Color filter manufacturing method, color filter, and resin composition

Abstract

The present invention relates to a method for manufacturing a color filter, a color filter, and a resin composition. The subject of the present invention is to provide a method for manufacturing a color filter that does not require the use of fluororesin as a material for a partition wall and can use a material that can be easily removed by ashing to form a partition wall with a low refractive index, a color filter that can be manufactured using the method for manufacturing a color filter, and a resin composition that can be suitably used in the method for manufacturing a color filter. The solution is to form a partition wall using a resin containing bubbles and having an inorganic component content of 5% by mass or less, or a resin composition containing bubbles.

Description

Technical Field

[0001] The present invention relates to a method for producing a color filter, a color filter that can be produced by the method for producing a color filter, and a resin composition that can be suitably used in the method for producing a color filter. Background Art

[0002] Conventionally, various image display devices such as solid-state imaging devices and liquid crystal display devices use a color filter including red (R), green (G), blue (B) and other color layers arranged in a matrix and partitions separating the color layers.

[0003] As the color filter, for example, a color filter for a solid-state imaging device having a color layer arranged in a matrix and a low refractive index layer formed of a fluororesin as a partition separating the plurality of color layers has been proposed (Patent Document 1). The color filter can be manufactured using a simplified manufacturing process and can well suppress color mixing caused by light incident obliquely with respect to the color filter.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2006-295125 Summary of the invention

[0007] Problems to be solved by the invention

[0008] However, the color filter described in Patent Document 1 has the advantage of being able to be manufactured using a simplified manufacturing process, but on the other hand, it also has disadvantages caused by the partition wall being formed of a fluororesin having high liquid repellency. Specifically, Patent Document 1 discloses the following method: using a spin coating method, a coating liquid containing a fluororesin is filled in the gap between the coloring layers arranged in a matrix, thereby forming the partition wall. However, in the method described in Patent Document 1, due to the liquid repellency of the fluororesin, depending on the size of the gap, it is sometimes difficult for the coating liquid containing the fluororesin to penetrate into the gap well.

[0009] The material of the partition wall is preferably low in refractive index and can be easily removed by ashing for the purpose of facilitating removal when a defect occurs during processing during the manufacture of the partition wall or during the manufacture of the color filter.

[0010] The present invention is made in view of the above-mentioned problems, and its purpose is to provide a method for manufacturing a color filter that does not require the use of fluororesin as the material of the partition wall and can use a material that can be easily removed by ashing to form a low-refractive index partition wall, a color filter that can be manufactured using the color filter manufacturing method, and a resin composition that can be suitably used in the aforementioned color filter manufacturing method.

[0011] Means for solving problems

[0012] The inventors of the present application have found that the above-mentioned problems can be solved by forming the partition walls using a resin or a resin composition containing bubbles and having an inorganic component content of 5% by mass or less, thereby completing the present invention.

[0013] A first aspect of the present invention is a method for manufacturing a color filter, wherein the color filter comprises, on a substrate, a light-transmitting color layer and a partition wall which contacts both adjacent color layers without a gap, separates the adjacent color layers, and has a refractive index lower than that of the color layer.

[0014] The manufacturing method comprises the following steps:

[0015] a coloring layer forming step of forming, on a substrate, a plurality of coloring layers arranged so as to have gaps at positions corresponding to partition walls; and

[0016] a partition wall forming step of filling the voids with a resin containing bubbles, a resin composition containing bubbles, a cured product of a resin containing bubbles, or a cured product of a resin composition containing bubbles to form partition walls;

[0017] The content of the inorganic component in the resin, the resin composition, the cured product of the resin, or the cured product of the resin composition is 5% by mass or less.

[0018] A second aspect of the present invention is a method for manufacturing a color filter, wherein the color filter comprises, on a substrate, a light-transmitting color layer and a partition wall which contacts both adjacent color layers without a gap, separates the adjacent color layers, and has a refractive index lower than that of the color layer.

[0019] The manufacturing method comprises the following steps:

[0020] A precursor film forming step of forming a precursor film of a partition wall on a substrate;

[0021] A mask forming step of forming a mask at a position on the precursor film corresponding to the partition wall;

[0022] an ashing step of ashing the mask and the precursor film to remove the portion of the precursor film not covered by the mask and leave the portion of the precursor film covered by the mask as a partition wall;

[0023] The step of removing the mask; and

[0024] a coloring layer forming step of forming a coloring layer in the region divided by the partition wall;

[0025] The precursor film is formed of a resin containing bubbles, a resin composition containing bubbles, a cured product of a resin containing bubbles, or a cured product of a resin composition containing bubbles.

[0026] The content of the inorganic component in the resin, the resin composition, the cured product of the resin, or the cured product of the resin composition is 5% by mass or less.

[0027] A third aspect of the present invention is a color filter comprising, on a substrate, a light-transmitting color layer and a partition wall which contacts both adjacent color layers without a gap, separates the adjacent color layers, and has a refractive index lower than that of the color layer.

[0028] The partition wall is formed of a resin containing bubbles, a resin composition containing bubbles, a cured product of a resin containing bubbles, or a cured product of a resin composition containing bubbles.

[0029] The content of the inorganic component in the resin, the resin composition, the cured product of the resin, or the cured product of the resin composition is 5% by mass or less.

[0030] The fourth embodiment of the present invention is a resin composition comprising (A) a resin, (B) hollow particles whose shell portion is composed of a resin, and (S) an organic solvent, which is used in the method for manufacturing a color filter involved in the first embodiment or the second embodiment, wherein the partition wall or the precursor film is formed by a resin composition comprising (A) a resin and (B) hollow particles whose shell portion is composed of a resin, or a cured product of the resin composition.

[0031] Effects of the Invention

[0032] According to the present invention, there can be provided a method for manufacturing a color filter which does not require the use of fluororesin as the material for the partition wall and can use a material that can be easily removed by ashing to form a low-refractive-index partition wall, a color filter that can be manufactured using the method for manufacturing the color filter, and a resin composition that can be suitably used in the method for manufacturing the color filter. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] [ Figure 1 ] is a diagram schematically showing a method for manufacturing a color filter involved in the first embodiment.

[0034] [ Figure 2 ] is a diagram schematically showing a method for manufacturing a color filter involved in the second embodiment.

[0035] Description of Reference Numerals

[0036] 1 Color Filter

[0037] 10 substrate

[0038] 11 Coloring Layer

[0039] 12 Next Door

[0040] 13 Precursor membrane

[0041] 14 Mask DETAILED DESCRIPTION

[0042] The First Way

[0043] In the method for manufacturing a color filter according to a first aspect, the color filter comprises, on a substrate, a light-transmitting color layer and a partition wall which contacts both adjacent color layers without a gap, separates the adjacent color layers, and has a refractive index lower than that of the color layer.

[0044] The manufacturing method comprises the following steps:

[0045] a coloring layer forming step of forming, on a substrate, a plurality of coloring layers arranged so as to have gaps at positions corresponding to partition walls; and

[0046] a partition wall forming step of filling the voids with a resin containing bubbles, a resin composition containing bubbles, a cured product of a resin containing bubbles, or a cured product of a resin composition containing bubbles to form partition walls;

[0047] The content of the inorganic component in the resin, the resin composition, the cured product of the resin, or the cured product of the resin composition is 5% by mass or less.

[0048] See below Figure 1 , a method for manufacturing a color filter according to the first embodiment is described.

