Power module assembly structure and assembly method thereof

Abstract

The present invention provides a power module assembly structure and an assembly method thereof, wherein the power module assembly structure comprises a first circuit board assembly, a second circuit board assembly and a conductive connector. The first circuit board assembly comprises a first circuit board body, a power switch device and a magnetic assembly. The first circuit board body comprises a first surface, a second surface and a through hole. The power switch device is arranged on the first circuit board body. The magnetic assembly comprises a first magnetic core and a second magnetic core, which are buckled on the first circuit board body through the through hole. The second circuit board assembly comprises a second circuit board body, the second circuit board body comprises a third surface, a fourth surface and a hollow groove running through the third surface and the fourth surface, and the second magnetic core of the magnetic assembly is exposed through the hollow groove. The conductive connector is arranged between the second surface of the first circuit board body and the third surface of the second circuit board body, and electrically connects the first circuit board assembly and the second circuit board assembly.

Description

Technical Field

[0001] The invention relates to a power module, and in particular to a power module assembly structure and an assembly method thereof which can reduce the number of times a device undergoes reflow soldering. Background Art

[0002] In recent years, onboard high-power DC / DC power modules have been widely used in telephone communications, data centers, supercomputers and other fields. With the rapid development of fixed-line, mobile communications and artificial intelligence, the requirements for the output power and efficiency of onboard high-power DC / DC power modules are getting higher and higher. On the other hand, as communication products become increasingly miniaturized, module power supplies need to further increase power density by reducing volume while improving efficiency.

[0003] In order to significantly reduce the volume and weight of the power module and improve the power density of the power module, the power module on the existing market adopts planar transformer technology and double PCB welding assembly technology. The power module is assembled by a power board component and a pin board component. The power board component needs to undergo two chip reflow solderings first, and then the power device is mounted on the power board body, and then the magnetic component is assembled. The upper magnetic core of the magnetic component is first attached to the top layer of the power board body, and then the lower magnetic core of the magnetic component is bonded, that is, the assembly of the power board component and the planar transformer is completed. After that, the power board component is placed on the pin board body together with the components on the pin board body, and then the third reflow soldering is completed to obtain the finished power module. In other words, in the existing assembly structure of the power module, delicate devices such as power devices on the power board component need to undergo more than three reflow solderings to complete the assembly, which takes a long time to manufacture and is costly, and also increases the risk of device damage during the process. Furthermore, the assembly process of the power board component, the magnetic component and the pin board component must be stacked and combined in sequence, the modulation of the assembly process is poor, and the height of the overall structure cannot be further reduced to achieve the purpose of improving the power density.

[0004] Therefore, how to develop a power module assembly structure and an assembly method thereof to solve the problems faced by the prior art is indeed a topic that needs to be addressed in the art. Summary of the invention

[0005] The purpose of the present invention is to provide a power module assembly structure and an assembly method thereof. For example, a first circuit board assembly such as a power board assembly and a second circuit board assembly such as a pin board assembly can be assembled by at least one conductive connector in a reflow soldering manner to reduce delicate devices such as power devices on the power board assembly, while achieving the purpose of simplifying the manufacturing process and reducing production costs.

[0006] Another object of the present invention is to provide a power module assembly structure and an assembly method thereof. For example, a first circuit board assembly of a power board assembly and a second circuit board assembly of a Pin board assembly can be assembled by a reflow soldering method through at least one conductive connector. The design of at least one hollow groove on the Pin board body corresponds to a magnetic component with upper and lower magnetic cores in space, and the conductive connector and the magnetic component are offset from each other, and the projections of the magnetic component and the hollow groove on a plane of the Pin board body at least partially overlap, so that the bottom surface of the lower magnetic core is exposed through the hollow groove. As a result, the magnetic component arranged on the power board assembly can pass through the hollow groove of the Pin board body after reflow soldering, and a tool can pass through the hollow groove to push against the lower magnetic core of the magnetic component to complete the assembly of the magnetic component buckled on the power board assembly, thereby increasing the modulability of the assembly process. In addition, the hollow groove can also correspond to the lower magnetic core portion of the magnetic component to reduce the height of the overall structure, while achieving the purpose of improving the power density.

[0007] To achieve the above-mentioned purpose, the present invention provides a power module assembly structure, including a first circuit board assembly, a second circuit board assembly and at least one conductive connector. The first circuit board assembly includes a first circuit board body, at least one power switch device and at least one magnetic assembly. The first circuit board body includes a first surface, a second surface and at least one through hole. The first surface and the second surface are opposite to each other, at least one through hole runs through the first surface and the second surface, and at least one power switch device is arranged on the first circuit board body. At least one magnetic assembly includes a first magnetic core and a second magnetic core, which are respectively arranged on the first surface and the second surface, and are buckled on the first circuit board body through at least one through hole. The second circuit board assembly includes a second circuit board body, wherein the second circuit board body includes a third surface, a fourth surface and at least one hollow groove, the third surface and the fourth surface are opposite to each other, and the third surface faces the second surface. At least one hollow groove runs through the third surface and the fourth surface, and is arranged relative to the second magnetic core of the at least one magnetic assembly in space, and the second magnetic core of the at least one magnetic assembly is exposed through the at least one hollow groove. At least one conductive connector is disposed between the second surface of the first circuit board body and the third surface of the second circuit board body, electrically connecting the first circuit board assembly and the second circuit board assembly, and the at least one conductive connector and the at least one magnetic assembly are offset from each other.

