Processing device for LED packaging and LED packaging process

Abstract

The present invention provides a processing device for LED packaging and an LED packaging process, comprising a frame, a wire welding mechanism and a glue dispensing mechanism, wherein the wire welding mechanism and the glue dispensing mechanism are both arranged on the frame, the wire welding mechanism is used to weld LEDs and form welding points, and the glue dispensing mechanism is used to dispense glue on the welding points. The processing device has low cost, short circuit exposure time to air, high LED packaging quality, and high product qualification rate. The LED packaging process includes dispensing glue on LEDs that have completed wire welding on the same device.

Description

Technical Field

[0001] The invention relates to the technical field of LED processing, and in particular to a processing device for LED packaging and an LED packaging process. Background Art

[0002] In the LED packaging process, the glue dispensing process (including silver paste, phosphor and primer, etc.) is required after the wire bonding process. Because the wire bonding process requires minimal vibration interference, and the glue dispensing process has large vibration, a special positioning mechanism needs to be configured. Therefore, the wire bonding machine for the wire bonding process and the glue dispensing machine for the glue dispensing process are usually separated and operated separately.

[0003] Research has found that the existing processing systems for LED packaging have the following disadvantages:

[0004] First, the existing workpiece completes "one welding 010 + arc drawing + two welding 020" (the welding process can be simplified as: the bonding process of the first welding point, referred to as one welding 010; the welding line forming process, referred to as arc drawing; the bonding process of the second welding point 020, referred to as two welding. The connecting wire formed by "one welding + arc drawing + two welding" is called "wire arc 130". Please refer to the attached Figure 7 )The formed wire arc is exposed to the air for a long time and is easily oxidized and contaminated, thus reducing the qualified rate of the product;

[0005] Second, the glue dispenser that works alone dispenses glue at the second welding position to increase the bonding force between the solder joint and the bracket. The glue dispenser cannot accurately measure the position (XYZ direction) of each glue dispensing surface of the LED bracket in real time. In the long run, this will cause the glue dispensing position of the glue dispensing head to deviate too much, and regular correction is required. Otherwise, it will not only reduce the bonding force between the solder joint and the bracket, but also increase the risk of the glue dispensing head being crooked or even damaging the arc.

[0006] Third, the traditional dispensing machine uses a multi-head and multi-cup dispensing head method, which cannot measure the positions of multiple lamp cups to be dispensed in real time. It can only use the pre-set average position of each lamp cup as the dispensing position. This will affect the dispensing consistency due to the actual position error. At the same time, the multi-head and multi-cup dispensing method makes the moving mass heavy and will produce a lot of vibration shock. Summary of the invention

[0007] The object of the present invention is to provide a processing device for LED packaging and an LED packaging process, which can shorten the time that the arc is exposed to the air and improve the qualified rate of the product.

[0008] The embodiment of the present invention is achieved as follows:

[0009] An embodiment of the present invention provides a processing device for LED packaging, comprising:

[0010] A frame, a wire welding mechanism and a glue dispensing mechanism, wherein the wire welding mechanism and the glue dispensing mechanism are both arranged on the frame, the wire welding mechanism is used to weld the LED and form welding points, and the glue dispensing mechanism is used to dispense glue on the welding points;

[0011] Or the processing device includes: a frame, a wire welding mechanism and a glue spraying mechanism, the wire welding mechanism and the glue spraying mechanism are both arranged on the frame, the wire welding mechanism is used to weld the LED and form welding points, and the glue spraying mechanism is used to spray glue on the welding points.

[0012] In an optional embodiment, the wire welding mechanism includes a porcelain nozzle and a first driving assembly, the first driving assembly is connected to the frame, and the first driving assembly is used to drive the porcelain nozzle to move so that the porcelain nozzle contacts the LED and welds the LED.

[0013] In an optional embodiment, the first driving assembly includes a first three-dimensional mobile platform, the porcelain nozzle is connected to the first three-dimensional mobile platform, and the first three-dimensional mobile platform is connected to the frame.

