Integrated system for making semiconductor devices

Abstract

The present disclosure relates to an integrated system for manufacturing semiconductor devices, which includes a first carrier cassette, an equipment front end module connected to the first carrier cassette, a first chamber connected to the equipment front end module, and a cutting module connected to the first chamber. The cutting module includes a dry film supply unit providing a dry film, a cutting unit cutting the dry film, and a film suction unit collecting the cut dry film. The first chamber includes a first cavity movable between the cutting module and the first chamber, and a second cavity movable within the first cavity.

Description

Technical Field

[0001] This disclosure relates to an integrated system and a film-coating method for fabricating semiconductor devices, particularly a film-coating process for semiconductor packaging. Background Technology

[0002] In semiconductor packaging processes, the common practice for attaching dry film to a panel is as follows: clamp the front edge of the panel with a jig, use rollers to flatten the uncutable dry film on the panel, then cut the dry film at the rear edge of the panel with a cutter, and then continue to use rollers to flatten the cut but not yet flattened portion of the dry film onto the panel. Summary of the Invention

[0003] In the traditional dry film bonding process, after the dry film is flattened on the panel, the cutter will cut the dry film in the air. When cutting the dry film, some particles will inevitably be generated, and these particles will fall onto the panel and / or the dry film. As a result, when the dry film is pressed to the panel later, air bubbles will be generated between the dry film and the panel due to these particles.

[0004] This disclosure relates to an integrated system and film application method for semiconductor devices, which can solve the problem of air bubbles being generated after lamination due to the falling of microparticles from cutting the dry film onto the dry film and / or panel.

[0005] One aspect of this disclosure relates to a film-applying apparatus for semiconductor devices, the apparatus comprising a dry film supply unit, a cutting unit, a movable first cavity, and a movable film-suction unit. The dry film supply unit provides dry film, and the cutting unit cuts the dry film supplied by the dry film supply unit. The first cavity can be used to hold a panel and is movable between a first position and a second position. The film-suction unit collects the dry film cut by the cutting unit and is movable between a third position and a fourth position, wherein the fourth position corresponds to the first position of the first cavity.

[0006] Another aspect of this disclosure relates to a film application method for a semiconductor device, the film application method comprising: providing a dry film; providing a cutting unit to cut the dry film into a predetermined size using the cutting unit; providing a film suction unit capable of collecting the dry film cut into the predetermined size; moving the film suction unit to simultaneously move the dry film cut into the predetermined size and place the dry film cut into the predetermined size collected by the film suction unit onto a panel.

[0007] Another aspect of this disclosure relates to an integrated system for a semiconductor device, the system comprising a first carrier cassette, an equipment front-end module connected to the first carrier cassette, a first chamber connected to the equipment front-end module, and a dicing module connected to the first chamber. The dicing module includes a dry film supply unit for supplying dry film, a dicing unit for dicing the dry film supplied from the dry film supply unit, and a movable suction unit for collecting the dry film diced by the dicing unit. The first chamber includes a first cavity movable between the dicing module and the first chamber, and a second cavity movable within the first chamber.

[0008] Other aspects and embodiments of this disclosure are also anticipated. The foregoing summary and the following detailed description are not intended to limit this disclosure to any particular embodiment, but are merely intended to describe some embodiments of this disclosure. Attached Figure Description

[0009] To better understand the nature and objectives of some embodiments of this disclosure, reference is made to the following detailed description taken in conjunction with the accompanying drawings. In the drawings, similar reference numerals denote similar elements unless the context clearly specifies otherwise.

[0010] Figure 1 This is a schematic diagram of an integrated system of semiconductor devices according to some embodiments of this disclosure.

[0011] Figure 2 This is a schematic diagram of the first chamber and dicing module of the integrated system of the semiconductor device according to an embodiment of the present disclosure.

[0012] Figure 3A , 3B Figures 3C, 3D, 3E, and 3F are operational schematic diagrams of the first chamber and dicing module of the integrated system of a semiconductor device according to some embodiments of this disclosure.

[0013] Figure 4 This is a schematic diagram of the second chamber and dicing module of an integrated system for a semiconductor device according to some embodiments of this disclosure.

[0014] Figure 5A , 5B Figures 5C, 5D, 5E, and 5F are operational schematic diagrams of the second chamber and dicing module of the integrated system of a semiconductor device according to some embodiments of this disclosure.

[0015] Figure 6 This is a die-pressing flowchart of an integrated system for a semiconductor device according to some embodiments of this disclosure.

[0016] Figure 7 This is a schematic diagram of an integrated system of semiconductor devices according to some embodiments of this disclosure.

[0017] Figure 8 This is a schematic diagram of the first chamber and dicing module of the integrated system of the semiconductor device according to an embodiment of the present disclosure.

[0018] Figure 9A , 9B Figures 9C, 9D, 9E, and 9F are operational schematic diagrams of the first chamber and dicing module of the integrated system of a semiconductor device according to some embodiments of this disclosure.

[0019] Figure 10 This is a schematic diagram of the second chamber and dicing module of an integrated system for a semiconductor device according to some embodiments of this disclosure.

[0020] Figure 11A , 11B 11C, 11D, 11E, and 11F are schematic diagrams of the operation of the second chamber and dicing module of the integrated system of a semiconductor device according to some embodiments of this disclosure.

[0021] Figure 12 This is a die-pressing flowchart of an integrated system for a semiconductor device according to some embodiments of this disclosure. Detailed Implementation

[0022] Figure 1 This is a schematic diagram of an integrated system 1 of semiconductor devices according to some embodiments of this disclosure. Figure 1 As shown, the integrated system 1 of the semiconductor device includes a first cassette 11, a second cassette 12, an equipment front end module (EFEM) 13, a first chamber 14, a second chamber 15, and a dicing module 16. The first and second cassettes 11 and 12 are connected to the EFEM 13, which in turn is connected to the first and second chambers 14 and 15. The first and second chambers 14 and 15 are connected to the dicing module 16. Furthermore, the first and second chambers 14 and 15 are arranged side-by-side, such that one side of each chamber is connected to the EFEM 13, while the other side is connected to the dicing module 16. This significantly reduces the overall volume of the integrated system 1, particularly its overall length.

