Substrate, optical element, electronic device, and method for manufacturing substrate

Abstract

The application provides a substrate, an optical element, an electronic device and a manufacturing method of the substrate. The substrate comprises a center layer, a first adhesive layer and a second adhesive layer. The material of the center layer is PET. The first adhesive layer is connected with one side surface of the center layer. The second adhesive layer is connected with the other side surface of the center layer, which is far away from the first adhesive layer. The application solves the problem that the substrate is easy to warp in the prior art.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of optical imaging devices, in particular to a substrate, an optical element, an electronic device and a manufacturing method of the substrate. BACKGROUND

[0002] Miniaturization of electronic devices has gradually become a development trend, and optical modules such as under-screen fingerprint, DOE (Diffractive Optical Element), and DIFFUSER (Diffuser) are as light and thin as possible. The substrate often uses ultra-thin glass or flexible glass, but the thickness of such glass is mostly around 0.1 mm. If PET (thickness up to 0.01 um) is used as the substrate, the PET material is too soft to cause warping and other problems.

[0003] That is, the substrate in the prior art has the problem of easy warping. SUMMARY

[0004] The main purpose of the present application is to provide a substrate, an optical element, an electronic device and a manufacturing method of the substrate to solve the problem of easy warping of the substrate in the prior art.

[0005] In order to achieve the above-mentioned purpose, according to one aspect of the present application, a substrate is provided, comprising: a center layer, the material of the center layer being PET; a first adhesive layer, the first adhesive layer being connected with one side surface of the center layer; and a second adhesive layer, the second adhesive layer being connected with the other side surface of the center layer away from the first adhesive layer.

[0006] Further, the thickness of the center layer is greater than or equal to 0.1 um and less than or equal to 50 um; and / or the thickness of the first adhesive layer is greater than or equal to 1 um and less than or equal to 10 um; and / or the thickness of the second adhesive layer is greater than or equal to 1 um and less than or equal to 10 um.

[0007] Further, the substrate further comprises an optical film, the optical film being arranged on the side surface of the first adhesive layer and / or the second adhesive layer away from the center layer; and / or the substrate further comprises a negative ultraviolet curing resin, the negative ultraviolet curing resin being arranged on the side surface of the first adhesive layer and / or the second adhesive layer away from the center layer.

[0008] Further, the material of the first adhesive layer and the second adhesive layer is UV adhesive; and / or the thickness of the substrate is greater than or equal to 10 um and less than or equal to 1 mm.

[0009] According to another aspect of the present application, an optical element is provided, comprising the above-mentioned substrate.

[0010] According to another aspect of the present application, an electronic device is provided, comprising the above-mentioned optical element.

[0011] According to another aspect of the present application, a method for manufacturing a substrate is provided, the substrate is manufactured by the method for manufacturing a substrate, the method for manufacturing a substrate comprises: coating a resin material on a base to form a base with a first adhesive layer; contacting and combining a PET material with the base with the first adhesive layer; irradiating the PET material and the base with the first adhesive layer by ultraviolet rays; separating the first adhesive layer from the base to form a first adhesive layer and a center layer; coating a resin material on the base to form a base with a second adhesive layer; contacting and combining a surface of the center layer away from the first adhesive layer with the base with the second adhesive layer; irradiating the center layer and the base with the second adhesive layer by ultraviolet rays; separating the second adhesive layer from the base to form the substrate.

[0012] Further, when coating the resin material on the base, spin coating or spray coating is used.

[0013] Further, in the contacting and combining of the PET material with the base with the first adhesive layer, the first adhesive layer is rolled or hard contacted to combine the PET material with the first adhesive layer.

[0014] Further, in the contacting and combining of the surface of the center layer away from the first adhesive layer with the base with the second adhesive layer, the second adhesive layer is rolled or hard contacted to combine the center layer with the second adhesive layer.

[0015] According to the technical solution of the present application, the substrate comprises a center layer, a first adhesive layer and a second adhesive layer, the material of the center layer is PET; the first adhesive layer is connected with a surface of the center layer; and the second adhesive layer is connected with a surface of the center layer away from the first adhesive layer.

