Solder point creation method, device, electronic device and storage medium

Abstract

The present invention proposes a solder joint creation method, device, electronic device and storage medium, the method comprising reading solder joint information in a solder joint information data table; creating at least one solder joint unit associated with an initial model according to the solder joint information; storing the created solder joint unit in a corresponding target component, and adding each target component to a corresponding target module, wherein the target module is a module in a target application, and the target component is a component in a target application. The present invention can realize automatic creation of solder joint units during CAE finite element analysis modeling, effectively reduce labor costs, improve the creation efficiency of solder joint units, and improve the creation effect.

Description

Technical Field

[0001] The present invention relates to the field of vehicle technology, and in particular to a welding point creation method, device, electronic equipment and storage medium. Background Art

[0002] As a connection method, welding technology is currently widely used in the manufacturing industry. Welding point connection is an important connection method in welding technology and is one of the main connection methods currently used by various vehicle manufacturers in the production process.

[0003] When using Computer Aided Engineering (CAE) for finite element analysis modeling, the body in white usually has 3,500 to 5,000 welds. CAE engineers usually create weld units one by one for the CAE model in the CAE application based on the weld coordinates, parts connected to the welds, and the number of welding layers provided by the design engineers.

[0004] In this way, since there are a large number of welds involved, the parts connected by the welds are different, and the number of welding layers is two, three, or four, the workload is large. Manually creating welds in the CAE model is cumbersome and prone to omissions or errors, resulting in poor weld unit creation. Summary of the invention

[0005] The present invention aims to solve one of the technical problems in the related art at least to a certain extent.

[0006] To this end, the purpose of the present invention is to propose a solder joint creation method, device, electronic device and storage medium, which can realize the automatic creation of solder joint units during CAE finite element analysis modeling, effectively reduce labor costs, improve the creation efficiency of solder joint units, and improve the creation effect.

[0007] To achieve the above-mentioned purpose, the first aspect of the present invention proposes a solder point creation method, including: reading solder point information in a solder point information data table; creating at least one solder point unit associated with an initial model based on the solder point information; storing the created solder point unit in a corresponding target component, and adding each target component to a corresponding target module, wherein the target module is a module in a target application, and the target component is a component in the target application.

[0008] The weld point creation method proposed in the embodiment of the first aspect of the present invention reads the weld point information in the weld point information data table, and creates at least one weld point unit associated with the initial model based on the weld point information, and stores the created weld point unit in the corresponding target component, and adds each target component to the corresponding target module. The target module is a module in the target application, and the target component is a component in the target application. This method can realize the automatic creation of weld point units during CAE finite element analysis modeling, effectively reduce labor costs, improve the creation efficiency of weld point units, and improve the creation effect.

[0009] To achieve the above-mentioned purpose, the solder joint creation device proposed in the second aspect of the embodiment of the present invention includes: a reading module, used to read the solder joint information in the solder joint information data table; a first creation module, used to create at least one solder joint unit associated with the initial model according to the solder joint information; a storage module, used to store the created solder joint unit in the corresponding target component, and the target component is a component in the target application; an adding module, used to add each of the target components to the corresponding target module, and the target module is a module in the target application.

[0010] The weld point creation device proposed in the embodiment of the second aspect of the present invention reads the weld point information in the weld point information data table, and creates at least one weld point unit associated with the initial model based on the weld point information, and stores the created weld point unit in the corresponding target component, and adds each target component to the corresponding target module. The target module is a module in the target application, and the target component is a component in the target application. It can automatically create weld point units during CAE finite element analysis modeling, effectively reduce labor costs, improve the creation efficiency of weld point units, and improve the creation effect.

[0011] To achieve the above-mentioned purpose, an electronic device proposed in an embodiment of the third aspect of the present invention includes a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the solder joint creation method as described above when executing the program.

[0012] The electronic device proposed in the embodiment of the third aspect of the present invention reads the solder point information in the solder point information data table, and creates at least one solder point unit associated with the initial model based on the solder point information, and stores the created solder point unit in the corresponding target component, and adds each target component to the corresponding target module. The target module is a module in the target application, and the target component is a component in the target application. It can automatically create solder point units during CAE finite element analysis modeling, effectively reduce labor costs, improve the creation efficiency of solder point units, and improve the creation effect.

[0013] To achieve the above-mentioned purpose, a computer-readable storage medium is proposed in an embodiment of the fourth aspect of the present invention, on which a computer program is stored, and when the program is executed by a processor, the solder joint creation method proposed in the embodiment of the first aspect of the present invention is implemented.

[0014] The computer-readable storage medium proposed in the fourth aspect of the embodiment of the present invention reads the solder joint information in the solder joint information data table, and creates at least one solder joint unit associated with the initial model based on the solder joint information, and stores the created solder joint unit in the corresponding target component, and adds each target component to the corresponding target module. The target module is a module in the target application, and the target component is a component in the target application. This can realize the automatic creation of solder joint units during CAE finite element analysis modeling, effectively reduce labor costs, improve the creation efficiency of solder joint units, and improve the creation effect.

