Display device

Abstract

The display device includes: a display panel having a plurality of first display pads arranged along a first direction; a main circuit board; a first flexible circuit board including a first substrate pad connected to the main circuit board and the first display pad and a first driving chip connected to the first substrate pad, and being bent in a direction toward a rear surface of the display panel; and a protective member disposed on the first flexible circuit board. The protective member covers the first driving chip.

Description

[0001] This application claims priority to Korean Patent Application No. 10-2019-0091575, filed on Jul. 29, 2019, and claims all rights arising therefrom, the entire contents of which are incorporated herein by reference. Background Art

[0002] The disclosure herein relates to a display device, and more particularly, to a display device having improved reliability.

[0003] After the display panel is manufactured, the display device connects the circuit board to the display panel. For example, a tape automated bonding ("TAB") mounting method bonds the circuit board to the display panel using an anisotropic conductive film. Summary of the invention

[0004] The present disclosure provides a display device which prevents defects of a circuit board from being generated when the circuit board is bent.

[0005] An embodiment of the present invention provides a display device, comprising: a display panel, comprising a plurality of first display pads arranged along a first direction; a main circuit board; a first flexible circuit board, comprising a first substrate pad connected to the main circuit board and the first display pad and a first driving chip connected to the first substrate pad, and being bent in a direction toward a rear surface of the display panel; and a protective member, disposed on the first flexible circuit board, wherein the protective member covers the first driving chip.

[0006] In an embodiment, the first flexible circuit board may include a lower surface and an upper surface facing the lower surface, the first substrate pad being exposed from the lower surface, wherein the lower surface faces the rear surface of the display panel when the first flexible circuit board is bent.

[0007] In an embodiment, the first driving chip may be mounted on the lower surface, and the protection member may cover a portion of the lower surface and the first driving chip.

[0008] In an embodiment, the first driving chip may be mounted on the upper surface, and the protection member may cover a portion of the upper surface and the first driving chip.

[0009] In an embodiment, the first flexible circuit board may further include: a first portion overlapping at least a portion of the main circuit board; a second portion overlapping at least a portion of the display panel; and a third portion connecting the first portion and the second portion, wherein when the first flexible circuit board is bent, the third portion may have a relatively larger curvature than each of the first portion and the second portion.

[0010] In an embodiment, the first driving chip may be disposed on the first portion, and the protection member may cover the first driving chip.

[0011] In an embodiment, the first driving chip may be disposed on the third portion, and the protection member may cover the first driving chip.

[0012] In an embodiment, the display panel may further include a plurality of second display pads, which are spaced apart from the first display pads in a second direction intersecting the first direction and arranged in the first direction; and the display device may further include a second flexible circuit board, the second flexible circuit board including a second substrate pad connected to the main circuit board and the second display pad and a second driving chip connected to the second substrate pad, and is bent in a direction toward the rear surface of the display panel, wherein a portion of the second flexible circuit board covers a portion of the first flexible circuit board.

[0013] In an embodiment, the protection member may be provided in plural, and one of the protection members may cover the second driving chip.

[0014] In an embodiment, the protection member may include first and second extension patterns spaced apart from each other along a first direction and extending along a second direction intersecting the first direction, and a connection pattern connecting the first and second extension patterns and extending along the first direction, wherein the connection pattern covers the first driving chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings are included to provide a further understanding of the inventive concept, are incorporated into this specification, and constitute a part of this specification. The accompanying drawings illustrate embodiments of the inventive concept and together with the description are used to explain the principles of the inventive concept. In the drawings:

[0016] Figure 1A is a perspective view of a display device according to an embodiment of the inventive concept;

[0017] Figure 1B It is shown that the Figure 1A A perspective view of a circuit board in a display device in a bent state;

[0018] Figure 1C It is shown that the Figure 1A A perspective view of a circuit board in a display device in a bent state;

[0019] Figure 2 is a plan view of a display device according to an embodiment of the inventive concept;

[0020] Figure 3A and Figure 3B is a cross-sectional view of a display area of ​​a display panel according to an embodiment of the inventive concept;

[0021] Figure 4Ais an enlarged plan view of a portion of a display device according to an embodiment of the inventive concept;

[0022] Figure 4B is an enlarged plan view of a portion of a display panel according to an embodiment of the inventive concept;

[0023] Figure 5A is along Figure 4A A cross-sectional view taken along line II';

[0024] Figure 5B and Figure 5C is a bottom view of a flexible circuit board according to an embodiment of the inventive concept;

[0025] Fig. 6A yes Figure 5A An enlarged cross-sectional view of area AA;

[0026] Figure 6B yes Figure 5A An enlarged cross-sectional view of region BB;

[0027] Fig. 7A is a bottom view of a flexible circuit board according to an embodiment of the inventive concept;

[0028] Figure 7B yes Fig. 7A A cross-sectional view of a flexible circuit board;

[0029] Fig. 8A is a bottom view of a flexible circuit board according to an embodiment of the inventive concept;

[0030] Figure 8B yes Fig. 8A A cross-sectional view of a flexible circuit board;

[0031] Fig. 9A is a plan view of a flexible circuit board according to an embodiment of the inventive concept;

[0032] Fig. 9B yes Fig. 9A A cross-sectional view of a flexible circuit board;

[0033] Fig.10 is a plan view of a protection member according to an embodiment of the present inventive concept; and

[0034] Fig.11 is a plan view of a protection member according to another embodiment of the present inventive concept. DETAILED DESCRIPTION

[0035] In the present disclosure, when an element (or region, layer, part, etc.) is mentioned as being "on", "connected to" or "coupled to" another element, it means that the element may be directly set on / connected to / coupled to the other element, or a third element may be set therebetween.

[0036] The same reference numerals refer to the same elements. Also, in the drawings, in order to effectively describe the technical contents, the thickness, ratio and size of the elements are exaggerated.

[0037] The term "and / or" includes all possible combinations of one or more of the associated configurations.

[0038] It should be understood that although the terms "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element without departing from the scope of the embodiments of the present invention. Unless the context clearly indicates otherwise, a term in the singular may include a plural form.

[0039] In addition, terms such as "below", "lower", "above", and "upper" are used to describe the relationship of the configurations shown in the drawings. These terms are used as relative concepts and are described with reference to the directions indicated in the drawings.

[0040] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which the inventive concept belongs. It should also be understood that terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with that in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense, unless explicitly defined herein.

