Electronic device

Abstract

An electronic device is disclosed. The electronic device includes a plurality of first sensing electrodes, a plurality of second sensing electrodes, a plurality of first sensing lines, a plurality of second sensing lines, and a connection line connecting two second sensing patterns spaced apart from each other among the second sensing electrodes. Each of the first sensing lines includes a trench line that is connected to one of the first sensing electrodes and intersects the connection line so as to be insulated from the connection line. The connection line includes a plurality of line portions and a bridging portion. The plurality of line portions are spaced apart from each other on a plane and the trench line is located therebetween, and the bridging portion is located on a layer different from the layer where the line portions are located. The bridging portion connects the line portions to each other and has a conductivity smaller than that of the trench line.

Description

[0001] Cross - reference to related applications

[0002] This application claims priority and the benefit of Korean Patent Application No. 10 - 2019 - 0078197, filed on Jun. 28, 2019, the entire contents of which are incorporated herein by reference. Technical Field

[0003] Herein, embodiments of the present disclosure relate to an electronic device, and for example, to an electronic device that senses an external input. Background Art

[0004] An electronic device is activated according to an electrical signal. Such an electronic device is composed of (for example, includes) various suitable electronic components (such as, an electronic panel and an electronic module). The electronic panel may include a display unit that displays an image and a sensing unit that senses an external input. The electronic components may be electrically connected to each other through signal lines, which are differently arranged.

[0005] The display unit includes a light - emitting element that generates an image. The sensing unit may include sensing electrodes for sensing an external input. The sensing electrodes are located in an active area. The sensing unit is designed to provide uniform (for example, substantially uniform) sensitivity over the entire surface of the active area. Summary of the Invention

[0006] Embodiments of the present disclosure provide an electronic device having improved reliability.

[0007] Embodiments of the present disclosure provide an electronic device, including: a substrate; a plurality of first sensing electrodes located on the substrate; a plurality of second sensing electrodes spaced apart from the first sensing electrodes; a plurality of first sensing lines respectively connected to ends of the first sensing electrodes; a plurality of second sensing lines respectively connected to ends of the second sensing electrodes and spaced apart from the first sensing lines; and a connection line configured to connect two spaced - apart second sensing patterns in a second sensing pattern of one of the second sensing electrodes to each other, wherein each of the first sensing lines includes a trench line that is connected to one of the first sensing electrodes and crosses the connection line to be insulated from the connection line, and wherein the connection line includes: a plurality of line portions located on the same layer as the trench line, and spaced apart from each other in a plane with the trench line therebetween; and a bridging portion located on a layer different from the layer where the line portions are located and overlapping the trench line in a plane, the bridging portion being configured to connect the line portions to each other, wherein the bridging portion has a conductivity (for example, electrical conductivity) smaller than that of the trench line.

[0008] In an exemplary embodiment, the trench line may be located on the bridging portion in a cross - section (for example, in a cross - sectional view).

[0009] In an exemplary embodiment, each of the line portions may include a metal, and the bridging portion may include a transparent conductive oxide.

[0010] In an exemplary embodiment, each of the line portions may include: a first layer including a metal; and a second layer located on the first layer and including the same (e.g., substantially the same) material as the bridging portion, wherein the first layer and the second layer may be in contact with each other (e.g., directly or physically) in a cross-section (e.g., in a cross-sectional view).

[0011] In an exemplary embodiment, the trench line may include: a first portion extending in a first direction and spaced apart from a first sensing electrode in a second direction crossing the first direction; a second portion extending from the first portion in the second direction and connected to the first sensing electrode; and a third portion spaced apart from the first portion and the second portion being located between the first portion and the third portion to extend from the second portion, wherein the bridging portion may extend in the first direction.

[0012] In an exemplary embodiment, the width of the second portion in the first direction may be substantially the same as the width of each of the line portions in the second direction.

[0013] In an exemplary embodiment, the electronic device may further include at least one metal pattern located between the first portion and the first sensing electrode, wherein the metal pattern may be located on the same layer as the trench line and may include the same (e.g., substantially the same) material as the trench line.

[0014] In an exemplary embodiment, the electronic device may further include an electrostatic induction pattern that overlaps the bridging portion in a plane and includes the same (e.g., substantially the same) material as the line portions.

[0015] In an exemplary embodiment, the electrostatic induction pattern may be connected to the bridging portion.

[0016] In an exemplary embodiment, the electrostatic induction pattern may be connected to the first sensing electrode.

[0017] In an exemplary embodiment, the electronic device may further include a trench portion passing through the substrate, wherein the trench portion may be connected to at least one edge of the substrate.

[0018] In an exemplary embodiment, the connection line may be located in a plane between the trench portion and the first sensing electrode.

[0019] In an exemplary embodiment, the electronic device may further include an organic light-emitting element located on a base substrate and a packaging layer configured to cover the organic light-emitting element, wherein the first sensing electrode and the second sensing electrode may be located on the packaging layer in a cross-section (e.g., in a cross-sectional view).

[0020] In an exemplary embodiment of the present disclosure, the electronic device includes: a first sensing electrode including a first column electrode having a first length in a first direction and a second column electrode having a length smaller than the first length in the first direction; a second sensing electrode including a first row electrode having a second length in a second direction different from the first direction and a second row electrode having a length smaller than the second length in the second direction, wherein the second row electrode includes sensing patterns spaced apart from each other in the second direction; a plurality of first sensing lines including a normal line connected to the first column electrode and a trench line connected to the second column electrode; a plurality of second sensing lines respectively connected to the first row electrode and the second row electrode; and a connection line configured to connect the sensing patterns of the second row electrode to each other, the connection line intersecting the trench line so as to be insulated from the trench line, wherein the connection line includes: a bridging portion overlapping the trench line in a plane; and line portions spaced apart from each other with the trench line therebetween, the line portions being connected to each other by the bridging portion, wherein the trench line is located on the bridging portion in a cross-section (e.g., in a cross-sectional view).

[0021] In an exemplary embodiment, the connection line may have a conductivity (e.g., electrical conductivity) smaller than that of the trench line.

[0022] In an exemplary embodiment, the connection line may include a transparent conductive oxide.

[0023] In an exemplary embodiment, the connection line may be spaced apart from the second column electrode in a plane.

[0024] In an exemplary embodiment, the width of the line portion in the first direction may be substantially the same as the width of the trench line in the second direction.

[0025] In an exemplary embodiment, the electronic device may further include an electrostatic induction pattern located on the connection line and connected to the connection line in a cross-section (e.g., in a cross-sectional view), wherein the electrostatic induction pattern may be spaced apart from the trench line in a plane.

