On-vehicle computing device in smart car and smart car

Abstract

A vehicle-mounted computing device in a smart car and a smart car, the vehicle-mounted computing device comprising: two stacked main boards (40, 50), and a radiator (10, 70) arranged between the two main boards (40, 50) and dissipating heat for the two main boards (40, 50). A closed plate is provided on the side of each main board (40, 50) facing away from the radiator and connected to the radiator (10, 70); wherein each closed plate (20, 30) and the radiator (10, 70) seal the corresponding main board (40, 50) between the closed plate and the radiator (10, 70). In this way, the vehicle-mounted computing device comprising two main boards (40, 50) can dissipate heat through a common radiator (10, 70), thereby reducing the volume of the computing device in the smart car and improving the heat dissipation capacity of the computing device in the smart car.

Description

Technical Field

[0001] The present application relates to the field of smart car technology, and in particular to a vehicle-mounted computing device in a smart car and a smart car. Background Art

[0002] Automated driving is a key technology for realizing smart cars and smart transportation, and is also an inevitable trend for the development of smart cars in the future. With the continuous improvement of the level of smart driving, the demand for the computing power of on-board computing devices is constantly increasing, and the challenges to the heat dissipation devices of on-board computing devices are also increasing. For example, the heat dissipation requirement has increased from at least 20w to more than 200w. However, when traditional on-board computing devices dissipate heat through natural wind, they cannot meet the heat dissipation requirements of on-board computing devices in smart cars. On the other hand, with the improvement of the driving level of autonomous driving, it is necessary to physically achieve a 1+1 redundant design of the on-board computing device, that is, two on-board computing devices need to be set up, and each on-board computing device needs to be cooled by an independent heat dissipation device. In the traditional design, the two on-board computing devices are respectively set at the front and rear ends of the smart car body, and each on-board computing device is equipped with a heat dissipation device, which is large in size and occupies more space in the car. Therefore, how to provide a small-sized and good heat dissipation on-board computing device in a smart driving car has become a technical problem that needs to be solved urgently. Summary of the invention

[0003] The present application provides an on-board computing device in a smart car and a smart car, aiming to reduce the volume of the computing device in the smart car and improve the heat dissipation capacity of the computing device in the smart car.

[0004] In the first aspect, a vehicle-mounted computing device in a smart car is provided, the vehicle-mounted computing device comprising: two stacked main boards, each main board comprising a plurality of devices, the plurality of devices being used to control the driving state and monitor the state of the smart car; and the two main boards are designed as 1+1 redundancy. The vehicle-mounted computing device also comprises a radiator disposed between the two main boards and thermally connected to each main board, and the radiator serves as a common radiator for the two main boards. In addition, the vehicle-mounted computing device also comprises a closed plate disposed on a side of each main board away from the radiator and connected to the radiator; wherein each closed plate and the radiator seal the corresponding main board between the closed plate and the radiator. In the above technical solution, two main boards are designed in the vehicle-mounted computing device, and the two main boards are cooled by a common radiator. The volume of a vehicle-mounted computing device similar to that of the prior art is adopted to achieve the effect of two vehicle-mounted computing devices in the prior art, meet the redundant design of the car, reduce the space area occupied by the vehicle-mounted computing device, and seal the main board by the closed plate and the radiator, thereby improving the waterproof effect of the main board.

[0005] In a possible implementation, the radiator includes a housing, a heat dissipation channel arranged in the housing, and an air supply module; the air supply module includes: a first fan module and a second fan module arranged along the length direction of the heat dissipation channel, wherein the air supply directions of the first fan module and the second fan module are the same. The air outside the radiator is supplied into the heat dissipation channel through the first fan module, and the air in the heat dissipation channel is discharged through the second fan module, thereby improving the fluidity in the heat dissipation channel and thus improving the heat dissipation effect of the radiator.

[0006] In another possible implementation, the smart car includes an on-board power supply system, and the on-board power supply system supplies power to the first fan module or the second fan module through at least one of the two mainboards; the first fan module is electrically connected to one of the two mainboards, and the second fan module is electrically connected to the other of the two mainboards; or the first fan module is electrically connected to the two mainboards, respectively, and the second fan module is electrically connected to the two mainboards, respectively. By connecting the first fan module and the second fan module to the two mainboards, respectively, the power supply system can supply power to the first fan module and the second fan module through at least one mainboard, ensuring that at least one fan module is in working condition, improving the reliability of the air-cooled radiator, and also improving the reliability of the on-board computing device.

[0007] In another possible implementation, the first fan module and the second fan module are respectively detachably fixedly connected to the housing. Each fan module is detachably connected to the housing, and when a fan module fails, the fan module can be individually removed for repair or replacement.

[0008] In another possible implementation, the housing is provided with a first plug hole and a second plug hole; the first fan module is detachably fixed to the first plug hole, and the second fan module is detachably fixed to the second plug hole. The combination of the plug hole and the fan module facilitates the installation of the fan module.

[0009] In another possible implementation, the first fan module and the second fan module are directly fastened to the air inlet and the air outlet of the heat dissipation channel. The fan module is directly fastened to the housing, which facilitates the installation and maintenance of the fan module.

[0010] In another possible implementation, a plurality of heat dissipation fins are arranged in the housing, and the heat dissipation channel is formed between the plurality of heat dissipation fins. When air flows in the heat dissipation channel, the heat on the heat dissipation fins is taken away, thereby increasing the heat exchange effect.

[0011] In another possible implementation, the first fan module and the second fan module both include: a bracket, at least one mounting hole provided on the bracket, and a fan fixed in each mounting hole by a connecting member. The fan and the bracket are detachably connected, so that the fan can be easily disassembled and repaired when a fan fails.

[0012] In another possible implementation, the heat dissipation channel is a straight channel; and the length direction of the heat dissipation channel is perpendicular to the stacking direction of the two mainboards. With a straight heat dissipation channel, air can flow directly from the air inlet to the air outlet, and the air will not be hindered during the flow process, which improves the fluidity of the air and further improves the heat dissipation effect of the radiator.

[0013] In another possible implementation, the first fan module delivers air from the outside of the radiator into the heat dissipation channel, and the second fan module draws air from the heat dissipation channel to the outside of the radiator. The air is drawn into the heat dissipation channel by the first fan module, and the air in the heat dissipation channel is drawn out of the radiator by the second fan module, thereby improving the fluidity of the air in the heat dissipation channel, improving the heat dissipation effect of the air and the heat dissipation fins, and thus improving the heat dissipation efficiency of the radiator.