[0008] In one embodiment, at least one conductive connector connects the first circuit board assembly and the second circuit board assembly by a reflow soldering method.

[0009] In one embodiment, a projection of at least one hollow groove on the third surface at least partially overlaps with a projection of the second magnetic core of at least one magnetic component on the third surface.

[0010] In one embodiment, the projection area of ​​at least one hollow groove on the third surface is greater than 0.2 mm 2 .

[0011] In one embodiment, at least one hollow groove is a stepped structure and has a accommodating area, which is recessed from the third surface toward the fourth surface, and the projection area of ​​the accommodating area on the third surface is larger than the projection area of ​​the second magnetic core of at least one magnetic component on the third surface, and the second magnetic core of at least one magnetic component is at least partially accommodated in the accommodating area.

[0012] In one embodiment, at least one hollow groove passes through the second circuit board body, and the projection area of ​​the at least one hollow groove on the third surface is larger than the projection area of ​​the second magnetic core of at least one magnetic component on the third surface, and the second magnetic core of at least one magnetic component is at least partially accommodated in the at least one hollow groove.

[0013] In one embodiment, at least one conductive connecting member is selected from a group consisting of a copper block and a row of pins.

[0014] In one embodiment, the material of at least one conductive connecting element is selected from the group consisting of aluminum, copper, and copper alloy.

[0015] In one embodiment, at least one magnetic component is a planar transformer.

[0016] In one embodiment, the second circuit board body includes at least one pin disposed on the fourth surface for external electrical connection.

[0017] In one embodiment, at least one pin is selected from a group consisting of a land grid array package pin and a ball grid array package pin.

[0018] In one embodiment, the first circuit board assembly includes at least one driving chip disposed on the first surface or the second surface of the first circuit board body.

[0019] In one embodiment, the second circuit board assembly includes at least one control chip disposed on the third surface of the second circuit board body.

[0020] In one embodiment, the at least one hollow groove is used to operate a tool to assemble the magnetic component.

[0021] In one embodiment, the shape of the at least one hollow groove is selected from the group consisting of circle, rectangle, square, and ellipse.

[0022] To achieve the aforementioned object, the present invention provides an assembly method of a power module assembly structure, comprising the following steps: (a) providing a first circuit board assembly, comprising a first circuit board body, at least one power switch device and at least one magnetic component, wherein the first circuit board body comprises a first surface, a second surface and at least one through hole, the first surface and the second surface are opposite to each other, the at least one through hole passes through the first surface and the second surface, and the at least one power switch device is arranged on the first circuit board body, wherein the at least one magnetic component comprises a first magnetic core and a second magnetic core; (b) providing a second circuit board assembly and a conductive connector, the second circuit board assembly comprises a second circuit board body, wherein the second circuit board body comprises a third surface, a fourth surface and at least one hollow groove, the third surface and the fourth surface are opposite to each other On the contrary, at least one hollow groove runs through the third surface and the fourth surface, wherein the conductive connector is arranged on the third surface; (c) the second circuit board component and the at least one conductive connector are stacked and placed on the second surface of the first circuit board body, wherein the second surface of the first circuit board body faces the third surface, the second magnetic core of the at least one magnetic component is spatially relative to the at least one hollow groove, and the second magnetic core of the at least one magnetic component is exposed through the at least one hollow groove; (d) the at least one conductive connector is connected to the first circuit board component by a reflow soldering method; and (e) the second magnetic core is abutted by at least one hollow groove, and the first magnetic core and the second magnetic core are connected by at least one through-hole, so that the first magnetic core and the second magnetic core are respectively arranged on the first surface and the second surface, and are buckled on the first circuit board body.

[0023] In one embodiment, step (a) also includes step (a0) of disposing at least one power switching device on the first circuit board body by a reflow soldering method, and step (b) also includes step (b0) of disposing a conductive connector on the third surface by a reflow soldering method.

[0024] In one embodiment, step (c) further includes step (c1) of pre-placing the second magnetic core between the first circuit board body and the second circuit board body.

[0025] In one embodiment, at least one hollow groove penetrates the second circuit board body, and a projection of the at least one hollow groove on the third surface at least partially overlaps with a projection of the second magnetic core of the at least one magnetic component on the third surface.

[0026] In one embodiment, the projection area of ​​at least one hollow groove on the third surface is greater than 0.2 mm 2 .

[0027] In one embodiment, at least one hollow groove is a stepped structure and has a accommodating area, which is recessed from the third surface toward the fourth surface, and the projection area of ​​the accommodating area on the third surface is larger than the projection area of ​​the second magnetic core of at least one magnetic component on the third surface, and the second magnetic core of at least one magnetic component is at least partially accommodated in the accommodating area.

[0028] In one embodiment, at least one conductive connecting member is selected from a group consisting of a copper block and a row of pins.

