Camera module and electronic device including the same

Abstract

An electronic device includes a camera module and an external structure. The camera module includes an image sensor and a shielding structure that shields components of the camera module from electromagnetic interference (EMI). The external structure two-dimensionally surrounds the camera module, and a portion of the external structure is electrically conductive. The shielding structure includes an accommodation portion that accommodates the image sensor and a protruding portion that protrudes from the accommodation portion to contact the external structure.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2019-0119822, filed on September 27, 2019, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] This disclosure relates to camera modules and electronic devices including such camera modules, and more specifically, to camera modules including shielding structures and electronic devices including such camera modules. Background Technology

[0004] In electronic devices that include a camera module, electromagnetic waves generated by the camera module can affect another electronic component in the device, and electromagnetic waves generated by that other electronic component can affect the camera module. Therefore, in order to shield against electromagnetic interference (EMI) and improve electromagnetic compatibility (EMC), the camera module may have a shielding structure. Summary of the Invention

[0005] On the one hand, it provides a camera module with high electromagnetic compatibility (EMC) and electronic devices including the camera module.

[0006] According to one aspect of the embodiments, an electronic device is provided, comprising: a camera module including an image sensor and a shielding structure configured to shield components of the camera module from electromagnetic interference (EMI); and an external structure surrounding the camera module in two dimensions, at least a portion of the external structure being conductive, wherein the shielding structure includes a receiving portion configured to receive the image sensor and a protruding portion protruding from the receiving portion, and wherein the protruding portion of the shielding structure contacts the external structure.

[0007] According to one aspect of the embodiments, an electronic device is provided, comprising: a main circuit board; an electronic component connected to the main circuit board; a first camera module connected to the main circuit board; a device housing including sidewalls surrounding a space therein containing the main circuit board, the electronic component, and the first camera module; and a front panel configured to cover the space therein containing the main circuit board, the electronic component, and the first camera module, wherein at least a portion of the device housing is conductive, wherein the first camera module includes a first image sensor and a first shielding structure surrounding the first image sensor, wherein the first shielding structure of the first camera module includes a first protrusion contacting the device housing.

[0008] In accordance with an aspect of an embodiment, an electronic device is provided that includes a main circuit board, a first camera module connected to the main circuit board, a second camera module connected to the main circuit board, a flange surrounding the first camera module and the second camera module, and a device housing configured to house the main circuit board, the first camera module, the second camera module, and the flange, wherein at least a portion of the flange is electrically conductive, wherein the first camera module includes a first image sensor and a first shielding structure surrounding the first image sensor and including a first protruding portion that contacts the flange.

[0009] In accordance with another aspect of an embodiment, an electronic device is provided that includes a camera module including an image sensor, and an electrically conductive shielding structure including a housing portion surrounding the image sensor and a protruding portion protruding from the housing portion, and the protruding portion contacts an electrically conductive flange or an electrically conductive portion of a device housing of the electronic device. BRIEF DESCRIPTION OF DRAWINGS

[0010] Various embodiments will be more clearly understood as follows in conjunction with the accompanying drawings, in which:

[0011] FIG. 1A is an exploded perspective view of a camera module according to an embodiment;

[0012] FIG. 1B is a cross-sectional view of a camera module according to an embodiment;

[0013] FIGS. 2A-2D is a cross-sectional view of a shielding structure according to an embodiment;

[0014] FIGS. 3A-3B is a cross-sectional view of a camera module according to an embodiment;

[0015] FIG. 4 is an exploded perspective view of an electronic device according to an embodiment;

[0016] FIG. 5A is a plan view of an electronic device with a front panel removed according to an embodiment;

[0017] FIG. 5B is a cross-sectional view of an electronic device taken along line B-B' of FIG. 5A

[0018] FIG. 5C is a cross-sectional view of an electronic device taken along line C-C' of FIG. 5A

[0019] FIGS. 6-8 is a plan view of an electronic device with a front panel removed according to an embodiment; ​​

[0020] FIG. 9 is a cross-sectional view of a device housing according to an embodiment;

[0021] FIG. 10 is an exploded perspective view of an electronic device according to an embodiment;

[0022] FIG. 11A is a plan view of an electronic device with a front panel removed according to an embodiment;

[0023] FIG. 11B is a cross-sectional view of an electronic device taken along FIG. 11A line B-B' according to an embodiment;

[0024] FIG. 11C is a cross-sectional view of an electronic device taken along FIG. 11A line C-C' according to an embodiment;

[0025] FIG. 12 is an exploded perspective view of an electronic device according to an embodiment;

[0026] FIG. 13A is a plan view of an electronic device with a rear panel removed according to an embodiment;

[0027] FIG. 13B is a cross-sectional view of an electronic device taken along FIG. 13A line B-B' according to an embodiment;

[0028] FIG. 13C is a cross-sectional view of an electronic device taken along FIG. 13A line C-C' according to an embodiment;

[0029] FIG. 14 is an exploded perspective view of an electronic device according to an embodiment;

[0030] FIG. 15A is a plan view of an electronic device with a front panel removed according to an embodiment;

[0031] FIG. 15B is a cross-sectional view of an electronic device taken along FIG. 15A line B-B' according to an embodiment;

[0032] FIG. 15C is a cross-sectional view of an electronic device taken along FIG. 15A line C-C' according to an embodiment;

[0033] FIG. 16 is a cross-sectional view of a flange according to an embodiment;

[0034] FIGS. 17A-17C is a plan view showing a device housing and a camera module in an electronic device according to an embodiment;

[0035] FIGS. 18A-18H is a plan view illustrating a device housing and a camera module in an electronic device according to an embodiment; and

[0036] FIGS. 19A-19E is a plan view illustrating a flange and a camera module in an electronic device according to an embodiment. DETAILED DESCRIPTION

[0037] FIG. 1A is an exploded perspective view of a camera module CM according to an embodiment. FIG. 1B is a cross-sectional view of a camera module CM according to an embodiment.

[0038] Referring to FIG. 1A and FIG. 1B , the camera module CM can include a module circuit board 60, a connector 70, an image sensor 50, an optical filter 40, a lens assembly 20, a module housing 30, and a shielding structure 10. The module circuit board 60 can include, for example, a printed circuit board (PCB). The connector 70 can be connected to the module circuit board 60. The camera module CM can be connected to components outside the camera module CM, for example, to a main circuit board 130 (refer to FIG. 4 ) through the connector 70.

[0039] The image sensor 50 can be located on and connected to the module circuit board 60. The image sensor 50 can convert light into an electrical signal. The electrical signal generated by the image sensor 50 can be output to components outside the camera module CM through the module circuit board 60 and the connector 70. The image sensor 50 can include, for example, a complementary metal-oxide-semiconductor (CMOS) sensor or a charge-coupled device (CCD) sensor.

