A universal dilution refrigerator multi-channel expandable signal measurement device

Abstract

The present invention discloses a general-purpose dilution refrigerator multi-channel expandable signal measurement device, which is partially built in the dewar of the dilution refrigerator. The dewar is divided into 300K layer, 50K layer, 4K layer, 1K layer, 100mK layer and 10mK layer from top to bottom according to the temperature of different layers, and each layer is separated by a cold plate. The measurement device includes a quantum chip, an ultra-low temperature attenuator component, an ultra-low temperature low-pass filter component, a parametric amplifier, an ultra-low temperature integrated DC bias device, an ultra-low temperature infrared filter component, an integrated connector, an ultra-low temperature circulator / isolator component and an integrated cable component; the parametric amplifier, the ultra-low temperature circulator / isolator component, and the ultra-low temperature integrated DC bias device are all arranged in the 100mK layer. Under the premise that the cooling capacity of the refrigerator remains unchanged, the present invention greatly expands the number of channels and devices to achieve 100-bit quantum computing measurement.

Description

Technical Field

[0001] The invention relates to a universal dilution refrigerator multi-channel expandable signal measurement device, belonging to the technical field of multi-bit quantum computing. Background Art

[0002] In recent years, with the continuous development of semiconductor technology, the size of transistor devices integrated on semiconductor chips has become smaller and smaller, and the number has increased. The quantum effect brought by the volatility of electrons has gradually become prominent, and integrated circuit technology is facing its technical limits. Moreover, although the processing speed of computers has increased exponentially, some problems are still simply unsolvable by current computers. To this end, new computing technologies must be developed. Quantum computing, which emerged at the end of the last century, is one of the solutions. Since quantum computing is based on quantum mechanics, its inherent parallelism enables it to solve some problems that classical computers cannot solve. This makes it of great research significance and huge application prospects. At present, quantum computing has become a very popular research field.

[0003] Since various quantum computing schemes have been proposed, superconducting qubits are the fastest growing scheme in quantum computing. With the rapid increase in the number of qubits, the demand for the capacity of refrigerator measurement systems is also expanding. The cooling capacity of existing refrigerators only meets the requirements of 20Qubit quantum computing. Expanding the original cooling capacity to accommodate more qubits, such as 100Qubit, and avoiding the high investment in dilution refrigerators has become the choice of more and more users. Summary of the invention

[0004] The purpose of the present invention is to provide a general-purpose dilution refrigerator multi-channel expandable signal measurement device to solve the problem of insufficient capacity of refrigerator measurement system in the prior art. By combining the low-temperature performance characteristics of different materials and structures, in order to adapt to the cooling capacity of existing refrigerators, the present invention adopts superconducting materials with high thermal conductivity, reduces the size of key components, and appropriately transforms the measurement system of the refrigerator, so that the 80 cables carried by the refrigerator are expanded to 240, thereby meeting the requirements of quantum computing systems within 100-Qubit.

[0005] The present invention specifically adopts the following technical scheme: a general-purpose dilution refrigerator multi-channel expandable signal measurement device, which is partially built in the dewar of the dilution refrigerator, and the dewar is divided into 300K layer, 50K layer, 4K layer, 1K layer, 100mK layer and 10mK layer from top to bottom according to the temperature of different layers, and each layer is separated by a cold plate, and the measurement device includes a quantum chip, an ultra-low temperature attenuator component, an ultra-low temperature low-pass filter component, a parametric amplifier, an ultra-low temperature integrated DC bias device, an ultra-low temperature infrared filter component, an integrated connector, an ultra-low temperature circulator / isolator component and an integrated cable component; the 300K layer cold plate is used as a vacuum cover, and each layer of the cold plate is installed with a heat sink, and the integrated connector component is arranged on the heat sink through a plate;

[0006] The parametric amplifier, the ultra-low temperature circulator / isolator component, and the ultra-low temperature integrated DC bias device are all arranged in the 100mK layer.

[0007] As a preferred embodiment, a shielding barrel and a shielding cover are provided below the 10mK layer cold plate, and the 10mK layer cold plate and the shielding cover are connected by a first bracket; an aluminum cover is provided below the shielding cover, and an aluminum tray is provided inside the shielding barrel, and the aluminum tray and the aluminum cover are connected by a second bracket; a quantum chip printed board is provided above the aluminum tray, and a copper plate is provided below the aluminum tray; the quantum chip is sealed on the quantum chip printed board, and a shielding box is provided above the quantum chip; a plurality of multi-channel integrated sockets are provided on the quantum chip printed board, The quantum chip is connected to the multi-channel integrated socket through the wires on the quantum chip printed circuit board; the ultra-low temperature infrared filter component is arranged on the aluminum cover and the shielding cover through the board, and a multi-core adapter is arranged below the ultra-low temperature infrared filter component, and the multi-core adapter is fixedly connected to the aluminum cover; an ultra-low temperature attenuator component and an ultra-low temperature low-pass filter component are arranged in sequence below the 10mK layer integrated connector component, and the 10mK layer integrated connector, the ultra-low temperature attenuator component, and the ultra-low temperature low-pass filter component are plug-in connected.

[0008] As a preferred embodiment, the ultra-low temperature low-pass filter assembly is connected to the ultra-low temperature infrared filter assembly through a tinned copper braided flexible cable; the multi-core adapter is connected to the multi-channel integrated socket through a tinned copper braided flexible cable.

