Device data analysis method, device, computer device and readable storage medium

Abstract

The embodiment of the present invention discloses a device data analysis method, apparatus, computer equipment and readable storage medium, wherein the method comprises: obtaining device data sent by a target device, the device data comprising module temperature and module failure times corresponding to each target module in the target device; analyzing the module temperature corresponding to each target module to obtain a temperature analysis result corresponding to each target module; analyzing the module failure times corresponding to each target module to obtain a failure analysis result corresponding to the target device; obtaining a device analysis result corresponding to the target device according to the temperature analysis result corresponding to each target module and the failure analysis result corresponding to the target device, so as to feed back the device analysis result to maintenance personnel. By adopting the embodiment of the present invention, maintenance personnel can timely understand the equipment status, so as to perform equipment maintenance in advance, for example, replace equipment components at night to ensure the normal operation of the enterprise.

Description

Technical Field

[0001] The present invention relates to the technical field of equipment maintenance, and in particular to an equipment data analysis method, device, computer equipment and readable storage medium. Background Art

[0002] Self-service devices, such as Automatic Teller Machines (ATMs), have a wide distribution range.

[0003] When a self-service device fails, the maintenance process of the self-service device is usually: bank staff contacts relevant maintenance personnel for maintenance. If the relevant maintenance personnel cannot handle it, they need to further contact the equipment manufacturer.

[0004] It can be seen that if the bank staff cannot discover the ATM failure in time, the ATM will not be repaired in time. Or, even if the bank staff discovers the failure in time, a lot of time will be wasted due to the need to replace equipment parts, which will also affect the normal operation of the bank and reduce the user experience. Summary of the invention

[0005] Based on this, it is necessary to propose a device data analysis method, device, computer equipment and readable storage medium that can understand the device status in advance to address the above problems.

[0006] A device data analysis method, the method comprising:

[0007] Acquire device data sent by the target device, wherein the device data includes a module temperature and a number of module failures corresponding to each target module in the target device;

[0008] Analyze the module temperature corresponding to each target module to obtain the temperature analysis result corresponding to each target module;

[0009] Analyze the number of module failures corresponding to each target module to obtain a failure analysis result corresponding to the target device;

[0010] According to the temperature analysis result corresponding to each target module and the fault analysis result corresponding to the target device, the device analysis result corresponding to the target device is obtained, so as to feed back the device analysis result to the maintenance personnel.

[0011] In one embodiment, the fault analysis result includes the remaining life corresponding to the target device; the number of module failures corresponding to each target module is analyzed to obtain the fault analysis result corresponding to the target device, including: determining the target area where the target device is located, and obtaining the average number of failures of each target module corresponding to the target area; obtaining the normal working time and current working time corresponding to the target device; and obtaining the remaining life corresponding to the target device based on the number of module failures corresponding to each target module, the average number of failures, the normal working time and the current working time corresponding to the target device.

[0012] In one embodiment, obtaining the normal working time and current working time corresponding to the target device includes: obtaining the working time corresponding to each target module in the target device; obtaining the target working time with the shortest working time from the working time corresponding to each target module; and determining the normal working time corresponding to the target device according to the target working time.

[0013] In one embodiment, the remaining life of the target device is obtained according to the number of module failures corresponding to each target module, the average number of failures, the normal working time and the current working time of the target device, including: obtaining the module weight corresponding to each target module in the target device; obtaining the module failure rate corresponding to each target module according to the number of module failures corresponding to each target module, the average number of failures and the module weight; obtaining the device failure rate corresponding to the target device according to the module failure rate corresponding to each target module; obtaining the remaining life of the target device according to the device failure rate corresponding to the target device, the normal working time and the current working time.

[0014] In one embodiment, the temperature analysis result includes a high temperature result, a medium-high temperature result and a normal result; the module temperature corresponding to each target module is analyzed to obtain the temperature analysis result corresponding to each target module, including: obtaining the normal temperature range corresponding to each target module; if the module temperature and the normal temperature range corresponding to the target module meet a first preset condition, the temperature analysis result of the target module is a high temperature result; if the module temperature and the normal temperature range corresponding to the target module meet a second preset condition, the temperature analysis result corresponding to the target module is a medium-high temperature result; if the module temperature and the normal temperature range corresponding to the target module meet a third preset condition, the temperature analysis result corresponding to the target module is a normal result.

[0015] In one embodiment, obtaining the normal temperature range corresponding to each target module includes: obtaining the expected temperature and standard deviation temperature corresponding to each target module in the target device; obtaining the normal working time range corresponding to the target device; and obtaining the normal temperature range corresponding to each target module according to the expected temperature, standard deviation temperature and normal working time range corresponding to each target module in the target device.

[0016] In one embodiment, the device analysis results include immediate processing results, queued processing results and processing-free results; the device analysis results corresponding to the target device are obtained based on the temperature analysis results corresponding to each target module and the fault analysis results corresponding to the target device, including: obtaining the historical temperature analysis results corresponding to each target module; obtaining a temperature score based on the temperature analysis results corresponding to each target module and the historical temperature analysis results; obtaining a fault score based on the fault analysis results; obtaining a device score corresponding to the target device based on the fault score and the temperature score corresponding to each target module; and determining the device analysis result corresponding to the target device based on the device score.

[0017] A device data analysis apparatus, comprising:

[0018] A first acquisition module is used to acquire device data sent by a target device, wherein the device data includes a module temperature and a module failure count corresponding to each target module in the target device;

[0019] The temperature analysis module is used to analyze the module temperature corresponding to each target module and obtain the temperature analysis result corresponding to each target module;

[0020] A fault analysis module is used to analyze the number of module faults corresponding to each target module to obtain a fault analysis result corresponding to the target device;

[0021] The analysis result module is used to obtain the device analysis result corresponding to the target device according to the temperature analysis result corresponding to each target module and the fault analysis result corresponding to the target device, so as to feed back the device analysis result to the maintenance personnel.

[0022] A computer device comprises a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor performs the following steps:

[0023] Acquire device data sent by the target device, wherein the device data includes a module temperature and a number of module failures corresponding to each target module in the target device;

[0024] Analyze the module temperature corresponding to each target module to obtain the temperature analysis result corresponding to each target module;

[0025] Analyze the number of module failures corresponding to each target module to obtain a failure analysis result corresponding to the target device;

[0026] According to the temperature analysis result corresponding to each target module and the fault analysis result corresponding to the target device, the device analysis result corresponding to the target device is obtained, so as to feed back the device analysis result to the maintenance personnel.

[0027] A computer-readable storage medium stores a computer program, which, when executed by a processor, causes the processor to perform the following steps:

[0028] Acquire device data sent by the target device, wherein the device data includes a module temperature and a number of module failures corresponding to each target module in the target device;

[0029] Analyze the module temperature corresponding to each target module to obtain the temperature analysis result corresponding to each target module;

[0030] Analyze the number of module failures corresponding to each target module to obtain a failure analysis result corresponding to the target device;

[0031] According to the temperature analysis result corresponding to each target module and the fault analysis result corresponding to the target device, the device analysis result corresponding to the target device is obtained, so as to feed back the device analysis result to the maintenance personnel.