[0023] When a user wants to use the integrated system 1 of the semiconductor equipment, the user can place the panel to be laminated on the first carrier cassette 11 and / or the second carrier cassette 12. The equipment front-end module 13 can move the panel placed on the first carrier cassette 11 and / or the second carrier cassette 12 to the first chamber 14 and / or the second chamber 15 for dry film lamination. After the dry film is laminated onto the panel, the equipment front-end module 13 can move the panel that has been laminated with the dry film from the first chamber 14 and / or the second chamber 15 to the first carrier cassette 11 and / or the second carrier cassette 12. The user can then retrieve the panel that has been laminated with the dry film from the first carrier cassette 11 and / or the second carrier cassette 12. As can be seen from the above, the integrated system 1 of the semiconductor equipment only requires a single equipment front-end module 13 to complete the entire lamination process, thus significantly reducing the cost of the integrated system 1 of the semiconductor equipment. Furthermore, users can place panels to be dry-film pressed at the first carrier cassette 11 and / or the second carrier cassette 12, and can also retrieve panels that have already been dry-film pressed at the first carrier cassette 11 and / or the second carrier cassette 12, thus greatly simplifying the overall workflow. Generally, integrated systems use a front-end equipment module to transfer panels from the carrier cassette to the film-applying module. After the panel is film-applied, another front-end equipment module is used to transfer the panel to another carrier cassette. In this way, not only are two front-end equipment modules required, but panels also need to be placed into and retrieved from the system at both ends, making the system more complex and requiring more space to accommodate it.

[0024] As described above, the front-end module 13 can move the panel placed on the first carrier cartridge 11 and / or the second carrier cartridge 12 to the first chamber 14 and / or the second chamber 15 for dry film lamination. The following is a further explanation of how the first chamber 14 and the second chamber 15 cooperate with the cutting module 16 to complete the process of laminating the dry film onto the panel.

[0025] Figure 2 This is a schematic diagram of the first chamber 14 and the dicing module 16 of an integrated system 1 of a semiconductor device according to some embodiments of this disclosure. Figure 2As shown, the first chamber 14 has an upper chamber 141 that is substantially vertically movable within the first chamber 14. The upper chamber 141 has an airbag contact surface 142, and also has a support member 144 for supporting a PE protective film 143 for protecting the airbag contact surface 142. Furthermore, the first chamber 14 has a lower chamber 145 that is movable between the first chamber 14 and the cutting module 16. The lower chamber 145 has a download tray 146 thereon and a vacuum suction device 149. When the front-end module 13 moves the panel to be dry-film pressed from the first carrier cassette 11 or the second carrier cassette 12 into the first chamber 14, the panel will be placed on the download tray 146 of the lower chamber 145. When the panel is placed on the download tray 146 of the lower chamber 145, the vacuum suction device 149 can operate to flatten and adsorb the panel onto the download tray 146, thus reducing unnecessary warping of the panel in subsequent processes.

[0026] Also, see reference Figure 2 The cutting module 16 may include a dry film roller 161, a cover film roller 162, a waste film roller 163, a rotary cutter cylinder 165, and a receiving cylinder 167. Dry film 50 can be loaded onto dry film roller 161, and dry film 50 has dry film body 51 and cover film 52 attached to dry film body 51; cover film roller 162 is used to load the cover film 52 to be peeled off from dry film 50, and roller drum 165 is used to cut the dry film body 51 that no longer has cover film 52 attached, and the dry film body cut by roller drum 165 can be loaded into receiving drum 167. In addition, waste film 53 cut by roller drum 165 but not loaded into receiving drum 167 will be recycled by waste film roller 163; furthermore, conveyor rollers 1611 and 1612 are used to assist in feeding dry film 50 from dry film roller 161, conveyor roller 1621 is used to assist in conveying cover film 52 to cover film roller 162, and conveyor roller 1631 is used to assist in conveying waste film 53 to waste film roller 163, such as Figure 2 As shown, when the dry film 50 passes through the conveyor rollers 1612 and 1621, the dry film body 51 and the cover film 52 separate from each other. The dry film body 51 is continuously conveyed to the rotary cutter 165, while the cover film 52 is conveyed to the cover film roller 162. The dry film rollers 161 and 162 can be considered as dry film supply units providing the dry film 50, and the waste film roller 163 can be considered as a waste film recycling unit for recovering the waste film 53. Therefore, the rotary cutter 165 can be considered as a cutting unit, especially as... Figure 2As shown, the cutting unit is located between the dry film supply unit and the waste film recycling unit. Furthermore, the roller drum 165 is located on the lower side of the dry film body 51 and has a negative pressure device 169; when the roller drum 165 cuts the dry film body 51, the particles generated from the cutting of the dry film body 51 can be directly sucked away by the negative pressure device 169; in this way, the chance of particles falling onto the dry film body cut by the roller drum 165 can be greatly reduced.

[0027] Figure 3A , 3B Figures 3C, 3D, 3E, and 3F are operational schematic diagrams of the first chamber 14 and the dicing module 16 of the integrated system 1 of a semiconductor device according to some embodiments of this disclosure. (See reference...) Figure 3A As previously described, the front-end module 13 can move the panel 17 from the first carrier cartridge 11 or the second carrier cartridge 12 into the first chamber 14. The panel 17 moved into the first chamber 14 is then placed on the download tray 146 of the lower chamber 145. Simultaneously, the vacuum suction device 149 can flatly adhere the panel 17 to the download tray 146. (Reference) Figure 3B After the panel 17 is placed on the download disk 146 of the lower cavity 145, the lower cavity 145 can be moved from the first chamber 14 to a position in the cutting module 16, thereby moving the panel 17 from the first chamber 14 to the cutting module 16; simultaneously, the receiving cylinder 167 is located at the position corresponding to the hobbing cylinder 165. (See reference) Figure 3C The dry film roller 161 begins to rotate to supply dry film 50 to the rotary cutter drum 165 via the guide rollers 1611 and 1612. At the same time, the cover film roller 162 begins to collect the cover film 52 peeled off from the dry film 50 via the guide roller 1621, and the dry film body 51 after the cover film 52 has been peeled off is supplied toward the rotary cutter drum 165. When the dry film body 51 passes above the rotary cutter drum 165, the rotary cutter drum 165 begins to cut the dry film body 51. Since the receiving drum 167 is located at the position corresponding to the rotary cutter drum 165, the dry film body 51' cut by the rotary cutter drum 165 is simultaneously loaded onto the receiving drum 167, while the waste film 53 cut by the rotary cutter drum 165 but not loaded onto the receiving drum 167 is loaded and recycled by the waste film roller 163 via the guide roller 1631. In addition, as previously mentioned, when the rotary cutter 165 cuts the dry film body 51, the negative pressure device 169 will operate simultaneously to suck away the particles generated by cutting the dry film body 51, so as to reduce the chance of particles falling onto the cut dry film body 51'.

[0028] like Figure 3DAs shown, after the receiving cylinder 167 loads the cut dry film body 51', the receiving cylinder 167 moves to the position of the lower cavity 145 and places the cut dry film body 51' loaded on the receiving cylinder 167 onto the panel 17 supported by the lower cavity 145. (Reference) Figure 3E After the receiving cylinder 167 places the cut dry film body 51' onto the panel 17 supported by the lower cavity 145, the receiving cylinder 167, which is not loaded with any dry film body 51', can return to its original position corresponding to the roller cylinder 165.