[0009] As a preferred embodiment, the integrated connector assembly adopts a 13-core combination plug module, including a first heat sink, an SSMP connector, an SSMP mounting slot, a first mounting screw hole, and a connector mounting hole. The SSMP connector shell is provided with an external thread, and the joint of the SSMP connector is provided with an SSMP mounting slot for easy installation of a torque wrench; a plurality of connector mounting holes are provided inside the heat sink, and each of the connector mounting holes is provided with an internal thread matching the external thread of the SSMP connector shell; the SSMP connector is rotated to the inside of the heat sink to complete the installation; a plurality of first mounting screw holes are provided on the heat sink, and after the integrated connector assembly is connected to other components, it is fixed by screws installed in the first mounting screw holes.

[0010] As a preferred embodiment, the integrated cable assembly includes any one or more of the following items: stainless steel cable assemblies used in 300K and 50K layers; niobium-titanium cable assemblies used in 4K layers and below; conventional tin-dipped copper braided silver-plated copper soft cables used in 10mK layers.

[0011] As a preferred embodiment, the niobium-titanium cable assembly includes a second heat sink, a niobium-titanium cable, a second mounting screw hole, a second mounting screw, and a cable connector. The cable connector adopts an SSMP connector. Two groups of the niobium-titanium cable assemblies are plug-in connected to one group of the integrated connector assembly, and the second mounting screw is connected to the integrated connector assembly through the second mounting screw hole. The niobium-titanium cable is provided with a bending area in the middle part, which is used to prevent the niobium-titanium cable from breaking due to shortening at ultra-low temperatures.

[0012] As a preferred embodiment, the ultra-low temperature annulator / isolator assembly includes a third mounting screw, a third upper cover plate, an ultra-low temperature annulator, a cavity, a third lower cover plate, an ultra-low temperature isolator, a baffle, a boss, a third mounting hole, and a threaded hole;

[0013] A third upper cover plate is provided on the upper side of the cavity, and a third lower cover plate is provided on the lower side of the cavity, and the third upper cover plate and the third lower cover plate are both provided with a through third mounting hole, and a threaded hole is provided on the cavity at a position corresponding to the third mounting hole; the cavity and the third upper cover plate and the third lower cover plate are detachably connected by third mounting screws; a baffle is provided in the middle of the cavity, and the baffle divides the cavity into two layers, an upper layer and an lower layer, and a boss is provided in the center of the baffle, the upper end surface of the boss is in the same plane with the upper surface of the cavity, and the lower end surface of the boss is in the same plane with the lower surface of the cavity; a plurality of ultra-low temperature isolators and a plurality of ultra-low temperature annular devices are provided between the cavity and the third upper cover plate, and a plurality of ultra-low temperature isolators and a plurality of ultra-low temperature annular devices are provided between the cavity and the third lower cover plate, and the ultra-low temperature annular devices and ultra-low temperature isolators are distributed inside the cavity around the boss.

[0014] As a preferred embodiment, the ultra-low temperature integrated DC bias device comprises: a fourth upper cover plate, a DC bias device printed circuit board, a DC bias device cavity, a front connector, a fourth lower cover plate, a rear connector, a partition plate, a baffle, and a wire;

[0015] The DC bias device cavity is detachably connected to the fourth upper cover plate and the fourth lower cover plate; the DC bias device cavity is an I-shaped cavity placed on its side, and a partition plate is provided inside the DC bias device cavity, and the partition plate divides the DC bias device cavity into two layers, an upper layer; a plurality of baffles are provided on the upper layer of the DC bias device cavity, and the upper layer of the DC bias device cavity is divided into a plurality of chambers; a plurality of front side connectors for signal transmission are provided on the front side of the DC bias device cavity, and the front side connectors are fixed on the front side of the DC bias device cavity; a plurality of rear side connectors for signal transmission are provided on the rear side of the DC bias device cavity, and the rear side connectors are fixed on the rear side of the DC bias device cavity, and each chamber of the DC bias device cavity is configured in a one-to-one correspondence with the front side connector and the rear side connector, and a DC bias device printed circuit board is provided inside the cavity, and the front side connector and the rear side connector are welded on the corresponding DC bias device printed circuit board.

[0016] As a preferred embodiment, a through hole is provided on the left side of the partition plate, connecting the upper and lower layers of the DC bias device cavity, and the baffle is provided with a groove for wiring; a micro-rectangular electrical connector is provided on the left side of the DC bias device cavity, and one end of the micro-rectangular electrical connector is connected to a wire; the wire provides a DC bias voltage to the DC bias device printed circuit board through the through hole of the partition plate and the groove of the baffle.

[0017] As a preferred embodiment, the ultra-low temperature infrared filter assembly includes an ultra-low temperature infrared filter, an upper cavity of a heat sink plate, a lower cavity of a heat sink plate, a fifth mounting screw, a fifth mounting screw hole, an ultra-low temperature infrared filter mounting hole, an ultra-low temperature infrared filter connector, and an assembly mounting screw. The upper cavity of the heat sink plate and the lower cavity of the heat sink plate are detachably connected by the fifth mounting screw. The upper cavity of the heat sink plate and the lower cavity of the heat sink plate are each provided with a plurality of ultra-low temperature infrared filter mounting holes. The ultra-low temperature infrared filter is installed in the ultra-low temperature infrared filter mounting hole inside the heat sink plate, and the ultra-low temperature infrared filter connector adopts an SSMP connector. A fifth mounting screw hole is provided on the heat sink plate cavity, and the fifth mounting screw is connected to the fifth mounting screw hole. The assembled ultra-low temperature integrated infrared filter is plug-in connected to the integrated connector assembly.

