pipe base

Abstract

The pipe base of the present invention includes: a pipe base body formed with a through hole; a nickel plating film formed on the surface of the inner wall surface of the pipe base body including the through hole, having concave-convex or voids; and a fixing member provided in the through hole of the pipe base body for fixing a pin, a part of which is received in the concave-convex or voids of the nickel plating film in the through hole.

Description

Technical Field

[0001] This invention relates to a tube seat. Background Technology

[0002] A socket for mounting semiconductor elements such as optical elements is manufactured by forming a socket body with a through hole, and then fixing the pins to the through hole of the socket body via a fixing member made of an insulating material such as glass.

[0003] The retaining component is fitted into the through hole of the tube holder body to allow the pin to pass through. Moreover, by solidifying the retaining component after melting, the pin is fixed to the through hole of the tube holder body via the retaining component. The through hole of the tube holder body is in principle formed as a circle, but sometimes it may be formed as a non-circular shape such as an elongated hole.

[0004] Patent Document 1: Japanese Patent Application Publication No. 2005-191088 Summary of the Invention

[0005] However, in a tube seat with a non-circular through hole formed in the tube seat body, the stress from the tube seat body cannot be uniformly applied to the fixing component fitted into the through hole. That is, during the solidification process after melting, the stress is applied from the tube seat body to the fixing component due to the expansion and contraction of the fixing component and the tube seat body, which have different coefficients of thermal expansion. However, this stress will be uneven in the circumferential direction along the inner wall surface of the non-circular through hole.

[0006] As described above, when uneven stress is applied from the socket to the mounting component, gaps may form between the socket and the mounting component due to heat or impact if semiconductor elements are mounted on the socket or a cover component is installed to protect the semiconductor elements. This can lead to leakage in non-circular through-holes containing the mounting component; leakage refers to the inflow of external air through the gap between the socket and the mounting component. Leakage in through-holes can degrade the quality of the semiconductor elements mounted on the socket, which is undesirable.

[0007] The disclosed technology is proposed in view of the above-mentioned problems, and its purpose is to provide a pipe seat that can suppress leakage in the through hole.

[0008] The tube socket disclosed in this application, in one embodiment, includes: a tube socket body having a through hole; a nickel plating film formed on the surface of the tube socket body, including the inner wall surface of the through hole, having irregularities or gaps; and a fixing member disposed in the through hole of the tube socket body for fixing a pin, a portion of which is housed within the irregularities or gaps of the nickel plating film in the through hole.

[0009] According to one method of the pipe seat disclosed in this application, it is possible to suppress leakage in the through hole. Attached Figure Description

[0010] Figure 1 This is a cross-sectional view illustrating an example of the structure of the tube seat involved in the embodiment.

[0011] Figure 2 This is a top view of the tube seat from above.

[0012] Figure 3 This is a diagram illustrating an example of the setup state of a fixed component.

[0013] Figure 4 This is a diagram illustrating an example of the surface condition of a tube holder corresponding to the Ni coating thickness.

[0014] Symbol Explanation

[0015] 1. Tube socket; 10. Tube socket body; 10a, 10b. Through holes for pins; 20, 40. Fixing components; 30. Electrical signal pins; 50. Power supply pins; 70. Ni coating; 70a. Gap; 70b. Protrusion; R. Component mounting area. Detailed Implementation

[0016] Hereinafter, embodiments of the tube holder disclosed in this application will be described in detail based on the accompanying drawings. Furthermore, the disclosed technology is not limited to these embodiments.

[0017] Example

[0018] tube seat structure

[0019] Figure 1 This is a cross-sectional view illustrating an example of the structure of the tube seat 1 according to an embodiment. Hereinafter, for ease of explanation, [the following will be described]. Figure 1 The surface facing upwards towards the paper is called the upper surface, and the surface facing downwards towards the paper is called the lower surface. However, the tube holder 1 can also be used upside down, and can be used in any orientation. For example... Figure 1 As shown, the tube socket 1 has a tube socket body 10, a fixing component 20, an electrical signal pin 30, a fixing component 40, and a power supply pin 50.