[0029] In one embodiment, at least one magnetic component is a planar transformer.

[0030] In one embodiment, the shape of the at least one hollow groove is selected from the group consisting of circle, rectangle, square, and ellipse.

[0031] The beneficial effect of the present invention is that the present invention provides a power module assembly structure and an assembly method thereof. For example, a first circuit board assembly such as a power board assembly and a second circuit board assembly such as a pin board assembly can be assembled by at least one conductive connector in a reflow soldering manner to reduce the number of times delicate devices such as power devices on the power board assembly undergo reflow soldering, while achieving the purpose of simplifying the manufacturing process and reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 The present invention discloses a structural exploded view of the power module assembly structure of the first preferred embodiment of the present invention.

[0033] Figure 2 A structural exploded view of the power module assembly structure of the first preferred embodiment of the present invention from another perspective.

[0034] Figure 3 The invention discloses a three-dimensional view of the power module assembly structure according to the first preferred embodiment of the present invention.

[0035] Figure 4 The invention discloses a three-dimensional view of the power module assembly structure at another viewing angle according to the first preferred embodiment of the invention.

[0036] Figure 5 The present invention discloses a structural exploded view of a power module assembly structure according to a second preferred embodiment of the present invention.

[0037] Figure 6 A structural exploded view of the power module assembly structure of the second preferred embodiment of the present invention from another perspective.

[0038] Figure 7 The invention discloses a three-dimensional view of a power module assembly structure according to a second preferred embodiment of the invention.

[0039] Figure 8 A three-dimensional view of the power module assembly structure at another viewing angle is disclosed in accordance with the second preferred embodiment of the present invention.

[0040] Fig. 9 The present invention discloses a structural exploded view of a power module assembly structure according to a third preferred embodiment of the present invention.

[0041] Fig.10 A structural exploded view of the power module assembly structure at another viewing angle is disclosed in the third preferred embodiment of the present invention.

[0042] Fig.11 A three-dimensional diagram of the power module assembly structure according to the third preferred embodiment of the present invention is disclosed.

[0043] Fig.12 A three-dimensional diagram of the power module assembly structure at another viewing angle is disclosed in the third preferred embodiment of the present invention.

[0044] Fig.13 The invention discloses an assembling method of a power module assembly structure of the present invention.

[0045] The reference numerals are as follows:

[0046] 1. 1a, 1b: Power module assembly structure

[0047] 2: First circuit board assembly

[0048] 3: Second circuit board assembly

[0049] 10: First circuit board body

[0050] 11: Side 1

[0051] 12: Side 2

[0052] 13: Perforation

[0053] 20: Power switching devices

[0054] 21: Driver chip

[0055] 30: Magnetic components

[0056] 31: First core

[0057] 32: Second core

[0058] 33, 34: Magnetic column

[0059] 40: Second circuit board body

[0060] 41: The third side

[0061] 42: The fourth side

[0062] 43, 43a, 43b: hollow groove

[0063] 431: Accommodation area

[0064] 44: Control chip

[0065] 45: Pin

[0066] 50: Conductive connector

[0067] S01~S05: Steps DETAILED DESCRIPTION

[0068] Some typical embodiments that embody the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can be varied in various ways without departing from the scope of the present invention, and the description and drawings are essentially for illustrative purposes rather than for limiting the present invention.

[0069] Figure 1 and Figure 2 The present invention discloses a structural exploded view of the power module assembly structure of the first preferred embodiment of the present invention. Figure 3 and Figure 4 The present invention discloses a three-dimensional diagram of a power module assembly structure of a first preferred embodiment of the present invention. In this embodiment, the power module assembly structure 1 includes a first circuit board assembly 2, a second circuit board assembly 3 and at least one conductive connector 50. The first circuit board assembly 2 and the second circuit board assembly 3 can be, for example, a power board assembly and a pin board assembly, respectively. The at least one conductive connector 50 is, for example, a copper block or a row of pins, and the assembly of the at least one conductive connector 50, the first circuit board assembly 2 and the second circuit board assembly 3 is completed by reflow soldering.

[0070] In the present embodiment, the first circuit board assembly 2 includes a first circuit board body 10, at least one power switch device 20 and at least one magnetic component 30. The first circuit board body 10 includes a first surface 11, a second surface 12 and at least one through hole 13. At least one through hole 13 passes through the first surface 11 and the second surface 12. At least one power switch device 20 is disposed on the first circuit board body 10. In the present embodiment, the first circuit board assembly 2 further includes, for example, a plurality of power switch devices 20, which are disposed on the first surface 11 and the second surface 12 of the first circuit board body 10. In other embodiments, at least the power switch device 20 may be, for example, disposed on the first surface 11 or the second surface 12 of the first circuit board body, but the present invention is not limited thereto.