[0049] <Coloring Layer Formation Step>

[0050] like Figure 1 As shown in (a), in the above method, first, a plurality of colored layers 11 are formed on a substrate 10 so as to have gaps at positions corresponding to the partition walls 12 .

[0051] The substrate 10 is not particularly limited, and can be appropriately selected from known substrates 10 according to the type of device to which the color filter 1 is applied.

[0052] Typically, a plurality of color layers 11 of red (R), green (G), blue (B), etc. arranged in a matrix are formed on the substrate 10 according to the size of the substrate 10. The method of forming the plurality of color layers 11 arranged in a matrix is ​​not particularly limited.

[0053] As a method for forming a red (R), green (G), and blue (B) colored layer 11 in a matrix arrangement on a substrate 10, for example, the following method can be cited: using a photosensitive composition of three colors of red (R), green (G), and blue (B), the operation of forming each color colored layer based on a photolithography method is repeated three times.

[0054] The thickness of the formed colored layer 11 is not particularly limited and can be appropriately determined in consideration of the type of device to which the color filter 1 is applied, performance, etc. The thickness of the colored layer 11 is, for example, preferably 0.1 μm to 10 μm, more preferably 0.5 μm to 5 μm.

[0055] The width of the space between the coloring layers 11 is not particularly limited and can be appropriately determined in consideration of the type of device to which the color filter 1 is applied, performance, etc. The width of the space between the coloring layers 11 is preferably 0.1 μm to 5 μm, and more preferably 0.3 μm to 2 μm.

[0056] When the width of the space between the colored layers 11 is within the above range, the space can be easily filled with the material of the partition 12 in the subsequent partition forming step.

[0057] <Partition Rib Formation Step>

[0058] In the partition wall forming process, Figure 1 As shown in (b), the gaps between the colored layers 11 formed in the colored layer forming step are filled with a resin containing bubbles, a resin composition containing bubbles, a cured product of a resin containing bubbles, or a cured product of a resin composition containing bubbles to form partition walls 12.

[0059] Here, the resin, resin composition, cured product of the resin, or cured product of the resin composition filled in the gap contains bubbles. That is, bubbles are contained in the partition wall 12. By making the resin, resin composition, cured product of the resin, or cured product of the resin composition contain bubbles, the partition wall 12 having a lower refractive index than the colored layer can be formed.

[0060] The resin or resin composition can be filled in the gap in the following manner: a liquid composition containing a resin and a solvent is filled in the gap, and then the solvent is removed by heating or the like. From the perspective of the ease with which the resin or resin composition can be filled in the gap, the resin contained in the liquid composition is preferably a fluorine-free resin. As the resin contained in the liquid composition, (meth) acrylic resin, polyester resin, polyamide resin, cyclic olefin resin, etc. can be used, but are not limited to these.

[0061] The resin or resin composition may be a cured product of a curable material. In this case, after a liquid composition containing an uncured resin precursor is filled in the gap, the liquid composition filled in the gap is cured by heating or exposure, thereby filling the gap with a cured product of the resin or a cured product of the resin composition.

[0062] As the curable material that can be used as a resin precursor, it is not particularly limited as long as it is a material that provides a translucent cured product. The curable material can be a thermosetting material or a photocurable material. In addition, the curable material is preferably used together with a curing agent as required. As a curing agent, a photosensitive curing agent or a thermosensitive curing agent can also be used.

[0063] Typical examples of thermosetting materials include isocyanate compounds, melamine compounds, oxetane compounds, epoxy compounds, etc. Among these, epoxy compounds and oxetane compounds are preferred from the perspective of good curability, and epoxy compounds are more preferred. As epoxy compounds, polyfunctional epoxy compounds are preferred. Here, polyfunctional epoxy compounds are epoxy compounds having two or more epoxy groups in one molecule.

[0064] Typical examples of photocurable materials include compounds having unsaturated double bonds such as various (meth)acrylates. The photocurable compounds include monofunctional compounds and polyfunctional compounds.

[0065] Examples of the monofunctional compound include (meth)acrylamide, hydroxymethyl (meth)acrylamide, methoxymethyl (meth)acrylamide, ethoxymethyl (meth)acrylamide, propoxymethyl (meth)acrylamide, butoxymethoxymethyl (meth)acrylamide, N-hydroxymethyl (meth)acrylamide, N-hydroxymethyl (meth)acrylamide, (meth)acrylic acid, fumaric acid, maleic acid, maleic anhydride, itaconic acid, itaconic anhydride, citraconic acid, citraconic anhydride, crotonic acid, 2-acrylamide-2-methylpropanesulfonic acid, tert-butylacrylamidesulfonic acid, methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, (meth)acrylic acid, 2-Ethylhexyl acrylate, cyclohexyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 2-phenoxy-2-hydroxypropyl (meth)acrylate, 2-(meth)acryloyloxy-2-hydroxypropyl phthalate, glycerol mono(meth)acrylate, tetrahydrofurfuryl (meth)acrylate, N,N-dimethylaminoethyl (meth)acrylate, glycidyl (meth)acrylate, 2,2,2-trifluoroethyl (meth)acrylate, 2,2,3,3-tetrafluoropropyl (meth)acrylate, semi-(meth)acrylate of phthalic acid derivatives, etc. These monofunctional compounds can be used alone or in combination of two or more.

[0066] Examples of the polyfunctional compound include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, butanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, glycerol di(meth)acrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 2,2-bis(4-(meth)acryloyloxydiethoxyphenyl)propane alkane, 2,2-bis(4-(meth)acryloxypolyethoxyphenyl)propane, 2-hydroxy-3-(meth)acryloxypropyl(meth)acrylate, ethylene glycol diglycidyl ether di(meth)acrylate, diethylene glycol diglycidyl ether di(meth)acrylate, phthalic acid diglycidyl ester di(meth)acrylate, glycerol triacrylate, glycerol polyglycidyl ether poly(meth)acrylate, urethane (meth)acrylate (i.e., toluene diisocyanate), a reaction product of trimethylhexamethylene diisocyanate and hexamethylene diisocyanate and 2-hydroxyethyl (meth)acrylate, methylenebis(meth)acrylamide, (meth)acrylamide methylene ether, a condensate of a polyol and N-hydroxymethyl (meth)acrylamide, and 1,3,5-triacryloylhexahydro-1,3,5-triazine. These polyfunctional compounds may be used alone or in combination of two or more.

[0067] Bubble can be included in the matrix formed by resin, resin combination, the cured product of resin or the cured product of resin combination in the state without shell (shell), and can also be included in the matrix formed by resin, resin combination, the cured product of resin or the cured product of resin combination in the state with shell.From the aspect that bubble size in easily regulating resin, resin combination, the cured product of resin or the cured product of resin combination, bubble is easily stably dispersed, it is preferably included in the matrix formed by resin, resin combination, the cured product of resin or the cured product of resin combination with the bubble of shell.With regard to the bubble with shell, it is included in resin, resin combination, the cured product of resin or the cured product of resin combination by adding hollow particles to resin or resin combination.

[0068] As described later, the resin, resin composition, cured product of the resin, or cured product of the resin composition constituting the partition wall 12 contains only a small amount of inorganic components. Therefore, as the hollow particles, hollow particles having a shell portion composed of a resin are preferably used.

[0069] As a method for including bubbles in a resin, a resin composition, a cured product of a resin, or a cured product of a resin composition, for example, there can be cited: a method in which a known microbubble generating device or a nanobubble generating device is used to blow tiny bubbles into a liquid composition for forming the partition wall 12; a method in which a foaming agent that generates gas by thermal decomposition or chemical reaction is included in a liquid composition for forming the partition wall 12, and foaming is generated in the liquid composition; and the like.