[0016] By arranging the first adhesive layer and the second adhesive layer on both sides of the center layer, the structural strength of the center layer can be increased, so that the center layer has strong structural strength even if it is thin, and is not prone to warping, thereby ensuring the stability of the center layer. This arrangement can reduce the amount of material used for the center layer, and the structural strength of the center layer is increased by the adhesive layers on both sides, thereby reducing the production cost while ensuring the structural strength of the substrate, and greatly avoiding warping of the substrate. BRIEF DESCRIPTION OF DRAWINGS

[0017] The accompanying drawings, which form a part of the present application, are used to provide further understanding of the present application, and serve as an explanation of the illustrative embodiments of the present application, and do not constitute improper limitations of the present application. In the drawings:

[0018] Figure 1 FIG. 1 shows a structural schematic diagram of a substrate according to an optional embodiment of the present application; and

[0019] Figure 2 FIG. 2 shows a state diagram of coating a resin material on a base according to an optional embodiment of the present application;

[0020] Figure 3 It shows Figure 2 The resin material is spin-coated onto the substrate;

[0021] Figure 4 It shows Figure 3 A first adhesive layer and a central layer are formed on the substrate, and a state diagram of the first adhesive layer and the central layer is imprinted and exposed.

[0022] Figure 5 It shows Figure 4 A diagram showing the state of the first adhesive layer separating from the substrate;

[0023] Figure 6 It shows Figure 5 A diagram showing the state of the formation of a second adhesive layer on the central layer;

[0024] Figure 7 It shows Figure 6 Diagram showing the separation of the second adhesive layer from the substrate.

[0025] The above figures include the following reference numerals:

[0026] 10. Core layer; 20. First adhesive layer; 30. Second adhesive layer; 40. Substrate. Detailed Implementation

[0027] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0028] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0029] In this invention, unless otherwise stated, directional terms such as "upper," "lower," "top," and "bottom" are generally used in relation to the direction shown in the accompanying drawings, or in relation to the vertical, perpendicular, or gravitational direction of the component itself; similarly, for ease of understanding and description, "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not intended to limit this invention.

[0030] To address the problem of substrate warping in existing technologies, this invention provides a substrate, optical elements, electronic devices, and a method for manufacturing the substrate.

[0031] like Figures 1 to 7 As shown, the substrate includes a central layer 10, a first adhesive layer 20, and a second adhesive layer 30. The material of the central layer 10 is PET. The first adhesive layer 20 is connected to one side surface of the central layer 10. The second adhesive layer 30 is connected to the side surface of the central layer 10 away from the first adhesive layer 20.

[0032] By arranging the first adhesive layer 20 and the second adhesive layer 30 on both sides of the center layer 10, the structural strength of the center layer 10 can be increased, so that the center layer 10 has strong structural strength even if it is thin, and is not prone to warping, thereby ensuring the stability of the center layer 10. This arrangement can reduce the amount of material used for the center layer 10, and increase the structural strength of the center layer 10 through the adhesive layers on both sides, thereby reducing production costs while ensuring the structural strength of the substrate, and greatly avoiding warping of the substrate.

[0033] Optionally, the thickness of the center layer 10 is greater than or equal to 0.1 um and less than or equal to 50 um. If the thickness of the center layer 10 is less than 0.1 um, the thickness of the center layer 10 is too small, and the center layer 10 is prone to breakage. Meanwhile, the optical performance of the thin center layer 10 is poor, which in turn leads to poor optical performance of the substrate. If the thickness of the center layer 10 is greater than 50 um, the thickness of the center layer 10 is too large, which increases the production cost of the substrate, and is not conducive to miniaturization of the substrate. Limiting the thickness of the center layer 10 to a range of 0.1 um to 50 um ensures the optical performance of the center layer 10 while facilitating miniaturization of the substrate. The center layer 10 can provide support, and the thickness of the center layer 10 determines the overall thickness of the substrate. Of course, the specific thickness of the center layer 10 can be designed according to specific use requirements.

[0034] Specifically, the thickness of the first adhesive layer 20 is greater than or equal to 1 um and less than or equal to 10 um. If the thickness of the first adhesive layer 20 is less than 1 um, the first adhesive layer 20 is not easy to completely cover the center layer 10, which makes the first adhesive layer 20 unevenly laid, affects the optical performance of the substrate, and increases the hardness of the center layer 10, which makes the substrate prone to warping. If the thickness of the first adhesive layer 20 is greater than 10 um, the thickness of the first adhesive layer 20 is too large, which is not conducive to miniaturization of the substrate. Limiting the thickness of the first adhesive layer to a range of 1 um to 10 um can ensure that the first adhesive layer 20 can be completely coated on the surface of the center layer 10 while facilitating miniaturization of the substrate.

