Holder, carrier comprising at least two holders, device and method

Abstract

A holder (120) is provided, the holder (120) being configured to be attached to a carrier body (160) of a carrier for holding a substrate (101). The holder (120) comprises a fixed portion (122) configured to be attached to the carrier body (160); and a floating portion (123) configured to be movable along a direction relative to the fixed portion (122) and comprising a groove (126) configured to receive at least a portion of the substrate (101).

Description

Technical Field

[0001] Embodiments of the present disclosure relate to holders configured to be attached to a carrier body of a carrier for holding a substrate; two carriers comprising at least two holders; and two methods of processing a substrate held in a carrier, in particular for substrate processing, such as for layer deposition; and two methods of unloading a substrate from a carrier; and two apparatuses for depositing a layer on a large-area glass substrate. Embodiments of the present disclosure relate in particular to holders and carriers for supporting large-area substrates having a thin thickness in a substrate processing machine, and apparatuses for processing large-area substrates. Background Art

[0002] Several methods are known for depositing materials on substrates. For example, the substrate can be coated by a physical vapor deposition (PVD) process, a chemical vapor deposition (CVD) process, a plasma enhanced chemical vapor deposition (PECVD) process, etc. Typically, the process is performed in a processing device or a processing chamber where the substrate to be coated is located. The deposition material is provided in the device. A variety of materials, including oxides, nitrides or carbides thereof, can be used for deposition on the substrate. In addition, other processing actions such as etching, structuring, annealing or similar processes can be performed in the processing chamber.

[0003] The coated material can be used in a variety of applications and in a variety of technical fields. For example, applications belong to the field of microelectronics, such as the production of semiconductor devices. Moreover, substrates for displays are usually coated by PVD processes. Further applications include insulating panels, organic light emitting diode (OEED) panels, substrates with TFTs, color filters or similar devices.

[0004] Especially for fields such as display production, thin film solar cell manufacturing and similar applications, large area glass substrates are processed. The substrate size has been increasing in the past and is still increasing. The increasing size of glass substrates makes it increasingly challenging to handle, support and process the glass substrates without sacrificing production throughput due to glass breakage.

[0005] Typically, a glass substrate may be supported on a carrier during its processing. The carrier drives the glass or substrate through the processing machine. The carrier typically forms a frame or plate that supports the surface of the substrate along its periphery or, in the latter case, supports the surface as it is. In particular, a frame-shaped carrier may also be used to shield a glass substrate, wherein an opening in the carrier surrounded by the frame provides an opening for coating the material to be deposited on the exposed substrate portion or for other processing actions acting on the substrate portion exposed by the opening.

[0006] The trend towards larger and thinner substrates can lead to substrate bulging, particularly due to stresses applied to the substrate during layer deposition, where bulging can in turn cause problems due to an increased likelihood of cracking. Furthermore, bulging can reduce the quality, such as uniformity, of the deposited material layer. Therefore, there is a need to reduce bulging and enable carriers to transport larger and thinner substrates without breaking the substrate, and to improve the quality of the coated material layer.

[0007] In view of the foregoing, a carrier is provided, particularly a carrier having at least two retainers, which overcomes at least some of the problems in the art, and advantageously provides a retainer for a carrier. Summary of the invention

[0008] In view of the above, a holder according to an embodiment described herein is provided, the holder being configured to be attached to a carrier body of a carrier. According to another embodiment, a carrier according to an embodiment described herein is provided. According to another embodiment, a method of processing a substrate held in a carrier according to an embodiment described herein is provided. According to another embodiment, a method of unloading a substrate from a carrier according to an embodiment described herein is provided. According to another embodiment, an apparatus for depositing a layer on a large area glass substrate according to an embodiment described herein is provided. Further aspects, advantages and features are apparent from the dependent claims, the description and the drawings.

[0009] According to one aspect, a holder is provided, the holder being configured to be attached to a carrier body of a carrier for holding a substrate. The holder includes a fixed portion configured to be attached to the carrier body; and a floating portion configured to be movable in one direction relative to the fixed portion and including a groove configured to receive at least a portion of the substrate.

[0010] According to one aspect, a carrier is provided that includes at least two holders, each of which includes a fixed portion configured to be attached to a carrier body, and a floating portion configured to be movable in one direction relative to the fixed portion and including a groove configured to receive at least a portion of the substrate.

[0011] According to one aspect, a method of processing a substrate held in a carrier having a carrier body to which at least one holder is attached is provided. The method includes: loading the substrate onto the carrier; processing the substrate at an elevated temperature; and moving a floating portion of at least one holder by thermal expansion caused by processing at the elevated temperature.

