Perovskite solar cell module and preparation method thereof

Abstract

The present invention provides a perovskite solar cell module and a preparation method thereof. The solar cell module includes: a conductive substrate, which includes a base layer and a conductive layer; a partition groove that penetrates through the conductive layer to divide the conductive layer into an area array, and each row of the area array includes a plurality of separated conductive areas; an electron transport layer, a perovskite layer, and a hole transport layer, which are sequentially located on each conductive area; a plurality of openings, each of which sequentially penetrates through the electron transport layer, the perovskite layer, and the hole transport layer on each conductive area to expose each conductive area; and a plurality of electrodes. By using the perovskite solar cell module and the preparation method thereof of the present invention, the internal connection mode of the solar cell module can be changed, and the stability and reliability of the solar cell module can be improved.

Description

Technical Field

[0001] The present invention mainly relates to the field of solar cells, and particularly relates to a perovskite solar cell module and a preparation method thereof. Background Art

[0002] Due to its advantages of high efficiency and low cost, perovskite technology has received continuous attention from the academic and industrial circles in recent years. Currently, the highest certified efficiency of small-area perovskite solar cells in the laboratory has reached 25.5%, which can be comparable to traditional solar cells. Therefore, it has broad commercialization prospects. Studying and preparing perovskite solar cell modules is the only way for perovskite to move towards commercialization.

[0003] Such as Figure 1 is a sectional three-dimensional structure diagram of a solar cell module 10. Currently, most perovskite solar cell modules adopt an etching isolation method to form a structure in which the sub-cells 11, 12, and 13 are connected in series as shown in Figure 1 The bottom of the battery module 10 is composed of a non-conductive glass Glass layer and a discontinuous conductive glass FTO layer.

[0004] Among them, taking the sub-cell 11 as an example, it adopts an electron transport layer ETL (Electron Transporting Layer), a perovskite layer (Perovskite), and a hole transport layer HTL (Hole Transporting Layer), and a metal layer Au layer is covered thereon to finally form a metal electrode.

[0005] Such as Figure 1 The structure and the existing preparation methods shown have many problems. For example, since the sub-cells are connected in series, during the operation of the battery module, due to factors such as the instability of the perovskite layer, a certain sub-cell in the series connection may fail, or even the entire battery module may be damaged. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to provide a perovskite solar cell module and a preparation method thereof, which can change the internal connection mode of the solar cell module and improve the stability and reliability of the solar cell module.

[0007] To solve the above technical problems, the present invention provides a perovskite solar cell module, comprising: a conductive substrate including a base layer and a conductive layer; a partition groove penetrating the conductive layer to divide the conductive layer into an area array, each row of the area array including a plurality of separated conductive areas; an electron transport layer, a perovskite layer, and a hole transport layer, which are sequentially located above each of the conductive areas; a plurality of openings, each opening sequentially penetrating the electron transport layer, the perovskite layer, and the hole transport layer on each of the conductive areas to expose each of the conductive areas; and a plurality of electrodes, including: a first common electrode contacting the hole transport layer above the leftmost conductive area in each row, a second common electrode passing through the rightmost opening in each row to contact the rightmost conductive area, and a plurality of connecting electrodes, each connecting electrode passing through a first opening in each row to contact a first conductive area exposed by the first opening and contacting the hole transport layer above a second conductive area, the first conductive area and the second conductive area being adjacent on the conductive layer.

[0008] In an embodiment of the present invention, the first common electrode includes a handle portion and a plurality of tooth portions, each tooth portion extending from the handle portion and contacting the hole transport layer above the leftmost conductive area in each row.

[0009] In an embodiment of the present invention, the second common electrode includes a handle portion and a plurality of tooth portions, each tooth portion extending from the handle portion and passing through the rightmost opening in each row to contact the rightmost conductive area.

[0010] In an embodiment of the present invention, each of the connecting electrodes includes a handle portion and a tooth portion, the handle portion passing through the first opening to contact the first conductive area exposed by the first opening, and the tooth portion extending from the handle portion and contacting the hole transport layer above the second conductive area.

[0011] In an embodiment of the present invention, the thickness of the electrode is 30 to 100 nm.