[0032] Implementing the embodiments of the present invention will have the following beneficial effects:

[0033] The present invention proposes a device data analysis method, device, computer equipment and computer-readable storage medium, firstly obtaining device data sent by a target device, wherein the device data includes a module temperature and a number of module failures corresponding to each target module in the target device; then analyzing the module temperature corresponding to each target module to obtain a temperature analysis result corresponding to each target module; at the same time, analyzing the number of module failures corresponding to each target module to obtain a failure analysis result corresponding to the target device; finally, obtaining a device analysis result corresponding to the target device based on the temperature analysis result corresponding to each target module and the failure analysis result corresponding to the target device, so as to feed back the device analysis result to maintenance personnel. It can be seen that since the equipment temperature and the number of equipment failures are analyzed and the equipment analysis results are obtained based on this, maintenance personnel can view the equipment analysis results in advance, thereby understanding the conditions of different equipment distributed in various areas, and make maintenance preparations in advance for equipment that may need maintenance to prevent staff from failing to discover failures in time; or, for some equipment that often works at high temperatures and has a high number of failures, prepare to replace equipment parts in advance to prevent equipment failure and failure to handle it in time, affecting business operations and reducing user self-service experience; finally, since the relevant data of each module of the target equipment is analyzed, the final analysis results are more accurate. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0035] in:

[0036] Figure 1 A schematic diagram of an implementation flow of a device data analysis method in one embodiment;

[0037] Figure 2 A schematic diagram of a device analysis result in one embodiment;

[0038] Figure 3 Schematic diagram of the implementation process of step S300 in one embodiment;

[0039] Figure 4 is a schematic diagram of a target area in one embodiment;

[0040] Figure 5 Schematic diagram of the implementation process of step S304 in one embodiment;

[0041] Figure 6 Schematic diagram of the implementation process of step S306 in one embodiment;

[0042] Figure 7 Schematic diagram of the implementation process of step S200 in one embodiment;

[0043] Figure 8 Schematic diagram of the implementation process of step S202 in one embodiment;

[0044] Fig. 9 Schematic diagram of the implementation process of step S400 in one embodiment;

[0045] Fig.10 A schematic diagram of a fault frequency table, a current duration table, and a weighted duration table in one embodiment;

[0046] Fig.11 is a structural block diagram of a device data analysis apparatus in one embodiment;

[0047] Fig.12 FIG. 4 is a structural block diagram of a computer device in one embodiment. DETAILED DESCRIPTION

[0048] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0049] like Figure 1 As shown, in one embodiment, a device data analysis method is provided. The execution subject of the device data analysis method described in the embodiment of the present invention is a device that can implement the device data analysis method described in the embodiment of the present invention. The device may include but is not limited to a terminal and a server, wherein the terminal may include but is not limited to a desktop terminal and a mobile terminal. The desktop terminal includes a desktop computer, and the mobile terminal includes but is not limited to a mobile phone, a tablet and a laptop computer; the server includes a high-performance computer and a high-performance computer cluster. The device data analysis method specifically includes the following steps:

[0050] Step S100: acquiring device data sent by a target device, wherein the device data includes a module temperature and a number of module failures corresponding to each target module in the target device.

[0051] The target device is the device to be analyzed, including but not limited to self-service devices; the device data is the data reflecting the status of the target device itself, and the device data can come from various modules in the device. For example, the target device can also be a non-self-service device. It is understandable that even if it is a non-self-service device, the staff cannot monitor the device status well and in time. The non-self-service device can still upload the relevant device data to the server through the method of this application to help maintenance personnel understand the device status of the non-self-service device.

[0052] The target module is the module to be analyzed in the target device, for example, the target module is a touch screen module. Exemplarily, in order to monitor the target device in an all-round way and obtain more accurate and comprehensive analysis results, all modules included in the target device are target modules; Exemplarily, in order to reduce the workload of the analysis task, some relatively important modules in the target device are set as target modules.

[0053] Among them, the module temperature is the temperature value corresponding to the current time of the target module; the number of module failures is the total number of module failures from the time the module was put into use to the present. It can be understood that if a target module has more failures, it may be that there are certain problems with the target module itself, for example, the failure of the target module caused by physical reasons (collision), or the aging of the module itself, or there may be certain problems with other modules in the target device, which indirectly causes the target to fail. In either case, the number of failures of the target module is counted, and the number of failures is fed back to the maintenance personnel through the equipment analysis results. After seeing the equipment analysis results, if the maintenance personnel find that a certain module has a serious failure, they can consider replacing a new module or even directly replacing the equipment.

[0054] In one embodiment, the acquiring device data sent by the target device includes: acquiring device data sent by the target device at preset intervals. For example, the preset interval is set to 0.5 days.

[0055] In one embodiment, in order to monitor the target device in an all-round way and obtain more accurate and comprehensive analysis results, the device data may also include the module humidity and / or module cleanliness corresponding to each target module in the target device. If a target module is a sensor module, the device data may also include the module sensor data corresponding to the target module. For example, if the target module is a touch screen module, the module humidity is the touch screen module humidity. It is understandable that if it is summer, many people will sweat, and each touch will increase the humidity of the touch screen. The increase in humidity will reduce the user experience. Finally, the obtained module cleanliness or module humidity is compared with the preset value to determine whether the module is abnormal.

[0056] Step S200 , analyzing the module temperature corresponding to each target module to obtain a temperature analysis result corresponding to each target module.

[0057] The temperature analysis result reflects the current temperature of the target module. Too high a temperature will accelerate module aging and reduce the module's service life. Therefore, it is necessary to monitor the module's temperature to ensure that the module has a maximum service life.

[0058] Exemplarily, a preset module temperature is obtained; the module temperature corresponding to each target module is compared with the preset module temperature, and if the module temperature corresponding to the target module exceeds the preset module temperature, the temperature analysis result corresponding to the target module is high temperature; otherwise, the temperature analysis result corresponding to the target module is normal. By comparing the module temperature with the preset module temperature, it is determined whether the module is in a high temperature state.

[0059] Step S300, analyzing the number of module failures corresponding to each target module to obtain a failure analysis result corresponding to the target device.

[0060] Among them, the fault analysis results reflect the current fault conditions of each target module in the target device. The more faults there are, the more serious the module aging and damage is. Since the modules will affect each other and affect the use of the entire device, the fault analysis results of the device are obtained according to the fault times of each module to ensure the normal use of the device.