[0012] According to one aspect, a method of unloading a substrate from a carrier having a carrier body to which at least one holder is attached is provided. The method includes moving the carrier from a substantially vertical orientation to a substantially horizontal orientation; unloading the substrate from the carrier, and moving a floating portion of at least one holder to a central position.

[0013] According to one aspect, there is provided an apparatus for depositing a layer on a large area glass substrate. The apparatus comprises a vacuum chamber adapted to deposit the layer therein; a conveying system adapted to convey a carrier. The carrier comprises at least two holders. Each of the at least two holders comprises: a fixed portion configured to be attached to a carrier body; and a floating portion configured to be movable in one direction relative to the fixed portion; and a groove configured to receive at least a portion of the substrate. The apparatus also comprises a deposition source for depositing a material forming the layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The above briefly summarizes the manner in which the above-described features of the present disclosure can be understood in detail, as well as a more specific description of the present disclosure, which can be obtained by referring to the embodiments. The accompanying drawings relate to the embodiments of the present disclosure and are described below:

[0015] Figure 1A , Figure 1B , Figure 1C and Figure 1D Carriers according to embodiments described herein are shown, each carrier having a holder and each carrier having a substrate arranged in a substrate region of the carrier;

[0016] FIG. 2A to FIG. 2E shows an example of a holder that may be attached to a carrier according to embodiments described herein;

[0017] Figure 3 A view showing an apparatus for depositing a material layer on a substrate using a carrier according to an embodiment described herein;

[0018] Figure 4 A flow chart showing a method of processing a substrate held in a carrier according to embodiments described herein; and

[0019] Figure 5 A flow chart of a method of unloading a substrate from a carrier according to embodiments described herein is shown. DETAILED DESCRIPTION

[0020] Reference will now be made in detail to various embodiments of the present disclosure, one or more examples of which are shown in the accompanying drawings. In the following description of the drawings, the same reference numerals represent the same parts. Differences with respect to various embodiments are described. Each example is provided by way of explanation of the present disclosure and is not meant to be a limitation of the present disclosure. In addition, features shown or described as part of one embodiment may be used on other embodiments or used in combination with other embodiments to produce another embodiment. This specification is intended to include such modifications and variations.

[0021] According to embodiments described herein, a carrier may be provided comprising at least two retainers. The at least two retainers may be configured to reduce bending or bulging of the substrate caused by stress, in particular stress introduced by depositing a layer on the substrate, or by thermal expansion of the substrate or the carrier, or by the weight of the substrate. The retainer may provide a two-part body having a fixed part and a movable or floating part.

[0022] In addition, in the following description, a carrier or substrate carrier may be understood as a carrier capable of supporting a substrate. In particular, the carrier mentioned herein may be understood as a carrier having a frame shape or including a frame. In some examples, the carrier may also be referred to as a carrier frame. According to some examples, the substrate carrier may include a fixing element for holding the substrate. The fixing element mentioned herein may be understood as a fixing element for providing contact with the substrate. In particular, the fixing element mentioned herein may be understood as a fixing element for providing contact with more than one surface of the substrate. In some examples, the substrate carrier is suitable for moving through a processing chamber or a processing device, such as by including a moving device that allows the substrate carrier to be transferred through the processing chamber, a connecting device for connecting the substrate carrier to a conveying system in the processing chamber, a sliding surface, a roller or the like, the moving device such as a guide rail.

[0023] According to embodiments described herein, a carrier may include at least two retainers. The at least two retainers may be distributed around the periphery of the substrate to effectively avoid or reduce bending or bulging of the substrate. Each retainer may include a fixed portion, which may be configured to be attached to a carrier body, the fixed portion specifically having a fixed position relative to the carrier body; and a floating portion, which may be movable relative to the fixed portion along at least one direction. The floating portion may include a groove, the groove being configured to receive at least a portion of the substrate. The relative movement of the floating portion relative to the fixed portion may provide an aspect that is considered to reduce the bending of the substrate. In addition, a force arrangement may be provided, such as at least one spring or at least one cylinder, or a similar arrangement, and the force arrangement may be configured to pull or push the substrate in the carrier along at least one direction. The substrate may experience thermal expansion during processing. The floating portion may be moved by an increase in length caused by thermal expansion. Therefore, stress in the substrate may be reduced.

