Temperature control method for on-chip structure and layout method for on-chip structure

Abstract

The present application provides a temperature control method for an on-chip structure and a layout method for the on-chip structure. Among them, the on-chip structure includes: an analog computing unit, a circuit unit, and a temperature sensor. Based on this, the temperature control method for the on-chip structure includes: obtaining the temperature collected by the temperature sensor; wherein, the temperature includes at least one of the following: the temperature of the analog computing unit, the temperature of the circuit unit; controlling the operating states of the analog computing unit and the circuit unit according to the comparison result between the temperature and a preset temperature range. Through the present application, the problem in the prior art that the operation results of analog devices have large errors or are untrustworthy due to large temperature differences among analog devices is solved.

Description

Technical Field

[0001] This application relates to the field of analog devices, and particularly to a temperature control method for an on-chip structure and a layout method for the on-chip structure. Background Art

[0002] Temperature has a great influence on the characteristics of analog devices. Generally, as the temperature rises, the kinetic energy of electrons increases, which will lead to changes in device characteristics, such as Figure 1 shown in Figure 1 FIG. 1 is a schematic diagram of the influence of temperature on the characteristics of a diode in the prior art. Due to the above temperature characteristics of analog devices, for a single analog device, if the temperature difference of the analog device at different times is large, it will lead to a large difference in the operation results, that is, a large error in the operation results. For multiple analog devices, the temperature difference of the analog devices at different positions will also cause deviations in the operations at different positions, and the results generated by the analog devices at one position cannot be directly used for the analog devices at another position, resulting in untrustworthy data. Summary of the Invention

[0003] Embodiments of this application provide a temperature control method for an on-chip structure and a layout method for the on-chip structure to solve the problem in the prior art that the large temperature difference in analog devices leads to a large error in the operation results of the analog devices or the untrustworthiness of the operation results.

[0004] To solve the above technical problems, this application is implemented as follows:

[0005] In a first aspect, this application provides a temperature control method for an on-chip structure. The on-chip structure includes: an analog computing unit, a circuit unit, and a temperature sensor. The method includes: obtaining the temperature of the analog computing unit collected by the temperature sensor; controlling the operating states of the analog computing unit and the circuit unit according to the comparison result between the temperature and a preset temperature range.

[0006] In a second aspect, this application provides a layout method for an on-chip structure. The on-chip structure includes: an analog computing unit, a circuit unit, and a temperature sensor. Among them, the analog computing unit is arranged at a second target position of the on-chip structure. The method includes: determining to arrange the circuit unit within a first range including the analog computing unit; determining to arrange the temperature sensor at a first target position of the on-chip structure. Among them, the temperature sensor is used to collect the temperature of at least one of the following: the temperature of the analog computing unit, the temperature of the circuit unit.

[0007] In a third aspect, the present application provides an on-chip structure, including: an analog computing unit, a circuit unit, a temperature sensor, and a controller; wherein, the controller is respectively connected to the analog computing unit, the circuit unit, and the temperature sensor; the temperature sensor is configured to collect the temperature, where the temperature includes at least one of the following: the temperature of the analog computing unit, the temperature of the circuit unit; the controller is configured to control the operating states of the analog computing unit and the circuit unit according to the comparison result between the temperature and a preset temperature range.

[0008] In a fourth aspect, the present application provides a layout device for an on-chip structure, where the on-chip structure includes: an analog computing unit, a circuit unit, and a temperature sensor; the analog computing unit is disposed at a second target position of the on-chip structure; based on this, the device includes: a first determination module configured to determine to dispose the circuit unit within a first range including the analog computing unit; a second determination module configured to determine to dispose the temperature sensor at a first target position of the on-chip structure; where the temperature sensor is configured to collect the temperature of at least one of the following: the temperature of the analog computing unit, the temperature of the circuit unit.

[0009] In a fifth aspect, an embodiment of the present application further provides an electronic device, which is characterized by including a processor, a memory, and a program or instruction stored on the memory and executable on the processor, and when the program or instruction is executed by the processor, the steps of the method described in the first aspect or the second aspect are implemented.

[0010] In a sixth aspect, an embodiment of the present application further provides a readable storage medium, where a program or instruction is stored on the readable storage medium, and when the program or instruction is executed by a processor, the steps of the method described in the first aspect or the second aspect are implemented.

