Nozzle, system and method

Abstract

A nozzle directs a flow of solder during a soldering operation. The nozzle includes a body portion having an inlet to receive a supply of solder, an outlet portion having an outlet to dispense the solder, and a channel fluidly connecting the inlet to the outlet. The outlet portion is disposed above the inlet such that solder flows from the inlet up the channel to the outlet portion. The outlet portion has first and second overflow sections each integral with or connected to a peripheral edge of the outlet such that solder is dispensed from the outlet and flows through the first and / or second overflow sections. At least a portion of the first overflow section has a first width such that solder flowing through the first overflow section produces a flow of solder having a width corresponding to the first width. At least a portion of the second overflow section has a second width such that solder flowing through the second overflow section produces a flow of solder having a width substantially corresponding to the second width. Methods of manufacturing such nozzles and methods of soldering components with such nozzles are also disclosed.

Description

Technical Field

[0001] This invention relates to a nozzle, and more particularly, but not exclusively, to a nozzle for guiding the flow of solder during a welding operation. The invention also relates to a method of welding using a nozzle and a method of manufacturing the nozzle. Background Technology

[0002] Selective soldering can be used in many soldering applications, such as soldering components on printed circuit boards (PCBs). Generally, selective soldering can be divided into two methods: multi-wave dip soldering and point-to-point soldering.

[0003] In multi-wave impregnation welding, a large-size welding tank or welding assembly 100 with plate 102 is typically used (e.g., Figure 1a As shown, the solder bath or welding assembly includes a nozzle 104 to which liquid solder is pumped. A PCB (not shown) descends toward the nozzle, causing connector leads / pins (e.g., in a Cu (copper) panel) to be immersed in the liquid solder present in the nozzle, forming solder joints / connections at corresponding locations on the PCB. That is, multiple solder joints can be formed simultaneously. Each multi-wave dip soldering assembly has a specific nozzle plate, with the nozzle positioned at the desired soldering location. The nozzles can have different shapes depending on the free space on the connectors and assemblies to be soldered. Figure 1b A typical nozzle 104 used in multi-peak dip soldering is shown. For connectors with a high risk of bridging, a laser-cut wire mesh 106 (separately set from the nozzle itself) can be incorporated into the nozzle 104 to help prevent solder bridging.

[0004] In point-to-point welding processes, small-sized welding tanks or welding assemblies 200 (such as...) are typically used. Figure 2 As shown), it typically contains only one nozzle 204. In contrast to multi-wave soldering where connector pins are immersed in the nozzle, solder overflows from nozzle 204, and the pins are dragged across or immersed in the flowing solder (or conversely, the nozzle can be moved relative to the pins). Each solder joint is soldered individually. Some known point-to-point soldering assemblies include a solder flow regulator (SDC) 213 that projects a bridging fluid jet or stream toward the nozzle outlet and the soldered pins to help prevent solder bridging between adjacent soldered connections. Current SDCs can be quite large.

[0005] In point-to-point welding, multiple welding tanks are typically used, each with a different nozzle size. For example, the first nozzle might be a smaller nozzle for welding fine-pitch parts, while the second nozzle might be a larger / wider nozzle for welding larger-pitch parts (e.g., double-row parts) in a single drag. This need for multiple welding tanks / nozzles can reduce production output because production must be stopped to switch between nozzles.

[0006] The advantage is that it helps to produce nozzles that overcome the above problems. Summary of the Invention

[0007] According to a first aspect of the invention, a nozzle for guiding solder flow during a welding operation is provided, the nozzle comprising:

[0008] The main body has:

[0009] The inlet is used to receive the supply of solder;

[0010] The export section has one or more outlets for dispensing solder therefrom; and

[0011] At least one channel that fluidly connects the inlet to the one or more outlets;

[0012] The outlet portion is adapted to be positioned above the inlet, such that during use, solder flows from the inlet to the outlet portion along the at least one channel in a generally upward direction.

[0013] The outlet portion has a first overflow section and a second overflow section, each overflow section being integral with or connected to the outer perimeter of the outlet in the one or more outlets, such that in use, the solder is dispensed from the outlet in the one or more outlets and flows through the first overflow section and / or the second overflow section.

[0014] At least a portion of the first overflow section has a first width, such that during use, the solder flowing through the first overflow section produces a solder flow with a width substantially corresponding to the first width.

[0015] At least a portion of the second overflow section has a second width that is different from the first width, such that in use, the solder flowing through the second overflow section produces a solder flow with a width substantially corresponding to the second width.

[0016] Suitable, the first overflow section and the second overflow section are integrated with the common outlet or the first overflow section and the second overflow section are connected to the common outlet.

[0017] Appropriately, the export section has a first export and a second export.

[0018] Suitablely, the first overflow section is integrated with the first outlet or the first overflow section is connected to the first outlet, and wherein the second overflow section is integrated with the second outlet or the second overflow section is connected to the second outlet.

[0019] Suitablely, the main body includes a first channel and a second channel, the first channel fluidly connecting the inlet to the first outlet and the second channel fluidly connecting the inlet to the second outlet.

[0020] Suitable, the first overflow section and / or the second overflow section includes a substantially straight portion at the outer edge of the outlet in one or more of the outlets.

[0021] Suitable, the first overflow section and / or the second overflow section include a recessed section or a stepped section within the outer edge of the outlet in one or more outlets.

[0022] Appropriately, the first overflow section and the second overflow section are located on opposite sides of the outlet portion.

[0023] Suitablely, the outlet portion has a third overflow section that is integral with or connected to the outer edge of the outlet of the one or more outlets, wherein at least a portion of the third overflow section has a third width that is different from the first width and the second width, such that in use, solder flowing through the third overflow section produces a solder flow with a width substantially corresponding to the third width.

[0024] Appropriately, the overflow section is spaced around the perimeter of the outlet portion.

[0025] Suitablely, the nozzle includes multiple stacked layers configured to define the at least one channel.

[0026] Suitable, these stacked layers are deposited during additive manufacturing or 3D printing processes.

[0027] Suitable, these stacked layers contain stainless steel or titanium.