[0024] According to embodiments that can be combined with other embodiments described herein, the substrate thickness can be 0.1 mm to 1.8 mm, and the holder can be adapted to such substrate thicknesses. It can be particularly advantageous if the substrate thickness is about 0.9 mm or less, such as 0.7 mm, 0.5 mm or 0.3 mm, and the holder is adapted to such substrate thicknesses.

[0025] According to some embodiments, the size of the large area substrate may be at least 0.174 m 2 Typically, the size may be about 1.4 m 2 About 8m 2 , more typically about 2m 2 About 9m 2 , or even up to 12m 2 Typically, the rectangular substrate for which the mask structures, apparatus and methods according to the embodiments described herein are provided is a large area substrate as described herein. For example, the large area substrate may be GEN 5, which corresponds to about 1.4 m 2 substrate (1.1m×1.3m); GEN 7.5, which corresponds to about 4.39m 2 substrate (1.95m×2.25m); GEN 8.5, which corresponds to about 5.5m 2 of substrate (2.2m x 2.5m); or even GEN 10, which corresponds to about 8.7m 2 Even larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can be similarly realized. Embodiments of the present disclosure are particularly advantageous with a substrate thickness of about 0.3 mm and a large-area substrate of GEN8.5.

[0026] Figure 1A A carrier 100 is shown. The carrier 100 can be configured to support a large-area thin substrate 101. Figure 1A As shown, the substrate 101 can be disposed in a certain position within the carrier 100, particularly when being processed in a processing chamber. The carrier 100 may include a frame or carrier body 160 defining a window or aperture. Depending on the implementation, the frame may provide a substrate receiving surface. Specifically, the substrate receiving surface may be configured to contact a peripheral portion of the substrate during operation, i.e., contact with it when loading the substrate.

[0027] The substrate 101 can be made of any material suitable for material deposition. For example, the substrate can be made of a material selected from the group consisting of glass (e.g., soda-lime glass, borosilicate glass, etc.), metal, polymer, ceramic, composite material, or any other material or combination of materials that can be coated by a deposition process. The ridges that may also affect substrate processing can be reduced by a carrier according to the embodiments described herein. Especially for glass substrates or ceramic substrates, cracking is another problem, and the carrier can also significantly reduce substrate cracking, which reduces the productivity of the production process due to increased losses.

[0028] According to some embodiments, the frame 160 can be made of aluminum, aluminum alloy, titanium, their alloys, stainless steel or similar materials. For relatively small large-area substrates, such as GEN 5 or lower generations, the frame 160 can be manufactured by a single piece, that is, the frame can be formed integrally. In addition, according to some embodiments that can be combined with other embodiments described herein, the frame 160 can include two or more elements, such as a top bar, a side bar and / or a bottom bar. Especially for very large-area substrates, the carrier or carrier body can be manufactured to have multiple parts. These parts of the carrier body can be assembled to provide a frame 160 for supporting the substrate 101. The frame 160 can be particularly constructed to receive the substrate 101 in the substrate area.

[0029] Figure 1A The illustrated carrier 100 may further include a retainer. Figure 1A In the example shown, two holders 120 are provided at the bottom side of a frame or carrier body 160. According to some embodiments, the floating parts of the two holders 120 at the bottom side of the frame 160 can move relative to the fixed position in a direction, wherein the direction can be parallel to the edge of the substrate, as shown by the arrows. According to some embodiments, the two holders can also be arranged in the middle of the left and right sides of the carrier. According to some embodiments, the movement direction of the floating part 123 relative to the fixed part 122 can also be alternatively or additionally perpendicular to the edge of the substrate and / or in a plane substantially parallel to the substrate 101.

[0030] For example, one retainer 120 may be provided at the left side of the bottom side, and one retainer 120 may be provided at the right side of the bottom side. Figure 1A 1 shows two retainers 120 at the bottom side of the frame 160, but the present application is not limited thereto. More than two retainers 120 may be provided at the bottom side of the frame 160. Figure 1B As described in more detail, more than one holder 120 may be provided on one or more sides of the substrate 101. Furthermore, in addition to the at least two holders, other holding arrangements may be provided, for example between the at least two holders 120.

[0031] Figure 1A The carrier 100 shown provides a floating portion of the two holders, which can move along the first direction. The expansion or other movement of the substrate can be compensated by one or more of the holders having a floating portion, which can move relative to the fixed portion, for example, in a plane substantially parallel to the surface of the carrier and / or the substrate. The position of the substrate 101 in the substrate area defined by the frame 160 can be accurately adjusted and centered. In addition, the floating portion can follow the dimensional changes caused by the thermal expansion of the substrate. Therefore, the stress of the substrate or the movement of the substrate relative to the holder can be reduced. The holder according to the embodiment described herein enables the substrate to expand at the corresponding side and / or expand to the bottom. According to some embodiments that can be combined with other embodiments described herein, the carrier described herein and the equipment using the carrier described herein are for vertical substrate processing. According to embodiments that can be combined with embodiments described herein, the holder 120 can be configured to be attached to the substrate in a substantially vertical orientation.