[0018] The beneficial effects achieved by the present invention are as follows: First, a universal dilution refrigerator multi-channel expandable signal measurement device disclosed in the present invention enables the refrigerator to adapt to more quantum bits, such as 100-Qubit, avoiding the high investment in dilution refrigerators. Second, after the device is modularized, the overall structure of the measurement device in the refrigerator dewar becomes very clear and neat, which greatly simplifies the installation of the system and facilitates the subsequent system maintenance. Third, the present invention integrates the connector on the heat sink disk, designs two connector modules for the integrated connector, expands the number of connectors on the heat sink disk, meets the installation of the modular device, and the future maintenance and replacement of the connector. Fourth, the integrated connector integrated on the vacuum cover of the present invention adopts an airtight connector design to ensure the airtightness requirements of the entire system. Fifth, the integrated cable assembly, ultra-low temperature attenuator, ultra-low temperature low-pass filter, ultra-low temperature infrared filter and integrated connector of the present invention adopt the same combined plug design, which is easy to adapt. Sixth, the quantum chip of the present invention is sealed on the quantum chip printed circuit board and encapsulated in a shielding box to reduce the interference of the external magnetic field on the quantum chip. Seventh, the quantum chip of the present invention adopts a high dielectric constant plate material to increase the wiring density and reduce the chip area. Eighth, the quantum chip of the present invention adopts a multi-layer board structure to increase the isolation between transmission lines. The quantum chip is surrounded by multi-channel integrated sockets connected to the quantum chip, and the number of sockets meets the use requirements of 100Qubit quantum chips. Ninth, a shielding barrel is provided under the 10mK layer of the present invention to further reduce the interference of the external magnetic field on the quantum chip. In order to achieve a better shielding effect, the present invention adds a layer of aluminum shielding barrel inside the shielding barrel and adds a magnetic shielding material cover. Tenth, the measuring device of the present invention includes a parametric amplifier, and the parametric amplifier, the ultra-low temperature circulator and the ultra-low temperature isolator are placed in the 100mK layer, away from the quantum chip, to reduce interference with the quantum bit readout, and to leave enough space for the quantum chip to place the shielding box. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the structure of a 13-core combined plug module of the present invention;

[0020] Figure 2 It is a schematic structural diagram of the integrated niobium-titanium cable assembly of the present invention;

[0021] Figure 3 yes Figure 2 A local enlarged schematic diagram of H in FIG.

[0022] Figure 4 yes Figure 2 A-direction schematic diagram in FIG.

[0023] Figure 5 is a schematic structural diagram of the ultra-low temperature annulator / isolator assembly of the present invention;

[0024] Figure 6 It is a structural schematic diagram of the ultra-low temperature integrated DC bias device of the present invention;

[0025] Figure 7 It is a structural schematic diagram of the ultra-low temperature integrated infrared filter assembly of the present invention;

[0026] Figure 8 It is a schematic diagram of the internal layout of the 10mK layer shielding barrel of the present invention.

[0027] Meanings of the marks in the figure: 101-first heat sink; 102-SSMP connector; 103-SSMP mounting slot; 104-first mounting screw hole; 105-connector mounting hole; 201-second heat sink; 202-niobium titanium cable; 203-second mounting screw hole; 204-second mounting screw; 205-cable connector; 301-third mounting screw; 302-third upper cover; 303-ultra-low temperature annulator; 304-cavity; 305-third lower cover; 306-ultra-low temperature isolator; 307-baffle; 308-boss; 309-third mounting hole; 310-threaded hole; 311-threaded hole; 312-threaded hole; 313-threaded hole; 314-threaded hole; 315-threaded hole; 316-threaded hole; 317-threaded hole; 318-threaded hole; 319-threaded hole; 320-threaded hole; 321-threaded hole; 322-threaded hole; 323-threaded hole; 324-threaded hole; 325-threaded hole; 326-threaded hole; 327-threaded hole; 328-threaded hole; 329-threaded hole; 330-threaded hole; 331-threaded hole; 332-threaded hole; 333-threaded hole; 334-threaded hole; 335-threaded hole; 336-threaded hole; 337-threaded hole; 338-threaded hole; 339-threaded hole; 340-threaded hole; 341-threaded hole; 342-threaded hole; 343-threaded hole; 344-threaded hole; 1-pin; 312-pin hole; 313-first port; 314-second port; 315-third port; 401-fourth mounting screw; 402-fourth upper cover; 403-capacitor; 404-conical inductor; 405-DC bias device printed board; 406-fourth pin hole; 407-DC bias device cavity; 408-front connector; 409-front connector fastening screw; 410-micro rectangular electrical connector; 411-micro rectangular electrical connector fastening screw; 412-fourth pin; 413-fourth lower cover; 414-conical inductor; 415-capacitor; 416-lower cover fastening screw; 417-rear connector fastening screw; 418-rear connector; 419-lower DC bias device printed circuit board; 420-separator; 421-baffle; 422-wire; 501-ultra-low temperature infrared filter; 502-heat sink upper cavity; 503-heat sink lower cavity; 504-fifth mounting screw; 505-fifth mounting screw hole; 506-ultra-low temperature infrared filter mounting hole; 507-ultra-low temperature infrared filter connector; 508-assembly mounting screw; 601-10mK cold plate; 602-shielding barrel; 603-shielding cover; 604-first bracket; 605-aluminum bracket; 606-quantum chip printed circuit board Board; 607-copper plate; 608-quantum chip; 609-shielding box; 610-shielding box mounting screws; 611-shielding box mounting screw holes; 612-multi-channel integrated socket; 613-aluminum cover; 614-shielding cover mounting screws; 615-second bracket; 616-ultra-low temperature infrared filter assembly; 617-tinned copper braided flexible cable; 618-ultra-low temperature attenuator assembly; 619-ultra-low temperature low-pass filter assembly; 620-assembly mounting screws; 621-multi-core adapter; 622-mounting screws; 623-10mK layer integrated connector assembly; 624-shielding cover mounting screw holes. DETAILED DESCRIPTION