[0041] It should be understood that the term "includes" or "has" is intended to indicate that the described features, integrals, steps, operations, elements, parts or combinations thereof are present in the present disclosure, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, parts or combinations thereof. Hereinafter, embodiments of the inventive concept will be described with reference to the accompanying drawings.

[0042] Figure 1A is a perspective view of a display device according to an embodiment of the inventive concept. Figure 1B It is shown that the Figure 1A A perspective view of a circuit board in a display device in a bent state. Figure 1C It is shown that the Figure 1A A perspective view of a circuit board in a display device in a bent state. Figure 2is a plan view of a display device according to an embodiment of the inventive concept. Figure 3A and Figure 3B is a cross-sectional view of a display region of a display panel according to an embodiment of the inventive concept.

[0043] refer to Figure 1A to Figure 2 , the display device DD includes a display panel DP, flexible circuit boards FPCB1 and FPCB2, a main circuit board MPCB, and protection members DTM1 and DTM2.

[0044] Although not separately shown, the display device DD may further include a receiving member, and may even further include a backlight unit according to the type of the display panel DP.

[0045] The display panel DP may be any one of a liquid crystal display panel, a plasma display panel, an electrophoretic display panel, a microelectromechanical system (“MEMS”) display panel, an electrowetting display panel, and an organic light emitting display panel. However, the present invention is not particularly limited thereto.

[0046] The display panel DP may include a first display substrate 100 and a second display substrate 200. The second display substrate 200 may be disposed on the first display substrate 100. A grayscale display layer for generating an image may be disposed between the first display substrate 100 and the second display substrate 200. Depending on the type of the display panel DP, the grayscale display layer may include any one of a liquid crystal layer, an organic light emitting layer, and an electrophoretic layer.

[0047] like Figure 1A As shown in , the display panel DP may display an image through the display surface DP-IS. The display surface DP-IS is parallel to a plane defined by the first direction DR1 and the second direction DR2. The display surface DP-IS may include a display area DA and a non-display area NDA. The non-display area NDA is defined along an edge of the display surface DP-IS. The display area DA may be surrounded by the non-display area NDA. In an embodiment of the inventive concept, the non-display area NDA may be provided only in an area on one side of the display area DA adjacent to the flexible circuit boards FPCB1 and FPCB2.

[0048] The normal direction of the display surface DP-IS, that is, the thickness direction of the display panel DP is indicated by the third direction DR3. The front surface (or upper surface) and the rear surface (or lower surface) of each component described below are distinguished by the third direction DR3. However, the first to third directions DR1, DR2 and DR3 shown in this embodiment are only exemplary. In the following, the first to third directions are respectively defined as the directions indicated by the first to third directions DR1, DR2 and DR3, and are given the same reference numerals.

[0049] In an embodiment of the inventive concept, a display panel DP provided with a flat display surface DP-IS is shown, but the inventive concept is not limited thereto. In another embodiment, the display device DD may include a curved display surface or a three-dimensional display surface. The three-dimensional display surface may include a plurality of display areas indicating different directions.

[0050] A signal control unit SC may be mounted on the main circuit board MPCB. The signal control unit SC receives image data and a control signal from an external graphic control unit (not shown). The signal control unit SC may provide the control signal to the display panel DP.

[0051] The flexible circuit boards FPCB1 and FPCB2 may be connected to the display panel DP and the main circuit board MPCB, respectively, by a conductive adhesive member. The conductive adhesive member may include an anisotropic conductive film. Hereinafter, the conductive adhesive member will be described as an anisotropic conductive film.

[0052] In an embodiment, the flexible circuit boards FPCB1 and FPCB2 may be provided in plurality. For example, the flexible circuit boards FPCB1 and FPCB2 may include a first flexible circuit board FPCB1 and a second flexible circuit board FPCB2. Each of the two types of flexible circuit boards FPCB1 and FPCB2 may be connected to different pad rows provided in one display pad area PDA. In the present embodiment, it is shown that the display pad area PDA is provided on the first display substrate 100, but the inventive concept is not limited thereto. In another embodiment of the inventive concept, the display pad area PDA may be provided on the second display substrate 200.

[0053] The first flexible circuit board FPCB1 may include a first driving chip DC1, and the second flexible circuit board FPCB2 may include a second driving chip DC2. The main circuit board MPCB transmits a signal to the driving chips DC1 and DC2, and the driving chips DC1 and DC2 may transmit the signal to the display panel DP. In an embodiment, each of the driving chips DC1 and DC2 may be a data driving circuit. In an embodiment of the present invention, the flexible circuit boards FPCB1 and FPCB2 may transmit a signal received from a signal control unit SC of the main circuit board MPCB to the display panel DP.

[0054] The display device DD according to the inventive concept includes protection members DTM1 and DTM2. The protection members DTM1 and DTM2 may be disposed on the flexible circuit boards FPCB1 and FPCB2, respectively. For example, the protection members DTM1 and DTM2 may include a first protection member DTM1 disposed on the first flexible circuit board FPCB1 and a second protection member DTM2 disposed on the second flexible circuit board FPCB2.

[0055] In a plan view, the protection members DTM1 and DTM2 may be disposed to overlap the driving chips DC1 and DC2, respectively. For example, the first protection member DTM1 overlaps the first driving chip DC1 of the first flexible circuit board FPCB1 and may cover the first driving chip DC1. In addition, the second protection member DTM2 overlaps the second driving chip DC2 of the second flexible circuit board FPCB2 and may cover the second driving chip DC2.

[0056] The protection members DTM1 and DTM2 according to the embodiment may be provided as a resin or a double-sided carrier tape.

[0057] like Figure 1B As shown in the figure, the flexible circuit boards FPCB1 and FPCB2 may be bent in a direction toward the rear surface DP-BS of the display panel DP. In this case, the flexible circuit boards FPCB1 and FPCB2 have a predetermined curvature and may be bent toward the rear surface DP-BS of the display panel DP. In a state where the flexible circuit boards FPCB1 and FPCB2 are bent, the main circuit board MPCB may be connected to the flexible circuit boards FPCB1 and FPCB2 and received in a receiving member (not shown).

[0058] In an embodiment, when the flexible circuit boards FPCB1 and FPCB2 are bent, the driving chips DC1 and DC2 may be disposed on rear surfaces of the flexible circuit boards FPCB1 and FPCB2 , respectively, to be disposed adjacent to the rear surface DP-BS of the display panel DP. Figure 1B The first driving chip DC1 disposed on the rear surface of the first flexible circuit board FPCB1 and the first protection member DTM1 covering the first driving chip DC1 are exemplarily shown.