[0035] Specifically, the thickness of the second adhesive layer 30 is greater than or equal to 1 um and less than or equal to 10 um. If the thickness of the second adhesive layer 30 is less than 1 um, the second adhesive layer 30 is not easy to completely cover the center layer 10, which makes the second adhesive layer 30 unevenly laid, affecting the optical performance of the substrate. If the thickness of the second adhesive layer 30 is greater than 10 um, the thickness of the second adhesive layer 30 is too large, which is not conducive to miniaturization of the substrate. Limiting the thickness of the first adhesive layer to a range of 1 um to 10 um can ensure that the second adhesive layer 30 can be completely coated on the surface of the center layer 10 while facilitating miniaturization of the substrate.

[0036] Optionally, the substrate further comprises an optical film, which is arranged on the side surface of the first adhesive layer 20 and / or the second adhesive layer 30 away from the center layer 10. The arrangement of the optical film can increase the optical effect of the substrate and broaden the use range of the substrate. The optical film can be an antireflection film or a reflection film.

[0037] Optionally, the substrate further comprises a negative ultraviolet curing resin, which is arranged on the side surface of the first adhesive layer 20 and / or the second adhesive layer 30 away from the center layer 10. The negative ultraviolet curing resin can increase the bonding force of the substrate with other materials, so that the substrate can be combined with various materials, thereby increasing the use range of the substrate.

[0038] Optionally, the material of the first adhesive layer 20 and the second adhesive layer 30 is UV glue. The first adhesive layer 20 and the second adhesive layer 30 can increase the hardness of the center layer 10. Different types of UV glue can be selected according to the use requirements of the substrate. Different types of UV glue can provide different hardness after curing, so as to ensure that the substrate does not warp and meet the individual needs of the product.

[0039] Specifically, the thickness of the substrate is greater than or equal to 10 um and less than or equal to 1 mm. Such a setting makes the substrate super-thin, which is conducive to the miniaturization of the substrate and can increase the use range of the substrate.

[0040] The optical element comprises the above-mentioned substrate. The optical element with the above-mentioned substrate has the advantages of strong hardness, not easy to warp, and easy to be made into miniaturization, so that the optical element can work stably. The optical element can be a display screen, a DOE, a light homogenizing sheet, etc.

[0041] The electronic device comprises the optical element. The electronic device with the above-mentioned optical element has the advantages of good optical performance, not easy to warp, and small structure, which can effectively increase the working time of the electronic device. The electronic device can be a mobile phone, a computer, a tablet, etc.

[0042] As shown in Figures 2 to 7 The above-mentioned substrate is made by the method for making a substrate, which comprises: coating a resin material on a base 40 to form the base 40 with a first adhesive layer 20; contacting and combining a PET material with the base 40 with the first adhesive layer 20; irradiating the PET material and the base 40 with the first adhesive layer 20 with ultraviolet rays; separating the first adhesive layer 20 from the base 40 to form the first adhesive layer 20 and the center layer 10; coating a resin material on the base 40 to form the base 40 with a second adhesive layer 30; contacting and combining the side surface of the center layer 10 away from the first adhesive layer 20 with the base 40 with the second adhesive layer 30; irradiating the center layer 10 and the base 40 with the second adhesive layer 30 with ultraviolet rays; and separating the second adhesive layer 30 from the base 40 to form the substrate.

[0043] The resin material is coated on the substrate 40 to form the first glue layer 20 on the substrate 40. The PET material is coated on the surface of the first glue layer 20 away from the substrate 40 to form the center layer 10. The PET material and the substrate 40 with the first glue layer 20 are irradiated by ultraviolet rays to cure the resin material to form the first glue layer 20 in a fixed shape. The first glue layer 20 is separated from the substrate 40 to form the first glue layer 20 and the center layer 10. The second glue layer 30 is obtained by the same method to form the substrate. The method can form an ultra-thin substrate without warping.

[0044] Specifically, the resin material is coated on the substrate 40 by spin coating or spraying. The spin coating or spraying can ensure the thickness and uniformity of the first glue layer 20 to avoid the first glue layer 20 from being too large on the center layer 10.

[0045] Specifically, in the contact and combination of the PET material and the substrate 40 with the first glue layer 20, the first glue layer 20 is rolled or hard contacted to combine the PET material and the first glue layer 20. The PET material and the first glue layer 20 are tightly combined together by rolling the first glue layer 20, and there is no air gap between the center layer 10 and the first glue layer 20, which effectively ensures the adhesion of the first glue layer 20 and the center layer 10.

[0046] Of course, the first glue layer 20 and the center layer 10 can also be hard contacted.

[0047] It should be noted that the hard contact means that the first glue layer 20 is pressed by using a hard panel or other surface flat material, so that the first glue layer 20 can be evenly coated on the surface of the center layer 10 under the action of the pressure.