[0040] The optical filter 40 can be located on the image sensor 50. The optical filter 40 can block or transmit a portion of a spectrum of light that enters the optical filter 40 and has a particular wavelength. For example, the optical filter 40 can include an infrared (IR) blocking filter that blocks near-infrared (NIR) light (e.g., light having a wavelength from about 700 nm to about 1150 nm). In some embodiments, the optical filter 40 can be omitted.

[0041] The lens assembly 20 can be located on the optical filter 40. The lens assembly 20 can include at least one lens for focusing light passing therethrough. The module housing 30 can house the image sensor 50, the optical filter 40, and the lens assembly 20. That is, the module housing 30 can surround the image sensor 50, the optical filter 40, and the lens assembly 20. The module housing 30 can secure the optical filter 40 and the lens assembly 20. In some embodiments, the module housing 30 can be omitted, and the shield structure 10 can function as the module housing 30. That is, in some embodiments, the shield structure 10 can house and protect the image sensor 50, the optical filter 40, and the lens assembly 20.

[0042] The shield structure 10 can house the module housing 30. The shield structure 10 can surround the image sensor 50. In order for light to be able to enter the lens assembly 20, the module housing 30 can include an opening or window that exposes the lens assembly 20. The shield structure 10 can shield components housed therein from electromagnetic interference (EMI). The shield structure 10 is electrically conductive and can include an electrically conductive material. For example, the shield structure 10 can include a metal, such as copper (Cu), aluminum (Al), gold (Au), nickel (Ni), silver (Ag), iron (Fe), or a combination thereof.

[0043] The shield structure 10 can include a housing portion 10Q that houses (i.e., surrounds) the image sensor 50, and a protruding portion 10P that protrudes outward from the housing portion 10Q. The housing portion 10Q can include side walls and a top. For example, the housing portion 10Q can include four side walls and a top connected to each of the four side walls. The top of the housing portion 10Q can include an opening or window through which light can enter the lens assembly 20. The protruding portion 10P of the shield structure 10 can protrude outward from the side walls of the housing portion 10Q in, for example, the -X direction. FIG. 1A The protruding portion 10P of the shield structure 10 is electrically conductive and can include an electrically conductive material. The protruding portion 10P of the shield structure 10 can include the same material as the housing portion 10Q of the shield structure 10, however, embodiments are not limited thereto, and in some embodiments, the protruding portion 10P of the shield structure 10 can include a different material than the housing portion 10Q of the shield structure 10.

[0044] In some embodiments, the protruding portion 10P of the shielding structure 10 may be integral with the receiving portion 10Q of the shielding structure 10. That is, there is no real boundary between the protruding portion 10P and the receiving portion 10Q of the shielding structure 10, and a virtual boundary can be used to distinguish the protruding portion 10P and the receiving portion 10Q of the shielding structure 10. In other embodiments, the protruding portion 10P and the receiving portion 10Q of the shielding structure 10 may be formed as separate bodies and then joined together, for example, by bonding, adhesives, etc. That is, in some embodiments, a real boundary may exist between the protruding portion 10P and the receiving portion 10Q of the shielding structure 10.

[0045] The protruding portion 10P of the shielding structure 10 can contact an external structure (e.g., FIG. 4 The device housing 110 shown in the figure FIG. 14 As shown in the diagram, flange 170), this external structure is located outside the camera module CM and at least a portion of it is conductive. Therefore, the shielding structure 10 can be electrically connected to the external structure, and thus, can be... FIG. 1A The shielding structure 10 shown improves electromagnetic compatibility (EMC). Furthermore, heat generated by the camera module CM can be transferred to the external structure, and therefore, heat dissipation performance can be improved through the shielding structure 10. Thus, the camera module CM according to the embodiment can have improved EMC and heat dissipation performance.

[0046] FIGS. 2A-2D This is a cross-sectional view showing an example of the shielding structures 10a to 10d according to an embodiment.

[0047] Reference FIGS. 2A-2D The protruding portions 10Pa to 10Pd of the shielding structures 10a to 10d can have various shapes. For example, although FIG. 1A and FIG. 1B The protruding portion 10P of the shielding structure 10 shown extends in only one direction, but according to other embodiments, FIG. 2A The protruding portion 10Pa of the shielding structure 10a shown may include multiple portions extending in different directions. For example, the protruding portion 10Pa may include a first portion 10Pa-1 extending outward (e.g., in the -X direction) and downward (e.g., in the -Z direction) from the receiving portion 10Q, and a second portion 10Pa-2 extending outward (e.g., in the -X direction) and upward (e.g., in the +Z direction). Additionally, although... FIG. 1A and FIG. 1B The protruding portion 10P of the shielding structure 10 shown is straight, but according to other embodiments, such as FIG. 2B As shown, the protruding portion 10Pb of the shielding structure 10b can be bent. Additionally, in some embodiments, such as...FIG. 2C As shown, the protruding portion 10Pc of the shielding structure 10c can have a more complex shape, such as a coil shape.

[0048] In some embodiments, the protruding portions 10Pa to 10Pc of the shielding structures 10a to 10c can function as springs. In other words, the protruding portions 10Pa to 10Pc of the shielding structures 10a to 10c can be deformed, and can have a structure in which an elastic force can be applied to the outside by the deformation. Thus, the protruding portions 10Pa to 10Pc of the shielding structures 10a to 10c can hold contact with the outside structure (e.g., the device housing 110 or the flange 170 shown in FIG. 1) by the elasticity. FIG. 4 The device housing 110 or the flange 170 shown in FIG. 1 FIG. 14 The device housing 110 or the flange 170 shown in FIG. 1