[0059] In another embodiment, when the flexible circuit boards FPCB1 and FPCB2 are bent, the driving chips DC1 and DC2 may be disposed on upper surfaces of the flexible circuit boards FPCB1 and FPCB2 , respectively. Figure 1CThe second driving chip DC2 disposed on the upper surface of the second flexible circuit board FPCB2 and the second protective member DTM2 covering the second driving chip DC2 are exemplarily shown. Although not shown, the inventive concept is not limited thereto. In another embodiment, the driving chips DC1 and DC2 may be disposed on different surfaces of the flexible circuit boards FPCB1 and FPCB2. For example, any one of the driving chips DC1 and DC2 may be disposed on the upper surface of the corresponding flexible circuit board in the flexible circuit boards FPCB1 and FPCB2, and the other of the driving chips DC1 and DC2 may be disposed on the rear surface of the corresponding flexible circuit board in the flexible circuit boards FPCB1 and FPCB2. In this case, the protective members DTM1 and DTM2 may cover the driving chips DC1 and DC2, respectively.

[0060] At this time, due to tensile stress and / or compressive stress caused by bending of the flexible circuit boards FPCB1 and FPCB2, the driving chips DC1 and DC2 may be separated from the flexible circuit boards FPCB1 and FPCB2, or may be damaged by external impact or by foreign matter inflow without the protective members DTM1 and DTM2.

[0061] According to the inventive concept, since the protective members DTM1 and DTM2 for covering the driving chips DC1 and DC2 are included, damage to the driving chips DC1 and DC2 caused by tensile stress and / or compressive stress occurring when the flexible circuit boards FPCB1 and FPCB2 are bent can be prevented. In addition, external impact can be mitigated, and entry of foreign matter can be prevented. Therefore, a display device DD with improved reliability can be provided.

[0062] Figure 2 The planar arrangement relationship of the signal lines GL1 to GLn, DL1 to DLm and PL-D and the pixels PX11 to PXnm is shown. The signal lines GL1 to GLn, DL1 to DLm and PL-D may include a plurality of gate lines GL1 to GLn, a plurality of data lines DL1 to DLm and an auxiliary signal line PL-D.

[0063] The plurality of gate lines GL1 to GLn extend in the first direction DR1 and are arranged in the second direction DR2. The plurality of data lines DL1 to DLm and the plurality of gate lines GL1 to GLn are insulated from each other while crossing each other. The plurality of data lines DL1 to DLm extend in the second direction DR2 and are arranged in the first direction DR1.

[0064] A plurality of gate lines GL1 to GLn and a plurality of data lines DL1 to DLm are disposed to overlap the display area DA. An auxiliary signal line PL-D is disposed to overlap the non-display area NDA and is connected to the plurality of data lines DL1 to DLm.

[0065] The auxiliary signal line PL-D may be disposed on a layer different from a layer on which the plurality of data lines DL1 to DLm are disposed. The data lines DL1 to DLm may be electrically connected to the corresponding auxiliary signal lines PL-D, respectively, through contact holes CH. The contact holes CH pass through at least one insulating layer disposed between the data lines DL1 to DLm and the auxiliary signal line PL-D. Figure 2 Two contact holes CH are shown as an example.

[0066] In another embodiment of the present inventive concept, the contact hole CH may be omitted. The data lines DL1 to DLm and the auxiliary signal line PL-D may be disposed on the same layer. In this case, one data line and one auxiliary signal line connected to each other may be defined as one signal line. In this case, the data line and the auxiliary signal line connected to each other may be defined as different parts of one signal line.

[0067] Each of the pixels PX11 to PXnm is connected to a corresponding gate line among a plurality of gate lines GL1 to GLn and a corresponding data line among a plurality of data lines DL1 to DLm. Each of the pixels PX11 to PXnm may include a pixel driving circuit and a display element.

[0068] Figure 2 The pixels PX11 to PXnm are exemplarily shown in a matrix form, but the inventive concept is not limited thereto. The pixels PX11 to PXnm may be arranged in a pentile form. For example, the points where the pixels PX11 to PXnm are arranged may correspond to the vertices of a rhombus.

[0069] like Figure 2 As shown in , two display pad rows PD1 and PD2 are provided in each display pad area PDA. Each of the two display pad rows PD1 and PD2 includes a plurality of substrate pads arranged in a first direction DR1.

[0070] The first display pad row PD1 and the second display pad row PD2 are arranged at intervals in the second direction DR2. In the second direction DR2, the second display pad row PD2 is arranged to be spaced farther from the edge E-DP of the display panel DP than the first display pad row PD1, and is arranged to be closer to the display area DA. The pads of the first display pad row PD1 and the second display pad row PD2 are each connected to the auxiliary signal line PL-D.

[0071] The gate driving circuit GDC may be integrated into the display panel DP through an oxide silicon gate driver circuit (“OSG”) process or an amorphous silicon gate driver circuit (“ASG”) process.

[0072] Figure 3A and Figure 3Bis a cross-sectional view of a display area DA of a display panel DP according to an embodiment of the inventive concept. Figure 3A A cross-sectional view corresponding to a pixel PX of a liquid crystal display panel is shown, and Figure 3B A cross-sectional view corresponding to a pixel PX of an organic light emitting display panel is shown.

[0073] refer to Figure 3A , the grayscale display layer of the display panel DP according to an embodiment of the inventive concept may be a liquid crystal layer LC. Therefore, the display panel DP may be a liquid crystal display panel. The pixel PX of the liquid crystal display panel may include a transistor TR, a liquid crystal capacitor Clc, and a storage capacitor Cst.

[0074] The transistor TR includes a control electrode GE connected to a gate line, an active cell AL overlapping the control electrode GE, an input electrode SE connected to a data line, and an output electrode DE spaced from the input electrode SE. The liquid crystal capacitor Clc includes a pixel electrode PE and a common electrode CE. The storage capacitor Cst includes the pixel electrode PE and a portion of the storage line STL overlapping the pixel electrode PE.

[0075] The control electrode GE and the storage line STL are disposed on one surface of the first base substrate BS1. The first base substrate BS1 may be any one of a glass substrate, a plastic substrate, and a substrate containing polyimide ("PI"). A first insulating layer 10 covering the control electrode GE and the storage line STL is disposed on one surface of the first base substrate BS1. The first insulating layer 10 may include at least one of an inorganic material and an organic material.