[0048] Specifically, in the contact and combination of the center layer away from the first glue layer 20 on one side and the substrate 40 with the second glue layer 30, the second glue layer 30 is rolled or hard contacted to combine the center layer 10 and the second glue layer 30. The PET material and the second glue layer 30 are tightly combined together by rolling the second glue layer 30, and there is no air gap between the center layer 10 and the second glue layer 30, which effectively ensures the adhesion of the second glue layer 30 and the center layer 10.

[0049] Of course, the second glue layer 30 and the center layer 10 can also be hard contacted.

[0050] It should be noted that the hard contact means that the second glue layer 30 is pressed by using a hard panel or other surface flat material, so that the second glue layer 30 can be evenly coated on the surface of the center layer 10 under the action of the pressure.

[0051] Obviously, the above-described embodiments are only some, but not all of the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts should fall within the protection scope of the present application.

[0052] It is to be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments consistent with the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising," when used in this specification, specify the presence of stated features, steps, operations, devices, components and / or combinations thereof, but do not preclude the presence or addition of one or more other features, steps, operations, devices, components and / or combinations thereof.

[0053] It is to be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments consistent with the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising," when used in this specification, specify the presence of stated features, steps, operations, devices, components and / or combinations thereof, but do not preclude the presence or addition of one or more other features, steps, operations, devices, components and / or combinations thereof.

[0054] The preferred embodiments of the present application have been described above with the aid of drawing figures, and are not limited to those embodiments; instead, they will include, in general, any modifications of more or less than the specific details of the embodiments. Accordingly, the application is not limited, except as by the appended claims.

Claims

1. A method of manufacturing a substrate, characterized by, The manufacturing method of the substrate comprises: coating a resin material on a base (40) to form the base (40) with a first adhesive layer (20); coating a PET material on a surface of the first adhesive layer (20) away from the base (40) to form a center layer (10); irradiating the PET material and the base (40) with the first adhesive layer (20) with ultraviolet rays; separating the first adhesive layer (20) from the base (40); coating the resin material on the base (40) to form the base (40) with a second adhesive layer (30); contacting and combining a surface of the center layer (10) away from the first adhesive layer (20) with the second adhesive layer (30); irradiating the center layer (10) and the base (40) with the second adhesive layer (30) with ultraviolet rays; separating the second adhesive layer (30) from the base (40) to form the substrate; wherein the thickness of the center layer (10) is greater than or equal to 0.1 um and less than or equal to 50 um, the thickness of the first adhesive layer (20) is greater than or equal to 1 um and less than or equal to 10 um, and the thickness of the second adhesive layer (30) is greater than or equal to 1 um and less than or equal to 10 um.

2. The method of manufacturing a substrate according to claim 1, wherein When coating the resin material on the base (40), spin coating or spray coating is used.

3. The method of manufacturing a substrate according to claim 1, wherein In the contacting and combining of the PET material with the base (40) with the first adhesive layer (20), the first adhesive layer (20) is rolled or hard contacted to combine the PET material with the first adhesive layer (20).

4. The method of manufacturing a substrate according to claim 1, wherein In the contacting and combining of the surface of the center layer (10) away from the first adhesive layer (20) with the base (40) with the second adhesive layer (30), the second adhesive layer (30) is rolled or hard contacted to combine the center layer (10) with the second adhesive layer (30).

5. A substrate, characterized by, The manufacturing method of the substrate of any one of claims 1 to 4 comprises: a center layer (10), the material of the center layer (10) being PET; a first adhesive layer (20), the first adhesive layer (20) being connected to a surface of the center layer (10); a second adhesive layer (30), the second adhesive layer (30) being connected to a surface of the center layer (10) away from the first adhesive layer (20).

6. The substrate of claim 5, wherein the substrate further comprises an optical film disposed on a surface of the first adhesive layer (20) and / or the second adhesive layer (30) away from the center layer (10); and / or the substrate further comprises a negative ultraviolet curing resin disposed on a surface of the first adhesive layer (20) and / or the second adhesive layer (30) away from the center layer (10).

7. The substrate of claim 5 or 6, wherein the material of the first adhesive layer (20) and the second adhesive layer (30) is UV adhesive; and / or the thickness of the substrate is greater than or equal to 10 um and less than or equal to 1 mm.

8. An optical element, characterized by, The substrate of any one of claims 5 to 7.

9. An electronic device, comprising: The optical element of claim 8 is included.

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