[0014] In another possible implementation, the radiator is a liquid cooling radiator, which dissipates heat from the mainboard through liquid medium, thereby improving the heat dissipation effect of the mainboard.

[0015] In another possible implementation, the smart car includes a refrigeration system, which is used to control the liquid cooling radiator; the liquid cooling radiator includes a shell, and a heat dissipation pipe arranged in the shell, and the shell is provided with a water inlet pipe and a water outlet pipe connected to the heat dissipation pipe; wherein the two opposite surfaces of the shell are respectively connected to the two mainboards in a one-to-one correspondence and thermal conductivity. The heat dissipation of the mainboard is carried out by the heat dissipation pipe carrying the liquid medium.

[0016] In another possible implementation, a plurality of first heat dissipation fins arranged at intervals are arranged in the housing, and an S-shaped heat dissipation pipe connected between the plurality of first heat dissipation fins is formed. The S-shaped heat dissipation pipe increases the fluidity of the liquid medium in the housing, thereby improving the heat dissipation effect of the radiator.

[0017] In another possible implementation, a plurality of second heat sinks are provided between any adjacent first heat sinks, and the plurality of second heat sinks are arranged at intervals. The heat transferred to the housing is transferred to the second heat sinks, and the contact area with the liquid medium is increased by the second heat sinks, thereby increasing the heat dissipation effect of the liquid medium.

[0018] In another possible implementation, the refrigeration system is used to pump the liquid medium into the heat dissipation pipeline, and the liquid medium dissipates heat for the two chips in the heat dissipation pipeline. The refrigeration system provides power for the flow of the liquid medium.

[0019] In another possible implementation, when the heat dissipation pipeline is formed by the plurality of first heat dissipation fins, the volume of the liquid medium pumped into the heat dissipation pipeline by the refrigeration system at a time is greater than or equal to the volume of the liquid medium contained between two adjacent first fins. By pumping in a certain amount of liquid medium, the fluidity of the liquid medium in the heat dissipation pipeline is ensured.

[0020] In another possible implementation, each mainboard has a first surface facing the heat sink, the first surface is provided with at least one first functional device, and the at least one first functional device is thermally connected to the heat sink. The first functional device is a device with higher power among the devices on the mainboard, and by directly contacting the first functional device with the heat sink, the heat generated by the first functional device can be directly taken away by the heat sink, thereby improving the heat dissipation effect of the heat sink on the mainboard.

[0021] In another possible implementation, each mainboard has a second surface facing away from the heat sink, and at least one second functional device is arranged on the second surface; the enclosed plate corresponding to each mainboard is a heat sink; and each second functional device of each mainboard is thermally connected to the heat sink. The second functional device is a device with relatively low power among the devices of the mainboard, and by using the enclosed plate as the heat sink, and thermally connecting the heat sink to the heat sink; the heat generated by the second functional device is transferred to the heat sink through the heat sink and dissipated, thereby further improving the heat dissipation effect of the mainboard.

[0022] In a second aspect, a smart car is provided, the smart car comprising a smart car body and the above-mentioned vehicle-mounted computing device arranged in the smart car body. In the above-mentioned technical solution, two mainboards are designed in the vehicle-mounted computing device, and the two mainboards are cooled by a common radiator, so that the volume of one vehicle-mounted computing device in the prior art can be used to achieve the effect of two vehicle-mounted computing devices in the prior art, satisfying the redundant design of the car and reducing the space area occupied by the vehicle-mounted computing device.

[0023] In another possible implementation, the vehicle-mounted computing device is disposed at one end of the smart vehicle body. The vehicle-mounted computing device can be disposed at different positions in the smart vehicle body as required.

[0024] In another possible implementation, the smart car further includes a refrigeration system disposed in the smart car body, the refrigeration system including: a condenser, and a cooling plate and the radiator connected to the condenser through a pipeline, wherein the radiator is a liquid-cooled radiator. The refrigeration system in the car is used to dissipate heat for the on-board computing device.

[0025] In another possible implementation, the refrigeration system further comprises a liquid pump (eg, a water pump) disposed on the pipeline to improve the heat dissipation effect.

[0026] Based on the implementations provided in the above aspects, this application can also be further combined to provide more implementations. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 A schematic diagram of the structure of an on-board computing device in a smart car provided by the present application;

[0028] Figure 2 An exploded schematic diagram of an on-board computing device in a smart car provided by the present application;

[0029] Figure 3a for Figure 1 Sectional view at AA in the middle;

[0030] Figure 3b for Figure 1 Sectional view at the middle BB;

[0031] Figure 4a A schematic diagram of the specific structure of another air-cooled radiator provided in this application;

[0032] Figure 4b A schematic diagram of the structure of a heat dissipation fin provided in this application;

[0033] Figure 5 A schematic diagram of the structure of another air-cooled radiator provided in this application;

[0034] Figure 6a An exploded schematic diagram of a fan module and an air-cooled radiator provided in the present application;

[0035] Figure 6b A schematic diagram of the assembly of a fan module and an air-cooled radiator provided in this application;

[0036] Figure 7 A schematic structural diagram of a first fan module provided in this application;

[0037] Figure 8 An exploded schematic diagram of another matching method of a fan module and an air-cooled radiator provided in the present application;

[0038] Fig. 9 An exploded schematic diagram of a second vehicle-mounted computing device provided by the present application;

[0039] Fig.10a is a cross-sectional view of the second vehicle-mounted computing device along the vertical direction;

[0040] Fig.10b is a cross-sectional view of the second vehicle-mounted computing device along the horizontal wind direction;

[0041] Fig.11 A schematic diagram of a smart car provided for this application;

[0042] Fig.12 A schematic diagram of another smart car provided for this application;

[0043] Fig.13 A specific schematic diagram of the refrigeration system provided for this application.