[0076] An active cell AL overlapping the control electrode GE is disposed on the first insulating layer 10. The active cell AL may include a semiconductor layer SCL and an ohmic contact layer OCL. The semiconductor layer SCL is disposed on the first insulating layer 10, and the ohmic contact layer OCL is disposed on the semiconductor layer SCL.

[0077] The semiconductor layer SCL may include amorphous silicon or crystalline silicon. In addition, the semiconductor layer SCL may include a metal oxide semiconductor. The ohmic contact layer OCL may include a dopant doped at a higher density than the semiconductor layer SCL. The ohmic contact layer OCL may include two portions spaced apart from each other. In an embodiment of the present inventive concept, the ohmic contact layer OCL may have a monomer shape. However, the present inventive concept is not limited thereto. Depending on the type of the semiconductor layer SCL, the ohmic contact layer OCL may be omitted and is not limited to any one embodiment.

[0078] An output electrode DE and an input electrode SE are disposed on the active cell AL. The output electrode DE and the input electrode SE are disposed at intervals from each other. A second insulating layer 20 covering the active cell AL, the output electrode DE, and the input electrode SE is disposed on the first insulating layer 10. A third insulating layer 30 is disposed on the second insulating layer 20. The second insulating layer 20 and the third insulating layer 30 may include at least one of an inorganic material and an organic material. The third insulating layer 30 may be a single-layer organic layer providing a flat surface. In an embodiment, the third insulating layer 30 may include a plurality of color filters. A fourth insulating layer 40 is disposed on the third insulating layer 30. The fourth insulating layer 40 may be an inorganic layer covering the color filter.

[0079] like Figure 3A As shown in FIG, a pixel electrode PE is disposed on the fourth insulating layer 40. The pixel electrode PE is connected to the output electrode DE through a through hole CH0 passing through the second insulating layer 20, the third insulating layer 30 and the fourth insulating layer 40. An alignment film (not shown) covering the pixel electrode PE may be disposed on the fourth insulating layer 40.

[0080] The second base substrate BS2 may be any one of a glass substrate, a plastic substrate, and a substrate containing polyimide ("PI"). A black matrix layer BM is disposed on the lower surface of the second base substrate BS2. An opening corresponding to a pixel area may be defined in the black matrix layer BM. The spacer CS may be disposed to overlap the black matrix layer BM.

[0081] An insulating layer covering the black matrix layer BM is disposed on the lower surface of the second base substrate BS2. Figure 3A The fifth insulating layer 50 providing a flat surface is exemplarily shown. The fifth insulating layer 50 may include an organic substance.

[0082] A common electrode CE is disposed on the lower surface of the second base substrate BS2. An alignment film (not shown) may be disposed on the common electrode CE.

[0083] The common electrode CE according to the embodiment may include a transmissive metal such as a transparent conductive oxide (“TCO”).

[0084] A common voltage is applied to the common electrode CE. The common voltage may have a different value from the pixel voltage, or may have the same value. In a liquid crystal display panel in a vertical alignment ("VA") mode, when the common voltage and the pixel voltage have the same value, the potential difference is zero, and in this case, the common voltage may be applied to the common electrode CE in the display area DA (see Figure 1A ) displays a black screen.

[0085] Figure 3AThe cross-sectional view of the pixel PX shown in FIG. 1 is merely exemplary. In another embodiment, the first display substrate 100 and the second display substrate 200 may be reversed in the third direction DR3. A color filter may be provided on the second display substrate 200.

[0086] exist Figure 3A A liquid crystal display panel in a vertical alignment mode has been exemplarily described in the specification. However, in another embodiment of the present invention, any one of an in-plane switching ("IPS") mode, a fringe field switching ("FFS") mode, and a plane-to-line switching ("PLS") mode may be applied, and the liquid crystal display panel is not limited to any one specific mode.

[0087] refer to Figure 3B , the grayscale display layer of the display panel DP according to an embodiment of the inventive concept may include an organic light emitting layer EML. Therefore, the display panel DP may be an organic light emitting display panel. The pixel PX of the organic light emitting display panel may include a switching transistor T1, a driving transistor T2, and a light emitting diode OLED.

[0088] The organic light emitting display panel includes a first display substrate 100 and a second display substrate (or encapsulation substrate) 200. The first display substrate 100 includes a first base substrate BS1, a circuit element layer DP-CL disposed on the first base substrate BS1, a display element layer DP-OLED disposed on the circuit element layer DP-CL, and a cover layer CL disposed on the display element layer DP-OLED. The second display substrate 200 may include a second base substrate BS2, a black matrix layer BM disposed on the second base substrate BS2, and a color conversion layer CCL.

[0089] The first base substrate BS1 may be any one of a glass substrate, a plastic substrate, and a substrate containing polyimide ("PI"). The circuit element layer DP-CL includes a circuit element and at least one insulating layer. The circuit element includes a signal line and a driving circuit of a pixel PX, etc. The circuit element layer DP-CL may be formed by a formation process of an insulating layer, a semiconductor layer, and a conductive layer by coating and deposition, etc., and a patterning process of an insulating layer, a semiconductor layer, and a conductive layer by a photolithography process.

[0090] In an embodiment, the circuit element layer DP-CL may include a buffer film BFL, a first insulating layer 10, a second insulating layer 20, and a third insulating layer 30. The first insulating layer 10 and the second insulating layer 20 may both be inorganic films, and the third insulating layer 30 may be an organic film.

[0091] Figure 3BThe arrangement relationship of the first semiconductor pattern OSP1, the second semiconductor pattern OSP2, the first control electrode GE1, the second control electrode GE2, the first output electrode DE1, the first input electrode SE1, the second output electrode DE2, and the second input electrode SE2, which all constitute the switching transistor T1 and the driving transistor T2, is exemplarily shown. The first, second, third, and fourth through holes CH1, CH2, CH3, and CH4 may also be exemplarily shown.

[0092] The display element layer DP-OLED includes a light emitting diode OLED. The display element layer DP-OLED may include an organic light emitting diode as the light emitting diode OLED. The display element layer DP-OLED includes a pixel defining film PDL. For example, the pixel defining film PDL may be an organic layer.

[0093] A first electrode AE ​​is disposed on the third insulating layer 30. The first electrode AE ​​is connected to the second output electrode SE2 through a fifth through hole CH5 passing through the third insulating layer 30. An opening OP is defined in the pixel defining film PDL. The opening OP of the pixel defining film PDL exposes at least a portion of the first electrode AE. The opening OP of the pixel defining film PDL is referred to as a light emitting opening to be distinguished from other openings.