[0071] In the present embodiment, at least one magnetic component 30 includes a first magnetic core 31 and a second magnetic core 32. The first magnetic core 31 and the second magnetic core 32 are, for example, upper and lower magnetic cores that cooperate with each other, and are respectively disposed on the first surface 11 and the second surface 12 of the first circuit board body 10, and are buckled on the first circuit board body 10 through at least one through hole 13. In the present embodiment, at least one magnetic component 30 is, for example, a planar transformer, and also includes a planar winding (not shown), which is disposed on the first circuit board body 10 and assembled with the first magnetic core 31 and the second magnetic core 32 to form a planar transformer. In other embodiments, when the magnetic column 33 of the first magnetic core 31 and the magnetic column 34 of the second magnetic core 32 are connected through at least one through hole 13, at least one air gap (not shown) is further formed to modulate the performance of at least one magnetic component 30 according to actual application requirements. Of course, the present invention is not limited thereto.

[0072] In this embodiment, the second circuit board assembly 3 includes a second circuit board body 40, wherein the second circuit board body 40 includes a third surface 41, a fourth surface 42 and at least one hollow groove 43. The third surface 41 of the second circuit board body 40 faces the second surface 12 of the first circuit board body 10. The at least one hollow groove 43 runs through the third surface 41 and the fourth surface 42, and is spatially relative to the second magnetic core 32 of the at least one magnetic component 30, and the second magnetic core 32 of the at least one magnetic component 30 is exposed through the at least one hollow groove 43. The shape of the at least one hollow groove 43 can be circular, rectangular, square or elliptical, but the present invention is not limited thereto.

[0073] In the present embodiment, at least one conductive connector 50 is disposed between the second surface 12 of the first circuit board body 10 and the third surface 41 of the second circuit board body 40, electrically connecting the first circuit board assembly 2 and the second circuit board assembly 3, and the at least one conductive connector 50 and the at least one magnetic assembly 30 are offset from each other. Thus, the first circuit board assembly 2, such as a power board assembly, and the second circuit board assembly 3, such as a pin board assembly, can be assembled by a reflow soldering method through at least one conductive connector 50, so as to reduce the number of times that delicate devices such as at least one power switch device 20 on the first circuit board assembly 2 undergo reflow soldering, and at the same time achieve the purpose of simplifying the manufacturing process and reducing production costs.

[0074] It should be noted that at least one power switch device 20 of the first circuit board assembly 2 can also be pre-set on the first circuit board body 10 by reflow soldering. Thereafter, when the first circuit board assembly 2 and the second circuit board assembly 3 are assembled by reflow soldering through at least one conductive connector 50, the at least one power switch device 20 of the first circuit board assembly 2 undergoes reflow soldering only twice. Because the projections of at least one magnetic component 30 and at least one hollow groove 43 on the third surface 41 of the second circuit board body 40 at least partially overlap, and the bottom surface of the second magnetic core 32 is exposed through at least one hollow groove 43. In this embodiment, the area of ​​the projection of at least one hollow groove 43 on the third surface 41 is greater than 0.2mm 2 , so that a tool can pass through the hollow groove 43 to abut against the exposed bottom surface of the second magnetic core 32 of the magnetic component 30. Therefore, at least one magnetic component 30 disposed on the first circuit board body 10 can pass through at least one hollow groove 43 of the second circuit board body 40 after the aforementioned reflow soldering, so that the tool can pass through the hollow groove 43 to abut against the exposed bottom surface of the second magnetic core 32 of the magnetic component 30, and the assembly of the magnetic component 30 buckled on the first circuit board body 10 is completed, thereby increasing the modulability of the assembly process.

[0075] In addition, in the present embodiment, the first circuit board assembly 2 includes at least one driver chip 21, which is disposed on the first surface 11 or the second surface 12 of the first circuit board body 10. The at least one driver chip 21 can be pre-disposed on the first circuit board body 10, for example, together with at least one power switch device 20, by a reflow soldering method. Of course, the present invention is not limited to this. In addition, in the embodiment, the second circuit board assembly 3 includes at least one control chip 44, which is disposed on the third surface 41 of the second circuit board body 40. The at least one control chip 44 can be placed on the third surface 41 of the second circuit board body 40, for example, together with at least one conductive connector 50, and can be disposed on the third surface 41 of the second circuit board body 40 together with the first circuit board assembly 2, at least one conductive connector 50 and the second circuit board body 40 by a reflow soldering method. The present invention is not limited to this. In addition, the second circuit board body 40 includes at least one pin 45, which is disposed on the fourth surface 42, for external electrical connection to, for example, a system end or a system motherboard. In other words, at least one pin 45 serves as an input / output and control port of the power module, and is electrically connected to the system end or the system motherboard. In this embodiment, at least one pin 45 may be a land grid array (LGA) pin or a ball grid array (BGA) pin, but the present invention is not limited thereto.

