A wire binding plate for IGBT wiring

Abstract

The present invention is a wire binding plate for IGBT wiring, comprising a wire binding plate body, a first through hole and a second through hole are provided on the wire binding plate body at intervals, the wire binding plate body can be fixed on the main terminal or control terminal of the IGBT through the first through hole or the second through hole, and a cable tie for binding can be inserted into the first through hole or the second through hole. The wire binding plate for IGBT wiring of the present invention has a simple structure, can facilitate wiring of wire harnesses, and can reduce the installation space on the water cooling plate.

Description

Technical Field

[0001] The invention relates to the technical field of power supply, and in particular to a wire binding plate for IGBT wiring. Background Art

[0002] IGBT (Insulated Gate Bipolar Transistor) is the core device for energy conversion and transmission. Its structure is as follows Figure 1 As shown, it includes a housing 01, a substrate 02 is provided at the bottom of the housing 01, a main terminal 03 and a control terminal 04 are provided at the top of the housing 01, the main terminal 03 includes a plurality of emitters and a plurality of collectors, the control terminal 04 includes a plurality of drive electrodes, and the size of the control terminal 04 is smaller than that of the main terminal 03. The number of each electrode is determined according to the needs, for example Figure 1 The IGBT shown in FIG. 1 has three emitters, three collectors and three drive electrodes. The main terminal 03 and the control terminal 04 are both L-shaped plate structures, one surface of the L-shaped plate is parallel to the top surface of the shell 01 and has a certain gap, and the other surface is perpendicular to the top surface of the shell 01 and connected to the electrode of the chip inside the shell 01. When in use, Figure 2 As shown, generally, the IGBT is installed on the water-cooled plate 05 of the water-cooled radiator, a busbar (i.e., copper busbar) is installed above the IGBT, each main terminal can directly contact the busbar, and each control terminal 04 is connected to the drive board through a wiring harness.

[0003] In the process of using high-voltage and high-power IGBTs in railway locomotives, automobiles, and power grid industries, electrical isolation is generally considered. The driver board and the IGBT are arranged in different positions, and the wiring harness connecting the IGBT and the driver board cannot touch the upper busbar or the lower water cooling plate 05 during wiring. In the prior art, the wiring structure of the wiring harness between the IGBT and the driver board generally adopts a wiring rack 06 installed on the radiator, and the wiring harness is erected using the wiring rack 06 for wiring, such as Figure 2 However, this structure will occupy a larger installation space of the water cooling plate 05.

[0004] Therefore, the inventor, relying on his many years of experience and practice in related industries, proposes a wire binding plate for IGBT wiring to overcome the defects of the prior art. Summary of the invention

[0005] The object of the present invention is to provide a wire binding plate for IGBT wiring, which has a simple structure, can facilitate wiring of wire harnesses, and can reduce the installation space on the water cooling plate.

[0006] The objective of the present invention is achieved by providing a wire binding plate for IGBT wiring, comprising a wire binding plate body; a first through hole and a second through hole are provided on the wire binding plate body at intervals; the wire binding plate body can be fixed on the main terminal or control terminal of the IGBT through the first through hole or the second through hole; a cable tie for binding wires can be passed through the first through hole or the second through hole.

[0007] In a preferred embodiment of the present invention, at least one third through hole is provided between the first through hole and the second through hole, and a cable tie for binding wires can be passed through the third through hole.

[0008] In a preferred embodiment of the present invention, the wire binding plate is a long strip-shaped plate, and the first through hole, the third through hole and the second through hole are arranged at intervals along the length direction of the wire binding plate.

[0009] In a preferred embodiment of the present invention, the first through hole is a square hole, and the length direction of the square hole is perpendicular to the length direction of the wire binding plate body, and the square hole can be sleeved on the main terminal of the IGBT.

[0010] In a preferred embodiment of the present invention, the second through hole and the third through hole are both circular holes, and the shape of the second through hole matches the threaded hole on the main terminal of the IGBT.

[0011] In a preferred embodiment of the present invention, the wire binding plate includes a first rectangular plate, a second rectangular plate and a first semicircular plate connected in sequence along its length direction, the width of the first rectangular plate is greater than that of the second rectangular plate; the first through hole is opened on the first rectangular plate, the third through hole is opened on the second rectangular plate, and the second through hole is arranged close to the first semicircular plate.

