Carrier-based test system

Abstract

An exemplary test system is disclosed, the exemplary test system comprising a test carrier for receiving a device to be tested. The test carrier comprises a test component for performing at least a structural test on the device. The exemplary test system also comprises a slot for receiving the test carrier. The slot comprises an interface to which the test carrier is connected so that the test carrier can communicate with a system that is part of the test system or is external to the test system.

Description

Technical Field

[0001] The present specification generally relates to a test system having a test carrier including electronics for testing a device within the test carrier. Background Art

[0002] The test system is configured to test the operation of electronic devices such as microprocessors and memory chips. Testing may include sending signals to the device and determining how the device reacts to these signals based on its response. The reaction of the device will determine whether the device passes or fails the test. Summary of the invention

[0003] An exemplary test system is disclosed, the exemplary test system comprising a test carrier for receiving a device to be tested. The test carrier comprises a test component for performing at least a structural test on the device. The exemplary test system also comprises a slot for receiving the test carrier. The slot comprises an interface to which the test carrier is connected so that the test carrier can communicate with a system that is part of the test system or is external to the test system. The exemplary test system may include one or more of the following features (alone or in combination).

[0004] Structural testing may be used to perform component level testing on a device. Structural testing may include parametric testing. Structural testing may include scan testing. Test components may be configured to perform functional testing on a device. Functional testing may be used to perform system level testing on a device. Functional testing may include providing input to a device, obtaining output based on the input, and determining whether the device has passed the functional testing based on the output.

[0005] An exemplary test system may include a printed circuit board (PCB) having test components for performing at least structural testing on a device. An exemplary test system may include a robot for moving a test carrier into and out of a slot.

[0006] An exemplary test system may include one or more additional test carriers. Each of the one or more additional test carriers may be configured to receive a different device to be tested. Each additional test carrier may include a test component for performing at least a structural test on the different devices. An exemplary test system may include one or more additional slots. Each of the one or more additional slots may be configured to receive a target test carrier in the one or more additional test carriers. Each slot may include an interface to which each test carrier is connected so that the target test carrier can communicate with a system that is part of the test system or is external to the test system.

[0007] Each test carrier may include the same type of test components.At least some of the additional test carriers may include different types of test components configured to perform different types of tests.

[0008] The device may be a first device. The test carrier may include a first receptacle for receiving the first device and a second receptacle for receiving a second device to be tested. The test component may also be configured to test the second device. The test component may be configured to perform the same type of test on the first device and the second device. The test component may be configured to perform different types of tests on the first device and the second device. Different types of tests may be performed asynchronously.

[0009] The test component may include a memory storing data representing a test stimulus vector for use in a structural test. The test component may include one or more processing devices configured to execute instructions to perform the structural test. The test component may include a memory storing test results based on the execution of the structural test. The test component may include an interface capable of communicating with a system. The system may include a computing system. The communication may include instructions for executing a test originating from the computing system. The test results may originate from a test carrier.

[0010] The test component may include a memory storing instructions including one or more test programs and one or more processing devices for executing the instructions to perform structural tests on the device. The instructions define a test flow.

[0011] The system may include a computing system. The test carrier may be configured to receive a command from the computing system for changing a test flow.

[0012] An exemplary method includes receiving a device to be tested in a test carrier. The test carrier includes a test component that performs at least a structural test on the device. The exemplary method also includes receiving the test carrier in a slot. The slot includes an interface to which the test carrier is connected to communicate with a system that is part of the test system or external to the test system. The test carrier communicates with the system based on the structural test. The exemplary method may include one or more of the following features (alone or in combination).

[0013] Structural testing may perform component level testing on a device. Structural testing may include parametric testing. Structural testing may include scan testing. Test components may perform functional testing on a device. Functional testing may perform system level testing on a device. Functional testing may provide input to a device, obtain output based on the input, and determine whether the device has passed the functional testing based on the output.

[0014] An exemplary test system includes means for receiving a device to be tested, wherein the means for receiving the device includes a test component for performing at least a structural test on the device; means for receiving a test carrier, wherein the means for receiving the test carrier includes an interface to which the test carrier is connected to enable the test carrier to communicate with a system that is part of the test system or is external to the test system; and means for moving the test carrier into and out of the slot. The exemplary test system may include one or more of the following features, either alone or in combination.

[0015] An exemplary testing system may include means for moving a device into and out of a device for receiving the device.The testing component may also be configured to perform functional tests on the device.