[0015] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0017] Figure 1 is a schematic flow chart of a solder joint creation method according to an embodiment of the present invention;

[0018] Figure 2 is a schematic flow chart of a solder joint creation method according to another embodiment of the present invention;

[0019] Figure 3 is a schematic flow chart of a solder joint creation method according to another embodiment of the present invention;

[0020] Figure 4 is a schematic flow chart of a solder joint creation method according to another embodiment of the present invention;

[0021] Figure 5 Schematic diagram of a PLOTEL unit in an embodiment of the present invention;

[0022] Figure 6 is a structural schematic diagram of a welding point creation device proposed in an embodiment of the present invention;

[0023] Figure 7 is a structural schematic diagram of a welding point creation device proposed in another embodiment of the present invention;

[0024] Figure 8 is a structural schematic diagram of a welding point creation device proposed in another embodiment of the present invention;

[0025] Fig. 9 is a structural schematic diagram of a welding point creation device proposed in another embodiment of the present invention;

[0026] Fig.10 It is a structural schematic diagram of an electronic device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0027] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and are not to be construed as limitations of the present invention. On the contrary, embodiments of the present invention include all changes, modifications and equivalents that fall within the spirit and connotation of the appended claims.

[0028] In order to solve the technical problems in the related art that the workload of creating welds is large, the manual method of creating welds in the CAE model is cumbersome and prone to omissions or errors, and the weld unit creation effect is not good, the embodiment of the present invention provides a weld creation method, which reads the weld information in the weld information data table, and creates at least one weld unit associated with the initial model according to the weld information, and stores the created weld unit in the corresponding target component, and adds each target component to the corresponding target module, the target module is a module in the target application, and the target component is a component in the target application. The weld unit can be automatically created during CAE finite element analysis modeling, effectively reducing labor costs, improving the creation efficiency of the weld unit, and improving the creation effect.

[0029] Figure 1 It is a flow chart of a solder joint creation method proposed in one embodiment of the present invention.

[0030] This embodiment is described by taking the case where the solder joint creation method is configured as a solder joint creation device as an example.

[0031] The solder joint creation method in this embodiment may be configured in a solder joint creation device, and the solder joint creation device may be set in a server, or may also be set in an electronic device, which is not limited in this embodiment of the present invention.

[0032] The solder joint creation device in this embodiment is applied to CAE analysis, and specifically, can be applied to the CAE analysis pre-processing application program HyperMesh.

[0033] See also Figure 1 , the method comprising:

[0034] S101: Read the solder joint information in the solder joint information data table.

[0035] The solder joint information data table may be pre-configured and may include some solder joint information required to create a solder joint unit, such as solder joint coordinates, identification of components connected to the solder joint, number of soldering layers, etc.

[0036] For example, CAE modeling analysts can configure the weld coordinates, identification of components connected to the welds, number of welding layers, etc. according to actual analysis requirements, and generate a weld information data table based on the configured weld coordinates, identification of components connected to the welds, and number of welding layers.

[0037] As an example, the weld information in the weld information data table may be weld coordinates, identification of components connected to the weld, and the number of welding layers. The weld coordinates correspond one to one with the identification of components connected to the weld and the number of welding layers. The weld coordinates may be used to describe the coordinate values ​​of each weld in the vehicle or vehicle in the world coordinate system, and the identification of components connected to the weld can be used to uniquely identify the corresponding components. The number of welding layers is used to describe the number of welding layers corresponding to the weld to be created, and there is no restriction on this.

[0038] During the specific execution process, the solder joint information is stored in a solder joint information data table. The format of the solder joint information data table can be CSV format, Excel format, or txt format, etc. After the CAE model that needs to create a solder joint unit is imported into the CAE pre-processing application HyperMesh, the application HyperMesh can automatically read the solder joint information in the solder joint information data table, that is, the solder joint coordinates, the identification of the components connected to the solder joint, and the number of welding layers.

[0039] When reading the solder joint information in the solder joint information data table, the embodiment of the present invention can call a preset application programming interface and execute a corresponding script file to automatically read the solder joint information in the solder joint information data table.

[0040] In an embodiment of the present invention, by pre-writing the weld coordinates, the identification of the parts connected to the weld, and the number of welding layers into the weld information data table, during specific execution, the application HyperMesh can be triggered to automatically obtain the corresponding weld information in the form of reading the weld information data table, thereby ensuring the execution efficiency of the weld unit creation.

[0041] In the specific execution process of the embodiment of the present invention, the soldering point information in each soldering point information data table may be read from a preset folder.

[0042] The name of the preset folder and the name of the solder joint information data table may both be composed of a mixture of English characters and Arabic numerals.

[0043] Among them, the preset folder may include one or more solder point information data tables, and multiple solder point information data tables may be respectively included in subfolders under the preset folder to achieve hierarchical storage.

[0044] S102: Creating at least one solder joint unit associated with the initial model according to the solder joint information.

[0045] In the specific execution process, a solder point unit associated with the initial model and corresponding to the solder point information can be created based on the solder point information. Thus, when there are multiple solder point information, solder point units corresponding to each solder point information are created respectively, and multiple solder point units are created.

[0046] S103: Store the created solder joint units into corresponding target components, and add each target component into a corresponding target module. The target module is a module in a target application, and the target component is a component in the target application.

[0047] Among them, the target module is the module in the target application, the target component is the component in the target application, the target application can be, for example, the CAE pre-processing application HyperMesh, the target module Assembly is the module in the CAE pre-processing application HyperMesh used to store the target component Component, and the target component Component is the component in the CAE pre-processing application HyperMesh used to store the created solder joint units.