[0049] Referring to FIG. 2D According to some embodiments, the shielding structure 10d can include an adhesive 10T and a protruding portion 10Pd. The adhesive 10T can attach the protruding portion 10Pd of the shielding structure 10d to the housing portion 10Q of the shielding structure 10d. In some embodiments, the protruding portion 10Pd can include a first surface 10Pd-s facing the housing portion 10Q and a second surface 10Pd-o extending outward from the housing portion 10Q (as shown in FIG. 10B), and the adhesive 10T can be located between the housing portion 10Q and the first surface 10Pd-s of the protruding portion 10Pd facing the housing portion 10Q (as shown in FIG. 10B). FIG. 1A In other words, the adhesive 10T can be attached to the side wall of the housing portion 10Q between the first surface 10Pd-s and the side wall of the housing portion 10Q. In this case, the adhesive 10T can include a conductive material. In other embodiments, unlike in FIG. 10B, the adhesive 10T can be located on the outside of the outward-facing second surface 10Pd-o of the protruding portion 10Pd, and can extend over the housing portion 10Q of the shielding structure 10d. In other words, the adhesive portion can not be disposed between the protruding portion 10Pd and the side wall of the housing portion 10Q, but can be attached to the outside of the protruding portion 10Pd, and can wrap around at least a portion of the side wall and the top of the housing portion 10Q. FIG. 2D In other words, the adhesive 10T can be attached to the side wall of the housing portion 10Q between the first surface 10Pd-s and the side wall of the housing portion 10Q. In this case, the adhesive 10T can include a conductive material. In other embodiments, unlike in FIG. 10B, the adhesive 10T can be located on the outside of the outward-facing second surface 10Pd-o of the protruding portion 10Pd, and can extend over the housing portion 10Q of the shielding structure 10d. In other words, the adhesive portion can not be disposed between the protruding portion 10Pd and the side wall of the housing portion 10Q, but can be attached to the outside of the protruding portion 10Pd, and can wrap around at least a portion of the side wall and the top of the housing portion 10Q. FIG. 2D In other words, the adhesive 10T can be attached to the side wall of the housing portion 10Q between the first surface 10Pd-s and the side wall of the housing portion 10Q. In this case, the adhesive 10T can include a conductive material. In other embodiments, unlike in FIG. 10B, the adhesive 10T can be located on the outside of the outward-facing second surface 10Pd-o of the protruding portion 10Pd, and can extend over the housing portion 10Q of the shielding structure 10d. In other words, the adhesive portion can not be disposed between the protruding portion 10Pd and the side wall of the housing portion 10Q, but can be attached to the outside of the protruding portion 10Pd, and can wrap around at least a portion of the side wall and the top of the housing portion 10Q.

[0050] FIGS. 3A-3B are cross-sectional views of camera modules CMa and CMb according to embodiments, respectively.

[0051] Referring to FIG. 3AThe camera module CMa can further include a prism 80 located in the module housing 30. The prism 80 can change a traveling direction of light. Light can enter the prism 80 through an opening or a window of the module housing 30 and the shielding structure 10 in a vertical direction (e.g., -Z direction) and can exit from the prism 80 in a horizontal direction (e.g., X direction). The lens assembly 20 is located in the module housing 30 and can be oriented such that an optical axis of the lens assembly 20 is parallel to the horizontal direction (e.g., X direction). The image sensor 50 can be erected so as to receive light traveling in the horizontal direction (e.g., X direction). That is, a pixel array of the image sensor 50 can face the horizontal direction (e.g., -X direction).

[0052] Referring to FIG. 3B , the camera module CMb can include a plurality of individual camera modules CM1 and CM2, and the plurality of individual camera modules CM1 and CM2 can share the shielding structure 10. In this configuration, the shielding structure 10 can include an opening or a window corresponding to each of the plurality of individual camera modules CM1 and CM2, as shown in FIG. 3B . The camera module CMb can be referred to as a dual camera module.

[0053] FIG. 4 is an exploded perspective view of an electronic device according to an embodiment. FIG. 5A is a plan view of an electronic device with a front panel removed according to an embodiment. FIG. 5B is a cross-sectional view of the electronic device taken along line B-B' of FIG. 5A . FIG. 5C is a cross-sectional view of the electronic device taken along line C-C' of FIG. 5A .

[0054] Hereinafter, the electronic device 100 is described by way of a smartphone as an example. However, the electronic device 100 is not limited thereto. For example, the electronic device 100 can include any portable electronic device such as a smartwatch, smartglasses, a smart band, a tablet personal computer (PC), a personal digital assistant (PDA), a digital camera, or a game console, any home appliance such as a refrigerator, a washing machine, a dryer, a vacuum cleaner, or a television, any transport unit such as a vehicle, a ship, or an airplane, an industrial electronic device, or a robot.

[0055] Referring to FIG. 4 , for example, the electronic device 100 can include a main circuit board 130, a camera module (a front camera module CM-F and / or a rear camera module CM-R), electronic components 140, a front panel 120, a rear panel 160, and a device housing 110.

[0056] The main circuit board 130 can include, for example, a PCB. The front camera module CM-F, the rear camera module CM-R, and the electronic component 140 can be connected to the main circuit board 130. Each of the front camera module CM-F and the rear camera module CM-R can be a camera module described with reference to FIGS. 1A and 1B. FIGS. 1A-3B The front camera module CM-F can be oriented to face a front surface, i.e., the front panel 120, of the electronic device 100. The rear camera module CM-R can be oriented to face a rear surface, i.e., the rear panel 160, of the electronic device 100.

[0057] The electronic component 140 can include, for example, a memory, a processor, and / or an interface. The memory can include, for example, a dynamic random access memory (DRAM), a static random access memory (SRAM), a flash memory, an electrically erasable programmable read-only memory (EEPROM), a phase- change random access memory (PRAM), a magnetic random access memory (MRAM), and / or a resistive random access memory (RRAM). The processor can include, for example, a central processing unit (CPU), a graphics processing unit (GPU), and / or an application processor (AP). The interface can include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB), an interface, a secure digital (SD) card interface, and / or an audio interface.

[0058] In some embodiments, the electronic device 100 can further include a battery 150 connected to the main circuit board 130. In some embodiments, although not shown in FIG. 1A, FIG. 4 In some embodiments, although not shown in FIG. 1A, the electronic device 100 can further include a communication module, a microphone, a speaker, a fingerprint sensor, a gyro sensor, a bio sensor, an illumination sensor, a humidity sensor, a temperature sensor, and / or a flash.

[0059] The front panel 120 and the rear panel 160 can face each other. The device case 110 can be between the front panel 120 and the rear panel 160. The front panel 120, the device case 110, and the rear panel 160 together can form an outer shape of the electronic device 100. That is, the front panel 120, the device case 110, and the rear panel 160 can be exposed to the outside of the electronic device 100. For example, the front panel 120 can form a front surface of the electronic device 100, the rear panel 160 can form a rear surface of the electronic device 100, and the device case 110 can form side surfaces of the electronic device 100.

[0060] The main circuit board 130, the front camera module CM-F, the rear camera module CM-R, the electronic components 140, and the battery 150 can be accommodated in a space formed by the front panel 120, the device housing 110, and the rear panel 160. The device housing 110 can include a sidewall that, for example, two-dimensionally surrounds the space in which the main circuit board 130, the front camera module CM-F, the rear camera module CM-R, the electronic components 140, and the battery 150 are located. The front panel 120 and the rear panel 160 can cover the space in which the main circuit board 130, the front camera module CM-F, the rear camera module CM-R, the electronic components 140, and the battery 150 are located.

[0061] The front panel 120 can include a display 122. In addition, the front panel 120 can further include a front cover 121 including a transparent window located on the display 122. The front panel 120 can further include a touch input panel (not shown) between the transparent window of the front cover 121 and the display 122. The front panel 120 can include an opening or window 120A for the front camera module CM-F to receive light. The rear panel 160 can include an opening or window 160A for the rear camera module CM-R to receive light.