[0026] In an exemplary embodiment, the electronic device may further include an electrostatic induction pattern connected to the second column electrode in a plane, wherein the electrostatic induction pattern may be spaced apart from the trench line in a plane. Description of the Drawings

[0027] The accompanying drawings are included to provide a further understanding of the subject matter of the present disclosure and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the present disclosure and, together with the specification, are used to explain the principles of the present disclosure. In the drawings:

[0028] Figure 1 is a schematic perspective view of an electronic device according to an embodiment of the present disclosure;

[0029] Figure 2 is Figure 1 an exploded perspective view of the electronic device;

[0030] Figure 3 is Figure 1 a block diagram of the electronic device;

[0031] Figure 4 is a plan view showing a part of an electronic panel according to an embodiment of the present disclosure;

[0032] Figure 5A is Figure 4 a plan view of the region XX';

[0033] Figure 5B is a cross-sectional view taken along the line Figure 5A I-I' of;

[0034] Figure 6 is a plan view showing Figure 4 the region YY';

[0035] Figure 7A is a cross-sectional view taken along the line Figure 6 II-II' of;

[0036] Figure 7B is a cross-sectional view taken along the line Figure 6 III-III' of;

[0037] Figure 8A and Figure 8B are cross-sectional views showing parts of an electronic panel according to an embodiment of the present disclosure;

[0038] Figure 9 is an enlarged plan view showing a part of a sensing unit according to an embodiment of the present disclosure;

[0039] Figure 10A and Figure 10B are each an enlarged plan view showing a part of a sensing unit according to an embodiment of the present disclosure;

[0040] Figure 11A is an exploded perspective view of an electronic device according to an embodiment of the present disclosure; and

[0041] Figure 11B is a plan view of a part of the components of an electronic device shown Figure 11A . DETAILED DESCRIPTION

[0042] In this specification, it should also be understood that when a component (or region, layer, part) is referred to as being "on", "connected to", or "coupled to" another component, it can be directly on, connected to, or coupled to the other component, or one or more intervening third components can also be interposed therebetween.

[0043] Like reference numerals always denote like elements. Further, in the drawings, for clarity of illustration, the thickness, ratios, and dimensions of components may be exaggerated.

[0044] The term "and / or" includes any and all combinations of one or more of the associated listed items.

[0045] It should be understood that although terms such as "first" and "second" are used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one component from other components. For example, without departing from the scope of the appended claims, an element that is referred to as a first element in one embodiment can be referred to as a second element in another embodiment. As used herein, unless the context clearly indicates otherwise, the singular form of a term may also include the plural form.

[0046] In addition, spatial relative terms such as "beneath", "below", "above", "over" etc. are used to explain the relationship of one element or feature to another element or feature as shown in the drawings. Spatial relative terms can be relative concepts and can be described based on the directions shown in the drawings.

[0047] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Further, terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and / or this specification, and should not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0048] The terms "include" and "comprise" specify the presence of attributes, fixed numbers, steps, operations, elements, components, and / or combinations thereof, but do not preclude the presence or addition of one or more other attributes, fixed numbers, steps, operations, elements, components, and / or combinations thereof.

[0049] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings.

[0050] Figure 1 is a schematic perspective view of an electronic device according to an embodiment of the present disclosure. Figure 2 is Figure 1 an exploded perspective view of the electronic device. Figure 3 is Figure 1 a block diagram of the electronic device. Hereinafter, some embodiments of the present disclosure will be described with reference to Figures 1 to 3 the following.

[0051] The electronic device EA may be a device activated according to an electrical signal (e.g., activated by an electrical signal or operated according to an electrical signal). The electronic device EA may include various examples (e.g., may take various forms). Examples of the electronic device EA may include a tablet, a notebook, a computer, a smart TV, etc. In Figure 1 the embodiment shown, the electronic device EA includes (e.g., is) a smart phone, and this embodiment will be described as an example. However, the present disclosure is not limited thereto.

[0052] Referring to Figure 1 , the electronic device EA may display an image IM through a front surface FS. The front surface FS may be parallel to (e.g., substantially parallel to) a surface (e.g., a plane) defined by a first direction DR1 and a second direction DR2. The front surface FS may include a transmissive area TA and a border area BZA adjacent to the transmissive area TA.

[0053] The electronic device EA displays the image IM in the transmissive area TA (e.g., through the transmissive area TA). The image IM may include at least one selected from a still image and a moving image. In Figure 1 , as an example, the image IM is shown as a clock and a plurality of icons.

[0054] The transmissive area TA may have a rectangular shape parallel to (e.g., substantially parallel to) the first direction DR1 and the second direction DR2 (e.g., parallel to a plane defined by the first direction DR1 and the second direction DR2). For example, when the transmissive area TA has a rectangular shape, the long side of the transmissive area TA may be parallel to (e.g., substantially parallel to) the first direction DR1, and the short side of the transmissive area TA may be parallel to (e.g., substantially parallel to) the second direction DR2. However, the present disclosure is not limited thereto. For example, each of the electronic device EA and the transmissive area TA may have various suitable shapes.

[0055] The border area BZA is adjacent to the transmissive area TA. The border area BZA may surround the transmissive area TA. However, the present disclosure is not limited thereto. For example, the border area BZA may be adjacent to only one side of the transmissive area TA, or may be omitted. The electronic device EA may include various suitable embodiments.

[0056] The normal direction of the front surface FS (e.g., the direction perpendicular to the front surface FS or the direction orthogonal to the front surface FS) may correspond to the thickness direction of the electronic device EA (hereinafter, referred to as the third direction DR3). In some embodiments, the front surface (or top surface) and / or the rear surface (or bottom surface) of each of the components (e.g., components and / or features of the electronic device EA) may be defined based on the direction along which the image IM is displayed. The front surface and the rear surface may face each other in the third direction DR3. The directions indicated as the first direction DR1, the second direction DR2, and the third direction DR3 may be relative concepts and may thus be changed to different directions. Hereinafter, the first to third directions may be the directions represented by the first direction DR1, the second direction DR2, and the third direction DR3 and may be represented by the same reference numerals, respectively.

[0057] An electronic device EA according to some embodiments of the present disclosure may sense an input TC of a user applied from the outside (hereinafter, referred to as “external input TC”). The input TC of the user may include various types or kinds of external inputs, such as a part of the user's body, light and / or heat, pressure, etc. In addition, the electronic device EA may sense not only an input that contacts (e.g., directly or physically contacts) the electronic device EA, but also an input that is close or adjacent.

[0058] In some embodiments, the input TC of the user is shown as a user's hand (e.g., the user's fingertip) applied to the front surface FS (e.g., physically contacting the front surface FS or hovering above the front surface FS). However, the present disclosure is not limited thereto. For example, as described above, the input TC of the user may be provided in various suitable forms or shapes. The electronic device EA may sense the input TC of the user applied to the side surface or the rear surface of the electronic device EA depending on the structure of the electronic device EA, but the present disclosure is not limited thereto.

[0059] The electronic device EA may include a window 100, an electronic panel 200, an electronic module 300, and a housing 400. The window 100 and the housing 400 may be coupled to each other to define the appearance of the electronic device EA. In some embodiments, the electronic device EA may include a base substrate. In some embodiments, the base substrate may be included in the electronic panel 200.

[0060] The window 100 may cover the front surface IS of the electronic panel 200 on the electronic panel 200. The window 100 may include an optically transparent insulating material. For example, the window 100 may include glass and / or plastic. The window 100 may have a single-layer or multi-layer structure. For example, the window 100 may have a laminated structure of a plurality of plastic films bonded to each other by an adhesive, or a laminated structure of a glass substrate and a plastic film bonded to each other by an adhesive.

[0061] The transmissive region TA and the border region BZA may be regions on the window 100. For example, the transmissive region TA may be an optically transparent region. The transmissive region TA may have a shape corresponding to the shape of the active region AA of the electronic panel 200. For example, the transmissive region TA may overlap the entire surface of at least a part of the active region AA. For example, in some embodiments, the transmissive region TA overlaps a part or all of the active region AA. An image IM displayed in the active region AA of the electronic panel 200 (e.g., displayed by or from the active region AA of the electronic panel 200) may be visible from the outside through the transmissive region TA.