[0016] Any two or more of the features described in this specification (including this Summary) can be combined to form implementations not specifically described herein.

[0017] The systems and methods described herein, or a portion thereof, may be implemented as or controlled by a computer program product that includes instructions stored on one or more non-transitory machine-readable storage media and that can be executed on one or more processing devices to control (e.g., coordinate) the operations described herein. The systems and methods described herein, or a portion thereof, may be implemented as an apparatus, method, or electronic system that may include one or more processing devices and a memory storing executable instructions for implementing various operations.

[0018] The details of one or more implementations are set forth in the accompanying drawings and the following detailed description. Other features, objects, and advantages will be apparent from the detailed description and drawings, and from the claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a perspective view of an exemplary carrier for use in a testing system.

[0020] Figure 2 is a perspective view of an exemplary testing system.

[0021] Figure 3 and Figure 4 is shown in different configurations during operation Figure 2 A perspective view of an example of the internal components of a testing system.

[0022] Like reference numbers in different drawings indicate similar elements. DETAILED DESCRIPTION

[0023] Exemplary embodiments of a carrier-based test system ("test system") are described herein. Examples of such test systems include a test carrier for receiving a device to be tested. The test carrier includes electronics including test components for performing at least structural tests on the device. Structural tests include testing individual components of the device. The test carrier may also include electronics including test components for performing functional tests on the device. Functional tests include testing the overall operation of the device. The test system includes a test slot ("slot") to receive the test carrier. The slot includes an interface to which the test carrier is connected so that the test carrier can communicate with a system that is part of or external to the test system. The robot can be configured and controlled to move the test carrier into and out of the slot during the test process.

[0024] Figure 1 An example of a test carrier 1 is shown. In some embodiments, the test carrier 1 is self-contained, portable, and capable of being moved in and out of a slot. The test carrier 1 includes an electronic device 2 that includes test components that are configured to perform structural tests, functional tests, or both structural tests and functional tests on a device held in the test carrier. In this regard, the test carrier 1 includes receptacles for holding devices to be tested. The receptacles include one or more interfaces that are configured to mechanically and electrically connect the devices to the test carrier. In the test carrier 1, the receptacles include two test sockets 3 and 4 arranged along the longitudinal dimension of the test carrier. Although two test sockets are shown, other embodiments of the test carrier may include more or less than two test sockets. The test sockets may also be connected to the test carrier as shown. Figure 1 The test sockets may be arranged in different ways as shown. For example, the test sockets may be arranged along a lateral dimension.

[0025] As described above, the exemplary electronic device 2 can be incorporated into the test carrier itself to perform one or more tests on the device in the test socket. The electronic device 2 is internal to the test carrier and is Figure 1 The electronic device 2 may be included on a printed circuit board (PCB) as part of a test carrier.

[0026] The electronic device 2 may include a memory 5 storing data representing test stimulus vectors for structural testing, functional testing, or both structural testing and functional testing. A circuit such as described below may retrieve all or some of the data from the memory and generate stimulus signals or test data based on the retrieved data.

[0027] The electronic device 2 may include a scan test circuit 6. In general, an exemplary scan test includes obtaining access to internal nodes of a device under test (DUT), shifting bits into registers in those internal nodes, and monitoring the responses of those internal nodes to the bits in the registers. In an exemplary scan test system, memory elements such as latches or flip-flops are connected to form a shift register, referred to as a scan register. The internal state of the DUT can be controlled by shifting test data applied to the various components of the DUT into the scan register. The state of the various components can be obtained by shifting out the data stored in the scan register.

[0028] Examples of scan test systems that can be implemented using the scan test circuit 6 include a level sensitive scan design system (LSSD). In an exemplary LSSD, shift register latches operate as basic building blocks in a logical organization. Clock sequences control groups of shift register latches to shift data into and out of the shift register latches. Independent access and control are also provided for these latches to perform independent scan-in / scan-out functions.

[0029] The electronic device 2 may include a parametric measurement unit (PMU) 7 for performing parametric testing on the device in the socket. Exemplary types of PMUs that may be used include per-pin PMUs (PPMUs). Exemplary parametric tests may include DC (direct current) parametric tests, AC (alternating current) parametric tests, or both AC and DC parametric tests. In parametric testing, the parametric measurement unit forces a current or voltage stimulus signal to a pin on the DUT, measures the response to the stimulus signal, and compares the measurement result to an expected metric.

