An integrated packaged electronic device structure

Abstract

The present invention provides a novel integrated packaged electronic device structure, which encapsulates an integrated passive device area including a matching circuit module and a grounding circuit module in a packaging component, and the integrated passive device area forms at least two connection circuits with a packaging frame, such as electrically connecting the matching circuit module and the grounding circuit module to the packaging frame respectively, so as to realize a direct grounding function setting on the integrated packaged electronic device, thereby avoiding the problem of occupying a large area of ​​the integrated electronic device when applied due to setting a longer bias line on a printed circuit board and mounting a larger capacitor to realize the grounding function.

Description

Technical Field

[0001] The invention belongs to the field of integrated electronic devices, and in particular relates to a novel integrated packaged grounded electronic device structure. Background Art

[0002] The power amplifier is an important component in wireless communication systems. The power amplifier is used to amplify the input signal and then output it. In the process of performing the amplification function, the power amplifier converts DC energy into RF energy.

[0003] At present, it is difficult to integrate the power amplifier module with other modules. Most of the power amplifier modules are connected to the whole system in the form of separate modules, which makes the power amplifier module occupy a large size of the whole wireless communication system, which is not conducive to the miniaturization of the whole wireless communication system. In addition, the grounding of the traditional surface mount power supply circuit needs to be realized on the PCB board, and a long bias line is introduced to connect the DC power supply. The filter circuit on the PCB board can be grounded through the chip capacitor, etc. This method will not only occupy a large PCB area, resulting in a waste of resources and space, and reduce the integration of integrated circuits, but also greatly limit the application field of power amplifiers. Summary of the invention

[0004] In view of this, the embodiment of the present invention provides an integrated packaged electronic device structure, which realizes the grounding function setting on the packaged electronic device structure, which not only avoids the problem of occupying a large area when the integrated electronic device is applied due to setting a long bias line on the printed circuit board and mounting a large capacitor to realize the grounding function, but also helps to reduce the size of the power amplifier module and improve the integration of the power amplifier application circuit. The integrated packaged device structure of the invention can be widely used in the application of radio frequency grounding circuits, improve traditional surface mount circuits, greatly improve the application integration of current radio frequency power amplifiers, and lay a solid foundation for the miniaturization and lightweight of portable intelligent electronic products.

[0005] The present invention provides an integrated packaged electronic device structure, comprising: a packaging component, wherein the packaging component comprises a packaging frame and a packaging substrate; an integrated passive device area is packaged on one side of the substrate in the packaging frame; the integrated passive device area comprises a matching circuit module and a grounding circuit module; the matching circuit module and the grounding circuit module are electrically connected to the packaging frame at the same time.

[0006] Furthermore, one end of the grounding circuit is electrically connected to the packaging frame via a resonant inductor Ls, and one end of the matching circuit module is electrically connected to the packaging frame via a radio frequency choke RFC.

[0007] Furthermore, the grounding circuit module includes an integrated capacitor Cs, and the integrated capacitor Cs and the resonant inductor Ls are electrically connected to form a series resonant circuit.

[0008] Furthermore, the other end of the grounding circuit module has the same potential as that of the package substrate.

[0009] Furthermore, the grounding circuit module also includes a debugging inductor L2, the debugging inductor L2 and the integrated capacitor Cs are connected in series, and the integrated capacitor Cs, the debugging inductor Ls2 and the resonant inductor Ls form a series resonant circuit.

[0010] Furthermore, the inductance value of the radio frequency choke RFC is greater than the inductance value of the resonant inductor Ls.

[0011] Furthermore, an active device area is also encapsulated in the encapsulation frame, and the active device area is electrically connected to the integrated passive device area.

[0012] Furthermore, the other end of the matching circuit module is connected to a load circuit.

[0013] Furthermore, the packaging frame includes at least one pad, and the matching circuit module and the grounding circuit module are electrically connected to the pads respectively; the pad connected to the matching circuit module and the pad connected to the grounding circuit module are connected to the same fixed voltage.

[0014] Furthermore, the other end of the radio frequency choke RFC connected to the matching circuit module is electrically connected to the other end of the resonant inductor Ls connected to the grounding circuit module.