[0044] Reference numerals

[0045] 10-air cooling radiator 11-housing 111-protrusion 12-heat dissipation fin 121-bending structure

[0046] 13- heat dissipation channel 14- top wall 15- bottom wall 20- first closing plate 30- second closing plate

[0047] 40 - first main board 41 - first functional device 42 - first surface 43 - second surface 44 - second functional device

[0048] 50-second mainboard 60-air supply module 61-first fan module 62-second fan module 63-cable

[0049] 64- bracket 65- mounting hole 66- connection terminal 70- liquid cooling radiator 71- housing 711- first side wall

[0050] 712 - second side wall 72 - water outlet 73 - water inlet 74 - heat dissipation pipe 75 - first heat dissipation fin

[0051] 751-first heat dissipation fin 752-first heat dissipation fin 753-first heat dissipation fin 754-first heat dissipation fin

[0052] 76- Second heat sink DETAILED DESCRIPTION

[0053] The embodiments of the present application will be further described below in conjunction with the accompanying drawings.

[0054] First, the application scenario of the vehicle-mounted computing device provided in the embodiment of the present application is explained. The vehicle-mounted computing device provided in the embodiment of the present application is applied to the automatic driving of smart cars, including electric cars or gasoline-driven cars that support unmanned driving, driver assistance / ADAS, intelligent driving, connected driving, intelligent network driving and car sharing. The vehicle-mounted computing device is used to control and monitor the driving state of smart cars, including but not limited to a vehicle-mounted mobile data center (MDC), a hardware monitor (HMI) that realizes the function of a human-computer interaction controller, an in-vehicle infotainment (IVI) controller, a body control module (BCM), and a vehicle control unit (VCU). The vehicle-mounted computing device may specifically be a chip with computing and processing capabilities, or may be a collection of multiple devices such as a processor and a memory integrated in a printed circuit board (PCB), wherein the processor includes but is not limited to a central processing unit (CPU), a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components, a graphics processor unit (GPU), a system on chip (SoC), and an artificial intelligence (AI) chip. A general-purpose processor may be a microprocessor or any conventional processor, etc. The printed circuit board in which the above-mentioned processor is integrated is also referred to as a motherboard.

[0055] The specific structure of the vehicle-mounted computing device provided in the embodiment of the present application is explained below with reference to the accompanying drawings.

[0056] like Figure 1 and Figure 2 As shown, Figure 1 A schematic diagram of the structure of an on-board computing device in a smart car provided in an embodiment of the present application is shown in FIG. Figure 2 This is a schematic diagram of a computing module in a smart car provided in an embodiment of the present application. The vehicle-mounted computing module provided in the embodiment of the present application includes two main boards, each of which includes multiple devices, and the multiple devices are used to control the driving state and monitor the state of the smart car. For the convenience of description, the two main boards are named as the first main board 40 and the second main board 50, respectively, and the structures and functions of the first main board 40 and the second main board 50 are the same. When specifically setting the first main board 40 and the second main board 50, refer to Figure 3a , Figure 3a Shows Figure 1 The cross-sectional view at AA in FIG. 1 is a cross-sectional view of the first main board 40 and the second main board 50, wherein the cross-sectional view at AA refers to a cross-sectional view along a vertical direction parallel to the stacking direction of the first main board 40 and the second main board 50. Figure 1 The schematic diagram of the cross-section of the vehicle-mounted computing device shown in FIG. The first mainboard 40 and the second mainboard 50 both include a first surface 42 and a second surface 43 opposite to each other, wherein at least one first functional device 41 is disposed on the first surface 42, and at least one second functional device 44 is disposed on the second surface 43, wherein the power of the first functional device 41 is greater than the power of the second functional device 44, that is, the heat generated by the first functional device 41 is greater than the heat generated by the second functional device 44. Of course, the first functional device may be disposed only on the first surface 41, and no device may be disposed on the second surface 42. When the first mainboard is connected to other devices, connection terminals for connecting to other devices are provided on the first mainboard 40, and the connection terminals are electrically connected to the above-mentioned first functional device 41 and the second functional device 44. The connection terminals and the first functional device 41 and the second functional device 44 can be connected in a welding, slot or surface mounting connection manner, wherein surface mounting refers to surface mounting technology, specifically including applying solder paste on the pads of the mainboard, mounting the device on the corresponding position of the surface of the mainboard printed with solder paste or surface mount adhesive, and then re-melting the paste-loaded soft solder pre-allocated to the pads to achieve electrical connection between the solder end or pin of the surface mounted device and the pad.

[0057] The first mainboard 40 and the second mainboard 50 are both used to control the driving state and monitor the state of the smart car. In actual use, only one of the first mainboard 40 and the second mainboard 50 is in working state, and the other mainboard is used as a backup mainboard to achieve a 1+1 redundancy design to ensure the reliability of the entire automatic driving system. Optionally, the two mainboards can also use load sharing to jointly complete the data processing process in the smart car to speed up the data processing.

[0058] Continue to refer Figure 1 and Figure 2The vehicle-mounted computing device provided in the embodiment of the present application further includes a radiator and two closed plates, wherein the radiator is an air-cooled radiator 10. Figure 2 As shown in the figure, the air-cooled radiator 10 is arranged between the first main board 40 and the second main board 50 to dissipate heat for the first main board 40 and the second main board 50, and the first main board 40 and the second main board 50 are respectively connected to the air-cooled radiator 10 by thermal conductivity. Each closed plate is arranged on the side of the main board away from the air-cooled radiator 10. For the convenience of description, the two closed plates are named as the first closed plate 20 and the second closed plate 30, respectively, wherein the first closed plate 20 corresponds to the first main board 40, and the second closed plate 30 corresponds to the second main board 50. The connection method of each closed plate and the corresponding main board is the same. The following takes the cooperation of the first closed plate 20 and the first main board 40 as an example to illustrate the connection method of the air-cooled radiator 10, the closed plate and the main board.

[0059] For the convenience of description, Figure 3a Two opposite surfaces of the air-cooling heat sink 10 are defined: a third surface c and a fourth surface d, wherein the third surface c faces the first mainboard 40 and the fourth surface d faces the second mainboard 50 .

[0060] Continue to refer Figure 3a , the first main board 40 is fixed to the third surface c of the air-cooled radiator 10. Specifically, the first main board 40 can be fixed to the third surface c of the air-cooled radiator 10 by threaded connectors (such as bolts or screws), and the first surface of the first main board 40 faces the air-cooled radiator 10. The first functional device 41 of the first main board 40 faces the air-cooled radiator 10 and is thermally connected to the third surface c of the air-cooled radiator 10 through thermally conductive adhesive or other thermally conductive media. When there are multiple first functional devices 41 on the first main board 40, each first functional device 41 is thermally connected to the third surface c of the air-cooled radiator 10 through thermally conductive adhesive or other thermally conductive media. When the heights of different first functional devices 41 are different, the third surface c of the air-cooled radiator 10 is provided with corresponding protrusions or grooves (in Figure 3a (not shown) to ensure that each first functional device 41 can fully contact the third surface c of the air-cooled heat sink 10. During heat dissipation, the heat generated by the first functional device 41 is transferred to the third surface c of the air-cooled heat sink 10 through the thermal conductive adhesive or other thermal conductive medium, and the heat is dissipated through the air-cooled heat sink 10.