[0014] In an optional embodiment, the dispensing mechanism includes a dispensing head and a second driving component, the second driving component is connected to the frame, the dispensing head is connected to the second driving component, and the second driving component is used to drive the dispensing head to move so that the dispensing head is close to the welding point.

[0015] In an optional embodiment, the dispensing head includes an outer tube, a fixing part and a needle tube, the fixing part is inserted in the outer tube, the needle tube is inserted in the fixing part, and the end of the needle tube away from the outer tube extends out of the fixing part; the fixing part has a ventilation cavity, and one end of the ventilation cavity is set as an air inlet; the outer wall of the fixing part and the inner wall of the outer tube form an air storage cavity, and a connecting hole is provided on the fixing part, and the ventilation cavity is connected with the air storage cavity; a first air outlet is provided on the side of the air storage cavity away from the air inlet; the needle tube is connected with the connecting hole through the ventilation cavity, and the end of the needle tube away from the connecting hole is set as a second air outlet.

[0016] In an optional embodiment, the second driving assembly includes a second three-dimensional mobile platform, the second three-dimensional mobile platform is connected to the frame, the dispensing head is connected to the second three-dimensional mobile platform, and the second three-dimensional mobile platform is used to drive the dispensing head to move.

[0017] In an optional embodiment, the second three-dimensional mobile platform includes a first linear telescopic structure, a second linear telescopic structure and a four-bar linkage structure, the second linear telescopic structure is connected to the first linear telescopic structure, the four-bar linkage structure is connected to the second linear telescopic structure, and the dispensing head is connected to the four-bar linkage structure; wherein the first linear telescopic structure is telescopic along a first direction, the second linear telescopic structure is telescopic along a second direction perpendicular to the first direction, and the four-bar linkage structure is used to drive the dispensing head to move in a third direction, and the third direction has an angle with the plane determined by the first direction and the second direction.

[0018] In an optional embodiment, the glue dispensing mechanism further includes a glue storage member, which is connected to the second driving assembly, and the glue dispensing head is used to collect glue liquid from the glue storage member.

[0019] In an optional embodiment, the glue dispensing mechanism also includes a smoothing member and a driving member, the driving member is connected to the second driving component, and the driving member is connected to the glue storage member, and is used to drive the glue storage member to rotate; the smoothing member is connected to the second driving component, and the smoothing member is used to stir the glue liquid in the glue storage member when the glue storage member rotates.

[0020] This embodiment also provides an LED packaging process, which includes dispensing glue on the LED with completed wire bonding on the same device.

[0021] Optionally, in the step of dispensing glue on the LED that has completed wire bonding on the same device, the same control system is used to control the wire bonding mechanism used for wire bonding and the glue dispensing mechanism used for glue dispensing.

[0022] Optionally, the step of dispensing glue on the LED with completed wire bonding on the same device includes driving the porcelain nozzle of the wire bonding mechanism to move to the position where the wire is to be bonded and bonding the LED bracket; after the wire bonding is completed, the porcelain nozzle returns to its position; then, driving the LED bracket to move so that the wire bonding position where the wire bonding has been completed moves to the glue dispensing mechanism, and using the glue dispensing head of the glue dispensing mechanism to dispense glue on the wire bonding position.

[0023] Optionally, the step of using the dispensing head of the dispensing mechanism to dispense glue at the welding line position includes using the driving mechanism to drive the dispensing head that has completed the glue dispensing to approach the welding line position, using the dispensing head to dispense glue at the welding line position by blowing air inside and outside, and returning the dispensing head after the dispensing is completed.