[0015] The integrated packaged electronic device provided by the embodiment of the present invention is provided by encapsulating an integrated passive device area including a matching circuit module and a grounding circuit module in a packaging component, wherein the matching circuit module and the grounding circuit module are electrically connected to the packaging frame at the same time, and are connected to the same external voltage through a radio frequency choke RFC and a resonant inductor Ls respectively, and the other end of the grounding circuit module is equal to the potential of the packaging substrate, so as to realize the direct grounding function setting on the integrated packaged electronic device, thereby avoiding the problem of occupying a large area when the integrated electronic device is used due to setting a longer bias line and mounting a larger capacitor on the printed circuit board to realize the grounding function. In addition, by setting an integrated capacitor Cs and a debugging inductor Ls2 inside the grounding circuit module, an inductor is connected to each end of the integrated capacitor Cs of the grounding circuit, so as to realize the circuit adjustment flexibility of the packaged device structure, so that the grounding circuit can be debugged according to different frequency requirements, improve the utilization rate of the integrated device, and reduce the development time and cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the background technology, the following is a brief introduction to the drawings required for use in the description of the embodiments or the background technology. Obviously, the drawings described below are schematic diagrams of some embodiments of the present invention. For ordinary technicians in this field, other solutions can be obtained based on these drawings without paying creative work.

[0017] Figure 1 A schematic diagram of the structure of an integrated packaged electronic device provided by an embodiment of the present invention;

[0018] Figure 2 A schematic diagram of another integrated packaged electronic device structure provided by an embodiment of the present invention;

[0019] Figure 3 A schematic diagram of another integrated packaged electronic device structure provided by an embodiment of the present invention;

[0020] Figure 4 A schematic diagram of another integrated packaged electronic device structure provided by an embodiment of the present invention; DETAILED DESCRIPTION

[0021] The present invention will be further described in detail below in conjunction with the accompanying drawings and examples. It will be appreciated that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings. Throughout this specification, the same or similar reference numerals represent the same or similar structures, elements or processes. It should be noted that, in the absence of conflict, the embodiments in this application and the features in the embodiments may be combined with each other.

[0022] An embodiment of the present invention provides an integrated packaged electronic device structure, comprising: a packaging component, the packaging component comprising a packaging frame and a packaging substrate; an integrated passive device area is packaged on one side of the substrate in the packaging frame; the integrated passive device area comprises a matching circuit module and a grounding circuit module; the matching circuit module and the grounding circuit module are electrically connected to the packaging frame at the same time.

[0023] The integrated packaged electronic device structure provided by the embodiment of the present invention is realized by encapsulating an integrated passive device area including a matching circuit module and a grounding circuit module in a packaging component, and the integrated passive device area forms at least two connection circuits with the packaging frame, such as electrically connecting the matching circuit module and the grounding circuit module to the packaging frame respectively, so as to realize the direct grounding function setting on the integrated packaged electronic device, thereby avoiding the problem of occupying a large area when the integrated electronic device is used due to setting a longer bias line and mounting a larger capacitor on the printed circuit board to realize the grounding function. The circuit adjustment flexibility of the packaged device structure is also realized by setting an integrated capacitor Cs and a debugging inductor Ls2 inside the grounding circuit module, so that the grounding circuit can be debugged according to different frequency requirements, thereby improving the utilization rate of the integrated device and reducing development time and cost.

[0024] The above is the core idea of ​​the present invention. The technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] Figure 1 A schematic diagram of an integrated packaged electronic device structure provided by an embodiment of the present invention. Figure 1 The integrated packaged electronic device structure includes a package component, the package component includes a package frame 1 and a package substrate 2, an integrated passive device area 3 is packaged on one side of the package substrate 2 within the package frame 1, and the integrated passive device area 3 forms at least two connection circuits with the package frame 1; the integrated passive device area 3 includes at least a matching circuit module 5 and a grounding circuit module 4. The matching circuit module 5 and the grounding circuit module 4 in this embodiment are electrically connected to the package frame 1 respectively.

[0026] Specifically, one end of the grounding circuit module 4 is electrically connected to the packaging frame 1 through the resonant inductor Ls, and one end of the matching circuit module 5 is electrically connected to the packaging frame 1 through the radio frequency choke RFC. In this embodiment, the packaging frame 1 includes at least one pad 6, the integrated passive device area 3 encapsulated inside the device is electrically connected to the pad 6, and the integrated passive device area 3 and the packaging frame 1 form at least two connection circuits; wherein the matching circuit module 5 and the grounding circuit module 4 form one electrical connection with the pad 6 respectively, specifically, one end of the matching circuit module 5 is electrically connected to the pad 6 through the radio frequency choke RFC, and one end of the grounding circuit module 4 is electrically connected to the pad 6 through the resonant inductor Ls. In this embodiment, the pad connected to the matching circuit module 5 and the pad connected to the grounding circuit module 4 are connected to the same fixed voltage to obtain the same external DC voltage U, so as to ensure the stable power supply of the integrated passive device area 3.