[0032] The term "vertical direction" or "vertical orientation" may be understood to be distinguished from a "horizontal direction" or "horizontal orientation". That is, a "vertical direction" or "vertical orientation" may relate to a substantially vertical orientation, such as a substantially vertical orientation of a carrier and a substrate, wherein a deviation of a few degrees (e.g. up to + / -10° or even up to + / -15°) from the exact vertical direction or vertical orientation may still be regarded as a "substantially vertical direction" or "substantially vertical orientation". The vertical direction may be substantially parallel to gravity.

[0033] According to embodiments that can be combined with other embodiments described herein, in particular when referring to substrate orientation, substantially vertical can be understood as allowing deviations from the vertical direction of + / -20° or less, such as + / -10° or less. For example, such deviations can be provided because a substrate support with a certain deviation from the vertical orientation can lead to a more stable substrate positioning. However, the substrate orientation during the deposition of materials, in particular the deposition of metals and / or oxides, can be considered to be substantially vertical, which can be considered to be different from a horizontal substrate orientation.

[0034] The term "substantially vertical" may relate, for example, to a substantially vertical orientation of the rotation axis and the support surface or substrate surface, wherein deviations from a precise vertical orientation of a few degrees, for example up to + / - 10° or even up to + / - 15°, may still be considered "substantially vertical".

[0035] According to the embodiments described herein, and as described with respect to FIG. 2A to FIG. 2C In more detail, the holder can allow relative movement in at least one direction to reduce the bending of the substrate in its peripheral area. In addition, the holder can provide a holding force or a supporting force for stably supporting the substrate in the carrier. The relative movement of the holder can be provided by the relative movement of the floating part relative to the fixed part. When practicing the embodiments, a beneficial stress reduction with respect to the bending or bulging of the substrate can be provided.

[0036] Figure 1B Another example of a carrier 100 according to some embodiments is shown. Figure 1B The implementation shown in is similar to Figure 1A The embodiment shown. Figure 1B The carrier 100 may include two retainers 120, each of which may be positioned at a corner of the bottom side of the carrier or carrier body. Alternatively, two retainers or additional retainers may also be provided in the middle of each side of the carrier or carrier body. Additionally or alternatively, retainers may be provided only at specific sides of the carrier or carrier body, such as at its bottom side and / or left side.

[0037] Figure 1BAdditional retaining arrangements 140, 145, 170 are shown. Retaining arrangements 140, 145, 170 may be similar to retainer 120, but may not include floating portion 123. For example, retaining arrangement 140 may be arranged on the right side of a carrier or carrier body. Retaining arrangement 140 may move in a direction perpendicular to the right side of the carrier or carrier body. That is, retaining arrangement 140 may move away from the right side of the carrier or carrier body and / or move to the right side of the carrier or carrier body. Additionally or alternatively, retaining arrangement 145 may be provided on the left side of the carrier or carrier body. Retaining arrangement 145 may be fixed relative to the left side of the carrier or carrier body. Additionally or alternatively, retaining arrangement 170 may be arranged on the top side or upper portion of the carrier or carrier body. Retaining arrangement 170 may move in a direction perpendicular to the top side of the carrier or carrier body. That is, the holding arrangement 140 may be movable away from and / or to the top side of the carrier or carrier body.

[0038] According to an embodiment, which can be combined with other embodiments described herein, at least one holder is provided on at least two sides of the frame 160, such as the bottom side and the left side, and optionally even on each side of the frame 160. Furthermore, the holding arrangement 140, 145, 170 may be on at least one side of the frame.

[0039] According to other embodiments that can be implemented additionally or alternatively, the positions at which the retainers can be fixed to the substrate are distributed around the periphery of the substrate, for example evenly distributed at one or more sides. For example, retainers can be arranged at one or more sides of the substrate around the edge of the substrate every 200mm to every 1000mm, such as every 300mm to 800mm. In addition, retainers can also be arranged in pairs.