[0062] The border region BZA may be a region having a light transmittance (e.g., light transparency) relatively smaller than that of the transmissive region TA. The border region BZA may define the shape of the transmissive region TA. The border region BZA may be adjacent to the transmissive region TA to surround the transmissive region TA.

[0063] The border region BZA may have a set or predetermined color. When the window 100 is a glass and / or plastic substrate, the border region BZA may be a color layer printed or deposited on one surface (e.g., the outer surface) of the glass or plastic substrate. In some embodiments, the border region BZA may be formed by coloring a corresponding region of the glass or plastic substrate.

[0064] The border region BZA may cover the peripheral region NAA of the electronic panel 200 to prevent or reduce the visibility of the peripheral region NAA from the outside. However, the present disclosure is not limited thereto. For example, in some embodiments, the border region BZA may be omitted from the window 100.

[0065] The electronic panel 200 may display the image IM and sense an external input TC. The electronic panel 200 includes a front surface IS, and the front surface IS includes an active region AA and a peripheral region NAA. The active region AA may be a region activated according to an electrical signal (e.g., activated by or operated according to an electrical signal).

[0066] In some embodiments, the active region AA may be a region in which (e.g., from which) the image IM is displayed and in which the external input TC can be sensed. The transmissive region TA at least overlaps the active region AA. For example, the transmissive region TA overlaps the entire surface of at least a part of the active region AA. Thus, a user may see the image IM through the transmissive region TA, or may provide an external input TC through the transmissive region TA. However, the present disclosure is not limited thereto. For example, in some embodiments, the region in which the image IM is displayed in the active region AA and the region in which the external input TC is sensed in the active region AA may be separated from each other.

[0067] The peripheral area NAA may be an area covered by the border area BZA. The peripheral area NAA is adjacent to the active area AA. The peripheral area NAA may surround the active area AA. A driving circuit or driving lines for driving the active area AA may be in the peripheral area NAA.

[0068] Various signal lines that can supply an electrical signal to the active area AA, the pads, or the electronic components may be in the peripheral area NAA. The peripheral area NAA may be covered by the border area BZA and thus may not be visible from the outside.

[0069] In some embodiments, the electronic panel 200 may be assembled such that the active area AA and the peripheral area NAA are flat and face the window 100. However, the present disclosure is not limited thereto. For example, a part of the peripheral area NAA of the electronic panel 200 may be curved. For example, a part of the peripheral area NAA may face the rear surface (e.g., the bottom surface) of the electronic device EA to reduce the area of the border area BZA on the front surface FS (e.g., the top surface) of the electronic device EA. In some embodiments, a part of the active area AA of the electronic panel 200 may be curved. In some embodiments, the peripheral area NAA may be omitted from the electronic panel 200.

[0070] Reference Figure 2 , the electronic panel 200 may include a display unit 210 and a sensing unit 220. The display unit 210 may be a component that generates (e.g., substantially generates) an image IM. The image IM generated by the display unit 210 may be seen by a user from the outside through the transmissive area TA. In some embodiments, the display unit 210 includes a base substrate and organic light-emitting elements located on the base substrate. The display unit 210 includes a encapsulation layer covering the organic light-emitting elements. In some embodiments, the sensing unit 220 is located on the display unit 210. In some embodiments, the encapsulation layer is located between the display unit 210 and the sensing unit 220. The sensing unit 220 is located on the encapsulation layer. In some embodiments, a first sensing electrode and a second sensing electrode are located on the encapsulation layer in a cross-section.

[0071] The sensing unit 220 senses an external input TC applied from the outside. As described above, the sensing unit 220 may sense the external input TC provided to the window 100 (e.g., provided on the window 100).

[0072] A set or predefined groove portion TRH may be located in the electronic panel 200. The groove portion TRH may pass through at least one selected from the display unit 210 and the sensing unit 220. The groove portion TRH may be connected to at least one selected from the edges of the electronic panel 200. In some embodiments, the groove portion TRH may pass through all of the display unit 210 and the sensing unit 220 (e.g., through all of the electronic panel 200).

[0073] The active area AA may surround at least a portion of the groove portion TRH. Due to the groove portion TRH, the active area AA may have a shape that is partially recessed from the plane along the edge of the groove portion TRH. For example, in some embodiments, the portion of the active area AA on one side where the groove portion TRH is located may be recessed away from the said side of the active area AA due to the groove portion TRH.

[0074] The electronic module 300 is located below the window 100. The electronic module 300 may overlap with the groove portion TRH.

[0075] The electronic module 300 may be located on the rear surface of the electronic panel 200. According to an embodiment of the present disclosure, the electronic module 300 may overlap with the active area AA, thereby preventing or reducing an increase in the bezel area BZA.

[0076] Reference Figure 3 , the electronic device EA may include an electronic panel 200, a power supply module PM, a first electronic module EM1, and a second electronic module EM2. The electronic panel 200, the power supply module PM, the first electronic module EM1, and the second electronic module EM2 may be electrically connected to each other. In Figure 2 , the display unit 210 and the sensing unit 220 of the electronic panel 200 are shown as examples.

[0077] The first electronic module EM1 and the second electronic module EM2 may include various functional modules for driving the electronic device EA. The first electronic module EM1 may be directly mounted on a motherboard electrically connected to the electronic panel 200, or may be mounted on a separate board and electrically connected to the motherboard through a connector.

[0078] The first electronic module EM1 may include a control module CM, a wireless communication module TM, an image input module IIM, an audio input module AIM, a memory MM, and an external interface IF. A part of the modules (e.g., a part or some of the modules of the first electronic module EM1) may not be mounted on the motherboard, but may be electrically connected to the motherboard through a flexible circuit board.

[0079] The control module CM controls the overall operation of the electronic device EA. The control module CM can be a microprocessor. For example, the control module CM can activate or deactivate the electronic panel 200. The control module CM can control other modules such as the image input module IIM or the audio input module AIM based on (e.g., based on or according to) the touch signals received from the electronic panel 200.

[0080] The wireless communication module TM can send wireless signals to other electronic devices and / or receive wireless signals from other electronic devices by using Bluetooth and / or Wi-Fi. The wireless communication module TM can send audio signals and / or receive audio signals by using (e.g., via) a general communication line. The wireless communication module TM includes: a transmitter TM1 to modulate and transmit the signal to be transmitted; and a receiver TM2 to demodulate the received signal.

[0081] The image input module IIM processes the image signal to convert the image signal into image data that can be displayed on the electronic panel 200 (e.g., can be used for displaying an image). The audio input module AIM receives an external audio signal by using a microphone during a recording mode or a voice recognition mode, and converts the received audio signal into electroacoustic data.

[0082] The external interface IF serves as an interface for connecting to an external charger, a wired / wireless data port, a card socket (e.g., a memory card and / or a SIM / UIM card), etc.

[0083] The second electronic module EM2 can include an audio output module AOM, a light emitting module LM, a light receiving module LRM, and a camera module CMM. The above components (e.g., the above modules of the second electronic module EM2) can be directly mounted on the motherboard, can be mounted on a separate board and electrically connected to the electronic panel 200 through a connector, or can be electrically connected to the first electronic module EM1.

