Board-to-board connector cutting detection, packaging method and equipment

Through positioning needle feeding, glue-pressing cam mold pressing and image recognition technology, the problem of low manual sorting efficiency in board-to-board connector detection is solved, and efficient and accurate sorting and packaging of defective products is achieved, which improves detection accuracy and efficiency.

CN112792205BActive Publication Date: 2025-07-22SUZHOU RUIXINUO INTELLIGENT TECH CO LTD
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Patent Information

Application Number
CN202011643136.6
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2020-12-30
Publication Date
2025-07-22
Estimated Expiration
2040-12-30

AI Technical Summary

Technical Problem

In the prior art, the detection and sorting of board-to-board connectors mainly relies on manual operations, which are inefficient and prone to misoperation, making it difficult to achieve efficient and accurate sorting of defective products.

Method used

The positioning needle insertion tape jack drives the feeding material, combined with the glue cam control mold pressing and image recognition technology, first cut the metal tool and then cut the pins of the defective product. Through multiple inspections, the good product is ensured to be qualified and finally packaged.

Benefits of technology

It realizes efficient and accurate detection and sorting of board-to-board connectors, avoids chip and pin deformation, improves system inspection efficiency, and ensures product quality.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention discloses a board-to-board connector cutting, detection and packaging method, which inserts a positioning pin into a material belt jack, and moves the material belt forward to accurately feed the material; drives the lower pressing die and the upper top die to press the connector at the same time through the glue pressing cam, and flattens the size of the external glue injection of the connector; obtains the appearance image of the connector, detects the appearance size of the product through image recognition, and determines whether it meets the appearance detection standard; then cuts the hardware of the connector first, then cuts the pins of defective products, removes the defective products from the material belt, and then cuts the pins of good products, and continues to convey the good products; the material shifting mechanism shifts the good products to the detection position in turn, and performs pin short circuit detection, voltage resistance detection, pin size detection, and pin flatness detection; when any of the above detections does not meet the detection standard, the defective products are removed by the defective elimination mechanism, and the qualified products are packaged by the packaging mechanism. The entire detection and subpackaging process is carried out one by one, and the detection is accurate and completed efficiently.
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Description

Technical Field

[0001] The present invention relates to an electronic component detection device, and more specifically, to a board-to-board connector cutting, detection and packaging method and device. Background Art

[0002] With the rapid development of optoelectronics, communications, materials, electronics and other industries, as well as the large-scale rise of electronic consumer products, board-to-board connectors (BTB connectors) have been widely used in electronic products with their powerful and stable transmission capabilities. As the scale of connector production continues to expand, product quality requirements are rapidly increasing.

[0003] The BTB connector includes a connector body, on which ping pins and hardware are provided. The strip material strip is connected to several connector bodies through the ping pins and hardware. When the BTB connector is processed and produced, the ping pins and hardware on the strip need to be cut off to form an independent BTB connector.

[0004] In the prior art, the processed BTB connectors need to be inspected before packaging, and unqualified products need to be sorted. The existing sorting work is usually done manually, which is not only inefficient but also prone to sorting errors.

[0005] In view of this, the inventors of the present invention have deeply conceived and actively studied, improved and tried to develop and design the present invention in order to solve the above-mentioned problems. Summary of the invention

[0006] In view of the shortcomings of the prior art, the first object of the present invention is to provide a board-to-board connector cutting, detection and packaging method, which supports efficient and accurate detection of defective products and sorting and packaging.

[0007] To achieve the above object, the present invention provides the following technical solutions:

[0008] A board-to-board connector cutting, detection and packaging method, comprising:

[0009] Insert the positioning pin into the tape jack and move the tape forward to feed the material accurately;

[0010] The glue pressing cam drives the lower pressing die and the upper ejecting die to press the connector at the same time to level the size of the glue injection outside the connector;

[0011] Obtain the connector appearance image, detect the product appearance dimensions through image recognition, and determine whether it meets the appearance inspection standards;

[0012] After that, the hardware of the connector is cut first, and then the pins of the defective products are cut, and the defective products are removed from the material belt. After that, the pins of the good products are cut and the good products are transported further;

[0013] The material transfer mechanism transfers the qualified products to the testing position in sequence for pin short circuit detection, voltage resistance detection, pin size detection, and pin flatness detection.