[0094] like Figure 3B As shown in , the display panel DP may include a light emitting area PXA and a non-light emitting area NPXA adjacent to the light emitting area PXA. The non-light emitting area NPXA may surround the light emitting area PXA. In an embodiment, the light emitting area PXA is defined as a specific area corresponding to the first electrode AE ​​exposed by the light emitting opening OP.

[0095] The hole control layer HCL may be commonly disposed in the light emitting area PXA and the non-light emitting area NPXA. The hole control layer HCL includes a hole transport layer and may further include a hole injection layer. An organic light emitting layer EML is disposed on the hole control layer HCL. The organic light emitting layer EML may be commonly disposed in the light emitting area PXA and the non-light emitting area NPXA. However, the inventive concept is not limited thereto. In another embodiment, the organic light emitting layer EML may be disposed in the light emitting area PXA and may not be disposed in the non-light emitting area NPXA. The organic light emitting layer EML may include organic matter and / or inorganic matter. The organic light emitting layer EML may generate predetermined light, such as blue light.

[0096] An electron control layer ECL is disposed on the organic light emitting layer EML. The electron control layer ECL includes an electron transport layer and may further include an electron injection layer. The hole control layer HCL and the electron control layer ECL may be commonly formed in a plurality of pixels PX using an open mask. A second electrode CE is disposed on the electron control layer ECL. The second electrode CE is commonly disposed in a plurality of pixels PX. A cover layer CL for protecting the second electrode CE may be disposed on the second electrode CE. The cover layer CL may include an organic substance or an inorganic substance.

[0097] The second base substrate BS2 is spaced apart from the cover layer CL. The second base substrate BS2 may be any one of a glass substrate, a plastic substrate, and a substrate including polyimide ("PI"). The color conversion layer CCL may transmit the first color light, or may convert the first color light into the second color light or the third color light according to the pixel PX. The color conversion layer CCL may include quantum dots.

[0098] In an embodiment of the present inventive concept, the second display substrate 200 may be replaced with a thin film encapsulation layer including a plurality of inorganic layers and an organic layer sealed by the inorganic layers. In this case, the black matrix layer BM and the color conversion layer CCL may be disposed on the thin film encapsulation layer.

[0099] Figure 4A is an enlarged plan view of a portion of a display device according to an embodiment of the inventive concept. Figure 4B is an enlarged plan view of a portion of a display panel according to an embodiment of the inventive concept. Figure 5A is along Figure 4A A cross-sectional view taken along line II'. Figure 5B and Figure 5C is a bottom view of a flexible circuit board according to an embodiment of the inventive concept. Fig. 6A yes Figure 5A An enlarged cross-sectional view of area AA. Figure 6B yes Figure 5A The same reference numerals are used for the enlarged cross-sectional view of the area BB. Figure 1A and Figure 2 The same / similar parts are referred to as the parts of the embodiment and their redundant descriptions are omitted.

[0100] refer to Figure 4A , Figure 4B and Figure 5A , in the display pad area PDA (see Figure 1A ), a first display pad row PD1 and a second display pad row PD2 forming different rows are respectively arranged in the first display pad area PDA1 and the second display pad area PDA2. The first display pad row PD1 includes a plurality of first display pads PD1-P, and the second display pad row PD2 includes a plurality of second display pads PD2-P.

[0101] The first display pads PD1-P are arranged in a first direction DR1 and spaced apart from each other. The second display pads PD2-P are arranged in a second direction DR2 and spaced apart from the first display pads PD1-P, and spaced apart from each other in the first direction DR1. The first display pads PD1-P are arranged closer to the edge E-DP of the display panel DP than the second display pads PD2-P.

[0102] When viewed from the edge E-DP, one second display pad PD2-P may be seen between two adjacent first display pads PD1-P. Thus, when viewed from the edge E-DP, the first display pads PD1-P and the second display pads PD2-P may be alternately disposed.

[0103] The first flexible circuit board FPCB1 may include first substrate pads F-PD1 and M-PD1 (see FIG. 1 ) corresponding to the first display pads PD1-P. Figure 5B ), and the second flexible circuit board FPCB2 may include second substrate pads F-PD2 and M-PD2 corresponding to the second display pads PD2-P (see Figure 5C ).

[0104] For example, the first output pad F-PD1 of the first flexible circuit board FPCB1 is electrically connected to the first display pad PD1-P, and the second output pad F-PD2 of the second flexible circuit board FPCB2 is electrically connected to the second display pad PD2-P.

[0105] Since the flexible circuit boards FPCB1 and FPCB2 are respectively connected to the display pad rows PD1 and PD2 spaced apart from each other in the second direction DR2, the widths of the flexible circuit boards FPCB1 and FPCB2 in the second direction DR2 may be different from each other. For example, the width of the second flexible circuit board FPCB2 in the second direction DR2 may be greater than the width of the first flexible circuit board FPCB1 in the second direction DR2. Therefore, a portion of the second flexible circuit board FPCB2 according to the embodiment may cover a portion of the first flexible circuit board FPCB1.

[0106] According to the inventive concept, since the flexible circuit boards FPCB1 and FPCB2 are respectively connected to the display pad rows PD1 and PD2 spaced apart from each other along the second direction DR2 and partially overlap each other, the area of ​​the non-display area NDA in which the display pads PD1-P and PD2-P are provided is reduced, so that a display device DD with a narrow bezel can be provided.

[0107] Figure 5AThe relationship between the first flexible circuit board FPCB1 and the second flexible circuit board FPCB2 connected to the display panel DP is schematically shown. A pad included in each of the display panel DP, the first flexible circuit board FPCB1 and the second flexible circuit board FPCB2 is omitted.

[0108] A portion of the second flexible circuit board FPCB2 according to the embodiment covers a portion of the first flexible circuit board FPCB 1. That is, the second flexible circuit board FPCB2 covers one side of the first flexible circuit board FPCB1 facing the display area DA.

[0109] refer to Figure 5B and Figure 5C , the first flexible circuit board FPCB1 according to the embodiment includes a first upper surface F-U1 and a first lower surface F-B1 facing the first upper surface F-U1. The first upper surface F-U1 is shown in a plan view, and the first lower surface F-B1 is shown in a bottom view. The first flexible circuit board FPCB1 includes a first substrate signal line SL-1, a first driving chip DC1 disposed on the first lower surface F-B1, and a plurality of first substrate pads F-PD1, M-PD1, and CPD-1 exposed from the first lower surface F-B1.