[0028] According to a second aspect of the present invention, a system for welding components is provided, the system comprising:

[0029] Liquid solder supply department;

[0030] Nozzle according to the first aspect of the invention;

[0031] Pumping equipment configured to pump solder from the solder supply section to the nozzle; and

[0032] An actuation device configured to change the relative orientation between the nozzle and the part to be welded.

[0033] Suitable for use, the nozzle has a longitudinal axis.

[0034] Suitablely, the actuation device is configured to rotate the nozzle about its axis.

[0035] Suitablely, the actuation device is configured to tilt the nozzle axis and / or the part to be welded, so as to change the angle between the two.

[0036] According to a third aspect of the present invention, a method for manufacturing a nozzle for guiding solder flow during a welding operation is provided, the method comprising:

[0037] A material layer is deposited during additive manufacturing or 3D printing to construct a nozzle according to the first aspect of the invention.

[0038] Suitable material is stainless steel or titanium.

[0039] According to a fourth aspect of the present invention, a method for welding components is provided, the method comprising:

[0040] A system according to a second aspect of the invention is provided;

[0041] Provide the components to be welded;

[0042] Select the preferred overflow section based on the required solder width;

[0043] Adjust the relative orientation between the nozzle and the component to be welded so that, during the welding operation, the component is welded using the solder flow generated when the solder flows through the preferred overflow section; and

[0044] Perform welding operations.

[0045] Appropriately, this component is a printed circuit board.

[0046] Appropriately, the relative orientation between the nozzle and the part to be welded is adjusted by rotating the nozzle about its axis.

[0047] Suitablely, the relative orientation between the nozzle and the part to be welded is adjusted by tilting the nozzle axis and / or the part to be welded to change the angle between the two.

[0048] Suitable, the method further includes the following steps:

[0049] Select another preferred overflow section based on another required solder width;

[0050] Adjust the relative orientation between the nozzle and the component to be welded so that, during the welding operation, the component is welded using the solder flow generated as the solder flows through the other preferred overflow section; and

[0051] Perform further welding operations.

[0052] Some embodiments of the present invention offer the advantage of providing a nozzle for guiding solder flow during a welding operation, which can be used to generate solder flows of varying widths. This reduces or completely eliminates the need to switch between nozzles during the welding operation. This contributes to a faster, more efficient welding process with less delay.

[0053] Some embodiments of the present invention offer the advantage of providing a method for welding components that results in less production delay than known methods.

[0054] As used in this article, when referring to “solder” used in a nozzle, it should be understood that the solder is in a liquid state.

[0055] As used in this article, it should be understood that "the outer edge of the exit" is the boundary or edge that defines the mouth of the exit. The outer edge can be considered as a single continuous edge that defines the exit or multiple edges that connect / combine to define the exit.

[0056] As used herein, it should be understood that "nozzle axis" refers to the longitudinal axis of the nozzle (i.e., the axis of the nozzle that is approximately coaxial with the direction of solder flow). In the examples described, the nozzle axis typically corresponds to the nozzle channel (i.e., this axis typically extends substantially vertically in use).

[0057] As used herein, it should be understood that an "overflow section" is a structural section (e.g., an outlet portion or outlet) through which solder flows as it "overflows" from the nozzle outlet. The overflow section can be an edge (e.g., the outer edge of the outlet), a section of an edge, or a surface connected to an edge. In other words, for a nozzle arranged such that solder flows in a generally upward direction toward and subsequently out of the outlet, solder flows out of the nozzle outlet (i.e., is dispensed from the nozzle outlet), flows through the overflow section (before, after, or during the flow of solder through the overflow section), and then flows in a generally downward direction along (or adjacent to) the outer surface of the nozzle (due to gravity). Generally, after the solder has at least partially flowed through the overflow section, the connector pins to be soldered are dragged across or immersed in the flowing solder.

[0058] As used herein, it should be understood that "width of overflow section" generally refers to the dimension of an overflow section (i.e., edge, edge segment, or surface) that is transverse or perpendicular to the solder flowing through it. It should be understood that "width of overflow section" can be the width of only a portion of the overflow section. For example, an overflow section may include a surface whose width narrows towards the nozzle portion. For a curved edge or nozzle that serves as an overflow section, the width can be the distance between multiple endpoints of the curved edge.

[0059] As used herein, it should be understood that the width of an overflow section can be configured to "such that, in use, the solder flowing through the overflow section produces a solder flow with a width substantially corresponding to the width of the overflow section" by guiding or restricting the flow of solder over the overflow section. Generally, solder flow can be guided or restricted due to the surface tension of the solder over the overflow section. For example, when the overflow section is an edge (particularly an edge at an angle between adjacent adjacent edges), the surface tension of the solder flowing over the edge can help ensure that the solder flows substantially only over the edge (i.e., rather than overflowing onto adjacent edges). In other examples, the overflow section can be guided or restricted by using a physical barrier that defines the width of the overflow section (i.e., defines the endpoints of the overflow section), thereby allowing the solder to flow over a certain width.

[0060] As used herein, it should be understood that the phrase “tilt” is used to describe a change in the degree or angle of inclination of a feature / component relative to a reference plane or another feature / component. For example, a PCB can be tilted relative to a horizontal plane. That is, the angle between the plane of the PCB and the horizontal plane can increase or decrease. As another example, a PCB can be tilted relative to a soldering nozzle (or vice versa). That is, the angle between the plane of the PCB and the nozzle axis can increase or decrease. Attached Figure Description

[0061] Embodiments of the present invention will be further described below with reference to the accompanying drawings, in which:

[0062] Figure 1a and Figure 1b (Separately) show perspective views of the welding tank and nozzle used in the multi-wave dip welding process;

[0063] Figure 2 A side view of the welding trough used in point-to-point welding is shown;

[0064] Figures 3 to 5 A perspective view shows an example of a nozzle used to guide the flow of solder during a welding operation;

[0065] Figure 6 Showing Figures 3 to 5 The cross-section of the nozzle;

[0066] Figure 7a and Figure 7b Demonstrates the welding operation process Figures 3 to 5 The nozzle;

[0067] Figure 8 A cross-sectional view showing another example of a nozzle used to guide the flow of solder during a welding operation;

[0068] Figure 9a and Figure 9b Demonstrates the welding operation process Figure 8 A three-dimensional view of the nozzle;

[0069] Figure 10a and Figure 10b Demonstrates the welding operation process Figure 8 The nozzle;

[0070] Figure 11 A cross-sectional view showing another example of a nozzle used to guide the flow of solder during a welding operation;

[0071] Figure 12a and Figure 12b Showing Figure 11 A plan view of the nozzle;

[0072] Figure 13 and Figure 14 Showing included Figures 3 to 5 A three-dimensional view of the welding assembly of the nozzle; and

[0073] Figure 15 A cross-sectional view showing another example of a nozzle used to guide the flow of solder during a welding operation.