[0061] Exemplarily, the preset number of faults and the preset number of dangers are obtained; the number of module faults corresponding to each target module is compared with the preset number of faults. If the number of module faults corresponding to the target module exceeds the preset number of faults, the module fault analysis result corresponding to the target module is the first danger result; otherwise, the module fault analysis result corresponding to the target module is the first normal result; the number of target modules whose module fault analysis results are the first danger result is counted. If the number of target modules whose module fault analysis results are the first danger result exceeds the preset number of dangers, the fault analysis result corresponding to the target device is the second danger result; otherwise, the fault analysis result corresponding to the target device is the second normal result. By comparing the number of module faults with the preset number of faults, it is determined whether the module is seriously aged or damaged; the number of modules in danger of aging or damage is counted. If it exceeds the preset number of dangers, it is considered that the entire target device is seriously aged or damaged, and it may be necessary to consider replacing the module, or using a new target device to replace the aged or seriously damaged target device.

[0062] Step S400, obtaining a device analysis result corresponding to the target device according to the temperature analysis result corresponding to each target module and the fault analysis result corresponding to the target device, so as to feed back the device analysis result to maintenance personnel.

[0063] The equipment analysis results reflect the overall situation of the equipment. When maintenance personnel see the equipment analysis results, they can directly or indirectly know which equipment or modules may need to be processed urgently and which equipment is operating normally based on the equipment analysis results.

[0064] Exemplarily, the temperature analysis results corresponding to each target module and the fault analysis results corresponding to the target device are directly combined and displayed in a table to obtain the device analysis results. Figure 2 As shown, the form records the temperature analysis results of each target module. Furthermore, the target module whose module temperature exceeds the preset module temperature is displayed in a special way, for example, marked in red or bold. Furthermore, the target module that has repeatedly appeared high temperature is marked in purple. When maintenance personnel see the target module marked in red or purple, they may need to go to the site to repair the equipment. At the same time, the form also records the module fault analysis results of the target module and the corresponding fault analysis results of the target device. Through this form, maintenance personnel can also understand the fault status of the equipment. For equipment that often fails, see whether it is necessary to replace the module or directly replace the new equipment.

[0065] The above-mentioned device data analysis method first obtains the device data sent by the target device, and the device data includes the module temperature and the number of module failures corresponding to each target module in the target device; then analyzes the module temperature corresponding to each target module to obtain the temperature analysis result corresponding to each target module; at the same time, analyzes the number of module failures corresponding to each target module to obtain the failure analysis result corresponding to the target device; finally, according to the temperature analysis result corresponding to each target module and the failure analysis result corresponding to the target device, obtains the device analysis result corresponding to the target device, so as to feed back the device analysis result to the maintenance personnel. It can be seen that through the above-mentioned method, since the device temperature and the number of device failures are analyzed, and the device analysis result is obtained based on this, the maintenance personnel can view the device analysis result in advance, so as to understand the situation of different devices distributed in various areas, and make maintenance preparations in advance for equipment that may be repaired to prevent the staff from failing to find the fault in time; or, for some equipment that often works at high temperature and has a high number of failures, prepare to replace equipment parts in advance to prevent the equipment from breaking down and being unable to be handled in time, affecting the operation of the enterprise and reducing the user's self-service experience; finally, since the relevant data of each module of the target device is analyzed, the final analysis result is more accurate.

[0066] In one embodiment, Figure 3 As shown, a device data analysis method is provided. In an embodiment of the present invention, the fault analysis result includes the remaining life of the target device, wherein the remaining life reflects how long the device can be used. For example, if the remaining life of a device is 100 days, it indicates that the device will no longer be usable after 100 days of continuous use and needs to be replaced with a new device. Specifically, step S300 includes:

[0067] Step S302: determine the target area where the target device is located, and obtain the average number of failures of each target module corresponding to the target area.

[0068] The target area is an area composed of multiple devices, and the area includes the target device.

[0069] Among them, the average number of failures of the target module reflects the failure status of the target module in the target area. Figure 4 As shown, a target area includes multiple target modules, and each target module corresponds to an average number of failures.

[0070] Exemplarily, a method for calculating the average number of failures of a target module is provided, comprising: obtaining the total number of the target modules in the target area; obtaining the total number of failures of the target modules in the target area; and obtaining the average number of failures of the target module according to the total number and the total number of failures. For example, the target module is a touch screen module, the total number of touch screen modules is 100, and the total number of failures of the touch screen modules is 120, so the average number of failures is 120 / 100=1.2.

[0071] The total number of target modules in the area is obtained by adding up the number of target modules of each device in the area: Where N is the total number of devices in the area, A i is the number of target modules in device i. For example, if there are 3 devices in the target area, the number of target modules P in device 1 is A1=1, the number of target modules P in device 2 is A2=1, and the number of target modules P in device 3 is A3=2. Therefore, the total number of target modules P in the target area is 1+1+2=4.

[0072] The total number of failures of a target module in each device in the region is obtained by accumulating the number of failures of the target module in the region: Where M is the total number of target modules in device i, A ij is the number of module failures of the jth target module in device i. For example, there are 2 devices in the target area, the number of target modules P in device 1 is 2, and A 11=1(number of module failures of the first target module P in device 1), A 12 =2 (number of module failures of the second target module P in device 1), the number of target modules P in device 2 A 21 =1, A 22 =2, A 23 =1, so the total number of failures of the target module P in the target area is: A 11 +A 12 +A 21 +A 22 +A 23 =7.

[0073] Step S304, obtaining the normal working time and current working time corresponding to the target device.

[0074] Among them, the normal working time reflects the time from the time the target device is put into use to the time it is stopped being used, and the normal working time can be accurate to the hour. It should be noted that stopping use means that the device is not only not used in the current area, but also not put into use in other areas. It can be understood as the scrapping of the equipment, or the need to return the equipment to the factory to disassemble the various modules of the equipment and reassemble the available modules into a new device.

[0075] The current working time reflects the time the target device has been in use from the time it was put into use to the current working time.

[0076] In one embodiment, a method for determining the normal working time is provided. It is understandable that the normal working time of the module determines the normal working time of the device to a certain extent. The aging of the module causes the device to be unable to be used normally, so the normal working time of the device is determined according to the normal working time of the module. Specifically, Figure 5 As shown, the step S304 of obtaining the normal working time and current working time corresponding to the target device includes:

[0077] Step S304A, obtaining the working time corresponding to each target module in the target device.

[0078] The working time corresponding to the target module is the time from when the target module is put into use to when it is stopped being used, which can be accurate to hours. It should be noted that stopping use means that the module is seriously aged and can no longer be used normally in various areas, and the module is scrapped.

[0079] Step S304B, obtaining the target working time with the shortest working time from the working time corresponding to each target module.

[0080] For example, there are three target modules in the target device 1, the working time of the target module A is 32100, the working time of the target module B is 32200, and the working time of the target module C is 32000, so the target working time is: 32000.

[0081] It is understandable that even for the same modules, their working hours are not exactly the same and may have certain differences. At the same time, considering that the longer the working time, the more serious the module aging will be, therefore, in order to ensure the normal use of the module, the target working time with the shortest working time is obtained from the working time corresponding to each target module, and the normal working time of the equipment is determined according to the obtained target working time.