[0110] The first substrate pads F-PD1, M-PD1 and CPD-1 may include a first connection pad CPD-1 connected to a connection terminal of the first driving chip DC1, a first output pad F-PD1 connected to the display panel DP, and a first input pad M-PD1 connected to the main circuit board MPCB.

[0111] The first substrate signal line SL-1 connects the first connection pad CPD-1 and the first output pad F-PD1, and connects the first connection pad CPD-1 and the first input pad M-PD1. In another embodiment where the first driving chip DC1 is omitted, the first substrate signal line SL-1 can directly connect the first output pad F-PD1 and the first input pad M-PD1.

[0112] In an embodiment, the first flexible circuit board FPCB1 may be divided into a plurality of parts. For example, the parts are a first part P1-1 in which the first input pad M-PD1 is disposed and overlaps at least a portion of the main circuit board MPCB, a second part P2-1 in which the first output pad F-PD1 is disposed and overlaps at least a portion of the display panel DP, and a third part P3-1 connecting the first part P1-1 and the second part P2-1.

[0113] The width of the second portion P2-1 in the first direction DR1 may be greater than the width of the first portion P1-1 in the first direction DR1. Therefore, at least one side of the third portion P3-1 of the main plane (i.e., the plane defined by the first direction DR1 and the second direction DR2) may be inclined from the second portion P2-1 toward the first portion P1-1.

[0114] In this embodiment, it is shown that the first driving chip DC1 is disposed in the first portion P1-1, but it is not limited thereto. In another embodiment, the first driving chip DC1 may be disposed in any one of the second portion P2-1 and the third portion P3-1.

[0115] The second flexible circuit board FPCB2 according to the embodiment includes a second upper surface F-U2 and a second lower surface F-B2 facing the second upper surface F-U2. The second upper surface F-U2 is shown in a plan view, and the second lower surface F-B2 is shown in a bottom view. The second flexible circuit board FPCB2 includes a second substrate signal line SL-2, a second driving chip DC2 disposed on the second lower surface F-B2, and a plurality of second substrate pads F-PD2, M-PD2, and CPD-2 exposed from the second lower surface F-B2.

[0116] The second substrate pads F-PD2, M-PD2 and CPD-2 may include a second connecting pad CPD-2 connected to a connecting terminal of a second driving chip DC2, a second output pad F-PD2 connected to a display panel DP, and a second input pad M-PD2 connected to a main circuit board MPCB.

[0117] The second substrate signal line SL-2 connects the second connection pad CPD-2 and the second output pad F-PD2, and connects the second connection pad CPD-2 and the second input pad M-PD2. In another embodiment in which the second driving chip DC2 is omitted, the second substrate signal line SL-2 can directly connect the second output pad F-PD2 and the second input pad M-PD2.

[0118] In an embodiment, the second flexible circuit board FPCB2 may be divided into a plurality of parts. For example, the parts are a first part P1-2 in which the second input pad M-PD2 is disposed and overlaps at least a portion of the main circuit board MPCB, a second part P2-2 in which the second output pad F-PD2 is disposed and overlaps at least a portion of the display panel DP, and a third part P3-2 connecting the first part P1-2 and the second part P2-2.

[0119] The width of the second portion P2-2 in the first direction DR1 may be greater than the width of the first portion P1-2 in the first direction DR1. Therefore, at least one side of the third portion P3-2 of the main plane may be inclined from the second portion P2-2 toward the first portion P1-2.

[0120] In this embodiment, it is shown that the second driving chip DC2 is disposed in the first part P1-2, but it is not limited thereto. In another embodiment, the second driving chip DC2 may be disposed in any one of the second part P2-2 and the third part P3-2.

[0121] According to the present invention, the width of the first flexible circuit board FPCB1 in the second direction DR2 may be smaller than the width of the second flexible circuit board FPCB2 in the second direction DR2. That is, the sum of the widths of the first portion P1-1, the second portion P2-1, and the third portion P3-1 of the first flexible circuit board FPCB1 in the second direction DR2 is smaller than the sum of the widths of the first portion P1-2, the second portion P2-2, and the third portion P3-2 of the second flexible circuit board FPCB2 in the second direction DR2. Therefore, Figure 5A As shown in FIG. 1 , the second portion P2-2 of the second flexible circuit board FPCB2 may cover at least a portion of the second portion P2-1 of the first flexible circuit board FPCB1. That is, the second flexible circuit board FPCB2 covers one side of the first flexible circuit board FPCB1 facing the display area DA.

[0122] Each of the flexible circuit boards FPCB1 and FPCB2 according to the present invention is bent (see Figure 1B ) may have different curvatures according to regions. For example, the third portions P3-1 and P3-2 may have relatively greater curvatures than the first portions P1-1 and P1-2 and the second portions P2-1 and P2-2.

[0123] based on Figure 3A The LCD panel shown in FIG. Fig. 6A and Figure 6B The first display substrate 100 shown in FIG.

[0124] refer to Fig. 6A , the first display pad PD1-P is connected to the auxiliary signal line PL-D through the first contact hole CH-P1 passing through the first to fourth insulating layers 10 to 40. The first display pad PD1-P is exposed from the first to fourth insulating layers 10 to 40. When the first display pad PD1-P is omitted, the end of the auxiliary signal line PL-D may be exposed from the first to fourth insulating layers 10 to 40.

[0125] The first flexible circuit board FPCB1 is exemplarily shown to include a sixth insulating layer IL-1, a first substrate signal line SL-1, a first solder resist layer SR-1, and a first output pad F-PD1. The first solder resist layer SR-1 may define an opening exposing at least a portion of the first substrate signal line SL-1. The first output pad F-PD1 may be connected to the first substrate signal line SL-1 exposed through the opening of the first solder resist layer SR-1. The first output pad F-PD1 is electrically connected to the first display pad PD1-P through the anisotropic conductive film ACF.

[0126] refer to Figure 6B , the second display pad PD2-P is connected to the auxiliary signal line PL-D through the second contact hole CH-P2 passing through the first to fourth insulating layers 10 to 40. The second display pad PD2-P is exposed from the first to fourth insulating layers 10 to 40. When the second display pad PD2-P is omitted, the end of the auxiliary signal line PL-D may be exposed from the first to fourth insulating layers 10 to 40.

