Optical module, double-sided screen electronic device and preparation method of optical module

Abstract

The application discloses an optical module, a double-sided screen electronic device and a preparation method of the optical module. The optical module comprises a shell, the shell comprising a first surface and a second surface, the second surface being arranged opposite to the first surface, the first surface being provided with a first light outlet and a first light inlet, and the second surface being provided with a second light outlet and a second light inlet; a first light emitting component arranged in the shell and corresponding to the first light outlet; a first light receiving component arranged in the shell and corresponding to the first light inlet; a second light emitting component arranged in the shell and corresponding to the second light outlet; and a second light receiving component arranged in the shell and corresponding to the second light inlet. The application improves the structure of the shell and integrally arranges two sets of light emitting and light receiving components in the shell, so that one set of optical modules realizes double-sided light emitting and light receiving functions, thereby meeting the sensing requirements of two screens of the double-sided screen electronic device, enriching the functions of the two screens and promoting the development of the double-sided screen electronic device.

Description

Technical Field

[0001] This application belongs to the field of electronic equipment technology, specifically relating to an optical module, a dual-screen electronic device, and a method for manufacturing an optical module. Background Technology

[0002] In related technologies, optical modules such as photosensitive sensors are widely used in electronic devices. They achieve functions such as distance measurement by emitting electromagnetic waves and then receiving and detecting changes in the reflected electromagnetic wave signals.

[0003] In the process of developing this application, the inventors discovered at least the following problems in the prior art: Dual-screen electronic devices are now widely used, and both the front and rear screens require actions such as turning the screen on / off and adjusting brightness during use. However, existing optical modules 100' (such as photosensitive sensors, etc.) Figure 1 As shown, it can only emit and receive light from one side, so it can only work with one screen to realize the perception of the environment to enrich the function of that screen, while the function of the other screen is relatively simple, which limits the development of dual-screen electronic devices. Summary of the Invention

[0004] This application aims to provide an optical module and a dual-screen electronic device, at least to solve one of the problems in the related technology where the single-sided light output and light reception of optical modules such as photosensitive sensors restricts the development of dual-screen electronic devices.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows:

[0006] In a first aspect, embodiments of this application propose an optical module, comprising:

[0007] The housing includes a first surface and a second surface, the second surface being disposed opposite to the first surface, the first surface having a first light outlet and a first light inlet, and the second surface having a second light outlet and a second light inlet;

[0008] A first light emitting element is disposed inside the housing and is correspondingly arranged with the first light outlet, for emitting light out of the housing through the first light outlet;

[0009] A first light receiver is disposed inside the housing and is correspondingly arranged with the first light inlet port, for receiving light entering the housing through the first light inlet port;

[0010] The second light emitting element is disposed inside the housing and is correspondingly arranged with the second light emitting port, for emitting light out of the housing through the second light emitting port;

[0011] A second light receiver is disposed inside the housing and is configured corresponding to the second light inlet port, for receiving light entering the housing through the second light inlet port.

[0012] Secondly, embodiments of this application propose a dual-screen electronic device, comprising:

[0013] The housing includes a first screen panel and a second screen panel disposed opposite to the first screen panel;

[0014] A circuit board is disposed between the first screen panel and the second screen panel, and the circuit board is provided with a third light outlet and a third light inlet.

[0015] An optical module, wherein the optical module is the optical module according to any one of the first aspects, the optical module is disposed in the housing, the first light emitter, the first light receiver, the second light emitter, and the second light receiver of the optical module are electrically connected to the circuit board, the second light outlet of the optical module is correspondingly disposed with the third light outlet, and the second light inlet of the optical module is correspondingly disposed with the third light inlet.

[0016] Thirdly, embodiments of this application propose a method for fabricating an optical module, including:

[0017] The first light emitter, the first light receiver, the second light emitter, and the second light receiver are encapsulated in a housing, such that the first light emitter, the first light receiver, the second light emitter, and the second light receiver are respectively configured to correspond to the first light outlet, the first light inlet, the second light outlet, and the second light inlet of the housing.

[0018] In the embodiments of this application, since the optical module's housing has light-emitting and light-receiving ports on both the front and back, and two sets of light-emitting and light-receiving components are integrated within the housing, one optical module can achieve dual-sided light emission and reception. Therefore, both screens of the dual-screen electronic device can achieve environmental sensing capabilities, resulting in rich functionality for both screens and promoting the development of dual-screen electronic devices. Furthermore, compared to the scheme of installing two independent optical modules corresponding to the two screens of a dual-screen electronic device, the embodiments of this application utilize a single optical module to achieve dual-sided light emission and reception. This reduces the number of internal components in the dual-screen electronic device, simplifies the layout of internal components, and facilitates the thinning and lightening of the dual-screen electronic device.

[0019] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0020] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0021] Figure 1 This is a schematic diagram of the three-dimensional structure of an optical module in the prior art;

[0022] Figure 2 This is a cross-sectional structural schematic diagram of an optical module according to an embodiment of the present invention;

[0023] Figure 3 This is one of the partial cross-sectional structural schematic diagrams of an optical module according to an embodiment of the present invention;

[0024] Figure 4 This is a second partial cross-sectional structural schematic diagram of an optical module according to an embodiment of the present invention;

[0025] Figure 5 This is a schematic diagram illustrating the fabrication process of the second light emitting element according to an embodiment of the present invention;

[0026] Figure 6 This is a schematic diagram illustrating the fabrication process of the first light-emitting element according to an embodiment of the present invention;

[0027] Figure 7 This is a schematic diagram of the processing of the second optical receiver according to an embodiment of the present invention;

[0028] Figure 8 This is a schematic diagram of the processing of the first optical receiver according to an embodiment of the present invention;

[0029] Figure 9 This is one of the assembly schematic diagrams of a partial structure of an optical module according to an embodiment of the present invention;

[0030] Figure 10 This is a second schematic diagram of the assembly of a portion of the optical module according to an embodiment of the present invention;

[0031] Figure 11 This is a three-dimensional structural diagram of the carrier plate according to an embodiment of the present invention;

[0032] Figure 12 This is a partial cross-sectional schematic diagram of a dual-screen electronic device according to an embodiment of the present invention;

[0033] Figure 13 This is a schematic block diagram of a dual-screen electronic device according to an embodiment of the present invention;

[0034] Figure 14 This is one of the schematic flowcharts of a method for fabricating an optical module according to an embodiment of the present invention;

[0035] Figure 15 This is a second schematic flowchart of the method for preparing an optical module according to an embodiment of the present invention;

[0036] Figure 16 This is a third schematic flowchart of the method for preparing an optical module according to an embodiment of the present invention;

[0037] Figure 17 This is the fourth schematic flowchart of the method for preparing an optical module according to an embodiment of the present invention.

[0038] Figure label:

[0039] 100' optical module;

[0040] 10. Outer shell; 102. Carrier board; 1022. Second surface; 1024. Second light exit port; 1026. Second light inlet port; 1028. Pad; 1030. Second light exit hole; 1032. Second light inlet hole; 104. Top cover; 1042. First surface; 1044. First light exit port; 1046. First light inlet port; 1048. First light exit hole; 1050. First light inlet hole; 106. Emitting cavity; 108. Receiving cavity; 20. First light emitter; 202. First groove; 30. First light receiver; 302. Third groove; 40. Second light emitter. ; 402 Second groove; 50 Second light receiver; 502 Fourth groove; 602 First heat-conducting layer; 604 Second heat-conducting layer; 606 First conductor; 608 Second conductor; 610 First conductive protrusion; 612 Second conductive protrusion; 70 Transparent resin; 80 Separator; 100 Optical module; 200 Dual-sided screen electronic device; 210 Housing; 212 First screen panel; 214 Second screen panel; 220 Circuit board; 222 Third light outlet; 224 Third light inlet; 300 Etching tool; 400 Adhesive application tool.

[0041] in, Figure 2 The arrow in the diagram illustrates the direction of light propagation. Figure 4 The vertical arrow in the middle indicates the Z-direction. Figure 4 The horizontal arrow in the middle indicates the X direction. Detailed Implementation

[0042] Embodiments of the present invention will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0043] The terms "first," "second," "third," and "fourth" in the specification and claims of this application may explicitly or implicitly include one or more of the features described herein. In the description of this invention, unless otherwise stated, "a plurality of" means two or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0044] In the description of this invention, it should be understood that the terms "front", "back", "lateral", "thickness", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0045] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0046] In existing technologies, optical modules 100' such as photosensitive sensors all communicate with the external environment through front openings, such as... Figure 1 As shown. Accordingly, the housing of the optical module 100' contains only one set of light-emitting and light-receiving components. Therefore, when applied to dual-screen electronic devices, only one screen can work with the optical module 100', such as the photosensitive sensor, to achieve environmental perception, thereby enabling functions such as detecting nearby objects, ranging, and laser focusing, while the other screen can only perform simple functions such as turning the screen on and off and adjusting brightness.

[0047] The following is combined Figures 2 to 17 This invention describes an optical module, a dual-screen electronic device, and a method for manufacturing the optical module according to embodiments of the present invention.