[0076] Figure 5 and Figure 6 The present invention discloses a structural exploded view of a power module assembly structure according to a second preferred embodiment of the present invention. Figure 7 and Figure 8 FIG. 1 is a perspective view of a power module assembly structure according to a second preferred embodiment of the present invention. In this embodiment, the power module assembly structure 1a and Figures 1 to 4 The power module assembly structure 1 shown is similar, and the same component numbers represent the same components, structures and functions, which will not be repeated here. In this embodiment, the first circuit board assembly 2, the second circuit board assembly 3 and the conductive connector 50 of the power module assembly structure 1a can also be connected by a reflow soldering method, so as to reduce the number of times that delicate devices such as the power switch device 20 undergo reflow soldering, and simplify the manufacturing process and reduce the production cost. The magnetic component 30 is then buckled onto the first circuit board body 10 after reflow soldering. In this embodiment, at least one hollow groove 43a is a stepped structure, and also has a receiving area 431, which is concavely arranged from the third surface 41 to the fourth surface 42. In addition, the projection area of ​​the receiving area 431 on the third surface 41 is greater than the projection area of ​​the second magnetic core 32 of at least one magnetic component 30 on the third surface 41, and the second magnetic core 32 of at least one magnetic component 30 is at least partially accommodated in the receiving area 431. In other words, in addition to providing a tool for the magnetic component 30 to pass through and thereby complete the assembly of the first circuit board body 10, the hollow groove 43a can also correspond to a portion of the second magnetic core 32 of the hollow groove 43a to accommodate the magnetic component 30, so as to reduce the height of the overall structure of the power module assembly structure 1a and achieve the purpose of improving the power density.

[0077] Fig. 9 and Fig.10 The present invention discloses a structural exploded view of a power module assembly structure according to a third preferred embodiment of the present invention. Fig.11 and Fig.12 1 is a perspective view of a power module assembly structure according to a third preferred embodiment of the present invention. Figures 1 to 4The power module assembly structure 1 shown is similar, and the same component numbers represent the same components, structures and functions, which will not be repeated here. In this embodiment, the first circuit board assembly 2, the second circuit board assembly 3 and the conductive connector 50 of the power module assembly structure 1b can also be connected by a reflow soldering method, so as to reduce the number of times that delicate devices such as the power switch device 20 undergo reflow soldering, and at the same time simplify the manufacturing process and reduce the production cost. The magnetic component 30 is then buckled onto the first circuit board body 10 after reflow soldering. In this embodiment, at least one hollow groove 43b passes through the second circuit board assembly 3, and the projection area of ​​the hollow groove 43b on the third surface 41 is larger than the projection area of ​​the second magnetic core 32 of at least one magnetic component 30 on the third surface 41, and the second magnetic core 32 of at least one magnetic component 30 is at least partially accommodated in at least one hollow groove 43b. Therefore, in addition to allowing the second magnetic core 32 to pass through and completing the assembly of the magnetic component 30 and the first circuit board body 10, the hollow groove 43b can also correspond to a portion of the second magnetic core 32 of the magnetic component 30 to reduce the height of the overall structure of the power module assembly structure 1a, while achieving the purpose of improving the power density.

[0078] On the other hand, according to the concept of the aforementioned power module assembly structure, the present invention further provides an assembly method of the power module assembly structure. Fig.13 That is, the assembly method of the power module assembly structure of the present invention is disclosed. Figures 1 to 4 as well as Fig.13 . First, as shown in step S01, a first circuit board assembly 2 as in the above-mentioned embodiment is provided. The first circuit board assembly 2 at least includes a first circuit board body 10, a power switch device 20 and a magnetic component 30. The first circuit board body 10 includes a first surface 11 and a second surface 12 opposite to each other, and a through hole 13 penetrating the first surface 11 and the second surface 12. The power switch device 20 and other devices such as a driver chip 21 on the first circuit board body 10 can be arranged on the first surface 11 of the first circuit board body 10 by a reflow soldering method. The magnetic component 30 includes a first magnetic core 31 and a second magnetic core 32, which are, for example, a combination of an upper and a lower magnetic core. The first magnetic core 31 and the second magnetic core 32 can be combined and connected after another reflow soldering process.

[0079] Next, as shown in step S02, a second circuit board assembly 3 and a conductive connector 50 are provided. The second circuit board assembly 3 includes a second circuit board body 10 and a control chip 44. The second circuit board body includes a third surface 41 and a fourth surface 42 opposite to each other, and a hollow groove 43 that penetrates the third surface 41 and the fourth surface 42. The shape of the hollow groove 43 can be circular, rectangular, square or elliptical, but the present invention is not limited thereto. In one embodiment, the hollow groove 43a is further a stepped structure, having a receiving area 431, such as Figure 5 In another embodiment, the hollow groove 43 is, for example, a large area that penetrates the third surface 41 and the fourth surface 42 of the second circuit board body 40. Fig. 9 As shown. The control chip 44 and other devices and the conductive connector 50 on the second circuit board body 40 can be arranged on the third surface 41 of the second circuit board body 40 by a reflow soldering method. The present invention is not limited to this. In addition, the second circuit board body 40 includes at least one pin 45, which is arranged on the fourth surface 42, for external electrical connection to, for example, a system terminal or a system motherboard. In this embodiment, at least one pin 45 can be a land grid array package (LGA) pin or a ball grid array package (BGA) pin, but the present invention is not limited to this.

[0080] In addition, in this embodiment, the first circuit board assembly 2 and the second circuit board assembly 3 are, for example, a power board assembly and a pin board assembly, respectively. The at least one conductive connecting member 50 can be, for example, a copper block or a row of pins, but the present invention is not limited thereto.