[0014] When any of the above tests does not meet the test standards, the defective products are removed by the defective elimination mechanism, and the qualified products are packaged by the packaging mechanism.

[0015] By adopting the above technical solution, the positioning pin is inserted into the jack of the material belt, and the positioning pin drives the material belt forward to drive the material belt to be transported, and accurate transportation is performed, which helps to improve the accuracy of detection. After that, the glue pressing cam starts to move, driving the upper top mold and the lower pressing mold to move at the same time, pressing the connector, and leveling the glue injection on the surface of the connector, eliminating the impact of glue leakage or material stripping on subsequent detection. After that, the appearance image of the connector is obtained, and the image recognition algorithm is used to determine whether the appearance size of the product meets the appearance inspection standard. After the inspection, all the hardware of the connector is cut, and then the pins of defective products that do not meet the appearance inspection standard are cut again, and finally the pins of good products are cut. This cutting order, on the one hand, avoids chip deformation or pin deformation due to different cutting pressures of hardware and pins when cutting at the same time, and on the other hand, the defective products are separated from the material belt after the pins are cut, and subsequent inspections are omitted, thereby improving the system inspection efficiency. After that, the material-pickup mechanism will start to move the qualified connectors that have been cut and separated from the material strip to the next inspection station one by one, and then conduct pin short circuit detection, voltage resistance detection, pin size detection, and pin flatness detection to ensure that all parameters of the connector meet the inspection standards. Finally, the defective elimination mechanism will remove those that do not meet the inspection standards, and the packaging mechanism will package the qualified products. The entire inspection and subpackaging process is carried out one by one, with accurate inspection and efficient completion.

[0016] Furthermore, when the material strip enters,

[0017] Check whether the passing material strips are equipped with connectors in sequence. If there are material strips without connectors, the subsequent inspection will automatically skip the material strips without connectors.

[0018] Furthermore, when the strip carries the connector,

[0019] Check whether the thickness of the hardware exceeds the preset standard. If the thickness of the hardware exceeds the preset standard, stop the test and report the abnormality.

[0020] In view of the shortcomings of the prior art, the second object of the present invention is to provide a board-to-board connector cutting, inspection and packaging equipment that supports efficient and accurate inspection of defective products and sorting and packaging.

[0021] To achieve the above object, the present invention provides the following technical solutions:

[0022] A board-to-board connector cutting, inspection and packaging device comprises a frame and a feeding mechanism connected to the frame, wherein a positioning pin is inserted into a jack of a material belt to move the material belt forward for feeding;

[0023] The glue pressing mechanism drives the lower pressing die and the upper ejecting die to press the connector at the same time through the glue pressing cam to level the size of the glue injection outside the connector;

[0024] Appearance inspection module, which obtains the appearance image of the connector, detects the appearance dimensions of the product through image recognition, and determines whether it meets the appearance inspection standards;

[0025] The cutting mechanism is used for linkage cutting at three stations: first cutting the connector hardware, then cutting the pins of defective products so that the defective products fall into the waste mobile phone box, and finally cutting the pins of good products;

[0026] The material transfer mechanism transfers the qualified products to each inspection position in sequence;

[0027] Short-circuit voltage detection module, used to detect whether the pin is short-circuited and perform voltage resistance test on the connector;

[0028] The pin detection module detects whether the pin size and pin flatness meet the detection standards through image recognition;

[0029] Defective product elimination mechanism, used to eliminate defective products;

[0030] The packaging organization packs the good products.