[0030] In this regard, the response to the excitation signal may include an electrical signal. The electrical signal includes, for example, the information content transmitted - data. The electrical signal also includes associated parameter information, such as signal-to-noise ratio, modulation amplitude, extinction ratio, wavelength, rise time, fall time, conversion rate, or any other characteristic related to the wave or the shape of the wave. The PMU may obtain parameter information from the electrical signal sent in response to the excitation signal and compare the parameter information with one or more expected metrics. If the parameter information is deemed acceptable, the components of the DUT associated with the pins receiving the input signal may pass the test. Otherwise, these components may fail the test. The PMU may also determine whether the information content of the electrical signal sent in response to the excitation signal is as expected. For example, the voltage or current of the electrical signal may be compared with a reference voltage or current. If the information content is deemed acceptable, the components of the DUT associated with the pins receiving the input signal may pass the test. Otherwise, these components may fail the test.

[0031] The electronic device 2 may include one or more processing devices, such as a microprocessor 8. The microprocessor 8 may be configured (e.g., programmed) with instructions to implement structural testing, functional testing, or both structural testing and functional testing on the DUT in the test carrier socket. As described above, structural testing includes performing component-level testing on the device. Functional testing includes performing system-level testing on the device. Exemplary functional testing includes providing an input such as an excitation signal to the DUT, thereby obtaining an output from the DUT based on the input, and determining whether the device has passed the functional test based on the output. For example, the output may be compared to one or more metrics by a microprocessor. If the comparison indicates that the output of the DUT is within an acceptable range, the DUT passes the test. Otherwise, the DUT fails the test. In functional testing, as part of the test process, multiple outputs may be obtained from the same DUT and compared to one or more metrics.

[0032] As described below, the test system may include multiple test carriers, such as Figure 1 Test carrier shown. In some embodiments, two or more different test carriers in the same test system may include different types or numbers of test components to perform structural tests, functional tests, or both structural tests and functional tests on devices held in the test carrier. In some embodiments, two or more different test carriers in the same test system may include the same type or number of test components to perform structural tests, functional tests, or both structural tests and functional tests on devices held in the test carrier. In some embodiments, all test carriers in the same test system may include the same type or number of test components to perform structural tests, functional tests, or both structural tests and functional tests on devices held in the test carrier.

[0033] As mentioned above, Figure 1An exemplary test carrier of includes two test sockets, each test socket being used to accommodate a different DUT. The tests performed on the two DUTs may be the same type of tests or different types of tests. For example, a parameter test may be performed on one DUT while a scan test may be performed on a different DUT. For example, a functional test may be performed on one DUT while a structural test may be performed on a different DUT. The two DUTs may be tested synchronously or asynchronously. For a test carrier configured to hold and test more than two DUTs, the situation is also as described above. For example, the tests performed on all DUTs in the test carrier may be the same type of tests or different types of tests. For example, a parameter test may be performed on one or more DUTs while a scan test may be performed on one or more different DUTs. For example, a functional test may be performed on one or more DUTs while a structural test may be performed on one or more different DUTs. Multiple DUTs may be tested synchronously or asynchronously. In some embodiments, structural tests and functional tests may be performed synchronously or simultaneously on the same DUT. For example, structural tests and functional tests may be performed on the same DUT at the same time, or portions of structural tests and functional tests may overlap in time.

[0034] In some embodiments, the tests performed on the test carrier may be initiated or controlled by a computing system located external to the test carrier but in communication with the test carrier. Exemplary embodiments of such computing systems are described herein. In some embodiments, the tests performed on the test carrier may be initiated or controlled by an electronic device located external to the test carrier but in communication with the test carrier. Exemplary embodiments of such electronic devices include components in a rack that holds the test carrier.

[0035] The tests performed by the test carrier may be independent of or may supplement other tests performed by the test system. For example, as described below, the test system may perform tests on the DUT in the test carrier while the test carrier is in the slot of the test system. The tests may be performed by electronic devices contained in the slot or contained in a test rack that holds the slot. These tests may include structural tests, functional tests, or both structural and functional tests.