[0024] The beneficial effects of the embodiments of the present invention are:

[0025] In summary, the present embodiment provides a processing device for LED packaging, including a frame and a wire bonding mechanism and a glue dispensing mechanism simultaneously arranged on the frame, the wire bonding mechanism and the glue dispensing mechanism are integrated into one device, after the wire bonding mechanism performs wire bonding operation on the LED, the glue dispensing mechanism can be directly used to perform glue dispensing operation on the LED that has completed the wire bonding operation, thereby omitting the step of transferring the LED to a glue dispensing machine independently arranged from the wire bonding machine for glue dispensing operation after the LED wire bonding operation is completed, reducing the cost generated in the LED transfer link, and avoiding the situation where the wire bonding wire on the LED is damaged during the LED transfer link, so as not to affect the subsequent glue dispensing process, thereby improving the product qualification rate. At the same time, the wire bonding mechanism and the glue dispensing mechanism are integrated into one, and after the LED completes the wire bonding operation, the LED can be glued in time through the glue dispensing mechanism, the LED wire arc is exposed to the air for a short time, and the wire arc is not easily oxidized and contaminated, which can also improve the product qualification rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0027] Figure 1 It is a structural schematic diagram of a processing device for LED packaging according to an embodiment of the present invention;

[0028] Figure 2 for Figure 1 Schematic diagram of the local enlarged structure in;

[0029] Figure 3 A schematic diagram of a partial structure of a dispensing mechanism according to an embodiment of the present invention;

[0030] Figure 4 It is a schematic structural diagram of a glue storage member and a smoothing member according to an embodiment of the present invention;

[0031] Figure 5 A schematic structural diagram of a dispensing head according to an embodiment of the present invention;

[0032] Figure 6 is a schematic cross-sectional structural diagram of a dispensing head according to an embodiment of the present invention;

[0033] Figure 7 This is a schematic diagram of the LED wire bonding assembly.

[0034] icon:

[0035] 010-first welding; 020-second welding; 030-wire arc; 001-LED bracket; 100-wire welding mechanism; 110-ceramic nozzle; 300-glue dispensing mechanism; 310-glue dispensing head; 311-outer tube; 312-fixing piece; 3121-ventilation cavity; 3122-air inlet; 3123-connecting hole; 313-needle tube; 314-gas storage cavity; 315-first air outlet; 316-second air outlet; 317-conical surface; 330 -Second driving assembly; 331-first linear telescopic structure; 333-second linear telescopic structure; 335-four-bar linkage; 3351-motor; 3352-driving wheel; 3353-driven wheel; 3354-transmission belt; 3355-first transmission rod; 3356-second transmission rod; 3357-third transmission rod; 350-transmission arm; 370-glue storage member; 371-annular groove; 380-smoothing member; 390-driving member. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0037] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0039] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0040] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0041] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] In addition, in the following embodiments, unless otherwise specified, the first direction refers to the direction indicated by the ab arrow or the ba arrow, the second direction refers to the direction indicated by the cd arrow or the dc arrow, and the third direction refers to the direction indicated by the ef arrow or the fe arrow, wherein the first direction, the second direction and the third direction are perpendicular to each other. Obviously, in other embodiments, the three directions may not be perpendicular to each other.

[0043] See also Figure 7 In the process of LED wire welding, for ease of understanding, the wire welding process can be simplified as follows: the bonding process of the first welding point, referred to as one welding 010, this process is the welding of LED chip and wire; the welding wire forming process, referred to as arc drawing; the bonding process of the second welding point, referred to as two welding 020, this process is the welding of wire and LED bracket. The connecting wire formed by "one welding + arc drawing + two welding" is "wire arc 030". After the wire welding process is completed, in order to increase the strength of the second welding, it is necessary to perform the glue dispensing process at the location of the second welding point. At present, the wire welding machine and the glue dispensing machine are independently set up and in order to avoid mutual influence, the wire welding machine and the glue dispensing machine are basically set in different rooms. When the LED wire welding process is completed, the LED needs to be transported to the room where the glue dispensing machine is located, which increases the transportation cost, and during the transportation process, the LED is easily damaged, affecting the quality of LED packaging. In addition, during the transportation process, the wire arc is exposed to the external environment for a long time, and the wire arc is easily oxidized and contaminated, thereby reducing the product qualification rate.

[0044] See also Figure 1 In view of this, the present embodiment provides a processing device for LED packaging, which can complete the wire bonding process and glue dispensing process in the LED packaging process. The processing device integrates the wire bonding and glue dispensing into one, shortens the cycle of the LED packaging process, improves the processing efficiency, and has low processing costs and high product qualification rate.