[0012] In an embodiment of the present invention, the width of the opening is 1 to 10 mm.

[0013] In an embodiment of the present invention, it further includes: a packaging material encapsulated above the plurality of electrodes; and a back plate encapsulated under the conductive substrate.

[0014] To solve the above technical problems, the present invention also provides a method for preparing a perovskite solar cell module, comprising the following steps: providing a conductive substrate, the conductive substrate including a base layer and a conductive layer; cutting the conductive layer to form a penetrating partition groove, the partition groove separating the conductive layer into a region array, each row of the region array including a plurality of separated conductive regions; sequentially forming an electron transport layer, a perovskite layer, and a hole transport layer on each of the conductive regions; forming an opening sequentially penetrating the electron transport layer, the perovskite layer, and the hole transport layer on each of the conductive regions, each opening exposing each of the conductive regions; forming a first common electrode contacting the hole transport layer above the leftmost conductive region in each row, a second common electrode passing through the rightmost opening in each row to contact the rightmost conductive region, and a plurality of connecting electrodes, each connecting electrode passing through a first opening in each row to contact a first conductive region exposed by the first opening and contacting the hole transport layer above a second conductive region, the first conductive region and the second conductive region being adjacent on the conductive layer.

[0015] In an embodiment of the present invention, the preparation method further includes: cleaning the conductive substrate.

[0016] In an embodiment of the present invention, the step of cutting the conductive layer to form a penetrating partition groove includes physical scribing and laser etching, and the width of the partition groove is 0.1 - 1 mm.

[0017] In an embodiment of the present invention, the step of forming the first common electrode, the second common electrode, and the plurality of connecting electrodes includes thermal evaporation or screen printing, and the thickness of the first common electrode, the second common electrode, and the plurality of connecting electrodes is 30 to 100 nm.

[0018] In an embodiment of the present invention, the preparation method further includes: covering with a packaging material and a backplane to package into a perovskite solar cell module.

[0019] In an embodiment of the present invention, the step of covering with a packaging material and a backplane to package into a perovskite solar cell module includes: completing the packaging by hot pressing, wherein the pressing temperature is 80 to 150 degrees Celsius and the pressing time is 1 to 60 minutes.

[0020] Compared with the prior art, the present invention has the following advantages:

[0021] The perovskite solar cell module and its preparation method of the present invention divide the conductive layer part of the whole conductive substrate into a plurality of conductive regions arranged in an array, then sequentially cover an electron transport layer, a perovskite layer, and a hole transport layer, and set openings penetrating through each layer to reach the conductive regions. Finally, a metal electrode is prepared through a patterned mask, realizing the series-parallel combination connection mode of each sub-cell on the substrate. The process is simple, has good repeatability, and the series and parallel connection modes coexist between sub-cells, which is beneficial to improving the anti-failure performance of the module and significantly enhancing the stability after encapsulation of the module. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings are provided to further understand the present application. They are incorporated and constitute a part of this application. The drawings illustrate embodiments of the present application and, together with this specification, serve to explain the principles of the present invention. In the drawings:

[0023] Figure 1 is a sectional three-dimensional structure diagram of a solar cell module;

[0024] Figures 2a - 2f is a schematic exploded plan view of each layer of a perovskite solar cell module according to an embodiment of the present invention;

[0025] Figures 3a - 3f is a schematic exploded three-dimensional view of each layer of a perovskite solar cell module according to an embodiment of the present invention;

[0026] Figure 4 is a schematic structural diagram of an electrode in a perovskite solar cell module according to an embodiment of the present invention; and

[0027] Figure 5 is a schematic flow chart of a preparation method of a perovskite solar cell module according to an embodiment of the present invention.

