TOF Camera Module, Its Projection Module and Electronic Device

Abstract

The present invention provides a TOF camera module, a projection module thereof, and an electronic device. The TOF camera module includes a projection module and a receiving module. The projection unit of the projection module is controlled by a driving chip to project a detection light. The receiving module is disposed adjacent to the projection module. The receiving module receives the reflected light of the detection light and obtains a depth information of an object to be illuminated based on the reflected light. The receiving module includes a transmitting circuit board, a bracket, an optical element, at least one projection unit, and at least one driving chip. The driving chip is conductively connected to the transmitting circuit board. The driving chip controls the projection unit through the transmitting circuit board. The driving chip and the projection unit are located on the same side of the transmitting circuit board.

Description

Technical Field

[0001] The present invention relates to the technical field of camera modules, and in particular, to a TOF camera module, a projection module thereof, and an electronic device. Background Art

[0002] With the gradual improvement of biometric technologies, such as face recognition technology, it is being widely applied to various mobile terminals (mobile phones, tablets) to realize various application developments based on biometric features, such as password unlocking, quick payment, etc. In face recognition technology, a depth information camera module based on the Time of Flight (TOF) principle, that is, a TOF camera module, is one of the relatively popular products.

[0003] A TOF camera module refers to a module that uses a sensor to emit modulated light, and then after the light is reflected by an object, the sensor calculates the time difference or phase difference between the emitted light and the light received from the object reflected by the object to obtain depth information about the object. Existing TOF camera modules generally include a projection module, a receiving module, and a circuit board, wherein the projection module and the receiving module are respectively directly mounted and electrically connected to the circuit board.

[0004] Due to the current demand for thin, light, and full-screen development trends in electronic devices such as smart phones and tablets, the design of camera modules also tends to be miniaturized. The existing TOF camera modules also have at least one of the following defects: First, the waveform of the projection optical signal projected by the projection module of the TOF camera module is poor. The main reason affecting the waveform of the projection optical signal projected by the projection module is the wiring distance between the driving chip and the projection unit of the projection module. If the wiring distance between the driving chip and the projection unit is farther, the pulse waveform formed by the driving chip controlling the projection unit to project is similar to a mountain shape.

[0005] Due to the relatively large size of the driving chip itself, the driving chip of the TOF camera module in the prior art is disposed in the receiving module or stacked below the projection module to facilitate reducing the size of the TOF camera module in the XY direction (length and width). However, the routing distance between the driving chip and the projection unit of the existing TOF camera module is relatively long, resulting in a poor waveform of the projected optical signal. Secondly, when the electronic device is assembled, the TOF camera module is usually stacked on top of the circuit board of the electronic device by welding. And since the driving chip is usually stacked on the back of the projection module, the thickness of the TOF camera module in the prior art cannot be further reduced, which is not conducive to the thinning of the electronic device. On the other hand, the heat dissipation performance of the TOF camera module in the prior art is poor, and an excessive temperature of the projection module of the TOF camera module will affect the optical power of the projection unit or the service life of the TOF camera module.

[0006] The transmitting end and the receiving end of the TOF camera module in the prior art are assembled into one body and then assembled to the main board of the electronic device. Among them, the transmitting end of the TOF camera module cannot be used independently to emit an optical signal with a specific waveform. Because the transmitting end of the TOF camera module in the prior art is controlled by the receiving end to emit the optical signal with a preset waveform, that is, the driving chip controlling the transmitting end is encapsulated in the receiving end. The transmitting end of the TOF camera module in the prior art is not a module that can exist and work independently, that is, the transmitting end in the prior art needs to work under the control of the receiving end. Therefore, the transmitting end of the TOF camera module in the prior art cannot exist independently. Summary of the Invention

[0007] One main advantage of the present invention is to provide a TOF camera module, its projection module and an electronic device, wherein by reducing the routing distance between the driving chip of a projection module of the TOF camera module and the projection unit, the parasitic inductance of the projection module is reduced, the pulse waveform quality of the optical signal projected by the projection unit is improved, and the signal-to-noise ratio is increased.

[0008] Another advantage of the present invention is to provide a transmitting end module with complete functions. The transmitting end module includes a driving IC encapsulated inside. The bottom of the transmitting end module has solder joints, and can be directly conducted with the terminal main board through the bottom solder joints, that is, the transmitting end module can work independently of the receiving end module.

[0009] Another advantage of the present invention is to provide a TOF camera module, its projection module and an electronic device, wherein the driving chip and the projection unit of the projection module are attached to the same side of a circuit board of the projection module, which is beneficial to shortening the routing distance between the driving chip and the projection unit.

[0010] Another advantage of the present invention is to provide a TOF camera module, its projection module and an electronic device, wherein the circuit board of the projection module is a ceramic substrate, which is beneficial to improving the heat dissipation performance of the projection module.

[0011] Another advantage of the present invention is to provide a TOF camera module, its projection module and an electronic device, wherein the bracket of the projection module is a heat dissipation bracket, so as to improve the heat dissipation performance of the projection module through the bracket.

[0012] Another advantage of the present invention is to provide a TOF camera module, its projection module and an electronic device, wherein the bracket of the projection module is integrally formed on the circuit board, and the driving chip and some other electronic components are wrapped by the bracket to reduce the XY (length and width) size of the projection module.

[0013] Another advantage of the present invention is to provide a TOF camera module, its projection module and an electronic device, wherein the bracket of the projection module is integrally formed on the circuit board, which is beneficial to improving the reliability and overall strength of the projection module.

[0014] Another advantage of the present invention is to provide a TOF camera module, its projection module and an electronic device, wherein the bracket of the projection module is integrally formed on the circuit board, reducing the manufacturing and processing technology of the projection module and improving the production efficiency.

[0015] Another advantage of the present invention is to provide a TOF camera module, its projection module and an electronic device, wherein the bracket of the projection module is integrally formed on the circuit board, and the driving chip is wrapped by the bracket so that the bracket protects the driving chip.

[0016] Another advantage of the present invention is to provide a TOF camera module, its projection module and an electronic device, wherein the bracket of the projection module is integrally formed on the circuit board, the driving chip is wrapped by the bracket, and the bracket conducts the heat generated by the driving chip to improve the heat dissipation performance of the projection module.

[0017] Another advantage of the present invention is to provide a TOF camera module, its projection module and an electronic device, wherein the projection module and the receiving module of the TOF camera module can be independently arranged on the main board of the electronic device, and the TOF camera module can be assembled based on the design requirements of the electronic device, which is beneficial to improving the use performance of the TOF camera module.

[0018] Another advantage of the present invention is to provide a TOF camera module, its projection module and an electronic device, wherein the driving chip and the projection unit of the projection module are placed on the same side to reduce the overall thickness of the projection module, which is beneficial to the thinning of the electronic device.

[0019] Another advantage of the present invention is to provide a TOF camera module, its projection module and an electronic device, wherein the main board of the electronic device is provided with a mounting groove (hole or half-hole) corresponding to the TOF camera module, and the receiving module of the TOF camera module is correspondingly embedded in the mounting groove (hole or half-hole) of the main board, which is beneficial to reducing the overall thickness of the electronic device. Other advantages and features of the present invention are fully embodied by the following detailed description and can be achieved by the combination of the means and devices specifically pointed out in the appended claims.

[0020] According to one aspect of the present invention, a projection module of the present invention capable of achieving the foregoing and other objects and advantages includes:

[0021] A transmitting circuit board;

[0022] A bracket, wherein the bracket is disposed on the transmitting circuit board;

[0023] An optical element, wherein the optical element is attached to the bracket, and an accommodation space is formed above the transmitting circuit board by the optical element and the bracket;

[0024] At least one projection unit, wherein the projection unit is disposed in the accommodation space, and the projection unit is conductively attached to the transmitting circuit board; and

[0025] At least one driving chip, wherein the driving chip is conductively connected to the transmitting circuit board, and the driving chip controls the projection unit through the transmitting circuit board, wherein the driving chip and the projection unit are located on the same side of the transmitting circuit board.

[0026] According to an embodiment of the present invention, the transmitting circuit board has an upper end face and a lower end face, wherein the driving chip is attached to the upper end face of the transmitting circuit board in a manner adjacent to the projection unit.

[0027] According to an embodiment of the present invention, the projection module further includes a connection layer, and the bracket is connected to the upper end face of the transmitting circuit board by the connection layer.

[0028] According to an embodiment of the present invention, the connection layer is selected from the group consisting of an adhesive layer and a soldering layer.

[0029] According to an embodiment of the present invention, the bracket contacts the driving chip in a heat-conductive manner, and conducts the heat generated by the driving chip through the bracket.

[0030] According to an embodiment of the present invention, the bracket has a receiving cavity, the driving chip is placed in the receiving cavity, and the bracket covers the upper surface of the driving chip in a heat-contact manner.

[0031] According to an embodiment of the present invention, the bracket is selected from: a bracket combination composed of a ceramic sintered bracket and a molded bracket.

[0032] According to an embodiment of the present invention, the bracket is integrally formed on the upper end surface of the emission circuit board through a molding process.

[0033] According to an embodiment of the present invention, the driving chip is covered by the bracket, and the heat generated by the driving chip is conducted through the bracket.

[0034] According to an embodiment of the present invention, the emission circuit board includes:

[0035] An emission circuit substrate;

[0036] A plurality of upper solder joints, wherein the upper solder joints are arranged at the upper end of the emission circuit substrate;

[0037] A plurality of lower solder joints, wherein the lower solder joints are arranged at the lower end of the emission circuit substrate; and

[0038] A plurality of conduction circuits, wherein the conduction circuits electrically connect each of the upper solder joints and each of the lower solder joints, wherein the driving chip is conductively connected through the upper solder joints and the conduction circuits, and each of the lower solder joints is electrically connected to the upper solder joints through the conduction circuits.

[0039] According to an embodiment of the present invention, the projection module further includes a flexible board and a connector, wherein the lower solder joints of the emission circuit board are conductively connected to the flexible board, and the flexible board is conductively connected to the connector through the flexible board.

[0040] According to an embodiment of the present invention, the projection module further includes a flexible board, wherein one end of the flexible board is conductively connected to the emission circuit board.

[0041] According to an embodiment of the present invention, the bracket includes a bracket body and further has an installation groove and at least one air escape groove, wherein the installation groove is formed at the upper end of the bracket body, the optical element is arranged in the installation groove, the air escape groove communicates the accommodation space with the external environment, and the air pressure between the accommodation space and the external environment is balanced through the air escape groove.

[0042] According to an embodiment of the present invention, the bracket includes a bracket body and further has at least one glue - painting area. A cured glue layer is formed by curing glue between the glue - painting area and the optical element, and an air - escape gap is formed at intervals. The air - escape gap communicates the accommodation space with the external environment, and the air pressure between the accommodation space and the external environment is balanced by the air - escape gap.

[0043] According to an embodiment of the present invention, the projection module further includes at least one electronic component, and the electronic component is conductively connected to the emission circuit board.

[0044] According to an embodiment of the present invention, the electronic component includes a photodiode for monitoring the light change in the projection module. The photodiode is conductively connected to the driving chip, so that the driving chip controls the working state of the projection unit based on the detection information of the photodiode.

[0045] According to an embodiment of the present invention, the electronic component includes a negative temperature coefficient device, and the negative temperature coefficient device is used for monitoring the temperature of the projection unit. The negative temperature coefficient device is conductively connected to the driving chip through the emission circuit board.

[0046] According to an embodiment of the present invention, the emission circuit substrate of the emission circuit board is selected from a ceramic substrate and a PCB board.

[0047] According to another aspect of the present invention, the present invention further provides a TOF camera module, including:

[0048] The projection module as described in any one of the above, wherein the projection unit of the projection module is controlled by the driving chip to project a detection light; and

[0049] A receiving module, wherein the receiving module is disposed adjacent to the projection module. The receiving module receives the reflected light of the detection light and obtains a depth information of the object to be illuminated based on the reflected light.

[0050] According to an embodiment of the present invention, the projection module and the receiving module are independently disposed.

[0051] According to an embodiment of the present invention, the TOF camera module includes a lens assembly, a photosensitive element, and at least one receiving circuit board. The photosensitive element is attached to the receiving circuit board, and the lens assembly is disposed above the receiving circuit board based on the photosensitive path of the photosensitive element.

[0052] According to an embodiment of the present invention, the receiving circuit board includes a circuit board receiving end and a circuit board transmitting end integrally extending from the circuit board receiving end, wherein the projection module is disposed above the circuit board transmitting end of the receiving circuit board, and the transmitting circuit board of the projection module is conductively connected to the receiving circuit board.

[0053] According to an embodiment of the present invention, the TOF camera module further includes at least one flexible circuit board, wherein the flexible circuit board conductively connects the transmitting circuit board of the projection module to the circuit board transmitting end of the receiving circuit board.

[0054] According to an embodiment of the present invention, the TOF camera module further includes at least one base bracket, wherein the base bracket is stacked on the circuit board transmitting end of the receiving circuit board, and the projection module is supported above the base bracket, and the height of the projection module is increased by the base bracket.

[0055] According to an embodiment of the present invention, the TOF camera module further includes at least one electronic component unit, the electronic component unit is disposed on the circuit board transmitting end, wherein the base bracket is integrally formed on the circuit board transmitting end, and the electronic component unit is wrapped by the base bracket.