[0048] In the specific execution process, a preset folder can be first configured, and the preset folder includes multiple solder joint information data tables, each solder joint information data table contains several solder joint information, and then, the CAE analysis pre-processing application HyperMesh is started, and the CAE model that needs to create solder joints is imported. The CAE model that needs to create solder joints can be called the initial model, and each solder joint information data table in the above preset folder is read in turn. Each time the current solder joint information data table is read, the table information of the solder joint information data table is obtained (wherein the table information is, for example, the name of the table), and a component Component with the same name as the name of the solder joint information data table is created. The component Component can be called the target component Component. The target component is used to store at least one solder joint unit created based on the solder joint information in the solder joint information data table, and then, a solder joint unit associated with the initial model is created according to the above solder joint information, and the created solder joint unit is stored in the above target component Component.

[0049] In addition, when reading each solder point information data table from the preset folder in turn, a module Assembly can be created according to the folder information of the preset folder (the folder information is, for example, the folder name), and then the created module Assembly can be called the target module Assembly, wherein, by adding each target component Component to the target module Assembly, the target application can automatically call the solder point unit in each target component during operation to perform the corresponding modeling operation, and prompt the CAE analysis user that the solder point unit creation is completed.

[0050] In this embodiment, by reading the solder joint information in the solder joint information data table, and creating at least one solder joint unit associated with the initial model based on the solder joint information, and storing the created solder joint unit in the corresponding target component, and adding each target component to the corresponding target module, the target module is a module in the target application, and the target component is a component in the target application, it is possible to automatically create solder joint units during CAE finite element analysis modeling, effectively reduce labor costs, improve the creation efficiency of solder joint units, and improve the creation effect.

[0051] Figure 2 It is a flow chart of a solder joint creation method proposed in another embodiment of the present invention.

[0052] This embodiment is exemplified by reading solder joint information in each solder joint information data table from a preset folder, and the preset folder includes: at least one first folder and a second folder contained in the first folder.

[0053] See also Figure 2 , the method comprising:

[0054] S201: reading solder joint information in each solder joint information data table from a first folder, and reading solder joint information in each solder joint information data table from a second folder.

[0055] In the embodiment of the present invention, the preset folder may include multiple folders, and different folders may be in a nested relationship, that is, the preset folder includes multiple first folders, and some of the first folders also include multiple second folders, which is not limited.

[0056] By configuring a multi-layer structure of preset folders, the actual application scenario requirements can be better simulated, making the processing logic of CAE modeling and analysis more in line with the actual application situation, facilitating the operation of CAE analysts, and fully realizing the automatic reading of solder joint information in the solder joint information data table.

[0057] During the specific execution process, the CAE model for which the solder joint unit needs to be created can be imported into the CAE analysis pre-processing software HyperMesh, and then a preset folder is prepared, which includes at least one first folder and a second folder contained in the first folder. The simulation calculation program pre-written in the Tcl / Tk executable programming language is imported into the HyperMesh application, so that the HyperMesh application automatically reads all the solder joint information data tables in the first folder and the second folder, and generates corresponding solder joint units according to the solder joint information in the currently read solder joint information data table, until the creation of solder joint units corresponding to the solder joint information in all solder joint information data tables is automatically completed.

[0058] As an example, see the following:

[0059] 1. Import the analysis model for creating solder joints into the CAE analysis pre-processing application HyperMesh;

[0060] 2. Prepare a preset folder, which includes one or more weld information data sheets. The weld information data sheet includes: the number of weld layers, the X, Y, and Z coordinate values ​​of the weld in the rectangular coordinate system of the vehicle, and the ID information of the parts connected to the weld. The weld information data sheet is arranged in sequence. If the sequence is wrong, the program will prompt that the file format is wrong.

[0061] 3. Import the simulation calculation program pre-written in Tcl / Tk language into the HyperMesh application;

[0062] 4. Select the above preset folder according to the application prompts;

[0063] 5. The program automatically identifies the file type in the preset folder, finds the files with the suffix .xlsx and .csv as the solder joint information data table, and extracts the name of the solder joint information data table;

[0064] 6. The program automatically marks the solder joint information data table under the above preset folder and calculates its total number L1;

[0065] 8. The program automatically creates a target module Assembly with the same name as the folder name of the above preset folder in the HyperMesh application to store the solder joint units created later;

[0066] 8. The program starts to automatically create solder joint units according to the contents in the above solder joint information data table:

[0067] 8.1. When the loop variable i=1, the program automatically marks the first solder joint information data table in the above preset folder, and then generates a solder joint unit;

[0068] 8.2. When the loop variable i=2, the program automatically marks the second solder joint information data table in the above preset folder;

[0069] 8.3. When the loop variable i=L1, the program automatically marks the L1th solder joint information data table in the above preset folder;

[0070] 9. The program automatically marks the subfolders under the above preset folder (at this time, the preset folder can be regarded as the first folder, and the subfolders under the preset folder can be regarded as the second folder), and calculates the number of files in the second folder L2:

[0071] 9.1. When the loop variable j=1, the program automatically marks the first solder joint information data table in the second folder.

[0072] 9.2. When the loop variable j=2, the program automatically marks the second solder joint information data table in the second folder;

[0073] 9.3. When the loop variable j = L2, the program automatically marks the L2th solder joint information data table in the second folder;

[0074] 10. This process is repeated until all the solder joint information data tables under the first folder and the second sub-folder are searched, and solder joints are automatically created in HyperMesh based on the solder joint information in the solder joint information data tables.

[0075] S202: Generate a corresponding target component according to the table information of the solder point information data table; the target component is used to store at least one solder point unit created based on the solder point information in the solder point information data table.

[0076] S203: Creating at least one welding point unit associated with the initial model according to the welding point information.