[0028] Figures 1 - 4 List of reference numerals in

[0029] 10 Solar cell module

[0030] 11-13 Sub-cells in the solar cell module 10

[0031] 20 Perovskite solar cell module

[0032] 21 Conductive substrate

[0033] 211 Base layer

[0034] 212 Conductive layer

[0035] 2120 External electrode

[0036] 22 Partition groove

[0037] 220 Conductive Region

[0038] 2200 The leftmost conductive region

[0039] 2201 The rightmost conductive region

[0040] 23 Solid Layer

[0041] 231 Electron Transport Layer

[0042] 232 Perovskite Layer

[0043] 233 Hole Transport Layer

[0044] 24 Encapsulation Layer

[0045] 25 Opening

[0046] 251 The rightmost opening

[0047] 26 Metal Electrode Layer

[0048] 260 First Common Electrode

[0049] 261 Second Common Electrode

[0050] 262 Connecting Electrode

[0051] 2600 First Common Electrode Shank

[0052] 2601 - 2603 First Common Electrode Teeth

[0053] 2610 Second Common Electrode Shank

[0054] 2611 - 2613 Second Common Electrode Teeth

[0055] 2620 Connecting Electrode Shank

[0056] 2621 Connecting Electrode Teeth Detailed Implementation Manner

[0057] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the accompanying drawings required for the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some examples or embodiments of the present application. For those of ordinary skill in the art, without creative efforts, the present application can also be applied to other similar scenarios based on these drawings. Unless it is obvious from the language context or otherwise stated, the same reference numerals in the figures represent the same structure or operation.

[0058] As shown in this application and the claims, unless the context clearly indicates otherwise, words such as "a", "an", "one", and / or "the" are not specifically singular and may also include the plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of the steps and elements that have been clearly identified, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements.

[0059] Unless otherwise specifically stated, the relative arrangements of the components and steps, numerical expressions, and numerical values set forth in these embodiments do not limit the scope of this application. At the same time, it should be understood that for the sake of convenience of description, the dimensions of the various parts shown in the drawings are not drawn in actual proportional relationships. Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such technologies, methods, and devices should be regarded as part of the authorization specification. In all the examples shown and discussed here, any specific value should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, further discussion thereof is not required in subsequent drawings.

[0060] In the description of this application, it should be understood that the orientation or positional relationships indicated by orientation words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal", and "top, bottom" are generally based on the orientation or positional relationships shown in the drawings. It is only for the convenience of describing this application and simplifying the description. Without contrary instructions, these orientation words do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation on the protection scope of this application; the orientation words "inside, outside" refer to the inside and outside relative to the contour of each component itself.

[0061] For ease of description, spatial relative terms, such as "above", "over", "on the upper surface", "upper", etc., may be used herein to describe the spatial positional relationship of one device or feature to other devices or features as shown in the figures. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is inverted, a device described as "above" or "over" other devices or structures will then be positioned "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both the orientations of "above" and "below". The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and corresponding interpretations of the spatial relative descriptions used herein will be made.

[0062] In addition, it should be noted that the use of terms such as "first", "second", etc. to limit components is only for the convenience of differentiating the corresponding components. Without additional statements, the above terms have no special meanings, and thus should not be construed as limiting the scope of protection of this application. In addition, although the terms used in this application are selected from well-known and commonly used terms, some of the terms mentioned in the specification of this application may be selected by the applicant according to his or her judgment, and their detailed meanings are described in the relevant parts of this description. In addition, it is required to understand this application not only through the actual terms used, but also through the meanings implied by each term.

[0063] It should be understood that when a component is referred to as "on another component", "connected to another component", or "in contact with another component", it can be directly above, connected to, or coupled to, or in contact with that other component, or there may be an intervening component. In contrast, when a component is referred to as "directly on another component", "directly connected to", "directly coupled to", or "directly in contact with" another component, there is no intervening component.

[0064] One aspect of the present invention provides a perovskite solar cell module, which can change the internal connection mode of the solar cell module and improve the stability and reliability of the solar cell module.

[0065] As Figure 2f and 3f shown, respectively, are a top plan view and a three-dimensional schematic view of a perovskite solar cell module 20 in an embodiment of the present invention. And Figures 2a - 2e shown is a decomposed plan schematic view of each layer of the perovskite solar cell module 20 in this embodiment of the present invention, and Figures 3a - 3e shown is a decomposed three-dimensional schematic view of each layer of the perovskite solar cell module 20 in this embodiment of the present invention.

[0066] The following will describe Figures 2a - 3f the structure of a perovskite solar cell module 20 according to an embodiment of the present invention.