[0045] See also Figure 1 In this embodiment, the processing device for LED packaging includes a frame (not shown), a wire welding mechanism 100 and a glue dispensing mechanism 300. The wire welding mechanism 100 and the glue dispensing mechanism 300 are both arranged on the frame. The wire welding mechanism 100 is used to weld the LED and form welding points, and the glue dispensing mechanism 300 is used to dispense glue on the welding points.

[0046] In the processing device provided in this embodiment, the wire welding mechanism 100 and the glue dispensing mechanism 300 are both installed on the frame, so that the two mechanisms are integrated into one device. In the LED packaging process, after the wire welding mechanism 100 performs wire welding on the LED, the LED that has completed the wire welding operation can be directly glued by the glue dispensing mechanism 300, which omits the step of transferring the LED to a glue dispensing machine independently set up from the wire welding machine for glue dispensing after the LED wire welding operation is completed, reducing the cost generated in the LED transfer link, and avoiding the situation where the wire welding on the LED is damaged during the LED transfer link, so as not to affect the subsequent glue dispensing process, thereby improving the product qualification rate. At the same time, the wire welding mechanism 100 and the glue dispensing mechanism 300 are integrated into one. When the LED completes the wire welding operation, the LED can be glued in time through the glue dispensing mechanism 300, and the wire arc on the LED is exposed to the air for a short time, and the wire arc is not easily oxidized and contaminated, which can also improve the product qualification rate.

[0047] In this embodiment, optionally, the frame may be a frame structure or a plate structure, and the frame is provided with a plurality of holes for bolts to pass through, so as to facilitate fixing the wire welding mechanism 100 and the glue dispensing mechanism 300 to the frame by bolts.

[0048] Obviously, in other embodiments, the wire welding mechanism 100 and the glue dispensing mechanism 300 can be connected to the frame by welding or other methods.

[0049] Please combine Figure 1 and Figure 2 In this embodiment, optionally, the wire welding mechanism 100 includes a porcelain nozzle 110 and a first driving assembly (not shown), the first driving assembly is connected to the frame, the porcelain nozzle 110 is connected to the first driving assembly, and the first driving assembly is used to drive the porcelain nozzle 110 to move relative to the LED to be welded, thereby realizing the welding of the LED welding area and the wire.

[0050] Optionally, the first driving component includes a first slide, a second slide and a lifting platform, the first slide slides with the frame in a first direction, the second slide slides with the first slide in a second direction, the lifting platform slides with the second slide in a third direction, and the first direction, the second direction and the third direction are perpendicular to each other.

[0051] Furthermore, the first slide, the second slide and the lifting platform can all be driven by a cylinder, a hydraulic cylinder or a screw transmission structure. For example, in this embodiment, a screw transmission structure is used as an example of a driving source. A screw transmission structure is arranged on the frame, and the screw transmission structure is connected to the first slide, and is used to drive the first slide to slide relative to the frame along a first direction. A screw transmission structure is arranged on the first slide, and the screw transmission structure is connected to the second slide, and is used to drive the second slide to move in a second direction relative to the first slide; a screw transmission structure is arranged on the second slide, and the screw transmission structure is connected to the lifting platform, and is used to drive the lifting platform to move in a third direction. The porcelain nozzle 110 is connected to the lifting platform, and finally the porcelain nozzle 110 is driven by the first driving component to realize the movement of the porcelain nozzle 110 in a three-dimensional direction. The porcelain nozzle 110 has a wide range of movement, which is convenient for LED wire welding operations.

[0052] It should be noted that the screw transmission structure includes a motor, a screw body and a slider, the slider is screwed to the screw body, and the motor drives the screw body to rotate so that the slider reciprocates in the extension direction of the screw body. The motor can be a servo motor, which has more precise control.

[0053] It should be noted that the first driving component may be a mechanical arm, the mechanical arm is connected to the frame, and the porcelain nozzle 110 is connected to the mechanical arm.