[0061] Continue to refer Figure 3a The first closing plate 20 is fixedly connected to the air-cooled radiator 10, such as by fixing the first closing plate 20 to the third surface c of the air-cooled radiator 10 by bolts or screws. Figure 2 and Figure 3aThe first surface of the air-cooled heat sink 10 is provided with a ring-shaped protrusion 111, and the first closing plate 20 covers the protrusion 111 and forms a receiving cavity (not shown in the figure) with the protrusion 111 to receive the first main board 40. The first main board 40 is located in the receiving cavity. The air-cooled heat sink 10, the first main board 40 and the first closing plate 20 form a sandwich-type stacked structure.

[0062] The first main board 40 needs to meet certain waterproof requirements when in use, so the first closing plate 20 and the air-cooling radiator 10 are sealed and connected to seal the first main board 40 in the accommodating cavity surrounded by the first closing plate 20 and the air-cooling radiator 10. When sealing, the connection terminals of the first main board 40 need to be exposed outside the air-cooling radiator 10 to connect with other devices, so the connection terminals are connected to the set waterproof level, and the connection terminals and the air-cooling radiator 10 are also sealed and waterproofed, such as by using a sealant or a sealing gasket to seal the connection terminals and the air-cooling radiator 10.

[0063] Continue to refer Figure 3a When the first main board 40 is placed in the accommodating cavity, the second surface 43 of the first main board 40 faces the first closed plate 20. When the second functional device 44 is provided on the second surface 42, the heat generated by the second functional device 44 can be dissipated through the first closed plate 20. At this time, the first closed plate adopts a heat sink, and the second functional device 44 on the second surface 43 is thermally connected to the first closed plate 20. For example, heat conduction can be achieved by filling the space between the second functional device 44 and the first closed plate 20 with thermal conductive adhesive or other common thermal conductive materials. Figure 3a The number of the second functional devices 44 shown is three, but the number of the second functional devices 44 is not limited to Figure 3a The number shown in the figure may also be another number of second functional devices 44, such as one, two, four, etc. In addition, the heights of different second functional devices 44 may be the same or different; when the heights of the second functional devices 44 are different, the second closing plate 30 is also provided with a corresponding protrusion or depression structure (not shown in the figure) to ensure that the second functional device 44 can fully contact the second closing plate 30.

[0064] When the first closed plate 20 is used as a heat dissipation plate, the first closed plate 20 is thermally connected to the air-cooled radiator 10, for example, by applying a thermally conductive adhesive or other common thermally conductive materials between the first closed plate 20 and the protrusion 111. When in use, the heat generated by the second functional device 44 is transferred to the second closed plate 30, and the heat on the second closed plate 30 is transferred to the air-cooled radiator 10 through the protrusion 111, and the heat is dissipated through the air-cooled radiator 10.

[0065] Optionally, the first main board 40 and the first closing plate 20 may also be fixedly connected, such as the first main board 40 is fixedly connected to the first closing plate 20 by means of snap-fit ​​or threaded connectors (such as bolts or screws), and then the first closing plate 20 is fixedly connected to the air-cooled radiator 10, thereby fixing the first main board 40 in the accommodating cavity.

[0066] The configuration of the second main board 50 is the same as that of the first main board 40 , and thus will not be described in detail herein.

[0067] For reference Figure 2 , Figure 3a and Figure 3b , Figure 3b for Figure 1 The cross-sectional view at BB in the figure refers to the cross-sectional view along Figure 1 A schematic diagram of a cross-section of the vehicle-mounted computing device in a horizontal plane perpendicular to the stacking direction of the first main board 20 and the second main board 30. First, refer to Figure 2 The air-cooled heat sink 10 includes a housing 11, which has four side walls (not shown) and a top wall and a bottom wall connected to the four side walls. The top wall has the third surface c mentioned above, and the bottom wall has the fourth surface d mentioned above. Figure 3a and Figure 3b A heat dissipation channel 13 is provided in the housing 11, and an air inlet a and an air outlet b communicating with the heat dissipation channel 13 are provided on two opposite side walls of the housing 11. Figure 3a and Figure 3b A plurality of heat dissipation fins 12 are arranged in the housing 11. Each heat dissipation fin 12 is a rectangular (or prismatic, elliptical or other) heat dissipation fin, and its length direction is along the air inlet a and points to the direction of the air outlet b; each heat dissipation fin 12 is thermally connected to the top wall and the bottom wall respectively. The heat transferred to the air-cooled radiator 10 by the first mainboard 40 and the second mainboard 50 is transferred to the heat dissipation fin 12 through the housing 11 and dissipated.

[0068] Continue to refer Figure 3a and Figure 3b , multiple heat dissipation fins 12 are arranged in a single row, and the arrangement direction of the multiple heat dissipation fins 12 is perpendicular to the direction from the air inlet a to the air outlet b. Figure 3b When the plurality of heat dissipating fins 12 are arranged, there are gaps (not shown) between adjacent heat dissipating fins 12. Figure 3b The adjacent heat dissipation fins 12 are arranged at equal intervals, but the spacing between the heat dissipation fins 12 is not limited in the embodiment of the present application, and the spacing between the heat dissipation fins 12 can be set as needed. Figure 3bThe plurality of heat dissipation fins 12 form a heat dissipation channel 13 of the air-cooled radiator 10. When dissipating heat, cold air flows from the air inlet a into the heat dissipation channel 13 and flows through the gaps between the heat dissipation fins 12, takes away the heat on the heat dissipation fins 12 through heat exchange, and finally flows out through the air outlet b. The air inlet a and the air outlet b are arranged opposite to each other, and the heat dissipation channel is a straight channel, so there is no loss in the air flow, which improves the heat dissipation effect.