[0070] The bubble content of the partition walls 12 is not particularly limited and can be appropriately determined in consideration of the refractive index of the partition walls 12 .

[0071] The content of inorganic components in the resin, resin composition, cured product of the resin, or cured product of the resin composition constituting the partition wall 12 is 5 mass % or less, more preferably 3 mass % or less, further preferably 1 mass % or less, and particularly preferably 0 mass %.

[0072] By making the content of the inorganic component 5% by mass or less, the material constituting the partition 12 can be easily removed by ashing. In the case where the coloring layer 11 also does not contain an inorganic component or substantially contains no inorganic component, and in the case where a defect is observed in the coloring layer 11 or the partition 12 after the color filter 1 is formed, the coloring layer 11 and the partition 12 can be removed by ashing, and the substrate 10 can be reused.

[0073] On the other hand, when the resin, resin composition, resin cured product, or resin composition cured product constituting the partition wall 12 contains a large amount of inorganic components, a large amount of residue derived from the inorganic components is generated, making it difficult to remove the partition wall by ashing.

[0074] For the same reason as that described for the partition walls 12 , it is preferred that the colored layer 11 also does not contain an inorganic component such as copper phthalocyanine from the viewpoint of being able to easily perform ashing.

[0075] The ashing method is not particularly limited as long as it is a method that does not cause unacceptable damage to the substrate 10 .

[0076] A preferred ashing method is a method using oxygen plasma. In order to ash the colored layer 11 and the partition wall 12 on the substrate 10 using oxygen plasma, a known oxygen plasma generating device is used to generate oxygen plasma, and the colored layer 11 and the partition wall 12 on the substrate 10 are irradiated with the oxygen plasma.

[0077] As the gas used for generating oxygen plasma, various gases conventionally used together with oxygen in plasma processing may be mixed, such as nitrogen, hydrogen, helium, and the like.

[0078] The ashing conditions using oxygen plasma are not particularly limited, and the treatment time is, for example, in the range of 10 seconds to 20 minutes, preferably in the range of 20 seconds to 18 minutes, and more preferably in the range of 30 seconds to 15 minutes.

[0079] There is no particular limitation on the method for filling the gaps between the colored layers 11 with a resin, a resin composition, a cured product of a resin, or a cured product of a resin composition. For example, after applying a liquid composition containing a resin, a resin composition, or a curable material to the entire surface of the substrate 10, the solvent is removed from the liquid composition filled in the gaps, or the curable material filled in the gaps is cured, thereby filling the gaps with a resin or a resin composition.

[0080] As a method for applying the liquid composition to the entire surface of the substrate 10, it is preferred to use a contact transfer coating device such as a roll coater, a reverse coater, or a rod coater, or a non-contact coating device such as a spin coater (rotary coating device) or a curtain coater, and a method using a spin coater is more preferred.

[0081] Alternatively, the liquid composition may be supplied only to the gaps by a printing method such as an inkjet printing method.

[0082] When a coating film covering the surface of the colored layer 11 other than the voids is formed after the liquid composition is applied, the coating film can be removed by ashing or the like.

[0083] In the method described above, as the material constituting the partition wall 12, from the aspects of low refractive index, small unevenness of bubble size and distribution, easy removal by ashing, etc., it is preferred to include a resin composition of hollow particles in which (A) a resin and (B) a shell portion are composed of a resin. About this preferred resin composition, it is described in detail as follows.

[0084] By the method described above, the coloring layers 11 and the partitions 12 filling the gaps between the coloring layers 11 are formed on the substrate 10 , thereby obtaining a color filter including the coloring layers 11 and the partitions 12 .

[0085] <Second Method>

[0086] In the method for manufacturing a color filter according to a second aspect, the color filter is a color filter having, on a substrate, a light-transmitting color layer and a partition wall which contacts both adjacent color layers without a gap, separates the adjacent color layers, and has a refractive index lower than that of the color layer.

[0087] The manufacturing method comprises the following steps:

[0088] A precursor film forming step of forming a precursor film of a partition wall on a substrate;

[0089] A mask forming step is to form a mask at a position corresponding to the partition wall on the precursor film.

[0090] an ashing step of ashing the mask and the precursor film to remove the portion of the precursor film not covered by the mask and leave the portion of the precursor film covered by the mask as a partition wall;

[0091] The step of removing the mask; and

[0092] a coloring layer forming step of forming a coloring layer in the region divided by the partition wall;

[0093] The precursor film is formed of a resin containing bubbles, a resin composition containing bubbles, a cured product of a resin containing bubbles, or a cured product of a resin composition containing bubbles.

[0094] The content of the inorganic component in the resin, the resin composition, the cured product of the resin, or the cured product of the resin composition is 5% by mass or less.

[0095] It should be noted that the material of the precursor film is the same as the material of the partition wall to be finally formed. Therefore, the material of the precursor film and the material of the partition wall in the color filter manufacturing method according to the second embodiment are the same as the material of the partition wall described in the color filter manufacturing method according to the first embodiment.

[0096] See below Figure 2 , a method for manufacturing a color filter according to the second embodiment is described.

[0097] <Precursor film forming step>

[0098] In the precursor film forming step, Figure 2 As shown in (a), first, a precursor film 13 of the partition wall 12 is formed on a substrate 10. To form the precursor film 13, the aforementioned liquid composition preferably used for forming the partition wall 12 in the method for manufacturing a color filter according to the first embodiment is used. The liquid composition is applied to the substrate 10, and then the solvent is removed from the coating film by heating or the like as needed, or the coating film is cured by heating or exposure or the like, thereby forming the precursor film 13.

[0099] As a method for applying the liquid composition to the substrate 10, preferably a method using a contact transfer type coating device such as a roll coater, a reverse coater, or a rod coater, or a non-contact type coating device such as a spin coater (rotary coating device) or a curtain coater is used, and a method using a spin coater is more preferred.

[0100] Alternatively, the coating film may be formed by a printing method such as a screen printing method or an inkjet printing method.

[0101] The thickness of the precursor film 13 is the same as that of the colored layer 11. The thickness of the colored layer 11 and the thickness of the precursor film 13 are preferably, for example, 0.1 μm to 10 μm, and more preferably 0.5 μm to 5 μm.

[0102] <Mask Formation Process>

[0103] In the mask forming process, Figure 2 As shown in (b), the mask 14 is formed at the position corresponding to the partition 12 on the precursor film 13. In the subsequent ashing step, the position of the precursor film 13 covered only by the mask 14 is not ashed and remains, and becomes the partition 12.

[0104] The mask 14 may be formed of a material that is durable against ashing, or may be formed of a material that can be ashed. In the former case, after the subsequent ashing process, a laminate of the partition wall 12 and the mask 14 (not shown) remains on the substrate. By treating with a solvent, an alkali, etc., only the mask 14 is removed from the laminate, thereby forming a partition wall on the substrate 10. The latter case will be described as an ashing process. It should be noted that Figure 2 (c) and Figure 2 (d) shows a case where a mask 14 made of a material that can be ashed is used.

[0105] <Ashing process and mask removal process>

[0106] In the ashing step, the mask 14 and the precursor film 13 are ashed to remove the portion of the precursor film 13 not covered by the mask 14 and to leave the portion of the precursor film 13 covered by the mask 14 as the partition 12 .