[0020] The socket body 10 is formed of metal in the shape of a circular plate, and serves as a substrate for mounting various components constituting the socket 1. Iron can be used as the metal for forming the socket body 10. A component mounting region R for mounting semiconductor components such as optical components is formed on the upper surface of the socket body 10. A plurality of through holes 10a and 10b for leads are formed in the thickness direction of the upper surface of the socket body 10, surrounding the component mounting region R.

[0021] Figure 2This is a top view of the tube seat 1 as seen from above. Figure 2 In the diagram, the upper surface of the tube base 10 is represented by a disc shape. Figure 2 The cross section of line II is equivalent to Figure 1 The cross-section of the tube seat 1 is shown. Figure 2 As shown, the housing 10 has through holes 10a and 10b for pins. The through hole 10a is circular, and one signal pin 30 is fixed thereon via a fixing member 20. The through hole 10b, on the other hand, is non-circular. In this embodiment, the through hole 10b is elongated. Three power supply pins 50 are fixed in the through hole 10b via a fixing member 40. By fixing three power supply pins 50 within one through hole 10b, the spacing between the pins is reduced, thereby increasing the pin mounting density.

[0022] Furthermore, a nickel (Ni) plating is formed on the surface of the socket body 10, including the inner wall surface of the through holes 10a and 10b for the leads, to prevent surface corrosion of the socket body 10. The Ni plating will be described in detail later.

[0023] return Figure 1 The fixing member 20 is formed of an insulating material with a lower coefficient of thermal expansion than the metal forming the socket body 10, and is disposed in the lead through hole 10a of the socket body 10. Glass can be used as an example of the insulating material forming the fixing member 20. The fixing member 20 has a hole through which a power signal pin 30 is inserted, and the power signal pin 30 inserted into this hole is fixed in the lead through hole 10a. Specifically, the fixing member 20 is fitted into the lead through hole 10a of the socket body 10 and the power signal pin 30 is inserted therethrough. Furthermore, by melting and solidifying the fixing member 20, the power signal pin 30 is fixed in the lead through hole 10a of the socket body 10 via the fixing member 20.

[0024] The electrical signal pin 30 is formed, for example, in a cylindrical shape, for transmitting electrical signals, which are high-frequency signals provided to the semiconductor element on the element mounting area R of the socket body 10. The electrical signal pin 30 is fixed to the pin through-hole 10a of the socket body 10 via the fixing member 20.

[0025] The fixing member 40 is formed of an insulating material with a coefficient of thermal expansion smaller than that of the metal forming the socket body 10, and is disposed in the lead through hole 10b of the socket body 10. Glass can be used as an example of the insulating material forming the fixing member 40. The fixing member 40 has a hole through which a power supply pin 50 is inserted, and the power supply pin 50 inserted into this hole is fixed in the lead through hole 10b. Specifically, the fixing member 40 is fitted into the lead through hole 10b of the socket body 10 and the power supply pin 50 is inserted through it. Furthermore, by melting and solidifying the fixing member 40, the power supply pin 50 is fixed in the lead through hole 10b of the socket body 10 via the fixing member 40. The arrangement of the fixing member 40 will be described in detail later.

[0026] The power supply pin 50 is formed, for example, in a cylindrical shape, and is a pin for providing current to drive a semiconductor device mounted on the component mounting area R of the socket body 10. The power supply pin 50 is fixed to the pin through-hole 10b of the socket body 10 via a fixing member 40.

[0027] Setting status of fixed components

[0028] Next, refer to Figure 3 The setting state of the fixed component 40 is described in detail. Figure 3 This diagram illustrates an example of the mounting configuration of the fixing component 40. The fixing component 40 is provided in the pin through-hole 10b of the tube housing 10 to fix the power supply pin 50 within the pin through-hole 10b. The pin through-hole 10b is formed in an elongated hole shape (see reference). Figure 2 ).