[0031] With the above technical solution, the positioning pin is inserted into the jack of the tape, and the tape is driven to be conveyed by the way that the positioning pin toggles the tape forward for precise conveyance, which helps to improve the accuracy of detection. After that, the glue pressing cam starts to actuate, driving the upper die and the lower die to actuate simultaneously to press the connector and flatten the glue injection on the surface of the connector, eliminating the influence of glue leakage or material detachment of the glue injection on subsequent detection. Then, an appearance image of the connector is obtained, and it is judged whether the appearance size of the product meets the appearance detection standard through an image recognition algorithm. After the detection, the metal fittings of all connectors are cut, and then the pins of the defective products that do not meet the appearance detection standard are cut again. Finally, the pins of the qualified products are cut. Such a cutting sequence, on the one hand, avoids deformation of the chip or pins caused by different cutting pressures of the metal fittings and pins during simultaneous cutting. On the other hand, after the defective products are cut off the pins, they are separated from the tape, omitting subsequent detection and improving the detection efficiency of the system. After that, the material feeding mechanism acts, and the qualified connectors that have been cut off the pins and separated from the tape are successively fed to the next detection station. Then, pin short-circuit detection, withstand voltage detection, pin size detection, and pin flatness detection are carried out successively to ensure that each parameter of the connector meets the detection standard. Finally, the defective products that do not meet the detection standard are removed through the defect elimination mechanism, and the detected qualified products are packed through the packaging mechanism. The entire detection and subcontracting process is carried out one by one, with accurate detection and high efficiency completed.

[0032] Further, the feeding mechanism includes

[0033] A carrier tape sprocket, rotatably connected to the frame, having positioning pins that can be inserted into the jacks of the tape;

[0034] A carrier tape power source that drives the carrier tape sprocket to rotate.

[0035] Further, the glue pressing mechanism includes

[0036] A glue pressing cam, rotatably connected to the frame, for pressing and driving the upper swing rod assembly and the lower swing rod assembly to actuate respectively;

[0037] An upper swing rod assembly, rotatably connected to the frame, connected to the glue pressing cam, and driven by the glue pressing cam to drive the lower die to move up and down;

[0038] A lower swing rod assembly, rotatably connected to the frame, connected to the glue pressing cam, and driven by the glue pressing cam to drive the upper die to move up and down;

[0039] The lower die and the upper die are connected to the frame and are driven by the glue pressing cam to press against the connector or move away from the connector simultaneously.

[0040] Further, the cutting mechanism includes a support plate, and also includes those installed on the support plate

[0041] The cam drive assembly drives the fitting cutting assembly, the defective pin cutting assembly, and the non-defective pin cutting assembly to perform cutting operations simultaneously;

[0042] The fitting cutting assembly cuts the fittings of all conveyed connectors driven by the cam drive assembly;

[0043] The defective pin cutting assembly cuts the pins of defective products driven by the cam drive assembly;

[0044] The non-defective pin cutting assembly cuts the pins of non-defective products driven by the cam drive assembly;

[0045] The transmission control assembly is used to control whether the driving force of the cam is transmitted to the defective pin cutting assembly.

[0046] Furthermore, the defective pin cutting assembly includes

[0047] The cutting swing rod is rotatably connected to the frame and swings under the pressing of the cam drive assembly;

[0048] The cutting pressure head assembly is slidably connected to the support plate and moves up and down under the pressing of the swing rod;

[0049] The defective pin cutting die is connected to the frame and cuts the pins of defective products when the cutting pressure head assembly presses down.

[0050] Furthermore, the transmission control assembly includes

[0051] The connecting block is slidably connected to the swing rod and can press against the cam assembly to drive the swing rod to swing;

[0052] The pushing air cylinder is connected to the swing rod and is used to push the connecting block to press against the cam for linkage.

[0053] In summary, the present invention has the following beneficial effects: by inserting the positioning pin into the jack of the material belt and pushing the material belt forward by the positioning pin, the material belt is driven to be conveyed, and accurate conveying is performed, which helps to improve the accuracy of detection. Afterwards, the glue pressing cam starts to move, driving the upper top mold and the lower pressing mold to move simultaneously, pressing the connector, and leveling the glue injection on the surface of the connector, eliminating the influence of glue leakage or material stripping on subsequent detection. Afterwards, the appearance image of the connector is obtained, and the image recognition algorithm is used to determine whether the appearance size of the product meets the appearance detection standard. After the detection, all the hardware of the connector is cut, and then the pins of defective products that do not meet the appearance detection standard are cut again, and finally the pins of good products are cut. Such a cutting order, on the one hand, avoids deformation of the chip or pin due to different cutting pressures of the hardware and pins when cutting at the same time, and on the other hand, the defective products are separated from the material belt after the pins are cut, and subsequent detection is omitted, thereby improving the detection efficiency of the system. After that, the material-pickup mechanism will start to move the qualified connectors that have been cut and separated from the material strip to the next inspection station one by one, and then conduct pin short circuit detection, voltage resistance detection, pin size detection, and pin flatness detection to ensure that all parameters of the connector meet the inspection standards. Finally, the defective elimination mechanism will remove those that do not meet the inspection standards, and the packaging mechanism will package the qualified products. The entire inspection and subpackaging process is carried out one by one, with accurate inspection and efficient completion. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] Figure 1 It is a schematic diagram of the process of the board-to-board connector cutting, detection and packaging method in the present invention;