[0012] In a preferred embodiment of the present invention, a chamfer is formed at the connection between the first rectangular plate and the second rectangular plate.

[0013] In a preferred embodiment of the present invention, the first through hole, the second through hole and the third through hole are all circular holes, and the shape of the first through hole or the third through hole matches the threaded hole on the control terminal of the IGBT.

[0014] In a preferred embodiment of the present invention, the wire binding plate includes a third rectangular plate and two second semicircular plates symmetrically connected at both ends of the third rectangular plate, the third through hole is opened on the third rectangular plate, and the first through hole and the second through hole are respectively arranged close to the two second semicircular plates.

[0015] In a preferred embodiment of the present invention, the wire binding plate is made of insulating material.

[0016] As described above, the wire binding plate for IGBT wiring in the present invention can fix the wire binding plate body 1 on the main terminal or control terminal of the IGBT through the cooperation of the through holes, and at the same time, the wire binding function of the wire harness can be achieved by inserting a cable tie in the corresponding through hole. There is no need to install a wire rack on the radiator, and there is no need to reserve installation space for other wiring components (such as a wire rack) on the water cooling plate of the entire radiator. Therefore, the distance between two or more IGBTs can be reduced, that is, the same number of IGBTs can use a smaller water cooling plate, which greatly saves the installation space on the water cooling plate. The entire wire binding plate has a simple structure, is easy to install, and has low cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The following drawings are intended only to illustrate and explain the present invention, and do not limit the scope of the present invention.

[0018] Figure 1 : Schematic diagram of the structure of IGBT.

[0019] Figure 2 : It is a structural schematic diagram of the IGBT and the wire rack installed on the water cooling plate in the prior art.

[0020] Figure 3 : A schematic structural diagram of a first form of a wire binding plate for IGBT wiring provided by the present invention.

[0021] Figure 4 : A schematic structural diagram of a second form of a wire binding plate for IGBT wiring provided by the present invention.

[0022] Figure 5 : A schematic diagram of the structure after installing an IGBT wiring binding plate on the IGBT provided by the present invention.

[0023] Description of Figure Numbers:

[0024] 01. Shell; 02. Base plate; 03. Main terminal; 04. Control terminal; 05. Water cooling plate; 06. Wire rack;

[0025] 1. wire binding plate; 11. first rectangular plate; 12. second rectangular plate; 13. first semicircular plate; 14. third rectangular plate; 15. second semicircular plate;

[0026] 2. a first through hole;

[0027] 3. A second through hole;

[0028] 4. The third through hole. DETAILED DESCRIPTION

[0029] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, specific embodiments of the present invention are now described with reference to the accompanying drawings.

[0030] like Figures 3 to 5 As shown, this embodiment provides a wire binding plate for IGBT wiring, including a wire binding plate body 1, on which a first through hole 2 and a second through hole 3 are spaced apart. The wire binding plate body 1 can be fixed on the main terminal 03 or the control terminal 04 of the IGBT through the first through hole 2 or the second through hole 3, and a cable tie for binding can be inserted into the first through hole 2 or the second through hole 3.

[0031] When in use, the wire binding plate 1 is fixed to the main terminal 03 or the control terminal 04 of the IGBT through one of the first through hole 2 and the second through hole 3. When wiring the wiring harness between the IGBT and the driver board, a cable tie is inserted into the other through hole to facilitate binding of the wiring harness. The structure of the cable tie is prior art and will not be described herein.

[0032] Therefore, the IGBT wiring binding plate in this embodiment can fix the binding plate body 1 on the main terminal 03 or the control terminal 04 of the IGBT through the cooperation of the through holes, and at the same time, the wire harness can be bound by inserting the cable tie in the corresponding through hole, without the need to specially install the wire rack 06 on the radiator (such as Figure 2 As shown in FIG. 1 , there is no need to leave installation space for other wiring components (such as wire rack 06) on the water cooling plate 05 of the entire radiator, so the distance between two or more IGBTs can be reduced, that is, the same number of IGBTs can use a smaller water cooling plate 05, which greatly saves the installation space on the water cooling plate 05. The entire wire binding plate has a simple structure, is easy to install, and has low cost.