[0084] The audio output module AOM converts the audio data received from the wireless communication module TM or the audio data stored in the memory MM (e.g., the audio data stored in the memory MM and received by the audio output module AOM), and outputs the converted audio data to the outside.

[0085] The light-emitting module LM generates and outputs light. The light-emitting module LM can output infrared rays. For example, the light-emitting module LM can include an LED element. In some embodiments, the light-receiving module LRM can sense infrared rays. When infrared rays having a set or predetermined level (e.g., set or predetermined energy or intensity) or greater are sensed, the light-receiving module LRM can be activated. The light-receiving module LRM can include a complementary metal oxide semiconductor (CMOS) sensor. The infrared rays generated by the light-emitting module LM can be output, and then can be reflected by an external object (e.g., a user's finger or face), and the reflected infrared rays can be incident on the light-receiving module LRM. The camera module CMM captures an external image.

[0086] The electronic module 300 according to an embodiment of the present disclosure can include at least one component selected from components of the first electronic module EM1 and the second electronic module EM2. For example, the electronic module 300 can include at least one selected from a camera, a speaker, an optical detection sensor, and a thermal detection sensor. The electronic module 300 can sense an external object received through the trench portion TRH (e.g., a signal from an external object received through the trench portion TRH). In some embodiments, the electronic module 300 can include a plurality of components, and the plurality of components can include any suitable combination of components.

[0087] In the electronic module 300 overlapping with the trench portion TRH, an external object can be easily seen through the trench portion TRH, or an output signal generated by the electronic module 300 can be easily transmitted to the outside.

[0088] The electronic device EA according to an embodiment of the present disclosure can include a transparent member located between the electronic module 300 and the electronic panel 200. The transparent member can be attached to (e.g., attached to through an adhesive layer) the rear surface of the electronic panel 200, or can be located between the electronic panel 200 and the electronic module 300 without an adhesive layer. The electronic device EA according to some embodiments of the present disclosure is not limited to a specific embodiment and can have various suitable shapes.

[0089] According to an embodiment of the present disclosure, the electronic module 300 can overlap with the transmissive region TA on a plane. Therefore, since the electronic module 300 is positioned not to overlap with the electronic panel 200, an increase in the bezel area BZA can be prevented or reduced to improve the aesthetics of the electronic device EA.

[0090] Figure 4 is a plan view showing a part of an electronic panel according to some embodiments of the present disclosure. Figure 5A is Figure 4 a plan view of the region XX' of Figure 5B is along Figure 5AA cross-sectional view taken along line I-I'. In the following, reference will be made to Figures 4 to 5B Some embodiments of the present disclosure. The same reference numerals may be given to components identical to Figures 1 to 3 the components of, and their repeated descriptions will not be repeated here.

[0091] In Figure 4 , for ease of description, components of the sensing unit 220 on the display unit 210 are shown. As Figure 4 shown, the sensing unit 220 may include a plurality of first sensing electrodes SE1, a plurality of second sensing electrodes SE2, a plurality of first sensing lines SL1, a plurality of second sensing lines SL2, a plurality of third sensing lines SL3, and a plurality of sensing pads PDT.

[0092] The first sensing electrodes SE1 may be arranged to be spaced apart from each other in the first direction DR1 and may extend in the second direction DR2. Each of the first sensing electrodes SE1 may include a plurality of first sensing patterns SP1 and a plurality of first connection patterns CP1 arranged in the second direction DR2.

[0093] The first sensing patterns SP1 and the first connection patterns CP1 may be alternately arranged in the second direction DR2. The first sensing patterns SP1 may be arranged in the second direction DR2, and the first connection patterns CP1 may be located between the first sensing patterns SP1. Each of the first connection patterns CP1 may connect two adjacent first sensing patterns SP1 (e.g., two first sensing patterns SP1 adjacent to each other in the second direction DR2 among the first sensing patterns SP1) to each other.

[0094] The second sensing electrodes SE2 may be arranged to be spaced apart from each other in the second direction DR2 and may extend in the first direction DR1. Each of the second sensing electrodes SE2 may include a plurality of second sensing patterns SP2 and a plurality of second connection patterns CP2 arranged in the first direction DR1. The second sensing patterns SP2 and the second connection patterns CP2 may be alternately arranged in the first direction DR1. Each of the second connection patterns CP2 connects two adjacent second sensing patterns SP2 (e.g., two second sensing patterns SP2 adjacent to each other in the first direction DR1 among the second sensing patterns SP2) to each other.

[0095] In some embodiments, the first connection pattern CP1 and the second connection pattern CP2 may be located on different layers from each other, and the first sensing pattern SP1 and the second sensing pattern SP2 may be located on the same layer. Hereinafter, for convenience of description, some embodiments will be described in which the first connection pattern CP1 is located on a layer different from the layer in which the second connection pattern CP2, the first sensing pattern SP1, and the second sensing pattern SP2 are located. However, the present disclosure is not limited thereto. For example, in some embodiments, the first connection pattern CP1 may be located on the same layer as the first sensing pattern SP1 and the second sensing pattern SP2, or the first connection pattern CP1 and the first sensing pattern SP1 may be located on a layer different from the layer in which the second connection pattern CP2 and the second sensing pattern SP2 are located.

[0096] As Figure 5A and Figure 5B shown, two adjacent first sensing patterns SP11 and SP12 in the first sensing pattern SP1 are connected to each other through the first connection pattern CP1A. The first sensing patterns SP11 and SP12 are located between the display unit 210 and the first layer L1.

[0097] In some embodiments, the first connection pattern CP1A may include a plurality of patterns CP11 and CP12 spaced apart from each other. Each of the patterns CP11 and CP12 may include a first portion C1, a second portion C2, and a third portion C3.

[0098] The first portion C1 extends to cross the first sensing pattern SP11 and the second connection pattern CP2A. The first portion C1 overlaps the first sensing pattern SP11 and the second connection pattern CP2A in a plane.

[0099] The first portion C1 is located on a layer different from the layer in which the first sensing pattern SP11 and the second connection pattern CP2A are located. In this embodiment, the first portion C1 may be located between the first layer L1 and the second layer L2 to be electrically insulated from the first sensing pattern SP11 and the second connection pattern CP2A.

[0100] The second portion C2 may be located on a layer different from the layer in which the first portion C1 is located, and the second portion C2 may be located on the same layer as the second sensing patterns SP21 and SP22 and the second connection pattern CP2A. The second portion C2 may be located between the display unit 210 and the first layer L1, and may also be spaced apart from the second sensing patterns SP21 and SP22 and the second connection pattern CP2A in a plane. In some embodiments, the second portion C2 may be located within an opening defined in the second connection pattern CP2A.

[0101] The third portion C3 is spaced apart from the first portion C1 to extend to cross the first sensing pattern SP12 and the second connection pattern CP2A. The third portion C3 overlaps the first sensing pattern SP12 and the second connection pattern CP2A in a plane. The third portion C3 is located on the same layer as the first portion C1. The first portion C1 and the third portion C3 may pass through the first layer L1 and be respectively connected to the first sensing patterns SP11 and SP12. The first portion C1 and the third portion C3 may pass through the first layer L1 and be connected to the second portion C2. For example, in some embodiments, the first portion C1 may connect (e.g., electrically connect) the first sensing pattern SP11 to the second portion C2, and the third portion C3 may connect (e.g., electrically connect) the second portion C2 to the first sensing pattern SP12. Thus, the first portion C1, the second portion C2, and the third portion C3 may connect (e.g., electrically connect) the first sensing patterns SP11 and SP12 to each other.