[0077] In the specific execution process, a solder point unit associated with the initial model and corresponding to the solder point information can be created based on the solder point information. Thus, when there are multiple solder point information, solder point units corresponding to each solder point information are created respectively, and multiple solder point units are created.

[0078] S204: Determine the folder information of the folder to which the solder point information data table corresponding to the solder point unit belongs.

[0079] S205: Create a target module corresponding to the folder according to the folder information.

[0080] Among them, the target module is the module in the target application, the target component is the component in the target application, the target application can be, for example, the CAE pre-processing application HyperMesh, the target module Assembly is the module in the CAE pre-processing application HyperMesh used to store the target component Component, and the target component Component is the component in the CAE pre-processing application HyperMesh used to store the created solder joint units.

[0081] S206: Store the created solder joint units into corresponding target components, and add each target component into a corresponding target module. The target module is a module in the target application, and the target component is a component in the target application.

[0082] By adding each target component Component in the target module Assembly, the target application can automatically call the solder point unit in each target component to perform the corresponding modeling operation during operation, configure the target component corresponding to the solder point information data table to which the solder point unit belongs, and configure the target module corresponding to the preset folder to which the solder point information data table belongs, add all the solder point units corresponding to the solder point information in the specific preset folder to the target module, and use different target components in the target module to distinguish the solder point units corresponding to different solder point information data tables, so as to realize hierarchical creation and storage of solder point units corresponding to solder point information of different levels and structures, which improves the creation efficiency while making the creation logic clearer, effectively avoids missed creation and creation errors, and improves the creation accuracy.

[0083] As an example, see the following:

[0084] 1. Prepare a preset folder, which contains multiple solder point information data tables, each of which contains several solder point information;

[0085] 2. Open the CAE analysis pre-processing application HyperMesh and import the CAE model for which solder joint units need to be created;

[0086] 3. Extract the name of the above preset folder;

[0087] 4. Calculate the number of solder joint information data tables in the above preset folder, recorded as L1;

[0088] 5. When the loop variable i=1, extract the name of the first solder joint information data table mentioned above;

[0089] 6. Create a Component with the same name as the first solder joint information data table above;

[0090] 7. Calculate the number of solder joint information in the first solder joint information data table, and record it as L2;

[0091] 8. When the loop variable j=1, read the first solder point information in the first solder point information data table: solder point coordinates, component ID connected to the solder point, number of soldering layers, create a solder point unit according to the solder point information and solder point creation function, and store it in the above Component;

[0092] 9. When the loop variable j=2, read the second solder joint information in the first solder joint information data table: solder joint coordinates, solder joint connected component ID, number of welding layers, create a solder joint unit according to the solder joint information and solder joint creation function, and store it in the above Component;

[0093] 10. Similarly, when the loop variable j=L2, read the last solder joint information in the first solder joint information data table: solder joint coordinates, solder joint connected component ID, number of welding layers, create a solder joint unit according to the solder joint information and solder joint creation function, and store it in the above Component;

[0094] 11. When the loop variable i=2, extract the name of the second solder joint information data table;

[0095] 12. Create a Component with the same name as the second solder joint information data table above;

[0096] 13. Calculate the number of solder joint information in the second solder joint information data table, and record it as L2;

[0097] 14. When the loop variable j=1, read the first solder joint information in the second solder joint information data table: solder joint coordinates, solder joint connected component ID, number of welding layers, create a solder joint unit according to the solder joint information and solder joint creation function, and store it in the above Component;

[0098] 15. When the loop variable j=2, read the second solder point information in the second solder point information data table: solder point coordinates, component ID connected to the solder point, number of soldering layers, create a solder point unit according to the solder point information and solder point creation function, and store it in the above Component;

[0099] 16. Similarly, when the loop variable j=L2, read the last solder joint information in the second solder joint information data table: solder joint coordinates, solder joint connected component ID, number of welding layers, create a solder joint unit according to the solder joint information and solder joint creation function, and store it in the above Component;

[0100] 17. When the loop variable i=L1, extract the name of the last solder joint information data table mentioned above;

[0101] 18. Create a Component with the same name as the last solder joint information data table mentioned above;

[0102] 19. Calculate the number of solder joint information in the last solder joint information data table, and record it as L2;

[0103] 20. When the loop variable j=1, read the first solder joint information in the last solder joint information data table: solder joint coordinates, component ID connected to the solder joint, number of soldering layers, create a solder joint unit according to the solder joint information and solder joint creation function, and store it in the above Component;

[0104] 21. When the loop variable j=2, read the second solder joint information in the last solder joint information data table: solder joint coordinates, solder joint connected component ID, number of welding layers, create a solder joint unit according to the solder joint information and solder joint creation function, and store it in the above Component;

[0105] 22. Similarly, when the loop variable j=L2, read the last solder joint information in the last solder joint information data table: solder joint coordinates, solder joint connected component ID, number of welding layers, create a solder joint unit according to the solder joint information and solder joint creation function, and store it in the above Component;

[0106] 23. Create an Assembly with the same name as the solder joint folder above;

[0107] 24. Add the above Component to the above Assembly;

[0108] 25. A pop-up window prompts the user that the solder point creation is complete.

[0109] By using Tcl / Tk language, the above steps can be compiled into a script file to realize batch automatic creation of solder joints.