[0011] Through the present application, for the temperature of the analog computing unit in the on-chip structure, after obtaining the temperature collected by the temperature sensor, the operating states of the analog computing unit and the circuit unit can be controlled according to the comparison result between the temperature and the preset temperature range, so as to achieve temperature control of the on-chip structure, thereby avoiding too large a temperature difference of the analog computing unit, improving the accuracy of the operation result of the analog computing unit, and thus solving the problem in the prior art that the operation result error of the analog device is large or the operation result is untrustworthy due to large temperature differences of the analog devices. Description of the Drawings

[0012] Figure 1 Schematic diagram of the influence of temperature on diode characteristics in the prior art

[0013] Figure 2 It is a flowchart of the temperature control method for the on-chip structure according to the embodiment of the present application;

[0014] Figure 3 is a flowchart of the layout method of the on-chip structure according to an embodiment of the present application;

[0015] Figure 4 is a schematic structural diagram of the on-chip structure according to an embodiment of the present application;

[0016] Figure 5 is a schematic diagram of an optional structure of the on-chip structure according to an embodiment of the present application Figure 1 ;

[0017] Figure 6 is a schematic diagram of an optional structure of the on-chip structure according to an embodiment of the present application Figure 2 ;

[0018] Figure 7 is a schematic diagram of an optional structure of the on-chip structure according to an embodiment of the present application Figure 3 ;

[0019] Figure 8 is a schematic diagram of an optional structure of the on-chip structure according to an embodiment of the present application Figure 4 ;

[0020] Figure 9 is a schematic diagram of an optional structure of the on-chip structure according to an embodiment of the present application Figure 5 ;

[0021] Figure 10 is a schematic structural diagram of the layout device of the on-chip structure according to an embodiment of the present application;

[0022] Figure 11 is a schematic diagram of an optional structure of the layout device of the on-chip structure according to an embodiment of the present application. Detailed implementation manners

[0023] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0024] In the description of the present application, it should be understood that the terms "first" and "second" are only for the purpose of description, and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Therefore, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise stated, the meaning of "a plurality" is two or more.

[0025] The following will combine with the attached drawings and elaborate on the data processing method provided by the embodiments of the present application through specific embodiments and their application scenarios.

[0026] The embodiments of the present application provide a temperature control method for an on-chip structure, where the on-chip structure includes: an analog computing unit, a circuit unit, and a temperature sensor; Figure 2 is a flowchart of the temperature control method for the on-chip structure of the embodiments of the present application, as Figure 2 shown, the steps of the method include:

[0027] Step S202, obtain the temperature collected by the temperature sensor, where the temperature includes at least one of the following: the temperature of the analog computing unit, the temperature of the circuit unit;

[0028] Step S204, control the operating states of the analog computing unit and the circuit unit according to the comparison result between the temperature and the preset temperature range.

[0029] Through step S202 and step S204 of the embodiments of the present application, for the temperature of the analog computing unit in the on-chip structure, after obtaining the temperature collected by the temperature sensor, the operating states of the analog computing unit and the circuit unit can be controlled according to the comparison result between the temperature and the preset temperature range, so as to achieve the temperature control of the on-chip structure, thereby avoiding the problem that the temperature difference of the analog computing unit is too large, improving the accuracy of the operation result of the analog computing unit, and thus solving the problem in the prior art that the operation result error of the analog device is large or the operation result is untrustworthy due to the large temperature difference of the analog device.

[0030] In an alternative embodiment of the embodiments of the present application, the on-chip structure in the embodiments of the present application may further include a controller, and the above steps S202 and S204 are executed through this controller, that is, the temperature control of the on-chip structure can be realized by the controller.

[0031] In an alternative embodiment of the embodiments of the present application, for the manner of controlling the operating states of the analog computing unit and the circuit unit according to the comparison result between the temperature and the preset temperature range involved in the above step S204, it may further include:

[0032] Step S204-11, when the temperature is within the preset temperature range, maintain the current operating states of the analog computing unit and the circuit unit;

[0033] Step S204-12, when the temperature exceeds the highest temperature within the preset temperature range, control the analog computing unit and the circuit unit to stop operating;

[0034] Step S204-13: When the temperature is lower than the lowest temperature within the preset temperature range, control the operating states of the simulation calculation unit and the circuit unit according to whether the simulation calculation unit needs to be started.

[0035] Among them, the method of controlling the operating states of the simulation calculation unit and the circuit unit according to whether the simulation calculation unit needs to be started, which is involved in step S204-13, may further include:

[0036] Step S11: Determine whether the simulation calculation unit needs to be started.