[0054] See also Figure 1-Figure 3 In this embodiment, optionally, the dispensing mechanism 300 includes a dispensing head 310 and a second driving component 330, the second driving component 330 is connected to the frame, the dispensing head 310 is connected to the second driving component 330, and the second driving component 330 is used to drive the dispensing head 310 to move so that the dispensing head 310 is close to the welding point, and the dispensing head 310 sends out glue to perform dispensing operation on the welding point.

[0055] See also Figure 5 and Figure 6Optionally, the dispensing head 310 includes an outer tube 311, a fixing member 312 and a needle tube 313, the fixing member 312 is inserted into the outer tube 311, the needle tube 313 is inserted into the fixing member 312, and the end of the needle tube 313 away from the outer tube 311 extends out of the fixing member 312; the fixing member 312 has a ventilation cavity 3121, and one end of the ventilation cavity 3121 is set as an air inlet 3122; the outer wall of the fixing member 312 and the inner wall of the outer tube 311 form an air storage cavity 314, and the fixing member 312 is provided with a connecting hole 3123, and the ventilation cavity is connected to the air storage cavity 314; the air storage cavity 314 is provided with a first air outlet 315 on the side away from the air inlet 3122, and the first air outlet 315 It is arranged around the needle tube 313, and the air outlet direction of the first air outlet 315 points to the end of the needle tube 313 away from the outer tube 311. Optionally, the surrounding wall surrounding the first air outlet 315 is a conical surface 317, so that the gas discharged from the first air outlet 315 is blown to the distal end of the needle tube 313; further, the inner wall of the fixing piece 312 cooperating with the first air outlet 315 is a conical surface 317, which plays a double guiding role, so that the gas discharged from the first air outlet 315 can smoothly reach the distal outer wall of the needle tube 313; the needle tube 313 is connected with the connecting hole 3123 through the ventilation cavity 3121, and the end of the needle tube 313 away from the connecting hole 3123 is set as the second air outlet 316. The use of an internal and external air-blowing dispensing head structure can ensure that the dispensing head 310 moves to a dispensing position very close to the LED bracket during dispensing, and the dispensing head 310 does not need to contact the dispensing surface. Dispensing is achieved by internal and external air-blowing, which can avoid the dispensing head 310 hitting the bracket to generate vibration and improve the dispensing quality. At the same time, micro-control can also be achieved. In the actual operation process, the glue dispensing head 310 is moved so that the needle tube 313 moves to the glue taking position and is inserted into the viscous glue. A small amount of glue adheres to the tube cavity of the needle tube 313, the outer tube wall and the end face of the needle tube 313. Then, the glue dispensing head 310 is moved to the position corresponding to the position to be glued on the LED bracket, and the fan is used to blow air into the ventilation cavity 3121. The gas flows in the needle tube 313 and blows the glue in the needle tube 313 to the welding line position; at the same time, the gas enters the gas storage cavity 314 from the connecting hole 3123 and is discharged from the second air outlet 316. The gas is directly blown to the outer tube wall of the needle tube 313, so that the glue on the outer tube wall falls off and reaches the welding line position. That is, the glue dispensing head 310 uses the first air outlet 315 and the second air outlet 316 to blow the glue adhering to and inside the needle tube 313 to the welding line position to achieve glue dispensing. Since the amount of glue adhering to the welding line position can be controlled by the amount of glue adhering to the needle tube 313, it is not easy to have too little or too much glue, which can ensure the quality of glue dispensing and will not cause waste of glue. In addition, the glue dispensing is performed by the internal and external blowing method, and the glue is not easy to remain on the needle tube 313, ensuring that the glue inside and outside the needle tube 313 can reach the welding line position, thereby ensuring the quality of glue dispensing.

[0056] It should be noted that the glue dispensing mechanism 300 mentioned in this embodiment is used to dispense glue to the LED bracket that has completed the wire welding process. The glue dispensing mechanism 300 can also be a glue spraying mechanism. The glue dispensing process performed by the glue dispensing mechanism 300 can also be performed by a glue spraying mechanism, which is called a glue spraying process. Similarly, the glue dispensing head 310 can also be a glue spraying head.