[0056] According to an embodiment of the present invention, the TOF camera module further includes at least one electronic component unit, the electronic component unit is disposed on the circuit board transmitting end, the base bracket includes a base bracket body and further has at least one accommodation groove, wherein the accommodation groove is formed at the lower end of the base bracket body, and the base bracket body is attached above the circuit board transmitting end, and the electronic component unit is wrapped by the base bracket.

[0057] According to an embodiment of the present invention, the TOF camera module further includes at least one base bracket, wherein the base bracket is conductively disposed on the circuit board transmitting end of the receiving circuit board, and the projection module is stacked above the base bracket, and the height of the projection module is increased by the base bracket.

[0058] According to an embodiment of the present invention, the base bracket includes a base bracket body and at least one bracket conduction circuit disposed on the base bracket body, wherein the bracket conduction circuit electrically connects the transmitting circuit board of the projection module to the circuit board receiving end.

[0059] According to an embodiment of the present invention, the transmitting circuit board of the projection module is integrally formed on the circuit board receiving end of the receiving circuit board, and the height of the projection module is increased by the base bracket.

[0060] According to an embodiment of the present invention, the base bracket is selected from: a ceramic bracket sintered from ceramics and a molded bracket composed of a molded base formed by integral molding.

[0061] According to an embodiment of the present invention, the TOF camera module further includes at least one fixing bracket, wherein the receiving module is arranged on the fixing bracket in a manner that the optical axis can be adjusted, and the receiving module is fixed by the fixing bracket.

[0062] According to an embodiment of the present invention, the fixing bracket includes a receiving-end fixing bracket and a transmitting-end fixing bracket, wherein the receiving module is arranged on the receiving-end fixing bracket, the projection module is arranged on the transmitting-end fixing bracket, and the distance between the projection module and the receiving module is maintained by the fixing bracket.

[0063] According to another aspect of the present invention, the present invention further provides an electronic device, including:

[0064] An electronic device host;

[0065] An electronic device main board, wherein the electronic device main board is arranged in the electronic device host; and

[0066] At least one TOF camera module, the TOF camera module is conductively arranged on the electronic device main board, and the TOF camera module includes:

[0067] The projection module as described in any one of the above, wherein the projection unit of the projection module is controlled by the driving chip to project a detection light; and

[0068] A receiving module, wherein the receiving module is arranged adjacent to the projection module, the receiving module receives the reflected light of the detection light, and obtains a depth information of the object being illuminated based on the reflected light.

[0069] According to an embodiment of the present invention, the lower solder joint of the transmitting module is conductively connected to the transmitting circuit board on the electronic device main board, and the transmitting module is fixed on the electronic device main board.

[0070] According to an embodiment of the present invention, the projection module and the receiving module are arranged independently of each other.

[0071] According to an embodiment of the present invention, the electronic device main board includes a main board body, a pad area and a receiving-end installation groove arranged on the main board body, wherein the projection module is attached to the pad area of the electronic device main board, the receiving module is arranged in the receiving-end installation groove, and the projection module and the receiving module are respectively conductively connected to the main board body.

[0072] According to an embodiment of the present invention, the receiving module is installed in a sunken manner from one surface of the main board body into the receiving end installation slot.

[0073] According to an embodiment of the present invention, the electronic device main board includes a main board body, a pad area provided on the main board body, and a receiving end installation hole. The projection module is attached to the pad area of the electronic device main board, the receiving module is disposed in the receiving end installation hole, and the projection module and the receiving module are respectively conductively connected to the main board body.

[0074] In another aspect of the present invention, the present invention further provides an electronic device, including:

[0075] An electronic device host;

[0076] An electronic device main board, wherein the electronic device main board is disposed in the electronic device host; and

[0077] The TOF camera module as described in any one of the above, wherein it is conductively disposed on the electronic device main board.

[0078] According to an embodiment of the present invention, the electronic device main board includes a main board body, a pad area provided on the main board body, and a receiving end installation area. The projection module of the TOF camera module is attached to the pad area, the receiving module is attached to the receiving end installation area, and the receiving module is conductively connected to the main board body.

[0079] Through the understanding of the subsequent description and the drawings, the further objects and advantages of the present invention will be fully embodied.

[0080] These and other objects, features, and advantages of the present invention are fully embodied through the following detailed description, drawings, and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0081] Figure 1 is an overall schematic diagram of an electronic device according to a preferred embodiment of the present invention.

[0082] Figure 2A is an overall schematic diagram of a TOF camera module of the electronic device according to the above preferred embodiment of the present invention.

[0083] Figure 2B is an overall cross-sectional view of a TOF camera module of the electronic device according to the above preferred embodiment of the present invention.

[0084] Figure 3AIt is a cross-sectional view of a projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.

[0085] Figure 3B It is a top view of a projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.

[0086] Figure 3C It is a cross-sectional view of a projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.

[0087] Figure 3D It is a top view of an alternative embodiment of a projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.

[0088] Figure 3E It is a cross-sectional view of a projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.

[0089] Figure 3F It is a cross-sectional view of a projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.

[0090] Figure 3G It is a cross-sectional view of a projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.

[0091] Figure 3H It is a cross-sectional view of a projection module of the TOF camera module according to the variant embodiment of the above-mentioned preferred embodiment of the present invention.

[0092] Figure 4A It is an overall schematic diagram of a projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.

[0093] Figure 4B It is a schematic diagram of an air escape structure of a projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention. Figure 5A It is a schematic diagram of glue application of the projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.

[0094] Figure 5B It is a schematic diagram of glue application of the projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.

[0095] Figure 5C It is a schematic diagram of glue application of the projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.

[0096] Figure 6 It is a pulse waveform diagram projected by the projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.

[0097] Figure 7A It is a cross-sectional view of a projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.

[0098] Figure 7B It is a cross-sectional view of a projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.

[0099] Figure 7C It is a cross-sectional view of a projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.

[0100] Figure 7D It is a cross-sectional view of a projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.

[0101] Figure 7E It is a cross-sectional view of a projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.

[0102] Figure 7F It is a cross-sectional view of a projection module of the TOF camera module according to the above-mentioned preferred embodiment of the present invention.

[0103] Figure 8 It is an overall schematic diagram of a TOF camera module of the electronic device according to the above-mentioned preferred embodiment of the present invention.

[0104] Figure 9A It is a cross-sectional view of a TOF camera module of the electronic device according to the above-mentioned preferred embodiment of the present invention.

[0105] Figure 9B It is a cross-sectional view of a TOF camera module of the electronic device according to the above-mentioned preferred embodiment of the present invention.

[0106] Figure 9C It is a cross-sectional view of a TOF camera module of the electronic device according to the above-mentioned preferred embodiment of the present invention.

[0107] Figure 9D It is a cross-sectional view of a TOF camera module of the electronic device according to the above-mentioned preferred embodiment of the present invention.

[0108] Figure 10A It is an installation schematic diagram of the TOF camera module of the electronic device according to the above-mentioned preferred embodiment of the present invention.

[0109] Figure 10B It is a cross-sectional schematic diagram of the installation of the TOF camera module of the electronic device according to the above-mentioned preferred embodiment of the present invention.

[0110] Figure 10CIt is a schematic cross-sectional view of the installation of the TOF camera module of the electronic device according to the above-mentioned preferred embodiment of the present invention.

[0111] Figure 11A It is a schematic view of the installation of the TOF camera module of the electronic device according to the above-mentioned preferred embodiment of the present invention.

[0112] Figure 11B It is a schematic cross-sectional view of the installation of the TOF camera module of the electronic device according to the above-mentioned preferred embodiment of the present invention.

[0113] Figure 11C It is a schematic cross-sectional view of the installation of the TOF camera module of the electronic device according to the above-mentioned preferred embodiment of the present invention.

[0114] Figure 12A It is a schematic view of the installation of a TOF camera module of the electronic device according to the above-mentioned preferred embodiment of the present invention.

[0115] Figure 12B It is a schematic cross-sectional view of the installation of the TOF camera module of the electronic device according to the above-mentioned preferred embodiment of the present invention.

[0116] Figure 13 It is a schematic cross-sectional view of the installation of the TOF camera module of the electronic device according to the above-mentioned preferred embodiment of the present invention. Detailed implementation manners

[0117] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles defined in the following description of the present invention can be applied to other implementation manners, variant solutions, improvement solutions, equivalent solutions, and other technical solutions that do not depart from the spirit and scope of the present invention.

[0118] Those skilled in the art should understand that in the disclosure of the present invention, the orientation or positional relationships indicated by the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings. These are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the above terms should not be construed as limitations on the present invention.

[0119] It can be understood that the term "a" should be understood as "at least one" or "one or more". That is, in one embodiment, the number of an element can be one, while in other embodiments, the number of the element can be multiple. The term "a" should not be understood as a limitation on the quantity.

[0120] Referring to the accompanying drawings of the present invention Figure 1 as shown, an electronic device according to a preferred embodiment of the present invention is illustrated in the following description. The electronic device includes an electronic device main body 100, an electronic device main board 200, and at least one TOF camera module 300. The TOF camera module 300 is disposed on the electronic device main body 100 and is conductively connected to the electronic device main board 200. The TOF camera module 300 is supported by the electronic device main board 200 of the electronic device to perform a shooting operation. It can be understood that other types of camera modules, such as a wide-angle camera module, a telephoto camera module, etc., can also be mounted on the electronic device main body 100 of the electronic device. Exemplarily, the electronic device can be, but is not limited to, a smart phone, a tablet computer, or other types of devices with a shooting function.

[0121] As Figures 2A to 7F shown, the TOF camera module 300 of the electronic device includes a projection module 10 and a receiving module 20. The receiving module emits light based on a control signal of the electronic device main body 100. When the light emitted by the projection module 10 irradiates an object, the reflected light of the light is reflected by the object to the receiving module 20. A depth information about the irradiated object is obtained based on difference information such as a time difference or a phase difference between the light emitted by the projection module 10 and the reflected light received by the receiving module 20.

[0122] The projection module 10 and the receiving module 20 of the TOF camera module 300 are electrically connected to the main board 200 of the electronic device, and the host 100 of the electronic device controls the working state of the TOF camera module 300 through the main board 200 of the electronic device. It is worth mentioning that, in this preferred embodiment of the present invention, the projection module 10 and the receiving module 20 of the TOF camera module 300 can be independently installed on the main board 200 of the electronic device, that is, the projection module 10 and the receiving module 20 of the TOF camera module 300 can be separately assembled to the main board 200 of the electronic device, and the projection module 10 and the receiving module 20 are respectively conductively connected to the main board 200 of the electronic device. It can be understood that the projection module 10 and the receiving module 20 of the TOF camera module 300 are independently installed from each other. Therefore, the projection module 10 and the receiving module 20 of the TOF camera module 300 can be installed based on the design requirements of the electronic device. That is to say, the projection module 10 and the receiving module 20 are separately assembled based on the assembly requirements and design requirements, that is, the projection module 10 and the receiving module 20 are assembled on the main board 200 of the electronic device into the TOF camera module 300, improving the applicability of the TOF camera module 300.

[0123] Specifically, the receiving module 20 includes a lens assembly 21, a photosensitive element 22, and at least one receiving circuit board 23. The lens assembly 21 is disposed above the photosensitive element 22, and the lens assembly 21 provides a light-sensing path for the photosensitive element 22, so that external light is projected onto the photosensitive element 22 through the light-sensing path. The photosensitive element 22 converts the optical signal of the external light into an electrical signal corresponding to the optical signal, that is, photoelectric conversion. The photosensitive element 22 is disposed on a surface of the receiving circuit board 23, and the photosensitive element 22 is conductively connected to the receiving circuit board 23. The receiving circuit board 23 supports the photosensitive element 22 to work and receives the photoelectric signal of the photosensitive element 22.

[0124] The lens assembly 21 includes at least one optical lens 211, a lens holder 212, a base 213, and at least one filter element 214 disposed on the base 213. The optical lens 211 is supported by the lens holder 212 above the base 213 based on the light-sensitive path of the receiving module 20. Light is transmitted through the optical lens 211 to the filter element 214 for the filter element 214 to filter the light and remove stray light that affects imaging. Those skilled in the art can understand that in this preferred embodiment of the present invention, the receiving module 20 may further include other components, such as a bracket for supporting and fixing the lens assembly, or electronic components for supporting the operation of the receiving module 20, etc.

[0125] As Figure 2A and Figure 2B shown, the receiving module 20 of the TOF camera module 300 further includes a receiving-end connector 24. One end of the receiving-end connector 24 is electrically connected to the receiving circuit board 23 of the receiving module 20, and the receiving circuit board 23 of the receiving module 20 is conductively connected to the main board 200 of the electronic device through the receiving-end connector 24.

[0126] The projection module 10 includes a bracket 11, a transmitting circuit board 12, at least one optical element 13, at least one projection unit 14, and at least one driving chip 15. The projection unit 14 and the driving chip 15 are disposed on the same side of the transmitting circuit board 12. The bracket 11 is disposed on the transmitting circuit board 12. The optical element 13 is attached above the bracket 11 and is located in the projection path of the projection module 10 to diffract (or expand, shape, etc.) the optical signal projected by the projection unit 14 through the optical element 13. The bracket 11, the transmitting circuit board 12, and the optical element 13 of the projection module 10 are sealed to form an accommodation space 101, and the projection unit 14 and the driving chip 15 are built into the enclosed space 101.