[0067] First of all, generally speaking, with reference to Figure 3f as shown, the cell module 20 includes a conductive substrate 21, a plurality of dividing grooves 22 and a solid layer 23. The solid layer 23, with reference to Figure 3c as shown, can be understood as a solid layer 23 formed by sequentially stacking an electron transport layer 231, a perovskite layer 232 and a hole transport layer 233. Further, above the solid layer 23, there is also a packaging layer 24, thereby packaging the cell module 20 into one body.

[0068] Specifically, more clearly as Figure 3a shown, the conductive substrate 21 includes a base layer 211 and a conductive layer 212.

[0069] Exemplarily, in some embodiments of the present invention, the base layer 211 is a glass substrate or an organic substrate such as polyethylene terephthalate or polyimide. In some other embodiments of the present invention, the conductive layer 212 can be a transparent conductive material such as FTO, ITO, AZO, GZO, Ag nanowires, etc., and the thickness of the conductive layer is 100 to 500 nm.

[0070] Further, as Figure 2b , 2c and as shown in 3b, when dividing the conductive layer 21, an external electrode position 2120 is reserved at the edge position of the conductive layer 21. This area can be directly used as an access port or wiring area for the cell module 20 to achieve electrical connection with the outside.

[0071] As Figure 2b and 3b shown, a plurality of dividing grooves 22 penetrate through the conductive layer 212 to divide the conductive layer 212 into a regional array. Each row of the regional array includes a plurality of divided conductive regions 220. Since the plurality of dividing grooves 22 penetrate through the conductive layer 212, the plurality of divided conductive regions 220 are not electrically conductive with each other. Each conductive region 220 can be regarded as the basis of an electrode in the cell module. The connection method between the electrodes will be described later.

[0072] As described above, as Figure 2c and 3c shown, the reference numeral 23 indicates the combined solid layer 23 in which the electron transport layer 231, the perovskite layer 232 and the hole transport layer 233 are sequentially covered on each conductive region 220. After being arranged in sequence, the upper surface of the solid layer 23 is the hole transport layer 233.

[0073] Exemplarily, the electron transport layer 231 can be one or more of TiO2, SnO2, ZnO2, IZO, fullerenes and derivatives (C60, C70, PCBM), BaSnO3 or AZO. The preparation method can be selected from sputtering method or sol-gel method, and the thickness is 5 to 100 nm. The above perovskite layer 232 selects a perovskite material with the chemical formula ABX3, where A is one or more of Cs, Rb, CH3NH3 or CH2(NH2)2, B is Pb, and X is one or more of I or Br. The preparation method is thermal evaporation method or solution method. Finally, the above hole transport layer 233 is an inorganic hole conducting material such as NiOx, CuSCN, CuAlO2 or some high-temperature resistant organic hole conducting materials such as poly[bis(4-phenyl)(2,4,6-trimethylphenyl)amine].

[0074] It can be understood that whether it is Figure 2c the entity layer 23 marked by the slanted shaded area in Figure 3c or the entity layer 23 marked by the gray area in

[0075] it is an abstract and simple representation of the electron transport layer 231, perovskite layer 232 and hole transport layer 233 arranged in sequence for the sake of the simplicity of the drawings. The present invention does not limit the arrangement and structure of each layer because of this. For example, the shapes of the electron transport layer 231, perovskite layer 232 and hole transport layer 233 may not be completely the same in some cases, or there are differences in the sizes of each layer, etc. Figure 2d and 3d As shown in

[0076] Exemplarily, in some embodiments of the present invention, the method of configuring the plurality of openings 25 can adopt physical scribing or wiping with a chemical solvent to ensure that a part (presented as the size of the opening 25) of the conductive layer 212 (i.e., each conductive region 220) located below the electron transport layer 231, perovskite layer 232 and hole transport layer 233 is exposed, so that different electrodes can be connected and conduct electricity through the conductive layer 212 exposed at the position of the opening 25.

[0077] In an embodiment of the present invention, the width of the conductive region exposed on the conductive layer via the above opening is 1 to 10 mm, but the present invention is not limited thereto.