[0029] Subsequently, as Figure 3F As shown, the lower cavity 145 returns to the first chamber 14, and simultaneously moves the panel 17, on which the cut dry film body 51' is placed, into the first chamber 14. The lower cavity 145 is located approximately below the upper cavity 141. After the lower cavity 145 moves the panel 17, on which the cut dry film body 51' is placed, back into the first chamber 14, the interior of the first chamber 14 is evacuated until below 1 Torr. After the interior of the first chamber 14 is evacuated to below 1 Torr, the upper cavity 141 moves vertically downward to press the cut dry film body 51' placed on the panel 17 against the panel 17. After the first chamber 14 is evacuated to below 1 Torr, the air between the panel 17 and the download disk 146 and between the panel 17 and the dry film body 51' can be completely removed. In this way, the panel 17 can be more flat against the download disk 146, and the dry film body 51' can be more flat against the panel 17. When the upper chamber 141 is pressed, unwanted air bubbles can be avoided between the panel 17 and the dry film body 51'.

[0030] Subsequently, as previously described, the pressed dry film body 51' and panel 17 are selectively moved from the first chamber 14 to the first carrier cartridge 11 or the second carrier cartridge 12 via the equipment front-end module 13, and the user can collect the panel 17 that has been pressed with the dry film at the first carrier cartridge 11 or the second carrier cartridge 12.

[0031] Based on the above, it can be understood that the first chamber 14 and the cutting module 16 mainly perform the process of pressing the dry film 50 onto the panel 17, while the first carrier cassette 11, the second carrier cassette 12, and the equipment front-end module 13 are mainly used to transfer the panel 17 into the first chamber 14 and the cutting module 16 for the dry film pressing process, and to transfer the panel 17 after the dry film pressing process has been completed out. Therefore, the components and structure of the first chamber 14 and the cutting module 16 can be regarded as a device for semiconductor film bonding.

[0032] Furthermore, Figure 4 This is a schematic diagram of the second chamber 15 and the dicing module 16 of an integrated system 1 of a semiconductor device according to some embodiments of this disclosure. Figure 4As shown, the second chamber 15 has an upper chamber 151, which is generally vertically movable within the second chamber 15. The upper chamber 151 has an airbag contact surface 152, and also has a support member 154 for supporting a PE protective film 153 for protecting the airbag contact surface 152. Furthermore, the second chamber 15 has a lower chamber 155, which is movable between the second chamber 15 and the cutting module 16. The lower chamber 155 has a download tray 156 thereon and a vacuum suction device 159. When the front-end module 13 moves the panel to be dry-film pressed from the first carrier cassette 11 or the second carrier cassette 12 into the second chamber 15, the panel will be placed on the download tray 156 of the lower chamber 155. When the panel is placed on the download tray 156 of the lower chamber 155, the vacuum suction device 159 can operate to flatly adhere the panel to the download tray 145, thereby reducing unnecessary warping of the panel in subsequent processes.

[0033] Also, regarding Figure 4 The cutting module 16 shown, including its components and connections, has been described in detail below. Figure 2 As stated in the explanation, it will not be repeated here.

[0034] Figure 5A , 5B Figures 5C, 5D, 5E, and 5F are operational schematic diagrams of the second chamber 15 and the dicing module 16 of the integrated system 1 of a semiconductor device according to some embodiments of this disclosure. (See reference...) Figure 5A As previously described, the front-end module 13 can move the panel 18 from the first carrier cartridge 11 or the second carrier cartridge 12 into the second chamber 15. The panel 18 moved into the second chamber 15 is then placed on the download tray 156 of the lower chamber 155. Simultaneously, the vacuum suction device 159 can flatly adhere the panel 18 to the download tray 156. (Reference) Figure 5B After the panel 18 is placed on the download disk 156 of the lower cavity 155, the lower cavity 155 can be moved from the second chamber 15 to a position in the cutting module 16, thereby moving the panel 18 from the second chamber 15 to the cutting module 16; simultaneously, the receiving cylinder 167 is positioned corresponding to the hobbing cylinder 165. (See reference) Figure 5CThe dry film roller 161 begins to rotate to supply dry film 50 to the cutter drum 165 via the guide rollers 1611 and 1612. At the same time, the cover film roller 162 begins to collect the cover film 52 peeled off from the dry film 50 via the guide roller 1621, while the dry film body 51 after the cover film 52 has been peeled off is supplied toward the cutter drum 165. When the dry film body 51 passes above the cutter drum 165, the cutter drum 165 begins to cut the dry film body 51. Since the receiving drum 167 is located at the position corresponding to the cutter drum 165, the dry film body 51 cut by the cutter drum 165 is simultaneously loaded onto the receiving drum 167; while the waste film 53 cut by the cutter drum 165 but not loaded onto the receiving drum 167 is loaded and recycled by the waste film roller 163 via the guide roller 1631. In addition, as previously mentioned, when the rotary cutter 165 cuts the dry film body 51, the negative pressure device 169 will operate simultaneously to suck away the particles generated by cutting the dry film body 51, so as to reduce the chance of particles falling onto the cut dry film body 51.

[0035] like Figure 5D As shown, after the receiving cylinder 167 loads the cut dry film body 51, the receiving cylinder 167 moves to the position of the lower cavity 155 and places the cut dry film body 51' loaded on the receiving cylinder 167 onto the panel 18 supported by the lower cavity 155. (Reference) Figure 5E After the receiving cylinder 167 places the cut dry film body 51' onto the panel 18 supported by the lower cavity 155, the receiving cylinder 167, which is not loaded with any dry film body 51', can return to its original position corresponding to the roller cylinder 165.

[0036] Subsequently, as Figure 5F As shown, the lower cavity 155 returns to the second chamber 15, and simultaneously moves the panel 18 containing the cut dry film body 51' into the second chamber 15, where the lower cavity 155 is approximately located below the upper cavity 151. After the lower cavity 155 moves the panel 18 containing the cut dry film body 51' back to the second chamber 15, the interior of the second chamber 15 is evacuated to below 1 Torr. After the interior of the second chamber 15 is evacuated to below 1 Torr, the upper cavity 151 moves vertically downward to press the cut dry film body 51' placed on the panel 18 against the panel 18. After the interior of the second chamber 15 is evacuated to below 1 Torr, the air between the panel 18 and the download tray 156 and between the panel 18 and the dry film body 51' can be completely removed. In this way, the panel 18 can be more flat against the download tray 156, and the dry film body 51' can be more flat against the panel 18. When the upper chamber 151 is pressed, unwanted air bubbles can be avoided between the panel 18 and the dry film body 51'.

[0037] Subsequently, as previously described, the pressed dry film body 51' and panel 18 will be moved from the second chamber 15 to the first carrier cassette 11 or the second carrier cassette 12 via the equipment front-end module 13, and the user can collect the panel 18 that has completed the dry film pressing process at the first carrier cassette 11 or the second carrier cassette 12.