[0107] In the mask removal step, the mask 14 is removed. The mask removal is performed after the ashing step or simultaneously with the ashing step.

[0108] Here, the case where the mask 14 formed of a material that can be ashed is used is described. In this case, since the mask 14 gradually disappears by ashing, the ashing process and the mask removal process are performed. Figure 2 (c) shows a state where ashing of the precursor film 13 including the mask 14 made of an ashing material has started. Figure 2 In (c), the film thickness of the portion of the precursor film 13 not covered by the mask 14 is reduced by ashing, and the thickness of the mask 14 is also reduced by ashing.

[0109] from Figure 2 (c) shows the state, and further ashing is continued, thereby Figure 2As shown in (d), the portion of the precursor film 13 not covered by the mask 14 is completely removed, and the mask 14 is also removed by ashing, but the portion of the precursor film 13 covered only by the mask 14 remains without being ashed, and becomes the partition 12 .

[0110] The conditions for ashing are not particularly limited as long as barrier ribs 12 in a desired state can be formed.

[0111] As a preferred ashing method, a method using oxygen plasma can be cited. As the gas used in the generation of oxygen plasma, various gases used in plasma treatment together with oxygen in the past can be mixed. As the gas, for example, nitrogen, hydrogen, helium, etc. can be cited.

[0112] The ashing conditions using oxygen plasma are not particularly limited, and the treatment time is, for example, in the range of 10 seconds to 20 minutes, preferably in the range of 20 seconds to 18 minutes, and more preferably in the range of 30 seconds to 15 minutes.

[0113] <Coloring Layer Formation Step>

[0114] In the coloring layer forming step, Figure 2 As shown in (e), the coloring layer 11 is formed in the area divided by the partition wall 12. In the coloring layer forming step, typically, the coloring layers 11 of red (R), green (G), and blue (B) are formed in the area divided by the partition wall 12. As a method for forming the coloring layer 11, the following method can be cited: using a photosensitive composition of three colors of red (R), green (G), and blue (B), the operation of forming the coloring layer of each color by photolithography is repeated three times. Alternatively, the coloring layer 11 can be formed in the area divided by the partition wall 12 by a printing method such as an inkjet printing method using inks for forming the coloring layer 11 of three colors of red (R), green (G), and blue (B).

[0115] 《Resin composition》

[0116] In the method for manufacturing a color filter according to the first embodiment and the method for manufacturing a color filter according to the second embodiment, as a resin composition for forming a partition wall or a precursor film, a resin composition preferably comprises (A) a resin, (B) hollow particles whose shell portion is composed of a resin, and (S) an organic solvent. Below, the essential components and optional components contained in the preferred resin composition are further described.

[0117] <(A) Resin>

[0118] (A) Resin is not particularly limited. As (A) resin, from the aspect of good processability when forming the partition including ashing, a (meth) acrylic resin is preferred. As (meth) acrylic resin, from the aspect of being easy to remove well by ashing, and providing a crosslinked product with excellent solvent resistance and chemical resistance by a curing reaction between epoxy groups, a resin containing a structural unit represented by the following formula (a1) and a structural unit represented by the following formula (a2) is preferred.

[0119] Therefore, in the method for manufacturing a color filter involved in the first embodiment and the method for manufacturing a color filter involved in the second embodiment, the formed partition wall or precursor film preferably includes (B) hollow particles whose shell portion is composed of a resin and (A) a resin, which is a cross-linked product of a resin containing a structural unit represented by the following formula (a1) and a structural unit represented by the following formula (a2).

[0120] [Chemical formula 1]

[0121]

[0122] (In formula (a1) and (a2), R 1 are each independently a hydrogen atom or a methyl group, R 2 is a single bond or an alkylene group having 1 to 5 carbon atoms, R 3 is a monovalent organic group having 2 or more and 30 or less carbon atoms and containing an epoxy group in its structure, R 4 A divalent hydrocarbon group.)

[0123] Hereinafter, the structural unit represented by formula (a1) is also referred to as "structural unit A1", and the structural unit represented by formula (a2) is also referred to as "structural unit A2".

[0124] [Structural unit A1]

[0125] The structural unit A1 represented by the above formula (a1) has 3 It contains epoxy groups, and thus exhibits curing properties as a resin.

[0126] Can be used as R 2 The carbon number of the alkylene group is 1 to 5, preferably 1 to 4, more preferably 1 to 3, and further preferably 1 or 2. Specific examples of the alkylene group include methylene, ethylene, propylene, and butylene.

[0127] R 3 is a monovalent organic group having 2 or more and 30 or less carbon atoms and containing an epoxy group in the structure. The epoxy group also includes an alicyclic epoxy group. 3 The structure may contain a hetero atom or a halogen atom other than the oxygen atom constituting the epoxy group.

[0128] Examples of the hetero atom include a nitrogen atom, a sulfur atom, and a silicon atom. Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.

[0129] The structural unit A1 can be formed, for example, by subjecting a (meth)acrylate having an epoxy group to a polymerization reaction.

[0130] The (meth)acrylate having an epoxy group may be a (meth)acrylate having a chain aliphatic epoxy group, or may be a (meth)acrylate having an alicyclic epoxy group as described later. In addition, the (meth)acrylate having an epoxy group may contain an aromatic group. Among the (meth)acrylates having an epoxy group, aliphatic (meth)acrylates having a chain aliphatic epoxy group and aliphatic (meth)acrylates having an alicyclic epoxy group are preferred.

[0131] It should be noted that the structural unit A1 may be present in the resin in a block form or may be present randomly.

[0132] Examples of the (meth)acrylate containing an aromatic group and having an epoxy group include 4-glycidyloxyphenyl (meth)acrylate, 3-glycidyloxyphenyl (meth)acrylate, 2-glycidyloxyphenyl (meth)acrylate, 4-glycidyloxyphenyl methyl (meth)acrylate, 3-glycidyloxyphenyl methyl (meth)acrylate, and 2-glycidyloxyphenyl methyl (meth)acrylate.

[0133] Examples of aliphatic (meth)acrylates having a chain aliphatic epoxy group include (meth)acrylate epoxyalkyl esters and (meth)acrylate epoxyalkyloxyalkyl esters, in which a chain aliphatic epoxy group is bonded to the oxy group (-O-) in the ester group (-O-CO-). The chain aliphatic epoxy group possessed by such a (meth)acrylate may contain one or more oxy groups (-O-) in the chain. The number of carbon atoms in the chain aliphatic epoxy group is not particularly limited, but is preferably 3 or more and 20 or less, more preferably 3 or more and 15 or less, and particularly preferably 3 or more and 10 or less.

[0134] Specific examples of the aliphatic (meth)acrylate having a chain aliphatic epoxy group include epoxyalkyl (meth)acrylates such as glycidyl (meth)acrylate, 2-methylglycidyl (meth)acrylate, 3,4-epoxybutyl (meth)acrylate, and 6,7-epoxyheptyl (meth)acrylate; and epoxyalkyl (meth)acrylates such as 2-glycidyloxyethyl (meth)acrylate, 3-glycidyloxy-n-propyl (meth)acrylate, 4-glycidyloxy-n-butyl (meth)acrylate, 5-glycidyloxy-n-hexyl (meth)acrylate, and 6-glycidyloxy-n-hexyl (meth)acrylate.