[0036] As described above, the tests performed on the test carrier can supplement other tests performed by the test system. For example, the output from the test performed on the test carrier can be provided to the electronic device contained in the slot, the electronic device contained in the test rack holding the slot, or the computing system. The electronic device contained in the slot, the electronic device contained in the test rack holding the slot, or the computing system can analyze these outputs or integrate these outputs into the test results generated by the electronic device contained in the slot, the electronic device contained in the test rack holding the slot, or the computing system, respectively. Similarly, the electronic device contained in the slot, the electronic device contained in the test rack holding the slot, or the computing system can output the test results to the components (electronic device 2) on the test carrier. When performing on-carrier testing of the DUT, the components can use those external test results.

[0037] Figures 2 to 4 shows where the above relative Figure 1 Components of the exemplary test system 10 of the test carrier. In some embodiments, the exemplary test system is modular, so that the test system can adapt to various test requirements. Each unit of the test system is called a slice. Two or more slices can be combined and controlled to operate together (e.g., dependently) or independently to perform test operations.

[0038] See also Figure 2 and Figure 3 , the exemplary test system 10 includes five levels (or zones) per slice; however, any appropriate number of levels may be included in the test system. In an exemplary embodiment, the five levels include an input / output (I / O) level 14, a transfer level 17, a loading level 18, an insertion level 19, and a test level 20. The definition of each level is not intended to be restrictive, and one or more components may perform functions in two or more of the levels. In some embodiments, different levels are configured to operate at different levels of precision. For example, a higher level of precision (e.g., up to the micron level) may be used in the loading level, while a lower level of precision may be used in some or all other levels. System components (such as mechanical components) may be configured to operate within tolerances to achieve lower levels of precision in some levels. By reducing higher precision to the level where it may be needed, the cost and complexity of the test system can be controlled in some cases.

[0039] Computing system 45 communicates with test system 10 to control and coordinate the operation of test system 10. Computing system 45 may include one or more processing devices, examples of which are described herein. Communication between test system 10 and computing system 45 is represented by dashed arrow 46.

[0040] The different stages of the test system can be operated independently and simultaneously. Figure 3In the example of , each stage includes two parallel paths 21 and 22. Each of the parallel paths includes an automated device, such as a robot, that transfers test carriers, equipment, or both between adjacent stages. The operation of different stages independently, simultaneously, and in parallel paths can support higher test throughput and speed than some equivalent test systems.

[0041] exist Figure 2 In the example of , the I / O level 14 includes, but is not limited to, a feeder for receiving trays of tested devices and for providing trays of untested devices to the test system. Figure 2 In the example of , there are three feeders 23, 24, 25 for each slice; however, the system is not limited to use with three feeders. The first feeder 23 is used for trays containing untested devices; the second feeder 24 is used for trays containing tested devices that have not passed the test, and the third feeder 25 is used for trays containing devices that have passed the test. In this example, the feeder 23 is manually loaded with trays of untested devices. A tray in a stack of trays containing untested devices is fed from the feeder 23 to the transport stage 17. After all devices on the tray have been forwarded for testing and the tray is empty, the tray is retracted into the feeder and a new tray containing untested devices is fed to the transport stage. After the device is loaded onto the tray after testing and the tray is full (in some embodiments), the tray is retracted into the feeder, and a new empty tray is fed from the I / O stage to the transport stage from either feeder 24 or 25. In this example, feeders 24 and 25 operate identically for trays containing devices that have passed testing and trays containing devices that have not passed testing.

[0042] In this example, the transfer stage 17 includes, but is not limited to, a transfer robot 30 (e.g., Figure 3 ) and two device shuttles 31, 32 (e.g., Figure 4 ). The two equipment shuttles provide parallel transfer paths into and out of the loading stage 18 described below and support test throughput and redundant reliability in some examples. The transfer robot 30 is controllable to load and unload the test equipment from a tray 34 (e.g., Figure 3 ) picks up the untested device and places the untested device into the device shuttle 31 and / or 32 (e.g., Figure 4 ). The transfer robot 30 is controllable to pick up a test device from the device shuttles 31 and 32 and place the test device into the appropriate one of the trays 35 or 36, depending on whether the particular device passed or failed the test. In some embodiments, the transfer robot 30 can pick up and hold the device by air suction or using a mechanical clamp or other mechanical mechanism.

[0043] In some embodiments, two equipment shuttles can be configured and controlled to operate in parallel, independently, simultaneously and / or in parallel. For example, a transfer robot can provide an equipment shuttle with a device to be tested, while removing the tested device from another equipment shuttle. The two equipment shuttles can be configured to move between the loading level and the transmission level independently, in parallel, simultaneously and / or in parallel. For example, one equipment shuttle can transfer the device to be tested from the transmission level toward the loading level and transfer it to the loading level, while another equipment shuttle transfers the tested device away from the loading level and transfers it to the transmission level. In addition, one equipment shuttle can be stationary while the other equipment shuttle is moving. For example, one equipment shuttle can receive the device to be tested, while the other equipment shuttle transfers the device to the loading level or transfers the device from the loading level.