[0062] The device housing 110 can accommodate the main circuit board 130, the front camera module CM-F, the rear camera module CM-R, the electronic components 140, and the battery 150. At least a portion of the device housing 110 can be electrically conductive and can include an electrically conductive material. For example, the device housing 110 can include a metal, such as Cu, Al, Au, Ni, Ag, Fe, or a combination of these metals.

[0063] Referring to FIGS. 5A-5CThe protruding portions 10P-F of the shielding structure 10-F of the front camera module CM-F and the protruding portions 10P-R of the shielding structure 10-R of the rear camera module CM-R can contact the device housing 110. In some embodiments, the protruding portions 10P-F of the shielding structure 10-F of the front camera module CM-F and the protruding portions 10P-R of the shielding structure 10-R of the rear camera module CM-R can protrude in different directions in two dimensions. For example, in some embodiments, the protruding portions 10P-F of the shielding structure 10-F of the front camera module CM-F can protrude in a +Y direction, and the protruding portions 10P-R of the shielding structure 10-R of the rear camera module CM-R can protrude in a -X direction. That is, a surface on which the protruding portions 10P-F of the shielding structure 10-F of the front camera module CM-F of the front camera module CM-F are located and a surface on which the protruding portions 10P-R of the shielding structure 10-R of the rear camera module CM-R of the rear camera module CM-R are located can face different directions. For example, the surface on which the protruding portions 10P-F of the shielding structure 10-F of the front camera module CM-F of the front camera module CM-F are located can face a +Y direction, and the surface on which the protruding portions 10P-R of the shielding structure 10-R of the rear camera module CM-R of the rear camera module CM-R are located can face a -X direction.

[0064] FIG. 6 is a plan view of an electronic device from which a front panel is removed, according to an embodiment.

[0065] Referring to FIG. 6 In some embodiments, the protruding portions 10P-F of the shielding structure 10-F of the front camera module CM-F and the protruding portions 10P-R of the shielding structure 10-R of the rear camera module CM-R can protrude in the same direction in two dimensions. For example, the protruding portions 10P-F of the shielding structure 10-F of the front camera module CM-F can protrude in a +Y direction, and the protruding portions 10P-R of the shielding structure 10-R of the rear camera module CM-R can protrude in the +Y direction. That is, a surface on which the protruding portions 10P-F of the shielding structure 10-F of the front camera module CM-F of the front camera module CM-F are located and a surface on which the protruding portions 10P-R of the shielding structure 10-R of the rear camera module CM-R of the rear camera module CM-R are located can face the same direction. For example, the surface on which the protruding portions 10P-F of the shielding structure 10-F of the front camera module CM-F of the front camera module CM-F are located and the surface on which the protruding portions 10P-R of the shielding structure 10-R of the rear camera module CM-R of the rear camera module CM-R are located can face a +Y direction.

[0066] FIG. 7 is a plan view of an electronic device from which a front panel is removed, according to an embodiment.

[0067] Referring to FIG. 7 In some embodiments, although the protruding portion 10P-F of the shielding structure 10-F of the front camera module CM-F contacts the device housing 110, the protruding portion 10P-R of the shielding structure 10-R of the rear camera module CM-R can not contact the device housing 110 but can contact the shielding structure 10-F of the front camera module CM-F. Accordingly, the shielding structure 10-R of the rear camera module CM-R can be electrically connected to the device housing 110 through the shielding structure 10-F of the front camera module CM-F.

[0068] According to FIG. 7 In the embodiment shown in FIG. 10, the front camera module CM-F is disposed not to overlap the display 122 of the front panel 120 two-dimensionally, and the rear camera module CM-R is disposed at a position away from the sidewall of the device housing 110. However, since the rear camera module CM-R can contact the shielding structure 10-F of the front camera module CM-F, the flexibility of the design of the disposition of the rear camera module CM-R can increase.

[0069] FIG. 8 is a plan view of an electronic device from which a front panel according to an embodiment is removed.

[0070] Referring to FIG. 8 In the embodiment shown in FIG. 10, the front camera module CM-F is disposed not to overlap the display 122 of the front panel 120 two-dimensionally, and the rear camera module CM-R is disposed at a position away from the sidewall of the device housing 110. However, since the rear camera module CM-R can contact the shielding structure 10-F of the front camera module CM-F, the flexibility of the design of the disposition of the rear camera module CM-R can increase.

[0071] According to FIG. 8When the manufacturer of the electronic device 100 purchases only the front camera module CM-F including the shielding structure 10-F having two protruding portions (e.g., the first protruding portion 10P-F-1 and the second protruding portion 10P-F-2), the rear camera module CM-R including the shielding structure 10-R having no protruding portion can also be used, which is economical, in the embodiment shown in FIG. 1. In addition, when the front camera module CM-F is to be disposed not to overlap the display 122 of the front panel 120 two-dimensionally, there is no such restriction on the disposition of the rear camera module CM-R, and thus the flexibility of the design of the disposition of the rear camera module CM-R can increase, although the rear camera module CM-R is disposed at a position away from the sidewall of the device housing 110, since the rear camera module CM-R can contact the shielding structure 10-F of the front camera module CM-F.

[0072] FIG. 9 is a cross-sectional view of a device housing according to an embodiment.

[0073] Referring to FIG. 9 In some embodiments, the device housing 110 can include a conductive body 111 and an insulating coating 112 on the conductive body 111. The conductive body 111 can include any electrically conductive material, e.g., a metal such as Cu, Al, Au, Ni, Ag, Fe, or a combination of these metals. The insulating coating 112 can include, e.g., a polymer. The protruding portions 10P-F and 10P-R of the shielding structures 10-F and 10-R of the camera modules CM-F and CM-R can contact the conductive body 111 of the device housing 110. For example, the insulating coating 112 of the device housing 110 can expose at least a portion of the conductive body 111 of the device housing 110, and the protruding portions 10P-F and 10P-R of the shielding structures 10-F and 10-R of the camera modules CM-F and CM-R can contact the exposed portion of the conductive body 111 of the device housing 110. FIGS. 5A-5C Alternatively, the protruding portions 10P-F and 10P-R of the shielding structures 10-F and 10-R of the camera modules CM-F and CM-R shown in FIG. 1 can pass through the insulating coating 112 of the device housing 110 and can contact the conductive body 111 of the device housing 110. FIGS. 5A-5C Alternatively, the protruding portions 10P-F and 10P-R of the shielding structures 10-F and 10-R of the camera modules CM-F and CM-R shown in FIG. 1 can pass through the insulating coating 112 of the device housing 110 and can contact the conductive body 111 of the device housing 110.