[0040] Figure 1CAnother example of a carrier 100 is shown. According to embodiments that can be combined with other embodiments described herein, the carrier 100 may include a first holding arrangement 151 and / or a second holding arrangement 152 for holding the substrate 101 in the substrate area. The first holding arrangement 151 may be fixedly attached to the frame 160. Alternatively, the first holding arrangement 151 may be movable. One or more first holding arrangements 151 may be provided. The second holding arrangement 152 may be movable. Specifically, the first holding arrangement 151 and / or the second holding arrangement 152 may be movable perpendicular to the corresponding edge of the substrate 101, as shown by the arrows. According to embodiments that can be combined with embodiments described herein, at least one holding arrangement, such as the first holding arrangement 151 and / or the second holding arrangement 152, may be connected to one side of the carrier body 160. The at least one holding arrangement may be movable in a direction substantially perpendicular to the longitudinal extension of the side of the carrier body to which the holding arrangement is connected.

[0041] For example, the first holding arrangement 151 and the second holding arrangement 152 may include a clamp or a guide element. According to some embodiments, as Figure 1C The holding arrangements 151, 152 shown exemplarily in the drawings, for example at the sides or at the top, can be designed so that the positioning elements can help compensate for forces caused by bending or bulging of the substrate. In addition, the positioning elements can be suitable for avoiding free movement of the substrate 101, and / or be provided to hold more than 50% of the weight of the substrate in the substrate receiving surface of the frame 160 and / or compensate for thermal expansion. For example, the first holding arrangement 151 and the second holding arrangement 152 can be moved relative to the carrier or the carrier body, for example in at least one direction, in particular in two directions. In the context of the present application, the floating part and / or the positioning element such as the holder being movable in at least one direction can be understood as a bidirectional movement in one direction, for example a bidirectional movement from left to right, or vice versa.

[0042] The carrier 100 further comprises at least two holders 120, for example on the bottom side of the frame 160. Figure 1C Two retainers 120 for reducing substrate bending are shown in FIG. The number of retainers and corresponding fixing positions can be adjusted according to the embodiments described herein. According to the embodiment, two or more retainers 120 can be provided.

[0043] Figure 1D Another carrier 100 is shown. The carrier 100 may be configured to support large area substrates. Figure 1DThe carrier may include a first holding arrangement 151 for holding the substrate 101 in the substrate area and / or may be configured to provide a predetermined substrate position. The first holding arrangement 151 may be movably attached to the frame 160. According to some embodiments that may be combined with other embodiments described herein, one or more first holding arrangements 151 are provided. According to some embodiments that may be combined with other embodiments described herein, three first holding arrangements 151 may be provided. For example, two first holding arrangements may be provided at the top portion of the frame, and / or one first holding arrangement 151 may be provided at a side portion of the frame. The first holding arrangement may have a gap for substrate insertion or other elements for arranging the substrate on the first holding arrangement. The contact position may define a predetermined substrate position in the carrier. The first holding arrangement 151 may be movable. Specifically, the first holding arrangement 151 may be movable perpendicular to the corresponding edge of the substrate 101, as shown by the arrow. Additionally or alternatively, a second holding arrangement 145 may be provided on the left side of the carrier or the carrier body. The holding arrangement 145 may be fixed relative to the left side of the carrier or the carrier body.

[0044] According to embodiments described herein, the holding arrangements 140 , 145 , 151 , 152 , 170 may prevent the substrate 101 from falling out of the frame 160 and / or may follow the substrate edges during thermal expansion of the substrate and / or the carrier.

[0045] Figure 1D The illustrated carrier 100 may also include a holder 120, parts of which are movable relative to the periphery of the carrier frame or carrier body, ie, movable parallel to the surface of the substrate received in the carrier. FIG. 2A to FIG. 2C These holders are described in more detail.According to embodiments, which can be combined with other embodiments described herein, the holders may be arranged and / or distributed along the sides of the frame 160 , in particular at the bottom side of the frame 160 .

[0046] like Figure 2A , Figure 2B and Figure 2C As shown in , according to embodiments described herein, the holder 120 may include a fixed portion 122 and / or a floating portion 123. The fixed portion may have a fixed position relative to the carrier body 160. The floating portion 123 may move relative to the fixed portion 122 along one direction. The floating portion 123 may have a substantially flat or planar first surface for contacting the first surface 102 of the substrate 101.

[0047] According to embodiments that can be combined with other embodiments described herein, the floating part 123 can include a tilting member 127, which is configured to tilt the substrate 101, specifically the edge 104 of the substrate. In particular, the tilting member 127 can be configured to tilt relative to the fixed part and / or be configured to support a main surface of the substrate 101, such as the first surface 102. For example, the tilting member 127 can be arranged on the first surface of the floating part 123 to contact the substrate 101, specifically the first surface 102 of the substrate 101. For example, the tilting member 127 can be a ball bearing or any other kind of suitable bearing. When practicing the embodiments, the tilting of the substrate and / or the geometric tolerances of the substrate and / or the carrier can be compensated.