[0048] In embodiments of the present invention, the optical module 100 may be, but is not limited to, devices for electronic devices that have light emission and light reception functions, such as photosensitive sensors, laser focusers, and infrared sensors.

[0049] Among them, the photosensitive sensor can emit electromagnetic waves out of the sensor, and then receive and detect the changes in the reflected electromagnetic wave signals. After processing, it can detect nearby objects or measure the distance between the sensor and the object without physical contact, thus enabling electronic devices to have the function of detecting nearby objects or measuring distance.

[0050] Laser autofocus technology was initially used by the military, but with technological advancements and cost reductions, it has gradually transitioned to civilian applications. In smartphones and other electronic devices, laser autofocus works by using a reflective component in the rear-mounted laser sensor to emit a low-power infrared laser beam that illuminates the subject. The reflected laser beam is then received by the receiver in the phone's laser sensor, which calculates the distance to the subject. Based on this distance measurement, the phone's camera module motor moves the lens to the appropriate position for focusing; this movement is a single, continuous operation. Laser autofocus significantly improves focusing success rates in low-light and macro photography, and it also offers faster focusing speeds in bright light. Simply put, it calculates the distance from the target to the testing instrument by recording the time difference between the infrared laser beam emitted from the device, reflected from the target surface, and received by the rangefinder. The advantage of laser autofocus is its greater accuracy in low-light conditions compared to phase-detection and contrast-detection autofocus.

[0051] An infrared sensor is a sensor that can sense infrared radiation emitted by a target and uses the physical properties of infrared radiation to make measurements, thereby enabling electronic devices to have functions such as ranging and temperature measurement.

[0052] The dual-screen electronic device 200 can be, but is not limited to, dual-screen mobile phones, dual-screen tablets, dual-screen game consoles, etc.

[0053] The optical module 100 provided in the embodiments of the present invention will be described in detail below using a photosensitive sensor as an example.

[0054] like Figure 2 As shown, an optical module 100 according to some embodiments of the present invention includes: a housing 10, a first light emitter 20, a first light receiver 30, a second light emitter 40, and a second light receiver 50.

[0055] Specifically, the housing 10 includes a first surface 1042 and a second surface 1022, the second surface 1022 being disposed opposite to the first surface 1042. The first surface 1042 is provided with a first light outlet 1044 and a first light inlet 1046, and the second surface 1022 is provided with a second light outlet 1024 and a second light inlet 1026.

[0056] The first light emitting element 20 is disposed inside the housing 10 and is correspondingly disposed with the first light emitting port 1044, for emitting light to the outside of the housing 10 through the first light emitting port 1044.

[0057] The first light receiver 30 is disposed inside the housing 10 and is correspondingly disposed to the first light inlet 1046, for receiving light entering the housing 10 through the first light inlet 1046.

[0058] The second light emitting element 40 is disposed inside the housing 10 and is correspondingly disposed to the second light emitting port 1024, for emitting light to the outside of the housing 10 through the second light emitting port 1024.

[0059] The second light receiver 50 is disposed inside the housing 10 and is correspondingly disposed to the second light inlet 1026, for receiving light entering the housing 10 through the second light inlet 1026.

[0060] In specific applications, the first light emitter 20 and the second light emitter 40 are surface light sources LEDs (Light Emitting Diodes), and the first light receiver 30 and the second light receiver 50 are PD (Photo Diodes, mainly used to receive light) chips.

[0061] According to the optical module 100 of the present invention, by improving the structure of the housing 10, light-emitting ports and light-receiving ports are opened on both the front and back sides of the housing 10, and two sets of light-emitting and light-receiving components are integrated in the housing 10, so that one optical module 100 realizes the functions of double-sided light emission and light reception, thereby meeting the environmental perception needs of the two screens of the dual-screen electronic device 200, enriching the functions of the two screens of the dual-screen electronic device 200, solving the limitation of the existing optical module that can only emit and receive light from one side, which restricts the development of the dual-screen electronic device 200, and can greatly promote the development of the dual-screen electronic device 200.

[0062] Meanwhile, compared to the solution of using two existing single-sided light-emitting and light-receiving optical modules to correspond to the two screens of the dual-screen electronic device 200 respectively, the embodiment of this application only needs to use one optical module 100 to meet the needs of the two screens, thereby reducing the number of internal components of the dual-screen electronic device 200, reducing the layout difficulty of the internal components of the dual-screen electronic device 200, and facilitating the thinning and lightening of the dual-screen electronic device 200.

[0063] Specifically, the optical module 100 includes a housing 10, a first light emitter 20, a first light receiver 30, a second light emitter 40, and a second light receiver 50. The housing 10 includes a first surface 1042 and a second surface 1022. Since the second surface 1022 is positioned opposite to the first surface 1042, the first surface 1042 and the second surface 1022 are the front and back surfaces of the housing 10. The first surface 1042 is designated as the front surface of the housing 10, and the second surface 1022 is designated as the back surface of the housing 10. The first light-emitting port 1044 and the first light-inlet port 1046 of the first surface 1042 are used for light emission and light reception on the front surface of the optical module 100, while the second light-emitting port 1024 and the second light-inlet port 1026 of the second surface 1022 are used for light emission and light reception on the back surface of the optical module 100, thereby ensuring that both the front and back surfaces of the optical module 100 can emit and receive light.

[0064] The first light emitter 20 and the first light receiver 30 constitute a light-emitting and light-receiving assembly, which works in conjunction with the first light-exit port 1044 and the first light-in port 1046 on the front of the housing 10 to achieve front-side light emission and light reception functions. The second light emitter 40 and the second light receiver 50 constitute another light-emitting and light-receiving assembly, which works in conjunction with the second light-exit port 1024 and the second light-in port 1026 on the back of the housing 10 to achieve rear-side light emission and light reception functions. Thus, one optical module 100 can achieve dual-sided light emission and light reception functions, thereby meeting the sensing needs of the two screens of the dual-screen electronic device 200, enriching the functions of the two screens, and strongly promoting the development of the dual-screen electronic device 200.

[0065] Furthermore, compared to the solution of using two existing single-sided light-emitting and light-receiving optical modules to correspond to the two screens of the dual-screen electronic device 200 respectively, the embodiment of this application is equivalent to integrating the existing two light-emitting and light-receiving components into a single housing 10, while functionally achieving the functions of the existing two optical modules 100'. This at least reduces the number of optical modules 100 within the dual-screen electronic device 200 and eliminates the installation process of one optical module 100. At the same time, compared to the height of the housing 10, the thickness and planar dimensions of one light-emitting and light-receiving component are relatively small, thus also effectively eliminating the need for a separate housing 10 for one optical module 100.

[0066] Thus, compared to the existing layout of two independent photosensitive sensors stacked back-to-back on both sides of the circuit board of a dual-screen electronic device, the optical module 100 of this application's embodiment helps to reduce the thickness and weight of the dual-screen electronic device 200. Compared to the existing layout of two independent photosensitive sensors arranged side-by-side but facing opposite directions, the optical module 100 of this application's embodiment helps to reduce the lateral dimensions and weight of the dual-screen electronic device 200.

[0067] Therefore, the optical module 100 of the embodiments of this application also helps to achieve the thinning, miniaturization and lightness of the dual-screen electronic device 200.

[0068] In one possible implementation, the optical module 100 further includes: a light-transmitting resin 70, such as... Figure 2 As shown, the translucent resin 70 is filled inside the housing 10.

[0069] To ensure the strength of the outer casing 10, the areas of the first light-emitting port 1044, the first light-incoming port 1046, the second light-emitting port 1024, and the second light-incoming port 1026 cannot be too large. However, the first light emitting element 20, the second light emitting element 40, the first light receiving element 30, and the second light receiving element 50 are mostly flat structures with relatively large areas. Therefore, a certain distance is maintained between the first light emitting element 20, the first light receiving element 30, the second light emitting element 40, and the second light receiving element 50 and the outer casing 10 to ensure sufficient light emission and penetration.

[0070] Further, a light-transmitting resin 70 is filled inside the outer casing 10. During its flow, the liquid light-transmitting resin 70 fills the spaces between the outer casing 10 and the first light emitter 20, the second light emitter 40, the first light receiver 30, and the second light receiver 50. After the liquid light-transmitting resin 70 solidifies, the first light emitter 20, the first light receiver 30, the second light emitter 40, and the second light receiver 50 are securely encapsulated within the outer casing 10, thus protecting these components and effectively improving their positional stability and reliability. Simultaneously, due to the light-transmitting properties of the resin 70, it does not affect the emission or incidence of light.

[0071] In one possible implementation, the optical module 100 further includes: a separator 80, such as Figure 2 As shown. A separator 80 is disposed within the housing 10, dividing the internal space of the housing 10 into a transmitting cavity 106 and a receiving cavity 108. The first light-emitting port 1044 and the second light-emitting port 1024 communicate with the transmitting cavity 106. The first light-inlet port 1046 and the second light-inlet port 1026 communicate with the receiving cavity 108. The first light emitting element 20 and the second light emitting element 40 are disposed within the transmitting cavity 106. The first light receiving element 30 and the second light receiving element 50 are disposed within the receiving cavity 108.