[0110] In this embodiment, by reading the solder joint information in the solder joint information data table, and creating at least one solder joint unit associated with the initial model according to the solder joint information, and storing the created solder joint unit in the corresponding target component, and adding each target component to the corresponding target module, the target module is a module in the target application, and the target component is a component in the target application, it is possible to automatically create solder joint units during CAE finite element analysis modeling, effectively reduce labor costs, improve the creation efficiency of solder joint units, and improve the creation effect. By configuring a preset folder with a multi-layer structure, it is possible to better simulate the actual application scenario requirements, so that the processing logic of CAE modeling analysis is more in line with the actual application situation, which is convenient for the operation of CAE analysts, and realizes the automatic reading of solder joint information in the solder joint information data table in an all-round way. It is possible to realize the hierarchical creation and storage of solder joint units corresponding to solder joint information of different levels and structures, while improving the creation efficiency, making the creation logic clearer, effectively avoiding missed creation and creation errors, and improving the creation accuracy.

[0111] Figure 3 It is a flow chart of a solder joint creation method proposed in another embodiment of the present invention.

[0112] See also Figure 3 , the method comprising:

[0113] S301: creating an initial model of at least one solder joint unit as a target model, and determining a plurality of solder joints to be inspected from the target model.

[0114] Among them, the solder joints whose spacing currently needs to be detected can be called solder joints to be detected.

[0115] The CAE pre-processing application HyperMesh can respond to the user's selection instructions and select multiple welds from multiple welds in the target model as welds to be tested. Alternatively, a requirement analysis document entered by the user can be received and the requirements in the requirement analysis document can be automatically analyzed to determine multiple welds to be tested from the target model. There is no limitation to this.

[0116] S302: Obtain coordinate information corresponding to each welding point to be detected.

[0117] S303: Performing spacing detection on a plurality of solder joints to be detected according to the coordinate information.

[0118] In the embodiment of the present invention, the following three distances can be detected: the distance between any two welding points; the distance from any welding point to the edge of the hole; the distance from any welding point to the edge of the part contour, and there is no restriction on this.

[0119] In the specific execution process, the CAE analysis pre-processing application HyperMesh can be started, the CAE model that needs to check the spacing between welds can be imported, and then four levels of sets Set are configured according to preset rules, wherein different levels of sets are used to store welds corresponding to different spacings, and then all welds in the CAE model are marked, and the coordinate information of each weld is extracted, and then the spacing between any two welds is calculated, and the above detection results are stored in the corresponding Set according to the above four levels, and all non-two-dimensional grids are hidden, and only all two-dimensional grids are displayed, and the currently displayed parts are selected one by one, and PLOTEL units are generated in the holes and contour edges of each part, and the above four levels are detected one by one to see if the above PLOTEL units exist within the specified range around each weld, and if so, the weld is stored in the corresponding Set, and the above PLOTEL units are deleted.

[0120] Among them, the coordinate information can be used to describe the coordinate values ​​of the entire vehicle or each welding point in the vehicle in the world coordinate system. The coordinate information can be, for example, the above-mentioned welding point coordinates, or it can also be any other mathematical indicator that can describe the coordinate values ​​of each welding point in the world coordinate system, without limitation.

[0121] The PLOTEL unit refers to the one-dimensional linear unit that can generate holes and contour edges after the sheet metal part is divided into a two-dimensional grid. The two nodes on each one-dimensional linear unit coincide with the corresponding nodes on the two-dimensional grid unit.

[0122] Among them, four levels of sets Set are configured according to preset rules, and the preset rules can be, for example: Set_1—the spacing from the weld point to other weld points, hole edges, and part edges is greater than 0, and less than or equal to 9 Set_2—the spacing from the weld point to other weld points, hole edges, and part edges is greater than 9, and less than or equal to 18 Set_3—the spacing from the weld point to other weld points, hole edges, and part edges is greater than 18, and less than or equal to 25; Set_4—the spacing from the weld point to other weld points, hole edges, and part edges is greater than 25.

[0123] The above-mentioned grade parameters 9, 18, and 25 are a set of preferred empirical data, which vary with the type of analysis model and are not limited thereto.

[0124] In the embodiment of the present invention, by creating an initial model of at least one solder joint unit as a target model, determining multiple solder joints to be detected from the target model, obtaining coordinate information corresponding to each solder joint to be detected, and performing spacing detection on multiple solder joints to be detected according to the coordinate information, not only the solder joint units in CAE finite element analysis modeling are automatically created, the labor cost is effectively reduced, the creation efficiency of solder joint units is improved, and the creation effect is improved. It also realizes the automatic detection of the spacing of solder joint units, enriches the application function of CAE finite element analysis modeling, improves the automatic analysis effect, and improves the user experience.

[0125] Figure 4 It is a flow chart of a solder joint creation method proposed in another embodiment of the present invention.

[0126] See also Figure 4 , the method comprising:

[0127] S401: configuring a plurality of sets of grades according to a preset rule, wherein sets of different grades are used to store solder joints corresponding to different spacings.

[0128] S402: creating an initial model of at least one solder joint unit as a target model, and determining a plurality of solder joints to be inspected from the target model.

[0129] S403: Obtain coordinate information corresponding to each welding point to be detected.

[0130] S404: performing spacing detection according to coordinate information of any two welding points to be detected among the plurality of welding points to be detected, to obtain a plurality of spacings.

[0131] The description of S401 - S404 can be found in the above embodiment and will not be repeated here.

[0132] S405: Divide the solder joints corresponding to each spacing into sets of grades corresponding to each spacing.