[0074] In the accompanying drawings, similar reference numerals indicate similar parts. Detailed Implementation

[0075] Figures 3 to 6 An exemplary embodiment of the nozzle 300 of the present invention for guiding solder flow during a soldering operation is shown. The nozzle 300 includes a body portion 302 having an inlet 304 for receiving a supply of solder. The body portion 302 further includes an outlet portion having an outlet 316 for dispensing solder therefrom. The body portion 302 further includes a channel 314 fluidly connecting the inlet 304 to the outlet 316. In this example, the inlet 304 is located at a first end of the body portion 302, and the outlet 316 is located at the opposite second end of the body portion 302.

[0076] In this example, channel 314 has a larger / wider nozzle portion corresponding to inlet 304 and generally tapers towards a narrower outlet 316. In this example, the outer profile of nozzle 300 corresponds to channel 314 (that is, having a larger / wider bottom and tapering towards a narrower outlet portion). However, in other examples, channel 314 and the outer profile of nozzle can have any suitable shape / size / profile.

[0077] The outlet portion (i.e., outlet 316) is adapted to be positioned above the inlet 304, such that in use, solder flows from the inlet 304 to the outlet 316 in a generally upward direction along the channel 314. In other words, in use, the nozzle is arranged such that solder flows from the inlet 304 to the outlet 316 and “overflows” from that outlet. In this example, the nozzle 300 is arranged vertically in use (i.e., outlet 316 is directly above the inlet 304); however, in other examples, the nozzle 300 may be slightly tilted.

[0078] Outlet 316 is defined by a peripheral edge 306. In other words, the peripheral edge defines the boundary of outlet 316. Outlet 316 has a first overflow section 310 and a second overflow section 312. In this example, each overflow section 310, 312 is integral with the peripheral edge of outlet 316. That is, overflow sections 310, 312 are segments of the peripheral edge of outlet 316. In this example, the first overflow section 310 and the second overflow section 312 are substantially straight portions of the peripheral edge of one or more outlets; however, in other examples, the overflow sections may correspond to portions of a curved peripheral edge. In this example, the first overflow section 310 and the second overflow section 312 are angled relative to adjacent portions of the peripheral edge.

[0079] Solder is dispensed from outlet 316 and flows through one or both of the first overflow section 310 and the second overflow section 312. In some examples, solder may be dispensed simultaneously on both overflow sections 310 and 312, resulting in two distinct solder streams. In other examples, for instance, solder may be preferentially dispensed on an overflow section if the flow path to and across it has lower resistance (e.g., due to an outlet sloping towards a particular overflow section, such as...). Figures 3 to 6 For example, where solder preferentially flows through overflow section 310 when the nozzle is arranged vertically. In such an example, the nozzle may need to be tilted away from the vertical direction to allow flow through the non-preferred overflow section.

[0080] The first overflow section 310 has a first width. In other words, the first overflow section 310 has a width dimension that is transverse to the solder flow thereon. The width of the first overflow section 310 is such that, in use, the solder flowing through the first overflow section produces a solder flow with a width substantially corresponding to the first width (of the first overflow section 310). Similarly, the second overflow section 312 has a second width such that, in use, the solder flowing through the second overflow section 312 produces a solder flow with a width substantially corresponding to the second width. The width of the second overflow section 312 is different from the width of the first overflow section 310. In other words, the sizes of the first overflow section 310 and the second overflow section 312 are designed such that, when solder is dispensed from the output, the first overflow section 310 and the second overflow section 312 produce different solder flows with different widths.

[0081] The overflow section can have any suitable width depending on the intended use. In this example, the first overflow section 310 can have a width from about 1 mm to 4 mm, preferably 2 mm, and the second overflow section 312 can have a width from about 4 mm to 10 mm, preferably 6 mm.

[0082] In this example, the first overflow section 310 and the second overflow section 312 are located on opposite or opposite sides of the outlet portion (in this case, only outlet 316). However, in other examples, the overflow sections 310, 312 may be separated around outlet 316 or the outlet portion by other amounts, for example, the overflow sections may be arranged such that the multiple streams of solder flowing through these overflow sections form an angle of about 30 degrees to 160 degrees, suitably from about 40 degrees to 100 degrees, with each other.

[0083] In this example, the first overflow section 310 includes a recessed or stepped section within the peripheral edge 306 of the outlet 316. That is, the first overflow section 310 is recessed downwards from an adjacent portion of the peripheral edge 306. This recessed or stepped section provides a defined boundary within which the solder flow is guided to produce a flow of a specific width. In other examples, overflow sections 310 and 312 may or may not include a recessed or stepped section within their peripheral edges.

[0084] In this example, the outer surface of the nozzle 300 includes at least one guide portion configured to guide solder dispensed from the outlet 316. The guide portion may be a channel, a groove, a flat guide surface, etc.

[0085] In this example, the body portion 302 of the nozzle 300 is surrounded by a sidewall portion 372. A first guide portion, a channel 380, is defined at the junction between the body portion 302 and the raised wall portion 372. This channel is configured to guide solder dispensed from the outlet 316. The channel 380 extends around the outer surface of the nozzle 300 and guides overflowing liquid solder back into the liquid solder supply section (i.e., solder tank or solder reservoir). In other words, the channel portion 380 is configured to function as a groove located around the body portion 302 of the nozzle 300 to smoothly guide the solder back to the solder supply section.

[0086] Solder can be guided back to the solder supply section, for example, through an opening 382 in the sidewall portion 372 of the channel portion 380.