[0069] like Figure 4a and Figure 4b As shown, Figure 4a The specific structure of another air-cooled heat sink is shown. The housing 11 of the air-cooled heat sink 10 only includes a top wall 14 and a bottom wall 15, and the top wall 14 and the bottom wall 15 are fixedly connected by heat dissipation fins 12. Figure 4b , Figure 4b The specific structure of the heat dissipation fin 12 is shown. The side where the heat dissipation fin 12 is connected to the top wall 14 and the bottom wall 15 has a bending structure 121. The heat dissipation fin 12 is welded to the top wall 14 and the bottom wall 15 through the bending structure 121, or is fixedly connected to the top wall 14 and the bottom wall 15 through rivets or threaded connectors (such as bolts or screws). In order to improve the heat conduction effect, a common heat conduction medium such as heat conductive glue can be coated between the bending structure 121 of the heat dissipation fin 12 and the top wall 14 or the bottom wall 15.

[0070] like Figure 5 As shown, Figure 5 Another specific structure of an air-cooled radiator is shown, where the heat dissipation fins 12 and the housing 11 are an integral structure, and are prepared together with the housing 11 through an extrusion molding process, and each heat dissipation fin 12 is a rectangular (or other shapes such as a prism or an ellipse) heat dissipation fin, and its length direction points from the air inlet to the air outlet. When the integral structure is adopted, there is a good heat conduction effect between the housing 11 and the heat dissipation fins 12.

[0071] When the above-mentioned housing and heat dissipation fins are used, the housing and heat dissipation fins of the air-cooled radiator can be made of materials with good thermal conductivity, such as common metal materials such as aluminum and iron.

[0072] Continue to refer Figure 2 and Figure 3b In order to improve the heat dissipation effect of the air-cooled radiator, the air-cooled radiator further includes an air supply module 60 to increase the air circulation speed in the heat dissipation channel. The air supply module 60 includes: a first fan module 61 and a second fan module 62 arranged along the length direction of the heat dissipation channel. The first fan module 61 and the second fan module 62 are arranged in a one-to-one correspondence at the air inlet a and the air outlet b of the heat dissipation channel, and the air supply directions of the first fan module 61 and the second fan module 62 are the same, such as Figure 3bThe air flow direction indicated by the arrow in the middle is the same as the air flow direction of the first fan module 61 and the second fan module 62. Figure 3b As shown in the figure, the first fan module 61 is used to deliver cold air from the outside into the heat dissipation channel, while the second fan module 62 is used to draw the air in the heat dissipation channel out to the outside. The cooperation between the first fan module 61 and the second fan module 62 increases the air flow speed in the heat dissipation channel, thereby improving the heat dissipation efficiency of the air-cooled radiator.

[0073] The smart car using the vehicle-mounted computing device includes a vehicle-mounted power supply system, which supplies power to the first fan module or the second fan module through at least one of the two mainboards. For example, the first fan module 61 is electrically connected to one of the two mainboards, and the second fan module 62 is electrically connected to the other of the two mainboards. Take the first fan module 61 connected to the first mainboard 20 and the second fan module 62 connected to the second mainboard 30 as an example to illustrate the relationship between the fan module and the mainboard. The first fan module 61 is electrically connected to the first mainboard 20. When the first mainboard 20 is used as the mainboard in the working state, the vehicle-mounted power supply system supplies power to the first fan module 61 through the first mainboard 20, and the second fan module 62 is in the standby state. When the first mainboard 20 fails, the second mainboard 30 starts to work, and the vehicle-mounted power supply system supplies power to the second fan module 62 through the second mainboard 30, and the first fan module 61 is in the standby state. It can be seen from the above description that no matter which motherboard fails, a fan module can still be guaranteed to be in working condition, ensuring the heat dissipation effect of the air-cooled radiator, so that the first motherboard 20 or the second motherboard 30 can have a reliable heat dissipation effect.

[0074] In one possible implementation, the first fan module 61 can be electrically connected to the two main boards respectively, and the second fan module 62 can be electrically connected to the two main boards respectively. That is, the vehicle-mounted power supply system supplies power to the first fan module 61 through the first main board 20 and the second main board 30, and supplies power to the second fan module 62 through the first main board 20 and the second main board 30 at the same time. Taking the first fan module 61 as an example, when the first main board 20 is in working state and the second main board 30 is used as a backup main board, the vehicle-mounted power supply system supplies power to the first fan module 61 through the first main board 20, and the first fan module 61 is in working state; when the first main board 20 fails and the second main board 30 starts to work, the vehicle-mounted power supply system supplies power to the first fan module 61 through the second main board 30. The working mode of the second fan module 62 is the same as that of the first fan module 61, so it will not be repeated. It can be seen from the above description that when the first mainboard 20 or the second mainboard 30 fails, the first fan module 61 and the second fan module 62 can still work normally, ensuring that the air-cooled radiator can dissipate heat normally, and ensuring that the first mainboard 20 or the second mainboard 30 can have a reliable heat dissipation effect. And by using a common radiator to dissipate heat for the two mainboards at the same time, the occupied space of the vehicle-mounted computing device is reduced, and the effect of two vehicle-mounted computing devices in the prior art can be achieved by using a volume similar to that of a vehicle-mounted computing device in the prior art. At the same time, by connecting the first fan module 61 and the second fan module 62 to the two mainboards respectively, it is ensured that at least one fan module is in working condition, which improves the reliability of the air-cooled radiator and the reliability of the vehicle-mounted computing device.

[0075] like Figure 6a and Figure 6b As shown, Figure 6a An exploded schematic diagram of a fan module and an air-cooled radiator is shown; Figure 6b The figure shows the assembly diagram of the fan module and the air-cooled radiator. Figure 6a and Figure 6b The same reference numerals in Figure 2 and Figure 3b The first fan module 61 and the second fan module 62 are both connected to the air-cooled radiator in a detachable manner. The connection between the fan module and the air-cooled radiator is described below by taking the first fan module 61 as an example.

[0076] Continue to refer Figure 6a and Figure 6b The first fan module 61 is detachably fixedly connected to the housing 11 of the air-cooled radiator. The housing 11 of the air-cooled radiator is provided with a first plug hole 112 that cooperates with the first fan module 61. The first plug hole 112 is opened on a side wall of the housing 11 (not shown in the figure), and the length direction of the first plug hole 112 is perpendicular to the length direction of the heat dissipation channel. Figure 3bWhen the first fan module 61 is inserted into the first plug hole 112, the length direction of the first fan module 61 is perpendicular to the length direction of the heat dissipation channel 13, and the air supply direction of the first fan module 61 is the same as the length direction of the heat dissipation channel 13. Figure 6b The first fan module 61 is fixed to the side wall of the housing 11 by a threaded connector (such as a bolt or a screw), such as by a screw that fixes the first fan module 61 to the side wall of the housing 11. When maintenance is required, the screws can be removed and the first fan module 61 can be directly pulled out.