[0055] Figure 2 It is a three-dimensional schematic diagram of the board-to-board connector cutting, detection and packaging equipment in the present invention;

[0056] Figure 3 It is a structural schematic diagram of the feeding mechanism in the present invention;

[0057] Figure 4 It is a structural schematic diagram of the glue pressing mechanism in the present invention;

[0058] Figure 5 It is a schematic diagram of the explosion of the upper top mold and the lower pressure film in the present invention;

[0059] Figure 6 It is a structural schematic diagram of the appearance detection module in the present invention;

[0060] Figure 7 The schematic diagram of the structure of the cutting mechanism in the present invention is

[0061] Figure 8 It is a three-dimensional schematic diagram of the cutting mechanism in the present invention.

[0062] In the figure: 1. Frame; 2. Material tray module; 3. Feeding mechanism; 301. Carrier sprocket; 302. Carrier power source; 4. Gluing mechanism; 401. Gluing cam; 402. Upper swing rod assembly; 403. Lower swing rod assembly; 404. Upper top mold; 405. Lower pressing mold; 5. Appearance inspection module; 51. 45-degree appearance inspection assembly; 52. Vertical appearance inspection assembly; 6. Cutting mechanism; 61. Cam drive assembly; 62. Hardware cutting assembly; 63. Defective product pin cutting assembly; 631. Cutting swing rod; 632. Cutting pressure head assembly; 633. Defective product pin cutting mold; 64. Good product pin cutting assembly; 65. Transmission control assembly; 651. Connection block; 652. Push cylinder; 66. Support plate; 7. Material removal mechanism; 8. Packaging mechanism. DETAILED DESCRIPTION

[0063] The present invention is described in detail below in conjunction with the accompanying drawings and embodiments.

[0064] This specific embodiment is merely an explanation of the present invention and is not a limitation of the present invention. After reading this specification, those skilled in the art may make non-creative modifications to the present embodiment as needed. However, as long as they are within the scope of the claims of the present invention, they are protected by the patent law.

[0065] Example 1

[0066] A board-to-board connector cutting, testing and packaging method is intended to detect whether the board-to-board connector meets various testing standards, and to cut and discard defective products that do not meet the testing standards, and to cut and package good products. Figure 1 , including the following process steps:

[0067] Step S101: insert the positioning pin into the material tape insertion hole and move the material tape forward to feed the material accurately.

[0068] Step S102: The glue pressing cam 401 drives the lower pressing mold 405 and the upper ejecting mold 404 to press the connector simultaneously to level the size of the glue injection outside the connector.

[0069] Step S103: Obtain an appearance image of the connector, detect the appearance dimensions of the product through image recognition, and determine whether it meets the appearance inspection standard.

[0070] Step S104: First cut the hardware of the connector, then cut the pins of the defective products, remove the defective products from the material belt, and then cut the pins of the good products, and continue to transport the good products.

[0071] Step S105: the material transfer mechanism 7 transfers the good products to the testing position in sequence, and performs pin short circuit detection, voltage resistance detection, pin size detection, and pin flatness detection.

[0072] Step S106: When any of the above detections does not meet the detection standard, the defective products are removed by the defective product exclusion mechanism, and the qualified products are packed by the packing mechanism 8.

[0073] In step S101, when conveying the material tape, the positioning pins are inserted into the positioning holes on the material tape, and the positioning pins keep rotating, and the material tape is conveyed forward through each pin hole, which can achieve very precise feeding and is helpful for subsequent precise detection and precise cutting.