[0081] Thereafter, as shown in step S03, the second circuit board assembly 3 and other device stacks that have completed one reflow soldering are placed on the second surface 12 of the first circuit board body 10 that has completed one reflow soldering. The second surface 12 of the first circuit board body 10 faces the third surface 41 of the second circuit board body 40. The magnetic component 30 is disposed at a position of the first circuit board body 10 relative to the hollow groove 43 of the second circuit board body 40. In this embodiment, the second magnetic core 32 of the magnetic component 30 is spatially relative to the hollow groove 43, the second magnetic core 32 is pre-placed between the first circuit board body 10 and the second circuit board body 40, and the second magnetic core 32 of the magnetic component 30 is exposed through the hollow groove 43. Since the conductive connector 50 and the magnetic component 30 are misaligned with each other, the second magnetic core 32 can, for example, be placed in advance between the second surface 12 of the first circuit board body 10 and the third surface 41 of the second circuit board body 40. Thus, the bottom surface of the second magnetic core 32 can be exposed through the hollow groove 43 , and the conductive connector 50 can be correspondingly disposed between the second surface 12 of the first circuit board body 10 and the third surface 41 of the second circuit board body 40 through solder.

[0082] Then, as shown in step S04, the conductive connector 50, the first circuit board assembly 2 and the second circuit board assembly 3 are connected by a reflow soldering method. At this time, the second magnetic core 32 is maintained between the second surface 12 of the first circuit board body 10 and the third surface 41 of the second circuit board body 40, and the bottom surface of the second magnetic core 32 is exposed through the hollow groove 43.

[0083] Finally, as shown in step S05, a tool is used to push against the bottom surface of the second magnetic core 32 through the hollow groove 43, so that the first magnetic core 31 arranged on the first surface 11 and the second magnetic core 32 arranged on the second surface 12 can be connected through the through hole 13 of the first circuit board body 10, and buckled on the first circuit board body 10 to form the required planar transformer. As a result, the number of times that fine devices such as the power switch component 20 and the driver chip 21 in the first circuit board assembly 2 undergo reflow soldering can be controlled within two times, and the number of times that the control chip in the second circuit board assembly 3 undergoes reflow soldering is once. Therefore, the assembly method of the power module assembly structure 1 of the present invention helps to reduce the number of times that fine devices undergo reflow soldering, while achieving the purpose of simplifying the manufacturing process and reducing production costs. On the other hand, after the aforementioned reflow soldering, the magnetic component 30 arranged on the first circuit board body 10 can be pushed against the exposed bottom surface of the second magnetic core 32 of the magnetic component 30 by a tool through the hollow groove 43 to complete the assembly of the magnetic component 30 buckled on the first circuit board body 10, thereby increasing the modulability of the assembly process.

[0084] refer to Figures 5 to 8 as well as Fig.13. In the present embodiment, at least one hollow groove 43a is a stepped structure, having an accommodation area 431, the accommodation area 431 is recessed from the third surface 41 toward the fourth surface 42, and the projection area of ​​the accommodation area 431 on the third surface 41 is larger than the projection area of ​​the second magnetic core 32 of at least one magnetic component 30 on the third surface 41. Therefore, in the aforementioned step S03, the second magnetic core 32 of the magnetic component 30 can be partially accommodated in the accommodation area 431. In the aforementioned step S05, the tool presses against the bottom surface of the second magnetic core 32 through the hollow groove 43, so that the second magnetic core 32 is closely attached to the second surface 12 of the first circuit board body 10. Thus, the first magnetic core 31 disposed on the first surface 11 and the second magnetic core 32 disposed on the second surface 12 can be connected through the through hole 13 of the first circuit board body 10, and buckled on the first circuit board body 10, forming a planar transformer of the required specifications, thereby completing the power module assembly structure 1a. The tool can be removed after the assembly is completed, and the present invention is not limited thereto. Similarly, the number of times that the fine devices such as the power switch component 20, the driving chip 21, and the control chip 44 in the first circuit board component 2 and the second circuit board component 3 undergo reflow soldering can be controlled within two times. Therefore, the assembly method of the power module assembly structure 1a of the present invention helps to reduce the number of times that the fine devices undergo reflow soldering, while achieving the purpose of simplifying the manufacturing process and reducing production costs. On the other hand, after the aforementioned reflow soldering, the magnetic component 30 disposed on the first circuit board body 10 can be assembled by a tool through the hollow groove 43 to push against the exposed bottom surface of the second magnetic core 32 of the magnetic component 30, thereby completing the assembly of the magnetic component 30 buckled on the first circuit board body 10, thereby increasing the modulability of the assembly process. Furthermore, since the projection area of ​​the accommodation area 431 on the third surface 41 is larger than the projection area of ​​the second magnetic core 32 of at least one magnetic component 30 on the third surface 41, the accommodation area 431 of the hollow groove 43a can further correspond to a part of the second magnetic core 32 of the magnetic component 30, so as to reduce the height of the overall structure of the power module assembly structure 1a, while achieving the purpose of improving the power density.