[0028] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0030] In the description of the present invention, it is necessary to understand that the orientations or positional relationships indicated by terms such as "upper", "middle", "lower", "front" and "back" are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0031] Embodiment 1: The present invention proposes a universal dilution refrigerator multi-channel expandable signal measurement device, the low temperature part is built in the dewar of the dilution refrigerator; the dewar can be divided into 300K layer, 50K layer, 4K layer, 1K layer, 100mK layer and 10mK layer from top to bottom according to the temperature of different layers, and each layer is separated by a cold plate, and the measurement device includes a quantum chip, an ultra-low temperature attenuator component, an ultra-low temperature low-pass filter component, a parametric amplifier, an ultra-low temperature integrated DC bias device, an ultra-low temperature infrared filter component, an integrated connector component, an ultra-low temperature circulator / isolator component and an integrated cable component. The ultra-low temperature circulator / isolator component prevents the reflected signal from being fed into the quantum chip, improves the matching and signal interference of the chip input and output. The ultra-low temperature DC bias device adds a DC bias to the RF output signal. The ultra-low temperature circulator / isolator component is packaged with magnetic shielding material to effectively reduce the influence of the magnetic field of the ultra-low temperature circulator / isolator component on the outside world.

[0032] Optionally, the low temperature part of the measuring device adopts a vacuum design; the 300K layer cold plate is used as a vacuum cover; the cold plates of each temperature layer are equipped with heat sinks; the integrated connector assembly is set on the heat sink through the plate; the integrated cable assembly is divided into three types, one is a stainless steel cable for 50K and room temperature layers, the other is a NbTi (niobium titanium) cable suitable for 4K layers and below, and the last is a conventional tin-impregnated copper braided silver-plated copper soft cable for 10mK layers. The stainless steel cable assembly is used in the 50K and 300K layers to reduce the thermal conduction effect from room temperature to the 50K layer. The inner diameter of the NbTi cable assembly is as small as possible. The NbTi cable assembly is in a superconducting state below the 4K layer, ensuring minimal signal attenuation and thermal noise. The tin-impregnated copper braided soft cable assembly is easy to bend, which is convenient for wiring and connection at the 10mK layer with limited space.

[0033] Optionally, the operating temperature of the above-mentioned ultra-low temperature devices is as low as -273°C; the ultra-low temperature devices are all miniaturized integrated devices; the ultra-low temperature integrated DC bias device adopts a split-cavity design; the ultra-low temperature integrated DC bias device printed circuit board adopts a high dielectric constant plate; the ultra-low temperature integrated DC bias device cavity material is non-magnetic copper; the ultra-low temperature circulator / isolator assembly is packaged with iron-nickel alloy.

[0034] NbTi cable components exhibit superconducting properties below the 4K temperature layer, and have a small inner diameter and good surface heat sink effect; integrated connector components are all SSMP connectors; SSMP connectors are made of non-magnetic beryllium bronze; SSMP connectors are small in size, stable in connection, and have the best pluggable times among micro connectors, and the technology is mature, which can effectively transfer the heat from the device to the heat sink. The integrated connector components integrated on the vacuum cover adopt an airtight design; the integrated connector components can be decomposed into 12-core and 13-core combination plug designs.

[0035] Optionally, the integrated cable assembly, ultra-low temperature attenuator assembly, ultra-low temperature low-pass filter assembly, and ultra-low temperature infrared filter assembly all use the same combination plug design as the integrated connector assembly; the parametric amplifier, ultra-low temperature circulator / temperature isolator assembly, and ultra-low temperature integrated DC bias device are all placed in the 100mK layer.

[0036] The quantum chip test circuit board uses multiple layers of high dielectric constant plates and an optimized wiring structure to improve crosstalk between signal lines; the quantum chip is equipped with four multi-channel integrated sockets connected to the quantum chip, achieving the requirements of up to 100-bit quantum computing. A shielding box is provided above the quantum chip; an electromagnetic signal shielding barrel is provided below the 10mK layer, using a special magnetic shielding material mu-metal, because the magnetic shielding structure requires the diameter and height ratio to be maintained above 1:4. In view of the 10mK temperature layer height limit of this type of dilution refrigerator, in order to achieve a better magnetic shielding effect, a shielding cover is added to the top of the shielding barrel to achieve shielding of external magnetic field energy. The shielding barrel adds a layer of aluminum shielding barrel inside the shielding barrel, the purpose of which is to utilize the superconducting properties of aluminum. Inside the aluminum shell, the external weak magnetic field cannot penetrate, further enhancing the shielding of external electromagnetic signals.