[0057] In addition, in the dispensing process described in this embodiment, the dispensing head 310 can be in direct contact with the LED bracket, or a certain distance can be maintained between the two; at the same time, in the spraying process provided in this embodiment, the spraying head and the LED bracket can be in direct contact, or a certain distance can be maintained between the two.

[0058] Optionally, the second driving assembly 330 includes a second three-dimensional mobile platform, which includes a first linear telescopic structure 331, a second linear telescopic structure 333 and a four-link structure 335, wherein the second linear telescopic structure 333 is connected to the first linear telescopic structure 331, the four-link structure 335 is connected to the second linear telescopic structure 333, and the dispensing head 310 is connected to the four-link structure 335; wherein the first linear telescopic structure 331 is telescopic along a first direction, the second linear telescopic structure 333 is telescopic along a second direction perpendicular to the first direction, and the four-link structure 335 is used to drive the dispensing head 310 to move in a third direction, and the third direction is perpendicular to the plane defined by the first direction and the second direction. Obviously, in other embodiments, the third direction may be in an inclined state that is not perpendicular to the plane defined by the first direction and the second direction.

[0059] See also Figure 3 Optionally, the four-bar linkage structure 335 includes a motor 3351, a driving wheel 3352, a driven wheel 3353, a transmission belt 3354, a first transmission rod 3355, a second transmission rod 3356 and a third transmission rod 3357. The motor 3351 is connected to the second linear telescopic structure 333. The driving wheel 3352 and the driven wheel 3353 are both rotationally matched with the second linear telescopic structure 333. The transmission belt 3354 is tensioned outside the driving wheel 3352 and the driven wheel 3353. The first transmission rod 3355 is rotationally matched with the axle of the driving wheel 3352 and the third transmission rod 3357 at the same time, and the second transmission rod 3356 is rotationally matched with the axle of the driven wheel 3353 and the third transmission rod 3357 at the same time. The driving wheel 3352 rotates under the drive of the motor 3351, thereby driving the driven wheel 3353, the first transmission rod 3355, the second transmission rod 3356 and the point transmission rod to move.

[0060] It should be noted that the driving wheel 3352 and the driven wheel 3353 can be sprockets or gears, and correspondingly, the transmission belt 3354 can be a chain or a toothed bar.

[0061] Optionally, the glue dispensing mechanism 300 also includes a transmission arm 350, which is connected to the third transmission rod 3357, and the glue dispensing head 310 is connected to the transmission arm 350. The glue outlet of the glue dispensing head 310 is set downward. When the glue dispensing head 310 is raised or lowered by the four-bar structure 335, the glue dispensing head 310 always maintains a vertical state, and the glue in the glue dispensing head 310 will not flow back, thereby ensuring the uniformity of glue output, thereby improving the quality of glue dispensing. And through the setting of the four-bar structure 335, the horizontal space is reasonably utilized to avoid the interference caused by the concentrated parts of the processing device.

[0062] It should be noted that the second driving component 330 may be a robotic arm, the robotic arm is connected to the frame, and the dispensing head 310 is connected to the robotic arm.

[0063] In this embodiment, it should be noted that the glue dispensing head 310 of the glue dispensing mechanism 300 and the porcelain nozzle 110 of the wire bonding mechanism 100 may also share a three-dimensional motion platform.

[0064] See also Figure 3 and Figure 4 In this embodiment, optionally, the glue dispensing mechanism 300 also includes a glue storage member 370 , a smoothing member 380 and a driving member 390 .

[0065] Optionally, the glue storage member 370 has an annular groove 371 for accommodating glue. The glue storage member 370 and the second linear telescopic structure 333 are rotatably matched, and the rotation axis of the two extends along the third direction. At the same time, the axis of the annular groove 371 coincides with the rotation axis. The movement of the glue storage member 370 and the glue dispensing head 310 in the first direction and the second direction is consistent. In other words, when the first linear telescopic structure 331 and the second linear telescopic structure 333 move, the glue storage member 370 and the glue dispensing head 310 both move synchronously.