[0078] Preferably, in this embodiment, as Figure 2d and 3d shown, each opening 25 is correspondingly located on the solid layer 23 directly above one of the conductive regions 220. And for each row of adjacent conductive regions 220, the positions of the openings 25 are respectively located at the upper edge of the former and the lower edge of the latter, so as to facilitate the subsequent connection of electrodes. However, the present invention is not limited thereto. In some other embodiments, the positions and arrangements of the openings 25 may change due to different electrode connection methods to be achieved.

[0079] Further as Figure 2e and 3e shown, on the upper surface of the solid layer 23 having a plurality of openings 25, there is also a metal electrode layer 26. Due to the coverage of the metal electrode layer 26 and its connection with the conductive regions 220 having the same size as the plurality of openings 25, the battery assembly 20 has a plurality of electrodes.

[0080] In some embodiments of the present invention, the material of the above metal electrode 26 can be metals such as Au, Ag, Al, Cu, etc., and its preparation method is thermal evaporation or screen printing method.

[0081] In an embodiment of the present invention, the thickness of the above metal electrode layer (i.e., the thickness of the above first common electrode, second common electrode, and a plurality of connection electrodes) is 30 to 100 nm. However, the present invention does not limit the thickness of the metal electrode layer because of this.

[0082] More specifically, as described above, a plurality of partition grooves 22 penetrate through the conductive layer 212 to divide the conductive layer 212 into a region array. Each row of the region array includes a plurality of separated regions 220. Now referring to Figure 2b and 3b shown, the above region array has the leftmost conductive region 2200 and the rightmost conductive region 2201 at the leftmost and rightmost sides of each row respectively.

[0083] It can be understood that since Figures 2a - 3f only shows the case of a region having two columns, the two columns shown in the figure are respectively the leftmost conductive region 2200 and the rightmost conductive region 2201. In other embodiments of the present invention, there are also arranged multiple columns of other conductive regions 220 between the leftmost conductive region 2200 and the rightmost conductive region 2201.

[0084] Continuing as Figure 2e and 3e shown, among the plurality of electrodes in the battery assembly 20, there is a first common electrode 260 and a second common electrode 261. Among them, the first common electrode 260 contacts the hole transport layer above the leftmost conductive region 2200 of each row (inFigure 2e and 3e a first common electrode 260 that is shown as the uppermost surface of the solid layer 23).

[0085] Now refer to Figure 2d and 3d As shown, as described above, the plurality of openings 25 staggeredly expose two adjacent conductive regions 220 in each row, and the rightmost conductive region 2201 in each row of the above region array is exposed by the rightmost opening 251. Continuing as Figure 2e and 3e shown, the second common electrode 261 passes through the rightmost opening 251 in each row to contact the rightmost conductive region 2201.

[0086] In addition to the above-mentioned first common electrode 260 and second common electrode 261, there is also a connection electrode 262 among the above-mentioned plurality of electrodes, which is located between the first common electrode 260 and the second common electrode 261 in each row. Each connection electrode 262 passes through the first opening in each row to contact the first conductive region exposed by the first opening, and contacts the hole transport layer above the second conductive region. The first conductive region and the second conductive region are adjacent on the conductive layer.

[0087] It can be understood that Figures 2a - 3f only two columns of conductive regions 220 are shown. Therefore, the leftmost conductive region 2200 and the rightmost conductive region 2201 are naturally adjacent on the conductive layer 212. Thus, only the first common electrode 260 located on the leftmost side, the second common electrode 261 located on the rightmost side, and one connection electrode 262 therebetween are shown in the drawings. Thus, Figure 2e and 3e the connection electrode 262 in each row shown, the first opening passed through in the row where it is located is the opening on the leftmost conductive region 2200, and the hole transport layer above the second conductive region contacted is the hole transport layer 233 above the rightmost conductive region 2201.

[0088] However, the present invention is not limited to the position and number of the above-mentioned connection electrodes 262. In some other embodiments of the present invention, there are multiple connection electrodes in each row.

[0089] As Figure 4 shown, it is a schematic structural diagram of multiple electrodes in the perovskite solar cell module 20 in the above embodiment.