[0077] For reference Figure 7 , Figure 7 The structure of the first fan module 61 is shown. The first fan module 61 includes a bracket 64 and at least one mounting hole 65 provided on the bracket 64, and a fan is fixed in each mounting hole 65 through a connecting member, such as a bolt, a screw or a buckle to fix the fan in the corresponding mounting hole 65. Figure 7 In the structure shown, two mounting holes 65 are provided on the bracket 64, and the two mounting holes 65 are arranged along the length direction of the bracket 64. Figure 3b As shown in , when the first fan module 61 is assembled into the air-cooled radiator, the arrangement direction of the fans is perpendicular to the length direction of the heat dissipation channel. Figure 7 The bracket 64 is also provided with a cable 63 connected to each fan, and a connection terminal 66 for connecting to the first mainboard or the second mainboard. The connection terminal 66 is electrically connected to each fan through the cable 63. When the first fan module 61 is inserted into the first jack, it is electrically connected to the first mainboard or the second mainboard through the connection terminal 66, or is electrically connected to the first mainboard and the second mainboard at the same time. The way in which the first fan module 61 is connected to the first mainboard through the connection terminal 66 is a common connection method in the prior art and is not described in detail here.

[0078] When assembling the second fan module 62, a corresponding second plug hole 113 is provided on the housing 11. The matching mode between the second fan module 62 and the second plug hole 113 is the same as the matching mode between the first fan module 61 and the first plug hole 112, which will not be described in detail here. The structure of the second fan module 62 can be specifically referred to the description of the structure of the first fan module 61.

[0079] As a possible implementation, Figure 8Another way of matching a fan module with an air-cooled radiator is shown. As shown in the figure, the first fan module 61 and the second fan module 62 are respectively located at the two ends of the shell 11 of the air-cooled radiator, and the shell 11 of the air-cooled radiator has openings at both ends, and the two openings correspond to the air inlet and the air outlet of the heat dissipation channel. When the first fan module 61 and the second fan module 62 are assembled, the first fan module 61 covers the air inlet of the heat dissipation channel, and the first fan module 61 is fixedly connected to the shell 11 by a threaded connector (such as a bolt or a screw); the second fan module 62 covers the air outlet of the heat dissipation channel, and the second fan module 62 is fixedly connected to the shell 11 by a threaded connector (a bolt or a screw). When using Figure 7 In the connection mode shown, the fan module is easy to assemble and can be directly covered and fixed on the housing 11, thereby reducing assembly errors.

[0080] As another possible implementation Fig. 9 shows an exploded schematic diagram of a second vehicle-mounted computing device provided by an embodiment of the present application, Fig. 9 The same reference numerals in the Figure 2 The label in . Figures 1 to 8 The difference is that Fig. 9 The radiator of the vehicle-mounted computing device provided is a liquid cooling radiator 70. Fig.10a and Fig.10b , Fig.10a A cross-sectional view of a second vehicle-mounted computing device along a vertical direction is shown; Fig.10b The second in-vehicle computing device is shown in a cross-sectional view along the horizontal wind direction. The liquid cooling radiator 70 includes a housing 71 and a heat dissipation pipe 74 disposed in the housing 71, wherein two opposite surfaces of the housing 71 are respectively connected to the first mainboard 20 and the second mainboard 30 in a one-to-one correspondence and thermal conductivity. The heat dissipation pipe 74 is disposed as shown in FIG. Fig.10b As shown, the heat dissipation pipe 74 is laid in the horizontal direction (with Fig.10b The liquid-cooled radiator is placed in the shell 71 (the placement direction is the reference direction), and the flat heat dissipation pipe 74 is spiraled into an S-shaped heat dissipation pipe, and the two ends of the heat dissipation pipe 74 are respectively connected to the water inlet 73 and the water outlet 72 set on the shell 71.

[0081] Continue to refer Fig.10b A plurality of first heat dissipation fins 75 are arranged at intervals in the housing 71. Each first heat dissipation fin 75 has a first length, which is smaller than the width of the housing 71. One end of each first heat dissipation fin 75 is connected to a side wall of the housing. Two adjacent first heat dissipation fins 75 are connected to different side walls of the housing, so that a connected "S"-shaped heat dissipation pipe is formed between the plurality of first heat dissipation fins 75. Fig.10bIn the embodiment, there are four first heat dissipation fins 75, which are respectively the first heat dissipation fin 751, the first heat dissipation fin 752, the first heat dissipation fin 753, and the first heat dissipation fin 754, and the four first heat dissipation fins 75 are arranged along the arrangement direction of the water inlet 73 and the water outlet 72, and the first heat dissipation fins 75 divide the housing into multiple areas. To facilitate the description of the arrangement of the first heat dissipation fins 75, two opposite first side walls 711 and second side walls 712 of the lower housing 71 are first defined, wherein the first side wall 711 is the side wall where the water inlet 73 is arranged, and the second side wall 712 is the other side wall opposite to the first side wall 711. The two ends of the first heat dissipation fin 751 are respectively sealed and connected to the first side wall 711 and the second side wall 712; the first heat dissipation fin 752 is sealed and connected to the first side wall 711; the first heat dissipation fin 753 is sealed and connected to the second side wall 712; the first heat dissipation fin 754 is sealed and connected to the first side wall 711; and the first heat dissipation fin 754 and the side wall of the shell 71 (the side wall between the first side wall 711 and the second side wall 712) surround the part of the heat dissipation pipe 74 connected to the water outlet 72. It can be seen from the above description that a connected S-shaped heat dissipation pipe 74 can be formed by using the first heat dissipation fins 752, 753, 754 located in the middle part to be alternately sealed and connected to the first side wall 711 and the second side wall 712. When the number of the first heat dissipation fins 75 is m (m is a positive integer and greater than 2), m-1 bent S-shaped heat dissipation pipes can be formed. And the S-shaped heat dissipation pipe increases the fluidity of the liquid medium in the shell, thereby improving the heat dissipation effect of the radiator. As shown in FIG. Fig.10b The liquid medium flow direction indicated by the arrow in the middle: the liquid medium flows from the water inlet 73 into the heat dissipation pipe 74, and then flows out through the water outlet 72. During the circulation process, the liquid medium takes away the heat transferred from the first mainboard or the second mainboard to the housing 71. The above-mentioned liquid medium can be a common medium such as oil and water.