[0074] FIG. 10 is an exploded perspective view of an electronic device according to an embodiment. FIG. 11A is a plan view of an electronic device with a front panel removed according to an embodiment. FIG. 11B is a cross-sectional view of an electronic device taken along FIG. 11A line B-B' of FIG. 1B. FIG. 11C is a cross-sectional view of an electronic device taken along FIG. 11A line C-C' of FIG. 1C.

[0075] Referring to FIG. 10With FIG. 4 In comparison with the electronic device 100 illustrated in FIG. 1A, the electronic device 100b can omit the back panel 160 illustrated in FIG. 1A, and can include a device housing 110b different from the device housing 110 illustrated in FIG. 1A. In comparison with the device housing 110 illustrated in FIG. 1A, the device housing 110b can further include a bottom 110B. The bottom 110B of the device housing 110b can face the front panel 120 and can be spaced apart from the front panel 120. The sidewall 110S of the device housing 110b can be located between the front panel 120 and the bottom 110B of the device housing 110b. The device housing 110b can form at least a portion of the outer shape of the electronic device 100b. The bottom 110B of the device housing 110b can form a rear surface of the electronic device 100b, and the sidewall 110S of the device housing 110b can form a side surface of the electronic device 100b. FIG. 4 FIG. 4 In comparison with the electronic device 100 illustrated in FIG. 1A, the electronic device 100b can omit the back panel 160 illustrated in FIG. 1A, and can include a device housing 110b different from the device housing 110 illustrated in FIG. 1A. In comparison with the device housing 110 illustrated in FIG. 1A, the device housing 110b can further include a bottom 110B. The bottom 110B of the device housing 110b can face the front panel 120 and can be spaced apart from the front panel 120. The sidewall 110S of the device housing 110b can be located between the front panel 120 and the bottom 110B of the device housing 110b. The device housing 110b can form at least a portion of the outer shape of the electronic device 100b. The bottom 110B of the device housing 110b can form a rear surface of the electronic device 100b, and the sidewall 110S of the device housing 110b can form a side surface of the electronic device 100b. FIG. 4

[0076] The main circuit board 130, the front camera module CM-F, the rear camera module CM-R, the electronic component 140, and the battery 150 can be accommodated in a space formed by the front panel 120 and the device housing 110b. The sidewall 110S of the device housing 110b can surround the space in which the main circuit board 130, the front camera module CM-F, the rear camera module CM-R, the electronic component 140, and the battery 150 are located, for example, two-dimensionally. The bottom 110B of the device housing 110b can cover the space in which the main circuit board 130, the front camera module CM-F, the rear camera module CM-R, the electronic component 140, and the battery 150 are located. The bottom 110B of the device housing 110b can include an opening or a window 110A through which the rear camera module CM-R receives light.

[0077] In some embodiments, the device housing 110b can further include an inner wall 110W located on the bottom 110B of the device housing 110b and in the space surrounded by the sidewall 110S of the device housing 110b. The inner wall 110W of the device housing 110b can extend from the bottom 110B of the device housing 110b toward the front panel 120, for example, the inner wall 110W of the device housing 110b can extend upward (+Z direction) from the bottom 110B of the device housing 110b. The inner wall 110W of the device housing 110b can be located around the opening or window 110A of the bottom 110B of the device housing 110b. Further, the inner wall 110W of the device housing 110b can be located around the rear camera module CM-R. In some embodiments, the inner wall 110W of the device housing 110b can two-dimensionally and completely surround the rear camera module CM-R.

[0078] Referring to FIGS. 11A-11C ​​The protruding portion 10P-F of the shielding structure 10-F of the front camera module CM-F can contact the side wall 110S of the device housing 110b, whereas the protruding portion 10P-R of the shielding structure 10-R of the rear camera module CM-R can contact the inner wall 110W of the device housing 110b. When the front camera module CM-F is to be disposed not to overlap the display 122 two-dimensionally, since the front camera module CM-F is close to the side wall 110S of the device housing 110b, it is advantageous that the front camera module CM-F contacts the side wall 110S of the device housing 110b. On the other hand, although the rear camera module CM-R is disposed at a position away from the side wall 110S of the device housing 110b, since the rear camera module CM-R can contact the inner wall 110W of the device housing 110b, the flexibility of the arrangement design of the rear camera module CM-R can increase.

[0079] FIG. 12 is an exploded perspective view of an electronic device according to an embodiment. FIG. 13A is a plan view of an electronic device with a rear panel removed according to an embodiment. FIG. 13B is a cross-sectional view of the electronic device taken along line B-B' of FIG. 13A . FIG. 13C is a cross-sectional view of the electronic device taken along line C-C' of FIG. 13A .

[0080] Referring to FIG. 12 and FIGS. 13A-13C , compared with the electronic device 100b shown in FIG. 10 , the electronic device 100c can include a device housing 110c instead of the device housing 110b shown in FIG. 10 , and can further include the rear panel 160 shown in FIG. 4 . The device housing 110c can have a structure in which the device housing 110b shown in FIG. 10 is reversed. That is, the bottom 110B of the device housing 110c can be located on the front panel 120, can face the rear panel 160, and can be spaced apart from the rear panel 160. The side wall 110S of the device housing 110c can be located between the rear panel 160 and the bottom 110B of the device housing 110c.

[0081] Through the opening or window 110A of the device housing 110c, a front camera module CM-F, not a rear camera module CM-R, can receive light. An inner wall 110W of the device housing 110c can extend from a bottom 110B of the device housing 110c toward the rear panel 160, for example, the inner wall 110W of the device housing 110c can extend downward (in the -Z direction) from the bottom 110B of the device housing 110c. The inner wall 110W of the device housing 110c can not be located around the opening or window 110A of the bottom 110B of the device housing 110b, but can be located around the rear camera module CM-R. In some embodiments, the inner wall 110W of the device housing 110c can two-dimensionally and completely surround the rear camera module CM-R.

[0082] FIG. 14 is an exploded perspective view of an electronic device according to an embodiment. FIG. 15A is a plan view of an electronic device with a front panel removed according to an embodiment. FIG. 15B is a cross-sectional view of the electronic device taken along FIG. 15A line B-B' of FIG. 1D. FIG. 15C is a cross-sectional view of the electronic device taken along FIG. 15A line C-C' of FIG. 1D.

[0083] Referring to FIG. 14 , unlike the electronic device 100 shown in FIG. 4 , the electronic device 100d can further include a flange 170 housed in the device housing 110. The flange 170 can not be exposed to the outside of the electronic device 100d. The flange 170 can surround the rear camera module CM-R. The flange 170 can be electrically conductive and can include an electrically conductive material. For example, the flange 170 can include a metal such as Cu, Al, Au, Ni, Ag, Fe, or a combination of these metals.