[0044] In some embodiments, the loading stage 18 includes, but is not limited to, loading robots 48, 49 and areas for loading devices into and unloading devices from a test carrier (such as 50 and 51). In this example, there are two loading robots per slice; however, the test system may include any appropriate number of loading robots. In this example, the loading robots 48, 49 are configured to move in the X dimension and also in the Z dimension to perform pick and place operations on the devices. For example, an untested device is picked up from a shuttle and moved to a test carrier for testing, and a tested device is picked up from a test carrier and moved to a shuttle.

[0045] exist Figure 3 and Figure 4 In the example of FIG, two test arms 77, 78 are shown per slice; however, the test system may include any suitable number of test arms. The test arms may move in all three dimensions (X, Y, and Z), including rotation and flipping, to insert test carriers containing untested devices into test slots in the test rack and extract or remove test carriers containing tested devices from test slots in the test rack. The test carriers containing tested devices are moved back to the loading stage, where the devices are unloaded onto the shuttle by the loading robot.

[0046] Each test arm is configured to hold two test carriers simultaneously, one on each face or side of the test arm. In some embodiments, each side of the test arm (e.g., 77 or 78) includes a test carrier holding receptacle, such as a clamp, for receiving, holding and releasing the test carrier. In one example, the clamp is spring loaded to accept a test carrier containing an untested device from a test carrier shuttle, and release a test carrier containing a tested device onto a (same or different) test carrier shuttle. The test carrier shuttle can be configured to control the opening and closing of each clamp. The test carrier shuttle 82 can move the test carrier between the test arm and the loading position.

[0047] The test rack 80 includes a plurality of test slots. A test carrier 81 is shown in a corresponding slot of the test rack. Each test slot can be configured and controlled to test the device in the test socket on the test carrier, and the test results are reported back to the computing system controlling the test system. The computing system tracks which devices have passed the test, and which devices have failed the test, classifies the devices accordingly and reports the test results. The test slots in the test rack are served by test arms. In some embodiments, during the test, except for a short time during the exchange of the test carrier in the slot, the test slots always remain occupied. For example, a test arm 77 or 78 can reach the test slot while maintaining a test carrier containing an untested device, extract a test carrier containing a tested device from the test slot, and insert the test carrier containing the untested device into the same test slot from which another test carrier has been extracted. Therefore, except for the time between removing and inserting the test carrier, the test slot is still occupied. Each test slot in the test rack can be served in this way to improve the test throughput. An example of how to insert and extract the test carrier is provided below.

[0048] In operation, the test arm 77 or 78 moves (e.g., flips and rotates) to position itself to pick up a test carrier containing an untested device from a test carrier shuttle such as the test carrier shuttle 50, and deposit the test carrier containing the tested device onto the (same or different) test carrier shuttle. In this example, the test carrier rotates (e.g., about 180°) and flips. The rotation is around the longitudinal axis of the test arm, and the flipping includes a rotation in the Y dimension. Due to this movement, the first gripper above the test arm is in a suitable position to pick up the test carrier containing the untested device from the test carrier shuttle. Therefore, the first gripper is controlled to pick up the test carrier containing the untested device from the test carrier shuttle. Then, the test arm rotates at a point above or near the test carrier shuttle along its longitudinal axis to position the test carrier containing the tested device to be deposited onto the test carrier shuttle. The second gripper holding the test carrier on the test arm is opened, so that the test carrier containing the tested device is deposited on the test carrier shuttle. Then, the test carrier shuttle transfers the test carrier containing the tested device to the loading stage.

[0049] Therefore, at this time, the second clamp is empty and the first clamp holds the test carrier containing the untested device. Therefore, the test arm rotates and flips to position the test arm to provide service for the test slot. The test arm can also move vertically to position itself in front of the target test slot to be serviced. This rotation and flipping is relative to the rotation and flipping performed by positioning the test arm above the test carrier shuttle. Therefore, the test arm is positioned to extract or receive the test carrier containing the tested device from the target test slot. The test carrier containing the tested device is received in the second clamp that was previously empty. After receiving the test carrier containing the tested device, the test arm rotates to position the test carrier in the first clamp containing the device that has not been tested to an appropriate position to be inserted into the same test slot. Then, the test carrier containing the device that has not been tested is pushed into the test slot, and the above operation is repeated slot by slot.