[0038] Based on the above, it can be understood that the second chamber 15 and the cutting module 16 mainly perform the process of laminating the dry film 50 onto the panel 18, while the first carrier cassette 11, the second carrier cassette 12, and the equipment front-end module 13 are mainly used to transfer the panel 18 into the second chamber 15 and the cutting module 16 for the dry film lamination process, and to transfer the panel 18 that has completed the dry film lamination process out. Therefore, the components and structure of the second chamber 15 and the cutting module 16 can be regarded as a device for semiconductor film lamination.

[0039] Figure 6 A lamination process for an integrated system 1 of semiconductor devices using some embodiments of this disclosure. Figure 2 In step 21, the user can place panel 17 into the first carrier cassette 11 and panel 18 into the second carrier cassette 12. In step 22, the equipment front-end module 13 can move panel 17 from the first carrier cassette 11 into the first chamber 14. In step 23, the lower chamber 145 of the first chamber 14 can move panel 17 to the cutting module 16 for placing the dry film body 51' onto panel 17. In step 24, the equipment front-end module 13 can move panel 18 from the second carrier cassette 12 into the second chamber 15. Steps 23 and 24 can be performed approximately simultaneously. In step 25, the lower chamber 145 can move panel 17, with the dry film body 51' already placed on it, into the first chamber 14, and the upper chamber 141 of the first chamber 14 can perform a pressing operation on the dry film body 51' and panel 17. In step 26, the lower cavity 155 of the second chamber 15 can move the panel 18 to the cutting module 16 for placing the dry film body 51' onto the panel 18. Steps 25 and 26 can be performed approximately simultaneously. In step 27, the front-end module 13 can move the pressed panel 17 from the first chamber 14 to the first carrier cassette 11 for the user to retrieve. In step 28, the lower cavity 155 can move the panel 18 with the dry film body 51' placed on it into the second chamber 15, and the upper cavity 151 of the second chamber 15 can perform pressing operations on the dry film body 51' and the panel 18. Steps 25 and 26 can be performed approximately simultaneously. In step 29, the front-end module 13 can move the pressed panel 18 from the second chamber 15 to the second carrier cassette 12 for the user to retrieve.

[0040] Depend onFigure 6 The film pressing process shown Figure 2 It is understood that when using the integrated system 1 of semiconductor equipment for the lamination process, it is not necessary to wait for the panel 17 to complete the lamination process before performing the lamination process of the panel 18. The lamination process can be performed alternately using the first chamber 14 and the second chamber 15. For example, when the panel 17 returns to the first chamber 14 for lamination after the dry film body 51' is placed on the panel 17 in the cutting module 16 (step 25), the panel 18 is moved from the second chamber 15 to the cutting module to perform the operation of placing the dry film body 51' on the panel 18 (step 26). In this way, the efficiency of panel lamination can be greatly improved.

[0041] Figure 7 This is a schematic diagram of an integrated system 3 of a semiconductor device according to some embodiments of this disclosure. Figure 7 As shown, the integrated system 1 of the semiconductor device includes a first carrier cartridge 31, a second carrier cartridge 32, an equipment front-end module (EFEM) 33, a first chamber 34, a second chamber 35, and a dicing module 36. The first carrier cartridge 31 and the second carrier cartridge 32 are connected to the equipment front-end module 33, which is connected to the first chamber 34 and the second chamber 35. The first chamber 34 and the second chamber 35 are connected to the dicing module 36. Furthermore, the first chamber 34 and the second chamber 35 are arranged side-by-side, such that one side of each chamber is connected to the equipment front-end module 33, while the other side is connected to the dicing module 36. This significantly reduces the overall volume of the integrated system 3, particularly its overall length.

[0042] When a user wants to use the integrated system 3 of the semiconductor equipment, the user can place the panel to be laminated on the first carrier cassette 31 and / or the second carrier cassette 32. The equipment front-end module 33 can move the panel placed on the first carrier cassette 31 and / or the second carrier cassette 32 to the first chamber 34 and / or the second chamber 35 for dry film lamination. After the dry film is laminated onto the panel, the equipment front-end module 33 can move the panel that has been laminated with the dry film from the first chamber 34 and / or the second chamber 35 to the first carrier cassette 31 and / or the second carrier cassette 32. The user can then retrieve the panel that has been laminated with the dry film from the first carrier cassette 31 and / or the second carrier cassette 32. As can be seen from the above, the integrated system 3 of the semiconductor equipment only requires a single equipment front-end module 33 to complete the entire lamination process, thus significantly reducing the cost of the integrated system 3 of the semiconductor equipment. In addition, users can place the panel to be dry-film pressed at the first carrier cassette 31 and / or the second carrier cassette 32, and can also retrieve the panel that has been dry-film pressed at the first carrier cassette 31 and / or the second carrier cassette 32, which greatly simplifies the overall workflow.

[0043] As described above, the front-end module 33 can move the panel placed on the first carrier cartridge 31 and / or the second carrier cartridge 32 to the first chamber 34 and / or the second chamber 35 for dry film lamination. The following further explains how the first chamber 34 and the second chamber 35 cooperate with the cutting module 36 to complete the process of laminating the dry film onto the panel.

[0044] Generally, an integrated system uses a front-end equipment module to transfer the panel from the carrier cassette to the film-applying module. After the panel is film-applied, another front-end equipment module is used to transfer the panel to another carrier cassette. This requires two front-end equipment modules, and panels need to be placed into and retrieved from the system at both ends, making the system more complex and requiring more space to accommodate it.

[0045] Figure 8 This is a schematic diagram of the first chamber 34 and the dicing module 36 of the integrated system 3 of a semiconductor device according to some embodiments of this disclosure. Figure 8As shown, the first chamber 34 has an upper chamber 341, which is generally vertically movable within the first chamber 34. The upper chamber 341 has an airbag contact surface 342. In addition, there is a support member 344 for supporting a PE protective film 343 for protecting the airbag contact surface 342. Furthermore, the first chamber 34 has a lower chamber 345, which is movable between the first chamber 34 and the cutting module 36. The lower chamber 345 has a download tray 346 thereon and a vacuum suction device 349. When the front-end module 33 moves the panel to be dry-film pressed from the first carrier cassette 31 or the second carrier cassette 32 into the first chamber 34, the panel will be placed on the download tray 346 of the lower chamber 345. When the panel is placed on the download tray 346 of the lower chamber 345, the vacuum suction device 349 can operate to flatten and adsorb the panel onto the download tray 346, thus reducing unnecessary warping of the panel in subsequent processes.