[0127] The second flexible circuit board FPCB2 is exemplarily shown to include a seventh insulating layer IL-2, a second substrate signal line SL-2, a second solder resist layer SR-2, and a second output pad F-PD2. The second solder resist layer SR-2 may define an opening exposing at least a portion of the second substrate signal line SL-2. The second output pad F-PD2 may be connected to the second substrate signal line SL-2 exposed through the opening of the second solder resist layer SR-2. The second output pad F-PD2 is electrically connected to the second display pad PD2-P through the anisotropic conductive film ACF.

[0128] Fig. 7A is a bottom view of a flexible circuit board according to an embodiment of the inventive concept. Figure 7B yes Fig. 7A The same reference numerals are used for the cross-sectional view of the flexible circuit board. Figure 1A and Figure 6B The same / similar parts are referred to as the parts of the embodiment and their redundant descriptions are omitted.

[0129] refer to Fig. 7A and Figure 7B , the flexible circuit board FPCB-A according to the embodiment includes an upper surface FU and a lower surface FB, and can be divided into a first portion P1, a second portion P2, and a third portion P3 connecting the first portion P1 and the second portion P2. The upper surface FU is shown in a plan view, and the lower surface FB is shown in a bottom view. The flexible circuit board FPCB-A includes substrate pads F-PD and M-PD and a driving chip DC-A. In the accompanying drawings, signal lines connected to the substrate pads F-PD and M-PD and the driving chip DC-A are omitted.

[0130] The substrate pads F-PD and M-PD may be exposed by the lower surface FB of the flexible circuit board FPCB-A. Fig. 7A , wherein the first portion P1 of the input pad M-PD in the substrate pads F-PD and M-PD overlaps at least a portion of the main circuit board MPCB. The second portion P2 of the output pad F-PD in the substrate pads F-PD and M-PD overlaps at least a portion of the display panel DP. The third portion P3 connects the first portion P1 and the second portion P2, and when the flexible circuit board FPCB-A is bent (see Figure 1B ), the third portion P3 may have a relatively larger curvature than each of the first portion P1 and the second portion P2.

[0131] The driving chip DC-A may be disposed on the same surface as the substrate pads F-PD and M-PD. For example, the driving chip DC-A may be disposed on the lower surface FB of the flexible circuit board FPCB-A. In addition, the driving chip DC-A may be disposed in the first portion P1 of the lower surface FB.

[0132] According to the present embodiment, the protection member DTM-A may cover the driving chip DC-A. Therefore, the protection member DTM-A may cover a portion of the first portion P1 of the lower surface FB. When the flexible circuit board FPCB-A is bent, the first portion P1 on which the driving chip DC-A is disposed may have a relatively small curvature, and since the protection member DTM-A covers the driving chip DC-A, damage to the driving chip DC-A may be minimized. Therefore, a display device DD with improved reliability may be provided.

[0133] Although not shown, according to another embodiment, the driving chip DC-A may be disposed in the second portion P2, and in this case, the protection member DTM-A may be disposed in the second portion P2 to cover the driving chip DC-A. However, the inventive concept is not limited to any one embodiment.

[0134] Fig. 8A is a bottom view of a flexible circuit board according to an embodiment of the inventive concept. Figure 8B yes Fig. 8A The same reference numerals are used for the cross-sectional view of the flexible circuit board. Figure 1A and Figure 6B The same / similar parts are referred to as the parts of the embodiment and their redundant descriptions are omitted.

[0135] refer to Fig. 8A and Figure 8B, the flexible circuit board FPCB-B according to the embodiment includes an upper surface FU and a lower surface FB, and can be divided into a first portion P1, a second portion P2, and a third portion P3 connecting the first portion P1 and the second portion P2. The upper surface FU is shown in a plan view, and the lower surface FB is shown in a bottom view. The flexible circuit board FPCB-B includes substrate pads F-PD and M-PD and a driving chip DC-B. In the accompanying drawings, signal lines connected to the substrate pads F-PD and M-PD and the driving chip DC-B are omitted.

[0136] The substrate pads F-PD and M-PD may be exposed by the lower surface FB of the flexible circuit board FPCB-B. Fig. 8A , wherein the first portion P1 of the input pad M-PD in the substrate pads F-PD and M-PD overlaps at least a portion of the main circuit board MPCB. The second portion P2 of the output pad F-PD in the substrate pads F-PD and M-PD overlaps at least a portion of the display panel DP. The third portion P3 connects the first portion P1 and the second portion P2, and when the flexible circuit board FPCB-B is bent (see Figure 1B ), the third portion P3 may have a relatively larger curvature than each of the first portion P1 and the second portion P2.

[0137] The driver chip DC-B may be disposed on the same surface as the substrate pads F-PD and M-PD. For example, the driver chip DC-B may be disposed on the lower surface FB of the flexible circuit board FPCB-B. In addition, the driver chip DC-B may be disposed in the third portion P3 of the lower surface FB.

[0138] According to the present embodiment, the protection member DTM-B may cover the driving chip DC-B. Therefore, the protection member DTM-B may cover a portion of the third portion P3 of the lower surface FB. When the flexible circuit board FPCB-B is bent, the third portion P3 on which the driving chip DC-B is disposed may have a relatively large curvature. According to the inventive concept, even when the driving chip DC-B is disposed in the third portion P3 to which the stress is applied most when the flexible circuit board FPCB-B is bent, damage to the driving chip DC-B may be minimized due to the inclusion of the protection member DTM-B for covering the driving chip DC-B. Therefore, a display device DD with improved reliability may be provided.

[0139] Fig. 9A is a plan view of a flexible circuit board according to an embodiment of the inventive concept. Fig. 9B yes Fig. 9A The same reference numerals are used for the cross-sectional view of the flexible circuit board. Figure 1A and Figure 6BThe same / similar parts are referred to as the parts of the embodiment and their redundant descriptions are omitted.

[0140] refer to Fig. 9A and Fig. 9B , the flexible circuit board FPCB-C according to the embodiment includes an upper surface FU and a lower surface FB, and can be divided into a first portion P1, a second portion P2, and a third portion P3 connecting the first portion P1 and the second portion P2. The upper surface FU is shown in a plan view, and the lower surface FB is shown in a bottom view. The flexible circuit board FPCB-C includes substrate pads F-PD and M-PD and a driving chip DC-C.