[0050] Similar to Figures 2 to 4 An exemplary embodiment of the system is described in U.S. Patent Application No. 15 / 688,112, filed on August 28, 2017, entitled "Calibration Process For An Automated Test System". U.S. Patent Application No. 15 / 688,112 is incorporated herein by reference. For example, the robot and other components of the input / output (I / O) stage 14, the transfer stage 17, the loading stage 18, the insertion stage 19, and the test stage 20 are incorporated into this application by reference from U.S. Patent Application No. 15 / 688,112.

[0051] As mentioned above, Figure 4 An example of a test carrier 51 is shown. Also as described, a test socket and an electronic device are included in the test carrier. In some embodiments, the test socket is device-specific. For example, the test socket may include electrical contacts that are complementary to corresponding electrical contacts on a device under test (DUT). Among other things, a loading robot may be configured to place an untested device into a test socket and remove a test device from the test socket. The test socket is included in the test carrier and includes walls that guide the device under test to a suitable position so that the electrical contacts in the test socket of the test carrier are aligned with the electrical contacts on the device under test. In some embodiments, for example, in the case where the electrical contacts are relatively large, the loading robot may not require a high level of precision, and the test socket wall may play a significant role in guiding the device under test to a suitable position so that the electrical contacts in the test socket of the test carrier are aligned with the electrical contacts on the device under test.

[0052] After the untested device reaches a resting position within the test socket, a socket cover is placed over the test socket to, among other things, apply pressure to the device so that electrical contacts in the device under test mate with complementary electrical contacts in the test carrier. In some embodiments, the socket cover may include a memory storing executable instructions that can be used by the device or by a microprocessor on the carrier during testing. For example, the executable instructions may include operating instructions, test routines, etc. Thus, the socket cover may also include electrical contacts that mate with complementary electrical contacts on the device and / or the test carrier. In some embodiments, the socket cover applies force on the device to achieve various electrical connections; any appropriate amount of force may be applied to achieve the connection. In some embodiments, as described herein, the socket cover may be or include a kinematic base that applies force via a compression spring.

[0053] The above relative Figure 1 Other testing systems of the test carrier include, but are not limited to, the disk drive testing system described in U.S. Patent No. 7,848,106, entitled "Temperature Control Within Disk Drive Testing Systems," published on December 7, 2010. U.S. Patent No. 7,848,106 is incorporated herein by reference. For example, the robot and test slot are incorporated into this application by reference according to U.S. Patent No. 7,848,106.

[0054] The exemplary systems described herein may be implemented and / or controlled using one or more computer systems including hardware or a combination of hardware and software. For example, a system similar to the system described herein may include various controllers and / or processing devices positioned at various points in the system to control the operation of the automation elements. A central computer may coordinate operations in the various controllers or processing devices. The central computer, controllers, and processing devices may execute various software routines to achieve control and coordination of the various automation elements.

[0055] The exemplary systems described herein may be controlled at least in part using one or more computer program products, such as one or more computer programs tangibly embodied in one or more information test carriers (such as one or more non-transitory machine-readable media) for execution by one or more data processing devices or for controlling the operation of the one or more data processing devices, such as programmable processors, computers, multiple computers and / or programmable logic components.

[0056] A computer program may be written in any form of programming language, including compiled or interpreted languages, and may be deployed in any form, including as a stand-alone program or as a module, component, subroutine, or other unit suitable for use in a computing environment. A computer program may be deployed to be executed on one computer or on multiple computers at one site or distributed across multiple sites and interconnected by a network.

[0057] The actions associated with implementing all or part of the test may be performed by one or more programmable processors that execute one or more computer programs to perform some of the functions described herein. All or part of the test may be implemented using dedicated logic circuits such as FPGAs (field programmable gate arrays) and / or ASICs (application specific integrated circuits).