[0084] Referring to FIGS. 15A-15C , a protruding portion 10P-F of the shielding structure 10-F of the front camera module CM-F can contact the device housing 110, while a protruding portion 10P-R of the shielding structure 10-R of the rear camera module CM-R can contact the flange 170. When the front camera module CM-F is to be arranged not to two-dimensionally overlap the display 122, since the front camera module CM-F is close to the sidewall of the device housing 110, it is advantageous that the front camera module CM-F contacts the sidewall of the device housing 110. On the other hand, although the rear camera module CM-R is arranged at a position away from the sidewall of the device housing 110, since the rear camera module CM-R can contact the flange 170, the flexibility of the arrangement design of the rear camera module CM-R can increase.

[0085] FIG. 16 is a cross-sectional view of a flange according to an embodiment.

[0086] Referring to FIG. 16 In some embodiments, the flange 170 can include a conductive body 171 and an insulating coating 172 disposed on the conductive body 171. The conductive body 171 can include a metal such as Cu, Al, Au, Ni, Ag, Fe, or a combination of these metals. The insulating coating 172 can include, for example, a polymer.

[0087] FIGS. 15A-15C The protruding portion 10P-R of the shielding structure 10-R of the rear camera module CM-R shown in FIG. 10A can contact the conductive body 171 of the flange 170. Although FIGS. 15A-15C The flange 170 is shown surrounding the rear camera module CM-R, but embodiments are not limited thereto, and in some other embodiments, the flange 170 can alternatively be positioned to surround the front camera module CM-F, and the protruding portion 10P-F of the shielding structure 10-F of the front camera module CM-F can alternatively contact the conductive body 171 of the flange 170. In some embodiments, the insulating coating 172 of the flange 170 can expose at least a portion of the conductive body 171 of the flange 170, and FIGS. 15A-15C The protruding portion 10P-R of the shielding structure 10-R of the rear camera module CM-R shown in FIG. 10A can contact the exposed portion of the conductive body 171 of the flange 170. Alternatively, in other embodiments, FIGS. 15A-15C The protruding portion 10P-R of the shielding structure 10-R of the rear camera module CM-R shown in FIG. 10A can contact the exposed portion of the conductive body 171 of the flange 170. Alternatively, in other embodiments,

[0088] FIGS. 17A-17C is a plan view showing a device housing and camera modules in an electronic device according to an embodiment. In FIGS. 17A-17C In embodiments of FIG. 11, the device housing 110 can include a first camera module CM-1 and a second camera module CM-2.

[0089] Referring to FIG. 17A In some embodiments, the protruding portion 10P-1 of the shielding structure 10-1 of the first camera module CM-1 and the protruding portion 10P-2 of the shielding structure 10-2 of the second camera module CM-2 can contact a sidewall of the device housing 110. In some embodiments, both the first camera module CM-1 and the second camera module CM-2 can be front cameras, and in other embodiments, both the first camera module CM-1 and the second camera module CM-2 can be rear cameras. The combination of the first camera module CM-1 and the second camera module CM-2 can be, for example, a combination of a wide-angle camera and a telephoto camera, a combination of a color camera and an infrared (IR) camera, or a combination of a main camera and a time-of-flight (TOF) camera.

[0090] In some embodiments, the protruding portion 10P-1 of the shielding structure 10-1 of the first camera module CM-1 and the protruding portion 10P-2 of the shielding structure 10-2 of the second camera module CM-2 can protrude in the same direction in two dimensions. For example, the direction in which the protruding portion 10P-1 of the shielding structure 10-1 of the first camera module CM-1 protrudes and the direction in which the protruding portion 10P-2 of the shielding structure 10-2 of the second camera module CM-2 protrudes can be the +Y direction. That is, the surfaces on which the protruding portion 10P-1 of the shielding structure 10-1 of the first camera module CM-1 and the surfaces on which the protruding portion 10P-2 of the shielding structure 10-2 of the second camera module CM-2 protrudes can face the same direction. For example, the surfaces on which the protruding portion 10P-1 of the shielding structure 10-1 of the first camera module CM-1 and the surfaces on which the protruding portion 10P-2 of the shielding structure 10-2 of the second camera module CM-2 protrudes can face the +Y direction.

[0091] In other embodiments, with FIG. 17A Unlike other camera modules, the protruding portions 10P-1 of the shielding structure 10-1 of the first camera module CM-1 and 10P-2 of the shielding structure 10-2 of the second camera module CM-2 can protrude in different directions in two dimensions. For example, the protruding portion 10P-1 of the shielding structure 10-1 of the first camera module CM-1 can protrude in the +Y direction, and the protruding portion 10P-2 of the shielding structure 10-2 of the second camera module CM-2 can protrude in the -X direction. In other words, the surfaces of the protruding portions 10P-1 of the shielding structure 10-1 of the first camera module CM-1 and the surfaces of the protruding portions 10P-2 of the shielding structure 10-2 of the second camera module CM-2 can face different directions. For example, the surface of the protruding portion 10P-1 of the shielding structure 10-1 of the first camera module CM-1 can face the +Y direction, and the surface of the protruding portion 10P-2 of the shielding structure 10-2 of the second camera module CM-2 can face the -X direction.

[0092] Reference FIG. 17BIn some embodiments, the protruding portion 10P-1 of the shielding structure 10-1 of the first camera module CM-1 can contact the sidewall of the device case 110, and the protruding portion 10P-2 of the shielding structure 10-2 of the second camera module CM-2 can contact the shielding structure 10-1 of the first camera module CM-1. Accordingly, the shielding structure 10-2 of the second camera module CM-2 can be electrically connected to the device case 110 through the shielding structure 10-1 of the first camera module CM-1. According to such embodiments, since the second camera module CM-2 can be disposed at a position away from the sidewall of the device case 110, flexibility in the design of the arrangement of the second camera module CM-2 can increase.

[0093] Referring to FIG. 17C In some embodiments, the shielding structure 10-1 of the first camera module CM-1 includes a first protruding portion 10P-1-1 and a second protruding portion 10P-1-2, and the shielding structure 10-2 of the second camera module CM-2 can not include a protruding portion. The first protruding portion 10P-1-1 of the shielding structure 10-1 of the first camera module CM-1 can contact the device case 110, and the second protruding portion 10P-1-2 of the shielding structure 10-1 of the first camera module CM-1 can contact the shielding structure 10-2 of the second camera module CM-2. Accordingly, the shielding structure 10-2 of the second camera module CM-2 can be electrically connected to the device case 110 through the shielding structure 10-1 of the first camera module CM-1. According to such embodiments, when only the first camera module CM-1 including the shielding structure 10-1 having the first protruding portion 10P-1-1 and the second protruding portion 10P-1-2 is purchased, the second camera module CM-2 including the shielding structure 10-2 having no protruding portion can also be used, which is economical. Further, since the second camera module CM-2 can be disposed at a position away from the sidewall of the device case 110, flexibility in the design of the arrangement of the second camera module CM-2 can increase.