[0085] In addition, please refer to Figures 9 to 12 as well as Fig.13. In this embodiment, the projection area of ​​at least one hollow groove 43b on the third surface 41 is larger than the projection area of ​​the second magnetic core 32 of at least one magnetic component 30 on the third surface 41. Then in the aforementioned step S05, the second magnetic core 32 can directly pass through the hollow groove 43 and be close to the second surface 12 of the first circuit board body 10. As a result, the first magnetic core 31 disposed on the first surface 11 and the second magnetic core 32 disposed on the second surface 12 can be connected through the through hole 13 of the first circuit board body 10, and snapped on the first circuit board body 10 to form the required planar transformer, thereby completing the power module assembly structure 1b. Among them, the number of times that fine devices such as the power switch component 20 and the driver chip 21 in the first circuit board component 2 undergo reflow soldering can be controlled within two times, and the number of times that the control chip in the second circuit board component 3 undergoes reflow soldering is also within two times. Therefore, the assembly method of the power module assembly structure 1b of the present invention helps to reduce the number of times that fine devices undergo reflow soldering, while achieving the purpose of simplifying the manufacturing process and reducing production costs. On the other hand, the second magnetic core 32 of the magnetic component 30 can be closely attached to the second surface 12 of the first circuit board body 10 through the hollow groove 43 after the aforementioned reflow soldering, and connected with the first magnetic core 31 on the first surface 11 through the through hole 13 to complete the assembly of the magnetic component 30 buckled on the first circuit board body 10, thereby increasing the modulability of the assembly process. In addition, since the projection area of ​​at least one hollow groove 43b on the third surface 41 is larger than the projection area of ​​the second magnetic core 32 of at least one magnetic component 30 on the third surface 41, the hollow groove 43b can correspond to a portion of the second magnetic core 32 of the magnetic component 30, so as to reduce the height of the overall structure of the power module assembly structure 1a, and at the same time achieve the purpose of improving the power density.

[0086] In another embodiment, the power module may also include a plurality of magnetic components 30, as shown in the above embodiment, and correspondingly, the second circuit board body 40 includes a plurality of hollow grooves 43. According to the principle shown in the embodiment of the present invention, the number of reflow soldering experienced by the delicate components in the power module can be controlled within two times.

[0087] In summary, the present invention provides a power module assembly structure and an assembly method thereof. For example, a first circuit board assembly of a power board assembly and a second circuit board assembly of a pin board assembly can be assembled by a reflow soldering method through at least one conductive connector to reduce the number of times delicate devices such as power devices on the power board assembly undergo reflow soldering, while achieving the purpose of simplifying the manufacturing process and reducing production costs. The design of at least one hollow groove on the pin board body corresponds to a magnetic component with upper and lower magnetic cores in space, and the conductive connector and the magnetic component are offset from each other, and the projection of the magnetic component and the hollow groove on a plane of the pin board body at least partially overlaps, so that the bottom surface of the lower magnetic core is exposed through the hollow groove. As a result, the magnetic component arranged on the power board assembly can pass through the hollow groove of the pin board body after reflow soldering, and a tool can pass through the hollow groove to push against the lower magnetic core of the magnetic component, so as to complete the assembly of the magnetic component buckled with the power board assembly, thereby increasing the modulability of the assembly process. In addition, the hollow groove can also correspond to the lower magnetic core portion of the magnetic component to reduce the height of the overall structure, while achieving the purpose of improving the power density.

[0088] The present invention can be modified in various ways by those skilled in the art, but all of them are within the protection of the attached claims.

Claims

1. A power module assembly structure, include: A first circuit board assembly, comprising a first circuit board body, at least one power switch device and at least one magnetic component, wherein the first circuit board body comprises a first surface, a second surface and at least one through hole, the at least one through hole passes through the first surface and the second surface, the at least one power switch device is arranged on the first circuit board body, wherein the at least one magnetic component comprises a first magnetic core and a second magnetic core, which are respectively arranged on the first surface and the second surface, and are buckled on the first circuit board body through the at least one through hole; A second circuit board assembly, comprising a second circuit board body, wherein the second circuit board body comprises a third surface, a fourth surface and at least one hollow groove, and the third surface faces the second surface, wherein the at least one hollow groove penetrates the third surface and the fourth surface, and is spatially arranged relative to the second magnetic core of the at least one magnetic component, and the second magnetic core of the at least one magnetic component is exposed through the at least one hollow groove; and At least one conductive connector is disposed between the second surface of the first circuit board body and the third surface of the second circuit board body, electrically connects the first circuit board assembly and the second circuit board assembly, and the at least one conductive connector and the at least one magnetic assembly are offset from each other.

2. The power module assembly structure as claimed in claim 1, wherein the at least one conductive connecting member connects the first circuit board assembly and the second circuit board assembly by a reflow soldering method. 3 . The power module assembly structure as claimed in claim 1 , wherein a projection of the at least one hollow slot on the third surface at least partially overlaps with a projection of the second magnetic core of the at least one magnetic component on the third surface.

4. The power module assembly structure as claimed in claim 1, wherein the projection area of ​​the at least one hollow groove on the third surface is greater than 0.2 mm 2 .