[0058] Processors suitable for computer program execution include, by way of example, both general and special purpose microprocessors, and any one or more processors of any kind of digital computer. Typically, a processor will receive instructions and data from a read-only storage area or a random access storage area or both. Elements of a computer (including a server) include one or more processors for executing instructions and one or more storage area devices for storing instructions and data. Typically, a computer will also include (or be operatively coupled to receive data from it or transmit data to it or both) one or more machine-readable storage media, such as a mass storage device for storing data, for example, a magnetic disk, a magneto-optical disk, or an optical disk. Machine-readable storage media suitable for embodying computer program instructions and data include all forms of non-volatile storage areas, including, by way of example, semiconductor storage area devices, such as EPROM, EEPROM, and flash storage area devices; magnetic disks, such as internal hard disks or removable disks; magneto-optical disks; and CD-ROM and DVD-ROM disks.

[0059] Any "connected" as used herein may imply a direct physical connection, or a wired or wireless connection that may or may not include intervening components but still allows signals to flow between the connected components.

[0060] The elements of different specific implementations described herein can be combined together to form other embodiments that are not specifically illustrated above. Multiple elements can be excluded from the structure described herein without adversely affecting its operation. In addition, each individual element can be combined into one or more single elements to carry out the function described herein.

Claims

1. A testing system comprising: a test carrier for receiving a device to be tested, the test carrier comprising a test component for performing at least a structural test on the device on the test carrier; and a slot in a test rack, the test rack comprising a plurality of slots configured to receive the test carrier from a test arm, the slots configured to connect to the test carrier to enable the test carrier to communicate with a system that is part of the test system or external to the test system, Wherein at least the structural test is independent of functional testing performed on the device by components not on the test carrier while the test carrier is within the slot, wherein the test system is capable of performing at least the structural test and the functional test simultaneously.

2. The test system of claim 1, wherein the structural test is used to perform component level testing on the device. The test system of claim 1 , wherein the structural test comprises a parametric test. The test system of claim 1 , wherein the structural test comprises a scan test.

5. The test system of claim 4, wherein the functional test is used to perform system level testing on the device.

6. The test system of claim 4, wherein the functional test comprises providing an input to the device, obtaining an output based on the input, and determining whether the device has passed the functional test based on the output.

7. The test system according to claim 1, wherein the test carrier comprises A printed circuit board (PCB) for holding test electronics including said test components for performing at least said structural test on said device.

8. The test system according to claim 1, further comprising: A robot is provided for moving the test carrier into and out of the slot.

9. The test system of claim 1, wherein the test carrier is a first test carrier, the device is a first device, and the slot is a first slot; and The test system further comprises: one or more additional test carriers, each of the one or more additional test carriers being configured to receive a different device to be tested, each additional test carrier comprising a test component for performing at least a structural test on the different device; and One or more additional slots, each of the one or more additional slots is used to receive a target test carrier among the one or more additional test carriers, and each slot is configured to enable the target test carrier to communicate with a system that is part of the test system or located outside the test system.

10. The test system of claim 9, wherein each test carrier includes test components of the same type.

11. The test system of claim 9, wherein at least some of the additional test carriers include different types of test components configured to perform different types of structural tests, wherein the different types of structural tests are performed simultaneously with the functional tests.

12. The test system of claim 11, wherein a parametric test and a scan test are performed simultaneously with the functional test.

13. The test system of claim 1, wherein the device is a first device; wherein the test carrier comprises a first receptacle for receiving the first device and a second receptacle for receiving a second device to be tested; and The testing component is further configured to test the second device.

14. The test system of claim 13, wherein the test component is configured to perform the same type of test on the first device and the second device.

15. The testing system of claim 13, wherein the testing component is configured to perform different types of tests on the first device and the second device.

16. The test system of claim 15, wherein the different types of tests are performed asynchronously.

17. The test system of claim 1, wherein the test component includes a memory that stores data representing a test stimulus vector for the structural test.

18. The test system of claim 1, wherein the test component comprises one or more processing devices configured to execute instructions to perform the structural test.

19. The test system of claim 1, wherein the test component includes a memory that stores test results based on the execution of the structural test.

20. The test system of claim 19, wherein the test component includes an interface for enabling exchange of communications with the system, the system including a computing system, the communications including instructions for executing tests originating from the computing system, the test results originating from the test carrier.

21. The test system of claim 1, wherein the test component comprises: a memory storing instructions including one or more test programs; and One or more processing devices, the one or more processing devices being configured to execute the instructions to perform the structural test on the device, the instructions defining a test flow.

22. The testing system of claim 21, wherein the system comprises a computing system; and The test carrier is configured to receive a command from the computing system for changing the test flow.

23. A method for testing a device, comprising: The device is tested using a test system according to any one of claims 1 to 22.

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