[0082] Step S304C: determining the normal working time corresponding to the target device according to the target working time.

[0083] Exemplarily, the target working time is directly used as the normal working time corresponding to the target device, ensuring the maximum duration of the use of modules and devices, thereby saving costs.

[0084] For example, in order to ensure that the modules put into use are absolutely not scrapped, the target working time minus the preset time is obtained to obtain the normal working time corresponding to the target device. For example, the target working time is 32,500 hours, and the preset time is 500 hours, so the normal working time corresponding to the target device is 32,500-500=32,000.

[0085] Step S306, obtaining the remaining life of the target device according to the number of module failures and the average number of failures corresponding to each target module, the normal working time and the current working time corresponding to the target device.

[0086] In one embodiment, the impact of the failure of each target module on the remaining life of the device is comprehensively considered to calculate a more accurate remaining life. Figure 6 As shown, step S306 includes:

[0087] Step S306A, obtaining a module weight corresponding to each target module in the target device.

[0088] Among them, the module weight reflects the importance of the target module in the target device.

[0089] Exemplarily, the module weight is determined according to the proportion of the target module to all target modules in the target device. For example, if the total number of all target modules in the target device is 100, the number of a certain module A is 1, then the module weight corresponding to the module A is 0.01, and the number of a certain module B is 10, then the module weight corresponding to the module B is 0.1.

[0090] Exemplarily, the importance parameters corresponding to all target modules in the target device are obtained; the total importance parameters corresponding to the target device are obtained according to the importance parameters corresponding to all target modules in the target device; the module weight corresponding to the target module is determined according to the importance parameters corresponding to the target module and the total importance parameters. For example, there are 3 target modules in the target device, the importance parameter of target module 1 is 5, the importance parameter of target module 2 is 5, and the importance parameter of target module 3 is 20, so the module weight corresponding to target module 1 is determined to be 5 / (5+5+10)=0.25, the module weight corresponding to target module 2 is determined to be 5 / (5+5+10)=0.25, and the module weight corresponding to target module 3 is determined to be 10 / (5+5+10)=0.5.

[0091] Step S306B, obtaining the module failure rate corresponding to each target module according to the module failure times, the average failure times and the module weight corresponding to each target module.

[0092] The module failure rate reflects the failure status of the target module in the target device.

[0093] Module failure rate = (module failure times / average failure times) × module weight. For example, if the module failure times of target module A is 5 times, the average failure times is 6 times, and the module weight is 0.2, then the module failure rate corresponding to target module A is 0.1667.

[0094] Step S306C, obtaining the device failure rate corresponding to the target device according to the module failure rate corresponding to each target module.

[0095] Among them, the equipment failure rate reflects the failure status of the target equipment.

[0096] Where N is the total number of target modules in the target device, P i is the module failure rate corresponding to target module i. For example, there are 3 target modules in the target device, the module failure rate P1 corresponding to target module 1 is 0.05, the module failure rate P2 corresponding to target module 2 is 0.1, and the module failure rate P3 corresponding to target module 3 is 0.05. Therefore, the device failure rate is: (0.05+0.1+0.05) / 3=0.0667.

[0097] Step S306D, obtaining the remaining life of the target device according to the device failure rate corresponding to the target device, the normal working time and the current working time.

[0098] Remaining life = (1-equipment failure rate) × normal working time - current working time. For example, if the equipment failure rate is 0.05, the normal working time is 265,000 (hours), and the current working time is 5,000 (hours), then the remaining life = (1-0.05) × 265,000-5,000 = 246,750 (hours).

[0099] In one embodiment, the module failure rate corresponding to each target module is obtained based on the number of module failures and the average number of failures corresponding to each target module; the module failure rate with the largest value is selected from multiple module failure rates as the target module failure rate; the device failure rate is determined based on the target module failure rate; and the remaining life corresponding to the target device is obtained based on the device failure rate, the normal working time corresponding to the target device, and the current working time.

[0100] For example, the number of module failures corresponding to target modules A~D is 10, 8, 10, 8, and the average number of failures is 12 times. The module failure rates corresponding to target modules A~D are 0.833, 0.667, 0.833, and 0.667. The module failure rate with the largest value is 0.833. Therefore, the target module failure rate is 0.833. The target module failure rate is divided by the total number of target modules 4, and the equipment failure rate is 0.20825. Then, the normal working time, current working time and calculated equipment failure rate are substituted into: (1-equipment failure rate)×normal working time-current working time to obtain the remaining life of the equipment.

[0101] The above-mentioned equipment data analysis method establishes a correlation between the number of failures and the remaining life. Since the calculation of the remaining life of the equipment measures the number of failures in the entire area, different equipment obtains different remaining lives. Equipment with a large number of failures in the area has a shorter life, and equipment with a small number of failures has a relatively longer remaining life, which reflects the differentiation of the remaining life of the equipment.

[0102] In one embodiment, Figure 7 As shown, a device data analysis method is provided. In an embodiment of the present invention, the temperature analysis result includes a high temperature result, a medium-high temperature result and a normal result. The high temperature result indicates that the temperature of the target module is too high, and the target module is in a dangerous situation at this time; the medium-high temperature result indicates that the temperature of the target module is relatively high, and the target module is in a certain danger at this time; the normal result indicates that the temperature of the target module is within the normal temperature range, and the use of the target module is safe at this time. Specifically, step S200 includes:

[0103] Step S202, obtaining a normal temperature range corresponding to each target module.

[0104] The normal temperature range indicates the temperature range corresponding to the target module when it is working normally. For example, the normal temperature range of a target module in the target device is 20° to 35°. When the target module is short-circuited, the temperature of the target module may reach 50°, which is abnormal.

[0105] In one embodiment, since the increase of module temperature will accelerate the aging of the device, a correspondence between the module temperature and the normal working time range of the device is pre-established: normal distribution, so that the normal temperature range of the module temperature is determined according to the normal working time range of the device. Specifically, Figure 8 As shown, the step S202 of obtaining the normal temperature range corresponding to each target module includes:

[0106] Step S202A, obtaining the expected temperature and standard deviation temperature corresponding to each target module in the target device.

[0107] The corresponding working hours of different modules at different module temperatures are counted in advance. Assuming that the corresponding relationship between the module temperature and the working time is normally distributed, the normal distribution function corresponding to a certain module can be calculated based on the corresponding relationship between different module temperatures and the working time of the module obtained by statistics. The normal distribution function records the expected temperature and standard deviation temperature corresponding to the module.

[0108] Step S202B, obtaining the normal working time range corresponding to the target device.

[0109] The normal working time range reflects the shortest and longest time that the target device has been in use since it was put into use and stopped being used. The normal working time range can be accurate to hours. For example, the normal working time range is 110000 (hours) to 105000 (hours). The normal working time range can be obtained by counting the normal working time of multiple identical devices.