[0090] Specifically, as Figure 4As shown, the first common electrode 260 includes a handle portion 2600 and a plurality of tooth portions 2601, 2602, and 2603. Each tooth portion extends from the handle portion 2600, and the number of tooth portions represents the number of rows of the battery assembly in some embodiments. Refer to Figure 2e and 3e As shown, each of the tooth portions 2601, 2602, and 2603 contacts the hole transport layer 233 of the leftmost conductive region 2200 in each row (shown as the upper surface of the solid layer 23 in Figure 2e and 3e ).

[0091] Similarly, as Figure 4 shown, the second common electrode 261 includes a handle portion 2610 and a plurality of tooth portions 2611, 2612, and 2613. Each tooth portion also extends from the handle portion 2610. Refer to Figure 2e and 3e As shown, each of the tooth portions 2611, 2612, and 2613 extends from the handle portion 2610, passes through the rightmost opening 251 in the rightmost conductive region 2201 in each row, and contacts the rightmost conductive region 2201.

[0092] In this embodiment, the plurality of connection electrodes 262 are in a "knife" shape and each has a handle portion 2620 and a tooth portion 2621. It can be understood that, refer to Figure 2e and 3e shown, for any two adjacent conductive regions 220 in the same row on the conductive layer 212, the one defined earlier is the first conductive region and the one defined later is the second conductive region. The handle portion 2620 of a certain connection electrode is located on the earlier first conductive region and passes through the first opening in the earlier first conductive region to contact the earlier first conductive region exposed by the first opening. The tooth portion 2621 of this connection electrode is located on the later second conductive region and contacts the hole transport layer above the later second conductive region. Further, the above-mentioned second conductive region where the tooth portion 2621 of this connection electrode is located serves as the first conductive region again for the next connection electrode adjacent to it in the same row, and so on. In each row, the connection electrodes 262 are connected in an alternating positive and negative form in sequence, and are respectively connected to the first common electrode 260 and the second common electrode 261 of the battery assembly 20 at the leftmost and rightmost sides of each row.

[0093] In some other embodiments of the present invention, a backplane is further provided under the above-mentioned conductive substrate and is encapsulated together with the above-mentioned encapsulation material to play a role in protecting the battery assembly.

[0094] Exemplarily, the material used for the encapsulation layer 24 can be ethylene-vinyl acetate copolymer, polyolefin fiber, polyurethane, polyamide, polyester, polyolefin, Surlyn resin or epoxy resin. The encapsulation backplane can be glass or an organic backplane. During the encapsulation process of the laminator, the pressing temperature is 80 to 150 °C and the pressing time is 1 to 60 minutes.

[0095] The above-mentioned perovskite solar cell module separates the conductive regions, opens in the electron transport layer, perovskite layer, and hole transport layer and cooperates with the patterned metal electrode layer. Thus, series connection is achieved between the electrodes in each row of the cell module, and a parallel connection mode is formed between the rows due to the specific positions of the openings, thereby changing the internal connection mode of the perovskite solar cell module. Even if an electrode in a certain row fails, the electrodes in other rows connected in parallel with it can still work, effectively improving the stability and reliability of the solar cell module.

[0096] Another aspect of the present invention also proposes a preparation method for a perovskite solar cell module, which can also change the internal connection mode of the solar cell module and improve the stability and reliability of the solar cell module.

[0097] As Figure 5 shown, it is a schematic flowchart of a preparation method 50 for a perovskite solar cell module according to an embodiment of the present invention. Figure 5 Flowcharts are used to illustrate the operations performed by the systems according to the embodiments of the present application. It should be understood that the operations before or below do not necessarily need to be executed precisely in order. On the contrary, various steps can be executed in reverse order or simultaneously. Also, other operations can be added to these processes, or one or several operations can be removed from these processes.