[0037] Example 2: Figure 1 As shown, the integrated connector assembly of the present invention adopts a 13-core combined plug module. It includes a first heat sink 101, an SSMP connector 102, an SSMP mounting slot 103, a first mounting screw hole 104, and a connector mounting hole 105. The internal structure and joint of the SSMP connector 102 are consistent with the standard SSMP connector. The outer shell of the SSMP connector 102 is provided with an external thread, and the joint is provided with an SSMP mounting slot 103 for easy installation of a torque wrench. 26 connector mounting holes 105 are provided inside the first heat sink 101, and each connector mounting hole is provided with an internal thread matching the outer shell thread of the SSMP connector 102. During installation, a special wrench is used to rotate the SSMP connector 102 to the inside of the first heat sink 101. Two first mounting screw holes 104 are provided on the first heat sink 101, and after the integrated connector assembly is connected to other components, it can be fixed by screws installed in the first mounting screw holes 104. The integration method of the integrated connector assembly includes but is not limited to this embodiment.

[0038] Example 3: Figure 2 , Figure 3 and Figure 4 As shown, the integrated niobium-titanium cable assembly of the present invention comprises a second heat sink 201, a niobium-titanium cable 202, a second mounting screw hole 203, a second mounting screw 204, and a cable connector 205. The cable connector 205 adopts an SSMP connector, and two sets of integrated niobium-titanium cable assemblies can be connected to a set of integrated connector assemblies in a plug-in manner, and the second mounting screw 204 is connected to the first mounting screw hole 104 through the second mounting screw hole 203. The niobium-titanium cable 202 is provided with a bending area H in the middle part, and after bending, the niobium-titanium cable 202 can be prevented from being broken due to shortening at ultra-low temperatures. The integrated stainless steel cable assembly adopts a connection structure that is completely consistent with this embodiment.

[0039] Example 4: Figure 5 As shown, the ultra-low temperature circulator / isolator assembly of the present invention includes a third mounting screw 301, a third upper cover plate 302, an ultra-low temperature circulator 303, a cavity 304, a third lower cover plate 305, an ultra-low temperature isolator 306, a baffle 307, a boss 308, a third mounting hole 309, a threaded hole 310, a pin 311, a pin hole 312, a first port 313, a second port 314, and a third port 315.

[0040] A third upper cover plate 302 is provided on the upper side of the cavity 304, and a third lower cover plate 305 is provided on the lower side of the cavity 304. A through third mounting hole 309 is provided on both the third cover plate 302 and the third lower cover plate 305, and a threaded hole 310 is provided on the cavity 304 at a position corresponding to the third mounting hole. The cavity 304 and the third upper cover plate 302 and the third lower cover plate 305 are detachably connected by third mounting screws 301. A baffle plate 307 is provided in the middle of the cavity 304, and the baffle plate 307 divides the cavity 304 into two layers, an upper layer and an lower layer, and a boss 308 is provided in the center of the baffle plate 307. The upper end surface of the boss 308 is in the same plane as the upper surface of the cavity 304, and the lower end surface of the boss 308 is in the same plane as the lower surface of the cavity 304. Two ultra-low temperature isolators 306 and one ultra-low temperature annulator 303 are arranged between the cavity 304 and the third upper cover plate 302, and two ultra-low temperature isolators 306 and one ultra-low temperature annulator 303 are arranged between the cavity 304 and the third lower cover plate 305. The ultra-low temperature annulator 303 and the ultra-low temperature isolators 306 are distributed inside the cavity 304 around the boss 308. The third mounting screw 301 is made of non-magnetic copper, and the cavity 304, the third upper cover plate 302 and the third lower cover plate 305 are made of iron-nickel soft magnetic alloy, which can effectively shield the magnetic field inside the component inside the cavity 304 and reduce the impact on the outside. Pins 311 are respectively provided on the upper surface and the lower surface of the cavity 304, and pin holes 312 are provided at corresponding positions of the third upper cover plate 302 and the third lower cover plate 305. The cooperation between the pin 311 and the pin hole 312 prevents displacement between the cavity 304 and the third upper cover plate 302 and the third lower cover plate 305 during the installation and locking process.

[0041] Example 5: Figure 6 As shown, the ultra-low temperature integrated DC bias device of the present invention includes a fourth mounting screw 401, a fourth upper cover plate 402, an upper capacitor 403, an upper conical inductor 404, a DC bias device printed circuit board 405, an upper cover plate pin hole 406, a DC bias device cavity 407, a front connector 408, a front connector fastening screw 409, a micro-rectangular electrical connector 410, a micro-rectangular electrical connector fastening screw 411, a lower cover plate pin 412, a fourth lower cover plate 413, a lower conical inductor 414, a lower capacitor 415, a lower cover plate fastening screw 416, a rear connector fastening screw 417, a rear connector 418, a lower DC bias device printed circuit board 419, a partition plate 420, a baffle 421; and a wire 422.