[0027] Optionally, the matching circuit module 5 and the grounding circuit module 4 can be electrically connected to the same pad 6 at the same time, or can be electrically connected to different pads 6; Figure 2 , when the matching circuit module 5 and the grounding circuit module 4 are electrically connected to different pads 6, the two pads must be electrically connected, and there is no restriction on the electrical connection position and the electrical connection form, so as to ensure that the other end of the RF choke RFC connected to the matching circuit module 5 and the other end of the resonant inductor Ls connected to the grounding circuit module 4 are electrically connected. It should be noted that, Figure 1 and 2 The connection method between the matching circuit module 5 and the grounding circuit module 4 and a portion of the pads 6 on a certain side of the packaging frame 1 is only shown by way of example. The embodiment of the present invention does not limit the specific area of ​​the packaging frame 1 where the pads 6 electrically connected to the matching circuit module 5 and the grounding circuit module 4 are located.

[0028] Optionally, electrical connection can be achieved by setting metal bonding wires or microstrip lines between the pad 6 and the matching circuit module 5 and the grounding circuit module 4, thereby realizing the functions of the radio frequency choke RFC and the resonant inductor Ls, respectively. The number, length, and height of the bonding wires or microstrip lines can be adjusted according to the frequency of the actual circuit, etc. Preferably, the inductance value of the radio frequency choke RFC is greater than the inductance value of the resonant inductor Ls. In this embodiment, the inductance value of the radio frequency choke RFC is greater than the inductance value of the resonant inductor Ls, so that the grounding setting circuit can isolate the AC signal, and prevent the signal of the matching circuit module from passing through the grounding circuit module through the DC bias signal.

[0029] One end of the matching circuit module 5 is electrically connected to the packaging frame 1 through the radio frequency choke RFC, and the other end is connected to the load circuit to achieve matching adjustment of the load impedance.

[0030] The device structure of this embodiment realizes direct grounding function setting at the level of integrated packaged electronic devices, thereby avoiding the problem of setting a longer bias line on the printed circuit board and mounting a larger capacitor to realize the grounding function, which causes the integrated electronic device to occupy a larger area when used.

[0031] In RF circuit applications, this structure can be used for RF integrated packaging electronic devices of power amplifiers, such as Figure 2As shown, on one side of the package substrate 2 within the scope of the package frame 1, that is, on the same side where the integrated passive device area 3 is packaged, an active device area 7 is also packaged, and the active device area 7 is electrically connected to the integrated passive device area 3. Exemplarily, the active device area 7 includes a power amplifier chip Die, which is used to amplify the input signal and then output it, and convert the DC energy into radio frequency energy. The power amplifier chip Die may include semiconductor chips such as gallium nitride GaN, gallium arsenide GaAs high electron mobility transistor, LDMOS, GeSi, etc. The active device area 7 is electrically connected to the integrated passive device area 3. Specifically, the active device area 7 is electrically connected to the matching circuit module 5, and a stable working voltage is input to the active device area 3 through the matching circuit module 5 of the integrated passive device area 3. In addition, the matching circuit module 5 can also match the load impedance of the load circuit to the output impedance of the active device area 3. For example, when the power amplifier chip Die is actually working, it obtains a gate bias voltage through the integrated passive device area 3, and the matching circuit module 5 provides a drain bias circuit for the power amplifier chip Die. The matching circuit module 5 can also match the load impedance to the output impedance of the power amplifier chip Die to ensure that the power amplifier Die has good power amplifier power, efficiency and linearity characteristics. The package device structure greatly reduces the size of the current power amplifier module and improves the integration of the power amplifier application circuit.