[0037] Step S12: When the simulation calculation unit needs to be started, control the simulation calculation unit to start running and control the calculation unit to run.

[0038] Step S13: When the simulation calculation unit does not need to be started, maintain the current operating states of the simulation calculation unit and the circuit unit.

[0039] As can be seen from the above steps S204-11 to S204-13, when the temperature of the simulator exceeds the highest temperature within the preset temperature range, control the simulation calculation unit and the circuit unit to stop running. Since the operation of the circuit unit will generate a large amount of heat, resulting in a relatively high temperature, in this case, the simulation calculation unit and the circuit unit can be controlled to stop running to prevent the temperature from rising further, thereby effectively controlling the temperature difference. Moreover, in this case, the calculation result error of the simulation calculation unit is relatively large or unreliable, so it can also be controlled to stop running together. When the temperature is within the preset temperature range, it indicates that the current temperature is in a relatively appropriate range, and there is no need to control the operating states of the simulation calculation unit and the circuit unit, and only the current state needs to be maintained. When the temperature is lower than the lowest temperature within the preset temperature range, if the current simulation calculation unit needs to work, it can be controlled to start running, and if it does not need to work, the current operating state can also be maintained.

[0040] It should be noted that the value of the above preset temperature range can be correspondingly set according to the actual situation. For example, it can be set with reference to the temperature corresponding to the optimal working state of the simulation calculation unit, or the staff can make corresponding settings according to experience. The specific value range is not limited in this application.

[0041] In an alternative implementation manner of the embodiment of the present application, when the number of simulation calculation units is multiple, before obtaining the temperature of the simulation calculation unit collected by the temperature sensor, the method steps of the embodiment of the present application may further include:

[0042] Step S21: Obtain the first temperature value of each analog computing unit, where the first temperature value includes at least one of the following: historical temperature value, predicted temperature value;

[0043] Step S22: Determine the number of circuit units required for each analog computing unit according to the first temperature value and the mapping table; where the mapping table is used to indicate the mapping relationship between the first temperature value and the number of required circuit units.

[0044] Through the above steps S21 to S23, the historical temperature value is the temperature value corresponding to the analog computing unit measured at different historical times. If most of the historical temperature values are on the high side, a smaller number of circuit units can be set; if most of the historical temperature values are on the low side, a relatively larger number of circuit units can be set. The same processing method applies to the predicted temperature value. As for how many to set specifically, it can be determined according to the mapping relationship in the mapping table, because for different temperature values in the mapping table, different numbers of circuit units can be corresponding, and the specific mapping relationship can be set accordingly according to the actual situation.

[0045] It should be noted that the circuit units in the embodiments of the present application are arranged within a first range including analog computing units, and the temperature sensors are arranged at a first target position on the on-chip structure; where the temperature sensors are used to collect the temperatures of the analog computing units within a second range including the first target position.

[0046] Since the temperature sensors can collect the temperatures of the analog computing units within a second range including the first target position, that is to say, as long as the analog computing units within the second range can have their temperatures collected by the temperature sensors. Based on this, when the analog computing unit is within the second range including one temperature sensor, the temperature of the analog computing unit is the temperature collected by the temperature sensor; when the analog computing unit is within the second range including multiple temperature sensors, the temperature of the analog computing unit is the average value of the temperatures collected by the multiple temperature sensors.

[0047] Furthermore, since the temperature sensors can collect the temperatures of the analog computing units within a second range including the first target position, that is, one temperature sensor can collect the temperatures of multiple analog computing units, so that it is not necessary to configure a temperature sensor for each analog computing unit.

[0048] In another embodiment of the present application, a layout method of an on-chip structure is provided, where the on-chip structure includes: analog computing units, circuit units, temperature sensors and a controller; where the analog computing units are arranged at a second target position on the on-chip structure. It should be noted that the second target position is a position determined in advance; as Figure 3 shown, the steps of the method include:

[0049] Step S302, determine to set circuit units within a first range including the analog computing unit;

[0050] Step S304, determine to set a temperature sensor at a first target position on the on-chip structure; wherein, the temperature sensor is used to collect the temperature of the analog computing unit within a second range including the first target position.