[0087] In this example, the nozzle 300 includes a second guide portion, namely a guide surface 384. In this example, the guide surface 384 is a flat section on the body portion 302 that extends longitudinally along the outer side of the nozzle 300. In this example, the guide surface 384 is longitudinally aligned with the overflow section 310 (i.e., extends downwards from the overflow section). Thus, as solder flows through the overflow section 310, the solder can flow downwards along the guide surface back to the solder supply section. It should be understood that the nozzle 300 may include guide surfaces extending from both overflow sections.

[0088] Figures 3 to 6 The nozzle is configured for use in a system for welding components, the system further including a liquid solder supply unit and a pump device configured to pump solder from the solder supply unit to the nozzle (or more specifically, to the outlet portion / outlet of the nozzle). For example, the system can be of a type known in the art, such as Vitrionics Soltec ZEVAm.

[0089] In this example, the system is used to solder components, such as printed circuit boards (PCBs).

[0090] In some examples, the system may include a transport system configured to support the PCB and move it from a first loading non-soldering position to a soldering position (e.g., at a soldering station within the system). Any suitable transport system can be used, such as a pin support chain.

[0091] Once in the soldering position, soldering can begin. During soldering, solder is pumped to the nozzle outlet, causing solder to overflow from that outlet. The connector pins are then dragged through or immersed in the overflow solder corresponding to one of the overflow sections (or conversely, the nozzle can move relative to the connector pins on the PCB). In other words, during soldering, the nozzle, the PCB, or both can move relative to each other (i.e., the relative position between the nozzle and the PCB is adjusted).

[0092] When soldering specific sections of a PCB (with specific requirements for the required solder width), a preferred overflow section can be selected based on the required solder width. In other words, an overflow section that produces a solder flow of the preferred width is selected. During the soldering operation, the connector pins of the PCB can then be dragged into or immersed in the solder flow.

[0093] The selection can be made by the system's controller. The controller can make the selection based on information according to pre-programmed information. For example, the controller may include (or have access to) memory containing information related to the preferred width of the solder flow for a specific segment of the PCB.

[0094] In some examples, the additional identification / determination steps can precede the selection steps. That is, information related to the PCB (specifically, a particular section of the PCB) can be identified or determined, for example, through visual inspection of the PCB. The selection steps can then be based on this identified / determined information.

[0095] Figure 7a An example of soldering operations on PCB 800 using nozzle 300 is shown. In this example, when soldering a row of pins 801, overflow section 310 has been selected as the preferred overflow section.

[0096] Before the soldering operation, it may be necessary to adjust the relative orientation and / or position between the nozzle and the PCB so that, during the soldering operation, the solder flow generated as the solder flows through a preferred overflow section will be used to solder the PCB. In other words, the relative orientation and / or position between the nozzle and the PCB can be adjusted to align the connector pins of the PCB with the solder overflowing from the preferred overflow section (considering the direction of relative movement between the PCB and the nozzle during the soldering operation). As an example, consider... Figure 7a Once overflow section 310 has been selected as the preferred overflow section, the relative position and orientation between the nozzle and the PCB may need to be adjusted to align pin 801 with the solder flow flowing through overflow section 310.

[0097] In some examples, the relative orientation between the nozzle and the PCB is adjusted by tilting the nozzle axis and / or the PCB to change the angle between them. That is, the nozzle can be tilted relative to the PCB and / or the PCB can be tilted relative to the nozzle.

[0098] In this example, the relative orientation between the nozzle 300 and the PCB 800 is adjusted by tilting the PCB 800 relative to the nozzle 300 (which remains vertical). In other words, the PCB 800 is tilted away from the horizontal plane. Tilting the PCB is beneficial to the soldering process because it utilizes gravity to better guide solder with a lower risk of bridging.

[0099] In some examples, the relative orientation between the nozzle and the PCB is adjusted by rotating the nozzle about its axis. That is, with the PCB in a fixed position, the nozzle is rotated about its longitudinal axis to adjust the relative orientation between the two. In this example, the nozzle 300 has been rotated until the path of the solder flowing through the preferred overflow section 310 is substantially aligned with the direction of movement of the nozzle 300 relative to the PCB 800.

[0100] In this example, nozzle 300 moves parallel to PCB 800 (see arrow 1000) to immerse the connector pins in overflow solder. Specifically, the nozzle moves downwards, but parallel to the tilt of PCB 800. That is, the displacement of the nozzle relative to the PCB has both horizontal and vertical components. Specifically, during the soldering operation, the nozzle height is adjusted to allow the connector pins of PCB 800 to be dragged across the overflow solder (regardless of the relative angle between the non-horizontal PCB 800 and the vertical nozzle).

[0101] In some cases, it may be necessary to solder certain sections of a PCB with a first-width solder flow and other sections with a second-width solder flow. For example, different types / sizes of connector pins may be soldered using solder flows of varying thicknesses. Similarly, depending on the arrangement of the connector pins on the PCB, a smaller solder flow may be required (e.g., a dual-row connector may require a finer solder pitch). As an example, the first set of pins may require approximately 2mm of solder width, while the second set of pins on the same PCB may require 6mm of solder width.

[0102] Return to reference Figure 7a For example, after soldering pin 801, the selection process can be repeated based on the desired solder width preferred for soldering pin 803. If necessary (e.g., if the preferred overflow section for pin 803 is different from the preferred overflow section for pin 801), the relative orientation between the nozzle and the PCB can be adjusted before further soldering operations.

[0103] In this example, overflow section 312 is selected as the preferred overflow section for soldering pin 803. Figure 7b The diagram shows the nozzle 300 after it has been rotated about its axis, along with the PCB 800. In this example, because the overflow sections 310 and 312 are located on opposite sides of the outlet 316, the nozzle rotates 180 degrees to switch from using overflow section 310 to using overflow section 312. In other examples, the amount of rotation will depend on the relative positions of the overflow sections.

[0104] In this example, the relative orientation between nozzle 300 and PCB 800 is also adjusted by tilting nozzle 300 relative to PCB 800. In other words, the nozzle axis is tilted away from the vertical direction. This helps to prevent the solder flow from naturally preferentially flowing through overflow section 310 (due to the slope of the outlet). However, in other examples where there is no such preferential flow, tilting the nozzle may not be necessary.