[0048] According to embodiments that can be combined with other embodiments described herein, the floating portion 123 can be moved in a direction from a first end position to a second end position. Additionally or alternatively, the floating portion 123 can further include a force arrangement 130. The force arrangement 130 can be configured to center the floating portion 123 relative to the fixed portion 122 in at least one direction.

[0049] The force arrangement 130 may be selected differently depending on the type of substrate (material, thickness, area size, etc.), the number of layers to be deposited on the substrate 101, the type of one or more materials to be deposited, the thickness of one or more layers to be deposited, the type of processing chamber, the processing time, etc. According to the embodiments described herein, the force arrangement 130 may be selected from the group consisting of: at least one spring or at least one cylinder.

[0050] In addition, the floating portion 123 may include a groove 126. The groove 126 may be configured to receive at least a portion of the substrate 101. Specifically, the groove 126 may be configured to contact the first surface 102 of the substrate 101, the second surface 103 of the substrate 101 opposite to the first surface 102, and / or the edge 104 of the substrate 101 spanning from the first surface 102 to the second surface 103.

[0051] like Figure 2DAs shown, the groove 126 may include a first surface 126a and / or a second surface 126b. When the substrate 101 is loaded into the groove 126, the first surface 126a of the groove 126 may face the first surface 102 of the substrate 101, and / or the second surface 126b of the groove 126 may face the second surface 103 of the substrate 101. That is, the first surface 126a of the groove 126 may be configured to face the first surface 102 of the substrate 101, and / or the second surface 126b of the groove 126 may be configured to face the second surface 103 of the substrate 101. In addition, the groove 126 may have a third surface 126c extending from the first surface 126a of the groove 126 to the second surface 126b of the groove 126. When the substrate 101 is loaded into the groove 126, the third surface 126c of the groove 126 may face the edge 104 of the substrate 101. That is, the third surface 126c of the groove 126 may be configured to face the edge 104 of the substrate 101. According to some embodiments, the first surface and the second surface of the groove 126 may be substantially parallel to each other.

[0052] During operation, i.e., when the substrate is carried by the carrier, the substrate 101 may be arranged between the first surface 126a and the second surface 126b of the groove 126. During operation, the substrate 101 may not contact the first surface 126a and / or the second surface 126b of the groove 126. An edge 104 of the substrate 101, such as a lateral side of the substrate 101, may contact the groove 126, specifically the third surface 126c of the groove 126.

[0053] In particular, during the vertical transfer of the substrate 101, the substrate 101 may stand on the holder 120, specifically in the groove 126, more specifically on the third surface 126c of the groove 126. During the process, the substrate 101 may be heated, resulting in thermal expansion. Depending on the friction between the substrate 101 and the holder 120, the substrate 101 may slide over the holder 120, or the floating portion 123 of the holder 120 may slide with the substrate 101. When the substrate 101 is unloaded, the force arrangement 130 may return the floating portion 123 to the initial position of the floating portion 123. When practicing the embodiment, cracking or degradation of the substrate may be prevented.

[0054] According to an embodiment that can be combined with other embodiments described herein, the movement direction of the floating portion 123 can be parallel to the first direction. According to an embodiment that can be combined with other embodiments described herein, the movement direction of the floating portion 123 can be substantially parallel to the substrate, in particular substantially parallel to the first surface 102 and / or the second surface 103 of the substrate 101 in a plane.

[0055] Although, for example, FIG. 2A to FIG. 2CAs shown in , the holder 120 includes a floating part that can move in one direction relative to the fixed part, but the present application is not limited thereto. The holder 120 may also include a floating part that can move in at least two directions relative to the fixed part.

[0056] Figure 2E The frame 160 is shown equipped with two holders 120 at the bottom side. Figure 2E The carrier shown further comprises a holding arrangement 140 on the right side, a holding arrangement 145 on the left side, and / or a holding arrangement 170 on the top side. Figure 2E Also shown are upper guide elements 162 and / or lower guide elements 164. The upper guide elements 162 and / or lower guide elements 164 may be configured to guide the frame 160. For example, the upper guide elements 162 may be magnetic guide elements, and / or the lower guide elements 164 may be mechanical guide elements, such as rods.