[0098] As Figure 5 shown, the preparation method 50 for a perovskite solar cell module includes the following steps:

[0099] 51: Provide a conductive substrate, which includes a base layer and a conductive layer;

[0100] 52: Cut the conductive layer to form through-separating grooves, and the separating grooves divide the conductive layer into an area array. Each row of the area array includes multiple separated conductive regions;

[0101] 53: Sequentially form an electron transport layer, a perovskite layer, and a hole transport layer on each conductive region;

[0102] 54: Form openings that sequentially penetrate the electron transport layer, the perovskite layer, and the hole transport layer on each conductive region, and each opening exposes each conductive region;

[0103] 55: a first common electrode that forms a hole transport layer above the conductive region contacting the leftmost side of each row, a second common electrode that passes through the opening on the rightmost side of each row to contact the conductive region on the rightmost side, and a plurality of connection electrodes, each connection electrode passing through the first opening in each row to contact the first conductive region exposed by the first opening and contacting the hole transport layer above the second conductive region, the first region and the second region being adjacent on the conductive layer.

[0104] In an embodiment of the present invention, the method for preparing the perovskite solar cell module further includes cleaning the conductive substrate.

[0105] Exemplarily, in an embodiment of the present invention, the step of cutting the conductive layer to form a through-separating groove includes physical scribing and laser etching, and the width of the separating groove is 0.1 to 1 mm.

[0106] In an embodiment of the present invention, the step of forming an electrode that contacts a partial conductive region and the hole transport layer in each region includes a thermal evaporation method or a screen printing method, and the thickness of the electrode is 30 to 100 nm.

[0107] In some other embodiments of the present invention, the method for preparing the perovskite solar cell module further includes covering the encapsulation material and the backsheet to encapsulate into a perovskite solar cell module.

[0108] Exemplarily, the step of covering the encapsulation material and the backsheet to encapsulate into a perovskite solar cell module includes: completing the encapsulation by hot pressing, wherein the pressing temperature is 80 to 150 degrees Celsius and the pressing time is 1 to 60 minutes.

[0109] It can be understood that the preparation method 50 as Figure 5 shown can be applicable to the battery module 20 as Figures 2a - 3f shown, although the present invention is not limited thereto. Moreover, in the order of Figures 2a - 2f , or Figures 3a - 3f 's order, the exploded plan view and the three-dimensional view of each layer of the battery module 20 can also be regarded as the effect diagrams corresponding to each step of the preparation method 50. Therefore, other details about the preparation method 50 can refer to the description of the perovskite solar cell module 20 as Figures 2a - 3f shown above, and will not be elaborated here.

[0110] The above-mentioned method for preparing the perovskite module can change the internal connection method of the solar cell module, thereby improving the stability and reliability of the solar cell module during use.

[0111] The basic concepts have been described above. Obviously, for those skilled in the art, the above invention disclosure is only an example and does not constitute a limitation to this application. Although not explicitly stated here, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are proposed in this application, so such modifications, improvements, and corrections still fall within the spirit and scope of the exemplary embodiments of this application.

[0112] Meanwhile, this application uses specific terms to describe the embodiments of this application. Such as "one embodiment", "an embodiment", and / or "some embodiments" mean a certain feature, structure, or characteristic related to at least one embodiment of this application. Therefore, it should be emphasized and noted that the "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more at different positions in this specification does not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of this application can be appropriately combined.

[0113] Similarly, it should be noted that, in order to simplify the description of this application disclosure and thus help the understanding of one or more invention embodiments, in the previous description of the embodiments of this application, sometimes multiple features are merged into one embodiment, drawing, or description thereof. However, this disclosure method does not mean that the features required by the object of this application are more than those mentioned in the claims. In fact, the features of the embodiments are fewer than all the features of the individual embodiments disclosed above.

[0114] In some embodiments, numbers are used to describe the components and the quantity of attributes. It should be understood that such numbers used for the description of embodiments are, in some examples, modified by the modifiers "about", "approximate", or "substantially". Unless otherwise stated, "about", "approximate", or "substantially" indicate that the said numbers allow a variation of ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, and such approximate values can change according to the characteristics required by individual embodiments. In some embodiments, the numerical parameters should consider the specified significant digits and adopt the method of retaining the general number of digits. Although the numerical ranges and parameters used to confirm the breadth of the scope in some embodiments of this application are approximate values, in specific embodiments, the setting of such numerical values is as precise as possible within the feasible range.

[0115] Although this application has been described with reference to the current specific embodiments, those of ordinary skill in the art should recognize that the above embodiments are only used to illustrate this application, and various equivalent changes or substitutions can be made without departing from the spirit of this application. Therefore, as long as the changes and variations of the above embodiments are within the scope of the spirit of this application, they will fall within the scope of the claims of this application.