[0105] Before adjusting the relative orientation between the nozzle and the PCB, the relative position between the PCB and the nozzle may also be adjusted depending on the relative positions of the consecutive connector pins to be soldered. For example, if a row of pins 801 and a row of pins 803 are located at different locations on the PCB (instead of being aligned), the PCB and / or the nozzle may be translated to reposition the PCB and / or the nozzle.

[0106] Combining PCB tilting and nozzle rotation when using fine-pitch soldering, such as when soldering dual-row connectors, helps reduce the need to switch soldering tanks / nozzles in use.

[0107] To adjust the relative position and orientation between the nozzle and the PCB, the system further includes an actuation device. As needed, the actuation device can be configured to rotate the nozzle about its axis and / or tilt the nozzle axis and / or the PCB to change the angle between them and / or adjust the relative position of the PCB and the nozzle.

[0108] Any suitable actuation device can be used, such as an electric or mechanical actuator. It should be understood that the actuation device may include, for example, a single actuation device centrally controlled by a controller (e.g., comprising independent actuators, each configured to provide a specific adjustment of position / orientation). In other examples, the actuation device may include multiple separate actuators, each individually controlled and operated.

[0109] Figure 8 , Figure 9a and Figure 9bAnother example of a nozzle 600 for guiding solder flow during a welding operation is shown. Nozzle 600 includes many features common to nozzle 300 of the foregoing example, wherein similar components are labeled in the same manner, but with the prefix 6-. Nozzle 600 is suitable for the same system described in the foregoing example and operates in substantially the same manner.

[0110] In this example, the export section includes more than one export. In this particular example, the export section includes two exports 616. 1-2 In other words, the outlet section includes two distinct outlets from which solder is dispensed during the soldering operation. In other examples, any number of outlets can be used, such as three, four, or more.

[0111] In this example, there exists a 616 at each outlet. 1-2 The associated overflow sections are 610 and 612; however, in other examples, each outlet is 616. 1-2 It may include more than one overflow section. In this example, the overflow section for each outlet is connected to the corresponding outlet. Specifically, in this example, the overflow section is a section on the outer edge of the corresponding outlet.

[0112] In this example, nozzle 600 includes channels 620 and 622, each channel corresponding to outlet 616. 1-2 Fluidly connected to inlet 604. In this example, channels 620 and 622 connect to their corresponding outlets 616 via the same channel 614. 1-2 It is fluidly connected to the inlet. However, in other examples, each channel can extend independently from the inlet 604 to the corresponding outlet 616. 1-2 .

[0113] Using more than one channel in a nozzle allows for better control of the flow of liquid solder. For example, as indicated in the previous example, when using a single channel with multiple overflow sections, the solder will choose the path of least resistance (e.g., the solder will typically flow through the lowest overflow section). This can result in higher flow rates in one overflow section and almost no flow rates in another. Consequently, the nozzle may need to be tilted towards the non-preferred overflow section when necessary. Providing a separate supply channel for each outlet and / or each overflow section allows for better control over the path chosen by the solder. In some examples, one or more of these channels may have flow-limiting elements, such as screws or the like, located within the channel to limit / control the fluid flowing through it. In some examples, if the corresponding outlet or overflow section is not in use, the channel can be manually closed (and then reopened when needed).

[0114] In this example, such as Figure 9a and Figure 9b As shown, during use, the solder flows through each overflow section 610 and 612 simultaneously to generate two different solder flows. Figure 10a and Figure 10b The nozzle 600 used in welding operations is shown. Specifically, Figure 10a The nozzle 600 in use when overflow section 610 is the preferred overflow section is shown. As in the previous example, the relative orientation between the nozzle 600 and the PCB 800 is adjusted by tilting the PCB 800 relative to the nozzle 600 (which remains vertical). In this example, the PCB 800 is tilted such that when the nozzle 600 moves parallel to the PCB 800 (see arrow 1000), the connector pins are only immersed in the solder overflowing from the preferred overflow section (i.e., overflow section 610). In other words, the PCB 800 is tilted toward the preferred overflow section. The tilt of the PCB 800 prevents the connector pins from being immersed in the solder flow flowing through the non-preferred overflow section 612.

[0115] Figure 10b This illustrates the nozzle 600 in use when overflow section 612 is a preferred overflow section. In this example, nozzle 600 has been... Figure 10a The arrangement shown is rotated (approximately 180 degrees in this example) until the path of the solder flowing through the preferred overflow section 612 is substantially aligned with the direction of movement of the nozzle 600 relative to the PCB 800. After the nozzle 600 is rotated, tilting the PCB ensures that the connector pins will now be immersed only in the solder overflowing from the overflow section 612, and not in the now non-preferred overflow section 610.

[0116] Figure 11 , Figure 12a and Figure 12b Another example of a nozzle 400 for guiding solder flow during a welding operation is shown. Nozzle 400 includes many features common to the nozzles of the aforementioned examples, with similar components labeled in the same manner but prefixed with 4-. Nozzle 400 is suitable for use in the same system described in the aforementioned examples and operates in substantially the same manner.

[0117] In this example, nozzle 400 includes three outlets 416 1-3Each outlet has a corresponding overflow section. Specifically, in this example, each overflow section includes a surface extending from the outer edge of the corresponding outlet. In use, solder flows out of each outlet and over the surface of the corresponding overflow section. In this example, the nozzle 400 includes three channels 420, 422, and 424 (however, channel 420 is not visible in the figure). Each channel 420, 422, and 424 fluidly connects the corresponding outlet to the inlet 404 via a conduit 414.

[0118] In this example, the surface of each overflow section includes a boundary wall or edge that provides a boundary for the solder flowing across the surface of the overflow section. In other words, the portion of the surface through which solder can flow in each overflow section is defined by a wall or edge (the distance between the boundary walls at a portion of the surface is the “width” of the surface). This helps guide the solder to flow over it and also prevents mixing between solder dispensed from different outlets.

[0119] In this example, each overflow section has a width different from the widths of the other overflow sections, such that in use, the solder flowing through each overflow section produces a solder flow with a different width. For example, the surface of the overflow section associated with the first outlet 4161 may have a width from about 1 mm to 4 mm, preferably 2 mm; the surface of the overflow section associated with the second outlet 4162 may have a width from about 2 mm to 6 mm, preferably 4 mm; and the surface of the overflow section associated with the third outlet 4163 may have a width from about 4 mm to 8 mm, preferably 6 mm.