[0094] FIGS. 18A-18H is a plan view illustrating a device case and camera modules in an electronic device according to an embodiment. FIGS. 18A-18H In an embodiment of FIG. 10, the device case 110b can include the first camera module CM-1, the second camera module CM-2, and the third camera module CM-3 accommodated therein.

[0095] Referring to FIG. 18AIn some embodiments, the inner wall 110W of the device housing 110b can be located around the first camera module CM-1, the second camera module CM-2, and the third camera module CM-3. In some embodiments, the inner wall 110W of the device housing 110b can two-dimensionally and completely surround the first camera module CM-1, the second camera module CM-2, and the third camera module CM-3. The protruding portion 10P-1 of the shielding structure 10-1 of the first camera module CM-1, the protruding portion 10P-2 of the shielding structure 10-2 of the second camera module CM-2, and the protruding portion 10P-3 of the shielding structure 10-3 of the third camera module CM-3 can contact the inner wall 110W of the device housing 110b. Note that, in the example of FIG. 18A , the protruding portions 10P-1, 10P-2, and 10P-3 all extend in the +Y direction to contact the same side wall of the inner wall 110W, but embodiments are not limited thereto. In some embodiments, one or more of the first camera module CM-1, the second camera module CM-2, and the third camera module CM-3 can have a protruding portion that contacts a different side wall of the inner wall 110W (see the example of the protruding portion that contacts a different side wall in FIG. 18B ). In some embodiments, all of the first camera module CM-1, the second camera module CM-2, and the third camera module CM-3 can be front cameras. In other embodiments, all of the first camera module CM-1, the second camera module CM-2, and the third camera module CM-3 can be rear cameras. The combination of the first camera module CM-1, the second camera module CM-2, and the third camera module CM-3 can be, for example, a combination of a telephoto camera, a wide-angle camera, and an ultra-wide-angle camera, or a combination of a telephoto camera, a wide-angle camera, and a time-of-flight (TOF) camera.

[0096] In some embodiments, the first camera module CM-1, the second camera module CM-2, and the third camera module CM-3 can be arranged in a row, as shown in FIG. 18A . In some embodiments, the device housing 110b can have a long axis (Y axis) and a short axis (X axis), and the first camera module CM-1, the second camera module CM-2, and the third camera module CM-3 can be arranged in the direction of the short axis (X axis) of the device housing 110b.

[0097] Referring to FIG. 18B , unlike FIG. 18A , in some embodiments, the first camera module CM-1, the second camera module CM-2, and the third camera module CM-3 can be arranged in the direction of the long axis (Y axis) of the device housing 110b.

[0098] Referring to FIG. 18CIn some embodiments, the first camera module CM-1, the second camera module CM-2, and the third camera module CM-3 can not be arranged in a row. For example, the first camera module CM-1 and the second camera module CM-2 can be arranged in a short axis direction (X-axis direction), and the first camera module CM-1 and the third camera module CM-3 can be arranged in a long axis direction (Y-axis direction).

[0099] Referring to FIG. 18D In some embodiments, the shielding structure 10-2 of the second camera module CM-2 can include a first protruding portion 10P-2-1 and a second protruding portion 10P-2-2, and the shielding structure 10-3 of the third camera module CM-3 can include one protruding portion 10P-3, while the shielding structure 10-1 of the first camera module CM-1 can not include a protruding portion. The first protruding portion 10P-2-1 of the shielding structure 10-2 of the second camera module CM-2 can contact the inner wall 110W of the device housing 110b, and the second protruding portion 10P-2-2 of the shielding structure 10-2 of the second camera module CM-2 can contact the shielding structure 10-1 of the first camera module CM-1. Accordingly, the shielding structure 10-1 of the first camera module CM-1 can be electrically connected to the inner wall 110W of the device housing 110b through the shielding structure 10-2 of the second camera module CM-2.

[0100] Referring to FIG. 18E In some embodiments, the shielding structure 10-2 of the second camera module CM-2 can include a first protruding portion 10P-2-1, a second protruding portion 10P-2-2, and a third protruding portion 10P-2-3, while the shielding structure 10-1 of the first camera module CM-1 and the shielding structure 10-3 of the third camera module CM-3 each can not include a protruding portion. The first protruding portion 10P-2-1 of the shielding structure 10-2 of the second camera module CM-2 can contact the inner wall 110W of the device housing 110b. The second protruding portion 10P-2-2 of the shielding structure 10-2 of the second camera module CM-2 can contact the shielding structure 10-1 of the first camera module CM-1. The third protruding portion 10P-2-3 of the shielding structure 10-2 of the second camera module CM-2 can contact the shielding structure 10-3 of the third camera module CM-3. Accordingly, the shielding structure 10-1 of the first camera module CM-1 and the shielding structure 10-3 of the third camera module CM-3 can be electrically connected to the inner wall 110W of the device housing 110b through the shielding structure 10-2 of the second camera module CM-2.

[0101] Referring to FIG. 18FIn some embodiments, the protruding portion 10P-2 of the shielding structure 10-2 of the second camera module CM-2 can contact the inner wall 110W of the device housing 110b, while the protruding portion 10P-1 of the shielding structure 10-1 of the first camera module CM-1 and the protruding portion 10P-3 of the shielding structure 10-3 of the third camera module CM-3 can contact the shielding structure 10-2 of the second camera module CM-2. Accordingly, the shielding structure 10-1 of the first camera module CM-1 and the shielding structure 10-3 of the third camera module CM-3 can be electrically connected to the inner wall 110W of the device housing 110b through the shielding structure 10-2 of the second camera module CM-2.

[0102] Referring to FIG. 18G With FIG. 18A the inner wall 110W-1 of the device housing 110b can further include a first portion between the first camera module CM-1 and the second camera module CM-2 and a second portion between the second camera module CM-2 and the third camera module CM-3, as compared to the inner wall 110W shown in FIG. 1. In other words, the inner wall 110W-1 of the device housing 110b can surround each of the first camera module CM-1, the second camera module CM-2, and the third camera module CM-3. According to such an embodiment, the inner wall 110W-1 of the device housing 110b can be used to align the first camera module CM-1, the second camera module CM-2, and the third camera module CM-3.