Claims

1. A perovskite solar cell module, comprising: A conductive substrate, the conductive substrate includes a base layer and a conductive layer, and an external electrode position is reserved at the edge position of the conductive layer; A partition groove, which penetrates the conductive layer to divide the area of the conductive layer except the external electrode position into an area array, and each row of the area array includes a plurality of divided conductive areas; An electron transport layer, a perovskite layer and a hole transport layer, which are sequentially located above each conductive area; A plurality of openings, each opening sequentially penetrates the electron transport layer, the perovskite layer and the hole transport layer on each conductive area to expose each conductive area; And A plurality of electrodes, including: a first common electrode that contacts the hole transport layer above the leftmost conductive area in each row, a second common electrode that passes through the rightmost opening in each row to contact the rightmost conductive area, and a plurality of connecting electrodes, each connecting electrode passes through the first opening in each row to contact the first conductive area exposed by the first opening, and contacts the hole transport layer above the second conductive area, and the first conductive area and the second conductive area are adjacent on the conductive layer.

2. The perovskite solar cell module according to claim 1, wherein The first common electrode includes a handle portion and a plurality of tooth portions, and each tooth portion extends from the handle portion and contacts the hole transport layer above the leftmost conductive area in each row.

3. The perovskite solar cell module according to claim 1, characterized in that, The second common electrode includes a handle portion and a plurality of tooth portions, and each tooth portion extends from the handle portion and passes through the rightmost opening in each row to contact the rightmost conductive area.

4. The perovskite solar cell module according to claim 1, wherein, Each of the connecting electrodes includes a handle portion and a tooth portion, the handle portion passes through the first opening to contact the first conductive area exposed by the first opening, and the tooth portion extends from the handle portion and contacts the hole transport layer above the second conductive area.

5. The perovskite solar cell module according to claim 1, wherein The thickness of the electrode is 30 to 100 nm.

6. The perovskite solar cell module according to claim 1, wherein The width of the opening is 1 to 10 mm.

7. The perovskite solar cell module according to claim 1, wherein It further includes: A packaging material, which is packaged above the plurality of electrodes; And A backplane, which is packaged under the conductive substrate.

8. A preparation method of a perovskite solar cell module, comprising the following steps: Providing a conductive substrate, the conductive substrate includes a base layer and a conductive layer; Cutting the conductive layer to form a penetrating partition groove, the partition groove divides the conductive layer into an area array, and each row of the area array includes a plurality of divided conductive areas; Sequentially forming an electron transport layer, a perovskite layer and a hole transport layer on each conductive area; Forming openings that sequentially penetrate the electron transport layer, the perovskite layer and the hole transport layer on each conductive area, and each opening exposes each conductive area; Forming a first common electrode that contacts the hole transport layer above the leftmost conductive area in each row, a second common electrode that passes through the rightmost opening in each row to contact the rightmost conductive area, and a plurality of connecting electrodes, each connecting electrode passes through the first opening in each row to contact the first conductive area exposed by the first opening, and contacts the hole transport layer above the second conductive area, and the first conductive area and the second conductive area are adjacent on the conductive layer.

9. The method according to claim 8, wherein It further includes: Cleaning the conductive substrate.

10. The method according to claim 8, characterized in that, The step of cutting the conductive layer to form a penetrating separation groove includes physical scribing and laser etching, and the width of the separation groove is 0.1 to 1 mm.

11. The method according to claim 8, wherein The step of forming the first common electrode, the second common electrode and the plurality of connection electrodes includes thermal evaporation or screen printing, and the thickness of the first common electrode, the second common electrode and the plurality of connection electrodes is 30 to 100 nm.

12. The method according to claim 8, wherein It further includes: Covering the encapsulation material and the backplane to encapsulate into a perovskite solar cell module.

13. The method according to claim 12, characterized in that, The step of covering the encapsulation material and the backplane to encapsulate into a perovskite solar cell module includes: completing the encapsulation by hot pressing, wherein the pressing temperature is 80 to 150 °C and the pressing time is 1 to 60 minutes.

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