The dam member DM can prevent the overflow of organic materials such as monomers in the case where the organic layer 372 of the encapsulation layer EN may be formed. Therefore, the edge of the organic layer 372 of the encapsulation layer EN can be substantially disposed inside the dam member DM. For example, such an edge can be disposed between the dam member DM and the display area DA. The first inorganic layer 371 and the second inorganic layer 373 of the encapsulation layer EN can be formed to extend above the dam member DM. Therefore, the contact area between the first inorganic layer 371 and the second inorganic layer 373 can be increased, so that the adhesion between the first inorganic layer 371 and the second inorganic layer 373 can be increased.

[0129] The dam member DM may include a first dam D1 and a second dam D2. The first dam D1 may be disposed closer to the display area DA than the second dam D2. The second dam D2 may be formed to be higher than the first dam D1. The first dam D1 and the second dam D2 may include at least one layer. The first dam D1 and the second dam D2 may include a layer formed of the same material as and in the same process as the third insulating layer IN3 and / or the fourth insulating layer IN4.

[0130] Figure 10 A top plan view of a display device 1 according to an embodiment is shown.

[0131] Figure 10 The display device 1 shown in Figure 3 is different from the display device 1 shown in

[0132] in the shape of each of the four corner regions of the display panel 20. For example, notches may be formed in the corner regions of the display panel 20.

[0133] As discussed, due to the stress during bending, cracks may appear in the bent display area BDA. Accordingly, the display panel 20 may include the first crack detection lines CD1a and CD1b and the second crack detection lines CD2a and CD2b that may be disposed in the bent display area BDA as described above, and the display device 1 may detect cracks generated in the bent display area BDA. The display panel 20 may include third crack detection lines CD3a and CD3b and fourth crack detection lines CD4a and CD4b disposed in the non-display area NA, and may detect cracks generated in the non-display area NA.

[0134] Although the present disclosure has been described in connection with the embodiments provided herein, it will be understood that such embodiments may not be limited to the description and illustration provided by them, and such disclosure is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the present disclosure.

Claims

1. A display device, wherein, The display device includes: A display panel, including a display area and a non-display area surrounding the display area, the display area including a plurality of pixels, wherein, the display area includes a flat display area and at least one curved display area, and the display panel includes at least one crack detection line provided in the at least one curved display area, and the at least one crack detection line is provided between the plurality of pixels in a plan view.

2. The display device according to claim 1, wherein, The display device further includes: A crack detection circuit portion provided in the non-display area, wherein, the at least one crack detection line is electrically connected to the crack detection circuit portion.

3. The display device according to claim 1, wherein, the at least one curved display area includes four curved display areas respectively adjacent to four sides of the flat display area.

4. The display device according to claim 3, wherein, the at least one crack detection line includes a first crack detection line extending across three of the four curved display areas.

5. The display device according to claim 3, wherein, the display panel includes a pad portion provided in the non-display area, and the at least one crack detection line includes a second crack detection line extending in a curved display area between the flat display area and the pad portion among the four curved display areas.

6. The display device according to claim 1, wherein, the display panel includes: A substrate; Light emitting diodes provided on the substrate; A packaging layer covering the light emitting diodes; and A touch sensor unit provided on the packaging layer, wherein, the touch sensor unit includes: A first conductor; An insulating layer provided on the first conductor; and A second conductor provided on the insulating layer.

7. The display device according to claim 6, wherein, the first conductor includes the at least one crack detection line.

8. The display device according to claim 7, wherein, the first conductor has a grid shape, and the at least one crack detection line extends in an alternating pattern along the lines forming the grid shape.

9. The display device according to claim 7, wherein, the at least one crack detection line is offset from the light emitting diodes.

10. The display device according to claim 7, wherein, the second conductor includes touch electrodes, and the first conductor includes bridges electrically connecting adjacent touch electrodes among the touch electrodes.

11. The display device according to claim 6, wherein, the display panel further includes a buffer layer provided between the packaging layer and the touch sensor unit, and the at least one crack detection line is provided between the packaging layer and the buffer layer.

12. The display device according to claim 11, wherein, the at least one crack detection line is offset from the light emitting diodes.

13. The display device according to claim 1, wherein, the display panel includes: A substrate, Transistors provided on the substrate, and A light-blocking layer is disposed between the substrate and the transistor and overlaps with the semiconductor layer of the transistor, and the at least one crack detection line is disposed in the same layer as the light-blocking layer and includes the same material as the light-blocking layer.

14. The display device according to claim 13, wherein the display panel further includes a buffer layer disposed between the substrate and the transistor, and the at least one crack detection line is disposed between the substrate and the buffer layer.

15. An electronic device, wherein, The electronic device includes the display device according to any one of claims 1 to 14.

Citation Information

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