[0046] Also, see reference Figure 8 The cutting module 36 may include a dry film roller 361, a cover film roller 362, a waste film roller 363, a rotary cutter 365, and a film suction component 367. Dry film 50 can be loaded onto dry film roller 361, and dry film 60 has dry film body 61 and cover film 62 attached to dry film body 61; cover film roller 362 is used to load the cover film 62 that will be peeled off from dry film 60, and cutting blade assembly 365 is used to cut the dry film body 61 that no longer has cover film 62 attached, and the dry film body 61 cut by cutting blade assembly 365 can be loaded by film suction member 367. In addition, waste film 63 cut by cutting blade assembly 365 but not loaded by film suction member 367 will be recycled by waste film roller 363; furthermore, conveying roller 3611 is used to assist in feeding dry film 50 out of dry film roller 161, conveying rollers 3621 and 3622 are used to assist in conveying cover film 62 to cover film roller 362, and conveying roller 3631 is used to assist in conveying waste film 63 to waste film roller 363, such as Figure 2 As shown, when the dry film 60 passes through the conveyor roller 3622, the dry film body 61 and the cover film 652 separate from each other. The dry film body 61 is continuously conveyed to the cutting blade assembly 365, while the cover film 62 is conveyed to the cover film roller 362. The dry film roller 361 and the cover film roller 362 can be considered as a dry film supply unit providing the dry film 60, and the waste film roller 363 can be considered as a waste film recycling unit for recovering the waste film 63. Therefore, the cutting blade assembly 365 can be considered as a cutting unit, especially as... Figure 8As shown, the cutting unit is located between the dry film supply unit and the waste film recycling unit. Furthermore, the cutting blade assembly 365 is located on the lower side of the dry film body 61 and has a negative pressure device 369; when the cutting blade assembly 365 cuts the dry film body 61, the particles generated from the cutting of the dry film body 61 can be directly sucked away by the negative pressure device 369, thus greatly reducing the chance of particles falling onto the dry film body 61 cut by the cutting blade assembly 365. Furthermore, the cutting blade assembly 365 may consist of four blades (not shown), which are configured to move in parallel pairs. Thus, the cutting blade assembly 365 can cut the dry film body 61 into a rectangular shape. Also, the film suction member 367 may have a plane 368, so the film suction member 367 can use its plane 368 to carry the dry film body cut into a rectangular shape by the cutting blade assembly 365. Moreover, when the film suction member 367 uses its plane 368 to carry the dry film body cut into a rectangular shape by the cutting blade assembly 365, the tension of the cut dry film can be maintained.

[0047] Figure 9A , 9B Figures 9C, 9D, 9E, and 9F are operational schematic diagrams of the first chamber 34 and the dicing module 36 of the integrated system 3 of the semiconductor device according to some embodiments of this disclosure. (See reference...) Figure 9A As previously described, the front-end module 33 can move the panel 37 from the first carrier cartridge 31 or the second carrier cartridge 32 into the first chamber 34. The panel 37 moved into the first chamber 34 is then placed on the download tray 346 of the lower chamber 345. Simultaneously, the vacuum suction device 349 can flatly adhere the panel 37 to the download tray 346. (Reference) Figure 9B After the panel 37 is placed on the download disk 346 of the lower cavity 345, the lower cavity 345 can be moved from the first chamber 34 to a position in the cutting module 36, thereby moving the panel 37 from the first chamber 34 to the cutting module 36; simultaneously, the film suction member 367 is positioned in the cutting blade assembly 365. (Reference) Figure 9CThe dry film roller 361 begins to rotate to supply dry film 60 to the cutting blade assembly 365 via the guide roller 3611. Simultaneously, the cover film roller 362 begins to collect the cover film 62 peeled off from the dry film 60 via the guide rollers 3622 and 3621. The dry film body 61, after the cover film 62 has been peeled off, is then supplied towards the cutting blade assembly 365. As the dry film body 61 passes above the cutting blade assembly 365, the cutting blade assembly 365 begins to cut the dry film body 61, specifically cutting it into a rectangular shape. After the dry film body 61 is cut into a rectangular shape by the cutting blade assembly 365, the suction member 367 can use its plane 368 to pick up the rectangularly cut dry film body 61'. Waste film 63, cut by the cutting blade assembly 365 but not loaded onto the suction member 367, is loaded and recycled by the waste film roller 363 via the guide roller 3631. In addition, as previously mentioned, when the cutting blade assembly 365 cuts the dry film body 61, the negative pressure device 369 will operate simultaneously to suck away the particles generated by cutting the dry film body 61, so as to reduce the chance of particles falling onto the cut dry film body 61'.

[0048] like Figure 9D As shown, after the film suction member 367 loads the cut dry film body 61', the film suction member 367 moves to the position of the lower cavity 345 and places the rectangular dry film body 61' loaded on the film suction member 367 onto the panel 37 supported by the lower cavity 345. (Reference) Figure 9E After the film suction member 367 places the cut dry film body 61' onto the panel 37 supported by the lower cavity 345, the film suction member 367, which is not loaded with any dry film body 61', can return to its original position corresponding to the cutting blade assembly 365.

[0049] Subsequently, as Figure 9FAs shown, the lower cavity 345 returns to the first chamber 34, simultaneously moving the panel 37 containing the cut dry film body 61' into the first chamber 34. The lower cavity 345 is positioned approximately below the upper cavity 341. After the lower cavity 345 moves the panel 37 containing the cut dry film body 61' back to the first chamber 34, the interior of the first chamber 34 is evacuated to below 1 Torr. After the interior of the first chamber 34 is evacuated to below 1 Torr, the upper cavity 341 moves vertically downwards to press the cut dry film body 61' placed on the panel 37 against the panel 37. After the first chamber 34 is evacuated to below 1 Torr, the air between the panel 37 and the download disk 346 and between the panel 37 and the dry film body 61' can be completely removed. In this way, the panel 37 can be more flat against the download disk 346, and the dry film body 61' can be more flat against the panel 37. When the upper chamber 341 is pressed, unwanted air bubbles can be avoided between the panel 37 and the dry film body 61'.

[0050] Subsequently, as previously described, the pressed dry film body 61' and panel 37 are selectively transferred from the first chamber 34 to the first carrier cartridge 31 or the second carrier cartridge 32 via the equipment front-end module 33, and the user can collect the panel 37 that has completed the dry film pressing process at the first carrier cartridge 31 or the second carrier cartridge 32.

[0051] Based on the above, it can be understood that the first chamber 34 and the cutting module 36 mainly perform the process of pressing the dry film 60 onto the panel 37, while the first carrier cassette 31, the second carrier cassette 32, and the equipment front-end module 33 are mainly used to transfer the panel 37 into the first chamber 34 and the cutting module 36 for the dry film pressing process and to transfer the panel 37 after the dry film pressing process has been completed out. Therefore, the components and structure of the first chamber 34 and the cutting module 36 can be regarded as a device for semiconductor film bonding.