[0127] The projection unit 14 and the driving chip 15 are conductively electrically connected to the transmitting circuit board 12, and the driving chip 15 controls the projection unit 14 to project an optical signal. Specifically, the driving chip 15 controls the pulse waveform of the optical signal projected by the projection unit 14 through the transmitting circuit board 12. Preferably, in this preferred embodiment of the present invention, the driving chip 15 is disposed adjacent to the projection unit 14 so that the driving chip 15 can control the projection unit 14 to project an optical signal with a required waveform.

[0128] It is worth mentioning that the projection unit 14 and the driving chip 15 are attached to the same side of the emission circuit board 12, and the driving chip 15 is disposed adjacent to the projection unit 14, so that the wiring distance between the driving chip 15 and the projection unit 14 is shortened, the parasitic inductance of the projection unit 14 is reduced, the waveform quality of the optical signal projected by the projection unit 14 is improved, and the signal-to-noise ratio of the projection module 10 is improved. Preferably, in this preferred embodiment of the present invention, the spacing distance between the driving chip 15 and the projection unit 14 is less than or equal to 0.5 mm.

[0129] The emission circuit board 12 of the projection module 10 has an upper end face (front face or upper surface) 121 and a lower end face (back face or lower surface) 122, wherein the projection unit 14 and the driving chip 15 are attached to the upper end face 121 of the emission circuit board 12, and the projection unit 14 is electrically connected to the emission circuit board 12 from the upper end face 121 by the driving chip 12. The bracket 11 is disposed on the upper end face 121 of the emission circuit board 12.

[0130] As Figure 3A shown, the bracket 11 is attached to the upper end face 121 of the emission circuit board 12, and the bracket 11 supports the optical element 13 on the projection path of the projection module 10. The bracket 11 is attached to the upper end face 121 of the emission circuit board 12 by an adhesive method. Correspondingly, the projection module 10 further includes a connection layer 16, wherein the connection layer 16 is disposed on the upper end face 121 of the emission circuit board 12, and the bracket 11 is attached to the upper side of the upper end face 121 in a pasting manner on the connection layer 16. Preferably, in this preferred embodiment of the present invention, the connection layer 16 can be, but is not limited to, a heat-conducting adhesive layer, a soldering layer, that is, an adhesive with high heat dissipation performance, so as to improve the heat dissipation performance of the projection module 10. Preferably, in this preferred embodiment of the present invention, the connection layer 16 can be, but is not limited to, an adhesive layer, a soldering layer and other materials with a connection and installation function.

[0131] It is worth mentioning that the bracket 11 can be made by processes such as injection molding or sintering, that is, the bracket 11 can be integrally formed by processes such as injection molding or sintering. Preferably, in this preferred embodiment of the present invention, the bracket 11 is a ceramic bracket device sintered by ceramics. More preferably, the bracket is made of aluminum nitride ceramic (Aluminum nitride, ALN) material. Since the thermal conductivity of the aluminum nitride ceramic material is better than that of other ceramic materials and the coefficient of thermal expansion (CTE) is smaller, it has good heat dissipation performance, which is beneficial to the working reliability of the TOF module.

[0132] The bracket 11 of the projection module 10 includes a bracket body 111 and further has a bearing surface 112 and a mounting groove 113 formed above the bearing surface 112. The optical element 13 is attached to the bearing surface 112 of the bracket 11, and the optical element 13 is supported in the mounting groove 113 by the bracket body 111. Preferably, the optical element 13 is adhesively attached to the mounting groove 113 at the upper end of the bracket 11, that is, the optical element 13 is pasted above the bearing surface 112 of the bracket 11.

[0133] The projection module 10 further includes a plurality of electronic components 17. The plurality of electronic components 17 are electrically connected to the emission circuit board 12 in a conductible manner. At least one of the electronic components 17 is conductibly connected to the projection unit 14 of the projection module 10 through the emission circuit board 12, and at least one of the electronic components 17 is conductibly connected to the driving chip 15 through the emission circuit board 12. The electronic components 17 are used to support the operation of the projection unit 14 and / or the driving chip 15 of the projection module 10. In this preferred embodiment of the present invention, the electronic components 17 are conductibly arranged on the upper end surface 121 of the emission circuit board 12, and the electronic components 17 are built in the enclosed space 101.

[0134] The electronic component 17 may be a passive electronic device such as a resistor, a capacitor, an inductor, etc., and the electronic component 17 may also be other types of electronic devices that cooperate with the driving chip 15. The electronic component 17 can reduce the parasitic inductance between the driving chip 15 and the projection unit 14 to ensure that the waveform of the optical signal emitted by the projection module 10 is close to an ideal square wave. It can be understood that in this preferred embodiment of the present invention, the electronic component 17 can also be installed at other positions of the TOF camera module 300, such as the receiving circuit board 23 of the receiving module 20; or the electronic component 17 is installed on the electronic device main board 200 of the electronic device to further reduce the overall structure of the TOF camera module 300, which is beneficial to reducing the overall volume of the electronic device. That is to say, although the electronic component 17 can improve the pulse waveform of the optical signal projected by the projection unit 14, the electronic component 17 does not need to be disposed on the transmitting circuit board 12. Based on the design requirements of the TOF camera module 300 or the overall design requirements of the electronic device, the electronic component 17 is installed on the receiving circuit board 23 of the receiving module 20, wherein the electronic component 17 supports the operation of the projection unit 14 and / or the driving chip 15 through the conduction between the receiving circuit board 23 and the transmitting circuit board 12; or the electronic component 17 is installed on the electronic device main board 200, wherein the electronic component 17 supports the operation of the projection unit 14 and / or the driving chip 15 through the electronic device main board 200.

[0135] As Figure 2A and Figure 2B shown, the projection module 10 and the receiving module 20 of the TOF camera module 300 are conductively connected to the electronic device main board 200 through their respective connectors. The TOF camera module 300 further includes at least one fixing bracket 30, wherein the receiving module 20 is adjustably disposed on the fixing bracket 30, and the receiving module 20 is fixed to the electronic device main board 200 by means of the fixing bracket 30. After the receiving module 20 is conductively disposed on the electronic device main board 200, the position of the receiving module 20 on the fixing bracket 30 is adjusted so that the optical axis of the receiving end of the receiving module 20 is adapted to the optical axis of the transmitting end of the projection module 10, so that the TOF camera module 300 has good shooting performance.

[0136] Optionally, in other embodiments of the present invention, the projection module 10 and / or the receiving module 20 of the TOF camera module 300 may also be conductively connected to the motherboard 200 of the electronic device through other conduction methods, such as welding conduction. The projection module 10 and / or the receiving module 20 are connected to the motherboard 200 of the electronic device by welding. It can be understood that in this preferred embodiment of the present invention, the conduction connection method of the TOF camera module 300 is only exemplary here, rather than restrictive.

[0137] It is worth mentioning that in this preferred embodiment of the present invention, the fixing bracket 30 can be used to adjustably fix and support the projection module 10 and the receiving module 20, or the fixing bracket 30 is used to adjustably fix and support the receiving module 20, wherein the receiving module 20 is directly or indirectly fixed to the motherboard 200 of the electronic device. By adjusting the optical axis of the receiving end of the receiving module 20, the optical axis of the receiving end is adapted to the optical axis of the transmitting end.

[0138] Preferably, the fixing bracket 30 includes a receiving end fixing bracket 31 and a transmitting end fixing bracket 32. The receiving module 20 is adjustably arranged on the receiving end fixing bracket 31, and the projection module 10 is arranged on the transmitting end fixing bracket 32. The receiving end fixing bracket 31 includes a receiving end fixing bracket main body 311 and a receiving end adjustment slot 312. The receiving module 20 is held by the receiving end fixing bracket main body 311 in the receiving end adjustment slot 312. It can be understood that in this preferred embodiment of the present invention, the receiving module 20 is arranged in the receiving end adjustment slot 312 of the receiving end fixing bracket 31 in an optically axis-adjustable manner. By adjusting the position of the receiving module 20 in the receiving end adjustment slot 312, the optical axis of the receiving end of the receiving module 20 is adjusted so that the optical axis direction of the receiving module 20 is adapted to the projection module 10.

[0139] The projection module 10 is arranged on the transmitting end fixing bracket 32, and the position of the projection module 10 is raised by the transmitting end fixing bracket 32. It is worth mentioning that the overall height of the projection module 10 is lower than the height of the receiving module 20. The overall height of the projection module 10 is increased by the transmitting end fixing bracket 32 of the fixing bracket 30 so that the height of the upper end surface of the projection module 10 is adapted to the height of the upper end surface of the receiving module 20.

[0140] Those skilled in the art can understand that the projection module 10 can also be adjustably arranged on the transmitting end fixing bracket 32, so as to adjust the position of the projection module 10 in the fixing bracket 30 by adjusting the optical axis of the transmitting end of the projection module 10, so that the optical axis of the projection module 10 and the optical axis of the receiving module 20 are adapted to each other. As Figure 3A shown, the projection unit 14 is attached to the upper end surface 121 of the transmitting circuit board 12, wherein one electrode (negative electrode) of the projection unit 14 is arranged on the upper end surface 121, and the other electrode (positive electrode) of the projection unit 14 is welded to the transmitting circuit board 12 through a lead wire, and is electrically connected to the main board 200 of the electronic device through the circuit board 12, so that the main board 200 of the electronic device supports the projection unit 14 to work through the transmitting circuit board 12. In addition, in this preferred embodiment of the present invention, the driving chip 15 and the electronic component 17 are arranged on the upper end surface 121 of the transmitting circuit board 12 by welding, and the driving chip 15 is conducted with the main board 200 of the electronic device through the transmitting circuit board 12, and the electronic component 17 is conducted with the main board 200 of the electronic device.

[0141] As Figure 3A and Figure 3B shown, the projection unit 14 is arranged adjacent to the driving chip 15, or the driving chip 15 is attached to the transmitting circuit board 12 in a manner adjacent to the projection unit 14. The lead wire connecting the projection unit 14 is arranged on one side of the projection unit 14 with its back facing the driving chip 15, or a lead wire for connecting the projection unit 14 is arranged at one end of the projection unit 14 facing away from the driving chip 15. In short, in order to arrange the projection unit 14 and the driving chip 15 closer, the lead wire connecting the projection unit 14 is arranged on the side away from the driving chip 15, so that the projection unit 14 and the driving chip 15 are as close as possible. It can be understood that the closer the relative positions of the projection unit 14 and the driving chip 15 are, the closer the waveform of the optical signal reflected by the driving chip 15 controlling the projection unit 14 is to the ideal waveform, such as a projected square wave.

[0142] Optionally, the lead wire connecting the projection unit 14 is arranged on the side not adjacent to the driving chip 15. For example, the lead wire connecting the projection unit 14 is arranged on the same side of the driving chip 15 and the projection unit 14. It can be understood that setting the lead wire connecting the projection unit 14 away from the driving chip 15 can reduce the heat generated by the driving chip 15 during operation from being conducted to the lead wire.

[0143] Accordingly, the projection module 10 is conductively disposed on the main board 200 of the electronic device (or the circuit board of the electronic device). In this preferred embodiment of the present invention, the emission circuit board 12 of the projection module 10 is conductively connected to the main board 200 of the electronic device by welding. Accordingly, the emission circuit board 12 of the projection module 10 further includes an emission circuit substrate 120, a plurality (two or more) of upper solder joints 123, at least one lower solder joint 124, and a plurality of conduction circuits 125. The upper solder joints 123 are disposed on the upper end surface 121 of the emission circuit substrate 120, and the lower solder joint 124 is disposed on the lower end surface 122 of the emission circuit substrate 120. The upper solder joints 123 solder the projection unit 14, the drive chip 15, and the electronic component 17 of the projection module 10 on the upper end surface 121 of the emission circuit board 12.

[0144] Each of the upper solder joints 123 and the lower solder joint 124 is electrically connected to the conduction circuit 125 to realize the conductive connection between the drive chip 15 and the emission unit 14 of the projection module 10 through the conduction circuit 125. Specifically, one end of at least one conduction circuit 125 of the emission circuit board 12 is connected to an upper solder joint 123, where the upper solder joint 123 is electrically connected to the drive chip 15, and the other end of the conduction circuit 125 is electrically connected to another upper solder joint 123 on the upper end surface 121, where the other upper solder joint 123 is electrically connected to an electrode of the projection unit 14. It can be understood that the drive chip 15 is disposed adjacent to the projection unit 14, which can effectively reduce the wiring distance between the drive chip 15 and the projection unit 14 and is beneficial to improving the waveform of the light emitted by the drive chip 15 controlling the projection unit 14.

[0145] The drive chip 15 of the projection module 10 drives (controls) the emission projection unit 14 to work through the conduction circuit 125 of the emission circuit board 12. One end of at least one conduction circuit 125 of the emission circuit board 12 is connected to at least one solder joint 123, where the upper solder joint 123 is electrically connected to the drive chip 15, and the other end of the conduction circuit 125 is electrically connected to a lower solder joint 124 to realize the internal and external conduction of the circuit board 12. There is at least one conduction circuit 125 with one end electrically connected to an upper solder joint 123, where the upper solder joint 123 is connected to the electronic component 17, and the other end of the conduction circuit 125 is electrically connected to a lower solder joint 124 to realize the internal and external conduction of the circuit board 12.