[0135] As specific examples of aliphatic (meth)acrylates having an alicyclic epoxy group, for example, compounds represented by the following formulae (a1-1) to (a1-15) can be cited. Among these, compounds represented by the following formulae (a1-1) to (a1-5) are preferred, and compounds represented by the following formulae (a1-1) to (a1-3) are more preferred. In addition, for each of these compounds, the bonding site between the oxygen atom of the ester group and the alicyclic ring is not limited to the position shown here, and some positional isomers may be included.

[0136] [Chemical formula 2]

[0137]

[0138] [Chemical formula 3]

[0139]

[0140] [Chemical formula 4]

[0141]

[0142] In the above formula, R a1 represents a hydrogen atom or a methyl group, R a2 represents a divalent aliphatic saturated hydrocarbon group having 1 to 6 carbon atoms, R a3 represents a divalent hydrocarbon group having 1 to 10 carbon atoms, and t represents an integer of 0 to 10. a2 , preferably a linear or branched alkylene group, such as methylene, ethylene, propylene, tetramethylene, ethylethylene, pentamethylene, and hexamethylene. a3 , for example, methylene, ethylene, propylene, tetramethylene, ethylethylene, pentamethylene, hexamethylene, phenylene, and cyclohexylene are preferred.

[0143] The amount of the structural unit A1 in the (A) resin is not particularly limited within the range that does not impair the purpose of the present invention. From the perspective of curability, the content of the structural unit A1 in the (A) resin is, for example, 20 mol% or more, preferably 20 mol% or more and 95 mol% or less, more preferably 30 mol% or more and 90 mol% or less, and further preferably 50 mol% or more and 85 mol% or less, relative to all structural units of the resin.

[0144] [Structural unit A2]

[0145] The structural unit A2 is a structural unit represented by the above-mentioned formula (a2).

[0146] In formula (a2), R 4 is a divalent hydrocarbon group. 4 The hydrocarbon group may be an aliphatic hydrocarbon group, an aromatic hydrocarbon group, or a hydrocarbon group having an aliphatic portion and an aromatic portion. 4 It is preferably a divalent aliphatic hydrocarbon group. 4 In the case of a divalent aliphatic hydrocarbon group, the structure of the aliphatic hydrocarbon group may be linear, branched, cyclic, or a combination of these, but a linear structure is preferred.

[0147] As R 4 The number of carbon atoms of the hydrocarbon group is not particularly limited. When the hydrocarbon group is an aliphatic hydrocarbon group, the number of carbon atoms is preferably 1 or more and 20 or less, more preferably 2 or more and 10 or less, and particularly preferably 2 or more and 6 or less. When the hydrocarbon group is an aromatic group or a hydrocarbon group having an aliphatic portion and an aromatic portion, the number of carbon atoms is preferably 6 or more and 20 or less, and more preferably 6 or more and 12 or less.

[0148] Specific examples of the divalent aliphatic hydrocarbon group include a methylene group, an ethane-1,2-diyl group, an ethane-1,1-diyl group, a propane-1,3-diyl group, a propane-1,2-diyl group, a butane-1,4-diyl group, a pentane-1,5-diyl group, a hexane-1,6-diyl group, a heptane-1,7-diyl group, an octane-1,8-diyl group, a nonane-1,9-diyl group, a decane-1,10-diyl group, an undecane-1,11-diyl group, a dodecane-1,12-diyl group, a tridecane-1,13-diyl group, a tetradecane-1,14-diyl group, a pentadecane-1,15-diyl group, a hexadecane-1,16-diyl group, a heptadecane-1,17-diyl group, an octadecane-1,18-diyl group, a nonadecane-1,19-diyl group, and an eicosane-1,20-diyl group.

[0149] Among these, methylene, ethane-1,2-diyl, propane-1,3-diyl, butane-1,4-diyl, pentane-1,5-diyl, hexane-1,6-diyl, heptane-1,7-diyl, octane-1,8-diyl, nonane-1,9-diyl, decane-1,10-diyl, undecane-1,11-diyl, dodecane-1,12-diyl, tridecane-1,13-diyl, tetradecane-1,14-diyl, pentadecane-1,15-diyl, hexadecane-1,16-diyl, heptadecane-1,17-diyl, octadecane-1,18-diyl, octadecane-1,19-diyl, octadecane-1,20-diyl, octadecane-1,21-diyl, octadecane-1,22-diyl, octadecane-1,23-diyl, octadecane-1,24-diyl, octadecane-1,25-diyl, octadecane-1,26-diyl, octadecane-1,27-diyl, octadecane-1,28-diyl, octadecane-1,29-diyl, octadecane-1,30-diyl, octadecane-1,31-diyl, octadecane-1,32-diyl, octadecane-1,33-diyl, octadecane-1,34-diyl, octadecane-1,35-diyl, octadecane-1,36-diyl, octadecane-1,37-diyl, octadecane-1,38-diyl, octadecan The invention further comprises 1,10-diyl, 1,2-diyl, 1,3-diyl, 2,4-diyl, 1,5-diyl, 2,6-diyl, 1,7-diyl, 1,8-diyl, 2,9-diyl, 3,6-diyl, 2,7-diyl, 4,6-diyl, 5,7-diyl, 6,-diyl, 7,-diyl, 1,8-diyl, 2,9-diyl, 3,-diyl, 2,6-diyl, 3,-diyl, 2,7-diyl, 3,-diyl, 2, ...

[0150] Specific examples of the divalent aromatic hydrocarbon group include p-phenylene, m-phenylene, o-phenylene, naphthalene-1,4-diyl, naphthalene-2,6-diyl, and naphthalene-2,7-diyl. Among them, p-phenylene and m-phenylene are preferred, and p-phenylene is more preferred.

[0151] The structural unit A2 can be incorporated into the resin by copolymerizing a (meth)acrylate represented by the following formula (a-II) with a monomer that provides other structural units.

[0152] The structural unit A2 may be present in the resin in a block form or may be present randomly.

[0153] [Chemical formula 5]

[0154]

[0155] (In formula (a-II), R 1 and R 4 Same as formula (a2).

[0156] Preferred specific examples of the (meth)acrylate providing the structural unit A2 include 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 3-hydroxypropyl acrylate, 3-hydroxypropyl methacrylate, 4-hydroxybutyl acrylate, 4-hydroxybutyl methacrylate, 4-hydroxyphenyl acrylate, 4-hydroxyphenyl methacrylate, 3-hydroxyphenyl acrylate, and 3-hydroxyphenyl methacrylate.

[0157] Among these, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 4-hydroxyphenyl acrylate, and 4-hydroxyphenyl methacrylate are preferred.

[0158] The amount of the structural unit A2 in the resin (A) is not particularly limited within a range not impairing the object of the present invention.

[0159] From the perspective of curability, the content of structural unit A2 in the (A) resin is preferably 3 mol% to 40 mol% relative to all structural units of the resin, more preferably 5 mol% to 30 mol%, and further preferably 10 mol% to 25 mol%.

[0160] 〔Other structural units〕

[0161] The resin (A) may be composed only of the structural unit A1 and the structural unit A2, or may contain other structural units in addition to the structural unit A1 and the structural unit A2 as long as the object of the present invention is not impaired.

[0162] As other structural units, for example, structural units derived from (meth)acrylates other than those mentioned above can be mentioned. Such (meth)acrylates are compounds represented by the following formula (a-III), and are not particularly limited unless the purpose of the present invention is impaired.

[0163] [Chemical formula 6]

[0164]

[0165] In the above formula (a-III), R a4 is a hydrogen atom or a methyl group. a5 It is an organic group having no active hydrogen-containing group.