[0110] Step S202C, obtaining a normal temperature range corresponding to each target module in the target device according to the expected temperature, standard deviation temperature and normal working time range corresponding to each target module.

[0111] Assume that the normal distribution function corresponding to a certain target module is: Among them, μ is the expected temperature, σ is the standard deviation temperature, f(x) is the normal working time, and x is the normal temperature. Therefore, according to the expected temperature, standard deviation temperature and normal working time range corresponding to the target module, the normal temperature range corresponding to each target module is obtained. For example, the expected temperature of a target module is 48.7°, and the standard deviation temperature is 22.8°. Substituting the normal working time range of the target device into the above formula, the normal temperature range of the target module can be obtained as 25.9°~71.5°.

[0112] Step S204: If the module temperature corresponding to the target module and the normal temperature range meet the first preset condition, the temperature analysis result of the target module is a high temperature result.

[0113] Among them, the first preset condition is a pre-set high temperature judgment condition. For example, the first preset condition is that the module temperature exceeds 120% of the normal temperature range. For example, the module temperature is 50°, the normal temperature range is 20°~35°, and 120% of the normal temperature range is 24°~42°. Obviously, the module temperature of 50° exceeds 24°~42°. In this case, the temperature analysis result of the target module is a high temperature result.

[0114] Step S206: If the module temperature corresponding to the target module and the normal temperature range meet the second preset condition, the temperature analysis result corresponding to the target module is a medium-high temperature result.

[0115] Among them, the second preset condition is a pre-set medium-high temperature judgment condition. For example, the second preset condition is that the module temperature is within 100% to 120% of the normal temperature range. For example, the module temperature is 38°, the normal temperature range is 20° to 35°, and 100% to 120% of the normal temperature range is 20° to 42°. Obviously, the module temperature of 38° is within the range of 20° to 42°. At this time, the temperature analysis result of the target module is a medium-high temperature result.

[0116] Step S208: If the module temperature corresponding to the target module and the normal temperature range meet the third preset condition, the temperature analysis result corresponding to the target module is a normal result.

[0117] Among them, the third preset condition is a pre-set normal temperature judgment condition. For example, the third preset condition is that the module temperature is within the normal temperature range. For example, the module temperature is 32°, and the normal temperature range is 20° to 35°. Obviously, the module temperature of 32° is within 20° to 35°. At this time, the temperature analysis result of the target module is a normal result.

[0118] The above-mentioned equipment data analysis method determines whether the module temperature is within the normal operating range, thereby determining whether each module is at a high temperature. For modules that are often at a high temperature, maintenance personnel are arranged to go to the site to thoroughly investigate the cause of the high temperature.

[0119] In one embodiment, Fig. 9As shown, a device data analysis method is provided. In an embodiment of the present invention, the device analysis results include immediate processing results, queued processing results, and non-processing results; wherein, the immediate processing result indicates that the device is in an urgent situation and needs to be notified immediately to the maintenance personnel for processing, for example, a new module needs to be replaced immediately, or a new device needs to be replaced immediately; the queued processing result indicates that the device needs to be processed, but the situation is not very urgent, for example, a module in the device is often at a medium or high temperature, but the module is not the core module of the device, and has a relatively small impact on the normal operation of the device; the non-processing result indicates that the device is operating normally and does not require any maintenance processing, and only needs to continue to pay attention to the status of the device. Specifically, step S400 includes:

[0120] Step S402, obtaining the historical temperature analysis results corresponding to each target module.

[0121] Among them, the historical temperature analysis results are the temperature analysis results obtained historically. The server will store the temperature analysis results, fault analysis results and device analysis results sent by the device at different times.

[0122] By analyzing the temperature conditions of the modules in the device in combination with the historical temperature analysis results, it can be understood that if a module is at a high temperature for a long time, its corresponding temperature score will be higher, and the obtained device analysis result will be more urgent.

[0123] Step S404, obtaining a temperature score according to the temperature analysis result corresponding to each target module and the historical temperature analysis result.

[0124] If the temperature analysis result corresponding to the target module is a high temperature result or a medium-high temperature result, the number of high temperature results and / or medium-high temperature results in the historical temperature analysis results of the target module is counted, and the temperature score is determined according to the number of high temperature results and / or medium-high temperature results; if the temperature analysis result corresponding to the target module is a normal result, the temperature score is determined according to the module temperature corresponding to the target module.

[0125] For example, in the case where the temperature analysis result is a high temperature result or a medium-high temperature result, if the number of high temperature results exceeds A and the number of medium-high temperature results exceeds B, the temperature score can be set to 100; if the number of high temperature results exceeds A and the number of medium-high temperature results is between C and B, the temperature score can be set to 95; if the number of high temperature results is between D and A and the number of medium-high temperature results exceeds B, the temperature score can be set to 90; if the number of high temperature results is between D and A and the number of medium-high temperature results is between C and B, the temperature score can be set to 85; if the number of high temperature results is less than D and the number of medium-high temperature results is greater than C, the temperature score can be set to 80; if the number of high temperature results is less than D and the number of medium-high temperature results is less than C, the temperature score can be set to 75. If the temperature analysis result is a normal result, the temperature score is determined according to the specific module temperature of the module, and the determined temperature score is less than 75 at this time.

[0126] Step S406: Obtain a fault score according to the fault analysis result.

[0127] If the fault analysis result reflects that the target module has a large number of faults (for example, the number of faults exceeds the first preset number of faults), the fault score is set to a higher value (for example, set between 80 and 100 points); if the fault analysis result reflects that the target module has a relatively large number of faults (for example, the number of faults is between the second preset number of faults and the first preset number of faults), the fault score is set to a medium-high value (for example, set between 70 and 80 points); if the fault analysis result reflects that the target module has a relatively small number of faults (for example, the number of faults is less than the second preset number of faults), the fault score is set to a relatively low value (for example, set below 70 points).

[0128] Step S408: Obtain a device score corresponding to the target device according to the fault score and the temperature score corresponding to each target module.

[0129] According to the temperature score corresponding to each target module, the device temperature score corresponding to the target device is obtained; the device score is determined according to the device temperature score and the fault score. For example, the temperature scores of each target module are added together to obtain an average, and the obtained average value is used as the device temperature score.

[0130] Obtain a first weight coefficient corresponding to the device temperature score and a second weight coefficient corresponding to the fault score; determine the device score corresponding to the target device according to the device temperature score, the first weight coefficient, the fault score and the second weight coefficient.

[0131] For example, the device temperature score is 90, the first weight coefficient is 0.6, the fault score is 80, and the second weight coefficient is 0.4. Therefore, the device score is: 90×0.6+80×0.4=86.

[0132] Step S410: determining a device analysis result corresponding to the target device according to the device score.