[0052] Furthermore, Figure 10 This is a schematic diagram of the second chamber 35 and the dicing module 36 of the integrated system 3 of a semiconductor device according to some embodiments of this disclosure. Figure 10As shown, the second chamber 35 has an upper chamber 351, which is generally vertically movable within the second chamber 35. The upper chamber 351 has an airbag contact surface 352, and also has a support member 354 for supporting a PE protective film 353 for protecting the airbag contact surface 352. Furthermore, the second chamber 35 has a lower chamber 355, which is movable between the second chamber 35 and the cutting module 36. The lower chamber 355 has a download tray 356 thereon, and the download tray 356 has a vacuum suction device 359. When the front-end module 33 moves the panel to be dry-film pressed from the first carrier cassette 31 or the second carrier cassette 32 into the second chamber 35, the panel will be placed on the download tray 356 of the lower chamber 355. When the panel is placed on the download tray 356 of the lower chamber 355, the vacuum suction device 359 can operate to flatten and adsorb the panel onto the download tray 356, thus reducing unnecessary warping of the panel in subsequent processes.

[0053] Also, regarding Figure 10 The cutting module 36 shown, including its components and connections, has been described in detail below. Figure 8 As stated in the explanation, it will not be repeated here.

[0054] Figure 11A , 11B Figures 11C, 11D, 11E, and 11F are operational schematic diagrams of the second chamber 35 and the dicing module 36 of the integrated system 3 of a semiconductor device according to some embodiments of this disclosure. (See reference...) Figure 11A As previously described, the front-end module 33 can move the panel 38 from the first carrier cartridge 31 or the second carrier cartridge 32 into the second chamber 35. The panel 38 moved into the second chamber 35 is then placed on the download tray 356 of the lower chamber 355. Simultaneously, the vacuum suction device 359 can flatly adhere the panel 38 to the download tray 356. (Reference) Figure 11B After the panel 38 is placed on the download disk 356 of the lower cavity 355, the lower cavity 355 can be moved from the second chamber 35 to a position in the cutting module 36, thereby moving the panel 38 from the second chamber 35 to the cutting module 36; simultaneously, the film suction member 367 is positioned in the cutting blade assembly 365. (Reference) Figure 11CThe dry film roller 361 begins to rotate to supply dry film 60 to the cutting blade assembly 365 via the guide roller 3611. Simultaneously, the cover film roller 362 begins to collect the cover film 62 peeled off from the dry film 60 via the guide rollers 3622 and 3621. The dry film body 61, after the cover film 62 has been peeled off, is then supplied towards the cutting blade assembly 365. As the dry film body 61 passes above the cutting blade assembly 365, the cutting blade assembly 365 begins to cut the dry film body 61, specifically cutting it into a rectangular shape. After the dry film body 61 is cut into a rectangular shape by the cutting blade assembly 365, the suction member 367 can use its plane 368 to pick up the rectangularly cut dry film body 61'. Waste film 63, cut by the cutting blade assembly 365 but not loaded onto the suction member 367, is loaded and recycled by the waste film roller 363 via the guide roller 3631. In addition, as previously mentioned, when the cutting blade assembly 365 cuts the dry film body 61, the negative pressure device 369 will operate simultaneously to suck away the particles generated by cutting the dry film body 61, so as to reduce the chance of particles falling onto the cut dry film body 61'.

[0055] like Figure 11D As shown, after the film suction member 367 loads the cut dry film body 61', the film suction member 367 moves to the position of the lower cavity 355 and places the rectangular dry film body 61' loaded on the film suction member 367 onto the panel 38 supported by the lower cavity 355. (Reference) Figure 11E After the film suction member 367 places the cut dry film body 61' onto the panel 38 supported by the lower cavity 355, the film suction member 367, which is not loaded with any dry film body 61', can return to its original position corresponding to the cutting blade assembly 365.

[0056] Subsequently, as Figure 11FAs shown, the lower cavity 355 returns to the second chamber 35, and simultaneously moves the panel 38 containing the cut dry film body 61' into the second chamber 35, where the lower cavity 355 is approximately located below the upper cavity 351. After the lower cavity 355 moves the panel 36 containing the cut dry film body 61' back to the first chamber 35, the interior of the second chamber 35 is evacuated to below 1 Torr. After the interior of the second chamber 35 is evacuated to below 1 Torr, the upper cavity 351 moves vertically downward to press the cut dry film body 61' placed on the panel 38 against the panel 38. After the interior of the second chamber 35 is evacuated to below 1 Torr, the air between the panel 38 and the download tray 356, and between the panel 38 and the dry film body 61', can be completely removed. As a result, the panel 38 can be more flat against the download tray 356, and the dry film body 61' can be more flat against the panel 38. When the upper chamber 351 is pressed together, unwanted air bubbles can be avoided between the panel 38 and the dry film body 61'.

[0057] Subsequently, as previously described, the pressed dry film body 61' and panel 38 will be moved from the second chamber 35 to the first carrier cartridge 31 or the second carrier cartridge 32 via the equipment front-end module 33, and the user can collect the panel 38 that has completed the dry film pressing process at the first carrier cartridge 31 or the second carrier cartridge 32.

[0058] Based on the above, it can be understood that the second chamber 35 and the cutting module 36 mainly perform the process of laminating the dry film 60 onto the panel 38, while the first carrier cartridge 31, the second carrier cartridge 32, and the equipment front-end module 33 are mainly used to transfer the panel 38 into the second chamber 35 and the cutting module 36 for the dry film lamination process and to transfer the panel 38 after the dry film lamination process has been completed out. Therefore, the components and structure of the second chamber 35 and the cutting module 36 can be regarded as a device for semiconductor film lamination.

[0059] Figure 12 A lamination process for an integrated system 3 of semiconductor devices using some embodiments of this disclosure. Figure 4In step 41, the user can place panel 37 in the first carrier cassette 31 and panel 38 in the second carrier cassette 32. In step 42, the equipment front-end module 33 can move panel 37 from the first carrier cassette 31 to the first chamber 34. In step 33, the lower chamber 345 of the first chamber 34 can move panel 37 to the cutting module 36 for placing the dry film body on panel 37. In step 44, the equipment front-end module 33 can move panel 38 from the second carrier cassette 32 to the second chamber 35. Steps 43 and 44 can be performed approximately simultaneously. In step 45, the lower chamber 345 can move panel 37, on which the dry film body 61' has been placed, to the first chamber 34, and the upper chamber 341 of the first chamber 34 can perform a pressing operation on the dry film body 61' and panel 37. In step 46, the lower chamber 355 of the second chamber 35 can move the panel 38 to the cutting module 36 to place the dry film body 61' on the panel 38. Steps 45 and 46 can be performed approximately simultaneously. In step 47, the front-end module 33 can move the pressed panel 37 from the first chamber 34 to the first carrier cassette 31 for the user to retrieve. In step 48, the lower chamber 355 can move the panel 38 with the dry film body 61' placed on it into the second chamber 35, and the upper chamber 351 of the second chamber 35 can perform pressing operations on the dry film body 61' and the panel 38. Steps 45 and 46 can be performed approximately simultaneously. In step 49, the front-end module 33 can move the pressed panel 38 from the second chamber 35 to the second carrier cassette 32 for the user to retrieve.