[0051] Through the above on-chip structure layout method of steps S302 to S304, the operating states of the analog computing unit and the circuit unit can be controlled according to the comparison result between the temperature and the preset temperature range, so as to control the temperature of the analog temperature device, thereby avoiding too large a temperature difference in the analog computing unit and affecting the operation result of the analog computing unit, thus solving the problem in the prior art that the operation result error of the analog device is large or the operation result is untrustworthy due to large temperature differences in the analog devices.

[0052] It should be noted that the on-chip structure in the embodiment of the present application may further include a controller. Based on this, the method steps of the embodiment of the present application may further include:

[0053] Step S306, determine that the controller is respectively connected to the analog computing unit, the circuit unit, and the temperature sensor, wherein the controller controls the operating states of the analog computing unit and the circuit unit according to the comparison result between the temperature and the preset temperature range.

[0054] In an alternative embodiment of the embodiment of the present application, when the number of analog computing units is multiple, before obtaining the temperature of the analog computing unit collected by the temperature sensor, the method steps of the embodiment of the present application may further include:

[0055] Step S31, obtain a first temperature value of each analog computing unit, wherein the first temperature value includes at least one of the following: historical temperature value, predicted temperature value;

[0056] Step S32, determine the number of circuit units required for each analog computing unit according to the first temperature value and the mapping table; wherein the mapping table is used to indicate the number of circuit units required corresponding to the first temperature value range;

[0057] Step S33, set the determined circuit units within a first range including the analog computing unit.

[0058] Through the above steps S31 to S33, the historical temperature value is the temperature value corresponding to the analog computing unit measured at different historical times. If most of the historical temperature values are on the high side, a smaller number of circuit units can be set. If most of the historical temperature values are on the low side, a relatively larger number of circuit units can be set. The same processing method is applied to the predicted temperature value. As for the specific number to be set, it can be determined according to the mapping relationship in the mapping table, because in the mapping table, different temperature values can correspond to different numbers of circuit units, and the specific mapping relationship can be set according to the actual situation.

[0059] In another embodiment of the present application, an on-chip structure is provided, as Figure 4 shown. The on-chip structure includes: an analog computing unit 42, a circuit unit 44, a temperature sensor 46, and a controller 48; the controller 48 is respectively connected to the analog computing unit 42, the circuit unit 44, and the temperature sensor 46; wherein,

[0060] The temperature sensor 46 is used to collect the temperature of the analog computing unit 42, where the temperature includes at least one of the following: the temperature of the analog computing unit, the temperature of the circuit unit;

[0061] The controller 48 is used to obtain the temperature of the analog computing unit 42 collected by the temperature sensor 46, and control the operating states of the analog computing unit 42 and the circuit unit 44 according to the comparison result between the temperature and the preset temperature range.

[0062] It should be noted that the analog computing unit involved in the embodiments of the present application may be: analog devices including resistors, capacitors, inductors, diodes, triodes, analog amplifiers, D / A, A / D, analog signal regulators, integrated voltage regulators, sensors, audio and video circuits, etc.

[0063] Optionally, when the number of analog computing units is multiple, the controller 48 in the embodiments of the present application is further used to obtain the first temperature value of each analog computing unit before obtaining the temperature of the analog computing unit collected by the temperature sensor, where the first temperature value includes at least one of the following: historical temperature value, predicted temperature value; and,

[0064] The controller 48 in the embodiments of the present application is further used to determine the number of circuit units required for each analog computing unit according to the first temperature value and the mapping table; wherein, the mapping table is used to indicate the mapping relationship between the first temperature value and the number of required circuit units.

[0065] Optionally, when the analog computing unit is within a second range including one temperature sensor, the temperature of the analog computing unit is the temperature collected by the temperature sensor; when the analog computing unit is within a second range including multiple temperature sensors, the temperature of the analog computing unit is the average value of the temperatures collected by the multiple temperature sensors.

[0066] Optionally, for the manner in which the controller in the embodiment of the present application controls the operating states of the analog computing unit and the circuit unit according to the comparison result between the temperature and the preset temperature range, it may further be: when the temperature is within the preset temperature range, the controller maintains the current operating states of the analog computing unit and the circuit unit; when the temperature exceeds the highest temperature within the preset temperature range, the controller controls the analog computing unit and the circuit unit to stop operating; when the temperature is lower than the lowest temperature within the preset temperature range, the controller controls the operating states of the analog computing unit and the circuit unit according to whether the analog computing unit needs to start operating.