[0074] In step S102, the pressing rubber cam 401 drives the lower pressing die 405 and the upper top die 404 at the same time. On the one hand, the transmission structure is simplified to reduce costs. On the other hand, being driven by the same pressing rubber cam 401 helps to keep the pace consistent.

[0075] Then in step S103, the appearance image of the connector is obtained through the imaging instrument, and the appearance size of the product is detected by using the graphic recognition software and algorithm. First, it is judged whether the product appearance meets the appearance detection standard, and the defective products are distinguished.

[0076] In step S104, when conveying the material tape, the cutting mechanism 6 first cuts the metal fittings of the connector, then cuts the pins of the defective products, and finally cuts the pins and the material tape of the qualified products, so as to distinguish the defective products and the qualified products in the appearance detection of the connector, and remove the defective products, leaving the qualified products in the appearance detection to continue to be conveyed for subsequent detection.

[0077] Since the cutting mechanism 6 cuts the metal fittings, pins and material tape of the connector in step S104, and the metal fittings are separated from the material tape, in step S105, the qualified products that pass the appearance detection are sequentially dialed to the next detection station for detection by the material dialing mechanism 7, and

[0078] In addition, the cutting, detection and packaging method for the board-to-board connector further includes that when the material tape enters, it is sequentially detected whether the passing material tape carries a connector. When there is a material tape that does not carry a connector, the subsequent detection automatically skips the material tape that does not carry a connector.

[0079] The cutting, detection and packaging method for the board-to-board connector further includes that when the material tape carries a connector, it is detected whether the thickness of the metal fitting exceeds the preset standard. When the thickness of the metal fitting exceeds the preset standard, the detection is stopped and an abnormality is reported.

[0080] Embodiment 2

[0081] A board-to-board connector cutting, detecting and packaging device works by applying the board-to-board connector cutting, detecting and packaging method in Embodiment 1. Refer to Figure 2, including a frame 1, and a material tray module 2 connected to the frame 1, a feeding mechanism 3, a glue pressing mechanism 4, an appearance inspection module, a cutting mechanism 6, a material shifting mechanism 7, a short-circuit voltage detection module, a pin detection module, a defective product elimination mechanism, and a packaging mechanism 8.

[0082] Reference Figure 3 The feeding mechanism 3 inserts the positioning pin into the insertion hole of the material belt to move the material belt forward. Specifically, the feeding mechanism 3 includes a belt-carrying toothed disc 301 and a belt-carrying power source 302 that drives the belt-carrying toothed disc 301 to rotate, wherein the belt-carrying toothed disc 301 is rotatably connected to the frame 1 and has a positioning pin that can be inserted into the insertion hole of the material belt.

[0083] Reference Figure 4 , Figure 5 The glue pressing mechanism 4 drives the lower pressing die 405 and the upper top die 404 to press the connector at the same time through the glue pressing cam 401 to level the size of the glue injection outside the connector. Specifically, the glue pressing mechanism 4 includes a glue pressing cam 401, an upper swing rod assembly 402, a lower swing rod assembly 403, a lower pressing die 405 and an upper top film.

[0084] The glue pressing cam 401 is rotatably connected to the frame 1, and is used to press and drive the upper swing arm assembly 402 and the lower swing arm assembly 403 to move respectively. The upper swing arm assembly 402 is rotatably connected to the frame 1, and is connected to the glue pressing cam 401. The glue pressing cam 401 drives the lower pressing die 405 to move up and down. The lower swing arm assembly 403 is rotatably connected to the frame 1, and is connected to the glue pressing cam 401. The glue pressing cam 401 drives the upper ejection die 404 to move up and down. The lower ejection die 405 and the upper ejection film are connected to the frame 1, and are driven by the glue pressing cam 401 to press the connector or stay away from the connector at the same time.

[0085] Reference Figure 6 The appearance detection module obtains the appearance image of the connector, detects the appearance dimensions of the product through image recognition, and determines whether it meets the appearance detection standard. Specifically, the appearance detection module includes a 45-degree appearance detection component 51 and a vertical appearance detection component 52.