[0033] In a specific implementation, at least one third through hole 4 is provided between the first through hole 2 and the second through hole 3, and a cable tie for binding wires can be passed through the third through hole 4. The number of the specific third through holes 4 can be determined according to the number of wires to be bound, so as to facilitate binding of multiple wire harnesses. Generally, the wire binding plate body 1 is preferably a long strip plate body, and the first through hole 2, the third through hole 4 and the second through hole 3 are arranged at intervals along the length direction of the wire binding plate body 1.

[0034] In practical applications, since the size of the main terminal 03 is larger than that of the control terminal 04, and the installation orientations of the main terminal 03 and the control terminal 04 are also different, in order to better adapt to the main terminal 03 and the control terminal 04, the wire binding plate in this embodiment has two forms, which are used to be installed on the main terminal 03 and the control terminal 04 respectively. The details are as follows:

[0035] The first type of wire binding plate is Figure 3 As shown, it is mainly used for installation on the main terminal 03, that is, for installation on the emitter or collector of the IGBT.

[0036] For the first type of wire binding plate, in order to facilitate the fixing of the wire binding plate body 1 and the main terminal 03 of the IGBT, as shown in FIG. Figure 3 As shown, the first through hole 2 is a square hole, and the length direction of the square hole is perpendicular to the length direction of the wire binding plate 1, and the square hole can be sleeved on the main terminal 03 of the IGBT. Figure 5 As shown, when in use, the square hole of the wire binding plate body 1 is directly sleeved on the main terminal 03 to fix the wire binding plate body 1 without affecting the contact between the main terminal 03 and the busbar above it, which is simple and convenient.

[0037] Since the main terminals 03 on two adjacent IGBTs may have opposite orientations of their L-shaped plate structures, in order to adapt to the orientations of different main terminals 03, the installation of the wire binding plate 1 is made more flexible to facilitate wiring, such as Figure 3 As shown, the second through hole 3 and the third through hole 4 are both circular holes, and the shape of the second through hole 3 matches the threaded hole on the main terminal 03 of the IGBT.

[0038] Thus, for different orientations of the main terminal 03, such as Figure 5 As shown, the square hole of the wire binding plate body 1 can be selected to be set on the main terminal 03 for fixing. Alternatively, the wire binding plate body 1 can be inserted below the main terminal 03 (i.e., inserted in the gap between the L-shaped plate structure of the main terminal 03 and the housing 01), the second through hole 3 is aligned with the threaded hole on the main terminal 03, and then bolts are inserted through the threaded hole and the second through hole 3 to fix the wire binding plate body 1; and since the wire binding plate body 1 is installed below the main terminal 03 at this time, it will not contact the main terminal 03 with the busbar above it.

[0039] For example, Figure 3 Taking the two third through holes 4 shown in the figure as an example, if the first through hole 2 is used to fix the wire binding plate body 1, the remaining three through holes (i.e., the second through hole 3 and the two third through holes 4) can all be used to pass the rolling strip for wire binding; if the second through hole 3 is used to fix the wire binding plate body 1, the remaining three through holes (i.e., the first through hole 2 and the two third through holes 4) can all be used to pass the rolling strip for wire binding.

[0040] In order to facilitate processing and installation, Figure 3 As shown, the wire binding plate 1 includes a first rectangular plate 11, a second rectangular plate 12 and a first semicircular plate 13 sequentially connected along its length direction, and the width of the first rectangular plate 11 is greater than that of the second rectangular plate 12. The first through hole 2 is provided on the first rectangular plate 11, the third through hole 4 is provided on the second rectangular plate 12, and the second through hole 3 is provided close to the first semicircular plate 13. Generally, a chamfer is formed at the connection between the first rectangular plate 11 and the second rectangular plate 12.

[0041] The second type of wire binding plate is Figure 4 As shown, it is mainly used for installation on the control terminal 04, that is, for installation on the driving pole of the IGBT.