[0133] The device analysis result is determined based on the score range of the device score. For example, if the device score is in the score range (80, 100], the device analysis result is determined to be an immediate processing result; if the device score is in the score range (60, 80], the device analysis result is determined to be a queue processing result; if the device score is in the score range [0, 60], the device analysis result is determined to be a non-processing result.

[0134] The above equipment data analysis method takes into account the historical temperature analysis results. For equipment that is often at high temperatures, there may be some undiscovered faults that need to be handled immediately by maintenance personnel to avoid accidents. At the same time, the above method also obtains temperature scores and fault scores. Maintenance personnel can determine the specific possible problems of the equipment based on the fault score and the temperature score of the module to a certain extent, and thus determine the maintenance plan.

[0135] An application example is provided below to better illustrate the device data analysis method described in the embodiment of the present invention. Fig.10 The fault count table, current duration table and weighted duration table are displayed. The fault count table records the fault counts of 10 modules of 20 devices in a target area and the average fault counts of the 10 modules; the current duration table records the current working hours of the 20 devices; the weighted duration table records the module weights and working hours of the 10 modules (assuming that the 20 devices are all of the same model, the same modules in the 20 devices have the same working hours).

[0136] Device 1:

[0137] F1=(0.0556+0.1098+0.2094+0.1217+0.0582+0.0272+0.0442+0.1660+0.0523+0.1480) / 10=0.09924; where F1 is the equipment failure rate corresponding to equipment 1.

[0138] S1 = (1-0.09924) × 265000-31387 = 207314.4 hours; S1 is the remaining life corresponding to device 1.

[0139] Device 2:

[0140] F2=(0.0523+0.1037+0.1097+0.1449+0.0615+0.0286+0.0410+0.1358+0.0439+0.1351) / 10=0.08565; wherein F2 is the equipment failure rate corresponding to equipment 2.

[0141] S2 = (1-0.08565) × 265000-31387 = 210915.75 hours; S2 is the remaining life of device 2

[0142] Device 3:

[0143] F3=(0.0621+0.1342+0.2293+0.1507+0.0648+0.0300+0.0663+0.1283+0.0230+0.1609) / 10=0.10496; wherein F3 is the equipment failure rate corresponding to equipment 3.

[0144] S3 = (1-0.10496) × 265000-31387 = 205798.5 hours; S3 is the remaining life corresponding to device 3.

[0145] like Fig.11 As shown, a device data analysis apparatus 1100 is provided, which specifically includes:

[0146] A first acquisition module 1102 is used to acquire device data sent by a target device, wherein the device data includes a module temperature and a module failure count corresponding to each target module in the target device;

[0147] The temperature analysis module 1104 is used to analyze the module temperature corresponding to each target module to obtain the temperature analysis result corresponding to each target module;

[0148] The fault analysis module 1106 is used to analyze the number of module faults corresponding to each target module to obtain a fault analysis result corresponding to the target device;

[0149] The analysis result module 1108 is used to obtain the device analysis result corresponding to the target device according to the temperature analysis result corresponding to each target module and the fault analysis result corresponding to the target device, so as to feed back the device analysis result to the maintenance personnel.

[0150] The above-mentioned device data analysis device first obtains the device data sent by the target device, and the device data includes the module temperature and the number of module failures corresponding to each target module in the target device; then analyzes the module temperature corresponding to each target module to obtain the temperature analysis result corresponding to each target module; at the same time, analyzes the number of module failures corresponding to each target module to obtain the failure analysis result corresponding to the target device; finally, according to the temperature analysis result corresponding to each target module and the failure analysis result corresponding to the target device, obtains the device analysis result corresponding to the target device, so as to feed back the device analysis result to the maintenance personnel. It can be seen that through the above-mentioned device, since the device temperature and the number of device failures are analyzed, and the device analysis result is obtained based on this, the maintenance personnel can view the device analysis result in advance, so as to understand the situation of different devices distributed in various areas, and make maintenance preparations in advance for equipment that may be repaired to prevent the staff from failing to find the fault in time; or, for some equipment that often works at high temperature and has a high number of failures, prepare to replace equipment parts in advance to prevent the equipment from breaking down and being unable to be handled in time, affecting the operation of the enterprise and reducing the user's self-service experience; finally, since the relevant data of each module of the target device is analyzed, the final analysis result is more accurate.

[0151] In one embodiment, the fault analysis result includes the remaining life corresponding to the target device; the fault analysis module 1106 includes: an average failure module, used to determine the target area where the target device is located, and obtain the average number of failures of each target module corresponding to the target area; a duration acquisition module, used to obtain the normal working time and current working time corresponding to the target device; a remaining life module, used to obtain the remaining life corresponding to the target device according to the number of module failures corresponding to each target module, the average number of failures, the normal working time and the current working time corresponding to the target device.

[0152] In one embodiment, the duration acquisition module includes: a module duration acquisition module, used to obtain the working duration corresponding to each target module in the target device; a shortest duration module, used to obtain the target working duration with the shortest working duration from the working duration corresponding to each target module; and a normal duration determination module, used to determine the normal working duration corresponding to the target device based on the target working duration.

[0153] In one embodiment, the remaining life module includes: a weight acquisition module, used to obtain the module weight corresponding to each target module in the target device; a first failure rate module, used to obtain the module failure rate corresponding to each target module according to the number of module failures corresponding to each target module, the average number of failures and the module weight; a second failure rate module, used to obtain the device failure rate corresponding to the target device according to the module failure rate corresponding to each target module; and a life calculation module, used to obtain the remaining life of the target device according to the device failure rate corresponding to the target device, the normal working time and the current working time.

[0154] In one embodiment, the temperature analysis results include high temperature results, medium-high temperature results and normal results; the temperature analysis module 1104 includes: a normal temperature range module, used to obtain the normal temperature range corresponding to each target module; a first preset module, used to if the module temperature and normal temperature range corresponding to the target module meet the first preset condition, the temperature analysis result of the target module is a high temperature result; a second preset module, used to if the module temperature and normal temperature range corresponding to the target module meet the second preset condition, the temperature analysis result corresponding to the target module is a medium-high temperature result; a third preset module, used to if the module temperature and normal temperature range corresponding to the target module meet the third preset condition, the temperature analysis result corresponding to the target module is a normal result.

[0155] In one embodiment, the normal temperature range module includes: a normal module, used to obtain the expected temperature and standard deviation temperature corresponding to each target module in the target device; a range module, used to obtain the normal working time range corresponding to the target device; and a range calculation module, used to obtain the normal temperature range corresponding to each target module in the target device according to the expected temperature, standard deviation temperature and normal working time range corresponding to each target module in the target device.

[0156] In one embodiment, the device analysis results include immediate processing results, queued processing results and processing-free results; the analysis result module 1108 includes: a historical temperature acquisition module, used to obtain the historical temperature analysis results corresponding to each target module; a temperature score module, used to obtain the temperature score according to the temperature analysis results corresponding to each target module and the historical temperature analysis results; a fault score module, used to obtain the fault score according to the fault analysis results; a comprehensive score module, used to obtain the device score corresponding to the target device according to the fault score and the temperature score corresponding to each target module; a score analysis module, used to determine the device analysis result corresponding to the target device according to the device score.

