A lubricating cold punching plate for drilling holes in FPC boards

Abstract

The present invention provides a lubricating cold punching plate for drilling holes in FPC boards, comprising a cooling and lubricating mechanism, wherein a cold punching plate substrate for accurately drilling holes in FPC boards is provided at the bottom of the cooling and lubricating mechanism, wherein the cooling and lubricating mechanism comprises a buffer layer coated on the surface of the cold punching plate substrate, the surface of the buffer layer is coated with a heat dissipation coating, the surface of the heat dissipation coating is coated with a water-soluble coating, and the cold punching plate substrate is provided with snap-on card grooves and snap-on card heads which are positioned relative to each other and are used to splice multiple plates. The lubricating cold punching plate of the present invention adopts the cold punching plate as the substrate, and a cooling and lubricating mechanism is coated on the surface of the cold punching plate through a process. The water-soluble coating, heat dissipation coating and buffer layer provided by the cooling and lubricating mechanism can cool the drill bit, protect the drill bit, keep the cutting edge of the drill bit always in a sharp state, and reduce the friction resistance of drill chips in the chip removal groove, which is conducive to smooth chip removal and improves the drilling processing efficiency.

Description

Technical Field

[0001] The invention belongs to the technical field of flexible circuit board processing, and particularly relates to a lubricating cold punching plate for drilling holes in an FPC board. Background Art

[0002] Flexible printed circuit board, also known as FPC board, is a highly reliable and flexible printed circuit board made of polyimide or polyester film as the base material. It has the characteristics of high wiring density, light weight, thin thickness and good bendability.

[0003] Flexible circuit boards need to go through multiple processes during the production process, among which the flexible circuit boards need to be punched. The existing punching method usually uses a semi-automatic drilling machine, which requires manual alignment of the flexible circuit board and then operates the drilling machine to drill the flexible circuit board. The lubricated cold punching plate is a top cover plate specially used for drilling holes in FPC boards to improve the accuracy of drilling holes. However, when the existing cold punching plate is used for FPC board drilling, it cannot cool the drill bit. At the same time, the debris generated by drilling cannot be discharged out of the hole in time, and the debris remaining on the surface of the drill bit is not easy to clean, which invisibly reduces the efficiency of FPC board drilling and reduces the service life of the drill bit. Therefore, the traditional cold punching plate still has many shortcomings when used for FPC board hole opening processing. Summary of the Invention

[0004] The purpose of the present invention is to provide a lubricating cold punching plate for FPC board drilling, aiming to solve the problem that the cold punching plate in the prior art cannot cool the drill bit when used for FPC board drilling processing, and the debris generated by drilling cannot be discharged out of the hole in time, and the debris remaining on the surface of the drill bit is not easy to clean, which invisibly reduces the efficiency of FPC board drilling processing and shortens the service life of the drill bit.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a lubricating cold punching plate for drilling holes in FPC boards, comprising a cooling and lubricating mechanism for cooling and lubricating a drill bit, a cold punching plate substrate for accurately drilling holes in FPC boards being provided at the bottom of the cooling and lubricating mechanism, the cooling and lubricating mechanism comprising a buffer layer coated on the surface of the cold punching plate substrate, the surface of the buffer layer being coated with a heat dissipation coating, the surface of the heat dissipation coating being coated with a water-soluble coating, and snap-on card slots and snap-on card heads being positioned relative to each other and used to splice multiple plates around the cold punching plate substrate.

[0006] In order to position the drill bit and remove debris, as a preferred embodiment of the present invention, the water-soluble coating is a water-soluble hot melt adhesive prepared from cellulose acetate propionate, mannitol acetate propionate, and succinic acid.

[0007] In order to cool down the high-speed rotating drill bit, as a preferred embodiment of the present invention, the heat dissipation coating is a resin of acrylic acid and amino system.

[0008] In order to provide a buffer when drilling a hole with a drill bit, as a preferred embodiment of the present invention, the buffer layer is made of acrylic rubber.

[0009] In order to accurately open holes in the FPC board, as a preferred embodiment of the present invention, the thickness of the water-soluble coating, the heat dissipation coating and the buffer layer are all less than 1 mm, and the surface of the water-soluble coating is printed with a printed circuit pattern corresponding to the FPC board using a water-soluble paint.

[0010] In order to securely fix the FPC board, as a preferred embodiment of the present invention, the cold punching board substrate is a glass fiber composite board, and the bottom of the cold punching board substrate is provided with nano-level anti-slip grooves.