[0042] For the second type of wire binding plate, the first through hole 2 , the second through hole 3 and the third through hole 4 are all circular holes, and the shape of the first through hole 2 or the third through hole 4 matches the threaded hole on the control terminal 04 of the IGBT.

[0043] When using, Figure 5 As shown, the wire binding plate is inserted below the control terminal 04 (i.e., inserted into the gap between the L-shaped plate structure of the control terminal 04 and the housing 01), the first through hole 2 or the second through hole 3 is aligned with the threaded hole on the control terminal 04, the wire terminal is placed above the control terminal 04, and then the wire binding plate body 1 can be fastened with bolts, so that the wire binding plate can be fixed at the same time when the electrode is wired. Moreover, since the wire binding plate body 1 is installed below the control terminal 04 at this time, it will not contact the control terminal 04 with the busbar above it.

[0044] In order to facilitate processing and installation, Figure 4 As shown, the wire binding plate 1 includes a third rectangular plate 14 and two second semicircular plates 15 symmetrically connected at both ends of the third rectangular plate 14, the third through hole 4 is opened on the third rectangular plate 14, and the first through hole 2 and the second through hole 3 are respectively arranged close to the two second semicircular plates 15.

[0045] Furthermore, for the above two types of wire binding plates, the material of the wire binding plate body 1 is an insulating material, such as PET plastic (Polyethylene terephthalate) or SMC composite material (Sheet molding compound).

[0046] In addition, during actual installation, which main terminal 03 the first type of wire binding plate is installed on and how many main terminals 03 the wire binding plate is installed on, and which control terminal 04 the second type of wire binding plate is installed on and how many control terminals 04 the wire binding plate is installed on, are all determined according to actual wiring needs, as long as it is convenient for wiring.

[0047] The above are only exemplary embodiments of the present invention and are not intended to limit the scope of the present invention. Any equivalent changes and modifications made by any person skilled in the art without departing from the concept and principle of the present invention shall fall within the scope of protection of the present invention.

Claims

1. A wire binding plate for IGBT wiring, characterized in that: Including a wire binding plate body; A first through hole and a second through hole are provided at intervals on the wire binding plate body, and the wire binding plate body can be fixed on the main terminal or the control terminal of the IGBT through the first through hole or the second through hole, and a cable tie for wire binding can be inserted through the first through hole or the second through hole; at least one third through hole is provided between the first through hole and the second through hole, and a cable tie for wire binding can be inserted through the third through hole; the material of the wire binding plate body is an insulating material, and the wire binding plate for IGBT wiring includes a first type of wire binding plate or a second type of wire binding plate; The first through hole of the first form of wire binding plate is a square hole, and the length direction of the square hole is perpendicular to the length direction of the wire binding plate body, and the square hole can be sleeved on the main terminal of the IGBT, and the second through hole and the third through hole are both circular holes, and the shape of the second through hole matches the threaded hole on the main terminal of the IGBT; the first through hole, the second through hole and the third through hole of the second form of wire binding plate are all circular holes, and the shape of the first through hole or the third through hole matches the threaded hole on the control terminal of the IGBT.

2. The IGBT wiring binding plate according to claim 1, wherein: The wire binding plate body is a long strip-shaped plate body, and the first through holes, the third through holes and the second through holes are arranged at intervals along the length direction of the wire binding plate body.

3. The IGBT wiring binding plate according to claim 2, wherein: The wire binding plate body comprises a first rectangular plate body, a second rectangular plate body and a first semicircular plate body sequentially connected along its length direction, and the width of the first rectangular plate body is greater than that of the second rectangular plate body; The first through hole is formed on the first rectangular plate body, the third through hole is formed on the second rectangular plate body, and the second through hole is disposed close to the first semicircular plate body.

4. The IGBT wiring binding plate according to claim 3, wherein: A chamfer is formed at a connection between the first rectangular plate and the second rectangular plate.

5. The IGBT wiring binding plate according to claim 2, wherein: The wire binding plate includes a third rectangular plate and two second semicircular plates symmetrically connected at both ends of the third rectangular plate. The third through hole is opened on the third rectangular plate, and the first through hole and the second through hole are respectively arranged close to the two second semicircular plates.

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