[0166] As an organic group, a group containing carbon atoms is preferred, and a group containing one or more carbon atoms and one or more atoms selected from the group consisting of H, O, S, Se, N, B, P, Si, and halogen atoms is more preferred. The number of carbon atoms in the group containing carbon atoms is not particularly limited, but is preferably 1 or more and 50 or less, and more preferably 1 or more and 20 or less.

[0167] Examples of the active hydrogen-containing group include hydroxyl, mercapto, amino, carboxyl, etc. As for the organic group, a bond or a substituent other than a hydrocarbon group such as a heteroatom may be contained in the organic group. In addition, the organic group may be any of linear, branched, and cyclic.

[0168] As R a5The substituents other than the hydrocarbon group in the organic group are not particularly limited as long as they do not impair the effects of the present invention, and include halogen atoms, alkylthio groups, arylthio groups, cyano groups, silyl groups, alkoxy groups, alkoxycarbonyl groups, nitro groups, nitroso groups, acyl groups, acyloxy groups, alkoxyalkyl groups, alkylthioalkyl groups, aryloxyalkyl groups, arylthioalkyl groups, N,N-disubstituted amino groups (-NRR': R and R' each independently represent a hydrocarbon group), etc. The hydrogen atoms contained in the above substituents may be substituted with hydrocarbon groups. In addition, the hydrocarbon groups contained in the above substituents may be any of linear, branched, and cyclic.

[0169] As R a5 , preferably an alkyl group, an aryl group, an aralkyl group, or a heterocyclic group. These groups may be substituted by a halogen atom, an alkyl group, or a heterocyclic group. In addition, when these groups contain an alkylene moiety, the alkylene moiety may be interrupted by an ether bond, a thioether bond, or an ester bond.

[0170] When the alkyl group is a linear or branched alkyl group, the number of carbon atoms is preferably 1 to 20, more preferably 1 to 15, and particularly preferably 1 to 10. Preferred examples of the alkyl group include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, n-pentyl, isopentyl, sec-pentyl, tert-pentyl, n-hexyl, n-heptyl, n-octyl, isooctyl, sec-octyl, tert-octyl, n-nonyl, isononyl, n-decyl, and isodecyl.

[0171] R a5 In the case of an alicyclic group or a group containing an alicyclic group, preferred alicyclic groups include monocyclic alicyclic groups such as cyclopentyl and cyclohexyl, and polycyclic alicyclic groups such as adamantyl, norbornyl, isobornyl, tricyclononyl, tricyclodecanyl, and tetracyclododecyl.

[0172] Examples of monomers other than the (meth)acrylates that provide other structural units include allyl compounds, vinyl ethers, vinyl esters, styrenes, etc. These monomers may be used alone or in combination of two or more.

[0173] Examples of the allyl compound include allyl acetate, allyl caproate, allyl octanoate, allyl laurate, allyl palmitate, allyl stearate, allyl benzoate, allyl acetoacetate, allyl lactate and the like; allyloxyethanol; and the like.

[0174] Examples of the vinyl ethers include alkyl vinyl ethers such as hexyl vinyl ether, octyl vinyl ether, decyl vinyl ether, ethylhexyl vinyl ether, methoxyethyl vinyl ether, ethoxyethyl vinyl ether, chloroethyl vinyl ether, 1-methyl-2,2-dimethylpropyl vinyl ether, 2-ethylbutyl vinyl ether, diethylene glycol vinyl ether, dimethylaminoethyl vinyl ether, diethylaminoethyl vinyl ether, butylaminoethyl vinyl ether, benzyl vinyl ether, and tetrahydrofurfuryl vinyl ether; vinyl aryl ethers such as vinyl phenyl ether, vinyl tolyl ether, vinyl chlorophenyl ether, vinyl-2,4-dichlorophenyl ether, vinyl naphthyl ether, and vinyl anthracenyl ether; and the like.

[0175] Examples of the vinyl esters include vinyl butyrate, vinyl isobutyrate, vinyl pivalate, vinyl diethyl acetate, vinyl valerate, vinyl hexanoate, vinyl chloroacetate, vinyl dichloroacetate, vinyl methoxyacetate, vinyl butoxyacetate, vinyl phenyl acetate, vinyl acetoacetate, vinyl lactate, vinyl-β-phenylbutyrate, vinyl benzoate, vinyl chlorobenzoate, vinyl tetrachlorobenzoate, and vinyl naphthoate.

[0176] Examples of the styrenes include styrene; alkyl styrenes such as methyl styrene, dimethyl styrene, trimethyl styrene, ethyl styrene, diethyl styrene, isopropyl styrene, butyl styrene, hexyl styrene, cyclohexyl styrene, decyl styrene, benzyl styrene, chloromethyl styrene, trifluoromethyl styrene, ethoxymethyl styrene, and acetoxymethyl styrene; alkoxy styrenes such as methoxy styrene, 4-methoxy-3-methyl styrene, and dimethoxy styrene; halogenated styrenes such as chlorostyrene, dichlorostyrene, trichlorostyrene, tetrachlorostyrene, pentachlorostyrene, bromostyrene, dibromostyrene, iodostyrene, fluorostyrene, trifluorostyrene, 2-bromo-4-trifluoromethylstyrene, and 4-fluoro-3-trifluoromethylstyrene; and the like.

[0177] When the (A) resin contains other structural units in addition to the aforementioned structural units A1 and structural units A2, the total amount of the structural units A1 and structural units A2 in the (A) resin is preferably 80 mol% or more, more preferably 90 mol% or more, and particularly preferably 95 mol% or more, relative to all the structural units in the (A) resin.

[0178] [(A) Method for producing resin]

[0179] The method for producing the resin (A) described above is not particularly limited. Generally speaking, the monomers providing the structural units A1 and A2 and the monomers providing other structural units as required are mixed in respective predetermined amounts, and then polymerized in a suitable solvent in the presence of a polymerization initiator, for example, at a temperature range of 50°C to 120°C, thereby obtaining the resin (A). The resin (A) is mostly obtained in the form of a solution formed with an organic solvent, and the resin (A) obtained in the form of a solution can be directly incorporated into the resin composition, or the resin (A) temporarily precipitated in the form of a solid polymer can be incorporated into the resin composition.

[0180] The weight average molecular weight of the resin (A) obtained by the above method is preferably 5000 or more, more preferably 7500 or more and 100000 or less, and particularly preferably 10000 or more and 80000 or less. The weight average molecular weight is a molecular weight measured by GPC and converted to polystyrene. By making the weight average molecular weight of the resin larger to a certain extent, it is easy to form a cured product with excellent solvent resistance and thermal decomposition resistance.

[0181] The content of the resin (A) is preferably 20% by mass to 90% by mass, more preferably 30% by mass to 85% by mass, and particularly preferably 40% by mass to 80% by mass, based on the total solid content of the composition.

[0182] By setting it within such a range, a cured product having excellent solvent resistance can be easily obtained.

[0183] <(B) Hollow particles>

[0184] The (B) hollow particles contained in the resin composition of the present embodiment are characterized in that the shell portion is composed of a resin.

[0185] The (B) hollow particles are particles consisting of a shell portion as an outer shell and internal voids. The shell portion may be a single layer or multiple layers. When the shell portion includes multiple layers, each layer may be composed of a different resin component.

[0186] In order to improve the affinity with the aforementioned (A) resin and the like, the (B) hollow particles may be subjected to surface treatment by a known method.