[0060] Depend on Figure 12 The film pressing process shown Figure 4 It is understood that when using the integrated system 3 of semiconductor equipment for the lamination process, it is not necessary to wait for the panel 37 to complete the lamination process before performing the lamination process of the panel 38. The lamination process can be performed alternately using the first chamber 34 and the second chamber 35. For example, when the panel 37 returns to the first chamber 34 for lamination after the dry film body 61' is placed on the panel 37 in the cutting module 36 (step 45), the panel 38 is moved from the second chamber 35 to the cutting module to perform the operation of placing the dry film body 61' on the panel 38 (step 46). In this way, the efficiency of panel lamination can be greatly improved.

[0061] Throughout this specification, references to "some embodiments," "partial embodiments," "one embodiment," "another example," "example," "specific example," or "partial example" mean that at least one embodiment or example in this application includes the specific feature, structure, or characteristic described in that embodiment or example. Therefore, descriptions appearing throughout this specification, such as "in some embodiments," "in an embodiment," "in one embodiment," "in another example," "in one example," "in a specific example," or "example," do not necessarily refer to the same embodiments or examples in this application.

[0062] As used herein, spatial relative terms, such as “below,” “under,” “lower,” “above,” “upper,” “lower,” “left,” “right,” and the like, may be used herein for the simple purpose of describing the relationship between one element or feature and another element or feature as illustrated in the figures. In addition to the orientations depicted in the figures, spatial relative terms are intended to cover different orientations of a device in use or operation. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein shall be interpreted accordingly. It should be understood that when an element is referred to as “connected to” or “coupled to” another element, it may be directly connected to or coupled to the other element, or there may be intermediate components.

[0063] As used herein, the terms “approximately,” “substantially,” “essentially,” and “about” are used to describe and account for small variations. When used in conjunction with an event or situation, the terms may refer to examples where the event or situation occurs precisely or very approximately. As used herein with respect to a given value or range, the term “about” generally means within ±10%, ±5%, ±1%, or ±0.5% of the given value or range. A range may be expressed herein as from one endpoint to another or between two endpoints. Unless otherwise specified, all ranges disclosed herein include endpoints. The term “substantially coplanar” may refer to two surfaces located along the same plane within a few micrometers (μm), for example, within 10 μm, 5 μm, 1 μm, or 0.5 μm along the same plane. When referring to “substantially” identical numerical values ​​or characteristics, the term may refer to values ​​within ±10%, ±5%, ±1%, or ±0.5% of the average of said values.

[0064] As used herein, the terms “approximately,” “substantially,” “essentially,” and “about” are used to describe and explain small variations. When used in conjunction with an event or situation, the terms may refer to examples where the event or situation occurred precisely or where it occurred very approximately. For example, when used in conjunction with a numerical value, the terms may refer to a range of variation less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if the difference between two values ​​is less than or equal to ±10% of the average of the values ​​(e.g., less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%), then the two values ​​can be considered "substantially" or "approximately" the same. For example, "substantially" parallel can refer to an angular variation of less than or equal to ±10° relative to 0°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°. For example, “basically” vertical can refer to an angular variation of less than or equal to ±10° relative to 90°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°.

[0065] As used herein, unless the context clearly indicates otherwise, the singular terms “a / an” and “the” may include a plural of indicators. In the description of some embodiments, a component provided “on” or “above” another element may cover the case where the preceding element is directly on the following element (e.g., in physical contact with the following element), and the case where one or more intermediate elements are located between the preceding and following elements.

[0066] Unless otherwise specified, spatial descriptions such as “above,” “below,” “up,” “left,” “right,” “lower,” “top,” “bottom,” “vertical,” “horizontal,” “side,” “above,” “below,” “upper part,” “above,” “below,” “downward,” etc., are relative to the orientation shown in the figures. It should be understood that the spatial descriptions used herein are for illustrative purposes only, and actual embodiments of the structures described herein can be arranged in space in any orientation or manner, provided that the advantages of the embodiments of the invention are not affected by such arrangements.

[0067] Although this disclosure has been described and illustrated with reference to specific embodiments thereof, such description and illustration are not limiting of this disclosure. It will be readily understood by those skilled in the art that various changes may be made and equivalent components may be substituted within embodiments without departing from the true spirit and scope of this disclosure as defined by the appended claims. Illustrations may not be drawn to scale. Artistic representations in this disclosure may differ from actual devices due to variations in the manufacturing process, etc. Other embodiments of this disclosure may exist that are not specifically described. This specification and drawings should be considered illustrative rather than limiting. Modifications may be made to suit particular circumstances, materials, compositions, substances, methods, or processes to the objectives, spirit, and scope of this disclosure. All such modifications are intended to be within the scope of the appended claims. While the methods disclosed herein have been described with reference to specific operations performed in a particular order, it should be understood that these operations may be combined, subdivided, or reordered to form equivalent methods without departing from the teachings of this disclosure. Therefore, unless specifically indicated herein, the order and grouping of operations are not a limitation of this disclosure.

[0068] The foregoing provides an overview of several embodiments and detailed features of this disclosure. The embodiments described in this disclosure can be readily used as a basis for designing or modifying other processes and as structures for performing the same or similar purposes and / or obtaining the same or similar advantages of the embodiments introduced herein. Such equivalent constructions do not depart from the spirit and scope of this disclosure, and various changes, substitutions, and variations can be made without departing from the spirit and scope of this disclosure.