[0133] During the specific execution process, the currently displayed parts can also be determined; PLOTEL units are generated at the preset positions of each part; it is detected whether the generated PLOTEL units exist within the preset distance range of each weld to be detected; if the PLOTEL units exist, the welds to be detected are divided into sets of corresponding grades; after all welds to be detected are detected, the PLOTEL units are deleted, which can effectively ensure the detection accuracy and realize the detection of the distance from the weld to be detected to the edge of the hole and the edge of the part, making the detection more comprehensive and improving the automatic detection effect.

[0134] See also Figure 5 , Figure 5 Schematic diagram of a PLOTEL unit in an embodiment of the present invention.

[0135] As an example, see the following:

[0136] 1. Open the CAE analysis pre-processing application HyperMesh and import the CAE model for which the solder joint spacing needs to be checked;

[0137] 2. Create four Sets according to the four levels (0,9], (9,18], (18,25], (25,∞), and set their initial contents to empty:

[0138] Set_1—The distance from the weld point to other weld points, hole edge, and part edge is greater than 0 and less than or equal to 9;

[0139] Set_2—The distance from the weld point to other weld points, hole edge, and part edge is greater than 9 and less than or equal to 18;

[0140] Set_3—The distance from the weld point to other weld points, hole edge, and part edge is greater than 18 and less than or equal to 25;

[0141] Set_4—The distance between the welding point and other welding points, the edge of the hole, and the edge of the part is greater than 25;

[0142] 3. Hide all non-2D meshes and only display all 2D meshes in the model;

[0143] 4. Mark the currently displayed parts and generate PLOTEL units at the holes and contour edges of each part;

[0144] 5. Mark all the welding points in the current CAE model and count their number as n;

[0145] 6. Extract the coordinates of all solder joints in the above CAE model;

[0146] 7. When the loop variable i=1, calculate the distance between the first solder joint and the remaining n-1 solder joints, and store the relevant solder joints in the corresponding Set according to the above four levels; and detect whether the above PLOTEL unit exists in the corresponding range around the first solder joint according to the above four levels, and if so, store the solder joint in the corresponding Set;

[0147] 8. When the loop variable i=2, calculate the distance between the second solder joint and the remaining n-2 solder joints (remove the distance between the first solder joint, and store the relevant solder joints in the corresponding Set according to the above four levels; and detect whether the above PLOTEL unit exists in the corresponding range around the second solder joint according to the above four levels, and if so, store the solder joint in the corresponding Set;

[0148] 9. Similarly, when the loop variable i=n-1, the distance between the n-1th solder joint and the nth solder joint is calculated, and the relevant solder joints are stored in the corresponding Set according to the above four levels; and the above four levels are used to detect whether the above PLOTEL unit exists in the corresponding range around the n-1th solder joint, and if so, the solder joint is stored in the corresponding Set;

[0149] 10. Detect whether the above-mentioned PLOTEL unit exists in the corresponding range around the nth solder joint according to the above-mentioned four levels. If so, store the solder joint in the corresponding Set;

[0150] 11. Delete the above PLOTEL unit.

[0151] By using Tcl / Tk language and compiling the above steps into a script file, batch and automated inspection of solder joint spacing in CAE models can be realized.

[0152] In the embodiment of the present invention, by taking the initial model that creates at least one solder joint unit as the target model, determining multiple solder joints to be detected from the target model, obtaining the coordinate information corresponding to each solder joint to be detected, and performing spacing detection on multiple solder joints to be detected according to the coordinate information, not only the solder joint units in CAE finite element analysis modeling are automatically created, the labor cost is effectively reduced, the creation efficiency of solder joint units is improved, and the creation effect is improved. It also realizes the automatic detection of the spacing of solder joint units, enriches the application function of CAE finite element analysis modeling, improves the automatic analysis effect, and improves the user experience. By determining the currently displayed parts; generating PLOTEL units at the preset positions of each part; detecting whether the generated PLOTEL units exist within the preset distance range of each solder joint to be detected; if the PLOTEL units exist, the solder joints to be detected are divided into the corresponding grade set; after all the solder joints to be detected are detected, the PLOTEL units are deleted, batch spacing detection is realized, and the detection logic is clear, which is convenient for the development and maintenance of the corresponding program code and improves the detection effect. It can effectively guarantee the detection accuracy and realize the detection of the distance from the weld to the edge of the hole and the edge of the part, making the detection more comprehensive and improving the effect of automated detection.

[0153] Figure 6 It is a structural schematic diagram of a welding spot creation device proposed in one embodiment of the present invention.

[0154] See also Figure 6 , the device 600 comprises:

[0155] The reading module 601 is used to read the solder joint information in the solder joint information data table;

[0156] A first creation module 602, used to create at least one solder joint unit associated with the initial model according to the solder joint information;

[0157] The storage module 603 is used to store the created solder joint unit into the corresponding target component, where the target component is a component in the target application program;

[0158] The adding module 604 is used to add each target component to the corresponding target module, where the target module is a module in the target application.

[0159] Optionally, in some embodiments, the reading module 601 is specifically configured to:

[0160] Read the solder joint information in each solder joint information data table from the preset folder.

[0161] Figure 7 It is a structural schematic diagram of a welding spot creation device proposed in another embodiment of the present invention.

[0162] See also Figure 7 , the device 600 further includes:

[0163] The generation module 605 is used to generate a corresponding target component according to the table information of the solder joint information data table; the target component is used to store at least one solder joint unit created based on the solder joint information in the solder joint information data table.