[0029] A Ni coating 70 is formed on the surface of the housing 10, including the inner wall surface of the lead through-hole 10b. The Ni coating 70 has voids 70a that partially expose the surface of the housing 10. For example, the Ni coating 70 has voids 70a at grain boundary locations, which are the boundaries between multiple crystalline particles forming the Ni coating 70. Furthermore, a portion of the fixing member 40 is housed in the voids 70a of the Ni coating 70 in the lead through-hole 10b. Further, a portion of the fixing member 40 contacts the surface of the housing 10 exposed from the voids 70a.

[0030] Furthermore, the Ni coating 70 has a protrusion 70b, which is formed by the diffusion of the metal forming the tube seat 10 onto the Ni coating 70. For example, the Ni coating 70 has a protrusion 70b in the region where the voids 70a are not formed. The protrusion 70b, together with the voids 70a, imparts a certain surface roughness to the tube seat 10. The surface roughness of the tube seat 10 (e.g., arithmetic mean roughness Ra) is, for example, in the range of 2.5 μm to 3.4 μm. Moreover, the fixing member 40 has a recess on its outer peripheral surface at a position corresponding to the protrusion 70b of the Ni coating 70 to receive the protrusion 70b.

[0031] Furthermore, when the tube base body 10 has a non-circular through hole 10b for pins, such as an elongated hole, the stress from the tube base body 10 cannot be uniformly applied to the fixing member 40 fitted into the through hole 10b. That is, during the solidification process after melting, the stress is applied from the tube base body 10 to the fixing member 40 due to the expansion and solidification of the fixing member 40 and the tube base body 10, which have different coefficients of thermal expansion. However, this stress is uneven in the circumferential direction along the inner wall surface of the through hole 10b.

[0032] As described above, when the stress applied by the socket 10 to the fixing member 40 is uneven, if semiconductor elements are mounted on the socket 10 or a cover member for protecting the semiconductor elements is installed, a gap may be generated between the socket 10 and the fixing member 40 due to heat or impact. As a result, leakage may occur in the non-circular pin through-hole 10b in which the fixing member 40 is fitted, allowing external air to flow in through the gap between the socket 10 and the fixing member 40.

[0033] Therefore, in the tube seat 1 of this embodiment, as Figure 3 As shown, a gap 70a is formed in the Ni coating 70 to partially expose the surface of the tube base 10, and a portion of the fixing member 40 is housed in the gap 70a of the Ni coating 70 within the through hole 10b for the pin.

[0034] By forming a void 70a in the Ni coating 70 and housing a portion of the fixing member 40 within the void 70a of the lead through hole 10b, an anchoring effect is achieved, thereby improving the adhesion between the fixing member 40 and the lead through hole 10b. Therefore, even when the stress from the housing 10 cannot be uniformly applied to the fixing member 40 fitted into the non-circular lead through hole 10b, the lead through hole 10b will be stably sealed by the fixing member 40, thus suppressing leakage in the lead through hole 10b.

[0035] Furthermore, in the tube socket 1 of this embodiment, a portion of the fixing member 40 is housed in the gap 70a of the Ni-plated film 70, and is brought into contact with the surface of the tube socket body 10 exposed from the gap 70a. This further improves the adhesion between the fixing member 40 and the lead through-hole 10b, thereby further suppressing leakage in the lead through-hole 10b.

[0036] Furthermore, in the tube seat 1 of this embodiment, a protrusion 70b is formed on the Ni-plated film 70, and a recess is formed on the outer peripheral surface of the fixing member 40 at a position corresponding to the protrusion 70b of the Ni-plated film 70 to receive the protrusion 70b. This creates an anchoring effect, thereby further improving the adhesion between the fixing member 40 and the through-hole 10b for the pin, and further suppressing leakage in the through-hole 10b for the pin.

[0037] Manufacturing method of tube seat

[0038] Figure 1 The tube seat 1 shown can be manufactured, for example, by the following manufacturing method. First, a tube seat body 10 is formed, which has a circular through hole 10a for leads and an elongated through hole 10b for leads. The tube seat body 10 is formed by stamping a metal such as iron by means of, for example, cold forging.