[0042] The DC bias device cavity 407 is detachably connected to the fourth upper cover plate 402 and the fourth lower cover plate 413. The DC bias device cavity 407 is an I-shaped cavity placed on its side, and a partition plate 420 is provided inside the DC bias device cavity 407, and the partition plate 420 divides the DC bias device cavity 407 into two layers, an upper layer and an lower layer. Four baffles 421 are provided on the upper layer of the DC bias device cavity 407, which divide the upper layer of the DC bias device cavity 407 into five chambers. The front side of the DC bias device cavity 407 is provided with a plurality of front side connectors 408 for signal transmission, and the front side connectors 408 are fixed to the front side of the DC bias device cavity 407 by front side connector fastening screws 409. The rear side of the DC bias device cavity 407 is provided with a rear side connector 418 for signal transmission, and the rear connector 418 is fixed to the rear side of the DC bias device cavity 407 by rear side connector fastening screws 417. Each chamber is configured in one-to-one correspondence with the front connector 408 and the rear connector 418. A DC bias device printed board 405 is provided inside the chamber, and the front connector 408 and the rear connector 418 are welded on the corresponding DC bias device printed board 405. The number of chambers can be reduced or increased according to the specific use environment.

[0043] There is a through hole on the left side of the partition plate 420, connecting the upper and lower layers of the DC bias device cavity 407. The baffle plate 421 has a groove for wiring. A micro-rectangular electrical connector 410 is provided on the left side of the DC bias device cavity 407, and the micro-rectangular electrical connector 410 is fixed to the left side of the DC bias device cavity 407 by a micro-rectangular electrical connector fastening screw 411. One end of the micro-rectangular electrical connector 410 is connected to a wire 422. The wire 422 provides a DC bias voltage to the DC bias device printed circuit board 505 through the through hole of the partition plate 420 and the groove of the baffle plate 421.

[0044] The DC bias device is a three-port network device, including a first port 313, a second port 314, and a third port 315. The three ports are respectively a radio frequency port RF, a DC bias port DC, and a radio frequency DC port RF&DC. The DC bias device includes a DC bias device printed circuit board 405, and a conical inductor 404 (414) welded on the DC bias device printed circuit board 405 is used to add a DC bias, isolate AC information, and prevent the high-frequency signal of the radio frequency port from leaking to the power supply system. It is used to input radio frequency signals and can block the DC bias voltage of the bias port from leaking to the capacitor 403 (415) of the subsequent circuit or test instrument. The lower cavity structure and its arrangement are consistent with the upper cavity, which can be obtained by rotating the upper cavity structure and arrangement 180° about the partition plate 420. The parameters of the conical inductor 404 and the capacitor 403 can be determined by the specific device use environment.

[0045] The DC bias device cavity 407 and the pins on the fourth upper cover plate 402 are tightly matched with the corresponding upper cover plate pin holes 406, and are detachably connected through the fourth mounting screws 401; the specific implementation of the fourth lower cover plate 413 is the same as that of the fourth upper cover plate. The DC bias device cavity 407 is made of non-magnetic copper material, which can effectively reduce the deformation of the cavity in an ultra-low temperature environment. The DC bias device printed circuit board 405 (409) has a high dielectric constant, which can effectively reduce the width of the lines on the DC bias device printed circuit board 405, further reduce the volume of the printed circuit board, reduce the deformation of the DC bias device printed circuit board 405 in an ultra-low temperature environment, and deteriorate the electrical performance.

[0046] Example 6: Figure 7 As shown, the ultra-low temperature integrated infrared filter assembly of the present invention includes an ultra-low temperature infrared filter 501, an upper cavity 502 of a heat sink, a lower cavity 503 of a heat sink, a fifth mounting screw 504, a fifth mounting screw hole 505, an ultra-low temperature infrared filter mounting hole 506, an ultra-low temperature infrared filter connector 507, and an assembly mounting screw 508. The upper cavity 502 of the heat sink and the lower cavity 503 of the heat sink are detachably connected by the fifth mounting screw 504. The upper cavity 502 of the heat sink and the lower cavity 503 of the heat sink are each provided with 13 ultra-low temperature infrared filter mounting holes 506. The ultra-low temperature infrared filter 501 is installed in the ultra-low temperature infrared filter mounting hole 506 inside the heat sink, and the ultra-low temperature infrared filter connector 507 adopts an SSMP connector. A through fifth mounting screw hole 505 is provided on the heat sink cavity, and the fifth mounting screw 504 is connected to the fifth mounting screw hole 505. The fifth mounting screw 504 is a hollow structure with a layer of thread inside. The assembled ultra-low temperature integrated infrared filter component is plug-in connected to the integrated connector component, and the component mounting screw 508 is connected to the first mounting screw hole 104 of the integrated connector component through the inside of the fifth mounting screw 504 .

[0047] The appearance structure and heat sink disk plug-in of the ultra-low temperature attenuator component and the ultra-low temperature low-pass filter component are exactly the same as the appearance structure and heat sink disk plug-in of the ultra-low temperature integrated infrared filter component. The corresponding components can be obtained by replacing the ultra-low temperature infrared filter with the ultra-low temperature attenuator and the ultra-low temperature low-pass filter, which will not be repeated here.