[0141] The substrate pads F-PD and M-PD may be exposed by the lower surface FB of the flexible circuit board FPCB-C. Fig. 9A , wherein the first portion P1 of the input pad M-PD in the substrate pads F-PD and M-PD overlaps at least a portion of the main circuit board MPCB. The second portion P2 of the output pad F-PD in the substrate pads F-PD and M-PD overlaps at least a portion of the display panel DP. The third portion P3 connects the first portion P1 and the second portion P2, and when the flexible circuit board FPCB-C is bent (see Figure 1B ), the third portion P3 may have a relatively larger curvature than each of the first portion P1 and the second portion P2.

[0142] The driving chip DC-C may be disposed on a surface different from the surface on which the substrate pads F-PD and M-PD are disposed. For example, the driving chip DC-C may be disposed on the upper surface FU of the flexible circuit board FPCB-C. In addition, the driving chip DC-C may be disposed in the first portion P1 of the upper surface FU.

[0143] According to the present embodiment, the protection member DTM-C may cover the driving chip DC-C. Therefore, the protection member DTM-C may cover a portion of the first portion P1 of the upper surface FU. When the flexible circuit board FPCB-C is bent so that the lower surface FB is disposed within the curvature, the upper surface FU may have a relatively larger tensile stress than the lower surface FB.

[0144] According to the inventive concept, even when the driving chip DC-C is disposed on the upper surface FU to which the tensile stress is applied to the greatest extent when the flexible circuit board FPCB-C is bent, damage to the driving chip DC-C can be minimized because the protective member DTM-C for covering the driving chip DC-C is included. Therefore, a display device DD with improved reliability can be provided.

[0145] Fig.10 is a plan view of a protection member according to an embodiment of the present inventive concept. Fig.11 is a plan view of a protective member according to another embodiment of the present invention. Figure 1A and Figure 6B The same / similar parts are referred to as the parts of the embodiment and their redundant descriptions are omitted.

[0146] See also Fig.10 According to the embodiment, the protection member DTM-D may include a first extension pattern PM-L, a second extension pattern PM-R, and a connection pattern PM-C. The connection pattern PM-C is disposed between the first extension pattern PM-L and the second extension pattern PM-R to connect the first extension pattern PM-L and the second extension pattern PM-R.

[0147] The first extension pattern PM-L and the second extension pattern PM-R are spaced apart from each other in the first direction DR1 and extend in the second direction DR2. The connection pattern PM-C may extend in the first direction DR1. In a plan view, the protection member DTM-D may have an "H" shape.

[0148] exist Fig.10 In which driver chips DC1 and DC2 are set (see Figure 1A ) is shown using a dotted line in the chip region DCA. According to this embodiment, the connection pattern PM-C may overlap the chip region DCA. Therefore, the connection pattern PM-C may cover the driving chips DC1 and DC2 in the chip region DCA.

[0149] refer to Fig.11 , the protection member DTM-E according to the embodiment may include a plurality of extension patterns PM1 , PM2 , PM3 , and PM4 and a plurality of connection patterns PC1 , PC2 , and PC3 .

[0150] The extension patterns PM1, PM2, PM3 and PM4 are spaced apart from each other in the first direction DR1 and extend in the second direction DR2. The connection patterns PC1, PC2 and PC3 are disposed between the corresponding extension patterns PM1, PM2, PM3 and PM4 and connect the extension patterns PM1, PM2, PM3 and PM4.

[0151] exist Fig.11 In which driver chips DC1 and DC2 are set (see Figure 1A ) is shown using a dotted line in the chip area DCA. According to the present embodiment, the extension patterns PM2 and PM3 and the connection patterns PC1, PC2 and PC3 may overlap the chip area DCA. Therefore, the extension patterns PM2 and PM3 and the connection patterns PC1, PC2 and PC3 may cover the driver chips DC1 and DC2 in the chip area DCA.

[0152] The display device according to the present invention includes a protective member for covering a driving chip mounted on a flexible circuit board, and thus, damage to the driving chip caused by stress occurring when the flexible circuit board is bent can be prevented. In addition, external impact can be mitigated, and foreign matter can be prevented from entering.

[0153] Therefore, a display device with improved reliability can be provided.

[0154] While the inventive concept has been described with reference to preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the inventive concept.

[0155] Therefore, the technical scope of the inventive concept is not intended to be limited to the contents set forth in the specific embodiments of the specification, but is intended to be defined by the appended claims.

Claims

1. A display device, include: The display panel comprises a plurality of first display pads arranged along a first direction; Main circuit board; a first flexible circuit board, comprising a first substrate pad connected to the main circuit board and the first display pad and a first driving chip connected to the first substrate pad, and being bent in a direction toward a rear surface of the display panel; as well as a protective member disposed on the first flexible circuit board, wherein the protective member covers the first driving chip, wherein the protection member includes a first extension pattern and a second extension pattern that are spaced apart from each other along the first direction and extend along a second direction intersecting the first direction, and a connection pattern that connects the first extension pattern and the second extension pattern and extends along the first direction, and The connection pattern covers the first driving chip.

2. The display device according to claim 1, wherein the first flexible circuit board comprises a lower surface and an upper surface facing the lower surface, the first substrate pad is exposed from the lower surface, When the first flexible circuit board is bent, the lower surface faces the rear surface of the display panel.

3. The display device according to claim 2, in: The first driving chip is mounted on the lower surface; and The protection member covers a portion of the lower surface and the first driving chip.

4. The display device according to claim 2, in: The first driving chip is mounted on the upper surface; and The protection member covers a portion of the upper surface and the first driving chip.

5. The display device according to claim 1, wherein the first flexible circuit board further include: a first portion overlapping at least a portion of the main circuit board; a second portion overlapping at least a portion of the display panel; as well as a third part, connecting the first part and the second part, When the first flexible circuit board is bent, the third portion has a relatively larger curvature than each of the first portion and the second portion.

6. The display device according to claim 5, in: The first driving chip is disposed on the first portion, and The protection member covers the first driving chip.

7. The display device according to claim 5, in: The first driving chip is disposed on the third portion; and The protection member covers the first driving chip.

8. The display device according to claim 1, in: The display panel further includes a plurality of second display pads, the plurality of second display pads being spaced apart from the first display pads in a second direction crossing the first direction and arranged in the first direction; and The display device further includes a second flexible circuit board, the second flexible circuit board includes a second substrate pad connected to the main circuit board and the second display pad and a second driving chip connected to the second substrate pad, and is bent in the direction toward the rear surface of the display panel, A portion of the second flexible circuit board covers a portion of the first flexible circuit board. 9 . The display device according to claim 8 , wherein the protection member is provided in plural, and one of the protection members covers the second driving chip.

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