[0102] However, the present disclosure is not limited thereto. For example, in some embodiments, the second portion C2 may be omitted from the sensing unit 220, and the first portion C1 and the third portion C3 may be directly connected to each other. In some embodiments, the patterns CP11 and CP12 may have different structures from each other, but the present disclosure is not limited thereto. For example, in some embodiments, the patterns CP11 and CP12 may have the same structure.

[0103] The second connection pattern CP2A in the second connection pattern CP2 that crosses the first connection pattern CP1A connects (e.g., electrically connects) two adjacent second sensing patterns SP21 and SP22 in the second sensing pattern SP2 (e.g., two second sensing patterns SP21 and SP22 adjacent in the first direction DR1). The second connection pattern CP2A may be located on the same layer as the second sensing patterns SP21 and SP22 and may cross the first connection pattern CP1A such that the first connection pattern CP1A and the second connection pattern CP2A are insulated from each other. In some embodiments, the second sensing patterns SP21 and SP22 may be integrated with the second connection pattern CP2A.

[0104] Referring back to Figure 4 , the first sensing electrode SE1 may include a plurality of first column electrodes SE1_A and at least one second column electrode SE1_B. The first column electrodes SE1_A may be electrodes in a region that does not overlap with the trench portion TRH in the second direction DR2. For example, in some embodiments, each of the first column electrodes SE1_A may extend along a line that does not cross the trench portion TRH in the second direction DR2.

[0105] The second column of electrodes SE1_B may overlap with the trench portion TRH in the second direction DR2. For example, in some embodiments, the second column of electrodes SE1_B may extend along a line that intersects the trench portion TRH in the second direction DR2. The length of the second column of electrodes SE1_B in the second direction DR2 is less than the length of each of the first column of electrodes SE1_A in the second direction DR2.

[0106] The second sensing electrode SE2 may include a plurality of second row electrodes SE2_A and at least one second row electrode SE2_. The second row electrodes SE2_A may be electrodes in a region that does not overlap with the trench portion TRH in the first direction DR1. For example, in some embodiments, each of the second row electrodes SE2_A may extend along a line that does not overlap with the trench portion TRH in the first direction DR1.

[0107] The second row of electrodes SE2_B may overlap with the trench portion TRH in the first direction DR1. For example, in some embodiments, the second row of electrodes SE2_B may extend along a line that overlaps with the trench portion TRH in the first direction DR1. The second row of electrodes SE2_B may be divided into two parts that are spaced apart from each other in the first direction DR1, and the trench portion TRH is located between the two parts. The two parts of the second row of electrodes SE2_B that are separated from each other by the trench portion TRH may be connected to each other by a connection line BL. In some embodiments, the connection line BL connects two second sensing patterns SP2E1 and SP2E2 that face the trench portion TRH of the two parts of the second row of electrodes SE2_B. However, the present disclosure is not limited thereto. For example, according to the position of the trench portion TRH, the second row of electrodes SE2_B may have various suitable shapes.

[0108] The sensing lines SL1, SL2, and SL3 and the sensing pads PDT are located in the peripheral area NAA. The sensing pads PDT are connected to the sensing lines SL1, SL2, and SL3. The sensing lines SL1, SL2, and SL3 include a plurality of first sensing lines SL1, a plurality of second sensing lines SL2, and a plurality of third sensing lines SL3. In some embodiments, the sensing pads PDT may include a first pad T1, a second pad T2, and a third pad T3. For example, in some embodiments, the first pad T1, the second pad T2, and the third pad T3 are respectively connected to the first sensing line SL1, the second sensing line SL2, and the third sensing line SL3.

[0109] The first sensing line SL1 is respectively connected to the ends (e.g., the first ends) of the first sensing electrodes SE1. The first sensing line SL1 connects the first pad T1 of the sensing pad PDT to the first sensing electrodes SE1 respectively to transmit an electrical signal provided from the outside (e.g., from outside the sensing unit 220) to the first sensing electrodes SE1.

[0110] The second sensing line SL2 is respectively connected to the ends of the second sensing electrode SE2. The second sensing line SL2 connects the second pad T2 of the sensing pad PDT to the second sensing electrode SE2 respectively to transmit an electrical signal provided from the outside (e.g., outside the sensing unit 220) to the second sensing electrode SE2.

[0111] The third sensing line SL3 is respectively connected to the other ends (e.g., the second ends) of the first sensing electrode SE1. The other ends (e.g., the second ends) of the first sensing electrode SE1 may be the parts (e.g., the end parts of the first sensing electrode SE1) opposite to the ends (e.g., the first ends) of the first sensing electrode SE1. According to an embodiment of the present disclosure, the first sensing electrode SE1 may be connected to the first sensing line SL1 and the third sensing line SL3. Thus, the sensitivity in the region with respect to (e.g., corresponding to) the first sensing electrode SE1 can be maintained uniformly (e.g., substantially uniformly), where each of the first sensing electrodes SE1 has a length relatively longer than that of each of the second sensing electrodes SE2.

[0112] The first sensing line SL1 according to an embodiment of the present disclosure may include a trench line SL1_T. The trench line SL1_T may be connected to the second column electrodes SE1_B of the first sensing electrode SE1. The trench line SL1_T is connected to the first sensing pattern SP1E of the second column electrodes SE1_B facing the trench portion TRH.

[0113] The trench line SL1_T may overlap with the connection line BL in a plane. The trench line SL1_T may cross the connection line BL so as to be insulated from the connection line BL. Thus, the trench line SL1_T and the connection line BL can transmit independent electrical signals to maintain uniform (e.g., substantially uniform) sensitivity even in the region adjacent to the trench portion TRH (e.g., the region corresponding to the second column electrodes SE1_B), and prevent or reduce the occurrence of electrical short - circuit between the first sensing electrode SE1 and the second sensing electrode SE2.

[0114] Figure 6 is a plan view showing Figure 4 region YY'. Figure 7A is a cross - sectional view taken along line II - II' of Figure 6 and Figure 7B is a cross - sectional view taken along line III - III' of Figure 6 Figure 8A and Figure 8B Each of Figure 8A shows the region corresponding to Figure 7A and Figure 8B shows the region corresponding to​Figure 7B region. Hereinafter, some embodiments of the present disclosure will be described with reference to Figures 6 to 8B the same. The same reference numerals may be given to the same components as those of Figures 1 to 5B and their repeated descriptions will not be repeated here.

[0115] Figure 6 FIG. shows an enlarged view of a region where the trench line SL1_T and the connection line BL cross each other. The first sensing line SL1 may include a trench line SL1_T and a normal line SL1_N. The normal lines SL1_N may be provided in plurality. The plurality of normal lines SL1_N may be respectively connected to the first column electrodes SE1_A (see Figure 4 ) of the first sensing electrode SE1 (see Figure 4 ) (e.g., the first end).