[0103] Referring to FIG. 18H In some embodiments, the inner wall 110W-2 of the device housing 110b can be located only around the second camera module CM-2. In some embodiments, the second camera module CM-2 can be located in a space surrounded by the inner wall 110W-2 of the device housing 110b, while the first camera module CM-1 and the third camera module CM-3 can be located outside the space surrounded by the inner wall 110W-2 of the device housing 110b. Accordingly, the protruding portion 10P-2 of the shielding structure 10-2 of the second camera module CM-2 can contact an inner surface of the inner wall 110W-2 of the device housing 110b, while the protruding portion 10P-1 of the shielding structure 10-1 of the first camera module CM-1 and the protruding portion 10P-3 of the shielding structure 10-3 of the third camera module CM-3 can contact an outer surface of the inner wall 110W-2.

[0104] FIGS. 19A-19E is a plan view illustrating a flange and camera modules in an electronic device according to an embodiment. FIGS. 19A-19E In an embodiment of FIG. 1, the flange 170 can include the first camera module CM-1, the second camera module CM-2, and the third camera module CM-3 accommodated therein.

[0105] Referring to FIG. 19AIn some embodiments, the flange 170 can surround the first, second, and third camera modules CM-1, CM-2, and CM-3. The protruding portions 10P-1 of the shielding structure 10-1 of the first camera module CM-1, 10P-2 of the shielding structure 10-2 of the second camera module CM-2, and 10P-3 of the shielding structure 10-3 of the third camera module CM-3 can contact the flange 170. Note that in FIG. 19A the example, the protruding portions 10P-1, 10P-2, and 10P-3 all extend in the +Y direction to contact the same side wall of the flange 170, although embodiments are not limited thereto. In some embodiments, one or more of the first, second, and third camera modules CM-1, CM-2, and CM-3 can have protruding portions that contact different side walls of the flange 170. Although the first, second, and third camera modules CM-1, CM-2, and CM-3 are shown in FIG. 19A arranged in a row in the X direction, similar to the description with reference to FIGS. 18A-18C , the first, second, and third camera modules CM-1, CM-2, and CM-3 can be arranged in alternative arrangements such as those shown in FIGS. 18A-18C , with the flange 170 replacing the inner wall 110W.

[0106] With reference to FIG. 19B , in some embodiments, the shielding structure 10-2 of the second camera module CM-2 includes a first protruding portion 10P-2-1 and a second protruding portion 10P-2-2, and the shielding structure 10-3 of the third camera module CM-3 includes a protruding portion 10P-3, while the shielding structure 10-1 of the first camera module CM-1 can not include a protruding portion. The first protruding portion 10P-2-1 of the shielding structure 10-2 of the second camera module CM-2 can contact the flange 170, and the second protruding portion 10P-2-2 of the shielding structure 10-2 of the second camera module CM-2 can contact the shielding structure 10-1 of the first camera module CM-1. Thus, the shielding structure 10-1 of the first camera module CM-1 can be electrically connected to the flange 170 through the shielding structure 10-2 of the second camera module CM-2.

[0107] With reference to FIG. 19CThe shielding structure 10-2 of the second camera module CM-2 includes a first protrusion 10P-2-1, a second protrusion 10P-2-2, and a third protrusion 10P-2-3. The shielding structures 10-1 of the first camera module CM-1 and 10-3 of the third camera module CM-3 may each exclude protrusions. The first protrusion 10P-2-1 of the shielding structure 10-2 of the second camera module CM-2 can contact the flange 170. The second protrusion 10P-2-2 of the shielding structure 10-2 of the second camera module CM-2 can contact the shielding structure 10-1 of the first camera module CM-1. The third protrusion 10P-2-3 of the shielding structure 10-2 of the second camera module CM-2 can contact the shielding structure 10-3 of the third camera module CM-3. Therefore, the shielding structures 10-1 of the first camera module CM-1 and 10-3 of the third camera module CM-3 can be electrically connected to the flange 170 through the shielding structure 10-2 of the second camera module CM-2.

[0108] Reference FIG. 19D The protruding portion 10P-2 of the shielding structure 10-2 of the second camera module CM-2 can contact the flange 170, while the protruding portions 10P-1 of the shielding structure 10-1 of the first camera module CM-1 and 10P-3 of the shielding structure 10-3 of the third camera module CM-3 can contact the shielding structure 10-2 of the second camera module CM-2. Therefore, the shielding structures 10-1 of the first camera module CM-1 and 10-3 of the third camera module CM-3 can be electrically connected to the flange 170 through the shielding structure 10-2 of the second camera module CM-2.

[0109] Reference FIG. 19E ,and FIG. 19A Compared to the flange 170 shown, in some embodiments, flange 170-1 may further include a first portion between the first camera module CM-1 and the second camera module CM-2, and a second portion between the second camera module CM-2 and the third camera module CM-3. That is, flange 170-1 may surround each of the first camera module CM-1, the second camera module CM-2, and the third camera module CM-3. According to such an embodiment, flange 170-1 can be used for alignment of the first camera module CM-1, the second camera module CM-2, and the third camera module CM-3.

[0110] Although this disclosure has been specifically shown and described with reference to various embodiments thereof, it will be understood that various changes in form and detail may be made therein without departing from the spirit and scope of the appended claims.

Claims

1.An electronic device comprising: a camera module including an image sensor and a shielding structure configured to shield components of the camera module from electromagnetic interference; and an external structure two-dimensionally surrounding the camera module, at least a portion of the external structure being electrically conductive, wherein the shielding structure includes an accommodation portion configured to accommodate the image sensor and a protruding portion protruding from the accommodation portion, wherein the protruding portion of the shielding structure contacts the external structure, and wherein the external structure is not exposed to an outside of the electronic device. 2.The electronic device of claim 1, wherein, The protruding portion protrudes outward from a sidewall of the accommodation portion. 3.The electronic device of claim 1, wherein The protruding portion is configured to maintain contact with the external structure by elasticity. 4.The electronic device of claim 1, wherein The external structure includes an electrically conductive body and an insulating coating layer disposed on the electrically conductive body. 5.The electronic device of claim 1, wherein The shielding structure further includes an adhesive configured to attach the protruding portion to the accommodation portion. 6.The electronic device of claim 1, wherein The protruding portion of the shielding structure physically contacts the external structure. 7.The electronic device of claim 1, wherein The protruding portion of the shielding structure directly contacts the external structure. 8.An electronic device comprising: a camera module including an image sensor and a shielding structure configured to shield components of the camera module from electromagnetic interference, the shielding structure including a plurality of sidewalls and a top portion connected to each of the plurality of sidewalls, the image sensor being accommodated in a space formed by the plurality of sidewalls and the top portion; and an external structure two-dimensionally surrounding the camera module, at least a portion of the external structure being electrically conductive, wherein the shielding structure includes a protruding portion protruding from a sidewall of the plurality of sidewalls at a position on the sidewall spaced apart from the top portion and spaced apart from an edge of the sidewall opposite the top portion, wherein the protruding portion of the shielding structure contacts the at least a portion of the external structure, wherein the external structure is not exposed to an outside of the electronic device.

Images