[0067] Among them, for the manner in which the controller controls the operating states of the analog computing unit and the circuit unit according to whether the analog computing unit needs to start operating, it may further be: the controller determines whether the analog computing unit needs to start operating; when the analog computing unit needs to start operating, the controller controls the analog computing unit to start operating and controls the computing unit to operate; when the analog computing unit does not need to start operating, the controller maintains the current operating states of the analog computing unit and the circuit unit.

[0068] It should be noted that the circuit unit in the embodiment of the present application is arranged within a first range including the analog computing unit; the temperature sensor is arranged at a first target position on the on-chip structure; wherein, the temperature sensor is used to collect the temperature; wherein, the temperature includes at least one of the following: the temperature of the analog computing unit, the temperature of the circuit unit.

[0069] Since the temperature sensor can collect the temperature of the analog computing unit within a second range including the first target position, that is, one temperature sensor can collect the temperatures of multiple analog computing units, so that it is not necessary to configure a temperature sensor for each analog computing unit. As Figure 5 shown, taking the on-chip structure including 8 analog computing units as an example, and 1 temperature sensor corresponds to 1 analog computing unit; as Figure 6 shown, taking the on-chip structure including 8 analog computing units as an example, and every 2 analog computing units correspond to 1 temperature sensor, that is to say, 1 temperature sensor can collect the temperatures of the corresponding 2 analog computing units; as Figure 7As shown in the figure, one temperature sensor can collect the temperature values of four surrounding analog computing units. Among them, the temperatures of the two analog computing units on the left in the virtual box are collected by two temperature sensors (the first temperature sensor and the second temperature sensor), and the temperatures of the two analog computing units on the right in the virtual box are also collected by two temperature sensors (the second temperature sensor and the third temperature sensor). Therefore, the temperature values of these two analog computing units are the average of the temperatures collected by these two temperature sensors.

[0070] Optionally, when the number of analog computing units is multiple, at least one circuit unit is set in the first range including the analog computing units; wherein, the corresponding number of at least one circuit unit is determined according to the first temperature value of the analog computing unit and the mapping table; the first temperature value includes at least one of the following: historical temperature value, predicted temperature value, and the mapping table is used to indicate the number of required circuit units corresponding to the temperature value range. That is to say, the number of circuit units of different analog computing units can be different, as Figure 8 and Figure 9 shown. It should be noted that Figure 8 and Figure 9 are only examples. In other alternative embodiments of the present application, the number of corresponding circuit units can be determined according to the actual situation.

[0071] In another alternative embodiment of the present application, a layout device for an on-chip structure is further provided. Among them, as Figure 4 shown, the on-chip structure includes: an analog computing unit, a circuit unit, and a temperature sensor; the analog computing unit is set at the second target position of the on-chip structure; based on this, the device in the embodiment of the present application is as Figure 10 shown, including:

[0072] A first determination module 102, configured to determine to set a circuit unit in the first range including the analog computing unit;

[0073] A second determination module 104, configured to determine to set a temperature sensor at the first target position of the on-chip structure; wherein, the temperature sensor is used to collect the temperature of the analog computing unit in the second range including the first target position.

[0074] Optionally, when the number of analog computing units is multiple, the first determination module 102 includes: an acquisition unit configured to acquire a first temperature value of each analog computing unit, where the first temperature value includes at least one of the following: a historical temperature value, a predicted temperature value; a first determination unit configured to determine the number of circuit units required for each analog computing unit according to the first temperature value and a mapping table, where the mapping table is used to indicate the mapping relationship between the first temperature value and the number of required circuit units; a second determination unit configured to determine that the circuit units are arranged within a first range including the analog computing units.

[0075] Optionally, when the on-chip structure in the embodiment of the present application further includes a controller, the device in the embodiment of the present application is as Figure 11 shown, and the device may further include: a third determination module 106 configured to determine that the controller is respectively connected to the analog computing unit, the circuit unit, and the temperature sensor, where the controller controls the operating states of the analog computing unit and the circuit unit according to a comparison result between the temperature and a preset temperature range.

[0076] Optionally, the embodiment of the present application further provides an electronic device, including a processor, a memory, a program or instruction stored on the memory and executable on the processor, where when the program or instruction is executed by the processor, it implements each process of the above temperature control method for the on-chip structure or the layout method embodiment of the on-chip structure, and can achieve the same technical effect. To avoid repetition, it will not be elaborated here.

[0077] It should be noted that the electronic device in the embodiment of the present application includes the above-mentioned mobile electronic device and non-mobile electronic device.