[0082] It should be understood that Fig.10b The figure only illustrates the location of the heat dissipation pipe 74 and does not represent the actual shape of the heat dissipation pipe 74 .

[0083] Continue to refer Fig.10b, in order to increase the heat dissipation effect of the liquid cooling radiator. A plurality of second heat dissipation fins are arranged between any adjacent first heat dissipation fins, and the plurality of second heat dissipation fins are arranged at intervals, the second heat dissipation fins are of a second length, the second length is less than the first length, and each second heat dissipation fin does not conflict with the side wall of the shell, so that a plurality of channels are formed between two adjacent first heat dissipation fins, and the liquid can flow in the shell, and the heat of the components on the first mainboard and / or the second mainboard is conducted to the outside of the radiator, so as to achieve heat dissipation of the computing device. For example, four second heat dissipation fins 76 are arranged between the first heat dissipation fins 751 and the first heat dissipation fins 752, and the arrangement direction of the second heat dissipation fins 76 is the same as that of the first heat dissipation fins 75, and both ends of each second heat dissipation fin 76 are not sealed with the first side wall 711 and the second side wall 712, and a certain distance of gap is left between the two so that the liquid medium can flow through. When in use, the heat transferred to the shell 71 is transferred to the first heat dissipation fins 75 and the second heat dissipation fins 76; when the liquid medium flows in the liquid pipeline 74, the liquid medium contacts the first heat dissipation fins 75 and the second heat dissipation fins 76 respectively, thereby increasing the contact area between the liquid medium and the shell 71, and further increasing the heat dissipation effect of the liquid medium.

[0084] When the liquid cooling radiator is used, the smart car has a refrigeration system, which is used to control the liquid cooling radiator. Specifically, the refrigeration system provides power for the flow of the liquid medium in the liquid cooling radiator, pumps the liquid medium into the heat dissipation pipe through the pump in the refrigeration system and drives the liquid medium to flow in the heat dissipation pipe, so that the liquid medium dissipates heat for the two chips in the heat dissipation pipe. In addition, the liquid medium after flowing through the liquid radiator is cooled by the refrigeration system and then enters the liquid radiator again, thereby forming a circulation loop to continuously dissipate heat for the first mainboard and the second mainboard.

[0085] When the refrigeration system pumps liquid medium into the heat dissipation pipe, the volume of the liquid medium pumped into the heat dissipation pipe by the refrigeration system at a single time is greater than or equal to the volume of the liquid medium contained between two adjacent first fins, so that the liquid medium pumped in each time can fill the gap between the two first heat dissipation fins, avoiding high-temperature liquid medium from remaining between the two first heat dissipation fins, thereby ensuring the fluidity of the liquid medium in the heat dissipation pipe.

[0086] Optionally, when multiple first heat dissipation fins 75 divide the shell into multiple areas of equal size, the volume of liquid medium pumped into the heat dissipation pipe by the refrigeration system at a single time is greater than or equal to the volume of liquid that can be accommodated in any one area, so that the liquid medium pumped in each time can fill the space of one area. Under the action of power, the liquid medium can flow in the shell, bringing the heat conducted by the liquid medium of the chip out of the shell, and the refrigeration system completes the cooling of the liquid medium, ensuring that the liquid radiator effectively dissipates heat for the components on the mainboard.

[0087] An embodiment of the present application also provides a smart car, which can be a new energy car or a car that uses gasoline as energy. However, no matter which type of car is used, it includes a smart car body and an automatic driving system arranged in the smart car body, and the automatic driving system includes the above-mentioned on-board computing device.

[0088] When the vehicle-mounted computing device is specifically arranged, due to the need for dust / waterproofing, the vehicle-mounted computing device is placed at one end of the interior of the vehicle body, such as the front or rear of the vehicle, or in the passenger compartment.

[0089] like Fig.11 As shown, Fig.11 A schematic diagram of a smart car is shown. The smart car includes a power supply system 300, which is electrically connected to the first mainboard and the second mainboard of the vehicle-mounted computing device 100, respectively, and is electrically connected to the first fan module and the second fan module through the first mainboard or the second mainboard. When in use, the power supply system 300 supplies power to the first mainboard, the second mainboard, the first fan module and the second fan module, and the first fan module and the second fan module increase the fluidity of the air in the radiator, thereby improving the heat dissipation effect of the first mainboard and the second mainboard. In addition, the smart car also includes a refrigeration system 200, which is an air conditioning system in the smart car. The air outlet of the air conditioning system is connected to the heat dissipation channel of the radiator, and the cold air blown out by the air conditioning system can enter the heat dissipation channel to dissipate heat for the first mainboard and the second mainboard.

[0090] like Fig.12 As shown, another schematic diagram of the internal structure of the smart car is shown. The smart car body is provided with a refrigeration system 400, which includes: a condenser, a cooling plate connected to the condenser through a pipeline, and the above-mentioned radiator, which is a liquid-cooled radiator. In addition, the smart car also includes a power supply system 300, which supplies power to the vehicle-mounted computing device 100. The specific power supply method can be specifically referred to Fig.12 The refrigeration system 400 is also used to cool the power supply system 300.

[0091] like Fig.13 As shown, Fig.13The specific refrigeration system structure is shown. When dissipating heat, the smart car uses coolant (a mixture of ethylene glycol and water) as a medium to form an independent refrigeration system to cool the battery pack. The refrigeration system includes components such as a liquid pump (such as a water pump), an electronic expansion valve (or a solenoid valve and a thermal expansion valve), a cooling plate (also called a water cooling plate), and a condenser. The water pump can be an electric water pump, and the water pump serves as a driving component to provide a power source for the circulation of the coolant; the electronic expansion valve (not shown in the figure) serves as a control component, and can actively adjust the flow of the refrigeration system according to the pressure and temperature of the refrigeration system; the cooling plate is used to dissipate heat for the battery, and the radiator in the on-board computing device dissipates heat for the first mainboard and the second mainboard. When in use, the coolant through the electronic expansion valve is supplied to the cooling plate and the radiator respectively, and the cooling plate and the radiator dissipate heat for the battery and the first mainboard and the second mainboard respectively. The coolant after heat exchange flows into the battery cooler. The battery cooler is used as a heat exchange device. The battery cooler exchanges heat with the air conditioning system through pipes. The air conditioning system includes a condenser, an evaporator, an electric compressor, and expansion valves and other devices. The structure of the air conditioning system is the system of vehicle air conditioning in the prior art and will not be described in detail here. The battery cooler is connected in parallel with the evaporator in the air conditioning system, and the cooling medium is provided by the condenser to exchange heat with the coolant after heat exchange in the battery cooler. In the above refrigeration system, the original refrigeration system and air conditioning system in the smart car are used to provide heat dissipation for the radiator. Compared with the air-cooled radiator, the cost is lower and the cooling effect is better than air cooling.