[0157] Fig.12FIG. 1 shows an internal structure diagram of a computer device in an embodiment. The computer device may specifically be a terminal or a server. Fig.12 As shown, the computer device includes a processor, a memory and a network interface connected via a system bus. The memory includes a non-volatile storage medium and an internal memory. The non-volatile storage medium of the computer device stores an operating system and may also store a computer program. When the computer program is executed by the processor, the processor may implement the device data analysis method. The internal memory may also store a computer program. When the computer program is executed by the processor, the processor may implement the device data analysis method. Those skilled in the art will understand that Fig.12 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0158] In one embodiment, the device data analysis method provided by the present application can be implemented in the form of a computer program. The computer program can be Fig.12 The computer device shown in the figure is run. The memory of the computer device can store various program templates constituting the device data analysis device, such as the first acquisition module 1102, the temperature analysis module 1104 and the fault analysis module 1106.

[0159] A computer device comprises a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor executes the following steps:

[0160] Acquire device data sent by the target device, wherein the device data includes a module temperature and a number of module failures corresponding to each target module in the target device;

[0161] Analyze the module temperature corresponding to each target module to obtain the temperature analysis result corresponding to each target module;

[0162] Analyze the number of module failures corresponding to each target module to obtain a failure analysis result corresponding to the target device;

[0163] According to the temperature analysis result corresponding to each target module and the fault analysis result corresponding to the target device, the device analysis result corresponding to the target device is obtained, so as to feed back the device analysis result to the maintenance personnel.

[0164] In one embodiment, the fault analysis result includes the remaining life corresponding to the target device; the number of module failures corresponding to each target module is analyzed to obtain the fault analysis result corresponding to the target device, including: determining the target area where the target device is located, and obtaining the average number of failures of each target module corresponding to the target area; obtaining the normal working time and current working time corresponding to the target device; and obtaining the remaining life corresponding to the target device based on the number of module failures corresponding to each target module, the average number of failures, the normal working time and the current working time corresponding to the target device.

[0165] In one embodiment, obtaining the normal working time and current working time corresponding to the target device includes: obtaining the working time corresponding to each target module in the target device; obtaining the target working time with the shortest working time from the working time corresponding to each target module; and determining the normal working time corresponding to the target device according to the target working time.

[0166] In one embodiment, the remaining life of the target device is obtained according to the number of module failures corresponding to each target module, the average number of failures, the normal working time and the current working time of the target device, including: obtaining the module weight corresponding to each target module in the target device; obtaining the module failure rate corresponding to each target module according to the number of module failures corresponding to each target module, the average number of failures and the module weight; obtaining the device failure rate corresponding to the target device according to the module failure rate corresponding to each target module; obtaining the remaining life of the target device according to the device failure rate corresponding to the target device, the normal working time and the current working time.

[0167] In one embodiment, the temperature analysis result includes a high temperature result, a medium-high temperature result and a normal result; the module temperature corresponding to each target module is analyzed to obtain the temperature analysis result corresponding to each target module, including: obtaining the normal temperature range corresponding to each target module; if the module temperature and the normal temperature range corresponding to the target module meet a first preset condition, the temperature analysis result of the target module is a high temperature result; if the module temperature and the normal temperature range corresponding to the target module meet a second preset condition, the temperature analysis result corresponding to the target module is a medium-high temperature result; if the module temperature and the normal temperature range corresponding to the target module meet a third preset condition, the temperature analysis result corresponding to the target module is a normal result.

[0168] In one embodiment, obtaining the normal temperature range corresponding to each target module includes: obtaining the expected temperature and standard deviation temperature corresponding to each target module in the target device; obtaining the normal working time range corresponding to the target device; and obtaining the normal temperature range corresponding to each target module according to the expected temperature, standard deviation temperature and normal working time range corresponding to each target module in the target device.

[0169] In one embodiment, the device analysis results include immediate processing results, queued processing results and processing-free results; the device analysis results corresponding to the target device are obtained based on the temperature analysis results corresponding to each target module and the fault analysis results corresponding to the target device, including: obtaining the historical temperature analysis results corresponding to each target module; obtaining a temperature score based on the temperature analysis results corresponding to each target module and the historical temperature analysis results; obtaining a fault score based on the fault analysis results; obtaining a device score corresponding to the target device based on the fault score and the temperature score corresponding to each target module; and determining the device analysis result corresponding to the target device based on the device score.

[0170] In one embodiment, a computer-readable storage medium is provided, storing a computer program, wherein when the computer program is executed by a processor, the processor performs the following steps:

[0171] Acquire device data sent by the target device, wherein the device data includes a module temperature and a number of module failures corresponding to each target module in the target device;

[0172] Analyze the module temperature corresponding to each target module to obtain the temperature analysis result corresponding to each target module;

[0173] Analyze the number of module failures corresponding to each target module to obtain a failure analysis result corresponding to the target device;

[0174] According to the temperature analysis result corresponding to each target module and the fault analysis result corresponding to the target device, the device analysis result corresponding to the target device is obtained, so as to feed back the device analysis result to the maintenance personnel.

[0175] In one embodiment, the fault analysis result includes the remaining life corresponding to the target device; the number of module failures corresponding to each target module is analyzed to obtain the fault analysis result corresponding to the target device, including: determining the target area where the target device is located, and obtaining the average number of failures of each target module corresponding to the target area; obtaining the normal working time and current working time corresponding to the target device; and obtaining the remaining life corresponding to the target device based on the number of module failures corresponding to each target module, the average number of failures, the normal working time and the current working time corresponding to the target device.

[0176] In one embodiment, obtaining the normal working time and current working time corresponding to the target device includes: obtaining the working time corresponding to each target module in the target device; obtaining the target working time with the shortest working time from the working time corresponding to each target module; and determining the normal working time corresponding to the target device according to the target working time.

[0177] In one embodiment, the remaining life of the target device is obtained according to the number of module failures corresponding to each target module, the average number of failures, the normal working time and the current working time of the target device, including: obtaining the module weight corresponding to each target module in the target device; obtaining the module failure rate corresponding to each target module according to the number of module failures corresponding to each target module, the average number of failures and the module weight; obtaining the device failure rate corresponding to the target device according to the module failure rate corresponding to each target module; obtaining the remaining life of the target device according to the device failure rate corresponding to the target device, the normal working time and the current working time.