[0039] Next, a Ni plating film 70 is formed on the surface of the socket body 10. At this time, the Ni plating film 70 is formed integrally on the surface of the socket body 10 including the inner wall surface of the lead through hole 10a and the inner wall surface of the lead through hole 10b. The Ni plating film 70 is formed, for example, by Ni electroplating on the surface of the socket body 10.

[0040] Next, a fixing member 20 is embedded in the pin through hole 10a, and a fixing member 40 is embedded in the pin through hole 10b.

[0041] Next, the electrical signal pin 30 is inserted into the hole of the fixing member 20, and the power supply pin 50 is inserted into the fixing member 40. Thus, an intermediate structure having a tube base 10, a fixing member 20, an electrical signal pin 30, a fixing member 40, and a power supply pin 50 is formed.

[0042] Next, the intermediate structure is heated at a temperature that melts the fixing components 20 and 40 (e.g., 1000°C). Heating the intermediate structure melts the fixing components 20 and 40. Afterward, the intermediate structure is cooled to solidify the fixing components 20 and 40.

[0043] By solidifying the fixing components 20 and 40 after melting, the signal pin 30 is fixed to the pin through-hole 10a via the fixing component 20, and the power supply pin 50 is fixed to the pin through-hole 10b via the fixing component 40. Here, due to the heat applied when the fixing component 40 is melted, the Ni coating 70 is recrystallized, and a gap 70a is formed at the grain boundary of the recrystallized Ni coating 70, partially exposing the surface of the socket body 10. Furthermore, a portion of the fixing component 40 is housed in the gap 70a of the Ni coating 70 within the pin through-hole 10b. Additionally, due to the heat applied when the fixing component 40 is melted, the metal forming the socket body 10 diffuses into the Ni coating 70, forming a protrusion 70b in the Ni coating 70. Moreover, a recess is formed in the pin through-hole 10b at a position on the outer peripheral surface of the fixing component 40 corresponding to the protrusion 70b of the Ni coating 70, to accommodate the protrusion 70b. As a result, the through hole 10b for the pins exerts an anchoring effect, thereby improving the adhesion between the fixing component 40 and the through hole 10b for the pins, and thus suppressing leakage in the through hole 10b for the pins.

[0044] Here, refer to Figure 4 The thickness of the Ni coating 70 suitable for forming the voids 70a and the protrusions 70b is explained. Figure 4 This is a diagram illustrating an example of the surface condition of the tube holder 10 corresponding to the thickness of the Ni coating 70. Figure 4 The diagrams 101 and 102 show the surface condition of the tube holder 10 when the Ni coating 70 thickness is 4.5 μm. Furthermore, in... Figure 4 The diagrams 103 and 104 show the surface condition of the tube seat 10 when the Ni coating 70 is 5 μm thick. Diagrams 101 and 103 show the surface condition of the tube seat 10 after Ni electroplating. Diagrams 102 and 104 show the surface condition of the tube seat 10 after the fixing component 40 has been melted and solidified. Surface roughness is also shown in each diagram.

[0045] See Figure 4 It can be seen that the surface of the tube seat 10 after the fixing component 40 is melted and solidified is rougher when the Ni coating 70 thickness is 4.5 μm compared to when the Ni coating 70 thickness is 5 μm. That is, from Figure 4 It can be inferred that when the Ni coating 70 has a thickness of 4.5 μm, voids 70a are formed at the grain boundaries of the recrystallized Ni coating 70. Furthermore, from... Figure 4It can be deduced that when the thickness of the Ni coating 70 is 4.5 μm, the metal forming the tube seat 10 diffuses into the Ni coating 70, forming a protrusion 70b on the Ni coating 70. Therefore, the thickness of the Ni coating 70 is preferably less than 5.0 μm, and more preferably less than 4.5 μm. This allows for the stable formation of voids 70a and protrusions 70b in the Ni coating 70.