[0146] Preferably, the transmitting circuit board 12 is a ceramic substrate. The driving chip 15, the projection unit 14, and the electronic component 17 disposed on the transmitting circuit board 12 conduct the generated heat to the transmitting circuit board 12 in a heat conduction manner, and the transmitting circuit board 12 dissipates heat. It can be understood that in this preferred embodiment of the present invention, the material of the transmitting circuit board 12 is only exemplary here and not restrictive.

[0147] In this preferred embodiment of the present invention, the projection module 10 is electrically connected to the main board 200 of the electronic device through the lower solder joints 124 of the transmitting circuit board 12 to achieve the conduction connection between the projection module 10 and the main board 200 of the electronic device.

[0148] Figure 3C and Figure 3E FIG. shows another alternative embodiment of a projection module 10 of the TOF camera module 300 of the present invention. The projection module 10 includes a bracket 11A, a transmitting circuit board 12, at least one optical element 13, at least one projection unit 14, at least one driving chip 15, and at least one electronic component 17. The projection unit 14 and the driving chip 15 are disposed on the same side of the transmitting circuit board 12. It is worth mentioning that different from the above preferred embodiment, the bracket 11A is integrally formed on the transmitting circuit board 12. The bracket 11A is integrally formed above the transmitting circuit board 12 by a molding process, and the driving chip 15 of the projection module 10 is covered by the bracket 11A.

[0149] Preferably, in this preferred embodiment of the present invention, the bracket 11A is an integrated molding bracket, that is, the bracket 11A is integrally formed on the upper end surface 121 of the transmitting circuit board 12 by a molding process. The bracket 11A wraps the driving chip 15 on the transmitting circuit board 12, or the driving chip 15 is covered between the bracket 11A and the transmitting circuit board 12. It can be understood that the bracket 11A covers (wraps) the driving chip 15 through a molding or sintering process, which can effectively reduce the XY (length and width) size of the projection module 10 and is beneficial to reducing the overall volume of the TOF camera module 300. It can be understood that the driving chip 15 is covered (wrapped) by the bracket 11A, and the bracket 11A can protect the driving chip 15.

[0150] It can be understood that after the driving chip 15 is soldered to the upper surface of the emitting circuit board 12, the bracket 11A covers (wraps) the driving chip 15 through a molding process, and further fixes the driving chip 15 by means of the bracket 11A, thereby improving the strength (reliability) of the projection module 10. The driving chip 15 is covered by the bracket 11A, and the heat energy generated by the driving chip 15 during operation is conducted to the bracket 11A through heat conduction for the bracket 11A to dissipate heat, so as to prevent the heat generated by the driving projection module 10 from accumulating in the enclosed space 101, which may affect the accuracy of the light signal projected by the projection unit 14, the detection distance, or the service life of the TOF camera module 300. In short, the bracket 11A is integrally formed on the emitting circuit board 12 through a molding process, and the bracket 11A conducts the heat generated by the driving chip 15 through heat transfer, thereby improving the heat dissipation performance of the projection module 10.

[0151] As Figure 3E shown, the bracket 11A is further provided with at least one air escape groove 114A, wherein the air escape groove 114A communicates the accommodation space 101 with the external environment. After the optical element 13 is attached to the mounting groove 113A of the bracket 11A in a glued manner, the projection module 10 is baked or exposed so that the glue (colloid) between the optical element 13 and the bracket 11A is cured. When the optical element 13 is attached to the bracket 11A, the air escape groove 114A guides the air flow in the accommodation space 101 to prevent the gas in the accommodation space 101 from expanding, which may cause the optical element 13 to fail to be attached to the bracket 11A. Preferably, the air escape groove 114A is formed at the upper end of the bracket body 111A of the bracket 11A, and the air escape groove 114 communicates with the mounting groove 113A of the bracket 11A. Therefore, when the optical element 13 is installed in the mounting groove 113A, the air escape groove 114A communicates the accommodation space 101 with the external environment, so that the air escape groove 114A guides the air in the accommodation space 101 outwards to prevent the air pressure in the accommodation space 101 from being too high. It can be understood that in this preferred embodiment of the present invention, the position and formation method of the formed air escape groove 114A are only illustrative here and not restrictive. More preferably, after the glue for pasting the optical element 13 is cured, the air escape groove 114 of the bracket 11A is selectively blocked to seal the accommodation space 101.

[0152] Figure 3FOr 3G shows another two alternative embodiments of the projection module 10 of the above TOF camera module 300 of the present invention, wherein the projection module 10 includes a bracket 11B, a transmitting circuit board 12, at least one optical element 13, at least one projection unit 14, at least one driving chip 15, and at least one electronic component 17, wherein the projection unit 14 and the driving chip 15 are disposed on the same side of the transmitting circuit board 12. It is worth mentioning that, different from the above preferred embodiment, the bracket 11B is adhesively disposed on the transmitting circuit board 12. It is worth mentioning that the bracket 11B can be made by processes such as injection molding or sintering, that is, the bracket 11B can be integrally formed by processes such as injection molding or sintering. Preferably, in this preferred embodiment of the present invention, the bracket 11B is a ceramic bracket sintered from ceramics.

[0153] The bracket 11B of the projection module 10 includes a bracket body 111B and further has a bearing surface 112B and a mounting groove 113B formed above the bearing surface 112B, wherein the optical element 13 is attached to the bearing surface 112B of the bracket 11B, and the optical element 13 is supported in the mounting groove 113B by the bracket body 111B. Different from the above first preferred embodiment, the bracket 11B covers the upper surface of the driving chip 15, wherein the driving chip 15 is covered by the bracket 11B in a heat conduction manner, and the heat generated by the driving chip 15 is conducted by the bracket 11B. In other words, the bracket 11B covers above the driving chip 15, and the driving chip 15 is further fixed to the transmitting circuit board 12 by the bracket 11B to protect the driving chip 15.

[0154] As Figure 3F and Figure 3G shown, the bracket 11B is further provided with a receiving cavity 110B, wherein the receiving cavity 110B is formed below the bracket body 111B of the bracket 11B, and the driving chip 15 is covered by the bracket body 111B in the receiving cavity 110B. The heat generated by the driving chip 15 is conducted outward by the bracket body 111B of the bracket 11B, wherein the upper surface of the driving chip 15 is completely or partially covered by the bracket body 111B of the bracket 11B, and the bracket body 111B contacts the driving chip 15 in a heat conduction manner for the bracket body 111B to dissipate heat.

[0155] As Figure 3FAs described above, the bracket 11B is further provided with at least one heat conduction surface 115B, wherein the heat conduction surface 115B is formed above the accommodation cavity 110B. When the bracket 11B is mounted on the emission circuit board 12, the heat generated by the driving chip 15 during operation is conducted outwards through the bracket body 111B of the bracket 11B by means of direct heat contact or indirect heat conduction of the heat conduction surface 115B of the bracket 11B, avoiding heat accumulation in the accommodation space 101.

[0156] As Figure 3F and Figure 3G As shown, the upper end of the bracket 11B extends inwards, wherein the upper end of the bracket 11B covers above the driving chip 15, and the optical element 13 is supported by the bracket 11B above the projection unit 14. That is to say, in this preferred embodiment of the present invention, the upper end of the bracket 11B extends inwards to reduce the size of the optical element 14. Figure 3H FIG. shows another alternative embodiment of a projection module 10 of the TOF camera module 300 of the present invention described above. The projection module 10 includes a bracket 11, an emission circuit board 12`, at least one optical element 13, at least one projection unit 14, at least one driving chip 15, and at least one electronic component 17, wherein the projection unit 14 and the driving chip 15 are arranged on the same side of the emission circuit board 12. The difference from the above first preferred embodiment lies in the emission circuit board 12` of the projection module 10 of the TOF camera module, wherein the emission circuit board 12` can be formed by a molding process or by ceramic integral sintering, and the projection unit 14 of the projection module 10 is conductively connected to the driving chip 15 through the circuit board 12`. The emission circuit board 12` of the projection module 10 is also conductively connected to the motherboard 200 of the electronic device. The bracket 11, the projection unit 14 and the driving chip 15 of the projection module 10 are arranged above the emission circuit board 12`, and the overall height of the bracket 11, the projection unit 14 and the driving chip 15 is increased by means of the emission circuit board 12`. Therefore, the thickness of the emission circuit board 12` can be designed based on the design requirements of the TOF camera module 300 so that the heights of the projection module 10 and the receiving module 20 of the TOF camera module 300 are adapted.

[0157] Preferably, in this preferred embodiment of the present invention, the emission circuit board 12` is an integrally formed ceramic circuit board formed by ceramic sintering. The ceramic circuit board has good thermal conductivity, which is beneficial to improving the heat dissipation of the projection module 10. It can be understood that the material of the emission circuit board 12` is only for illustrative purposes here, rather than restrictive. Therefore, the emission circuit board 12` can also be implemented as other types of circuit boards, such as an integrally molded circuit board.

[0158] It is worth mentioning that, in this preferred embodiment of the present invention, the projection module 10 and the receiving module 20 of the TOF camera module 300 are of an independently installed structure, and the emission circuit board 12` of the projection module 10 can be integrally formed on the main board 200 of the electronic device. Those skilled in the art can understand that the emission circuit board 12` of the projection module 10 can also be integrally formed on the receiving module 20; or the emission circuit board 12` can also be integrally formed on other electrical connection devices, such as a flexible board, and then the projection module 10 is electrically connected to the main board 200 of the electronic device through the flexible board.

[0159] Specifically, the emission circuit board 12` includes an emission circuit substrate 120`, a plurality of upper solder joints 123`, a plurality of lower solder joints 124` provided on the emission circuit substrate 120`, and at least one conduction circuit 125`. The upper solder joints 123` are provided at the upper end of the emission circuit substrate 120`. At least one of the upper solder joints 123` is used for conductively connecting to the projection unit 14 of the projection module 10, at least one of the upper solder joints 123` is used for conductively connecting to the drive chip 15 of the projection module 10, and at least one of the upper solder joints 123` is used for conductively connecting to the electronic component 17 of the projection module 10. Similar to the above first preferred embodiment, the upper solder joints 123` are electrically connected to the lower solder joints 124` through the conduction circuit 125`, and the upper solder joints 123` corresponding to the drive chip 15 are electrically connected to the upper solder joints 123` for conducting the projection unit 14 through the conduction circuit 125`, so that the projection unit 14 is conductively connected to the drive chip 15.

[0160] In this preferred embodiment of the present invention, the conduction circuit 125`, the upper solder joint 123`, and the lower solder joint 124` are integrally provided on the emission circuit substrate 120`, or when the conduction circuit 125`, the upper solder joint 123`, and the lower solder joint 124` are preset, the emission circuit substrate 120` is integrally formed by sintering or molding. The upper solder joint 123` is embedded in the upper end face of the emission circuit substrate 120`, and the lower solder joint 124` is embedded in the lower end face of the emission circuit substrate 120`, wherein the conduction circuit 125` is built-in (wrapped) in the emission circuit substrate 120`. In this preferred embodiment of the present invention, the conduction circuit 125`, the upper solder joint 123`, and the lower solder joint 124` are preset before the sintering or molding process of the emission circuit substrate 120` of the emission circuit board 12` to ensure that the projection unit 14, the drive chip 15, and the electronic component 17 electrically connected to the upper solder joint 123` can be conducted.

[0161] As Figures 3A to 3D shown, the electronic component 17 may further include active electronic components, wherein the electronic component 17 is electrically connected to the emission circuit board 12 of the projection module 10, and the drive chip 15 of the projection module 10 is controlled or supported by the electronic component 17. The electronic component 17 further includes at least one photodiode 171 (photo diode, PD), wherein the photodiode 171 is disposed on the emission circuit board 12, and the photodiode 171 is conductively connected to the drive chip 15. The photodiode 171 is a monitoring device for eye safety and skin safety, wherein the photodiode 171 monitors the light change in the projection module 10, converts the received light into a corresponding current signal and transmits it to the drive chip 15 for the drive chip 15 to control the working power of the projection unit 14 based on the monitored light change. It can be understood that once an abnormality occurs in the projection, the photodiode 171 sends a control signal to the drive chip 15 for the drive chip 15 to abort the projection work of the projection unit 14 to protect the operation of the TOF camera module 300.

[0162] As Figure 3A and Figure 3BAs shown, the photodiode 171 is attached to the upper end face 121 of the emission circuit board 12. One electrode (negative electrode) of the photodiode 171 is disposed on the upper end face 121, and the other electrode (positive electrode) of the photodiode 171 is soldered to the emission circuit board 12 through a lead and is electrically connected to the main board 200 of the electronic device through the circuit board 12, so that the main board 200 of the electronic device supports the operation of the photodiode 171 through the emission circuit board 12. The photodiode 171 is disposed adjacent to the projection unit 14, or the projection unit 14 is attached to the emission circuit board 12 in a manner adjacent to the photodiode 171. The lead connecting the photodiode 171 is disposed on one side of the photodiode 171 with its back facing the projection unit 14, or a lead for connecting the photodiode 171 is disposed at one end of the photodiode 171 facing away from the projection unit 14. In short, in order to arrange the photodiode 171 and the projection unit 14 closer, the lead connecting the photodiode 171 is arranged on the side away from the projection unit 14, so that the photodiode 171 and the projection unit 14 are as close as possible.