[0178] In one embodiment, the temperature analysis result includes a high temperature result, a medium-high temperature result and a normal result; the module temperature corresponding to each target module is analyzed to obtain the temperature analysis result corresponding to each target module, including: obtaining the normal temperature range corresponding to each target module; if the module temperature and the normal temperature range corresponding to the target module meet a first preset condition, the temperature analysis result of the target module is a high temperature result; if the module temperature and the normal temperature range corresponding to the target module meet a second preset condition, the temperature analysis result corresponding to the target module is a medium-high temperature result; if the module temperature and the normal temperature range corresponding to the target module meet a third preset condition, the temperature analysis result corresponding to the target module is a normal result.

[0179] In one embodiment, obtaining the normal temperature range corresponding to each target module includes: obtaining the expected temperature and standard deviation temperature corresponding to each target module in the target device; obtaining the normal working time range corresponding to the target device; and obtaining the normal temperature range corresponding to each target module according to the expected temperature, standard deviation temperature and normal working time range corresponding to each target module in the target device.

[0180] In one embodiment, the device analysis results include immediate processing results, queued processing results and processing-free results; the device analysis results corresponding to the target device are obtained based on the temperature analysis results corresponding to each target module and the fault analysis results corresponding to the target device, including: obtaining the historical temperature analysis results corresponding to each target module; obtaining a temperature score based on the temperature analysis results corresponding to each target module and the historical temperature analysis results; obtaining a fault score based on the fault analysis results; obtaining a device score corresponding to the target device based on the fault score and the temperature score corresponding to each target module; and determining the device analysis result corresponding to the target device based on the device score.

[0181] It should be noted that the above-mentioned device data analysis method, device data analysis device, computer equipment and computer-readable storage medium belong to a general inventive concept, and the contents in the embodiments of the device data analysis method, device data analysis device, computer equipment and computer-readable storage medium are applicable to each other.

[0182] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the program can be stored in a non-volatile computer-readable storage medium. When the program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).

[0183] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0184] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A device data analysis method, characterized in that: include: Acquire device data sent by the target device, wherein the device data includes a module temperature and a number of module failures corresponding to each target module in the target device; Analyze the module temperature corresponding to each target module to obtain the temperature analysis result corresponding to each target module; Analyze the number of module failures corresponding to each target module to obtain a failure analysis result corresponding to the target device; According to the temperature analysis result corresponding to each target module and the fault analysis result corresponding to the target device, a device analysis result corresponding to the target device is obtained, so as to feed back the device analysis result to the maintenance personnel; The fault analysis result includes the remaining life corresponding to the target device; The analyzing the number of module failures corresponding to each target module to obtain a failure analysis result corresponding to the target device includes: Determine a target area where the target device is located, and obtain an average number of failures of each target module corresponding to the target area; Obtaining the normal working time and current working time corresponding to the target device; Obtaining the remaining life of the target device according to the number of module failures, the average number of failures, the normal working time and the current working time corresponding to each target module; The obtaining of the normal working time and the current working time corresponding to the target device includes: Obtaining the working time corresponding to each target module in the target device; Obtaining the target working time with the shortest working time from the working time corresponding to each target module; Determine the normal working time corresponding to the target device according to the target working time; The obtaining of the remaining life of the target device according to the number of module failures, the average number of failures, the normal working time and the current working time corresponding to each target module comprises: Obtaining a module weight corresponding to each target module in the target device; According to the number of module failures corresponding to each target module, the average number of failures and the module weight, the module failure rate corresponding to each target module is obtained; Obtaining a device failure rate corresponding to the target device according to a module failure rate corresponding to each target module; The remaining life of the target device is obtained according to the device failure rate corresponding to the target device, the normal working time and the current working time.

2. The method according to claim 1, characterized in that The temperature analysis results include high temperature results, medium and high temperature results and normal results; The module temperature corresponding to each target module is analyzed to obtain a temperature analysis result corresponding to each target module, including: Get the normal temperature range corresponding to each target module; If the module temperature corresponding to the target module and the normal temperature range meet the first preset condition, the temperature analysis result of the target module is a high temperature result; If the module temperature corresponding to the target module and the normal temperature range meet the second preset condition, the temperature analysis result corresponding to the target module is a medium-high temperature result; If the module temperature corresponding to the target module and the normal temperature range meet the third preset condition, the temperature analysis result corresponding to the target module is a normal result.

3. The method according to claim 2, characterized in that The obtaining of the normal temperature range corresponding to each target module includes: Obtaining the expected temperature and standard deviation temperature corresponding to each target module in the target device; Obtaining a normal working time range corresponding to the target device; According to the expected temperature, standard deviation temperature and normal working time range corresponding to each target module in the target device, the normal temperature range corresponding to each target module is obtained.

4. The method according to any one of claims 1 to 3, characterized in that The equipment analysis results include immediate processing results, queue processing results and processing-free results; The obtaining of the device analysis result corresponding to the target device according to the temperature analysis result corresponding to each target module and the fault analysis result corresponding to the target device includes: Obtain the historical temperature analysis results corresponding to each target module; According to the temperature analysis results corresponding to each target module and the historical temperature analysis results, a temperature score is obtained; Obtaining a fault score according to the fault analysis result; Obtaining a device score corresponding to the target device according to the fault score and the temperature score corresponding to each target module; A device analysis result corresponding to the target device is determined according to the device score.

5. A device data analysis device, characterized in that: include: A first acquisition module is used to acquire device data sent by a target device, wherein the device data includes a module temperature and a module failure count corresponding to each target module in the target device; The temperature analysis module is used to analyze the module temperature corresponding to each target module and obtain the temperature analysis result corresponding to each target module; A fault analysis module is used to analyze the number of module faults corresponding to each target module to obtain a fault analysis result corresponding to the target device; An analysis result module, used to obtain a device analysis result corresponding to the target device according to the temperature analysis result corresponding to each target module and the fault analysis result corresponding to the target device, so as to feed back the device analysis result to the maintenance personnel; The fault analysis result includes the remaining life corresponding to the target device; The fault analysis module is further used to determine the target area where the target device is located, and obtain the average number of faults of each target module corresponding to the target area; Obtaining the normal working time and current working time corresponding to the target device; Obtaining the remaining life of the target device according to the number of module failures, the average number of failures, the normal working time and the current working time corresponding to each target module; The fault analysis module is further used to obtain the corresponding working time of each target module in the target device; Obtaining the target working time with the shortest working time from the working time corresponding to each target module; Determine the normal working time corresponding to the target device according to the target working time; The fault analysis module is further used to obtain a module weight corresponding to each target module in the target device; According to the number of module failures corresponding to each target module, the average number of failures and the module weight, the module failure rate corresponding to each target module is obtained; Obtaining a device failure rate corresponding to the target device according to a module failure rate corresponding to each target module; The remaining life of the target device is obtained according to the device failure rate corresponding to the target device, the normal working time and the current working time.

6. A computer device, characterized in that: The method comprises a memory, a processor and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the device data analysis method as claimed in any one of claims 1 to 4 when executing the computer program.

7. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, wherein the computer program, when executed by a processor, implements the steps of the device data analysis method according to any one of claims 1 to 4.

Images