[0072] Because the housing 10 is filled with transparent resin, light will be scattered inside the housing 10. Therefore, the partition 80 can separate the light emitter and the light receiver of the same light-emitting and light-receiving assembly, preventing the light emitted by the light emitter from being directly scattered inside the housing 10 to the corresponding light receiver and interfering with the detection of the light receiver, thereby improving the reliability of the optical module 100.

[0073] In specific applications, the specific form of the separator 80 is not limited. For example, the separator 80 can be a partition, which is installed inside the housing 10 and fixedly connected to the housing 10 by means of adhesive, screws, or other methods. Alternatively, the housing 10 can be a split structure, such as including a top cover 104 and a carrier plate 102, with the partition and the top cover 104 integrally formed. Or, the separator 80 can be an opaque resin separator layer, formed by the curing of opaque resin filled inside the housing 10, in which case the transparent resin and opaque resin are filled separately.

[0074] In one possible implementation, the housing 10 further includes: a carrier plate 102 and a top cover 104, as shown below. Figure 2 As shown. Specifically, the carrier plate 102 is electrically connected to the first light emitter 20, the second light emitter 40, the first light receiver 30, and the second light receiver 50. The top cover 104 is placed on the carrier plate 102 and connected to the carrier plate 102.

[0075] The surface of the upper cover 104 facing away from the carrier plate 102 forms the first surface 1042, and the surface of the carrier plate 102 facing away from the upper cover 104 forms the second surface 1022. The carrier plate 102 has a second light hole and a second light outlet 1030, and the upper cover 104 has a first light inlet 1050 and a first light outlet 1048. The port of the first light inlet 1050 on the first surface 1042 forms the first light inlet 1046. The port of the first light outlet 1048 on the first surface 1042 forms the first light outlet 1044. The port of the second light inlet 1032 on the second surface 1022 forms the second light inlet 1026. The port of the second light outlet 1030 on the second surface 1022 forms the second light outlet 1024.

[0076] In the above embodiment, the outer shell 10 is divided into a carrier plate 102 and a top cover 104. The carrier plate 102 and the top cover 104 can be molded separately, which simplifies the structure and helps reduce the processing difficulty of the outer shell 10. At the same time, it also facilitates the assembly of various components inside the outer shell 10, which helps reduce the assembly difficulty of the optical module 100.

[0077] The carrier board 102 has internal wiring that enables signal conduction between electronic components and the circuit board 220. Therefore, when the carrier board 102 is electrically connected to the first light emitter 20, the second light emitter 40, the first light receiver 30, and the second light receiver 50, it is only necessary to electrically connect the carrier board 102 to the circuit board 220 of the dual-screen electronic device 200 to achieve signal conduction between the first light emitter 20, the second light emitter 40, the first light receiver 30, the second light receiver 50 and the circuit board 220, without the need for additional wiring structures to connect the first light emitter 20, the second light emitter 40, the first light receiver 30, the second light receiver 50 and the circuit board 220. This simplifies the assembly structure of the optical module 100 and the circuit board 220, simplifies the wiring layout of the dual-screen electronic device 200, and further reduces the design difficulty of the dual-screen electronic device 200. The top cover 104 is placed on the carrier plate 102 and connected to the carrier plate 102 to form a complete outer shell 10, which protects the components inside the outer shell 10.

[0078] The surface of the upper cover 104 facing away from the carrier plate 102 forms the first surface 1042 (i.e., the front surface of the outer shell 10) of the outer shell 10. The surface of the carrier plate 102 facing away from the upper cover 104 forms the second surface 1022 (i.e., the back surface of the outer shell 10). The upper cover 104 is correspondingly disposed with the first light emitting element 20 and the first light receiving element 30, and the upper cover 104 has openings at the parts corresponding to the first light emitting element 20 and the first light receiving element 30 to form a first light emitting hole 1048 and a first light entering hole 1050, ensuring the emission and injection of light. The ports of the first light emitting hole 1048 and the first light entering hole 1050 located on the first surface 1042 form a first light emitting port 1044 and a first light entering port 1046. The carrier plate 102 is correspondingly disposed with the second light emitting element 40 and the second light receiving element 50, and the parts of the carrier plate 102 corresponding to the second light emitting element 40 and the second light receiving element 50 are hollowed out to form a second light emitting hole 1030 and a second light receiving hole 1032 to ensure the emission and injection of light. The ports of the second light emitting hole 1030 and the second light receiving hole 1032 located on the second surface 1022 form a second light emitting port 1024 and a second light receiving port 1026.

[0079] In one possible implementation, the optical module 100 further includes: a first thermally conductive layer 602, such as... Figure 2 As shown. The first thermally conductive layer 602 is disposed inside the emission cavity 106 and sandwiched between the first light emitting element 20 and the second light emitting element 40.

[0080] Furthermore, the optical module 100 also includes: a second thermally conductive layer 604, such as Figure 2 As shown. The second thermally conductive layer 604 is disposed inside the receiving cavity 108 and sandwiched between the first light receiver 30 and the second light receiver 50.

[0081] In the above embodiments, a first heat-conducting layer 602 is provided between the first light emitter 20 and the second light emitter 40. This facilitates timely heat dissipation from both light emitters 20 and 40, preventing overheating and emission failures or even damage. Furthermore, it allows the first light emitter 20 and the second light emitter 40 to be stacked (i.e., placed along the thickness direction of the dual-screen electronic device 200, that is, along...). Figure 12 The optical module 100 is stacked in the Z-direction, which helps reduce its thickness and, consequently, the thickness of the dual-screen electronic device 200, thus contributing to its thinner and lighter design. Furthermore, the first light emitter 20 and the second light emitter 40 share the first heat-conducting layer 602. Compared to providing separate heat dissipation structures for the first light emitter 20 and the second light emitter 40, this solution simplifies the structure of the optical module 100, reduces its weight, and also contributes to the thinner and lighter design of the dual-screen electronic device 200.

[0082] Similarly, a second heat-conducting layer 604 is provided between the second light emitter 40 and the second light emitter 40. On the one hand, this facilitates timely heat dissipation for the second light emitter 40 and the second light emitter 40, preventing overheating and emission failure or even damage. On the other hand, it allows the second light emitter 40 and the second light emitter 40 to be stacked (i.e., placed along the thickness direction of the double-sided screen electronic device 200, that is, along...) Figure 12 The optical module 100 is stacked in the Z direction, which helps reduce its thickness and, consequently, the thickness of the dual-screen electronic device 200, thus contributing to its thinner and lighter design. Furthermore, the second light emitter 40 and the second light emitter 40 share the second heat-conducting layer 604. Compared to providing separate heat dissipation structures for the second light emitter 40 and the second light emitter 40, this solution simplifies the structure of the optical module 100, reduces its weight, and also contributes to the thinner and lighter design of the dual-screen electronic device 200.

[0083] In one possible implementation, the first light emitting element 20 further has a first groove 202 on its surface facing the first heat-conducting layer 602, such as... Figure 6 As shown. The first thermally conductive layer 602 is partially embedded in the first groove 202, as... Figure 4 As shown.

[0084] The second light emitting element 40 has a second groove 402 on its surface facing the first heat-conducting layer 602, such as Figure 5 As shown. The first thermally conductive layer 602 is partially embedded in the second groove 402, as... Figure 4 As shown.

[0085] The surface of the first light receiver 30 facing the second heat-conducting layer 604 is provided with a third groove 302, such as Figure 8 As shown. The second thermally conductive layer 604 is partially embedded in the third groove 302, as... Figure 3 As shown.

[0086] The second light receiver 50 has a fourth groove 502 on its surface facing the second heat-conducting layer 604, such as Figure 7 As shown. The second thermally conductive layer 604 is partially embedded in the fourth groove 502, as... Figure 3 As shown.

[0087] A first groove 202 is provided on the surface of the first light emitting element 20 facing the first heat-conducting layer 602, so that a part of the first heat-conducting layer 602 can be embedded in the first groove 202. This increases the contact area between the first light emitting element 20 and the first heat-conducting layer 602, thereby improving the heat dissipation capacity of the first heat-conducting layer 602 for the first light emitting element 20, and also improving the bonding force between the first heat-conducting layer 602 and the first light emitting element 20, thereby improving the positional stability and reliability of the first light emitting element 20.

[0088] Similarly, a second groove 402 is provided on the surface of the second light emitter 40 facing the first heat-conducting layer 602, so that a part of the first heat-conducting layer 602 can be embedded in the second groove 402. This increases the contact area between the second light emitter 40 and the first heat-conducting layer 602, thereby improving the heat dissipation capacity of the first heat-conducting layer 602 for the second light emitter 40, and also improving the bonding force between the first heat-conducting layer 602 and the second light emitter 40, thereby improving the positional stability and reliability of the second light emitter 40.