[0163] As Figure 3C and Figure 3D shown, the lead connecting the photodiode 171 is disposed on the side not adjacent to the projection unit 14. For example, the lead connecting the photodiode 171 is disposed on the same side of the projection unit 14 and the photodiode 171. It can be understood that the lead connecting the photodiode 171 is disposed away from the projection unit 14, which can reduce the heat generated during the operation of the projection unit 14 from being conducted to the lead.

[0164] As Figures 3A to 3D shown, the electronic component 17 further includes a negative temperature coefficient device (NTC) 172, and the negative temperature coefficient device 172 is conductively disposed on the emission circuit board 12. The negative temperature coefficient device 172 is used to monitor the real-time temperature of the projection unit 14 and transmit the data to the driving chip 15 in real time, so that the driving chip 15 controls the operating power of the projection unit 14 based on the negative temperature coefficient device 172.

[0165] Referring to the drawings of the specification of the present invention Figures 4A to 5CAs shown, the optical element 13 is adhesively mounted on the bracket 11. The projection module 10 is provided with a venting structure which communicates the accommodation space 101 with the external environment, so that during the drying process of the glue, the gas in the accommodation space 101 is guided to the external environment by the venting structure to balance the air pressure between the accommodation space 101 and the outside. It can be understood that during the drying process of the glue, the increase and expansion of the air pressure in the accommodation space 101 can easily cause the optical element 13 mounted on the upper end of the bracket 11 to fall off. The venting structure of the projection module 10 can balance the air pressure between the accommodation space 101 and the outside, preventing the optical element 13 from falling off during the baking process of the projection module 10.

[0166] Specifically, in this preferred embodiment of the present invention, the bracket 11 is further provided with at least one glue painting area 110, and the glue is coated on the glue painting area 110 of the bracket 11. Preferably, in this preferred embodiment of the present invention, the glue painting area 110 is arranged on the bearing surface 112 of the bracket 11, that is, the glue is coated on the bearing surface 112 of the bracket 11. The optical element 13 is arranged in the mounting groove 113 of the bracket 11. The glue between the glue painting area 110 and the optical element 13 is cured to form at least one cured glue layer 116, and the optical element 13 is fixed on the bearing surface 112 of the bracket 11 by means of the cured glue layer 116. It is worth mentioning that the pasting range and the glue layer thickness of the cured and formed cured glue layer 116 are determined by the glue coating amount and the coating range of the glue coated on the glue painting area 110. The cured and formed cured glue layer 116 seals the gap between the bracket 11 and the optical element 13. In other words, the cured glue layer 116 formed after the glue is cured has a certain thickness, and the cured glue layer 116 isolates the accommodation space 101 from the external environment.

[0167] Correspondingly, an air venting gap 117 is formed between the non-glue-coated glue painting area 110 and the optical element 13. After the glue is cured, the air venting gap 117 is formed in the same layer as the cured glue layer 116. The air venting gap 117 communicates the accommodation space 101 with the external environment. When the glue coated on the glue painting area 110 is dried and cured, the air venting gap 117 guides the gas in the accommodation space 101 to move to maintain the air pressure balance between the accommodation space 101 and the external environment.

[0168] As Figures 5A to 5C shows several different glue painting methods of the glue painting area 110. As Figure 5AAs shown, three sides of the glue painting area 110 are coated with glue, and the solidified glue layer 116 formed by the solidification of the glue is formed on three sides of the glue painting area 110. In other words, glue is coated on three sides of the glue painting area 110, and the air escape gap 117 is formed above the glue painting area 110 where glue is not coated.

[0169] As Figure 5B and Figure 5C As shown, glue is coated on the glue painting area 110, and at least one notch is set during the glue coating process. The air escape gap 117 is formed at the notch position after the glue is solidified and formed. Preferably, during the glue painting process, the starting position and the ending position of the glue painting are not connected to form a glue painting notch; or, the glue coating is interrupted during the glue painting process to form the glue painting notch.

[0170] In this preferred embodiment of the present invention, the notch position can be set at the corner position of the glue painting. The starting position of the glue painting is on one side of the corner position, and the ending position is on the other side of the corner position, so that one less corner is experienced during the line drawing. It should be noted that the glue painting speed will decrease at the corner position. Experiencing fewer corners (or arcs) and walking more straight lines are beneficial to improving production efficiency.

[0171] In the attached drawings of the specification Figure 6 shows the pulse waveform of the detection optical signal emitted by the projection unit 14 controlled by the drive chip 15 of the projection module 10 of the present invention. Preferably, in this preferred embodiment of the present invention, the drive chip 15 controls the projection unit 14 to emit the optical signal in the form of a square wave. It is worth mentioning that the shorter the wiring distance between the drive chip 15 and the projection unit 14 of the projection module 10, the closer the pulse waveform of the optical signal projected by the projection unit 14 is to a square wave.

[0172] Preferably, in this preferred embodiment of the present invention, the projection unit 14 can be a vertical cavity surface emitting laser (VCSEL).

[0173] In the attached drawings of the specification of the present invention Figures 7A to 7F shows several other alternative embodiments of the projection module 10 of the TOF camera module 300, in which the projection module 10 is conductively arranged on the main board 200 of the electronic device in a flexible board conduction manner, that is, the projection module 10 is connected to the main board 200 of the electronic device by setting a flexible board.

[0174] Figure 7A and Figure 7CTwo alternative embodiments of the projection module 10 of the TOF camera module 300 are illustrated, where the projection module 10 includes a bracket 11, a transmitting circuit board 12C, at least one optical element 13, at least one projection unit 14, at least one driving chip 15, and at least one electronic component 17, and the projection unit 14 and the driving chip 15 are disposed on the same side of the transmitting circuit board 12C. Different from the above preferred embodiment, the transmitting circuit board 12C is conductively connected to the main board 200 of the electronic device by means of a flexible board connection. Specifically, the projection module 10 further includes at least one flexible board 103C and a connector 102C, where one end of the flexible board 103C is electrically connectable to the transmitting circuit board 12C, and the other end of the flexible board 103C is conductively connected to the main board 200 of the electronic device through the connector 102C.

[0175] It can be understood that in this alternative embodiment of the present invention, no solder joints need to be provided under the transmitting circuit board 12C of the projection module 10, and the transmitting circuit board 12C is conductively connected to the main board 200 of the electronic device through the flexible board 103C.

[0176] Those skilled in the art can understand that the flexible board 103C is a flexible circuit board, which can be bent to facilitate the conductive connection of the projection module 10 to the main board 200 of the electronic device. The transmitting circuit board 12C is conductively connected to the main board 200 of the electronic device through the flexible board 103C.

[0177] In this preferred embodiment of the present invention, the bracket 11 is disposed on the upper surface of the transmitting circuit board 12C by means of adhesion. The bracket 11 can be made by processes such as injection molding or sintering, that is, the bracket 11 can be integrally formed by processes such as injection molding or sintering. Preferably, in this preferred embodiment of the present invention, the bracket 11 is a ceramic bracket device sintered from ceramics. As Figure 7A shown, the connector 102C is conductively disposed above one end of the flexible board 103C. As Figure 7C shown, the connector 102C is conductively disposed below one end of the flexible board 103C.

[0178] Figure 7A and Figure 7CTwo alternative embodiments of the projection module 10 of the TOF camera module 300 are illustrated. The projection module 10 includes a bracket 11, a transmitting circuit board 12C, at least one optical element 13, at least one projection unit 14, at least one driving chip 15, and at least one electronic component 17. The projection unit 14 and the driving chip 15 are disposed on the same side of the transmitting circuit board 12C. Different from the alternative embodiment of the above preferred embodiment, the bracket 11 of the projection module 10 is a molded bracket, and the bracket 11 is integrally formed on the upper surface of the transmitting circuit board 12C by a molding process.

[0179] Figure 7E and Figure 7F Two other alternative embodiments of the projection module 10 of the TOF camera module 300 are illustrated. The projection module 10 includes a bracket 11, a transmitting circuit board 12, at least one optical element 13, at least one projection unit 14, at least one driving chip 15, and at least one electronic component 17. The projection unit 14 and the driving chip 15 are disposed on the same side of the transmitting circuit board 12. Different from the above preferred embodiment, the way the transmitting circuit board 12 of the projection module 10 is connected to the main board 200 of the electronic device. Specifically, the projection module 10 further includes a flexible printed circuit board 103C and a connector 102C, where the flexible printed circuit board 103C is a flexible circuit board. One end of the flexible printed circuit board 103C is attached to the lower side of the transmitting circuit board 12, and the transmitting circuit board 12 is conductively connected to the flexible printed circuit board 103C by soldering, and the transmitting circuit board 12 is electrically connected to the main board 200 of the electronic device through the flexible printed circuit board 103C. The other end of the flexible printed circuit board 103C is electrically connected to the connector 102C, and the connector 102C is conductively connected to the main board 200 of the electronic device, and the flexible printed circuit board 103C is conductively connected to the main board 200 of the electronic device through the connector 102C.

[0180] It is worth mentioning that in this alternative embodiment of the present invention, the structure and function of the transmitting circuit board 12 are the same as those of the first preferred embodiment above. The lower solder joint 124 of the transmitting circuit board 12 is electrically connected to one end of the flexible printed circuit board 103C, and the transmitting circuit board 12 is conductively connected to the main board 200 of the electronic device through the flexible printed circuit board 103C. In short, the transmitting circuit board 12 is conductively attached to the flexible printed circuit board 103C, and the transmitting circuit board 12 is electrically connected to the main board 200 of the electronic device through the flexible printed circuit board 103C.

[0181] It is worth mentioning that, in this preferred embodiment of the present invention, the bracket 11 can be manufactured by processes such as injection molding or sintering, that is, the bracket 11 can be integrally formed by processes such as injection molding or sintering. The bracket 11 is disposed above the emission circuit board 12 in a pasted manner or an integrally formed manner.

[0182] Referring to the accompanying drawings of the present invention Figures 8 to 9D As shown, another preferred embodiment of a TOF camera module 300D of the electronic device according to the above-mentioned preferred embodiment of the present invention is illustrated in the following description. The TOF camera module 300D is assembled into an integrated camera module, wherein the TOF camera module 300D includes a projection module 10D and a receiving module 20D. The projection module 10D is disposed adjacent to the receiving module 20D, and the projection module 10D is conductively connected to the receiving module 20D, and the projection module 10D is controlled to operate by the receiving module 20D. The projection module 10D is conductively disposed on the receiving module 20D, wherein the receiving module 20D is conductively connected to the main board 200 of the electronic device, that is, the main board 200 of the electronic device supports the operation of the projection module 10D through the receiving module 20D.

[0183] It can be understood that, in this preferred embodiment of the present invention, the TOF camera module 300D may further include a lens holder for fixing the projection module 10D and the receiving module 20D to maintain the relative positions between the projection module 10 and the receiving module 20D fixed.

[0184] Specifically, the receiving module 20D includes a lens assembly 21D, a photosensitive element 22D, and at least one receiving circuit board 23D. The lens assembly 21D is disposed above the photosensitive element 22D, and the lens assembly 21D provides a light-sensing path for the photosensitive element 22D, so that external light is projected onto the photosensitive element 22D through the light-sensing path. Different from the above-mentioned first preferred embodiment, the receiving circuit board 23D includes a circuit board receiving end 231D and a circuit board transmitting end 232D integrally extending from the circuit board receiving end 231D. The photosensitive element 22D is attached to the circuit board receiving end 231D of the receiving circuit board 23D. The projection module 10D is conductively disposed on the circuit board transmitting end 232D of the receiving circuit board 23D, and the projection module 10D is supported by the receiving circuit board 23D and the distance between the projection module 10D and the receiving module 20D is positioned.

[0185] It can be understood that the projection module 10D and the receiving module 20D of the TOF camera module 300D are assembled into an integrated structure. When the TOF camera module 300D is installed on the motherboard 200 of the electronic device, the projection module 10D and the receiving module 20D are integrally installed on the motherboard 200 of the electronic device. It can be understood that the dimension of the projection module 10D in the height direction is smaller than the height dimension of the receiving module 20D, and the projection module 10D is stacked on the circuit board transmitting end 232D of the receiving module 20D, thereby raising the upper position of the projection module 10D and making the overall height of the projection module 10D and the receiving module 20D of the TOF camera module 300 close. Preferably, the top heights of the projection module 10D and the receiving module 20D are equal, which is beneficial to improving the shooting quality of the TOF camera module 300D.

[0186] Different from the above first preferred embodiment, the projection module 10D includes a bracket 11D, a transmitting circuit board 12D, at least one optical element 13D, at least one projection unit 14D, at least one driving chip 15, and at least one electronic element 17D, wherein the projection unit 14D and the driving chip 15D are arranged on the same side of the transmitting circuit board 12D. The bracket 11D is arranged on the transmitting circuit board 12D, and the optical element 13D is attached above the bracket 11D and located on the projection path of the projection module 10D, and diffracts (or expands, shapes, etc.) the optical signal projected by the projection unit 14D through the optical element 13D. The bracket 11D, the transmitting circuit board 12D, and the optical element 13D of the projection module 10D are sealed to form an accommodating space 101D, and the projection unit 14D and the driving chip 15D are built in the enclosed space 101D.

[0187] As Figure 8 shown, the receiving module 20D of the TOF camera module 300D further includes a receiving end connector 24D, and one end of the receiving end connector 24D is electrically connected to the receiving circuit board 23D of the receiving module 20D, and the receiving circuit board 23D of the receiving module 20D is conductively connected to the motherboard 200 of the electronic device through the receiving end connector 24.