5. The power module assembly structure as described in claim 1, wherein the at least one hollow groove is a stepped structure and has a receiving area, the receiving area is recessed from the third surface toward the fourth surface, the projection area of ​​the receiving area on the third surface is larger than the projection area of ​​the second magnetic core of the at least one magnetic component on the third surface, and the second magnetic core of the at least one magnetic component is at least partially received in the receiving area.

6. The power module assembly structure as described in claim 1, wherein the at least one hollow groove passes through the second circuit board body, and the projection area of ​​the at least one hollow groove on the third surface is larger than the projection area of ​​the second magnetic core of the at least one magnetic component on the third surface, and the second magnetic core of the at least one magnetic component is at least partially accommodated in the at least one hollow groove. 7 . The power module assembly structure as claimed in claim 1 , wherein the at least one conductive connecting member is selected from one of the group consisting of a copper block and a row of pins. 8 . The power module assembly structure as claimed in claim 1 , wherein the at least one magnetic component is a planar transformer. 9 . The power module assembly structure as claimed in claim 1 , wherein the second circuit board body comprises at least one pin disposed on the fourth surface for external electrical connection. 10 . The power module assembly structure as claimed in claim 9 , wherein the at least one pin is selected from one of a group consisting of a land grid array package pin and a ball grid array package pin. 11 . The power module assembly structure as claimed in claim 1 , wherein the first circuit board component comprises at least one driving chip disposed on the first surface or the second surface of the first circuit board body. 12 . The power module assembly structure as claimed in claim 1 , wherein the second circuit board assembly comprises at least one control chip disposed on the third surface of the second circuit board body. 13 . The power module assembly structure as claimed in claim 1 , wherein the at least one hollow groove is used to operate a tool to assemble the magnetic component.

14. The power module assembly structure as claimed in claim 1, wherein the shape of the at least one hollow groove is selected from one of the group consisting of circle, rectangle, square, and ellipse.

15. A method for assembling a power module assembly structure, comprising the steps of: (a) providing a first circuit board assembly, comprising a first circuit board body, at least one power switch device and at least one magnetic component, wherein the first circuit board body comprises a first surface, a second surface and at least one through hole, the first surface and the second surface are opposite to each other, the at least one through hole passes through the first surface and the second surface, the at least one power switch device is disposed on the first circuit board body, wherein the at least one magnetic component comprises a first magnetic core and a second magnetic core; (b) providing a second circuit board assembly and a conductive connecting member, the second circuit board assembly comprising a second circuit board body, wherein the second circuit board body comprises a third surface, a fourth surface and at least one hollow groove, the third surface and the fourth surface are opposite to each other, and the at least one hollow groove runs through the third surface and the fourth surface, wherein the conductive connecting member is disposed on the third surface; (c) placing the second circuit board assembly and the at least one conductive connecting member stack on the second surface of the first circuit board body, wherein the second surface of the first circuit board body faces the third surface, the second magnetic core of the at least one magnetic assembly is spatially opposite to the at least one hollow groove, and the second magnetic core of the at least one magnetic assembly is exposed through the at least one hollow groove; (d) connecting the at least one conductive connection member and the first circuit board assembly by a reflow soldering method; and (e) The second magnetic core is abutted against by the at least one hollow groove, and the first magnetic core and the second magnetic core are connected by the at least one through hole, so that the first magnetic core and the second magnetic core are respectively arranged on the first surface and the second surface, and are buckled on the first circuit board body.

16. An assembling method for a power module assembly structure as described in claim 15, wherein the step (a) also includes a step (a0) of disposing the at least one power switching device on the first circuit board body by a reflow soldering method, and the step (b) also includes a step (b0) of disposing the conductive connector on the third surface by a reflow soldering method.

17. The method for assembling a power module assembly structure as claimed in claim 15, wherein the step (c) further comprises a step (c1) of pre-placing the second magnetic core between the first circuit board body and the second circuit board body.

18. An assembling method for a power module assembly structure as described in claim 15, wherein the at least one hollow groove passes through the second circuit board body, and a projection of the at least one hollow groove on the third surface at least partially overlaps with a projection of the second magnetic core of the at least one magnetic component on the third surface.

19. The method for assembling a power module assembly structure according to claim 15, wherein the projection area of ​​the at least one hollow groove on the third surface is greater than 0.2 mm 2 .

20. An assembling method for a power module assembly structure as described in claim 15, wherein the at least one hollow groove is a stepped structure and has a receiving area, the receiving area is recessed from the third surface toward the fourth surface, the projection area of ​​the receiving area on the third surface is larger than the projection area of ​​the second magnetic core of the at least one magnetic component on the third surface, and the second magnetic core of the at least one magnetic component is at least partially received in the receiving area.

21. The method for assembling a power module assembly structure as claimed in claim 15, wherein the at least one conductive connecting member is selected from one of the group consisting of a copper block and a row of pins. 22 . The method for assembling a power module assembly structure as claimed in claim 15 , wherein the at least one magnetic component is a planar transformer.

23. The method for assembling a power module assembly structure as claimed in claim 15, wherein a shape of the at least one hollow groove is selected from a group consisting of a circle, a rectangle, a square, and an ellipse.

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