[0089] A third groove 302 is provided on the surface of the first light receiver 30 facing the second heat-conducting layer 604, so that a portion of the second heat-conducting layer 604 can be embedded in the third groove 302. This increases the contact area between the first light receiver 30 and the second heat-conducting layer 604, thereby improving the heat dissipation capacity of the second heat-conducting layer 604 for the first light receiver 30, and also improving the bonding force between the second heat-conducting layer 604 and the first light receiver 30, thereby improving the positional stability and reliability of the first light receiver 30.

[0090] A fourth groove 502 is provided on the surface of the second light receiver 50 facing the second heat-conducting layer 604, so that a portion of the second heat-conducting layer 604 can be embedded in the fourth groove 502. This increases the contact area between the second light receiver 50 and the second heat-conducting layer 604, thereby improving the heat dissipation capacity of the second heat-conducting layer 604 for the second light receiver 50, and also improving the bonding force between the second heat-conducting layer 604 and the second light receiver 50, thereby improving the positional stability and reliability of the second light receiver 50.

[0091] In specific applications, such as Figure 5 , Figure 6 , Figure 7 and Figure 8 As shown, the first groove 202, the second groove 402, the third groove 302, and the fourth groove 502 can be formed by etching using an etching tool 300 (such as an etching machine). The shape of the first groove 202 can be, but is not limited to, prism, hemisphere, cone, etc. Similarly, the shape of the second groove 402 can be, but is not limited to, prism, hemisphere, cone, etc., the shape of the third groove 302 can be, but is not limited to, prism, hemisphere, cone, etc., and the shape of the fourth groove 502 can be, but is not limited to, prism, hemisphere, cone, etc.

[0092] Optionally, there may be multiple first grooves 202, which are spaced apart. There may also be multiple second grooves 402, which are spaced apart. There may also be multiple third grooves 302, which are spaced apart. And there may also be multiple fourth grooves 502, which are spaced apart.

[0093] In one possible implementation, the first thermally conductive layer 602 is further defined as an adhesive layer. The second thermally conductive layer 604 is also defined as an adhesive layer.

[0094] The first thermally conductive layer 602 is an adhesive layer, which facilitates the full filling of the liquid adhesive into the first groove 202 of the first light emitter 20 and the second groove 402 of the second light emitter 40. This further increases the contact area and bonding force between the first light emitter 20 and the first thermally conductive layer 602, and further increases the contact area and bonding force between the second light emitter 40 and the second thermally conductive layer 604. Compared with solutions that do not have the first groove 202 and the second groove 402, this solution can effectively prevent the adhesive layer from delaminating between the two material interfaces, which could lead to malfunctions or even overheating and burnout of the first light emitter 20 and the second light emitter 40, thus further improving the reliability of the optical module 100.

[0095] Similarly, the second thermally conductive layer 604 is an adhesive layer, which facilitates the full filling of the liquid adhesive into the third groove 302 of the first light receiver 30 and the fourth groove 502 of the second light receiver 50. This further increases the contact area and bonding force between the first light receiver 30 and the second thermally conductive layer 604, and further increases the contact area and bonding force between the second light receiver 50 and the second thermally conductive layer 604. Compared to solutions without the third groove 302 and the fourth groove 502, this solution can effectively prevent the adhesive layer from delaminating between the two material interfaces, which could lead to malfunctions or even overheating and burnout of the first light receiver 30 and the second light receiver 50, thus further improving the reliability of the optical module 100.

[0096] In one possible implementation, the first thermally conductive layer 602 is further defined as a conductive adhesive layer. The second thermally conductive layer 604 is also defined as a conductive adhesive layer.

[0097] The first thermally conductive layer 602 is made of a conductive adhesive layer, such as a silver-based adhesive layer, a gold-based adhesive layer, or a copper-based adhesive layer. Therefore, the first thermally conductive layer 602 serves both heat dissipation and electrical conductivity, facilitating indirect electrical connection between the first light emitter 20 and the carrier plate 102, as well as indirect electrical connection between the second light emitter 40 and the carrier plate 102. This helps to further simplify the circuit structure of the optical module 100, thereby reducing the cost of the optical module 100.

[0098] For example, if the first light emitter 20 and the second light emitter 40 are LED elements, the front sides of the two LED elements (i.e., the light-emitting surface or the side where the active area is located) face the first light-emitting port 1044 and the second light-emitting port 1024 respectively, and the back sides of the two LED elements (i.e., the side where the non-light-emitting surface or the non-active area is located) are pasted together with conductive silver paste. Then, it is only necessary to set an electrical connection structure between the active area of ​​the two LED elements and the carrier plate 102 to achieve electrical conduction, so that both the active area and the non-active area of ​​the two LED elements can be electrically connected to the carrier plate 102, thereby ensuring that the two LED elements work normally.

[0099] Similarly, if the second thermally conductive layer 604 is made of a conductive adhesive layer, such as a silver-based adhesive layer, a gold-based adhesive layer, or a copper-based adhesive layer, then the second thermally conductive layer 604 has both heat dissipation and conductivity functions, facilitating indirect conductivity between the first light receiver 30 and the carrier plate 102, as well as indirect electrical conductivity between the second light receiver 50 and the carrier plate 102. This helps to further simplify the circuit structure of the optical module 100, thereby reducing the cost of the optical module 100.

[0100] For example, if the first optical receiver 30 and the second optical receiver 50 are PD elements, the front sides of the two PD elements (i.e., the side where the light-emitting surface or active area is located) face the first light inlet 1046 and the second light inlet 1026 respectively, and the back sides of the two PD elements (i.e., the side where the non-light-emitting surface or non-active area is located) are bonded to conductive silver paste. Then, it is only necessary to set an electrical connection structure between the active areas of the two PD elements and the carrier plate 102 to achieve electrical conduction, so that both the active and non-active areas of the two PD elements can be electrically connected to the carrier plate 102, thereby ensuring that the two PD elements work normally.

[0101] In one possible implementation, the optical module 100 further includes: a first conductive wire 606, a second conductive wire 608, a first conductive protrusion 610, and a second conductive protrusion 612, such as... Figure 2 As shown.

[0102] Specifically, the first conductor 606 is electrically connected to the first light emitter 20 and the carrier plate 102. The second conductor 608 is electrically connected to the first light receiver 30 and the carrier plate 102. The first conductive protrusion 610 is located between the second light emitter 40 and the carrier plate 102, and is electrically connected to both the second light emitter 40 and the carrier plate 102. The second conductive protrusion 612 is located between the second light receiver 50 and the carrier plate 102, and is electrically connected to both the second light receiver 50 and the carrier plate 102.

[0103] In the above embodiments, the distance between the first light emitter 20 and the carrier plate 102 is relatively far compared to the second light emitter 40. Therefore, the first wire 606 is used to realize the electrical connection between the first light emitter 20 and the carrier plate 102, which facilitates the reasonable setting of the position of the first light emitter 20 and the length and connection position of the first wire 606 as needed. Similarly, the distance between the first light receiver 30 and the carrier plate 102 is relatively far compared to the second light receiver 50. Therefore, the second wire 608 is used to realize the electrical connection between the first light receiver 30 and the carrier plate 102, which facilitates the reasonable setting of the position of the second light emitter 40 and the length and connection position of the second wire 608 as needed.

[0104] Compared to the first light emitter 20, the distance between the second light emitter 40 and the carrier plate 102 is relatively closer. Therefore, a first conductive protrusion 610 is directly provided between the second light emitter 40 and the carrier plate 102, which not only achieves electrical communication between the second light emitter 40 and the carrier plate 102, but also achieves mechanical connection between the second light emitter 40 and the carrier plate 102, and enables the carrier plate 102 to support the first light emitter 20 and the second light emitter 40, while also simplifying the wiring within the housing 10. Similarly, compared to the first light receiver 30, the distance between the second light receiver 50 and the carrier plate 102 is relatively closer. Therefore, a first conductive protrusion 610 is directly provided between the second light receiver 50 and the carrier plate 102, which not only achieves electrical communication between the second light receiver 50 and the carrier plate 102, but also achieves mechanical connection between the second light receiver 50 and the carrier plate 102, and enables the carrier plate 102 to support the first light receiver 30 and the second light receiver 50, while also simplifying the wiring within the housing 10.

[0105] In some examples, specifically, the first conductor 606 is an electrically conductive solder wire. The second conductor 608 is an electrically conductive solder wire. The first conductive protrusion 610 is an electrically conductive solder ball. The second conductive protrusion 612 is an electrically conductive solder ball.

[0106] The first conductor 606 is an electrically conductive solder wire. Its two ends are soldered to the first light emitting element 20 and the carrier plate 102, respectively. This soldering process results in high connection strength and good reliability, thus improving the reliability of the optical module 100. Similarly, the second conductor 608 is an electrically conductive solder wire. Its two ends are soldered to the first light receiving element 30 and the carrier plate 102, respectively. This soldering process also results in high connection strength and good reliability, thus improving the reliability of the optical module 100.