[0086] Reference Figure 7 , Figure 8 The cutting mechanism 6 is used for linkage cutting of three stations: first cutting the hardware of the connector, then cutting the pins of defective products so that the defective products fall into the waste mobile phone box, and finally cutting the pins of good products.

[0087] Specifically, the cutting mechanism 6 includes a support plate 66 , and also includes a cam driving assembly 61 , a hardware cutting assembly 62 , a defective pin cutting assembly 63 , a good pin cutting assembly 64 , and a transmission control assembly 65 installed on the support plate 66 .

[0088] Among them, the cam drive assembly 61 drives the fitting cutting assembly 62, the defective pin cutting assembly 63, and the non-defective pin cutting assembly 64 to perform cutting actions simultaneously. The fitting cutting assembly 62 cuts the fittings of all the conveyed connectors driven by the cam drive assembly 61. The defective pin cutting assembly 63 cuts the pins of defective products driven by the cam drive assembly 61. The non-defective pin cutting assembly 64 cuts the pins of non-defective products driven by the cam drive assembly 61. The transmission control assembly 65 is used to control whether the driving force of the cam is transmitted to the defective pin cutting assembly 63.

[0089] Furthermore, the defective pin cutting assembly 63 includes a cutting swing rod 631, a cutting pressure head assembly 632, and a defective pin cutting die 633. The cutting swing rod 631 is rotatably connected to the frame 1 and swings under the pressing of the cam drive assembly 61. The cutting pressure head assembly 632 is slidably connected to the support plate 66 and moves up and down under the pressing of the swing rod. The defective pin cutting die 633 is connected to the frame 1 and cuts the pins of defective products when the cutting pressure head assembly 632 presses down.

[0090] Furthermore, the transmission control assembly 65 includes a connecting block 651 and a pushing air cylinder 652. The connecting block 651 is slidably connected to the swing rod and can press against the cam assembly to drive the swing rod to swing. The pushing air cylinder 652 is connected to the swing rod and is used to push the connecting block 651 to press against the cam for linkage.

[0091] The material feeding mechanism 7 is used to sequentially feed non-defective products to each detection position. The short-circuit voltage detection module is used to detect whether the pins are short-circuited and perform a withstand voltage test on the connectors. The pin detection module detects whether the pin dimensions and pin flatness meet the detection standards through image recognition. The defective product removal mechanism is used to remove defective products. The packaging mechanism 8 packs non-defective products.

[0092] The above is only the preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions falling within the idea of the present invention belong to the protection scope of the present invention. It should be noted that for those of ordinary skill in the art, several improvements and refinements made without departing from the principle of the present invention should also be regarded as within the protection scope of the present invention.

Claims

1. A method for cutting, detecting and packaging a board-to-board connector, characterized in that: Including Insert the positioning pin into the tape jack and move the tape forward for precise feeding. Drive the lower pressing die (405) and the upper pressing die (404) to press the connector simultaneously through the glue pressing cam (401) to flatten the size of the glue injection outside the connector. Obtain the appearance image of the connector, detect the appearance size of the product through image recognition, and determine whether it meets the appearance detection standard. First cut the metal fittings of the connector, then cut the pins of the defective products, remove the defective products from the tape, and then cut the pins of the qualified products and continue to convey the qualified products. The material shifting mechanism (7) sequentially shifts the qualified products to the detection positions for pin short circuit detection, withstand voltage detection, pin size detection, and pin flatness detection. When any of the above detections does not meet the detection standard, the defective products are removed through the defective product elimination mechanism, and the qualified products are packed through the packaging mechanism (8).

2. The board-to-board connector cutting detection and packaging method according to claim 1, wherein: It also includes when the tape enters Sequentially detect whether the passing tape carries a connector. When there is a tape that does not carry a connector, the subsequent detections automatically skip the tape without a connector.

3. The board-to-board connector cutting detection and packaging method according to claim 1, characterized in that: It also includes when the tape carries a connector Detect whether the thickness of the metal fitting exceeds the preset standard. When the thickness of the metal fitting exceeds the preset standard, stop the detection and report an abnormality.