[0057] The holding arrangement 140 can be configured to open the loading aperture. That is, the holding arrangement 140 can be moved relative to the right side of the frame 160. In addition, the holding arrangement 140 can be configured to compensate for thermal expansion of the substrate 101 and / or the carrier. In addition, the holding arrangements 140, 145, 170 can be the same or similar to the corresponding holding arrangements 140, 145, 170 described herein.

[0058] Figure 3 A schematic diagram of a deposition chamber 600 according to an embodiment is shown. The deposition chamber 600 is suitable for a deposition process, such as a PVD or CVD process. The substrate 101 is shown as being located in or at a carrier on a substrate conveyor 620. A deposition material source 630 may be disposed in the chamber 612 facing the side of the substrate to be coated. The deposition material source 630 may provide a deposition material 635 to be deposited on the substrate.

[0059] exist Figure 3 In the embodiment of the present invention, the material source 630 can be a target with a deposition material thereon, or any other arrangement that allows the release of material to be deposited on the substrate 101. Typically, the material source 630 can be a rotatable target. According to some embodiments, the material source 630 can be movable in order to position and / or replace the source. According to other embodiments, the material source can be a planar target.

[0060] Depending on the embodiment, the deposition material 635 may be selected depending on the deposition process and subsequent application of the coated substrate. For example, the deposition material of the source may be a material selected from the group consisting of metals such as aluminum, molybdenum, titanium, copper, and similar materials, silicon, indium tin oxide, and other transparent conductive oxides. Typically, oxide, nitride, or carbide layers that may include such materials may be deposited by providing the material from the source or by reactive deposition, i.e., reacting the material from the source with an element such as oxygen, nitrogen, or carbon from a process gas.

[0061] Typically, substrate 101 may be disposed in or at carrier 100, which may also serve as an edge exclusion mask, in particular for non-stationary deposition processes. Dashed line 665 exemplarily shows the path of deposition material 635 during operation of chamber 600. According to further embodiments, which may be combined with other embodiments described herein, shielding may be provided by a separate edge exclusion mask disposed in chamber 612. Carriers according to embodiments described herein are beneficial for both stationary processes and for non-stationary processes.

[0062] According to embodiments that can be combined with other embodiments described herein, the fixing assembly can firmly hold the edge of the substrate, especially during the deposition process. Embodiments can provide reduced substrate breakage, especially in view of the fact that the length and height of substrates are becoming larger and larger, the thickness of the substrate can be reduced. Humps that may also affect substrate handling can be reduced by a carrier according to embodiments described herein.

[0063] Figure 4 A flow chart of a method for processing a substrate held in a carrier according to embodiments described herein is shown.

[0064] The method 200 for processing a substrate 101 held in a carrier can be performed using the holder 120 described herein. In block 210, the substrate 101 can be loaded on or in the carrier. During loading, the substrate 101 can be in a horizontal direction. The substrate 101 can then be rotated to a vertical or substantially vertical orientation for transfer and / or processing. In block 220, the substrate 101 can be processed at an elevated temperature. The temperature can be elevated for a variety of reasons, such as due to a heating process prior to processing and / or process energy during the process (e.g., during sputtering). An elevated temperature can be understood as a temperature above ambient temperature. The elevated temperature can cause the substrate to elongate due to thermal expansion. In block 230, the floating portion 123 of at least one holder 120 can be moved by thermal expansion caused by processing at high temperatures.

[0065] Figure 5A flow chart of a method for unloading a substrate from a carrier according to embodiments described herein is shown.

[0066] The method 300 of unloading the substrate 101 from the carrier can be performed using the holder 120 described herein. In addition, the method 300 can be performed after the method 200. In box 310, the carrier can be moved from a substantially vertical orientation to a substantially horizontal orientation. In box 320, the substrate 101 can be unloaded from the carrier. In box 330, the floating portion 123 of at least one holder 120 can be moved to a center position. For example, the floating portion 123 can be moved out of the center position during processing at high temperature and may not have returned to the center position. Therefore, after the substrate 101 is unloaded from the holder 120, the floating portion 123 can return to the center position. According to an embodiment that can be combined with other embodiments described herein, the force arrangement 130 can pull or push at least one holder to the center position.

[0067] Optionally, unloading the substrate 101 may include moving at least one holding arrangement away from the substrate 101 while the substrate 101 remains loaded in the at least one holder 120. For example, the holder 120 may be arranged at the bottom side of the carrier. Holding arrangements, such as the first holding arrangement 151 and the second holding arrangement 152, may be arranged at the top side and another lateral side of the carrier, such as the right side. To unload the substrate 101, the holding arrangement may first be moved away from the substrate 101, and then the substrate 101 may be moved away from the holder 120. To load the substrate 101 into the carrier, the operation may be reversed.