[0092] exist Fig.13 In addition to the example of connecting the vehicle-mounted computing device and the cooling plate in parallel, the embodiment of the present application does not limit the specific connection method between the vehicle-mounted computing device and the cooling plate. They can also be connected in series, which can achieve the heat dissipation effect for the first mainboard and the second mainboard.

[0093] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A vehicle-mounted computing device in a smart car, characterized in that: include: Two stacked main boards, each main board comprising a plurality of devices, wherein the plurality of devices are used to control the driving state of the smart car; A heat sink disposed between the two main boards and thermally connected to each main board; A closing plate disposed on a side of each mainboard facing away from the radiator and connected to the radiator; Wherein, each of the mainboards has a first surface facing the heat sink, the first surface is provided with at least one first functional device, and the at least one first functional device is thermally connected to the heat sink; Each of the mainboards has a second surface facing away from the heat sink, and the second surface is provided with at least one second functional device; The closing plate corresponding to each mainboard is a heat dissipation plate; and each second functional component of each mainboard is thermally connected to the heat dissipation plate.

2. The vehicle-mounted computing device according to claim 1, wherein: The radiator is an air-cooled radiator.

3. The vehicle-mounted computing device according to claim 2, wherein: The air-cooled radiator comprises a housing, a heat dissipation channel arranged in the housing, and an air supply module; the air supply module comprises: A first fan module and a second fan module are arranged along the length direction of the heat dissipation channel, wherein the air supply directions of the first fan module and the second fan module are the same.

4. The vehicle-mounted computing device according to claim 3, wherein: The smart car includes an on-board power supply system, and the on-board power supply system supplies power to the first fan module or the second fan module through at least one of the two main boards; the first fan module is electrically connected to one of the two main boards, and the second fan module is electrically connected to the other of the two main boards; or The first fan module is electrically connected to the two mainboards respectively, and the second fan module is electrically connected to the two mainboards respectively.

5. The vehicle-mounted computing device according to claim 3, wherein: The first fan module and the second fan module are respectively detachably fixedly connected to the shell.

6. The vehicle-mounted computing device according to claim 5, wherein: The housing is provided with a first plug hole and a second plug hole; the first fan module is detachably fixed to the first plug hole, and the second fan module is detachably fixed to the second plug hole.

7. The vehicle-mounted computing device according to any one of claims 3 to 6, characterized in that: A plurality of heat dissipation fins are arranged in the shell, and the heat dissipation channels are formed between the plurality of heat dissipation fins.

8. The vehicle-mounted computing device according to claim 7, wherein: The heat dissipation channel is a straight channel; and the length direction of the heat dissipation channel is perpendicular to the stacking direction of the two main boards.

9. The vehicle-mounted computing device according to claim 8, wherein: The first fan module delivers air outside the radiator into the heat dissipation channel, and the second fan module draws air in the heat dissipation channel out of the radiator.

10. The vehicle-mounted computing device according to claim 1, wherein: The radiator is a liquid-cooled radiator.

11. The vehicle-mounted computing device according to claim 10, wherein: The smart car includes a refrigeration system, which is used to control the liquid-cooled radiator; the liquid-cooled radiator includes a shell and a heat dissipation pipe arranged in the shell, and the shell is provided with a water inlet pipe and a water outlet pipe connected to the heat dissipation pipe; wherein two opposite surfaces of the shell are respectively connected to the two mainboards.

12. The vehicle-mounted computing device according to claim 11, wherein: A plurality of first heat dissipation fins arranged at intervals are arranged in the shell, and a communicating S-shaped heat dissipation pipe is formed between the plurality of first heat dissipation fins.

13. The vehicle-mounted computing device according to claim 12, wherein: A plurality of second heat dissipation fins are arranged between any adjacent first heat dissipation fins, and the plurality of second heat dissipation fins are arranged at intervals.

14. The vehicle-mounted computing device according to any one of claims 11 to 13, characterized in that: The refrigeration system is used to pump liquid medium into the heat dissipation pipeline, and the liquid medium dissipates heat for two chips in the heat dissipation pipeline.

15. The vehicle-mounted computing device according to claim 14, wherein: A plurality of first heat dissipation fins are arranged in the shell, and the plurality of first heat dissipation fins divide the shell into a plurality of areas. The first heat dissipation fins are of a first length, and one end of the first heat dissipation fins conflicts with the inner wall of the shell, and two adjacent first heat dissipation fins conflict with different inner walls of the shell, and the different inner walls are arranged in parallel. A plurality of second heat dissipation fins are arranged at intervals in each area, and each of the plurality of second heat dissipation fins is of a second length, and the first length is greater than the second length, and each second heat dissipation fin does not conflict with the inner wall of the shell.

16. The vehicle-mounted computing device according to claim 14, wherein: When the heat dissipation pipe is formed by a plurality of first heat dissipation fins, the volume of the liquid medium pumped into the heat dissipation pipe by the refrigeration system at one time is greater than or equal to the volume of the liquid medium contained between two adjacent first heat dissipation fins.

17. A smart car, characterized in that: It comprises an intelligent vehicle body, and a vehicle-mounted computing device as claimed in any one of claims 1 to 16 arranged in the intelligent vehicle body.

18. The intelligent vehicle according to claim 17, characterized in that: The vehicle-mounted computing device is arranged at one end of the intelligent vehicle body.

19. The intelligent vehicle according to claim 17, wherein: It also includes a refrigeration system arranged in the intelligent vehicle body, and the refrigeration system includes: a condenser, and a cooling plate and the radiator connected to the condenser through a pipeline, wherein the radiator is a liquid-cooled radiator.

20. The intelligent vehicle according to claim 19, characterized in that: The refrigeration system further comprises a liquid pump arranged on the pipeline.

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