[0048] Example 7: Figure 8The figure shows the internal layout schematic diagram of the 10mK layer shielding barrel of the present invention. A shielding barrel 602 and a shielding cover 603 are provided below the 10mK cold plate 601. The 10mK cold plate 601 and the shielding cover 603 are connected by a first bracket 604. An aluminum cover 613 is provided below the shielding cover 603, and a shielding cover mounting screw hole 624 is provided on the shielding cover 603. The shielding cover mounting screw 614 is fixedly connected to the shielding cover 603 and the aluminum cover 613 through the shielding cover mounting screw hole 624. An aluminum support 605 is provided inside the shielding barrel 602, and the aluminum support 605 and the aluminum cover 613 are connected by a second bracket 615. A quantum chip printed board 606 is provided above the aluminum support 605, and a copper plate 607 is provided below the aluminum support 605. The quantum chip 608 is sealed on the quantum chip printed board 606, and a shielding box 609 is provided above the quantum chip 608. The aluminum support 605, the quantum chip printed circuit board 606, and the copper plate 607 are all provided with 4 shielding box mounting screw holes 611, and the shielding box mounting screw holes 611 on each board layer are on the same vertical line. The shielding box 609 is fixed to the quantum chip printed circuit board 606 through the shielding box mounting screw holes 611 using the shielding box mounting screws 610. Four multi-channel integrated sockets 612 are provided on the printed circuit board 606, and the quantum chip 608 is connected to the 60-core multi-channel integrated socket 612 through the wires on the quantum chip printed circuit board 606. The ultra-low temperature infrared filter assembly 616 is set on the aluminum cover 613 and the shielding cover 603 through the board. A 13-core to 60-core multi-core adapter 621 is provided below the ultra-low temperature infrared filter assembly 616, and is fixedly connected to the aluminum cover 613 by mounting screws 622. The multi-core adapter 621 is connected to the multi-channel integrated socket 612 through a tinned copper braided soft cable 617. An ultra-low temperature attenuator assembly 618 and an ultra-low temperature low-pass filter assembly 619 are sequentially arranged below the 10mK layer integrated connector assembly 623. The 10mK layer integrated connector assembly 623, the ultra-low temperature attenuator assembly 618, and the ultra-low temperature low-pass filter assembly 619 are plug-in connected and connected via assembly mounting screws 620. The ultra-low temperature low-pass filter assembly 619 is connected to the ultra-low temperature infrared filter assembly 616 via a tinned copper braided flexible cable 617.

[0049] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations within the meaning and scope of the elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0050] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features thereof may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A general-purpose dilution refrigerator multi-channel expandable signal measurement device, partly built in the dewar of the dilution refrigerator, the dewar is divided into 300K layer, 50K layer, 4K layer, 1K layer, 100mK layer and 10mK layer from top to bottom according to the temperature of different layers, and each layer is separated by a cold plate, characterized in that: The measuring device comprises a quantum chip, an ultra-low temperature attenuator component, an ultra-low temperature low-pass filter component, a parametric amplifier, an ultra-low temperature integrated DC bias device, an ultra-low temperature infrared filter component, an integrated connector, an ultra-low temperature circulator / isolator component and an integrated cable component; the 300K layer cold plate is used as a vacuum cover, each layer of the cold plate is equipped with a heat sink, and the integrated connector component is arranged on the heat sink through a plate; The parametric amplifier, the ultra-low temperature circulator / isolator assembly, and the ultra-low temperature integrated DC bias device are all arranged in the 100mK layer; A shielding barrel and a shielding cover are provided below the 10mK layer cold plate, and the 10mK layer cold plate and the shielding cover are connected by a first hanger; an aluminum cover is provided below the shielding cover, and an aluminum tray is provided inside the shielding barrel, and the aluminum tray and the aluminum cover are connected by a second hanger; a quantum chip printed board is provided above the aluminum tray, and a copper plate is provided below the aluminum tray; the quantum chip is sealed on the quantum chip printed board, and a shielding box is provided above the quantum chip; a plurality of multi-channel integrated sockets are provided on the quantum chip printed board, and the quantum chip is connected to the multi-channel integrated sockets through the wires on the quantum chip printed board; the ultra-low temperature infrared filter assembly is provided on the aluminum cover and the shielding cover, and a multi-core adapter is provided below the ultra-low temperature infrared filter assembly, and the multi-core adapter is fixedly connected to the aluminum cover; an ultra-low temperature attenuator assembly and an ultra-low temperature low-pass filter assembly are provided below the 10mK layer integrated connector assembly in sequence, and the 10mK layer integrated connector, the ultra-low temperature attenuator assembly, and the ultra-low temperature low-pass filter assembly are plug-in connected; The ultra-low temperature annular device / isolator assembly includes a third mounting screw, a third upper cover plate, an ultra-low temperature annular device, a cavity, a third lower cover plate, an ultra-low temperature isolator, a baffle, a boss, a third mounting hole, and a threaded hole; A third upper cover plate is provided on the upper side of the cavity, and a third lower cover plate is provided on the lower side of the cavity, and the third upper cover plate and the third lower cover plate are both provided with a through third mounting hole, and a threaded hole is provided on the cavity at a position corresponding to the third mounting hole; the cavity and the third upper cover plate and the third lower cover plate are detachably connected by third mounting screws; a baffle is provided in the middle of the cavity, and the baffle divides the cavity into two layers, an upper layer and an lower layer, and a boss is provided in the center of the baffle, the upper end surface of the boss is in the same plane with the upper surface of the cavity, and the lower end surface of the boss is in the same plane with the lower surface of the cavity; a plurality of ultra-low temperature isolators and a plurality of ultra-low temperature annular devices are provided between the cavity and the third upper cover plate, and a plurality of ultra-low temperature isolators and a plurality of ultra-low temperature annular devices are provided between the cavity and the third lower cover plate, and the ultra-low temperature annular devices and ultra-low temperature isolators are distributed inside the cavity around the boss.