[0011] In order to enable the cold stamping plates to be used in combination, as a preferred embodiment of the present invention: the groove wall of the buckle slot and the surface of the buckle head are both provided with frosted patterns.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] 1) The lubricated cold punch plate uses a cold punch plate as the base material, and a cooling and lubricating mechanism is applied to the surface of the cold punch plate through a process. The water-soluble coating, heat dissipation coating, and buffer layer provided by the cooling and lubricating mechanism can cool the drill bit, protecting the drill bit and keeping the cutting edge sharp. At the same time, it reduces the friction resistance of the drill chips in the chip removal groove, which is conducive to smooth chip removal. Because the coating of the cooling and lubricating mechanism is soft, the elastic bending deformation of the drill tip can be reduced during the tiny contact moment of the drill bit, which has a clamping effect on the drill bit, thereby greatly improving the drilling position accuracy;

[0014] 2) Since the cooling and lubricating mechanism and the cold punching plate base material are both transparent materials, when drilling holes in FPC boards, multiple pieces of the lubricating cold punching plates can be stacked to process multiple FPC boards, thereby improving drilling efficiency. The printed circuit pattern on the surface of the water-soluble coating can further increase the drilling accuracy of the FPC board and improve the hole wall quality.

[0015] 3) The setting of the cooling and lubricating mechanism enables the lubricating cold punching plate to reduce the roughness and burrs of the hole wall when drilling the FPC board with the drill bit. The debris left by the drill bit is completely water-soluble and easy to clean, without the risk of residual adhesion, ensuring improved drilling quality and reduced drilling costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0017] Figure 1 It is a structural schematic diagram of the present invention;

[0018] Figure 2 is a cross-sectional view of the present invention;

[0019] Figure 3 It is a schematic diagram of the cold punching plate substrate structure of the present invention.

[0020] In the figure: 1. Cooling and lubricating mechanism; 11. Water-soluble coating; 12. Heat dissipation coating; 13. Buffer layer; 2. Cold stamping board substrate; 21. Snap-on card slot; 22. Snap-on card head; 3. FPC board. DETAILED DESCRIPTION

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] Example 1

[0023] See also Figure 1-3 The present invention provides the following technical solutions: A lubricating cold punching plate for drilling holes in an FPC board, comprising a cooling and lubricating mechanism 1 for cooling and lubricating a drill bit, a cold punching plate substrate 2 for accurately drilling holes in an FPC board 3 being provided at the bottom of the cooling and lubricating mechanism 1, the cooling and lubricating mechanism 1 comprising a buffer layer 13 applied to the surface of the cold punching plate substrate 2, the surface of the buffer layer 13 being applied with a heat dissipation coating 12, the surface of the heat dissipation coating 12 being applied with a water-soluble coating 11, and buckle slots 21 and buckle heads 22 which are positioned relative to each other and used to splice multiple plates are provided around the cold punching plate substrate 2.

[0024] In this embodiment, the water-soluble coating 11 is a water-soluble hot melt adhesive prepared from cellulose acetate propionate, mannitol acetate propionate, and succinic acid.

[0025] Specifically, the water-soluble coating 11 is formed by a water-soluble hot melt adhesive made of cellulose acetate propionate, mannitol acetate propionate, and succinic acid. When a high-speed rotating drill bit contacts the water-soluble coating 11, the heat of the drill bit is used to cause the water-soluble material to absorb heat and melt into a liquid state, and then flow upward along the drill bit groove and be sucked away, while taking away the heat of the drill cuttings and the drill bit, thereby improving the quality of the hole wall and extending the service life of the drill bit.

[0026] In this embodiment, the heat dissipation coating 12 is a resin of acrylic acid and amino system.

[0027] Specifically, the heat dissipation coating 12 formed by brushing with acrylic acid and amino system resins uses a water-based radiation heat dissipation paint modified with acrylic acid and amino resins. The adhesion, heat dissipation effect, and paint film performance can almost reach the performance of oil-based radiation heat dissipation paint, achieving efficient heat dissipation of high-speed rotating drill bits.

[0028] In this embodiment, the buffer layer 13 is made of acrylic rubber.

[0029] Specifically, the buffer layer 13 formed by brushing the acrylic material can effectively increase the buffering performance and toughness of the cold punching plate. At the moment of contact with the tiny drill bit, it can reduce the elastic bending deformation of the drill tip, have a clamping effect on the drill bit, and thus greatly improve the drilling position accuracy.

[0030] In this embodiment, the thickness of the water-soluble coating 11 , the heat dissipation coating 12 and the buffer layer 13 are all less than 1 mm, and the surface of the water-soluble coating 11 is printed with a printed circuit pattern corresponding to the FPC board 3 using a water-soluble paint.

[0031] Specifically, the thickness of the water-soluble coating 11, the heat dissipation coating 12 and the buffer layer 13 are all less than 1 mm, ensuring that the FPC board 3 is fixed. At the same time, the water-soluble material is easy to clean and leaves no residue. It effectively prevents the debris from adhering to the hole during the drilling process and being unable to be completely cleaned, resulting in subsequent electroplating defects such as no copper in the hole and open circuits in the hole. The printed circuit pattern set can facilitate personnel to intuitively observe the position of the drill bit in the FPC board 3, thereby improving the accuracy of the hole drilling process.