[0116] The trench line SL1_T is connected to the first sensing pattern SP1E of the second column electrodes SE1_B (see Figure 4 ) facing the trench portion TRH. The trench line SL1_T may include a first portion P1, a second portion P2, a third portion P3, a fourth portion P4, and a fifth portion P5 that are connected to each other to form a single body.

[0117] The first portion P1 may be the portion of the trench line SL1_T closest to the normal line SL1_N and extending parallel (e.g., substantially parallel) to the normal line SL1_N. In some embodiments, the first portion P1 may extend parallel (e.g., substantially parallel) to the normal line SL1_N and may be closer to the normal line SL1_N than the second portion P2, the third portion P3, the fourth portion P4, and the fifth portion P5. The second portion P2 bends from the first portion P1 and extends toward the first sensing pattern SP1E.

[0118] The third portion P3 may bend from the second portion P2 and extend parallel (e.g., substantially parallel) to the connection line BL. An embodiment is described in which the third portion P3 has a width relatively larger than the width of each of the first portion P1 and the second portion P2.

[0119] Each of the fourth portion P4 and the fifth portion P5 may be a portion extending from the third portion P3 and connected to the first sensing pattern SP1E. The fourth portion P4 and the fifth portion P5 overlap the first sensing pattern SP1E in a plane. Each of the fourth portion P4 and the fifth portion P5 may be connected to the first sensing pattern SP1E through a set or predetermined contact hole CN_S.

[0120] The first part P1, the second part P2, the third part P3, the fourth part P4, and the fifth part P5 can be connected to each other to form a main body. The trench line SL1_T can include a metal having high conductivity (e.g., high electrical conductivity). For example, the trench line SL1_T can include silver, gold, copper, aluminum, and / or molybdenum. The trench line SL1_T can be located on the same layer as a part of the connection line BL and can include the same (e.g., substantially the same) material as that part of the connection line BL.

[0121] The connection line BL overlaps the trench line SL1_T in a plane. The connection line BL can include a line portion LP and a bridging portion BP. The line portions LP can be provided in plurality. In some embodiments, the bridging portion BP can include a plurality of bridging portions. The plurality of line portions LP can be spaced apart from each other. The line portions LP do not overlap the trench line SL1_T and the first sensing pattern SP1E in a plane.

[0122] The bridging portion BP can be located on a layer different from the layer on which the line portion LP is located. The bridging portion BP connects the line portions LP spaced apart from each other. The bridging portion BP is connected to the line portion LP through a set or predetermined contact hole CN_L.

[0123] The bridging portion BP overlaps the trench line SL1_T in a plane. The bridging portion BP is located on a layer different from the layer where the trench line SL1_T is located. The bridging portion BP can cross the fourth part P4 and the fifth part P5 so as to be insulated from each of the fourth part P4 and the fifth part P5.

[0124] The bridging portion BP has a relatively lower electrical conductivity than that of the line portion LP (e.g., electrical conductivity). The bridging portion BP has a relatively lower electrical conductivity than that of the trench line SL1_T (e.g., electrical conductivity). For example, the bridging portion BP can include a transparent conductive oxide. In some embodiments, each of the line portions LP can include a first layer and a second layer located on the first layer, the first layer including a metal, and the second layer including the same material as the bridging portion BP. In some embodiments, in a cross-sectional view, the second layer can contact or directly contact the first layer.

[0125] Reference Figure 7A , the bridging portion BP is located between the display unit 210 and the first layer L1. The line portion LP is located between the first layer L1 and the second layer L2. The line portions LP can be located on the same layer as the fifth part P5 and can be spaced apart from each other in a plane. The contact hole CN_L can pass through the first layer L1 to connect the line portion LP to the bridging portion BP. Therefore, the occurrence of electrical short circuits between the connection line BL and the trench line SL1_T can be prevented or reduced.

[0126] Reference Figure 7B, the trench line SL1_T can be located on a layer different from the layer where the bridging portion BP is located, and can be connected to the first sensing pattern SP1E through a contact hole CN_S penetrating the first layer L1. The bridging portion BP can be located on the same layer as the first sensing pattern SP1E. When the bridging portion BP includes the same (e.g., substantially the same) material as the first sensing pattern SP1E, the bridging portion BP can be formed by the same (e.g., substantially the same) process as the first sensing pattern SP1E, and thus, the manufacturing process can be simplified. However, the present disclosure is not limited thereto. For example, the bridging portion BP can include a material different from the material of the first sensing pattern SP1E, but the present disclosure is not limited thereto.

[0127] According to an embodiment of the present disclosure, the trench line SL1_T and the bridging portion BP can be designed such that the trench line SL1_T located at the relatively higher side and having high conductivity (e.g., low resistivity, low resistance, or low sheet resistance) has a larger surface area than the surface area of the bridging portion BP located at the relatively lower side and having low conductivity (e.g., low conductivity), to prevent or reduce damage to the connection line BL due to the introduction of static electricity. Since the third portion P3, the fourth portion P4, and the fifth portion P5 of the trench line SL1_T (each of which has a relatively large surface area) include the same (e.g., substantially the same) material as the first portion P1 and the second portion P2, and the material includes a metal having high conductivity (e.g., high conductivity), the static electricity introduced through the trench line SL1_T can be stably dispersed through the wide (e.g., large) area of the trench line SL1_T. Therefore, the introduction of static electricity into the bridging portion BP having a relatively small surface area can be prevented or reduced, and the occurrence of a short circuit between the trench line SL1_T and the connection line BL due to the introduction of static electricity can be prevented or reduced, to improve the electrical reliability of the sensing unit 220.

[0128] The width WD_L of the connection line BL in the second direction DR2 (e.g., the width WD_L of the line portion LP of the connection line BL in the second direction DR2) (hereinafter referred to as the width WD_L of the line portion LP) and the width WD_S of the trench line SL1_T in the first direction DR1 (e.g., the width WD_S of the fourth portion P4 or the fifth portion P5 of the trench line SL1_T in the first direction DR1) (hereinafter referred to as the width WD_S of the fourth portion P4 or the fifth portion P5) can be designed to (e.g., can have) various suitable values. Each of the width WD_L of the line portion LP and the width WD_S of the fourth portion P4 or the fifth portion P5 can be greater than the width of the first portion P1 of the trench line SL1_T or the width of the normal line SL1_N. According to an embodiment of the present disclosure, as the difference between the width WD_L of the line portion LP and the width WD_S of the fourth portion P4 or the fifth portion P5 decreases, damage caused by the introduction of static electricity and electrical short - circuit occurring in the cross - region between the trench line SL1_T and the connection line BL can be prevented or reduced, so as to improve electrical reliability.

[0129] The sensing unit 220 according to an embodiment of the present disclosure may include a dummy line DML. The dummy line DML may be located between the first sensing pattern SP1E and the connection line BL, between the connection line BL and the trench line SL1_T, between the trench line SL1_T and the normal line SL1_N, and / or between the connection line BL and the normal line SL1_N. The dummy line DML may be located on the same layer as the trench line SL1_T and the line portion LP.