[0066] The driving member 390 is connected to the second linear telescopic structure 333 , and the driving member 390 is used to drive the glue storage member 370 to rotate relative to the second linear telescopic structure 333 .

[0067] Among them, the smoothing member 380 is connected to the second linear telescopic structure 333, and part of the smoothing member 380 extends into the annular groove 371. When the glue storage member 370 rotates under the action of the driving member 390, the glue storage member 370 rotates relative to the smoothing member 380, and the smoothing member 380 realizes the stirring operation of the glue liquid in the annular groove 371, and the glue liquid is not easy to coagulate. When the glue dispensing head 310 collects the glue liquid from the glue storage member 370, the glue liquid is mixed evenly, which can improve the glue dispensing quality. At the same time, during the rotation of the glue storage member 370, the glue liquid in the glue storage member 370 is stirred by the smoothing member 380, and the liquid surface of the glue liquid is more flat, consistent and stable, so that the depth of the glue dispensing head 310 immersed in the glue liquid is consistent each time when taking glue, ensuring the consistency of taking glue, thereby further improving the glue dispensing quality.

[0068] It should be noted that the structure of the glue dispensing mechanism 300 is not limited to the above structure, and the structure of an existing glue dispensing machine can also be directly adopted.

[0069] In this embodiment, optionally, the processing device also includes a conveying mechanism, which is connected to the frame and slides relative to the frame in the second direction. The conveying mechanism is used to carry the LED bracket 001 and drive the LED bracket 001 to move in the second direction.

[0070] It should be noted that the dispensing head 310 and the porcelain nozzle 110 are arranged at intervals in the second direction. When the LED bracket 001 is transported by the transport mechanism, it first reaches the porcelain nozzle 110 and completes the wire welding operation, and then continues to be transported to the dispensing head 310 to complete the dispensing operation. The LED wire welding and dispensing processes are carried out on the same processing device, and during the processing, the LED moves through the transport mechanism, and the LED does not need to be repositioned. In other words, the LED shares a positioning coordinate system during the wire welding and dispensing processes. The position of the LED soldering point is easy to confirm and can be directly fed back to the dispensing process, thereby ensuring the accuracy of the dispensing position and improving the quality of dispensing.

[0071] In this embodiment, the wire welding and glue dispensing can be uniformly controlled by the control system to realize automatic packaging. For example, the control system issues a command to drive the porcelain nozzle of the wire welding mechanism to move to the position of the wire to be welded to weld the LED bracket, and then the porcelain nozzle returns to prepare for the next wire welding; then, the conveying mechanism conveys the LED bracket and moves the position where the wire welding has been completed to the glue dispensing mechanism, and the control system obtains the position information of the LED bracket welding wire and can use the position information to control the movement of the second driving component 330. At this time, the second driving component 330 first drives the glue dispensing head 310 to move to the glue storage part 370 to take glue, and then drives the glue dispensing head 310 to perform glue dispensing. After the glue dispensing is completed, the glue dispensing head 310 returns to facilitate the next glue taking and glue dispensing operation.

[0072] The processing device provided in this embodiment is used for LED packaging. LED wire welding and glue dispensing are achieved through the same device, which reduces the cost of transporting LEDs and shortens the time that the LED wire arc is exposed to the air, thereby improving the product qualification rate.

[0073] This embodiment also provides an LED packaging process, in which the LED with completed wire bonding is glued on the same device, which reduces the cost of transporting the LED and shortens the time that the wire arc 030 of the LED is exposed to the air, thereby improving the qualified rate of the product.