[0032] In this embodiment, the cold punching plate substrate 2 is a glass fiber composite board, and the bottom of the cold punching plate substrate 2 is provided with nano-level anti-slip grooves.

[0033] Specifically, the use of cold-punched plates can increase the number of drilled and stacked plates, thereby improving production efficiency. The nano-level anti-slip grooves can increase the stability of the FPC board 3 when it is fixed, preventing the FPC board 3 from shifting during drilling. At the same time, the plate composed of glass fiber material and a high-heat-resistant composite material does not contain asbestos components that are harmful to the human body. The glass fiber board has high mechanical and dielectric properties, good heat resistance and moisture resistance, and good processability.

[0034] In this embodiment, the groove wall of the buckle slot 21 and the surface of the buckle head 22 are both provided with frosted textures.

[0035] Specifically, the buckle slot 21 and the buckle head 22 are buckled and fixed, and the frosted texture can increase the stability of the buckle slot 21 and the buckle head 22 when they are buckled, so that multiple cold-punched plates can be combined and spliced ​​for use, thereby realizing the opening processing of FPC boards 3 of different sizes.

[0036] Working principle: By placing the lubricated cold punching plate on the processing station of the FPC board drilling machine, and then laying the FPC board 3 to be processed on the lubricated cold punching plate, multiple lubricated cold punching plates and FPC boards 3 can be stacked in a stacked manner according to actual processing needs. The drill bit of the FPC board drilling machine can be used to drill multiple FPC boards 3 of the same specification at the same time, thereby increasing the hole opening efficiency of the FPC board 3. Personnel can also assemble multiple lubricated cold punching plates according to actual processing needs by using the snap-on card slot 21 and the snap-on card head 22 to further increase the applicability of the lubricated cold punching plate. The lubricated cold punching plate uses the cold punching plate as the base material, and a cooling and lubricating mechanism 1 is coated on the surface of the cold punching plate through a process. The water-soluble coating 11, heat dissipation coating 12 and buffer layer 13 provided by the cooling and lubricating mechanism 1 can cool the drill bit, protect the drill bit, keep the cutting edge of the drill bit always sharp, and reduce the friction resistance of the drill chips in the chip groove, which is conducive to smooth chip removal. Since the coating of the cooling and lubricating mechanism 1 is soft, the elastic bending deformation of the drill tip can be reduced at the moment of contact with the tiny drill bit, which has a clamping effect on the drill bit, thereby greatly improving the drilling position accuracy.

[0037] It should also be noted that the cooling and lubricating mechanism 1 can also apply a layer of water-soluble heat dissipation coating to the surface of the cold punching plate substrate 2. The water-soluble heat dissipation coating can also protect the drill bit and reduce the friction resistance of the drill chips in the chip groove, which is conducive to smooth chip removal.

[0038] In the present invention, unless otherwise clearly stipulated and limited, the terms "install", "set", "connect", "fix", "screw" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. Unless otherwise clearly defined, ordinary technicians in this field can understand the specific meanings of the above terms in the present invention according to the specific circumstances.

[0039] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents, and all should be included within the scope of protection of the present invention.

Claims

1. A lubricating cold punching plate for drilling holes in FPC boards, comprising a cooling and lubricating mechanism (1) for cooling and lubricating a drill bit, characterized in that: The bottom of the cooling and lubricating mechanism (1) is provided with a cold punching plate substrate (2) for accurately drilling holes in the FPC board (3); the cooling and lubricating mechanism (1) comprises a buffer layer (13) applied to the surface of the cold punching plate substrate (2); the surface of the buffer layer (13) is applied with a heat dissipation coating (12); the surface of the heat dissipation coating (12) is applied with a water-soluble coating (11); and the cold punching plate substrate (2) is provided with relative snap-fitting slots (21) and snap-fitting heads (22) around its periphery for realizing splicing of multiple plates; The water-soluble coating (11) is a water-soluble hot melt adhesive prepared from cellulose acetate propionate, mannitol acetate propionate, and succinic acid; The heat dissipation coating (12) is a resin of acrylic acid and amino system; The buffer layer (13) is acrylic rubber; The thicknesses of the water-soluble coating (11), the heat dissipation coating (12), and the buffer layer (13) are all less than 1 mm, and a printed circuit pattern corresponding to the FPC board (3) is printed on the surface of the water-soluble coating (11) using a water-soluble coating; The cold punching plate substrate (2) is a glass fiber composite board, and the bottom of the cold punching plate substrate (2) is provided with nano-level anti-slip grooves; The groove wall of the buckle-joining groove (21) and the surface of the buckle-joining clamp head (22) are both provided with frosted patterns.

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