[0107] The first conductive protrusion 610 is an electrically conductive solder ball. Therefore, the first conductive protrusion 610 is welded to the second light emitting element 40 and the carrier plate 102. The welding process results in high connection strength and good reliability, thus improving the reliability of the optical module 100. Similarly, the second conductive protrusion 612 is an electrically conductive solder ball. Therefore, the second conductive protrusion 612 is welded to the second light receiving element 50 and the carrier plate 102. The welding process also results in high connection strength and good reliability, thus improving the reliability of the optical module 100.

[0108] In the specific preparation process, such as Figure 9 and Figure 10 As shown, the second light emitter 40 can be flip-chip soldered onto the carrier plate 102 first. Then, conductive adhesive is applied to the back side (i.e., the side where the non-active area is located) of the second light emitter 40 using an adhesive applicator 400 (such as an adhesive applicator). Next, the back side (i.e., the side where the non-active area is located) of the first light emitter 20 is pressed onto the back side of the second emitter. After the conductive adhesive cures, a conductive adhesive layer is formed between the first light emitter 20 and the second light emitter 40. Then, a wire bonding machine or other welding equipment is used to weld the front side (i.e., the active area) of the first light emitter 20 to the carrier plate 102 via wire bonding, achieving an electrical connection.

[0109] Similarly, such as Figure 9 and Figure 10 As shown, the second light receiver 50 can be flip-chip soldered onto the carrier plate 102 first. Then, using an adhesive applicator 400 (such as an adhesive applicator), conductive adhesive is applied to the back side of the second light receiver 50 (i.e., the side where the non-active area is located). Next, the back side of the first light receiver 30 (i.e., the side where the non-active area is located) is pressed onto the back side of the second light receiver 50. After the conductive adhesive cures, a conductive adhesive layer is formed between the first light receiver 30 and the second light receiver 50. Then, using a wire bonding machine or other welding equipment, the front side (i.e., the active area) of the first light receiver 30 is welded to the carrier plate 102 via wire bonding to achieve electrical connection.

[0110] In practical applications, soldering bumps can be pre-reserved on the back side of the second light emitter 40 (i.e., the side where the non-active area is located) and the back side of the second light receiver 50 (i.e., the side where the non-active area is located). After soldering, the first conductive bump 610 and the second conductive bump 612 are formed. Multiple solder pads 1028 can be provided on the surface of the carrier plate 102 facing the cover plate, such as... Figure 11 As shown. The position of the pad 1028 corresponds to the first conductive bump 610, the second conductive bump 612, the first conductor 606, and the second conductor 608, and is used for soldering connections with the first conductor 606, the second conductor 608, the first conductive bump 610, and the second conductive bump 612. Wherein, in Figure 11 In the diagram, the portion circled A has a partial cutout opening, which gives the carrier plate 102 a second light exit port 1024, and the portion circled B has a partial cutout opening, which gives the carrier plate 102 a second light entrance port 1026.

[0111] In one possible implementation, the optical module 100 further includes a first light-transmitting element (not shown in the figure). The first light-transmitting element is disposed at the first light-exit port 1044 and the first light-in port 1046, and is used to cover the first light-exit port 1044 and the first light-in port 1046.

[0112] A second light-transmitting element is provided at the first light-emitting port 1044 and the first light-inlet port 1046 to cover the first light-emitting port 1044 and the first light-inlet port 1046. This can prevent external substances from entering the housing 10 through the first light-emitting port 1044 and the first light-inlet port 1046, thereby effectively protecting the components such as the first light emitting element 20, the first light receiving element 30, the second light emitting element 40, and the second light receiving element 50 inside the housing 10.

[0113] In another possible implementation, the optical module 100 does not include a first light-transmitting element, that is, the first light-exit port 1044 and the first light-in port 1046 are hollowed out, as shown below. Figure 2 As shown. Compared to the solution of adding a first light-transmitting element, this solution helps to reduce the cost and weight of the optical module 100.

[0114] In one possible implementation, the optical module 100 further includes a second light-transmitting element (not shown in the figure). The second light-transmitting element is disposed at the second light-exit port 1024 and the second light-in port 1026, and is used to cover the second light-exit port 1024 and the second light-in port 1026.

[0115] A second light-transmitting element is provided at the second light outlet 1024 and the second light inlet 1026 to cover the second light outlet 1024 and the second light inlet 1026. This can prevent external substances from entering the housing 10 through the second light outlet 1024 and the second light inlet 1026, thereby effectively protecting the components such as the first light emitter 20, the first light receiver 30, the second light emitter 40, and the second light receiver 50 inside the housing 10.

[0116] Optionally, the second light-transmitting element can be made of glass or resin. Glass elements have good light transmittance and are inexpensive. Resin elements have good light transmittance and can be manufactured by filling with liquid resin, which is a simple process.

[0117] In another possible implementation, the optical module 100 does not include a second light-transmitting element; that is, the second light-exit port 1024 and the second light-inlet port 1026 are hollowed out, as shown in the example. Figure 2 As shown. Compared to the solution of adding a second light-transmitting element, this solution helps to reduce the cost and weight of the optical module 100.

[0118] like Figure 13 As shown, an embodiment of the present invention also provides a dual-screen electronic device 200, including: a housing 210, a circuit board 220 and an optical module 100.

[0119] Specifically, such as Figure 12 As shown, the housing 210 includes a first screen panel 212 and a second screen panel 214 disposed opposite to the first screen panel 212.

[0120] The circuit board 220 is disposed between the first screen panel 212 and the second screen panel 214. The circuit board 220 is provided with a third light outlet 222 and a third light inlet 224.

[0121] The optical module 100 is the optical module 100 according to any of the above embodiments. The optical module 100 is disposed inside the housing 210. The first light emitter 20, the first light receiver 30, the second light emitter 40, and the second light receiver 50 of the optical module 100 are electrically connected to the circuit board 220.

[0122] The second light-emitting port 1024 of the optical module 100 is correspondingly arranged with the third light-emitting port 222 to ensure that the light emitted by the second light emitting element 40 can pass through the circuit board 220 and be emitted outward without being blocked by the circuit board 220. The second light-in port 1026 of the optical module 100 is correspondingly arranged with the third light-in port 224 to ensure that the light received by the second light receiving element 50 can pass through the circuit board 220 and enter the housing of the optical module without being blocked by the circuit board 220.

[0123] The dual-screen electronic device 200 provided in the embodiments of the present invention includes the optical module 100 provided in any of the above embodiments, and therefore has all the beneficial effects of any of the above embodiments, which will not be repeated here.

[0124] In one possible implementation, the front side (i.e., the side containing the active region) of the first light emitter 20 of the optical module 100 is further electrically connected to the carrier plate 102 via a first conductor 606 (specifically, an electrically conductive soldered wire). The front side (i.e., the side containing the active region) of the first light receiver 30 is electrically connected to the carrier plate 102 via a second conductor 608 (specifically, an electrically conductive soldered wire). The front side (i.e., the side containing the active region) of the second light emitter 40 is electrically connected to the carrier plate 102 via a first conductive protrusion 610 (specifically, an electrically conductive solder ball). The front side (i.e., the side containing the active region) of the second light receiver 50 is electrically connected to the carrier plate 102 via a second conductive protrusion 612 (specifically, an electrically conductive solder ball).

[0125] The back of the first light emitter 20 has a first groove 202, the back of the second light emitter 40 has a second groove 402, the back of the first light receiver 30 has a third groove 302, and the back of the second light receiver 50 has a fourth groove 502. A first thermally conductive layer 602 (specifically a conductive adhesive layer) is provided between the back of the first light emitter 20 (i.e., the side where the non-active region is located) and the back of the second light emitter 40 (i.e., the side where the non-active region is located). A second thermally conductive layer 604 (specifically a conductive adhesive layer) is provided between the back of the first light receiver 30 and the back of the second light receiver 50.

[0126] The carrier plate 102 of the optical module 100 is soldered to any side of the circuit board 220 away from the cover plate, and electrical conduction is achieved.

[0127] This enables signal transmission between the first light transmitter 20, the first light receiver 30, the second light transmitter 40, the second light receiver 50, and the circuit board 220.

[0128] The dual-screen electronic device 200 provided in this embodiment adopts a novel optical module 100. This optical module 100 can achieve dual-sided light emission and emission from the top (the side corresponding to the first light-emitting port 1044 and the first light-inlet port 1046) and the bottom (the side where the second light-emitting port 1024 and the second light-inlet port 1026 are located) within the same package, thereby simplifying the number of components in the dual-screen electronic device 200, reducing the thickness of the dual-screen electronic device 200, and reducing the area of ​​the dual-screen electronic device 200.

[0129] Meanwhile, the groove design on the back of the two light-emitting and light-receiving components of the optical module 100 significantly increases the bonding area between the first light emitter 20, the first light receiver 30, the second light emitter 40, the second light receiver 50 and the conductive adhesive layer, thereby improving the bonding force and heat dissipation capacity of the conductive adhesive layer and enhancing the reliability of the chip.