[0120] In this example, the outlet section has a roughly rectangular outline (viewed from above); however, other outlines are possible. Overflow sections are spaced around the perimeter of the outlet section, causing the solder flowing through the overflow sections to be guided in different directions (e.g., Figure 12b (As shown). Thus, by rotating the nozzle, for example by rotating it 90 degrees or 180 degrees, welding flows of different widths can be provided.

[0121] Figure 13 and Figure 14 A welding assembly 500 is shown, which includes a nozzle 300 for guiding the solder flow during the welding operation. In the example shown, the nozzle 300 corresponds to... Figures 3 to 6 The nozzle shown, however, in other examples, could correspond to nozzle 400, nozzle 600, or any variant discussed herein.

[0122] In this example, the welding assembly further includes a shielding assembly 410, which includes a shielding portion 412 configured to at least partially surround the nozzle 300. Specifically, the shielding portion 412 is configured to at least partially surround a side portion (i.e., sidewall portion 372) of the nozzle 300, thereby allowing the nozzle to extend through an aperture or hollow cavity of the shielding portion 412. In this example, the shielding portion 412 has a hollow truncated conical profile. However, in other examples, the shielding portion 412 may have other profiles, such as a cylindrical shape.

[0123] The shielding part 412 is configured to contain solder spatter from the nozzle 300 during use and to help guide the solder from the nozzle 300 back to the solder supply part.

[0124] In this example, the shielding assembly 410 further includes a conduit 414 configured to project, emit, or dispense debridging fluid. In this example, the conduit 414 has a first end configured to connect to a supply of the debridging fluid (e.g., an inert gas flow, such as nitrogen). The conduit 414 has a second end positioned near the nozzle outlet 406. In use, the debridging fluid is supplied from the fluid supply through the conduit 414 and projected as a stream or jet of debridging fluid from the second end of the conduit 414. The supply of the debridging fluid can be continuous or intermittent (e.g., corresponding to soldering connector pins). In some examples, the temperature and / or velocity of the debridging fluid flow is adjustable.

[0125] The conduit 414 is configured to project debridging fluid into the area near the outlet 316 of the nozzle 300. That is, the debridging fluid jet or stream is guided or angled toward the area near the outlet 316 of the nozzle 300. Thus, the debridging fluid jet or stream is projected toward the component most recently soldered by the overflow solder stream distributed from the outlet. For example, when soldering connector pins on a PCB using a soldering assembly, the connector pins are impacted by the debridging fluid as they emerge from the overflow solder stream. The shield 412 helps provide an inert environment in the soldering area. That is, the debridging fluid is blown into the solder bath and will escape along the nozzle. The shield reduces the oxygen level and prevents oxidation during the soldering process, and helps promote solder wetting.

[0126] In this example, in use, the conduit 414 is oriented / angled to guide the fluid jet or stream in the opposite direction to the relative movement between the PCB and the nozzle.

[0127] In some examples, the conduit (which may or may not be integrated with the shield) is rotatable relative to the nozzle 300. That is, while the nozzle 300 rotates relative to the PCB, the conduit (and in this example, the shield) can remain fixed, allowing the jet or stream to be redirected based on the overflow section in use (relative to the nozzle). In some examples, when switching between different overflow sections of the nozzle, the conduit can remain in a fixed orientation relative to the PCB, and only the nozzle can rotate. In other examples, both the conduit and the nozzle can rotate to some extent. In other words, the conduit can rotate independently of the nozzle.

[0128] Because the debridging fluid impacts the soldered components, it reduces or prevents bridging between adjacent soldered components (e.g., adjacent consecutively soldered connector pins within a row of connector pins). In other words, overflow solder can become unstable when it bridges adjacent connector pins, and this instability is corrected by impacting the debridging fluid. Furthermore, using a hot gas (e.g., nitrogen at a temperature above approximately 230 degrees Celsius, typically corresponding to the liquidus temperature of solder) as the debridging fluid improves solderability.

[0129] In this example, the second end of the catheter is substantially flattened. That is, the catheter has a generally tubular profile, with the second tubular end being flattened to provide more concentrated flow.

[0130] Revise

[0131] Various modifications to the detailed design described above are possible. For example, it should be understood that aspects of the above examples (and their variations) can be combined in any suitable manner. In a non-limiting example, the nozzle described above can have any suitable number of outlets, each outlet integrally formed with or connected to any suitable number of overflow sections (of any of the above configurations). The overflow sections can be arranged around the periphery of the outlet portion at any suitable location to allow flow over them.

[0132] The nozzle of the described example can be manufactured in any suitable manner. For example, the nozzle may comprise multiple stacked layers configured to define at least one channel. The stacked layers may be deposited, for example, during additive manufacturing or 3D brushing. For example, the stacked layers may comprise stainless steel or titanium. Constructing nozzles in this way (e.g., by additive manufacturing or 3D printing) allows for the production of different shapes and models that are typically not achievable with milling or drilling machines. This allows for the production of nozzles with improved functionality and / or more efficient use of material. 3D-printed nozzles may have suitable coatings to improve corrosion resistance (e.g., a diffusion coating of chromium carbide). Using 3D printing to produce the nozzle of the described example allows for the efficient production of such nozzles (with complex geometries, including more than one overflow section).

[0133] Similarly, in other aspects of the described examples, for example, shielding 412 and conduit 414 can be produced during additive manufacturing or 3D printing processes.

[0134] In some examples, such as Figure 15 As shown, the conduit can be integrated with the nozzle. For example, the conduit can extend from the end of the nozzle. For example, the conduit can be located between overflow sections. Figure 15 Showing from Figure 8 The nozzle 700 shown is an extension of the conduit 714. In this way, the conduit is properly positioned to function for both overflow sections. By simultaneously projecting bridging fluid toward both overflow sections, the conduit can function for both overflow sections. Alternatively, the conduit can be rotated relative to the overflow sections, such that when the nozzle rotates (switching between uses of the overflow sections), the nozzle rotates relative to the conduit, and therefore the conduit is always aligned with the overflow section in use.