[0187] Specific examples of the (B) hollow particles include polyester-based porous particles obtained by W / O / W emulsion suspension polymerization, acrylic-based porous particles, styrene-acrylic hollow latex produced by seed polymerization, vinylidene chloride-acrylonitrile-based, and acrylonitrile-based heat-expandable microcapsules.

[0188] Moreover, as commercially available hollow particles, Techpolymer (registered trademark) NH (Sekisui Chemicals Co., Ltd.) and the like can also be used.

[0189] The average particle size of the hollow particles (B) can be appropriately set in consideration of the refractive index of the partition walls, and is, for example, in the range of 20 nm to 300 nm, preferably 25 nm to 200 nm, and more preferably 30 nm to 150 nm.

[0190] Regarding the thickness of the shell layer of the above-mentioned (B) hollow particles, when the average particle size of the (B) hollow particles is set to X [nm], it is set, for example, in the range of 0.03×X to 0.60×X, preferably in the range of 0.05×X to 0.50×X, and more preferably in the range of 0.10×X to 0.40×X.

[0191] More typically, the average particle size of the hollow particles (B) is set within a range of 30 nm to 150 nm, and the thickness of the shell layer of the hollow particles (B) is preferably set within a range of 5 nm to 30 nm.

[0192] By setting it within such a range, it is possible to obtain a balance between the mechanical strength when the resin composition is cured and the low refractive index.

[0193] (B) The average particle size of the hollow particles can be measured, for example, by a dynamic light scattering method. (B) The thickness of the shell layer of the hollow particles can be measured by observing the cross-sections of 50 randomly selected particles.

[0194] The content of the hollow particles (B) is preferably 10% by mass to 80% by mass, more preferably 15% by mass to 70% by mass, and particularly preferably 20% by mass to 60% by mass, based on the total solid content of the resin composition.

[0195] By setting it within such a range, a cured product excellent in solvent resistance can be easily obtained.

[0196] <(S) Organic Solvent>

[0197] The resin composition preferably used for forming the partition wall or the precursor film contains (S) an organic solvent.

[0198] Preferred examples of the (S) organic solvent include monoalkyl ethers of glycols such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, propylene glycol monopropyl ether, and propylene glycol monobutyl ether; monoalkyl ether acetates of glycols such as ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, and propylene glycol monobutyl ether acetate; aromatic hydrocarbons such as toluene and xylene. Solvents; ketones such as acetone, methyl ethyl ketone, 2-heptanone, cyclopentanone, and cyclohexanone; esters such as ethyl acetate, butyl acetate, ethoxyethyl acetate, hydroxyethyl acetate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, methyl 2-hydroxy-3-methylbutyrate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, methyl 3-ethoxypropionate, methyl pyruvate, ethyl lactate, butyl lactate, and γ-butyrolactone.

[0199] Among these (S) organic solvents, from the perspective of leveling properties of the coating film when applying the resin composition, preferred are propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, 2-heptanone, cyclopentanone, cyclohexanone, ethyl lactate, and butyl lactate, and more preferred are propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, 2-heptanone, cyclopentanone, and cyclohexanone.

[0200] The (S) organic solvent contained in the resin composition may be one kind or a combination of two or more kinds.

[0201] The amount of the (S) organic solvent used in the resin composition is not particularly limited and can be appropriately determined in consideration of viscosity and the like depending on the application of the resin composition.

[0202] With regard to the usage amount of (S) organic solvent, preferably the solid content concentration in the resin combination becomes the mode of more than 1 mass % and is set, more preferably the mode of more than 2 mass % and is set, and further preferably the mode of more than 3 mass % and is set. In addition, with regard to the usage amount of (S) organic solvent, preferably the solid content concentration in the resin combination becomes the mode of less than 45 mass % and is set, more preferably the mode of less than 30 mass % and is set, and further preferably the mode of less than 25 mass % and is set.

[0203] Hereinafter, components which may be contained in the resin composition as optional components will be described.

[0204] <(C) Epoxy Compound>

[0205] The resin composition preferably used for forming the partition wall or the precursor film may contain (C) an epoxy compound.

[0206] In addition, the (C) epoxy compound here is a compound which does not belong to the said component (A).

[0207] As (C) epoxy compound, various epoxy compounds widely known can be used. The molecular weight of the epoxy compound is not particularly limited. Among epoxy compounds, from the perspective of easily forming a cured film with excellent heat resistance, chemical resistance, mechanical properties, etc., it is preferred that the polyfunctional epoxy compound has two or more epoxy groups in the molecule.

[0208] The polyfunctional epoxy compound is not particularly limited as long as it is an epoxy compound with two or more functions. Examples of the polyfunctional epoxy compound include bifunctional epoxy resins such as bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, bisphenol AD ​​epoxy resin, naphthalene epoxy resin, and biphenyl epoxy resin; glycidyl ester epoxy resins such as dimer acid glycidyl ester and triglycidyl ester; glycidylamine epoxy resins such as tetraglycidylaminodiphenylmethane, triglycidyl-p-aminophenol, tetraglycidyl meta-xylylenediamine, and tetraglycidylbisaminomethylcyclohexane; heterocyclic epoxy resins such as triglycidyl isocyanurate; phloroglucinol triglycidyl ether, trihydroxybiphenyl triglycidyl ether, trihydroxy trifunctional epoxy resins such as phenylmethane triglycidyl ether, glycerol triglycidyl ether, 2-[4-(2,3-epoxypropoxy)phenyl]-2-[4-[1,1-bis[4-(2,3-epoxypropoxy)phenyl]ethyl]phenyl]propane, and 1,3-bis[4-[1-[4-(2,3-epoxypropoxy)phenyl]-1-[4-[1-[4-(2,3-epoxypropoxy)phenyl]-1-methylethyl]phenyl]ethyl]phenoxy]-2-propanol; and quadrifunctional epoxy resins such as tetrahydroxyphenylethane tetraglycidyl ether, tetraglycidyl benzophenone, bisresorcinol tetraglycidyl ether, and tetraglycidoxybiphenyl.

[0209] Further, from the aspect of providing a cured product with high hardness, an alicyclic epoxy compound is also preferred as the polyfunctional epoxy compound. Specific examples of the alicyclic epoxy compound include 2-(3,4-epoxycyclohexyl-5,5-spiro-3,4-epoxy) cyclohexane-m-dioxane, bis(3,4-epoxycyclohexylmethyl) adipate, bis(3,4-epoxy-6-methylcyclohexylmethyl) adipate, 3,4-epoxy-6-methylcyclohexyl-3',4'-epoxy-6'-methylcyclohexanecarboxylate, ε-caprolactone-modified 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexanecarboxylate, trimethylcaprolactone-modified 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexanecarboxylate, β-methyl-δ-valerolactone-modified 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexanecarboxylate, methylenebis(3,4-epoxycyclohexane), bis(3,4-epoxycyclohexylmethyl) ether of ethylene glycol, ethylenebis(3,4-epoxycyclohexanecarboxylate), dioctyl epoxycyclohexahydrophthalate, and di-2-ethylhexyl epoxycyclohexahydrophthalate, an epoxy resin having a tricyclodecene oxide group, and the like.

[0210] When the resin composition contains (C) an epoxy compound, its content is preferably 1 part by mass or more and 100 parts by mass or less, more preferably 3 parts by mass or more and 50 parts by mass or less, relative to 100 parts by mass of the above-mentioned (A) resin.

[0211] <<(D) Surfactant>>

[0212] Examples of the surfactant include a surfactant containing a fluorine atom, a surfactant containing a silicon atom, and the like. As the surfactant containing a fluorine atom, a fluorine-based surfactant having an alkylene oxide chain is preferred. As the surfactant containing a silicon atom, a polysiloxane-based surfactant having an alkylene oxide chain is preferred.