[0130] Furthermore, since the optical module 100 has optical paths for both light emission and light reception on both sides, the optical module 100 can be arranged on any side of the circuit board 220 according to design requirements, making the placement of the photosensitive module more flexible.

[0131] like Figure 14 As shown, embodiments of the present invention also provide a method for fabricating an optical module 100, used to fabricate an optical module 100 as described in any of the first aspect embodiments, the method comprising:

[0132] Step S1410: Encapsulate the first light emitter, the first light receiver, the second light emitter, and the second light receiver inside the housing, so that the first light emitter, the first light receiver, the second light emitter, and the second light receiver are respectively configured to correspond to the first light outlet, the first light inlet, the second light outlet, and the second light inlet of the housing.

[0133] According to the method for preparing an optical module according to an embodiment of the present invention, the prepared optical module improves the structure of the outer shell 10 by opening light-emitting ports and light-receiving ports on both the front and back sides of the outer shell 10, and integrating two sets of light-emitting and light-receiving components inside the outer shell 10. This enables one optical module 100 to achieve double-sided light emission and light reception functions, thereby reducing the number of internal components of the double-sided screen electronic device 200, reducing the layout difficulty of the internal components of the double-sided screen electronic device 200, and facilitating the thinning and lightening of the double-sided screen electronic device 200. This solves the problem in the prior art that the optical module 100 can only emit and receive light from one side, resulting in a large number of internal components, layout difficulties, and hindering the thinning and lightening of the double-sided screen electronic device 200.

[0134] In one possible embodiment, specifically, as shown in the example... Figure 15 As shown, step S1410 includes:

[0135] Step S1412: Connect the second light emitter to the carrier plate of the housing using the first conductive protrusion, connect the second light receiver to the carrier plate using the second conductive protrusion, and make the second light emitter and the second light receiver respectively correspond to the second light outlet and the second light inlet provided on the carrier plate.

[0136] Step S1414: Apply conductive adhesive to the surface of the second light emitting element facing away from the carrier plate and the surface of the second light receiving element facing away from the carrier plate.

[0137] Step S1416: The first light emitter and the first light receiver are respectively stacked on the second light emitter and the second light receiver coated with the conductive adhesive, so that a first thermally conductive layer is formed between the first light emitter and the second light emitter, and a second thermally conductive layer is formed between the first light receiver and the second light receiver.

[0138] Step S1418: Connect the surface of the first light emitter away from the second light emitter to the carrier plate using a first wire, and connect the surface of the first light receiver away from the second light receiver to the carrier plate using a second wire;

[0139] Step S1420: Connect the top cover of the housing to the carrier plate, so that the first light outlet and the first light inlet provided on the top cover are respectively corresponding to the first light emitting element and the first light receiving element.

[0140] In the above embodiment, the outer shell 10 is divided into a carrier plate 102 and a top cover 104. The carrier plate 102 and the top cover 104 can be molded separately, which simplifies the structure and helps reduce the processing difficulty of the outer shell 10. At the same time, it also facilitates the assembly of various components inside the outer shell 10, which helps reduce the assembly difficulty of the optical module 100.

[0141] The front side of the first light emitter 20 (i.e., the side where the active area is located) is electrically connected to the carrier plate 102 via the first conductor 606. The back side of the first light emitter 20 (i.e., the side where the non-active area is located) is electrically connected to the carrier plate 102 via the first thermally conductive layer 602, the second light emitter 40, and the first conductive protrusion 610. This ensures the normal operation of the first light emitter 20.

[0142] The front side (i.e., the side where the active area is located) of the first light receiver 30 is electrically connected to the carrier plate 102 through the second conductor 608. The back side (i.e., the side where the non-active area is located) of the first light receiver 30 is electrically connected to the carrier plate 102 through the second thermally conductive layer 604, the second light receiver 50, and the second conductive protrusion 612. This ensures the normal operation of the first light receiver 30.

[0143] The front side (i.e., the side where the active area is located) of the second light emitter 40 is electrically connected to the carrier plate 102 through the first conductive protrusion 610. The back side (i.e., the side where the non-active area is located) of the second light emitter 40 is electrically connected to the carrier plate 102 through the first thermally conductive layer 602, the first light emitter 20, and the first wire 606. This ensures the normal operation of the second light emitter 40.

[0144] The front side (i.e., the side where the active area is located) of the second light receiver 50 is electrically connected to the carrier plate 102 through the second conductive protrusion 612. The back side (i.e., the side where the non-active area is located) of the second light receiver 50 is electrically connected to the carrier plate 102 through the second thermally conductive layer 604, the second light receiver 50, and the second conductive wire 608. This ensures the normal operation of the second light receiver 50.

[0145] The above-mentioned electrical conduction method has a simple structure, which simplifies the circuit layout of the optical module 100.

[0146] Specifically, in step S1412, the first conductive protrusion 610 is located between the front surface of the second light emitter 40 and the carrier plate 102, and the second conductive protrusion 612 is located between the front surface of the second light receiver 50 and the carrier plate 102. Compared with the first light emitter 20, the distance between the second light emitter 40 and the carrier plate 102 is relatively close. Therefore, by directly setting the first conductive protrusion 610 between the second light emitter 40 and the carrier plate 102, both electrical communication between the second light emitter 40 and the carrier plate 102 and mechanical connection between the second light emitter 40 and the carrier plate 102 are achieved. This also enables the carrier plate 102 to support the first light emitter 20 and the second light emitter 40, and simplifies the wiring inside the housing 10. Similarly, compared to the first light receiver 30, the distance between the second light receiver 50 and the carrier plate 102 is relatively close. Therefore, the first conductive protrusion 610 is directly provided between the second light receiver 50 and the carrier plate 102, which realizes both the electrical connection between the second light receiver 50 and the carrier plate 102 and the mechanical connection between the second light receiver 50 and the carrier plate 102. It also enables the carrier plate 102 to support the first light receiver 30 and the second light receiver 50, and simplifies the wiring inside the housing 10.

[0147] In steps S1414 and S1416, the first thermally conductive layer 602 formed by the curing of the conductive adhesive is a conductive adhesive layer, such as a silver-based adhesive layer, a gold-based adhesive layer, or a copper-based adhesive layer. Therefore, the first thermally conductive layer 602 has both heat dissipation and electrical conductivity functions, facilitating indirect electrical connection between the first light emitter 20 and the carrier plate 102, as well as indirect electrical connection between the second light emitter 40 and the carrier plate 102. This helps to further simplify the circuit structure of the optical module 100, thereby reducing the cost of the optical module 100.

[0148] For example, if the first light emitter 20 and the second light emitter 40 are LED elements, the front sides of the two LED elements (i.e., the light-emitting surface or the side where the active area is located) face the first light-emitting port 1044 and the second light-emitting port 1024 respectively, and the back sides of the two LED elements (i.e., the side where the non-light-emitting surface or the non-active area is located) are pasted together with conductive silver paste. Then, it is only necessary to set an electrical connection structure between the active area of ​​the two LED elements and the carrier plate 102 to achieve electrical conduction, so that both the active area and the non-active area of ​​the two LED elements can be electrically connected to the carrier plate 102, thereby ensuring that the two LED elements work normally.

[0149] Similarly, the second thermally conductive layer 604 formed by the curing of the conductive adhesive is also a conductive adhesive layer, such as a silver-based adhesive layer, a gold-based adhesive layer, or a copper-based adhesive layer. Therefore, the second thermally conductive layer 604 has both heat dissipation and conductivity functions, facilitating indirect conduction between the first light receiver 30 and the carrier plate 102, as well as indirect electrical conduction between the second light receiver 50 and the carrier plate 102. This helps to further simplify the circuit structure of the optical module 100, thereby reducing the cost of the optical module 100.

[0150] For example, if the first optical receiver 30 and the second optical receiver 50 are PD elements, the front sides of the two PD elements (i.e., the side where the light-emitting surface or active area is located) face the first light inlet 1046 and the second light inlet 1026 respectively, and the back sides of the two PD elements (i.e., the side where the non-light-emitting surface or non-active area is located) are bonded to conductive silver paste. Then, it is only necessary to set an electrical connection structure between the active areas of the two PD elements and the carrier plate 102 to achieve electrical conduction, so that both the active and non-active areas of the two PD elements can be electrically connected to the carrier plate 102, thereby ensuring that the two PD elements work normally.

[0151] Furthermore, a first heat-conducting layer 602 is provided between the first light emitter 20 and the second light emitter 40. This serves two purposes: firstly, it facilitates timely heat dissipation for both light emitters 20 and 40, preventing overheating and emission malfunctions or even damage; secondly, it allows the first light emitter 20 and the second light emitter 40 to be stacked (i.e., placed along the thickness direction of the dual-screen electronic device 200, that is, along...). Figure 12 The optical module 100 is stacked in the Z-direction, which helps reduce its thickness and, consequently, the thickness of the dual-screen electronic device 200, thus contributing to its thinner and lighter design. Furthermore, the first light emitter 20 and the second light emitter 40 share the first heat-conducting layer 602. Compared to providing separate heat dissipation structures for the first light emitter 20 and the second light emitter 40, this solution simplifies the structure of the optical module 100, reduces its weight, and also contributes to the thinner and lighter design of the dual-screen electronic device 200.