[0074] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A processing device for LED packaging, characterized in that: include: A frame, a wire welding mechanism and a glue dispensing mechanism, wherein the wire welding mechanism and the glue dispensing mechanism are both arranged on the frame, the wire welding mechanism is used to weld the LED and form a welding point, and the glue dispensing mechanism is used to dispense glue on the welding point; The wire welding mechanism comprises a porcelain nozzle and a first driving component, wherein the first driving component is connected to the frame, and the first driving component is used to drive the porcelain nozzle to move so that the porcelain nozzle contacts the LED and welds the LED; The first driving assembly comprises a first three-dimensional mobile platform, the porcelain nozzle is connected to the first three-dimensional mobile platform, and the first three-dimensional mobile platform is connected to the frame; The dispensing mechanism comprises a dispensing head and a second driving component, wherein the second driving component is connected to the frame, the dispensing head is connected to the second driving component, and the second driving component is used to drive the dispensing head to move so that the dispensing head is close to the welding point; The second driving assembly includes a second three-dimensional mobile platform, the second three-dimensional mobile platform is connected to the frame, the dispensing head is connected to the second three-dimensional mobile platform, and the second three-dimensional mobile platform is used to drive the dispensing head to move; The dispensing head and the porcelain nozzle share a three-dimensional motion platform, and the first three-dimensional moving platform and the second three-dimensional moving platform are the same three-dimensional motion platform.

2. The processing device according to claim 1, characterized in that: The dispensing head includes an outer tube, a fixing part and a needle tube, the fixing part is inserted in the outer tube, the needle tube is inserted in the fixing part, and one end of the needle tube away from the outer tube extends out of the fixing part; the fixing part has a ventilation cavity, one end of the ventilation cavity is set as an air inlet; the outer wall of the fixing part and the inner wall of the outer tube form an air storage cavity, the fixing part is provided with a connecting hole, the ventilation cavity is connected with the air storage cavity; a first air outlet is provided on the side of the air storage cavity away from the air inlet; the needle tube is connected with the connecting hole through the ventilation cavity, and the end of the needle tube away from the connecting hole is set as a second air outlet.

3. The processing device according to claim 1, characterized in that: The second three-dimensional mobile platform includes a first linear telescopic structure, a second linear telescopic structure and a four-bar linkage structure, the second linear telescopic structure is connected to the first linear telescopic structure, the four-bar linkage structure is connected to the second linear telescopic structure, and the dispensing head is connected to the four-bar linkage structure; wherein the first linear telescopic structure is telescopic along a first direction, the second linear telescopic structure is telescopic along a second direction perpendicular to the first direction, the four-bar linkage structure is used to drive the dispensing head to move in a third direction, and the third direction has an angle with a plane determined by the first direction and the second direction.

4. The processing device according to claim 1, characterized in that: The glue dispensing mechanism also includes a glue storage part, which is connected to the second driving component, and the glue dispensing head is used to collect glue liquid from the glue storage part.

5. The processing device according to claim 4, characterized in that: The glue dispensing mechanism also includes a smoothing member and a driving member, wherein the driving member is connected to the second driving assembly, and the driving member is connected to the glue storage member, and is used to drive the glue storage member to rotate; the smoothing member is connected to the second driving assembly, and the smoothing member is used to stir the glue liquid in the glue storage member when the glue storage member rotates.

6. An LED packaging process, characterized in that: The LED packaging process includes: The LED with completed wire bonding is glued on the processing device described in any one of claims 1 to 5.

7. The LED packaging process according to claim 6, characterized in that: In the step of applying glue to the LED with completed wire bonding, the same control system is used to control the wire bonding mechanism used for wire bonding and the glue applying mechanism used for glue applying.

8. The LED packaging process according to claim 6 or 7, characterized in that: The step of dispensing glue on the LED with completed wire bonding includes driving the porcelain nozzle of the wire bonding mechanism to move to the wire bonding position and bonding the LED bracket; After the wire welding is completed, the porcelain nozzle returns to its position; then, the LED bracket is driven to move so that the wire position where the wire welding has been completed moves to the dispensing mechanism, and the dispensing head of the dispensing mechanism is used to dispense glue on the wire position.

9. The LED packaging process according to claim 8, characterized in that: The step of using the dispensing head of the dispensing mechanism to dispense glue on the welding line position includes using a driving mechanism to drive the dispensing head that has completed the glue dispensing to approach the welding line position, using the dispensing head to dispense glue on the welding line position by blowing air inside and outside, and the dispensing head returns to its original position after the dispensing is completed.

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