[0068] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope of the disclosure and the scope of the disclosure is determined by the claims that follow.

Claims

1. A holder (120), the holder being configured to be attached to a carrier body (160) of a carrier for holding a substrate (101), the holder (120) include: a fixed portion (122) configured to be attached to a carrier body (160) and having a fixed position relative to the carrier body (160); and a floating portion (123) configured to be movable along a direction relative to the fixed portion (122) and comprising a groove (126) configured to receive at least a portion of the substrate (101), The floating portion (123) includes a tilting member (127), which is arranged on the surface of the floating portion (123) contacting the main surface of the substrate (101) and is configured to contact the main surface of the substrate (101), and wherein the tilting member (127) is configured to be inclined relative to the fixed portion.

2. The holder according to claim 1, wherein the holder (120) is configured to be attached to a substrate (101) in a substantially vertical orientation.

3. The holder according to claim 1, wherein the tilting member (127) is configured to support a major surface of the substrate.

4. A retainer according to claim 1, wherein the groove (126) is configured to contact at least one of the group consisting of: a first surface (102) of the substrate (101), a second surface (103) of the substrate (101) opposite to the first surface (102), and an edge (104) of the substrate (101) spanning from the first surface (102) to the second surface (103).

5. A retainer according to claim 1, wherein the floating portion (123) is movable along a direction from a first end position to a second end position, and wherein the floating portion further includes a force arrangement (130), which is configured to center the floating portion (123) relative to the fixed portion (122) in at least one direction.

6. The holder according to claim 5, wherein the force arrangement (130) is selected from the group consisting of: at least one spring or at least one cylinder.

7. The holder according to claim 1, wherein the direction is in a plane substantially parallel to the substrate (101).

8. The holder according to claim 7, wherein the direction is in a plane substantially parallel to the first surface (102) of the substrate (101).

9. The holder according to claim 7 or 8, wherein the direction is in a plane substantially parallel to the second surface (103) of the substrate (101).

10. A carrier comprising at least two holders (120) according to claim 1.

11. A carrier according to claim 10, wherein the carrier is constructed to carry a substrate (101) in a substantially vertical orientation, and wherein the at least two retainers (120) are positioned at at least one location selected from the group consisting of: a bottom side and a first lateral side of the carrier.

12. The carrier according to claim 10 comprises at least one retaining arrangement connected to one side of the carrier body, wherein the at least one retaining arrangement is movable in a longitudinal extension direction substantially perpendicular to the side of the carrier to which the retaining arrangement is connected.

13. A carrier according to claim 11, wherein the carrier includes at least one retaining arrangement, which is connected to one side of the carrier body, and the at least one retaining arrangement is movable in a longitudinal extension direction substantially perpendicular to the side of the carrier to which the retaining arrangement is connected.

14. A method of processing a substrate held in a carrier having a carrier body, at least one holder being attached to the carrier body, the holder having a fixed portion having a fixed position relative to the carrier body (160), the method comprising loading the substrate into the carrier; processing the substrate at an elevated temperature; and moving a floating portion of the at least one retainer by thermal expansion caused by processing at high temperature, The floating portion includes a tilting member disposed on a surface of the floating portion contacting a main surface of the substrate and configured to contact the main surface of the substrate, and wherein the tilting member is configured to be tilted relative to the fixed portion.

15. A method of unloading a substrate from a carrier having a carrier body, at least one holder being attached to the carrier body, the holder having a fixed portion having a fixed position relative to the carrier body (160), the method include: moving the carrier from a substantially vertical orientation to a substantially horizontal orientation; unloading the substrate from the carrier; and moving the floating portion of the at least one holder to a central position of the fixed portion of the holder, The floating portion includes a tilting member disposed on a surface of the floating portion contacting a main surface of the substrate and configured to contact the main surface of the substrate, and wherein the tilting member is configured to be tilted relative to the fixed portion.

16. The method of claim 15, wherein a force arrangement pulls or pushes the at least one retainer to the central position.

17. The method of claim 15 or 16, wherein unloading the substrate comprises moving at least one holding arrangement away from the substrate while the substrate remains loaded in the at least one holder.

18. An apparatus for depositing a layer on a large-area glass substrate, the apparatus include: a vacuum chamber suitable for performing layer deposition therein; A conveying system, the conveying system being suitable for conveying a carrier according to any one of claims 10 to 13; and A deposition source is used to deposit a material, the material forming the layer.

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