[0213] Preferred specific examples of the surfactant containing a fluorine atom include, for example, PF-636, PF-6320, PF-656, PF-6520 (all are trade names, manufactured by OMNOVA Corporation (referred to as "Omnova Corporation" in Japanese)) of the PolyFox series.

[0214] Preferred specific examples of the surfactant containing a silicon atom include BYK-307, BYK-333, BYK-378 (all are trade names, manufactured by BYK-Chemie GmbH).

[0215] When the resin composition contains the surfactant (D), the content thereof is preferably 0.01 to 1 part by mass, and more preferably 0.03 to 0.8 parts by mass, based on 100 parts by mass of the resin (A).

[0216] The resin composition preferably used in the formation of the aforementioned partition wall or precursor film can also contain various additives within the scope of not damaging the purpose of the present invention. As examples of additives, crosslinking agents, ultraviolet light absorbers, sensitizers, plasticizers, antioxidants, light stabilizers, adhesion aids, acid generators, and free radical generators can be enumerated.

[0217] [Method for preparing resin composition]

[0218] For the resin combination preferably used in the formation of aforementioned partition wall or precursor film, utilize common method that above-mentioned each component is mixed, stirred and prepared.As the device that can be used when above-mentioned each component is mixed, stirred, dissolver, homogenizer, three-roll mill etc. can be enumerated.Can further use screen, membrane filter etc. to filter the mixture obtained after above-mentioned each component is uniformly mixed.

[0219] [Cured material]

[0220] The resin composition is subjected to a heating step to be converted into a cured product.

[0221] The refractive index of the cured product is preferably 1.50 or less, more preferably 1.48 or less, and more preferably 1.45 or less. The lower limit of the refractive index is not particularly limited, and is, for example, 1.20 or more.

[0222] The resin containing the structural unit A1 and the structural unit A2 described above provides a crosslinked product having excellent solvent resistance and chemical resistance by heating. The heating temperature is not particularly limited as long as it does not cause excessive damage to the substrate. The upper limit of the heating temperature is preferably 300° C. or less, preferably 280° C. or less. The lower limit of the heating temperature is preferably 120° C. or more, more preferably 130° C. or more.

Claims

1. A method for manufacturing a color filter, wherein the color filter comprises, on a substrate, a light-transmitting color layer and a partition wall which contacts adjacent color layers without a gap, separates adjacent color layers, and has a refractive index lower than that of the color layer, The manufacturing method comprises the following steps: a coloring layer forming step of forming a plurality of coloring layers on the substrate, wherein the gaps between the coloring layers correspond to the positions of the partition walls; and a partition wall forming step of filling the voids with a resin composition containing air bubbles and comprising (A) a resin and (B) hollow particles whose shell portions are composed of a resin, or a cured product of the resin composition, to form the partition walls; The content of inorganic components in the resin composition or the cured product of the resin composition excluding the solvent is 5% by mass or less, The resin (A) is a resin comprising a structural unit represented by the following formula (a1) and a structural unit represented by the following formula (a2), In formula (a1) and (a2), R 1 are each independently a hydrogen atom or a methyl group, R 2 is a single bond or an alkylene group having 1 to 5 carbon atoms, R 3 is a monovalent organic group having 2 or more and 30 or less carbon atoms and containing an epoxy group in its structure, R 4 A divalent hydrocarbon group.

2. A method for manufacturing a color filter, wherein the color filter comprises, on a substrate, a light-transmitting color layer and a partition wall which contacts both adjacent color layers without a gap, separates the adjacent color layers, and has a refractive index lower than that of the color layer, The manufacturing method comprises the following steps: a precursor film forming step of forming a precursor film of the partition wall on the substrate; a mask forming step of forming a mask at a position on the precursor film corresponding to the partition wall; an ashing step of ashing the mask and the precursor film to remove a portion of the precursor film not covered by the mask and leaving a portion of the precursor film covered by the mask as the partition wall; A step of removing the mask; and a coloring layer forming step of forming the coloring layer in the region partitioned by the partition wall; The precursor film is formed of a resin composition containing bubbles and comprising (A) a resin and (B) hollow particles whose shell portions are composed of a resin, or a cured product of the resin composition. The resin (A) is a resin comprising a structural unit represented by the following formula (a1) and a structural unit represented by the following formula (a2), The content of inorganic components in the resin composition or the cured product of the resin composition excluding the solvent is 5% by mass or less, In formula (a1) and (a2), R 1 are each independently a hydrogen atom or a methyl group, R 2 is a single bond or an alkylene group having 1 to 5 carbon atoms, R 3 is a monovalent organic group having 2 or more and 30 or less carbon atoms and containing an epoxy group in its structure, R 4 A divalent hydrocarbon group.

3. The method for manufacturing a color filter according to claim 1 or 2, wherein: In all the structural units of the resin including the structural unit represented by the formula (a1) and the structural unit represented by the formula (a2), the proportion of the structural unit represented by the formula (a1) is 20 mol% or more.

4. The method for manufacturing a color filter according to claim 1 or 2, wherein: In all the structural units of the resin including the structural unit represented by the formula (a1) and the structural unit represented by the formula (a2), the proportion of the structural unit represented by the formula (a2) is 3 mol% or more and 40 mol% or less.

5. The method for manufacturing a color filter according to claim 1 or 2, wherein: The average particle diameter of the (B) hollow particles is 20 nm or more and 300 nm or less.

6. The method for manufacturing a color filter according to claim 1 or 2, wherein: The content ratio of the (A) resin in the resin composition is 20 mass % or more and 90 mass % or less.

7. The method for manufacturing a color filter according to claim 1 or 2, wherein: The content ratio of the (B) hollow particles in the resin composition is 10% by mass or more and 80% by mass or less.

8. A color filter comprising, on a substrate, a light-transmitting color layer and a partition wall which contacts both adjacent color layers without a gap, separates the adjacent color layers, and has a refractive index lower than that of the color layer, The partition walls are formed of a resin composition containing bubbles and comprising (A) a resin and (B) hollow particles whose shell portions are composed of a resin, or a cured product of the resin composition. The resin (A) is a resin comprising a structural unit represented by the following formula (a1) and a structural unit represented by the following formula (a2), The content of inorganic components in the resin composition or the cured product of the resin composition excluding the solvent is 5% by mass or less, In formula (a1) and (a2), R 1 are each independently a hydrogen atom or a methyl group, R 2 is a single bond or an alkylene group having 1 to 5 carbon atoms, R 3 is a monovalent organic group having 2 or more and 30 or less carbon atoms and containing an epoxy group in its structure, R 4 A divalent hydrocarbon group.

9. A resin composition for forming the partition wall or the precursor film in the method for manufacturing a color filter according to claim 1 or 2, the resin composition comprising (A) a resin, (B) hollow particles whose shell portion is composed of a resin, and (S) an organic solvent, wherein the (A) resin is a resin comprising a structural unit represented by the following formula (a1) and a structural unit represented by the following formula (a2), [Chemical formula 2] In formula (a1) and (a2), R 1 are each independently a hydrogen atom or a methyl group, R 2 is a single bond or an alkylene group having 1 to 5 carbon atoms, R 3 is a monovalent organic group having 2 or more and 30 or less carbon atoms and containing an epoxy group in its structure, R 4 A divalent hydrocarbon group.

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