[0130] The dummy line DML may be designed to have a floating pattern to which no separate electrical signal is applied or the floating pattern may receive a ground voltage. The dummy line DML may prevent or reduce electrical interference between adjacent conductive patterns to which different signals are applied. In some embodiments, the light reflection ratio in the space between the conductive patterns (e.g., the first sensing pattern SP1E, the connection line BL, the trench line SL1_T, and the normal line SL1_N) can be made substantially the same as the light reflection ratio in the region where the conductive patterns are located by the dummy line DML. For example, in some embodiments, the light reflection ratio in the region corresponding to the conductive patterns can be substantially the same as the light reflection ratio in the region corresponding to the dummy line DML between the conductive patterns. Therefore, the limitation of the visibility of the conductive patterns caused by the reflection of external light can be improved.

[0131] As Figure 8A shown, in the sensing unit 220 according to an embodiment of the present disclosure, the connection line BL - 1 may include a bridging portion BP and a plurality of line portions LPa and LPb. The bridging portion BP may correspond to Figure 7A the bridging portion BP.

[0132] The line portions LPa and LPb may have different structures from each other. The first line portion LPa of the line portions LPa and LPb may correspond to Figure 7A the line portion LP. The second line portion LPb of the line portions LPa and LPb may include a first pattern LP1 and a second pattern LP2 located on different layers from each other.

[0133] The first pattern LP1 is located on the same layer as the bridging portion BP. The second pattern LP2 is located on the first pattern LP1. The second pattern LP2 may contact (e.g., directly or physically contact) the first pattern LP1. In some embodiments, a portion aa1 of the second pattern LP2 may be located on the first layer L1 so as to be spaced apart from the first pattern LP1, and another portion aa2 of the second pattern LP2 may pass through the first layer L1 to contact (e.g., directly or physically contact) the first pattern LP1. The contact surface CNT may correspond to the front surface (e.g., top surface) of the first pattern LP1.

[0134] As Figure 8B shown, the sensing unit 220 according to an embodiment of the present disclosure may include a lower pattern P51. The lower pattern P51 may overlap with a third portion P3 of the trench line SL1_T in a plane and contact (e.g., directly or physically contact) the third portion P3. The third portion P3 passes through the first layer L1 to contact (e.g., directly or physically contact) the lower pattern P51. The contact area between the third portion P3 and the lower pattern P51 may be about 1 / 2 or more of the planar area of the lower pattern P51.

[0135] According to an embodiment of the present disclosure, at least a part of the connection line BL-1 or at least a part of the trench line SL1_T may be designed to have a structure in which a plurality of conductive patterns are in direct contact (e.g., physical contact) with each other and are laminated (e.g., and then laminated) to reduce the resistance of the connection line BL-1 or the trench line SL1_T. In some embodiments, even if damage occurs to the connection line BL-1 and the trench line SL1_T, the transmission of an electrical signal may be maintained through the first pattern LP1 and the lower pattern P51 at the lower side to improve the reliability of the sensing unit 220.

[0136] Figure 9 is an enlarged plan view showing a part of a sensing unit according to an embodiment of the present disclosure. Figure 10A and Figure 10B are enlarged plan views showing a part of each of the sensing units according to an embodiment of the present disclosure. For ease of description, Figures 9 to 10B shows the region corresponding to Figure 4 the region YY'. Hereinafter, some embodiments of the present disclosure will be described with reference to Figures 9 to 10B the same reference numerals may be given to thoseFigures 1 to 8B components identical to those of, and the repetitive description thereof will not be repeated herein.

[0137] As Figure 9 shown, in the sensing unit 220 according to an embodiment of the present disclosure, the connection line BL-2 may include a bridging portion BP-2 having various suitable dimensions. The bridging portion BP-2 may have an area overlapping at least a part of the dummy line DML and at least a part of the line portion LP. Since the bridging portion BP-2 increases the surface area through the connection line BL-2, the static electricity introduced into the bridging portion BP-2 can be easily dispersed. For example, since the width of the bridging portion BP-2 of the connection line BL-2 is greater than the width of the line portion LP of the connection line BL-2, the static electricity introduced into the bridging portion BP-2 can be easily dispersed.

[0138] Some (e.g., most) of the static electricity introduced into the bridging portion BP-2 can be dispersed to the front surface of the connection line BL-2 through the line portion LP. However, the static electricity partially remaining in the bridging portion BP-2 can be dispersed to the edge of the bridging portion BP-2. Since the bridging portion BP-2 is designed such that the bridging portion BP-2 has an area larger than the crossing area between the trench line SL1_T and the connection line BL-2, damage to the conductive pattern due to static electricity in the crossing area between the trench line SL1_T and the connection line BL-2 can be easily prevented or reduced. For example, in some embodiments, the crossing area between the trench line SL1_T and the connection line BL-2 may be an area corresponding to the portion of the trench line SL1_T overlapping with the bridging portion BP-2, or an area corresponding to the portion of the trench line SL1_T located between the two portions of the line portion LP of the connection line BL-2 connected by the bridging portion BP-2.

[0139] In some embodiments, as Figure 10A and Figure 10B shown, the sensing unit 220 according to an embodiment of the present disclosure may include an electrostatic induction pattern PP. The electrostatic induction pattern PP may be connected to the bridging portion BP-2 through a contact portion CN1, as Figure 10A shown, or may be connected to the first sensing pattern SP1E through a contact portion CN2, as Figure 10B shown. The electrostatic induction pattern PP is located on a layer different from the layer where the bridging portion BP-2 or the first sensing pattern SP1E is located.

[0140] In some embodiments, the static induction pattern PP may include a metal having high conductivity (e.g., high electrical conductivity). The static induction pattern PP may be spaced apart from the dummy line DML and / or the line portion LP of the connection line BL-2 on a plane. When the static induction pattern PP includes (e.g., is) the same (e.g., substantially the same) material as the dummy line DML and / or the line portion LP, the static induction pattern PP may be formed at the same (e.g., substantially the same) time as when the dummy line DML and the line portion LP are formed. Thus, the process (e.g., manufacturing process) can be simplified, and the process cost can be reduced.

[0141] The static induction pattern PP may be a path into which the static electricity introduced into the bridging portion BP-2 or the first sensing pattern SP1E is dispersed. The movement path of the static electricity introduced into the bridging portion BP-2 or the first sensing pattern SP1E (e.g., the path along which the static electricity can move) may be limited to the static induction pattern PP to easily control the dispersion of the static electricity. In addition, the static induction pattern PP may be located at a position spaced apart from the crossing region between the trench line SL1_T and the connection line BL-2 to prevent or reduce damage to the crossing region between the trench line SL1_T and the connection line BL-2 even if the static induction pattern PP is damaged by static electricity, thereby improving the electrical reliability of the detection unit.

[0142] Figure 11A is an exploded perspective view of an electronic device according to an embodiment of the present disclosure. Figure 11B is a plan view showing Figure 11A a part of the components of the electronic device. Hereinafter, some embodiments of the present disclosure will be described with reference to Figure 11A and Figure 11B The same reference numerals may be given to the same components as those of Figures 1 to 10B and their repeated descriptions will not be repeated here.

[0143] As Figure 11A shown, the electronic device EA_N may include a window 100_N, an electronic panel 200_N, an electronic module 300_N, and a housing 400_N. The front surface FS of the window 100_N includes a border region BZA_N and a transmissive region TA_N.

[0144] The electronic panel 200_N may include a notch portion NT instead of the trench portion TRH of the electronic panel 200 (see Figure 2 ). The notch portion NT may have a width that is larger than the width of the trench portion TRH in the second direction DR2.