[0069] Legend

[0070] 1. Integrated systems for semiconductor equipment

[0071] 11 First Carrying Cartridge

[0072] 12 Second Carrying Cartridge

[0073] 13 Equipment front-end module

[0074] 14 First Chamber

[0075] 141 upper cavity

[0076] 142 Airbag contact surface

[0077] 143 PE protective film

[0078] 145 Lower cavity

[0079] 146 Download Drive

[0080] 15 Second Chamber

[0081] 151 upper cavity

[0082] 152 Airbag contact surface

[0083] 153 PE protective film

[0084] 155 Lower cavity

[0085] 156 Download Drive

[0086] 16 Cutting Module

[0087] 161 Dry film roller

[0088] 1611 Transmission Wheel

[0089] 1612 Transmission Wheel

[0090] 162 Covering film wheel

[0091] 1621 Transmission Wheel

[0092] 163 Waste Film Roller

[0093] 1631 Transmission Wheel

[0094] 165 hobbing cutter barrel

[0095] 167 Receiving tube

[0096] 169 Negative Pressure Equipment

[0097] 17 Panels

[0098] 18 panels

[0099] 2. Molding process flow chart

[0100] 21 steps

[0101] 22 steps

[0102] 23 steps

[0103] 24 steps

[0104] 25 steps

[0105] 26 steps

[0106] 27 steps

[0107] 28 steps

[0108] 29 steps

[0109] 3. Integrated Systems for Semiconductor Equipment

[0110] 31 First Carrying Cartridge

[0111] 32 Second Carrying Cartridge

[0112] 33 Equipment front-end module

[0113] 34 First Chamber

[0114] 341 upper cavity

[0115] 342 Airbag contact surface

[0116] 343 PE protective film

[0117] 345 Lower cavity

[0118] 346 Download Disk

[0119] 35 Second Chamber

[0120] 351 upper cavity

[0121] 352 Airbag Contact Surface

[0122] 353 PE protective film

[0123] 355 Lower cavity

[0124] 356 Download Drive

[0125] 36 Cutting Module

[0126] 361 Dry Film Roller

[0127] 3611 Transmission Wheel

[0128] 362 Covering Film Roller

[0129] 3621 Transmission Wheel

[0130] 3622 Transmission Wheel

[0131] 363 Waste Film Roller

[0132] 3631 Transmission Wheel

[0133] 365 Cutting Blade Set

[0134] 367 Film suction component

[0135] 368 Plane

[0136] 369 Negative Pressure Equipment

[0137] 37 Panels

[0138] 38 panels

[0139] 4. Molding process flow chart

[0140] 41 steps

[0141] 42 steps

[0142] 43 steps

[0143] 44 steps

[0144] 45 steps

[0145] 46 steps

[0146] 47 steps

[0147] 48 steps

[0148] 49 steps

[0149] 50 dry film

[0150] 51 dry film body

[0151] 51' dry film body

[0152] 52 Covering film

[0153] 53 Waste membrane

[0154] 60 dry film

[0155] 61 dry film body

[0156] 61' dry film body

[0157] 62 Covering film

[0158] 63 Waste membrane

Claims

1. A film-applying device for semiconductor equipment, comprising: A dry film roller (161) for supplying dry film (50), wherein the dry film has a dry film body (51) and a cover film (52) attached to the dry film body; Covering film wheel (162) for loading the covering film; A rotary cutter (165) for cutting the dry film body, wherein the rotary cutter includes a negative pressure device (169) configured to adsorb particles generated by cutting. A receiving cylinder (167) for loading the dry film body cut by the rotary cutter and movable between a first position and a second position; and The first cavity (145) is movable and serves to support the panel. When the rotary cutter cylinder and the receiving cylinder rotate in the same direction, and the dry film body passes between the rotary cutter cylinder and the receiving cylinder, the rotary cutter cylinder cuts the dry film body, while the receiving cylinder loads the dry film body. The receiving cylinder collects the dry film body at the first position and places the dry film body on the panel at the second position.

2. The film-applying device for semiconductor equipment according to claim 1, further comprising: Waste film recycling unit (163) is used to load the dry film body that has been cut by the roller but not moved by the receiving cylinder.

3. The film-applying device for semiconductor equipment according to claim 2, wherein the waste film recycling unit is a waste film wheel.

4. The film-applying apparatus for semiconductor devices according to claim 2, wherein the roller cylinder is disposed between the dry film roller and the waste film recycling unit, wherein the roller cylinder is disposed below the receiving cylinder, and wherein the covering film roller is disposed below the roller cylinder.

5. The film-applying apparatus for semiconductor devices according to claim 4, wherein the roller cylinder is disposed below the dry film body and the receiving cylinder is disposed above the dry film body.

6. The film-applying apparatus for semiconductor devices according to claim 5, wherein the negative pressure device is configured to operate simultaneously with the dry film being cut by the rotary cutter.

7. The film-applying apparatus for semiconductor devices according to claim 1, further comprising: A second cavity (141) having an airbag contact surface (142) and movable up and down relative to the first cavity, wherein the second cavity is configured to press the dry film body on the panel against the panel.

8. The film-applying apparatus for semiconductor devices according to claim 7, further comprising: The chamber (14) is such that when the first chamber (145) carries the panel into the chamber, the interior of the chamber is evacuated until below 1 Torr, and the second chamber (141) moves vertically downward to press the dry film body against the panel.

9. The film-applying apparatus for semiconductor devices according to claim 1, further comprising: Three guide rollers are positioned between the dry film roller and the cover film roller. When the dry film passes through the three guide rollers, the cover film is peeled off from the dry film.

10. The film application apparatus for a semiconductor device according to claim 1, wherein the first cavity has an adsorption device for adsorbing the panel, wherein the receiving cylinder is configured to carry the dry film body and roll it at the second position.

11. The film-applying apparatus for semiconductor devices according to claim 1, further comprising: A third cavity, wherein the first cavity and the third cavity are configured to move alternately below the receiving cylinder.

12. The film-applying apparatus for semiconductor devices according to claim 11, further comprising: A fourth cavity, wherein the fourth cavity has an airbag contact surface and is movable up and down relative to the third cavity.

13. An integrated system for fabricating a semiconductor device, comprising: First carrying cartridge; Second carrying cartridge; The equipment front-end module is connected to the first carrier cartridge and the second carrier cartridge, wherein the equipment front-end module can selectively pick up a panel from the first carrier cartridge or the second carrier cartridge. The first chamber is connected to the front-end module of the equipment; The second chamber is connected to the front-end module of the equipment; and A cutting module, which is connected to the first chamber and the second chamber; The cutting module includes: A dry film roller (161) for supplying dry film (50), wherein the dry film has a dry film body (51) and a cover film (52) attached to the dry film body; Covering film wheel (162) for loading the covering film; A rotary cutter (165) for cutting the dry film body, wherein the rotary cutter includes a negative pressure device (169) configured to adsorb particles generated by cutting. and A receiving cylinder (167) is used to load the dry film body cut by the rotary cutter and is movable between a first position and a second position; And wherein the first chamber comprises: A first cavity that can move between the cutting module and the first chamber; and A second cavity movable within the first cavity, wherein when the first cavity carrying the panel enters the first cavity, the interior of the first cavity is evacuated until below 1 Torr, and the second cavity moves vertically downward to press the dry film body against the panel; And wherein the second chamber comprises: A third cavity movable between the cutting module and the second chamber; and A fourth cavity that can move within the second cavity.

14. The integrated system for fabricating a semiconductor device according to claim 13, further comprising: Three guide rollers are positioned between the dry film roller and the cover film roller. When the dry film passes through the three guide rollers, the cover film is peeled off from the dry film.

Images