[0078] The embodiment of the present application further provides a readable storage medium, where a program or instruction is stored on the readable storage medium, and when the program or instruction is executed by the processor, it implements each process of the above temperature control method for the on-chip structure or the layout method embodiment of the on-chip structure, and can achieve the same technical effect. To avoid repetition, it will not be elaborated here.

[0079] Wherein, the processor is the processor in the electronic device in the above embodiment. The readable storage medium includes a computer-readable storage medium, such as a computer read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, etc.

[0080] Obviously, those skilled in the art should understand that the various modules or steps of the present application described above can be implemented by a general-purpose computing device. They can be concentrated on a single computing device or distributed over a network composed of multiple computing devices. Optionally, they can be implemented by program codes executable by the computing device. Thus, they can be stored in a storage device and executed by the computing device. And in some cases, the steps shown or described can be executed in a sequence different from that here, or they can be separately fabricated into individual integrated circuit modules, or multiple modules or steps among them can be fabricated into a single integrated circuit module for implementation. In this way, the present application is not limited to any specific combination of hardware and software.

[0081] The above are only the preferred embodiments of the present application and are not used to limit the present application. For those skilled in the art, the present application can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. A temperature control method for an on-chip structure, characterized in that The on-chip structure includes: an analog computing unit, a circuit unit, and a temperature sensor; the method includes: Obtain the temperature collected by the temperature sensor; wherein, the temperature includes at least one of the following: the temperature of the analog computing unit, the temperature of the circuit unit; Control the operating states of the analog computing unit and the circuit unit according to the comparison result between the temperature and a preset temperature range; The controlling the operating states of the analog computing unit and the circuit unit according to the comparison result between the temperature and the preset temperature range includes: When the temperature is within the preset temperature range, maintain the current operating states of the analog computing unit and the circuit unit; When the temperature exceeds the highest temperature within the preset temperature range, control the analog computing unit and the circuit unit to stop operating; When the temperature is lower than the lowest temperature within the preset temperature range, control the operating states of the analog computing unit and the circuit unit according to whether the analog computing unit needs to start operating; The controlling the operating states of the analog computing unit and the circuit unit according to whether the analog computing unit needs to start operating includes: Judge whether the analog computing unit needs to start operating; When the analog computing unit needs to start operating, control the analog computing unit to start operating and control the circuit unit to operate; When the analog computing unit does not need to start operating, maintain the current operating states of the analog computing unit and the circuit unit; The circuit unit is within a first range of the analog computing unit.

2. The method according to claim 1, wherein When the number of the analog computing units is multiple, before obtaining the temperature of the analog computing unit collected by the temperature sensor, the method further includes: Obtain a first temperature value of each analog computing unit, wherein the first temperature value includes at least one of the following: a historical temperature value, a predicted temperature value; Determine the number of circuit units required for each analog computing unit according to the first temperature value and a mapping table; wherein, the mapping table is used to indicate the mapping relationship between the first temperature value and the number of required circuit units.

3. The method according to claim 2, wherein The circuit unit is arranged within a first range including the analog computing unit; The temperature sensor is arranged at a first target position of the on-chip structure; wherein, the temperature sensor is used to collect the temperature of the analog computing unit within a second range including the first target position.

4. The method according to claim 3, wherein When the analog computing unit is within a second range including one temperature sensor, the temperature of the analog computing unit is the temperature collected by the temperature sensor; When the analog computing unit is within a second range including multiple temperature sensors, the temperature of the analog computing unit is the average value of the temperatures collected by the multiple temperature sensors.

5. A layout method for an on-chip structure, characterized in that, The on-chip structure includes: an analog computing unit, a circuit unit, and a temperature sensor; wherein, the analog computing unit is disposed at a second target position of the on-chip structure; the method includes: Determine to dispose the circuit unit within a first range including the analog computing unit; Determine to dispose the temperature sensor at a first target position of the on-chip structure; wherein, the temperature sensor is used to collect the temperature of at least one of the following: the temperature of the analog computing unit, the temperature of the circuit unit; When the temperature is within a preset temperature range, maintain the current operating states of the analog computing unit and the circuit unit; When the temperature exceeds the highest temperature within the preset temperature range, control the analog computing unit and the circuit unit to stop operating; When the temperature is lower than the lowest temperature within the preset temperature range, control the operating states of the analog computing unit and the circuit unit according to whether the analog computing unit needs to be started; The controlling the operating states of the analog computing unit and the circuit unit according to whether the analog computing unit needs to be started includes: Judge whether the analog computing unit needs to be started; When the analog computing unit needs to be started, control the analog computing unit to start operating and control the circuit unit to operate; When the analog computing unit does not need to be started, maintain the current operating states of the analog computing unit and the circuit unit.