[0152] Similarly, a second heat-conducting layer 604 is provided between the second light emitter 40 and the second light emitter 40. On the one hand, this facilitates timely heat dissipation for the second light emitter 40 and the second light emitter 40, preventing overheating and emission failure or even damage. On the other hand, it allows the second light emitter 40 and the second light emitter 40 to be stacked (i.e., placed along the thickness direction of the double-sided screen electronic device 200, that is, along...) Figure 12 The optical module 100 is stacked in the Z direction, which helps reduce its thickness and, consequently, the thickness of the dual-screen electronic device 200, thus contributing to its thinner and lighter design. Furthermore, the second light emitter 40 and the second light emitter 40 share the second heat-conducting layer 604. Compared to providing separate heat dissipation structures for the second light emitter 40 and the second light emitter 40, this solution simplifies the structure of the optical module 100, reduces its weight, and also contributes to the thinner and lighter design of the dual-screen electronic device 200.

[0153] In step S1418, the surface of the first light emitter 20 facing away from the second light emitter 40 is the front surface of the first light emitter 20, i.e., the surface where the active region is located. The surface of the first light receiver 30 facing away from the second light receiver 50 is the front surface of the first light receiver 30, i.e., the surface where the active region is located. Compared to the second light emitter 40, the distance between the first light emitter 20 and the carrier plate 102 is relatively far. Therefore, the first wire 606 is used to realize the electrical connection between the first light emitter 20 and the carrier plate 102, which facilitates the reasonable setting of the position of the first light emitter 20 and the length and connection position of the first wire 606 as needed. Similarly, compared to the second light receiver 50, the distance between the first light receiver 30 and the carrier plate 102 is relatively far. Therefore, the second wire 608 is used to realize the electrical connection between the first light receiver 30 and the carrier plate 102, which facilitates the reasonable setting of the position of the second light emitter 40 and the length and connection position of the second wire 608 as needed.

[0154] In step S1420, the cover 104 can be attached to the carrier plate 102 by pasting, which has high connection reliability and can achieve a good sealing effect.

[0155] In some examples, specifically in step S1418, the first conductor 606 is an electrically conductive bonding wire, and the second conductor 608 is an electrically conductive bonding wire.

[0156] In step S1412, the first conductive protrusion 610 is an electrically conductive solder ball, and the second conductive protrusion 612 is an electrically conductive solder ball.

[0157] The first conductor 606 is an electrically conductive solder wire. Its two ends are soldered to the first light emitting element 20 and the carrier plate 102, respectively. This soldering process results in high connection strength and good reliability, thus improving the reliability of the optical module 100. Similarly, the second conductor 608 is an electrically conductive solder wire. Its two ends are soldered to the first light receiving element 30 and the carrier plate 102, respectively. This soldering process also results in high connection strength and good reliability, thus improving the reliability of the optical module 100.

[0158] The first conductive protrusion 610 is an electrically conductive solder ball. Therefore, the first conductive protrusion 610 is welded to the second light emitting element 40 and the carrier plate 102. The welding process results in high connection strength and good reliability, thus improving the reliability of the optical module 100. Similarly, the second conductive protrusion 612 is an electrically conductive solder ball. Therefore, the second conductive protrusion 612 is welded to the second light receiving element 50 and the carrier plate 102. The welding process also results in high connection strength and good reliability, thus improving the reliability of the optical module 100.

[0159] In the specific preparation process, such as Figure 9 and Figure 10 As shown, the second light emitter 40 can be flip-chip soldered onto the carrier plate 102 first. Then, conductive adhesive is applied to the back side (i.e., the side where the non-active area is located) of the second light emitter 40 using an adhesive applicator 400 (such as an adhesive applicator). Next, the back side (i.e., the side where the non-active area is located) of the first light emitter 20 is pressed onto the back side of the second emitter. After the conductive adhesive cures, a conductive adhesive layer is formed between the first light emitter 20 and the second light emitter 40. Then, a wire bonding machine or other welding equipment is used to weld the front side (i.e., the active area) of the first light emitter 20 to the carrier plate 102 via wire bonding, achieving an electrical connection.

[0160] Similarly, such as Figure 9 and Figure 10 As shown, the second light receiver 50 can be flip-chip soldered onto the carrier plate 102 first. Then, using an adhesive applicator 400 (such as an adhesive applicator), conductive adhesive is applied to the back side of the second light receiver 50 (i.e., the side where the non-active area is located). Next, the back side of the first light receiver 30 (i.e., the side where the non-active area is located) is pressed onto the back side of the second light receiver 50. After the conductive adhesive cures, a conductive adhesive layer is formed between the first light receiver 30 and the second light receiver 50. Then, using a wire bonding machine or other welding equipment, the front side (i.e., the active area) of the first light receiver 30 is welded to the carrier plate 102 via wire bonding to achieve electrical connection.

[0161] In practical applications, soldering bumps can be pre-reserved on the back side of the second light emitter 40 (i.e., the side where the non-active area is located) and the back side of the second light receiver 50 (i.e., the side where the non-active area is located). After soldering, the first conductive bump 610 and the second conductive bump 612 are formed. Multiple solder pads 1028 can be provided on the surface of the carrier plate 102 facing the cover plate, such as... Figure 11 As shown. The position of the pad 1028 corresponds to the first conductive bump 610, the second conductive bump 612, the first wire 606, and the second wire 608, and is used for soldering connection with the first wire 606, the second wire 608, the first conductive bump 610, and the second conductive bump 612.

[0162] In one possible implementation, further, as Figure 16 As shown, the fabrication method of the optical module 100 further includes:

[0163] Step S1400: A first groove, a second groove, a third groove, and a fourth groove are respectively machined on the surface of the first light emitter facing the second light emitter, the surface of the second light emitter facing the first light emitter, the surface of the first light receiver facing the second light receiver, and the surface of the second light receiver facing the first light receiver.

[0164] In the above embodiment, a first groove 202 is provided on the surface of the first light emitting element 20 facing the first heat-conducting layer 602, so that a portion of the first heat-conducting layer 602 can be embedded in the first groove 202. This increases the contact area between the first light emitting element 20 and the first heat-conducting layer 602, thereby improving the heat dissipation capacity of the first heat-conducting layer 602 for the first light emitting element 20, and also improving the bonding force between the first heat-conducting layer 602 and the first light emitting element 20, thereby improving the positional stability and reliability of the first light emitting element 20.

[0165] Similarly, a second groove 402 is provided on the surface of the second light emitter 40 facing the first heat-conducting layer 602, so that a part of the first heat-conducting layer 602 can be embedded in the second groove 402. This increases the contact area between the second light emitter 40 and the first heat-conducting layer 602, thereby improving the heat dissipation capacity of the first heat-conducting layer 602 for the second light emitter 40, and also improving the bonding force between the first heat-conducting layer 602 and the second light emitter 40, thereby improving the positional stability and reliability of the second light emitter 40.

[0166] A third groove 302 is provided on the surface of the first light receiver 30 facing the second heat-conducting layer 604, so that a portion of the second heat-conducting layer 604 can be embedded in the third groove 302. This increases the contact area between the first light receiver 30 and the second heat-conducting layer 604, thereby improving the heat dissipation capacity of the second heat-conducting layer 604 for the first light receiver 30, and also improving the bonding force between the second heat-conducting layer 604 and the first light receiver 30, thereby improving the positional stability and reliability of the first light receiver 30.

[0167] A fourth groove 502 is provided on the surface of the second light receiver 50 facing the second heat-conducting layer 604, so that a portion of the second heat-conducting layer 604 can be embedded in the fourth groove 502. This increases the contact area between the second light receiver 50 and the second heat-conducting layer 604, thereby improving the heat dissipation capacity of the second heat-conducting layer 604 for the second light receiver 50, and also improving the bonding force between the second heat-conducting layer 604 and the second light receiver 50, thereby improving the positional stability and reliability of the second light receiver 50.

[0168] In specific applications, such as Figure 5 , Figure 6 , Figure 7 and Figure 8 As shown, the first groove 202, the second groove 402, the third groove 302, and the fourth groove 502 can be formed by etching using an etching tool 300 (such as an etching machine). The shape of the first groove 202 can be, but is not limited to, prism, hemisphere, cone, etc. Similarly, the shape of the second groove 402 can be, but is not limited to, prism, hemisphere, cone, etc., the shape of the third groove 302 can be, but is not limited to, prism, hemisphere, cone, etc., and the shape of the fourth groove 502 can be, but is not limited to, prism, hemisphere, cone, etc.

[0169] Optionally, there may be multiple first grooves 202, which are spaced apart. There may also be multiple second grooves 402, which are spaced apart. There may also be multiple third grooves 302, which are spaced apart. And there may also be multiple fourth grooves 502, which are spaced apart.

[0170] In one possible implementation, the method for preparing the optical module 100 further includes: injecting transparent resin into the housing 10.