[0164] Optionally, in some embodiments, the apparatus 600 further includes:

[0165] The second creation module 606 is used to determine the folder information of the folder to which the solder joint information data table corresponding to the solder joint unit belongs, and to create a target module corresponding to the folder according to the folder information.

[0166] Figure 8 It is a structural schematic diagram of a welding spot creation device proposed in another embodiment of the present invention.

[0167] See also Figure 8 , the device 800 comprises:

[0168] A determination module 801 is used to create an initial model of at least one solder joint unit as a target model, and determine a plurality of solder joints to be detected from the target model;

[0169] The acquisition module 802 is used to acquire the coordinate information corresponding to each welding point to be detected;

[0170] The detection module 803 is used to perform spacing detection on multiple welding points to be detected according to the coordinate information.

[0171] Fig. 9 It is a structural schematic diagram of a welding spot creation device proposed in another embodiment of the present invention.

[0172] See also Fig. 9 , the device 800 further includes:

[0173] The configuration module 804 is used to configure a plurality of sets of grades according to a preset rule, wherein sets of different grades are used to store solder joints corresponding to different spacings.

[0174] Optionally, in some embodiments, the apparatus 800 further includes:

[0175] The division module 805 is used to perform spacing detection based on the coordinate information of any two welding points to be detected among the multiple welding points to be detected, to obtain multiple spacings; and to divide the welding points corresponding to each spacing into a set of grades corresponding to each spacing.

[0176] Optionally, in some embodiments, see Fig. 9 , the detection module 803 includes:

[0177] Determine submodule 8051, used to determine the currently displayed part;

[0178] A generating submodule 8052 is used to generate PLOTEL units at preset positions of each part;

[0179] The judgment submodule 8053 is used to detect whether the generated PLOTEL unit exists within a preset distance range of each welding point to be detected;

[0180] The detection submodule 8054 is used to classify the solder joints to be detected into sets of corresponding grades when PLOTEL units exist, and to delete the PLOTEL units after all the solder joints to be detected are detected.

[0181] It should be noted that the above Figure 1-Figure 4 The explanation of the solder joint creation method embodiment in the embodiment is also applicable to the solder joint creation devices 600 and 800 of this embodiment, and the implementation principles are similar, which will not be repeated here.

[0182] In this embodiment, by reading the solder joint information in the solder joint information data table, and creating at least one solder joint unit associated with the initial model based on the solder joint information, and storing the created solder joint unit in the corresponding target component, and adding each target component to the corresponding target module, the target module is a module in the target application, and the target component is a component in the target application, it is possible to automatically create solder joint units during CAE finite element analysis modeling, effectively reduce labor costs, improve the creation efficiency of solder joint units, and improve the creation effect.

[0183] Fig.10 It is a structural schematic diagram of an electronic device provided by an embodiment of the present invention.

[0184] The electronic device 1000 includes: a memory 1001, a processor 1002, and a computer program stored in the memory 1001 and executable on the processor 1002. When the processor 1002 executes the program, the solder joint creation method in the above embodiment is implemented.

[0185] In a possible implementation, the electronic device further includes a communication interface 1003 for communication between the memory 1001 and the processor 1002 .

[0186] It should be noted that the above Figure 1-Figure 4 The explanation of the solder joint creation method in the embodiment is also applicable to the electronic device 1000 of this embodiment, and the implementation principle is similar, which will not be repeated here.

[0187] In this embodiment, by reading the solder joint information in the solder joint information data table, and creating at least one solder joint unit associated with the initial model based on the solder joint information, and storing the created solder joint unit in the corresponding target component, and adding each target component to the corresponding target module, the target module is a module in the target application, and the target component is a component in the target application, it is possible to automatically create solder joint units during CAE finite element analysis modeling, effectively reduce labor costs, improve the creation efficiency of solder joint units, and improve the creation effect.

[0188] This embodiment also provides a computer-readable storage medium on which a computer program is stored, wherein the program implements the above solder joint creation method when executed by a processor.

[0189] It should be noted that, in the description of the present invention, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, in the description of the present invention, unless otherwise specified, the meaning of "plurality" is two or more.

[0190] Any process or method description in a flowchart or otherwise described herein may be understood to represent a module, segment or portion of code that includes one or more executable instructions for implementing the steps of a specific logical function or process, and the scope of the preferred embodiments of the present invention includes alternative implementations in which functions may not be performed in the order shown or discussed, including performing functions in a substantially simultaneous manner or in the reverse order depending on the functions involved, which should be understood by those skilled in the art to which the embodiments of the present invention belong.

[0191] It should be understood that the various parts of the present invention can be implemented by hardware, software, firmware or a combination thereof. In the above-mentioned embodiments, a plurality of steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented by hardware, as in another embodiment, it can be implemented by any one of the following technologies known in the art or their combination: a discrete logic circuit having a logic gate circuit for implementing a logic function for a data signal, a dedicated integrated circuit having a suitable combination of logic gate circuits, a programmable gate array (PGA), a field programmable gate array (FPGA), etc.

[0192] A person skilled in the art may understand that all or part of the steps in the method for implementing the above-mentioned embodiment may be completed by instructing related hardware through a program, and the program may be stored in a computer-readable storage medium, which, when executed, includes one or a combination of the steps of the method embodiment.

[0193] In addition, each functional unit in each embodiment of the present invention may be integrated into a processing module, or each unit may exist physically separately, or two or more units may be integrated into one module. The above-mentioned integrated module may be implemented in the form of hardware or in the form of a software functional module. If the integrated module is implemented in the form of a software functional module and sold or used as an independent product, it may also be stored in a computer-readable storage medium.