[0032] In one embodiment, if Figure 3 As shown, one end of the grounding circuit 4 is electrically connected to the resonant inductor Ls, and the other end is electrically connected to the fixed voltage end. Exemplarily, the grounding circuit module 4 includes an integrated capacitor Cs, one end of the grounding circuit module 4 is connected to the resonant inductor Ls, and the other end is equal to the potential of the package substrate 2; in this embodiment, one end of the integrated capacitor Cs is electrically connected to the resonant inductor Ls, and the other end is equal to the potential of the package substrate 2, for example, the ground potential of the package substrate 2. In this embodiment, one end of the integrated capacitor Cs is electrically connected to one end of the resonant inductor Ls, and a series resonant circuit is formed, and the other end of the resonant inductor Ls is electrically connected to the pad 6, and at the same time connected to the fixed voltage V, so as to realize the signal grounding function setting at the device structure level, and the series resonant circuit resonates at the circuit operating frequency f0.

[0033] In the series resonant circuit, the inductance value of the resonant inductor Ls is Ls, the capacitance value of the integrated capacitor Cs is Cs, and the resonant frequency of the series resonant circuit is f0. According to the working conditions of the series resonant circuit, the resonant frequency f0 satisfies:

[0034]

[0035] That is, the resonant frequency of the series resonant circuit of the embodiment to realize the signal grounding function is

[0036] Alternatively, if Figure 3 As shown, the pad 6 electrically connected to the resonant inductor Ls is not only connected to the fixed voltage V, but also electrically connected to the pad 6 connected to the radio frequency choke RFC, so that the matching circuit module 5 and the grounding circuit module 4 have the same stable voltage outside the integrated passive device area 3. In addition, when an active device chip is packaged inside the integrated packaged electronic device structure, the active device chip is electrically connected to the integrated passive device area 3 inside the package structure, so that the integrated passive device area 3 is used inside the integrated packaged electronic device to provide a working bias voltage for the active device chip.

[0037] Since the cost of integrated passive devices is currently high, the cost of the integrated packaged electronic devices is also high. Therefore, how to debug the internal circuit of the integrated packaged device according to different frequency requirements at the packaged device level to match different active device working frequencies has become a further problem that needs to be solved in the integrated packaging structure.

[0038] In another embodiment, the grounding circuit module 4 includes an integrated capacitor Cs and a debugging inductor Ls2; in this embodiment, the integrated capacitor Cs and the debugging inductor Ls2 are connected in series, that is, one end of the integrated capacitor Cs is electrically connected to the resonant inductor Ls, and the other end is electrically connected to one end of the debugging inductor Ls2, and the other end of the debugging inductor Ls2 is equal to the potential of the package substrate 2, for example, the package substrate 2 is at a ground potential, and the other end of the debugging inductor Ls2 is grounded. An inductor is connected to each end of the integrated capacitor Cs of the grounding circuit, especially the debugging inductor Ls2 is connected between the integrated capacitor Cs and the grounding end, which can not only reduce the capacitance of the entire grounding circuit, but also realize the modification and debugging of the grounding circuit, and realize the reuse of the integrated packaged electronic device within a certain frequency range, increase the adjustment flexibility of the integrated circuit, and greatly reduce the cost of the current RF circuit application. In this embodiment, one end of the integrated capacitor Cs is electrically connected to one end of the resonant inductor Ls, and the other end of the integrated capacitor Cs is electrically connected to one end of the debugging inductor Ls2, and the integrated capacitor Cs, the debugging inductor Ls2 and the resonant inductor Ls constitute a series resonant circuit, the other end of the resonant inductor Ls is electrically connected to the pad 6, and is also connected to a fixed voltage V, and the other end of the debugging inductor Ls2 is grounded to realize the signal grounding function setting at the device structure level, and the series resonant circuit resonates at a frequency f0.

[0039] In the series resonant circuit, the inductance value of the resonant inductor Ls is Ls, the capacitance value of the integrated capacitor Cs is Cs, the inductance value of the debugging inductor Ls2 is Ls2, and the resonant frequency of the series resonant circuit is f0. According to the working conditions of the series resonant circuit, the resonant frequency f0 satisfies:

[0040]

[0041] That is, in this embodiment, the resonant frequency of the series resonant circuit in which the debugging inductor Ls2 is added to realize the signal grounding function is

[0042] In this embodiment, an integrated capacitor Cs and a debugging inductor Ls2 are provided inside the grounding circuit module to achieve the circuit adjustment flexibility of the packaged device structure. The integrated capacitor Cs, the debugging inductor Ls2 and the resonant inductor Ls constitute a series resonant circuit, so that the grounding circuit can be debugged according to different frequency requirements, thereby increasing the adjustment flexibility of the integrated circuit, improving the utilization rate of the integrated device, and reducing development time and cost.