[0188] As Figure 9AAs shown, the projection module 10D is conductively connected to the receiving circuit board 23D of the receiving module 20D by means of a flexible board connection. The TOF camera module 300D further includes a flexible board 103D, wherein the flexible board 103D conductively connects the transmitting circuit board 12D of the projection module 10D to the receiving circuit board 23D of the receiving module 20D. It can be understood that the flexible board 103D is a flexible circuit board, and the flexible board 103D can be flipped so as to electrically connect the transmitting circuit board 12D stacked above the receiving module 20D to the circuit board transmitting end 232D of the receiving circuit board 23D.

[0189] The TOF camera module 300D further includes a base bracket 30D, wherein the base bracket 30D is placed at the circuit board transmitting end 232D of the receiving circuit board 23D, and the height of the projection module 10D is increased by means of the base bracket 30D so that the height of the projection module 10D is similar to or parallel to the height of the receiving module 20D. Accordingly, the base bracket 30D is padded under the transmitting circuit board 12D of the projection module 10D, and the projection module 10D is supported by means of the base bracket 30D. The transmitting circuit board 12D of the projection module 10D is attached to the upper surface of the base bracket 30D, and the base bracket 30D fixedly stacks the projection module 10D on the circuit board transmitting end 232D of the receiving circuit board 23D.

[0190] In this preferred embodiment of the present invention, the base bracket 30D is integrally formed at the circuit board transmitting end 232D of the receiving circuit board 23D by means of a molding process or a sintering process. Preferably, the base bracket 30D is implemented as a molding base, and the base bracket 30D is disposed below the transmitting circuit board 12D in a heat-conducting manner, and the heat generated by the transmitting circuit board 12D is conducted by means of the base bracket 30D.

[0191] The TOF camera module 300D further includes at least one electronic component unit 40D, wherein the electronic component unit 40D is disposed on the receiving circuit board 23D and is used to support the operation of the projection module 10D or the receiving module 20D of the TOF camera module 300D. Preferably, the electronic component unit 40D is conductively disposed at the circuit board transmitting end 232D of the receiving circuit board 23D. The electronic component unit 40D is covered by the base bracket 30D, and the electronic component unit 40D is protected by means of the base bracket 30D.

[0192] The TOF camera module 300D further includes at least one shielding cover 50D, wherein the shielding cover 50D is disposed on the transmitting module 10D to shield the radio frequency signals generated by the transmitting module 10D, thereby preventing the radio frequency signals generated by the transmitting module 10D from affecting the terminal device.

[0193] Preferably, the shielding cover 50D is a metal cover, and the shielding cover 50D is disposed around the outside of the transmitting module 10D. It is worth mentioning that when the bracket 11D of the transmitting module 10D is made of a material without shielding function such as plastic or ceramic, the shielding cover 50D shields the radio frequency generated by the projection unit 14D from affecting other electronic components.

[0194] It is worth mentioning that in this preferred embodiment of the present invention, the electronic component unit 40D includes but is not limited to capacitors, resistors, inductors, etc. The electronic component unit 40D can reduce the parasitic inductance between the driving chip and the projection module to ensure the waveform integrity of the optical signal emitted by the projection module. It can be understood that although the electronic component unit 40D can improve the pulse waveform of the optical signal projected by the projection unit 14D, according to the design requirements, the electronic component unit 40D can be attached to the main board 200 of the electronic device, the receiving circuit board 23D of the receiving module 20D, or / and the transmitting circuit board 12D of the projection module 10D. Therefore, in this preferred embodiment of the present invention, the installation position of the electronic component unit 40D is only exemplary here and not restrictive.

[0195] Figure 9B Another alternative embodiment of the TOF camera module 300D of the electronic device according to the above preferred embodiment of the present invention is shown. Different from the above alternative preferred embodiment, a base bracket 30E of the TOF camera module 300D is disposed on the projection module 10D and the receiving circuit board 23D of the receiving module 20D by means of adhesion to increase the height of the projection module 10D, so that the projection module 10D and the receiving module 20D have approximately the same height.

[0196] In this alternative embodiment of the present invention, the base bracket 30E is integrally formed by a molding process or a sintering process. The base bracket 30E includes a base bracket body 31E, and further has an upper bracket surface 32E and a lower bracket surface 33E. The lower bracket surface 33E is attached to the upper surface of the receiving circuit board 23D. The emitting circuit board 12D of the projection module 10D is disposed on the upper bracket surface 32E of the base bracket 30E, and the projection module 10D is supported by the base bracket body 31E to increase the height position of the projection module 10D. Preferably, in this preferred embodiment of the present invention, the base bracket 30E is an integral ceramic bracket. The emitting circuit board 12D of the projection module 10D is attached to the base bracket 30E in a heat-conducting manner, and the heat generated by the operation of the projection module 10D is conducted to the base bracket 30E by the emitting circuit board 12D for heat dissipation of the base bracket 30E.

[0197] The base bracket 30E further has a receiving groove 34E, which is formed at the lower end of the base bracket body 31E. The electronic component unit 40D is covered by the base bracket body 31E of the base bracket 30E in the receiving groove 34E. When the base bracket 30E is attached to the receiving circuit board 23D of the receiving module 20D, the circuit board emitting end 232D of the receiving circuit board 23D and the base bracket 30E seal the receiving groove 34E of the base bracket 30E, and the electronic component unit 40D is sealed in the receiving groove 34E.

[0198] Figure 9C Another alternative embodiment of the TOF camera module 300D of the electronic device according to the above preferred embodiment of the present invention is shown. Different from the above preferred embodiment, the projection module 10D is conductively connected to the receiving module 20D by means of solder joints.

[0199] The TOF camera module 300D further includes a base bracket 30F, wherein the base bracket 30F is placed at the circuit board transmitting end 232D of the receiving circuit board 23D, and the height of the projection module 10D is increased by means of the base bracket 30F so that the height of the projection module 10D is similar to or parallel to the height of the receiving module 20D. Accordingly, the base bracket 30F is padded under the transmitting circuit board 12D of the projection module 10D, and the projection module 10D is supported by means of the base bracket 30F. The transmitting circuit board 12D of the projection module 10D is attached to the upper surface of the base bracket 30F, and the base bracket 30F fixedly stacks the projection module 10D at the circuit board transmitting end 232D of the receiving circuit board 23D. The base bracket 30F is arranged to conductively connect the transmitting circuit board 12D of the projection module 10D to the receiving circuit board 23D of the receiving module 20D.

[0200] Accordingly, the base bracket 30F includes a base bracket body 31F and at least one bracket conduction circuit 35F provided on the base bracket body 31F. The bracket conduction circuit 35F is built into the base bracket body 31F, wherein one end (upper end) of the bracket conduction circuit 35F is electrically connected to the transmitting circuit board 12D of the projection module 10D, and the other end (lower end) of the bracket conduction circuit 35F is electrically connected to the receiving circuit board 23D of the receiving module 20D. In short, the base bracket 30F can conductively connect the transmitting circuit board 12D to the circuit board transmitting end 232D of the receiving circuit board 23D. Preferably, in this preferred embodiment of the present invention, the transmitting circuit board 12D of the projection module 10D is a solder joint connection structure, that is, the lower end of the transmitting circuit board 12D of the projection module 10D is conductively connected to the bracket conduction circuit 35F of the base bracket 30F through solder joints.

[0201] In this preferred embodiment of the present invention, the base bracket 30D is integrally formed at the circuit board transmitting end 232D of the receiving circuit board 23D by means of a molding process or a sintering process. Preferably, the base bracket 30D is implemented as a ceramic base. The transmitting circuit board 12D of the projection module 10D is attached to the base bracket 30F in a heat-conductive manner, wherein the transmitting circuit board 12D conducts the heat generated by the operation of the projection module 10D to the base bracket 30F for heat dissipation of the base bracket 30F.

[0202] Figure 9DAnother alternative embodiment of the TOF camera module 300D of the electronic device according to the above preferred embodiment of the present invention is shown. Different from the above preferred embodiment, a transmitting circuit board 12G of the projection module 10D of the TOF camera module is integrally formed on the transmitting circuit board 23D of the receiving module 20D. The transmitting circuit board 12G is conductively disposed on the receiving circuit board 23D, and the overall height of the projection unit 14D, the driving chip 15D, and the bracket 11D of the projection module 10D is increased by the transmitting circuit board 12G.

[0203] Preferably, in this preferred embodiment of the present invention, the transmitting circuit board 12G is an integrally formed ceramic circuit board formed by ceramic sintering. The ceramic circuit board has good thermal conductivity, which is beneficial to improving the heat dissipation of the projection module 10D. It can be understood that the material of the transmitting circuit board 12G is only illustrative here and not restrictive. Therefore, the transmitting circuit board 12G can also be implemented as other types of circuit board types, such as an integrally molded circuit board.

[0204] Specifically, the transmitting circuit board 12G includes a transmitting circuit substrate 120G, a plurality of upper solder joints 123G, a plurality of lower solder joints 124G, and at least one conduction circuit 125G disposed on the transmitting circuit substrate 120G. The upper solder joints 123G are disposed at the upper end of the transmitting circuit substrate 120G. At least one of the upper solder joints 123G is used to conductively connect to the projection unit 14D of the projection module 10D, at least one of the upper solder joints 123G is used to conductively connect to the driving chip 15D of the projection module 10D, and at least one of the upper solder joints 123G is used to conductively connect to the electronic component 17D of the projection module 10D. The same as the above first preferred embodiment, the upper solder joints 123G are electrically connected to the lower solder joints 124G through the conduction circuit 125G, and the upper solder joints 123G corresponding to the driving chip 15D are electrically connected to at least one of the upper solder joints 123G through at least one of the conduction circuits 125G. The upper solder joints 123G are electrically connected to an electrode of the projection unit 14D so that the projection unit 14D is conductively connected to the driving chip 15D. Preferably, the conduction circuit connecting the driving chip 15D and the projection unit 14D is arranged on the upper surface layer of the transmitting circuit substrate 120G.

[0205] In this preferred embodiment of the present invention, the conduction circuit 125G, the upper solder joint 123G, and the lower solder joint 124G are integrally provided on the transmitting circuit substrate 120G, or when the conduction circuit 125G, the upper solder joint 123G, and the lower solder joint 124G are preset, the transmitting circuit substrate 120G is integrally formed by sintering or molding. The upper solder joint 123G is embedded in the upper end surface of the transmitting circuit substrate 120G, and the lower solder joint 124G is embedded in the lower end surface of the transmitting circuit substrate 120G, wherein the conduction circuit 125G is built-in (wrapped) in the transmitting circuit substrate 120G. In this preferred embodiment of the present invention, the conduction circuit 125G, the upper solder joint 123G, and the lower solder joint 124G are preset before the sintering or molding process of the transmitting circuit substrate 120G of the transmitting circuit board 12G to ensure that the projection unit 14D, the driving chip 15D, and the electronic component 17D electrically connected to the upper solder joint 123G can be conducted.

[0206] It is worth mentioning that the transmitting circuit board 12G of the projection module 10D in this preferred embodiment of the present invention is integrally formed on the receiving circuit board 23D, wherein the lower solder joint 124G is electrically connected to the receiving circuit board 23D. It is easy for those skilled in the art to think that the projection module 10D can also be conductively arranged on the receiving circuit board 23D of the receiving module 20D in other ways, such as by means of a flexible board connection. Exemplarily, the transmitting circuit board 12G of the projection module 10D is integrally formed on a flexible board, and the projection module 10D is conductively connected to the receiving circuit board 23D of the receiving module 20D through the flexible board. It can be understood that in this alternative embodiment of the present invention, the projection module 10D can also be conductively attached to the receiving circuit board 23D of the receiving module 20D by means of adhesion, such as the formed projection module 10D is attached to the receiving circuit board 23D of the receiving module 20D by conductive silver paste.

[0207] Referring to the accompanying drawings of the specification of the present invention Figures 10A to 10CAs shown, an alternative implementation of installing the TOF camera module 300 of the electronic device according to the above preferred embodiment of the present invention to the electronic device main board 200. In this alternative embodiment, the projection module 10 and the receiving module 20 of the TOF camera module 300 are independently installed on the electronic device main board 200. Those skilled in the art can understand that the electronic device main board 200 of the electronic device can be, but is not limited to, a circuit board, where the projection module 10 and the receiving module 20 of the TOF camera module 300 are independently and conductively arranged on the electronic device main board 200. It is worth mentioning that the TOF camera module 300 can be arranged on the front or back of the electronic device main board 200. In other words, when the TOF camera module 300 is arranged on the front of the electronic device main board 200, the TOF camera module is implemented as the front camera device of the electronic device; when the TOF camera module 300 is arranged on the back of the electronic device main board 200, the TOF camera module is implemented as the rear camera device of the electronic device. It can be understood that the position of the TOF camera module here is only exemplary and not restrictive.

[0208] As Figure 10A and Figure 10B As shown, the electronic device main board 200 includes a main board body 210, a pad area 220 and a receiving end mounting groove 230 arranged on the main board body 210. The pad area 220 is formed on the front or back of the main board body 210, and the receiving end mounting groove 230 is formed at one end of the main board body 210, such as the top end of the main board body 210. The projection module 10 of the TOF camera module 300 is conductively arranged in the pad area 220, and the emission circuit board 12 of the projection module 10 can be electrically connected to the main board body 210 of the electronic device main board 200 by means of solder joint connection or flexible disk connection. Preferably, in this preferred embodiment of the present invention, the emission circuit board 12 of the projection module 10 is arranged in the pad area 220 in a way of solder joint conduction.