4. A board-to-board connector cutting, detecting and packaging device, characterized in that: Including the frame (1), it also includes the Feeding mechanism (3), insert the positioning pin into the tape jack and move the tape forward; the feeding mechanism (3) includes a tape carrying gear disk (301), rotatably connected to the frame (1), having a positioning pin that can be inserted into the tape jack; a tape carrying power source (302) that drives the tape carrying gear disk (301) to rotate. Glue pressing mechanism (4), drive the lower pressing die (405) and the upper pressing die (404) to press the connector simultaneously through the glue pressing cam (401) to flatten the size of the glue injection outside the connector. Appearance detection module, obtain the appearance image of the connector, detect the appearance size of the product through image recognition, and determine whether it meets the appearance detection standard. Cutting mechanism (6), used for the linkage cutting of three stations: first cut the metal fittings of the connector, then cut the pins of the defective products to make the defective products fall into the waste collection box, and finally cut the pins of the qualified products. Material shifting mechanism (7), sequentially shift the qualified products to each detection position. Short circuit voltage detection module, used to detect whether the pins are short circuited and perform a withstand voltage test on the connector. Pin detection module, detect whether the pin size and pin flatness meet the detection standard through image recognition. Defective product elimination mechanism, used to remove the defective products. Packaging mechanism (8), pack the qualified products.

5. The board-to-board connector cutting, detecting and packaging device according to claim 4, characterized in that: The glue pressing mechanism (4) includes Glue pressing cam (401), rotatably connected to the frame (1), used to press and drive the upper swing rod assembly (402) and the lower swing rod assembly (403) to act respectively. Upper swing rod assembly (402), rotatably connected to the frame (1), connected to the glue pressing cam (401), and driven by the glue pressing cam (401) to drive the lower pressing die (405) to move up and down. Lower swing rod assembly (403), rotatably connected to the frame (1), connected to the glue pressing cam (401), and driven by the glue pressing cam (401) to drive the upper pressing die (404) to move up and down. The lower pressing die (405) and the upper ejecting die (404) are connected to the frame (1) and are driven by the pressure rubber cam (401) to press against the connector or move away from the connector simultaneously.

6. The board-to-board connector cutting, detecting and packaging device according to claim 4, wherein: The cutting mechanism (6) includes a support plate (66), and also includes a cam driving assembly (61) which drives the metal fitting cutting assembly (62), the defective pin cutting assembly (63), and the non-defective pin cutting assembly (64) to perform cutting operations simultaneously; the metal fitting cutting assembly (62) which cuts the metal fittings of all the conveyed connectors driven by the cam driving assembly (61); the defective pin cutting assembly (63) which cuts the pins of defective products driven by the cam driving assembly (61); the non-defective pin cutting assembly (64) which cuts the pins of non-defective products driven by the cam driving assembly (61); a transmission control assembly (65) which is used to control whether the driving force of the cam is transmitted to the defective pin cutting assembly (63).

7. The board-to-board connector cutting, detecting and packaging equipment according to claim 6, characterized in that: The defective pin cutting assembly (63) includes a cutting swing rod (631) which is rotatably connected to the frame (1) and is pressed by the cam driving assembly (61) to swing; a cutting pressure head assembly (632) which is slidably connected to the support plate (66) and moves up and down under the pressure of the swing rod; a defective pin cutting die (633) which is connected to the frame (1) and cuts the pins of defective products when the cutting pressure head assembly (632) presses down.

8. The board-to-board connector cutting, detecting and packaging device according to claim 7, characterized in that: The transmission control assembly (65) includes a connecting block (651) which is slidably connected to the cutting swing rod (631) and can press against the cam assembly to drive the cutting swing rod (631) to swing; a pushing air cylinder (652) which is connected to the cutting swing rod (631) and is used to push the connecting block (651) to press against the cam for linkage.

Citation Information

Patent Citations

  • Full automatic production line of board to board (BTB) connector

    CN103022850A

  • Automatic production equipment for FPC connectors

    CN105470781A

  • Automatic detect guillootine

    CN207103549U

  • Board-to-board connector cutting, detecting and packaging equipment

    CN214639459U