2. A universal dilution refrigerator multi-channel scalable signal measurement device according to claim 1, characterized in that: The ultra-low temperature low-pass filter assembly is connected to the ultra-low temperature infrared filter assembly through a tinned copper braided flexible cable; the multi-core adapter is connected to the multi-channel integrated socket through a tinned copper braided flexible cable.

3. A universal dilution refrigerator multi-channel scalable signal measurement device according to claim 1, characterized in that: The integrated connector assembly adopts a 13-core combination plug module, including a first heat sink, an SSMP connector, an SSMP mounting slot, a first mounting screw hole, and a connector mounting hole. The SSMP connector shell is provided with an external thread, and the joint of the SSMP connector is provided with an SSMP mounting slot for easy installation of a torque wrench; a plurality of connector mounting holes are provided inside the heat sink, and each of the connector mounting holes is provided with an internal thread matching the external thread of the SSMP connector shell; the SSMP connector is rotated to the inside of the heat sink to complete the installation; a plurality of first mounting screw holes are provided on the heat sink, and after the integrated connector assembly is connected to other components, it is fixed by screws installed in the first mounting screw holes.

4. The general-purpose dilution refrigerator multi-channel expandable signal measurement device according to claim 1, characterized in that: The integrated cable assembly includes any one or more of the following items: stainless steel cable assemblies used in 300K and 50K layers; niobium-titanium cable assemblies used in 4K and below layers; conventional tin-dipped copper braided silver-plated copper soft cables used in 10mK layers.

5. A universal dilution refrigerator multi-channel expandable signal measurement device according to claim 4, characterized in that: The niobium-titanium cable assembly includes a second heat sink, a niobium-titanium cable, a second mounting screw hole, a second mounting screw, and a cable connector. The cable connector adopts an SSMP connector. Two groups of the niobium-titanium cable assemblies are plug-in connected to one group of the integrated connector assembly, and the second mounting screw is connected to the integrated connector assembly through the second mounting screw hole. The niobium-titanium cable is provided with a bending area in the middle part, which is used to prevent the niobium-titanium cable from breaking due to shortening at ultra-low temperatures.

6. The general-purpose dilution refrigerator multi-channel expandable signal measurement device according to claim 1, characterized in that: The ultra-low temperature integrated DC bias device comprises: a fourth upper cover plate, a DC bias device printed board, a DC bias device cavity, a front connector, a fourth lower cover plate, a rear connector, a partition plate, a baffle plate, and a wire; The DC bias device cavity is detachably connected to the fourth upper cover plate and the fourth lower cover plate; the DC bias device cavity is an I-shaped cavity placed on its side, and a partition plate is provided inside the DC bias device cavity, and the partition plate divides the DC bias device cavity into two layers, an upper layer; a plurality of baffles are provided on the upper layer of the DC bias device cavity, and the upper layer of the DC bias device cavity is divided into a plurality of chambers; a plurality of front side connectors for signal transmission are provided on the front side of the DC bias device cavity, and the front side connectors are fixed on the front side of the DC bias device cavity; a plurality of rear side connectors for signal transmission are provided on the rear side of the DC bias device cavity, and the rear side connectors are fixed on the rear side of the DC bias device cavity, and each chamber of the DC bias device cavity is configured in a one-to-one correspondence with the front side connector and the rear side connector, and a DC bias device printed circuit board is provided inside the cavity, and the front side connector and the rear side connector are welded on the corresponding DC bias device printed circuit board.

7. A universal dilution refrigerator multi-channel expandable signal measurement device according to claim 6, characterized in that: A through hole is provided on the left side of the partition plate, connecting the upper and lower layers of the DC bias device cavity, and the baffle is provided with a groove for wiring; a micro-rectangular electrical connector is provided on the left side of the DC bias device cavity, and one end of the micro-rectangular electrical connector is connected to a wire; the wire passes through the through hole of the partition plate and the groove of the baffle to provide a DC bias voltage to the DC bias device printed circuit board.

8. The universal dilution refrigerator multi-channel expandable signal measurement device according to claim 1, characterized in that: The ultra-low temperature infrared filter assembly comprises an ultra-low temperature infrared filter, an upper cavity of a heat sink plate, a lower cavity of a heat sink plate, a fifth mounting screw, a fifth mounting screw hole, an ultra-low temperature infrared filter mounting hole, an ultra-low temperature infrared filter connector, and an assembly mounting screw. The upper cavity of the heat sink plate and the lower cavity of the heat sink plate are detachably connected via the fifth mounting screw. The upper cavity of the heat sink plate and the lower cavity of the heat sink plate are each provided with a plurality of ultra-low temperature infrared filter mounting holes. The ultra-low temperature infrared filter is installed in the ultra-low temperature infrared filter mounting hole inside the heat sink plate, and the ultra-low temperature infrared filter connector adopts an SSMP connector. A fifth through mounting screw hole is provided on the heat sink plate cavity, and the fifth mounting screw is connected to the fifth mounting screw hole. The assembled ultra-low temperature integrated infrared filter is plug-in connected to the integrated connector assembly.

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