[0171] To ensure the strength of the outer casing 10, the areas of the first light-emitting port 1044, the first light-incoming port 1046, the second light-emitting port 1024, and the second light-incoming port 1026 cannot be too large. However, the first light emitting element 20, the second light emitting element 40, the first light receiving element 30, and the second light receiving element 50 are mostly flat structures with relatively large areas. Therefore, a certain distance is maintained between the first light emitting element 20, the first light receiving element 30, the second light emitting element 40, and the second light receiving element 50 and the outer casing 10 to ensure sufficient light emission and penetration.

[0172] Further, a light-transmitting resin 70 is filled inside the outer casing 10. During its flow, the liquid light-transmitting resin 70 fills the spaces between the outer casing 10 and the first light emitter 20, the second light emitter 40, the first light receiver 30, and the second light receiver 50. After the liquid light-transmitting resin 70 solidifies, the first light emitter 20, the first light receiver 30, the second light emitter 40, and the second light receiver 50 are securely encapsulated within the outer casing 10, thus protecting these components and effectively improving their positional stability and reliability. Simultaneously, due to the light-transmitting properties of the resin 70, it does not affect the emission or incidence of light.

[0173] In a specific example, such as Figure 17 As shown, the fabrication method of the optical module 100 includes the following steps:

[0174] Step S1702: Etch a first groove on the back side of the first light emitter, etch a second groove on the back side of the second light emitter, etch a third groove on the back side of the first light receiver, and etch a fourth groove on the back side of the second light receiver.

[0175] Step S1704: Flip-chip solder the front side of the second light emitter onto the carrier plate, so that a first conductive protrusion is formed between the second light emitter and the carrier plate; Flip-chip solder the front side of the second light receiver onto the carrier plate, so that a second conductive protrusion is formed between the second light receiver and the carrier plate.

[0176] Step S1706: Coat the back of the second light emitter with conductive silver paste, and coat the back of the second light receiver with conductive silver paste.

[0177] Step S1708: Press the back of the first light emitter onto the back of the second light emitter coated with conductive silver paste, so that a first thermally conductive layer is formed between the first light emitter and the second light emitter; press the back of the first light receiver onto the back of the second light receiver coated with conductive silver paste, so that a second thermally conductive layer is formed between the first light receiver and the second light receiver.

[0178] Step S1710: Electrically connect the front side of the first light emitter to the carrier plate via bonding wire, and electrically connect the front side of the first light receiver to the carrier plate via bonding wire;

[0179] Step S1712: Inject transparent resin and attach the top cover to the carrier plate.

[0180] This specific example addresses the problem that existing photosensitive sensors can only operate on one side (top light emission / reception) and that silver is prone to delamination between the chip and the substrate 102. A novel packaging structure for the photosensitive sensor is fabricated, enabling dual-sided light emission / reception. This reduces the number of components used in the dual-screen electronic device 200, decreases its area, and lowers its height. Furthermore, the groove design on the back of the two sets of light emission and reception components significantly increases the bonding area between the chip and the silver paste, improving adhesion and heat dissipation, and enhancing chip reliability.

[0181] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0182] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. An optical module, characterized by comprising: The application relates to an optical module. The optical module comprises: a shell, which comprises a first surface and a second surface arranged opposite to the first surface, the first surface is provided with a first light outlet and a first light inlet for light emission and light reception of the first surface of the shell, and the second surface is provided with a second light outlet and a second light inlet for light emission and light reception of the second surface of the shell; a first light emitting element arranged in the shell and corresponding to the first light outlet, which is used for emitting light to the outside of the shell through the first light outlet; a first light receiving element arranged in the shell and corresponding to the first light inlet, which is used for receiving light entering the shell through the first light inlet; a second light emitting element arranged in the shell and corresponding to the second light outlet, which is used for emitting light to the outside of the shell through the second light outlet; a second light receiving element arranged in the shell and corresponding to the second light inlet, which is used for receiving light entering the shell through the second light inlet, and the first light emitting element, the second light emitting element, the first light receiving element and the second light receiving element are integrally arranged in the shell, so that a set of the optical module can realize double-sided light emission and light reception; a first heat-conducting layer arranged between the first light emitting element and the second light emitting element, and the first light emitting element is connected with the second light emitting element through the first heat-conducting layer; and / or a second heat-conducting layer arranged between the first light receiving element and the second light receiving element, and the first light receiving element is connected with the second light receiving element through the second heat-conducting layer; a first light-transmitting element arranged at the first light outlet and the first light inlet, which is used for covering the first light outlet and the first light inlet; and / or a second light-transmitting element arranged at the second light outlet and the second light inlet, which is used for covering the second light outlet and the second light inlet. The shell comprises: a carrier plate electrically connected with the first light emitting element, the second light emitting element, the first light receiving element and the second light receiving element, and the carrier plate is provided with a second light inlet hole and a second light outlet hole; an upper cover arranged on the carrier plate and connected with the carrier plate, the upper cover is provided with a first light inlet hole and a first light outlet hole, and a surface of the carrier plate away from the upper cover forms the second surface, the first light inlet hole forms the first light inlet, the first light outlet hole forms the first light outlet, the second light inlet hole forms the second light inlet, and the second light outlet hole forms the second light outlet; wherein the first light emitting element and the first light receiving element form a set of light emitting and light receiving components, which are matched with the first light outlet and the first light inlet of the shell to realize the light emission and light reception functions of the first surface, and the second light emitting element and the second light receiving element form another set of light emitting and light receiving components, which are matched with the second light outlet and the second light inlet of the shell to realize the light emission and light reception functions of the second surface.

2. The optical module according to claim 1, wherein, for the solution that the optical module further comprises a first heat-conducting layer, the first light emitting element is provided with a first groove facing the surface of the first heat-conducting layer, and the first heat-conducting layer is partially embedded in the first groove; and the second light emitting element is provided with a second groove facing the surface of the first heat-conducting layer, and the first heat-conducting layer is partially embedded in the second groove. For the solution that the optical module further comprises a second heat-conducting layer, the first light receiving element is provided with a third groove facing the surface of the second heat-conducting layer, and the second heat-conducting layer is partially embedded in the third groove; and the second light receiving element is provided with a fourth groove facing the surface of the second heat-conducting layer, and the second heat-conducting layer is partially embedded in the fourth groove. Further comprising:

3. The optical module according to claim 1 or 2, characterized by a first wire electrically connected with the first light emitting element and the carrier plate; a second wire electrically connected with the first light receiving element and the carrier plate; a first conductive bump between the second light emitting element and the carrier plate and electrically connected with the second light emitting element and the carrier plate; a second conductive bump between the second light receiving element and the carrier plate and electrically connected with the second light receiving element and the carrier plate. Further comprising:

4. The optical module according to claim 1 or 2, wherein a partition provided in the shell and separating the internal space of the shell into a transmitting cavity and a receiving cavity, the first light outlet and the second light outlet being in communication with the transmitting cavity, the first light inlet and the second light inlet being in communication with the receiving cavity, the first light emitting element and the second light emitting element being provided in the transmitting cavity, and the first light receiving element and the second light receiving element being provided in the receiving cavity.

5. The optical module according to claim 1 or 2, wherein, the optical module is a photosensitive sensor, a laser focusing device or an infrared sensor. comprising:

6. A dual screen electronic device, comprising: a shell, the shell comprising a first screen plate and a second screen plate provided opposite to the first screen plate; a circuit board provided between the first screen plate and the second screen plate, the circuit board being provided with a third light outlet and a third light inlet; an optical module, the optical module being the optical module according to any one of claims 1 to 5, the optical module being provided in the shell, the first light emitting element, the first light receiving element, the second light emitting element and the second light receiving element of the optical module being electrically connected with the circuit board, the second light outlet of the optical module being provided corresponding to the third light outlet, and the second light inlet of the optical module being provided corresponding to the third light inlet. comprising:

7. A method for fabricating an optical module, characterized in that, encapsulating the first light emitting element, the first light receiving element, the second light emitting element and the second light receiving element in a shell, the first light emitting element, the first light receiving element, the second light emitting element and the second light receiving element being provided corresponding to the first light outlet, the first light inlet, the second light outlet and the second light inlet of the shell respectively, and the first light emitting element, the second light emitting element, the first light receiving element and the second light receiving element being integrated in the shell, so that a set of the optical module can realize double-sided light emission and light receiving. ​ A first heat-conducting layer is arranged between the first light emitting member and the second light emitting member, and the first light emitting member is connected with the second light emitting member through the first heat-conducting layer; A second heat-conducting layer is arranged between the first light receiving member and the second light receiving member, and the first light receiving member is connected with the second light receiving member through the second heat-conducting layer; The first light emitting member and the first light receiving member constitute a set of light emitting and light receiving assembly, and cooperate with the first light outlet and the first light inlet of the shell to realize the light emitting and light receiving functions of the first surface; the second light emitting member and the second light receiving member constitute another set of light emitting and light receiving assembly, and cooperate with the second light outlet and the second light inlet of the shell to realize the light emitting and light receiving functions of the second surface.

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