[0135] It should be understood that when the width of the first / second overflow section is "substantially" equal to the width of the first / second overflow section, the width of the resulting solder flow can be exactly the same as the width of the first / second overflow section. However, the width of the resulting solder flow can differ slightly from the width of the first / second overflow section. For example (especially if the overflow section does not include recessed portions, stepped portions, or boundary walls), the width of the resulting solder flow can be greater than or less than the width of the corresponding overflow section. The amount by which the width of the solder flow is greater or less than the width of the corresponding overflow section can vary depending on the pump output.

[0136] Similarly, it should be understood that the width of the solder flow can vary with distance from the outlet. For example, an overflow section may only guide / restrict the solder flow for a certain distance (e.g., until the solder has completely or at least partially flowed through the overflow section), after which the width of the solder flow can be increased or decreased.

[0137] In some examples, the PCB can be horizontal during the soldering operation. In such examples, one or more channels can be closed, causing solder to flow through only a single overflow section. Alternatively, the PCB can be raised relative to the nozzle in such a way that the connector pins are dragged across the highest point of the solder flow. The PCB or nozzle can then be tilted to switch to using another overflow section.

[0138] In some examples, the PCB can be tilted along more than one axis. For example, the PCB defines an XY plane, which can be tilted in either the X or Y direction (at positive and negative angles).

[0139] In the example above, the nozzle remains vertical throughout the welding operation. However, in other examples, the nozzle can be tilted (i.e., the nozzle's axis can be tilted relative to the horizontal plane). In particular, the nozzle can be tilted such that solder flows through only one overflow section (i.e., the overflow section the nozzle is tilted towards). The nozzle can be rotated along its axis as described above to switch between using the overflow sections.

[0140] In the example above, during the soldering operation, the PCB is tilted and the nozzle moves downwards along the PCB's slope. However, in other examples, the nozzle can move relative to the PCB in other ways. That is, referring back to... Figure 7a and Figure 7b The nozzle can be moved into or out of the page.

[0141] It will be apparent to those skilled in the art that the features described with respect to any of the above embodiments can be applied interchangeably between different embodiments. The above embodiments are examples used to illustrate various features of the present invention.

[0142] Throughout the specification and claims, the words “comprising” and “including,” and variations thereof, mean “including, but not limited to,” and are not intended to (and do not) exclude other parts, additions, components, integrals, or steps. Throughout the specification and claims, the singular encompasses the plural unless the context requires otherwise. In particular, where the indefinite article is used, the specification should be understood to consider both the plural and singular forms unless the context requires otherwise.

[0143] Features, integrals, properties, compounds, chemical portions, or groups described in connection with specific aspects, embodiments, or examples of the invention should be understood to be applicable to any other aspects, embodiments, or examples described herein, unless incompatible therewith. All features disclosed in this specification (including any appended claims, abstract, and drawings) and / or all steps of any method or process so disclosed may be combined in any combination unless at least some of such features and / or steps are mutually exclusive. The invention is not limited to the details of any of the foregoing embodiments. The invention extends to any novel feature or any novel combination of features disclosed in this specification (including any appended claims, abstract, and drawings), or to any novel step or any novel combination of steps in any method or process so disclosed.

[0144] Readers should note all papers and documents that were submitted concurrently with or prior to this specification and made publicly available together with this specification, and the contents of all such papers and documents are incorporated herein by reference.

Claims

1. A nozzle for guiding solder flow during point-to-point welding operations, wherein, The nozzle is configured to rotate about an axis to a first position and a second position, the nozzle comprising: The main body portion has: An inlet, configured to receive a supply of solder; The export section has one or more outlets, each of which is configured to dispense solder; and At least one channel fluidly connects the inlet to the one or more outlets; The outlet portion is located above the inlet, such that during use, solder flows from the inlet to the outlet portion in a generally upward direction along the at least one channel. The outlet portion has a first overflow section and a second overflow section, each overflow section being integral with or connected to the outer perimeter of one or more of the outlets. The outlet portion is configured to dispense solder from the one or more outlets and allow the solder to flow through the first overflow section and / or the second overflow section. The first overflow section has a first width, such that during use, the solder flowing through the first overflow section produces a solder flow with a width corresponding to the first width. The second overflow section has a second width different from the first width, so that during use, the solder flowing through the second overflow section produces a solder flow with a width corresponding to the second width. Wherein, when the nozzle is in the first position, the nozzle is configured to allow the solder to flow through the first overflow section but not through the second overflow section, and when the nozzle is in the second position, the nozzle is configured to allow the solder to flow through the second overflow section but not through the first overflow section.

2. The nozzle according to claim 1, wherein, The export section has a first export and a second export.

3. The nozzle according to claim 2, wherein, The first overflow section is integral with the first outlet or the first overflow section is connected to the first outlet, and wherein the second overflow section is integral with the second outlet or the second overflow section is connected to the second outlet.

4. The nozzle according to claim 2, wherein, The main body includes a first channel and a second channel, wherein the first channel fluidly connects the inlet to the first outlet, and the second channel fluidly connects the inlet to the second outlet.

5. The nozzle according to claim 1, wherein, At least one of the first overflow section or the second overflow section includes a substantially straight portion in the outer edge of the outlet of the one or more outlets.

6. The nozzle according to claim 1, wherein, At least one of the first overflow section or the second overflow section includes a recessed section or a stepped section within the peripheral edge of the outlet in one or more of the outlets; and / or Specifically, when the nozzle is in a vertical position, the flow resistance of the first flow path from the outlet portion through the first overflow section is lower than the flow resistance of the second flow path from the outlet portion to the second overflow section.

7. The nozzle according to claim 1, wherein, The first overflow section and the second overflow section are located on opposite sides of the outlet portion; and / or The main body portion of the nozzle further includes an outer surface, a first guide portion, and a second guide portion. The main body portion defines a vertically extending central axis. The first overflow section has a width between 1 mm and 4 mm, such that during use, the surface tension between the solder flowing through the first overflow section and the first guide portion generates a solder flow with a width corresponding to the first width. The second overflow section has a second width, which is between 4 mm and 10 mm and is different from the first width, so that during use, the surface tension between the solder flowing through the second overflow section and the second guide portion produces a solder flow with a width corresponding to the second width.