6. The method according to claim 5, characterized in that When the number of the analog computing units is multiple, determining to dispose the circuit unit within a first range including the analog computing unit includes: Obtain a first temperature value of each analog computing unit, wherein the first temperature value includes at least one of the following: a historical temperature value, a predicted temperature value; Determine the number of circuit units required for each analog computing unit according to the first temperature value and a mapping table; wherein, the mapping table is used to indicate the mapping relationship between the first temperature value and the number of required circuit units; Dispose the determined circuit units within a first range including the analog computing unit.

7. An on-chip structure applied to the method according to any one of claims 1-4, characterized in that, The on-chip structure includes: an analog computing unit, a circuit unit, a temperature sensor, and a controller; wherein, the controller is respectively connected to the analog computing unit, the circuit unit, and the temperature sensor; The temperature sensor is used to collect the temperature, wherein the temperature includes at least one of the following: the temperature generated by the analog computing unit in a working state, the temperature generated by the circuit unit in a working state; The controller is used to control the operating states of the analog computing unit and the circuit unit according to the comparison result between the temperature and a preset temperature range.

8. The on-chip structure according to claim 7, wherein The circuit unit is disposed within a first range including the analog computing unit; The temperature sensor is disposed at a first target position of the on-chip structure.

9. The on-chip structure according to claim 8, characterized in that, When the number of the simulation computing units is multiple, at least one of the circuit units is arranged within a first range including the simulation computing units; wherein, the number corresponding to at least one of the circuit units is determined according to a first temperature value of the simulation computing units and a mapping table, and the first temperature value includes at least one of the following: a historical temperature value, a predicted temperature value; the mapping table is used to indicate the number of required circuit units corresponding to a temperature value range.

10. A layout device for an on-chip structure, characterized in that, The on-chip structure includes: a simulation computing unit, a circuit unit, and a temperature sensor; wherein, the simulation computing unit is arranged at a second target position of the on-chip structure; the device includes: a first determination module, configured to determine to arrange the circuit unit within a first range including the simulation computing unit; a second determination module, configured to determine to arrange the temperature sensor at a first target position of the on-chip structure; wherein, the temperature sensor is used to collect the temperature of at least one of the following: the temperature of the simulation computing unit, the temperature of the circuit unit; The device is used for: when the temperature is within a preset temperature range, maintaining the current operating states of the simulation computing unit and the circuit unit; when the temperature exceeds the highest temperature within the preset temperature range, controlling the simulation computing unit and the circuit unit to stop operating; when the temperature is lower than the lowest temperature within the preset temperature range, controlling the operating states of the simulation computing unit and the circuit unit according to whether the simulation computing unit needs to start operating; The controlling the operating states of the simulation computing unit and the circuit unit according to whether the simulation computing unit needs to start operating includes: judging whether the simulation computing unit needs to start operating; when the simulation computing unit needs to start operating, controlling the simulation computing unit to start operating and controlling the circuit unit to operate; when the simulation computing unit does not need to start operating, maintaining the current operating states of the simulation computing unit and the circuit unit.

11. The device according to claim 10, characterized in that, When the number of the simulation computing units is multiple, the first determination module includes: an acquisition unit, configured to acquire a first temperature value of each simulation computing unit, wherein the first temperature value includes at least one of the following: a historical temperature value, a predicted temperature value; a first determination unit, configured to determine the number of required circuit units for each simulation computing unit according to the first temperature value and the mapping table; wherein, the mapping table is used to indicate the mapping relationship between the first temperature value and the number of required circuit units; a second determination unit, configured to determine that the circuit unit is arranged within a first range including the simulation computing unit.

12. An electronic device, characterized in that, It includes a processor, a memory, and a program or instruction stored on the memory and executable on the processor. When the program or instruction is executed by the processor, it implements the method steps described in any one of claims 1-4, or implements the method steps described in claim 5 or 6.

13. A readable storage medium, characterized in that, The program or instructions are stored on the readable storage medium, and when the program or instructions are executed by a processor, they implement the method steps described in any one of claims 1-4, or implement the method steps described in claim 5 or 6.

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