[0046] Alternatively, the surface of the Ni coating 70 can be roughened chemically before or after its formation to create irregularities and voids.

[0047] After the fixing components 20 and 40 are cured by cooling the intermediate structure, a Ni / Au coating is integrally formed on the surface of the intermediate structure. The Ni / Au coating is formed, for example, by electroplating Ni onto the surface of the intermediate structure followed by electroplating Au. Thus, the process is completed. Figure 1 The tube seat 1 shown.

[0048] As described above, the socket 1 according to the embodiment includes a socket body 10, a Ni plating 70, and a fixing member 40. A lead through-hole 10b is formed in the socket body 10. The lead through-hole 10b is, for example, non-circular. The Ni plating 70 is formed on the surface of the socket body 10, including the inner wall surface of the lead through-hole 10b, and has a gap 70a. The fixing member 40 is disposed in the lead through-hole 10b of the socket body 10 to fix the power supply lead 50, and a portion of it is housed within the gap 70a of the Ni plating 70 in the lead through-hole 10b. Therefore, leakage in the lead through-hole 10b can be suppressed.

[0049] Furthermore, in the tube socket 1 of the embodiment, a portion of the fixing member 40 is housed within the gap 70a of the Ni-plated film 70 in the through hole 10b for the lead, and contacts the surface of the tube socket body 10 exposed from the gap 70a. This further improves the adhesion between the fixing member 40 and the through hole 10b for the lead, thereby further suppressing leakage in the through hole 10b for the lead.

[0050] Furthermore, in the tube seat 1 of the embodiment, the Ni coating 70 has a protrusion 70b, which is formed by the diffusion of the metal forming the tube seat body 10 onto the Ni coating 70. Moreover, the fixing member 40 has a recess on its outer peripheral surface corresponding to the protrusion 70b of the Ni coating 70, which accommodates the protrusion 70b. This further improves the adhesion between the fixing member 40 and the lead through-hole 10b, thereby further suppressing leakage in the lead through-hole 10b.

[0051] Furthermore, the present invention can also be applied to circular through-holes 10a for leads. That is, by forming a gap 70a on the Ni-plated film 70 and housing a portion of the fixing member 20 within the gap 70a of the Ni-plated film 70 in the through-hole 10a for leads, an anchoring effect is achieved, thereby improving the adhesion between the fixing member 20 and the through-hole 10a for leads. As a result, leakage in the through-hole 10a for leads can be suppressed.

[0052] Furthermore, in the above description, an example was described in which a gap 70a is formed in the Ni coating 70, and a portion of the fixing member 40 is housed within the gap 70a of the Ni coating 70 within the through hole 10b for the lead; however, the disclosed technology is not limited to this. For example, an unevenness may be formed in the Ni coating 70, and a portion of the fixing member 40 may be housed within the unevenness of the Ni coating 70 within the through hole 10b for the lead.

Claims

1. A tube holder, characterized by Comprising: a tube base body formed with a through-hole; a nickel plating film formed on a surface of the tube base body including an inner wall surface of the through-hole, having a gap that partially exposes a surface of the tube base body; and a fixing member provided in the through-hole of the tube base body for fixing a pin, a portion of which is received in the gap of the nickel plating film in the through-hole.

2. The tube base according to claim 1, wherein the through-hole is non-circular.

3. The tube base according to claim 1 or 2, wherein a plurality of the pins are fixed in the through-hole.

4. The tube base according to claim 1, wherein the fixing member is in contact with the surface of the tube base body exposed from the gap.

5. The tube base according to claim 1, wherein the tube base body is formed of metal, the fixing member is formed of an insulating material having a smaller coefficient of thermal expansion than the metal forming the tube base body.

6. The tube base according to claim 5, wherein the metal is iron, the insulating material is glass.

7. The tube base according to claim 5 or 6, wherein the nickel plating film has a convex portion formed by diffusion of the metal forming the tube base body into the nickel plating film, the fixing member has a concave portion in a position of an outer peripheral surface thereof corresponding to the convex portion of the nickel plating film, which receives the convex portion.

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