[0194] The storage medium mentioned above can be a read-only memory, a magnetic disk or an optical disk, etc.

[0195] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0196] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A method for creating a solder joint, characterized in that: include: Read the solder joint information in the solder joint information data table; Creating at least one solder joint unit associated with the initial model according to the solder joint information; The created solder joint units are stored in corresponding target components, and each target component is added to a corresponding target module, wherein the target module is a module in a target application, and the target component is a component in the target application; The step of creating at least one solder joint unit associated with the initial model according to the solder joint information comprises: when there is one solder joint information, creating a solder joint unit associated with the initial model and corresponding to the one solder joint information according to the one solder joint information; when there are multiple solder joint information, creating solder joint units corresponding to each solder joint information respectively, and creating multiple solder joint units; Also includes: Using the initial model of the at least one solder joint unit as a target model, and determining a plurality of solder joints to be inspected from the target model; Obtaining coordinate information corresponding to each of the welding points to be detected; Performing spacing detection on the plurality of welding points to be detected according to the coordinate information; Before determining a plurality of welding points to be detected from the target model, the method further includes: According to preset rules, multiple sets of grades are configured, wherein sets of different grades are used to store solder joints corresponding to different spacings; The performing spacing detection on the plurality of welding points to be detected according to the coordinate information comprises: According to the coordinate information of any two welding points to be detected among the multiple welding points to be detected, the spacing detection is performed to obtain multiple spacings; and the welding points corresponding to each of the spacings are divided into sets of grades corresponding to each of the spacings.

2. The solder joint creation method according to claim 1, characterized in that: The step of reading solder joint information in a solder joint information data table includes: The soldering point information in each soldering point information data table is read from a preset folder.

3. The solder joint creation method according to claim 1, characterized in that: After reading the solder joint information in the solder joint information data table, the method further includes: The corresponding target component is generated according to the table information of the solder joint information data table; the target component is used to store at least one solder joint unit created based on the solder joint information in the solder joint information data table.

4. The solder joint creation method according to claim 2, characterized in that: The step of storing the created solder joint units in corresponding target components and adding each target component to the corresponding target module comprises: Determine the folder information of the folder to which the solder point information data table corresponding to the solder point unit belongs; A target module corresponding to the folder is created according to the folder information.

5. The solder joint creation method according to claim 1, characterized in that: The performing spacing detection on the plurality of welding points to be detected according to the coordinate information further includes: Determine the part currently displayed; Generating PLOTEL units at preset positions of each of the parts; Detecting whether there is a generated PLOTEL unit within a preset distance range of each of the solder joints to be detected; If the PLOTEL unit exists, the solder joints to be inspected are divided into sets of corresponding grades; After all the solder joints to be detected are detected, the PLOTEL unit is deleted.

6. A welding point creation device, characterized in that: include: A reading module, used for reading solder joint information in a solder joint information data table; A first creation module, used to create at least one welding point unit associated with the initial model according to the welding point information; A storage module, used to store the created solder joint unit into a corresponding target component, wherein the target component is a component in a target application; An adding module, used to add each of the target components to a corresponding target module, wherein the target module is a module in the target application; The first creation module is further used for: when the number of the soldering point information is one, creating a soldering point unit associated with the initial model and corresponding to the soldering point information according to the soldering point information; When there are multiple solder joint information, create solder joint units corresponding to each solder joint information respectively, and create multiple solder joint units; Also includes: A determination module, configured to use the initial model for creating the at least one solder joint unit as a target model, and determine a plurality of solder joints to be detected from the target model; An acquisition module, used to acquire coordinate information corresponding to each of the welding points to be detected; A detection module, used for performing spacing detection on the plurality of welding points to be detected according to the coordinate information; Also includes: A configuration module, used to configure a plurality of sets of grades according to a preset rule, wherein sets of different grades are used to store solder joints corresponding to different spacings; Also includes: The division module is used to perform spacing detection according to the coordinate information of any two welding points to be detected among the multiple welding points to be detected to obtain multiple spacings; and divide the welding points corresponding to each of the spacings into a set of grades corresponding to each of the spacings.

7. The solder joint creation device according to claim 6, characterized in that: The reading module is specifically used for: The soldering point information in each soldering point information data table is read from a preset folder.

8. The solder joint creation device according to claim 6, characterized in that: The device further comprises: A generation module is used to generate the corresponding target component according to the table information of the solder point information data table; the target component is used to store at least one solder point unit created based on the solder point information in the solder point information data table.

9. The solder joint creation device according to claim 7, characterized in that: The device comprises: The second creation module is used to determine the folder information of the folder to which the solder joint information data table corresponding to the solder joint unit belongs, and to create a target module corresponding to the folder according to the folder information.

10. The solder joint creation device according to claim 6, characterized in that: The detection module comprises: Determine submodule, used to determine the currently displayed part; A generating submodule, for generating PLOTEL units at preset positions of each of the parts; A judgment submodule, used for detecting whether there is a generated PLOTEL unit within a preset distance range of each of the solder joints to be detected; The detection submodule is used to classify the solder joints to be detected into sets of corresponding grades when the PLOTEL unit exists, and to delete the PLOTEL unit after all the solder joints to be detected are detected.

11. An electronic device, characterized in that: include: A memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the program, the solder joint creation method according to any one of claims 1 to 5 is implemented.

12. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the program is executed by a processor, the solder joint creation method according to any one of claims 1 to 5 is implemented.

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