8. The nozzle according to claim 1, wherein, The outlet portion has a third overflow section, which is integral with or connected to the outer edge of one or more of the outlets. At least a portion of the third overflow section has a third width that is different from the first width and the second width, such that in use, the solder flowing through the third overflow section produces a solder flow with a width substantially corresponding to the third width.

9. The nozzle according to claim 8, wherein, The overflow section is spaced around the periphery of the outlet portion.

10. The nozzle according to claim 1, wherein, The nozzle comprises multiple stacked layers that can be obtained by deposition during an additive manufacturing or 3D printing process, the multiple stacked layers being configured to define the at least one channel.

11. The nozzle according to claim 1, wherein: The outlet portion includes the outer edge; The first overflow section includes a recessed section or a stepped section within the outer edge; The second overflow section is a straight section located on the outer edge of the outlet portion opposite to the first overflow section; and The outer edge has a first straight portion and a second straight portion extending between the recessed section or the stepped section of the first overflow section and the straight section of the second overflow section, the first straight portion and the second straight portion of the outer edge being at an angle relative to the first overflow section and the second overflow section; and When the nozzle is in a vertical position, the second overflow section extends higher than the first overflow section, and the first straight portion and the second straight portion of the outer edge extend downward from the second overflow section to the first overflow section.

12. A system for welding components, the system comprising: Liquid solder supply department; A nozzle for guiding solder flow during point-to-point welding operations, wherein the nozzle is configured to rotate about an axis to a first position and a second position, the nozzle comprising: The main body portion has: An inlet, configured to receive a supply of solder; The export section has one or more outlets, each of which is configured to dispense solder. First guiding section; The second guiding section; and At least one channel fluidly connects the inlet to the one or more outlets; The outlet portion is located above the inlet, such that during use, solder flows from the inlet to the outlet portion in a generally upward direction along the at least one channel. The outlet portion has a first overflow section and a second overflow section, each overflow section being integral with or connected to the outer perimeter of one or more of the outlets. The outlet portion is configured to dispense solder from the one or more outlets and allow the solder to flow through the first overflow section and / or the second overflow section. The first overflow section has a first width, such that during use, the surface tension between the solder flowing through the first overflow section and the first guide portion generates a solder flow with a width corresponding to the first width. The second overflow section has a second width that is different from the first width, so that during use, the surface tension between the solder flowing through the second overflow section and the second guide portion generates a solder flow with a width corresponding to the second width. Pumping equipment, the pumping equipment being configured to pump solder from the solder supply section to the nozzle; and An actuation device configured to change the angle of the nozzle to control the width of the solder flow by controlling which of the first overflow section or the second overflow section receives the overflowing solder, and Wherein, when the nozzle is in the first position, the nozzle is configured to allow the solder to flow through the first overflow section but not through the second overflow section, and when the nozzle is in the second position, the nozzle is configured to allow the solder to flow through the second overflow section but not through the first overflow section.

13. The system of claim 12, wherein the nozzle has a longitudinal axis, wherein, The actuating device is configured to rotate the nozzle about its axis; and / or The main body portion has an outer surface, and the main body portion defines a vertically extending central axis.

14. The system of claim 12, wherein the nozzle has a longitudinal axis, The actuation device is configured to tilt at least one of the axis of the nozzle or the component to be welded to change the angle between the two.

15. A method of manufacturing a nozzle for guiding a flow of solder during a welding operation, the method comprising: A material layer is deposited during additive manufacturing or 3D printing to construct a nozzle according to any one of claims 1 to 11.

16. A method for welding components, the method comprising: Provide a system according to any one of claims 12 to 14; Provide the components to be welded; Select the preferred overflow section based on the required solder width; Adjust the relative orientation between the nozzle and the component to be welded so that, during the welding operation, the component is welded using the solder flow generated when the solder flows through the preferred overflow section; as well as The welding operation is performed using the system according to any one of claims 12 to 14.

17. The method according to claim 16, wherein, The relative orientation between the nozzle and the component to be welded is adjusted by rotating the nozzle about its axis.

18. The method according to claim 16, wherein, The relative orientation between the nozzle and the component to be welded is adjusted by tilting the axis of the nozzle and / or the component to be welded to change the angle between the two.

19. A nozzle for guiding solder flow during a point-to-point welding operation, wherein each weld joint is welded individually during the point-to-point welding operation, the nozzle comprising: The main body portion has: An inlet for receiving a supply of solder; The outlet portion has at least one outlet for dispensing solder therefrom; as well as At least one channel fluidly connects the inlet to the at least one outlet; The outlet portion is adapted to be positioned above the inlet, such that during use, solder flows from the inlet to the outlet portion in a generally upward direction along the at least one channel. The outlet portion has a first overflow section and a second overflow section, each overflow section being integral with or connected to the outer edge of the at least one outlet, such that in use, the solder is dispensed from the at least one outlet and flows through the first overflow section and / or the second overflow section. Wherein, the at least one outlet slopes toward either the first overflow section or the second overflow section. Wherein, at least a portion of the first overflow section has a first width, such that, in use, the solder flowing through the first overflow section produces a solder flow with a width substantially corresponding to the first width, and Wherein, at least a portion of the second overflow section has a second width different from the first width, such that in use, the solder flowing through the second overflow section produces a solder flow with a width substantially corresponding to the second width.

20. The nozzle according to claim 19, wherein, The first overflow section and the second overflow section are at an angle relative to the adjacent portions of the outer edge.

21. A system for welding components, the system comprising: Liquid solder supply department; A pumping device configured to pump solder from the solder supply section to the nozzle; The nozzle according to any one of claims 19 and 20; as well as An actuation device configured to change the relative orientation between the nozzle and the component to be welded.

22. A method of manufacturing a nozzle according to any one of claims 19 and 20, wherein each weld joint is welded individually, the method comprising: Deposit material layers during additive manufacturing or 3D printing to construct a nozzle according to any one of claims 19 and 20.

23. A method for welding components, the method comprising the following steps: Provide the system according to claim 21; Provide the components to be welded; Select the preferred overflow section based on the required solder width; Adjust the relative orientation between the nozzle and the component to be welded so that, during point-to-point welding operations, the component is welded using the solder flow generated as the solder flows through the preferred overflow section; as well as Perform point-to-point welding operations, in which each weld joint is welded individually.

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