[0209] The fixing bracket 30 of the TOF camera module 300 is fixed to the main board body 210 of the electronic device main board 200. By means of the fixing bracket 30, the receiving module 20 of the TOF camera module 300 is fixed and supported. After the projection module 10 of the TOF camera module 300 is fixedly installed on the main board body 210, the receiving module 20 can be adjusted based on the fixing bracket 30 so that the projection optical axis of the projection module 10 of the TOF camera module 300 is adapted to the receiving optical axis of the receiving module 20. In short, after the TOF camera module 300 is fixed to the electronic device main board 200, the position of the receiving module 20 in the fixing bracket 30 can be adjusted to adjust the receiving module 20 to adapt to the projection module 10.

[0210] The receiving module 20 of the TOF camera module 300 is embeddedly installed in the receiving end installation groove 230, wherein the receiving module 20 is conductively connected to the main board body 210. It can be understood that the receiving module 20 is installed in the receiving end installation groove 230 by diving under one surface (front or back) of the main board body 210 of the electronic device main board 200 to reduce the height difference between the upper end surface of the receiving module 20 and the upper end of the projection module 10. It can be understood that the receiving module 20 of the TOF camera module 300 is installed in the receiving end installation groove 230, which is beneficial to reducing the overall thickness of the electronic device and facilitating the thinning of the electronic device.

[0211] Those skilled in the art should understand that the electronic device main board 200 may further include a fixing mechanism for fixing the receiving module 20. When the receiving module 20 is installed in the receiving end installation groove 230 of the electronic device main board 200, the fixing mechanism fixes the receiving device 20 to the main board body 210 of the electronic device main board 200.

[0212] As Figure 10A and Figure 10B show two different installation methods of the TOF camera module 300, that is, the pad area 220 of the electronic device main board 200 can be arranged on the side (lower side, right side or left side) of the receiving end installation groove 230. Therefore, when the projection module 10 and the receiving module 20 of the TOF camera module 300 are independently installed on the electronic device main board 200, the projection module 10 and the receiving module 20 can have various arrangement methods.

[0213] Referring to the accompanying drawings of the specification of the present invention Figures 11A to 11CAs shown, another alternative implementation of installing the TOF camera module 300 of the electronic device according to the above preferred embodiment of the present invention to the electronic device main board 200. In this alternative embodiment, the projection module 10 and the receiving module 20 of the TOF camera module 300 are independently installed on the electronic device main board 200. As Figure 11A shown, the electronic device main board 200 includes a main board body 210, a pad area 220 provided on the main board body 210, and a receiving end mounting hole 230`. Wherein the pad area 220 is formed on the front or back of the main board body 210, and the receiving end mounting hole 230` is formed at one end of the main board body 210, such as the top end of the main board body 210. The projection module 10 of the TOF camera module is conductively arranged on the pad area 220, wherein the emission circuit board 12 of the projection module 10 can be electrically connected to the main board body 210 of the electronic device main board 200 by means of solder joint connection or flexible disk connection.

[0214] As Figure 11B and Figure 11C shown, different from the above preferred embodiment, in this preferred embodiment of the present invention, the receiving end mounting hole 230` is a through hole or a semi-through hole formed in the main board body 210. The receiving module 20 of the TOF camera module 300 is embeddedly installed in the receiving end mounting hole 230`, wherein the receiving module 20 is conductively connected to the main board body 210. It can be understood that the receiving module 20 is installed in the receiving end mounting hole 230` by diving based on one surface (front or back) of the main board body 210 of the electronic device main board 200 to reduce the height difference between the upper end surface of the receiving module 20 and the upper end of the projection module 10.

[0215] It is worth mentioning that, in this preferred embodiment of the present invention, the projection module 10 of the TOF camera module 300 can raise the position of the projection module 10 through a bracket with a connected circuit, so that the heights of the projection module 10 and the receiving module 20 are approximately the same. In other words, in this preferred embodiment of the present invention, the projection module 10 of the TOF camera module 300 is electrically connected to the main board body 210 in a raised manner from the pad area 220 of the electronic device main board 200.

[0216] Referring to the accompanying drawings of the specification of the present invention Figures 12A to 13As shown, another alternative implementation of installing the TOF camera module 300 of the electronic device according to the above preferred embodiment of the present invention to the motherboard 200 of the electronic device. Different from the above preferred embodiment, in this alternative embodiment, the assembled TOF camera module 300 is installed to the motherboard 200 of the electronic device. As Figure 12A shown, the motherboard 200 of the electronic device includes a motherboard main body 210, a pad area 220 provided on the motherboard main body 210, and a receiving end installation area 230``, wherein the pad area 220 is formed on the front or back of the motherboard main body 210, and the receiving end installation hole 230`` is formed at one end of the motherboard main body 210, such as the top end of the motherboard main body 210. The projection module 10 of the TOF camera module is conductively provided on the pad area 220, wherein the emission circuit board 12 of the projection module 10 is electrically connected to the motherboard main body 210 of the motherboard 200 of the electronic device by means of solder joint connection or flexible disk connection.

[0217] Preferably, the projection module 10 and the receiving module 20 of the TOF camera module 300 are attached to the motherboard main body 210 of the motherboard 200 of the electronic device, wherein the pad area 220 and the receiving end installation area 230`` are mounting areas formed on one surface of the motherboard main body 210. It can be understood that in other embodiments of the present invention, the pad area 220 and the receiving end installation area 230`` are holes, grooves, half holes, etc. formed in the motherboard main body 210. That is to say, the projection module 10 and the receiving module 20 of the TOF camera module 300 can be installed to the pad area 220 and the receiving end installation area 230`` in a sunken manner from one surface (front or back) of the motherboard main body 210 of the motherboard 200 of the electronic device to reduce the overall thickness of the electronic device. It can be understood that the motherboard 200 of the electronic device may further include a fixed installation mechanism for fixedly installing the TOF camera module 300, and the TOF camera module 300 is fixedly installed to the motherboard 200 of the electronic device by means of the fixed installation mechanism.

[0218] As Figure 13 shown, different from the above preferred embodiment, the projection module 10 and the receiving module 20 of the TOF camera module 300 are respectively provided on the fixing bracket 30, and the projection module 10 and the receiving module 20 are fixed to the motherboard 200 of the electronic device by means of the fixing bracket 30. In this preferred embodiment of the present invention, the receiving module 20 is adjustably provided on the receiving end fixing bracket 31 of the fixing bracket 30, and the transmitting end fixing bracket 32 of the fixing bracket 30 is used to raise the height position of the transmitting module 20.

[0219] It is worth mentioning that the projection module 10 and the receiving module 20 are respectively fixed to the fixing bracket 30, and the projection module 10 and the receiving module 20 are fixed and supported by the fixing bracket 30. In this preferred embodiment of the present invention, the projection module 10 is supported and elevated by the transmitting end fixing bracket 32 of the fixing bracket 30, wherein the bottom of the projection module 10 is elevated by the transmitting end fixing bracket 32 so that the upper plane of the projection module 10 is flush with or in a substantially parallel position to the receiving module 20. It can be understood that the projection module 10 is lifted by the fixing bracket 30, and a clearance space is formed below the projection module 10, and the clearance space can be used to install or accommodate other electronic components, where the electronic components can be electronic components supporting the TOF camera module 300, or other electronic components implemented as the electronic device. In short, in this preferred embodiment of the present invention, the projection module 10 is mounted above the main board 200 of the electronic device in a lifted manner by the fixing bracket 30, and the projection module 10 is lifted, and a clearance space for installing other electronic components is formed between the main boards 200 of the electronic device, forming a spatial superposition, which is beneficial to improving the space utilization rate.

[0220] It can be understood that the fixing bracket 30 lifts the projection module 10 so that the projection module 10 is superposed above the main board 200 of the electronic device, improving the space utilization rate.

[0221] It is worth mentioning that in this preferred embodiment of the present invention, the fixing bracket 30 supports the projection module 10. When the fixing bracket 30 is a bracket made of metal material, the fixing bracket 30 shields the radio frequency signal generated by the projection module 10, that is, the fixing bracket 30 made of metal material can be used as a shielding cover to shield the interference signal generated by the projection module 10. If the fixing bracket 30 is made of plastic material, at least one shielding cover 50D is provided outside the projection module 10, and the shielding cover shields the radio frequency signal generated by the projection module 10.

[0222] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the drawings are only examples and do not limit the present invention. The object of the present invention has been fully and effectively achieved. The function and structural principle of the present invention have been shown and described in the embodiments, and the embodiments of the present invention can be deformed or modified in any way without departing from the principle.

Claims

1. A projection module, characterized in that, Comprising: A transmitting circuit board; A bracket, wherein the bracket is disposed on the transmitting circuit board; An optical element, wherein the optical element is attached to the bracket, and an accommodating space is formed above the transmitting circuit board by the optical element and the bracket; At least one projection unit, wherein the projection unit is disposed in the accommodating space, and the projection unit is conductively attached to the transmitting circuit board; And At least one driving chip, wherein the driving chip is encapsulated in the accommodating space, the driving chip is conductively connected to the transmitting circuit board, and the driving chip is on the same side as the projection unit, and the driving chip sends a light control signal to the projection unit based on the transmitting circuit board; The bracket includes a bracket body, the upper surface of the driving chip is wholly or partially covered by the bracket body of the bracket, and the bracket body contacts the driving chip in a heat-conductive manner, and the heat generated by the driving chip is conducted by the bracket.

2. The projection module according to claim 1, wherein the emission circuit board has an upper end surface and a lower end surface, and the driving chip is attached to the upper end surface of the emission circuit board in a manner adjacent to the projection unit.

3. The projection module according to claim 2, wherein the projection module further comprises a connection layer, and the bracket is connected to the upper end surface of the emission circuit board through the connection layer.

4. The projection module according to claim 3, wherein the connection layer is selected from the group consisting of: an adhesive layer, or a combination composed of a soldering layer.

5. The projection module according to claim 1, wherein the bracket has a receiving cavity, the driving chip is placed in the receiving cavity, and the bracket covers the upper surface of the driving chip in a thermally contacting manner.

6. The projection module according to claim 1, wherein the bracket is selected from the group consisting of: a ceramic sintered bracket and a molded bracket.

7. The projection module according to claim 2, wherein the bracket is integrally formed on the upper end surface of the emission circuit board through a molding process.

8. The projection module according to claim 7, wherein the driving chip is covered by the bracket, and the heat generated by the driving chip is conducted through the bracket.

9. The projection module according to any one of claims 1 to 8, wherein the emission circuit board comprises: A transmitting circuit substrate; A plurality of upper solder joints, wherein the upper solder joints are disposed at the upper end of the transmitting circuit substrate; A plurality of lower solder joints, wherein the lower solder joints are disposed at the lower end of the transmitting circuit substrate; and A plurality of conducting circuits, wherein the conducting circuits electrically connect each of the upper solder joints and each of the lower solder joints, and the driving chip is conductively connected through the upper solder joints and the conducting circuits, and each of the lower solder joints is electrically connected to the upper solder joints through the conducting circuits.

10. The projection module according to claim 9, wherein the projection module further comprises a flexible circuit board and a connector, and the lower solder joints of the emission circuit board are conductively connected to the flexible circuit board, and the flexible circuit board is conductively connected to the connector through the flexible circuit board.

11. The projection module according to any one of claims 1 to 8, wherein the projection module further comprises a flexible printed circuit board, one end of which is conductively connected to the emission circuit board.

12. The projection module according to claim 2, wherein the bracket further has a mounting groove and at least one air escape groove, the mounting groove is formed at the upper end of the bracket body, the optical element is disposed in the mounting groove, and the air escape groove communicates the accommodating space with the external environment, so as to balance the air pressure between the accommodating space and the external environment through the air escape groove.

13. The projection module according to claim 2, wherein the bracket further has at least one glue application area, a cured glue layer is formed by curing glue between the glue application area and the optical element, and an air escape gap is formed therebetween at intervals, and the air escape gap communicates the accommodating space with the external environment, so as to balance the air pressure between the accommodating space and the external environment through the air escape gap.

14. The projection module according to claim 2, wherein the projection module further comprises at least one electronic component, and the electronic component is conductively connected to the emission circuit board.

15. The projection module according to claim 14, wherein the electronic component includes a photodiode for monitoring light changes in the projection module, and the photodiode is conductively connected to the driving chip, so that the driving chip controls the working state of the projection unit based on the detection information of the photodiode.

16. The projection module according to claim 14, wherein the electronic component includes a negative temperature coefficient device, the negative temperature coefficient device is used for monitoring the temperature of the projection unit, and the negative temperature coefficient device is conductively connected to the driving chip through the emission circuit board.

17. The projection module according to claim 9, wherein the emission circuit substrate of the emission circuit board is selected from the combination of a ceramic substrate and a PCB board.