[0043] Optionally, the present invention can set the packaging component to be a QFN packaging component. The QFN (Quad Flat No-lead package) packaging component is one of the surface mount packages. The QFN package is a leadless package. The QFN packaging component is square or rectangular. A large exposed pad is provided at the center of the bottom of the packaging component for heat conduction. Conductive pads for achieving electrical connection are provided around the periphery of the large pad, i.e., the pad 3 mentioned in the above embodiment. The packaging component can also be set to a DFN packaging component. The difference between the DFN (Dual Flat No-lead package) packaging component and the QFN packaging component is that the DFN packaging component only has conductive pads for achieving electrical connection on both sides of the packaging component. The packaging component can also adopt other packaging forms, which are not limited in the embodiments of the present invention.

[0044] It should be noted that the drawings shown in the embodiments of the present invention are only exemplary representations of regions and components, and do not represent actual sizes of components in the structure of the integrated packaged electronic device.

[0045] The integrated packaged electronic device provided by the embodiment of the present invention is provided by encapsulating an integrated passive device area including a matching circuit module and a grounding circuit module in a packaging component, wherein the matching circuit module and the grounding circuit module are electrically connected to the packaging frame at the same time, and are connected to the same external voltage through a radio frequency choke RFC and a resonant inductor Ls respectively, and the other end of the grounding circuit module is equal to the potential of the packaging substrate, so as to realize the direct grounding function setting on the integrated packaged electronic device, thereby avoiding the problem of occupying a large area when the integrated electronic device is used due to setting a longer bias line and mounting a larger capacitor on the printed circuit board to realize the grounding function. In addition, by setting an integrated capacitor Cs and a debugging inductor Ls2 inside the grounding circuit module, an inductor is connected to each end of the integrated capacitor Cs of the grounding circuit, so as to realize the circuit adjustment flexibility of the packaged device structure, so that the grounding circuit can be debugged according to different frequency requirements, improve the utilization rate of the integrated device, and reduce the development time and cost.

[0046] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. An integrated packaged electronic device structure, characterized in that: include: A packaging component, the packaging component comprising a packaging frame and a packaging substrate; An integrated passive device area is encapsulated on one side of the substrate in the packaging frame; The integrated passive device area at least includes a matching circuit module and a grounding circuit module; The integrated passive device area and the packaging frame form at least two connection circuits; The matching circuit module and the grounding circuit module are respectively connected to the packaging frame, wherein one end of the grounding circuit module is electrically connected to the packaging frame through a resonant inductor Ls, and one end of the matching circuit module is electrically connected to the packaging frame through a radio frequency choke RFC.

2. The integrated packaged electronic device structure according to claim 1, characterized in that: The grounding circuit module includes an integrated capacitor Cs, and the integrated capacitor Cs and the resonant inductor Ls are electrically connected to form a series resonant circuit.

3. The integrated packaged electronic device structure according to claim 2, characterized in that: The other end of the ground circuit module has the same potential as that of the package substrate.

4. The integrated packaged electronic device structure according to claim 2, characterized in that: The grounding circuit module further includes a debugging inductor Ls2, the debugging inductor Ls2 is connected in series with the integrated capacitor Cs, and the integrated capacitor Cs, the debugging inductor Ls2 and the resonant inductor Ls form a series resonant circuit.

5. The integrated packaged electronic device structure according to claim 1, characterized in that: The inductance value of the radio frequency choke RFC is greater than the inductance value of the resonant inductor Ls.

6. The integrated packaged electronic device structure according to claim 1, characterized in that: The packaging frame also packages an active device area, and the active device area is electrically connected to the integrated passive device area.

7. The integrated packaged electronic device structure according to claim 1, characterized in that: The other end of the matching circuit module is connected to the load circuit.

8. The integrated packaged electronic device structure according to any one of claims 1 to 6, characterized in that: The packaging frame includes at least one pad, and the matching circuit module and the grounding circuit module are electrically connected to the pads respectively; the pad connected to the matching circuit module and the pad connected to the grounding circuit module are connected to the same fixed voltage.

9. The integrated packaged electronic device structure according to claim 8, characterized in that: The other end of the radio frequency choke RFC connected to the matching circuit module and the other end of the resonant inductor Ls connected to the grounding circuit module are electrically connected.

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