[0145] The front surface of the electronic panel 200_N includes an active area AA_N and a peripheral area NAA_N. The notch portion NT may have a shape that recesses through the electronic panel 200_N and along one edge of the electronic panel 200_N in the direction of the active area AA_N (e.g., in the first direction DR1 in the present embodiment). For example, in some embodiments, a part of one side of the active area AA_N and a part of the side where the notch portion NT of the electronic panel 200_N is located may be recessed from the said side of the active area AA_N and the said side of the electronic panel 200_N, respectively.

[0146] In a plane, the electronic module 300_N may be located at a position overlapping with the area opened by the notch portion NT of the electronic panel 200_N. The electronic module 300_N may be inserted into the notch portion NT when the electronic panel 200_N is not between the electronic module 300_N and the window 100_N (e.g., the electronic panel 200_N is not between the electronic module 300_N and the window 100_N), and may be adjacent to the window 100_N. Therefore, an electronic device EA_N with a thin thickness can be formed, and an increase in the bezel area BZA_N can be prevented or reduced.

[0147] The housing 400_N may correspond to Figure 2 the housing 400, and thus, its repeated description will not be repeated here.

[0148] Figure 11B The electronic panel 200_N is shown, and for ease of description, the area corresponding to Figure 4 is shown. As Figure 11B shown, in the sensing unit 220, the first sensing electrode SE1 may include a plurality of first column electrodes SE1_A and a plurality of second column electrodes SE1_B that overlap the notch portion NT in the second direction DR2. For example, each of the second column electrodes SE1_B may extend along a line intersecting the notch portion NT in the second direction DR2. The first column electrodes SE1_A may be electrodes that do not overlap the notch portion NT in the second direction DR2. For example, each of the first column electrodes SE1_A may extend along a line that does not intersect the notch portion NT in the second direction DR2. Each of the second column electrodes SE1_B may have a length smaller than that of each of the first column electrodes SE1_A in the second direction DR2.

[0149] The second column electrode SE1_B according to an embodiment of the present disclosure may correspond to Figure 4 the second column electrode SE1_B. The second column electrode SE1_B may include first sensing patterns SP1E1, SP1E2, and SP1E3 that face the notch portion NT and are closest to the notch portion NT.

[0150] The second sensing electrode SE2 may include a second row of electrodes SE2_B and a plurality of first row of electrodes SE2_A. In some embodiments, the second row of electrodes SE2_B may be provided in a single number (e.g., may include a single second row of electrodes SE2_B). The second row of electrodes SE2_B may substantially correspond to Figure 4 the second row of electrodes SE2_B of

[0151] The first sensing line SL1 may include a plurality of trench lines LLa, LLb, and LLc. The trench lines LLa, LLb, and LLc may be respectively connected to the second column of electrodes SE1_B adjacent to the notch portion NT. The trench lines LLa, LLb, and LLc are respectively connected to the first sensing patterns SP1E1, SP1E2, and SP1E3 facing the notch portion NT.

[0152] The connection line BL-NT connects two second sensing patterns SP2E1 and SP2E2 of the second row of electrodes SE2_B spaced apart from each other through the notch portion NT. The connection line BL-NT may overlap the trench lines LLa, LLb, and LLc in a plane. The connection line BL-NT may cross the trench lines LLa, LLb, and LLc so as to be insulated from the trench lines LLa, LLb, and LLc. Therefore, the connection line BL-NT and the trench lines LLa, LLb, and LLc may transmit independent electrical signals to the area adjacent to the notch portion NT.

[0153] According to an embodiment of the present disclosure, each of the trench lines LLa, LLb, and LLc may include a metal having high conductivity (e.g., high electrical conductivity), and a portion of the connection line BL-NT overlapping the trench lines LLa, LLb, and LLc may include a material having relatively low conductivity (e.g., relatively low electrical conductivity). Therefore, damage to the trench lines LLa, LLb, and LLc or to the connection line BL-NT due to static electricity introduced through the trench lines LLa, LLb, and LLc can be prevented or reduced. Therefore, the electrical reliability of the electronic panel 200_N in the area adjacent to the notch portion NT can be improved.

[0154] According to an embodiment of the present disclosure, static electricity sensed by an electronic device (e.g., introduced into the electronic device) may be dispersed through a wide area to prevent or reduce damage to a conductive pattern or an electrical short circuit of the conductive pattern due to the appearance of static electricity in a narrow area. According to an embodiment of the present disclosure, damage to a sensing unit designed in various appropriate shapes can be prevented or reduced to improve the electrical reliability of the electronic device.

[0155] It will be apparent to those skilled in the art that various modifications and variations can be made to the subject matter of the present disclosure. Accordingly, the present disclosure is intended to cover modifications and variations of the disclosed subject matter, provided they are within the scope of the appended claims and their equivalents.

[0156] Therefore, the actual scope of protection of the present disclosure will be determined by the appended claims and their equivalent technical scope.

Claims

1. An electronic device, comprising: a base substrate; a plurality of first sensing electrodes located on the base substrate; a plurality of second sensing electrodes spaced apart from the first sensing electrodes; a plurality of first sensing lines respectively connected to ends of the first sensing electrodes; a plurality of second sensing lines respectively connected to ends of the second sensing electrodes and spaced apart from the first sensing lines; and a connection line for connecting two second sensing patterns spaced apart from each other in a second sensing pattern of one of the second sensing electrodes to each other, wherein each of the first sensing lines includes a trench line that is connected to one of the first sensing electrodes and crosses the connection line to be insulated from the connection line, and wherein the connection line includes: a plurality of line portions located on the same layer as the trench line, and spaced apart from each other in a plane with the trench line located between the plurality of line portions; and a bridging portion located on a layer different from the layer where the line portions are located, and overlapping the trench line in the plane, the bridging portion connecting the line portions to each other, wherein the bridging portion has a lower conductivity than the trench line.

2. The electronic device according to claim 1, wherein, The trench line is located on the bridging portion in a cross-section.

3. The electronic device according to claim 2, wherein, Each of the line portions includes a metal, and the bridging portion includes a transparent conductive oxide.

4. The electronic device according to claim 3, wherein, Each of the line portions includes: a first layer including the metal; and a second layer located on the first layer and including the same material as the bridging portion, wherein the first layer and the second layer are in contact with each other in the cross-section.

5. The electronic device according to claim 1, wherein, The trench line includes: a first portion extending in a first direction and spaced apart from the first sensing electrode in a second direction crossing the first direction; a second portion extending from the first portion in the second direction and connected to the first sensing electrode; and a third portion spaced apart from the first portion with the second portion located between the first portion and the third portion to extend from the second portion, wherein the bridging portion extends in the first direction.

6. The electronic device according to claim 5, wherein, The width of the second portion in the first direction is the same as the width of each of the line portions in the second direction.

7. The electronic device according to claim 5, further comprising at least one metal pattern located between the first portion and the first sensing electrode, Among them, the metal pattern being located on the same layer as the trench line and including the same material as the trench line.

8. The electronic device according to claim 1, further comprising an electrostatic induction pattern that overlaps the bridging portion in the plane and includes the same material as the line portions.

9. The electronic device according to claim 8, wherein, The electrostatic induction pattern is connected to the bridging portion.

10. The electronic device according to claim 8, wherein, The electrostatic induction pattern is connected to the first sensing electrode.

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