18. A TOF camera module, characterized in that Comprising: A projection module, wherein the projection unit of the projection module is controlled by a driving chip to project a detection light beam, and the projection module includes: A transmitting circuit board; A bracket, wherein the bracket is disposed on the transmitting circuit board; An optical element, wherein the optical element is attached to the bracket, and an accommodating space is formed above the transmitting circuit board by the optical element and the bracket; At least one projection unit, wherein the projection unit is disposed in the accommodating space, and the projection unit is conductively attached to the transmitting circuit board; and At least one driving chip, wherein the driving chip is encapsulated in the accommodating space, the driving chip is conductively connected to the transmitting circuit board, and the driving chip is on the same side as the projection unit, and the driving chip sends a light control signal to the projection unit based on the transmitting circuit board; The bracket includes a bracket body, the upper surface of the driving chip is wholly or partially covered by the bracket body of the bracket, and the bracket body contacts the driving chip in a heat-conductive manner, and the heat generated by the driving chip is conducted by the bracket; and A receiving module, wherein the receiving module is disposed adjacent to the projection module, the receiving module receives the reflected light beam of the detection light beam, and obtains a depth information of an illuminated object based on the reflected light beam.

19. The TOF camera module according to claim 18, wherein the transmitting circuit board has an upper end face and a lower end face, and the driving chip is attached to the upper end face of the transmitting circuit board in a manner adjacent to the projection unit.

20. The TOF camera module according to claim 19, wherein the projection module further includes a connection layer, and the bracket is connected to the upper end face of the transmitting circuit board through the connection layer.

21. The TOF camera module according to claim 20, wherein the connection layer is selected from the combination consisting of an adhesive layer and a soldering layer.

22. The TOF camera module according to claim 18, wherein the bracket has a receiving cavity, the driving chip is placed in the receiving cavity, and the bracket covers the upper surface of the driving chip in a thermally contacting manner.

23. The TOF camera module according to claim 18, wherein the bracket is selected from the bracket combination consisting of a ceramic sintered bracket and a molded bracket.

24. The TOF camera module according to claim 19, wherein the bracket is integrally formed on the upper end face of the transmitting circuit board through a molding process.

25. The TOF camera module according to claim 24, wherein the driving chip is covered by the bracket, and the heat generated by the driving chip is conducted through the bracket.

26. The TOF camera module according to any one of claims 18 to 25, wherein the transmitting circuit board includes: A transmitting circuit substrate; A plurality of upper solder joints, wherein the upper solder joints are disposed at the upper end of the transmitting circuit substrate; A plurality of lower solder joints, wherein the lower solder joints are disposed at the lower end of the transmitting circuit substrate; and Multiple conduction circuits, where the conduction circuits are electrically connected to each of the upper solder joints and each of the lower solder joints, and the drive chip is conductively connected through the upper solder joints and the conduction circuits, and each of the lower solder joints is electrically connected to the upper solder joints through the conduction circuits.

27. The TOF camera module according to claim 18, wherein the projection module and the receiving module are independently arranged.

28. The TOF camera module according to claim 18, wherein the TOF camera module includes a lens assembly, a photosensitive element, and at least one receiving circuit board, wherein the photosensitive element is attached to the receiving circuit board, and the lens assembly is arranged above the receiving circuit board based on the photosensitive path of the photosensitive element.

29. The TOF camera module according to claim 28, wherein the receiving circuit board includes a circuit board receiving end and a circuit board transmitting end integrally extending from the circuit board receiving end, wherein the projection module is disposed above the circuit board transmitting end of the receiving circuit board, and the transmitting circuit board of the projection module is conductively connected to the receiving circuit board through a lower solder joint disposed at the lower end of the transmitting circuit substrate of the transmitting circuit board.

30. The TOF camera module according to claim 29, wherein the TOF camera module further includes at least one flexible board, wherein the flexible board conductively connects the transmitting circuit board of the projection module to the circuit board transmitting end of the receiving circuit board.

31. The TOF camera module according to claim 30, wherein the TOF camera module further includes at least one base bracket, wherein the base bracket is stacked on the circuit board transmitting end of the receiving circuit board, and the projection module is supported above the base bracket, and the height of the projection module is increased by the base bracket.

32. The TOF camera module according to claim 31, wherein the TOF camera module further includes at least one electronic component unit, the electronic component unit is disposed at the circuit board transmitting end, and the base bracket is integrally formed at the circuit board transmitting end, and the electronic component unit is wrapped by the base bracket.

33. The TOF camera module according to claim 31, wherein the TOF camera module further includes at least one electronic component unit, the electronic component unit is disposed at the circuit board transmitting end, the base bracket includes a base bracket main body and further has at least one receiving groove, wherein the receiving groove is formed at the lower end of the base bracket main body, and the base bracket main body is attached above the circuit board transmitting end, and the electronic component unit is wrapped by the base bracket.

34. The TOF camera module according to claim 29, wherein the TOF camera module further includes at least one base bracket, wherein the base bracket is conductively disposed at the circuit board transmitting end of the receiving circuit board, and the projection module is stacked above the base bracket, and the height of the projection module is increased by the base bracket.

35. The TOF camera module according to claim 34, wherein the base bracket includes a base bracket main body and at least one bracket conduction circuit disposed on the base bracket main body, and the bracket conduction circuit electrically connects the transmitting circuit board of the projection module to the circuit board receiving end.

36. The TOF camera module according to claim 29, wherein the transmitting circuit board of the projection module is integrally formed at the circuit board receiving end of the receiving circuit board.

37. The TOF camera module according to claim 31, 34 or 35, wherein the base bracket is selected from: a ceramic bracket sintered from ceramics and a molded bracket composed of a molded base formed integrally by molding.

38. The TOF camera module according to claim 18, wherein the TOF camera module further comprises at least one fixing bracket, wherein the receiving module is arranged on the fixing bracket in a manner that the optical axis can be adjusted, and the receiving module is fixed by the fixing bracket.

39. The TOF camera module according to claim 38, wherein the fixing bracket comprises a receiving end fixing bracket and a transmitting end fixing bracket, wherein the receiving module is arranged on the receiving end fixing bracket, and the projection module is arranged on the transmitting end fixing bracket, and the distance between the projection module and the receiving module is maintained by the fixing bracket.

40. An electronic device, characterized in that Including: An electronic device host; An electronic device main board, where the electronic device main board is disposed in the electronic device host; And At least one TOF camera module, the TOF camera module is conductively disposed on the electronic device main board, and the TOF camera module includes: A projection module, where the projection unit of the projection module is controlled by a drive chip to project a detection light, and the projection module includes: A transmitting circuit board; A bracket, where the bracket is disposed on the transmitting circuit board; An optical element, where the optical element is attached to the bracket, and an accommodation space is formed above the transmitting circuit board by the optical element and the bracket; At least one projection unit, where the projection unit is disposed in the accommodation space, and the projection unit is conductively attached to the transmitting circuit board; and At least one drive chip, where the drive chip is encapsulated in the accommodation space, the drive chip is conductively connected to the transmitting circuit board, and the drive chip is on the same side as the projection unit, and the drive chip sends a light control signal to the projection unit based on the transmitting circuit board; The bracket includes a bracket body, the upper surface of the drive chip is completely or partially covered by the bracket body of the bracket, and the bracket body contacts the drive chip in a heat conduction manner, and the heat generated by the drive chip is conducted through the bracket; and A receiving module, where the receiving module is disposed adjacent to the projection module, the receiving module receives the reflected light of the detection light, and obtains a depth information of the illuminated object based on the reflected light.

41. The electronic device according to claim 40, wherein the transmitting circuit board has an upper end surface and a lower end surface, and the driving chip is attached to the upper end surface of the transmitting circuit board in a manner adjacent to the projection unit.

42. The electronic device according to claim 41, wherein the projection module further comprises a connection layer, and the bracket is connected to the upper end surface of the transmitting circuit board by the connection layer.

43. The electronic device according to claim 42, wherein the connection layer is selected from the combination consisting of an adhesive layer or a soldering layer.

44. The electronic device according to claim 40, wherein the bracket has a receiving cavity, the driving chip is placed in the receiving cavity, and the bracket covers the upper surface of the driving chip in a thermally contacting manner.

45. The electronic device according to claim 40, wherein the bracket is selected from the group consisting of: a bracket combination composed of a ceramic sintered bracket and a molded bracket.

46. The electronic device according to claim 41, wherein the bracket is integrally formed on the upper end surface of the emission circuit board by a molding process.

47. The electronic device according to claim 46, wherein the driving chip is covered by the bracket, and the heat generated by the driving chip is conducted through the bracket.

48. The electronic device according to any one of claims 40 to 47, wherein the emission circuit board includes: A transmitting circuit substrate; Multiple upper solder joints, where the upper solder joints are disposed at the upper end of the transmitting circuit substrate; Multiple lower solder joints, where the lower solder joints are disposed at the lower end of the transmitting circuit substrate; and Multiple conduction circuits, where the conduction circuits are electrically connected to each of the upper solder joints and each of the lower solder joints, and the drive chip is conductively connected through the upper solder joints and the conduction circuits, and each of the lower solder joints is electrically connected to the upper solder joints through the conduction circuits.

49. The electronic device according to claim 48, wherein the lower solder joints of the emission circuit board are conductively connected to the emission circuit substrate on the main board of the electronic device, and the emission circuit board is fixed to the main board of the electronic device.

50. The electronic device according to claim 48, wherein the projection module further includes a flexible printed circuit board and a connector, wherein the lower solder joints of the emission circuit board are conductively connected to the flexible printed circuit board, and the flexible printed circuit board is conductively connected to the connector through the flexible printed circuit board.

51. The electronic device according to claim 48, wherein the projection module and the receiving module are independently arranged.

52. The electronic device according to claim 51, wherein the main board of the electronic device includes a main board body, a pad area and a receiving end mounting groove provided on the main board body, wherein the projection module is arranged in the pad area of the main board of the electronic device, the receiving module is arranged in the receiving end mounting groove, and the projection module and the receiving module are respectively conductively connected to the main board body.

53. The electronic device according to claim 52, wherein the receiving module is installed in the receiving end mounting groove by diving from one surface of the main board body.

54. The electronic device according to claim 51, wherein the main board of the electronic device includes a main board body, a pad area and a receiving end mounting hole provided on the main board body, wherein the projection module is attached to the pad area of the main board of the electronic device, the receiving module is arranged in the receiving end mounting hole, and the projection module and the receiving module are respectively conductively connected to the main board body.

55. The electronic device according to claim 48, wherein the TOF camera module includes a lens assembly, a photosensitive element, and at least one receiving circuit board, wherein the photosensitive element is attached to the receiving circuit board, and the lens assembly is disposed above the receiving circuit board based on the light-sensing path of the photosensitive element.

56. The electronic device according to claim 55, wherein the receiving circuit board includes a circuit board receiving end and a circuit board transmitting end integrally extending from the circuit board receiving end, wherein the projection module is disposed above the circuit board transmitting end of the receiving circuit board, and the transmitting circuit board of the projection module is conductively connected to the receiving circuit board through the lower solder joints.

57. The electronic device according to claim 56, wherein the TOF camera module further includes at least one flexible printed circuit board, wherein the flexible printed circuit board conductively connects the transmitting circuit board of the projection module to the circuit board transmitting end of the receiving circuit board.

58. The electronic device according to claim 57, wherein the TOF camera module further includes at least one base bracket, wherein the base bracket is stacked on the circuit board transmitting end of the receiving circuit board, and the projection module is supported above the base bracket, and the height of the projection module is increased by the base bracket.

59. The electronic device according to claim 58, wherein the TOF camera module further includes at least one electronic component unit, the electronic component unit is disposed on the circuit board transmitting end, and the base bracket is integrally formed on the circuit board transmitting end, and the electronic component unit is wrapped by the base bracket.

60. The electronic device according to claim 58, wherein the TOF camera module further includes at least one electronic component unit, the electronic component unit is disposed on the circuit board transmitting end, the base bracket includes a base bracket main body and further has at least one receiving groove, wherein the receiving groove is formed at the lower end of the base bracket main body, and the base bracket main body is attached above the circuit board transmitting end, and the electronic component unit is wrapped by the base bracket.

61. The electronic device according to claim 56, wherein the TOF camera module further includes at least one base bracket, wherein the base bracket is conductively disposed on the circuit board transmitting end of the receiving circuit board, and the projection module is stacked above the base bracket, and the height of the projection module is increased by the base bracket.

62. The electronic device according to claim 61, wherein the base bracket includes a base bracket body and at least one bracket conduction circuit disposed on the base bracket body, and the bracket conduction circuit is electrically connected to the emission circuit board of the projection module at the circuit board receiving end.

63. The electronic device according to claim 56, wherein the TOF camera module further includes at least one base bracket, and the emission circuit board of the projection module is integrally formed at the circuit board receiving end of the receiving circuit board, and the height of the projection module is increased by the base bracket.

64. The electronic device according to claim 58, 61 or 63, wherein the base bracket is selected from: a ceramic bracket sintered from ceramics and a molded bracket composed of a molded base formed integrally by molding.

65. The electronic device according to claim 40, wherein the TOF camera module further includes at least one fixing bracket, and the receiving module is disposed on the fixing bracket in a manner that the optical axis can be adjusted, and the receiving module is fixed by the fixing bracket.

66. The electronic device according to claim 40, wherein the electronic device main board includes a main board body, a pad area and a receiving end mounting area disposed on the main board body, the projection module of the TOF camera module is attached to the pad area, the receiving module is attached to the receiving end mounting area, and the receiving module is conductively connected to the main board body.

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